NXP TEA1832LTS GreenChip SMPS control IC User Guide

NXP TEA1832LTS GreenChip SMPS control IC User Guide
UM10862
TEA1832DB1253 45 W demo board
Rev. 1.1 — 18 June 2015
User manual
Document information
Info
Content
Keywords
TEA1832DB1253, TEA1832TS, TEA1832LTS, notebook adapter
Abstract
This user manual provides the specification, schematics and PCB layout
of the TEA1832DB1253 45 W (90 W peak) demo board. See the data
sheet and application note for more information on the TEA1832TS/LTS
IC.
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TEA1832DB1253 45 W demo board
Revision history
Rev
Date
Description
v.1.1
20150618
updated issue
•
Modifications:
v.1
20150513
Figure 15 “TEA1832DB1253 schematic” has been updated.
first issue
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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1. Introduction
WARNING
Lethal voltage and fire ignition hazard
The non-insulated high voltages that are present when operating this product, constitute a
risk of electric shock, personal injury, death and/or ignition of fire.
This product is intended for evaluation purposes only. It shall be operated in a designated test
area by personnel qualified according to local requirements and labor laws to work with
non-insulated mains voltages and high-voltage circuits. This product shall never be operated
unattended.
The TEA1832DB1253 demo board demonstrates the capabilities of the low-cost 6-pin
TEA1832TS/LTS Switched-Mode Power Supply (SMPS) controller. This user manual
describes the specification, the schematics, and the PCB layout of the TEA1832DB1253
45 W demo board. See the data sheet and application note for more information on the
TEA1832TS/LTS IC.
Remark: Unless otherwise specified, all values are typical values.
1.1 Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
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Low no-load power (< 55 mW at 230 V (AC), output still in regulation)
200 % peak power
Universal mains supply operation
Low ripple and noise
Small form factor
Low-cost design
Efficiency DoE 2016 and COC 2014 compliant
EMI CISPR22 compliant
Brownin and brownout protection
Output OverVoltage Protection (OVP)
OverTemperature Protection (OTP)
OverPower Protection with high/low compensation
OverCurrent Protection (OCP)
Output Short Circuit Protection (OSCP)
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2. Safety warning
The TEA1832DB1253 demo board input is connected to the mains voltage. Avoid
touching the board while it is connected to the mains voltage and when it is in operation.
An isolated housing is obligatory when used in uncontrolled, non-laboratory environments.
Galvanic isolation from the mains phase using a fixed or variable transformer is always
recommended. Figure 1 shows the symbols on how to recognize these devices.
019aab174
019aab173
a. Isolated
Fig 1.
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b. Not isolated
Isolation symbols
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3. Power supply specification
Table 1 lists the specification of the TEA1832DB1253 demo board.
Table 1.
TEA1832DB1253 specifications
Symbol
Parameter
Value
Vi
input voltage
90 V to 264 V
fi
input frequency
47 Hz to 64 Hz
Pi
input power
< 55 mW; no-load
Vo
output voltage
19.5 V
Vo(ripple)(p-p)
ripple output voltage
< 150 mV (pp); full load;
20 MHz bandwidth;
10 F capacitor at end of cable
Po(nom)
nominal output power
45 W
Po(peak)
peak output power
> 90 W; 2 ms peak load during 50 %
continuous load; 100 V (AC); 50 Hz;
measured at end of cable
Vo(peak)
output voltage during peak load > 18 V; 2 ms 200 % peak load during
50 % continuous load; 100 V (AC);
50 Hz; measured at end of cable
tholdup
hold-up time
> 5 ms; 115 V (AC); 60 Hz; full load
tstartup
start-up time
< 2 s; 115 V (AC); 60 Hz
< 3 s; 90 V (AC); 60 Hz

efficiency
> 89 %; average; measured at end of
cable
> 83 %; at 10 % load
> 60 %; at 0.6 % load
(= at 270 mW load)
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Vline(reg)
line voltage regulation
< 1 %; 90 V (AC) to 264 V (AC);
measured at the PCB
Vload(reg)
load voltage regulation
< 1 %; no-load to full load (2.3 A);
measured at the PCB
EMI
conducted EMI
> 5 dB margin; according to CISPR22
Po(opp)
OPP trigger level
50 W to 60 W; over full input voltage
range
VO(ovp)
overvoltage protection output
voltage
< 24 V (DC)
Vbi
brownin voltage
75 V (AC) to 85 V (AC)
Vbo
brownout voltage
65 V (AC) to 75 V (AC); over full load
range
Pi(shorted_output)
average input power at
continuously shorted output
< 1 W; 264 V (AC)
Totp
overtemperature protection
temperature
105 C; ±5 C; diode and NTC same
temperature
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4. Board photographs
Fig 2.
