NXP TEA175X HV start-up DCM/QR flyback controller User Guide

NXP TEA175X HV start-up DCM/QR flyback controller User Guide

UM10514 GreenChip TEA1755DB1100 90 W power supply

Rev. 4 — 13 September 2017 User manual COMPANY PUBLIC

Document information Information Content

Keywords TEA1755DB1100, TEA1755T GreenChip SR, TEA1792TS, control IC, TEA1703TS, PFC, flyback, synchronous rectification, high efficiency, power down functionality for very low standby power, adapter, notebook, PC power Abstract This user manual provides the specification, performance measurements, schematics, bill of materials and PCB layout of the TEA1755DB1100 90 W board. See the associated data sheets and application notes for information on the TEA1792TS, TEA1792TS and TEA1703TS ICs.

NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply Table 1. Revision history Rev Date

v.4

20170913 Modifications v.3

v.2

v.1.1

v.1

Description

new version

Text and graphics have been updated throughout the document.

20150112 new version 20131118 20130118 20121210 new version updated issue first issue UM10514

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

1 Introduction

Warning

The non-insulated high voltages that are present when operating this product, constitute a risk of electric shock, personal injury, death and/or ignition of fire.

This product is intended for evaluation purposes only. It shall be operated in a designated test area by personnel qualified according to local requirements and labor laws to work with non-insulated mains voltages and high-voltage circuits. This product shall never be operated unattended.

• • • • • •

This user manual describes the TEA1755DB1100 demo board. The demo board is a universal input, 19.5 V, 90 W single output power supply using the GreenChip device TEA1755T together with the TEA1703TS and TEA1792TS.

It contains the following content: Specification of the power supply The circuit diagram The component list The PCB layout and component positions Documentation of the PFC choke and flyback transformer Test data and oscilloscope pictures of the most important waveforms The GreenChip combines the control and drive for both the PFC and the flyback stages into a single device. The TEA1755T provides SMPS control functionality to comply with the IEC61000-3-2 harmonic current emission requirements. It enables a significant reduction of components, save PCB space and BOM cost.

It offers low-power consumption in no-load condition, which is attractive for the consumer products where it is a requirement. The built-in green functions ensure high efficiency at all power levels. This efficiency results in a design that can easily meet all existing and proposed energy efficiency standards such as: CoC (Europe), ENERGY STAR (U.S), CEC (California), MEPS (Australian and New Zealand), and CECP (China).

The TEA1703 in combination with the TEA1755T provides a very low-power consumption performance in standby mode.

The TEA1792 is a synchronous rectification control IC that requires no external components to set the timing. The GreenChip SR can be applied to a wide V CC operating range between 8.5 V and 38 V, minimizing the number of external components required and enabling simpler designs. The high driver output voltage (10 V) makes the GreenChip SR compatible with all brands of MOSFETs.

Figure 1 shows the assembled top board view and bottom view of the TEA1755DB1100

demo board.

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

aaa-004745

a. Top view

aaa-004746

b. Bottom view

Figure 1. TEA1755DB1100 demo board

UM10514

User manual COMPANY PUBLIC 1.1 Features • • • • • • • • • • • • •

Universal mains supply operation Integrated PFC and flyback controller Accurate PFC on/off control Burst mode operation for high efficiency with low audible noise OverCurrent Protection (OCP) OverPower Protection (OPP) OverTemperature Protection (OTP) Open control loop protection for both converters (the open-loop protection for the flyback converter is safe restart; TEA1755LT version only) Excellent load step performance Ultra-low-power consumption in standby mode (Erp lot 6 compliant) High/low line output power compensation High efficiency (ENERGY STAR and Erp lot 6 compliant) EMI CISPR22 compliant All information provided in this document is subject to legal disclaimers.

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2 Configuration

There are two versions of the TEA1755DB1100 demo board

• •

APBADC068(A) - with TEA1703TS APBADC068(B) - without TEA1703TS The configuration is marked on the back side of the demo board. The performance data refer to the (A) version, unless otherwise specified. More information about the differences between the two versions and other alternative circuit options can be found in

Section 10 .

Figure 2. TEA1755DB1100 demo board configuration marking

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3 Power supply specifications

Table 2. Input specifications Symbol Description Condition A

V i f i P i(no-load) mains input voltage mains input frequency no-load input power 230 V/50 Hz < 50

Specification B

90 to 264 47 to 64 < 100

Units

V Hz mW UM10514

User manual COMPANY PUBLIC Table 3. Output specifications Symbol Description

V o V o(min) V o(ripple)(p-p) I o I OM t holdup V line(reg) V L(reg) t startup η SCP OCP OVP

Condition A

output voltage minimum output voltage during standby operation at 90 V; 60 Hz; no-load output ripple and noise 20 MHz bandwidth continuous output current 90 V to 264 V peak output current hold-up time 115 V; 60 Hz 115 V; 60 Hz; full-load output voltage regulation as a function of mains voltage 90 V to 264 V output voltage regulation as a function of load start-up time efficiency 0 A to 4.62 A 115 V; 60 Hz according to ENERGY STAR (EPS2) EMI CISPR22 compliant immunity against ESD EN61000-4-2 compliant (≥ ±12 kV air discharge) short-circuit protection overcurrent protection latched output overvoltage protection ≥ 12 All information provided in this document is subject to legal disclaimers.

Rev. 4 — 13 September 2017 Configuration B

19.5

≤ 100 0 to 4.62

5.6

5 ±1 ±2 ≤ 2 ≥ 89.5

pass pass P in < 1.2

P in < 2.2

< 24 -

Units

V V % s % W W V mV p-p A A ms % © NXP B.V. 2017. All rights reserved.

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NXP Semiconductors Symbol Description

OTP FLR overtemperature protection fast latched reset

UM10514 GreenChip TEA1755DB1100 90 W power supply Units Condition A

Disconnect mains voltages

Configuration B

≤ 120 < 2 °C s UM10514

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

4 Performance data

4.1 Test setup

Performance figures are based on the following PCB design:

Schematic version: APBADC068 TEA1755 plus TEA1792 plus TEA1703, 90 W adapter

(see Figure 25

or Figure 26

).

4.1.1 Test equipment

• • • • • • • • •

AC source: Agilent 6812B Power meter: Yokogawa WT210 with harmonics option DC electronic load: Chroma, model 6310 Digital oscilloscope: Yokogawa DLM 2024 Current probe: Yokogawa 701933 30 A; 50 MHz 100 MHz, high-voltage differential probe: Yokogawa 700924 500 MHz, low voltage differential probe: Yokogawa 701920 Multimeter: Keithley 2000 EMC receiver: Rohde & Schwarz ESPI-3 + LISN ENV216

4.1.2 Test conditions

• • • •

Adapter on the lab-table with the heat sinks downwards The adapter has no casing Ambient temperature between 20 °C and 25 °C Measurements are made after stabilization of the temperature. These measurements are according to "test method for calculating the efficiency of single-voltage external AC-DC and AC-AC power supplies" of ENERGY STAR

4.2 Efficiency

Efficiency measurements are executed using an automated test program containing a temperature stability detection algorithm. The output voltage and current are measured using a 4-wire current sense configuration directly at the PCB connector.

The measurement results for a selection of mains input voltages are shown in Table 4

.

Table 4. TEA1755DB1100 demo board efficiency results Condition ENERGY STAR 2.0 Efficiency requirement (%) Averag e 100 % load 75 % load

90 V/60 Hz > 87 100 V/50 Hz > 87 115 V/60 Hz > 87 230 V/50 Hz > 87 90.5

90.9

91.4

91.1

89.87

90.41

90.98

91.72

90.74

91.14

91.60

91.37

264 V/50 Hz > 87 91 91.92

91.53

50 % load

90.79

91.11

91.47

90.01

89.96

25 % load

90.63

90.94

91.53

91.33

90.76

500 mW load 250 mW load 100 mW load

81.41

81.49

81.29

77.11

75.27

72.99

72.88

72.41

66.12

63.71

54.61

54.13

53.34

45.27

42.78

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Notes:

Warm-up time is 10 minutes.

