LG CU575 Service Manual
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Date: Mugust, 2007 / Issue 1.0
Service Manual
CU575
Table Of Contents
1. INTRODUCTION .............................. 5
1.1 Purpose................................................... 5
1.2 Regulatory Information............................ 5
2. PERFORMANCE...............................7
2.1 System Specification................................7
2.2 Using Condition (Accessory)....................7
2.3 Radio Performance ..................................8
2.4 Current Consumption.............................11
2.5 Operation Time ......................................11
2.6 RSSI Bar ................................................11
2.7 Battery Bar .............................................12
2.8 BACKUP BATTERY : Over 50 hours ....12
2.9 Sound Level ...........................................12
3. RF TECHNICAL BRIEF...................13
3.1 MSM6260 ( Block Diagram)...................13
3.2 RF Block Diagram..................................14
3.3 Memory ..................................................15
3.4 Camera & LCD Interface........................16
3.5 Interface USB,UART,SIM,JTAG ............17
3.6 Peripheral...............................................18
3.7 Audio Block Diagram .............................19
3.8 Digital Baseband(DBB/MSM6260).........20
3.9 Subsystem(MSM6260) ..........................23
3.10 Power Block .........................................30
3.11 External memory interface ...................35
3.12 H/W Sub System..................................36
3.13 Main Features ......................................53
4.9 USB Troubleshooting.............................87
4.10 SIM Detect Troubleshooting ................89
4.11 Camera Troubleshooting .....................91
4.12 Keypad Backlight Troubleshooting ......92
4.13 Folder ON/OFF Troubleshooting .........93
4.14 Main LCD Troubleshooting ..................94
4.15 Receiver Path ......................................95
4.16 Headset path........................................97
4.17 Speaker phone path.............................99
4.18 Main microphone ...............................101
4.19 Headset microphone..........................103
5. DOWNLOAD .................................105
5.1 Introduction ..........................................105
5.2 Downloading Procedure.......................105
5.3 Troubleshooting Download Errors .......119
5.4 Caution.................................................126
6. BLOCK DIAGRAM ........................127
6.1 CU575 Block Diagram .........................127
7. Circuit Diagram ............................129
8. BGA ...............................................139
9. PCB LAYOUT ................................143
4. TROUBLE SHOOTING ...................57
4.1 RF Component.......................................57
4.2 Checking VCXO Block ...........................61
4.3 Checking Ant. SW Module Block ...........63
4.4 Checking UMTS Block ...........................66
4.5 Checking GSM Block .............................73
4.6 Power ON Troubleshooting....................79
4.7 Charger Troubleshooting
(TA Charging) ........................................81
4.8 Charger Troubleshooting
(USB Charging)......................................84
10. Calibration & RF Auto Test
Program ......................................147
9.1 Configuration of HOT KIMCHI .............147
9.2 How to use HOT KIMCHI.....................151
9.3 Example for using HOT KIMCHI ..........152
11. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 155
11.1 EXPLODED VIEW ............................ 155
11.2 Replacement Parts
<Mechanic component>.................... 157
<Main component> ........................... 160
11.3 Accessory ......................................... 178
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 LGE Internal Use Only
LGE Internal Use Only - 4 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 LGE Internal Use Only
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.
LGE Internal Use Only - 6 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2. PERFORMANCE
2.1 System Specification
Item
1. Type
2. Size
3. Weight
4. Battery
5. LCD Type
6. Accessory
1)Travel Adaptor
2)Ear-Mic Adaptor
3)Data Cable
Type / Spec.
Dual_LCD_Color Folder
98.9 x 51 x 16.9 mm
102.5g, (with 970mA Battery)
970 mAh (Li-Polymer)
TFT Main LCD(2.2’, 176 x 220), TFT Sub LCD(1.3’ 128 X160)
1) Input : AC 100~240V , Output : 5.1V,700mA
2) ELA (option)
3) USB data cable (option)
2.2 Using Condition (Accessory)
1) Maximum Using Condition (Using Environment)
Item
Available AC Input Power
Available DC Input Power
Storage Temperature
Specification
AC : 240V Max
12 V Max
-20 ~ +70 ° C
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 7 LGE Internal Use Only
2. PERFORMANCE
2) General Using Condition
Item
Output Power
Input Power
Current Consumption
Operation Temperature
Spec.
DC Power
Battery Power
AC Power
Min
3.2
100
-20
Typ.
3.7
110
Max
12
4.2
240
60
Unit
Vdc
Vdc
Vac
W
° C
2.3 Radio Performance
1) Transmitter-GSM Mode
Item
Phase Error
Frequency Error
EMC(Radiated Spurious Emission
Disturbance)
Transmitter Output power and Burst Timing
Burst Timing
Spectrum due to modulation out to less than 1800kHz offset
Spectrum due to modulation out to larger than 1800kHz offset to the edge of the transmit band
Spectrum due to switching transient
Reference Sensitivity - TCH/FS
Usable receiver input level range
Intermodulation rejection - Speech channels
AM Suppression
-GSM : -31dBm - DCS : -29dBm
Timing Advance
Specification
Rms : 5 °
Peak : 20
°
GSM850/EGSM : 0.1 ppm
DCS/PCS : 0.1 ppm
GSM850/EGSM/DCS/PCS : < -28dBm
GSM850/EGSM : 5dBm - 33dBm ± 3dB
DCS/PCS : 0dBm - 30dBm ± 3dB
<3.69us
200kHz : -36dBm
600kHz : -51dBm/-56dBm
GSM850/EGSM :
1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS/PCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Class II(RBER) : -105dBm(2.439%)
0.012(-15 - -40dBm)
± 800kHz, ± 1600kHz
: -98dBm/-96dBm (2.439%)
-98dBm/-96dBm (2.439%)
± 0.5T
LGE Internal Use Only - 8 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
- Frequency Range : GSM850(824~849MHz/869~894MHz), EGSM(880~915MHz/925~960MHz)
DCS(1710~1785MHz/1805~1880MHz), PCS (1850~1910MHz/1930~1990MHz)
- Oscillator Frequency Range : 1688 ~ 1736 MHz
- Intermediate Frequency : None
- Normal Maximum Output Power : 1995.3 mW(33dBm)
2)Transmitter - WCDMA Mode
Item
Transmit Frequency
Maximum Output Power
Frequency Error
Open Loop Power Control
Minimum Transmit Power
Occupied Bandwidth
< -50 dBm /3.84 MHz
< 5 MHz at 3.84 Mcps (99% of power)
Adjacent Channel > 33 dB @ ±5 MHz,
Leakage Power Ratio (ACLR) > 43 dB @ ±10 MHz
< -36 dBm / 1 kHz RW @ 9 kHz ≤ < 150 kHz
< -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz
< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz
Spurious Emissions
|f-f c
| > 12.5 MHz
Specification
WCDMA850 : 824 MHz ~ 849 MHz
WCDMA1900 : 1850 ~1910 MHz
+24 dBm / 3.84 MHz, +1 / -3 dB within ±0.1 PPM
Normal Conditions : within ±9 dB,
Extreme Conditions : within ±12 dB
Transmit Intermodulation
Error Vector Magnitude
Peak Code Domain Error
< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz
< -41 dBm / 300 kHz RW @ 1893.5 MHz < f < 1919.6 MHz
< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz
< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz
< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz
< -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz when Interference CW Signal Level = -40 dBc
< 17.5 %, when Pout ≥ -20 dBm
< -15 dB at Pout ≥ -20 dBm
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 9 LGE Internal Use Only
2. PERFORMANCE
3)Receiver - WCDMA Mode
Item
Receive Frequency
Reference Sensitivity Level
Maximum Input Level
Adjacent Channel
Selectivity (ACS)
Blocking Characteristic
Spurious Response
Intermodulation
Spurious Emissions
Specification
WCDMA850 : 849 MHz ~ 894 MHz
WCDMA1900 : 1930 ~1990 MHz
BER < 0.001 when Î or
= -106.7 dBm / 3.84 MHz
BER < 0.001 when Î or
= -25 dBm / 3.84 MHz
ACS > 33 dB where BER < 0.001 when Î or
= -92.7 dBm / 3.84 MHz
& I oac
= -52 dBm / 3.84 MHz @ ±5 MHz
BER < 0.001 when Î or
= -103.7 dBm / 3.84 MHz
& I blocking
= -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz or I blocking
= -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz
BER < 0.001 when Î or
= -103.7 dBm / 3.84 MHz & I blocking
= -44 dBm
BER < 0.001 when Î or
= -103.7 dBm / 3.84 MHz
& I ouw1
= -46 dBm @ F uw1
(offset) = 10 MHz
& I ouw2
= -46 dBm / 3.84 MHz @ F uw2
(offset) = ±20 MHz
< -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz
< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz
LGE Internal Use Only - 10 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2.4 Current Consumption
Sleep Mode
Standby
Talk Mode
NO SVC Mode
Power Off
(Backup Battery Charging)
WCDMA Only
1.5mA(sleep current) ↓
3.8mA(DRX=1.28sec) ↓
VC 13dBm
(low power mode) : 323 mA ↓
TBD
300 µ A ↓
500 µ A ↓
2.5 Operation Time
WCDMA
Only
GSM
Only
Stand by
250 hours ↑ = 3.8mA
↓
(970mAh battery,
DRX cycle = 1.28)
250 hours ↑ = 3.8mA
↓
(970mAh battery,
Paging frame class6)
Voice Call
180 mins ↑ = 323mA
↓
(970mAh battery,
TX = 12dBm)
180 mins ↑ = 323mA
↓
(970mAh battery,
TX = Level 5)
GSM Only
1.5mA(sleep current) ↓
3.8mA(PM=6) ↓
323 mA (Tx Lvl:5)
TBD
300 µ A ↓
500 µ A ↓
VT
/
/
2.6 RSSI Bar
Level Change
1) BAR 5
2) BAR 5 → 4
3) BAR 4 → 3
4) BAR 3 → 2
5) BAR 2
→
1
6) BAR 1
→
0
WCDMA
-82 ± 2 dBm
-82 ± 2 dBm
-87 ± 2 dBm
-92 ± 2 dBm
-95
±
2 dBm
-98
±
2 dBm
GSM
-85 ± 2 dBm
-85 ± 2 dBm
-90 ± 2 dBm
-95 ± 2 dBm
-100
±
2 dBm
-105
±
2 dBm
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 11 LGE Internal Use Only
2. PERFORMANCE
2.7 Battery Bar
Indication
Bar3
Bar 3 → 2
Bar 2
→
1
Bar 1 → Empty
Low Voltage, Warning message+
Blinking
Power Off
Standby
3.75 ± 0.05V
3.75 ± 0.05V
3.66 ± 0.05V
3.58 ± 0.05V
3.51 ± 0.05V (Stand-by) / 3.58 ± 0.05V (Talk)
[Interval : 3min(Stand-by) / 1min(Talk)]
3.28 ± 0.05V
2.8 BACKUP BATTERY : Over 50 hours
(When Normal POWER OFF/EMERGENCY OFF)
2.9 Sound Level
Key Tone
1) Standby : a) Speaker : 70~120dBspl (When 30cm distance, Maximum Tone) b) Headset : 70~100dBspl c) Warning Tone : 70~120dBspl (When 30cm distance, Maximum Tone)
2) Talk : a) Speaker : 70 ~ 100dBspl b) Headset : 70 ~ 100dBspl (Key Tone (In Calling) 100dBspl under) c) Warning Tone : 70~100dBspl (When 30cm distance, Maximum Tone)
LGE Internal Use Only - 12 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 MSM6260 ( Block Diagram)
SDRAM
512M
NAND Flash
1G
LCD
(2.2inch)
Camera 1.3M
CAMERA
PROCESSING
(Default 8bit
Interface)
GRAPHICS
Open GL ES
3D, 2D
VIDEO
MPEG-4
H.263, H.264
AUDIO
MP3, AAC,
EVRC, QCELP
AMR, CMX, MIDI
EBI 1 EBI 2
DUAL MEMORY BUS
MSM6260
Modem QDSP 4000
PLL
QDSP 4000
ARM 926ejs
With Jazelle
CONNECTIVITY
GSM/GPRS/EDGE processor
UMTS, WCDMA,
HSDPA processor
BT 1.2
processor
GPIO
RF SBI
Rx ADC
Tx DAC
PM6650
USIM
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 13 LGE Internal Use Only
3. TECHNICAL BRIEF
3.2 RF Block Diagram
FRONT
END
MODULE
SP8T
-LB_LNA_IN
-HB_LNA_IN
RFR6275
PLL
RX_IQ -
SSBI -
Coupler
WCDMA
Dual PA
TX SAW
FILTER RX SAW
FILTER
RX SAW
FILTER
Loop filter
SBDT -
PM6650
VCTCXO
19.2MHz
Coupler
TX SAW
FILTER
-LB_RF_OUT2
-HB_RF_OUT1
PLL2 PLL1
VCONTROL-
-PWD_DET_IN
UMTS RF
GSM RF
GSM
QUAD PA
GCELL/EGSM TX SAW
FILTER
DCS/PCS
BLUETOOTH RF
-GCELL_INP
-GCELL_INN
-EGSM_INP
-EGSM_INN
-DCS_INP
-DCS_INN
-GPCS_INP
-GPCS_INN
-LB_RF_OUT1
-HB_RF_OUT2
RTR6275
BLUETOOTH RF MODULE
TCXO
BT_SBST/CK/DT
BT_RX_TX_N
BT_DATA
SBDT -
RF_ON -
RX_IQ -
TX_IQ -
DAC_REF -
- RX_IQ
- SSBDT_RFR
-PM_SBDT
-TCXO
-TCXO_EN
-TRK_LO_ADJ
MSM6260
-TX_AGC_ADJ
-SSBDT_RTR
-TX_ON
-TX_IQ
-DAC_REF
BT_SBST/CK/DT
BT_RX_TX_N
BT_DATA
LGE Internal Use Only - 14 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.3 Memory
SDRAM
512Mb
(64MB)
EBI1
ADDRESS[14:0]
DATA[31:0]
WE*
CS*
CAS*
RAS*
CLK_EN
CLK
DQM[3:0]
TFLASH
TFLASH_CMD
TFLASH_DATA
TFLASH_CLK
TFLASH_DECT_N
MSM6260
EBI2
NAND_CS*
NAND_RE*
NAND_WE*
NAND_CLE
NAND_WP*
NAND_ALE
NAND_READY
DATA [15:0]
SIM_RESET
SIM_IO
SIM_CLK
PMIC
NAND
1Gb
(128MB)
USIM
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 LGE Internal Use Only
3. TECHNICAL BRIEF
3.4 Camera & LCD Interface
VREG_CAM_2.7V
VREG_CAM_1.8V
IOVDD_2.8V (MSMP)
1.3M
Camera
CAM_RESET
CAM_PWDN
I2C_SCL
I2C_SDA
CAM_MCLK
CAM_PCLK
CAM_VSYNC
CAM_HSYNC
CAM_DATA[7:0]
MSM6260
VREG_LCD_2.8V
LCD_RESET_N
EBI2_WE_N
LCD_ADS
LCD_IF_MODE
EBI2_DATA[15:0]
LCD_CS_N
SUB_LCD_CS_N
M_LCD 2.2'
TFT(QCIF)
S_LCD 1.3'
TFT(QQVGA)
LGE Internal Use Only - 16 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.5 Interface USB,UART,SIM,JTAG
MSM6260
USB
PM6650-2
USB_DAT
USB_SE0
USB_OE_N
USB
TRANSCEIVER
VBUS
D+
D-
UART3
/PM_SBI
SSBDT_PM
UART2
/RUIM1
PM6650
SBI
I/O
RST
CLK
USIM
TRANSCEIVER
UART1
RX
TX
JTAG Interface
JTAG
USB , UART
JTAG
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17 LGE Internal Use Only
3. TECHNICAL BRIEF
3.6 Peripheral
+VPWR
MAIN KEYPAD backlight
Motor
MOTOR_PWR
PM_ON_SW_N
TCXO
(19.2MHz)
PM6650-2
KYPD_DRV_N
VIB_DRV_N
GP1_DRV_N
LED,Motor
Driver
Xtal:sleep
(32.768kHz)
RESET_IN_N
PS_HOLD
TCXO_EN
BUFF_TCXO
SLEEP_CLK
PM_INT_N
Xtal:USB
(48MHz)
MSM6260
Remote PWR ON (Recep)
USB (Recep)
USB_D+, D-, VBUS
USIM
PA_THERM
USB Trans
AMUX_IN1
AMUX_IN2
RUIM_IO ,CLK,
RST_N
USIM Level
Trans
SBI
USB_DAT, SE0 , OE_N
AMUX_OUT
VBAT_SENSE
TTY_ADC_DET
REF_ADC
VBAT_TEMP
RUIM_M_IO, CLK, RST_N
SSBDT_PM
UART TX/RX
JTAG CON, UART,USB
USB_D+,D-,VBUS
TRST_N, TCK, TMS, TDI, TDO, RTCK
USB
HKADC0
HKADC1
HKADC3
HKADC4
HKADC5
ADC
UART2 (USIM)
UART3 (PM_SBI)
UART1 (IrDA)
JTAG
+VPWR
BACKLIGHT_CTRL
TFLASH_DET_N
SDCC_CMD
SDCC_DATA
SDCC_CLK
FOLDER_DET_N
KEY_ROW(0:4)
KEY_COL(0:5)
HOOK_SENSE
EAR_SENSE_N
TTY_ADC_DET
TFLASH
Hall Sensor
KEY
EAR JACK
LGE Internal Use Only - 18 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.7 Audio Block Diagram
MSM6260
AMP_N
AMP_P
SPK_AMP_EN
HPH_L
HPH_R
RCV+
RCV-
AMP
TPA2010D
AMP_SPK+
AMP_SPK-
NLA5223B
(Analog
Switch)
SPK+
SPK-
Loud SPEAKER
18x13 ,3.7T
8ohm, 0.8W
MICBIAS
MIC1P
MIC1N
MIC
4Pie, 1.5T
-42dB +/-3dB
EAR_SENSE_N
TTY_ADC_DET
HOOK_SENSE
MIC2P
VREG_MSMP_2.7V
EAR JACK
4 Pole(18 PIN MMI)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 19 LGE Internal Use Only
3. TECHNICAL BRIEF
3. BB Technical Description
3.8 Digital Baseband(DBB/MSM6260)
3.8.1 General Description
A. Features(MSM6260)
• Support for multimode operation - HSDPA, tri-band WCDMA (UMTS), quad GSM/GPRS/EDGE, and GPS.
• Support for HSDPA downlink up to 3.6 Mbps
• Support for WCDMA (UMTS) uplink data rate up to 384 kbps
•
High-performance ARM926EJ-S running at up to 270 MHz for 3.6 Mbps HSDPA
• ARM Jazelle Java hardware acceleration for faster Java-based games and other applets
• QDSP4000 high-performance DSP cores
• Integrated gpsOne position location technology functionality
• Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals
•
Qcamera with 30 fps QCIF viewfinder resolution, and support for 3 MP camera sensors
• Direct interface to digital camera module with video front end (VFE) image processing
• True 3D graphics for advanced wireless gaming
• SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and IMEI integrity. Support for Qfuse.
•
Audio on par with portable music players
• Vocoder support (AMR, FR, EFR, HR)
• Advanced 14 x 14 mm, 0.5-mm pitch, 409-pin lead-free CSP packaging technology
• SD/SDIO hardware support
LGE Internal Use Only - 20 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
SPDT
GSM Tx/Rx
1800/1900
850/900
GSM
PAM
TX_SAW
900
GSM 850 Rx
GSM 900 Rx
GSM 1800 Rx
GSM-VCO
GSM 1900 Rx
I/
Q
RTR6275
WCDMA
Tx/Rx
850
Coupler TX_SAW
WCDMA
PAM
1900
Coupler
TX_SAW
W-VCO
S
S
BI
HDET
MSM6260
SXGA
TPA2
010
Receiver
MIC
SPE
AKE
R
Stereo Headset
TFLA
SH
LCD
(2.2î QCIF)
NAND 1G
SDRAM
512M
LNA
1900
RX_SAW
RFR6275
LNA W-VCO
S
S
BI
850
RX_SAW
S
S
BI
Power
PM
6650
USIM
USB
+5V
Bluetooth
Figure. Simplified Block Diagram
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 21 LGE Internal Use Only
3. TECHNICAL BRIEF
3.8.2 Block Diagram(MSM6260)
SDRAM
512M
NAND Flash
1G
LCD
(2.2inch)
Camera
1.3M
CAMERA
PROCESSING
(Default 8bit
Interface)
GRAPHICS
Open GL ES
3D, 2D
VIDEO
MPEG-4
H.263, H.264
AUDIO
MP3, AAC,
EVRC, QCELP
AMR, CMX, MIDI
EBI 1 EBI 2
DUAL MEMORY BUS
MSM6260
Modem QDSP 4000
PLL
QDSP 4000
ARM 926ejs
With Jazelle
CONNECTIVITY
GSM/GPRS/EDGE processor
UMTS, WCDMA,
HSDPA processor
BT 1.2
processor
GPIO
RF SBI
Rx ADC
Tx DAC
PM6650
USIM
Figure. Simplified Block Diagram of MSM6260
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3. TECHNICAL BRIEF
3.9 Subsystem(MSM6260)
3.9.1 ARM Microprocessor Subsystem
The MSM6260 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, SDRAM, and NAND-Flash devices. Through a
QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6275, RFR6275 and PM6650 devices.
3.9.2 WCDMA R99 features
The MSM6260 device supports the W-CDMA FDD release 99, including the following features:
■
All modes and data rates for W-CDMA frequency division duplex (FDD), with the following restrictions:
❏ The downlink supports the following specifications:
• Up to four physical channels, including the broadcast channel (BCH), if present
• Up to three dedicated physical channels (DPCHs)
• Spreading factor (SF) range support from 4 to 256
• The following transmit diversity modes are supported:
Space time transmit diversity (STTD)
Time-switched transmit diversity (TSTD)
Closed-loop feedback transmit diversity (CLTD)
■ The uplink supports the following specifications:
❏ The uplink provides the following UE support:
• One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary
• A maximum data rate of 384 kbps
❏
Full SF range support from 4 to 256
■ SMS (CS and PS)
■ PS data rate - 384 kbps DL / 384 kbps UL
■ CS data rate - 64 kbps DL / 64 kbps UL
■
AMR (all rates)
3.9.3 GSM features
The following GSM modes and data rates are supported by the MSM6260 device hardware.
Support modes conform to release '99 specifications of the sub-feature.
■
Voice features
❏ FR
❏ EFR
❏ AMR
❏
HR
❏ A5/1, A5/2, and A5/3 ciphering
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3. TECHNICAL BRIEF
■ Circuit-switched data features
❏
9.6k
❏ 14.4k
❏ Fax
❏ Transparent and non-transparent modes for CS data and fax
❏
No sub-rates are supported.
3.9.4 GPRS features
■ Packet switched data (GPRS)
❏ DTM (Simple Class A) operation
❏
Multi-slot class 12 data services
❏ CS schemes: CS1, CS2, CS3, and CS4
❏ GEA1, GEA2, and GEA3 ciphering
■ Maximum of four Rx timeslots per frame
3.9.5 EDGE features
■ EDGE E2 power class for 8 PSK
■ DTM (simple Class A), multi-slot class 12
■ Downlink coding schemes - CS 1-4, MCS 1-9
■
Uplink coding schemes - CS 1-4, MCS 1-9
■ BEP reporting
■ SRB loopback and test mode B
■ 8-bit, 11-bit RACH
■ PBCCH support
■
1 phase/2 phase access procedures
■ Link adaptation and IR
■ NACC, extended UL TBF.
