NXP TEA172X HV start-up flyback controller User Guide

NXP TEA172X HV start-up flyback controller User Guide
UM10780
TEA1721ADB1102 GreenChip 5 W QBIC demo board
Rev. 1 — 7 May 2014
User manual
Document information
Info
Content
Keywords
TEA1721AT, ultra-low standby power, constant output voltage, constant
output current, primary sensing, integrated high-voltage switch, integrated
high-voltage start-up, USB charger, 5 V/1 A supply
Abstract
This user manual describes a 5 W Constant Voltage (CV) or Constant
Current (CC) universal input power supply for mobile phone adapters and
chargers. The TEA1721ADB1102 demo board is based on the GreenChip
SP TEA1721AT. GreenChip SP TEA1721AT enables low no-load power
consumption <10 mW. The TEA1721AT design ensures a low external
component count for cost-effective applications. In addition, the
TEA1721AT provides advanced control modes for optimal performance.
The TEA1721AT integrates the 700 V power MOSFET switch and SMPS
controller.
UM10780
NXP Semiconductors
TEA1721ADB1102 GreenChip 5 W QBIC demo board
Revision history
Rev
Date
Description
v.1
20140507
first issue
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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1. Introduction
WARNING
Lethal voltage and fire ignition hazard
The non-insulated high voltages that are present when operating this product, constitute a
risk of electric shock, personal injury, death and/or ignition of fire.
This product is intended for evaluation purposes only. It shall be operated in a designated test
area by personnel qualified according to local requirements and labor laws to work with
non-insulated mains voltages and high-voltage circuits. This product shall never be operated
unattended.
This User Manual describes a 5 W Constant Voltage (CV) or Constant Current (CC)
universal input power supply for mobile phone adapters and chargers. The
TEA1721ADB1102 demo board is based on the TEA1721AT GreenChip SP.
The TEA1721AT GreenChip SP provides ultra-low < 10 mW, no-load power consumption
without using additional external components. Designs are cost-effective using the
TEA1721AT GreenChip SP because only a few external components are needed in a
typical application. In addition, the TEA1721AT provides advanced control modes for
optimal performance. The TEA1721AT integrates the 700 V power MOSFET switch and
SMPS controller.
Remark: All voltages are in V (AC) unless otherwise stated
2. Safety warning
The complete demo board application is AC mains voltage powered. Avoid touching the
board when power is applied. An isolated housing is obligatory when used in uncontrolled,
non-laboratory environments. Always provide galvanic isolation of the mains phase using
a variable transformer. The following symbols identify isolated and non-isolated devices.
019aab174
019aab173
a. Isolated.
Fig 1.
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b. Non-isolated
Isolated and non-isolated symbols
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3. Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Enables low no-load power dissipation <10 mW
Low component count for a cost-effective design
Advanced control modes for optimal performance
SMPS controller with integrated power MOSFET switch
700 V high-voltage power switch for global mains operation
Primary sensing at end-of-conduction for accurate output voltage control
Avoids audible noise in all operation modes
Compensation of cable impedance included
Jitter function for reduced EMI
USB battery charging and Energy Star compliant
Universal mains input
Isolated output
Highly efficient: > 76 %
OverTemperature Protection (OTP)
4. Technical specification
Table 1.
Input and output specification
Parameter
Condition
Value
Remark
universal AC mains
Input
input voltage
-
90 V to 265 V
input frequency
-
47 Hz to 63 Hz
average power dissipation
no-load
< 10 mW
output voltage
-
5.0 V
-
maximum output current
-
1.0 A
-
maximum output power
-
5.0 W
-
Output
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5. Board photograph
Fig 2.
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6. Performance
6.1 No-load input power dissipation
No-load Input power dissipation[1]
Table 2.
Output voltage
Conditions
Power dissipation
Unit
5.16 V
115 V; 60 Hz
5.8
mW
5.14 V
230 V; 50 Hz
6.9
mW
[1]
The no-load input power has been measured after 20 minutes temperature stabilization time.
DDD
3L
P:
9PDLQV 9
(1) Pi = 5.6 mW
(2) Pi = 5.8 mW
(3) Pi = 6.9 mW
(4) Pi = 8.1 mW
Fig 3.
