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Texas Instruments CC256x Getting Started Selection (Rev. A) Selection guides
Getting Started Guide
SWRU523A – June 2017 – Revised June 2018
CC256x Getting Started Selection Guide
The CC256x family of devices from Texas Instruments™ allows different options for dual-mode Bluetooth®
and Bluetooth low-energy (BLE) solutions designed to meet your needs. These solutions are reliable, easy
to use, and allow flexibility to choose from a number of application processors with a royalty-free stack. TI
provides continued long-term support with online forums and technical documentation for the CC256x
family.
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Contents
Select the Device or Module ............................................................................................... 3
Device Information ........................................................................................................... 4
2.1
CC2564C ............................................................................................................ 4
2.2
CC2564MODA ...................................................................................................... 4
2.3
CC2564MODN ...................................................................................................... 5
2.4
CC2564 .............................................................................................................. 5
2.5
CC2560 .............................................................................................................. 5
Processor Information ....................................................................................................... 6
3.1
MSP430™ Microcontrollers ....................................................................................... 6
3.2
SimpleLink™ MSP432™ ARM® Cortex®-M4F MCU............................................................ 6
3.3
Sitara™ Processors ................................................................................................ 7
3.4
Tiva™ ARM® MCUs ................................................................................................ 8
3.5
Non-TI (Including STM32® F4) Processor ....................................................................... 8
Selection Guide for CC2564C.............................................................................................. 9
4.1
Use CC2564C With the MSP430™ MCU ....................................................................... 9
4.2
Use CC2564C With the MSP432™ MCU ....................................................................... 9
4.3
Use CC2564C With the Sitara™ AM335x, AM437x, AM57x Processors.................................. 10
4.4
Use CC2564C With the Tiva™ ARM® MCU ................................................................... 10
4.5
Use CC2564C With a Non-TI Processor ....................................................................... 11
Selection Guide for CC2564MODA ...................................................................................... 12
5.1
Use CC2564MODA With MSP430™ MCU .................................................................... 12
5.2
Use CC2564MODA With MSP432™ MCU .................................................................... 13
5.3
Use CC2564MODA With the Sitara™ AM335x, AM437x, AM57x Processors ........................... 14
5.4
Use CC2564MODA With the Tiva™ ARM® MCU ............................................................. 15
5.5
Use CC2564MODA With a Non-TI Processor ................................................................. 16
Selection Guide for CC2564MODN ...................................................................................... 17
6.1
Use CC2564MODN With the MSP430™ MCU ............................................................... 17
6.2
Use CC2564MODN With the MSP432™ MCU ............................................................... 18
6.3
Use CC2564MODN With the Sitara™ AM335x, AM437x, AM57x Processors ........................... 19
6.4
Use CC2564MODN With the Tiva™ ARM® MCU ............................................................. 20
6.5
Use CC2564MODN With a Non-TI Processor................................................................. 21
Selection Guide for CC2564 .............................................................................................. 22
7.1
Use CC2564 With the MSP430™ MCU ........................................................................ 22
7.2
Use CC2564 With the MSP432™ MCU ........................................................................ 23
7.3
Use CC2564 With the Sitara™ AM335x, AM437x, AM57x Processors.................................... 24
7.4
Use CC2564 With the Tiva™ ARM® MCU ..................................................................... 25
7.5
Use CC2564 With a Non-TI Processor ......................................................................... 26
Selection Guide for CC2560 .............................................................................................. 27
8.1
Use CC2560 With the MSP430™ MCU ........................................................................ 27
8.2
Use CC2560 With MSP432™ MCU ............................................................................ 28
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8.3
Use CC2560 With the Sitara™ AM335x, AM437x, AM57x Processors....................................
8.4
Use CC2560 With the Tiva™ ARM® MCU .....................................................................
8.5
Use CC2560 With a Non-TI Processor .........................................................................
Additional Documentation Support .......................................................................................
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Trademarks
Texas Instruments, MSP430, CapTIvate, LaunchPad, SimpleLink, MSP432, Sitara, Tiva, BoosterPack are
trademarks of Texas Instruments.
ARM, Cortex are registered trademarks of ARM Limited.
Amkor Technology is a trademark of Amkor Technology.
iPod, Apple are registered trademarks of Apple Inc.
Bluetooth, Bluetooth SIG are registered trademarks of Bluetooth SIG, Inc.
STM32 is a registered trademark of STMicroelectronics International N.V.
Bluetopia is a registered trademark of Stonestreet One, LLC.
Linux is a registered trademark of The Linux Foundation.
Wi-Fi is a registered trademark of Wi-Fi Aliance.
All other trademarks are the property of their respective owners.
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CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
SWRU523A – June 2017 – Revised June 2018
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Select the Device or Module
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1
Select the Device or Module
Table 1 lists the device and module options.
Table 1. Device and Module Information
Devices and Modules
Property
CC2564C
CC2564MODA
CC2564MODN
CC2564
Bluetooth BR-EDR
√
√
√
√
√
Bluetooth low energy
√
√
√
√
—
Module or IC
IC
Module
Module
IC
IC
FCC, IC, CE certification
—
√
√
—
—
Bluetooth certification
4.2
4.1
4.1
4.1
4.1
Internal antenna
—
√
—
—
—
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CC2560
CC256x Getting Started Selection Guide
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3
Device Information
2
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Device Information
For more information about the CC256x devices, see the CC256x wiki page.
Ask questions and solve problems with fellow engineers on our E2E Dual-Mode Bluetooth® Forum.
The following blog is applicable to the devices in the CC256x family:
Three reasons why our dual-mode Bluetooth stack is your new go-to software solution
2.1
CC2564C
For detailed information, see the CC2564C product folder page.
The following blog is applicable to the CC2564C device:
Introducing TI’s dual-mode Bluetooth® 4.2 CC2564C solution
2.1.1
Certifications
Hardware: Declaration ID D032801, QD ID 87924
Host software:
• Declaration ID D032797, QD ID 85355
• Declaration ID D025552, QD ID 69886
2.2
CC2564MODA
For detailed information, see the CC2564MODA product folder page.
