Sick SIM4000 Sensor Integration Machine Operating instructions

Sick SIM4000 Sensor Integration Machine Operating instructions
OPERATING INSTRUCTIONS
SIM4000
Sensor Integration Machine
Described product
SIM4000
Manufacturer
SICK AG
Erwin-Sick-Str. 1
79183 Waldkirch
Germany
Legal information
This work is protected by copyright. Any rights derived from the copyright shall be
reserved for SICK AG. Reproduction of this document or parts of this document is only
permissible within the limits of the legal determination of Copyright Law. Any modifica‐
tion, abridgment or translation of this document is prohibited without the express writ‐
ten permission of SICK AG.
The trademarks stated in this document are the property of their respective owner.
© SICK AG. All rights reserved.
Original document
This document is an original document of SICK AG.
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CONTENTS
Contents
1
2
3
About this document........................................................................
5
1.1
Information on the operating instructions..............................................
5
1.2
1.3
1.4
Explanation of symbols............................................................................
Further information...................................................................................
Customer service......................................................................................
5
6
6
Safety information............................................................................
7
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
7
7
7
8
8
8
9
9
Product description........................................................................... 11
3.1
3.2
3.3
3.4
4
14
14
14
Overview of mounting procedure.............................................................
Scope of delivery.......................................................................................
Preparing for mounting.............................................................................
Mounting the SIM4000............................................................................
Mounting the SIM4000 (at a critical ambient temperature of max.
50 °C)........................................................................................................
15
15
15
16
17
Important information..............................................................................
Preparing the electrical installation.........................................................
Assembling the cables (optional)............................................................
Pin allocation of the connections............................................................
Connecting peripheral devices................................................................
Connecting voltage supply.......................................................................
20
20
20
22
28
29
Commissioning.................................................................................. 30
7.1
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Transport...................................................................................................
Transport inspection.................................................................................
Storage......................................................................................................
Electrical installation........................................................................ 20
6.1
6.2
6.3
6.4
6.5
6.6
7
11
11
12
13
Mounting............................................................................................. 15
5.1
5.2
5.3
5.4
5.5
6
Device view................................................................................................
Functionality..............................................................................................
Product features and functions...............................................................
Preset Ethernet interfaces.......................................................................
Transport and storage....................................................................... 14
4.1
4.2
4.3
5
General safety notes................................................................................
Intended use.............................................................................................
Improper use.............................................................................................
IP technology.............................................................................................
Limitation of liability.................................................................................
Modifications and conversions................................................................
Requirements for skilled persons and operating personnel..................
Operational safety and particular hazards..............................................
Preparatory commissioning.....................................................................
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30
3
CONTENTS
8
Operation............................................................................................ 31
8.1
9
Cleaning.....................................................................................................
Maintenance.............................................................................................
Features....................................................................................................
Interfaces..................................................................................................
Mechanics and electronics......................................................................
Ambient data.............................................................................................
37
37
38
39
Annex.................................................................................................. 41
12.1 Dimensional drawings..............................................................................
12.2 Licenses....................................................................................................
4
36
Technical data.................................................................................... 37
11.1
11.2
11.3
11.4
12
35
35
Decommissioning............................................................................. 36
10.1 Disposal.....................................................................................................
11
31
Maintenance...................................................................................... 35
9.1
9.2
10
Status LEDs...............................................................................................
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ABOUT THIS DOCUMENT 1
1
About this document
1.1
Information on the operating instructions
These operating instructions provide important information on how to use devices from
SICK AG.
Prerequisites for safe work are:
•
•
Compliance with all safety notes and handling instructions supplied.
Compliance with local work safety regulations and general safety regulations for
device applications
The operating instructions are intended to be used by qualified personnel and electrical
specialists.
NOTE
Read these operating instructions carefully before starting any work on the device, in
order to familiarize yourself with the device and its functions.
The instructions constitute an integral part of the product and are to be stored in the
immediate vicinity of the device so they remain accessible to staff at all times. Should
the device be passed on to a third party, these operating instructions should be handed
over with it.
These operating instructions do not provide information on operating the machine or
system in which the device is integrated. For information about this, refer to the operat‐
ing instructions of the specific machine.
1.2
Explanation of symbols
Warnings and important information in this document are labeled with symbols. The
warnings are introduced by signal words that indicate the extent of the danger. These
warnings must be observed at all times and care must be taken to avoid accidents, per‐
sonal injury, and material damage.
DANGER
… indicates a situation of imminent danger, which will lead to a fatality or serious inju‐
ries if not prevented.
WARNING
… indicates a potentially dangerous situation, which may lead to a fatality or serious
injuries if not prevented.
CAUTION
… indicates a potentially dangerous situation, which may lead to minor/slight injuries if
not prevented.
NOTICE
… indicates a potentially harmful situation, which may lead to material damage if not
prevented.
NOTE
… highlights useful tips and recommendations as well as information for efficient and
trouble-free operation.
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5
1 ABOUT THIS DOCUMENT
1.3
Further information
NOTE
All the documentation available for the device can be found on the online product page
at:
b
www.sick.com/SIM4000
The following information is available for download there:
•
•
•
•
•
•
1.4
Model-specific online data sheets for device variants, containing technical data,
dimensional drawings and diagrams
EU declaration of conformity for the product family
Dimensional drawings and 3D CAD dimension models in various electronic for‐
mats
These operating instructions, available in English and German, and in other lan‐
guages if necessary
Other publications related to the devices described here
Publications dealing with accessories
Customer service
If you require any technical information, our customer service department will be happy
to help. To find your representative, see the final page of this document.
NOTE
Before calling, make a note of all type label data such as type code, serial number, etc.,
to ensure faster processing.
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SAFETY INFORMATION 2
2
Safety information
2.1
General safety notes
The following safety notes must always be observed regardless of specific application
conditions:
•
•
•
•
•
•
•
•
•
2.2
The device must only be mounted, commissioned, operated, and maintained by
professionally qualified safety personnel.
Electrical connections with peripheral devices must only be made when the volt‐
age supply is disconnected.
The device is only to be operated when mounted in a fixed position.
The device voltage supply must be protected in accordance with the specifications.
The specified ambient conditions must be observed at all times.
The electrical connections to peripheral devices must be screwed on correctly.
The cooling fins must not be covered or restricted in their functionality.
The pin assignment of pre-assembled cables must be checked and adjusted if
necessary.
These operating instructions must be made available to the operating personnel
and kept ready to hand.
Intended use
The device is a programmable control and evaluation unit for sensors and image proc‐
essing devices. The device also acts as a link between system and plant controls, and
the connected terminal devices. The device is mainly used in an industrial environment
in production, testing, and control. Other applications are possible depending on the
device-specific properties.
The device is programmed on a PC by using the development environment software
SICK AppSpace. Depending on the application, a browser-based, graphical user inter‐
face (HMI) can be created, which provides opportunities defined by the application
developer to influence an application at operator level.
The device connection to the peripherals is established by means of a range of indus‐
trial fieldbuses and other interfaces.
The device offers various interfaces for controlling, programming, and operating pur‐
poses, which can be activated as necessary via development environments, control sys‐
tems (programmable logic controllers), or applications.
However, configuration, programming, and control requires various technical skills,
depending on how the device is connected and used.
2.3
Improper use
Any use outside of the stated areas, in particular use outside of the technical specifica‐
tions and the requirements for intended use, will be deemed to be incorrect use.
•
•
•
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The device does not constitute a safety-relevant device according to the EC Machi‐
nery Directive (2006/42/EC).
The device must not be used in explosion-hazardous areas, in corrosive environ‐
ments or under extreme environmental conditions.
Any use of accessories not specifically approved by SICK AG is at your own risk.
