Compaq Evo D510 e-pc Technical Reference Manual

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technical reference manual

Evo D510 e-pc

Document Part Number: 305511-001

August 2002

© 2002 Compaq Information Technologies, L.P.

Compaq, the Compaq logo, and Evo are trademarks of Compaq Information Technologies Group, L.P. in the U.S. and/or other countries.

Microsoft, MS-DOS, Windows, and Windows NT are trademarks of Microsoft Corporation in the U.S. and/or other countries.

Intel, Pentium, Intel Inside, and Celeron are trademarks of Intel Corporation in the U.S. and other countries.

Adobe, Acrobat, and Acrobat Reader are trademarks or registered trademarks of Adobe Systems Incorporated.

All other product names mentioned herein may be trademarks of their respective companies.

Compaq Computer Corporation shall not be liable for technical or editorial errors or omissions contained herein or for incidental or consequential damages in connection with the furnishing, performance, or use of this material.

The information in this document is provided “as is” without warranty of any kind, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose, and is subject to change without notice. The warranties for Compaq products are set forth in the express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty.

This document contains proprietary information that is protected by copyright. No part of this document may be photocopied, reproduced, or translated to another language without the prior written consent of Compaq

Computer Corporation.

Å WARNING: Text set off in this manner indicates that failure to follow directions could result in bodily harm or loss of life.

Ä CAUTION: Text set off in this manner indicates that failure to follow directions could result in damage to equipment or loss of information.

technical reference manual

Evo D510 e-pc

First Edition August 2002

Document Part Number: 305511-001

Information Roadmap

Use the icon in Acrobat Reader to search for information in this PDF.

The following types of information are available for your computer:

Technical Reference

See the Technical Reference Manual (this document).

The Technical Reference Manual, available in PDF format on the support Web site http://www.compaq.com/support,

provides information on:

■

■

Your computer’s hardware components

The drivers, software and BIOS used in your computer.

Troubleshooting

See the Troubleshooting Guide.

■

■

■

■

The Troubleshooting Guide will help you solve problems with your computer. It is available in

PDF format on the support Web site http://www.compaq.com/support.

The Troubleshooting

Guide will help you:

Find out what to do first if you encounter a problem with your computer

Identify the problem area and provide a possible solution

Find further service and support if you still can’t solve the problem

Collect relevant information on your computer before contacting support.

Installing, Configuring, Upgrading

See the Illustrated Parts Map or the Upgrade Guide.

The Illustrated Parts Map available in PDF format on the support Web site http://www.compaq.com/support,

provides information on:

■

■

Computer configurations

Replacement parts

The Upgrade Guide will help you upgrade and replace components in your computer, including the hard drive, memory, battery, power supply, and optical disk drives. More information is available on the support Web site http://www.compaq.com/support.

Technical Reference Guide iii

Information Roadmap

Discover and Use Your Product

See the Quick Start card and other documentation provided with your computer.

The Quick Start card provided with your computer will help you:

■

■

Set up and begin using your computer for the first time

Upgrade and replace components in your computer, including the hard drive and memory.

More information is available on the support Web site http://www.compaq.com/support.

■ Find out where to get more information

The other documentation provided with your computer includes basic troubleshooting information, technical specifications, warranty and legal information.

Information on the hp Support Web Site

■

■

■

■

Connect to the support Web site http://www.compaq.com/support

and search for

Evo D510 e-pc. This site provides a wide range of information, including:

Downloadable documentation

Service and support options

The latest BIOS, drivers and utilities

Answers to Frequently Asked Questions

System Restore CD-ROMS

Used for restoring the computer’s preloaded hard disk contents. Includes instructions on how to restore your preloaded software including operating system, drivers and utilities.

iv Technical Reference Guide

Information Roadmap

Finding Information

Use the following table to determine where to locate particular types of information.

Type of Information

• Support phone numbers

• Technical support contact information

• Warranty information

How to set up your computer

Operation of your computer

• Diagrams and detailed instructions on installing add-on devices

• Internal wire connections for adding hard drives, CD-ROM, etc.

• Memory expansion and replacing devices

• LAN configuration

• LAN controller

• Identifying the problem

• Information on errors

• Problem solving

• Troubleshooting

Parts list

• BIOS

• Connectors

• Specifications

• System board layout

• Technical diagrams

Location

The documentation provided with your computer

Quick Start Card

Operating system and application manuals

Upgrade Guide

Technical Reference Manual

Troubleshooting Guide

Illustrated Parts Map

Technical Reference Manual

Technical Reference Guide v

Information Roadmap

Bibliography

Datasheets and other information can be obtained at:

■ Intel Chipsets developer.intel.com

■ Intel Dynamic Video Memory Technology developer.intel.com/business/products/chipsets/dvmt_white.pdf

■ Intel Celeron & Pentium 4 Processors http://www.intel.com/design/celeron http://www.intel.com/design/pentium4

■ Analog Devices AD1981A http://www.analogdevices.com

■ Intel LAN card http://www.intel.com/support/network

■ ATI graphics cards http://www.ati.com

■ Hewlett-Packard white papers are available on a variety of subjects including AGP graphics and SDRAM memory at: http://www.hp.com/go/library vi Technical Reference Guide

Contents

Information Roadmap

Technical Reference. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–iii

Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–iii

Installing, Configuring, Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–iii

Discover and Use Your Product. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–iv

Information on the hp Support Web Site . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–iv

System Restore CD-ROMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–iv

Finding Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–v

Bibliography. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–vi

1 System Overview

System Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

Package Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

Front View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

Rear View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4

View with Cover Removed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5

Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6

Physical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6

Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6

Acoustic Noise Emission. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6

Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–7

2 System Features

System Board Layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1

System Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2

System Board Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–3

Chipset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4

Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4

Intel System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–5

Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6

Intel Pentium 4 (Socket 478) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6

Intel Celeron (Socket 478). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7

Main Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7

DDR-SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7

System Board Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8

Hard Drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8

Ultra-ATA/100 Hard Drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9

Technical Reference Guide vii

Contents

Optical Drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–10

Features of the Slim CD-ROM Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–10

Features of the Slim CD-RW Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–11

Features of the Slim DVD-ROM Drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–12

Digital Versatile Disk (DVD) Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–13

Audio features of DVD-Video . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–13

DVD Region Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–14

CD-RW Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–14

Graphics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–15

Intel 845G Chipset Integrated Graphics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–15

Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–16

Analog Devices AD1981A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–17

LAN Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–18

LAN Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–19

USB 2.0 Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–19

3 Serviceability

Removing the Chassis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1

Removing the Hard Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–3

Installing or Replacing Main Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5

Replacing the Optical Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–6

4 BIOS Overview

BIOS Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1

Entering the Configuration and Diagnostics menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2

Setup and Advanced Screens . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–3

Power Management and Wake Up Events. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4

ACPI Power Management Modes

(Windows 2000 and Windows XP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4

Beep Codes and Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–5

Pre-Boot Audio Signal and Beeps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–5

BIOS Error Messages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–6

Error Message on Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–6

5 Drivers and Software

Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1

Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1

Operating System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1

Application Software. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1

e-Diagtools. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2

BIOS Updates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2

viii Technical Reference Guide

1

System Overview

This chapter introduces the internal and external features, and lists the specifications of the

Compaq Evo D510 e-pc.

