Freescale Semiconductor Technical Data
Document Number: MPC8241ECS01AD Rev. 2.2, 1/2006
MPC8241 Integrated Processor Hardware Specifications Addendum for the MPC8241T
XXnnnx
Series
This document describes part-number-specific changes to recommended operating conditions and revised electrical specifications, as applicable, from those described in the general
MPC8241 Integrated Processor Hardware Specifications
(MPC8241EC). The MPC8241 combines a MPC603e PowerPC™ core with a PCI bridge.
Specifications provided in this document supersede those in the
MPC8241 Integrated Processor Hardware Specifications
, Rev. 7 or later, for the part numbers listed in
Table A
only. Specifications not addressed herein are unchanged. Because this document is frequently updated, visit the website listed on the back cover of the document.
Note that headings and table numbers in this document are not consecutively numbered. They are intended to correspond to the heading or table affected in the general hardware specification.
Part numbers addressed in this document are listed in
Table A
. For more detailed ordering information see
Section 9, “Ordering Information.”
Freescale Part Numbers Affected: MPC8241TZQ166D MPC8241TZQ200D
© Freescale Semiconductor, Inc., 2006. All rights reserved.
Ordering Information Freescale Part Number
MPC8241TZQ166D MPC8241TZQ200D
Table A. Part Numbers Addressed by This Addendum Operating Conditions CPU Frequency (MHz)
166 200
V DD
1.8 V ± 100 mV
T J (°C)
–40 ° to 105 ° C
Significant Differences from Hardware Specification
Extended temperature range of standard part by changing minimum temperature from 0 ° C to -40 ° C.
4.1.2 Recommended Operating Conditions
Table 2 provides the recommended operating conditions for the MPC8241 part numbers described herein.
Table 2. Recommended Operating Conditions Characteristic Symbol Recommended Value Unit
Die-junction temperature T J –40 to 105 ° C
Note:
These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed.
9 Ordering Information
9.1 Part Numbers Addressed by This Document
Table 21
provides the ordering information for the MPC8241 parts described in this document.
Table 21. Part Marking Nomenclature 1 MPC
nnnn
T
xx nnn x
Product Code Part Identifier Process Descriptor Package 1 Processor Frequency (MHz) 2 Revision Level Processor Version Register Value
MPC 8241 T = Extended Temperature Spec.
–40 ° to 105 ° C ZQ = thick substrate and thick mold cap PBGA (two layers) 166, 200 MHz @1.8 V ± 100 mV D:1.4
Rev. ID:0x14 0x80811014
Notes:
1. This part’s marking will conform to Figure 34
. This table details the specifications of the device, not the marking.
2. Processor core frequencies supported by parts addressed by this addendum only. Parts addressed by other hardware specifications addendums may support other maximum core frequencies.
2
MPC8241 Integrated Processor Hardware Specifications Addendum for the MPC8241TXXnnnx Series, Rev. 2.2
Freescale Semiconductor
9.3 Part Marking
Parts are marked as in the example shown in Figure 34 .
.
MPC8241TZQ
nnnx
MMMMM ATWLYYWW CCCCC
Notes :
MMMMM is the 5-digit mask number.
ATWLYYWW is test traceability code.
CCCCC is the country code.
Figure 34. Freescale Part Number Key Ordering Information MPC8241 Integrated Processor Hardware Specifications Addendum for the MPC8241TXXnnnx Series, Rev. 2.2
Freescale Semiconductor 3
Ordering Information
Document Revision History
Table B
provides a revision history for this part number specification.
Table B. Document Revision History Revision
2.2
2.1
2 1 0
Date Substantive Change(s)
1/4/2005 8/29/2005
Changed format of Table A to be more in line with format for Addendum documents.. Updated table
number for
Table 21
to be consistent with hardware speciifcations document.
11/14/2005 Table .A, ”Part Numbers Addressed by MPC8241TXXPNS Series”—Updated format of part numbering table.
Corrected all references from ZP to ZQ as the Thick substrate-Thick mold version of packaging is what is available to customers for ordering.
Updated revision of part available from Rev B to Rev D. Removed reference to a 266 MHz part since it is not offered as an extended temperature part.
Created Section 9.3 for Part marking.
Figure 34
, “Freescale Part Number Key”—Replaced with latest part marking format.
Removed all references to “ZP” option as it is not offered on the market.
Changed document ID to MPC8241ECS01AD for a Hardware Specification Addendum. The old document ID was MPC8241TXXPNS for a Part Number Specification.
Document title changed to
MPC8241 RISC Microprocessor Hardware Specifications Addendum for the MPC8241TXXnnnx Series
from
MPC8241 Part Number Specification for the XPC8241TXXnnnx Series.
Changed product code from XPC to MPC.
— — Updated part listing on first page and in Table A. Table A—Added 266 MHz part to list of parts offered for extended temperature offerings. Also, added Processor Version Number column to table.
Updated list of extended temperature parts.
Section 1.9—Updated part marking format and package description offerings.
Initial release.
4
MPC8241 Integrated Processor Hardware Specifications Addendum for the MPC8241TXXnnnx Series, Rev. 2.2
Freescale Semiconductor
THIS PAGE INTENTIONALLY LEFT BLANK Ordering Information MPC8241 Integrated Processor Hardware Specifications Addendum for the MPC8241TXXnnnx Series, Rev. 2.2
Freescale Semiconductor 5
Ordering Information THIS PAGE INTENTIONALLY LEFT BLANK
6
MPC8241 Integrated Processor Hardware Specifications Addendum for the MPC8241TXXnnnx Series, Rev. 2.2
Freescale Semiconductor
THIS PAGE INTENTIONALLY LEFT BLANK Ordering Information MPC8241 Integrated Processor Hardware Specifications Addendum for the MPC8241TXXnnnx Series, Rev. 2.2
Freescale Semiconductor 7
How to Reach Us:
Home Page:
www.freescale.com
email:
[email protected]
USA/Europe or Locations Not Listed:
Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 (800) 521-6274 480-768-2130 [email protected]
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected]
Japan:
Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku Tokyo 153-0064, Japan 0120 191014 +81 3 5437 9125 [email protected]
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate, Tai Po, N.T., Hong Kong +800 2666 8080 [email protected]
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 (800) 441-2447 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor @hibbertgroup.com
Document Number: MPC8241ECS01AD Rev. 2.2
1/2006 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. The PowerPC name is a trademark of IBM Corp. and is used under license. All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc., 2006.