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2 SAFETY INFORMATION
WARNING
Danger due to improper use!
Any improper use can result in dangerous situations.
Therefore, observe the following information:
■
■
2.4
Device should be used only in accordance with its intended use.
All information in these operating instructions must be strictly observed.
IP technology
NOTE
SICK uses standard IP technology in its products. The emphasis is placed on availability
of products and services.
SICK always assumes the following prerequisites:
•
•
2.5
The customer ensures the integrity and confidentiality of the data and rights
affected by its own use of the aforementioned products.
In all cases, the customer implements the appropriate security measures, such as
network separation, firewalls, virus protection, and patch management.
Limitation of liability
Applicable standards and regulations, the latest state of technological development,
and our many years of knowledge and experience have all been taken into account
when assembling the data and information contained in these operating instructions.
The manufacturer accepts no liability for damage caused by:
■
■
■
■
■
■
Failing to observe the operating instructions
Incorrect use
Use by untrained personnel
Unauthorized conversions
Technical modifications
Use of unauthorized spare parts, consumables, and accessories
With special variants, where optional extras have been ordered, or owing to the latest
technical changes, the actual scope of delivery may vary from the features and illustra‐
tions shown here.
2.5.1
Programmable device
The Sensor Integration Machine (SIM) is a programmable device.
Therefore the respective programmer is responsible for his/her programming perform‐
ance and the resulting working principle of the device.
The liability and warranty of SICK AG is limited to the device specification (hardware
functionality and any programming interfaces) according to the agreed conditions.
Therefore, SICK AG is not liable, among other things, for damages that are caused by
programming of the customer or third parties.
2.6
Modifications and conversions
NOTICE
Modifications and conversions to the device may result in unforeseeable dangers.
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SAFETY INFORMATION 2
Interrupting or modifying the device or SICK software will invalidate any warranty claims
against SICK AG. This applies in particular to opening the housing, even as part of
mounting and electrical installation.
2.7
Requirements for skilled persons and operating personnel
WARNING
Risk of injury due to insufficient training.
Improper handling of the device may result in considerable personal injury and material
damage.
■
All work must only ever be carried out by the stipulated persons.
The operating instructions state the following qualification requirements for the various
areas of work:
■
■
■
Instructed personnel have been briefed by the operator about the tasks assigned
to them and about potential dangers arising from improper action.
Skilled personnel have the specialist training, skills, and experience, as well as
knowledge of the relevant regulations, to be able to perform tasks delegated to
them and to detect and avoid any potential dangers independently.
Electricians have the specialist training, skills, and experience, as well as knowl‐
edge of the relevant standards and provisions to be able to carry out work on elec‐
trical systems and to detect and avoid any potential dangers independently. In Ger‐
many, electricians must meet the specifications of the BGV A3 Work Safety Regu‐
lations (e.g. Master Electrician). Other relevant regulations applicable in other
countries must be observed.
The following qualifications are required for various activities:
Table 1: Activities and technical requirements
Activities
Mounting, maintenance
Qualification
■
■
Electrical installation,
device replacement
■
■
■
Commissioning, configura‐
tion
■
■
■
Operation of the device for
the particular application
■
■
2.8
Basic practical technical training
Knowledge of the current safety regulations in the workplace
Practical electrical training
Knowledge of current electrical safety regulations
Knowledge of the operation and control of the devices in
their particular application
Basic knowledge of the WindowsTM operating system in use
Basic knowledge of the design and setup of the described
connections and interfaces
Basic knowledge of data transmission
Knowledge of the operation and control of the devices in
their particular application
Knowledge of the software and hardware environment for
the particular application
Operational safety and particular hazards
Please observe the safety notes and the warnings listed here and in other chapters of
these operating instructions to reduce the possibility of risks to health and avoid dan‐
gerous situations.
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2 SAFETY INFORMATION
WARNING
Electrical voltage!
Electrical voltage can cause severe injury or death.
b
b
b
b
b
Work on electrical systems must only be performed by qualified electricians.
The power supply must be disconnected when attaching and detaching electrical
connections.
The sensor must only be connected to a voltage source as set out in the require‐
ments in the operating instructions.
National and regional regulations must be complied with.
Safety requirements relating to work on electrical systems must be complied with.
WARNING
Dangerous equipotential bonding currents!
Improper grounding can lead to dangerous equipotential bonding currents, which may
in turn lead to dangerous voltages on metallic surfaces, such as the housing. Electrical
voltage can cause severe injury or death.
b
b
b
2.8.1
Work on electrical systems must only be performed by qualified electricians.
Follow the notes in the operating instructions.
Install the grounding for the sensor and the system in accordance with national
and regional regulations.
LED RG0
The product is fitted with LEDs in risk group 0. The accessible radiation from these
LEDs does not pose a danger to the eyes or skin.
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PRODUCT DESCRIPTION 3
3
Product description
3.1
Device view
3
1
2
4
à
5
6
7
á
8
9
â
ß
3.2
1
I/O connection
2
POWER main and CAN voltage supply
3
Status indicators of the voltage supply
4
Connections for 1–2 incremental encoders with 1–2 status indicators
5
1–2 serial connections with 1–2 status indicators
6
1–2 fieldbus connections with 1–2 status indicators
7
1–2 CAN connections with 1–2 status indicators
8
1–8 sensor connections with S1–S8 status indicators
9
1–8 Ethernet connections with 1–8 status indicators
ß
Functional ground connection
à
Device status indicators
á
Servicing panel: function button, function selector switch, USB connection (for configura‐
tion/diagnostics)
â
Status indicators of Ethernet connections
Functionality
The SIM4000 Sensor Integration Machine – part of the SICK AppSpace ecosystem – is
opening up new possibilities for application solutions.
Data from SICK sensors such as laser scanners and cameras can be merged into a
point cloud, evaluated, archived, and transmitted. 8 Gigabit Ethernet interfaces are
available for 2D or 3D cameras, and in some cases feature a voltage supply over Ether‐
net (PoE).
Sensors can be integrated via IO-Link for distance and height measuring purposes.
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3 PRODUCT DESCRIPTION
Thanks to the high-performance multi-core processor featuring hardware support, the
SIM4000 enables image preprocessing and handling of input and output signals in real
time.
The integrated HALCON image processing library, plus the open SICK AppSpace soft‐
ware platform, make it possible to develop customized application programs for even
the most demanding 2D and 3D vision applications.
The SIM4000 is equipped with industrial-standard, Ethernet-based fieldbus interfaces
and can also be integrated into a SICK CAN sensor network. The HMI and data visuali‐
zation features can be provided on any browser-enabled notebook, PC, or tablet.
The app is developed in the SDKs SICK AppStudio and in HDevelop from MVTec.
3.3
Product features and functions
3.3.1
Functions
Figure 1: Application examples
The device as part of the SICK AppSpace ecosystem is opening up new possibilities for
application solutions.
Data from SICK sensors and cameras can be merged into a point cloud, evaluated,
archived, and transmitted. 8 GigE interfaces are available and in some cases with PoE.
Sensors can be integrated via IO-Link for distance and height measuring purposes.
Thanks to the powerful multi-core CPU with co-processors for image preprocessing and
I/O handling in real time, the device is able to find solutions for sophisticated image
processing tasks by using the HALCON library as well as SICK tools.