There is an efficiency loss of 1 % when measured at the end of a 1 m output cable.

A V DC current source Cable

014aab147

Figure 3. DC resistance output cable

The DC resistance output cable produces a two-way resistance of: (1)

4.3 PFC on/off level

To measure the PFC on/off tripping point, slowly increase/decrease the output current and check the power factor.

The measurement results for a selection of mains input voltages are shown in Table 5

.

Table 5. PFC on and off level as a function of the mains input voltage Condition Output current (A)

90 V/60 Hz

PFC ON level

1.8

PFC OFF level

1.25

100 V/50 Hz 115 V/60 Hz 230 V/50 Hz 264 V/50 Hz 1.82

1.82

1.76

1.76

1.25

1.25

1.22

1.22

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply 4.4 No-load power consumption

Power consumption performance of the total application without load connected is measured using an automated test program containing a temperature stability detection algorithm.

The measurement results for a selection of mains input voltages are shown in Table 6

.

Table 6. Output voltage and power consumption: no-load Condition ENERGY STAR 2.0

requirement (mW) No-load power consumption (mW) Configuration A Configuration B

90 V/60 Hz 100 V/50 Hz 115 V/60 Hz 230 V/50 Hz 264 V/50 Hz ≤ 300 ≤ 300 ≤ 300 ≤ 300 ≤ 300 4 5 6 27 34 69 70 72 97 112 Configuration (A) containing the IC combination TEA1755 and TEA1703, results in a standby power consumption far below the requirements of ENERGY STAR EPS2.0.

It reflects the extra low standby power consumption that is required in the market for certain products.

4.5 Minimum output current for normal operation

This measurement is valid only for configuration (A). This application can function in two modes:

• •

Normal mode: TEA1755 is active and output voltage is in regulation.

Standby mode: TEA1755 is set to power-down mode by TEA1703; output voltage is not in regulation and is a saw tooth waveform with an amplitude between V o and V o(min) The minimum current to leave standby operation and enter normal operation is measured

for 90 V/60 Hz and 264 V/50 Hz. The measurement results are shown in Table 7

.

Table 7. Minimum current for normal operation Condition Output current (mA)

90 V/60 Hz 264 V/50 Hz 1.73

1.78

4.6 Power factor and THD

The total harmonic distortion for voltage and current is measured according to the IEC standard. Power factor and THD are measured using the Yokogawa power meter at the mains input with an automated test program containing a temperature stability detection algorithm. Measurements are performed for full load (4.62 A) condition.

The measurement results for a selection of mains input voltages are shown in Table 8

.

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NXP Semiconductors Table 8. Power factor and THD Condition Power factor (%)

90 V/60 Hz 0.99

100 V/50 Hz 115 V/60 Hz 230 V/50 Hz 264 V/50 Hz 0.99

0.98

0.92

0.89

UM10514 GreenChip TEA1755DB1100 90 W power supply THD I (%)

11.65

13.29

16.44

36.73

40.28

4.7 High/low line output power compensation

Nominal output power is measured directly at the output connector for various mains input voltages.

Figure 4 shows the nominal and peak output power as function of mains voltage.

P 115 o 110 105 100 95

aaa-005820

(2) 90 85 (1) 80 90 130 170 210 250 290 V i V(AC) (1) Nominal P o (W) (2) Peak P o (W)

Figure 4. Normal and peak output power as a function of mains voltage

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply 4.8 VCC voltage

The voltage on the VCC pin is measured for both no-load and full-load conditions. The minimum output current of 5 mA prevents switching to standby mode for configuration (A).

Table 9. VCC voltage configuration (A) Condition No-load (5 mA)

115 V/60 Hz 230 V/50 Hz 21.2

21.2

Full-load (4.62 A)

28.6

28

Table 10. VCC voltage configuration (B) Condition No-load (0 mA)

115 V/60 Hz 230 V/50 Hz 15.8

15.8

Note:

The VCC voltage at no-load condition is VCC (min) .

Full-load (4.62 A)

28.6

28

4.9 Timing and protection

4.9.1 Switch-on delay and output rise time

Test conditions

The electronic load is set to Constant Current (CC) mode and V O = 0 V. The electronic load is set to the maximum continuous output current.

• • • • Criteria to pass

Switch-on delay: 2 s maximum after the AC mains voltage is applied to the time when the output is within regulation Output rise time: The output voltage rises from 10 % of the maximum to the regulation limit within 30 ms. The ramp-up of the output voltage is smooth and continuous. No voltage with a negative polarity is present at the output connector during start-up No output voltage bounce or hiccup is allowed during switch-on There is sufficient margin between the FBCTRL signal and the 7.75 V timeout trigger level. This margin avoids false triggering of the timeout protection due to component tolerances

Figure 5 shows the delay between switch-on and output regulation. Figure 6

shows the output rise time at full load start-up.

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a. Mains input 90 V/60 Hz; delay time: 820 ms

Figure 5. Delay between switch-on and output regulation

b. Mains input 264 V/50 Hz; delay time: 713 ms (1) Load = 4.62 A (2) Ch1 (yellow): mains input (3) Ch2 (green): VCC pin TEA1755 (4) Ch3 (magenta): FBCTRL pin TEA1755 (5) Ch4 (cyan): output voltage a. Mains input 90 V/60 Hz; output rise time: 13 ms b. Mains input 264 V/50 Hz; output rise time: 17 ms (1) Load = 4.62 A (2) Ch1 (yellow): mains input (3) Ch2 (green): FBCTRL pin TEA1755 (4) Ch3 (magenta): FBSENSE pin TEA1755 (5) Ch4 (cyan): output voltage

Figure 6. Output rise time at full-load start-up

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4.9.2 Brownout and brownout recovery

When the VINSENSE voltage is less than the V stop(VINSENSE) flyback driver output is switched off when driver t on(fb)max , the PFC driver output is switched off to prevent the PFC from operating at very low mains input voltages. The is reached.

Test conditions

The mains input voltage is decreased from 90 V down to 0 V and then increased from 0 V to 90 V. The electronic load is set to Constant Current (CC) mode and V on = 0 V. The electronic load is set to the maximum continuous output current (4.62 A).

Criteria to pass • • • •

The adapter survives the test without damage and excessive heating of component The output voltage remains within the specified regulation limits or switch-off No output bounce or hiccup is allowed during switch-on or switch-off The adapter powers up before the AC line input voltage reaches 85 V (maximum)

Figure 7 shows the graphs for brownout and brownout recovery.

a. AC mains input from 90 V to 0 V; brownout recovery voltage = 100 / (√2) = 71 V.

b. AC mains input from 0 V to 90 V; brownout recovery voltage = 110 / (√2) = 78 V.

(1) Load = 4.62 A (2) Ch1 (yellow): VINSENSE pin TEA1755 (3) Ch2 (green): VCC pin TEA1755 (4) Ch3 (magenta): output voltage (5) Ch4 (cyan): mains input voltage

Figure 7. Brownout and brownout recovery

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4.9.3 Output short circuit protection

To protect the adapter and application against an output short circuit or a single fault open (flyback) feedback loop, timeout protection is implemented. When the voltage on the FBCTRL pin rises above 4.5 V (typical), a fault is assumed and switching is blocked.

The timeout protection must not trigger during a normal start-up with the maximum continuous output current.

Test conditions • •

There are two test conditions: The adapter is switched on with 4.62 A output load. After start-up a short circuit is applied manually at the end of the output cable Before the adapter is switched on, a short circuit is applied at the end of the output cable

Note:

An output short circuit is defined as an output impedance less than 0.1 Ω.