No-load Input power dissipation
6.2 Output voltage and efficiency performance data
Table 3 and Figure 4 show the measured efficiency figures and VI characteristics of the
GreenChip SP TEA1721AT demo board. The efficiency and VI characteristics have been
measured after 20 minutes temperature stabilization time.
Table 3.
Efficiency and VI characteristics
VCC
Parameter
115 V/60 Hz
output current (A)
0.000
0.010 0.020 0.030 0.050 0.100 0.250 0.500 0.750 1.000
output voltage (V)
5.16
5.14
output power (W)
0.000
0.052 0.102 0.152 0.253 0.500 1.245 2.483 3.754 5.030
input power (W)
0.0058
0.097 0.182 0.244 0.366 0.669 1.609 3.252 4.929 6.625
efficiency (%)
-
-
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Values
5.12
-
5.09
-
5.06
-
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5.00
74.8
4.98
77.4
4.97
77.4
5.01
76.2
5.03
75.9
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Table 3.
Efficiency and VI characteristics …continued
VCC
Parameter
230 V/50 Hz
output current (A)
0.000
0.010 0.020 0.030 0.050 0.100 0.250 0.500 0.750 1.000
Values
output voltage (V)
5.14
5.11
output power
0
0.051 0.101 0.152 0.253 0.500 1.242 2.473 3.746 5.020
input power (W)
0.0067
0.111
0.210 0.299 0.423 0.721 1.635 3.205 4.848 6.494
efficiency (%)
-
-
-
5.10
5.09
-
5.06
-
5.00
69.3
4.97
75.9
4.95
77.2
5.00
77.3
5.02
77.3
DDD
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(1) efficiency at 115 V
(2) efficiency at 230 V
Fig 4.
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Efficiency at 115 V and 230 V
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DDD
9R
9
,R $
(1) 85 V
(2) 115 V
(3) 230 V
(4) 265 V
Fig 5.
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VI characteristics at 85 V, 115 V, 230 V and 265 V
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6.3 Dynamic loading from 0 A to 0.5 A
The dynamic loading was tested according to the USB-charger specification 1.1. At a load
step of 0 A to 0.5 A, the output voltage must stay above 4.1 V. Due to primary sensing, the
TEA1721AT detects the load step only after the next switching cycle. The load step is
measured at Vmains = 115 V.
CH1 = VDRAIN
CH3 = Io
CH4 = Vo
Fig 6.
Load step 0 A to 0.5 A; Vmains = 115 V
In the worst case (see Figure 6), the output voltage drops to 4.17 V which fulfills the
USB-charger specification 1.1.
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6.4 Dynamic loading from 0.5 A to 0 A
The dynamic loading was tested according to the USB-charger specification 1.1. At a load
step of 0.5 A to 0 A, the output voltage must stay below 6.0 V. Due to primary sensing, the
TEA1721AT detects the load step only after the next switching cycle. The load step is
measured at Vmains = 230 V.
CH1 = VDRAIN
CH3 = Io
CH4 = Vo
Fig 7.
Load step 0.5 A to 0 A; Vmains = 230 V
After the load step from 0.5 A to 0 A, the output voltage rises from 4.8 V to 5.25 V.
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6.5 Short-circuit of the output
The output of the demo board can be short-circuited without damaging of any component.
Figure 8 shows the behavior of the converter when the output is short-circuited. During
short-circuit of the output, the VCC voltage (CH3) switches between VCC(startup) (17 V) and
VCC(stop) (8 V) level.
At 115 V the average output current during short circuit is 470 mA. The input power is
0.32 W.
CH1 = VDRAIN
CH2 = VCC
CH3 = Io
CH4 = Vo
Fig 8.
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Short circuit of the output; Vmains = 115 V
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At 230 V, the average output current during a short circuit is 610 mA. The input power is
0.44 W.
CH1 = VDRAIN
CH2 = VCC
CH3 = Io
CH4 = Vo
Fig 9.
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Short circuit of the output; Vmains = 230 V
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6.6 Output voltage ripple performance
The output voltage ripple was measured with an oscilloscope probe connected to the
output of the demo board. A probe tip was used with a very small GND connection. A
100 nF capacitor between output voltage and GND was used to reduce high frequency
noise. The output voltage ripple was measured at full load and at Vmains of 115 V and
230 V.
Figure 10 shows the output voltage ripple at Vmains = 115 V. The output ripple voltage is
72 mV using output capacitors C6, C8 and C10 as specified in the Bill Of Materials
(BOM).
