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Texas Instruments CC3135 SimpleLink™ Wi-Fi® BoosterPack™ Plug-in Module Hardware User guides
User's Guide
SWAU106 – January 2019
CC3135 SimpleLink™ Wi-Fi® BoosterPack™
Development Kit (BOOSTXL-CC3135)
The CC3135 device is part of the SimpleLink™ microcontroller (MCU) platform which consists of Wi-Fi®,
Bluetooth® low energy, Sub-1 GHz radios and host MCUs. All share a common, easy-to-use development
environment with a single core software development kit (SDK) and rich tool set. A one-time integration of
the SimpleLink™ platform lets you add any combination of devices from the portfolio into your design. The
ultimate goal of the SimpleLink™ platform is to achieve 100 percent code reuse when your design
requirements change. For more information, visit www.ti.com/simplelink.
The SimpleLink™ Wi-Fi® CC3135 dual band wireless network processor from Texas Instruments™
provides users the flexibility to add Wi-Fi® to an MCU. This user's guide explains the various
configurations of the CC3135 BoosterPack™ Plug-In Module.
1
2
3
4
5
Contents
Introduction ................................................................................................................... 3
1.1
CC3135 BoosterPack™............................................................................................ 3
1.2
Key Features ........................................................................................................ 4
1.3
What is Included .................................................................................................... 4
1.4
FCC/IC Regulatory Compliance .................................................................................. 4
Hardware Description ....................................................................................................... 5
2.1
Block Diagram ....................................................................................................... 6
2.2
Hardware Features ................................................................................................. 6
2.3
Connector and Jumper Descriptions ............................................................................. 7
2.4
Power ................................................................................................................. 9
2.5
Measure the CC3135 Current Draw ............................................................................ 13
2.6
Clocking ............................................................................................................ 14
2.7
Performing Conducted Testing .................................................................................. 15
Connecting to the PC Using CC31XXEMUBOOST Board ........................................................... 16
3.1
CC31XXEMUBOOST Board ..................................................................................... 16
3.2
Connecting the Boards ........................................................................................... 18
3.3
Jumper Settings on the BOOSTXL-CC3135 Board .......................................................... 18
3.4
Jumper Settings on the CC31XXEMUBOOST Board ........................................................ 19
Connecting to a LaunchPad™ Kit ........................................................................................ 19
4.1
LaunchPad™ Kit Current Limitation ............................................................................ 20
Additional Information ...................................................................................................... 21
5.1
Design Files ........................................................................................................ 21
5.2
Software ............................................................................................................ 21
5.3
Hardware Change Log............................................................................................ 21
5.4
Known Limitations ................................................................................................. 21
List of Figures
1
BOOSTXL-CC3135 Overview.............................................................................................. 5
2
CC3135 Device Block Diagram ............................................................................................ 6
3
Pin Connector Assignment ................................................................................................. 8
4
3.3-V Power From MCU LaunchPad™ Kit ............................................................................... 9
5
Feed USB on the BoosterPack™ Module (LaunchPad™ Kit Cannot Source 5 V on 20-Pin Connector) ...... 10
6
3.3-V Power from LDO .................................................................................................... 11
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7
Feed USB on the BoosterPack™ Module (Always While Using the Onboard LDO) .............................. 12
8
Low Current Measurement ................................................................................................ 13
9
Active Current Measurement ............................................................................................. 14
10
RF Path on BOOSTXL-CC3135 .......................................................................................... 15
11
CC31XXEMUBOOST Board .............................................................................................. 16
12
Portable Devices ........................................................................................................... 17
13
BOOSTXL-CC3135 Connected to the CC31XXEMUBOOST Board ................................................ 18
14
CC3135BP Connected to MSP432™ LaunchPad™ Kit .............................................................. 19
15
Jumper Settings When Used With LaunchPad™ Kit .................................................................. 20
List of Tables
.................................................................................................................
1
Push-buttons
2
LEDs ........................................................................................................................... 7
7
3
Jumper Settings .............................................................................................................. 7
4
Ports Available on J6 ...................................................................................................... 16
5
Ports Available on J5 ...................................................................................................... 17
6
BOOSTXL-CC3135 Jumper Settings .................................................................................... 18
7
Jumper Settings on the CC31XXEMUBOOST Board ................................................................. 19
8
Hardware Change Log..................................................................................................... 21
Trademarks
SimpleLink, Texas Instruments, BoosterPack, MSP432, Internet-on-a chip, LaunchPad are trademarks of
Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG.
