NXP MMG3002NT1 40-3600 MHz, 20 dB, 21 dBm InGaP HBT GPA Data Sheet

NXP MMG3002NT1 40-3600 MHz, 20 dB, 21 dBm InGaP HBT GPA Data Sheet
Freescale Semiconductor
Technical Data
NOT RECOMMENDED FOR NEW DESIGN
Heterojunction Bipolar Transistor
Technology (InGaP HBT)
MMG3002NT1
Broadband High Linearity Amplifier
The MMG3002NT1 is a general purpose amplifier that is internally input
and output matched. It is designed for a broad range of Class A, small-signal, high linearity, general purpose applications. It is suitable for
applications with frequencies from 40 to 3600 MHz such as cellular, PCS,
BWA, WLL, PHS, CATV, VHF, UHF, UMTS and general small--signal RF.
40--3600 MHz, 20 dB
21 dBm
InGaP HBT GPA
Features
 Frequency: 40--3600 MHz
 P1dB: 21 dBm @ 900 MHz
 Small--Signal Gain: 20 dB @ 900 MHz
 Third Order Output Intercept Point: 37.5 dBm @ 900 MHz
 Single Voltage Supply
 Internally Matched to 50 Ohms
 Cost--effective SOT--89 Surface Mount Plastic Package
 In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7--inch Reel.
SOT--89
Table 1. Typical Performance (1)
Table 2. Maximum Ratings
Rating
Characteristic
Symbol
900
MHz
2140
MHz
3500
MHz
Unit
Small--Signal Gain
(S21)
Gp
20
18
14.5
dB
Input Return Loss
(S11)
IRL
--16
--26
--16
dB
Output Return Loss
(S22)
ORL
--12
--8
--11
dB
Power Output @
1dB Compression
P1dB
21
21
18.5
dBm
Third Order Output
Intercept Point
OIP3
37.5
36
32
dBm
Symbol
Value
Unit
Supply Voltage
VCC
7
V
Supply Current
ICC
400
mA
RF Input Power
Pin
12
dBm
Storage Temperature Range
Tstg
--65 to +150
C
Junction Temperature
TJ
175
C
1. VCC = 5.2 Vdc, TA = 25C, 50 ohm system.
Table 3. Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Case
Case Temperature 118C, 5.2 Vdc, 110 mA, no RF applied
Symbol
Value (2)
Unit
RJC
46.5
C/W
NOT RECOMMENDED FOR NEW DESIGN
Document Number: MMG3002NT1
Rev. 12, 9/2014
2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
 Freescale Semiconductor, Inc., 2004--2008, 2012, 2014. All rights reserved.
RF Device Data
Freescale Semiconductor, Inc.
MMG3002NT1
1
Characteristic
NOT RECOMMENDED FOR NEW DESIGN
Symbol
Min
Typ
Max
Unit
Small--Signal Gain (S21)
Gp
19.3
20
—
dB
Input Return Loss (S11)
IRL
—
--16
—
dB
Output Return Loss (S22)
ORL
—
--12
—
dB
Power Output @ 1dB Compression
P1dB
—
21
—
dBm
Third Order Output Intercept Point
OIP3
—
37.5
—
dBm
Noise Figure
NF
—
4.2
—
dB
Supply Current
ICC
95
110
125
mA
Supply Voltage
VCC
—
5.2
—
V
Table 5. Functional Pin Description
2
Pin
Number
Pin Function
1
RFin
2
Ground
3
RFout/DC Supply
1
2
3
Figure 1. Functional Diagram
Table 6. ESD Protection Characteristics
Test Conditions/Test Methodology
Class
Human Body Model (per JESD 22--A114)
1B
Machine Model (per EIA/JESD 22--A115)
A
Charge Device Model (per JESD 22--C101)
IV
Table 7. Moisture Sensitivity Level
Test Methodology
Per JESD 22--A113, IPC/JEDEC J--STD--020
Rating
Package Peak Temperature
Unit
1
260
C
NOT RECOMMENDED FOR NEW DESIGN
Table 4. Electrical Characteristics (VCC = 5.2 Vdc, 900 MHz, TA = 25C, 50 ohm system, in Freescale Application Circuit)
MMG3002NT1
2
RF Device Data
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS
0
S22
--10
25C
S11, S22 (dB)
20
--40C
15
S11
--30
VCC = 5.2 Vdc
VCC = 5.2 Vdc
1
0
2
3
--40
0
4
1
2
4
3
f, FREQUENCY (GHz)
f, FREQUENCY (GHz)
Figure 2. Small--Signal Gain (S21) versus
Frequency
Figure 3. Input/Output Return Loss versus
Frequency
23
