NXP TDA6108AJF TDA6108AJF Data Sheet

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TDA6108AJF

Triple video output amplifier

Rev. 03 — 20 April 2005 Product data sheet

1.

General description

The TDA6108AJF contains three video output amplifiers which are intended to drive the three cathodes of a color CRT. The device is contained in a plastic DIL-bent-SIL 9-pin medium power (DBS9MPF) package, and uses high-voltage DMOS technology.

To obtain maximum performance, the amplifier should be used with black-current control.

2.

Features

■ Typical bandwidth of 9.0 MHz for an output signal of 60 V (p-p)

■ High slew rate of 1310 V/

µ s

■ No external components required

■ Very simple application

■ Single supply voltage of 200 V

■ Internal reference voltage of 2.5 V

■ Fixed gain of 81

■ Black-Current Stabilization (BCS) circuit with voltage window from 1.5 V to 6 V and current window from +100

µ

A to

10 mA

■ Thermal protection

3.

Ordering information

Table 1: Ordering information

Type number Package

Name Description

TDA6108AJF DBS9MPF plastic DIL-bent-SIL medium power package with fin; 9 leads

Version

SOT111-1

Philips Semiconductors

TDA6108AJF

Triple video output amplifier

4.

Block diagram

MIRROR 1

TDA6108AJF

MIRROR 4

V i(1),

V i(2),

V i(3)

1, 2, 3

CURRENT

SOURCE

THERMAL

PROTECTION

CIRCUIT

VIP

REFERENCE

DIFFERENTIAL

STAGE

1

×

R f

MIRROR 3

3

×

R i

R a

3

×

MIRROR 5

CASCODE 1

V

DD

6

1

×

CASCODE 2

9, 8, 7

V oc(1),

V oc(2),

V oc(3)

5

I om

MIRROR 2

4 mce462

Fig 1.

Block diagram

9397 750 14729

Product data sheet Rev. 03 — 20 April 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

2 of 16

Philips Semiconductors

TDA6108AJF

Triple video output amplifier

5.

Pinning information

5.1 Pinning

Fig 2.

Pin configuration

5.2 Pin description

Table 2: Pin description

Symbol

V i(1)

V i(2)

V i(3)

GND

I om

V

DD

V oc(3)

V oc(2)

V oc(1)

6

7

4

5

8

9

2

3

Pin

1

V i(1)

1

V i(2)

2

V i(3)

3

GND 4

I om

5 TDA6108AJF

V

DD

6

V oc(3)

7

V oc(2)

8

V oc(1)

9

001aac594

Description inverting input 1 inverting input 2 inverting input 3 ground black-current measurement output supply voltage cathode output 3 cathode output 2 cathode output 1

9397 750 14729

Product data sheet Rev. 03 — 20 April 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

3 of 16

Philips Semiconductors

TDA6108AJF

Triple video output amplifier

6.

Internal circuitry

1, 2, 3

5

GND

4

V

DD

6 to cascode stage

TDA6108AJF

(1) esd esd to black-current measurement circuit

6.8 V to black-current measurement circuit from control circuit from blackcurrent measurement circuit from control circuit from input circuit from input circuit esd to black-current measurement circuit esd

V bias esd esd flash

7, 8, 9 to black-current measurement circuit mce465

(1) All pins have an energy protection for positive or negative overstress situations.

Fig 3.

Internal pin configuration

7.

Limiting values

Table 3: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Voltages measured with respect to ground; currents as specified in

Figure 9

; unless otherwise specified.

Symbol Parameter Conditions Min Max

V

DD

V i

V om supply voltage input voltage at pins V i(1)

, V i(2)

and V measurement output voltage i(3)

|I om(mean)

| absolute value of mean current of measurement output (for three channels) cathode output voltage V oc

T stg

T j

V esd storage temperature junction temperature electrostatic discharge voltage

V oc

= 0 V to V

DD

;

V om

= 1.5 V to 6 V

Human Body Model (HBM)

Machine Model (MM)

-

-

-

0

0

0

0

55

20

250

12

6

5.6

V

DD

+150

+150

±

3000

±

300

V

°

C

°

C

V

V

Unit

V

V

V mA

9397 750 14729

Product data sheet Rev. 03 — 20 April 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

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Philips Semiconductors

8.