3.9.6 MSM6260 device audio processing features
■
Integrated wideband stereo CODEC
❏ 16-bit DAC with typical 88 dB dynamic range
❏ Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path
■ VR- Voice mail + voice memo
■
Acoustic echo cancellation
■ Audio AGC
■ Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8
(G2)
■
Internal vocoder supporting AMR, FR, EFR, and HR
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3. TECHNICAL BRIEF
3.9.7 MSM6260 microprocessor subsystem
■
Industry standard ARM926EJ-S embedded microprocessor subsystem
❏ 16 kB instruction and 16 kB data cache
❏ Instruction set compatible with ARM7TDMI®
❏ ARM version 5TEJ instructions
❏
Higher performance 5 stage pipeline, Harvard cached architecture
❏
Higher internal CPU clock rate with on-chip cache
■ Java hardware acceleration
■ Enhanced memory support
■ 75 MHz and 90 MHz bus clock for SDRAM
■
32-bit SDRAM
■ Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed peripherals (EBI2) such as LCD panels
■ 1.8 V memory interface support for EBI1 and 1.8V or 2.6V memory interface support for EBI2
■
NAND FLASH memory interface
❏
8/16-bit data I/O width NAND flash support
❏ 1- or 4-bit ECC
❏ 512-byte/2KB page-size support
❏ 2 chip selects supported for NAND Flash
❏
Boot from NAND
❏ Low-power SDRAM (LP-SDRAM) interface
■ Internal watchdog and sleep timers
3.9.8 Supported interface features
■
USB On-the-Go core supports both slave and host functionality
■ Three universal asynchronous receiver transmitter (UART) serial ports
■ USIM controller (via UART)
■ Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards
■
Parallel LCD interface
■ General-purpose I/O pins
■ External keypad interface
3.9.9 Supported multimedia features
■
Provide additional general purpose MIPS by using:
❏ Two QDSP4000s
❏ Dedicated hardware accelerators and compression engines
■ Improve Java, BREW, and game performance
❏ Integrated Java and 2D/3D graphics accelerator with Sprite engine
■
Enable various accessories via USB host connectivity.
❏ Integrated USB host controller functionality
■ Enable compelling visual and audio applications.
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- 25 LGE Internal Use Only
3. TECHNICAL BRIEF
Qcamera
TM
■
High-quality digital camera processing, supporting CCD or CMOS image sensors up to 3 MP
■ 30 fps QCIF viewfinder
Qtv
TM
■ Audio and video decoder that supports VOD, MOD and Broadcast multimedia services.
■
Audio CODECs supported: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows® Audio v9,
RealAudio® v8
■ Integrated stereo wideband Codec for music/digital clips
■ CMX
■
Video Codecs supported: MPEG-4, H.263, H.264, Windows Media® v9 and RealNetworks® v10
Video telephony services: Qvideophone
TM
■ A two-way mobile video conferencing solution that delivers 15 fps @ QCIF, 64kbps
■ Video CODECs supported: MPEG-4 and H.263
■
Audio CODECs supported: AMR-NB.
Qcamcorder
TM
■ Real time mobile video encoder
■ Video CODECs supported: MPEG-4, H.263
■
Audio CODECs supported: AMR-NB
■ Recording performance: 15 fps @ QCIF, 192 kbps
■ Video telephony at 15 frames per second(fps), QCIF resolution video encode at 15 fps at QCIF for camcorder capability
■
Video decode at 15 fps at QCIF resolution, streaming or offline
gpsOne
TM
■ Integrated gpsOne processing
■ Standalone gpsOne mode in which the handset acts as a GPS receiver
CMX
TM (MIDI and still image, animation, text, LED/vibrate support)
■ 72 simultaneous polyphonic tones
■ 44 kHz sampling rate
■ 512 kB wave table
■
Support of universal file formats
❏ Standard MIDI Format (SMF)
❏ SP-MIDI
❏ SMAF® Audio playback (MA-2, MA-3, MA-5)
❏
XMF/DLS
❏
MFil (requires Docomo license)
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3. TECHNICAL BRIEF
■ PNG decoder
■
Pitch bend range support
■ LED/vibrate support
■ Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2)
■ MLZ decoder
■
Integrated PNG/SAF A.T.
Features
Modem
Processor
Process technology
Supported RF platforms
(see Description of RF configurations for platform definition)
HSDPA
Enhanced antenna
Memory configuration
Boradcast interface
Power management IC
USB
MDDI
Qcamera (camera interface)
Viewfinder frame rate
QTv (video decode)
Qvideophone (video telehony)
LCD HW interface
Boot mode
MSM6260
Tri-band WCDMA
Quad-band GSM/GPRAS/EDGE
HEDGE
3.6 Mbps HSDPA
GPS
DTM
ARM926 EJ-S-270 MHz
AHB-90 MHz for 3.6 Mbps HSDPA
ARM926 EJ-S-225 MHz
AHB-75 MHz for no HSDPA
ARM926 EJ-S-122 MHz
AHB-61 MHz for no HSDPA and limited multimedia
QDSP-100 MHz
65nm
Platform B (RTR6275+RFR6275)
Platform E (RTR6275+RFR6275)
Platform F (RTR6285+receive diversity)
3.6 Mbps, category 5/6
SAIC, equalizer, receive diversity
8/16-bit NAND and 32-bit SDRAM (See Note 2)
Not supported
PMIC 6650-2
3-wire USB-OTG
Supported
Up to 3.0 M pixel support
30 fps @ QCIF
MP3, AAC, AAC+, ADPCM, MPEG4, H.263,
H.264, Real networks, Windows media, WB-AMR/+
15 fps @ QCIF
Up to 24 bpp
Trusted boot mode only
Table. Summary of MSM6260 device features
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3. TECHNICAL BRIEF
3.9.10 Serial Bus Interface(SBI)
The MSM6260 device’s SSBI is designed specifically to be a quick, low pin count control protocol for
QUALCOMM’s RTR6275, RFR6275 and PM6650 ASICs. Using the SSBI, the RTR6275, RFR6275, and
PM6650 devices can be configured for different operating modes and for minimum power consumption, extending battery life in Standby mode. The SSBI also controls DC baseband offset errors.
3.9.11 Wideband CODEC
The MSM6260 device integrates a wideband voice/audio CODEC into the mobile station modem
(MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface.
The CODEC integrates the microphone and earphone amplifiers into the MSM6260 device, reducing the external component count to just a few passive components. The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set interally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems.
3.9.12 Vocoder Subsystem
The MSM6260 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal
Echo Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable,
13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM6260 device’s integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.
3.9.13 ARM Microprocessor subsystem
The MSM6260 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM device, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices.
Through a generic single serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the RFR6275, RTR6275, and PM6650 devices.
3.9.14 Mode Select and JTAG Interfaces
The mode pins to the MSM6260 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation,
ETM mode, which enables the built-in trace mode, and test mode for factory testing.
The MSM6260 device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture.
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3. TECHNICAL BRIEF
3.9.15 General-Purpose Input/Output Interface
The MSM6260 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional
RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.
3.9.16 UART
The MSM6260 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share multiplexed pins.
■ UART1 for data
■
UART2 (can be used for USIM interface)
■
UART3 for data
3.9.17 USB
The MSM6260 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral communicating with the USB host.
Copyright © 2007 LG Electronics. Inc. All right reserved.
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- 29 LGE Internal Use Only
3. TECHNICAL BRIEF
3.10 Power Block
3.10.1 General
MSM6260, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of
MSM6260, MSM memory, RF block, Bluetooth, Micro SD, USIM and TCXO.
Major power components are :
PM6650(U701) : Phone power supply
AAT3152IWP(U401) : LCD Backlight charge pump
BH28FB1WHFV(U402) : LCD LDO
MIC2211-LGYML(U404) : Camera dual LDO
3.10.2 PM6650
The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference.
A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (undervoltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions. MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.
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3. TECHNICAL BRIEF
Figure. PM6650 Functional Block Diagram
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- 31 LGE Internal Use Only
3. TECHNICAL BRIEF
3.10.3 Charging control
A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and
ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.
3.75
± 0.05V
3.58
±
0.05V
CU575 Battery Bar Display(Stand By Condition)
3.51
±
0.05V
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3. TECHNICAL BRIEF
Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from V
DD
, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from V
DD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V). The charging current is set to 80mA.
Parameter
Trickle Current
Min
60
Typ
80
Max
100
Unit mA
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Constant Current Charging
The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.
Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.
The end of constant voltage charging is commonly detected 10% of the full charging current (110mA)
• Charging Method : CC & CV (Constant Current & Constant Voltage)
• Maximum Charging Voltage : 4.2V
• Maximum Charging Current : 600mA
• Nominal Battery Capacity : 970 mAh
• Charger Voltage : 5.1V
• Charging time : Max 3h (Except time trickle charging)
• Full charge indication current (icon stop current) : 110mA
• Low battery POP UP : Idle - 3.51V, Dedicated(GSM/WCDMA) - 3.58V
• Low battery alarm interval : Idle - 3 min, Dedicated - 1min
• Cut-off voltage : 3.28V
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3. TECHNICAL BRIEF
3.11 External memory interface
A. MSM6260
The MSM6260 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SRAM, etc.
• EBI1 Features
- 16 bit static and dynamic memory interface
- 32 bit dynamic memory interface
- 24 bits of address for static memory devices which can support up to 32MBytes on each chip select
- Synchronous burst memories supported (burst NOR, burst PSRAM)
- Synchronous DRAM memories supported
- Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses
- Pseudo SRAM (PSRAM) memory support
• EBI2 Features
- Support for asynchronous FLASH and SRAM(16bit & 8bit).
- Interface support for byte addressable 16bit devices(UB_N & LB_N signals).
- 2Mbytes of memory per chip select.
- Support for 8 bit/16bit wide NAND flash.
- Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit)
• 1Gb NAND(16bit) flash memory + 512Mb SDRAM (32bit)
• 1-CS(Chip Select) are used
Device
FLASH
SDRAM
Part Name
TY90009800J0GG
TY90009800J0GG
Interface Spec
Maker
Toshiba
Toshiba
Read Access Time
50 ns
15 ns
Table#1. External memory interface for CU575
Write Access Time
50 ns
15 ns
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- 35 LGE Internal Use Only
3. TECHNICAL BRIEF
3.12 H/W Sub System
3.12.1 RF Interface
A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)
MSM6260 controls RF part(RTR6275) using these signals.
• SBST : SSBI I/F signals for control Sub-chipset
• PA_ON1, PA_ON2 : Power AMP on RF part
• RX0_I/Q_M/P,TX_I/Q_M/P: I/Q for T/Rx of RF
• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier
WDOG_STB_SBCK1_GPIO0
SBDT1_GPIO1
PA_ON1_GPIO2
GRFC9_GPIO12
CAMCLK_PO_GP_MN_GPIO13
GPIO28
USB_RX_DATA_GPIO29
XMEM2_CS_N2_GPIO35
XMEM2_CS_N3_GPIO36
LCD_EN_GPIO37
H25
F26
H11
D5
J21
A6
N19
W15
AA15
AE13
GPIO43
SYNTH2_GPIO65
GPIO66
XMEM1_CS_N1_GPIO76
XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77
UART3_RFR_N_GPIO87
UART2_DP_RX_DATA_GPIO89
SYNTH0_GP_PDM0_GPIO92
SBST1_GPIO93
H9
B6
F8
AA1
Y6
L25
H6
F18
H18
TX_AGC_ADJ
TRK_LO_ADJ
TCXO_EN_GPIO94
PA_ON0
H13
L13
F19
F17
Q_OUT_N
Q_OUT
I_OUT_N
I_OUT
DAC_REF
A12
B12
A13
B13
F12
Q_IM_CH1
Q_IP_CH1
I_IM_CH1
I_IP_CH1
Q_IM_CH0
Q_IP_CH0
I_IM_CH0
I_IP_CH0
W23
V23
V25
W25
AA25
Y25
AB25
AC25
GP_PDM2_PA_RANGE1
GP_PDM1_PA_RANGE0
D17
H17
TRST_N
TCK
TMS
TDI
TDO
RTCK
H15
D16
F15
D15
A17
H16
AUX_PCM_CLK_GRFC14_GPIO80
AUX_PCM_DIN_GRFC13_GPIO14
AUX_PCM_DOUT_GRFC12_GPIO103
AUX_PCM_SYNC_GRFC11_GPIO102
TX_ON_GRFC10
K19
N21
G4
J8
H12
GRFC8_GPIO11
GRFC7_GPIO10
GRFX6_GPIO9
GRFC5_AUX_SBST_GPIO8
GRFC4_AUX_SBCK_GPIO7
GRFC3_GPIO6
GRFC2_GPIO5
GRFC1_AUX_SBDT_GPIO4
GRFC0_GPIO3
F10
D9
A8
B8
B4
T23
T19
D11
H10
TP202
PA_ON1
ANT_SEL3
W850 PAM
CAM_MCLK
LCD_IF_MODE
PA_ON2
TFLASH_DET_N
CAM_PWDN
CAM_LDO_EN
W1900 PAM
LCD_RESET_N
HOOK_SENSE_N
VGA_CAM_RESET
FOLDER_DETECT
TX_AGC_ADJ
TCXO_EN
TX_QM
TX_QP
TX_IM
TX_IP
DAC_REF
2K R211
Close to MSM
TRK_LO_ADJ
RX_QM
RX_QP
RX_IM
RX_IP
PA_R0
JTAG_TMS
JTAG_TDI
JTAG_TDO
JTAG_RTCK
SPK_AMP_EN
SPK_SW_ON
TX_ON
ANT_SEL2
ANT_SEL1
ANT_SEL0
GSM_SAW_SW_MODE
GSM_PA_BAND
GSM_PA_EN
JTAG_TRST_N
JTAG_TCK
Figure. Schematic of RF Interface of MSM6260
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3. TECHNICAL BRIEF
B. RFR6275(WCDMA_Rx)
• SBDT: SSBI I/F signals for control Sub-chipset
• RX0_I/Q_M/P : I/Q for Rx of RF
C. the others
• TRK_LO_ADJ : TCXO(19.2M) Control
• PA_ON1 : WCDMA(850) TX Power Amp Enable
• PA_ON2: WCDMA(1900) TX Power Amp Enable
• ANT_SEL[0-3] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)
• GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp
• GSM_PA_RAMP : Power Amp Gain Control of APC_IC
• GSM_PA_EN : Power Amp Gain Control Enable of APC_IC
• GSM_SAW_SW_MODE: GSM SAW Filter Switch
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- 37 LGE Internal Use Only
3. TECHNICAL BRIEF
3.12.2 MSM Sub System
3.12.2.1 USIM Interface
SIM interface scheme is shown in Figure.
And, there control signals are followed
• USIM_CLK : USIM Clock
• USIM_Reset : USIM Reset
• USIM_Data : USIM Data T/Rx
MSM6260
USIM CLK
USIM Reset
USIM Data
PM6650
VREG_UIM 2.85V
USIM CLK
USIM Reset
USIM Data
USIM
Figure. SIM Interface
3.12.2.2. UART Interface
UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.
GPIO_Map Name Note
GPIO_96
GPIO_95
UART_RXD
UART_TXD
Data_Rx
Data_Tx
Table. UART Interface
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3. TECHNICAL BRIEF
3.12.2.3. USB
The MSM6260 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6260 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1.
Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification,
Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5
Mbps) and full-speed (12 Mbps), both of which are supported by the MSM6260.
Name
USB_DAT
USB_SE0
USB_OE_N
USB_VBUS
USB_D+
USB_D-
Note
Data to/from MSM
Data to/from MSM
Out-Put Enable of Transceiver
USB_Power From Host(PC)
USB Data+ to Host
USB Data- to Host
Table. USB Signal Interface
USB_OE_N
USB_CNT_N
USB_VBUS
USB_DAT
USB_D+
USB_SE0
USB_D-
R711
C722
1608
47K
4.7u
14
15
16
17
18
19
20
21
USB_OE_N
VSW_5V
USB_CTL_N
USB_VBUS
USB_DAT
USB_D_P
USB_SE0
USB_D_M
GP1_DRV_N(MPP7)
Figure. Schematic of USB block(MSM6260Side & PM6650 Side)
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3.12.3 HKADC(House Keeping ADC)
The MSM6260 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize
DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels.
The MSM6260 device has six analog input pins which are multiplexed to the input of the internal HKADC.
Channel
HKADC0
HKADC1
HKADC2
HKADC3
HKADC4
HKADC5
Figure. MSM6260HKADC Block diagram
Signal
AMUX_OUT
VBATT_SENSE
No use
TTY_ADC_DET
PCB_Rev_ADC
VBATT_TEMP
Note
Battery voltage level
Ear jack Detection for TTY
PCB Version Check
Battery Temperature Check
Table. HKADC channel table
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3. TECHNICAL BRIEF
3.12.4 Key Pad
There are 24 buttons, 3 side keys and touch keys in Figure. Shows the Keypad circuit. ‘END’ Key is connected On_SW to PMIC(PM6650).
ROW0
ROW1
ROW2
ROW3
ROW4
COL0
1
4
7
*
COL1 COL2
Multi
COL3
CLR
2 3 LEFT
5
8
0
6
9
#
OK
SEND
Down
Table. Key Matrix Mapping Table
COL4
MENU
UP
Right
SEARCH
BACK
COL5
Side
(up)
Side
(down)
CAM
VREG_MSMP_2.8V
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_COL(0)
KEY_ROW(4)
KEY_COL(1)
KEY_COL(2)
KEY_COL(3)
KEY_COL(4)
KEY
501
1
504
4
507
7
STAR
STAR
502
2
505
5
508
8
510
0
HOT502
HOT3
503
3
506
6
509
9
SHARP
#
CLR
LEFT
OK
SND
DN
MENU
UP
RIGHT
SEARCH
HOT501
Figure. Keypad Circuit
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 41 LGE Internal Use Only
3. TECHNICAL BRIEF
CON602
5
4
3
2
1
SIDE KEY
R823
R821
R822
R601
470
470
470
100ohm
OUT102
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_COL(5)
ON_SW_N
D602
RB521S-30
ON_SW
END
END
PM_ON_SW_N
VREG_LCD_2.8V
TOUCH_DAT
TOUCH_CLK
TOUCH_ACK
R103
22 C101
1u
(Shild Flood)
3
4
5
1
2
6
SCL
_ATTN
GPIO2
GPIO1
GPIO0
SHLD
U1
SO2810
S9
S8
XCAP
GND0
S7
S6
18
17
16
15
14
13
Figure. Keypad Circuit (On switch, Side KEY and Touch key )
LGE Internal Use Only - 42 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.12.5 Camera Interface
CU575 Installed a 1.3M Pixel SXGA Camera.
Below figure shows the camera board to board connector and camera I/F signal.
CAM_DATA(7)
CAM_DATA(6)
CAM_DATA(5)
CAM_DATA(4)
CAM_DATA(3)
CAM_DATA(2)
CAM_DATA(1)
CAM_DATA(0)
CAM_PCLK
CAM_RESET
CAM_PWDN
24
23
22
21
20
19
18
17
16
15
14
13
1.3M
CN101
6
7
8
9
10
11
12
3
4
5
1
2
14-5602-024-000-829
I2C_SCL
I2C_SDA
CAM_VSYNC
CAM_HSYNC
CAM_MCLK
VREG_CAM_2.7V
VREG_MSMP_2.8V
VREG_CAM_1.8V
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 43 LGE Internal Use Only
3. TECHNICAL BRIEF
The Camera module is connected to LCD FPCB with 24pin Board to Board connector. Its interface is dedicated camera interface port in MSM6260. The camera port supply 24MHz master clock to camera module and receive 48MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6260.
9
10
11
6
7
8
2
3
4
5
No
1
12
13
14
15
16
17
18
19
20
21
22
23
24
Name
GND
I2C_CLK
I2C_SDA
GND
CAM_VSYNC
CAM_HSYNC
CAM_MCLK
GND
VREG_CAM_2.7V
VREG_MSMP_2.8V
VREG_CAM_1.8V
GND
CAM_PWDN
CAM_RESET
CAM_PCLK
CAM_DATA(0)
CAM_DATA(1)
CAM_DATA(2)
CAM_DATA(3)
CAM_DATA(4)
CAM_DATA(5)
CAM_DATA(6)
CAM_DATA(7)
GND
O
I
O
GND
I
I
I
GND
I
I
O
O
O
O
O
O
O
O
O
GND
Port
GND
I
I
GND
Note
GND
I2C clock
I2C data
GND
Vertical Synch
Horizontal Sync
Main clock
GND
Camera Analog power
Camera I/O power
Camera core power
GND
Camera power down(Enable)
Camera reset
Camera pixel clock
Camera data
Camera data
Camera data
Camera data
Camera data
Camera data
Camera data
Camera data
GND
Table. Interface between Camera Module and LCD FPCB (in camera module)
LGE Internal Use Only - 44 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.12.6 Folder ON/OFF Operation
There is a magnet to detect the Folder status, opened or closed.
If a magnet is close to the hall-effect switch, the voltage at pin OUT of U405 goes to 0V. Otherwise,
2.8V. This folder signal is delivered to MSM6260 GPIO92.
FOLDER_DETECT
VREG_MSMP_2.8V
R407
62
1
U405
VDD
EM-0781-T5
4
VSS
2
OUT NC
3
FOLDER_DETECT
C826
33p
Figure. Schematic of Folder ON/OFF detection circuit
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 45 LGE Internal Use Only
3. TECHNICAL BRIEF
3.12.7 Keypad Light
There are 2 White LEDs in main board backlight circuit, which are driven by KPD_DRV_N line from
PM6650.
KEY_BACK_LIGHT
+VPWR
LD501 LEWW-S47-PA
R501
100ohm
LD502
LEWW-S47-PA
R502
100ohm
Figure. Keypad Backlight Circuit
KYBD_BACKLIGHT
LGE Internal Use Only - 46 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.12.8 LCD Module (NM220CT2 : Tovis)
- The NM220CT2 model is a Color TFT Main and TFT Sub LCD supplied by TOVIS. This main
Module has a 2.2 inch diagonally measured active display area with 176(RGB)X220 resolution and sub Module has a 1.3 inch diagonally measured active display area with 128(RGB)X160 resolution. In case of Main LCD, each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes.