P1dB, 1 dB COMPRESSION POINT (dBm)
24
900 MHz
19
2140 MHz
17
15
2600 MHz
3500 MHz, C5 = 0.1 pF
13
11
VCC = 5.2 Vdc
9
10
12
14
16
20
18
22
21
20
19
18
VCC = 5.2 Vdc
0.5
22
1
1.5
2
2.5
3
Pout, OUTPUT POWER (dBm)
f, FREQUENCY (GHz)
Figure 4. Small--Signal Gain versus Output
Power
Figure 5. P1dB versus Frequency
160
140
120
100
80
60
40
20
0
4.6
23
17
4.7
4.8
4.9
5
5.1
5.2
5.3
VCC, COLLECTOR VOLTAGE (V)
Figure 6. Collector Current versus Collector
Voltage
5.4
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
21
ICC, COLLECTOR CURRENT (mA)
--20
3.5
42
39
36
33
30
VCC = 5.2 Vdc
100 kHz Tone Spacing
27
0
1
2
3
NOT RECOMMENDED FOR NEW DESIGN
TC = 85C
10
Gp, SMALL--SIGNAL GAIN (dB)
NOT RECOMMENDED FOR NEW DESIGN
Gp, SMALL--SIGNAL GAIN (dB)
25
4
f, FREQUENCY (GHz)
Figure 7. Third Order Output Intercept Point
versus Frequency
MMG3002NT1
RF Device Data
Freescale Semiconductor, Inc.
3
39
36
33
30
f = 900 MHz
100 kHz Tone Spacing
27
5
5.1
5.2
5.3
5.4
VCC, COLLECTOR VOLTAGE (V)
41
40
39
38
37
VCC = 5.2 Vdc,
f = 900 MHz
100 kHz Tone Spacing
8 Vdc Supply with 25 Ω Dropping Resistor
36
35
--40
--20
0
40
60
80
100
Figure 9. Third Order Output Intercept Point
versus Case Temperature
Figure 8. Third Order Output Intercept Point
versus Collector Voltage
105
--30
MTTF (YEARS)
--40
--50
--60
104
103
VCC = 5.2 Vdc
f = 900 MHz
100 kHz Tone Spacing
--70
102
--80
5
7
9
11
15
13
17
19
120
21
125
Pout, OUTPUT POWER (dBm)
4
2
VCC = 5.2 Vdc
0
1
1.5
2
2.5
3
140
145
150
3.5
Figure 11. MTTF versus Junction Temperature
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
6
0.5
135
TJ, JUNCTION TEMPERATURE (C)
8
0
130
NOTE: The MTTF is calculated with VCC = 5.2 Vdc, ICC = 110 mA
Figure 10. Third Order Intermodulation Distortion
versus Output Power
NF, NOISE FIGURE (dB)
20
T, TEMPERATURE (_C)
4
--20
--30
--40
--50
VCC = 5.2 Vdc, f = 2140 MHz
Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth
Input Signal PAR = 8.5 dB @ 0.01% Probability (CCDF)
--60
--70
9
11
13
15
17
f, FREQUENCY (GHz)
Pout, OUTPUT POWER (dBm)
Figure 12. Noise Figure versus Frequency
Figure 13. Single--Carrier W--CDMA Adjacent
Channel Power Ratio versus Output Power
NOT RECOMMENDED FOR NEW DESIGN
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
42
IMD, THIRD ORDER
INTERMODULATION DISTORTION (dBc)
NOT RECOMMENDED FOR NEW DESIGN
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
50 OHM TYPICAL CHARACTERISTICS
19
MMG3002NT1
4
RF Device Data
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 40--800 MHz
VSUPPLY
C4
L1
RF
INPUT
Z1
DUT
Z2
C1
Z1, Z5
Z2
Z3
Z3
Z4
RF
OUTPUT
Z5
C2
VCC
0.347 x 0.058 Microstrip
0.575 x 0.058 Microstrip
0.172 x 0.058 Microstrip
Z4
PCB
0.403 x 0.058 Microstrip
Getek Grade ML200C, 0.031, r = 4.1
Figure 14. 50 Ohm Test Circuit Schematic
30
S21
20
R1
10
0
L1
--10
C2
C1
S22
--20
C4
C3
S11
--30
MMG30XX
Rev 2
VCC = 5.2 Vdc
--40
0
200
400
600
800
f, FREQUENCY (MHz)
Figure 15. S21, S11 and S22 versus Frequency
Figure 16. 50 Ohm Test Circuit Component Layout
Table 8. 50 Ohm Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2
0.01 F Chip Capacitors
C0603C103J5RAC
Kemet
C3
0.1 F Chip Capacitor
C0603C104J5RAC
Kemet
C4
1 F Chip Capacitor
C0603C105J5RAC
Kemet
L1
470 nH Chip Inductor
BK2125HM471--T
Taiyo Yuden
R1
7.5 Ω Chip Resistor
RK73B2ATTE7R5J
KOA Speer
Table 9. Supply Voltage versus R1 Values
Supply Voltage
6
7
8
9
10
11
12
V
R1 Value
7.3
16
25
35
44
53
62

