NXP MIFARE Plus® SE Data Sheet
NXP MIFARE Plus® SE, a secure contactless smart card IC, offers seamless migration for MIFARE Classic users. It provides AES-128 encryption for authenticity, integrity, and data protection. With 1 kB EEPROM, it fully supports MIFARE Classic value block operations. Its multi-sector authentication enables efficient data access, while the anti-tearing mechanism ensures secure key updates. Ideal for public transportation, access management, and loyalty applications, it enhances security and prepares your system for future advancements.
Advertisement
Advertisement
MF1SEP(H)10x1
MIFARE PLUS SE - Secure contactless smart card IC for seamless migration
Rev. 3.1 — 16 March 2017 328631 Product short data sheet COMPANY PUBLIC
MIFARE Plus is the only mainstream smart card family compatible with MIFARE Classic 1K and MIFARE Classic 4K that offers pre-issuance of cards prior to making security upgrades in the infrastructure. After security upgrade to Security Level 3, MIFARE Plus uses Advanced Encryption Standard (AES) for authentication, data integrity, and encryption.
MIFARE Plus SE is the entry-level version of NXP’s proven and reliable MIFARE Plus product family. Designed for full functional compatibility with MIFARE Classic 1K, it provides complete support for the MIFARE Classic value blocks.
MIFARE Plus SE is the choice for customers who want to switch to higher security while preparing for the future by introducing cards, ready for AES security, into the existing system environment.
MIFARE Plus SE cards are easy to distribute into running MIFARE Classic systems, since it uses a linear memory structure compatible to MIFARE Classic, and because MIFARE Plus SE supports all MIFARE Classic value-block operations in the Security Levels SL1 and SL3. MIFARE Plus SE stores its 128-bit AES keys on top of the data blocks. The optional AES authentication in SL1 enables efficient detection of cards not belonging to the system.
2. Features and benefits
Entry level version of the proven MIFARE Plus product family Simple fixed memory structure compatible with MIFARE Classic AES-128 for authenticity and integrity Freely configurable access conditions Optional support of random IDs Anti-tearing mechanism for writing AES keys Virtual card concept Number of single write operations: 200000 typical 1 kB EEPROM Fully supports MIFARE Classic value block operations NXP originality check Supports ISO/IEC 14443-3
UIDs (4-Byte NUID, 7-byte UID) Multi-sector authentication, Multi-block read and write Keys can be stored as MIFARE CRYPTO1 keys (2 x 48-bit per sector) and AES keys (2 x 128-bit per sector) Communication speed up to 848 kbit/s Data retention time: 10 years
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC
[1] ISO/IEC 14443-x used in this data sheet refers to ISO/IEC 14443 Type A.
3. Applications
Public transportation Access management Electronic toll collection Car parking School and campus cards Employee cards Loyalty Wearables
4. Quick reference data
Table 1.
Symbol
C i
Quick reference data Parameter Conditions
input capacitance T amb = 22 C; f i = 13.56 MHz; 2.8 V RMS T amb = 22 C; f i = 13.56 MHz; 2.8 V RMS
15.0
-
Min
f i input frequency
EEPROM characteristics
t ret N endu(W) retention time write endurance T amb = 22 C T amb = 22 C; excluding anti-tearing for AES keys or sector trailers in security level 3 [1] Measured with LCR meter.
Typ
17.0
70.0
13.56
-
Max
19.04
Unit
pF pF MHz 10 100000 200000 year cycle MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631
© NXP Semiconductors N.V. 2017. All rights reserved.
2 of 17
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC Table 2.