The following blogs are applicable to the CC2564MODA device:
• The dual-mode Bluetooth® module you’ve been waiting for is here
• Maximize your IoT design with new dual-mode Bluetooth® + MSP432™ MCU bundle
• Driving industrial markets with TI’s dual-mode Bluetooth® module
2.2.1
Certifications
Hardware: Declaration ID D024698, QD ID 64631
Host software:
• Declaration ID D025551, QD ID 69887
• Declaration ID D025552, QD ID 69886
The CC2564MODA (integrated antenna) device is FCC, IC, and CE certified to allow fast time to market
and minimal RF expertise. Learn how to transfer this certification to your device (see the CC256x FCC, IC,
and CE Certification Guide wiki page).
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Device Information
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2.3
CC2564MODN
For detailed information, see the CC2564MODN product folder page.
2.3.1
Certifications
Hardware: Declaration ID D022476, QD ID 55257
Host software:
• Declaration ID D025551, QD ID 69887
• Declaration ID D025552, QD ID 69886
The CC2564MODN (external antenna) device is FCC, IC, and CE certified to allow fast time to market and
minimal RF expertise. Learn how to transfer this certification to your device (see the CC256x FCC, IC, and
CE Certification Guide wiki page).
2.4
CC2564
For detailed information, see the CC2564 product folder page.
2.4.1
Certifications
Hardware: Declaration ID D022263, QD ID 54666
Host software:
• Declaration ID D025551, QD ID 69887
• Declaration ID D025552, QD ID 69886
2.4.2
Reference Design for CC2564
Low Noise and Small Form Factor Power Management Reference Design for CC256X Bluetooth®
Controller — The TIDA-00598 reference design features a low noise and size optimized power
management solution that regulates 5 V to 3.3 V and 1.8 V required to operate the CC256x
Bluetooth controller. These regulated voltage rails can also be used to power other components in
the system as microcontroller, level shifters, and sensors.
2.5
CC2560
For detailed information, see the CC2560 product folder page.
2.5.1
Certifications
Hardware: Declaration ID D022263, QD ID 54666
Host software:
• Declaration ID D025551, QD ID 69887
• Declaration ID D025552, QD ID 69886
2.5.2
Reference Design for CC2560
Low Noise and Small Form Factor Power Management Reference Design for CC256X Bluetooth®
Controller — The TIDA-00598 reference design features a low noise and size optimized power
management solution that regulates the 5 V to 3.3 V and 1.8 V required to operate the CC256x
Bluetooth controller. These regulated voltage rails can also be used to power other components in
the system as microcontroller, level shifters, and sensors.
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Processor Information
3
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Processor Information
The following subsections present the processors that are supported.
3.1
MSP430™ Microcontrollers
Features for the MSP430™ microcontroller (MCU) follow:
• Ultra-low-power microcontrollers family, optimized to achieve extended battery life in portable
measurement applications
• Advancing MCU technology with new integrated peripherals:
– CapTIvate™ technology
– Smart analog combo
– Low-energy accelerator (LEA)
– And more
• Broadest MCU portfolio with non-volatile FRAM memory, enabling faster writes, lower power
consumption and better reliability than flash
• Thousands of software libraries, online training, code examples, and application notes to simplify
developing across the ecosystem
• To learn more, see MSP430™ Ultra-Low-Power Microcontrollers and get started today with the
LaunchPad™ development platform.
3.1.1
Reference Designs for MSP430™ MCU
Bluetooth® and MSP430™ Audio Sink Reference Design — TI's Bluetooth + MSP430 Audio sink
reference design can be used by customers to create a variety of applications for low end, low
power audio solutions. Some application possibilities are toys, low end bluetooth speakers, and
audio streaming accessories. This reference design is a cost effective audio implementation and
with full design files provided allows you to focus your efforts on application and end product
development. Software supported on this reference design includes the TI Bluetooth Stack.
Bluetooth® and MSP430™ Audio Source Reference Design Board — The Bluetooth and low-power
MSP microcontroller Audio Source reference design can be used by customers to create a variety
of applications for low-end, low-power audio source solutions for applications including toys,
projectors, smart remotes, and any audio streaming accessories. This reference design is a costeffective audio implementation and with full design files provided allows you to focus your efforts on
application and end product development. This reference design also provides the TI Bluetooth
Stack.
3.2
SimpleLink™ MSP432™ ARM® Cortex®-M4F MCU
Features for the SimpleLink™ MSP432™ ARM® Cortex®-M4F MCU follow:
• High precision 1 MSPS SAR ADC with up to 16 bits of resolution
• 48-MHz ARM Cortex-M4 with floating point unit
• Ultra-low-power of 80 µA/MHz
• IP protection to secure multiple firmware
• To learn more, see TI SimpleLink™ MSP432™ Microcontrollers.
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Processor Information
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3.3
Sitara™ Processors
For an overview of the Sitara™ processors available from TI, see Sitara™ Processors.
3.3.1
Sitara™ AM335x Processors
Features for the Sitara AM335x processors follow:
• Scalable ARM® Cortex®-A8 based core from 300 MHz up to 1 GHz
• 3D graphics option for enhanced user interface
• Dual-core PRU-ICSS for industrial Ethernet protocols and position feedback control
• Secure-boot option
• To learn more, see Sitara™ AM335x Processors.
3.3.2
Sitara™ AM437x Processors
Features for the Sitara™ AM437x processors follow:
• Scalable ARM® Cortex®-A9 based core from 300 MHz up to 1 GHz
• 3D graphics option for enhanced user interface
• Quad-core PRU-ICSS for industrial Ethernet protocols and position feedback control
• Dual-camera support for barcode scanning, preview and still pictures
• Secure-boot option
• To learn more, see Sitara™ AM437x Processors.
