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Texas Instruments Dual-Mode Bluetooth CC2564 Evaluation Board User guides
Dual-Mode Bluetooth® CC2564 Evaluation Board
User's Guide
Literature Number: SWRU450
March 2016
User's Guide
SWRU450 – March 2016
Dual-Mode Bluetooth® CC2564 Evaluation Board
1
Introduction
The CC256XQFNEM evaluation board contains the CC2564B dual-mode Bluetooth controller and is
intended for evaluation and design. For a complete evaluation solution, the CC256XQFNEM board plugs
into the TI hardware development kits:
• MSP-EXP430F5529
• MSP-EXP430F5438
• DK-TM4C123G
• DK-TM4C129X
• Other MCUs
A certified and royalty-free TI Bluetooth® stack (TIBLUETOOTHSTACK-SDK) is available for the
MSP430™ and TM4C12x MCUs. The CC256XQFNEM hardware design files (schematics, layout, and
BOM) are provided as a reference to aid in the implementation of the CC2564 device.
The CC2564B is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables
fast time to market. The CC2564B device includes TI's seventh-generation Bluetooth core and provides a
product-proven solution that is Bluetooth-4.1 compliant. The CC2564B device provide one of the best
Bluetooth RF performances with a transmit power and receive sensitivity that provides range of 2×
compared to other Bluetooth low energy-only solutions. TI’s power-management hardware and software
algorithms provide significant power savings in commonly used Bluetooth BR/EDR/low energy modes of
operation.
MSP430, Code Composer Studio are trademarks of Texas Instruments.
ARM, Keil are registered trademarks of ARM Limited.
Bluetooth is a registered trademark of Bluetooth SIG.
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1.1
Features
The CC256XQFNEM evaluation board contains the following:
• CC2564B device (QFN package)
• Bluetooth Specification v4.1
• Dual mode—Bluetooth + Bluetooth low energy
• Class 1.5 transmit power (12 dBm)
• High sensitivity (–93 dBm typical)
• 32.768-kHz oscillator
• UART interface—control and data
• PCM–I2S interface—voice and audio
• 4-layer PCB design
• 1.8 LDO (LP2985-18)
• 3 voltage-level translators (SN74AVC4T774)
• PCB-printed antenna
• RF connector (U.FL-R-SMT-1)
• EM connectors that plug directly into the TI hardware development kits:
– MSP-EXP430F5529
– MSP-EXP430F5438
– DK-TM4C123G
– DK-TM4C129X
– Other MCUs
• COM connectors that plug directly into the TI hardware development kit TMDXEVM3358
• Certified and royalty-free TI dual-mode Bluetooth stack (TIBLUETOOTHSTACK-SDK):
– MSP430 (CC256XMSPBTBLESW)
– TM4C (CC256XM4BTBLESW)
– Other MCU (CC256XSTBTBLESW)
CC256XQFNEM Board Applications
Example embedded wireless applications include the following:
• Cable replacement
• Printer adapters
• Personal digital assistants (PDAs)
• Printers and scanners
• Computers and peripherals
• Wireless sensors
• Industrial control applications
• Low-power medical
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Introduction
1.2
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Introduction to CC256XQFNEM Board
This user's guide is intended for use with TI's Bluetooth development platform: the CC256XQFNEM board.
This guide helps you quickly start using this board to integrate with TI's evaluation platforms and software
SDKs. This document describes the components and configurations of this board for various Bluetooth
applications. The device information and capabilities, including pin descriptions and available software and
tools, will enhance your out-of-box experience. Figure 1 shows the CC256XQFNEM board.