Features:
•
•
•
•
•
•
•
•
12
6 x GigE with PoE to connect to 2D/3D cameras as well as a network or PC
2 x 10 GigE to connect to 10 GigE cameras and to quickly archive sensor or proc‐
ess data with high data volume
Real-time-capable hardware architecture with precise synchronization of I/O sig‐
nals
4 x serial/encoder interfaces
2 x Ethernet-based fieldbus interfaces
Integrated illumination control and supply
4 x IO-Link master connections
Housing with IP65 enclosure rating
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PRODUCT DESCRIPTION 3
•
•
Support for two SICK CAN networks with voltage supply to the sensors connected
to the CAN interfaces
S1 to S8 sensor connections with switchable and electronically monitored LPS
(Low Power Supply) pins
Benefits:
•
•
•
•
•
•
3.3.2
Tailored application development with SICK AppSpace
High-performance, innovative application solutions thanks to the merging of sen‐
sor and camera data
Integrated HALCON library opens up a whole host of image processing possibilities
for every industrial field of application
Multi-sensor/camera-based data recording and archiving enable quality control,
process analysis, and predictive maintenance for vertical integration in Industry
4.0
Real-time-capable hardware reduces integration work in, for example, time-critical
robotics applications
Quick and easy commissioning thanks to prefabricated cables
SICK AppSpace
Detailed instructions on the SICK AppStudio as well as programming the device can be
found at https://supportportal.sick.com.
3.4
Preset Ethernet interfaces
NOTE
Preset IP addresses of the ETHERNET interfaces:
•
•
•
•
•
•
•
•
ETHERNET 1: 192.168.0.1
ETHERNET 2: 192.168.1.1
ETHERNET 3: 192.168.2.1
ETHERNET 4: 192.168.3.1
ETHERNET 5: 192.168.4.1
ETHERNET 6: 192.168.5.1
ETHERNET 7: 192.168.6.1
ETHERNET 8: 192.168.7.1
•
The Ethernet interfaces 7 and 8 are 10 GigE ports and cannot be operated in 1
GigE mode.
When expanding the 1 GigE interfaces with one or more Ethernet switches, it is
essential to use only jumbo-frame compatible 1 GigE switches. Switches limited to
just 100 Mb do not support the data packet mode used by cameras and can
cause transmission errors.
•
Changing the IP addresses
The individual IP addresses can be changed using the SICK “SOPAS-ET” PC tool. This is
described in detail in the “SIM4000 Getting Started Guide”, which is available for down‐
load from the AppSpace area of the SICK Support Portal. This guide also includes fur‐
ther instructions on how to connect SICK sensors and the SICK picoCam and midiCam
cameras to the Ethernet interfaces.
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4 TRANSPORT AND STORAGE
4
Transport and storage
4.1
Transport
For your own safety, please read and observe the following notes:
NOTICE
Damage to the product due to improper transport.
■
■
■
■
■
■
4.2
The device must be packaged for transport with protection against shock and
damp.
Recommendation: Use the original packaging as it provides the best protection.
Transport should be performed by trained specialist staff only.
The utmost care and attention is required at all times during unloading and trans‐
portation on company premises.
Note the symbols on the packaging.
Do not remove packaging until immediately before you start mounting.
Transport inspection
Immediately upon receipt in Goods-in, check the delivery for completeness and for any
damage that may have occurred in transit. In the case of transit damage that is visible
externally, proceed as follows:
■
■
■
Do not accept the delivery or only do so conditionally.
Note the scope of damage on the transport documents or on the transport compa‐
ny's delivery note.
File a complaint.
NOTE
Complaints regarding defects should be filed as soon as these are detected. Damage
claims are only valid before the applicable complaint deadlines.
4.3
Storage
Store the device under the following conditions:
■
■
■
■
■
■
■
■
■
14
Recommendation: Use the original packaging.
Do not store outdoors.
Store in a dry area that is protected from dust.
So that any residual damp can evaporate, do not package in airtight containers.
Do not expose to any aggressive substances.
Protect from sunlight.
Avoid mechanical shocks.
Storage temperature: see "Technical data", page 37.
For storage periods of longer than 3 months, check the general condition of all
components and packaging on a regular basis.
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MOUNTING 5
5
Mounting
5.1
Overview of mounting procedure
NOTE
The mounting procedure described here for the device meets the requirements for use
in the target system.
Additional or different requirements may become necessary in the laboratory and dur‐
ing preparation, and should be taken into account as necessary, see "Commissioning",
page 30. If you have any questions or anything remains unclear in this regard, please
contact our service team.
•
•
•
•
•
5.2
Mounting the bracket, if provided.
Mounting the device.
Assembling and laying cables.
Connecting peripheral devices.
Connecting the voltage supply.
Scope of delivery
•
•
•
•
•
•
SIM4000
1x grounding screw
1x toothed lock washer
6x sliding nuts
Safety note
Optional: ordered accessories
NOTE
For a list of cables suitable for use with the device, see: https://supportpor‐
tal.sick.com.
5.3
Preparing for mounting
Mounting requirements
NOTE
It is recommended to mount the device using the adapter holding plate (part no.
2083419) which is available as an accessory. The following specific mounting instruc‐
tions must be taken into consideration if the device will be used at elevated ambient
temperatures up to max. 50 °C, see "Mounting the SIM4000 (at a critical ambient tem‐
perature of max. 50 °C)", page 17.
•
•
•
Select the mounting site: Plan space requirements and sufficient distance from
other devices. Be aware of the possibility of heat dissipation.
Unpack the device and allow to acclimatise to avoid formation of condensation.
Prepare vibration reduction measures, if necessary.
Preparing for mounting with holding plate
NOTE
The device can also be mounted onto an aluminum profile without holes.
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15
5 MOUNTING
1.
2.
3.
5.4
Place the holding plate at the mounting site.
Mark the mounting holes.
Proceed to drill the mounting holes.
Mounting the SIM4000
Mounting the SIM4000 with the adapter holding plate, available as an accessory
16
1.
2.
Mount the holding plate on SIM4000 using the supplied screws.
Place SIM4000 with the holding plate on the mounting site.
3.
Secure the holding plate by tightening the 3 screws.
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MOUNTING 5
4.
Alternatively: Pre-mount the 4 screws for suspended mounting and mount the
holding plate with the device.
NOTICE
Use self-locking or lock nuts on mounting sites that are exposed to vibrations to
prevent the holding plate from loosening.
5.5
Mounting the SIM4000 (at a critical ambient temperature of max. 50 °C)
NOTICE
To prevent damage to the device or the attached peripheral devices at high ambient
temperatures of a maximum of 50 °C, the following extended installation conditions
must be taken into account when mounting the device.
Prerequisites:
•
•
•
•
•
Device is mounted vertically (device name on top)
Mounting takes place using the supplied sliding nuts and the holding plate, which
is available as an accessory
Aluminum profiles for mounting on the system (min. 1,200 mm in length)
No direct sunlight and heat radiation
Distance to other components or housing walls: min. 400 mm (above, below, to
the left), min. 500 mm (on the heat-sink side)
Degradation of ambient temperature
Depending on the following device configurations, degradation of the permitted ambi‐
ent temperature must be taken into account:
•
•
•
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CPU load ≥75% (can be read using SICK AppStudio)
PoE load ≥25 W (load of attached camera)
Load at voltage/switching outputs ≥100 W
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5 MOUNTING
Ambient temperature [°C]
60
50
40
30
20
10
0
0
20
40
60
CPU load [%]
80
100
120
Figure 2: Degradation of ambient temperature depending on the CPU capacity
60
Ambient temperature [°C]
50
40
30
20
10
0
0
10
20
30
40
50
Load PoE [W]
60
70
80
Figure 3: Degradation of ambient temperature depending on the PoE load
Ambient temperature [°C]
60
50
40
30
20
10
0
0
50
100
150
200
250
Load voltage outputs [W]
300
350
Figure 4: Degradation of ambient temperature depending on the load on the voltage outputs
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MOUNTING 5
Mounting steps
1.
Click the three sliding nuts into place into each of the vertical slots.
2.
3.