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TEA1832DB1253 demo board photograph - Top view
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5. Performance
Performance figures are based on PCB design:
• Schematic version: v.3 (see Figure 15)
5.1 Efficiency
Efficiency measurements are taken using an automated test program containing a
temperature stability detection algorithm. The output voltage and output current are
measured using a 4-wire current sense configuration directly at the PCB connector.
Measurements are performed for:
• 115 V/60 Hz
• 230 V/50 Hz
Table 2.
High load efficiency
Measured directly at the PCB; see Section 5.1.1 for more information about how to calculate efficiency at end of cable.
Condition
Efficiency at specified load
10 %;
4.5 W
25 %;
11.25 W
50 %;
22.5 W
75 %;
33.75 W
100 %;
45 W
4-point
average
115 V (AC)/60 Hz
88.74 %
90.24 %
90.70 %
90.01 %
89.23 %
90.05 %
230 V (AC)/50 Hz
87.52 %
88.64 %
90.33 %
90.65 %
90.46 %
90.02 %
Table 3.
Low load efficiency
Measured directly at the PCB
Condition
Efficiency at specified load
0.1 W;
0.22 %
0.2 W;
0.44 %
0.5 W;
1.11 %
1 W;
2.22 %
2 W;
4.44 %
115 V (AC)/60 Hz
69.36 %
78.35 %
85.65 %
87.77 %
88.89 %
230 V (AC)/50 Hz
56.52 %
69.12 %
80.34 %
84.02 %
86.02 %
After subtracting 0.975 % from the 4-point average efficiency result for cable losses, the
board complies with all efficiency standards listed below.
Table 4.
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Efficiency standards
Standard
10 % load
4-point average
(25 %; 50 %; 75 %; 100 %)
COC 2014
78.43 %
88.43 %
COC 2016
78.85 %
88.85 %
DoE 2008
-
84.26 %
DoE 2016
-
87.73 %
Energy Star 2.0
-
86.03 %
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5.1.1 Cable loss
At full load, the cable loss reduces the efficiency by:
2
2
I nom  R cable
 2.3 A   R cable
P cable
 = --------------------  100 % = --------------------------------  100 % = ----------------------------------------  100 %
  P nom
  P nom
0.9  45 W
(1)
= R cable  13 %
• The resistance of a 1.8 m 20 AWG cable is approximately 120 m which reduces the
efficiency at full load by 13 %  120 m = 1.56 % .
• For the 4-point average, the result of the formula above must be multiplied by 0.6251
so for the 4-point average the efficiency is reduced by 0.97 %.
• At a 10 % load, the influence of the cable can already be neglected.
Table 5.
Cable loss for different types of cable
Cable thickness
(AWG)
16
18
20
Cable length
(m)
Resistance at 20 C
(m)
Efficiency loss
(4-point average)
(%)
1.2
32
0.26
1.8
47
0.39
1.2
50
0.41
1.8
75
0.71
1.2
80
0.65
1.8
120
0.97
5.1.2 Output diode
Replacing the 20 A Schottky diode (D5 in Figure 15) by a 40 A Schottky diode, for
example, the Vishay V40100C can improve the efficiency about 0.5 %.
5.2 No-load power consumption
Measurement details:
•
•
•
•
Power meter Yokogawa WT210
Integrated over 36 s
AC source Agilent 6812B
No probes or ground clips connected to board
Table 6.
1.
No-load power measurements
Input condition
No-load power
90 V (AC)/60 Hz
24.8 mW
115 V (AC)/60 Hz
27.4 mW
230 V (AC)/50 Hz
48.8 mW
264 V (AC)/50 Hz
58.7 mW
At low output current, the cable losses rapidly decrease: reducing the output current by a factor 2 decreases the cable losses by a
factor 4.
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Table 7.