Note: To provide VCC = 5.2 Vdc and ICC = 110 mA at the device.
NOT RECOMMENDED FOR NEW DESIGN
C3
S21, S11, S22 (dB)
NOT RECOMMENDED FOR NEW DESIGN
R1
MMG3002NT1
RF Device Data
Freescale Semiconductor, Inc.
5
50 OHM APPLICATION CIRCUIT: 800--3400 MHz
VSUPPLY
C3
C4
L1
RF
INPUT
Z1
DUT
Z2
C1
Z1, Z5
Z2
Z3
Z3
Z4
Z5
C2
VCC
0.347 x 0.058 Microstrip
0.575 x 0.058 Microstrip
0.172 x 0.058 Microstrip
RF
OUTPUT
Z4
PCB
0.403 x 0.058 Microstrip
Getek Grade ML200C, 0.031, r = 4.1
Figure 17. 50 Ohm Test Circuit Schematic
30
S21
S21, S11, S22 (dB)
20
R1
10
L1
0
C4
C3
C2
C1
S22
--10
--20
S11
--30
800
MMG30XX
Rev 2
VCC = 5.2 Vdc
1200
1600
2000
2400
2800
3200
3600
f, FREQUENCY (MHz)
Figure 18. S21, S11 and S22 versus Frequency
Figure 19. 50 Ohm Test Circuit Component Layout
Table 10. 50 Ohm Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2
150 pF Chip Capacitors
C0603C151J5RAC
Kemet
C3
0.1 F Chip Capacitor
C0603C104J5RAC
Kemet
C4
1 F Chip Capacitor
C0603C105J5RAC
Kemet
L1
56 nH Chip Inductor
HK160856NJ--T
Taiyo Yuden
R1
7.5 Ω Chip Resistor
RK73B2ATTE7R5J
KOA Speer
NOT RECOMMENDED FOR NEW DESIGN
NOT RECOMMENDED FOR NEW DESIGN
R1
MMG3002NT1
6
RF Device Data
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 3400--3600 MHz
VSUPPLY
C4
L1
RF
INPUT
Z1
DUT
Z2
C1
Z1, Z6
Z2
Z3
Z3
Z4
Z5
Z6
C5
VCC
0.347 x 0.058 Microstrip
0.575 x 0.058 Microstrip
0.086 x 0.058 Microstrip
Z4
Z5
PCB
RF
OUTPUT
C2
0.085 x 0.058 Microstrip
0.404 x 0.058 Microstrip
Getek Grade ML200C, 0.031, r = 4.1
Figure 20. 50 Ohm Test Circuit Schematic
20
S21
10
R1
C4
C3
VCC = 5.2 Vdc
0
L1
S22
C1
--10
C2
C5
S11
--20
--30
3200
MMG30XX
Rev 2
3300
3400
3500
3600
3700
3800
f, FREQUENCY (MHz)
Figure 21. S21, S11 and S22 versus Frequency
Figure 22. 50 Ohm Test Circuit Component Layout
Table 11. 50 Ohm Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2
150 pF Chip Capacitors
C0603C151J5RAC
Kemet
C3
0.1 F Chip Capacitor
C0603C104J5RAC
Kemet
C4
1 F Chip Capacitor
C0603C105J5RAC
Kemet
C5 (1)
0.1 pF Chip Capacitor
06035J0R1BS
AVX
L1
39 nH Chip Inductor
HK160839NJ--T
Taiyo Yuden
R1
7.5 Ω Chip Resistor
RK73B2ATTE7R5J
KOA Speer
1. Tuning capacitor: Capacitor value and location on the transmission line are varied for different frequencies.
NOT RECOMMENDED FOR NEW DESIGN
C3
S21, S11, S22 (dB)
NOT RECOMMENDED FOR NEW DESIGN
R1
MMG3002NT1
RF Device Data
Freescale Semiconductor, Inc.
7
50 OHM TYPICAL CHARACTERISTICS
S11
S21
S12
S22
f
MHz
|S11|