Criteria to pass • • •

The adapter can withstand a continuous short circuit at the output without damaging or overstressing the adapter under any input conditions The average input power is less than 3 W during the short circuit test After removal of the short circuit, the adapter recovers automatically

Figure 8 to

Figure 10

show the graphs for output short circuit protection.

a. Mains input 90 V/60 Hz b. Mains input 264 V/50 Hz (1) Load before short circuit = 4.62 A (2) Ch1 (yellow): drain flyback MOSFET (3) Ch2 (green): FBCTRL pin TEA1755 (4) Ch3 (magenta): VCC pin TEA1755 (5) Ch4 (cyan): output voltage

Figure 8. Output short circuit triggering of the timeout protection

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a. Output short circuit during normal operation b. Output short circuit applied before start-up (1) Load before short circuit = 4.62 A (2) Ch1 (yellow): drain flyback MOSFET (3) Ch2 (green): FBCTRL pin TEA1755 (4) Ch3 (magenta): VCC pin TEA1755 (5) Ch4 (cyan): output voltage

Figure 9. Output short circuit 90 V/60 Hz

a. Output short circuit during normal operation b. Output short circuit applied before start-up (1) Load before short circuit = 4.62 A (2) Ch1 (yellow): drain flyback MOSFET (3) Ch2 (green): FBCTRL pin TEA1755 (4) Ch3 (magenta): VCC pin TEA1755 (5) Ch4 (cyan): output voltage

Figure 10. Output short circuit 264 V/50 Hz

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply Table 11. Output short circuit input power

Output short circuit input power at different mains input voltages

Condition

90 V/60 Hz 100 V/50 Hz 115 V/60 Hz

Input power P

404 412 424

i (mW) Power meter current range (mA)

100 100 100 230 V/50 Hz 264 V/50 Hz 530 568 200 500

Note:

P i integrated over 6 minutes.

4.9.4 OverCurrent Protection (OCP)

• • Test conditions

The electronic load is set in Constant Current (CC) mode The load is increased from the maximum continuous value in small steps until the overcurrent protection is triggered. The input power is measured after triggering the overcurrent protection without changing the load setting. P minute interval. The input current range of the power meter is set to indicate in range when the controller is switching (burst on state).

i is integrated during a 6-

• • Criteria to pass

The output power is limited to less than 150 W, before triggering of the overcurrent protection The average input power is less than 3 W when the overcurrent protection has been triggered

Table 12. Maximum output power at different mains input voltages Condition Output voltage (V) OCP trigger level (A) Output power P o(max) (W)

90 V/60 Hz 100 V/50 Hz 19.25

19.25

6.7

6.7

129 129 115 V/60 Hz 230 V/50 Hz 264 V/50 Hz 19.25

19.23

19.23

6.7

6.4

6.4

129 123 123 UM10514

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply Table 13. Input power in OCP state at different mains input voltages Condition P i (W) Power meter current range (A)

90 V/60 Hz 2.2

2 100 V/50 Hz 115 V/60 Hz 230 V/50 Hz 264 V/50 Hz 2.2

2.2

2.1

2.1

1 1 0.5

0.5

4.9.5 OverVoltage Protection (OVP)

Test conditions

Applying a short circuit across the opto-LED of the optocoupler (U2) creates an output overvoltage condition. The output voltage and VCC pin voltage is measured directly at the output connector. The minimum output current of 15 mA prevents entering standby mode.

• • • • Criteria to pass

The output voltage does not exceed 25 V or stabilizes between 25 V and the rated output voltage The voltage on the TEA1755 VCC pin does not exceed the absolute maximum rating of 38 V When OVP is triggered, the primary side controller shuts down and stays in a latched mode A single point fault must not cause a sustained overvoltage condition at the output

Table 14. VCC and output voltage in case of OVP as a function of mains input voltage Condition V O (V) VCC (V)

90 V/60 Hz 24.2

27.55

100 V/50 Hz 115 V/60 Hz 230 V/50 Hz 264 V/50 Hz 24.28

24.38

24.13

24.15

27.45

27.48

27.30

27.15

Figure 11

shows the graphs for output overvoltage protection.

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

a. Mains input 90 V/60 Hz

Figure 11. Output overvoltage protection

b. Mains input 264 V/50 Hz (1) Output current before short circuit of the optocoupler = 0.015 A (2) Ch1 (yellow): drain flyback MOSFET (3) Ch2 (green): FBCTRL pin TEA1755 (4) Ch3 (magenta): VCC pin TEA1755 (5) Ch4 (cyan): output voltage UM10514

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

4.9.6 OverTemperature Protection (OTP)

An accurate external overtemperature protection (TEA1755 LATCH pin, RT2, R26, and C19) is provided on the TEA1755DB1100 demo board. This measure protects the flyback

transformer against overheating (see Figure 12

). Normally, the flyback transformer is the hottest component on the board.

Test conditions

The NTC temperature sensor, glued to the transformer, is heated using hot air.

Criteria to pass

The IC latches off the output at a V LATCH trip level of 0.494 V. No output bounce or hiccup is allowed.

Note:

For this demo board, the NTC is mounted on the heat sink. This place is not the hottest spot of the adapter. It is better to mount the NTC on the transformer.

(1) OTP trigger temperature 140 °C (2) Load = 4.62 A before OTP is triggered; Mains input: 230 V/50 Hz (3) Ch1 (yellow): mains input voltage (4) Ch2 (green): LATCH pin TEA1755 (5) Ch3 (magenta): VCC pin TEA1755 (6) Ch4 (cyan): output voltage

Figure 12. External overtemperature protection

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

4.9.7 Fast Latch Reset (FLR)

• •

A fast latch reset function enables latched protection to be reset without discharging the bulk electrolytic capacitor. The latch protection is reset when the voltage on the VINSENSE pin drops below 0.75 V and is then raised to 0.86 V. This voltage variation is done by disconnecting the mains voltage.

Test conditions

The output is loaded (I The test sequence is as follows:

– – –

(see also o = 50 mA) A short circuit across the OPTO-led provides an OVP to trigger the latch protection

Section 4.9.5

)

The mains input is switched off and the voltage on the VINSENSE pin drops below 0.75 V The mains input is switched on and, when the voltage on the VINSENSE pin rises above 0.86 V, the latch protection is released

Note:

Switching of both live and neutral is required.

Criteria to pass

The latch is reset within 3 s after switching of the mains input voltage.

Figure 13

shows the graphs for Fast Latch Reset (FLR).

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

a. Mains input 90 V/60 Hz; FLR = 1.5 s b. Mains input 264 V/50 Hz; FLR = 1.3 s (1) Ch1 (yellow): mains input voltage (2) Ch1 (green): FBDRIVER pin TEA1755 (3) Ch2 (magenta): VCC pin TEA1755 (4) Ch3 (cyan): output voltage

Figure 13. Fast latch reset 4.10 Output regulation

4.10.1 Load regulation

The output voltage as a function of load current is measured using a 4-wire current sense configuration at the end of the cable. The minimum current of 15 mA prevents switching to standby mode. Measurements are performed for 90 V/60 Hz and 264 V/50 Hz.

Criteria to pass

The output voltage deviation must be less than 2 %. The load regulation is calculated

using Equation 2 .

(2) Where:

V o(nom) = 19.5 V

The results are shown in Table 15 .

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply Table 15. Load regulation Condition No load

90 V/60 Hz 264 V/50 Hz

V o (V)

19.40

19.40

I o (A)

0.015

0.015

Full load V o (V)

19.29

19.24

I o (A)

4.62

4.62

Load regulation (%)

0.56

0.82

20.00

V o (V) 19.60

19.20

(1) (2)

aaa-005822

18.80

18.40

18.00

0 2 4 6 (1) 115 V (AC)/60 Hz (2) 230 V (AC)/50 Hz

Figure 14. Output voltage regulation as a function of load

I o (A) 8

4.10.2 Line regulation

The output voltage as a function of mains input voltage is measured using a 4-wire current sense configuration at the end of the cable for full-load (4.62 A) condition.

Table 16

and

Figure 15 show the results.

Criteria to pass

The output voltage deviation must be less than 0.05 %. The load regulation is calculated

using Equation 3 .