No-load power requirements
Standard
No-load power
COC 2014
150 mW
COC 2016
75 mW
DoE 2008
300 mW
DoE 2016
100 mW
Energy Star 2.0
300 mW
5.3 Load regulation
The output voltage as a function of load current is measured directly at the PCB and at the
end of the cable at 115 V (AC)/60 Hz.
DDD
9R
9
,2 $
(1) Measured at the PCB.
(2) Measured at the end of the cable.
Fig 3.
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Output voltage as a function of output current
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5.4 Line regulation
The output voltage as a function of mains input voltage is measured directly at the PCB at
full load (2.3 A) and at 60 Hz.
DDD
9R
9
Fig 4.
9PDLQV 9 $&
Output voltage as a function of mains voltage
5.5 High/low line compensation
The maximum continuous output power is measured at the PCB as function of the mains
voltage at 60 Hz.
DDD
3R
:
Fig 5.
9PDLQV 9 $&
Overpower protection threshold as a function of mains voltage
If necessary, the OPP level can be increased by decreasing resistors R11 and R12 to
0.47  and increasing capacitor C1 to 82 F. In that case resistor R13 must be increased
to limit the output power at high input voltages. See the TEA1832 application note (Ref. 3)
for more information about how to tune R13 and R27.
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5.6 Peak power
5.6.1 Example 1
• Load: 200 % peak (4.6 A) for 2 ms when continuously running at 50 % load (10 ms)
• Input voltage: 100 V (AC); 47 Hz
• Output voltage: remains above 18 V (18.44 V)
Green: Output voltage
Blue: Output voltage (bottom of screen is 15 V)
Fig 6.
200 % peak load for 2 ms when continuously running at 50 % load (accumulated
over 30 s)
The output voltage was measured at end of the cable.
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5.6.2 Example 2
• Load: 200 % peak (4.6 A) for 1 ms when continuously running at 100 % load (10 ms)
• Input voltage: 90 V (AC); 47 Hz
• Output voltage: remains above 17 V (17.59 V)
Green: Output voltage (bottom of screen is 15 V)
Fig 7.
200 % peak load for 1 ms when continuously running at 100 % load (accumulated
over 30 s)
The output voltage was measured at end of the cable.
For an even higher or longer peak load, decrease current sense resistor and increase bulk
capacitor (also increases the maximum continuous output power) or increase the output
capacitor.
5.7 VCC voltage
The VCC voltage is measured at different input and loading conditions. It is within a safe
margin of the UVLO level and the OVP level.
Table 8.
VCC voltage
The two voltages are the minimum and the maximum value of the VCC ripple.
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Condition
90 V (AC)/60 Hz
264 V (AC)/50 Hz
no-load
15.55 V to 17.25 V
15.05 V to 17.40 V
90 W peak load
24.50 V to 24.95 V
24.55 V to 24.75 V
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5.8 Brownout and start-up level
Brownout and start-up level were measured at no-load and at full load in 0.5 V steps.
Table 9.
Brownout and start-up level
Condition
Start-up voltage
Brownout voltage
no-load
83.5 V (AC)
73.5 V (AC)
full load (2.3 A)
83.5 V (AC)
75.0 V (AC)
5.9 OverVoltage Protection (OVP)
Applying a short circuit across the LED of the photocoupler (U2) creates an output
overvoltage condition. The output voltage is measured directly at the PCB.
Table 10.
Maximum output voltage
Condition
115 V (AC)/60 Hz
230 V (AC)/50 Hz
no-load
22.75 V
22.75 V
full load (2.3 A)
22.75 V
22.75 V
(1) Orange: VCC
(2) Blue: Vo
Fig 8.
Overvoltage protection (230 V (AC)/50 Hz; full load)
The OVP trigger level can be adjusted by changing resistor R27.
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5.10 Start-up time
The start-up time was measured without connecting any voltage probes. All capacitors
were fully discharged before starting up.
Table 11.
Start-up time measured at three input voltages
Input voltage
Start-up time
90 V (AC)/60 Hz
2.35 s
115 V (AC)/60 Hz
1.56 s
230 V (AC)/50 Hz
0.64 s
5.11 Start-up sequence
Figure 9 and Figure 10 show waveforms of some essential voltages. These waveforms
were captured during start-up at full load.
(1) Orange: VCC
(2) Magenta: CTRL
(3) Green: DRIVER
(4) Blue: Vo
Fig 9.
