Dfi CR960-HM76 Datasheet
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
CR960-HM76
Features
MEMORY
EXPANSION
HM76
2 DDR3/DDR3L SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP/SDVO)
12 USB: 4 USB 3.0, 8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
BGA 1023
DDR3_2
SODIMM
DDR3_1
SODIMM
Intel HM76
CPU Fan
LAN
DIMENSIONS
SSD
Optional
HM76
Mechanical Drawing
Block Diagram
121.00
117.00
87.00
4.00
0.00
4.00
4.00
0.00
0.00
95.00 Top View
DDR3
SODIMM
87.00
121.00
76.00
0.00
4.00
117.00
87.00
91.00
DDR3
SODIMM
91.00
Channel A
1333/1600MHz
Processor
CORE CORE CORE
Channel B
1333/1600MHz
CORE
IMVP7
(Vcore,Vgfx)
3rd/2nd Generation
Intel® Core™ i7/i5/i3
PEG 16X LANES
Memory
Controller
Graphics
CORE
125.00
FDI
DMI x4
(Direct Media
Interface)
LPC Bus
SLP/LID
WDT
Serial Port 0/1
System Fan Embedded
PWM/TACH_IN
Backup
EEPROM
DDI Port D
SM Bus
DIO SMBus
HD Audio
USB 2.0 8x
0.00
12.50
70.20
2.00
0.00
LVDS (Dual Channel)
CRT
SPI Bus
SPI Flash
95.00
87.00
LAN Ports
22.00
Heatsink
11.00
55.00
PCIe x1, Lane 8
Intel® GLAN
PHY 82579LM
Fan
53.00
USB 3.0 4x
PCIe x1/ Lane 7
PCIe x1/ Lane 8
(Opt. share with on board LAN)
PCIe x1/Lanes 1~6
87.00
Heat spreader
Module PCB
Standoff
Panther Point
Mobile
Intel® HM76
SATA 2.0 4x
125.00
53.00
DDI Port C
I2C
8bit DIO
14.00
DDI Port B/SDVO Port B
Controler
SATA Ports 4
(Opt.)
SSD Chip
C/D
A/B
Bottom View
LPC TPM
1.2 (Opt.)
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
Specifications
CR960-HM76
* Optional and is not supported in standard model. Please contact your sales representative for more information.
PROCESSOR
• BGA 1023 packaging technology
- 3rd generation Intel® CoreTM processors (22nm process technology)
- 2nd generation Intel® CoreTM processors (32nm process technology)
EXPANSION INTERFACES
• Supports 4 USB 3.0 ports
• Supports 8 USB 2.0 ports
• Supports 1 PCIe x16 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports I2C interface
• Supports SMBus interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
Please refer to the Ordering Information below
CHIPSET
• Intel® HM76 Express Chipset
SYSTEM MEMORY
• Two 204-pin DDR3/DDR3L SODIMM sockets
• 3rd generation processors
- Supports DDR3/DDR3L 1333/1600 MHz
• 2nd generation processors
- Supports DDR3 1066/1333 MHz
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies are
supported for x8 and x16 devices, unbuffered, non-ECC
BIOS
• 64Mbit SPI BIOS
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
POWER
• Input: 5VSB*, 12V, VCC_RTC
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000 (3rd generation processors)
• Intel® HD Graphics 3000 (2nd generation processors)
• Intel® HD Graphics (Intel® CeleronTM processors)
• Supports VGA, LVDS and DDI interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit, resolution up to
1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP or SDVO (for Port B)
• HDMI, DVI, DP: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing
- Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)
POWER CONSUMPTION
• TBD
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
TEMPERATURE
• 0oC to 60oC
HUMIDITY
• 5% to 90%
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
PCB
• Dimensions: 95mm (3.74") x 125mm (4.9")
• Compliance: PICMG COM Express® R2.1 basic form factor, Type 6
ONBOARD LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
SSD*
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
TRUSTED PLATFORM MODULE (TPM)*
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
Ordering Information
Model Name
CR960-HM76BS0-810E
CR960-HM76BS0-847E
Processor
Intel® CeleronTM B810E, 2M Cache, 1.6GHz, 35W
Intel® CeleronTM 847E, 2M Cache, 1.1GHz, 17W
CR960-HM76BS0-827E
Intel® CeleronTM 827E, 1.5M Cache, 1.4GHz, 17W
CR960-HM76BS0-1020E
Intel® CeleronTM 1020E, 2M Cache, 2.20 GHz, 35W
CR960-HM76BS0-3610ME Intel® CoreTM i5-3610ME, 3M Cache, 2.7GHz (3.3GHz), 35W
SODIMM
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
2 (16GB DDR3L)
SSD
None
None
None
None
None
Power
ATX/AT
ATX/AT
ATX/AT
ATX/AT
ATX/AT
Thermal
Fan
Fan
Fan
Fan
Fan
Temperature
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
0oC to 60oC
The following specifications will be available upon request. Please contact your sales representative for more information.
Model Name
CR960
-
Chipset
HM76
Temperature
B
B: 0oC to 60oC
Memory
S
S: Socket
Packing List
-
Processors
3615QE
3rd Generation
3610ME: Intel® CoreTM i5-3610ME, 3M Cache, 2.7GHz (3.3GHz), 35W
1020E: Intel® CeleronTM 1020E, 2M Cache, 2.20 GHz, 35W
2nd Generation
810E: Intel® CeleronTM B810E, 2M Cache, 1.6GHz, 35W
847E: Intel® CeleronTM 847E, 2M Cache, 1.1GHz, 17W
827E: Intel® CeleronTM 827E, 1.5M Cache, 1.4GHz, 17W
Optional Items
• 1 CR960 board
• 1 DVD
• Heat spreader with heat sink and fan: 761-CR9601-000G
www.dfi.com
SSD
0
0: None
2: 2GB
4: 4GB
8: 8GB
1: 16GB
3: 32GB
6: 64GB
• COM331-B carrier board kit: 770-COM331-000G
DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales
representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © July 7, 2016 DFI Inc.
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