(3)

Where: V o(nom) = 19.5 V UM10514

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NXP Semiconductors Table 16. Line regulation Condition Mains

90 V/60 Hz 100 V/50 Hz 115 V/60 Hz 230 V/50 Hz 264 V/50 Hz

V o (V)

19.28

19.28

19.28

19.24

19.24

UM10514 GreenChip TEA1755DB1100 90 W power supply Full-load I o (A)

4.62

4.62

4.62

4.62

4.62

19.5

V O (V) 19.4

19.3

19.2

19.1

aaa-005823

19.0

90 130 170 210 250 290 V i (V AC) (1) Device name: 1

Figure 15. Output voltage as a function of mains voltage

4.10.3 Output voltage regulation in standby mode

Measurement is only valid for configuration (A).

Table 17

shows the mains input voltages and results for output voltage regulation during no-load operation.

Table 17. Output voltage in standby mode (configuration A) Condition V o maximum (V) V o minimum (V)

90 V/60 Hz 19.6

12.7

264 V/50 Hz 19.6

12.7

Repetition rate (s)

134.3

134.9

Figure 16

shows the graphs for output voltage regulation at no-load.

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

a. Mains input 90 V/60 Hz b. Mains input 264 V/50 Hz (1) Ch1 (yellow): VCC pin TEA1755 (2) Ch2 (green): FBDRIVER pin TEA1755 (3) Ch4 (cyan):output voltage

Figure 16. Output voltage regulation at no-load

4.10.4 No-load output ripple in burst mode

This measurement is only valid for demo board configuration (B). The output voltage ripple is measured when the TEA1755 controller is operating in burst mode. The output voltage ripple during no-load operation is measured for 90 V/60 Hz and 264 V/50 Hz (see

Table 18

).

Table 18. Output voltage in standby mode (configuration B) Condition V o (V) maximum V o (V) minimum V p-p (mV) V mean (mV) Repetition rate (Hz)

90 V/60 Hz 264 V/50 Hz 19.6

19.6

19.2

19.3

363 363 19.4

19.4

5 5

4.10.5 Burst mode repetition rate

Burst repetition rate is measured when the burst on/off duty cycle is 50 %.

Criteria to pass

Burst repetition rate must be lower than 800 Hz to prevent the risk of audible noise.

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

Ch2 (green): FBDRIVER pin TEA1755 Ch3 (magenta): CTRL pin TEA1755 Ch4 (cyan): V o

Figure 17. Burst mode repetition rate at 230 V/50 Hz; I o = 0.45 A

Table 19

shows the mains input voltages and results for burst mode repetition rate and output current.

Table 19. Burst mode repetition rate Condition Burst mode repetition rate (Hz)

90 V/60 Hz 115 V/60 Hz 230 V/50 Hz 776 754 745 264 V/50 Hz 749

Output current for 50 % duty cycle (A)

0.46

0.44

0.43

0.43

4.10.6 Hold-up time

Hold-up time is defined as the time between the following events:

• • •

After mains switch-off When the lowest bulk capacitor voltage during a mains cycle is crossed When the output voltage starts to drop The hold-up time at 115 V/60 Hz is 28.2 ms.

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

(1) Ch3: V O (2) Ch4: bulk cap voltage

Figure 18. Full load: Hold-up time at 115 V/60 Hz 4.11 Dynamic loading • • • Test conditions

The adapter is subjected to a load change from 0.33 % to 100 % at a slew rate of 2.5 A/μs. The minimum output current of 15 mA (0.33 %) prevents that the device enters standby mode The frequency of change is set to give the best readability of the deviation and setting time The output voltage is measured at the end of the cable

Criteria to pass

The output voltage must not overshoot or undershoot beyond the specified limits (+1 V and −0.5 V) after a load change.

Figure 19

and

Figure 20 show the graphs for dynamic load response.

Table 20. Dynamic loading test condition and results

Deviation of the output voltage at a load step from 4.62 A to 0.015 A and from 0.015 A to 4.62 A.

Condition Loading V o(max) (V) V o(min) (V) V o(max) (mV) – V o(nom) Deviation V o(nom) (mV) – V o(min)

90 V/47 Hz I o : 0.33 % to 100 %; f: 1.25 Hz; duty cycle: 25 % 264 V/63 Hz I o : 0.33 % to 100 %; f: 1.25 Hz; duty cycle: 25 % 19.94

19.93

18.95

18.98

435 443 552 520 UM10514

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

a. Mains input

Figure 19. Dynamic load response 90 V/60 Hz

b. Mains input (detailed view) (1) Ch1 (yellow): PFC bus voltage (2) Ch2 (green): output current (3) Ch3 (magenta): PFC timer pin TEA1755 (4) Ch4 (cyan):output voltage a. Mains input 264 V/50 Hz

Figure 20. Dynamic load response 264 V/50 Hz

b. Mains input 264 V/50 Hz (detailed view) (1) Ch1 (yellow): PFC bus voltage (2) Ch2 (green): output current (3) Ch3 (magenta): PFC timer pin TEA1755 (4) Ch4 (cyan):output voltage UM10514

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply 4.12 Output ripple and noise Test conditions

Output ripple and noise are defined as periodic or random signals over a frequency band of 10 Hz to 20 MHz.

Output ripple and noise are measured at the end of the cable using the measurement

set-up shown in Figure 21

. An oscilloscope probe is connected to the end of the adapter cable using a probe tip.

100 nF and 1 μF capacitors are added between plus and minus to reduce high-frequency noise. The input channel bandwidth of the oscilloscope is limited to 20 MHz.

Adapter cable 1 µF 100 nF Probe tip 1:10 Probe

014aab151

Figure 21. Output ripple and noise measurement setup Criteria to pass

The output ripple and noise must remain within the specified limits 100 mV (peak-to peak) for the full load (4.62 A) condition.

Table 21

shows the measurement results for a selection of mains input voltages.

Table 21. Output ripple and noise measurements

Ripple and noise (at maximum load) as a function of the mains input voltage

Condition

90 V/47 Hz

V o(ripple)(p-p) (mV)

90 100 V/50 Hz 115 V/60 Hz 230 V/50 Hz 264 V/63 Hz 79 79 74 74

Figure 22

shows the graphs for output ripple and noise.

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

a. Mains input 90 V/60 Hz

Figure 22. Output ripple and noise

b. Mains input 264 V/50 Hz (1) Ch4 (cyan): output voltage (AC coupled) (2) Ch2 (green): FBDRIVER pin TEA1755 UM10514

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5 ElectroMagnetic Compatibility (EMC)

5.1 Conduction emission

5.1.1 Conditions

• • • • • • •

Type: Conducted Electromagnetic Compatibility (EMC) measurement Frequency range: 150 kHz to 30 MHz Output power: full load condition Supply voltage: 115 V and 230 V Margin: 6 dB below limit Secondary ground connected to earth ground Measurements performed by NXP Semiconductors Nijmegen (The Netherlands) In the graphs shown in

Figure 23

and

Figure 24 , the blue line is the quasi-peak

measurement result and the black line is the average measurement result.

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

a. Phase N b. Phase L

Figure 23. Conduction emission 115 V

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

a. Phase N b. Phase L

Figure 24. Conduction emission 230 V

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply 5.2 Immunity against lighting surges • • • • • • Test conditions

Combination wave: 1.2/50 μs open-circuit voltage and 8/20 μs short circuit current Test voltage: 2 kV L1 to L2: 2 Ω; L1 to PE, L2 to PE and L1 + L2 to PE: 12 Ω Phase angle: 0°, 90°, 180° and 270° Number of tests: 5 positive and 5 negative Pulse repetition rate: 20 s

Test result

There is no disruption of functionality.

5.3 Mains harmonic reduction • • Test conditions

The adapter is set to the maximum continuous load of 4.62 A The input voltage is 230 V/50 Hz Criteria to pass Compliance with EN61000-3-2 A14 class D.

Test result

Passed, see

Table 22 .

7 9 11 13 15 17 19 1 3 5

Table 22. MHR according to EN61000-3-2 A14, class D Harmonic nr.

Measured (mA) Limit (mA) Harmonic nr.