System Features

Component Description

Package Description 1 external shelf for a Slim CD drive.

1 internal bay for a 3 1/2 inch hard drive.

Processor

Operating System

Width: 25.0 cm (9.80 in.)

Height: 9.7 cm (3.82 in.)

Depth: 31.0 cm (12.2 in.)

Intel Pentium 4: 2.0 GHz to 2.6 GHz (400 MHz FSB)

Intel Celeron 1.7 GHz to 1.8 GHz (400 MHz FSB)

• Preloaded Windows XP Professional RTM, with possibility of downgrade to Windows 2000 SP2 with recovery CD

• Preloaded Windows XP Home RTM

• Preloaded Windows 2000 SP2

• Linux offer available (no preload, only a CD in the box)

System Board:

Chipset

I/O capability

Graphics

Audio

LAN

Mass storage

Main memory

Intel 845G with integrated video

2 memory slots, 1 IDE connector for hard drive, 1 IDE connector for

CD-ROM (specific connector format)

Intel 845G integrated graphics with 8MB graphics memory

Integrated ADI audio CODEC, AC97 compliant

Integrated Intel Pro/100 VE Network Adapter (10 Base-T/100 Base-TX

LAN Interface)

Slim CD-ROM drive: 24X IDE

Slim CD-RW drive: 8X, 8X, 24X IDE

Slim DVD-ROM drive: 8X, 24X IDE

Choice of hard drives:

Ultra ATA/100: 20 GB (5400 rpm), 20 GB (7200 rpm), 40 GB

(5400 rpm), 40 GB (7200 rpm), 80 GB (7200 rpm)

Theoretical maximum hard drive capacity of 144 PB (1015) using

48 bit BA addressing mode

Two DIMM sockets using: 128 MB, 256 MB, 512 MB and 1 GB

266 MHz DDR-SDRAM (non-ECC). Maximum of 2 GB.

Technical Reference Guide 1–1

System Overview

System Features (Continued)

Component

Input devices

Power supply

Connectors

BIOS

Description

Compaq USB easy access keyboard

Compaq USB scrolling mouse

ComStation Pro (Wireless keyboard and mouse)

Input voltage: 100–127 V~ 6 A max, 200–240 V~ 4 A max

Input frequency: 50 Hz/60 Hz

6 USB 2.0 connectors (2 front, 4 rear), VGA connector, LAN, audio

(microphone, line in, amplifier out)

USB to serial and USB to printer adapters available as options

HP/American Megatrends, Inc. (AMI) BIOS, Version: JK.xx.yy

(for example JK.01.01)

1–2 Technical Reference Guide

Package Features

Front View

System Overview

Power On/Off Button

Power on Status Light

(flashes in sleep mode or when the fan is disconnected)

HDD Drive Activity Light

CD-ROM, CD-RW or DVD-ROM Drive

Optical Drive Activity Light

2 x USB 2.0

usb serial usb printer

Technical Reference Guide 1–3

System Overview

Rear View

Kensington line in

LAN

~ ac power

110 V 230 V

futura

mic

600 electret time out 32

4 x USB 2.0

usb serial usb printer monitor

1–4 Technical Reference Guide

View with Cover Removed

System Overview

Location of two DIMM main memory sockets

Memory can be changed or upgraded to a maximum of 2 GB (2 x 1 GB modules)

System fan

Hard drive

This is easily removable for replacement or upgrading

(to a larger drive)

Optical drive

Position of switch block (under optical drive)

Use switch 2 to reset CMOS and passwords

Technical Reference Guide 1–5

System Overview

Specifications

Physical Characteristics

Characteristic Description

Weight

(configuration with 1 CD-ROM drive, excluding keyboard and display)

4.5 kg (9.92 pounds)

Dimensions

Footprint

Width: 25.0 cm (9.80 in.)

Height: 9.7 cm (3.82 in.)

Depth: 31.0 cm (12.2 in.)

Vertical Position: 0.0301 m2 (0.324 ft 2 )

Horizontal Position: 0.0775 m2 (0.835 ft 2 )

Power Supply

Input voltage (voltage selection switch)

Input frequency

100–127 V~ 6 A max, 200–240 V~ 4 A max

50 Hz/60 Hz

Power Consumption

The standard base models of this product meet the Energy Star guidelines for energy efficiency.

Power Consumption—Windows 2000

Maximum operating

Typical operating

Sleep (suspend)

Off

115 V/60 Hz and 230 V/50 Hz

70 W

50 W

<2.5 W

<2.5 W

Acoustic Noise Emission

The following values are given for the standard configuration as shipped and can vary depending on the actual components used.

Acoustic Noise Emission (ISO 7779)

Idle (typical)

Operating with hard disk access

Sound Power

(Average)

LwA ≤ 3.2 B(A)

LwA ≤ 3.4 B(A)

Sound Pressure at

Operator Position

LpA ≤ 26 dB(A)

LpA ≤ 28 dB(A)

1–6 Technical Reference Guide

System Overview

Environmental Specifications

Operating temperature and humidity ranges may vary depending upon the mass storage devices installed. High humidity levels can cause improper operation of disk drives. Low humidity levels can aggravate static electricity problems and cause excessive wear of the disk surface.