CH1 = VDRAIN
CH4 = Vo on board (scale 50 mV/division).
Fig 10. Output voltage ripple; Vmains = 115 V
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Figure 11 shows the output voltage ripple at a 1 A load at 230 V. The output ripple voltage
is 69 mV using output capacitors C6, C8 and C10 as specified in the Bill Of Materials
(BOM).
CH1 = VDRAIN
CH4 = Vo on board (scale 50 mV/division).
Fig 11. Output voltage ripple at 1 A load; Vmains = 230 V
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6.7 Conducted EMI measurement results
The conducted EMI is measured according to CISPR22, with a 5  load at the end of a
1m USB cable. EMI is measured on neutral and on line at Vmains = 230 V. The frequency
range is 150 kHz to 30 MHz.
(1) Quasi-peak
(2) Average
a. Neutral
(1) Quasi-peak
(2) Average
b. Line
Fig 12. Electromagnetic Interference; Vmains = 230 V
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(1) Quasi-peak
(2) Average
a. Neutral
(1) Quasi-peak
(2) Average
b. Line
Fig 13. Electromagnetic Interference; Vmains = 115 V
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7. Schematic
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TEA1721ADB1102 GreenChip 5 W QBIC demo board
8. Bill of Materials (BOM)
Table 4.
TEA1721ADB1102 bill of material
Reference
Description and values
Part number
Manufacturer
C1; C2
capacitor; 6.8 F; 400 V;
8  10.8 mm
AX series
Rubycon
C3
capacitor; 10 pF; 50 V; X7R;
C0603
-
-
C4
capacitor; 220 pF; 500 V;
C0805
CC0805JRNPOBBN221
Yageo
C5
2.2 F; 50 V; C0805
C2012X7R1H225K
TDK
C6; C8
560 F; 6.3 V; 6.3  8 mm
RS80J561MDN1JT
Nichicon
C7
capacitor; not mounted
-
-
C9
capacitor; 2.2 nF; 50 V; X7R;
C0603
-
-
C10
capacitor; 22 F; 10 V; 1206
GRM31CR71A226KE15L
Murata
D1a; D1b; D1c; D1d
diode; S1ML; 1000 V;
sub-SMA
S1ML
Taiwan Semiconductor
D2
diode; S1JL; 600 V; sub-SMA S1JL
Taiwan Semiconductor
D3
diode; BAS316; 100 V;
SOD323
BAS316
NXP Semiconductors
D4
diode; PMEG4050ETP; 40 V;
SOD128
PMEG4050ETP
NXP Semiconductors
IC1
TEA1721AT; 700 V; SO7
TEA1721AT/N1
NXP Semiconductors
J1; J2
connector; input pin
SN/040/LT SILVER
Oxley Group
J3
connector
USB AF DIP -094-H
Gold Conn
L1
inductor; 1.5 mH
ZAL-0512-152K
Zenith-Tek
R3; R7
resistor; 4.3 k; 1 %; 0603
-
-
R4
resistor; 100 k; 0805
-
-
R5
resistor; 470 ; 250 mW;
1206
-
-
R6
resistor; 1.5 ; 1 %; 1206
-
-
R7a
resistor; 91 k; 1 %; 0603
-
-
R8
resistor; 1 ; 0603
-
-
R9
resistor; 100 ; 0603
-
-
R10
resistor; 16 k; 0603
-
-
RF1
Fusistor; 1 A; 250 V (AC);
3.18  7.6 mm
MCPMP 1A 250V
Multicomp
T1
transformer; EPC13
750313567
Würth Elektronik
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9. Circuit description
The GreenChip SP TEA1721AT demo board consists of a single-phase full-wave rectifier
circuit, a filtering section, a switching section, an output section and a feedback section.
Figure 14 shows the circuit diagram. Table 4 shows the component list.
9.1 Rectification section
The bridge diodes D1a to D1d form the single-phase full-wave rectifier. Capacitors C1 and
C2 are reservoir capacitors for the rectified input voltage. Resistor RF1 limits inrush
current and acts as a fuse. Terminals J1 and J2 connect the input to the electricity utility
network. Swapping these two wires has no effect on the operation of the converter.