•
Features
- Display mode(Main LCD) : Normally White, Transmissive TN mode 65K colors
- Display mode(Sub LCD) : Normally White, Transmissive TN mode 65K colors
- LCD Driver IC: S1D19501(Main LCD,EPSON), R61502B(Sub LCD, Renesas)
- Driving Method : A-Si TFT Active Matrix
- 16 bit CPU interface Parallel
Figure. LCD Module Block Diagram
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 47 LGE Internal Use Only
3. TECHNICAL BRIEF
3.12.9 Display & LCD FPC Interface
LCD module is connected to LCD FPCB with 40 pins B TO B connector. The LCD module is controlled by 16-bit EBI2 in MSM6260
VREG_LCD_2.8V
SUB_CS_N
LCD_RESET_N
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
WLED_PWR
WLED_1
WLED_2
WLED_3
WLED_4
LCD
29
28
27
26
25
24
23
22
21
40
39
38
37
36
35
34
33
32
31
30
G2
CN102
G1
1
2
8
9
10
11
12
13
14
5
6
7
3
4
15
16
17
18
19
20
EBI2_WE_N
LCD_CS_N
LCD_ADS
EBI2_DATA(8)
EBI2_DATA(9)
EBI2_DATA(10)
EBI2_DATA(11)
EBI2_DATA(12)
EBI2_DATA(13)
EBI2_DATA(14)
EBI2_DATA(15)
LCD_IF_MODE
LCD_MAKER_ID
EBI2_OE_N
LGE Internal Use Only - 48 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.12.9.1 Audio Signal Processing & Interface
Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip
(MSM6260).
This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset.
The downlink path amplifies the signal from DBB chip (MSM6260) and outputs it to receiver (or speaker). The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (AUXOP, AUXON) are differential outputs. Earphone2 (EAR2/EAR3) is a single-ended output stage designed to drive a headset speaker.
The microphone interface consists of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.
(+16.5dB)
Figure. Audio Interface Detailed Diagram(MSM6260)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 49 LGE Internal Use Only
3. TECHNICAL BRIEF
MSM6260 CODEC pins
VREG_MSMP_2.8V
EAR_MIC2P
FB1
HH-1M1005-601JT
2.2K
R801
C815
10u tcc_1608h_9_r
TTY_ADC_DET
U303
SP0204LE5-PB
G3
PWR
G2
G1
OUT
5
4
3
2
1
MIC
TTY DETECT
0.1u
C801
MIC2P
VREG_MSMP_2.8V
C802
0.1u
VIN-
VIN+
4
3
5
VCC 1
OUT
HOOK_SENSE_N
GND
2
U801
NCS2200SQ2T2G
MICBIAS
R835
R834 47
47
C838 0.1u
C837 0.1u
MIC1N
MIC1P
LGE Internal Use Only
Figure . Audio part schematics
- 50 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
RCV-
AMP_SPK-
SPK_SW_ON
R837
Select RCV / SPK
U301
NLAS5223BMNR2G
R836
GND NC1
6 5
15
NC2 IN1
7 4
15
IN2 COM1
8 3
9
COM2
10
NO2
NO1
2
VCC
1
RCV+
AMP_SPK+
C839
100000pF
+VPWR
SPK-
SPK+
Audio AMP
AMP_N
AMP_P
SPK_AMP_EN
C318
22n
C319
22n
R312
51K
R314
51K
10u
C317
C1
U302
IN-
TPA2010D1YZF
B1
VDD
B2
PVDD
A1
IN+
C2
_SHDN
VO-
A3
VO+
C3
EUSY0278601
C321
1u
+VPWR
AMP_SPK-
AMP_SPK+
Figure . Audio part schematics
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 51 LGE Internal Use Only
3. TECHNICAL BRIEF
3.12.9.2 Audio Mode
There are three audio modes (Voice call, speaker phone, MIDI/MP3).
MODE
Voice Call
Speaker phone
MIDI
MP3
Device
Receiver Mode
Loud Mode
Headset
Loud Mode
Loud Mode
Headset
Loud Mode
Headset
Table. Audio Mode
Description
Receiver Voice Call
Speaker Phone
Headset Voice Call
Speaker Phone
Speaker MIDI Bell
Headset MIDI Bell
Speaker MP3
Headset MP3
Audio & Sound Main Component
There are 5 main components in CU575.
1
2
3
4
5
Component
MSM6260
Audio amp.
Speaker
Microphone
Ear jack
Design No.
U201
U302
In LCD-FPCB
U303
CON801
Maker Part No.
MSM6260
TPA2010D1YZF
EMS1813VCD2P
SP0204LE5-PB
GU041-18P-E1000
Note
Base-Band Modem
Class-D Audio Amp
8 ohm Speaker/receiver
-42 dB microphone
Ear jack
Table. Audio main component list
LGE Internal Use Only - 52 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.13 Main Features
1. LG-CU575 Main features
- Dual Clamshell Type
- WCDMA(850, 1900) + EDGE Quad(Class10)
- Color LCD(Main:65K TFT, 2.2’, Sub:TFT, 1.3”)
- SXGA(1.3M) Camera
- 18 x 13 speaker
- Stereo Headset
- Speaker phone(in GSM and WCDMA)
- 72 Poly Sound
- MP3/AAC decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth, USB
- Micro SD card
- 970 mAh (Li-Ion)
3. TECHNICAL BRIEF
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 53 LGE Internal Use Only
3. TECHNICAL BRIEF
2. CU575 Main Component
Bluetooth
Logic
/Audio
RF
Main board, Bottom
Logic
/Audio
Main board, Top
LGE Internal Use Only
LCD FPCB
- 54 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
RF
U108
FL102
FL104
U110
FL105
Reference
U101
U102
U103
U108
U110
Description
FEM
RTR6275
GSM PAM
WCDMA PAM
RFR6275
Reference
FL101
FL102
FL104
FL105
FL106
Description
GSM SAW
W1900 Duplexer
W850 Duplexer
W850 SAW
W1900 SAW
U102
FL101
U103
U101
FL106
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 55 LGE Internal Use Only
3. TECHNICAL BRIEF
Audio/Logic/BT
U109
CON601
S801
X702
CON401
U303
Reference
U109
U201
U302
U303
U701
U804
U806
Description
BT module
MSM6260
Audio AMP
MIC
PMIC
OVP IC
Memory
Reference
BAT401
S801
X701
X702
CON801
CON401
CON601
Description
Back-up Battery
Micro SD socket
X-tal(32.768KHz)
TCXO
MMI connector
USIM connector
FPCB connector
LGE Internal Use Only - 56 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
BAT401
U806
U201
U302
X701
U701
U804
CON801
4. TROUBLE SHOOTING
4.1 RF Component
4. TROUBLE SHOOTING
Bottom Side
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 57 LGE Internal Use Only
4. TROUBLE SHOOTING
LGE Internal Use Only - 58 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.1.1 SIGNAL PATH_UMTS RF
4. TROUBLE SHOOTING
WCDMA TX PATH
WCDMA RX PATH
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 59 LGE Internal Use Only
4. TROUBLE SHOOTING
4.1.2 SIGNAL PATH_GSM RF
GSM TX PATH
GSM RX PATH
LGE Internal Use Only - 60 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.2 Checking VCXO Block
The reference frequency (19.2MHz) from X702 (VCTCXO) is used in UMTS TX part, GSM part and BB part.
Check 1. Crystal part
If you already check this crystal part, you can skip check 1.
TP1
TCXO
VREG_TCXO_2.85V
TP2
7
8
NC3
NC4
NC2
NC1
6
5
3
OUTPUT GND
2
4
VCC VCONT
DSA321SCE-19.2M
X702
1
100ohm R127
TRK_LO_ADJ
TCXO_PM
RTR6275_TCXO
RFR6275_TCXO
C56 100p
C58 1000p
C62 1000p
TP3
TP4
R131 100K
C66 1000p
VCC
5
1
U106
TC7SH04FS
2
GND
4
C64
1000p
TCXO_BT
TP2
Schematic of the Crystal Part
TP1
Test Point (Crystal Part)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 61 -
TP3
TP4
LGE Internal Use Only
4. TROUBLE SHOOTING
Check C714 of PMIC (U701)
Check R211 of MSM (U201)
LGE Internal Use Only - 62 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.3 Checking Ant. SW Module Block
4. TROUBLE SHOOTING
TP1
ANT_SEL3
ANT_SEL2
ANT_SEL1
ANT_SEL0
Antenna Switch Block(Bottom)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 63 LGE Internal Use Only
4. TROUBLE SHOOTING
TP1
VREG_RF_2.85V
C11
0.1uF
C12
33p
15nH L108
14
13
12
11
VC1
VC2
VC3
VC4
10
VDD
23
24
26
27
28
9
18
20
21
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GSM1800RX1
GSM1800RX2
GSM1900RX1
GSM1900RX2
GSM900RX1
GSM900RX2
GSM850RX1
GSM850RX2
3
4
1
2
5
6
7
8
U101 UMTS1
UMTS2
15
16
GSM1800_1900TX
GSM850_900TX
22
25
NC
17
LMSP4LMA-573TEMP
ANT_SEL0
ANT_SEL1
ANT_SEL2
ANT_SEL3
1K R112
1K R113
1K R115
1K R116
Schematic of the Antenna Switch Block
CONTROL LOGIC
Mode
GSM850/900 Tx
GSM1800/GSM1900 Tx
GSM850 Rx
GSM900 Rx
GSM1800 Rx
GSM1900 Rx
UMTS1
UMTS2
Idle
Vc1
1.8-3.0V
1.8-3.0V
0-0.2V
0-0.2V
0-0.2V
0-0.2V
1.8-3.0V
1.8-3.0V
0-0.2V
Vc2
1.8-3.0V
0-0.2V
0-0.2V
0-0.2V
1.8-3.0V
1.8-3.0V
0-0.2V
0-0.2V
0-0.2V
Logic Table of the Antenna Switch
Vc3
0-0.2V
0-0.2V
0-0.2V
1.8-3.0V
1.8-3.0V
0-0.2V
1.8-3.0V
1.8-3.0V
0-0.2V
Vc4
0-0.2V
0-0.2V
0-0.2V
0-0.2V
0-0.2V
0-0.2V
0-0.2V
1.8-3.0V
0-0.2V
Vdd
2.4-3.0V
2.4-3.0V
2.4-3.0V
2.4-3.0V
2.4-3.0V
2.4-3.0V
2.4-3.0V
2.4-3.0V
0-0.2V
LGE Internal Use Only - 64 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Checking Switch Block power source
4. TROUBLE SHOOTING
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 65 LGE Internal Use Only
4. TROUBLE SHOOTING
4.4 Checking UMTS Block
4.4.1 Checking TX POWER of UMTS1900MHz
TP4
TP1
LGE Internal Use Only
TP2
TP3
Test Point (RF TX POWER of UMTS1900)
- 66 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
For testing, Max power of UMTS1900MHz is needed.
4.4.3
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 67 LGE Internal Use Only
4. TROUBLE SHOOTING
4.4.2 Checking TX POWER of UMTS 850MHz
TP4
TP1
LGE Internal Use Only
TP2
TP3
Test Point of RF TX POWER of UMTS 850
- 68 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
For testing, Max power of UMT850MHz is needed.
4.4.3
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 69 LGE Internal Use Only
4. TROUBLE SHOOTING
4.4.3 Checking UMTS PAM Control Block
• PAM control signal
1. PWR_DET : UMTS Tx Power Detected value (Check R103)
2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control
3. VREG_RF_2.85V : UMTS PAM enable (about 2.85V)
4. VREG_W_PA : UMTS PAM Main Voltage ( 3V < VREG_W_PA < 4.2V)
VREG_W_PA
(Q102, pin3)
R103
UMTS850
Coupler
VREG_W_PA
(C72)
UMTS1900
Coupler
LGE Internal Use Only - 70 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.4.4 Checking RF Rx Level
ANT101 ANT102 ANT103
R101
C3
1.5p
0
SW101
G2
ANT
G1
RF
L103
4.7nH
KMS-512
TP1
VREG_RF_2.85V
C11
0.1uF
C12
33p
15nH L108
C1 56p
L707
NA
14
13
12
11
VC1
VC2
VC3
VC4
10
VDD
9
18
20
21
23
24
26
27
28
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GSM1800RX1
GSM1800RX2
GSM1900RX1
GSM1900RX2
GSM900RX1
GSM900RX2
GSM850RX1
GSM850RX2
5
6
7
8
3
4
1
2
U101 UMTS1
UMTS2
15
16
GSM1800_1900TX
GSM850_900TX
22
25
NC
17
LMSP4LMA-573TEMP
ANT_SEL0
ANT_SEL1
ANT_SEL2
ANT_SEL3
1K R112
1K R113
1K R115
1K R116
TP2’
C15
56p
C16
NA
R102
5.6nH
L704
1.8nH
C822
1p
C18
56p
TP2
WCDMA_850
WCDMA_1900
VREG_W
WCDMA
WCDMA_1900
FL102
ACMD-7402-TR1G
RX TX
10p
C52
C61
3.9p
C823
1p
L127
3.3nH
RX_WCDMA_1900
TP3
TP3’
WCDMA_850
ANT
FL104
TX
RX
GND1
GND2
GND3
GND6
GND5
GND4
B7637
C71
39p
C68
56p
L130
15nH
RX_WCDMA_850
TP4’
L139
15nH
FL105
C81
33p
1
2
G1
IN
G2
3
O1
O2
5 4
C82
4p
C85 4p
1.2nH
L137
L140 15nH
L142
15nH
L143 1.2nH
C92
82p
C93
0.1u
L147
4.7nH
C100
10p
C110
0.5p
FL106
1
2
G1
IN
G2
5
3
4
O1
O2
L706 1.8nH
C99
NA
L146 68nH
L149 68nH
C109
NA
L705 1.8nH
TP4
VREG_W
RX_WCDMA_1900
VREG_MSMP_2.8V
RX_WCDMA_850
SSBDT_RFR
R142
51
100p
C96
R138
R139
11.8K
5.62K
(1%)
(1%)
14
10
LB_LNA_IN
LB_LNA_OUT
5
4
LB_INP
LB_INM
RX_QP
RX_QM
17
18
RX_IP
RX_IM
19
20
GRX_QP
GRX_QM
27
28 15
9
HB_LNA_IN
HB_LNA_OUT
32
35
7
6
HB_INP
HB_INM
GPS_PLNA_IN
GPS_PLNA_OUT
37
38
GPS_INP
GPS_INM
2
R_BIAS
GRX_IP
GRX_IM
29
30
TCXO
45
GPS_CP_OUT
UMTS_CP_OUT
41
47
U110
NC1
NC2
NC3
12
43
44
13
R_BIAS_UMTS
33
R_BIAS_GPS
23
34
SSBI
BLANK
24
49
GND
GND_SLUG
22
25
VDDM1
VDDM2
VDDA1
VDDA2
VDDA3
VDDA4
VDDA5
VDDA6
VDDA7
VDDA8
VDDA9
VDDA10
VDDA11
VDDA12
VDDA13
VDDA14
40
42
46
26
31
36
39
11
16
21
1
3
8
48
RFR6275
0.01u
C94
10K
C88
150p
R136
C87
2.2n
(PPS)
RFR6275_TCXO
C115
22p
0603
C116
22p
R141
R143
2.7
10
RX_QP
RX_QM
RX_IP
RX_IM
C101
30p
C102
30p
C103
30p
C104
0.1u
C105
30p
L144
47nH
2.2u
C107
2.2u
C108
L145
47nH
VREG_RF_SMPS
C112
120p
C113
22p
C114
120p
Vbias
Vbias’
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 71 LGE Internal Use Only
4. TROUBLE SHOOTING
ANT103
* TP*`: UMTS 850 RX PATH
TP*: UMTS 1900 RX PATH
LGE Internal Use Only - 72 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.5 Checking GSM Block
3. Rx path
2.Tx PAM
1. ANT.SW
Module
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 73 LGE Internal Use Only
4. TROUBLE SHOOTING
4.5.1 Checking Ant. SW Module
Refer to chapter 3.3
TP3
TP1
TP2
ANT101 ANT102 ANT103
TP1
Schematic of RF Tx level
R101
C3
1.5p
0
SW101
G2
ANT
G1
RF
L103
4.7nH
KMS-512
VREG_RF_2.85V
C11
0.1uF
C12
33p
15nH L108
C1 56p
L707
NA
14
13
12
11
VC1
VC2
VC3
VC4
10
VDD
23
24
26
27
28
9
18
20
21
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GSM1800RX1
GSM1800RX2
GSM1900RX1
GSM1900RX2
GSM900RX1
GSM900RX2
GSM850RX1
GSM850RX2
3
4
5
1
2
6
7
8
U101 UMTS1
UMTS2
15
16
GSM1800_1900TX
GSM850_900TX
22
25
17
NC
LMSP4LMA-573TEMP
TP2
C15
56p
C16
NA
R102
5.6nH
L704
1.8nH
C822
1p
C18
56p
ANT_SEL0
ANT_SEL1
ANT_SEL2
ANT_SEL3
1K R112
1K R113
1K R115
1K R116
C28
100p
C30
33p
C29
68p
R117
2.2K
ANTENNA SWITCH MODULE LOGIC
LMSP4LMA-573TEMP_Rev B Later
GSM900/GSM850 TX
ANT_SEL0
HIGH
ANT_SEL1
HIGH
ANT_SEL2
LOW
ANT_SEL3
LOW
DCS/PCS TX
GSM 850 RX
GSM900 RX
DCS RX
PCS RX
UMTS 850
UMTS 1900
HIGH
LOW
LOW
LOW
LOW
HIGH
HIGH
LOW
LOW
LOW
HIGH
HIGH
LOW
LOW
LOW
LOW
HIGH
HIGH
LOW
HIGH
HIGH
LOW
LOW
LOW
LOW
LOW
LOW
HIGH
C821
1p
C44
NA
C819
100p
L122
4.7nH
C45
NA
C32
0.5p
16
DCS_PCS_OUT
9
GSM_OUT
U103
SKY77329
C34
33p
DCS_PCS_IN
2
GSM_IN
7
TX_EN
BS
1
3
WCDMA_850
WCDMA_1900
TP3
GSM_PA_RAMP
C35
100u
+VPWR
GSM_PA_EN
GSM_PA_BAND
11.
LGE Internal Use Only - 74 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Checking RF Tx level
30dBm?
4.5.2
4. TROUBLE SHOOTING
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 75 LGE Internal Use Only
4. TROUBLE SHOOTING
4.5.2 Checking PAM Block
TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc < 1.6V,
TP2. GSM_PA_EN : Power Amp Enable
(Power ON : higher than 2.5V , Power OFF : lower than 0.7V)
TP3. GSM_PA_BAND : Power Amp Band Selection Control
(GSM Mode : lower than 0.7V , DCS/PCS Mode : higher than 2.5V)
TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.5V
TP1
TP4
TP3
TP2
C29
68p
R117
2.2K
C28
100p
C30
33p
C821
1p
C44
NA
C819
100p
L122
4.7nH
C45
NA
C32
0.5p
16
DCS_PCS_OUT
9
GSM_OUT
U103
SKY77329
C34
33p
DCS_PCS_IN
2
GSM_IN
7
TX_EN
BS
1
3
C35
100u
GSM_PA_RAMP
TP1
+VPWR
11.4dB
R119
82
TP4
DCS_PCS_TX
GSM_PA_EN
GSM_PA_BAND
TP2
TP3
LGE Internal Use Only
Schematic of GSM PAM Block
- 76 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.5.3 Checking RF Rx Block
TP1. GSM850 Rx Input
TP2. GSM900 Rx Input
TP3. PCS Rx Input
TP4. DCS Rx Input
TP3
TP4
TP1
TP2
4. TROUBLE SHOOTING
GSM1800RX1
GSM1800RX2
GSM1900RX1
GSM1900RX2
GSM900RX1
GSM900RX2
GSM850RX1
GSM850RX2
5
6
3
4
7
8
1
2
U101 UMTS1
UMTS2
15
16
GSM1800_1900TX
GSM850_900TX
22
25
NC
17
P4LMA-573TEMP
C15
56p
C16
NA
R102
5.6nH
L704
1.8nH
C822
1p
C18
56p
TP4
TP3
WCDMA_850
WCDMA_1900
TP1
L101 6.8nH
NA
L104
L105 6.8nH
L102
15nH
NA
L109
L106 6.8nH
L110 6.8nH
L107
12nH
56nH
L113
L111 27nH
L114 27nH
L112
68nH
47nH
L118
L116 27nH
L117
47nH
L119 27nH
TP2
Schematic of GSM850/GSM900/DCS/PCS Rx Block
WCDMA_1900_TX_OUT
DCS_PCS_TX
GSM_TX
WCDMA_850_TX_OUT
TX_AGC_ADJ
DAC_REF
TX_ON
C17
12p
SSBDT_RTR
C5
C6
C8
C9
6p
6p
4p
12p
R104 12K
R106 680
55
ENV_OUT
46
44
HB_RF_OUT1
HB_RF_OUT2
43
42
LB_RF_OUT1
LB_RF_OUT2
24
RF_ON
56
VCONTROL
54
DAC_REF
14
SBDT
3
27
R_BIAS1
R_BIAS2
R
31
30
GCELL_INP
GCELL_INN
32
33
EGSM_INP
EGSM_INN
38
39
DCS_INP
DCS_INN
36
37
GPCS_INP
GPCS_INN
22
CAL INP
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 77 LGE Internal Use Only
4. TROUBLE SHOOTING
LGE Internal Use Only - 78 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4. BB Trouble Shooting
4.6 Power ON Troubleshooting
Power On sequence of CU575 is :
PWR key press(Key PCB)
→
PM_ON_SW_N go to low(D603), PM6650 KPDPWR_N pin(24)
→
PM6650 Power Up → VREG_MSMC_1.25V(C733), VREG_MSME_1.8V(C734),
VREG_MSMP_2.8V(C721), VREG_MSMA_2.6V(C719), VREG_TCXO_2.85V(C714) power up and system reset assert to MSM → Phone booting and PS_HOLD(D701) assert to PMIC
Start
Battery voltage is higher than 3.25V?
YES
Signal of D603 is low
When key is pressed?
YES
NO
NO
Change or charging the
Battery
Check the Key Dome
VREG_MSMC_1.25V,VREG_MSMP_2.8V
VREG_MSME_1.8V, VREG_TCXO_2.85V,
VREG_MSMA_2.6V power up?
NO
Change the main board
YES
Is clock ok?
C56 : 19.2M
TP701 : 32.768Khz
YES
Change the main board
NO
Check the TXCO(X702)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 79 LGE Internal Use Only
4. TROUBLE SHOOTING
X702
C56
C734
(VREG_MSME_1.8V)
C733
(VREG_MSMC_1.25V)
TP701
C719
(VREG_MSMA_2.6V)
C721
(VREG_MSMP_2.8V)
C714
(VREG_TCXO_2.85V)
LGE Internal Use Only - 80 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.7 Charger Troubleshooting ( TA Charging)
Battery Charging Circuit
About 5 V
TA
VBATT
+5V_PWR
USB_VBUS
ICHARGE
ICHARGEOUT
+VPWR
U805
10
P_DRAIN P_COLLECTOR
1
EMITTER1
9
BASE1
8
2
EMITTER2
3
COLLECTOR
4
SOURCE
BASE2
7
GATE
6
DRAIN
5
NUS3116MTR2G
Turn to low
CHG_CNT_N
USB_CNT_N
BATT_FET_N
VBATT Main Battery
Charging Procedure
- Connect TA
- Control the charging current by PM6650 IC
- Charging current flows into the battery
Check Point
- Connection of TA
- Charging current path
- Battery
Troubleshooting Setup
- Connect TA and battery to the phone
Troubleshooting Procedure
- Check the charger connector
- Check the charging current Path
- Check the battery
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 81 LGE Internal Use Only
4. TROUBLE SHOOTING
Troubleshooting Flow
Start
Check the pin and Insert a Battery and TA
Connection OK?