Ordering information Type number Package Commerci al Name
MF1SEP1001DUD/03 FFC -
Name
MF1SEP1031DUD/03 MF1SEP1001DA4/03 MF1SEP1031DA4/03 MF1SEP1001DA8/03 MF1SEP1031DA8/03 MF1SEPH1001DA4/03 MF1SEPH1031DA4/03 FFC MOA4 MOA4 MOA8 MOA8 MF1SEPH1001DUD/03 FCC MOA4 MF1SEPH1001DA8/03 MOA8 MF1SEPH1031DUD/03 FFC MOA4 MF1SEPH1031DA8/03 MOA8 PLLMC PLLMC PLLMC PLLMC PLLMC PLLMC PLLMC PLLMC
Description Version
8 inch wafer (sawn; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECS-II format), 1 kB EEPROM, 7-byte UID, 17 pF input capacitance 8 inch wafer (sawn; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECS-II format), 1 kB EEPROM, 4-byte NUID, 17 pF input capacitance plastic leadless module carrier package; 35 mm wide tape, 1 kB EEPROM, 7-byte UID, 17 pF input capacitance plastic leadless module carrier package; 35 mm wide tape, 1 kB EEPROM, 4-byte NUID, 17 pF input capacitance plastic leadless module carrier package; 35 mm wide tape, 1 kB EEPROM, 7-byte UID, 17 pF input capacitance plastic leadless module carrier package; 35 mm wide tape, 1 kB EEPROM, 4-byte NUID, 17 pF input capacitance SOT500-2 SOT500-2 SOT500-4 SOT500-4 carrier; electronic fail die marking according to SECS-II format), 1 kB EEPROM, 7-byte UID, 70 pF input capacitance 8 inch wafer (sawn; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECS-II format), 1 kB EEPROM, 7-byte BUID, 70 pF input capacitance SOT500-2 SOT500-4 tape, 1 kB EEPROM, 7-byte UID, 70 pF input capacitance plastic leadless module carrier package; 35 mm wide tape, 1 kB EEPROM, 4-byte NUID, 70 pF input capacitance plastic leadless module carrier package; 35 mm wide tape, 1 kB EEPROM, 4-byte NUID, 70 pF input capacitance SOT500-2 SOT500-4 tape, 1 kB EEPROM, 4-byte NUID, 70 pF input capacitance MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631
© NXP Semiconductors N.V. 2017. All rights reserved.
3 of 17
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC
RF INTERFACE SECURITY SENSORS POWER ON RESET VOLTAGE REGULATOR CLOCK INPUT FILTER RESET GENERATOR UART ISO/IEC 14443A
Fig 1.
Block diagram
AES CRYPTO CO-PROCESSOR TRUE RANDOM NUMBER GENERATOR CRYPTO1 ROM CPU/LOGIC UNIT RAM CRC EEPROM
001aah389
7.1 Smart card contactless module
LA top view LB MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC
001aaj820
Fig 2.
Contact assignments for SOT500-2 (MOA4) Table 3.
Bonding pad assignments to smart card contactless module Contactless interface module Antenna contacts Symbol MF1SEP(H)10x1DA4/z3 Description
LA LB LA LB antenna coil connection LA antenna coil connection LB All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631
© NXP Semiconductors N.V. 2017. All rights reserved.
4 of 17
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC
8.1 Memory organization
The 1 kB EEPROM memory is organized in 16 sectors of 4 blocks One block consists of 16 bytes. Sector 15 14 0 Block 3 2 1 0 3 2 1 0 ...
...
...
3 2 1 0 0 1 2 3 CRYPTO1 Key A 4 Byte numbers within a block 5 (1) 6 7 8 Access bytes 9 10 11 12 13 14 CRYPTO1 Key B or Data 15 CRYPTO1 Key A CRYPTO1 Key A Access bytes Access bytes CRYPTO1 Key B or Data CRYPTO1 Key B or Data Description Sector trailer 15 Data Data Data Sector trailer 14 Data Data Data ...
...
...
Sector trailer 0 Data Data Manufacturer data
aaa-018291
(1) CRYPTO1 Key A in security level 0, 1, 2; plain text access byte in security level 3
Fig 3.
Memory organization 8.1.1 Manufacturer block
The first data block (block 0) of the first sector (sector 0) contains the PICC manufacturer data. This block is programmed and write protected at production test.
8.1.2 Data blocks
Sectors 0 D to 16 D contain 3 blocks each for data storage. The data blocks can be configured using the access bits as:
• •
read/write blocks for storing binary data value blocks Value blocks are special counters where the stored value can be manipulated with specific commands such as MF Increment, MF Decrement and MF Transfer.
