DFI | EXT-RS232 | Datasheet | Dfi EXT-RS232 Datasheet

Dfi EXT-RS232 Datasheet
LPC Extension Modules
EXT-RS232
Features
CHIP
PORT
INTERFACE
DIMENSIONS
COM
NCT5104
4 COM (RS232)
LPC
48mm x 30mm (1.89" x 1.18")
Specifications
Top View
air gap ±15kv
CHIP
• Main IC: NCT5104
COM ESD
Protection
I/O CONNECTORS
• 1 LPC connector
• 4 connectors for 4 external RS232 serial ports (2.0mm pitch)
LPC
POWER INPUT
• 3.3V/5V/5VSB via LPC connector
Bottom View
APPLIED MODELS
• SD631-C236/Q170, SD630-H110, SD331-C236/Q170, SD331-Q170/H110,
SD101/SD103-Q170/H110, SD100-Q170/H110, SU171/SU173, BW171/BW173
Mechanical Drawing
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -40oC to 85oC
17
0
4
6.67
0
Top View
0
5
HUMIDITY
• 5% to 90%
DIMENSIONS
• 48mm x 30mm (1.89" x 1.18")
16.95
0
9.08
31
48
22.16
30
Bottom View
Packing List
• 1 EXT-RS232 module
• 4 COM port cable (Length: 250mm)
Motherboard
LPC Extension Module
EXT-RS232
A81-017001-001G
LPC Extension Modules
EXT-RS485
Features
CHIP
PORT
INTERFACE
DIMENSIONS
COM
NCT5104
4 COM (RS485)
LPC
48mm x 30mm (1.89" x 1.18")
Specifications
Top View
air gap ±15kv
CHIP
• Main IC: NCT5104
COM ESD
Protection
I/O CONNECTORS
• 1 LPC connector
• 4 connectors for 4 external RS485 serial ports (2.0mm pitch)
LPC
POWER INPUT
• 3.3V/5V/5VSB via LPC connector
Bottom View
APPLIED MODELS
• SD631-C236/Q170, SD630-H110, SD331-C236/Q170, SD331-Q170/H110,
SD101/SD103-Q170/H110, SD100-Q170/H110, SU171/SU173, BW171/BW173
Mechanical Drawing
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -40oC to 85oC
17
0
4
6.67
0
5
HUMIDITY
• 5% to 90%
DIMENSIONS
• 48mm x 30mm (1.89" x 1.18")
16.95
30
0
9.08
22.16
31
48
www.dfi.com
0
Top View
Bottom View
Packing List
• 1 EXT-RS485 module
• 4 COM port cable (Length: 250mm)
A81-017001-001G
DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales
representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © July 4, 2016 DFI Inc.
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