YES
C808 is 5V?
YES
Pin 1 of U804 is 5V?
YES
Pin 1 of U802 is 5V?
YES
R414 is 5V?
YES
Change a main Board
No
Change 18pin connector
(CON801)
No
No
No
No
Change a TA
Change a U804
Change a U802
Change a U805
LGE Internal Use Only - 82 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Pin 1 of U802
4. TROUBLE SHOOTING
U804
C808
U805
Pin 1 of U805
R414
CON801
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 83 LGE Internal Use Only
4. TROUBLE SHOOTING
4.8 Charger Troubleshooting ( USB Charging)
Battery Charging Circuit
About 5 V
VBATT
+5V_PWR
USB Cable
USB_VBUS
ICHARGE
ICHARGEOUT
+VPWR
Charging Procedure
- Connect USB
- Control the charging current by PM6650 IC
- Charging current flows into the battery
Check Point
- Connection of USB
- Charging current path
- Battery
Troubleshooting Setup
- Connect USB and battery to the phone
Troubleshooting Procedure
- Check the charger connector
- Check the charging current Path
- Check the battery
U805
10
P_DRAIN P_COLLECTOR
1
EMITTER1
9
BASE1
8
2
EMITTER2
3
COLLECTOR
4
SOURCE
BASE2
7
GATE
6
DRAIN
5
NUS3116MTR2G
Turn to low
CHG_CNT_N
USB_CNT_N
BATT_FET_N
VBATT Main Battery
LGE Internal Use Only - 84 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Troubleshooting Flow
Start
Check the pin and Insert a Battery and Connect a USB Cable
Connection OK?
YES
VA808 is 5V?
YES
R414 is 5V?
YES
Change a main Board
No
Change 18 pins connector
(CON801)
No
No
Change a USB Cable
Change a U805
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 85 LGE Internal Use Only
4. TROUBLE SHOOTING
VA808
CON801
U805
R414
LGE Internal Use Only - 86 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.9 USB Troubleshooting
USB Initial sequence of CU575 is :
USB connected to CU575 power on
→
USB_VBUS go to 5V
→
USB_D+ go to 3.3V
→
48M Crystal on → USB_VP and USB_VN is triggered → USB work.
Start
Power is on?
YES
Cable is inserted?
YES
VA808(USB_VBUS) is 5V?
YES
VA810(USB_D+) is 3.3V?
YES
48M clock is running?
YES
Change the main board
NO
NO
NO
NO
NO
Go to power on trouble shooting
Insert cable
Check VA808
Check VA810
Check X201
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 87 LGE Internal Use Only
4. TROUBLE SHOOTING
X201
VA808
VA810
LGE Internal Use Only - 88 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.10 SIM Detect Troubleshooting
USIM Initial sequence of CU575 is :
USIM_CLK,USIM_RST,USIM_DATA triggered
→
VREG_USIM_2.85V go to 2.8V
→
USIM IF work
Start
Re-insert the SIM card
Work well?
No
VREG_USIM_2.85V is 2.85V?
USIM_P_CLK is run?
YES
Change SIM card
YES
NO
Work well?
No
Change the main board
YES
End
Check CON401
End
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 89 LGE Internal Use Only
4. TROUBLE SHOOTING
VREG_USIM_2.85V
USIM_P_CLK
GND CON401
LGE Internal Use Only - 90 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.11 Camera Troubleshooting
Camera control signals are generated by MSM6260.
Start
Check the camera connector and reconnect the camera
YES
Camera is OK?
NO
VREG_CAM_2.7V is 2.7V?(C413)
VREG_CAM_1.8V is 1.8V?(C414)
YES
Check the CAM_MCLK
(FL606_Pin4)
YES
Change the camera
NO
NO
YES
Camera is OK
NO
Change the main board
END
Change the main board
Change the main board
END
C414
FB500
C413
FL606
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 91 LGE Internal Use Only
4. TROUBLE SHOOTING
4.12 Keypad Backlight Troubleshooting
Key Pad Back Light is on as below :
Key pressing
→
KYBD_BACKLIGHT go to 0V
→
Main LED On
Start
Key press
Signal +VPWR is over 3.2V?
YES
VA501 is 0V ?
YES
Change the main board
NO
NO
Check battery
YES
Change the main board
+VPWR
LGE Internal Use Only
0 V
- 92 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.13 Folder ON/OFF Troubleshooting
Folder On/Off is worked as below :
Folder On/Off Event -> Flip(U405 pin OUT) is triggered(On : about 2.1V, Off : 0V) ->
MSM6260 Sense the Folder Event
Start
Check the magnet in
Folder ASSY
YES
Approach the magnet to
U405
NO
Insert the magnet
FLIP(U405 pin 2) is
0 V?
YES
Change the main board
NO
Change the U405
Magnet U405
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 93 LGE Internal Use Only
4. TROUBLE SHOOTING
4.14 Main LCD Troubleshooting
Main LCD control signals are generated by MSM6260. The signal path is :
MSM6260
→
C0N601(Main Board)
→
CN102(LCD FPCB)
→
LCD Module
Start
Press END key
NO
Key LED is on?
YES
Disconnect and reconnect
The LCD connector(CON601)
Go to power on trouble shooting
LCD display OK?
YES
No
Change the LCD module
END
LCD display OK?
YES
No
Change the main board
END
LCD display OK?
YES
No
Change the LCD FPCB
END
LGE Internal Use Only - 94 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.15 Receiver Path
MSM6260 RCV+/RCV-
→
R836/R837
→
Analog Switch(U301)
→
CON601
L1,L2(LCD_FPCB)
→
SPKP,SPKN
Start
Connect the phone to network equipment and setup call
Setup 1KHz tone out
Sine wave appears at
R836/R837?
YES
SPK_SW_ON(R829) is
0 V?
YES
Sine wave appears at
L1,L2 on LCD_FPCB?
YES
Speaker soldering is
Good?
NO
NO
NO
NO
Can you hear the tone?
YES
END
NO
Check R836/R837 or
Change the main board
Change the main board
Change the LCD
FPCB
Re-solder Speaker
Change the speaker
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 95 LGE Internal Use Only
4. TROUBLE SHOOTING
L1, L2
CN102
R836/R837
U301(Analog Switch)
LGE Internal Use Only - 96 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.16 Headset path
MSM6260 HPH_R, HPH_L
→
C803/C804
→
R804/R825
→
CON801
Start
Connect the phone to network equipment and setup call.
Setup 1KHz tone out and insert headset.
YES
Can you hear the tone?
NO
Sine wave appears at
R804/R825?
NO
Sine wave appears at C803/C804 ?
NO
Change the main board
YES
YES
END
Change the Head_Set
Re-solder R804/R825
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 97 LGE Internal Use Only
4. TROUBLE SHOOTING
C803/C804
CON801
R804/R825
LGE Internal Use Only - 98 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.17 Speaker phone path
MSM6260(AMP_P,AMP_N)
→
Audio AMP(U302)
→
Analog Switch(U301)
→
Main Connector(CON601)
→
L1,L2(LCD_FPCB)
→
SPKP,SPKN
Start
Connect the phone to network equipment and setup call
Setup 1KHz tone out
Sine wave appears at
C318/R312 and C319/R314?
NO
C318/R312 and C319/R314 or
Change the main board
YES
AMP_VDD(C317) is
Over 3.6V?
YES
SPK_SW_ON(R829) is
Over 1.8V?
YES
Sine wave appears at
L1,L2 on LCD_FPCB?
YES
Speaker soldering is
Good?
NO
NO
NO
NO
Can you hear the tone?
YES
END
NO
Change the main board
Change the main board
Change the LCD
FPCB
Re-solder Speaker
Change the speaker
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 99 LGE Internal Use Only
4. TROUBLE SHOOTING
L1, L2
U301(Analog Switch)
U302(Audio AMP)
LGE Internal Use Only - 100 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.18 Main microphone
U303(MIC)
→
R834,C837
→
MIC1P(MSM6260)
Start
Make a call
MIC_BIAS is 1.8V
YES
Make sound to MIC
NO
Sine wave appears at
C837 ?
YES
END
NO
YES
Change main board
Change the MIC
Work well?
NO
Change the main board
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 101 LGE Internal Use Only
4. TROUBLE SHOOTING
U303 (MIC)
LGE Internal Use Only - 102 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.19 Headset microphone
Headset
→
CON801
→
C801
→
MIC2P(MSM6260)
Start
Make a call
OK
Change the headset and retry
NO
EAR_SENSE_N
(VA811) is 0V?
NO
YES
VREG_MSMP is biased by 2.6V? (R801)
YES
Sine wave appears at
CON801 ?
YES
END
NO
NO
END
YES
Change the headset retry.
NO
Change main board
Change the headset retry.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 103 LGE Internal Use Only
4. TROUBLE SHOOTING
VA811 (Ear_Sense_N)
R801 (EAR_MIC Bias)
LGE Internal Use Only - 104 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
5.1 Introduction
LGMDP is a LGE application that allow users to download images from PC to handset.
LGMDP is a download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple to use and easy enough for the beginner to upload executable images to the handset.
LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed.
Additionally, LGMDP allows multi downloading up to 8 handsets at the same time.
5.2 Downloading Procedure
1) Setup Preferences
Connect the phone to your desktop PC using the USB cable and run the LGMDP application. Before getting started, set up LGMDP preferences from the Preferences of the file menu the way you want.
Click on the File menu and select Preferences.
➢ Play a success sound
This is an experimental feature. To enable this simply check the box. It will be played a .wav file when the download has been completed.
➢ Automatically run “Select Port” When LGMDP starts
This option is designed to give user convenient. When LGMDP starts, it will automatically select
“Select Port” button to download new image file.
➢ Always on Top
Check if LGMDP always appears at the top of the window so that user can monitor it all the time.
➢ Windows Size
If you want to change program window size, change this option.
➢ XML Log Path
You can change the directory path that XML log files are saved.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 105 LGE Internal Use Only
5. DOWNLOAD
1) Connecting to PC
Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button.
(The port number(COM7) and model name shall be different from that of the port number in the snapshot.)
LGE Internal Use Only - 106 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 107 LGE Internal Use Only
5. DOWNLOAD
1)
2)
The following slide describes how to use or set options in detail.
(The model name shall be different from that of the model name in the snapshot.)
6) 3)
5)
4)
7)
LGE Internal Use Only - 108 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse… button. The edit box shows the file path where new images are located. Please note that all images should be located in a selected folder. ( This program support the automatically loading image for some models based on MSM6275 ,MSM6280, MSM6260,
MSM6245)
2) Click on the Browse… button to select image files to be downloaded on the handset.
3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option.
Backup the NV data and restore the backed up NV data automatically.
4) Reset database & Contents: User related data including the setting data on the EFS is reset in the handset. The contents in the handset will be erased.
Erase_EFS: The calibration data, user contents, media, and module are erased. Only calibration data is kept when NV backup/restore is checked.
Keep All Contents: Maintain user data including WAP, AD, DRM, Email, Play lists, images When downloading a new images, user data stated above are maintained if this option is enable.
5) Additional Options:
Display Information is defaulty not selected and user cannot choose.
Security: The security option is automatically selected based on the selected country when security box is selected.
➢ Integrity is selected when the selected country is UK, Italy, Hong Kong, Austria, or Israel.
➢ Ciphering is not applied or used for H3G user.
➢
Fake Security is not applied or used for H3G user.
➢ Integrity + Ciphering is selected when the selected country is Australia, Sweden, or Denmark.
Please note that user cannot select the options stated above on the security
6) Clear: Clearing all directory paths of images in the dialog.
7) Clear: Clearing all directory paths of images in the dialog.
8) Start : Starting downloading the selected individual image.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 109 LGE Internal Use Only
5. DOWNLOAD
2) Choosing image files
Select the image folder, where all the image files are located, by clicking on the Browse… button.
(The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.)
★ if you select the image folder, the program will automatically load images accordingly.
LGE Internal Use Only - 110 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
★ if you select the image folder, the program will automatically load images accordingly.
Automatically load images
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 111 LGE Internal Use Only
5. DOWNLOAD
If NV restore is failed, then the NV Data(*.nv2) is erased permantly. In this case, choose the desired
NV file to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP installation directory by clicking on the Browse… button.
Click on the START button to start downloading.
Normally LGMDP will downloaded all files that need downloading. To download selected image file only simply select the image file that user want to process downloading.
LGE Internal Use Only - 112 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
3) Downloading
The following flow chart is whole process for downloading images to the handset. You will see snapshots for each step in the succeeding slides.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 113 LGE Internal Use Only
5. DOWNLOAD
• This message box informs that a new file for
NV backup will be created in the displayed file name in the LGMDP installation directory.
•
Backing up NV data and backed up NV data will be stored in the LGMDP installation directory.
• Erasing the existing directories and files before the Module image is downloaded.
• Downloading the AMSS modem image
LGE Internal Use Only - 114 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
• Rebooting the handset and re-establishing the connection
• Restoring NV data which backed up in the
Backing up process. User can also restore
NV data using NV Default image selection.
• Erasing the existing directories and files before downloading the selected Media image
• Downloading Media image in progress
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 115 LGE Internal Use Only
5. DOWNLOAD
• Downloading Module image in progress
• Downloading process has completed successfully
LGE Internal Use Only - 116 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
4) Tools
Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device
Manager from the Tools of the file menu.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 117 LGE Internal Use Only
5. DOWNLOAD
Log Extractor is designed to extract log information from handset and store log related files in the selected root path in PC. This function is very useful for debugging. Select Log Extractor from the
Tools of the file menu, and connect the phone with LGMDP by clicking on the Connect button. When clicking on the Connect button, this checks if the appropriate files such as LFAPP/RecMngr.bin, err directory, Debugging_Tip.txt, or Hidden_info.bin are placed on the handset. If they are exist, then appropriate check boxes are checked accordingly. Select directory to store log files by clicking on the
… button.
LGE Internal Use Only - 118 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
5.3 Troubleshooting Download Errors
1) When the phone does not work
➝ Reboot the phone as the emergency mode (keep pressing “2” and “5” key while the phone is being booted). and then try to download the images again.
★ The phone supports a special mode named emergency mode. In this mode, minimum units for downloading is running so that users can download the images again in case of emergency situation. (AMSS Modem, Media and Module Images don’t be running in this mode.)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 119 LGE Internal Use Only
5. DOWNLOAD
2) NV Restore error
When you meet the “NV Restore error”,
CU575
LGE Internal Use Only - 120 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
➝ Connect to the phone.
➝ Click on ‘Cancel’.
5. DOWNLOAD
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 121 LGE Internal Use Only
5. DOWNLOAD
➝ Click on ‘NV Restore’ then several NV Backup files(*.nv2) are shown.
★ The files are saved every NV Backup. The name is based on the time when NV Backup is done.)
LGE Internal Use Only - 122 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
➝ Select the proper file and click on ‘Restore’.
5. DOWNLOAD
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 123 LGE Internal Use Only
5. DOWNLOAD
➝ If you want image download and NV backup file restore at once, use the NV Default function.
LGE Internal Use Only - 124 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 125 LGE Internal Use Only
5. DOWNLOAD
5.4 Caution
1) Multi-downloading using the USB hub is not recommendable.
2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image (media and module) download.
3) In emergency mode, you can not download the media and module image. So if you want download media and module image, connect the phone normal mode after emergency mode download, and then you can do it.
4) The NV data saved at LGMDP folder like this.