Thermal characteristics

Table 4: Thermal characteristics

Symbol

R th(j-a)

R th(j-fin)

Parameter thermal resistance from junction to ambient thermal resistance from junction to fin

Conditions in free air

[1] An external heatsink is necessary; see Application Note AN10227-01.

TDA6108AJF

Triple video output amplifier

Typ

56

[1]

11

Unit

K/W

K/W

(1)

(2) mbh989

4

2

8

P tot

(W)

6

0

40 0 40 80 120

T amb

160

(

°

C)

(1) Infinite heatsink.

(2) No heatsink.

Fig 4.

Power derating curve

8.1 Thermal protection

The internal thermal protection circuit gives a decrease of the slew rate at high temperatures: 10 % decrease at 130

°

C and 30 % decrease at 145

°

C (typical values on the spot of the thermal protection circuit).

outputs

5 K/W thermal protection circuit

6 K/W fin

Fig 5.

Equivalent thermal resistance network mgk279

9397 750 14729

Product data sheet

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

5 of 16 Rev. 03 — 20 April 2005

Philips Semiconductors

TDA6108AJF

Triple video output amplifier

9.

Characteristics

Table 5: Characteristics

Operating range: T j

= − 20 ° C to +150 ° C; V

DD

= 180 V to 210 V; test conditions: T amb

= 25 ° C; V

DD

= 200 V;

V oc(1)

= V oc(2)

= V oc(3)

= 0.5V

DD

; C

L

= 10 pF (C

L

consists of parasitic and cathode capacitance); R in test circuit of

Figure 9 ; unless otherwise specified.

th(h-a)

= 18 K/W; measured

Symbol Parameter Conditions Min Typ Max Unit

-

7.9

9.4

2.5

-

10.8

mA

V

I q

V ref(int) quiescent supply current internal reference voltage (input stage)

R i

G

G input resistance gain of amplifier gain difference

PSRR

α ct(DC) power supply rejection ratio

DC crosstalk between channels f < 50 kHz

I

Measurement output pin I om

; V oc

= V oc(min) to V oc(max)

V om(clamp) clamping voltage of measurement output

∆ om(offset)

I om

/

I oc offset current of measurement output (for three channels) linearity of current transfer

(for three channels)

I oc

= 0

µ

A;

V om

= 1.5 V to 6 V

I oc

=

100

µ

A to +100

µ

A;

V om

= 1.5 V to 6 V

I oc

=

100

µ

A to +10 mA;

V om

= 1.5 V to 4 V

I

Output pins V oc(1)

, V oc(2)

, V oc(3)

V oc(DC)

V oc(DC)(offset)

DC output voltage differential DC output offset voltage between two output pins

V oc(T)

V oc(T)(offset) output voltage temperature drift oc(max)

V oc(min) differential output offset voltage temperature drift between two output pins maximum peak output current V oc

= 50 V to V

DD

50 V minimum output voltage

I

I i i

V i

= 0

µ

A

= 0

µ

A

= 4.5 V; at I oc

= 0 mA

V

B oc(max)

S

B

L t oc(p) maximum output voltage small signal bandwidth large signal bandwidth cathode output propagation time

50 % input to 50 % output

V

V

V i

= 0.5 V; at I oc oc

= 100 V (p-p)

= 100 V (p-p) square wave oc

V oc

= 60 V (p-p)

= 0 mA

∆ t oc(p) difference in cathode output propagation time 50 % input to

50 % output (between two output pins)

V oc

= 100 V (p-p) square wave

[1]

[2]

[2]

[3]

-

[3]