3.3.3
Sitara™ AM57x Processors
Features for the Sitara™ AM57x processors follow:
• Scalable single/dual ARM® Cortex®-A15 and C66x processor family
• 1080p HD video acceleration
• Dual 3D graphics and single 2D graphics options for enhanced user interface
• Quad core PRU and dual ARM® Cortex®-M4 core for real-time, deterministic control
• ICSS for industrial communications and high speed peripherals such as PCIe, USB 3.0, SATA and Gb
Ethernet
• Secure-boot option
• To learn more, see Sitara™ AM57x Processors.
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Processor Information
3.4
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®
Tiva™ ARM MCUs
Features for the Tiva™ ARM® Processors follow:
• TM4C129x MCUs
– ARM® Cortex®-M4F based MCUs
– Integrated Ethernet MAC + PHY
– 120-MHz CPU
– On-chip data protection and an LCD controller
• TM4C123x MCUs
– ARM Cortex-M4F CPU with single-precision floating-point core
– USB OTG, and two CAN controllers
– 80-MHz CPU
– High-performance analog-to-digital converters
– Low-power modes that consume as little 1.6 µA, with up to 40 PWM outputs
• To learn more, see TM4C12x ARM® Cortex®-M4F Core-Based Microcontrollers.
3.5
Non-TI (Including STM32® F4) Processor
There are options for using the CC2564x devices with non-TI processors:
• TI offers flexibility to attach most ARM processors running Linux® OS.
• TI offers a royalty-free stack for the STM32® F4 processor series (noOS and FreeRTOS).
• The stack can be ported to other ARM® Cortex®-M3 and ARM® Cortex®-M4 based processors. For
more information, refer to the API documentation and porting guidelines included in the stack SDK.
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Selection Guide for CC2564C
4.1
Use CC2564C With the MSP430™ MCU
Use of the CC2564C device with the MSP430™ Ultra-Low-Power Microcontrollers is not currently
available.
For more details, see the TI E2E Community Dual-Mode Bluetooth® Forum. For further assistance,
contact TI support or a TI sales representative.
4.2
Use CC2564C With the MSP432™ MCU
See the information in this section for using the CC2564C device with the TI SimpleLink MSP432™
Microcontrollers.
4.2.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564C device:
– CC2564C Dual-Mode Bluetooth Controller Evaluation Module, CC256XCQFN-EM
• Application processor platform:
– SimpleLink MSP432P401R LaunchPad Development Kit, MSP-EXP432P401R
• Adapters required:
– EM Adapter BoosterPack™ Plug-in Module, BOOST-CCEMADAPTER
• For audio/voice applications that use A3DP, HFP, or HSP:
– SimpleLink Wi-Fi® CC3200 Audio BoosterPack, CC3200AUDBOOST
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
4.2.2
Software
Build your Bluetooth use case and application with free software:
CC2564C TI Dual-Mode Bluetooth® Stack on MSP432™ MCUs (noOS)
The Apple MFi iPod® Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple® MFi license, follow the link to request access to the information:
MFi add-on download approval request
4.2.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC2564C Dual-Mode Bluetooth® Controller
• Bulletin: TI Bluetooth® CC2564C Solution
• Technical guides and user's guides:
– CC2564C TI Dual-Mode Bluetooth® Stack on MSP432™ MCUs
– CC256xCQFN-EM User's Guide
– Dual-Mode Bluetooth® CC2564CQFN-EM Evaluation Board
– EM Adapter BoosterPack User’s Guide
– CC256xEM Bluetooth® Adapter Kit
• Other documents and links:
– CC2564B to CC2564C Migration Guide
– Application Notes for CC2564C Bluetooth® 4.1 and 4.2
– QFN/SON PCB Attachment Application Report
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Selection Guide for CC2564C
4.3
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Use CC2564C With the Sitara™ AM335x, AM437x, AM57x Processors
See the information in this section for using the CC2564C device with the AM335x Processors, AM437x
Processors, or the AM57x Processors.
4.3.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564C device:
– CC2564C Dual-Mode Bluetooth Controller Evaluation Module, CC256XCQFN-EM
• Application processor platforms:
– For AM335x, use the AM335x Evaluation Module, TMDXEVM3358.
– For AM437x, use the AM437x Evaluation Module, TMDXEVM437x.
– For AM57x, use the AM572x Evaluation Module, TMDSEVM572X.
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
4.3.2
Software
Build your Bluetooth use case and application with free software:
TI Bluetooth 4.2 Stack Add-On for Linux Platforms With WL183x and CC2564C (Linux)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
4.3.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC2564C Dual-Mode Bluetooth® Controller
• Bulletin: TI Bluetooth® CC2564C Solution
• Technical guides and user's guides:
– CC256xCQFN-EM User's Guide
– Dual-Mode Bluetooth® CC2564CQFN-EM Evaluation Board
• Other documents and links:
– Bluetopia® Platform Manager Getting Started Guide wiki page
– CC2564B to CC2564C Migration Guide
– Application Notes for CC2564C Bluetooth® 4.1 and 4.2
– QFN/SON PCB Attachment Application Report
4.4
Use CC2564C With the Tiva™ ARM® MCU
See the information in this section for using the CC2564C device with the Tiva TM4C12x ARM® Cortex®M4F Core-Based Microcontrollers is not currently available.
For more details, see the TI E2E Community Dual-Mode Bluetooth® Forum. For further assistance,
contact TI support or a TI sales representative.
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4.5
Use CC2564C With a Non-TI Processor
See the information in this section for using the CC2564C device with a non-TI processor.