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Start-up waveforms at 115 V AC)/60 Hz
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(1) Orange: VCC
(2) Magenta: CTRL
(3) Green: DRIVER
(4) Blue: Vo
Fig 10. Start-up waveforms at 230 V (AC)/50 Hz
5.12 Hold-up time
The hold-up time at 115 V (AC)/50 Hz is 9.0 ms.
(1) Magenta: Bulk capacitor voltage
(2) Blue: Vo
Fig 11. Hold-up time at 115 V (AC)/50 Hz
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The hold-up time was measured from the last valley of the bulk capacitor ripple (worst
case moment for mains interruption) until the output voltage starts to drop (drops to below
18.5 V).
5.13 Average input power at continuously shorted output
Measurement details:
•
•
•
•
Output was shorted at the end of the cable
Power meter Yokogawa WT210
Current range 5 A
Integration time 36 s
Table 12.
Input power at continuously shorted output
Condition
Input power
90 V (AC)/60 Hz
168 mW
115 V (AC)/60 Hz
192 mW
230 V (AC)/50 Hz
618 mW
264 V (AC)/50 Hz
760 mW
5.14 Output ripple and noise
Measured at full load with a 10 F/50 V capacitor (United Chemi Con; KY series) at end of
the cable. The oscilloscope bandwidth was limited to 20 MHz.
Table 13.
Output ripple and noise
Condition
Vo(ripple)(p-p)
90 V (AC)
81 mV (pp)
264 V (AC)
81 mV (pp)
Fig 12. Output voltage ripple and noise at 264 V (AC)/50 Hz
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5.15 OverTemperature Protection (OTP)
The external OTP triggers at 105 C, measured in an oven at 115 V (AC)/60 Hz at no-load
operation.
5.16 EMI performance
Conducted EMI measurement details:
•
•
•
•
•
Full load (passive load 8.33  at end of cable)
Supply voltage 115 V (AC) and 230 V (AC)
Frequency range 150 kHz to 30 MHz
Test receiver Rohde & Schwarz ESPI3
Line impedance stabilization network Rohde & Schwarz ENV216
Remark: In Figure 13 and Figure 14, the blue line is the peak measurement result and the
black line is the average measurement result.
a. Line
b. Neutral
Fig 13. Conducted EMI performance at 115 V (AC)/60 Hz
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a. Line
b. Neutral
Fig 14. Conducted EMI performance at 230 V (AC)/50 Hz
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6. Schematic
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7. Bill Of Materials (BOM)
Table 14.
TEA1832DB1253 bill of materials
Reference
Description and values
Part number
Manufacturer
BC1
not mounted; ferrite core; on pin CY1
74270073
Würth Elektronik
BD1
bridge diode; 2 A; 600 V
KBP206G
Diodes Inc.
C1
capacitor; 68 F; 400 V; 105 C
400BXW68MEFC18X20
Rubycon
C2
capacitor; 3.3 nF; 1 kV; X7R; 1206
-
-
C3
capacitor; 2.2 nF; 630 V; X7R; 1206
-
-
C4
capacitor; not mounted; 100 pF; 1 kV;
X7R; 1206
-
-
C7
capacitor; 100 nF; 50 V; X7R; 0603
-
-
C9; C10; C15
capacitor; 1 nF; 50 V; X7R; 0603
-
-
C11
capacitor; 2.2 F; 50 V; 105 C;
5 mm  11 mm
50YXJ2R2MTA5X11
Rubycon
C13
capacitor; 680 F; 25 V; 105 C;
10 mm  20 mm
EKZE250ELL681MJ20S
United Chemi Con
C16
capacitor; 10 nF; 50 V; X7R; 0603
-
-
C18
capacitor; 220 pF; 100 V; NPO; 0805
-
-
C19
capacitor; 100 nF; 50 V; X7R; 1206
-
-
C20
capacitor; not mounted; 220 pF; 50 V;
X7R; 0603
-
-
CX1
capacitor; 220 nF; 275 V (AC); X2
-
HJC
CY1
capacitor; 1.5 nF; 250 V (AC); Y1
DE1E3KX152MA5BA01
Murata
D1
diode; 1 kV; 2 A
SA2M-E3/61T
Vishay
D2
diode; 100 V; 250 mA
BAS316
NXP Semiconductors
D3; D8
diode; 200 V; 200 mA
BAS21H
NXP Semiconductors
D5
diode; Schottky; 100 V; 2  10 A; TO220
NXPS20H100CX
NXP Semiconductors
D6
diode; 85 V; 200 mA
BAS416
NXP Semiconductors
