Dfi KD331-Q170 Datasheet
6th/7th Gen Intel® CoreTM Processor
microATX
Q170
KD331-Q170
Desktop
LAN 2 LAN 1
DVI-I
COM 1
USB 3.0
DP++
VGA
LAN 3/4
PS/2
KB/MS
USB 2.0
PCIe x16 PCIe x4
Features
•
•
•
•
4 DDR4 DIMM up to 64GB
Three independent displays: VGA + DVI-I + DP++
DP++ resolution up to 4096x2106 @ 60Hz
Multiple expansion:
2 PCIe x16 (1 x16 or 2 x8 signal), 2 PCIe x4, 1 M.2, 1 LPC
• Rich I/O: 4 Intel GbE, 6 COM, 6 USB 3.0, 6 USB 2.0
• LPC EXT-RS232/485 module extends additional 4 COM ports
Front Audio
S/PDIF
PCIe x4
air gap ±15kv
+12V
power
COM 2-6
DDR4
3 Displays
COM ESD
Protection
6 COM
DP++
PCIe x16
USB 3.0
LGA
1151
M.2
USB 2.0
CPU Fan
USB 2.0
Intel Q170
SMBus
DIO
DDR4_1
DDR4_2
DDR4_3
DDR4_4
LPC
System
Fan_2
System
Fan_1
SATA 3.0
Front Panel ATX Power
Ordering Information
Model Name
KD331-Q170IRM
P/N
Memory
770-KD3312-000G 4 DIMM
GbE
4
RS-232/422/485 RS-232
2
4
Mechanical Drawing
USB 3.0
6
USB 2.0
6
Power
24-pin ATX
Thermal
Active
Temp.
0 to 60oC
Block Diagram
209.55
198.98
173.73
165.82
135.39
105.13
90.81
84.63
47.29
26.97
0.00
VGA
10.16
0.00
R.G.B
PTN3355
DDI
DVI-D
Core i7/i5/i3
DP++
PCIe x16
75.29
150.29
154.94
154.94
I219LM
PCIe x2
PCIe x4
PCIe x1
USB 3.0
USB 2.0
Q170
USB 2.0
PS/2 KB/MS
USB 2.0 2x
Super IO
Digital I/O 8-bit
SPI Bus
SPI BIOS
SMBus
LPC
HD Audio
(Line-out,
Mic-in, S/PDIF)
SATA 3.0
MDI
227.33
233.68
LAN 2x
MDI
LPC Bus
I211AT
I211AT
PCIe x1
PCIe x1
M.2 1x
PCIe x4 2x
SMBus
with WDT
RS-232/422/485 2x
RS-232 4x
H/W Monitor
PCIe x16 slot 2x
(1 x16 or 2 x8 signal)
SATA3.0
USB 2.0
LAN 1x
USB 3.0 2x
130.79
PCIe x1
USB 3.0
MDI
94.79
I211AT
DDR4 DIMM 2x
DMI 3.0
MDI
LAN 1x
USB 3.0 2x
DDR4 DIMM 2x
Channel B
2133/2400MHz
DDI
22.86
46.94
Channel A
2133/2400MHz
DDI
LPC
LPC Bus
SATA 5x
LPC EXT-RS232/RS485
Module (Opt.)
TPM 1.2/2.0 (Opt.)