-

-

-

-

-

-

-

73

4.2

6

50

0.9

0.9

76

5

-

-

2.1

81

0

65

50

1.0

1.0

87

0

10

0

28

-

-

V

DD

15 -

-

9.0

10

8.0

32

0

-

-

-

-

-

-

-

-

-

-

89

+4.2

10

+50

1.1

1.1

97

+5

10

+10 k

V

µ

V

V

Ω dB dB

A mV/K mV/K mA

V

V

MHz

MHz ns ns t oc(r)

[3]

35 50 70 ns t oc(f) cathode output rise time

10 % output to 90 % output cathode output fall time

90 % output to 10 % output

V oc

= 50 V to 150 V square wave

V oc

= 150 V to 50 V square wave

[3]

35 50 65 ns

9397 750 14729

Product data sheet Rev. 03 — 20 April 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

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Philips Semiconductors

TDA6108AJF

Triple video output amplifier

Table 5: Characteristics …continued

Operating range: T j

=

20

°

C to +150

°

C; V

DD

V oc(1)

= V oc(2)

= V oc(3)

= 0.5V

DD

; C

L

= 10 pF (C

= 180 V to 210 V; test conditions: T

L amb

= 25

°

C; V

DD

= 200 V;

consists of parasitic and cathode capacitance); R th(h-a)

= 18 K/W; measured in test circuit of Figure 9 ; unless otherwise specified.

t

Symbol st

Parameter settling time input (50 %) to output (99 % to 101 %)

Conditions

V oc

= 100 V (p-p) square wave

[3]

-

Min

-

Typ Max

350

Unit ns

SR

O v slew rate between 50 V to

V

DD

50 V cathode output voltage overshoot

V

V oc oc

= 2.5 V (p-p) square wave

= 100 V (p-p) square wave

[3]

[3]

-

1310

10 -

V/

µ s

%

[1] The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.

[2] See

Figure 6 for the typical DC-to-DC transfer of V

i to V oc

.

[3] f < 1 MHz; t r

= t f

= 40 ns [pins V i(1)

, V i(2) and V i(3)

] see

Figure 7

and

Figure 8 .

mce455

200

V oc

(V)

160

120

80

40

0

0 1

Fig 6.

Typical DC-to-DC transfer of V i

to V oc

2 3

V i

(V)

4

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Product data sheet Rev. 03 — 20 April 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

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Philips Semiconductors

TDA6108AJF

Triple video output amplifier

V i

(V)

2.96

2.34

t

1.73

t st

O v

(in %)

V oc

(V)

150

140

100

151

149

60

50 t t oc(r) t co(p) mce477

Fig 7.

Output voltage [pins V oc(1)

, V oc(2)

and V oc(3)

] rising edges as a function of the AC input signal

9397 750 14729

Product data sheet Rev. 03 — 20 April 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

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Philips Semiconductors

TDA6108AJF

Triple video output amplifier

V i

(V)

2.96

2.34

t

1.73

t st

V oc

(V)

150

140

100

O v

(in %)

51

60

50

49 t t oc(f) t co(p) mce476

Fig 8.

Output voltage [pins V oc(1)

, V oc(2)

and V oc(3)

] falling edges as a function of the AC input signal

10. Application information

10.1 Flashover protection

For sufficient flashover protection it is necessary to apply an external diode and 100

Ω resistor for each channel; see Application Note AN10227-01.

To limit the diode current an external 1 k

carbon high-voltage resistor in series with the cathode output and a 2 kV spark gap are needed (for this resistor value, the CRT has to be connected to the main PCB).

V

DD

must be decoupled to GND:

1. With a capacitor > 20 nF with good HF behavior (e.g. foil); this capacitor must be placed as close as possible to pins V

DD and GND and must be within 5 mm

2. With a capacitor > 3.3

µ

F on the picture tube base print, depending on the CRT size.