|S21|

|S12|

|S22|

100
0.05966
176.181
10.25158
174.805
0.07235
--0.722
0.04946
--167.612
150
0.07228
--178.627
9.96687
171.111
0.07071
--1.821
0.0953
--129.396
200
0.09041
151.476
10.46556
167.719
0.07464
--3.053
0.05913
--124.668
250
0.0909
149.96
10.36837
164.949
0.07424
--3.553
0.08015
--125.378
300
0.08882
145.472
10.30366
162.017
0.07406
--4.277
0.09694
--122.814
350
0.08508
140.833
10.2505
158.995
0.07407
--4.934
0.11062
--121.876
400
0.08377
136.078
10.17971
156.158
0.07405
--5.7
0.12723
--122.007
450
0.08191
131.492
10.10383
153.293
0.07365
--6.307
0.14156
--122.555
500
0.07982
125.857
10.02536
150.437
0.07358
--7.037
0.15558
--123.436
550
0.07776
120.816
9.94165
147.642
0.07346
--7.676
0.1685
--124.8
600
0.0773
115.435
9.85596
144.898
0.07336
--8.2
0.18177
--126.796
650
0.07677
110.371
9.76098
142.109
0.07321
--8.911
0.19472
--128.506
700
0.07664
104.874
9.6623
139.374
0.07301
--9.464
0.20662
--130.47
750
0.07628
100.112
9.56168
136.692
0.0729
--10.069
0.21833
--132.663
800
0.07619
95.73
9.45426
134.024
0.07275
--10.618
0.22977
--134.835
850
0.07601
91.72
9.34921
131.391
0.07273
--11.184
0.24125
--137.084
900
0.07567
87.313
9.23967
128.792
0.07257
--11.821
0.25232
--139.685
950
0.07642
83.036
9.13144
126.149
0.07238
--12.312
0.26303
--142.257
1000
0.07619
80.021
9.01205
123.659
0.07228
--12.88
0.27394
--144.736
1050
0.07666
76.201
8.90327
121.137
0.07218
--13.474
0.28332
--147.346
1100
0.07678
73.008
8.78013
118.657
0.07202
--13.93
0.29417
--150.042
1150
0.07673
70.68
8.66342
116.191
0.0719
--14.519
0.30394
--152.767
1200
0.07674
68.773
8.53991
113.779
0.07178
--15.062
0.31393
--155.358
1250
0.07628
66.216
8.42251
111.392
0.07176
--15.551
0.32286
--157.992
1300
0.07618
64.635
8.30514
109.034
0.07164
--16.115
0.33259
--160.483
1350
0.07454
62.959
8.18109
106.673
0.07149
--16.539
0.34127
--162.981
1400
0.07373
60.65
8.06498
104.367
0.07152
--17.114
0.34972
--165.377
1450
0.0724
59.062
7.94403
102.073
0.07137
--17.565
0.35931
--167.823
1500
0.06466
48.656
7.85198
99.72
0.0715
--18.187
0.35762
--170.82
1550
0.0646
44.563
7.73641
97.503
0.07167
--18.755
0.36484
--172.845
1600
0.06495
39.856
7.63068
95.372
0.07161
--19.217
0.37158
--174.751
1650
0.0657
35.953
7.52257
93.247
0.07165
--19.614
0.37821
--176.697
1700
0.06599
31.949
7.43591
91.089
0.07171
--20.239
0.38558
--178.85
1750
0.0666
28.693
7.31976
88.981
0.07168
--20.731
0.39036
179.588
1800
0.06649
25.448
7.22121
86.872
0.07176
--21.241
0.39732
177.775
1850
0.06637
22.687
7.11782
84.83
0.07181
--21.685
0.40211
175.992
1900
0.06563
19.369
7.01794
82.771
0.07188
--22.233
0.40749
174.294
1950
0.06514
15.516
6.91688
80.824
0.07197
--22.678
0.41306
172.684
2000
0.0641
13.294
6.82126
78.739
0.07217
--23.218
0.41825
170.97
2050
0.06323
9.843
6.72865
76.797
0.07214
--23.632
0.42367
169.372
2100
0.06288
6.976
6.63794
74.849
0.07234
--24.15
0.42905
167.644
2150
0.06195
4.218
6.55483
72.888
0.07244
--24.689
0.43442
166.014
2200
0.06084
2.075
6.46275
70.939
0.07265
--25.273
0.43857
164.274
2250
0.05942
--0.3
6.37821
69.013
0.07275
--25.755
0.44419
162.598
NOT RECOMMENDED FOR NEW DESIGN
NOT RECOMMENDED FOR NEW DESIGN
Table 12. Common Emitter S--Parameters (VCC = 5.2 Vdc, TA = 25C, 50 Ohm System)
(continued)
MMG3002NT1
8
RF Device Data
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS
S11
S21
S12
S22
f
MHz
|S11|