D:\LGMDP\004400-01-429926\_COM17_
LGMDP folder name
IMEI number
Port number
5) Recommended that the Module and Media Image have to be downloaded at the same time.
6) Erase EFS option will erase everything (media, module, nv items, and user data) in the EFS area.
LGE Internal Use Only - 126 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
6.1 CU575 Block Diagram
SPDT
1800/1900
850/900
GSM Tx/Rx
GSM
PAM
GSM 850 Rx
GSM 900 Rx
GSM 1800 Rx
TX_SAW
900
GSM 1900 Rx
GSM-VCO
I/Q
RTR6275
WCDMA Tx/Rx
850
Coupler TX_SAW
1900
Coupler
WCDMA
PAM
TX_SAW
W-VCO
SSBI
HDET
1900 RX_SAW
LNA
RFR6275
LNA W-VCO
SSBI
850 RX_SAW
MSM6260
NAND 1G
SDRAM 512M
SSBI
Power
PM6650
SXGA
TPA2010
Receiver
MIC
SPEAKE
R
Stereo Headset
TFLASH
LCD
(2.2î QCIF)
USIM
USB
+5V
Bluetooth
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 127 LGE Internal Use Only
LGE Internal Use Only - 128 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
A
B
C
D
F
1
ANT101 ANT102 ANT103
2
ANT_SEL0
ANT_SEL1
ANT_SEL2
ANT_SEL3
VREG_RF_2.85V
C11
0.1uF
C12
33p
15nH
1K R112
1K R113
1K R115
1K R116
ANTENNA SWITCH MODULE LOGIC
LMSP4LMA-573TEMP_Rev B Later
ANT_SEL0 ANT_SEL1
GSM900/GSM850 TX
DCS/PCS TX
HIGH
HIGH
HIGH
LOW
ANT_SEL2 ANT_SEL3
LOW
LOW
LOW
LOW
GSM 850 RX
GSM900 RX
DCS RX
PCS RX
UMTS 850
UMTS 1900
LOW
LOW
LOW
LOW
HIGH
HIGH
LOW
LOW
HIGH
HIGH
LOW
LOW
LOW
HIGH
HIGH
LOW
HIGH
HIGH
LOW
LOW
LOW
LOW
LOW
HIGH
E
GSM/EDGE
WCDMA
WCDMA_1900
FL102
ACMD-7402-TR1G
RX
C61
3.9p
C823
1p
L127
3.3nH
RX_WCDMA_1900
C
WCDMA_850
ANT
FL104
TX
RX
GND1
GND2
GND3
GND6
GND5
GND4
B7637
C71
39p
R101
C3
1.5p
0
SW101
G2
ANT
G1
RF
L103
4.7nH
KMS-512
3
TX
10p
C52
L108
C68
56p
L130
15nH
RX_WCDMA_850
L707
NA
4
C1 56p
14
13
12
11
10
9
18
20
21
23
24
26
27
28
VC1
VC2
VC3
VC4
VDD
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GSM1800RX1
GSM1800RX2
GSM1900RX1
GSM1900RX2
GSM900RX1
GSM900RX2
GSM850RX1
GSM850RX2
5
6
7
8
3
4
1
2
U101 UMTS1
UMTS2
GSM1800_1900TX
GSM850_900TX
NC
LMSP4LMA-573TEMP
15
16
22
25
17
U104
C820 100p
C55
NA
C49 10p
U107
C69
1.5p
L129
3.3nH
C67
68p
CP0402A0836BNTR
HDET
5
C28
100p
C30
33p
C821
1p
C44
NA
C819
100p
L122
4.7nH
C45
NA
C32
0.5p
16
DCS_PCS_OUT
9
GSM_OUT
U103
SKY77329
C15
56p
C16
NA
R102
5.6nH
L704
1.8nH
C822
1p
C18
56p
L124
1nH
C29
68p
R117
2.2K
C34
33p
DCS_PCS_IN
2
GSM_IN
7
TX_EN
1
3
BS
C50
2200p
U108
RF5144
18
17
16
15
14
13
NC7
NC6
RFOUT_PCS
NC5
RFOUT_CELL
NC4
VREG_PCS
RFIN_PCS
VREG_CELL
VMODE_CELL
RFIN_CELL
VCC1_CELL
5
6
3
4
1
2
6
WCDMA_850
WCDMA_1900
C35
100u
7
GSM_PA_RAMP
+VPWR
GSM_PA_EN
GSM_PA_BAND
VREG_RF_2.85V
C72
2200p
C73
4.7u
11.4dB
8 9 10 11 12 13 14 15 16
R119
82
L101 6.8nH
NA
L104
NA
L109
47nH
L118
L105 6.8nH
L106 6.8nH
L110 6.8nH
L116 27nH
L119 27nH
DCS_PCS_TX
L102
15nH
L107
12nH
56nH
L113
L111 27nH
L114 27nH
L112
68nH
L117
47nH
WCDMA_1900_TX_OUT
DCS_PCS_TX
GSM_TX
WCDMA_850_TX_OUT
TX_ON
TX_AGC_ADJ
DAC_REF
C17
12p
SSBDT_RTR
FL101
5
RFOUT RFIN
1
VC
7
LMSM32AA-533
R123
51
GSM_TX
200 R126
GSM_SAW_SW_MODE
EGSM LOW
GSM850 HIGH remain LOW when not transmitting
C5
C6
C8
C9
6p
6p
4p
12p
R104 12K
R106 680
TX_IP
55
ENV_OUT
46
44
HB_RF_OUT1
HB_RF_OUT2
43
42
LB_RF_OUT1
LB_RF_OUT2
24
RF_ON
56
VCONTROL
54
3
27
DAC_REF
14
SBDT
R_BIAS1
R_BIAS2
ENV_LNP
ENV_LNN
2
1
TX_IP
TX_IN
TX_QP
TX_QN
51
50
53
52
TCXO
7
U102
RTR6275
VTUNE1
VTUNE2
5
18
RX_IP
RX_IN
12
13
RX_QP
RX_QN
10
11
31
30
GCELL_INP
GCELL_INN
32
33
EGSM_INP
EGSM_INN
38
39
DCS_INP
DCS_INN
36
37
GPCS_INP
GPCS_INN
22
23
CAL_INP
CAL_INN
26
WLNA_IN
PWD_DET_IN
TEST
40
21
VDDA1
VDDA2
VDDA3
VDDA4
VDDA5
VDDA6
VDDA7
VDDA8
VDDA9
VDDA10
VDDA11
VDDA12
VDDA13
VDDA14
9
15
16
19
20
28
4
6
8
41
45
47
48
49
C14
RTR6275_TCXO
C13
1200p
2700p
VTUNE-Connected directly to GND
10 R118
C2
180p
C4
180p
C7
180p
C10
180p
RX_IP
RX_IM
RX_QP
RX_QM
R109
R110
R111
R114
5.1
5.1
2.7
2.7
TX_IM
TX_QP
TX_QM
L115
C31
0.1u
L120
47nH
R103 56
47nH
HDET
VREG_RF_2.85V
VREG_RF_SMPS
VREG_SYNTH_2.6V
VREG_RF_SMPS
C42
4.7u
VREG_MSMP_2.8V
100ohm
R122
C46
0.01u
C43
22p
TCXO VREG_TCXO_2.85V
C48
1000p
KRX102E
Q101
PA_ON2
VREG_RF_2.85V
7
8
NC3
NC4
NC2
NC1
6
5
3
OUTPUT GND
2
4
VCC VCONT
DSA321SCE-19.2M
X702
1
100ohm R127
TRK_LO_ADJ
FL110
B9014
OUT IN
GND2 GND1
WCDMA_1900_TX_OUT
10p C59
L125 3.9nH
L126
NA
TCXO_PM
RTR6275_TCXO
RFR6275_TCXO
C56 100p
C58 1000p
C62 1000p
Q102
KRX102E
R131 100K
C66 1000p
1
U106
TC7SH04FS
VCC
5
4
2
GND
C64
1000p
TCXO_BT
PA_ON1
VREG_RF_2.85V
VREG_W_PA
C816
33p
L132
NA
FL103
B9003
OUT IN
GND2 GND1
C70
1000p
C176
6.8nH
C76
NA
L133
NA
WCDMA_850_TX_OUT
BLUETOOTH
D
E
F
VREG_W
L139
15nH
C92
82p
C93
0.1u
C81
33p
FL105
2
G1
3
O1
1
IN
5
G2
4
O2
L147
4.7nH
C100
10p
C110
0.5p
FL106
2
G1
3
O1
1
IN
5
G2
4
O2
C82
4p
C85 4p
1.2nH
L137
L140 15nH
L142
15nH
L143 1.2nH
L706 1.8nH
C99
NA
C109
NA
L146 68nH
L149 68nH
L705 1.8nH
VREG_W
RX_WCDMA_1900
VREG_MSMP_2.8V
RX_WCDMA_850
SSBDT_RFR
R142
51
100p
C96
R138 11.8K
(1%)
R139 5.62K
(1%)
14
10
LB_LNA_IN
LB_LNA_OUT
5
4
LB_INP
LB_INM
15
9
HB_LNA_IN
HB_LNA_OUT
7
6
HB_INP
HB_INM
32
35
GPS_PLNA_IN
GPS_PLNA_OUT
37
38
GPS_INP
GPS_INM
2
R_BIAS
RX_QP
17
RX_QM
18
RX_IP
RX_IM
19
20
GRX_QP
GRX_QM
27
28
GRX_IP
GRX_IM
29
30
U110
TCXO
45
GPS_CP_OUT
UMTS_CP_OUT
41
47
NC1
NC2
NC3
12
43
44
13
R_BIAS_UMTS
33
R_BIAS_GPS
23
34
SSBI
BLANK
24
49
GND
GND_SLUG
22
25
VDDM1
VDDM2
VDDA1
VDDA2
VDDA3
VDDA4
VDDA5
VDDA6
VDDA7
VDDA8
VDDA9
VDDA10
VDDA11
VDDA12
VDDA13
VDDA14
26
31
36
39
40
42
46
48
1
3
8
11
16
21
RFR6275
0.01u
C94
10K
C88
150p
R136
C87
2.2n
(PPS)
RFR6275_TCXO
R141
R143
2.7
10
C115
22p
0603
C116
22p
RX_QP
RX_QM
RX_IP
RX_IM
C101
30p
C102
30p
C103
30p
C104
0.1u
C105
30p
L144
47nH
2.2u
C107
2.2u
C108
L145
47nH
VREG_RF_SMPS
C112
120p
C113
22p
C114
120p
OUT101
R133
0
L135
4.7nH
16
ANT
U109
RB04
GND1
GND2
GND3
1
7
15
1u
C84
0.1uF
C97
C95
100p
VREG_MSMP_2.8V
A
B
C
D
E
F
C
VREG_BT_2.85V
R135
0
D
E
1 2 3 4 5 6 7 8 9
LGMC
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 129 LGE Internal Use Only
7. CIRCUIT DIAGRAM
A
1 2
( +/- 2500ppm for USB Peripheral)
USB_XTALIN
X201
48MHz
ICRT20S48M0X514CR
USB_XTALOUT
3
B
SDRAM_ADDR(0:14)
C
D
E
F
C
D
SDRAM_DATA(0:31)
EBI2_DATA(0:15)
(ADS signal for LCD)
SUB_CS_N
LCD_CS_N
NAND_CLE
NAND_CS_N
EBI2_OE_N
EBI2_WE_N
NAND_ALE
NAND_READY
LCD_ADS
SDRAM_DATA(31)
SDRAM_DATA(30)
SDRAM_DATA(29)
SDRAM_DATA(28)
SDRAM_DATA(27)
SDRAM_DATA(26)
SDRAM_DATA(25)
SDRAM_DATA(24)
SDRAM_DATA(23)
SDRAM_DATA(22)
SDRAM_DATA(21)
SDRAM_DATA(20)
SDRAM_DATA(19)
SDRAM_DATA(18)
SDRAM_DATA(17)
SDRAM_DATA(16)
SDRAM_DATA(15)
SDRAM_DATA(14)
SDRAM_DATA(13)
SDRAM_DATA(12)
SDRAM_DATA(11)
SDRAM_DATA(10)
SDRAM_DATA(9)
SDRAM_DATA(8)
SDRAM_DATA(7)
SDRAM_DATA(6)
SDRAM_DATA(5)
SDRAM_DATA(4)
SDRAM_DATA(3)
SDRAM_DATA(2)
SDRAM_DATA(1)
SDRAM_DATA(0)
R8
T2
T1
R6
T8
T6
T4
R11
V4
U6
L6
R4
W4
V6
Y2
Y1
E1
AB4
D1
AB2
D2
E2
L8
K4
J1
K6
J2
J4
P4
H4
G2
J6
A1_22
A1_21
A1_20
A1_19
A1_18
A1_17
A1_16
A1_15
GPIO_74
GPIO_73
GPIO_72
GPIO_71
GPIO_70
GPIO_69
GPIO_68
GPIO_67
SDRAM1_D15
SDRAM1_D14
SDRAM1_D13
SDRAM1_D12
SDRAM1_D11
SDRAM1_D10
SDRAM1_D9
SDRAM1_D8
SDRAM1_D7
SDRAM1_D6
SDRAM1_D5
SDRAM1_D4
SDRAM1_D3
SDRAM1_D2
SDRAM1_D1
SDRAM1_D0
AC15
AF14
XMEM2_CS_N1
LCD_CS_N_GPIO38
AF10
W14
AF7
AF4
AE10
T14
UB2_N
XMEM2_CS_N0
OE2_N
WE2_N
LB2_N_A2_0
NAND2_FLASH_READY_GPIO33
EBI2_DATA(15) AA10
EBI2_DATA(14)
EBI2_DATA(13)
EBI2_DATA(12)
EBI2_DATA(11)
EBI2_DATA(10)
EBI2_DATA(9)
EBI2_DATA(8)
EBI2_DATA(7)
EBI2_DATA(6)
EBI2_DATA(5)
EBI2_DATA(4)
EBI2_DATA(3)
EBI2_DATA(2)
EBI2_DATA(1)
EBI2_DATA(0)
AC7
AF5
AA7
AE5
AC6
AE4
AF3
AC5
AC9
W10
AA9
AE7
AC8
W9
AA8
D2_15
D2_14
D2_13
D2_12
D2_11
D2_10
D2_9
D2_8
D2_7
D2_6
D2_5
D2_4
D2_3
D2_2
D2_1
D2_0
AF13
AA14
T13
AC14
AE14
W13
AC13
AA13
AF12
AE12
AC12
AA12
W12
T12
AC11
AA11
AC10
W11
AF9
AE9
A2_20_GPIO34
A2_19
A2_18
A2_17
A2_16
A2_15
A2_14
A2_13
A2_12
A2_11
A2_10
A2_9
A2_8
A2_7
A2_6
A2_5
A2_4
A2_3
A2_2
A2_1
E
4
F
LG(42)-A-5505-10:01
1 2 3 4
LGE Internal Use Only
5
5 6
U201-1
MSM6260_DATA
7
1% 150K
R203
1% R202
47K
8
VREG_MSME_1.8V
9 10 11 12 13 14 15 16
MODE
MODE2 MODE1 MODE0
0 0 0
( Default Pull-Down)
Native, ARM JTAG
BOOT_MODE3 BOOT_MODE2 BOOT_MODE1
0 0 1
0 1 1
1 0 1
1 1 1
8-bit, NAND, Normal
16-bit, NAND, Normal
8-bit, NAND, Trusted
16-bit, NAND, Trusted
1005 0.1uF 16V +80/-20%
2012 10uF 6.3V +80/-20% Ceramic
VREG_MSMC_1.25V
VREG_MSME_1.8V
VREG_MSMP_2.8V
ADC
HKADC[0] - AMUX_OUT
HKADC[1] - VBATT_SENSE
HKADC[2] - HDET1
HKADC[3] - TTY_ADC_DET
HKADC[4] - PCB_Rev_ADC
HKADC[5] - VBATT_TEMP
PMIC_AUXIN[1]
PMIC_AUXIN[2] - PA_THERM
C201
4.7u
C202
10n
HKADC(4):PCB_Rev_ADC
150K : 10K : 0.17V
150K : 47K : 0.66V
150K : 68K : 0.87V
150K : 100K : 1.12V
150K : 150K : 1.40V
150K : 300K : 1.86V
150K : 470K : 2.12V
150K : 680K : 2.29V
150K : 750K : 2.33V
VREG_MSMA_2.6V
(CAD : 10uF=>Input MSMA_2.6V)
C203
10u
C204
0.1u
C205
0.1u
A
B
SDCC_DAT1_GPIO99
SDCC_DAT2_GPIO100
SDCC_DAT3_GPIO101
MDP_VSYNC_SECONDA_GPIO104
MDP_VSYNC_PRIMARY_GPIO105
F25
M25
M26
AE3
AD2
WDOG_STB_SBCK1_GPIO0
SBDT1_GPIO1
PA_ON1_GPIO2
GRFC9_GPIO12
CAMCLK_PO_GP_MN_GPIO13
GPIO28
USB_RX_DATA_GPIO29
XMEM2_CS_N2_GPIO35
XMEM2_CS_N3_GPIO36
LCD_EN_GPIO37
H25
F26
H11
D5
J21
A6
N19
W15
AA15
AE13
GPIO43
SYNTH2_GPIO65
GPIO66
XMEM1_CS_N1_GPIO76
XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77
UART3_RFR_N_GPIO87
UART2_DP_RX_DATA_GPIO89
SYNTH0_GP_PDM0_GPIO92
SBST1_GPIO93
L25
H6
F18
H18
H9
B6
F8
AA1
Y6
TX_AGC_ADJ
TRK_LO_ADJ
TCXO_EN_GPIO94
PA_ON0
H13
L13
F19
F17
Q_OUT_N
Q_OUT
I_OUT_N
I_OUT
DAC_REF
A12
B12
A13
B13
F12
Q_IM_CH1
Q_IP_CH1
I_IM_CH1
I_IP_CH1
Q_IM_CH0
Q_IP_CH0
I_IM_CH0
I_IP_CH0
W23
V23
V25
W25
AA25
Y25
AB25
AC25
GP_PDM2_PA_RANGE1
GP_PDM1_PA_RANGE0
D17
H17
TRST_N
TCK
TMS
TDI
TDO
RTCK
H15
D16
F15
D15
A17
H16
AUX_PCM_CLK_GRFC14_GPIO80
AUX_PCM_DIN_GRFC13_GPIO14
AUX_PCM_DOUT_GRFC12_GPIO103
AUX_PCM_SYNC_GRFC11_GPIO102
TX_ON_GRFC10
K19
N21
G4
J8
H12
GRFC8_GPIO11
GRFC7_GPIO10
GRFX6_GPIO9
GRFC5_AUX_SBST_GPIO8
GRFC4_AUX_SBCK_GPIO7
GRFC3_GPIO6
GRFC2_GPIO5
GRFC1_AUX_SBDT_GPIO4
GRFC0_GPIO3
B4
T23
T19
D11
H10
F10
D9
A8
B8
BT_CLK_GPIO25
BT_SBST_GPIO24
BT_SBCK_GPIO23
BT_DATA_GPIO20
BT_TX_RX_N_GPIO21
BT_SBDT_GPIO22
G23
F23
E26
R19
H21
E25
MDDIC_DATP
MDDIC_DATN
MDDIC_STBP
MDDIC_STBN
A22
A23
B22
B23
C206
0.1u
10%
Place near
MSM pin W18
(CODEC VSS)
C208
10n
C209
10n
C210
10n
C211
0.1u
C212
10n
C213
10n
C214
0.1u
C215
0.1u
C216
0.1u
C
TP202
TOUCH_ACK
TOUCH_DAT
TOUCH_CLK
LCD_MAKER_ID
C217
1000p
C218
1000p
C219
1000p
C220
10n
C221
10n
C222
10n
C223
10n
C224
0.1u
C225
0.1u
PA_ON1
ANT_SEL3
W850 PAM
CAM_MCLK
LCD_IF_MODE
PA_ON2 W1900 PAM
TFLASH_DET_N
CAM_PWDN
CAM_LDO_EN
LCD_RESET_N
HOOK_SENSE_N
C227
1000p
VGA_CAM_RESET
FOLDER_DETECT
TX_AGC_ADJ
TCXO_EN
TX_QM
TX_QP
TX_IM
TX_IP
DAC_REF
2K R211
Close to MSM
TRK_LO_ADJ
C228
1000p
C229
1000p
C230
1000p
PA_R0
GSM_PA_BAND
GSM_PA_EN
BT_CLK
BT_SBST
BT_SBCK
BT_DATA
BT_TX_RX_N
BT_SBDT
RX_QM
RX_QP
RX_IM
RX_IP
JTAG_TMS
JTAG_TDI
JTAG_TDO
JTAG_RTCK
SPK_AMP_EN
SPK_SW_ON
TX_ON
ANT_SEL2
ANT_SEL1
ANT_SEL0
GSM_SAW_SW_MODE
JTAG_TRST_N
JTAG_TCK
F1
K1
M1
R1
U1
VSS_PAD1_0
VSS_PAD1_1
VSS_PAD1_2
VSS_PAD1_3
VSS_PAD1_4
AF6
AF11
VSS_PAD2_0
AF15
VSS_PAD2_1
VSS_PAD2_2
R26
B17
A15
A9
VSS_PAD3_0
VSS_PAD3_1
VSS_PAD3_2
VSS_PAD3_3
A18
VSSA1
A21
VSSA2
D13
VSSA3
D19
VSSA4
P26
U19
V26
VSSA5
VSSA6
W16
VSSA7
W18
W26
VSSA8
VSSA9
VSSA10
AB26
VSSA11
AC16
VSSA12
AC26
VSSA13
AD25
AF23
VSSA14
AF24
VSSA15
VSSA16
C231
10n
C232
1000p
C233
1000p
C234
0.1u
U201-2
MSM6260_POWER w18 (Analog VSS guard ring for CODEC)
C235
0.1u
C236
0.1u
for VSS_THERMAL
C237
0.1u
RESERVED
C26
(PLLOUT_TEST)
VSS_DIG_0
VSS_DIG_1
VSS_DIG_2
VSS_DIG_3
VSS_DIG_4
VSS_DIG_5
VSS_DIG_6
VSS_DIG_7
VSS_DIG_8
VSS_DIG_9
VSS_DIG_10
VSS_DIG_11
VSS_DIG_12
VSS_DIG
T26
G26
D26
A24
A14
A11
A5
AC23
C1
H1
W1
AC1
AF8
AF16
NC
AA21
VSS39
VSS41
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
AA6
AC4
AE1
AE2
AE25
AE26
AF1
AF2
AF25
AF26
2200p cap => place between
D12(VDDA1) and F12(DAC_REF)
DAC_REF
Near to B18 (VDD_PLL)
VREG_MSMA_2.6V
C238
0.1u
10%
C239
10n
MSM6280 Reference Rev.B : AA21 -> NC
AC23: VSS_DIG
D
E
F
C
D
E
6
C241
0.1u
10%
Place near
MSM pin AD26
R212
R213
2.2K
2.2K
VREG_MSMP_2.8V
(Check CAM_DATA PINOUT !!!!)
7 8 9
OJ1 OJ2 OJ3 OJ4
LG Electronics Inc.
LGMC
- 130 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
E
A
B
D
1
SDRAM_DATA(0:31)
C
EBI2_DATA(0:15)
2 3 4 5
MEMORY (1Gbit 90n NAND FLASH + 512Mbit SDRAM)
N3 N4 N10
SDRAM_DATA(0)
SDRAM_DATA(1)
SDRAM_DATA(2)
SDRAM_DATA(3)
SDRAM_DATA(4)
SDRAM_DATA(5)
SDRAM_DATA(6)
SDRAM_DATA(7)
SDRAM_DATA(8)
SDRAM_DATA(9)
SDRAM_DATA(10)
SDRAM_DATA(11)
SDRAM_DATA(12)
SDRAM_DATA(13)
SDRAM_DATA(14)
SDRAM_DATA(15)
SDRAM_DATA(16)
SDRAM_DATA(17)
SDRAM_DATA(18)
SDRAM_DATA(19)
SDRAM_DATA(20)
SDRAM_DATA(21)
SDRAM_DATA(22)
SDRAM_DATA(23)
SDRAM_DATA(24)
SDRAM_DATA(25)
SDRAM_DATA(26)
SDRAM_DATA(27)
SDRAM_DATA(28)
SDRAM_DATA(29)
SDRAM_DATA(30)
SDRAM_DATA(31)
SDRAM_DQM(0)
SDRAM_DQM(1)
SDRAM_DQM(2)
SDRAM_DQM(3)
U8
T8
V7
U9
DQM0
DQM1
DQM2
DQM3
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
M11
M13
L10
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
L12
J9
H12
H10
EBI2_DATA(8)
EBI2_DATA(9)
EBI2_DATA(10)
EBI2_DATA(11)
G12
M12
L9
L11
EBI2_DATA(12)
EBI2_DATA(13)
K9
H13
H11
EBI2_DATA(14)
EBI2_DATA(15)
H9
G11
IO11
IO12
IO13
IO14
IO15
IO16
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
IO10
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
NC10
NC11
NC12
NC13
NC14
NC15
NC16
NC17
NC18
NC19
C13
C14
NC20
NC21
A12
A13
A14
B1
B2
B3
A1
A2
A3
A4
A11
B4
B11
B12
B13
B14
C1
C2
C5
U4
T4
T5
V5
T11
U11
V11
T12
U12
P3
R3
P4
R4
P5
R5
P6
R6
P9
P10
U5
T6
V6
U7
T9
T10
V10
R10
P11
R11
P12
R12
R13
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ29
DQ30
DQ31
D1
NC22 NC24 NC27 NC29
ERROR01
TY9000A800JOGG
6
VCCD1
VCCD2
VCCD3
VCCD4
VCCD5
VCCD6
C7
D2
D13
V3
V8
V12
VCCQD1
VCCQD2
VCCN2
V4
V9
K12
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
C6
F7
G2
G13
L13
P2
P13
R8
U2
U6
U10
U13
_WP
_WEN
_RAS
_WED
_CAS
CLK
_CS
ALE
CLE
_CE
_RE
RY__BY
CKE
BA0
BA1
L6
K6
D5
D6
E6
C8
E5
M3
M4
M9
M10
M2
D8
C4
D4
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
C3
D3
E3
E2
D12
C12
D11
C11
D10
C10
E4
D9
C9
R306
SDRAM_ADDR(0)
SDRAM_ADDR(1)
SDRAM_ADDR(2)
SDRAM_ADDR(3)
SDRAM_ADDR(4)
SDRAM_ADDR(5)
SDRAM_ADDR(6)
SDRAM_ADDR(7)
SDRAM_ADDR(8)
SDRAM_ADDR(9)
SDRAM_ADDR(10)
SDRAM_ADDR(11)
SDRAM_ADDR(12)
100K
RESOUT_EBI2_N
EBI2_WE_N
SDRAM_RAS_N
SDRAM_WE_N
SDRAM_CAS_N
SDRAM_CLK
SDRAM_CS_N(0)
NAND_ALE
NAND_CLE
EBI2_OE_N
SDRAM_CLK_EN
SDRAM_ADDR(13)
SDRAM_ADDR(14)
C314
0.1u
C315
10n
SDRAM_ADDR(0:12)
VREG_MSMP_2.8V
NAND_CS_N
NAND_READY
VREG_MSME_1.8V
VREG_MSMP_2.8V
U303
SP0204LE5-PB
5
G3
4
PWR
G2
OUT
3
G1
2
1
MIC
SPK-
Audio AMP
AMP_N
AMP_P
SPK_AMP_EN
C318
22n
C319
22n
R312
51K
R314
51K
C2
_SHDN
10u
C317
C1
U302
IN-
TPA2010D1YZF
VDD
PVDD
B1
B2
A1
IN+
VO-
A3
VO+
C3
EUSY0278601
C321
1u
+VPWR
AMP_SPK-
AMP_SPK+
NC71
NC72
NC73
NC74
NC75
NC76
NC77
NC78
NC79
NC80
NC81
NC82
NC83
L1
L2
L3
L4
K10
K11
K13
K14
L5
L14
M5
M6
N2
7
RCV-
AMP_SPK-
8 9
Select RCV / SPK
U301
NLAS5223BMNR2G
R836
GND NC1
5 6
15
R837
NC2 IN1
4
15
7
IN2 COM1
3 8
9
COM2
10
NO2
NO1
2
VCC
1
RCV+
AMP_SPK+
C839
100000pF
+VPWR
SPK_SW_ON
10
SPK+
MICBIAS
R835
47
C838 0.1u
C837 0.1u
MIC1N
MIC1P
A
B
C
D
4 5 1
LGIC(42)-A-5505-10:01
2
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3
- 131 -
LGMC
LG Electronics Inc.
LGE Internal Use Only
7. CIRCUIT DIAGRAM
A
1 2 3 4
+VPWR
WLED_PWR
LCD_BL_CTRL
LCD_BACK_LIGHT_CHARGE_PUMP
8
U401
IN C1+
3
C401 1u
5
OUTCP C1-
C2+
4
6
2
EN_SET
9
13
GND
PGND
C2-
ISINK1
ISINK2
ISINK3
ISINK4
7
10
11
12
1
AAT3152IWP
C402 1u
WLED_1
WLED_2
WLED_3
WLED_4
B
LCD_LDO_EN
+VPWR
LCD LDO
1
2
3
U402
STBY
GND
VIN
NC
BGND
VOUT
5
6
4
BH28FB1WHFV
VREG_LCD_2.8V
C
+VPWR
CAM_LDO_EN
CAM LDO
C411
1u
C412
0.01u
1
U404
VIN
2
EN1
3
EN2
4
BYP
5
NC1
MIC2211-LGYML
VOUT1
10
VOUT2
9
NC3
8
NC2
GND
BGND
7
6
11
C413
1u
C414
1u
VREG_CAM_2.7V
VREG_CAM_1.8V
D
E
1
LGIC(42)-A-5505-10:01
LGE Internal Use Only
2
VREG_MSMP_2.8V
FOLDER_DETECT
R407
62
1
U405
VDD
EM-0781-T5
VSS
4
2
OUT NC
3
FOLDER_DETECT
C826
33p
3 4 5
5
- 132 -
6
USIM_P_DATA
7 8
USIM
R401
15K
4
5
6
GND
VPP
I_O
CON401
VCC
RST
CLK
1
2
3
C408
33p
VREG_USIM_2.85V
USIM_P_RST_N
USIM_P_CLK
9
USIM_P_DATA
VREG_USIM_2.85V
6
5
4
U403
1
2
3
RCLAMP0504F
USIM_P_CLK
USIM_P_RST_N
BACK UP BAT
BAT401
NBL414R-F9J
VBACK_UP
10
B
C
D
LGMC
LG Electronics Inc.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7
A
B
C
D
+VPWR
KEY_BACK_LIGHT
R501
100ohm
R502
100ohm
LD501 LEWW-S47-PA
LD502
LEWW-S47-PA
KYBD_BACKLIGHT
VREG_MSMP_2.8V
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_COL(0)
KEY_ROW(4)
KEY_COL(1)
KEY_COL(2)
KEY_COL(3)
KEY_COL(4)
KEY
501
1
504
4
507
7
STAR
STAR
502
2
505
5
508
8
510
0
HOT502
HOT3
503
3
506
6
509
9
SHARP
#
CLR
LEFT
OK
SND
DN
MENU
UP
RIGHT
SEARCH
HOT501
KEY_COL(4)
KEY_COL(3)
KEY_COL(2)
KEY_COL(1)
KEY_COL(0)
E
1
LGIC(42)-A-5505-10:01
2 3
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4 5
- 133 -
8 9
KEY_ROW(4)
KEY_ROW(3)
KEY_ROW(2)
KEY_ROW(1)
KEY_ROW(0)
10
A
B
C
D
LGMC
LG Electronics Inc.