Environmental Specifications (System Processing Unit, with Hard Disk)

Operating Temperature 10º C to 35º C (50º F to 95º F)

Storage Temperature

Operating Humidity

Storage Humidity

-40º C to 70º C (-40º F to 158º F)

15% to 80% (relative)

8% to 85% (relative), non-condensing at 40º C (104º F)

Technical Reference Guide 1–7

2

System Features

This chapter describes core components of the Compaq Evo D510 e-pc such as the chipset, processor, mass storage devices, graphics controllers, audio controllers, network features and input devices.

System Board Layout

The system board uses either a Celeron or a Pentium 4 processor and two DIMM main memory slots.

Technical Reference Guide 2–1

System Features

System Board

2–2 Technical Reference Guide

System Features

System Board Components

The following diagram shows where the different slots and connectors are located on the system board.

Microphone Line OUT

Line IN

LAN

VGA Connector

System fan

4 USB connectors

(2 pairs of 2)

Processor Socket

Graphics and memory controller hub

PSU

Connector

845G chipset

Battery Socket

Optical disk drive connector

I/O controller hub

Switch 2 is

CMOS/Password switch

ON

1 2 3

Switch block

PSU

Connector

2 front stacked USB connectors

Å WARNING: There is a risk of explosion if the battery is not replaced by the correct type. Make sure you dispose of used batteries according to instructions provided.

Technical Reference Guide 2–3

System Features

Chipset

The Compaq Evo D510 e-pc features the Intel 845G chipset.

The 845G chipset offers the available bandwidth of DDR-SDRAM 266 MHz main memory, coupled with a 400 MHz Front Side Bus (FSB) and high speed USB 2.0 connectivity for high PC performance.

The 845G chipset consists of two controller hubs:

■ The 82845G Graphics Memory Controller Hub (GMCH) supports 400 MHz system bus design, PC133 or DDR200/DDR266 SDRAM memory, and the new integrated graphics architecture. It features Intel’s Dynamic Video Memory Technology (DVMT) and Zone

Rendering Technology (ZRT).

■ The 82801DB I/O Controller Hub (ICH4) brings high speed USB 2.0, offering up to 40 times the bandwidth of USB 1.1 for I/O intensive applications.

Main Features

■

■

■

■

■

■

■

■

■

■

■

■

■

■

■

Support for Intel Pentium 4 and Celeron processor

PGA478 socket

32 bpp true color support for high resolution texture

Memory bandwidth DDR200/266 SDRAM support

2.0 GB Max memory

2 DIMM, no ECC

ICH4 I/O Connectivity

Six high speed USB 2.0 ports offering up to 40 times the bandwidth of original USB 1.1

Enhanced audio

400 MHz system bus compatibility

AGP 4X interface providing the most advanced graphics support available

LAN connect Interface (LCI) provides flexible network solutions

Dual Ultra ATA/100 controllers

Communication and Networking Riser (CNR) card capability

Low power sleep mode.

2–4 Technical Reference Guide

System Features

Intel System Block Diagram

Celeron/Pentium 4 processor

Front side Bus 400 MHz

System Bus: 3.2 GB/s (400 MHz)

AGP 4X

> 1GB/s

Intel 845G

Integrated 845G graphics controller

Memory Bus

Main Memory

266 MHz

DDR-SDRAM

Hard Disk

Optical Drive

Audio

ADI AC’97

ICH4 chip

4 rear 2.0 USB Slots

2 front 2.0 USB Slots

Flash Bios

Integrated Intel Pro/100

VE Network Adapter

(10 Base-T/100 Base-TX

LAN Interface)

Technical Reference Guide 2–5

System Features

Processor

The Compaq Evo D510 e-pc is equipped with either a socket 478B Intel Celeron or Pentium 4 processor. The processor is connected to the system board through a Pin Grid Array (PGA)

478B Socket.

478B Socket

(under heatsink)

A heatsink and fan (not shown) cover the processor to prevent it from overheating. If the heatsink is removed, the thermal interface material between the heatsink and the processor must be replaced. If no thermal interface is used or the old one is re-used, then cooling may be impaired and the processor damaged.

Intel Pentium 4 (Socket 478)

■

■

The Intel Pentium 4 processor has the following features:

■

■

■

Speeds ranging up to 2.6 GHz at the time of initial product release

Data bus frequency of 400 MHz

Dual Independent Bus architecture, which combines a dedicated 64-bit L2 cache bus

(supporting 256 KB or 512 KB) plus a 64-bit system bus that enables multiple simultaneous transactions

■ MMX2 technology, which gives higher performance for media, communications and 3D applications

Dynamic execution to speed up software performance

Internet Streaming SIMD Extensions 2 (SSE2) for enhanced floating point and 3D application performance

■ Uses multiple low-power states, such as AutoHALT, Stop-Grant, Sleep and Deep Sleep to conserve power during idle times (refer to page 47 for PC power states)

■

■

The Pentium 4 processor is packaged in a pin grid array (PGA) that fits into a PGA478B socket. The Pentium 4 integrates the following cache memories on the same die as the processor cache:

A trace instruction and L1 data cache. The trace cache is 4-way set associative.

A 256 KB or 512 KB L2 cache. The L2 cache is 8-way associative.

2–6 Technical Reference Guide

System Features

Intel Celeron (Socket 478)

The “new” Celeron (socket 478) processor is based on the Pentium 4 architecture. It is supported by the Intel 845G chipset. The “new” Celeron processor also features the following:

■

■

■

Processor speeds ranging from 1.7 to 1.8 GHz at the time of initial product release

Front side bus 400 MHz

128 KB or 256 KB cache

Main Memory

There are two memory module slots on the system board for installing main memory. You can install 266 MHz DDR-SDRAM modules; these are available in 128, 256, 512 MB and

1 GB memory modules. You can install a maximum of 2 GB of memory (2 x 1 GB modules).

DIMM slots

You can only use non-ECC memory modules.

DDR-SDRAM

Short for Double Data Rate-Synchronous DRAM, DDR-SDRAM is a type of SDRAM that supports data transfers on both edges of each clock cycle, effectively doubling the memory chip’s data throughput. DDR-SDRAM also consumes less power. DDR-SDRAM is also called

SDRAM II.

While the new memory module is clocked at the same speed as normal SDRAM, it is able to transport double the amount of data by using the rising as well as falling edge of the clock signal for data transfers. DDR-SDRAM has another important enhancement over SDRAM. Its voltage supply uses only 2.5 V, instead of 3.3 V. This and the lower capacities inside the memory chips lead to significantly reduced power consumption.

