NXP BAP64-05W Datasheet

NXP BAP64-05W Datasheet
T3
23
BAP64-05W
SO
Silicon PIN diode
Rev. 3.2 — 1 February 2019
1
Product data sheet
Product profile
1.1 General description
Two planar PIN diodes in common cathode configuration in a SOT323 small plastic SMD
package.
1.2 Features and benefits
•
•
•
•
•
•
•
High voltage, current controlled
RF resistor for RF attenuators and switches
Low diode capacitance
Low diode forward resistance
Low series inductance
For applications up to 3 GHz
AEC-Q101 qualified
1.3 Applications
• RF attenuators and switches
BAP64-05W
NXP Semiconductors
Silicon PIN diode
2
Pinning information
Table 1. Discrete pinning
Pin
Description
Simplified outline
1
anode (a1)
2
anode (a2)
3
common cathode
Symbol
3
3
2
1
sym136
1
2
top view
3
Ordering information
Table 2. Ordering information
Type number Package
BAP64-05W
4
Name
Description
Version
-
plastic surface-mounted package; 3 leads
SOT323
Marking
Table 3. Marking
Type number
Marking
Description
BAP64-05W
5W%
% = t: made in Malaysia
% = W: made in China
Table 4. Marking
5
Type number
Marking code
BAP64-05W
5W-
Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Values are specified per diode.
BAP64-05W
Product data sheet
Symbol
Parameter
VR
Conditions
Min
Max
Unit
reverse voltage
-
100
V
IF
forward current
-
100
mA
Ptot
total power dissipation
-
240
mW
Tstg
storage temperature
-65
+150
°C
Tj
junction temperature
-65
+150
°C
Tsp ≤ 90 °C
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Rev. 3.2 — 1 February 2019
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BAP64-05W
NXP Semiconductors
Silicon PIN diode
6
Thermal characteristics
Table 6. Thermal characteristics
BAP64-05W
Product data sheet
Symbol
Parameter
Conditions
Rth(j-sp)
thermal resistance from junction to solder point
All information provided in this document is subject to legal disclaimers.
Rev. 3.2 — 1 February 2019
Typ
Unit
250
K/W
© NXP B.V. 2019. All rights reserved.
3 / 11
BAP64-05W
NXP Semiconductors
Silicon PIN diode
7
Characteristics
Table 7. Characteristics
Values are specified per diode; Tj = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 50 mA
-
0.95
1.1
V
IR
reverse current
VR = 60 V
-
-
10
µA
VR = 20 V
-
-
1
µA
VR = 0 V
-
0.52
-
pF
VR = 1 V
-
0.37
-
pF
-
0.23
0.35
pF
IF = 0.5 mA
-
20
40
Ω
IF = 1 mA
-
10
20
Ω
IF = 10 mA
-
2.0
3.8
Ω
IF = 100 mA
-
0.7
1.35
Ω
-
1.55
-
µs
-
1.2
-
nH
Cd
diode capacitance
see Figure 1; f = 1 MHz;
VR = 20 V
rD
diode forward resistance
τL
charge carrier life time
LS
series inductance
[1]
see Figure 2; f = 100 MHz;
when switched from IF = 10 mA to
IR = 6 mA; RL = 100 Ω; measured at
IR = 3 mA
[1]
Guaranteed on AQL basis: inspection level S4, AQL 1.0.
BAP64-05W
Product data sheet
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Rev. 3.2 — 1 February 2019
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BAP64-05W
NXP Semiconductors
Silicon PIN diode
7.1 Graphical data
aaa-017759
500
Cd
(fF)
rD
(Ω)
aaa-017777
102
400
10
300
200
1
100
0
0
4
8
12
16
VR (V)
20
10-1
10-1
1
10
IF (mA)
102
f = 1 MHz; Tj = 25 °C.
f = 100 MHz; Tj = 25 °C.
