Dfi CS100 Datasheet
9th/8th Gen Intel® CoreTM Processor
Mini-ITX
CS100
-Q370/C246/H310
Desktop
Q370
C246
H310
Mic-in
LAN 2
LAN 1
Line-out USB 3.1 USB 3.1
Gen 1 Gen 2
DP++
DP++
• 2 DDR4 2400/2666MHz SODIMM up to 32GB
• Three independent display: LVDS+VGA+DP++, LVDS+DP++
+DP++, VGA+ DP++ +DP++
• DP++ resolution supports up to 4096x2304 @ 60Hz
• Multiple Expansions:
Q370/C246: 1 PCIe x16 (Gen 3), 1 Full-size Mini PCIe (&
mSATA)
• H310: 1 PCIe x16 (Gen 3), 1 mSATA
• Storage: 3 SATA 3.0
• Rich I/O:
Q370/C246: 2 Intel GbE, 2 COM, 2 USB 3.1 Gen 2, 2 USB 3.1
Gen 1, 4 USB 2.0
H310: 2 Intel GbE, 2 COM, 4 USB 3.1 Gen 1, 4 USB 2.0
COM
VGA
USB 2.0
USB 2.0
CPU Fan
Mini PCIe
LVDS
Intel Core
i7/i5/i3
LPC
PCIe x16
Features
Thin
Mini-ITX
air gap ±15kv
4096x2304
25mm
DP++
4K2K
Display
COM ESD
Protection
DDR4
SATA 3.0
Intel Q370/C246/
H310
BAT
System
Fan
ATX power
Front
Panel
DFI's
Proprietary
Technology
2 Extension Modules for Additional 4 COM Ports
(via the LPC connector)
EXT-RS232
- 4 RS232
DDR4_2 DDR4_1 DIO DIO
SODIMM SODIMM Power
DFI Motherboard
EXT-RS485
- 4 RS485
EXT-RS232/RS485
Additional 4 COM
Model Name
P/N
Memory
CS100-H310D
CS100-Q370D
CS100-C246D
CS100-H310D
CS100-Q370DRM
CS100-C246DRM
770-CS1001-000G
770-CS1001-100G
770-CS1001-200G
770-CS1001-300G
770-CS1001-400G
770-CS1001-500G
2
2
2
2
2
2
Mechanical Drawing
SODIMM
SODIMM
SODIMM
SODIMM
SODIMM
SODIMM
LVDS VGA DP++ GbE RS-232 USB 3.1 Gen 2 USB 3.1 Gen 1 USB 2.0 SATA
3.0
1
1
2
2
2
0
4
4
3
1
1
2
2
2
2
2
4
3
1
1
2
2
2
2
2
4
3
1
1
2
2
2
0
4
4
3
1
1
2
2
2
2
2
4
3
1
1
2
2
2
2
2
4
3
Block Diagram
TPM Thermal Temp.
0
0
0
1
1
1
Cooler
Cooler
Cooler
Cooler
Cooler
Cooler
0
0
0
0
0
0
to
to
to
to
to
to
60oC
60oC
60oC
60oC
60oC
60oC
CS100-Q370/C246/H310
Specifications
SYSTEM
GRAPHICS
Processor
Memory
Chipset
BIOS
Controller
Feature
Display
EXPANSION
Triple Displays
Interface
AUDIO
ETHERNET
Audio Codec
Controller
REAR I/O
Ethernet
USB
Display
INTERNAL I/O
Serial
Audio
Serial
Display
Audio
SATA
DIO
LPC
WATCHDOG TIMER Output & Interval
SECURITY
TPM
POWER
Type
Connector
RTC Battery
Consumption
OS SUPPORT
ENVIRONMENT
Microsoft/Linux
Temperature
Humidity
MTBF
MECHANICAL
Dimensions
Height
CERTIFICATIONS
•
•
•
•
9th Generation Intel® Core™ Processors, LGA 1151 Socket, TDP up to 65W
Intel® Core i7-9700TE Processor (Core 8; Max speed 3.8 GHz; TDP 35W)
Intel® Core i5-9500E Processor (Core 6; Max speed 4.2 GHz; TDP 65W)
Intel® Core i5-9500TE Processor (Core 6; Max speed 3.6 GHz; TDP 35W)
Intel® Core i3-9100E Processor (Core 4; Max speed 3.7 GHz; TDP 65W)
Intel® Core i3-9100TE Processor (Core 4; Max speed 3.2 GHz; TDP 35W)
8th Generation Intel® Core™ Processors, LGA 1151 Socket, TDP up to 80W
Intel® Xeon E-2176G Processor (support ECC Memory)
Intel® Core™ i7-8700 Processor
Intel® Core™ i5-8500 Processor
Intel® Core™ i3-8100 Processor (support ECC Memory)
Intel® Pentium G5400 Processor (support ECC Memory)
Intel® Celeron G4900 Processor (support ECC Memory)