4.5.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564C device:
– CC2564C Dual-Mode Bluetooth Controller Evaluation Module, CC256XCQFN-EM
• Application processor platforms:
– Works with platforms like STM3240G EVAL
• Adapter:
– CC256XEM-STADAPT (see the TI Dual-mode Bluetooth® Stack on STM32F4 MCUs product
folder)
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
4.5.2
Software
For the STM32 F4 processor, build your Bluetooth use case and application with free software to get
started:
CC2564C TI Dual-mode Bluetooth® Stack on STM32F4 MCUs (noOS and FreeRTOS)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
4.5.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC2564C Dual-Mode Bluetooth® Controller
• Bulletin: TI Bluetooth® CC2564C Solution
• Technical guides and user's guides:
– CC2564C TI Dual-Mode Bluetooth® Stack on STM32F4 MCUs
– CC256xCQFN-EM User's Guide
– Dual-Mode Bluetooth® CC2564CQFN-EM Evaluation Board
– CC256xEM Bluetooth® Adapter Kit
– EM Adapter BoosterPack User’s Guide
• Other documents and links:
– CC2564B to CC2564C Migration Guide
– Application Notes for CC2564C Bluetooth® 4.1 and 4.2
– QFN/SON PCB Attachment Application Report
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Selection Guide for CC2564MODA
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Selection Guide for CC2564MODA
5.1
Use CC2564MODA With MSP430™ MCU
See the information in this section for using the CC2564MODA device with the MSP430™ Ultra-LowPower Microcontrollers.
5.1.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564MODA:
– Dual-Mode Bluetooth CC2564 Module with Integrated Antenna Evaluation Board,
CC2564MODAEM
• Application processor platforms:
– MSP430F5438 Experimenter Board, MSP-EXP430F5438
– For Bluetooth low energy and SPP only, use MSP430F5529 USB Experimenter’s Board,
MSP-EXP430F5529.
• For audio/voice applications that use A3DP, HFP, or HSP:
– Audio codec with manual routing is required.
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
5.1.2
Software
Build your Bluetooth use case and application with free software:
TI Dual-mode Bluetooth® stack on MSP430™ MCUs (noOS)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
5.1.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC2564MODx Bluetooth® Host Controller Interface (HCI) Module
• Bulletin: TI Bluetooth® CC256x Solutions: Dual-Mode Bluetooth 4.1 Controller Available in Certified
Modules With Integrated Audio Capabilities
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Module With Integrated Antenna Evaluation Board User's Guide
– Dual-Mode Bluetooth® CC2564 Module With Integrated Antenna Evaluation Board Quick Start
Guide
• Other documents and links:
– CC256x MSP430 TI Bluetooth Stack wiki page
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5.2
Use CC2564MODA With MSP432™ MCU
See the information in this section for using the CC2564MODA device with the TI SimpleLink MSP432™
Microcontrollers.
5.2.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564MODA:
– Dual-Mode Bluetooth CC2564 Module with Integrated Antenna BoosterPack Plug-In Module,
BOOST-CC2564MODA
• Application processor platforms:
– SimpleLink MSP432P401R LaunchPad Development Kit, MSP-EXP432P401R
• For audio/voice applications that use A3DP, HFP, or HSP:
– SimpleLink Wi-Fi CC3200 Audio BoosterPack, CC3200AUDBOOST
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
5.2.2
Software
Build your Bluetooth use case and application with free software:
TI Dual-mode Bluetooth Stack on MSP432 MCUs (noOS)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
5.2.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC2564MODx Bluetooth® Host Controller Interface (HCI) Module
• Bulletin: TI Bluetooth® CC256x Solutions: Dual-Mode Bluetooth 4.1 Controller Available in Certified
Modules With Integrated Audio Capabilities
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Module With Integrated Antenna BoosterPack™ Plug-in Module
User's Guide
– TI Dual-Mode Bluetooth® Stack on MSP432™ MCUs User's Guide
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Selection Guide for CC2564MODA
5.3
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Use CC2564MODA With the Sitara™ AM335x, AM437x, AM57x Processors
See the information in this section for using the CC2564MODA device with the AM335x Processors,
AM437x Processors, or the AM57x Processors.
5.3.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564MODA:
– Dual-mode Bluetooth CC2564 Module with Integrated Antenna Evaluation Board,
CC2564MODAEM
• Application processor platforms:
– For AM335x, use the AM335x Evaluation Module, TMDXEVM3358.
– For AM437x, use the AM437x Evaluation Module, TMDXEVM437x.
– For AM57x, use the AM572x Evaluation Module, TMDSEVM572X.
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
5.3.2
Software
Build your Bluetooth use case and application with free software:
TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone With WL18xx and
CC256x (Linux)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
5.3.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC2564MODx Bluetooth® Host Controller Interface (HCI) Module
• Bulletin: TI Bluetooth® CC256x Solutions: Dual-Mode Bluetooth 4.1 Controller Available in Certified
Modules With Integrated Audio Capabilities
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Module With Integrated Antenna Evaluation Board User's Guide
– Dual-Mode Bluetooth® CC2564 Module With Integrated Antenna Evaluation Board Quick Start
Guide
• Other documents and links:
– Bluetopia® Platform Manager Getting Started Guide wiki page
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5.4
®
Use CC2564MODA With the Tiva™ ARM MCU
See the information in this section for using the CC2564MODA device with the Tiva TM4C12x ARM®
Cortex®-M4F Core-Based Microcontrollers.
5.4.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564MODA:
– Dual-Mode Bluetooth CC2564 Module with Integrated Antenna Evaluation Board,
CC2564MODAEM
• Application processor platforms:
– TM4C123G USB + CAN Development Kit, DK-TM4C123G
– IoT Enabled ARM Cortex-M4F MCU TM4C129X Connected Development Kit, DK-TM4C129X
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
5.4.2
Software
Build you Bluetooth use case and application with free software:
Tiva Bluetooth Stack: TI Dual-Mode Bluetooth® Stack on TM4C MCUs (noOS and TI-RTOS)
5.4.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC2564MODx Bluetooth® Host Controller Interface (HCI) Module
• Bulletin: TI Bluetooth® CC256x Solutions: Dual-Mode Bluetooth 4.1 Controller Available in Certified
Modules With Integrated Audio Capabilities
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Module With Integrated Antenna Evaluation Board User's Guide
– Dual-Mode Bluetooth® CC2564 Module With Integrated Antenna Evaluation Board Quick Start
Guide
• Other documents and links:
– Stack SDK User’s Guide wiki page
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
15
Selection Guide for CC2564MODA
5.5
www.ti.com
Use CC2564MODA With a Non-TI Processor
See the information in this section for using the CC2564MODA device with a non-TI processor.