427.7

149.7

21.3

338.1

189 21 23 25 8.1

14.0

6.6

5.5

3.9

3.0

2.1

99.4

49.7

34.8

34.8

29.5

25.5

22.5

27 29 31 33 35 37 39 6.5

7.1

1.9

2.8

4.0

1.7

2.0

Measured (mA)

9.6

2.6

1.4

Limit (mA)

20.1

18.2

16.7

15.3

14.2

13.2

12.4

11.6

10.9

10.3

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UM10514

GreenChip TEA1755DB1100 90 W power supply

6 Schematic TEA1755DB1100 demo board

Figure 25

shows the schematic for configuration A.

L P.E

CN1 L G 1 F1 2 3.15 A 250 V N N 3 R1 3 MΩ R2 3 MΩ CX1 0.33µF LF2 12.8 mH C1 0.47 µF BD1 GBU806 + L1 220 µH R9 10 Ω R12 1 kΩ R11 15 kΩ C22 220 pF C2 0.47 µF 9 L2 250 µH D1 MUR460 7 BC1 R5B 12 1 C3 100 µF Q1 TK12A50D D2 1N4148W R8 10 Ω R31 2.2 kΩ C6 100 nF R17 1.2 kΩ R16 36 kΩ R14 10 Ω C23 220 pF C5 220 pF R40 n.m.

R10 0.1 Ω C10 100 nF R6 8.2 MΩ C3A 10 nF R5 6.8 MΩ R6B 8.2 MΩ Q9 BSS127 R5A 6.8 MΩ switch_signal R42 110 kΩ Q8 BSS127 R43 160 kΩ D4 1N4148W R13 10 Ω R16A 1.1 kΩ R15A n.m.

C8 3.3 nF 1N4007 1.5 A 1000 V R41 n.m.

Q2 TK10A60D R15 0.1 Ω R18 43 kΩ R19 43 kΩ D3 C9 100 pF 2 T1 450 µH 11 D30 BAS21 4 1 8 7, 8 9, 10 SRSENSE U3 1 GND 2 C30 1 µF 50 V VCC 3 4 5 SELREG n.c.

6 DRIVER

TEA1792

R30 Q4 PSMN013-100 10 Ω D50 BAS21 R51 20 kΩ C50 1 nF R33 n.m.

R52 100 kΩ C51 2.2 µF C31 n.m.

L4 10 mH R57 3 kΩ U2A-2 1 2 R32 1 kΩ D51 n.m.

R53 4.7 MΩ C52 100 pF R54 360 kΩ R22 10 kΩ switch_signal R45 430 kΩ R46 n.m.

R21 0 Ω D5 BAS21 R23A 220 kΩ D23A BAS21 C13 47 µF 35 V C14 1 µF 50 V C24, 1 µF HV HVS PFCTIMER FBDRIVER PFCDRIVER PFCSENSE FBSENSE U1 16 15 14 13 12 11 VOSENSE 10 9 R7 107 kΩ (1 %) C4 4.7 nF

TEA1755

1 2 3 4 7 8 5 6 R27 VCC GND FBCTRL FBAUX LATCH PFCCOMP VINSENSE PFCAUX 5.1 kΩ R3 62 kΩ R23 82 kΩ C36 n.m

R44 n.m.

5 6 R50 2.2 MΩ OPTO U5 6 PSENSE 5 SWDET 4 1 2 VCC GND 3 VSENSE

TEA1703

U2-2 1 R26 10 kΩ C19 RT2 220 kΩ R24 39 kΩ C16 330 nF R25 10 nF 39 kΩ C21 2.2 µF R4 47 kΩ C18 470 nF C17 330 nF C20 2.2 µF C15 220 pF CY1 1.5 nF U2A-1 LTV-817B 4 3 4 3 U2A-1 LTV-817B BC2 S6H/JK U4 AS431 use BCD TL431 D52 BAS21 2 C27 470 µF 25 V C28 470 µF 25 V R34 1 kΩ R35 n.m.

R39 n.m.

C34 C35 n.m.

100 nF R36 n.m.

R55 C53 220 nF 330 kΩ C29 470 µF 25 V CHOKE CM L3 VOUT R38 11 kΩ (1 %) R37 75 kΩ (1 %) R56 1.5 MΩ test point Q7 2N7002

aaa-002128

GND

Figure 25. Schematic: TEA1755DB1100 demo board (configuration A)

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NXP Semiconductors

UM10514

GreenChip TEA1755DB1100 90 W power supply

Figure 26

shows the schematic for configuration B.

L CN1 L 1 F1 3.15 A 250 V P.E

G 2 LF1 0.5 mH N N 3 R1 3 MΩ R2 3 MΩ CX1 0.33 µF LF2 12.8 mH C1 0.47 µF BD1 GBU806 + L1 220 µH C1 0.47 µF 9 L2 250 µH 7 D1 MUR460 BC1 R5B 12 1 C3 100 µF TK12A50D D2 1N4148W R8 10 Ω Q1 C5 220 pF R6 8.2 MΩ R6B 8.2 MΩ R40 0 Ω C3A 10 nF R5 6.8 MΩ R5A 6.8 MΩ R41 0 Ω R11 15 kΩ C6 100 nF R10 0.1 Ω Q2 TK10A60D C8 3.3 nF 1N4007 1.5 A 1000 V R18 43 kΩ R19 43 kΩ 2 T1 450 µH 11 4 D30 BAS21 1 8 7, 8 9, 10 D3 C9 100 pF R16 36 kΩ C10 100 nF R16A 1.1 kΩ R15A n.m.

R15 0.1 Ω SRSENSE U3 1 GND 2 C30 1 µF 50 V VCC 3

TEA1792

4 5 6 SELREG n.c.

DRIVER Q4 PSMN013-100 R33 n.m.

C31 n.m.

R30 10 Ω R32 1 kΩ C27 470 µF 25 V C28 470 µF 25 V C29 470 µF 25 V CHOKE CM L3 VOUT 19.5 V 4.62A

test point GND R9 10 Ω R12 1 kΩ C22 220 pF R31 2.2 kΩ R17 1.2 kΩ C23 220 pF R14 10 Ω R7 C24 1 µF HV HVS PFCTIMER FBDRIVER PFCDRIVER PFCSENSE FBSENSE VOSENSE U1 16 15 14 13 12 11 10 9 107 kΩ (1 %) C4 4.7 nF

Figure 26. Schematic: TEA1755DB1100 demo board (configuration B)

R22 10 kΩ C13 47 µF 35 V R21 0 Ω D5 BAS21 R23A 220 kΩ D23A C36 n.m

R44 n.m.

5 6 BAS21 R23 82 kΩ C14 1 µF 50 V

TEA1755

R27 5.1 kΩ 1 2 3 4 7 8 5 6 VCC GND FBCTRL FBAUX LATCH PFCCOMP VINSENSE PFCAUX R3 62 kΩ R26 10 kΩ C19 RT2 220 kΩ R25 10 nF C18 39 kΩ 470 nF C17 C21 2.2 µF 330 nF C20 R4 47 kΩ 2.2 µF R24 39 kΩ C16 330 nF C15 220 pF 4 3 1 U2-2 U2-1 LTV-817B U4 AS431 use BCD TL431 2 R34 1 kΩ R35 n.m.

C34 C35 n.m.

100 nF R36 n.m.