Screw the holding plate (or equivalent) to the sliding nuts with 6 screws.
Fit the device with the holding plate on the aluminum profile.
CAUTION
Danger from hot surfaces
An ambient temperature greater than 45 °C can lead to contact-critical heat in the lat‐
eral heat sink. It must be therefore be ensured that accidental contact is unlikely.
NOTE
Using an external fan (part number 2089755), the maximum ambient operating tem‐
perature of the device can be increased from +50 ° C to +60 °C. The fan is available
as an accessory at www.sick.com.
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19
6 ELECTRICAL INSTALLATION
6
Electrical installation
6.1
Important information
WARNING
Risk of injury and damage caused by electrical current!
Due to equipotential bonding currents, incorrect grounding can lead to the following
dangers and faults: Voltage is applied to the metal housing, cable fires due to cable
shields heating up, the product and other devices become damaged.
b
b
Generate the same ground potential at all grounding points.
Ground the equipotential bonding via the functional ground connection with a low
impedance (use standard cable lug with M4 hole).
NOTICE
Risk of damage to the device due to incorrect supply voltage
An incorrect supply voltage may result in damage to the device.
b
b
Only operate the device with the specified supply voltage.
All circuits connected to the device must be designed as SELV circuits (in accord‐
ance with EN 60950 or ES1 EN 62368-1).
NOTE
Layout of data cables
■
■
■
■
6.2
Use screened data cables with twisted-pair wires.
Implement the screening design correctly and completely.
To avoid interference, e.g. from switching power supplies, motors, clocked drives,
and contactors, always use cables and layouts that are suitable for EMC.
Do not lay cables over long distances in parallel with power supply cables and
motor cables in cable channels.
Preparing the electrical installation
To carry out the electrical installation, you will need:
•
•
•
6.3
Connection cables for the peripheral devices, including the corresponding data
sheets
Voltage supply cable
If customers assemble the cables: crimping tool, ferrules, soldering iron, and other
installation material
Assembling the cables (optional)
NOTE
Customer assembly of the cables is only necessary in special cases. SICK offers a large
range of pre-assembled cables at www.sick.com.
Depending on the peripheral devices to be connected and the connecting interface
used, various connection cables must be assembled before installing the device.
Ensure that you plan a sufficient length of cable for strain-relief clamps, for example.
20
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ELECTRICAL INSTALLATION 6
NOTICE
Risk of damage/malfunction due to incorrect PIN assignment
Incorrect wiring of the male connectors/female connectors can lead to damage to or
malfunctions in the system.
b
b
Observe data sheets provided by the cable manufacturer.
Observe the pin assignment.
Overview of connections
1
2
3
4
5
6
7
8
9
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1
I/O: Universal input/output with seven configurable inputs/outputs and four opto-decou‐
pled inputs.
2
POWER IN: Voltage supply input. Up to 4 x 24 V @ 8 A can be connected, whereby the
main supply is available at both male connectors.
3
INC: 1 x RS-422 or 1 x INC In/Out and a 0.5 A LPS voltage supply are available for each
connection to peripherals
4
SERIAL: 1 x RS-232/RS-422/RS-485 or 1 x INC In/Out and one 1 A LPS voltage supply
are available for each connection to peripherals
5
FBUS: Two Ethernet-based fieldbus interfaces.
O P E R A T I N G I N S T R U C T I O N S | SIM4000
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6 ELECTRICAL INSTALLATION
6
CAN: Two standard CAN receivers/transceivers with one termination resistor per channel,
can be activated via software. A 3.4 A LPS voltage supply is available for each connection
to peripherals. To enable voltage supply to the peripherals, both PowerIn CAN voltage sup‐
ply strands must be connected to 24 V.
7
SENSOR 1-4: 4 sensor connections with digital inputs/outputs and voltage supply. Can be
alternatively used as IO-Link master connections. A switchable 1 A LPS voltage supply is
available for each connection to connected peripherals.
8
SENSOR 5-8: Four IO connections with two configurable inputs/outputs and one dedi‐
cated input. A 2.5 A LPS voltage supply is available for each connection to peripherals. To
enable voltage supply to the peripherals, both PowerIn main voltage supply strands must
be connected to 24 V.
9
ETHERNET: Six 1 Gigabit Ethernet with switchable 15 W PoE and two 10 Gbit Ethernet. To
enable PoE voltage supply, both PowerIn main voltage supply strands must be connected
to 24 V.
6.4
Pin allocation of the connections
6.4.1
POWER In main/CAN
1
4
2
3
Figure 5: POWER In main/CAN pin assignment, M12 – 4-pin T-coded, male
Table 2: M12 – 4-pin (main, male)
Pin
Signal
Color coding of openended SIM cables1
Function
1
+24 V Us
BN (brown)
Supply voltage, system
2
GND Ua
WH (white)
Ground
3
GND Us
BU (blue)
Ground
4
24 V Ua
BK (black)
Supply voltage, sensor 5–8 +
PoE
Housing
–
–
Screen
1
SICK cables in the SIM4000 accessories
Table 3: M12 – 4-pin (male)
Pin
Signal
Color coding of openended SIM cables1
Function
1
+24 V Us
BN (brown)
Supply voltage, system
2
GND Ua
WH (white)
Ground
3
GND Us
BU (blue)
Ground
4
24 V Ua
BK (black)
Supply voltage, CAN
Housing
–
–
Screen
1
SICK cables in the SIM4000 accessories
Additional notes:
•
•
•
•
22
Max. 7.5 A permanent load per connection
24 V supply voltage ±10%
Maximum power consumption for SIM4000: 70 W
Maximum power output of all connections: 300 W
O P E R A T I N G I N S T R U C T I O N S | SIM4000
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ELECTRICAL INSTALLATION 6
•
•
6.4.2
System supply voltage can be set up redundantly.
Power cables must be protected with max. 12 A.