5.5.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564MODA:
– Dual-Mode Bluetooth CC2564 Module with Integrated Antenna Evaluation Board,
CC2564MODAEM
• Application processor platforms:
– Works with platforms like STM3240G EVAL.
• Adapter:
– CC256XEM-STADAPT (see the TI Dual-mode Bluetooth® Stack on STM32F4 MCUs product
folder)
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
5.5.2
Software
For the STM32 F4 processor, build your Bluetooth use case and application with free software:
TI Dual-mode Bluetooth® Stack on STM32F4 MCUs (noOS and FreeRTOS)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
5.5.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC2564MODx Bluetooth® Host Controller Interface (HCI) Module
• Bulletin: TI Bluetooth® CC256x Solutions: Dual-Mode Bluetooth 4.1 Controller Available in Certified
Modules With Integrated Audio Capabilities
• Technical guides and user's guides:
– Dual-Mode Bluetooth® Stack on STM32F4 MCUs User's Guide
– Dual-Mode Bluetooth® CC2564 Module With Integrated Antenna Evaluation Board User's Guide
– Dual-Mode Bluetooth® CC2564 Module With Integrated Antenna Evaluation Board Quick Start
Guide
– CC256xEM Bluetooth® Adapter Kit
– EM Adapter BoosterPack User’s Guide
16
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
Selection Guide for CC2564MODN
www.ti.com
6
Selection Guide for CC2564MODN
6.1
Use CC2564MODN With the MSP430™ MCU
See the information in this section for using the CC2564MODN device with the MSP430™ Ultra-LowPower Microcontrollers.
6.1.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564MODN:
– Dual-Mode Bluetooth CC2564 Module Evaluation Board, CC2564MODNEM
• Application processor platforms:
– MSP430F5438 Experimenter Board, MSP-EXP430F5438
– For Bluetooth low energy and SPP only, use the MSP430F5529 USB Experimenter’s Board,
MSP-EXP430F5529.
• For audio/voice applications that use A3DP, HFP, or HSP:
– Audio codec with manual routing is required.
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
6.1.2
Software
Build your Bluetooth use case and application with free software:
TI Dual-mode Bluetooth® stack on MSP430™ MCUs (noOS)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
6.1.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC2564MODx Bluetooth® Host Controller Interface (HCI) Module
• Bulletin: TI Bluetooth® CC256x Solutions: Dual-Mode Bluetooth 4.1 Controller Available in Certified
Modules With Integrated Audio Capabilities
• Technical guides and user's guides:
– BOOST-CCEMADAPTER EM Adapter BoosterPack User’s Guide
– Dual-Mode Bluetooth® CC2564 Module Evaluation Board User's Guide
– Dual-Mode Bluetooth® CC2564 Module Evaluation Board Quick Start Guide
– CC256xEM Bluetooth® Adapter Kit Quick Start Guide
– CC256x MSP430™ TI Bluetooth® Stack wiki page
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
17
Selection Guide for CC2564MODN
6.2
www.ti.com
Use CC2564MODN With the MSP432™ MCU
See the information in this section for using the CC2564MODN device with the TI SimpleLink MSP432™
Microcontrollers.
6.2.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564MODN:
– Dual-Mode Bluetooth CC2564 Module with Integrated Antenna BoosterPack Plug-In Module,
BOOST-CC2564MODA
• Application processor platforms:
– SimpleLink MSP432P401R LaunchPad Development Kit, MSP-EXP432P401R
• For audio/voice applications that use A3DP, HFP, or HSP:
– SimpleLink Wi-Fi CC3200 Audio BoosterPack, CC3200AUDBOOST
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
6.2.2
Software
Build your Bluetooth use case and application with free software:
TI Dual-mode Bluetooth Stack on MSP432 MCUs (noOS)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
6.2.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC2564MODx Bluetooth® Host Controller Interface (HCI) Module
• Bulletin: TI Bluetooth® CC256x Solutions: Dual-Mode Bluetooth 4.1 Controller Available in Certified
Modules With Integrated Audio Capabilities
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Module Evaluation Board Quick Start Guide
– Dual-Mode Bluetooth® CC2564 Module Evaluation Board User's Guide
– EM Adapter BoosterPack User’s Guide
– CC256xEM Bluetooth® Adapter Kit Quick Start Guide
– TI Dual-Mode Bluetooth® Stack on MSP432™ MCUs User's Guide
18
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
Selection Guide for CC2564MODN
www.ti.com
6.3
Use CC2564MODN With the Sitara™ AM335x, AM437x, AM57x Processors
See the information in this section for using the CC2564MODN device with the AM335x Processors,
AM437x Processors, or the AM57x Processors.
6.3.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564MODN:
– Dual-Mode Bluetooth CC2564 Module Evaluation Board, CC2564MODNEM
• Application processor platforms:
– For AM335x, use the AM335x Evaluation Module, TMDXEVM3358.
– For AM437x, use the AM437x Evaluation Module, TMDXEVM437x.
– For AM57x, use the AM572x Evaluation Module, TMDSEVM572X.
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
6.3.2
Software
Build your Bluetooth use case and application with free software:
TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone With WL18xx and
CC256x (Linux)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
6.3.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC2564MODx Bluetooth® Host Controller Interface (HCI) Module
• Bulletin: TI Bluetooth® CC256x Solutions: Dual-Mode Bluetooth 4.1 Controller Available in Certified
Modules With Integrated Audio Capabilities
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Module Evaluation Board
– Dual-Mode Bluetooth® CC2564 Module Evaluation Board User's Guide
• Other documents and links:
– Bluetopia® Platform Manager Getting Started Guide wiki page
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
19
Selection Guide for CC2564MODN
6.4
www.ti.com
®
Use CC2564MODN With the Tiva™ ARM MCU
See the information in this section for using the CC2564MODN device with the Tiva TM4C12x ARM®
Cortex®-M4F Core-Based Microcontrollers.