R37 75 kΩ (1 %) R39 0 Ω R38 11 kΩ (1 %)

aaa-005768

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

7 Bill of Materials (BOM)

C14; C30 C15 C16; C17 C18 C19 C20; C21 C22; C23 C24 C27; C28; C29 C35 C36 C50 C51

Table 23. TEA1755DB1100 demo board BOM Reference Description and values

BC1 BC2 BD1 cable C1 C2 C3 C3A C4 C5 C6 C8 C9 C10; C34 C13 bead; core; RH 4 × 6 × 2, R5B (King Core)/XP; for D1 bead; core; RH 3.5 × 4.2 × 1.3; S6H/JK; for CY1 bridge diode; Flat/Mini; 8 A; 600 V cable; 16AWG/1571; 2.5 × 5.5 × 12 (kk, fk); L = 1200 mm -

Part number/ package

N4/AMAX N6/AMAX GBU806 capacitor; film; axial lead; 0.47 μF; 450 V; P = 10 mm capacitor; film; axial lead; 0.47 μF; 450 V; P = 10 mm capacitor; electric; radial lead; 100 μF; 400 V; 105 °C; 16 × 30 mm capacitor; ceramic, disc, D = 11.5; 10000 pF; 1 KV capacitor; MLCC; 4700 pF; 50 V; X7R capacitor; MLCC; 220 pF; 630 V; NPO capacitor; MLCC; 0.1 μF; 50 V; X7R SMD 0603 capacitor; MLCC; 3300 pF; 630 V; X7R SMD 1206 capacitor; MLCC; 100 pF; 630 V; NPO capacitor; MLCC; 0.1 μF; 50 V; X7R SMD 1206 SMD 0603 capacitor; electric; radial lead; 5 × 11 mm; 47 μF; 35 V; 105 °C capacitor; MLCC; 1 μF; 50 V; Y5V capacitor; MLCC; 220 pF; 50 V; X7R capacitor; MLCC; 0.33 μF; 16 V; X7R capacitor; MLCC; 0.47 μF; 16 V; X7R SMD 0805 SMD 0603 SMD 0603 SMD 0603 capacitor; MLCC; 0.01 μF; 50 V; X7R capacitor; MLCC; 2.2 μF; 10 V; X7R capacitor; MLCC; 220 pF; 50 V; X7R capacitor; MLCC; 1 μF; 50 V; X7R capacitor; electric; radial lead; 10 × 12.5 mm; 470 μF; 25 V; 105 °C MFTD/HJC MFTD/HJC KMG/NCCC Z5U SMD 0603 SMD 1206 SMD 0603 SMD 0603 SMD 0603 SMD 0805 capacitor; not mounted capacitor; not mounted capacitor; MLCC; 1 nF; 50 V; X7R capacitor; MLCC; 2.2 μF; 10 V; X7R SMD 0805 SMD 0805 SMD 0603 SMD 0805 UM10514

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Manufacturer

Lite-On ZLH Rubycon KZH/NCC

Board version

A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A A © NXP B.V. 2017. All rights reserved.

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply Reference Description and values

C52 C53 CX1 CY1 D1 D2; D4 D3 D5; D23A capacitor; MLCC; 100 pF; 50 V; NPO capacitor; MLCC; 0.22 μF; 10 V; X7R capacitor; X2 cap; axial lead; 0.33 μF; 275 V capacitor; ceramic; D = 8.5; Y1 cap; 1500 pF; 400 V diode; ultra fast; axial lead; DO-201AD; 4 A; 600 V diode; switching; SMD; 0.15 A; 75 V diode; general purpose; SMB; 1.5 A; 1000 V diode; ultra fast; SMD; 0.2 A; 250 V -

Part number/ package

SMD 0603 SMD 0603 MKP/R46 MUR460 1N4148W; SOD-123 S2M BAS21; SOD-123 D30 D50 diode; ultra fast; SMD; 0.2 A; 250 V diode; ultra fast; SMD; 0.2 A; 250 V BAS21; SOD-123 BAS21; SOD-123 D52 diode; ultra fast; SMD; 0.2 A; 250 V BAS21; SOD-123 F1 heat sink for Q1, Q2, BD1 Heat sink for Q4 Inlet J1; J2 J3; J4 J5 J7 LF1 LF2 L1 L2 L3 fuse; axial lead; time-lag; T 3.15 A; 250 V I-Shape; 109 × 25 mm; t = 3 mm; Cu tinned; WD I-Shape; 90 × 25 mm; t = 3 mm; Cu tinned; WD Inlet; S3P jumper wire; D = 0.6 taping jumper wire; D = 0.6 × 27.5 mm with PVC jumper wire; D = 0.6 × 20 mm with PVC jumper wire; D = 0.6 × 12.5 mm with PVC LT-5 TU-333-BZ-315-P3D LF-TR120-001R inductor; choke; T12*6*4C A10/R10K; 10T; minimum 380 μH inductor; line choke; T16*12*8C A10/ R10K; 56 Ts; minimum 7 mH inductor; choke; T50-52/KST50-52; 80 Ts; 211 μH inductor; PFC choke; RM-10; 40:2; 250 μH inductor; choke; T10 x 6 x 5C A10/ R10K; 8 Ts; minimum 140 μH TF-TR160-002R LI-TR050-214R SP08Z187; TF RM100-213R TF-TR100-202R

Manufacturer

KEMET CD/TDK Vishay Diodes Lite-On NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors Littelfuse TECX BELTA BELTA BELTA SENDPOWER; BELTA BELTA

Board version

A A A and B A and B A and B A and B A and B A and B A and B A A A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B UM10514

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply Reference Description and values

R11 R12; R32 R16 R16A R17 R18; R19 R21 R22; R26 R23 R23A R24; R25 R27 R31 L4 Nut For Q1, Q2, Q4 PCB Q1 Q2 Q4 Q7 Q8 Q9 R1; R2 R3 R4 R5; R5A R6; R6B R7 R8; R9; R13; R14; R30 R10; R15 inductor; choke; 10 mH; 0.5 W nut; HEX/GW; M3; NI Shouh Pin; LF single side; CEM-1; 2-OZ; 125.5 × 59 × 1.6 mm transistor; n-channel MOSFET; 0.45 Ω; 500 V; 12 A; 15p-typ transistor; n-channel MOSFET; 0.58 Ω; 600 V; 10 A; 15p-typ transistor; n-channel MOSFET; 13.9 Ω; 100 V; 67 A; 220p-typ transistor; n-channel MOSFET; 60 V; 18 A transistor; n-channel MOSFET; 600 V; 0.023 A transistor; n-channel MOSFET; 600 V; 0.023 A resistor; thin film chip; 3 MΩ; 1 % resistor; thin film chip; 62 kΩ; 1 % resistor; thin film chip; 47 kΩ; 5 % resistor; thin film chip; 6.8 MΩ; 1 % resistor; thin film chip; 8.2 MΩ; 1 % resistor; thin film chip; 107 kΩ; 1 % resistor; thin film chip; 10 Ω; 5 % resistor; axial lead; MOF; 0.1 Ω; 1 W (S); 5 % resistor; thin film chip; 15 kΩ; 5 % resistor; thin film chip; 1 kΩ; 5 % resistor; thin film chip; 36 kΩ; 5 % resistor; thin film chip; 1.1 kΩ; 5 % resistor; thin film chip; 1.2 kΩ; 5 % resistor; thin film chip; 43 kΩ; 1 % resistor; thin film chip; 0 Ω; 5 % resistor; thin film chip; 10 kΩ; 5 % resistor; thin film chip; 82 kΩ; 1 % resistor; thin film chip; 220 kΩ; 1 % resistor; thin film chip; 39 kΩ; 5 % resistor; thin film chip; 5.1 kΩ; 5 % resistor; thin film chip; 2.2 kΩ; 5 % UM10514

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-

Part number/ package

ZAL-0410-101K APBADC052 TK12A50D; TO-220F TK10A60D; TO-220F PSMN013-100PS; TO-220F 2N7002; SOT-23 BSS127; SOT-23 BSS127; SOT-23 SMD 1206 SMD 1206 SMD 0603 SMD 1206 SMD 1206 SMD 0603 SMD 0805 SMD 0603 SMD 0805 SMD 0603 SMD 0603 SMD 0603 SMD 1206 SMD 0603 SMD 0603 SMD 0603 SMD 0603 SMD 0603 SMD 1206 SMD 0603 All information provided in this document is subject to legal disclaimers.

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Manufacturer

ZenithTek Toshiba Toshiba NXP Semiconductors NXP Semiconductors Infineon Infineon

Board version

A A and B A and B A and B A and B A and B A A A A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B A and B © NXP B.V. 2017. All rights reserved.

