NXP BAP50-05W Datasheet

NXP BAP50-05W Datasheet

SO T3 23 BAP50-05W

Silicon PIN diode

Rev. 3.1 — 8 February 2019 Product data sheet

1 Product profile

1.1 General description

Two planar PIN diodes in common cathode configuration in a SOT323 small SMD plastic package.

1.2 Features and benefits

• • •

Two elements in common cathode configuration in a small-sized plastic SMD package Low diode capacitance Low diode forward resistance

1.3 Applications

General RF applications

2 Pinning information

Table 1. Discrete pinning Pin Description

1 anode 2 3 anode common cathode

Simplified outline

3

Graphic symbol

3 1 Top view 2 1

aaa-029886

2

3 Ordering information

Table 2. Ordering information Type number Package

BAP50-05W -

Name Description

plastic surface-mounted package; 3 leads

Version

SOT323

NXP Semiconductors

4 Marking

Table 3. Marking code Type number

BAP50-05W

Marking code

W4%

5 Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V R

Parameter

continuous reverse voltage

Conditions

-

Min

I F P T T j tot stg continuous forward current total power dissipation storage temperature junction temperature T sp ≤ 90 °C -65 -65

6 Thermal characteristics

Table 5. Thermal characteristics Symbol Parameter

R th(j-sp) thermal resistance from junction to solder point

Conditions BAP50-05W Silicon PIN diode Max

50 50 240 +150 +150

Unit

V mA mW °C °C

Typ Unit

250 K/W BAP50-05W

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 3.1 — 8 February 2019

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BAP50-05W Silicon PIN diode

r

7 Characteristics

Table 6. Characteristics

T j = 25 °C unless otherwise specified.

Symbol Parameter

V F V R I R C d forward voltage reverse voltage reverse current diode capacitance L τ D ISL ins L diode forward resistance isolation insertion loss charge carrier life time L S series inductance [1] Guaranteed on AQL basis; inspection level S4, AQL 1.0

Conditions

I F = 50 mA I R = 10 μA V R = 50 V

f = 1 MHz (see Figure 1 )

V R = 0 V V R = 1 V V R = 5 V

f = 100 MHz (see Figure 2 )

I F = 0.5 mA I F = 1 mA I F = 10 mA V R

= 0 V (see Figure 4 )

f = 900 MHz f = 1800 MHz f = 2450 MHz

See Figure 3 .

I F = 0.5 mA f = 900 MHz f = 1800 MHz f = 2450 MHz I F = 1 mA f = 900 MHz f = 1800 MHz f = 2450 MHz I F = 10 mA f = 900 MHz f = 1800 MHz f = 2450 MHz when switched from I F = 10 mA to I R = 6 mA; R L = 100 Ω; measured at I R = 3 mA I F = 10 mA; f = 100 MHz -

[1] [1] [1]

-

Min

50 -

Typ

0.95

Max

1.1

100

Unit

V V nA 0.45

0.35

0.3

0.6

0.5

25 14 3 19 15.7

13.5

40 25 5 Ω Ω Ω pF pF pF dB dB dB 1.84

1.90

1.92

1.08

1.13

1.17

0.26

0.30

0.36

1.05

1.6

dB dB dB μs dB dB dB dB dB dB nH BAP50-05W

Product data sheet

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BAP50-05W Silicon PIN diode

8 Graphical data

C d (fF) 600 400

aaa-029888

10 3 r D (Ω) 10 2

aaa-029887

10 200 1 0 0 5 10 15 V R (V) 20 T j = 25 °C; f = 1 MHz

Figure 1. Diode capacitance as a function of reverse voltage (typical values)

10 -1 10 -1 1 10 10 2 I F (mA) T j = 25 °C; f = 100 MHz

Figure 2. Diode forward resistance as a function of forward current (typical values)

0 L ins (dB) -1 -2 -3 -4 (1) (2) (3)

aaa-029889

0 ISL (dB) -5 -10 -15 -20

aaa-029890

-5 0.5

1 1.5

2 2.5

f (GHz) 3 Diode inserted in series with a 50 Ω strip line circuit and biased via the analyzer T-network; T amb = 25 °C (1) I F = 10 mA (2) I F = 1 mA (3) I F = 0.5 mA