Figure 1. CC256XQFNEM Board
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Introduction
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Kit Content
• 1 CC256XQFNEM board with TI dual-mode Bluetooth CC2564 controller
• 1 block jumper for the MSP-EXP430F5438 board
• 4 jumpers for the MSP-EXP430F5529 board
Requirements
For a complete evaluation, the CC256XQFNEM board requires hardware and software tools selected from
the following list:
Hardware
• 1 MSP430 experimenter board—sold separately
– MSP-EXP430F5529 board
– MSP-EXP430F5438 board
• 1 TM4C development kit—sold separately
– DK-TM4C123G development kit
– DK-TM4C129X development kit
Software
• TI dual-mode Bluetooth stack
– On MSP430 MCUs: CC256XMSPBTBLESW
– On TM4C MCUs: CC256XM4BTBLESW
• Other MCUs
– On STM32F4 MCUs: CC256XSTBTBLESW
Tools
• TI dual-mode Bluetooth service pack for CC256x (optional)
• CC256x Bluetooth hardware evaluation tool (optional)
• IDE versions—platform dependent
– Code Composer Studio™ (CCS)
– IAR 7.2/7.3 for ARM®
– ARM Keil® uVision 4.70.0.0
Figure 2. MSP430 Hardware Setup Examples
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Introduction
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Figure 3. TM4C Hardware Setup Examples
Figure 4. Other MCU Hardware Setup Examples
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Introduction
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1.3
Overview
The CC256XQFNEM board is the development environment for the CC2564B controller and plugs directly
into TI MSP430 and TM4C experimenter boards with the added benefit of EM connectors that simplify
prototype wiring and field trials.
TI's CC2564B device uses a host controller interface (HCI), a cost-effective and flexible means to
implement a Bluetooth network. The HCI reduces BOM cost by eliminating redundant processing capacity
and giving designers the flexibility to choose a controller to work with because the Bluetooth stack resides
and executes on the host processor of the application.
The CC256XQFNEM board has two connectors: EM and COM. The I/Os for the EM are at 3.3 V, the
default assembly configuration. The I/Os for the COM are at 1.8 V and require hardware modification.
The CC256XQFNEM board is intended for evaluation purposes and works with TI's hardware
development kit. See Section 3. To aid in the implementation of this reference design, schematic and
layout files are available at the CC2564 product page. Figure 5 and Figure 6 show an overview of the front
and back connectors, respectively, of the CC256XQFNEM board.
Figure 5. CC256XQFNEM Board Front Overview
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Figure 6. CC2564MODNEM Board Back Connectors
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Hardware Description
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2
Hardware Description
2.1
Overview
Figure 7 is the high-level block diagram of the CC256XQFNEM board. The CC2564 board integrates the
antenna. The oscillator is the default clock with a frequency accuracy of 32.768 kHz + –250 ppm. The
signals from the dual-mode Bluetooth CC2564 module include UART, PCM, nSHUTD, and slow clock.
The CC256XQFNEM board has the following connectors:
• EM (default)
• COM
The connectors can supply power to the CC2564B device through either VBAT_EDGE or VBAT_MCU.
For the EM connector, the signals are controlled through level shifters. The third connector (the debug
header) can be used for testing. The I/Os of the EM connector are at 3.3 V. The I/Os of the COM
connector are at 1.8 V and require hardware modification. The I/Os for the debug header connector are at
1.8 V and require hardware modification.
LDO
VBAT_MCU
UART
PCM
EM
Connector
VBAT
Level
Shifters
UART
nSHUTD
Slow Clock
VDD_IO
Antenna
PCM
COM
Connector
CC2564B
nSHUTD
VBAT_EDGE
Debug
Header
Slow Clock
Oscillator
32.768-kHz
Slow Clock
Figure 7. CC256XQFNEM Block Diagram
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Hardware Description
2.2
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Connectors
2.2.1
EM Connector
The EM connectors can mount on a wide variety of TI MCU platforms such as the MSP430 (MSPEXP430F5529 and MSP-EXP430F5438) and TM4C (DK-TM4C123G and DK-TM4C129X). The EM I/Os
are at 3.3-V levels. For example, then MODULE_UART_RX refers to the receiving UART RX pin on the
CC2564B controller that would connect to the UART TX pin on the MCU. Table 1 and Table 2 list the
standard pinout and the pin assignments with respect to the CC2564B side.