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply Reference Description and values

R35; R36 R37 R38 R39; R40; R41 R42 R43 R44; R46 R45 R50 R51 R52 R53 R54; R55 R56 R57 RJ1; RJ2; RJ3; RJ4; RJ5 RT2 resistor; not mounted resistor; thin film chip; 75 kΩ; 1 % resistor; thin film chip; 11 kΩ; 1 % resistor; thin film chip; 0 Ω; 5 % resistor; thin film chip; 110 kΩ; 5 % resistor; thin film chip; 160 kΩ; 5 % resistor; not mounted resistor; thin film chip; 430 kΩ; 5 % resistor; thin film chip; 2.2 MΩ; 5 % resistor; thin film chip; 20 kΩ; 1 % resistor; thin film chip; 100 kΩ; 1 % resistor; thin film chip; 4.7 MΩ; 1 % resistor; thin film chip; 360 kΩ; 1 % resistor; thin film chip; 1.5 MΩ; 5 % resistor; thin film chip; 3 kΩ; 5 % resistor; thin film chip; 0 Ω; 5 % screw for BD1, Q1, Q2, Q4 T1 resistor; NTC; axial lead; D = 5; 220 kΩ; 5 % screw; M3 × 8; flat head 5.0; NI Shouh pin transformer; PQ-3220; 450 μH Tube for LF2 heat shrink tube; 20 D × 20 mm -

Part number/ package

SMD 0603 SMD 0603 SMD 0603 SMD 0805 SMD 0603 SMD 0603 SMD 0805 SMD 0603 SMD 0603 SMD 0603 SMD 0603 SMD 0603 SMD 0603 SMD 0603 SMD 0603 SMD 0603 TTC05104 SP08Z142 TF PQ320-290R Tube for RT2 silicone tube; 1 D × 15 mm U1 GreenChip SMPS control IC U2 U2A U3 U4 U5 TEA1755T; SO-16 IC optocoupler; CTR = 130 % to 260 % LTV-817B IC optocoupler; CTR = 130 % to 260 % LTV-817B IC synchronous rectifier controller IC adjustable precision shunt regulator IC; SMPS standby control TEA1792TS; TSOP-6 AS431I – ANTR-GL; SOT-23 TEA1703TS; TSOP-6 -

Manufacturer

Thinking Electronic Industrial Co., LTD A and B A and B SENDPOWER BELTA Fujikura, Sumitomo/LC A(Kurabe)/LC NXP Semiconductors Lite-On Lite-On NXP Semiconductors BCD NXP Semiconductors A and B A and B A and B A and B A and B A A and B A and B A

Board version

A and B A and B B A A A A A A A A A A A and B UM10514

User manual COMPANY PUBLIC

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

8 Transformer specifications

8.1 Flyback transformer (T1)

8.1.1 Flyback transformer T1 specification

Table 24. Electrical characteristics Item Winding

Inductance Leakage Inductance DC Resistance High-voltage test P1-2 P1-2 P1-2 PRI to SEC PRI to CORE SEC to CORE

Specification

450 μH; ±5 %; 50 kHz; 1 V 6 μH maximum maximum 300 mΩ at 25 °C 3000 V; 3 s; 5 mA 1500 V; 3 s; 5 mA 600 V; 3 s; 5 mA UM10514

User manual COMPANY PUBLIC Table 25. Material specifications Item Description

Core Bobbin Tape Wire Cu foil FERRITE Mn-Zn PQ32/20 PQ32/20 12P PHENOLIC #1350F1 2UEW; 130 °C TIW TLW-B × 130 °C 0.025 mm thickness × 7 mm width Tube Varnish Tin PTFE (TFLON) BC-359 D9930C/SN100

Manufacturer

JFE CHANG CHUN 3M JUNG SHING DAHJIN EXCELLENCE GREAT HOLDING DOLPH DAI HYUI

• •

Manufacturers: Axis Power Electronics, Taiwan (http://www.axispower.com.tw) Shenzhen Belta Electronics Co., Ltd. (http://www.belta.cn)

Figure 27

shows the schematic for the flyback transformer. Figure 28 shows its dimensions. Figure 29

shows its winding structure and order.

2 4 1 5 6 0.5 Ø, 16 Ts 0.5 Ø, 16 Ts 0.25 Ø x 2, 7 Ts E1, E2, E3, E4 0.3 Ø x 4, 6 Ts 0.3 Ø x 4, 6 Ts 0.3 Ø 5 Ts 7 T.I.W

9 10 T.I.W

8 T.I.W

11 0.025 x 7 mm + 0.3 Ø

Figure 27. Flyback transformer schematic

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aaa-005948

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NXP Semiconductors

7 1 5.08 ± 0.5

34 max

UM10514 GreenChip TEA1755DB1100 90 W power supply

39 max 6 23 max 12 3.5 ref 6 0.8 ± 0.1

7 30.5 ± 0.5

12 7 7.62 ± 0.5

Dimensions in mm

Figure 28. Flyback transformer dimensions

tape 3L 1L 1L 1L 1L 1L 1L 1L 1L 1L 1L 1L

aaa-005950

Figure 29. Flyback transformer winding structure and order

P11-8 P8-10 P7-9 P6 P4-2 P6 P8-10 P5-6 P6 P1-4 P6 P7-9

aaa-005949

UM10514

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

N1 E1 N2 E2 N3 N4 E3 N5 E4 N6 N7 N8

8.1.2 Flyback transformer T1 winding specifications

Table 26. Winding specifications Winding order Pin number Wire type Start Finish Number of wires Number of turns

7 1 5 8 4 7 8 11 9 6 4 6 6 2 6 10 6 9 10 8 TIW 0.3 Ø Copper foil 0.025 T × 7 mm 2UEW 0.5 Ø Copper foil 0.025 T × 7 mm 2UEW 0.25 Ø TIW 0.3 Ø Copper foil 0.025 T × 7 mm 2UEW 0.5 Ø Copper foil 0.025 T × 7 mm TIW 0.3 Ø TIW 0.3 Ø TIW 0.3 Ø 2 2 1 2 1 2 2 1 6 6 5 7 6 1 16 1

Winding Mylar tape

6 1 16 1 1 1 1 1 1 1 1 1 1 1 1 1

8.2 PFC inductor (L2)

8.2.1 PFC inductor L2 Specification

Table 27. Electrical characteristics Item Winding

Inductance P9-7 DC Resistance P9-7 P12-1

Remarks

finished with wire 0.3 Ø finished with wire 0.3 Ø finished with wire 0.3 Ø finished with wire 0.3 Ø

Specification

250 μH; ±10 %; 50 kHz; 1 V maximum 170 mΩ at 25 °C maximum 55 mΩ at 25 °C UM10514

User manual COMPANY PUBLIC Table 28. Material specification Item Description

Core Bobbin Tape Wire FERRITE Mn-Zn PQ32/20 RM10 PHENOLIC #1350F1 2UEW; 130 °C Cu foil Tube Varnish 0.05 mm thickness × 14 mm width PTFE (TFLON) BC-359 All information provided in this document is subject to legal disclaimers.

Rev. 4 — 13 September 2017 Manufacturer

JFE CHANG CHUN 3M JUNG SHING DAHJIN SCHLENK GREAT HOLDING DOLPH © NXP B.V. 2017. All rights reserved.

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply Item

Tin

Description

D99300C/SN100

Manufacturer

DYFENCO

• • Manufacturers:

Axis Power Electronics, Taiwan (http://www.axispower.com.tw) Shenzhen Belta Electronics Co., Ltd. (http://www.belta.cn)

Figure 30 shows the schematic for the PFC inductor. Figure 31 shows its dimensions.

Figure 32

shows its winding structure and order.

9 12 0.1 Ø, x 30 40 Ts 0.23 Ø x 2 2 Ts 4 1 0.05 x 14 mm + 0.3 Ø

aaa-005951

Figure 30. PFC inductor schematic

30.0 MAX.

31.5 MAX.

3.6 ± 0.5

7 5 9 25.2 ± 0.5

21.6 ± 0.5

18.0 ± 0.5

12 21.0 MAX.

5 1 2 3 10 11 12 Dimensions in mm.