Figure 3. Insertion loss of the diode as a function of frequency (typical values)

-25 0.5

1 1.5

2 2.5

f (GHz) 3 Diode zero-biased and inserted in series with a 50 Ω strip line circuit and biased via the analyzer T-network; T amb = 25 °C

Figure 4. Isolation of the diode as a function of frequency (typical values)

BAP50-05W

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 3.1 — 8 February 2019

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9 Package outline

Plastic surface-mounted package; 3 leads

D B

BAP50-05W Silicon PIN diode SOT323

E A X y HE v M A

3

Q A A1 c

1

e1 e bp

2

w M B detail X Lp 0 1 scale 2 mm

DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D

mm 1.1

0.8

0.1

0.4

0.3

0.25

0.10

2.2

1.8

E

1.35

1.15

e

1.3

e1

0.65

HE

2.2

2.0

Lp

0.45

0.15

Q

0.23

0.13

v

0.2

w

0.2

OUTLINE VERSION

SOT323

IEC JEDEC REFERENCES JEITA

SC-70

Figure 5. Package outline SOD323

BAP50-05W

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 3.1 — 8 February 2019 EUROPEAN PROJECTION ISSUE DATE

04-11-04 06-03-16 © NXP B.V. 2019. All rights reserved.

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BAP50-05W Silicon PIN diode

10 Revision history

Table 7. Revision history Document ID

BAP50-05W v.3.1

Modifications: BAP50-05W v.3

Modifications: BAP50-05W v.2.1

Release date

20190208

Data sheet status

Product data sheet -

Change notice Supersedes

BAP50-05W v.3

aligned the title of the data sheet with the description on the Internet 20181126 Product data sheet BAP50-05W v.2.1

• •

Section 1.2

20010417

"Features and benefits" has been updated.

The "Legal information" pages have been updated.

Product data sheet BAP50-05W v.1

BAP50-05W

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 3.1 — 8 February 2019

© NXP B.V. 2019. All rights reserved.

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BAP50-05W Silicon PIN diode

11 Legal information

11.1 Data sheet status

Document status

[1][2]

Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet

Product status

Development Qualification Production

[3]

Definition

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

[1] [2] [3] Please consult the most recently issued document before initiating or completing a design.

The term 'short data sheet' is explained in section "Definitions".

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions

Draft

— The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet

— A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification

Product data sheet.

— The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the

11.3 Disclaimers

Limited warranty and liability

— Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes

— NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use

— NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications

— Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Limiting values

— Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale

— NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

BAP50-05W

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 3.1 — 8 February 2019

© NXP B.V. 2019. All rights reserved.

7 / 9

NXP Semiconductors

BAP50-05W Silicon PIN diode No offer to sell or license

— Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Quick reference data

— The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

Export control

— This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.

Non-automotive qualified products

— Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements.

NXP Semiconductors accepts no liability for inclusion and/or use of non automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

Translations

— A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

Security

— While NXP Semiconductors has implemented advanced security features, all products may be subject to unidentified vulnerabilities.

Customers are responsible for the design and operation of their applications and products to reduce the effect of these vulnerabilities on customer’s applications and products, and NXP Semiconductors accepts no liability for any vulnerability that is discovered. Customers should implement appropriate design and operating safeguards to minimize the risks associated with their applications and products.

11.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

BAP50-05W

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 3.1 — 8 February 2019

© NXP B.V. 2019. All rights reserved.

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Contents

2 3

4 5

1

1.1

1.2

1.3

6

7

8

9

10

11

Product profile .................................................... 1

General description ............................................1

Features and benefits ........................................1

Applications ........................................................1

Pinning information ............................................ 1 Ordering information .......................................... 1

Marking .................................................................2

Limiting values ....................................................2

Thermal characteristics ......................................2

Characteristics .................................................... 3

Graphical data ..................................................... 4

Package outline ...................................................5

Revision history .................................................. 6

Legal information ................................................7

BAP50-05W Silicon PIN diode

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'.

© NXP B.V. 2019.

All rights reserved.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]

Date of release: 8 February 2019 Document identifier: BAP50-05W

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