6.4.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564MODN:
– Dual-Mode Bluetooth CC2564 Module Evaluation Board, CC2564MODNEM
• Application processor platforms:
– TM4C123G USB + CAN Development Kit, DK-TM4C123G
– IoT Enabled ARM Cortex-M4F MCU TM4C129X Connected Development Kit, DK-TM4C129X
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
6.4.2
Software
Build your Bluetooth use case and application with free software:
Tiva Bluetooth Stack: TI Dual-Mode Bluetooth® Stack on TM4C MCUs (noOS and TI-RTOS)
6.4.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC2564MODx Bluetooth® Host Controller Interface (HCI) Module
• Bulletin: TI Bluetooth® CC256x Solutions: Dual-Mode Bluetooth 4.1 Controller Available in Certified
Modules With Integrated Audio Capabilities
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Module Evaluation Board User's Guide
– Dual-Mode Bluetooth® CC2564 Module Evaluation Board Quick Start Guide
• Other documents and links:
– Stack SDK User’s Guide wiki page
20
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
Selection Guide for CC2564MODN
www.ti.com
6.5
Use CC2564MODN With a Non-TI Processor
See the information in this section for using the CC2564MODN device with a non-TI processor.
6.5.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564MODN:
– Dual-Mode Bluetooth CC2564 Module Evaluation Board, CC2564MODNEM
• Application processor platforms:
– Works with platforms like STM3240G EVAL.
• Adapter:
– CC256XEM-STADAPT (see the TI Dual-mode Bluetooth® Stack on STM32F4 MCUs product
folder)
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
6.5.2
Software
For the STM32 F4 processor, build your Bluetooth use case and application with free software:
TI Dual-mode Bluetooth® Stack on STM32F4 MCUs (noOS and FreeRTOS)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
6.5.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC2564MODx Bluetooth® Host Controller Interface (HCI) Module
• Bulletin: TI Bluetooth® CC256x Solutions: Dual-Mode Bluetooth 4.1 Controller Available in Certified
Modules With Integrated Audio Capabilities
• Technical guides and user's guides:
– Dual-Mode Bluetooth® Stack on STM32F4 MCUs User's Guide
– Dual-Mode Bluetooth® CC2564 Module Evaluation Board User's Guide
– Dual-Mode Bluetooth® CC2564 Module Evaluation Board Quick Start Guide
– CC256xEM Bluetooth® Adapter Kit
– EM Adapter BoosterPack User’s Guide
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
21
Selection Guide for CC2564
www.ti.com
7
Selection Guide for CC2564
7.1
Use CC2564 With the MSP430™ MCU
See the information in this section for using the CC2564 device with the MSP430™ Ultra-Low-Power
Microcontrollers.
7.1.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564:
– Dual-Mode Bluetooth CC2564 Evaluation Board, CC256XQFNEM
• Application processor platforms:
– MSP430F5438 Experimenter Board, MSP-EXP430F5438
– For Bluetooth low energy and SPP only, use the MSP430F5529 USB Experimenter’s Board,
MSP-EXP430F5529.
• Audio TI designs:
– For audio source TI design, use the Bluetooth and MSP MCU Audio Source Reference Design,
BT-MSPAUDSOURCE-RD.
– For audio sink TI design, use the Bluetooth and MSP430 Audio Sink Reference Design,
BT-MSPAUDSINK-RD.
• For audio/voice applications that use A3DP, HFP, or HSP:
– Audio codec with manual routing is required.
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
7.1.2
Software
Build your Bluetooth use case and application with free software:
TI Dual-mode Bluetooth® stack on MSP430™ MCUs (noOS)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
7.1.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC256x Dual-Mode Bluetooth Controller
• Bulletin: TI Bluetooth® CC256x Solutions
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Evaluation Board Quick Start Guide
– CC256x MSP430™ TI Bluetooth® Stack wiki page
• Other documents and links:
– QFN/SON PCB Attachment Application Report
22
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
Selection Guide for CC2564
www.ti.com
7.2
Use CC2564 With the MSP432™ MCU
See the information in this section for using the CC2564 device with the TI SimpleLink MSP432™
Microcontrollers.
7.2.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564:
– Dual-Mode Bluetooth CC2564 Module with Integrated Antenna BoosterPack Plug-In Module,
BOOST-CC2564MODA
• Application processor platforms:
– SimpleLink MSP432P401R LaunchPad Development Kit, MSP-EXP432P401R
• For audio/voice applications that use A3DP, HFP, or HSP:
– SimpleLink Wi-Fi CC3200 Audio BoosterPack, CC3200AUDBOOST
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
7.2.2
Software
Build your Bluetooth use case and application with free software:
TI Dual-Mode Bluetooth® Stack on MSP432™ MCUs (noOS)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
7.2.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC256x Dual-Mode Bluetooth Controller
• Bulletin: TI Bluetooth® CC256x Solutions
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Evaluation Board Quick Start Guide
– TI Dual-Mode Bluetooth® Stack on MSP432™ MCUs User's Guide
• Other documents and links:
– QFN/SON PCB Attachment Application Report
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
23
Selection Guide for CC2564
7.3
www.ti.com
Use CC2564 With the Sitara™ AM335x, AM437x, AM57x Processors
See the information in this section for using the CC2564 device with the AM335x Processors, AM437x
Processors, or the AM57x Processors.
7.3.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564:
– Dual-Mode Bluetooth CC2564 Evaluation Board, CC256XQFNEM
• Application processor platforms:
– For AM335x, use the AM335x Evaluation Module, TMDXEVM3358.
– For AM437x, use the AM437x Evaluation Module, TMDXEVM437x.
– For AM57x, use the AM572x Evaluation Module, TMDSEVM572X.
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
7.3.2
Software
Build your Bluetooth use case and application with free software:
TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone With WL18xx and
CC256x (Linux)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
7.3.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC256x Dual-Mode Bluetooth Controller
• Bulletin: TI Bluetooth® CC256x Solutions
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Evaluation Board Quick Start Guide
• Other documents and links:
– QFN/SON PCB Attachment Application Report
– Bluetopia® Platform Manager Getting Started Guide wiki page
24
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
Selection Guide for CC2564
www.ti.com
7.4
®
Use CC2564 With the Tiva™ ARM MCU
See the information in this section for using the CC2564 device with the Tiva TM4C12x ARM® Cortex®M4F Core-Based Microcontrollers.