Figure 1. Diode capacitance as a function of reverse
voltage; typical values
Figure 2. Forward resistance as a function of forward
current; typical values
Lins
(dB)
aaa-017761
0
-0.5
ISL
(dB)
aaa-017760
0
-1
(1)
(2)
(3)
(4)
-5
-1.5
-10
-2
-15
-2.5
0.5
1
-20
1.5
2
2.5
f (GHz)
3
Tamb = 25 °C
Diode zero biased and inserted in series with a 50 Ω
stripline circuit
Tamb = 25 °C
1. IF = 100 mA
2. IF = 10 mA
3. IF = 1 mA
4. IF = 0.5 mA
Diode inserted in series with a 50 Ω stripline circuit and
biased via the analyzer T-network
Figure 3. Isolation of the diode as a function of
frequency; typical values
Figure 4. Insertion loss of the diode as a function of
frequency; typical values
-25
0.5
BAP64-05W
Product data sheet
1
1.5
2
2.5
f (GHz)
3
All information provided in this document is subject to legal disclaimers.
Rev. 3.2 — 1 February 2019
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BAP64-05W
NXP Semiconductors
Silicon PIN diode
aaa-018155
150
IP2
(dB)
125
100
(2)
(1)
75
50
25
0
10-1
1
IF (mA)
10
Tamb = 25 °C
1. f = 900 MHz
2. f = 1800 MHz
Figure 5. Second-order intercept point as a function of forward current; typical values
BAP64-05W
Product data sheet
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Rev. 3.2 — 1 February 2019
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NXP Semiconductors
Silicon PIN diode
8
Package outline
Plastic surface-mounted package; 3 leads
SOT323
D
B
E
A
X
HE
y
v M A
3
Q
A
A1
1
c
2
e1
bp
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.8
0.1
0.4
0.3
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.23
0.13
0.2
0.2
OUTLINE
VERSION
REFERENCES
IEC
SOT323
JEDEC
JEITA
SC-70
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
Figure 6. Package outline SOT323
BAP64-05W
Product data sheet
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Rev. 3.2 — 1 February 2019
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BAP64-05W
NXP Semiconductors
Silicon PIN diode
9
Abbreviations
Table 8. Abbreviations
Acronym
Description
AQL
acceptable quality level
PIN
P-type, intrinsic, N-type
SMD
surface-mounted device
S4
special inspection level 4
10 Revision history
Table 9. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BAP64-05W v.3.2
20190201
Product data sheet
-
BAP64-05W v.3.1
Modifications
• changed condition for reverse current for VR from 100 V to 60 V
BAP64-05W v.3.1
20181211
Modifications
• adapted marking code
BAP64-05W v.3
20180713
Modifications
• changed IRconditions at characteristics
• adapted the layout of the data sheet
BAP64-05W v.2
20150428
Modifications
• The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• AEC-Q101 qualified
BAP64-05W v.1 (9397
750 07192)
20000713
BAP64-05W
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Product specification
-
BAP64-05W v.3
-
BAP64-05W v.2
-
BAP64-05W v.1
-
All information provided in this document is subject to legal disclaimers.
Rev. 3.2 — 1 February 2019
-
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8 / 11
BAP64-05W
NXP Semiconductors
Silicon PIN diode
11 Legal information
11.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
BAP64-05W
Product data sheet
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
All information provided in this document is subject to legal disclaimers.
Rev. 3.2 — 1 February 2019
© NXP B.V. 2019. All rights reserved.
9 / 11
BAP64-05W
NXP Semiconductors
Silicon PIN diode
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
11.4 Trademarks
BAP64-05W
Product data sheet
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
Rev. 3.2 — 1 February 2019
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NXP Semiconductors
Silicon PIN diode
Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
7.1
8
9
10
11
Product profile .................................................... 1
General description ............................................1
Features and benefits ........................................1
Applications ........................................................1
Pinning information ............................................ 2
Ordering information .......................................... 2
Marking .................................................................2
Limiting values .................................................... 2
Thermal characteristics ......................................3
Characteristics .................................................... 4
Graphical data ................................................... 5
Package outline ...................................................7
Abbreviations ...................................................... 8
Revision history .................................................. 8
Legal information ................................................ 9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2019.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 1 February 2019
Document identifier: BAP64-05W
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