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Data Sheet
ASMG-PT00-00001
1W Tri-Color High Power LED
Description
The Broadcom ® 1W Tri-Color High Power LED Light Source is a high-performance, energy-efficient device that can handle high thermal and high driving current.
The low-profile package design is suitable for a wide variety of applications, especially where height is a constraint.
The package is compatible with the reflow soldering process. This will give more freedom and flexibility to the light source designer.
Features
Available in tri-color
Energy efficient
Compatible with reflow soldering process
High current operation
Long operation life
Silicone encapsulation
Moisture sensitivity level 1
Applications
Sign backlight
Retail display
Commercial lighting
Decorative lighting
Architectural lighting
CAUTION!
This LED is Class 3B ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Broadcom ASMG-PT00-DS100
March 23, 2018
ASMG-PT00-00001 Data Sheet
Package Dimensions
1W Tri-Color High Power LED
NOTE:
1. All dimensions are in millimeters (mm).
2. Tolerance is ± 0.2 mm unless otherwise specified.
3. Encapsulation = silicone.
4. Terminal finish = silver plating.
5. Thermal pad is connected to the anode of red.
Broadcom ASMG-PT00-DS100
2
ASMG-PT00-00001 Data Sheet
Device Selection Guide
T
J
= 25°C, I
F
= 150 mA.
Luminous Flux, Ø
V
(lm a, b
Part Number Color Min.
Typ.
Max.
ASMG-PT00-00001 Red
Green
25.0
38.0
28.0
45.0
35.0
54.0
Blue 8.1
9.5
11.5
a. Luminous flux is the total flux output as measured with an integrating sphere at a mono pulse condition.
b. Luminous flux tolerance = ±10%.
Absolute Maximum Ratings
Parameter
DC Forward Current a
Peak Forward Current b
Reverse Voltage
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
a. Derate linearly as shown in Figure 7
and
b. Duty factor = 10%, frequency = 1 kHz.
Rating
200
250
Not designed for reverse bias
120
-40 to +105
-40 to +120
Units mA mA
°C
°C
°C
1W Tri-Color High Power LED
Dice Technology
AllnGaP
InGaN
InGaN
Broadcom ASMG-PT00-DS100
3
ASMG-PT00-00001 Data Sheet
Optical and Electrical Characteristics
T
J
= 25°C.
1W Tri-Color High Power LED
Parameter Min.
Typ.
Max.
Units
Viewing Angle, 2θ½ a
Forward Voltage, V
F b
Red
Green
Blue
—
1.8
2.8
2.8
155
2.2
3.1
3.0
Dominant Wavelength, d c
Red
Green
Blue
Peak Wavelength, p
Red
Green
Blue
Thermal Resistance, R
θJ-S
620.0
525.0
455.0
—
—
—
623.0
530.0
458.0
630.0
522.0
455.0
Red
Green
—
—
10
20
Blue — 10 a. 2θ½ is the off axis angle where the luminous intensity is half of the peak intensity.
—
2.8
3.7
3.7
630.0
535.0
460.0
—
—
—
—
—
—
Deg
V nm nm
°C/W b. Forward voltage tolerance = ±0.1V.
c. The dominant wavelength is derived from the CIE Chromaticity diagram and represents the perceived color of the device.
Test Conditions
I
F
= 150 mA
I
F
= 150 mA
I
F
= 150 mA
I
F
= 150 mA
LED junction to solder point
Part Numbering System
A S M G P x
1
0 0 0 x
2 x
3 x4 1
Code x
1 x
2 x
3 x
4
Description
Color
Minium flux bin (lm)
Maximum flux bin (lm)
Color bin
Option
T
00
0
Tri-color
Red:
Green:
25.0–35.0 lm
38.0–54.0 lm
Blue: 8.1–11.5 lm
Full distribution
Broadcom ASMG-PT00-DS100
4
ASMG-PT00-00001 Data Sheet
Bin Information
Flux Bin Limit (CAT)
Color
Red
Green
Blue
Tolerance = ±10%.
Bin
—
—
—
Luminous flux (lm)
Min.
25.0
38.0
8.1
Max.
35.0
54.0
11.5
Example of bin information on reel and packaging label:
BIN: 42A → Red color bin 4
→ Green color bin 2
→ Blue color bin A
1W Tri-Color High Power LED
Color Bin Limit (BIN)
Color
Red
Green
Blue
Tolerance = ±1 nm.