Macronix is a trademark of Macronix International Co., Ltd.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
All other trademarks are the property of their respective owners.
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Introduction
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1
Introduction
1.1
CC3135 BoosterPack™
The SimpleLink™ Wi-Fi® CC3135 dual band (2.4GHz and 5GHz) wireless network processor provides
users the flexibility to add Wi-Fi® to any microcontroller (MCU). This user's guide explains the various
configurations of the CC3135 BoosterPack™ Plug-in Module. This Internet-on-a chip™ integrated circuit
solution contains everything needed to easily create Internet of Things (IoT) solutions, including enhanced
security features, quick connection establishment, cloud support, and more. The CC3135 BoosterPack™
module can be used in the following ways:
• The module can be connected to a TI MCU LaunchPad™ Development Kit (software examples
provided for MSP-EXP432E401Y).
• The module can be plugged into a CC31xxEMUBOOST board, and connected to a PC for MCU
emulation.
• The module can be connected to an adapter board DISCOVERY-ADAPT, which enables customers
use the BOOSTXL-CC3135 with additional platforms beyond TI LaunchPad™ kits.
The CC3135 BoosterPack™ kit can be purchased in three configurations:
1. BOOSTXL-CC3135 plus CC31XXEMUBOOST board plus MSP-EXP432P401R LaunchPad™
Can run all software in the software design kit (SDK), and develop on the MSP430F5529 MCU
2. BOOSTXL-CC3135 plus CC31XXEMUBOOST board
Used for any CC3135 device development
3. BOOSTXL-CC3135
If extra CC3135 BoosterPack™ modules are needed.
NOTE: The CC31XXEMUBOOST board is an advanced emulation board that is required for flashing
the BOOSTXL-CC3135, using the radio tool (radio performance testing or putting into
certification modes), and doing networking processing logs for advanced debugging.
The pictures used in this user's guide refer to the Revision A board, but the contents also
apply to any higher revisions unless otherwise stated. For changes across the various
revisions of the board, see Section 5.3.
The maximum RF power transmitted in each WLAN 2.4-GHz band is 18.3 dBm. The
maximum RF power transmitted in each WLAN 5-GHz band is 17 dBm.
The antennas used for this transmitter must be installed to provide a separation distance of
at least 20 cm from all people, and must not be colocated or operating in conjunction with
any other antenna or transmitter.
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Introduction
1.2
Key Features
•
•
•
•
1.3
CC3135 Dual Band (2.4GHz and 5GHz) SimpleLink™ Wi-Fi®, Internet-on-a chip™ solution
40-pin BoosterPack™ pinout that leverages the BoosterPack™ ecosystem
Onboard chip antenna with U.FL connector for conducted testing
additional Micro USB connector for external power connections.
What is Included
•
•
•
1.4
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One BOOSTXL-CC3135 Board
One Micro USB Cable
Quick Start Guide
FCC/IC Regulatory Compliance
The CC3135 SimpleLink™ Wi-Fi® BoosterPacks™ are tested for and found to be in compliance with FCC
and ISED regulations regarding unlicensed intentional radiators. Hereby, Texas Instruments Inc. declares
that the radio equipment type BOOSTXL-CC3135 are in compliance with Directive 2014/53/EU. The full
text of the EU declaration of conformity is available at the following internet addresses:
• BOOSTXL-CC3135 Certification Documents
• BOOSTXL-CC3135 Declaration of Conformity (DoC)
Indoor Usage Restrictions:
The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range.
4
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PL
PT
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ES
SE
UK
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Hardware Description
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2
Hardware Description
Figure 1 shows the front side of the BOOSTXL-CC3135.
Figure 1. BOOSTXL-CC3135 Overview
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Hardware Description
2.1
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Block Diagram
Figure 2 shows the block diagram of the CC3135 device.
Figure 2. CC3135 Device Block Diagram
2.2
Hardware Features
•
•
•
•
•
•
•
•
•
6
Two 20-pin stackable connectors (BoosterPack Standard)
Onboard chip dual-band antenna with on-board U.FL connector for conducted RF testing
Power from onboard LDO using USB or 3.3 V from MCU LaunchPad™
Three push-buttons
4 LEDs
Jumper for current measurement with provision to mount 0.1 ohm (0603) resistor for measurement with
voltmeter
A 16-Mb serial flash (MX25R from Macronix™)
A 40-MHz crystal, 32-kHz crystal, and optional 32-kHz oscillator (not mounted on the PCB)
A 4-layer PCB with 6-mil spacing and track width
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2.3
Connector and Jumper Descriptions
2.3.1
Push-buttons and LEDs
Table 1 lists the push-button descriptions.
