DFI | BE960 | Datasheet | Dfi BE960 Datasheet

Dfi BE960 Datasheet
2nd Gen AMD® Embedded R-Series
COM Express® Basic
Features
CPU Fan
AMD
Embedded
R-Series
DDR3L_2
SODIMM
•
•
•
•
•
2 DDR3L 1866MHz SODIMM up to 16GB
Four independent displays: VGA*/DDI + LVDS*/eDP + 2 DDI
HDMI resolution up to 4096x2160 @ 24Hz
Multiple expansion: 1 PCIe x16, 7 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0
* Populated by default
AMD A77E
DDR3L_1
SODIMM
4096x2160
4K2K
Display
DDR3L
Mechanical Drawing
R2.1
Type6
4 Displays
DP++
Block Diagram
125.00
121.00
91.00
4.00
95.00
91.00
91.00
Top View
49.34
eDP
(opt.)
LVDS
(opt.)
15.44
4.00
0.00
DDI
(opt.)
PTN3460
4.00
Processor
CORE CORE CORE CORE
Channel B
121.00
119.00
80.00
54.80
4.00
0.00
104.77
AMD Embedded
R-Series APUs
PCIe (4 x1/ 1 x4)
Graphics
CORE
Channel A
DDR3L 1866MHz
SODIMM
PCIe x16 (PEG)
DDI Port 1
Memory
Controller
UMI
DDR3L 1866MHz
SODIMM
DDI Port 2
DDI Port 3
DDI (optional)
VGA
LPC Bus
Serial Port 0,1
Bottom View
SLP/LID
TPM 1.2
A/B
Fan PWM/
TACH_IN
I2C Bus
Embedded (optional)
Controller
IT8528E
C/D
WDT
USB 3.0 4x
18.08
6.08
0.00
EEPROM
AMD A77E FCH
8-bit DIO
TCA6408A
PCIe (1 x1)
SMBus
0.00
16.58
74.28
Coming Soon
PCIe (2 x1)
53.00
125.00
MDI
Intel® GLAN
I210AT
PCIe x1
USB 2.0 8x
SATA 3.0 4x
HDA
95.00
SPI Bus
SPI Flash
Heatsink
Heatspreader
22.00
55.00
20.00
Fan
Module PCB
11.00
R-Series
BE960
Standoff
x1
PCIe L0~3
PCIe L4~5
x4
-
x1
x1
x1
x1
* 7 x PCIe x1 or 1 x PCIe x4 + 3 x PCIe x1 (Gen 2)
PCIe L6~7
-
x1
x1
-
BE960
Specifications
SYSTEM
Processor
Chipset
Memory
BIOS
Controller
Feature
GRAPHICS
Display
EXPANSION
Quad Displays
Interface
AUDIO
ETHERNET
I/O
Interface
Controller
USB
SATA
DIO
Output & Interval
TPM
Type
Consumption
WATCHDOG TIMER
SECURITY
POWER
OS SUPPORT
ENVIRONMENT
Temperature
Humidity
MTBF
MECHANICAL
Dimensions
Compliance
2nd Generation AMD® Embedded R-Series APUs, FP3 BGA
AMD® RX-427BB, Quad Core, 4M Cache, 2.7GHz (3.6GHz), 35W
AMD® RX-425BB, Quad Core, 4M Cache, 2.5GHz (3.4GHz), 35W
AMD® A77E Fusion Controller Hub
Two 204-pin SODIMM up to 16GB
Dual Channel DDR3L 1866MHz
AMI SPI 64Mbit
AMD RadeonTM HD 9000 Series Graphics
OpenGL 4.2, OpenGL 3.1, Direct X 11.1, OpenCL 1.2
HW Decode: H.264, MPEG2, VC-1, MPEG4 (DivX), WMV
HW Encode: H.264
1 x VGA/DDI (DDI available upon request)
VGA: resolution up to 2048x1536 @ 75Hz
1 x LVDS/eDP (eDP available upon request)
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz
2 x DDI (HDMI/DVI/DP++)
eDP: resolution up to 1920x1080 @ 60Hz
HDMI: resolution up to 4096x2160 @ 24Hz or 1920x1080 @ 60Hz
DVI: resolution up to 1920x1200 @ 60Hz
DP++: resolution up to 3840x2160 @ 30Hz
VGA + LVDS + 2 DDI
eDP + 3 DDI
1 x PCIe x16 (Gen 3)
7 x PCIe x1 or 1 x PCIe x4 + 3 x PCIe x1 (Gen 2)
1 x LPC
1 x I2C
1 x SMBus
2 x Serial (TX/RX)
HD Audio
1 x Intel® I210AT PCIe (10/100/1000Mbps)
4 x USB 3.0
8 x USB 2.0
4 x SATA 3.0 (up to 6Gb/s)
1 x 8-bit DIO
System Reset, Programmable via Software from 1 to 255 Seconds
Available Upon Request
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Typical: RX-427BB: 12V @ 1.33A (15.95Watt)
Max.: RX-427BB: 12V @ 3.35A (40.18Watt)
Windows 8.1 64-bit
Debian 8 (with VESA graphic driver)
Windows 7 (/WES7) 32/64-bit
CentOS 7 (with VESA graphic driver)
Windows 10 IoT Enterprise 64-bit
Linux
Operating: 0 to 60°C
Storage: -40 to 85°C
Operating: 10 to 90% RH
Storage: 10 to 90% RH
822,620 hrs @ 25°C; 467,324 hrs @ 45°C; 293,581 hrs @ 60°C excluding accessories
Calculation Model: Telcordia Issue 2, Method Case 3
Environment: GB, GC – Ground Benign, Controlled
COM Express® Basic
95mm (3.74") x 125mm (4.9")
PICMG COM Express® R2.1, Type 6
Ordering Information
Model Name
P/N
Processor SODIMM
BE960-77E-BS-427B 770-BE9601-200G RX-427BB 2 SODIMM
BE960-77E-BS-425B 770-BE9601-000G RX-425BB 2 SODIMM
VGA/DDI
VGA
VGA
USB 3.0
4
4
USB 2.0
8
8
Power
ATX/AT
ATX/AT
Thermal
Cooler
Cooler
Temp.
0 to 60oC
0 to 60oC
Optional Items
Packing List
• 1 BE960 board
• 1 DVD
• 1 Cooler (Height: 36.58mm)
www.dfi.com
LVDS/eDP GbE
LVDS
1
LVDS
1
• COM332-B carrier board kit
770-CM3321-000G
A71-111026-000G
DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales
representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © December 23, 2019 DFI Inc.
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