Bin ID
4
2
A
Forward Volage (V)
Min.
620.0
525.0
455.0
Max.
630.0
535.0
460.0
Broadcom ASMG-PT00-DS100
5
ASMG-PT00-00001 Data Sheet
Figure 1: Relative Luminous Flux vs. Mono Pulse Current
1.2
1.0
0.8
0.6
1.6
1.4
0.4
0.2
0.0
0 25
Red
Green
Blue
50 75 100 125
MONO PULSE CURRENT - mA
150 175 200
1W Tri-Color High Power LED
Figure 2: Forward Current vs. Forward Voltage
200
180
160
140
120
100
80
60
40
20
0
0 0.5
1
Red
Green
Blue
1.5
2 2.5
FORWARD VOLTAGE - V
3 3.5
4
Figure 3: Dominant Wavelength Shift vs. Mono Pulse Current Figure 4: Relative Light Output vs. Junction Temperature
14
12
10
8
6
4
2
0
-2
-4
0
Red
Green
Blue
20 40 60 80 100 120 140 160 180 200
MONO PULSE CURRENT -mA
120
100
80
60
40
20
0
25
Red
Green
Blue
50 75
JUNCTION TEMPERATURE, T
J
100
-°C
125
Figure 5: Forward Voltage Shift vs. Junction Temperature
0.0
-0.1
0.2
0.1
-0.2
-0.3
-0.4
-0.5
-0.6
25
Red
Green
Blue
50 75
JUNCTION TEMPERATURE,T
J
100
- °C
125
Figure 6: Dominant Wavelength Shift vs. Junction
Temperature
2.0
1.0
0.0
-1.0
-2.0
25
6.0
5.0
4.0
3.0
Red
Green
Blue
50 75 100
JUNCTION TEMPERATURE, T
J
-°C
125
Broadcom ASMG-PT00-DS100
6
ASMG-PT00-00001 Data Sheet
Figure 7: Derating Curve According to Solder Point
Temperature (T
S
)
1W Tri-Color High Power LED
Figure 8: Derating Curve According to Ambient Temperature
(T
A
) . Derated based on T
JMAX and Blue and Rθ
= 120°C, Rθ
J-A
J-A
= 60°C/W for Green.
= 50°C/W for Red
250
250
Red and Blue
200
200
150
Green
150
Red
Green
Blue
100
100
50
50
0
0 20 40 60 80
SOLDER POINT TEMPERATURE, T
S
- °C
100 120
0
0 30 60
AMBIENT TEMPERATURE, T
A
90
- °C
120
Figure 9: Pulse Handling Capability at T
S
≤ 100°C for AllnGaP
1E-05 0.0001
0.001
0.01
0.1
t p
- PULSE DURATION sec
1 10
Figure 10: Pulse Handling Capability at T
S
≤ 100°C for InGaN
0.30
0.29
0.28
0.27
0.26
0.25
0.24
0.23
0.22
0.21
0.20
0.19
0.18
0.17
0.16
0.15
1E-05 0.0001
0.001
t
0.01
0.1
p
- PULSE DURATION sec
1 10
Figure 11: Radiation Pattern for Red
1.00
Figure 12: Radiation Pattern for Green
1.00
0.75
0.75
0.50
0.50
0.25
0.25
0.00
-90 -60 -30 0 30
ANGULAR DISPLACEMENT - DEGREES
60 90
0.00
-90 -60 -30 0 30
ANGULAR DISPLACEMENT - DEGREES
60 90
Broadcom ASMG-PT00-DS100
7
ASMG-PT00-00001 Data Sheet
Figure 13: Radiation Pattern for Blue
1.00
0.75
0.50
0.25
0.00
-90 -60 -30 0 30
ANGULAR DISPLACEMENT - DEGREES
60 90
Figure 15: Recommended Soldering Land Pattern (mm)
1W Tri-Color High Power LED
Figure 14: Spectral Power Distribution
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380 480 580
WAVELENGTH - nm
680
Red
Green
Blue
780
Units: mm.
Broadcom ASMG-PT00-DS100
8
ASMG-PT00-00001 Data Sheet
Figure 16: Carrier Tape Dimensions
NOTE:
1. Drawing not to scale.
2. All dimensions are in millimeters.
3. Tolerance is ± 0.10 mm unless otherwise specified.
1W Tri-Color High Power LED
Broadcom ASMG-PT00-DS100
9
ASMG-PT00-00001 Data Sheet
Figure 17: Reel Dimensions
1W Tri-Color High Power LED
A
178.0±1.0
C
13.1±0.5
N
60.0±0.5
W2
16.2±0.5
NOTE:
1. 500 pieces per reel.