9397 750 14729

Product data sheet Rev. 03 — 20 April 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

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Philips Semiconductors

TDA6108AJF

Triple video output amplifier

10.2 Switch-off behavior

The switch-off behavior of the TDA6108AJF is controllable. This is because the output pins of the TDA6108AJF are still under control of the input pins for low power supply voltages (approximately 30 V and higher).

10.3 Bandwidth

The addition of the flash resistor produces a decreased bandwidth and increases the rise and fall times.

10.4 Dissipation

A distinction must first be made between static dissipation (independent of frequency) and dynamic dissipation (proportional to frequency).

The static dissipation of the TDA6108AJF is due to voltage supply currents and load currents in the feedback network and CRT.

The static dissipation P stat

equals: P stat

= V

DD

×

I

DD

+ 3

×

V oc

×

I oc

Where:

V

DD

= supply voltage

I

DD

= supply current

V oc

= DC value of cathode output voltage

I oc

= DC value of cathode output current.

The dynamic dissipation P dyn

equals: P dyn

= 3

×

V

DD

×

(C

L

+ C int

)

× f i

×

V oc(p-p)

× δ

Where:

C

L

= load capacitance

C int

= internal load capacitance (

4 pF) f i

= input frequency

V oc(p-p)

= cathode output voltage (peak-to-peak value)

δ

= non-blanking duty factor.

The TDA6108AJF must be mounted on the picture tube base print to minimize the load capacitance.

9397 750 14729

Product data sheet Rev. 03 — 20 April 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

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Philips Semiconductors

TDA6108AJF

Triple video output amplifier

11. Test information

V i(1) 1

R i

9

V oc(1)

C7

20 nF

C8

10

µ

F

V

DD

C1 J1

22

µ

F

C2

22 nF

R f

1

V of

I om

6

R a

C10

6.8 pF

R1

2 M

C9

3.2 pF

C11

136 pF

R2

100 k

Ω probe 1

C3

22

µ

F

C4

J2

22 nF

V i(2) 2

R i

R a

R f

2

V of

I om

8

V oc(2)

R f

3

V of

C13

6.8 pF

R3

2 M

C12

3.2 pF

C14

136 pF

R4

100 k

Ω probe 2

C5

J3

22

µ

F

C6

22 nF

V i(3) 3

R i

7

V oc(3)

R a

C16

6.8 pF

R5

2 M

C15

3.2 pF

C17

136 pF

R6

100 k

Ω probe 3

VIP

REFERENCE

5

I om

TDA6108AJF

GND

4

V om

4 V mce464

Current sources J1, J2 and J3 must be adjusted so that the DC output voltage of pins V oc(1)

, V oc(2) and V oc(3) is set to 100 V.

Fig 9.

Test circuit

11.1 Quality information

The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.

9397 750 14729

Product data sheet Rev. 03 — 20 April 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

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Philips Semiconductors

12. Package outline

DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads

D

TDA6108AJF

Triple video output amplifier

SOT111-1

P

D

1 q

P

1 Q

A

2 q

1 q

2

A

3

A

A

4

E pin 1 index

Z

1 b

2 e

9 b b

1 w

M

L c e

2

θ

0 5 scale

10 mm

DIMENSIONS (mm are the original dimensions)

UNIT A

A

2 max.

A

3

A

4 b b

1 b

2 mm

18.5

17.8

3.7

8.7

8.0

15.5

15.1

1.40

1.14

0.67

0.50

1.40

1.14

c

0.48

0.38

D

(1)

D

1

E

(1) e e

2

21.8

21.4

21.4

20.7

6.48

6.20

2.54

2.54

L P

3.9

3.4

2.75

2.50

P

1

Q q q

1

3.4

3.2

1.75

1.55

15.1

14.9

4.4

4.2

q

2

5.9

5.7

w

0.25

Z

(1) max.

