NXP TEF810X Fully-Integrated 77 GHz Radar Transceiver Data Sheet

NXP TEF810X Fully-Integrated 77 GHz Radar Transceiver Data Sheet

TEF810X

76 GHz to 81 GHz car RADAR transceiver

Rev. 1.0 — 10 May 2019 Product short data sheet COMPANY PUBLIC

The TEF810X Car RADAR transceiver is a single-chip automotive FMCW RADAR transceiver for short-, medium- and long-range RADAR applications, covering the full car RADAR frequency band from 76 GHz to 81 GHz.

The packaged IC offers a low-cost fully integrated solution for all critical mm-wave functions, in combination with ADCs at each receiver path. The mm-wave front end part consists of a waveform generator offering flexible chirp control, three transmit chains featuring binary phase control and output level stabilization, and four receive chains with high input compression and low noise figure.

Each receive chain contains high-pass filters for suppression of strong low frequency signals, as well as low-pass filter functionality for suppression of signals in the ADC aliasing band. Each receive chain includes a 12-bit SAR ADC sampling at an effective rate of 40 MS/s (M samples per second). The ADC is followed by a programmable decimation filter with decimation factors of 1, 2, 4, 8 and 16.

The digitized signals from the four receiver chains are serialized. There are two digital output variants available:

• •

TEF8101 output is through four high-speed LVDS data lines, plus a bit and frame clock signals for data synchronization TEF8102 includes a CSI-2-DPHY interface with four data lanes and a clock lane The chip uses a full-duplex SPI interface with 40 Mbps maximal transfer rate for bi directional exchange of control and monitoring data between the RADAR IC and a host microcontroller.

The TEF810X contains a functional safety monitoring circuit, keeping track of key operational parameters such as chip temperature, status of RF connections to the PCB board, locking status of the PLLs during a frequency chirp, etc. The monitoring circuitry transfers some of the monitoring functions normally performed by the microcontroller into the TEF810X, creating a virtual

layered functional safety

concept, with the TEF810X functional monitoring circuitry as the inner layer.

The RADAR transceiver is packaged in a 7.5 mm x 7.5 mm eWLB package. The package has a 15 x 15 sized Ball Grid Array (BGA) with 0.5 mm pitch for easy interfacing to a wide range of antenna board technologies.

NXP Semiconductors

TEF810X 76 GHz to 81 GHz car RADAR transceiver

2 Features and benefits

• • • • • • • • • • • • • • • • •

Single-chip fully integrated automotive FMCW RADAR transceiver with digital output Developed in accordance to ISO26262 SEoOC methodology. Supporting ASIL-B applications Car RADAR frequency band from 76 GHz to 81 GHz, addressing short-, medium- and long-range RADAR applications for the global automotive market The mm-wave front end part consists of a waveform generator offering flexible chirp control with a chirp bandwidth up to 2 GHz, three transmit chains featuring binary phase control and output level stabilization, and four receive chains with high input compression point and low noise figure The timing engine supports different MIMO RADAR operation modes by simple programming of digital registers controlling timing parameters and front end configuration on a chirp-to-chirp basis The phase of the TX signals can be controlled on a chirp-to-chirp basis by the timing engine, or by digital I/O signals directly connected to the binary phase shifters of different TX sections Each receive chain contains programmable high-pass filters for suppression of strong low frequency signals, as well as low-pass filter functionality for suppression of signals in the ADC aliasing band.

Each receive chain includes a 12-bit SAR ADC sampling at an effective rate of 40 MS/ s. The ADC is followed by a programmable decimation filter with decimation factors of 1, 2, 4, 8 and 16 TEF8101: data output on four high-speed LVDS lines, in two modes: raw ADC serial data streaming, or packetized format with added CRC information TEF8102: four data lanes and a clock lane. Lane speed configurable from 120 Mbps to 480 Mbps, as a function of the decimation factor The chip uses a full-duplex SPI interface with 40 Mbps maximal transfer rate for bi directional exchange of control and monitoring data between the RADAR IC and a host microcontroller The TEF810X contains a functional safety monitoring circuit, keeping track of key operational parameters such as chip temperature, status of RF connections to the PCB board, locking status of the PLLs during a frequency chirp, etc.