9.2 Filtering section
Inductor L1, with capacitors C1 and C2, form a filter to attenuate conducted differential
mode EMI noise.
9.3 GreenChip SP section
The TEA1721AT device (IC1) contains the power MOS switch, oscillator, CV/CC, start-up
control and protection functions all in one IC. Its integrated 700 V MOSFET allows
sufficient voltage margins in universal input AC applications, including line surges. The
auxiliary windings on transformer T1 generate the supply voltage and primary sensing
information for the TEA1721AT. Diode D3 and capacitor C5 half-wave rectify the voltage.
Capacitor C5 is charged via the current limiter resistor R8. The voltage on capacitor C5 is
the supply voltage for the VCC pin.
The RCD-R clamp consisting of R4, C4, D2 and R5 limits drain voltage spikes caused by
leakage inductance of the transformer.
9.4 Output section
Diode D4 is a Schottky barrier type diode and capacitors C6/C8 rectify the voltage from
secondary winding of transformer T1. Using a Schottky barrier type diode results in a high
efficiency of the demo board. Capacitors C6, C8, and C10 must have sufficient low ESR
characteristics to meet the output voltage ripple requirement without adding an LC post
filter. Resistor R9 and capacitor C9 dampen high frequency ringing and reduce the voltage
stress on diode D4. Resistor R10 provides a minimum load to maintain output control in
no-load condition.
9.5 Feedback section
The TEA1721AT controls the output by current and frequency control for CV and CC
regulation. The auxiliary feedback winding on Transformer T1 senses the output voltage.
The FB pin senses the reflected output voltage using feedback resistors Rfb1 and Rfb2.
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10. PCB layout
DDD
a. Top
DDD
b. Bottom
Fig 15. PCB layout assembly
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DDD
a. Top view
DDD
b. Bottom view
Fig 16. PCB layout copper
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11. Transformer specifications
11.1 Transformer schematic design and winding construction
The transformer used in the small-size demo board has size EPC13 with bobbin EPC13
horizontal 10 pins. A few measures have been taken for a low EMI emission. Copper foil
shields are used between primary windings and secondary windings.
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b. Winding construction
Fig 17. Transformer schematic design and winding construction
11.2 Winding specification
Table 5.
Winding specification
Layer no.
Type
Wire  (mm)
Turns
No. of
layers
Method
Start
Finish
1
aux
0.1
12  2
1
split
pin 5
pin 3
2
tape
-
1
-
-
-
-
3
prim
0.1
165
3
close
pin 1
pin 2
4
tape
-
2
-
-
-
-
5
shield
0.025  CuSn6
1
-
-
pin 5
-
6
sec
0.4 TIW
11
1
close
fly 1
fly 2
7
FDBK
0.1
10
1
spread
pin 5
pin 4
8
tape
-
-
-
-
-
-
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11.3 Electrical characteristics
Table 6.
Electrical specification
Parameter
Pin
Value
Remark
primary inductance
1 to 2
1.85 mH, 10 %
Leakage inductance
1 to 2
75 H
all other windings short circuit
11.4 Core and bobbin
Core: EPC13. Core material: TP4/TP4A, equivalent to PC44
Bobbin: Würth Elektronik, EPC13 horizontal 10 pins, part number 070-5483
SDUWPXVWLQVHUWIXOO\WRVXUIDFH$
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ORWFRGHDQGGDWHFRGH
WHUPQXPEHUV
IRUUHIHUHQFHRQO\
‘ [
UHFRPPHQGHG
SFSDWWHUQFRPSRQHQWVLGH
'LPHQVLRQVLQPP
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Fig 18. Bobbin: EE13/12/6
11.5 Marking
Wurth/Midcom 750313567
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12. Attention points
When testing the CC mode of the TEA1721AT, use an electronic DC-load in resistive
mode, not in current mode.
The current in CC mode has a small fold back characteristic (see Figure 5). When the
current mode of an electronic DC-load is used, the output voltage drops immediate to zero
when the maximum current is exceeded. Once the output voltage and the input voltage of
the DC-load is zero, many DC-loads cannot adjust the current. Using the resistive mode of
the electronic DC-load avoids this problem.
Remark: This TEA1721AT controller behavior is not incorrect. Only test it in the correct
way.