Table 1. Push-buttons
Reference
Usage
Comments
SW3
Factory default
This button is used to restore the serial flash to the factory default image. Hold the
button and then toggle the RESET push-button.
SW2
RESET
This button can be used to reset the device. Holding the button down sets the device in
the SHUTDOWN state.
SW1
nHIB
This button boots the device to the bootloader mode for flashing the firmware over a
universal asynchronous receiver/transmitter (UART).
Table 2 lists the LED descriptions.
Table 2. LEDs
Reference
Color
Usage
Comments
D3
Red
PWR indication
On, when the 3.3-V power is provided to the board.
D6
Yellow
nRESET
This LED indicates the state of the nRESET pin. If this LED is glowing, the
device is functional.
D5
Green
nHIB
This LED indicates the state of the nHIB pin. When the LED is off the device
is in HIBERNATE state.
D7
Red
Factory default
This LED indicates whether the factory default switch is pressed on. The
RESET button must be pressed for this LED to function.
2.3.2
Jumper Settings
Table 3 lists the jumper settings.
Table 3. Jumper Settings
Reference
Usage
Comments
J6
USB connector
For powering the BoosterPack™ when connected with a LaunchPad™, which
cannot source enough current.
J7
Power selection
Choose the power supply from the LauchPad™ kit or the onboard USB.
J8 (1 to 2) power from the MCU LaunchPad™
J8 (2 to 3) power from the onboard USB using a 3.3-V LDO
J8
Current measurement
For hibernate and LPDS currents, connect an ammeter across J26
(range < 500 µA).
For active current, mount a 0.1-Ω resistor on R42, and measure the voltage
across the 0.1-Ω resistor using a voltmeter (range < 50 mV peak-peak).
P1…P4
BoosterPack™ header
2 × 10 pins each connected to the LaunchPad™
J10
RF test (2.4 Ghz only)
U.FL connector for conducted testing in the lab. Using this requires an ECO be
made to the board by swapping two resistors.
J11
RF test (2.4 GHz + 5 GHz)
U.FL connector for conducted testing in the lab. Using this requires an ECO be
made to the board by swapping two resistors.
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Hardware Description
2.3.3
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Assignment of the Two 20-Pin Connectors
Figure 3 shows the signal assignment on the two 20-pin connectors. The convention of J1...J4 is replaced with P1…P4 to avoid confusion with the
actual board reference.
Figure 3. Pin Connector Assignment
NOTE: All signals are 3.3-V CMOS logic levels, and are referred with respect to the CC3135 device. For example, UART1_TX is an output from
the CC3135. For the SPI lines, the CC3135 device always acts like a slave.
8
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2.4
Power
The board is designed to accept power from a connected LaunchPad™ kit, or through the
CC31xxEMUBOOST board. Some LaunchPad kits cannot source the peak current requirements of Wi-Fi,
which may be as high as 450 mA. In such cases, the USB connector on the BOOSTXL-CC3135 can be
used to aid the peak current. The use of Schottky diodes ensure that load sharing occurs between the
USB connectors on the LaunchPad kit and the BoosterPack™ module without any board modifications.
Also, the 3.3-V power can be sourced from the LaunchPad kit or from the 3.3-V LDO on the board. This
sourcing is done by using jumper J8. If the LaunchPad kit is unable to source the 3.3 V up to 450 mA,
then J8 must be configured to work from the onboard LDO.
2.4.1
Power From the LaunchPad™ Kit or CC3135EMUBOOST
The most common scenario is powering the BOOSTXL-CC3135 from the connected LaunchPad™ kit. In
this case, the LaunchPad kit provides 3.3 V to the BoosterPack™ module for its operation (see Figure 4).
In addition to the 3.3 V, some LaunchPad kits provide 5 V from the USB (see Figure 5), which is used to
drive a 3.3-V LDO on the BoosterPack module. If the LaunchPad kit is unable to provide the 5 V (for
example, the LaunchPad kit with only 20 pins), then the USB connector on the BOOSTXL-CC3135 must
be used to provide the LDO input, as shown in Figure 5.