LGE Internal Use Only
7. CIRCUIT DIAGRAM
E
D
1 2 3 4 5 6 7
A
B
C
LCD_CAM_CONNECTOR (T=1.5, SOCKET)
VREG_LCD_2.8V
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
+VPWR
VREG_CAM_1.8V
WLED_PWR
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
0.1u
C601
VA601
INSTPAR
UCLAMP0501H_TCT
FL602
INOUT_A4
4
INOUT_A3
3
INOUT_A2
2
1
INOUT_A1
INOUT_B4
6
INOUT_B3
7
INOUT_B2
8
INOUT_B1
9
ICVE10184E070R100FR
FL604
INOUT_A4
4
INOUT_A3
3
INOUT_A2
2
1
INOUT_A1
INOUT_B4
6
INOUT_B3
7
INOUT_B2
8
INOUT_B1
9
ICVE10184E070R100FR
CAM_MCLK
CAM_PWDN
VGA_CAM_PWDN
CAM_PCLK
CAM_DATA(0)
CAM_DATA(1)
CAM_DATA(2)
CAM_DATA(3)
4
3
2
1
INOUT_A4
INOUT_A3
INOUT_A2
INOUT_A1
INOUT_B4
6
INOUT_B3
7
INOUT_B2
8
INOUT_B1
9
FL606
EVRC18S03Q015010R
TOUCH_CLK
TOUCH_ACK
TOUCH_DAT
VREG_MSMP_2.8V
VREG_CAM_2.7V
TOUCH_LED_DRV_N
SPK+
SPK-
INOUT_A4
4
INOUT_A3
3
INOUT_A2
2
1
INOUT_A1
INOUT_B4
6
INOUT_B3
7
INOUT_B2
8
INOUT_B1
9
FL607
EVRC18S03Q015010R
28
29
30
31
25
26
27
21
22
23
24
36
37
38
39
40
32
33
34
35
9
10
5
6
7
8
1
2
3
4
15
16
17
18
11
12
13
14
19
20
CON601
G1 G2
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
75
74
73
72
71
70
69
80
79
78
77
76
68
67
66
65
64
63
62
61
G3 G4
INOUT_A4
4
INOUT_A3
3
INOUT_A2
2
1
INOUT_A1
INOUT_B4
6
INOUT_B3
7
INOUT_B2
8
INOUT_B1
9
FL601 ICVE10184E070R100FR
MOTOR_POWER-
LCD_MAKER_ID
INOUT_A4
4
INOUT_A3
3
INOUT_A2
2
1
INOUT_A1
FL603
INOUT_B4
6
INOUT_B3
7
INOUT_B2
8
INOUT_B1
9
ICVE10184E070R100FR
VGA_CAM_RESET
I2C_SCL
I2C_SDA
7
6
9
8
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
INOUT_A1
1
2
INOUT_A2
3
INOUT_A3
4
INOUT_A4
FL609
EVRC18S03Q015010R
LCD_IF_MODE
LCD_RESET_N
LCD_CS_N
LCD_ADS
EBI2_WE_N
EBI2_OE_N
EBI2_DATA(8)
EBI2_DATA(9)
EBI2_DATA(10)
EBI2_DATA(11)
2
1
4
3
INOUT_A4
INOUT_A3
INOUT_A2
INOUT_A1
INOUT_B4
6
INOUT_B3
7
INOUT_B2
8
INOUT_B1
9
FL605 ICVE10184E070R100FR
EBI2_DATA(12)
EBI2_DATA(13)
EBI2_DATA(14)
EBI2_DATA(15)
WLED_1
WLED_2
WLED_3
WLED_4
7
6
9
8
FL608
EVRC18S03Q015010R
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
INOUT_A1
1
2
INOUT_A2
3
INOUT_A3
4
INOUT_A4
CAM_DATA(4)
CAM_DATA(5)
CAM_DATA(6)
CAM_DATA(7)
CAM_HSYNC
CAM_VSYNC
CAM_RESET
SUB_CS_N
8 9
URT601
3G 2.5G
GND
RX
TX
UFLS NC1
1
GND
RX
2
TX
3
4
ON_SW ON_SW
VBAT
PWR
VBAT
NC2
5
6
7
URXD
UTXD
NC3
NC4
DSR
8
9
10
RTS
11
CTS
12
TP601
TP602
TP603
UART_RX
UART_TX
PM_ON_SW_N
VBATT
USB_VBUS
USB_D-
USB_D+
CON602
5
4
3
2
1
SIDE KEY
R823
R821
R822
R601
470
470
470
100ohm
OUT102
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_COL(5)
VREG_MSMP_2.8V
JTAG_TDI
JTAG_PS_HOLD
MSM_RESIN_N
JTAG_RTCK
JTAG
1
2
3
4
5
CN603
G1
G2
7
6
10
9
8
JTAG_TCK
JTAG_TMS
JTAG_TRST_N
JTAG_TDO
10
ON_SW_N
D602
RB521S-30
ON_SW
END
END
2 3
PM_ON_SW_N
4 5 1
LGIC(42)-A-5505-10:01
LGE Internal Use Only - 134 -
A
B
C
D
LGMC
LG Electronics Inc.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
4 4 5 5 7
PMIC VPWR BYPASS
VDD_MSMC : 4.7uF
VDD_MSME : 4.7uF
VDD_PA : 4.7uF
VDD_MSM : 0.1uF
VDD_ANA : 0.1uF
VDD_RUIM : 0.1uF
VDD_RF : 0.1uF
VDD_WLAN : 0.1uF
VDD_MAIN : 0.1uF
VDD_SPKR : 0.1uF
C701
33u
+VPWR
C836
10u
+5V_PWR
1005
ICHARGE
CHG_CNT_N
ICHARGEOUT
VBATT
BATT_FET_N
MSM_RESIN_N
C720 1u
USB_OE_N
USB_CNT_N
USB_VBUS
USB_DAT
USB_D+
USB_SE0
USB_D-
R711
C722
1608
47K
4.7u
TOUCH_LED_DRV_N
KYBD_BACKLIGHT
L701
4.7uH
Switcher Circuit for RF
VREG_RF_SMPS
C729
22u
C730
10u
C731
0.1u
C732
1000p
18
19
20
21
14
15
16
17
9
10
11
12
13
1
2
3
4
5
6
7
8
ADC_BYP
VCHG
ISNS_P
CHG_CTL_N
ISNS_M
VBAT
BAT_FET_N
FLSH_DRV_N
PON_RESET_N
VREG_USB
USB_ID
VREG_5V
USB_OE_N
VSW_5V
USB_CTL_N
USB_VBUS
USB_DAT
USB_D_P
USB_SE0
USB_D_M
GP1_DRV_N(MPP7)
U701
PM6650-2M
Check if it is LOW enable.
63
REF_BYP
PS_HOLD
VREG_MSMA
62
REF_GND
MSM_INT_N
TCXO_IN
61
REF_ISET
VCOIN
60
59
58
57
56
55
TCXO_EN
54
VDD_ANA
TCXO_OUT
53
52
VDD_MSM
51
SBST
50
VREG_MSMP
49
SBCK
48
VBACKUP
47
SBDT
46
XTAL_OUT
45
SLEEP_CLK
44
XTAL_IN
43
RUIM_RST(MPP6)
51
51K
51K
0.1u
R703
R707
R708
R710
TP701
C716
121K
TCXO_PM
TCXO_EN
+VPWR
TCXO_MSM
+VPWR
VREG_MSMP_2.8V
SLEEP_CLK
VBACK_UP
SSBDT_PM
USIM_P_RST_N
C726
2.2u
C727
2.2u
USIM_RST_N
USIM_P_CLK
USIM_CLK
USIM_DATA
VREG_USIM_2.85V
VREG_TFLASH_3.0V
C719
4.7u
C833
15p
C832
15p
D701 RB521S-30
JTAG_PS_HOLD
PS_HOLD
VREG_MSMA_2.6V
VREG_MSMP_2.8V
VREG_W_PA
Power Line --> Route carefully!!!!!
Draw the Artwork_line thickly !!!!!
--->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-
R717
100K
1
U702
PGND
FB6831J
M
10
2
GND PVDD
9
3
4
5
COP
CRES
IN
CE
8
VDD
7
VOUT
6
R718
150K C739
4.7u
C738
4.7u
+VPWR
VBATT
+5V_PWR
USB_VBUS
ICHARGE
ICHARGEOUT
+VPWR
Battery Charging Circuit
10
P_DRAIN
U805
P_COLLECTOR
9
1
EMITTER1
2
EMITTER2
3
COLLECTOR
4
SOURCE
8
BASE1
BASE2
7
GATE
6
DRAIN
5
NUS3116MTR2G
CHG_CNT_N
USB_CNT_N
BATT_FET_N
VBATT
Q704
SI8407DB-T2-E1
100K
R712
R713
C728
0.1u
1K
C725
10u
+VPWR
PA_FET_N
END Ref
U404, Q402, D400, BAT400, X400, C449, R410, L402, TP401
LGIC(42)-A-5505-10:01
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4 4
- 135 -
LGMC
LG Electronics Inc.
LGE Internal Use Only
7. CIRCUIT DIAGRAM
E
A
B
C
D
1
CON801
21
19
8
9
6
7
10
4
5
1
2
3
14
15
16
17
18
11
12
13
20
22
2 3 4 5 6 7 8 9 10
R804
R825
100ohm
100ohm
C803 33u
C804 33u
R807
1K
5
SRC
6
GATE
7
OUT
8
VCC
9
DRAIN_THERMAL
NUS3065MUTAG
DRAIN
4
CNTRL
3
GND
IN
U804
2
1
VREG_MSMP_2.8V
EAR_MIC2P
FB1
HH-1M1005-601JT
2.2K
R801
C815
10u tcc_1608h_9_r
TTY_ADC_DET
TTY DETECT
0.1u
C801
MIC2P
VREG_MSMP_2.8V
C802
0.1u
VIN-
4
VIN+
3
5
VCC 1
OUT
HOOK_SENSE_N
GND
2
U801
NCS2200SQ2T2G
EAR_MIC2P
HPL_L
HPL_R
USB_D+
USB_D-
EAR_SENSE_N
VBATT
PM_ON_SW_N
R806
470K
USB_VBUS
UART_TX
UART_RX
VBAT
5
CN801
1
2
4
3
C807
33u
VBAT_GND
VBATT_SENSE
C825
30p
C834
0.1uF
R831
80.6K
VREG_MSMP_2.8V
VBATT_TEMP
S801 500873-0802
GND
DAT2_RSV
CD_DAT3_CS
CMD_DI
VDD
CLK_SCLK
VSS
DAT0_DO
DAT1_RSV
GND
TransFlash Socket
(NORMAL TYPE)
VREG_TFLASH_3.0V
C806
100p
C
SDCC_CMD
SDCC_CLK
SDCC_DATA(0)
C824
33p
D803
INSTPAR
UCLAMP0501H_TCT
TFLASH_DET_N
D
A
B
1
IN
U802
OUT
2
3
G1 G2
4
NFM21PC105B1A3
+5V_PWR
3 4 5 1
LGIC(42)-A-5505-10:01
LGE Internal Use Only
2
- 136 -
LGMC
LG Electronics Inc.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
1
+VPWR
TOUCH LED
R101 100
R102 100
VA?
EVLC14S02050
LD101
LD102
TOUCH_LED_DRV_N
LCD_CAM_CONNECTOR (T=1.5, SOCKET)
VREG_LCD_2.8V
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
+VPWR
VREG_CAM_1.8V
WLED_PWR
CAM_MCLK
CAM_PWDN
CAM_PCLK
CAM_DATA(0)
CAM_DATA(1)
CAM_DATA(2)
CAM_DATA(3)
TOUCH_CLK
TOUCH_ACK
TOUCH_DAT
VREG_MSMP_2.8V
VREG_CAM_2.7V
TOUCH_LED_DRV_N
SPK+
SPK-
CON101
G1 G2
67
66
65
64
63
72
71
70
69
68
62
61
60
59
58
57
56
55
54
53
52
51
80
79
78
77
76
75
74
73
50
49
48
47
46
45
44
43
42
41
24
25
26
27
21
22
23
28
29
30
17
18
19
20
13
14
15
16
9
10
11
12
4
5
6
7
8
1
2
3
35
36
37
38
39
40
31
32
33
34
G3 G4
LCD_IF_MODE
LCD_RESET_N
LCD_CS_N
LCD_ADS
EBI2_WE_N
EBI2_OE_N
EBI2_DATA(8)
EBI2_DATA(9)
EBI2_DATA(10)
EBI2_DATA(11)
EBI2_DATA(12)
EBI2_DATA(13)
EBI2_DATA(14)
EBI2_DATA(15)
WLED_1
WLED_2
WLED_3
WLED_4
MOTOR_POWER-
LCD_MAKER_ID
CAM_DATA(4)
CAM_DATA(5)
CAM_DATA(6)
CAM_DATA(7)
CAM_HSYNC
CAM_VSYNC
CAM_RESET
SUB_CS_N
I2C_SCL
I2C_SDA
VREG_LCD_2.8V
TOUCH_DAT
TOUCH_CLK
TOUCH_ACK
TOUCH IC
R103
22 C101
1u
(Shild Flood)
3
4
1
2
5
6
SCL
_ATTN
GPIO2
GPIO1
GPIO0
SHLD
U1
SO2810
S9
S8
XCAP
GND0
S7
S6
18
17
16
15
14
13
VREG_LCD_2.8V
SUB_CS_N
LCD_RESET_N
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
WLED_PWR
WLED_1
WLED_2
WLED_3
WLED_4
LCD
G2
CN102
G1
15
16
17
18
12
13
14
19
20
8
9
6
7
10
11
3
4
5
1
2
29
28
27
26
25
24
23
22
21
35
34
33
32
31
30
40
39
38
37
36
EBI2_WE_N
LCD_CS_N
LCD_ADS
EBI2_DATA(8)
EBI2_DATA(9)
EBI2_DATA(10)
EBI2_DATA(11)
EBI2_DATA(12)
EBI2_DATA(13)
EBI2_DATA(14)
EBI2_DATA(15)
LCD_IF_MODE
LCD_MAKER_ID
EBI2_OE_N
CAM_DATA(7)
CAM_DATA(6)
CAM_DATA(5)
CAM_DATA(4)
CAM_DATA(3)
CAM_DATA(2)
CAM_DATA(1)
CAM_DATA(0)
CAM_PCLK
CAM_RESET
CAM_PWDN
1.3M
CN101
24
23
17
16
15
14
13
22
21
20
19
18
14-5602-024-000-829
1
2
7
8
9
10
11
12
5
6
3
4
I2C_SCL
I2C_SDA
CAM_VSYNC
CAM_HSYNC
CAM_MCLK
VREG_CAM_2.7V
VREG_MSMP_2.8V
VREG_CAM_1.8V
SPK+
SPK-
VA101
EVLC14S02050
L?
L?
82nH
82nH
VA102
EVLC14S02050
SPKP
SPKN
+VPWR
MOTOR_POWER-
L?
L?
82nH
82nH
MOTOP
MOTON
FAST_BACK
OUT101
SENSE_1
START&STOP
OUT102
SENSE_2
OUT103
SENSE_3
FAST_FORWARD
OUT104
SENSE_4
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 137 -
LGMC
LG Electronics Inc.
LGE Internal Use Only
LGE Internal Use Only - 138 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA
8. BGA
U201-1, U201-2 : MSM 6260
(EUSY0334501)
: USE
: NO USE
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 139 LGE Internal Use Only
8. BGA
U806 : TY9000A800JOGG
(EUSY0336901)
* U806 is ERROR01 in circuit diagram (page 3).
: USE
: NO USE
LGE Internal Use Only - 140 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 141 LGE Internal Use Only
LGE Internal Use Only - 142 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 143 LGE Internal Use Only
9. PCB LAYOUT
LGE Internal Use Only - 144 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 145 LGE Internal Use Only
9. PCB LAYOUT
LGE Internal Use Only - 146 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. Calibration & RF Auto Test Program
10. Calibration & RF Auto Test Program
10.1 Configuration of HOT KIMCHI
10.1.1 Configuration of directory
HOT KIMCHI PROJECT Auto_Model CU575
: Directory
: File
Cal_Model
HOT_KIMCHI
RF_Auto
Info_Db.txt
CU575
CmMqDll.dll
ComLMPLib_06.dll
Hot_KimchiD.exe
ShieldBox_DllD.dll
Main_SequenceD.dll
Dll_SerialATD.dll
DLL_PwrControlD.dll
DLL_E5515CD.DLL
AT_Serial_Cmd.xml
PwrSupply_Cmd.xml
Rf_AutoMain_Ver1114.dll
Setup_RF_AutoTest.xml
AutoSetup_100.xml
Procedure_CU575_102.xml
Spec_CU575_101.xml
At_Serial_Cmd.xml
dacTable.cfg
Diag_NV6275_RevB.dll
DLL_E5515CD.DLL
DLL_PwrControlD.dll
Dll_SerialATD.dll
Ezlooks.xml
FTMLib.dll
LG_RfCal_QuCU575Ag_099.dll
ModelInfo.txt
PwrSupply_Cmd.xml
QLib.dll
Setup_Cal_Test.xml
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 147 LGE Internal Use Only
10. Calibration & RF Auto Test Program
10.1.2 Setup file (Info_Db.txt)
/*cal*/[Default]=[CU575]
1 2 3
/*cal*/[CU575]=[..\\Cal_Model\\CU575\\LG_RfCal_Qu CU575 Ag_099.dll]
4
/*auto*/[CU575]=[..\\RF Auto\\Rf_AutoMain_Ver1114.dll]
[ezlooks]=[off]
[batcal]=[off]
[svc]=[off]
‘on’ or ‘off’. (use only lower case)
[standalone]=[off]
[tescom]=[off]
5
[process]=[cal]
‘auto’ or ‘cal’. (use only lower case)
6 7
[CU575]=[..\\Auto_Model\\CU400\\Procedure_CU575_102.xml,..\\Auto_Model\\ CU575
\\Spec_CU575_101.xml,..\\Auto_Model\\CU400\\AutoSetup_100.xml]
1: Indication of ‘cal process’ or ‘auto process’
2: Model name which is displayed on Hot Kimchi program
3: Relative path of Main Sequence dll file from Hot_KimchiD.exe
4: You can change this as ‘on’ or ‘off’(should be in lower case; on, off)
5: You can change this as ‘auto’ or ‘cal’(should be in lower case; on, off)
6: Auto model name
7: Relative path of auto model procedure, spec, setting file from Hot_KimchiD.exe
LGE Internal Use Only - 148 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. Calibration & RF Auto Test Program
10.1.3 Items of setup file
[ezlooks] => The yes or no for using ezlooks
Domestic: on, Overseas: off
[batcal] => The yes or no for using battery calibration
[svc] => The yes or no for using HOT KIMCHI at service center
Domestic: off, Service Center: on
[standalone] => Overseas factory or Service Center: on, Domestic: off
[tescom] => The yes or no for using TESCOM shield box
[process] => selection of the process (auto or cal)
[CU400] => procedure, spec., setup file name (only for auto)
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 149 LGE Internal Use Only
10. Calibration & RF Auto Test Program
10.1.4 Example for setup file
CAL Process AUTO Process
Ex1) Service center
[ezlooks]=[off]
[batcal]=[off]
[svc]=[on]
[standalone]=[off]
[tescom]=[off]
[process]=[cal]
Ex2) Overseas factory or Repair
[ezlooks]=[off]
[batcal]=[on]
[svc]=[off]
[standalone]=[on]
[tescom]=[off]
[process]=[cal]
Ex3) Domestic factory
[ezlooks]=[on]
[batcal]=[on]
[svc]=[off]
[standalone]=[off]
[tescom]=[off]
[process]=[cal]
Ex1) Service center, Overseas factory, Repair
[ezlooks]=[off]
[batcal]=[off]
[svc]=[off]
[standalone]=[off]
[tescom]=[off]
[process]=[auto]
Ex2) Domestic factory
[ezlooks]=[on]
[batcal]=[off]
[svc]=[off]
[standalone]=[off]
[tescom]=[off]
[process]=[auto]
❇
In case of using Tescom S/B, set [tescom]=[on].
LGE Internal Use Only - 150 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. Calibration & RF Auto Test Program
10.2 How to use HOT KIMCHI
CU575
➁
CU575
➂
➀
* Flow
1. Select the model name which you want
2. Click APPLY button to load the ‘cal’ or ‘auto’ lib file
3. Click START button to run the procedure which you want
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 151 LGE Internal Use Only
10. Calibration & RF Auto Test Program
10.3 Example for using HOT KIMCHI
Exe_QCU575Ver0.99A
➀
Choose Exe_QCU575Ver0.99A
Exe_ QCU575Ver0.99A
➁
Click APPLY button
➂
Click START button
- CU575_Ver0.99A Calibration -
LGE Internal Use Only - 152 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. Calibration & RF Auto Test Program
10.3.1 Example for RF Auto Test
CU575 ver097A
Click START
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 153 LGE Internal Use Only
10. Calibration & RF Auto Test Program
10.3.2 Example for RF Auto Test
Click Run button
KU950
Current model : CU575
EZLOOKS : OFFLINE
PROCEDURE : ..\\Auto Model\\CU575\\Procedure_CU575_102.xml
SEPC : ..\\Auto Model\\CU575\\Spec_CU575_101.xml
LGE Internal Use Only - 154 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.1 EXPLODED VIEW
1
2 3
4
5
6
7 8
9 10 11 12 13 14
15 16 17 18
19
20
21
22
23 24 25 26 29
30 32
33 34
35 36 37 38
39
27 28 31
49 51 52
54 55
56 57
58
36
59
40
41 42 43
44
45 17
46
47
48 50
53
60
61 62
63 64
65 66
24 67 68
69 70
71
72
73
74 75
76
77
78 79
80
81
82
83
96 84 85
86
68
87
88 89 90
91 92
93 94
79
95
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 155 LGE Internal Use Only
LGE Internal Use Only - 156 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.2 Replacement Parts
<Mechanic component>
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
5
5
5
5
5
5
2
3
4
Level
Location
No.