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13. References
UM10780
User manual
[1]
TEA1721AT — data sheet: ultra-low standby SMPS controller with integrated power
switch
[2]
AN11060 — Application note: TEA172X 5 W to 11 W power supply/usb charger
[3]
AN11029 — Application note: Using TEA1721/TEA1723 ultra-low standby SMPS
controller ICs in white goods applications
[4]
UM10520 — TEA1721 Isolated 3-phase universal mains flyback converter demo
board user manual
[5]
UM10521 — TEA1721 isolated universal mains flyback converter demo board user
manual
[6]
UM10522 — TEA1721 non-isolated universal mains buck and buck/boost converter
demo board user manual
[7]
UM10523 — TEA1721 universal mains white goods flyback SMPS demo board user
manual
[8]
UM10529 — TEA1721AT 5 W GreenChip SP small-size demo board
[9]
UM10532 — TEA1723AT GreenChip SP low standby power SMPS demo board
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 7 May 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
25 of 27
UM10780
NXP Semiconductors
TEA1721ADB1102 GreenChip 5 W QBIC demo board
14. Legal information
14.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
14.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express, implied
or statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of this
product remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
to customer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business, business
interruption, loss of use, loss of data or information, and the like) arising out
the use of or inability to use the product, whether or not based on tort
(including negligence), strict liability, breach of contract, breach of warranty or
any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by customer
for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
law, even if any remedy fails of its essential purpose.
Safety of high-voltage evaluation products — The non-insulated high
voltages that are present when operating this product, constitute a risk of
electric shock, personal injury, death and/or ignition of fire. This product is
intended for evaluation purposes only. It shall be operated in a designated
test area by personnel that is qualified according to local requirements and
labor laws to work with non-insulated mains voltages and high-voltage
circuits.
The product does not comply with IEC 60950 based national or regional
safety standards. NXP Semiconductors does not accept any liability for
damages incurred due to inappropriate use of this product or related to
non-insulated high voltages. Any use of this product is at customer’s own risk
and liability. The customer shall fully indemnify and hold harmless NXP
Semiconductors from any liability, damages and claims resulting from the use
of the product.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
14.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP Semiconductors N.V.
UM10780
User manual
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 7 May 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
26 of 27
UM10780
NXP Semiconductors
TEA1721ADB1102 GreenChip 5 W QBIC demo board
15. Contents
1
2
3
4
5
6
6.1
6.2
6.3
6.4
6.5
6.6
6.7
7
8
9
9.1
9.2
9.3
9.4
9.5
10
11
11.1
11.2
11.3
11.4
11.5
12
13
14
14.1
14.2
14.3
15
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Safety warning . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Technical specification . . . . . . . . . . . . . . . . . . . 4
Board photograph . . . . . . . . . . . . . . . . . . . . . . . 5
Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
No-load input power dissipation . . . . . . . . . . . . 6
Output voltage and efficiency performance data 6
Dynamic loading from 0 A to 0.5 A . . . . . . . . . . 9
Dynamic loading from 0.5 A to 0 A . . . . . . . . . 10
Short-circuit of the output . . . . . . . . . . . . . . . . 11
Output voltage ripple performance . . . . . . . . . 13
Conducted EMI measurement results . . . . . . 15
Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Bill of Materials (BOM). . . . . . . . . . . . . . . . . . . 18
Circuit description . . . . . . . . . . . . . . . . . . . . . . 19
Rectification section . . . . . . . . . . . . . . . . . . . . 19
Filtering section . . . . . . . . . . . . . . . . . . . . . . . 19
GreenChip SP section . . . . . . . . . . . . . . . . . . 19
Output section . . . . . . . . . . . . . . . . . . . . . . . . 19
Feedback section . . . . . . . . . . . . . . . . . . . . . . 19
PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Transformer specifications . . . . . . . . . . . . . . . 22
Transformer schematic design and winding
construction . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Winding specification . . . . . . . . . . . . . . . . . . . 22
Electrical characteristics . . . . . . . . . . . . . . . . . 23
Core and bobbin . . . . . . . . . . . . . . . . . . . . . . . 23
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Attention points . . . . . . . . . . . . . . . . . . . . . . . . 24
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 7 May 2014
Document identifier: UM10780
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