DDR-SDRAM DIMMs are not compatible with SDRAM DIMMs. The new DDR-DIMMs come with 184 instead of the 168 pins used by SDRAM-DIMMs. The module itself looks almost identical to SDRAM, but it has only one notch on its connector surface.

Technical Reference Guide 2–7

System Features

System Board Switches

System Board switches

The following table gives the functionality and default position of switches on the system board switch block.

Switch

1

2

3

Switch Position Function

ON Bootblock protected (default)

OFF

ON

Bootblock not protected

Clear CMOS and reload default values in

Computer Setup. Clear all passwords.

OFF

ON

OFF

CMOS locked (default)

Reserved

Reserved (default)

Hard Drives

A 3.5-inch hard drive is supplied on an internal shelf. These hard drives can be provided with the PC:

Average Seek Time (ms)

Track-to-Track Seek Time (ms)

Full Stroke Seek Time (ms)

Rotational Speed (RPM)

Buffer Size (MB)

20 GB

Ultra ATA

100

40 GB

Ultra ATA

100

8.9 to 12.1

1.5

20 to 25

5400

2

20 GB

Ultra ATA

100

40 GB

Ultra ATA

100

8.5 to 8.9

1.2

15

7200

2

80 GB

Ultra ATA

100

9.5

0.95

—

7200

2

2–8 Technical Reference Guide

System Features

Ultra-ATA/100 Hard Drives

ATA (AT Attachment) is a disk drive implementation designed to integrate the controller into the drive itself, thereby reducing interface costs. ATA is also known as IDE (Integrated Drive

Electronics).

Ultra ATA/100 is the latest generation of the ATA interface, it increases burst data rates significantly over previous versions of the protocol. Also known as Ultra DMA/100 and

Feature ATA, Ultra ATA/100 allows host computers to send and receive data at 100 MB/s. The result is maximum disk performance under PCI local bus environments.

At its fast burst data rates, Ultra ATA/100 removes bottlenecks associated with data transfers, especially during sequential operations. Ultra ATA/100 also delivers heightened data integrity to the EIDE interface through use of a 40-pin 80-conductor cable, and CRC (Cyclic Redundancy

Check) error detection code. The 80-conductor cable reduces crosstalk and improves signal integrity by providing 40 additional ground lines between the 40-pin IDE signal and ground lines. The connector is plug-compatible with existing 40-pin headers, and the incremental cost for the cable should be minimal.

By increasing the burst transfer rates of IDE drives, Ultra ATA/100 brings the effective transfer rate of the system’s bus and a drive’s internal data rate that much closer into balance. Ultra

ATA/100 allows greater system throughput, particularly for long sequential transfers required by audio/visual applications.

Ultra ATA/100 hard drives are backwards compatible with earlier devices but will take on the speed of earlier devices when used in their stead.

✎

S.M.A.R.T. or Self Monitoring Analysis and Reporting Technology allows the hard drive to report certain types of degradation or impending failure. This allows the operating system to take the necessary precautions and warn the user. The system is comprised of software that resides both on the disk drive and on the host computer. The disk drive software monitors the internal performance of the motors, media, heads, and electronics of the drive, while the host software monitors the overall reliability status of the drive. The reliability status is determined through the analysis of the drive's internal performance level and the comparison of internal performance levels to predetermined threshold limits.

Technical Reference Guide 2–9

System Features

Optical Drives

Some Compaq Evo D510 e-pc models are fitted with a 24X max slim IDE CD-ROM drive, an

8X/8X/24X slim IDE CD-RW drive or an 8X/24X slim IDE DVD-ROM drive.

Features of the Slim CD-ROM Drive

■

■

■

■

■

CD-DA

CD-ROM Mode 1, Mode 2

CD-I (Mode 2, Form 1 and 2)

Photo-CD (single and multi session)

Enhanced CD

Read Speed

Host Interface

Disc Diameter

Storage Capacity

Data Transfer Rate

Average Access Time

Buffer Memory Size

Rotational speed

Description

24X max

IDE (ATAPI)

120 mm

656 Mb

Burst: 33.3 MBs (max)

Sustained: 1545~3600 KBs

115 msec (average)

128 Kb

5136 rpm

2–10 Technical Reference Guide

System Features

Features of the Slim CD-RW Drive

■

■

■

Supported CD-ROM formats (read and write):

❏

❏

❏

❏

❏

❏

❏

❏

CD-ROM

CD-Text

Video CD

CD-Extra

CD-DA

CD-ROM XA

CD-R (Orange Book Part 2)

CD-RW (Orange Book Part 3)

Supported CD-ROM formats (read only):

❏ Photo CD (single and multi session)

Interface type: E-IDE/ATAPI

Write/Read Speed

Sustained Data Transfer Rate (maximum)

Storage Capacity

Random Access Time (Average)

Buffer Memory Size

Loading Type

Mounting Type

Weight

Acoustic Noise

Reliability

Description

Write CD-R 8X max

Write CD-R/W 8X max

Read 24X max

3,600 KB/s CAV

700 MB or up to 74 minutes of audio per disc

140 ms

2 MB

Manual

Horizontal and vertical

200 g approximate

< 45 dBA at 1 m

MTBF 6,000 POH

Technical Reference Guide 2–11

System Features

Features of the Slim DVD-ROM Drive

■

■

Supported formats (read only):

❏

❏

❏

❏

❏

❏

❏

❏

❏

❏

❏

DVD-ROM

CD-ROM Mode 1 and 2 data disc

Photo-CD Multi session

CD Audio disc

Mixed mode CD-ROM disc (data and audio)

CD-ROM XA

CD-I

CD-Extra

CD-Text

CD-R

CD-RW

Interface: E-IDE/ATAPI, Ultra DMA mode 2 (33.3 MB/s)

Description

Data Capacity:

Capacity DVD-ROM

Capacity DVD-RAM

Capacity DVD-R

Capacity CD

Data Transfer Rate

Access Time (Average)

Loading Type

Mounting Type

Weight

Buffer Memory Size

Acoustic Noise

Reliability

Up to 8.5 GB/side

4.7 GB/side

4.7 GB/side

700 MB

8X max DVD

24X max CD-ROM

90 ms for single-layer DVD-ROM

130 ms for dual-layer DVD-ROM

85 ms for CD-ROM

Manual, with electrical release of tray

Horizontal and vertical

180 g typical

512 KB

< 46 dBA at 0.5 m

MTBF 80,000 POH

✎

If a disk is still in the drive after power failure or drive failure, the disk can be removed by inserting a straightened paper-clip into the small hole at the bottom of the door.