1
Description
IMT,FOLDER
2 AAAY00 ADDITION
APEY00 PHONE
4
ACGG00
ABGA00
COVER ASSY,FOLDER
BUTTON ASSY,DIAL
ACGH00
COVER ASSY,
FOLDER(LOWER)
GMZZ00 SCREW MACHINE 5
5
5
5
MBFF00 BRACKET,LCD
MCCZ00 CAP
MCJH00 COVER,FOLDER(LOWER)
Part Number
TIFF0014801
AAAY0196301
APEY0385901
ACGG0080001
ABGA0007601
ACGH0046901
GMZZ0019002
MBFF0012301
MCCZ0025701
MCJH0037701
Specification
2.7 mm,1.5 mm,MSWR3 ,N ,+ ,- ,NYLOK Coating 1
CASTING, Al Alloy, , , , ,
COMPLEX, (empty), , , , ,
MOLD, PC LUPOY SC-1004A, , , , ,
Color Remark
Black
Black
Black
Black
Titan Silver
Titan Silver
5
5
5
5
5
5
5
MDAC00
MDAC01
MFBC00
MGAD00
MICZ00
MIDZ00
MMAA00
MPBG00
MPBN00
MPFD00
DECO,SIDE
DECO,SIDE
FILTER,SPEAKER
GASKET,SHIELD FORM
INSERT
INSULATOR
MAGNET,SWITCH
PAD,LCD
PAD,SPEAKER
PLATE,GROUND
MDAC0019301
MDAC0019501
MFBC0028801
MGAD0144701
MICZ0019901
MIDZ0127301
MMAA0000601
MPBG0056601
MPBN0039201
MPFD0003801
MTAD0064601
MTAF0011001
MTAZ0182601
COMPLEX, (empty), , , , ,
COMPLEX, (empty), , , , ,
COMPLEX, (empty), , , , ,
COMPLEX, (empty), , , , ,
COMPLEX, (empty), , , , ,
LG-G510,511,512 common use, DIA : 3.0mm+1.5t
COMPLEX, (empty), , , , ,
COMPLEX, (empty), , , , ,
PRESS, STS, 0.1mm, , , ,
COMPLEX, (empty), , , , ,
COMPLEX, (empty), , , , ,
COMPLEX, (empty), , , , ,
69
Silver
Titan Silver
Black
Titan Silver
Titanium
Black
Titanium
Black
Black
Gold
Without
Color
Without
Color
Silver
Black
Black
Without
Color
Black
Black
Black
29
33
56
24
30,68
27
26
34
55
28
25
23
57
32
31
22
54
4
5
5
5
5
MTAD00 TAPE,WINDOW
MTAF00 TAPE,MOTOR
MTAZ00 TAPE
ACGJ00
COVER ASSY,
FOLDER(UPPER)
MBJC00 BUTTON,FUNCTION
MCJJ00 COVER,FOLDER(UPPER)
MDAD00 DECO,CAMERA
MDAE00 DECO,FOLDER(UPPER)
ACGJ0060901
MBJC0021401
MDAE0038801
MOLD, PC LUPOY SC-1004A, , , , ,
MCJJ0047001 MOLD, PC LUPOY SC-1004A, , , , ,
MDAD0028601 PRESS, STS, 0.2, , , ,
PRESS, Al, 0.6, , , ,
Titan Silver
Titan Silver
Titan Silver
Titan Silver
Titan Silver
45
9
7
4
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 157 LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
5
5
5 MIDZ00 INSULATOR
MIDZ01 INSULATOR
MPBF00 PAD,FLEXIBLE PCB
MPBJ00 PAD,MOTOR
MPBN00 PAD,SPEAKER
MPBQ00 PAD,LCD(SUB)
MPBT00 PAD,CAMERA
MPBU00 PAD,CONNECTOR
MPBZ00 PAD
MPBZ01 PAD
MPBZ02 PAD
MPBZ04 PAD
MTAA00 TAPE,DECO
MTAD00 TAPE,WINDOW
MTAE00 TAPE,WINDOW(SUB)
MTAZ01 TAPE
MTAZ02 TAPE
ACGK00 COVER ASSY,FRONT
ADBY00 DECO ASSY
MDAG00 DECO,FRONT
MTAA00 TAPE,DECO
MBJL00 BUTTON,SIDE
MCJK00 COVER,FRONT
MFBD00 FILTER,MIKE
MGAD00 GASKET,SHIELD FORM
MGAD01 GASKET,SHIELD FORM
MICZ00 INSERT
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
5
4
6
5
5
5
5
5
Location
No.
MFEZ00 FRAME
Description
MICZ00
MIDZ01
MIDZ02
INSERT
INSULATOR
INSULATOR
Part Number Specification
MFEZ0012401 PRESS, STS, 0.4, , , ,
MICZ0019901
MIDZ0131301 COMPLEX, (empty), , , , ,
MIDZ0131401 COMPLEX, (empty), , , , ,
MPBF0021101 COMPLEX, (empty), , , , ,
MPBJ0041101 COMPLEX, (empty), , , , ,
MPBN0039301 COMPLEX, (empty), , , , ,
MPBQ0030801 COMPLEX, (empty), , , , ,
MPBT0038101 COMPLEX, (empty), , , , ,
MPBU0008701 COMPLEX, (empty), , , , ,
MPBZ0173601 COMPLEX, (empty), , , , ,
MPBZ0173701 COMPLEX, (empty), , , , ,
MPBZ0173801 COMPLEX, (empty), , , , ,
MPBZ0183001 COMPLEX, (empty), , , , ,
MTAA0131601 COMPLEX, (empty), , , , ,
MTAD0067901 COMPLEX, (empty), , , , ,
MTAE0030001 COMPLEX, (empty), , , , ,
MTAZ0182801 COMPLEX, (empty), , , , ,
MTAZ0182901 COMPLEX, (empty), , , , ,
ACGK0084401
ADBY0011401
MDAG0025201 COMPLEX, (empty), , , , ,
MTAA0131701 COMPLEX, (empty), , , , ,
MBJL0038701 COMPLEX, (empty), , , , ,
MCJK0068301 MOLD, PC LUPOY SC-1004A, , , , ,
MFBD0022001 COMPLEX, (empty), , , , ,
MGAD0144701 COMPLEX, (empty), , , , ,
MGAD0144801 COMPLEX, (empty), , , , ,
MICZ0019901
MIDZ0127801 COMPLEX, (empty), , , , ,
MIDZ0127701 COMPLEX, (empty), , , , ,
LGE Internal Use Only
Black
Black
Black
Black
Black
Titan Silver
Black
Black
Titanium
Black
Titan Silver
Without
Color
Gold
Gold
Without
Color
Without
Color
Without
Color
Color Remark
Black
Without
Color
Without
Color
Without
Color
Black
Black
Black
Black
Black
Black
Black
Black
Black
Black
Black
16
17
46
10
42
14
13
5,41
6
40
8
60
61
86
63
84
96
11
85
67
43
18
12
15
44
- 158 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
4
5
5
4
4
4
4
4
5
5
5
5
5
Level
5
Location
No.
Description
MPFD00 PLATE,GROUND
5 MSGY00 STOPPER
MSGY01
MTAZ00
MTAZ01
STOPPER
TAPE
TAPE
ADBY00 DECO ASSY
MDAH00 DECO,RECEIVER
MTAA00 TAPE,DECO
APGZ00 PLATE ASSY
MPBZ00 PAD
MPFZ00 PLATE
GMEY00 SCREW MACHINE,BIND
MCCH00 CAP,SCREW
MCCH01 CAP,SCREW
MGAD00 GASKET,SHIELD FORM
Part Number Specification
MPFD0003901 PRESS, STS, 0.1mm, , , ,
MSGY0020801 COMPLEX, (empty), , , , ,
MSGY0020901 COMPLEX, (empty), , , , ,
MTAZ0183001 COMPLEX, (empty), , , , ,
MTAZ0192201 COMPLEX, (empty), , , , ,
ADBY0011501
MDAH0021201 MOLD, PC LUPOY SC-1004A, , , , ,
MTAA0131501 COMPLEX, (empty), , , , ,
APGZ0002501
MPBZ0173901 COMPLEX, (empty), , , , ,
MPFZ0027901 PRESS, STS, 0.4, , , ,
GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK
MCCH0101001 COMPLEX, (empty), , , , ,
MCCH0101101 COMPLEX, (empty), , , , ,
MGAD0140301 COMPLEX, (empty), , , , ,
4 MGAD01 GASKET,SHIELD FORM MGAD0140401 COMPLEX, (empty), , , , ,
4 MGAD02 GASKET,SHIELD FORM
4
4
4
4
4
4
4
4
4
6
6
6
6
MHFD00 HINGE,FOLDER
MIDZ00 INSULATOR
MLAZ00 LABEL
MSGB00 STOPPER,HINGE
MTAB00
MTAB01
TAPE,PROTECTION
TAPE,PROTECTION
MWAC00 WINDOW,LCD
MWAE00 WINDOW,CAMERA
MWAF00 WINDOW,LCD(SUB)
MGAD00 GASKET,SHIELD FORM
MIDZ00 INSULATOR
MIDZ01 INSULATOR
MPBF00 PAD,FLEXIBLE PCB
MGAD0140601 COMPLEX, (empty), , , , ,
MHFD0012601 MG810c_HINGE
MIDZ0144601 COMPLEX, (empty), , , , ,
MLAZ0038303 PRINTING, (empty), , , , ,
MSGB0017601 MOLD, PC LUPOY SC-1004A, , , , ,
MTAB0138101 COMPLEX, (empty), , , , ,
MTAB0166001 COMPLEX, (empty), , , , ,
MWAC0075901 COMPLEX, (empty), , , , ,
MWAE0024001 CUTTING, PMMA MR 200, , , , ,
MWAF0036101 COMPLEX, (empty), , , , ,
MGAD0146501 COMPLEX, (empty), , , , ,
MIDZ0139701 COMPLEX, (empty), , , , ,
MIDZ0139801 COMPLEX, (empty), , , , ,
MPBF0022701 COMPLEX, (empty), , , , ,
Color Remark
Gold
Gray
Gray
Black
Black
White
Without
Color
Without
Color
Without
Color
Black
Titan Silver
Titan Silver
Without
Color
Without
Color
Without
Color
Without
Color
Green
Black
Black
Black
Without
Color
Black
Black
Without
Color
Black
Titan Silver
Gold
Sky Blue
Sky Blue
Without
Color
59
58
50
53
64
65
83
66
82
49
52
62
70
1
38
39
51
37
35
2
3
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 159 LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.2 Replacement Parts
<Main component>
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
4
4
4
4
4
4
4
4
4
4
Level
3
Location
No.
Description
ACGM00 COVER ASSY,REAR
4 MCBA00 CAN,SHIELD
MCCC00 CAP,EARPHONE JACK
MCCF00 CAP,MOBILE SWITCH
MCCG00 CAP,MULTIMEDIA CARD
MCJN00 COVER,REAR
MGAD00 GASKET,SHIELD FORM
Part Number
ACGM0086101
Specification
MCBA0017301 PRESS, STS, 0.2mm, , , ,
MCCC0042701 COMPLEX, (empty), , , , ,
MCCF0045201 COMPLEX, (empty), , , , ,
MCCG0007301 COMPLEX, (empty), , , , ,
MCJN0063901 MOLD, PC LUPOY SC-1004A, , , , ,
MGAD0140701 COMPLEX, (empty), , , , ,
MIDZ00 INSULATOR
MLAB00 LABEL,A/S
MLEA00 LOCKER,BATTERY
MLEY00 LOCKER
MSDC00 SPRING,LOCKER
MIDZ0139901 COMPLEX, (empty), , , , ,
MLAB0001102 C2000 USASV DIA 4.0
MLEA0037201 MOLD, PC LUPOY SC-1004A, , , , ,
MLEY0000801 SIM LOCKER
MSDC0008301
3
3
3
3
5
5
5
GMEY00 SCREW MACHINE,BIND
MCCH00 CAP,SCREW
MCCH01 CAP,SCREW
MLAK00 LABEL,MODEL
ADCA00 DOME ASSY,METAL
MPBU00 PAD,CONNECTOR
MLAZ00 LABEL
GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK
MCCH0101301 COMPLEX, (empty), , , , ,
MCCH0101401 COMPLEX, (empty), , , , ,
MLAK0006901
ADCA0063201
MPBU0010101 COMPLEX, (empty), , , , ,
MLAZ0038301 PID Label 4 Array
Color Remark
Titan Silver
Without
Color
Titan Silver
Titan Silver
Titan Silver
Titan Silver
Without
Color
Without
Color
White
Titan Silver
Silver
Without
Color
Without
Color
Titan Silver
Titan Silver
74
73
88
76
36,79
81
80
90
92
91
76
89
78
93
Without
Color
Black
Without
Color
71
LGE Internal Use Only - 160 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
7
7
7
6
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Level
4
Location
No.
Description
SACY00 PCB ASSY,FLEXIBLE
5 SACB00
PCB ASSY,
FLEXIBLE,INSERT
5
6
7
7
7
7
7
6
SACE00 PCB ASSY,FLEXIBLE,SMT
SACC00
PCB ASSY,FLEXIBLE,SMT
BOTTOM
CN101
CONNECTOR,BOARD TO
BOARD
CN102
CONNECTOR,BOARD TO
BOARD
CON101
CONNECTOR,BOARD TO
BOARD
L3 INDUCTOR,CHIP
L4 INDUCTOR,CHIP
SACD00
PCB ASSY,FLEXIBLE,SMT
TOP
C101 CAP,CERAMIC,CHIP
C102
L1
L2
CAP,CERAMIC,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
LD101 DIODE,LED,CHIP
LD102 DIODE,LED,CHIP
R101 RES,CHIP
R102
R103
R104
R105
R106
RES,CHIP
RES,CHIP,MAKER
RES,CHIP
RES,CHIP
RES,CHIP
U1
VA101
VA102
VA103
VA104
SPCY00
IC
VARISTOR
VARISTOR
VARISTOR
VARISTOR
PCB,FLEXIBLE
Part Number
SACY0058701
SACB0039601
SACE0053301
SACC0032601
ENBY0019101 24 PIN,0.4 mm,STRAIGHT , ,H1.5, MALE
ENBY0020301 40 PIN,0.4 mm,ETC , ,H=0.9, Socket
ENBY0033801 80 PIN,0.4 mm,ETC , ,H=1.5, P4S Socket
ELCH0005825 100 nH,J ,1005 ,R/TP ,
ELCH0005825 100 nH,J ,1005 ,R/TP ,
SACD0043501
ECCH0004904
ELCH0005825
ERHY0000220
ERHY0003601
Specification
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ELCH0005825 100 nH,J ,1005 ,R/TP ,
100 nH,J ,1005 ,R/TP ,
EDLH0012301 BLUE ,ETC ,R/TP ,Pb_free
EDLH0012301 BLUE ,ETC ,R/TP ,Pb_free
100 ohm,1/16W,J,1005,R/TP
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP
2700 ohm,1/16W ,J ,1005 ,R/TP
ERHY0003601 2700 ohm,1/16W ,J ,1005 ,R/TP
ERHY0003601 2700 ohm,1/16W ,J ,1005 ,R/TP
EUSY0328401 touch controller IC 8 Channel 4mm x 4mm ,24 PIN,R/TP
,touch controller IC
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SPCY0096401 POLYI ,0.5 mm,MULTI-5 ,CU570 F-LCD ,; , , , , , , , , ,
Color Remark
19
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 161 LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
4
4
4
4
4
Location
No.
Description
SJMY00 VIBRATOR,MOTOR
SUSY00
SVCY00
SVLM00
SNGF00
SPEAKER
CAMERA
LCD MODULE
ANTENNA,GSM,FIXED
4
5
4
3
4
5
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
SNGF01 ANTENNA,GSM,FIXED
SAFY00 PCB ASSY,MAIN
SAFB00 PCB ASSY,MAIN,INSERT
SPKY PCB,SIDEKEY
SAFF00 PCB ASSY,MAIN,SMT
SAFC00
PCB ASSY,MAIN,SMT
BOTTOM
BAT401 BATTERY,CELL,LITHIUM
C1
C10
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C100
C101
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C102
C103
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C104 CAP,CERAMIC,CHIP
C105
C107
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C108 CAP,CERAMIC,CHIP
C11
C110
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C112 CAP,CERAMIC,CHIP
C113
C114
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C115 CAP,CERAMIC,CHIP
C116
C117
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
C12
C13
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
Part Number Specification
SJMY0006506 3 V,0.08 A,10*3.45 ,17mm
SUSY0026902
ASSY ,8 ohm,90 dB,1813 mm,15mm ,Double diaphragm , , ,
, , , ,WIRE
SVCY0013001 CMOS ,MEGA ,1.3M, S/File 1/3.8", 8*14*5t, BtB
SVLM0020502
MAIN ,M_176*220 S_128*160 ,41*57.7*3.3t ,262k ,TFT ,TM
,M_S1D503B S_LGDP4512 ,Main : 2.2" S_1.3"
SNGF0022901
3.0 ,-2 dBd, ,BLUETOOTH, INTERNAL ,; ,SINGLE ,-2.0 ,50
,3.0
SNGF0023001
3.0 ,-2 dBd, ,GSM850+EGSM+DCS+PCS+W-BAND II+W-
BAND V, INTERNAL ,; ,MULTI ,-2.0 ,50 ,3.0
Color
SAFY0195401
SAFB0069601
SPKY0044801 POLYI ,0.2 mm,DOUBLE ,CU570 SIDEKEY ,; , , , , , , , , ,
SAFF0116501
SAFC0087901
SBCL0001701
2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi
4.8, Pb-Free
ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000118 30 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000118 30 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000118 30 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000118 30 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000148 2.7 nF,50V,K,X7R,HD,1005,R/TP
Remark
48
47
20
21
75
87
72
LGE Internal Use Only - 162 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C14
Description
CAP,CERAMIC,CHIP
6 C15 CAP,CHIP,MAKER
C17
C176
C18
CAP,CHIP,MAKER
INDUCTOR,CHIP
CAP,CHIP,MAKER
C2
C20
C201
C202
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP,MAKER
CAP,CERAMIC,CHIP
C203 CAP,TANTAL,CHIP,MAKER
C204
C205
C206
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
Part Number Specification
ECCH0000144 1.2 nF,50V,K,X7R,HD,1005,R/TP
ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ELCH0005015 6.8 nH,S ,1005 ,R/TP ,
ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECTZ0004701 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP
ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
C207
C208
C209
C21
C210
C211
C212
C213
C214
C215
C216
C217
C218
C219
C22
C220
C221
C222
C223
C224
C225
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
ECCH0009106
ECCH0009101
ECCH0009101
ECCH0009512
ECCH0000115
ECCH0009106
ECCH0009106
10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009512 1000 pF,25V ,K ,X7R ,HD ,0603 ,R/TP
ECCH0009512 1000 pF,25V ,K ,X7R ,HD ,0603 ,R/TP
1000 pF,25V ,K ,X7R ,HD ,0603 ,R/TP
22 pF,50V,J,NP0,TC,1005,R/TP
10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
Color Remark
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 163 LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C226
Description
CAP,CERAMIC,CHIP
6 C227 CAP,CERAMIC,CHIP
C228
C229
C23
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C230
C231
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C232
C233
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C234 CAP,CERAMIC,CHIP
C235
C236
C237
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C238
C239
C24
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C240
C241
C25
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C26
C27
C28
C29
C3
C30
C304
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C305 CAP,CERAMIC,CHIP
C306
C307
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C308 CAP,CERAMIC,CHIP
C309
C31
C310
C311
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
Part Number Specification
ECCH0009107 2.2 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
ECCH0009512 1000 pF,25V ,K ,X7R ,HD ,0603 ,R/TP
ECCH0009512 1000 pF,25V ,K ,X7R ,HD ,0603 ,R/TP
ECCH0009512 1000 pF,25V ,K ,X7R ,HD ,0603 ,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0009512 1000 pF,25V ,K ,X7R ,HD ,0603 ,R/TP
ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
ECCH0009512 1000 pF,25V ,K ,X7R ,HD ,0603 ,R/TP
ECCH0009512 1000 pF,25V ,K ,X7R ,HD ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
ECCH0000138 390 pF,50V,K,X7R,HD,1005,R/TP
ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
LGE Internal Use Only
Color Remark
- 164 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
6
6
Location
No.
C314
Description
CAP,CERAMIC,CHIP
C315
C317
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
Part Number Specification
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
ECTH0004807
10 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,-
55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]
ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP C318 CAP,CERAMIC,CHIP
C319
C32
C321
C34
C35
C36
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,TANTAL,CHIP,MAKER
CAP,CERAMIC,CHIP
ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECTZ0004204 100 uF,6.3V ,M ,STD ,3216 ,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
C37
C38
C39
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C4
C401
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C402
C403
C404
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
ECZH0000813
ECCH0000115
ECCH0000115
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
22 pF,50V,J,NP0,TC,1005,R/TP
22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C406
C407
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C408 CAP,CHIP,MAKER
C409
C41
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C410 CAP,CERAMIC,CHIP
C411
C412
C413
C414
C415
C416
C42
C43
C46
C48
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
ECZH0000830
ECCH0000182
ECZH0000830
ECCH0000198
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP
ECTH0003704 4.7 uF,10V ,M ,STD ,1608 ,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
Color Remark
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 165 LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C49
Description
CAP,CERAMIC,CHIP
6 C5 CAP,CERAMIC,CHIP
C50
C51
C52
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C53
C54
C56
C57
C58
C59
C6
C601
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C68
C69
C7
C70
C64
C66
C67
C602
C603
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C604 CAP,CERAMIC,CHIP
C605
C61
C62
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C701 CAP,TANTAL,CHIP
C703
C704
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C705 CAP,CERAMIC,CHIP
C706
C707
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C708
C709
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
Part Number Specification
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000195 3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECTH0005201
33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP , , ,[empty] ,[empty] ,
,[empty] , ,2.2X1.1X1.1MM ,[empty] ,[empty] ,[empty]
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
Color Remark
LGE Internal Use Only - 166 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C71
Description
CAP,CERAMIC,CHIP
6 C710 CAP,CERAMIC,CHIP
C711
C712
C713
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C714
C715
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C716
C718
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C719 CAP,CERAMIC,CHIP
C72
C720
C721
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C722
C725
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP,MAKER
C726 CAP,CERAMIC,CHIP
C727
C728
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C729 CAP,CERAMIC,CHIP
C73
C730
C731
C732
C733
C734
C735
C736
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C738
C739
C74
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C77
C8
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C801 CAP,CERAMIC,CHIP
C802 CAP,CERAMIC,CHIP
Part Number Specification
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
ECTH0003703 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP
ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000105 4 pF,50V,C,NP0,TC,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
Color Remark
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 167 LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
6
Location
No.
C803
Description
CAP,TANTAL,CHIP
Part Number Specification
ECTH0002002
33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,-
55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty] ,[empty]
Color Remark
C804 CAP,TANTAL,CHIP ECTH0002002
33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,-
55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty] ,[empty]
C805
C806
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C807 CAP,TANTAL,CHIP
C808
C81
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
C811 CAP,CERAMIC,CHIP
C813
C814
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C815
C816
CAP,TANTAL,CHIP,MAKER
CAP,CHIP,MAKER
C819 CAP,CHIP,MAKER
C82
C820
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
C821 CAP,CHIP,MAKER
C822
C823
CAP,CHIP,MAKER
CAP,CHIP,MAKER
C824 CAP,CERAMIC,CHIP
C825
C826
C83
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C830
C831
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C832 CAP,CERAMIC,CHIP
C833
C834
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
C835
C836
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C837 CAP,CERAMIC,CHIP
C838
C839
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP
ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP
ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000105 4 pF,50V,C,NP0,TC,1005,R/TP
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0009501 33 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP
ECCH0000118 30 pF,50V,J,NP0,TC,1005,R/TP
ECCH0009501 33 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
ECCH0002001 100000 pF,6.3V ,K ,B ,HD ,1005 ,R/TP
LGE Internal Use Only - 168 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
6
6
6
6
6
6
6
6
6
Location
No.