A successful mutual authentication is required to allow any data operation.
8.1.2.1
Access conditions
The access conditions for every data block and the sector trailer itself are stored in the sector trailer of the corresponding sector.
MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631
© NXP Semiconductors N.V. 2017. All rights reserved.
5 of 17
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC
The access bits control the rights of memory operations using the secret keys A and B. The access conditions may be altered after authentication with the relevant key and the current access condition allows this operation.
Furthermore, value blocks are configured using the access bits.
8.1.3 AES keys
AES keys are not shown in the memory map. The keys are stored on top of the other data and can be updated and used by referencing the so-called Key Number. In security level 3, anti-tearing is supported for the update of AES keys as well as for the update of the sector trailer. This anti-tearing mechanism is done by the PICC itself. The EEPROM stays in a defined status, even if the PICC is removed from the electromagnetic field during the write operation.
8.1.4 Multi-sector authentication
A new feature has been provided in security level 3 for data which is spread over multiple sectors to improve transaction performance.
Providing that such sectors are secured with identical keys (key value and key type) only one authentication is required to read and/or write data from these sectors. There is no need to re-authenticate when accessing any data within these sectors. Therefore it is possible to configure a card in such a way that operating with only one authentication is needed in security level 3 to access all sectors.
8.1.5 Originality function
The originality function is implemented by an AES authentication with the originality key. The authentication is performed in ISO/IEC 14443-4 protocol layer.
8.2 Card activation and communication protocol
The ISO/IEC 14443-3 anticollision mechanism allows for simultaneous handling of multiple PICCs in the field. The anticollision algorithm selects each PICC individually and ensures that execution of a transaction with a selected PICC is performed correctly without data corruption from other PICCs in the field.
MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631
© NXP Semiconductors N.V. 2017. All rights reserved.
6 of 17
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC
There are two different versions of the PICC. The UID is programmed into a locked part of the NV-memory which is reserved for the manufacturer:
• •
unique 7-byte serial number non-unique 4-byte serial number Due to security and system requirements, these bytes are write-protected after being programmed by the PICC manufacturer at production.
Remark:
The programmed 4-byte NUID serial number is not globally unique which has to
be considered in the contactless system design. See Ref. 10 for further information
regarding handling of UIDs.
The customer must decide which UID length to use when ordering the product, see
Table 2 for ordering information.
During personalization, the PICC can be configured to support Random ID in security level 3. The user can configure whether Random ID or fixed UID shall be used. According
to ISO/IEC 14443-3 (see Ref. 4
), the first anticollision loop returns the Random Number Tag 08h, the 3-byte Random Number and the BCC, if Random ID is used. The retrieval of the UID in this case can be done using the Virtual Card Support Last command (see
) or by reading out block 0.
8.2.1 Backwards compatibility protocol
The backwards compatibility of this product, as used in security level 1 and security level 2, runs on the same protocol layer as MIFARE Classic 1K. The protocol is formed out of the following components:
• • • •
Frame definition: according to ISO/IEC 14443-3 Bit encoding: according to ISO/IEC 14443-2 Error code handling: handling is proprietary as error codes are formatted in half bytes.
Command specification: commands are proprietary. Please use the specification as in
and the additional commands which are only implemented in MIFARE Plus as described in this document and in
The following security levels can run on this protocol:
• •
Security Level 0 Security Level 1
8.2.2 ISO/IEC 14443-4 Protocol
The ISO/IEC 14443-4 Protocol (also known as T=CL) is used in many processor cards. This protocol is used for the MIFARE Plus with the following security levels:
• • •
Security Level 0: all commands Security Level 1: only the security level switch and originality function.
Security Level 3: all commands MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631
© NXP Semiconductors N.V. 2017. All rights reserved.
7 of 17
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC
8.3 Security level switching
The MIFARE Plus SE offers a unique feature to support migration from CRYPTO1 based systems to AES based operation. The migration on the card-side is done using different security levels supporting different cryptographic algorithms and protocols. There are three security levels:
• •
Security level 0: initial delivery configuration, used for card personalization Security level 1: backwards functional compatibility mode (with MIFARE Classic 1K) with an optional AES authentication
•
Security level 3: 3-Pass authentication based on AES, data manipulation commands secured by AES encryption and an AES based MACing method.