2–12 Technical Reference Guide

System Features

Digital Versatile Disk (DVD) Technology

Digital Versatile Disc (DVD) is a medium for the distribution of from 4.7 to 17 GB of digital data on a 120 mm (4.75 inch) disc. This huge volume of data (CD-ROMs can store 680 MB) can be used to store up to nine hours of studio quality video and multi-channel surround-sound audio, highly interactive multimedia computer programs, 30 hours of CD-quality audio, or anything else that can be represented as digital data.

A DVD looks like a CD-ROM: it is a silvery disc, 4.75 inches in diameter, with a hole in the center. Like a CD, data is recorded on the disc in a spiral trail of tiny pits, and the discs are read using a laser beam. The DVD’s larger capacity is achieved by making the pits smaller and the spiral tighter, and by recording the data in as many as four layers, two on each side of the disc.

To read these tightly packed discs, lasers that produce a shorter wavelength beam of light are required, as are more accurate aiming and focusing mechanisms. In fact, the focusing mechanism is the technology that allows data to be recorded on two layers. To read the second layer, the reader simply focuses the laser a little deeper into the disc, where the second layer of data is recorded.

Not only are two layer discs possible, but so are double-sided discs. The availability of four layers is what gives DVD its 17 GB capacity.

Diameter

Thickness

Track Pitch

Minimum Pit Length

Laser Wavelength

Data Capacity (per layer)

Layers

DVD

120 mm

0.6 mm

0.74 nm

0.40 nm

640 nm

4.7 GB

1, 2, 4

CD

120 mm

1.2 mm

1.6 nm

0.834 nm

780 nm

0.68 GB

1

Audio features of DVD-Video

A DVD-Video disc can have up to 8 audio tracks (streams). Each track can be in one of three formats:

■

■

■

Dolby Digital (Dolby AC-3): 1 to 5.1 channels

MPEG-2 audio: 1 to 5.1 or 7.1 channels

LPCM: 1 to 8 channels

Dolby Digital is multi-channel digital audio, using lossy AC-3 coding technology from original

PCM with a sample rate of 48 kHz at up to 24 bits. The bitrate is 64 kbps to 448 kbps, with

384 being the normal rate for 5.1 channels and 192 being the normal rate for stereo (with or without surround encoding).

Technical Reference Guide 2–13

System Features

MPEG audio is multi-channel digital audio, using lossy compression from original PCM format with sample rate of 48 kHz at 16 bits. Both MPEG-1 and MPEG-2 formats are supported. The variable bitrate is 32 kbps to 912 kbps, with 384 being the normal average rate. MPEG-1 is limited to 384 kbps.

Linear PCM is uncompressed (lossless) digital audio, the same format used on CDs and most studio masters. It can be sampled at 48 or 96 kHz with 16, 20, or 24 bits/sample. (Audio CD is limited to 44.1 kHz at 16 bits.) There can be from 1 to 8 channels. The maximum bitrate is

6.144 MBps.

DVD Region Codes

3

4

5

After setting the DVD region (by playing a DVD video for the first time), the DVD region can be changed four times; after that the DVD drive will only play DVD videos from the last DVD region that was set.

Regional Codes

1

2

6

Region

USA & Canada

Europe (excluding former USSR countries), Japan, Near East

(including Iran and Egypt), South Africa

South East Asia, South Korea

Latin America & Oceania (Australia, New Zealand)

Africa (excluding Egypt and South Africa), Eastern European countries, Sub-Indian continent

China

CD-RW Technology

CD-RW drives use a technology known as optical phase-change. It does not use magnetic fields like the phase-change technology used with magneto-optical technology. The media are generally distinguishable from CD-R discs by their metallic grey color. The basic structure of the discs, however, is the same as a CD-R disc but with significant detail differences. A CD-RW disc’s phase-change medium consists of a polycarbonate substrate, moulded with a spiral groove for servo guidance, absolute time information and other data, on to which a stack (usually five layers) is deposited. The recording layer is sandwiched between dielectric layers that draw excess heat from the phase-change layer during the writing process. In place of the dye-based recording layer on a CD-R disc, CD-RW commonly uses a crystalline compound made up of a mix of silver, indium, antimony and tellurium. This mix, when heated to a certain temperature and then cooled becomes crystalline, but if heated to a higher temperature it becomes amorphous when it cools down again. The crystalline areas allow the metallized layer to reflect the laser light better while the non-crystalline portion absorbs the laser beam, and is therefore not reflected.

CD-RW devices use three different laser powers to achieve these effects in the recording layer:

■ the highest, called ‘Write Power,’ creates a non-crystalline (absorptive) state on the recording layer

■ the medium, ‘Erase Power,’ melts the recording layer and converts it to a reflective crystalline state

■ the lowest, ‘Read Power,’ does not alter the state of the recording layer, so it can be used for reading the data.

2–14 Technical Reference Guide

System Features

During writing, a focused ‘Write Power’ laser beam selectively heats areas of the phase-change material above the melting temperature (500-700º C), so all the atoms in this area can move rapidly in the liquid state. Then, if cooled sufficiently quickly, the random liquid state is

‘frozen-in’ and the so-called amorphous state is obtained. The amorphous version of the material shrinks, leaving a pit where the laser dot was written, resulting in a recognizable CD surface.

When an ‘Erase Power’ laser beam heats the phase-change layer to below the melting temperature but above the crystallization temperature (200º C) for a sufficient time (at least longer than the minimum crystallization time), the atoms revert back to an ordered state (the crystalline state). Writing takes place in a single pass of the focused laser beam, sometimes referred to as 'direct overwriting' and the process can be repeated several thousand times per disc.

Once the data has been burned the amorphous areas reflect less light, enabling a ‘Read Power’ laser beam to detect the difference between the lands and the pits on the disc. One compromise here is that the disc reflects less light than CD-ROMs or CD-Rs and consequently CD-RW discs can only be read on CD players that support the new MultiRead specification.

CD-RW drives are dual-function, offering both CD-R and CD-RW recording, so the user can choose the best media for a particular job.