Figure 4. 3.3-V Power From MCU LaunchPad™ Kit
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Hardware Description
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Figure 5. Feed USB on the BoosterPack™ Module
(LaunchPad™ Kit Cannot Source 5 V on 20-Pin Connector)
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2.4.2
Onboard LDO Power Supply
On some LaunchPad™ kits, the 3.3 V cannot source the 450-mA peak current needed for the BOOSTXLCC3135 board. In such a case, the onboard 3.3-V LDO can be used (see Figure 6). This LDO would be
sourced from the USB connector on the BOOSTXL-CC3135 and LaunchPad kit in a shared-load manner
(see Figure 7).
Figure 6. 3.3-V Power from LDO
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Figure 7. Feed USB on the BoosterPack™ Module (Always While Using the Onboard LDO)
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2.5
2.5.1
Measure the CC3135 Current Draw
Low Current Measurement (Hibernate and LPDS)
To measure the current draw of the CC3135 device, and the serial flash, a jumper labeled J8 is provided
on the board. By removing J6, users can place an ammeter into this path to observe the current. TI
recommends this method for measuring the LPDS and hibernate currents.
Jumper J6 is removed, and an ammeter is added in series to measure the hibernate and LPDS currents
(see Figure 8).
Figure 8. Low Current Measurement
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Hardware Description
2.5.2
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Active Current Measurement
To measure active current in a profile form, TI recommends using a 0.1-Ω 1% 0603 resistor on the board,
and measuring the differential voltage across the resistor. This measurement can be done using a
voltmeter or an oscilloscope for measuring the current profile.
Figure 9. Active Current Measurement
2.6
Clocking
The board provides two crystals for the clocks to the device:
• Y1 is a 40MHz crystal.
• Y3 is a 32kHz crystal used as a sleep clock.
The 32kHz crystal (Y3) allows for lower LPDS sleep currents than other low-frequency clock sources. The
presence of the crystal allows use of the full range of low-power modes.
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2.7
Performing Conducted Testing
The BoosterPack™ board by default ships with the RF signal connected to the onboard dual band chip
antenna. In addition to the dual band antenna, the board contains two U.FL connectorsthat can be used
for conduct testing, or connect an external antenna. One connector is present for 2.4 GHz only testing,
and another is provided after the diplexer to allow for dual band RF testing. The use of these connectors
requires a rework to be performed, which involves swapping the position of a resistor, as shown in
Figure 10.
Figure 10. RF Path on BOOSTXL-CC3135
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Connecting to the PC Using CC31XXEMUBOOST Board
3
Connecting to the PC Using CC31XXEMUBOOST Board
3.1
CC31XXEMUBOOST Board
3.1.1
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Overview
The CC31XXEMUBOOST board is designed to connect the BoosterPack™ module to a PC through a
USB connection. This connection updates the firmware patches, which are stored in the serial flash on the
BoosterPack, and in software development using SimpleLink Studio. The board is also used to measure
the RF performance using a software tool named RadioTool. For more information, see the CC31xx &
CC32xx Radio Tool wiki page.
3.1.2
Hardware Details
Figure 11 shows the CC31XXEMUBOOST board.
Figure 11. CC31XXEMUBOOST Board
The CC31XXEMUBOOST board has two FTDI ICs to enumerate multiple COM and D2XX ports. Table 4
gives the details of the ports.
Table 4. Ports Available on J6
16
Port Number
Port Type
Usage
1
D2XX
SPI port for SimpleLInk Studio
2
D2XX
GPIO for SimpleLink Studio
3
VCP
COM port for flash programming
4
VCP
NWP
Comments
Control the nRESET, nHIB, IRQ
Network processor logger output. Used with
specific tools to analyze the network processor
logs. For TI use only.
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The third COM port in the list is used for the flash programming (see Figure 12).
Figure 12. Portable Devices
NOTE: The third COM port shown (COM97 for the example in Figure 12) is used for flash
programming.
Table 5 lists the ports available on J5.
Table 5. Ports Available on J5
3.1.3
Port Number
Port Type
Usage
Comments
1
VCP
RT3
Used for TI internal debug only.
2
VCP
MAC logger
Used for TI internal debug only.
Driver Requirements
The FTDI Debug board requires users to install the associated drivers on a PC. This package is available
as part of the SDK release in the following folder:
[Install-Path]\CC3135-sdk\tools\cc31xx_board_drivers\
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Connecting to the PC Using CC31XXEMUBOOST Board
3.2
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Connecting the Boards
Figure 13 shows the connection of the CC3135 BoosterPack™ module to the CC31XXEMUBOOST
board. The connectors must be aligned carefully, because the CC31XXEMUBOOST board does not have
polarity protection, and the serial flash can be erased as a result. Pin 1 on each of the connectors is
marked on the board using a small triangle marking; these pins must be aligned while connecting.