C84
Description
CAP,CERAMIC,CHIP
C85
C86
C87
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,FILM,MPP
C91
C92
C93
C88
C9
C90
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C94
C95
C96
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
C97 CAP,CHIP,MAKER
CN603
CONNECTOR,BOARD TO
BOARD
CN801 CONNECTOR,ETC
CON401 CONN,SOCKET
CON601
CONNECTOR,BOARD TO
BOARD
CON801 CONNECTOR,I/O
D601
D602
D603
D701
D803
DIODE,SWITCHING
DIODE,SWITCHING
DIODE,SWITCHING
DIODE,SWITCHING
DIODE,TVS
Part Number Specification
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000105 4 pF,50V,C,NP0,TC,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECFD0000105
2.2 nF,16V ,J ,STD ,SMD ,1608 mm,R/TP ,; , ,5% ,[empty]
,[empty] ,-55TO+125C ,[empty] ,1.6X0.8X0.7MM ,R/TP
ECCH0000187 150 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
ECCH0000127 82 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
ENBY0018501 10 PIN,.4 mm,STRAIGHT , ,H=0.9,HEADER
ENZY0020101 3 PIN,2.5 mm,ETC , ,
ENSY0001602 6 PIN,ETC ,5 IRECTIONAL ,2.54 mm,K(GC200)
ENBY0033701 80 PIN,0.4 mm,ETC , ,H=1.5, P4S Header
ENRY0006801
18 PIN,0.4 mm,ETC , , ,; ,18 ,0.40MM ,ANGLE
,RECEPTACLE ,SMD ,R/TP ,
EDSY0011901
EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,
IR=30uA(VR=10V)
EDSY0011901
EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,
IR=30uA(VR=10V)
EDSY0011901
EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,
IR=30uA(VR=10V)
EDSY0011901
EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,
IR=30uA(VR=10V)
EDTY0007501 SOD-523 ,5 V,240 W,R/TP ,Vc 12.5V , 160pF , 1.6*0.8*.06
Color Remark
D804
D805
FB1
FL101
DIODE,TVS
DIODE,TVS
FILTER,BEAD,CHIP
FILTER,SAW,DUAL
EDTY0007801 SC-70 ,5 V,150 W,R/TP ,LOW CAPACITANCE TVS ARRAY
EDTY0007401 SMD ,12 V,350 W,R/TP ,
SFBH0009801 600 ohm,1005 ,DC Res.0.6ohm, R.C.500mA
SFSB0000601
836.5 MHz,25 MHz,4.4 dB,17 dB,897.5 MHz,35 MHz,4.4
dB,10 dB,3.2*2.5*1.5 ,SMD ,Pb-free_Tx Dual SAW & Switch
Module
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 169 LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
Location
No.
6
Description
FL102 DUPLEXER,PCS
6
6
FL103
FL104
FILTER,SAW
DUPLEXER,DCN
FL105
FL106
FL110
FL601
FILTER,SAW
FILTER,SAW
FILTER,SAW
FILTER,EMI/POWER
6
6
FL602
FL603
FILTER,EMI/POWER
FILTER,EMI/POWER
FL604 FILTER,EMI/POWER
FL605 FILTER,EMI/POWER
L108
L110
L111
L112
L113
L114
L115
L116
L117
L118
L101
L102
L103
L105
L106
L107
FL606 FILTER,EMI/POWER
FL607 FILTER,EMI/POWER
FL608 FILTER,EMI/POWER
FL609 FILTER,EMI/POWER
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
Part Number Specification
SDPY0002902
1880 MHz,1960 MHz,3.8 dB,3.5 dB,43 dB,52 dB,3.8*3.8*1.4 ,SMD ,FBAR
SFSY0018101 836.5 MHz,2.0*1.6*0.68 ,SMD ,
SDDY0004101
836.5 MHz,881.5 MHz,2.0 dB,2.7 dB,49 dB,61 dB,3.0*2.5*1.25 ,SMD ,
SFSY0018201 881.5 MHz,2.0*1.4*0.78 ,SMD ,
SFSY0024901
1960 MHz,2.0*1.4*0.68 ,SMD ,5pin, Unbal-Bal, 50/100,
B7834 Low Loss ver.
SFSY0020101 1880 MHz,2.0*1.6*0.8 ,SMD ,
SFEY0010501
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), Pbfree
SFEY0010501
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), Pbfree
SFEY0010501
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), Pbfree
SFEY0010501
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), Pbfree
SFEY0010501
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), Pbfree
SFEY0013501 SMD ,18V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
SFEY0013501 SMD ,18V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
SFEY0013501 SMD ,18V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
SFEY0013501 SMD ,18V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
ELCH0001408 6.8 nH,J ,1005 ,R/TP ,Pb Free
ELCH0001401 15 nH,J ,1005 ,R/TP ,Pb Free
ELCH0005806 4.7 nH,S ,1005 ,R/TP ,
ELCH0001408 6.8 nH,J ,1005 ,R/TP ,Pb Free
ELCH0001408 6.8 nH,J ,1005 ,R/TP ,Pb Free
ELCH0005003 12 nH,J ,1005 ,R/TP ,
ELCH0001401 15 nH,J ,1005 ,R/TP ,Pb Free
ELCH0001408 6.8 nH,J ,1005 ,R/TP ,Pb Free
ELCH0004715 27 nH,J ,1005 ,R/TP ,
ELCH0005019 68 nH,J ,1005 ,R/TP ,
ELCH0003825 56 nH,J ,1005 ,R/TP ,chip inductor,PBFREE
ELCH0004715 27 nH,J ,1005 ,R/TP ,
ELCH0001421 47 nH,J ,1005 ,R/TP ,PBFREE
ELCH0005813 27 nH,J ,1005 ,R/TP ,
ELCH0003827 47 nH,J ,1005 ,R/TP ,chip coil
ELCH0003827 47 nH,J ,1005 ,R/TP ,chip coil
Color Remark
LGE Internal Use Only - 170 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
L147
L148
L149
L401
L701
L702
L703
L704
L705
L706
L141
L142
L143
L144
L145
L146
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
L119
Description
INDUCTOR,CHIP
6 L120 INDUCTOR,CHIP
L122
L124
L125
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
L127
L129
L130
L134
L135
L137
L139
L140
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
RES,CHIP,MAKER
INDUCTOR,SMD,POWER
INDUCTOR,SMD,POWER
INDUCTOR,SMD,POWER
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
6 Q101 TR,BJT,ARRAY
Q102
Q704
R101
TR,BJT,ARRAY
TR,FET,P-CHANNEL
RES,CHIP,MAKER
Part Number
ELCH0005813 27 nH,J ,1005 ,R/TP ,
Specification
ELCH0001421 47 nH,J ,1005 ,R/TP ,PBFREE
ELCH0005013 4.7 nH,S ,1005 ,R/TP ,
ELCH0005020 1 nH,S ,1005 ,R/TP ,
ELCH0001040 3.9 nH,S ,1005 ,R/TP ,PBFREE
ELCH0001034 3.3 nH,S ,1005 ,R/TP ,PBFREE
ELCH0003826 3.3 nH,S ,1005 ,R/TP ,chip
ELCH0001031 15 nH,J ,1005 ,R/TP ,PBFREE
ELCH0001033 1.5 nH,S ,1005 ,R/TP ,PBFREE
ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE
ELCH0001009 1.2 nH,S ,1005 ,R/TP ,
ELCH0001031 15 nH,J ,1005 ,R/TP ,PBFREE
ELCH0001031 15 nH,J ,1005 ,R/TP ,PBFREE
ELCH0005006 33 nH,J ,1005 ,R/TP ,
ELCH0001031 15 nH,J ,1005 ,R/TP ,PBFREE
ELCH0001009 1.2 nH,S ,1005 ,R/TP ,
ELCH0001421 47 nH,J ,1005 ,R/TP ,PBFREE
ELCH0001421 47 nH,J ,1005 ,R/TP ,PBFREE
ELCH0005019 68 nH,J ,1005 ,R/TP ,
ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE
ELCH0005020 1 nH,S ,1005 ,R/TP ,
ELCH0005019 68 nH,J ,1005 ,R/TP ,
ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
ELCH0005010 1.8 nH,S ,1005 ,R/TP ,
ELCH0005010 1.8 nH,S ,1005 ,R/TP ,
ELCH0005010 1.8 nH,S ,1005 ,R/TP ,
EQBA0000602
TESV ,200 mW,R/TP ,EPITAXIAL PLANAR NPN/PNP
TRANSISTOR
EQBA0000602
TESV ,200 mW,R/TP ,EPITAXIAL PLANAR NPN/PNP
TRANSISTOR
EQFP0006801 MICRO FOOT ,1.47 W,-20 V,-5.8 A,R/TP ,
ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
Color Remark
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 171 LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
R102
Description
INDUCTOR,CHIP
6 R103 RES,CHIP,MAKER
R104
R106
R107
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
R108
R109
RES,CHIP,MAKER
RES,CHIP,MAKER
R110
R111
RES,CHIP,MAKER
RES,CHIP
R112 RES,CHIP,MAKER
R113
R114
R115
RES,CHIP,MAKER
RES,CHIP
RES,CHIP,MAKER
R116
R117
RES,CHIP,MAKER
RES,CHIP,MAKER
R118 RES,CHIP,MAKER
R119
R120
RES,CHIP,MAKER
RES,CHIP,MAKER
R121 RES,CHIP,MAKER
R122
R123
R124
R125
R126
R127
R131
R132
RES,CHIP
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP
RES,CHIP,MAKER
RES,CHIP,MAKER
R133
R135
RES,CHIP,MAKER
RES,CHIP,MAKER
R136 RES,CHIP,MAKER
R137
R138
RES,CHIP,MAKER
RES,CHIP,MAKER
R139 RES,CHIP
R140 RES,CHIP,MAKER
Part Number Specification
ELCH0001036 5.6 nH,S ,1005 ,R/TP ,PBFREE
ERHZ0000495 56 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000212 12 Kohm,1/16W ,F ,1005 ,R/TP
ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP
ERHZ0000408 110 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000408 110 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP
ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000243 2200 ohm,1/16W ,F ,1005 ,R/TP
ERHZ0000206 10 ohm,1/16W ,F ,1005 ,R/TP
ERHZ0000512 82 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000512 82 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000512 82 ohm,1/16W ,J ,1005 ,R/TP
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000408 110 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000408 110 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000527 200 ohm,1/6W ,J ,1005 ,R/TP
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP
ERHZ0000529 1.5 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000351 11800 ohm,1/16W ,F ,1005 ,R/TP
ERHY0005902 5.62 Kohm,1/16W ,F ,1005 ,R/TP
ERHZ0000326 330 ohm,1/16W ,F ,1005 ,R/TP
LGE Internal Use Only
Color Remark
- 172 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
R141
Description
RES,CHIP
6 R142 RES,CHIP,MAKER
R143
R201
R202
RES,CHIP,MAKER
RES,CHIP
RES,CHIP,MAKER
R203
R204
RES,CHIP,MAKER
RES,CHIP
R205
R206
RES,CHIP
RES,CHIP
R207 RES,CHIP
R208
R209
R211
RES,CHIP
RES,CHIP
RES,CHIP,MAKER
R212
R213
RES,CHIP
RES,CHIP
R306 RES,CHIP
R307
R308
RES,CHIP
RES,CHIP
R312 RES,CHIP,MAKER
R314
R401
R402
R404
R407
R408
R414
R505
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP
RES,CHIP
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP
R506
R507
RES,CHIP
RES,CHIP
R508 RES,CHIP
R509
R601
RES,CHIP
RES,CHIP
R703 RES,CHIP,MAKER
R704 RES,CHIP,MAKER
Part Number Specification
ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
ERHY0009553 1 Mohm,1/20W(0.05W) ,F ,0603 ,R/TP
ERHZ0000287 47 Kohm,1/16W ,F ,1005 ,R/TP
ERHZ0000222 150 Kohm,1/16W ,F ,1005 ,R/TP
ERHY0009527 47 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009516 2.2 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009527 47 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009527 47 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009539 20 ohm,1/20W(0.05W) ,F ,0603 ,R/TP
ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP
ERHY0009516 2.2 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009516 2.2 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009516 2.2 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP
ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHZ0000500 62 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0004301 0.1 ohm,1/4W ,F ,ETC ,R/TP
ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0004201 121000 ohm,1/16W ,F ,1005 ,R/TP
ERHZ0000439 200 Kohm,1/16W ,J ,1005 ,R/TP
Color Remark
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 173 LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
R707
Description
RES,CHIP,MAKER
6 R708 RES,CHIP,MAKER
R710
R711
R712
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
R713
R717
RES,CHIP
RES,CHIP,MAKER
R718
R719
RES,CHIP,MAKER
RES,CHIP,MAKER
R801 RES,CHIP
R802
R803
R804
RES,CHIP
RES,CHIP
RES,CHIP
R806
R807
RES,CHIP,MAKER
RES,CHIP,MAKER
R808 RES,CHIP,MAKER
R810
R813
RES,CHIP
RES,CHIP
R821 RES,CHIP,MAKER
R822
R823
R825
R826
R829
R830
R831
R834
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP
RES,CHIP
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP
R835
R836
RES,CHIP
RES,CHIP,MAKER
R837 RES,CHIP,MAKER
R838
S801
RES,CHIP
CONN,SOCKET
SW101 CONN,RF SWITCH
U101 FILTER,SEPERATOR
Part Number Specification
ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHY0009504 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000423 150 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHY0009516 2.2 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009553 1 Mohm,1/20W(0.05W) ,F ,0603 ,R/TP
ERHY0009559 330 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP
ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP
ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009528 470 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000318 80.6 Kohm,1/16W ,F ,1005 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHZ0000419 15 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000419 15 ohm,1/16W ,J ,1005 ,R/TP
ERHY0009507 1 Mohm,1/20W(0.05W) ,J ,0603 ,R/TP
ENSY0014101 8 PIN,ETC , ,1.1 mm,T-Flash Memory Socket
ENWY0002304 STRAIGHT ,SMD ,0.8 dB,MUSE MODEL
SFAY0009201 , , dB, dB, dB, dB,ETC ,
LGE Internal Use Only
Color Remark
- 174 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
Location
No.
6 U102 IC
Description
6 U103 PAM
U104
COUPLER,RF
DIRECTIONAL
U106
U107
IC
COUPLER,RF
DIRECTIONAL
U108 PAM
U109 MODULE,ETC
U110 IC
U201 IC
U301 IC
U302 IC
U303 MICROPHONE
U401 IC
U402 IC
U403 DIODE,TVS
U404 IC
U405 IC
U701
U702
IC
IC
U801 IC
U802 FILTER,EMI/POWER
U804 IC
U805 IC
U806 IC
VA301 DIODE,TVS
VA502 VARISTOR
VA503 VARISTOR
Part Number Specification
EUSY0300501
QFN ,56 PIN,R/TP ,GSM, WCDMA Single RF Transceiver,
8X8X0.9
SMPY0014801
34.5 dBm,55 %, A, dBc, dB,6x8x1.2 ,SMD ,Edge PAM for
QCT ,; , , , , , , , ,SMD ,R/TP ,16
SCDY0003402
-20 dB,-0.25 dB,-35 dB,1.0*0.58*0.35 ,SMD ,1850M ~
1910M, 4pin, Pb Free
EUSY0278501 SON5-P-0.50 ,5 PIN,R/TP ,INVERTER GATE, Pb Free
SCDY0003401
-22 dB,-0.2 dB,-37 dB,1.0*0.58*0.35 ,SMD ,824M ~ 849M,
4pin, Pb Free
SMPY0010601
28 dBm,41 %, A,-51 dBc, dB,4X4 ,SMD ,QFN ,24 PIN,R/TP
,DUAL-BAND PAM(CELL/USPCS
SMZY0010701 Bluetooth RF Module, 4.5*3.2*1.2
EUSY0300401
QFN ,48 PIN,R/TP ,WCDMA Dual Receiver IC for USA,
7X7X0.9
EUSY0334501 CSP ,409 PIN,R/TP ,HSDPA3.6Mbps Baseband
EUSY0300101
WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog
Switch, PB-Free
EUSY0278601
QFN ,9 PIN,R/TP ,9 PIN,R/TP ,2.5W Mono D-Class Audio
AMP
SUMY0010602
UNIT ,-42 dB,6.15*3.76*1.25 ,Silicon mic , ,-42 ,300 ,OMNI
,[empty] ,6.15*3.76*1.25 ,SMD
EUSY0236901 DFN ,12 PIN,R/TP ,1x/1.5x/2x Charge pump(Sink type)
EUSY0223002
HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT
CONTROL / 2.8V
Color
EDTY0007801 SC-70 ,5 V,150 W,R/TP ,LOW CAPACITANCE TVS ARRAY
EUSY0254901 MLF ,10 PIN,R/TP ,Dual(2.7V/150mA,1.8V/300mA) LDO
EUSY0313401
QFN ,4 PIN,R/TP ,1.8X1.2X0.5 size wide input voltage Hall
Switch
EUSY0306302 BCCS ,84 PIN,R/TP ,7x7, MSMC(1.2V), pbfree
EUSY0307301 DFN ,10 PIN,R/TP ,DC/DC+Inductor
EUSY0250501
SC70 ,5 PIN,R/TP ,Comparator, pin compatible to
EUSY0077701
SFEY0006501 SMD ,3 TERMINAL EMI FILTER
EUSY0333701 TLLGA ,8 PIN,R/TP ,OVP
EUSY0332901
WDFN ,8 PIN,R/TP ,-12V, 6.3A, Single P-MOSFET & DUAL
Transistor
EUSY0336901
FBGA ,225 PIN,ETC ,1G(LB/128Mx16/2.7V)
NAND+512(16Mx32) SDRAM , ,IC,MCP
EDTY0009401
VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW
,[empty] ,[empty] ,2P ,1
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
Remark
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 175 LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
VA504
Description
VARISTOR
6 VA505 VARISTOR
VA506
VA507
VA508
VARISTOR
VARISTOR
VARISTOR
VA509 VARISTOR
VA510 VARISTOR
VA511 VARISTOR
6 VA601 DIODE,TVS
VA602 VARISTOR
VA603 VARISTOR
VA604 VARISTOR
VA605 VARISTOR
VA606 VARISTOR
VA607 VARISTOR
VA608 VARISTOR
VA609 VARISTOR
VA610 VARISTOR
VA611 VARISTOR
VA801 VARISTOR
VA802 VARISTOR
VA803 VARISTOR
VA804 VARISTOR
VA805 VARISTOR
VA806 DIODE,TVS
VA807
VA820
X201
DIODE,TVS
VA808 VARISTOR
VA809 VARISTOR
VA810 VARISTOR
VA811 VARISTOR
DIODE,TVS
RESONATOR
Part Number Specification
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
EDTY0007501 SOD-523 ,5 V,240 W,R/TP ,Vc 12.5V , 160pF , 1.6*0.8*.06
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005401 18 V, ,SMD ,15pF,1005
SEVY0005401 18 V, ,SMD ,15pF,1005
SEVY0005401 18 V, ,SMD ,15pF,1005
SEVY0005401 18 V, ,SMD ,15pF,1005
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0000702 14 V,10% ,SMD ,
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0003602 5.6 V, ,SMD ,1005, 60pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
EDTY0009401
VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW
,[empty] ,[empty] ,2P ,1
EDTY0009401
VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW
,[empty] ,[empty] ,2P ,1
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
EDTY0009401
VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW
,[empty] ,[empty] ,2P ,1
EXRY0002401
48 MHz,.5 %,14 pF,SMD ,2.0*1.2*0.65 ,Outgoing Tolerance
0.2%, 0.05% at -40'C ~ +85C, Built-In Cap
Color Remark
LGE Internal Use Only - 176 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
6
6
5
6
6
6
6
Location
No.
X701
X702 VCTCXO
SAFD00 PCB ASSY,MAIN,SMT TOP
LD501
LD502
R501
R502
X-TAL
Description
DIODE,LED,CHIP
DIODE,LED,CHIP
RES,CHIP
RES,CHIP
Part Number Specification
EXXY0016601 32.768 KHz,20 PPM,9 pF,65 Kohm,SMD ,4.9*1.8*0.9 ,
EXSK0005703
19.2 MHz,1.5 PPM,40 pF,SMD ,3.2*2.5*0.9 , ,; , ,1.5PPM
,2.8V ,3.2 ,2.5 ,0.9 , ,SMD ,P/TP
SAFD0087201
EDLH0013403
WHITE ,ETC ,R/TP ,3.8*1.2*0.6T ,; ,[empty] ,2.9~3.2V
,20mA ,1200~1400mcd , ,126mW ,[empty] ,[empty] ,2P
EDLH0013403
WHITE ,ETC ,R/TP ,3.8*1.2*0.6T ,; ,[empty] ,2.9~3.2V
,20mA ,1200~1400mcd , ,126mW ,[empty] ,[empty] ,2P
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6
6
SPFY00
VA501
PCB,MAIN
VARISTOR
SPFY0144201
SEVY0000702
FR-4 ,0.8 mm,STAGGERED-8 ,CU575 MAIN ,; , , , , , , , ,,
14 V,10% ,SMD ,
Color Remark
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 177 LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.3 Accessory
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Level
Location
No.
3
Description
SBPP00
BATTERY PACK,LI-
POLYMER
3 SSAD00 ADAPTOR,AC-DC
ADAPTOR,AC-DC
ADAPTOR,AC-DC
ADAPTOR,AC-DC
Part Number Specification
SBPP0022901
3.7 V,950 mAh,1 CELL,PRISMATIC ,CU570 BATT, Pb-Free
,; ,3.7 ,950 ,0.2C ,PRISMATIC ,59x37x38 , ,BLACK
,Hardpack ,America Label
SSAD0024401
100-240V ,5060 Hz,5.1 V,.7 A,UL/CSA ,AC-DC ADAPTOR ,;
,85Vac ~ 264Vac ,5.1V +0.15, -0.2V ,700mA ,5060 , ,WALL
2P ,I/O CONNECTOR ,
SSAD0024402
100-240V ,5060 Hz,5.1 V,0.7 A,UL/CSA ,AD-DC ADAPTOR
,; ,85Vac~264Vac ,5.1 +0.15, -0.2V ,700mA ,5060 , ,WALL
2P ,I/O CONNECTOR ,
SSAD0024403
100-240V ,5060 Hz,5.1 V,.7 A,UL/CSA ,AC-DC ADAPTOR ,;
,85Vac~264Vac ,5.1V (+0.15V, -0.2V) ,700mA ,5060 ,
,WALL 2P ,I/O CONNECTOR ,
SSAD0024404
100-240V ,5060 Hz,5.1 V,.7 A,UL/CSA ,AC-DC ADAPTOR ,;
,85Vac~264Vac ,5.1 (+0.15V, -0.2V) ,700mA ,5060 , ,WALL
2P ,I/O CONNECTOR ,
Color
Black
Remark
95
LGE Internal Use Only - 178 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Note
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Note
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

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