Although UDF (Universal Disc Format) allows users to drag and drop files to discs, CD-RW is still not as easy to use as a hard drive. Initially limitations in the UDF standard and associated driver software meant that when data was deleted from a CD-RW, those areas of the disc were merely marked for deletion and were not immediately accessible. A disc could be used until all its capacity was used, but then the entire disc had to be erased to reclaim its storage space using a

'sequential erase' function. In hardware terms erasing a disk is accomplished by heating up the surface to a lower temperature, but for a longer time, which returns it to the crystalline state.

Evolution of the UDF standard and developments in associated driver software have improved things considerably, making CD-RW more like hard drives or diskette disks.

Graphics

The Compaq Evo D510 e-pc has an integrated Intel graphics solution.

Intel 845G Chipset Integrated Graphics

The Intel 845G chipset offers integrated graphics with Dynamic Video Memory Technology

(DVMT). Some memory (8 MB) is reserved at boot time from the main memory; further memory is allocated as needed.

Key Features

■ Dynamic Video Memory Technology: Ensures most efficient system memory usage for optimal 2D/3D graphics and system performance

■ Zone Rendering Technology: Significantly reduces the memory bandwidth by up to eleven times which results in much higher 3D performance

■ Tiled Memory Addressing: Performs Address Remapping in hardware for all graphics surfaces which increases page coherency and improves memory efficiency

■ Dynamic Multi-Context Switcher: Provides deeply pipelined operations in both 2D and 3D allowing overlapping operations with no need to flush between modes of operation

■ Intelligent Memory Manager: Fourth generation UMA Memory Manager that provides faster accesses, adequate burst sizes and smart page closing policies

Technical Reference Guide 2–15

System Features

■

■

■

■

■

4x Blit Engine for 2D operations: 256 bit wide Blitter fills at a much greater rate than memory bandwidth which speeds up operations like drop down menus

Deep Display Buffers: Buffer for screen refreshes which enables higher system performance by reducing the CPU latency as well as decreasing the total transactions handled by the CPU

Non-blocking and multi-tier cache structures: Dedicated internal caches for textures, colors,

Z, and vertices which significantly reduces memory bandwidth and improves core performance

Single-Pass Quad Texture Support: Supports up to blending operations for up to four textures in a single pass which reduces memory bandwidth requirements and CPU loading

Texture Decompression: Provide up to 8x compression and consequent reduction in bandwidth and footprint

Memory Usage with Dynamic Video Memory Technology

At boot time the system BIOS dedicates 8 MB of system memory for graphics display. When more memory is needed the Intel 845G graphics driver submits a request to the operating system, the operating system grants the request based upon available system memory. When the application is closed, the OS will reallocate system memory back for generic use. The quantity of additional memory which can be allocated for video by the operating system is limited, the limit depends on the quantity of memory installed on the system and on the driver version (the latest drivers can be downloaded from the web).

The quantity of system memory allocated by the BIOS and the maximum limit cannot be modified by the user.

Connectors

A 15-pin VGA DB connector is located on the rear panel of the computer.

VGA Connector for Monitor

Audio

The audio solution on the Compaq Evo D510 e-pc is the Integrated Analog Devices AD1981A

AC’97 SoundMAX CODEC. The AD1981A interfaces directly with the South Bridge chip and performs all digital operations, such as sample rate conversions and synthesis, as well as mixing and processing the analog signals.

2–16 Technical Reference Guide

System Features

All models have a Line In, Line Out and Microphone In connector located on the rear panel.

These external jacks are standard connectors.

Line in connector

Line out/speaker connector

Microphone connector

Analog Devices AD1981A

Features of the AD1981A include:

■

■

■

■

■

■

■

■

■

■

■

■

■

S/PDIF output, 20 bits data format, supporting 48 kHz, 44.1 kHz, and 32 kHz

Integrated stereo headphone amplifier

Variable sample rate audio

External audio power down control

Greater than 90 dB dynamic range

16 bit stereo full duplex CODEC

20 bit resolution output DACs

Three analog line level stereo inputs for: line in, AUX and CD

Mono line level phone input

Mono MIC input with built in programmable pre-amp

High quality CD input with ground sense

Mono output for speakerphone or internal speaker

Power management support

Other Enhanced Features include:

■

■

■

Built in digital equalizer function for optimized speaker sound

Full duplex variable sample rates from 7040 Hz to 48 kHz with 1 Hz resolution

Multiple CODEC configuration options

Technical Reference Guide 2–17

System Features

LAN Controller

The Compaq Evo D510 e-pc has an Integrated Intel Pro/100 VE Network LAN Controller

(10 Base-T/100 Base-TX LAN Interface).

The Intel LAN boot ROM setup can be launched by pressing CTRL-S while booting your PC.

LAN Interface

Manageability

Diagnostics

Drivers

Specifications

Intel PRO 100 VE Network Adapter Features

Power Management

• 32 bits PCI 10 Base-T/100 Base-TX

• RJ 45 LAN port

• RPO (Remote Power-On) for Windows 2000,

Windows XP

• RWU (Remote Wake-Up) for Windows 2000,

Windows XP

• On Now ACPI 1.0b

• PCI Power Management 1.1, PCI 2.2

• DMI 2.0 Component Code

• WfM 2.0, PXE 2.1, and RPL2.73 boot on LAN

• Production Diag

• MAC address DOS report tool

• User Diag for MS-DOS

Windows XP, Windows 2000 support

Network Interface • 10 Mbps Ethernet 10BASE-T:

Ethernet IEEE 802.3 industry standard for a 10 Mbps baseband CSMA/CD local area network.

• 100 Mbps Ethernet 100BASE-TX:

Ethernet IEEE 802.3u industry standard for a 100

Mbps baseband CSMA/CD local area network.

2–18 Technical Reference Guide

LAN Connector

The 10 Base-T/100 Base-TX LAN connector is located on the rear of the PC.

10 Base-T/100 Base-TX connector

LEDs

System Features

LED

Green

Yellow

There are two LEDs on the 10 Base-T/100 Base-TX connector as indicated in the graphic above.

The following table provides a status summary of these LEDs.

Description

Speed LED

Link Integrity and Activity LED

N/A

Flashing

Link integrity OK and network traffic present

Status

On

100 Base-TX connection between NIC and hub

Link integrity

OK and no network traffic

Off

10 Base-T connection between NIC and hub

No connection between NIC and hub

Technical Reference Guide 2–19

System Features

USB 2.0 Connectors

The Compaq Evo D510 e-pc features 6 USB 2.0 connectors (4 rear and 2 front).