203.20
45.72
20.32
KD331-Q170
Specifications
SYSTEM
GRAPHICS
Processor
Chipset
Memory
BIOS
Controller
Feature
Display
EXPANSION
Triple Displays
Interface
AUDIO
ETHERNET
Audio Codec
Controller
REAR I/O
Ethernet
USB
Serial
PS/2
Display
INTERNAL I/O
Serial
USB
Audio
WATCHDOG TIMER
SECURITY
POWER
OS SUPPORT
ENVIRONMENT
MECHANICAL
CERTIFICATIONS
SATA
DIO
LPC
SMBus
Output & Interval
TPM
Type
Connector
Consumption
RTC Battery
Temperature
Humidity
MTBF
Dimensions
Height
6th/7th Generation Intel® Core™ /Pentium®/Celeron® LGA 1151 Socket Processors with TDP up to 95W
Intel® Q170 Chipset
Four 288-pin DIMM up to 64GB
Dual Channel DDR4 2133/2400 MHz
Insyde SPI 128Mbit
Intel® HD Gen 9 Graphics
OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9
1 x VGA
VGA: resolution up to 1920x1200 @ 60Hz
1 x DVI-I (DVI-I-D signal)
DVI-I: resolution up to 1920x1200 @ 60Hz
1 x DP++
DP++: resolution up to 4096x2106 @ 60Hz
VGA + DVI-I (DVI-D signal) + DP++
2 x PCIe x16 (1 x16 or 2 x8 signal) (Gen 3)
2 x PCIe x4 (Gen 3)
1 x M.2 2260/2280 M key (SATA3.0/PCIe Gen3 x2 NVMe)
Realtek ALC888S-VD2-GR
3 x Intel® I211AT PCIe (10/100/1000Mbps)
1 x Intel® I219LM PCIe (10/100/1000Mbps) (only CoreTM i7/i5 supports iAMT)
4 x GbE (RJ-45)
4 x USB 3.0
2 x USB 2.0
1 x RS-232/422/485 (RS-232 w/ power) (DB-9)
1 x PS/2 (mini-DIN-6)
1 x VGA
1 x DVI-I (DVI-D signal)
1 x DP++
1 x RS-232/422/485 (RS-232 w/ power) (2.54mm pitch)
4 x RS-232 (2.54mm pitch)
2 x USB 3.0 (2.00mm pitch)
4 x USB 2.0 (2.54mm pitch) or 2 x USB2.0 (2.54mm pitch) +1 x Vertical USB 2.0 (opt., MOQ required)
1 x Front Audio Header
1 x S/PDIF
5 x SATA 3.0 (up to 6Gb/s)
RAID 0/1/5/10
1 x 8-bit DIO
1 x LPC (supports LPC EXT-RS232/RS485 module)
1 x SMBus
System Reset, Programmable via Software from 1 to 255 Seconds
Infineon TPM2.0/1.2 (opt., MOQ required)
ATX
8-pin ATX 12V power
24-pin ATX power
TBD
CR2032 Coin Cell
Windows 7 32/64-bit
Window 8.1 64-bit
Windows 10 64-bit
Linux
Note: 7th Gen CPU SKU ONLY support Windows 10 64-bit & Linux.
Operating: 0 to 60°C
Storage: -30 to 60°C with RTC Battery
-40 to 85°C without RTC Battery
Operating: 5 to 90% RH
Storage: 5 to 90% RH
TBD
microATX form factor
244mm (9.6") x 244mm (9.6")
PCB: TBD
Top Side: TBD, Bottom Side: TBD
CE, FCC, RoHS, UL
Optional Items
Packing List
•
•
•
•
•
•
1
1
1
1
1
1
KD331-Q170 motherboard
COM port cables (Length: 300mm, 2 x COM ports)
Serial ATA data cable (Length: 500mm)
I/O shield
M.2 standoff
M.2 screw
www.dfi.com
A81-015026-023G
332-553001-005G
A49-KD3310-000G
A33-725019-090G
A32-112016-041G
•
•
•
•
•
•
•
•
•
USB 2.0 port cable (Length: 350/398mm)
USB 3.0 port cable (Length: 320mm)
D-SUB cable (w/Bracket, Length: 300mm, 2 x DB9)
Serial ATA data cable (w/Lock, Length: 500mm)
Thermal solution (For 35W, Height: 37.3mm)
Thermal solution (For 65W, Height: 72.8mm)
Thermal solution (For 95W, Height: 69.3mm)
LPC EXT-RS232 module (4 x RS232 ports)
DP to HDMI Dongle
A81-001066-016G
A81-001052-023G
A81-015026-023G
332-553001-005G
A71-103004-000G
552-200049-000G
761-103001-000G
770-EXTRS1-000G
612-D2H13M-000G
DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales
representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © December 16, 2019 DFI Inc.
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