The security level switching (i.e. from security level 1 to security level 3) is performed using the dedicated AES authentication switching keys.
The security level can only be switched from a lower level to a higher level, never in the opposite direction.
8.4 Security level 0
Security level 0 is the initial delivery configuration of the PICC. The card can be operated either using the backwards compatibility protocol or the ISO/IEC 14443-4 protocol.
In this level, the card can be personalized including the programming of user data as well as of CRYPTO1 and/or AES keys. In addition, the originality function can be used.
The following mandatory AES keys need to be written using the Write Perso command before the PICC can be switched to security level 1 or security level 3 (for L3 card). Security level switching is performed using the Commit Perso command:
• • •
Card Configuration Key Card Master Key Level 3 Switch Key Using the originality function, it is possible to verify that the chip is a genuine NXP Semiconductors MIFARE Plus.
8.5 Security level 1
Security level 1 offers the same functionality as a MIFARE Classic 1K using the backwards compatibility protocol. The MIFARE Classic 1K products is specified in
Furthermore, an optional AES authentication is available in this level without affecting the MIFARE Classic 1K functionality. The authenticity of the card can be proven using strong cryptographic means with this additional functionality.
The timings may differ from the MIFARE Classic 1K products.
Using the originality function, it is possible to verify that the chip is a genuine NXP Semiconductors MIFARE Plus.
MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631
© NXP Semiconductors N.V. 2017. All rights reserved.
8 of 17
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC
8.6 Security level 3
The operation in security level 3 is solely based on the ISO/IEC 14443-4 protocol layer. The usage of the backwards compatibility protocol is not possible.
In security level 3, a mandatory AES authentication between PICC and reader is conducted, where two keys are generated as a function of the random numbers from the PICC and the reader as well as of the shared key. These two session keys are used to secure the data which is exchanged on the interface between the card and reader. One of the two keys is used to ensure the confidentiality of the command and the response while the other key ensures the integrity of the command and the response.
All commands carry a MAC, such that the PICC will only accept commands from the reader with which it is authenticated. Tampering of operands and messages is detected by checking the MAC. Also all responses contain a MAC, so that the reader on each response knows that neither the command nor the response has been tampered with.
Each response carries a MAC. When the appropriate MAC is received, due to linking of MACs, the reader knows that the command and commands before it was properly executed.
All commands between two consecutive first authenticate commands belong to one transaction and the MACing mechanism assures integrity of the whole transaction.
9.1 Security level 0, 1, 3: ISO/IEC 14443-3
Table 4.
ISO/IEC 14443-3 Command
REQA
Description
the REQA and ATQA commands are fully implemented according to ISO/IEC 14443-3.
WUPA the WAKE-UP command is fully implemented according to ISO/IEC 14443-3.
ANTICOLLISION/SELECT cascade level 1 the ANTICOLLISION and SELECT commands are fully implemented according to ISO/IEC 14443-3. The response is part 1 of the UID.
ANTICOLLISION/SELECT cascade level 2 for 7 byte UID version the ANTICOLLISION and SELECT commands are fully implemented according to ISO/IEC 14443-3. The response is part 2 of the UID.
HALT the HALT command is fully implemented according to ISO/IEC 14443-3 MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631
© NXP Semiconductors N.V. 2017. All rights reserved.
9 of 17
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC
9.2 Security level 0, 1, 3: ISO/IEC 14443-4
Table 5.
Command
RATS
ISO/IEC 14443-4
PPS DESELECT
Description
the response to the RATS command identifies the PICC type to the PCD.
the PPS command allows an individual selection of the communication baud rate between PCD and PICC. It is possible for the MF1SEP(H)10x1 to individually set the communication baud rate independently of each other for both directions i.e. MF1SEP(H)10x1 allows a non-symmetrical information interchange speed.
deselection according to ISO/IEC 14443-4 Please find more information on ISO/IEC 14443 in
Ref. 4 as well as on the settings of
ATQA, SAK and ATS in
9.3 Security level 0 command overview
Table 6.