|S21|

|S12|

|S22|

2300
0.05808
--2.187
6.29055
67.098
0.07295
--26.316
0.44756
160.879
2350
0.05526
--4.038
6.20851
65.179
0.07318
--26.813
0.45231
159.11
2400
0.05338
--6.096
6.12256
63.315
0.07337
--27.387
0.45571
157.425
2450
0.05054
--7.643
6.04461
61.45
0.07359
--27.903
0.46063
155.679
2500
0.04768
--10.036
5.96594
59.564
0.07386
--28.462
0.46419
153.884
2550
0.04494
--12.811
5.88833
57.733
0.07416
--29.19
0.4681
152.005
2600
0.04239
--14.731
5.81782
55.868
0.07435
--29.754
0.47249
150.142
2650
0.0393
--16.676
5.74121
53.98
0.07445
--30.312
0.47601
148.126
2700
0.03707
--20.889
5.66538
52.04
0.0748
--31.053
0.47991
146.214
2750
0.0346
--21.7
5.59155
50.247
0.07499
--31.654
0.48371
144.147
2800
0.03163
--24.056
5.51967
48.401
0.07519
--32.344
0.48777
142.183
2850
0.02869
--26.756
5.44631
46.54
0.0754
--33.048
0.49144
140.072
2900
0.02667
--28.324
5.37422
44.74
0.07563
--33.749
0.4961
138.081
2950
0.02324
--29.457
5.30336
42.914
0.07577
--34.431
0.50017
136.001
3000
0.02069
--34.403
5.23613
41.138
0.07596
--35.209
0.5054
133.872
3050
0.01861
--37.625
5.16698
39.322
0.07624
--35.917
0.50901
131.91
3100
0.01563
--41.101
5.09908
37.495
0.07648
--36.648
0.51431
129.855
3150
0.01407
--49.967
5.03148
35.696
0.0766
--37.389
0.51844
127.844
3200
0.01296
--54.052
4.96452
33.935
0.07684
--38.12
0.52333
125.818
3250
0.01129
--59.44
4.89769
32.159
0.07708
--38.894
0.52814
123.86
3300
0.01031
--67.904
4.83271
30.407
0.07721
--39.663
0.53368
121.891
3350
0.00977
--71.657
4.76883
28.702
0.07742
--40.479
0.53765
120.096
3400
0.00821
--77.779
4.707
26.984
0.07764
--41.116
0.54299
118.206
3450
0.0076
--90.054
4.64886
25.288
0.07774
--41.964
0.54702
116.357
3500
0.0074
--97.151
4.59041
23.575
0.07797
--42.707
0.55121
114.75
3550
0.00666
--114.876
4.5319
21.885
0.07819
--43.538
0.55593
113.11
3600
0.00749
--127.171
4.47455
20.231
0.07843
--44.293
0.55935
111.522
NOT RECOMMENDED FOR NEW DESIGN
NOT RECOMMENDED FOR NEW DESIGN
Table 12. Common Emitter S--Parameters (VCC = 5.2 Vdc, TA = 25C, 50 Ohm System) (continued)
MMG3002NT1
RF Device Data
Freescale Semiconductor, Inc.
9
3.00
2X
45
2X
1.25
3X
0.70
0.85
2X
1.50
Figure 23. PCB Pad Layout for SOT--89A
M3002N
( )
YYWW
Figure 24. Product Marking
4.35
NOT RECOMMENDED FOR NEW DESIGN
NOT RECOMMENDED FOR NEW DESIGN
1.90
MMG3002NT1
10
RF Device Data
Freescale Semiconductor, Inc.
NOT RECOMMENDED FOR NEW DESIGN
NOT RECOMMENDED FOR NEW DESIGN
PACKAGE DIMENSIONS
MMG3002NT1
RF Device Data
Freescale Semiconductor, Inc.
11
MMG3002NT1
12
RF Device Data
Freescale Semiconductor, Inc.
NOT RECOMMENDED FOR NEW DESIGN
NOT RECOMMENDED FOR NEW DESIGN
MMG3002NT1
RF Device Data
Freescale Semiconductor, Inc.
13
NOT RECOMMENDED FOR NEW DESIGN
NOT RECOMMENDED FOR NEW DESIGN
PRODUCT DOCUMENTATION AND SOFTWARE
Refer to the following resources to aid your design process.
 AN1955: Thermal Measurement Methodology of RF Power Amplifiers
 AN3100: General Purpose Amplifier and MMIC Biasing
Software
 .s2p File
NOT RECOMMENDED FOR NEW DESIGN
NOT RECOMMENDED FOR NEW DESIGN
Application Notes
For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to Software &
Tools on the part’s Product Summary page to download the respective tool.
FAILURE ANALYSIS
At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In
cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third
party vendors with moderate success. For updates contact your local Freescale Sales Office.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
7
Mar. 2007