7.4.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564:
– Dual-Mode Bluetooth CC2564 Evaluation Board, CC256XQFNEM
• Application processor platforms:
– TM4C123G USB + CAN Development Kit, DK-TM4C123G
– IoT Enabled ARM Cortex-M4F MCU TM4C129X Connected Development Kit, DK-TM4C129X
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
7.4.2
Software
Build your Bluetooth use case and application with free software:
Tiva Bluetooth Stack: TI Dual-Mode Bluetooth® Stack on TM4C MCUs (noOS and TI-RTOS)
7.4.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC256x Dual-Mode Bluetooth Controller
• Bulletin: TI Bluetooth® CC256x Solutions
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Evaluation Board Quick Start Guide
• Other documents and links:
– Stack SDK User’s Guide wiki page
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
25
Selection Guide for CC2564
7.5
www.ti.com
Use CC2564 With a Non-TI Processor
See the information in this section for using the CC2564 device with a non-TI processor.
7.5.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564:
– Dual-Mode Bluetooth CC2564 Evaluation Board, CC256XQFNEM
• Application processor platforms:
– Works with platforms like STM3240G EVAL
• Adapter:
– CC256XEM-STADAPT (see the TI Dual-mode Bluetooth® Stack on STM32F4 MCUs product
folder)
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
7.5.2
Software
For the STM32 F4 processor, build your Bluetooth use case and application with free software:
TI Dual-mode Bluetooth® Stack on STM32F4 MCUs (noOS and FreeRTOS)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
7.5.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC256x Dual-Mode Bluetooth Controller
• Bulletin: TI Bluetooth® CC256x Solutions
• Technical guides and user's guides:
– Dual-Mode Bluetooth® Stack on STM32F4 MCUs User's Guide
– Dual-Mode Bluetooth® CC2564 Evaluation Board Quick Start Guide
– CC256xEM Bluetooth® Adapter Kit
– EM Adapter BoosterPack User’s Guide
• Other documents and links:
– QFN/SON PCB Attachment Application Report
26
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
Selection Guide for CC2560
www.ti.com
8
Selection Guide for CC2560
8.1
Use CC2560 With the MSP430™ MCU
See the information in this section for using the CC2560 device with the MSP430™ Ultra-Low-Power
Microcontrollers.
8.1.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2560:
– Dual-Mode Bluetooth CC2564 Evaluation Board, CC256XQFNEM
• Application processor platforms:
– MSP430F5438 Experimenter Board, MSP-EXP430F5438
– For Bluetooth low energy and SPP only, use the MSP430F5529 USB Experimenter’s Board,
MSP-EXP430F5529.
• Audio TI designs:
– For audio source TI design, use the Bluetooth and MSP MCU Audio Source Reference Design,
BT-MSPAUDSOURCE-RD.
– For audio sink TI design, use the Bluetooth and MSP430 Audio Sink Reference Design,
BT-MSPAUDSINK-RD.
• For audio/voice applications that use A3DP, HFP, or HSP:
– Audio codec with manual routing is required.
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
8.1.2
Software
Build your Bluetooth use case and application with free software:
TI Dual-mode Bluetooth® stack on MSP430™ MCUs (noOS)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
8.1.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC256x Dual-Mode Bluetooth Controller
• Bulletin: TI Bluetooth® CC256x Solutions
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Evaluation Board Quick Start Guide
– CC256x MSP430™ TI Bluetooth® Stack wiki page
• Other documents and links:
– QFN/SON PCB Attachment Application Report
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
27
Selection Guide for CC2560
8.2
www.ti.com
Use CC2560 With MSP432™ MCU
See the information in this section for using the CC2560 device with the TI SimpleLink MSP432™
Microcontrollers.
8.2.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2560:
– Dual-Mode Bluetooth CC2564 Module with Integrated Antenna BoosterPack Plug-In Module,
BOOST-CC2564MODA
• Application processor platforms:
– SimpleLink MSP432P401R LaunchPad Development Kit, MSP-EXP432P401R
• Audio TI designs:
– SimpleLink Wi-Fi CC3200 Audio BoosterPack, CC3200AUDBOOST
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
8.2.2
Software
Build your Bluetooth use case and application with free software:
TI Dual-Mode Bluetooth® Stack on MSP432™ MCUs (noOS)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
8.2.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC256x Dual-Mode Bluetooth Controller
• Bulletin: TI Bluetooth® CC256x Solutions
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Evaluation Board Quick Start Guide
– TI Dual-Mode Bluetooth® Stack on MSP432™ MCUs User's Guide
• Other documents and links:
– QFN/SON PCB Attachment Application Report
28
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
Selection Guide for CC2560
www.ti.com
8.3
Use CC2560 With the Sitara™ AM335x, AM437x, AM57x Processors
See the information in this section for using the CC2560 device with the AM335x Processors, AM437x
Processors, or the AM57x Processors.
8.3.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2560:
– Dual-Mode Bluetooth CC2564 Evaluation Board, CC256XQFNEM
• Application processor platforms:
– For AM335x, use the AM335x Evaluation Module, TMDXEVM3358.
– For AM437x, use the AM437x Evaluation Module, TMDXEVM437x.
– For AM57x, use the AM572x Evaluation Module, TMDSEVM572X.
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
8.3.2
Software
Build your Bluetooth use case and application with free software:
TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone With WL18xx and
CC256x (Linux)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
8.3.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC256x Dual-Mode Bluetooth Controller
• Bulletin: TI Bluetooth® CC256x Solutions
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Evaluation Board Quick Start Guide
• Other documents and links:
– QFN/SON PCB Attachment Application Report
– Bluetopia® Platform Manager Getting Started Guide wiki page
SWRU523A – June 2017 – Revised June 2018
Submit Documentation Feedback
CC256x Getting Started Selection Guide
Copyright © 2017–2018, Texas Instruments Incorporated
29
Selection Guide for CC2560
8.4
www.ti.com
®
Use CC2560 With the Tiva™ ARM MCU
See the information in this section for using the CC2560 device with the Tiva TM4C12x ARM® Cortex®M4F Core-Based Microcontrollers.