Command Security level 0 command overview Description
Write Perso pre-personalization of AES keys and all blocks Commit Perso First Authenticate (part 1) switch to security level 1 first authenticate Following Authenticate (part 1) following authenticate Authenticate (part 2) second authentication step
9.4 Security level 1 command overview
Table 7.
Security level 1 command overview MF1ICS50, MF1ICS70, MF1ICS20 commands Description
MF Authenticate key A authentication with key A MF Authenticate key B MF Read MF Write MF Increment authentication with key B reading data writing data incrementing a value MF Decrement MF Restore decrementing a value restoring a value MF Transfer transferring a value
Commands using backwards compatibility protocol, see
Following Authenticate (part 1) Authenticate (part 2) following authenticate; protocol used as described in
second authentication step; protocol used as described in
MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631
© NXP Semiconductors N.V. 2017. All rights reserved.
10 of 17
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC Table 7.
Security level 1 command overview
…continued
MF1ICS50, MF1ICS70, MF1ICS20 commands Description Command set for security level switch and originality function using ISO/IEC 14443-4 protocol
First Authenticate (part 1) first authenticate Following Authenticate (part 1) Authenticate (part 2) following authenticate second authentication step
9.5 Security level 3 command overview
Table 8.
Command Security level 3 command overview Description MIFARE Plus commands
First Authenticate (part 1) first authenticate Following Authenticate (part 1) following authenticate Authenticate (part 2) second authentication step ResetAuth
READ commands
reset the authentication step reading in plain, MAC on response, MAC on command Read Plain MACed
WRITE commands
Write MACed Write Plain MACed writing encrypted, MAC on response, MAC on command writing in plain, MAC on response, MAC on command
VALUE operations
Increment MACed Decrement MACed Transfer MACed Increment Transfer MACed Decrement Transfer MACed Restore MACed
Virtual card concept
Virtual Card Support Last Deselect Virtual Card incrementing a value encrypted, MAC on response, MAC on command decrementing a value encrypted, MAC on response, MAC on command transferring a value, MAC on response, MAC on command combined incrementing and transferring a value encrypted, MAC on response, MAC on command combined decrementing and transferring a value encrypted, MAC on response, MAC on command restoring a value, MAC on response, MAC on command check if the virtual card concept is supported, communicate PCD capabilities and retrieve the UID deselect the virtual card MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631
© NXP Semiconductors N.V. 2017. All rights reserved.
11 of 17
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC
10. Limiting values
Table 9.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
input current
Conditions
I I P tot /pack T stg T amb V ESD I lu total power dissipation per package storage temperature ambient temperature electrostatic discharge voltage latch-up current
-
Min
55 25 2 100 -
Max
30 200 125 70 [1] [2] [3] Stresses above one or more of the limiting values may cause permanent damage to the device.
Exposure to limiting values for extended periods may affect device reliability.
MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 k .
Unit
mA mW C C kV mA
11. Abbreviations
Table 10.
Acronym
AES EEPROM LCR MAC NUID NV PCD PICC PPS RATS REQA SAK SECS-II UID VC WUPA
Abbreviations and symbols Description
Advanced Encryption Standard Electrically Erasable Programmable Read-Only Memory L = inductance, Capacitance, Resistance (LCR meter) Message Authentication Code Non-Unique IDentifier Non-Volatile memory Proximity Coupling Device (Contactless Reader) Proximity Integrated Circuit Card (Contactless Card) Protocol Parameter Selection Request Answer To Select REQuest Answer Select AcKnowledge, type A SEMI Equipment Communications Standard part 2 Unique IDentifier Virtual Card, one MIFARE Plus PICC is one virtual card Wake-Up Protocol type A MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631
© NXP Semiconductors N.V. 2017. All rights reserved.
12 of 17
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC
12. References
[1] [2] [3] [4] [5] [6] [7] Data sheet —
MIFARE Classic EV1 1K - Mainstream contactless smart card IC for fast and easy solution development, BL-ID Doc. No. 2792** 1 .