The functional monitoring circuitry transfers some of the monitoring functions normally performed by the microcontroller into the TEF810X, creating a virtual “layered functional safety” concept, with the TEF810X functional monitoring circuitry as the inner layer Total average power dissipation at typical conditions under 1.2 W (2TX at 50 % duty cycle) and peak dissipation under 2.5 W Operating junction temperature from -40 o C up to 135 o C Closed-loop, linear frequency chirp generator with < 0.2 % typical chirp nonlinearity Three chirp modes with Low Phase Noise: MRR SRR USR

Chirp BW (MHz/µs)

0.5

1.0

2.0

Slope (MHz/µs)

15 30 60

Phase noise (dBc/Hz @ 1 MHz)

< -90 (typical, in 76 GHz to 77 GHz band) < -88 (typical, in 76 GHz to 81 GHz band) < -86 (typical, in 77 GHz to 81 GHz band) TEF810X

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TEF810X 76 GHz to 81 GHz car RADAR transceiver • • • • • • • • • • •

2 GHz chirp deviation for high-resolution distance detection in USR mode. Higher phase noise level allowed (-86 dBc/Hz @ 1 MHz), with respect to nominal 1 GHz deviation mode Excellent phase stability for high angular resolution Transmit power of typical 12 dBm at antenna reference plane Typical receiver noise figure less than 12 dB at antenna reference plane Operation from a 40 MHz crystal oscillator Provides the 40 MHz clock signal to a microcontroller Power consumption < 50 mW in standby mode. In this condition the crystal oscillator is operative as well as the master 3.3 V LDOs GPIO 3.3 V digital interface signals for compatibility with a wide range of MCUs The core circuitry operates on 1.8 V and 1.1 V supply voltages. To simplify the application and decrease overall system BOM, the TEF810X offers two LDO circuits to generate the 1.8 V and 1.1 V operational voltages from a typical 2.3 V to 3.3 V supply available on the customer PCB. The internal band gap and voltage comparators drive external transistors, to decrease on-chip power dissipation and overall chip-area The RADAR transceiver is packaged in a 7.5 mm x 7.5 mm eWLB package. The package has a 15 x 15 sized Ball Grid Array (BGA) with 0.5 mm pitch. Package  Rth Junction -footprint ~18 K/W ESD immunity at 2000 V Human Body Model (HBM), 300 V Charged Device Model (CDM), 750 V CDM for corner balls

3 Applications

• • • • • • Front-side of car

Autonomous Emergency Braking (AEB) Adaptive Cruise Control (ACC) Narrow path assist Lateral collision avoidance Side pre-crash Traffic jam assist

• • • • • Rear-Side of car:

Lane Change Assist (LCA) Blind Spot Detection (BSD) Rear Cross Traffic Alert (RCTA) Rear pre-crash Parking Assist (PA)

4 Ordering information

Table 1. Ordering information Type number Package

TEF8101

Name Description

WFBGA155 plastic very-very-thin profile fine-pitch ball grid array package; 155 balls TEF8102

Version

SOT1456-1 TEF810X

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5 TEF810X block diagram

TEF810X 76 GHz to 81 GHz car RADAR transceiver Figure 1.  Block diagram of TEF810X car RADAR transceiver

TEF810X

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TEF810X 76 GHz to 81 GHz car RADAR transceiver

6 Limiting values

Table 2. Limiting values

In accordance with limiting maximum rating system (IEC 60134).

Supplies Conditions

3.3 V supply voltage 1.8 V supply voltage 1.1 V supply voltage

ESD

V ESD Human body model

[1]

Charge device model (CDM)

[2]

corner pins all other pins [1] [2] Class 2 according to AEC-Q100-002 Rev – E.

Class C3 according to AEC-Q100-011 Rev – C.

7 Characteristics

7.1 Global characteristics

Table 3. Global characteristics Description

Operational frequency range Operational junction temperature Power dissipation

Condition

Strongly dependent on use-case. Stated value for 2 TX at 50 % duty cycle.

Min

-0.5

-0.5

-0.5

2000 750 300

Min

76 - 40

7.2 Supply specifications

Table 4. Supply specifications Description

1.1 V supply voltage range 1.1 V supply voltage range 1.8 V supply voltage range 1.8 V supply voltage range 3.3 V supply voltage

Condition

±5 % tolerance, spec compliance and reliability limits -5 % / +10 % tolerance, spec compliance limits ±5 % tolerance, spec compliance and reliability limits -5 % / +10 % tolerance, spec compliance limits ±10 % tolerance

Min

1.045

1.045

1.71

1.71

2.97

Typ

1.13

1.13

1.85

1.85

3.3

-

Typ

1.2

Max

3.96

2.16

1.54

Max

1.155

1.21

1.89

1.98

3.63

Max

81 135

Unit

V V V V V V V V V

Unit

V V

Unit

GHz °C W TEF810X

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TEF810X 76 GHz to 81 GHz car RADAR transceiver

7.3 TX Characteristics

Table 5. TX characteristics Description

Output power (76 GHz to 78 GHz) Output power (78 GHz to 81 GHz)