8.4.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2564:
– Dual-Mode Bluetooth CC2564 Evaluation Board, CC256XQFNEM
• Application processor platforms:
– TM4C123G USB + CAN Development Kit, DK-TM4C123G
– IoT Enabled ARM Cortex-M4F MCU TM4C129X Connected Development Kit, DK-TM4C129X
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
8.4.2
Software
Build your Bluetooth use case and application with free software:
Tiva Bluetooth Stack: TI Dual-Mode Bluetooth® Stack on TM4C MCUs (noOS and TI-RTOS)
8.4.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC256x Dual-Mode Bluetooth Controller
• Bulletin: TI Bluetooth® CC256x Solutions
• Technical guides and user's guides:
– Dual-Mode Bluetooth® CC2564 Evaluation Board Quick Start Guide
• Other documents and links:
– Stack SDK User’s Guide wiki page
30
CC256x Getting Started Selection Guide
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Selection Guide for CC2560
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8.5
Use CC2560 With a Non-TI Processor
See the information in this section for using the CC2560 device with a non-TI processor.
8.5.1
Hardware
These are the evaluation platforms that fit your design needs:
• EVM for the CC2560:
– Dual-Mode Bluetooth CC2564 Evaluation Board, CC256XQFNEM
• Application processor platforms:
– Works with platforms like STM3240G EVAL.
• Adapter:
– CC256XEM-STADAPT (see the TI Dual-mode Bluetooth® Stack on STM32F4 MCUs product
folder)
• HCI tester: This hardware evaluation tool is used to evaluate RF performance and configure Bluetooth
properties.
• See the CC256x Hardware Design Checklist.
8.5.2
Software
For the STM32 F4 processor, build your Bluetooth use case and application with free software:
TI Dual-mode Bluetooth® Stack on STM32F4 MCUs (noOS and FreeRTOS)
The Apple MFi iPod Accessory Protocol (iAP) protocol is supported by add-on software packages. For
customers with a valid Apple MFi license, follow the link to request access to the information:
MFi add-on download approval request
8.5.3
Technical Documentation
We are here to help. TI offers a wide range of online resources that are accessible anytime, anywhere.
• Data sheet: CC256x Dual-Mode Bluetooth Controller
• Bulletin: TI Bluetooth® CC256x Solutions
• Technical guides and user's guides:
– Technical guides and user's guides:
• Dual-Mode Bluetooth® Stack on STM32F4 MCUs User's Guide
• Dual-Mode Bluetooth® CC2564 Evaluation Board Quick Start Guide
• CC256xEM Bluetooth® Adapter Kit
• EM Adapter BoosterPack User’s Guide
• Other documents and links:
– QFN/SON PCB Attachment Application Report
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Copyright © 2017–2018, Texas Instruments Incorporated
31
Additional Documentation Support
9
www.ti.com
Additional Documentation Support
White Paper: Why Classic Bluetooth® (BR/EDR)? — Bluetooth® technology is a proven, robust, and
widely spread technology. According to Bluetooth SIG®, there are more than 8 billion devices are in
circulation, including a strong presence in approximately 95% of all existing mobile phones and
smartphones. This technology presents a complete solution for wirelessly transmitting audio, voice,
and data. Bluetooth is a well-defined protocol up to the application level, which creates leading
interoperability and compatibility between different devices and manufacturers.
Which TI Bluetooth® Solution Should I Choose? — Texas Instruments™ offers multiple Bluetooth®
solutions, so it might be confusing to choose the correct part. Whether you want to add Bluetooth
technology to an existing device or create a new Bluetooth product, the question is: which TI device
should be chosen? This white paper discusses the CC256x and the CC26xx device options from
Texas Instruments.
Wireless Connectivity Tri-Fold Overview — Today with more users, things and cloud services
connecting to the Internet, the role of wireless connectivity is becoming increasingly important.
At Texas Instruments (TI), we are committed to delivering a broad portfolio of wireless connectivity
solutions that consume the lowest power and are the easiest to use. With TI innovation supporting
your designs, you can share, monitor and manage data wirelessly for applications in wearables,
home and building automation, manufacturing, smart cities, healthcare and automotive.
Learn how you can be a part of the Internet of Things (IoT) as TI helps you connect more.
Surface Mount Assembly of Amkor’s Dual Row MicroLeadFrame (MLF) Packages — See the links to
this documentation at the bottom of the Amkor Technology™ web page.
DN035 – Antenna Selection Quick Guide — This selection guide for antennas lists design and
application notes, antenna frequencies, bandwidth, and dimensions.
AN058 – Antenna Selection Guide — This application note describes important parameters to consider
when deciding what kind of antenna to use in a short range device application.
Important antenna parameters, different antenna types, design aspects and techniques for
characterizing antennas are presented. Radiation pattern, gain, impedance matching, bandwidth,
size and cost are some of the parameters discussed in this document.
Antenna theory and practical measurement are also covered. In addition different antenna types
are presented, with their pros and cons. All of the antenna reference designs available on
www.ti.com/lpw are presented including the Antenna Development Kit (see DN031 – CC-AntennaDK Documentation and Antenna Measurements Summary).
The last section in this document contains references to additional antenna resources such as
literature, applicable EM simulation tools and a list of antenna manufacturer and consultants.
Correct choice of antenna will improve system performance and reduce the cost.
32
CC256x Getting Started Selection Guide
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Revision History
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (June 2017) to A Revision ......................................................................................................... Page
•
Updated URL for MFi add-on download approval request in Software section. .................................................. 9
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Revision History
Copyright © 2017–2018, Texas Instruments Incorporated
33
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