I/O
2
12 3
13
1
11
10
16
9 8
4
5
14
6
17
15 7
Figure 6: I/O pin assignment, M12 – 17-pin A-coded, female
Table 4: M12 – 17-pin (female)
Pin
Signal
Function
Factory settings
Color coding of
open-ended SIM
I/O cables1
1
GND
Ground
–
BU (blue)
2
24 V OUT
Supply voltage, peripherals Deactivated
3
In/Out 1
Configurable switching
input/output
4
In/Out 2
Configurable switching
input/output
5
In/Out 3
Configurable switching
input/output
PK (pink)
6
In/Out 4
Configurable switching
input/output
YE (yellow)
7
In/Out 5
Configurable switching
input/output
BK (black)
8
In/Out 6
Configurable switching
input/output
GY (gray)
9
In/Out 7
Configurable switching
input/output
WHBK (white/
black)
10
In 1
Isolated switching input
–
VT (violet)
11
SensGND 1
Isolated GND In 1
–
GYPK (gray/pink)
12
In 2
Isolated switching input
–
RDBU (red/blue)
13
SensGND 2
Isolated GND In 2
–
WHGN (white/
green)
14
In 3
Isolated switching input
–
BNGN (brown/
green)
15
SensGND 3
Isolated GND In 3
–
WHYE (white/
yellow)
16
In 4
Isolated switching input
–
YEBN (yellow/
brown)
17
SensGND 4
Isolated GND In 4
–
WHGY (white/
gray)
Screen
–
Housing –
1
BN (brown)
All IO connections GN (green)
configured as
inputs
WH (white)
SICK cables in the SIM4000 accessories
Additional notes:
•
•
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Connection to control cabinet to connect devices directly
4 isolated inputs and 7 GPIO
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23
6 ELECTRICAL INSTALLATION
•
•
•
Max. 0.5 A output for supply voltage connection (compliant with LPS)
Digital outputs can be configured as inputs
Outputs:
° Max. current output: 100 mA
° Min. high output logic level: VCC – 3 V
° Max. low output logic level: 3 V
° Push/pull, NPN, PNP configurable
° Max. input frequency: 30 kHz
Inputs:
° Min. high input logic level: 12 V
° Max. low input logic level: 4 V
° In/Out 1–7: max. input frequency: 30 kHz
° In 1–4 (isolated): maximum 10 kHz
•
6.4.3
INC
5
4
6
8
3
7
2
1
Figure 7: Incremental pin assignment, M12 – 8-pin A-coded, female
Table 5: M12 – 8-pin (female)
Pin
Mode
RS-422
RS-232
RS-485
INC
1
T-
–
–
A- (in/out)
2
T+
–
–
A+ (in/out)
3
R-
–
–
B- (in/out)
4
R+
–
–
B+ (in/out)
5
–
–
–
–
6
–
–
–
–
7
GND (ground)
8
24 V (supply voltage for peripherals, configurable)
Housing
6.4.4
Screen
SERIAL
5
4
6
8
3
7
2
1
Figure 8: Serial pin assignment, M12 – 8-pin A-coded, female
Table 6: M12 – 8-pin (female)
Pin
Mode
RS-422
24
RS-232
RS-485
INC
1
–
–
–
A- (in/out)
2
–
–
–
A+ (in/out)
3
T-
–
Rx/Tx-
B- (in/out)
4
T+
TxD
Rx/Tx+
B+ (in/out)
O P E R A T I N G I N S T R U C T I O N S | SIM4000
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ELECTRICAL INSTALLATION 6
Pin
Mode
RS-422
RS-232
RS-485
INC
5
R-
–
–
–
6
R+
RxD
–
–
7
GND (ground)
8
24 V (supply voltage for peripherals, configurable)
Housing
6.4.5
Screen
FBUS
3
4
1
2
Figure 9: Fieldbus pin assignment, M12 – 4-pin D-coded, female
Table 7: M12 – 4-pin D-coded (female)
Pin
Signal
Function
1
TD+ (TX1_P)
Transmit data +
2
RD+ (RX1_P)
Receive data +
3
TD- (TX1_N)
Transmit data -
4
RD- (RX1_N)
Receive data -
Housing
Screen
Additional notes:
•
•
•
6.4.6
Designed for line topology
Data transmission rates: 10/100 Mbit/s
ProfiNet support
CAN
3
4
5
2
1
Figure 10: CAN pin assignment, M12 – 5-pin A-coded, female
Table 8: M12 – 5-pin A-coded (female)
Pin
Signal
Function
Factory settings
1
-
Screen
2
+24 V
Supply voltage for
Deactivated
peripherals, configura‐
ble
3
GND
Ground
4
CAN_H
CAN high -
5
CAN_L
CAN low
Housing
-
Screen
Term active
Additional notes:
•
•
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Access to CANopen I/O modules
Data transmission rates from 50 Kbit/s up to 1 Mbit/s
O P E R A T I N G I N S T R U C T I O N S | SIM4000
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6 ELECTRICAL INSTALLATION
•
•
6.4.7
Max. 3.2 A output for supply voltage connections (compliant with LPS)
Internal termination through programming
SENSOR 1–4
3
4
5
2
1
Figure 11: Pin assignment of sensor 1–4, M12 – 5-pin A-coded, female
Table 9: M12 – 5-pin A-coded (female)
Pin
Signal
Function
Factory settings
1
+24 V
Supply voltage for
–
peripherals, configura‐
ble
2
DI
Input
–
3
GND
Ground
–
4
CQ or DigIn/DigOut
CQ IO-link or configu‐
rable switching input/
output
All IO connections con‐
figured as inputs
5
NC
Not connected
–
Housing
–
Screen
–
Additional notes:
•
•
•
•
•
6.4.8
4x IO-Link master (1x master available per connection)
IO-Link stack is implemented in FPGA (SoftCore)
Max. 1 A output for supply voltage connections S1 to S4 (compliant with LPS)
Switching output:
° Max. output 100 mA.
° Min. high output logic level: VCC – 3 V
° Max. low output logic level: 3 V
° Push/pull, NPN, PNP configurable
° Push/pull, NPN, PNP configurable by user
° Max. IO-Link output frequency: 230 kHz
° Max. IO output frequency: 30 kHz
Switching input:
° Min. high input logic level: 12 V
° Max. low input logic level: 4 V
° Max. IO-Link input frequency: 230 kHz
° Max. IO input frequency: 30 kHz
SENSOR 5–8
3
4
5
2
1
Figure 12: Pin assignment of sensor 5–8, M12 – 5-pin A-coded, female
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ELECTRICAL INSTALLATION 6
Table 10: M12 – 5-pin A-coded (female)
Pin
Signal
Function
1
+24 V
Supply voltage for
Deactivated
peripherals, configura‐
ble
2
IN
Input
–
3
GND
Ground
–
4
I/O 1
Configurable switching IN
input/output
5
I/O 2
Configurable switching IN
input/output
Housing
–
Screen
•
•
Factory settings
–
Max. 2.5 A output for supply voltage connections S5 to S8 (compliant with LPS)
Switching output:
° Max. output 100 mA
° Min. high output logic level: VCC – 3 V
° Max. low output logic level: 3 V
° Push/pull, NPN, PNP configurable
° Push/pull, NPN, PNP configurable by user
° Max. IO output frequency: 30 kHz
Switching input:
° Min. high input logic level: 12 V
° Max. low input logic level: 4 V
° Max. IO input frequency: 30 kHz
•
Illumination control:
•
•
•
•
•
•
•
6.4.9
Voltage supply for S5 to S8, configurable
Reference CSC illumination
Ramp up: < 10 μs
Ramp down: < 10 μs
Delay: < 10 μs
Max. frequency: 10 kHz
Max. voltage supply: 1 A
ETHERNET
4
5
6
3
2
7
1
8
Figure 13: Ethernet pin assignment, M12 – 8-pin X-coded, female
Table 11: M12 – 1 and 10 Gbit Ethernet (female)
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Pin
Function
1
D1+
2
D1-
3
D2+
4
D2-
5
D4+
6
D4-
7
D3-
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6 ELECTRICAL INSTALLATION
Pin
Function
8
D3+
Additional notes:
•
•
•
•
•
6x 1 GigE connections with configurable PoE and 2x 10 GigE connections are
available.
The GigE connections can be used to connect to cameras as well as a PC or net‐
work.
The relevant drivers are implemented in the SIM4000 to enable usage of the SICK
picoCam and midiCam camera families as well as cameras compatible with GigE
Vision.
The 10 GigE connections are intended for quick data transmission to the archive
or other host systems, as well as for connection to the relevant 10 GigE cameras.
Jumbo frame support is required.
NOTICE
When supplying connected cameras using PoE, both POWER main voltage sup‐
plies need to be connected. The total current consumption must not exceed 7.5 A
(input at 24 V Main 2).
The sine power may affect the operating temperature.
6.5
Connecting peripheral devices
The device can be connected to a wide range of sensors and cameras.
The required pin assignments can be found in the data sheets for the peripherals to be
connected as well as in the relevant connection descriptions, see "Pin allocation of the
connections", page 22.
1.
2.
3.
4.
5.
28
If necessary, assemble connection cables, see "Assembling the cables (optional)",
page 20.
Connect the cables to peripheral devices.
Route the cables to the device using installation materials (cable channels, cable
ties, etc.). When doing so, pay attention to cable strain relief.
Connect cables to the relevant device connections and screw together tightly.
Seal unused connections with dummy plugs.