Table 1. EM1 Connector
Pin Number
EM Adapter Assignment
Pin Number
EM Adapter Assignment
1
GND
2
N/C
3
MODULE_UART_CTS
4
N/C
5
SLOW_CLK
6
N/C
7
MODULE_UART_RX
8
N/C
9
MODULE_UART_TX
10
N/C
11
N/C
12
N/C
13
N/C
14
N/C
15
N/C
16
N/C
17
N/C
18
N/C
19
GND
20
N/C
Table 2. EM2 Connector
10
Pin Number
EM Adapter Assignment
Pin Number
EM Adapter Assignment
1
N/C
2
GND
3
N/C
4
N/C
5
N/C
6
N/C
7
3.3 V
8
MODULE_AUDIO_DATA_OUT
9
3.3 V
10
MODULE_AUDIO_DATA_IN
11
MODULE_AUDIO_FSINK
12
N/C
13
N/C
14
N/C
15
N/C
16
N/C
17
MODULE_AUDIO_CLK
18
MODULE_UART_RTS
19
nSHUTD
20
N/C
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2.2.2
COM Connector
The COM connector interfaces with TI's MPU platforms, such as AM335x evaluation module
(TMDXEVM3358). I/Os of the COM connector are at 1.8 V. Some components must not be installed (DNI)
to use the COM connector. For further details, see Section 2.3. Table 3 lists the pinout for the COM
connector.
Table 3. COM Connector
Pin Number
Relevant COM Connector Pin Assignment
1
SLOW_CLK_EDGE
8
1V8_IN
52
AUD_CLK_1V8
54
AUD_FSYNC_1V8
56
AUD_IN_1V8
58
AUD_OUT_1V8
66
HCI_TX_1V8
68
HCI_RX_1V8
70
HCI_CTS_1V8
72
HCI_RTS_1V8
76
TX_DEBUG_1V8
89
nSHUTDOWN_1V8
3, 9, 19, 37, 47, 63, 77, 83, 87, 95, 97
GND
2, 6, 18, 22, 42, 60, 64, 92
GND
2.2.3
Debug Header
The debug header enables signals in the design such as power, ground, debug, UART, and audio signals
for testing and debugging. The I/Os are at 1.8 V. Table 4 lists the physical location of the pin numbers.
Table 4. Debug Header Pinout
Pin Number
EM Adapter Pin Assignment
Pin Number
EM Adapter Pin Assignment
1
GND
2
VBAT
3
VIO_HOST
4
GND
5
AUD_FSYNC_1V8
6
AUD_CLK_1V8
7
AUD_OUT_1V8
8
AUD_IN_1V8
9
CLK_REQ_OUT_1V8
10
SLOW_CLK_EDGE
11
HCI_TX_1V8
12
HCI_RX_1V8
13
HCI_CTS_1V8
14
HCI_RTS_1V8
15
TX_DEBUG_1V8
16
nSHUTDOWN_1V8
17
VDD_1V8
18
GND
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Hardware Description
2.3
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Board Configurations
2.3.1
Power Supplies Configuration
The CC2564 device requires the following two power sources:
• VDD_IN: main power supply for the module
• VDD_IO: power source for the 1.8-V I/O ring
The HCI module includes several on-chip voltage regulators for increased noise immunity and can
connect directly to the battery.
2.3.1.1
Jumper Configuration
The CC256XQFNEM board has two jumpers that can be configured to control power on the CC2564B
controller. Jumper VDD_1V8 (J1) is the power supply jumper to the CC2564B VDD_IO. Jumper VBAT_CC
(J2) is the main VDD_IN power supply to the CC2564B. Ensure jumpers are placed for connecting power
to the device. Table 5 lists the jumper configurations.
Table 5. Jumper Configurations
2.3.1.2
Jumper
Description
VDD_1V8 (J1)
Supplies power to CC2564B I/Os
VBAT_CC (J2)
Main power supply for CC2564B
Measuring Current Consumption
These jumpers can measure the current consumption by placing current sense resistors on R10 for
VBAT_CC (J2) and R7 for VDD_1V8 (J1). Both resistors are 0.10 Ω, 1/4 W. J2 can measure the power
consumed by the CC2564 controller, including the RF TX and RF RX, whereas the J1 can measure power
consumed by the digital VDD_IO.
2.3.2
Radio Frequency (RF) Interface
The board can be configured to route the RF output from the CC2564B controller to the onboard copper
antenna or the onboard U.FL connector. This configuration occurs by placing the resistor in either R29 or
R30 position that has negligible resistance of 0 Ω. R30 connects the RF to the U.FL, while R29 connects
to the copper antenna. The U.FL connector is for conducted testing of the RF. The Bluetooth hardware
evaluation tool (BHET) can be used to test basic RF functionality on this board. Figure 8 shows the
CC2564 integrated antenna.