Figure 31. PFC inductor dimensions

12 1 0.6 ± 0.1

aaa-005952

UM10514

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

3L 1L P12-1 P9-7

aaa-005953

Figure 32. PFC inductor winding structure and order

8.2.2 PFC inductor L2 winding specifications

Table 29. Winding specifications Winding order Pin number Wire type Start Finish Number of wires

N1 N2 9 12 7 1 2UEW 0.1 Ø 2UEW 0.23 Ø 30 2

Number of turns Winding Mylar tape

40 2 1 3 -

Remarks

UM10514

User manual COMPANY PUBLIC

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

9 90 W TEA1755DB1100 demo board layout

The SMPS printed-circuit board is a single-sided board. The dimensions are 125 mm × 59 mm. The PCBs material is 1.6 mm FR2 with a single-sided 2 oz. copper (70 μm) layer. The Gerber file set for production of the PCB is available on the NXP website (www.nxp.com) or through the local NXP Semiconductors sales office.

Figure 33

shows the copper layout. Figure 34 the component placing of the demo board.

Figure 33. TEA1755DB1100 demo board copper layout bottom side (top view)

UM10514

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

a. Bottom side (top view) b. Top side (top view)

Figure 34. TEA1755DB1100 demo board component placing

UM10514

User manual COMPANY PUBLIC

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

10 Alternative circuit options

10.1 Changing the output voltage

By changing the following components, the output voltage can be changed (±30 %). For more information on this topic, see the TEA1755T/LT application note. Ensure that the auxiliary voltage remains within its operation limits (13.4 V to 38 V typical) and it is high enough to start up (22.3 V typical).

• • R37/R38

The resistor divider R37 and R38 determines the output voltage. The total value of the two resistors is a compromise between no-load standby power dissipation and V the resistor divider in no-load standby mode.

o accuracy. For configuration (A), there is no such compromise. The TEA1703 switches off Higher value (R37 + R38): Power no-load standby power dissipation plus more tolerance on V o Higher value (R37 + R38): Higher no-load standby power dissipation plus less tolerance on V o (4)

C27, C28, C29

The voltage rating of the electrolytic capacitor must be higher than the output voltage. For lower output currents, the capacity can be decreased.

10.2 TL431 selection

The selection of the TL431 is critical for the following performance parameters:

• • • •

Output voltage regulation No-load standby power consumption Stability of the control loop Start-up profile of the output voltage The minimum cathode current for regulation must be met under all conditions. When at full-load, the current through the TL431 becomes too low and results in a drop of the output voltage at full-load. This current can be increased by changing R35 = 5.6 kΩ or by changing the TL431 for a type that requires a lower minimum cathode current for regulation.

UM10514

User manual COMPANY PUBLIC 10.3 VOSENSE pin resistors values

The VOSENSE pin senses the PFC output voltage. The VOSENSE pin has an integrated protection circuit to detect an open and short-circuited pin. The VOSENSE pin can also sense if one of the resistors of the voltage divider is open.

Based on calculations, the value of R7 must be less than 104.4 kΩ to guarantee the correct working of these protections. Selecting a too large value for R7 can override PFC open-loop protection when the current path to the bulk electrolytic capacitor C3 is lost (fault condition).

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

For more information about this subject, see the application note of the TEA1755 (AN11142, Section 4.1.1).

UM10514

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

11 Abbreviations

Table 30. Abbreviations Acronym Description

CC Constant Current EMC ElectroMagnetic Compatibility FLR MOSFET NTC OCP OPP OTP OVP PCB PFC SCP SMPS SR Fast Latch Reset Metal-Oxide-Semiconductor Field-Effect Transistor Negative Temperature Coefficient (?) OverCurrent Protection OverPower Protection OverTemperature Protection OverVoltage Protection Printed-Circuit Board Power Factor Correction (?) Short Circuit Protection Switched Mode Power Supplies Synchronous Rectification

12 References

1 2 3 4

TEA1755T data sheet TEA1792TS data sheet TEA1703TS data sheet AN11142 application note

HV start-up DCM/QR flyback controller with integrated DCM/ QR PFC controller; 2013, NXP Semiconductors GreenChip synchronous rectifier controller; 2014, NXP Semiconductors GreenChip SMPS standby control IC; 2012, NXP Semiconductors GreenChip TEA1755 integrated PFC and flyback controller; 2016, NXP Semiconductors UM10514

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13 Legal information

13.1 Definitions Draft

— The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

13.2 Disclaimers Limited warranty and liability

— Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes

to the publication hereof.

— NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior

Suitability for use

— NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications

— Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Export control

— This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.

Evaluation products

— This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose.

Safety of high-voltage evaluation products

— The non-insulated high voltages that are present when operating this product, constitute a risk of electric shock, personal injury, death and/or ignition of fire. This product is intended for evaluation purposes only. It shall be operated in a designated test area by personnel that is qualified according to local requirements and labor laws to work with non-insulated mains voltages and high-voltage circuits. The product does not comply with IEC 60950 based national or regional safety standards. NXP Semiconductors does not accept any liability for damages incurred due to inappropriate use of this product or related to non-insulated high voltages. Any use of this product is at customer’s own risk and liability. The customer shall fully indemnify and hold harmless NXP Semiconductors from any liability, damages and claims resulting from the use of the product.

Translations

— A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

13.3 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

GreenChip

— is a trademark of NXP B.V.

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NXP Semiconductors UM10514 GreenChip TEA1755DB1100 90 W power supply

Contents

5

5.1

5.1.1

5.2

5.3

6

7

8

8.1

8.1.1

8.1.2

4.2

4.3

4.4

4.5

4.6

4.7

4.8

4.9

1

1.1

2

3

4

4.1

4.1.1

4.1.2

4.9.1

4.9.2

4.9.3

4.9.4

4.9.5

4.9.6

4.9.7

4.10

4.10.1

4.10.2

4.10.3

4.10.4

4.10.5

4.10.6

4.11

4.12

8.2

8.2.1

8.2.2

9

10

10.1

10.2

10.3

11

Introduction ......................................................... 3

Features .............................................................4

Configuration .......................................................5

Power supply specifications ..............................6

Performance data ................................................8

Test setup ..........................................................8

Test equipment ..................................................8

Test conditions .................................................. 8 Efficiency ............................................................8

PFC on/off level .................................................9

No-load power consumption ............................10

Minimum output current for normal operation ...10

Power factor and THD .....................................10

High/low line output power compensation ....... 11

VCC voltage .................................................... 12 Timing and protection ......................................12

Switch-on delay and output rise time ...............12

Brownout and brownout recovery ....................14

Output short circuit protection ..........................15

OverCurrent Protection (OCP) .........................17

OverVoltage Protection (OVP) .........................18

OverTemperature Protection (OTP) .................20

Fast Latch Reset (FLR) ...................................21

Output regulation ............................................. 22 Load regulation ................................................22

Line regulation ................................................. 23

Output voltage regulation in standby mode ......24

No-load output ripple in burst mode ................ 25 Burst mode repetition rate ............................... 25

Hold-up time .................................................... 26

Dynamic loading .............................................. 27

Output ripple and noise ................................... 29

ElectroMagnetic Compatibility (EMC) ............. 31

Conduction emission ....................................... 31 Conditions ........................................................31

Immunity against lighting surges ..................... 34 Mains harmonic reduction ............................... 34

Schematic TEA1755DB1100 demo board ........35

Bill of Materials (BOM) ..................................... 37

Transformer specifications .............................. 41

Flyback transformer (T1) ................................. 41 Flyback transformer T1 specification ............... 41

Flyback transformer T1 winding specifications ................................................... 43 PFC inductor (L2) ............................................ 43 PFC inductor L2 Specification ......................... 43

PFC inductor L2 winding specifications ........... 45

90 W TEA1755DB1100 demo board layout ......46

Alternative circuit options ................................48

Changing the output voltage ............................48

TL431 selection ............................................... 48 VOSENSE pin resistors values ....................... 48

Abbreviations .................................................... 50 12

13

References .........................................................50

Legal information ..............................................51

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'.

© NXP B.V. 2017.

All rights reserved.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]

Date of release: 13 September 2017 Document identifier: UM10514

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