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ELECTRICAL INSTALLATION 6
6.6
Connecting voltage supply
Block diagram
El Fuse
<10A
24V_Device
10Gbit Ethernet
1Gbit Ethernet
Prozessor
Unit
2X M12
Fieldbus
M12
24V IN
CAN
PTC Fuse UL Listed
0,5A
+24 V Us
24V IO Driver
EL. Fuse
(0,5A max)
+24 V Ua
Incremental Driver
EL. Fuse
(0,5A max)
Serial Driver
EL. Fuse
(1A max)
IO LINK Driver
El Fuse
<10A
24V_CAN
EL. Fuse
(3,2A max)
CAN Driver
M12
24V IN
Main
Redundatn EL. Fuse
(2,5A max)
+24 V Us
+24 V Ua
24V IO Driver
El Fuse
<10 A
M12
IO
2x M12
INC
2x M12
Serial
4x M12
Sensor 1-4
2x M12
CAN
4x M12
Sensor 5-8
24V_Sensor/P0E
6X12W POE
6x M12
Ethernet 1-6
1Gbit Ethernet
10Gbit Ethernet
2x M12
Ethernet 7-8
Figure 14: Connection to the power supply
NOTICE
Risk of damage to peripheral devices!
If peripheral devices are connected when the voltage supply is also applied, these devi‐
ces can become damaged.
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b
Only connect peripheral devices when the voltage supply is disconnected.
1.
2.
3.
4.
5.
Ensure that the voltage has been disconnected by the user.
Connect the voltage supply cable(s) to the SIM4000 and screw together tightly.
Lay the cable(s) with strain relief.
Have the user connect the voltage supply.
Have the user activate the voltage.
O P E R A T I N G I N S T R U C T I O N S | SIM4000
29
7 COMMISSIONING
7
Commissioning
7.1
Preparatory commissioning
Commissioning for preparatory purposes and under laboratory conditions differs in
some respects from commissioning in the target system.
In general, all safety and hazard warnings applicable to mounting (see "Important infor‐
mation", page 20) and electrical installation (see "Mounting", page 15) must also be
observed under laboratory conditions. In addition, further information must be taken
into consideration to guarantee the most effective preparation possible:
•
•
•
•
•
Only connect those devices to the product that you want to configure or program.
Operate the connected device in a controlled and contained network environment
for the time being to check network communication if necessary.
Note the company standards that apply to the use of checking and testing devices.
For initial programming, use ideal conditions for sensor or camera recognition.
Use the largest possible deviations from these ideal conditions to check the pro‐
gramming with respect to its error tolerance and reliability, and to determine error
limit values.
Procedure
1.
2.
3.
4.
5.
30
Place the device on a non-slip base.
Connect the required peripheral devices, see "Connecting peripheral devices",
page 28.
Connect the network connection.
Connect the voltage supply.
Switch on the voltage supply.
O P E R A T I N G I N S T R U C T I O N S | SIM4000
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OPERATION 8
8
Operation
8.1
Status LEDs
When the device is operating, the operational status of the connections is indicated vis‐
ually by status LEDs.
Using these status indicators, the operator can find out quickly and easily whether the
device and the peripherals are working properly or whether any faults or errors have
occurred.
Monitoring the visual indicators is part of the routine inspection carried out on the
device and the machine/plant area into which the device is incorporated.
8.1.1
Situation and function of the LEDs
POWER IN
Table 12: Power status LEDs
Location
Designation
LED behavior
DEVICE
SENSOR/Po
E
CAN
Description
Voltage not applied to the con‐
nection.
Voltage applied.
Under/overvoltage detected.
INC
Table 13: INC status LEDs
Location
Designation
PWR/ACT
LED behavior
Description
Voltage not applied to the con‐
nection.
Voltage applied. No signal activ‐
ity.
Voltage applied. Signal activity.
Voltage not applied to the con‐
nection. Signal activity.
Overvoltage or short-circuit
detected. No signal activity.
Overvoltage or short-circuit
detected. Signal activity.
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O P E R A T I N G I N S T R U C T I O N S | SIM4000
31
8 OPERATION
SERIAL
Table 14: SERIAL status LEDs
Location
Designation
LED behavior
PWR/ACT
Description
Voltage not applied to the con‐
nection.
Voltage applied. No signal activ‐
ity.
Voltage applied. Signal activity.
Voltage not applied to the con‐
nection. Signal activity.
Overvoltage or short-circuit
detected. No signal activity.
Overvoltage or short-circuit
detected. Signal activity.
FBUS
Table 15: FBUS status LEDs
Location
Designation
LED behavior
Link
Description
Connection not established with
fieldbus.
Connection established with
fieldbus.
Act
No activity.
Data transmission via fieldbus.
CAN
Table 16: CAN status LEDs
Location
Designation
PWR/ACT
LED behavior
Description
Voltage not applied to the con‐
nection.
Voltage applied. No signal activ‐
ity.
Voltage applied. Signal activity.
Voltage not applied to the con‐
nection. Signal activity.
Overvoltage or short-circuit
detected. No signal activity.
Overvoltage or short-circuit
detected. Signal activity.
Term
Termination resistor not acti‐
vated.
Termination resistor activated.
32
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OPERATION 8
SENSOR S1 – S8
Table 17: S1 to S8 status LEDs
Location
Designation
LED behavior
PWR/ACT
Description
Voltage not applied to the con‐
nection.
Voltage applied. No signal activ‐
ity.
Voltage applied. Signal activity.
Voltage not applied to the con‐
nection. Signal activity.
Overvoltage or short-circuit
detected. No signal activity.
Overvoltage or short-circuit
detected. Signal activity.
ETHERNET 1 – 8
Table 18: ETHERNET status LEDs
Location
Designation
Link
LED behavior
Description
Connection not established with
Ethernet.
ETH1-ETH6 only. Connection
established with Ethernet.
Act
No activity.
Data transmission via Ethernet.
PoE
Voltage supply via Ethernet.
Fault in the supply line (over‐
load, short-circuit).
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O P E R A T I N G I N S T R U C T I O N S | SIM4000
33
8 OPERATION
Device status
Table 19: Device status indicators
Location
Designation
Dev RDY
LED behavior
Indicator
Runlevel READY, no errors
detected.
Runlevel READY, boot process
error.
Device booting
34
O P E R A T I N G I N S T R U C T I O N S | SIM4000
Sys RDY
User-defined, configurable with
AppSpace.
Result
User-defined, configurable with
AppSpace.
Funct 1
User-defined, configurable with
AppSpace.
Funct 2
User-defined, configurable with
AppSpace.
Remote
Remote maintenance active.
Currently not supported.
SSD 1
Internal SSD connected.
SSD 2
Internal SSD connected.
WIFI
Currently not supported.
BLE
Currently not supported.
BF / NS
Bus error (fieldbus)
SF / MS
System error (fieldbus)
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MAINTENANCE 9
9
Maintenance
9.1
Cleaning
NOTICE
Equipment damage due to improper cleaning.
Improper cleaning may result in equipment damage.
■
■
b
9.2
Only use recommended cleaning agents.
Never use sharp objects for cleaning.
The device must be cleaned regularly from the outside to guarantee heat dissipa‐
tion and therefore operation. Particular attention must be paid to ensure that the
cooling fins are free from dust and dirt. Clean using a dry towel or an industrial
vacuum cleaner. Do not use cleaning agents.
Maintenance
During operation, the device works maintenance-free.
Depending on the assignment location, the following preventive maintenance tasks
may be required for the device at regular intervals:
Table 20: Maintenance schedule
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Maintenance work
Interval
To be carried out
by
Check that the unused connections
are sealed with blind plugs
Interval depends on ambient condi‐ Specialist
tions and climate. Recommended: At
least every 6 months.