Condition

7.4 RX Characteristics

Table 6. RX characteristics Description

RX NF (76 GHz to 77 GHz) RX NF (77 GHz to 81 GHz) ADC resolution ADC clock

Condition

7.5 Chirp generator characteristics

Table 7. Chip generator characteristics Description Condition

Chirp bandwidth 76 GHz to 81 GHz band Phase noise 0.5 GHz chirp (mode 1) 76 GHz to 77 GHz band Phase noise 1 GHz chirp (mode 2) Phase noise 2 GHz chirp (mode 3) 76 GHz to 81 GHz band 77 GHz to 81 GHz band -

Min

-

Min Min

0

Typ

12 11 -

Max Typ

12 13 12 40 -

Max Unit

dBm dBm

Unit

dB dB bit MHz

Typ Max

2000 -90 -88 -86

Unit

MHz dBc/Hz @1 MHz dBc/Hz @1 MHz dBc/Hz @1 MHz TEF810X

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TEF810X 76 GHz to 81 GHz car RADAR transceiver

8 Application information

Figure 2 shows the overall configuration of a RADAR sensor based on a single TEF810X

device. The main functional blocks are the TEF810X, an MCU, a power supply network and a CAN, FlexRay or Ethernet interface.

The interface from the TEF810X to the MCU consists purely of digital signals, with the digitized and serialized received signals being transferred by LVDS or CSI-2 lines (RADAR data line), in combination with general-purpose I/O (GPIO) lines operating at nominal logical levels of 3.3 V, for timing signaling, SPI programming, and functional monitoring interface.

Figure 2. TEF810X in a RADAR sensor with a companion MCU

9 Package information

9.1 General

The TEF810X is packaged on a 7.5 mm x 7.5 mm eWLB package, with a pinning pitch of 500 µm.

TEF810X

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TEF810X 76 GHz to 81 GHz car RADAR transceiver Figure 3. TEF810X package dimensions

TEF810X

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TEF810X 76 GHz to 81 GHz car RADAR transceiver

10 Revision history

Table 8. Revision history Document ID Release date Data sheet status

TEF810X v.1.0 20190510 Product short data sheet -

Change notice

-

Supersedes

TEF810X

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TEF810X 76 GHz to 81 GHz car RADAR transceiver

11 Legal information

11.1 Data sheet status

Document status

[1][2]

Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet

Product status

Development Qualification Production

[3]

Definition

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

[1] [2] [3] Please consult the most recently issued document before initiating or completing a design.

The term 'short data sheet' is explained in section "Definitions".

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions

Draft

— The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet

— A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification

Product data sheet.

— The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the

11.3 Disclaimers

Limited warranty and liability

— Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes

— NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use

— NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications

— Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Limiting values

— Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale

— NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

TEF810X

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No offer to sell or license

— Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control

— This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.

TEF810X 76 GHz to 81 GHz car RADAR transceiver Translations

— A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

11.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

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TEF810X 76 GHz to 81 GHz car RADAR transceiver

Tables

Tab. 1.

Tab. 2.

Tab. 3.

Tab. 4.

Ordering information ..........................................3

Limiting values .................................................. 5 Global characteristics ........................................5

Supply specifications .........................................5

Figures

Fig. 1.

Block diagram of TEF810X car RADAR transceiver .........................................................4

Tab. 5.

Tab. 6.

Tab. 7.

Tab. 8.

TX characteristics ..............................................6

RX characteristics ............................................. 6 Chip generator characteristics ...........................6

Revision history .................................................9

Fig. 2.

Fig. 3.

TEF810X in a RADAR sensor with a companion MCU ............................................... 7

TEF810X package dimensions ......................... 8

TEF810X

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Contents

1

2

3 4

5

6 7

7.1

7.2

7.3

7.4

7.5

8 9

9.1

9.2

10

11

General description ............................................ 1

Features and benefits .........................................2

Applications .........................................................3

Ordering information .......................................... 3

TEF810X block diagram ..................................... 4

Limiting values ....................................................5

Characteristics .................................................... 5

Global characteristics ........................................ 5 Supply specifications ......................................... 5

TX Characteristics ............................................. 6 RX Characteristics .............................................6

Chirp generator characteristics ..........................6

Application information ......................................7

Package information ...........................................7

General .............................................................. 7

Package Dimensions .........................................8

Revision history .................................................. 9

Legal information ..............................................10

TEF810X 76 GHz to 81 GHz car RADAR transceiver

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'.

© NXP B.V. 2019.

All rights reserved.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]

Date of release: 10 May 2019 Document identifier: TEF810X

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