USB 2.0 extends the speed of the connection from 12 Mbps on USB 1.1 to 480 Mbps on USB 2.0, providing an attachment point for next-generation peripherals for use with higher performance PCs and user applications. USB 2.0 is both forwards and backwards compatible with USB 1.1 and uses the same cables and connectors as USB 1.1.

Externally, a USB 2.0 system looks no different from a USB 1.1 system except for the identifying logos:

USB 1.1 Logo

USB 2.0 Logo

USB 1.1’s data rate of 12 Mbps is sufficient for many PC peripherals. These peripherals will continue to operate with no change in USB 2.0 systems. The higher bandwidth of USB 2.0 permits the use of PC peripherals with wider functionality. The higher bandwidth supports the most demanding PC user applications, where multiple high-speed peripherals are running simultaneously. When using a USB hub it is important to make sure that you use a USB 2.0 compliant hub.

USB-to-serial and USB-to-printer adapters are available as optional accessories with the

Evo D510 e-pc. USB-to-serial adapters allow you to connect serial devices through your USB port, similarly USB-to-printer adapters allow you to connect parallel devices through your

USB port. USB-to-serial adapters require a special driver which can be downloaded from the support web site at: http://www.compaq.com/support.

2–20 Technical Reference Guide

3

Serviceability

This chapter introduces the enhanced serviceability features of the Compaq Evo D510 e-pc.

Removing the Chassis

1. Switch off the monitor and computer.

2. Remove the port control system (used to route and secure cables) if it is installed.

3. Disconnect all cables.

Technical Reference Guide 3–1

Serviceability

4. Push the two green latches inward.

5. Slide out the chassis from the enclosure.

3–2 Technical Reference Guide

Serviceability

Removing the Hard Drive

The hard drive has been designed to be easily removed. In the event of hard drive failure,

Compaq Support may decide to send you a new hard drive so that you can replace the hard drive yourself.

Ä CAUTION: Always place the drive on a soft surface. Protect the hard drive from static electricity by leaving it in its anti-static bag until you are ready to reinstall it.

Before handling the drive, touch any unpainted metal surface to discharge static electricity. When you remove the hard disk drive from its antistatic bag, handle it only by the frame. DO NOT TOUCH the electrical components. Place the drive on the anti-static bag whenever you set it down.

Hard drives are delicate and sensitive to shock vibration. When removing or installing a hard drive, be careful not to drop or knock the drive. Any shock may damage the drive and prevent it from functioning correctly.

1. Remove the chassis as described under

“Removing the Chassis” section.

2. Unclip and swing the drive retaining clip upwards and to the side.

3. Disconnect the cables from the back of the hard drive.

4. Remove the hard drive.

Step 2 Step 3

Step 4

Technical Reference Guide 3–3

Serviceability

5. Remove the hard drive from it’s carrier by unscrewing the four screws, two on each side, as shown.

6. To replace the hard drive, reverse the procedure described above taking care to reconnect all cables correctly and securely.

7. Replace the chassis in the enclosure.

3–4 Technical Reference Guide

Serviceability

Installing or Replacing Main Memory

1. Remove the chassis as described under

“Removing the Chassis” section.

2. Unclip and swing the drive retaining clip upwards and to the side.

3. Slide the hard drive outwards to access the memory module sockets.

4. Either remove the module you want to replace or locate the empty memory module socket.

5. Make sure that the socket’s clips are open.

6. Align the grooves on the bottom of the module with the corresponding marks on the socket and push it firmly into place. The clips close automatically.

7. Replace the chassis in the enclosure.

Step 6

Technical Reference Guide 3–5

Serviceability

Replacing the Optical Drive

Å WARNING: To avoid electrical shock and harm to your eyes by laser, do not open the laser module.

The laser module should be serviced by service personnel only. Do not attempt to make any adjustment to the laser unit. Refer to the label on the CD-ROM for power requirements and wavelength. This product is a class 1 laser product.

1. Remove the chassis as described in “Removing the Chassis”

section.

2. Pull on the plastic latch below the optical drive to release it.

3. Slide the optical drive tray out of the front of the computer and detach the cable from the back of the drive.

3–6 Technical Reference Guide

Serviceability

4. Release the catch that secures the old drive in place then, remove the old drive from the tray.

5. Place the new drive in the tray and secure with the sliding catch.

6. Attach the cable to the back of new drive and slide the drive tray back into the computer until it clicks into place.

7. Replace the chassis in the enclosure.

Technical Reference Guide 3–7

4

BIOS Overview

This chapter describes the BIOS features of the Compaq Evo D510 e-pc.

BIOS Summary

The Compaq Evo D510 e-pc contains an AMI BIOS. The system ROM contains the POST

(power-on self-test) routines and the BIOS: the System BIOS, video BIOS, and Intel LAN option ROM.

The system BIOS is identified by the version number JK.xx.yy (for example JK.01.01).

■

■

■

■

The latest BIOS version for your computer and instructions for updating the BIOS can be downloaded from the support Web site at: http://www.compaq.com/support

This section covers:

The Configuration and Diagnostics Menu and Setup Program

Setup and Advanced Menus

Power Management and Wake up Events

Beep Codes and Error Messages

Manual Title Variable 4–1

BIOS Overview

Entering the Configuration and Diagnostics Menu

To enter the Configuration and Diagnostics menu on your Evo D510 e-pc, restart the computer and keep

F8

pressed. The Configuration and Diagnostics menu is displayed:

Configuration and

Diagnostics

Boot Device

HDD

CD/DVD

LAN

<F2> Enter Setup

<ESC> Summary

<F12> Boot on lan

From the Boot Device section you can select which device to begin booting from.

Press

F2

to enter the Setup menu, see “Setup and Advanced Screens” for more information.

Press

Esc

to view the summary configuration screen. By default, this remains on the screen for

10 seconds, but by pressing the

Pause

key once, it can be held on the screen indefinitely until any key is pressed.

Press

F12

to boot (start) on the network. This option will only work if your PC and the network is configured correctly.

4–2 Manual Title Variable

BIOS Overview

Setup and Advanced Screens

The Setup menu contains the following fields in one page.