O P E R A T I N G I N S T R U C T I O N S | SIM4000
35
10 DECOMMISSIONING
10
Decommissioning
10.1
Disposal
CAUTION
Risk of injury due to hot device surface.
The surface of the device can become hot during operation.
b
Before commencing disassembly, switch off the device and allow it to cool down
as necessary.
Any device which can no longer be used must be disposed of in an environmentally
friendly manner in accordance with the applicable country-specific waste disposal regu‐
lations. Do not dispose of the product along with household waste.
NOTICE
Danger to the environment due to improper disposal of the device.
Disposing of devices improperly may cause damage to the environment.
Therefore, observe the following information:
b
b
36
Always observe the valid regulations on environmental protection.
Separate the recyclable materials by type and place them in recycling containers.
O P E R A T I N G I N S T R U C T I O N S | SIM4000
8019317/ZM93/2017-07-13 | SICK
Subject to change without notice
TECHNICAL DATA 11
11
Technical data
NOTE
The relevant online data sheet for your product, including technical data, dimensions,
and connection diagrams can be downloaded, saved, and printed at:
www.sick.com/SIM4000
b
11.1
Features
Feature
Parameter
Task
Data recording, evaluation, and archiving
Supported devices/excerpt 2D and 3D cameras, encoders, code readers, laser scanners, pho‐
toelectric sensors, etc.
Technology
Embedded hardware architecture:
• 16/8-Core PowerPC CPU (virtual/physical cores)
• FPGA for image (pre-)processing
• FPGA for I/O handling
• Dedicated fieldbus controller
Software:
• Can be programmed within the SICK AppSpace environment
• Integrated HALCON image processing library
• SICK vision tools
11.2
Random Access Memory
8 GB
Flash memory
512 MB in total, 490 MB of which available for applications
Memory card (optional)
Industry-grade microSD memory card (flash card), max. 16 GB
Programming software
SICK AppStudio
Image processing algo‐
rithms
based on HALCON and/or the SICK Algorithm API
Feature
Parameter
Data storage and retrieval
Image and data logging via optional internal SSD, microSD mem‐
ory card, internal RAM and external FTP
Interfaces
Serial (RS-232/RS-422/RS-485)
Quantity 2, also configurable as an encoder output port
Function RS-232 / RS-422 / RS-485
maximum data transmis‐ RS-232: 115.2 kBaud
sion rate RS-422: 2 MBaud
RS-485: 2 MBaud
Incremental
Quantity 2
Function Incremental encoder (In/OUT), RS-422 interface
Maximum frequency 2 MHz
Fieldbus
Quantity 2
Function Ethernet-based fieldbus
Data transmission rate 10/100 MBit/s
8019317/ZM93/2017-07-13 | SICK
Subject to change without notice
O P E R A T I N G I N S T R U C T I O N S | SIM4000
37
11 TECHNICAL DATA
Feature
Parameter
Protocol ProfiNet, Ethernet/IP, EtherCAT
Ethernet
Quantity 8
Function Host, AUX, image transmission, 6x PoE PSE 12 W max. (to 1 GigE
interfaces)
Data transmission rate 6 x [10/100/1,000 Mbit/s]
2 x 10,000 Mbit/s
Protocol TCP/IP, FTP (image transmission), GigE vision, GeniCam
CAN
Quantity 2
Function SICK CAN sensor network (master/slave, multiplexer/server) with
termination resistor which can be activated
CAN functional modes:
Mode 1: 2 separate CAN networks
Mode 2: 1 CAN network with 2x power-out
Data transmission rate 20 kbit/s ... 1 Mbit/s
Protocol CSN (SICK CAN sensor network)
IO-Link master
Quantity
4 (S1 to S4)
Data transmission rate
max. 230 kBaud
Protocol
IO-Link master 1.1
Digital switching inputs/outputs
11.3
38
I/O
Inputs: 4 opto-decoupled, max. frequency: 10 kHz
Inputs/outputs: 7 (configurable), max. frequency: 30 kHz
S1–S4
Inputs: 1 each, max. frequency: 10 kHz
Inputs/outputs: 1 each (configurable), max. frequency: 30 kHz
S5–S8
Inputs: 1 each, max. frequency: 30 kHz
Inputs/outputs: 2 each (configurable), max. frequency: 30 kHz
USB
AUX (USB 2.0), for configuration/diagnostics and image transmis‐
sion
Mechanics and electronics
Feature
Parameter
Optical indicators
15 x red/green status indicators
6 x red/green PoE indicators
8 x orange activity indicators
10 x green Link indicators
12 x red/green device status indicators
Operating elements
1 selector switch (under the front right-hand flap)
O P E R A T I N G I N S T R U C T I O N S | SIM4000
8019317/ZM93/2017-07-13 | SICK
Subject to change without notice
TECHNICAL DATA 11
Feature
Parameter
Electrical connection
I/O: 1 x M12, 17-pin female connector
POWER MAIN and CAN: 2 x M12, 4-pin male connector, T-coded
INC: 2 x M12, 8-pin female connector, A-coded
SERIAL: 2 x M12, 8-pin female connector, A-coded
FBUS: 2 x M12, 4-pin female connector, D-coded
CAN: 2 x M12, 5-pin female connector, A-coded
SENSOR S1–S4, IO-Link master: 4 x M12, 5-pin female connector,
A-coded
SENSOR S5–S8: 4 x M12, 5-pin female connector, A-coded
Ethernet GigE with POE: 6 x M12, 8-pin female connector, X-coded
Ethernet 10GigE: 2x M12, 8-pin female connector, X-coded
Operating voltage
24 V DC, ± 10% SELV in accordance with EN 60950-1
Power consumption
60 W type, without connected sensors
Power output
Total 300 W max. (all connections)
Output current
S1–S8, IO Max. output current to switching output pins: 100 mA
S1–S4 Max. output current to power supply pins: 1 A, LPS in accordance
with EN 60950-1
S5–S8 Illumination switched via the power supply pin: Imax = 1 A, LPS in
accordance with EN 60950-1 with rise time < 10 µs, fall time
< 10 µs, delay < 10 µs
Illumination switched via digital output: Imax = 2.5 A, LPS in accord‐
ance with EN 60950-1
CAN Max. output current to power supply pins: 3.2 A, LPS in accord‐
ance with EN 60950-1
Serial, incremental Max. output current to power supply pins: 1 A, LPS in accordance
with EN 60950-1
IO Max. output current to power supply pins: 500 mA, LPS in accord‐
ance with EN 60950-1
11.4
Housing material
Aluminum die cast
Housing color
Light blue (RAL 5012)
Protection class
II with functional ground
Weight
5120 g
Dimensions (W x D x H)
164.5 x 147 x 272 mm
Ambient data
8019317/ZM93/2017-07-13 | SICK
Subject to change without notice
Feature
Parameter
Electromagnetic compati‐
bility (EMC)
EN 61000-6-2:2005-08
EN 61000-6-4:2007 + A1:2011
EN 61131-9:2013-12
Shock resistance
EN 60068-2-6
Electrical safety
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 +AC:
2011 + A2:2013
Enclosure rating
IP65 in accordance with EN 60529-2000-09 (requires blind plugs
to be inserted into unused connections)
Ambient operating temper‐
ature
0 °C ... +50 °C, taking the described mounting requirements into
account, see "Mounting the SIM4000", page 16
Storage temperature
-20 °C ... +70 °C
O P E R A T I N G I N S T R U C T I O N S | SIM4000
39
11 TECHNICAL DATA
Feature
Parameter
Permissible relative humid‐ 90%, non-condensing
ity
40
O P E R A T I N G I N S T R U C T I O N S | SIM4000
8019317/ZM93/2017-07-13 | SICK
Subject to change without notice
ANNEX 12
12
Annex
12.1
Dimensional drawings
All measurements in mm.