Figure 13. BOOSTXL-CC3135 Connected to the CC31XXEMUBOOST Board
CAUTION
Align pin 1 of the boards together using the triangle marking on the PCB. An
incorrect connection can destroy the boards permanently.
Ensure that none of the header pins are bent before connecting the two boards.
3.3
Jumper Settings on the BOOSTXL-CC3135 Board
Table 6 specifies the jumpers to be installed on the BOOSTXL-CC3135 before pairing with the
CC31XXEMUBOOST board.
Table 6. BOOSTXL-CC3135 Jumper Settings
18
Number
Jumper Settings
Notes
1
J8 (1-2)
Powers the BoosterPack™ from the CC31XXEMUBOOST board. The jumper
shall be placed so that it is near the edge of the PCB.
3
J6 (short)
No current measurement.
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3.4
Jumper Settings on the CC31XXEMUBOOST Board
Table 7 specifies the jumpers to be installed while pairing with the CC31XXEMUBOOST board.
Table 7. Jumper Settings on the CC31XXEMUBOOST Board
No
Jumper Settings
Notes
1
J4 (short)
Provides 3.3 V to the BoosterPack™
2
J22 (short)
Provides 5.0 V to the BoosterPack™
3
J3 (1 to 2)
Routes the NWP logs to the dual port also
The remaining jumpers can remain open.
4
Connecting to a LaunchPad™ Kit
The CC3135 BoosterPack™ module can be directly connected to a compatible LaunchPad™
development kit using the standard two 20-pin connectors. The jumper settings needed for this connection
are the same as those needed for the CC31XXEMUBOOST board, as described in Section 3.3.
Ensure that pin 1 of the two 20-pin connectors are aligned correctly before pairing. Figure 14 shows the
connected setup. The USB cable is directly connected to the BoosterPack module to power it only. For
debugging, the USB cable on the LaunchPad kit is also required.
Figure 14. CC3135BP Connected to MSP432™ LaunchPad™ Kit
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Connecting to a LaunchPad™ Kit
4.1
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LaunchPad™ Kit Current Limitation
Some of the LaunchPad™ kits, including the MSP430FRAM, do not provide enough current to power the
CC3135 BoosterPack™ module. The BoosterPack module can consume up to 400-mA peak current from
the 3.3 V, and may need to be powered separately. For this, a USB connector is provided on the
BoosterPack module to provide the 3.3 V separately.
The power supply jumpers (J7) should be configured, as shown in Figure 15, when the power is supplied
from the onboard USB connector.
Figure 15. Jumper Settings When Used With LaunchPad™ Kit
CAUTION
Because two power sources exist in this setup, it is important to follow the
power-up sequence. Always power the BoosterPack™ module before powering
the LaunchPad™ kit.
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Additional Information
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5
Additional Information
5.1
Design Files
All design files including schematics, layout, bill of materials (BOM), Gerber files, and documentation are
available for download from: CC3135 SimpleLink WI-Fi and Internet of Things - Hardware Design Files .
5.2
Software
All design files including TI-TXT object-code firmware images, software example projects, and
documentation are available at www.ti.com/product/CC3135.
The Software Development Kit (SDK) to use with the CC3135 BoosterPack™ is available at
http://www.ti.com/tool/SIMPLELINK-WIFI-CC3120-SDK-PLUGIN
5.3
Hardware Change Log
Table 8 lists the hardware change log.
Table 8. Hardware Change Log
5.4
5.4.1
PCB Revision
Description
Rev A
First release
Known Limitations
Enabling Low-Power Measurement From the LaunchPad™ Kit
When the BOOSTXL-CC3135 is powered by a LaunchPad™ kit, the 3.3-V supply from the LaunchPad is
used to power the CC3135 BoosterPack™ module, as well as other parts on the board including the serial
flash, LEDs, and more. The total power drawn into the 3.3-V supply would be several mA in shutdown or
hibernate mode. To measure the low-power numbers, users are advised to remove the LEDs (D1, D5, and
D6 on the board). Similarly, the shutdown mode would leak about 33 µA into the pullup resistor (R27) on
the nRESET pin. This pullup resistor also must be removed to measure the total current below 1 µA in
shutdown mode. In hibernate mode, pullup resistor R296 must be removed to enable the lowest current
state.
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