Setup Menu

Field

System Date

System Time

1st Boot Device

2nd Boot Device

3rd Boot Device

4th Boot Device

Power-On Password

Set Supervisor Password

Set User Password

Remote Power On (RPO)

Boot On LAN after RPO

Front USB ports

CD-ROM Interface

HDD Interface

Network Interface

Audio Interface

[Not set]

[Not set]

Enabled

Disabled

Enabled

Enabled

Enabled

Enabled

Enabled

Default Value

July 10 2002 Wed

00:00:00

USB Floppy

CD/DVD

HDD

LAN

No password on boot

The boot order is defined by the settings of the 1st Boot Device to 4th Boot Device. Help is available for each item.

The Advanced menu contains the following fields in one menu.

Advanced Menu

Field

Boot-time Diagnostic Screen

POST Menu Wait Time

State after a power failure

Default Value

Disabled

None

Auto

Manual Title Variable 4–3

BIOS Overview

Power Management and Wake Up Events

You can reduce the computer’s overall power consumption by using Power Management to reduce power consumption when the computer is idle.

ACPI Power Management Modes

(Windows 2000 and Windows XP)

The following table describes the power states and identifies the possible Wake Up Events for the different power management modes. Activity on any one of these events will cause the system to wake up from it’s current power state.

Power State

S1 (Idle)

S3 (Standby/Suspend to RAM)

S4

(Hibernation/Suspend to Disk)

S5 (Power Off)

Description

Processor is shut down

All components of the system are shut down except for the system memory which remains active.

System memory is copied to the hard drive. All components of the system are shut down.

Wake Up Event

Windows 2000/XP

RTC (Real Time Clock)

LAN

USB

Power Button

RTC (Real Time Clock)

LAN

USB

Power Button

RTC (Real Time Clock)

USB and LAN

Power Button

Power Button and LAN

S5 (After Power Loss)

All components of the system are shut down.

All components of the system are shut down.

Power Button and LAN

■ By default, when activating Standby mode in Windows XP or Windows 2000, the computer will go into the S3, “Suspend to RAM,” power state.

■ The Hibernate menu in Windows XP and Windows 2000 is the same as S4, “Suspend to Disk.”

✎

For the Standby command to activate the S3 power state and not S1, all drivers must be correctly installed.

4–4 Manual Title Variable

BIOS Overview

Beep Codes and Error Messages

If the computer powers on but does not start properly, it attempts to report the error in two ways:

■ It emits a modulated audio signal followed by one or more distinct beeps—this is preboot diagnostics.

■ It displays an error message on the screen – this is a BIOS error.

Pre-Boot Audio Signal and Beeps

Preboot diagnostics is performed by a micro-controller on the system board, which generates audio signals when an error is encountered. The pre-boot audio signal can be used to identify the hardware component that needs troubleshooting or replacement:

The modulated audio signal can be interpreted by a support provider equipped with the

Virtual Call Assistant. (For more information about the Virtual Call Assistant, refer to the Virtual Call Assistant User’s Guide, available at http://www.compaq.com/support.

)

2

3

4

5

6

7

1

Beeps Issue/Meaning Resolution

✎ When the power switch is depressed, to activate the computer and there are no faults found, the computer will start up with no unusual or special sounds. If a fault is found during the start-up, the computer will generate a series of ringing tones followed by the correct number of beeps shown in this table that correspond to the fault found.

Processor fault

Power supply overload

1. Check that processor and heatsink ar properly installed.

2. Replace processor

1. Disconnect all external devices and restart the computer.

If the computer starts correctly, add devices, one-at-a-time until the overload situation is achieved and the faulty device is identified.

2. If the computer does not start, disconnect the internal drives and start the computer. If the computer starts correctly, add devices, one-at-a-time until the overload situation is achieved and the faulty device is identified.

Memory error 1. Verify that memory modules are properly installed in the computer.

2. Check that memory modules are the design specified by

Compaq.

3. Try replacing memory modules with other known good modules.

Graphics solution error Replace the system board.

Plug and Play initialization error

Replace the system board.

Corrupted ROM BIOS Reflash the ROM BIOS.

Defective system board Replace the system board.

Manual Title Variable 4–5

BIOS Overview

Pre-boot diagnostics will only detect codes 3, 4, and 5 after a 15-second time-out.

If you miss the beep code, press and hold the power button for at least five seconds until the modulated sound is emitted again. This “playback” of the memorized code can also be used to diagnose an intermittent fault.

✎

Avoid disconnecting the computer’s power cord as this will delete some of the computer’s error diagnostic information encoded in the modulated audio signal.

BIOS Error Messages

Error Message on Screen

If your computer encounters a BIOS error, it will display a BIOS error message on the screen.

Sometimes, recommendations for troubleshooting are also displayed below the error message, or you need to press

Enter to get the recommendations.

The error message and recommendations (if provided) can be used to troubleshoot the problem.

4–6 Manual Title Variable

5

Drivers and Software

This chapter describes the drivers and software preloaded with the Compaq Evo D510 e-pc.

Drivers

You can download up-to-date versions of drivers required for the Compaq Evo D510 e-pc from the “Software and Drivers” section of the support Web site at: http://www.compaq.com/support

Software

Compaq Evo D510 e-pcs come preloaded with the following software.

Operating System

■

■

■

Choice of operating systems:

■ Preloaded Windows XP Professional RTM, with possibility of downgrade to

Windows 2000 SP2

Preloaded Windows XP Home RTM

Preloaded Windows 2000 SP2

Linux offer available (no preload, only a CD in the box)

Application Software

■

■

■

■

■

■

■

EZ CD Creator software from ROXIO included on CD-RW models

Norton Antivirus is preloaded on the system

Compaq Restore CD-ROM

Compaq Operating System CD-ROM

Microsoft Service Pack (optional)

HP e-Diagtools CD-ROM

Other CD-ROMs for Microsoft Office etc.

Technical Reference Guide 5–1

Drivers and Software

e-Diagtools

e-Diagtools, the hardware diagnostics utility, can help you diagnose hardware-related problems on your computer. For more information about this utility, refer to the e-Diagtools User's Guide.

The e-Diagtools User’s Guide is available on the e-Diagtools CD-ROM. (e-Diagtools is not available in all geographical areas.)

BIOS Updates

The system BIOS is identified by the version number JK.xx.yy (for example JK.01.01). The latest BIOS version for your PC and instructions for updating the BIOS can be downloaded from the Support Web site at: http://www.compaq.com/support

5–2 Technical Reference Guide