30
(1.19)
SIM4000
DEVICE
SENSOR / PoE
(1.07)
CAN
I/0
INC
1
POWER IN
CAN
1
2
SERIAL
2
68.3
(2.69)
Pwr/Act
Pwr/Act
Link
Act
Link
Pwr/Act
Pwr/Act
Pwr/Act Term
Pwr/Act Term
Act
Dev RDY
Sys RDY
Result
Funct 1
Funct 2
Remote
SSD 1
SSD 2
Wi-Fi
BLE
BF / NS
SF / MS
100.3
Micro-SD
272 (10.71)
Mode
83 (3.25)
POWER
MAIN
29 (1.16)
85 (3.33)
27.3
Dev RDY
Sys RDY
Result
Funct 1
Funct 2
Remote
SSD 1
SSD 2
Wi-Fi
BLE
BF / NS
SF / MS
(3.95)
P1
FBUS
S1
P2
1
S2
S3
CAN
2
S4
136.3
USB
(5.36)
Pwr/Act
Pwr/Act
Pwr/Act
Pwr/Act
Pwr/Act
Pwr/Act
Pwr/Act
Pwr/Act
241 (9.49)
60 (2.37)
0
SENSOR
4
PoE
PoE
PoE
PoE
ETHERNET
PoE
10 GigE
PoE
246.3
7
38.5 (1.52)
8
12.5 (0.49)
6
0
39.5 (1.56)
5
1 Link
Act
2 Link
Act
3 Link
Act
4 Link
Act
5 Link
Act
6 Link
Act
7 Link
Act
8 Link
Act
40
S8
3
(8.00)
(9.69)
(1.18)
S7
2
203.2
1
2
3
4
5
6
7
8
32
S6
1
13.5 (0.53)
Link
Act
Link
Act
Link
Act
Link
Act
Link
Act
Link
Act
Link
Act
Link
Act
S5
79.4 (3.13)
(6.62)
(1.56)
168.3
164.5 (6.48)
147 (5.79)
160.5 (6.32)
40
(1.57)
5.3 (0.21)
11.5 (0.45)
147 (5.79)
7.8 (0.31)
(3.94)
36
100
(3.94)
36
(1.42)
100
(1.42)
Repair warranty
void if broken
10.4 (0.41)
157.4 (6.20)
8019317/ZM93/2017-07-13 | SICK
Subject to change without notice
O P E R A T I N G I N S T R U C T I O N S | SIM4000
41
12 ANNEX
Adapter holding plate (available as accessory)
Vesa 100 (3.94)
Vesa 75 (2.95)
1
M4 (8x)
118 (4.65)
99 (3.90)
84 (3.31)
74 (2.91)
R
2
( 0 . .7 5
11
)
59 (2.32)
44 (1.73)
75
2. 1)
R (0.1
34 (1.34)
6 .5 )
19 (0.75)
R .26
(0
12.2
10 (0.39)
0
19 (0.75)
29 (1.14)
65 (2.56)
165 (6.50)
265 (10.43)
301 (11.85)
310 (12.20)
319 (12.56)
330 (12.99)
1
320 (12.60)
0
Counterbore M5 (9x)
Licenses
SICK uses open-source software. This software is licensed by the rights holders using
the following licenses among others: the free licenses GNU General Public License (GPL
Version2, GPL Version3) and GNU Lesser General Public License (LGPL), the MIT
license, zLib license, and the licenses derived from the BSD license.
This program is provided for general use, but WITHOUT ANY WARRANTY OF ANY KIND.
This warranty disclaimer also extends to the implicit assurance of marketability or suita‐
bility of the program for a particular purpose.
More details can be found in the GNU General Public License. View the complete
license texts here: www.sick.com/licensetexts. Printed copies of the license texts are
also available on request.
42
O P E R A T I N G I N S T R U C T I O N S | SIM4000
8019317/ZM93/2017-07-13 | SICK
Subject to change without notice
ANNEX 12
8019317/ZM93/2017-07-13 | SICK
Subject to change without notice
O P E R A T I N G I N S T R U C T I O N S | SIM4000
43
8019317/ZM93/2017-07-13/en
Australia
Phone +61 3 9457 0600
1800 334 802 – tollfree
E-Mail sales@sick.com.au
Israel
Phone +972 4 6881000
E-Mail info@sick-sensors.com
South Korea
Phone +82 2 786 6321
E-Mail info@sickkorea.net
Italy
Phone +39 02 274341
E-Mail info@sick.it
Spain
Phone +34 93 480 31 00
E-Mail info@sick.es
Japan
Phone +81 3 5309 2112
E-Mail support@sick.jp
Sweden
Phone +46 10 110 10 00
E-Mail info@sick.se
Malaysia
Phone +6 03 8080 7425
E-Mail enquiry.my@sick.com
Switzerland
Phone +41 41 619 29 39
E-Mail contact@sick.ch
Mexico
Phone +52 (472) 748 9451
E-Mail mario.garcia@sick.com
Taiwan
Phone +886 2 2375-6288
E-Mail sales@sick.com.tw
Netherlands
Phone +31 30 2044 000
E-Mail info@sick.nl
Thailand
Phone +66 2645 0009
E-Mail Ronnie.Lim@sick.com
Chile
Phone +56 2 2274 7430
E-Mail info@schadler.com
New Zealand
Phone +64 9 415 0459
0800 222 278 – tollfree
E-Mail sales@sick.co.nz
Turkey
Phone +90 216 528 50 00
E-Mail info@sick.com.tr
China
Phone +86 20 2882 3600
E-Mail info.china@sick.net.cn
Norway
Phone +47 67 81 50 00
E-Mail sick@sick.no
Denmark
Phone +45 45 82 64 00
E-Mail sick@sick.dk
Poland
Phone +48 22 539 41 00
E-Mail info@sick.pl
Finland
Phone +358-9-2515 800
E-Mail sick@sick.fi
Romania
Phone +40 356 171 120
E-Mail office@sick.ro
France
Phone +33 1 64 62 35 00
E-Mail info@sick.fr
Russia
Phone +7 495 775 05 30
E-Mail info@sick.ru
Germany
Phone +49 211 5301-301
E-Mail info@sick.de
Singapore
Phone +65 6744 3732
E-Mail sales.gsg@sick.com
Hong Kong
Phone +852 2153 6300
E-Mail ghk@sick.com.hk
Slovakia
Phone +421 482 901201
E-Mail mail@sick-sk.sk
Hungary
Phone +36 1 371 2680
E-Mail office@sick.hu
Slovenia
Phone +386 591 788 49
E-Mail office@sick.si
India
Phone +91 22 6119 8900
E-Mail info@sick-india.com
South Africa
Phone +27 11 472 3733
E-Mail info@sickautomation.co.za
Austria
Phone +43 22 36 62 28 8-0
E-Mail office@sick.at
Belgium/Luxembourg
Phone +32 2 466 55 66
E-Mail info@sick.be
Brazil
Phone +55 11 3215-4900
E-Mail marketing@sick.com.br
Canada
Phone +1 905 771 14 44
E-Mail information@sick.com
Czech Republic
Phone +420 2 57 91 18 50
E-Mail sick@sick.cz
SICK AG | Waldkirch | Germany | www.sick.com
United Arab Emirates
Phone +971 4 88 65 878
E-Mail info@sick.ae
United Kingdom
Phone +44 1727 831121
E-Mail info@sick.co.uk
USA
Phone +1 800 325 7425
E-Mail info@sick.com
Vietnam
Phone +84 945452999
E-Mail Ngo.Duy.Linh@sick.com
Further locations at www.sick.com
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