Data sheet —
M1PLUSx0y1 MIFARE Plus functional specification, BU-ID Doc. No. 1637**.
Application note —
MIFARE Type identification procedure, BU-ID Doc. No. 1843**.
Application note —
ISO 14443 PICC selection, BU-ID Doc. No. 1308**.
NIST Special Publication 800-38A —
Recommendation for block cipher modes of operation: methods and techniques, 2001.
NIST Special Publication 800-38B —
Recommendation for block cipher modes of operation: The CMAC mode for authentication.
ISO/IEC Standard —
ISO/IEC 14443 Identification cards - contactless integrated circuit cards - proximity cards.
[8] FIPS PUB 197 ADVANCED ENCRYPTION STANDARD —
Recommendation for block cipher modes of operation: Methods and techniques.
[9] ISO/IEC Standard —
ISO/IEC 9797-1 Information technology - security techniques - Message Authentication Codes (MACs) - Part 1: Mechanisms using a block cipher.
[10] MIFARE and handling of UIDs —
Application note, BU-ID Document number 1907**
13. Revision history
Table 11.
Revision history Document ID Release date
MF1SEP_H_10x1_SDS Modifications: MF1SEP10x1_SDS 20170316
• •
20150427
Data sheet status
Product short data sheet -
Change notice Supersedes
MF1SEP10x1_SDS Product name title changed into MF1SEP(H)10x1
Table 2 “Ordering information”
: updated Product short data sheet 1.
** ... document version number MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631
© NXP Semiconductors N.V. 2017. All rights reserved.
13 of 17
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC
14. Legal information
Document status
Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
Development Qualification Production
Definition
This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com
.
14.2 Definitions
Draft —
The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.
Short data sheet —
A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
Product specification —
The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
14.3 Disclaimers
Limited warranty and liability —
Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the
Terms and conditions of commercial sale
of NXP Semiconductors.
Right to make changes —
NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC Suitability for use —
NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications —
Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.
Limiting values —
Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.
Terms and conditions of commercial sale —
NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.
No offer to sell or license —
Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
© NXP Semiconductors N.V. 2017. All rights reserved.
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631 14 of 17
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC Export control —
This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.
Quick reference data —
The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products —
Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
Translations —
A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
14.4 Licenses
ICs with DPA Countermeasures functionality
NXP ICs containing functionality implementing countermeasures to Differential Power Analysis and Simple Power Analysis are produced and sold under applicable license from Cryptography Research, Inc.
14.5 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
MIFARE —
is a trademark of NXP Semiconductors N.V.
MIFARE Plus —
is a trademark of NXP Semiconductors N.V.
15. Contact information
For more information, please visit:
http://www.nxp.com
For sales office addresses, please send an email to:
MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631
© NXP Semiconductors N.V. 2017. All rights reserved.
15 of 17
NXP Semiconductors
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC
16. Tables
Table 1. Quick reference data . . . . . . . . . . . . . . . . . . . . .2
Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .3
Table 4. ISO/IEC 14443-3 . . . . . . . . . . . . . . . . . . . . . . . .9
Table 5. ISO/IEC 14443-4 . . . . . . . . . . . . . . . . . . . . . . .10
17. Figures
Fig 1.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Contact assignments for SOT500-2 (MOA4) . . . .4
Memory organization . . . . . . . . . . . . . . . . . . . . . . .5
Table 8. Security level 3 command overview . . . . . . . . 11
Table 11. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
MF1SEP_H_10X1_SDS
Product short data sheet COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017 328631
© NXP Semiconductors N.V. 2017. All rights reserved.
16 of 17
NXP Semiconductors 18. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Smart card contactless module . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Security level 3 . . . . . . . . . . . . . . . . . . . . . . . . . 9
Look-up tables . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Security level 0, 1, 3: ISO/IEC 14443-3 . . . . . . 9
Security level 3 command overview . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
MF1SEP(H)10x1 MIFARE PLUS SE - Secure contactless smart card IC
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2017.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 16 March 2017 328631

Public link updated
The public link to your chat has been updated.
Advertisement