D7
diode; dual; common cathode; 85 V;
100 mA
BAV70W
NXP Semiconductors
D9; D10
diode; Zener; 75 V; 250 mW; SOD323F
BZX84J-B75
NXP Semiconductors
F1
fuse; slow blow; 3.15 A; 250 V (AC)
MST 3.15A 250V
Multicomp
HS1
heat sink for Q1
-
-
HS2
heat sink for D5
-
-
L1
inductor; 3.3 H; 1.2 A
LQM2HPN3R3MG0L
Murata
LF1
choke; common mode; not mounted;
shorted by wire bridge;
diameter = 0.8 mm; pitch 5.08 mm
-
-
LF2
choke; common mode; 2  6.8 mH
B82721K2122N20
EPCOS
M1; M2
screw; M3  8; for mounting Q1 and D5
-
-
M3; M4
spring washer; M3;
for mounting Q1 and D5
-
-
M5; M6
nut; M3; for mounting Q1 and D5
-
-
Q1
MOSFET; N-channel; 600 V; 10 A
TK10A60D
Toshiba
UM10862
User manual
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Rev. 1.1 — 18 June 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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UM10862
NXP Semiconductors
TEA1832DB1253 45 W demo board
Table 14.
TEA1832DB1253 bill of materials …continued
Reference
Description and values
Part number
Manufacturer
R1; R2; R3; R8
resistor; 1.2 M; 1206
-
-
R5; R6
resistor; 10 M; 1 %; 1206
-
-
R11; R12
resistor; 0.51 ; 1 %; 500 mW; 1206
-
-
R13
resistor; 6.8 k; 1 %; 0603
-
-
R14
resistor; 150 ; 0805
-
-
R15
resistor; 4.7 ; 0805
-
-
R17
resistor; 2.7 k; 1 %; 0603
-
-
R20
resistor; 1.0 k; 0805
-
-
R22
resistor; 10 k; 0603
-
-
R23
resistor; 180 k; 1 %; 0603
-
-
R24
resistor; 24 k; 1 %; 0603
-
-
R25
resistor; 2.2 M; 0603
-
-
R26
resistor; 47 ; 0805
-
-
R27
resistor; 56 k; 1 %; 0603
-
-
R28
resistor; 0 ; 2512
-
-
R29
resistor; 0 ; 0603
-
-
R30
resistor; not mounted; 47 ; 0603
-
-
RT1
resistor; NTC; 100 k
NTCLE100E3104JB0
Vishay
T1
transformer; RM8 (see Section 9)
TF-RM080-207R
Shenzhen Belta
U1
flyback controller
TEA1832TS
NXP Semiconductors
U2
photocoupler; CTR = 100 % to 200 % at
IF = 1 mA
VOL618A-3X001T
Vishay
U3
shunt regulator; 2.5 V
NCP431ACSNT1G
ON Semiconductor
WB1; WB2
wire bridge; diameter = 0.8 mm;
pitch = 5.08 mm
-
-
X1
mains inlet
770W-X2/10
Qualtek
X2
output cable; 20 AWG; 1.8 m
-
-
UM10862
User manual
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 18 June 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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UM10862
NXP Semiconductors
TEA1832DB1253 45 W demo board
8. PCB layout
Fig 16. Copper layout bottom side (top view)
a. Top
b. Bottom
Fig 17. Component placing (top view)
UM10862
User manual
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Rev. 1.1 — 18 June 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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TEA1832DB1253 45 W demo board
9. Transformer specification
• Manufacturer: Shenzhen Belta Technology Co. Ltd.
• Shenzhen Belta part number: TF-RM080-207R
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EXON
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GUDLQ
9DX[
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PP
W
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YLHZLQPRXQWLQJGLUHFWLRQ
DDD
Fig 18. Transformer specification
UM10862
User manual
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 18 June 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
23 of 27
UM10862
NXP Semiconductors
TEA1832DB1253 45 W demo board
Table 15.
Electrical characteristics
Parameter
Value
Conditions
DC resistance
1110 m
primary
45 m
secondary
527 m
auxiliary
650 H
10 kHz
5.8 H
100 kHz; 100 mV (RMS)
prim : sec : auxiliary
5.67:1.0:1.0
primary inductance
leakage
inductance[1]
winding ratio
[1]
Secondary and auxiliary winding shorted
Table 16.