Antenna
RF Interface
(Default)
CC2564B
RF Interface
U.FL
Figure 8. CC2564 Integrated Antenna
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2.3.3
Slow Clock
2.3.3.1
Clock Inputs
The slow clock can come from an internal or external source. The CC2564B controller lets you place the
slow clock on the board (the default setting) or source it from an external source and connects to the
SLOW_CLK_IN and can be a digital signal in the range of 0 V to 1.8 V. The frequency accuracy of the
slow clock must be 32.768 kHz + –250 ppm for Bluetooth use (according to the Bluetooth specification).
Figure 9 shows the clock input.
EM
Connector
Slow Clock
Level
Shifters
Oscillator
32,768-kHz
COM
Connector
Slow Clock
Slow Clock
(Default)
CC2564B
SLOW_CLK_IN
Slow Clock
Figure 9. Clock Input
2.3.4
UART Configuration
The UART for the CC256XQFNEM board can be routed to the EM or COM connector. The signals are
also available to the debug header to probe the signals. Figure 10 shows the EM connector as the default
UART configuration, where the dashed line indicates that the COM connector is not connected. To
configure the COM connector for UART, remove or depopulate the U3 level shifter as shown in Figure 11,
where the level shifter is surrounded by a dashed line to indicate that it is not populated.
EM
Connector
UART
Level
Shifters
(Default)
UART
UART
CC2564B
COM
Connector
UART
Figure 10. UART Default Configuration
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Hardware Description
EM
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UART
Level
Shifters
(Default)
UART
UART
CC2564B
COM
Connector
UART
Figure 11. UART COM Connector Configuration
2.3.5
PCM Configuration
For voice and assisted-audio features, the PCM signals from CC2564 controller (master) must connect to
an external audio host (slave). The CC256XQFN board provides the PCM clock (BCLK) and FSYNC
(WCLK) signals to the external codec. The PCM configuration is required for the following profiles:
• HFP
• HSP
• A3DP
Two configurations are available for the two connectors: EM and COM. Figure 12 shows the default
configuration. The following sections describe how to set up each connector.
EM
Connector
PCM
Level
Shifters
(Default)
PCM
PCM
CC2564B
COM
Connector
PCM
Figure 12. PCM Connector Configuration
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2.3.5.1
EM Configuration
The EM connector allows configuration of the CC2564 controller as either the master or slave. The default
configuration is a master role for the module through the EM connector. By default, the EM board is
configured for PCM master but not completely enabled. Resistor R11 must be removed. R11 is placed by
default to avoid leakage current (I/O floating) when there is no audio usage. Figure 13 shows the R11 DNI
to enable audio features.
Figure 13. R11 DNI to Enable Audio Features
To change the direction of the PCM to configure the module as the slave, do as follows:
1. Connect resistor R18.
2. Remove resistor R19 on the U4 level shifter (see Figure 14).
Figure 14. Resistors to Change the Direction of PCM
2.3.5.2
COM Configuration
To configure the COM connector, the resistors (R21, R22, R23, and R24) connected to U4 must be
removed to disable the lines connecting to the level shifters. The signal in the COM connector can be
configured to run in either direction without any changes to the board components.
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Software Tools
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3
Software Tools
3.1
TI Dual-Mode Bluetooth Stack
TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth low energy and is comprised of single
mode and dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack provides
simple command line sample applications to speed development.
The stack works with the following:
• Any MSP430 MCU with flash equal to or greater to 128KB and RAM equal to or greater than 8KB
(CC256XMSPBTBLESW)
• Any TM4C MCU with flash equal to or greater than 128KB (CC256XM4BTBLESW)
• Other MCUs (CC256XSTBTBLESW)
For detailed documentation, see the Bluetooth Demo APPS page.
3.2
TI Dual-Mode Bluetooth Service Pack for CC256x
The CC256x Bluetooth service packs (SPs) are mandatory initialization scripts that contain bug fixes and
platform-specific configurations. The scripts must be loaded into the corresponding CC256x device after
every power cycle. The CC256x SPs are delivered as a Bluetooth script (BTS) file. A BTS file is a scripted
binary file that contains the embedded HCI commands and HCI events.
3.3
Bluetooth Hardware Evaluation Tool
The CC256x Bluetooth hardware evaluation tool can be downloaded as a complete package from TI. This
program is an intuitive tool to test TI's Bluetooth chips, including this CC256xQFNEM board. This program
is used to test RF performance and modify the service packs of TI's Bluetooth chips.
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