2. Drawing not to scale
3. All dimensions are in millimeters.
Broadcom ASMG-PT00-DS100
10
ASMG-PT00-00001 Data Sheet
Soldering
Recommended reflow soldering conditions:
Figure 18: Recommended Reflow Soldering Profile
10 - 30 SEC.
255 - 260 q C
3°C/SEC. MAX.
217 q C
200 q C
150 q C
6°C/SEC. MAX.
3 q C/SEC. MAX.
60 - 120 SEC.
100 SEC. MAX.
TIME
(Acc. to J-STD-020C)
Do not perform reflow soldering more than twice.
Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot.
Use reflow soldering to solder the LED. Hot plate should only be used for rework if unavoidable but must be strictly controlled to the following conditions:
– LED temperature = 260°C max.
– Time at maximum temperature = 20s max.
Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hot plate.
Hand soldering is not recommended.
Precautionary Notes
Handling Precautions
The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Observe special handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the
LED. Do refer to Application Note AN5288, S ilicone
Encapsulation for LED: Advantages and Handling
Precautions for more information.
Do not poke sharp objects into the silicone encapsulant.
Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond.
1W Tri-Color High Power LED
Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body.
Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs.
The surface of the silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting too much pressure on the silicone. Ultrasonic cleaning is not recommended.
For automated pick-and-place, Broadcom has tested the following nozzle size to work well with this LED.
However, due to the possibility of variations in other parameters, such as pick-and-place machine maker/ model and other settings of the machine, verify that the selected nozzle will not cause damage to the LED.
Figure 19: Nozzle Size
Storage
The soldering terminals of these LEDs are silver plated.
If the LEDs are exposed in an ambient environment for too long, the silver plating might be oxidized and thus affecting its solderability performance. As such, keep unused LEDs in a sealed moisture barrier bag (MBB) with desiccant or in desiccator at <5%RH.
Application Precautions
The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance.
The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, ensure that the reverse bias voltage does not exceed the allowable limit of the
LED.
Broadcom ASMG-PT00-DS100
11
ASMG-PT00-00001 Data Sheet
Do not use the LED in the vicinity of material with sulfur content, in environments of high gaseous sulfur compound and corrosive elements. Examples of materials that may contain sulfur are rubber gaskets,
RTV (room temperature vulcanizing) silicone rubber, rubber gloves, and so on. Prolonged exposure to such environments may affect the optical characteristics and product life.
Avoid rapid changes in ambient temperature especially in high-humidity environments as this will cause condensation on the LED.
If the LED is intended to be used in harsh or outdoor environments, protect the LED by means of protective cover against damages caused by rain water, dust, oil, corrosive gases, external mechanical stress, and so on.
Thermal Management
Optical, electrical and reliability characteristics of LED are affected by temperature. The junction temperature (T
J
) of the LED must be kept below allowable limit at all times. T
J can be calculated as follows:
T
J
= T
S
+ R
θJ-S
× I
F
× V
Fmax where T
S
= LED solder point temperature as shown in the following figure (°C)
R
θJ-S
= Thermal resistance from junction to solder point (°C/W)
I
F
= Forward current (A)
V
Fmax
= Maximum forward voltage (V)
Figure 20: Thermal Management
1W Tri-Color High Power LED
Eye Safety and Precautions
LEDs may pose optical hazards when in operation. Do not look directly at operating LEDs as it may be harmful to the eyes. For safety reasons, use appropriate shielding or personnel protection equipment.
To measure the soldering point temperature, a thermocouple can be mounted on the T
S the preceding figure. Verify the T
S
point as shown in
of the LED in the final product to ensure that the LEDs are operated within all maximum ratings stated in the datasheet.
Broadcom ASMG-PT00-DS100
12
Disclaimer
Broadcom's products and software are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical devices or applications. The customer is solely responsible, and waives all rights to make claims against Broadcom or its suppliers, for all loss, damage, expense, or liability in connection with such use.
Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries, and/or the EU.
Copyright © 2018 Broadcom. All Rights Reserved.
The term “Broadcom” refers to Broadcom Inc. and/or its subsidiaries. For more information, please visit www.broadcom.com
.
Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.

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