UM10862
User manual
Winding specification
Winding[1]
Wire
N1
1  0.224 mm
N2
4  0.18 mm
10
pin 10
-
shield
N3
1  0.5 mm TEX-E
12
fly top
fly bottom
secondary
N4
1  0.224 mm
34
A[2]
pin 1
primary
N5
1  0.15 mm
12
pin 10
pin 11
auxiliary
Turns
34
Start
Finish
Purpose
pin 3
A[2]
primary
[1]
1 layer of mylar tape after each winding.
[2]
Intermediate connection A is not connected to a pin.
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 18 June 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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UM10862
NXP Semiconductors
TEA1832DB1253 45 W demo board
10. Abbreviations
Table 17.
Abbreviations
Acronym
Description
SMPS
Switched-Mode Power Supply
OCP
OverCurrent Protection
OPP
OverPower Protection
OTP
OverTemperature Protection
UVLO
UnderVoltage LockOut
LED
Light-Emitting Diode
OVP
OverVoltage Protection
EMI
ElectroMagnetic Interference
11. References
UM10862
User manual
[1]
TEA1832TS data sheet — GreenChip SMPS control IC
[2]
TEA1832LTS data sheet — GreenChip SMPS control IC
[3]
AN11588 application note — GreenChip TEA1832(L)TS fixed frequency flyback
controller
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 18 June 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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NXP Semiconductors
TEA1832DB1253 45 W demo board
12. Legal information
12.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
12.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express, implied
or statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of this
product remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
to customer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business, business
interruption, loss of use, loss of data or information, and the like) arising out
the use of or inability to use the product, whether or not based on tort
(including negligence), strict liability, breach of contract, breach of warranty or
any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by customer
for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
law, even if any remedy fails of its essential purpose.
Safety of high-voltage evaluation products — The non-insulated high
voltages that are present when operating this product, constitute a risk of
electric shock, personal injury, death and/or ignition of fire. This product is
intended for evaluation purposes only. It shall be operated in a designated
test area by personnel that is qualified according to local requirements and
labor laws to work with non-insulated mains voltages and high-voltage
circuits.
The product does not comply with IEC 60950 based national or regional
safety standards. NXP Semiconductors does not accept any liability for
damages incurred due to inappropriate use of this product or related to
non-insulated high voltages. Any use of this product is at customer’s own risk
and liability. The customer shall fully indemnify and hold harmless NXP
Semiconductors from any liability, damages and claims resulting from the use
of the product.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
12.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP Semiconductors N.V.
UM10862
User manual
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 18 June 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
26 of 27
UM10862
NXP Semiconductors
TEA1832DB1253 45 W demo board
13. Contents
1
1.1
2
3
4
5
5.1
5.1.1
5.1.2
5.2
5.3
5.4
5.5
5.6
5.6.1
5.6.2
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
5.15
5.16
6
7
8
9
10
11
12
12.1
12.2
12.3
13
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Safety warning . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Power supply specification. . . . . . . . . . . . . . . . 5
Board photographs . . . . . . . . . . . . . . . . . . . . . . 6
Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Cable loss . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
No-load power consumption . . . . . . . . . . . . . . . 8
Load regulation . . . . . . . . . . . . . . . . . . . . . . . . . 9
Line regulation . . . . . . . . . . . . . . . . . . . . . . . . 10
High/low line compensation . . . . . . . . . . . . . . 10
Peak power. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Example 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Example 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
VCC voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Brownout and start-up level . . . . . . . . . . . . . . 13
OverVoltage Protection (OVP) . . . . . . . . . . . . 13
Start-up time . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Start-up sequence. . . . . . . . . . . . . . . . . . . . . . 14
Hold-up time . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Average input power at continuously shorted
output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Output ripple and noise . . . . . . . . . . . . . . . . . 16
OverTemperature Protection (OTP) . . . . . . . . 17
EMI performance . . . . . . . . . . . . . . . . . . . . . . 17
Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Bill Of Materials (BOM) . . . . . . . . . . . . . . . . . . 20
PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Transformer specification . . . . . . . . . . . . . . . . 23
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 25
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 18 June 2015
Document identifier: UM10862
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