1

θ

65 o

55 o

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

SOT111-1

IEC

REFERENCES

JEDEC JEITA

EUROPEAN

PROJECTION

ISSUE DATE

95-03-11

03-03-12

Fig 10. Package outline SOT111-1 (DBS9MPF)

9397 750 14729

Product data sheet Rev. 03 — 20 April 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

12 of 16

Philips Semiconductors

TDA6108AJF

Triple video output amplifier

13. Handling information

Inputs and outputs are protected against electrostatic discharge in normal handling.

However, to be completely safe, it is desirable to take normal precautions appropriate to handling integrated circuits.

14. Soldering

14.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.

14.2 Soldering by dipping or by solder wave

Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from

3 seconds to 4 seconds at 250

°

C or 265

°

C, depending on solder material applied, SnPb or Pb-free respectively.

The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg(max)

). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

14.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300

°

C it may remain in contact for up to 10 seconds. If the bit temperature is between 300

°

C and 400

°

C, contact may be up to 5 seconds.

14.4 Package related soldering information

Table 6: Suitability of through-hole mount IC packages for dipping and wave soldering methods

Package

CPGA, HCPGA

DBS, DIP, HDIP, RDBS, SDIP, SIL

PMFP [2]

Soldering method

Dipping

− suitable

Wave suitable suitable [1] not suitable

[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

[2] For PMFP packages hot bar soldering or manual soldering is suitable.

9397 750 14729

Product data sheet Rev. 03 — 20 April 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

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TDA6108AJF

Triple video output amplifier

15. Revision history

Table 7: Revision history

Document ID

TDA6108AJF_3

Modifications:

Release date Data sheet status Change notice Doc. number Supersedes

20050420 Product data sheet 9397 750 14729 TDA6108AJF_2

The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors

TDA6108AJF_2

Modifications:

TDA6108AJF_1

040630 Preliminary specification

Preliminary specification

9397 750 13498 TDA6108AJF_1

In Features: change of slew rate

In Limiting values; change to ESD

In Characteristics; change of value for output measurement pin

In Characteristics; change of value for slew rate and cathode output rise time

030919 9397 750 11633 -

9397 750 14729

Product data sheet Rev. 03 — 20 April 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

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TDA6108AJF

Triple video output amplifier

16. Data sheet status

I

Level Data sheet status [1]

Objective data

Product status [2] [3]

Development

II

III

Preliminary data

Product data

Qualification

Production

Definition

This data sheet contains data from the objective specification for product development. Philips

Semiconductors reserves the right to change the specification in any manner without notice.

This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.

This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).

[1] Please consult the most recently issued data sheet before initiating or completing a design.

[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

17. Definitions

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

18. Disclaimers

Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process

Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

19. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales office addresses, send an email to: [email protected]

9397 750 14729

Product data sheet Rev. 03 — 20 April 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

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20. Contents

1

2

3

4

5

5.1

5.2

6

7

8

8.1

9

10

10.1

10.2

10.3

10.4

11

11.1

12

13

14

14.1

16

17

18

19

14.2

14.3

14.4

15

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ordering information . . . . . . . . . . . . . . . . . . . . . 1

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pinning information . . . . . . . . . . . . . . . . . . . . . . 3

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Thermal characteristics. . . . . . . . . . . . . . . . . . . 5

Thermal protection . . . . . . . . . . . . . . . . . . . . . . 5

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Application information. . . . . . . . . . . . . . . . . . . 9

Flashover protection . . . . . . . . . . . . . . . . . . . . . 9

Switch-off behavior . . . . . . . . . . . . . . . . . . . . . 10

Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Test information . . . . . . . . . . . . . . . . . . . . . . . . 11

Quality information . . . . . . . . . . . . . . . . . . . . . 11

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12

Handling information. . . . . . . . . . . . . . . . . . . . 13

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . 13

Soldering by dipping or by solder wave . . . . . 13

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13

Package related soldering information . . . . . . 13

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Contact information . . . . . . . . . . . . . . . . . . . . 15

TDA6108AJF

Triple video output amplifier

© Koninklijke Philips Electronics N.V. 2005

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Date of release: 20 April 2005

Document number: 9397 750 14729

Published in The Netherlands

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