 Corrected and updated Part Numbers in Tables 8, 10 and 11, Component Designations and Values, to
RoHS compliant part numbers, pp. 6--8
8
July 2007
 Replaced Case Outline 1514--01 with 1514--02, Issue D, pp. 1, 12--14. Case updated to add missing
dimension for Pin 1 and Pin 3.
9
Mar. 2008
 Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings,
p. 1
 Corrected Fig. 13, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis
(ACPR) unit of measure to dBc, p. 5
 Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected
frequency values from GHz to MHz, pp. 9, 10
10
Feb. 2012
 Corrected temperature at which ThetaJC is measured from 25C to 118C and added “no RF applied” to
Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no
RF signal applied, p. 1
 Table 6, ESD Protection Characteristics, removed the word “Minimum” after the ESD class rating. ESD
ratings are characterized during new product development but are not 100% tested during production. ESD
ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive
devices, p. 3
 Removed ICC bias callout from applicable graphs and Table 12, Common Emitter S--Parameters heading
as bias is not a controlled value, pp. 4–10
 Added .s2p File availability to Product Software, p. 15
11
Dec. 2012
 Replaced the PCB Pad Layout drawing, the package isometric and mechanical outline for Case 1514--02
(SOT--89) with Case 2142--01 (SOT--89) as a result of the device transfer from a Freescale wafer fab to an
external GaAs wafer fab and new assembly site. The new assembly and test site’s SOT--89 package has
slight dimensional differences, pp. 1, 11--14. Refer to PCN13337, GaAs Fab Transfer.
 Added Fig. 24, Product Marking, p. 11
12
Sept. 2014
 Table 2, Maximum Ratings: updated Junction Temperature from 150C to 175C to reflect recent test
results of the device, p. 1
 Added Failure Analysis information, p. 14
MMG3002NT1
14
RF Device Data
Freescale Semiconductor, Inc.
Home Page:
freescale.com
Web Support:
freescale.com/support
Information in this document is provided solely to enable system and software
implementers to use Freescale products. There are no express or implied copyright
licenses granted hereunder to design or fabricate any integrated circuits based on the
information in this document.
Freescale reserves the right to make changes without further notice to any products
herein. Freescale makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale assume any
liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental
damages. “Typical” parameters that may be provided in Freescale data sheets and/or
specifications can and do vary in different applications, and actual performance may
vary over time. All operating parameters, including “typicals,” must be validated for
each customer application by customer’s technical experts. Freescale does not convey
any license under its patent rights nor the rights of others. Freescale sells products
pursuant to standard terms and conditions of sale, which can be found at the following
address: freescale.com/SalesTermsandConditions.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc.,
Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their
respective owners.
E 2004--2008, 2012, 2014 Freescale Semiconductor, Inc.
NOT RECOMMENDED FOR NEW DESIGN
NOT RECOMMENDED FOR NEW DESIGN
How to Reach Us:
MMG3002NT1
Document
Number:
RF Device
DataMMG3002NT1
Rev.
12, 9/2014
Freescale
Semiconductor, Inc.
15
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Related manuals

Download PDF

advertisement