Two 260-pin SODIMM up to 32GB
Dual Channel DDR4 2400/2666MHz (C246 supoort ECC)
Intel® Q370/C246/H310 Chipset
AMI SPI 128Mbit
Intel® UHD Graphics 630 (Pentium G5400, Celeron G4900 support Intel® UHD Graphics 610)
OpenGL 4.4, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9
1 x LVDS
LVDS: resolution up to 1920x1200 @ 60Hz
1 x VGA
VGA: resolution up to 1920x1200 @ 60Hz
2 x DP++
DP: resolution up to 4096x2304 @ 60Hz
LVDS+VGA+DP++, LVDS+DP++ +DP++, VGA+ DP++ +DP++
Q370/C246:
H310:
1 x PCIe x16 (Gen 3)
1 x PCIe x16 (Gen 3)
1 x Full-size Mini PCIe (& mSATA)
1 x mSATA
Realtek ALC888S-VD2-GR
C246/Q370: 1 x Intel® I219LM PHY, 1 x Intel® I211AT PCIe (10/100/1000Mbps) (only Core i7/i5 support iAMT)
H310: 1 x Intel® I219V PHY, 1 x Intel® I211AT PCIe (10/100/1000Mbps)
2 x GbE (RJ-45)
Q370/C246:
H310:
2 x USB 3.1 Gen2
4 x USB 3.1 Gen1
2 x USB 3.1 Gen1
4 x USB 2.0
4 x USB 2.0
1 x VGA
2 x DP++
1 x RS-232 (DB-9)
1 x Line-in (available upon request)
1 x Line-out, 1 x Mic-in
1 x RS-232 (RS-232 w/ power)(2.0mm pitch)
1 x LVDS LCD Panel Connector
1 x LCD/Inverter Power
1 x S/PDIF
1 x Front Audio
3 x SATA 3.0 (up to 6Gb/s)
RAID 0/1/5
1 x 8-bit DIO
1 x LPC (support LPC EXT-RS232/RS485 module)
System Reset, Programmable via Software from 1 to 255 Seconds
dTPM2.0 (available upon request)
ATX
4-pin ATX 12V power
24-pin ATX power
CR2032 Coin Cell
Idle: i7-8700 65W: 12V @ 0.39A (4.68W), 5V @ 0.53A (2.65W), 3.3V @ 0.23A (0.795W)
Max: i7-8700 65W: 12V @ 11.24A (134.88W), 5V @ 1.14A (5.7W), 3.3V @ 0.25A (0.825W)
Windows 10 IoT Enterprise 64-bit
Linux
Operating: 0 to 60°C
Storage: -40 to 85°C
Operating: 5 to 90% RH
Storage: 5 to 90% RH
CS100-C246: 639,615 hrs @ 25°C; 393,053 hrs @ 45°C ; 259,094 hrs @ 60°C
CS100-Q370: 639,615 hrs @ 25°C; 393,053 hrs @ 45°C ; 259,094 hrs @ 60°C
CS100-H310: 640,703 hrs @ 25°C; 393,874 hrs @ 45°C ; 259,692 hrs @ 60°C
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
Mini-ITX Form Factor
170mm (6.7") x 170mm (6.7")
PCB: 1.6mm
Top Side: 20mm, Bottom Side: 3mm
CE, FCC Class B, RoHS
Packing List
1
1
1
1
CS100 motherboard
COM port cable (Length: 250mm, 1 x COM ports)
I/O shield
Serial ATA data with power cable (Length: 500mm)
www.dfi.com
A81-015011-001G
A49-CS1000-000G
332-553001-005G
•
•
•
•
•
•
•
•
Optional Items
USB port cable (Length: 200mm)
COM port cable (Length: 250mm, 1 x COM ports)
Serial ATA data with power cable (Length: 500mm)
Thermal solution (For 35W, Height: 37.3mm)
Thermal solution (For 65W, Height: 72.8mm)
Thermal solution (For 80W, Height: 77.1mm)
LPC EXT-RS232 module (4 x RS232 ports)
LPC EXT-RS485 module (4 x RS485 ports)
A81-001032-016G
A81-015011-001G
332-553001-005G
A71-103004-000G
552-200049-000G
761-103001-000G
770-EXTRS1-000G
770-EXTRS1-100G
DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales
representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © December 23, 2019 DFI Inc.
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