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LG KG270, MG160 Service manual. www.s | Manualzz

Date: April, 2007 / Issue 1.0

Service Manual

KG270/MG160

Table Of Contents

1. INTRODUCTION ...............................5

1.1 Purpose .................................................. 5

1.2 Regulatory Information............................ 5

2. PERFORMANCE...............................7

2.1 H/W Features...........................................7

2.2 S/W Features ...........................................8

3. TECHNICAL BRIEF ........................14

3.1 Digital Main Processor(PMB7880).........14

3.2 Power Amplifier Module (SKY77318) ....22

3.3 26 MHz Clock (DCXO)...........................24

3.4 RTC(32.768KHz Crystal) .......................25

3.5 LCD Interface(3-wire SPI interface) .......26

3.6 SIM Card Interface.................................28

3.7 KEYPAD Interface .................................29

3.8 Battery Charging Block Interface ...........30

3.9 RF Interface ...........................................31

3.10 Audio Interface.....................................33

3.11 Key LED Interface................................37

3.12 Vibrator Interface .................................38

3.13 Memory Interface .................................39

3.14 Power Block Interface ..........................40

3.15 FM Radio Interface ..............................42

4. TROUBLE SHOOTING ...................44

4.1 RF Trouble .............................................44

4.2 TX Trouble .............................................50

4.3 Power On Trouble..................................54

4.4 SIM Card Trouble...................................56

4.5 Vibrator Trouble .....................................58

4.6 Keypad Trouble......................................60

4.7 RTC Trouble ..........................................62

4.8. Key backlight Trouble ...........................64

4.9. LCD Trouble..........................................66

4.10. Microphone Trouble ............................69

4.11. Receiver Trouble.................................71

4.12 Speaker Trouble ..................................73

4.13 Headphone Trouble .............................75

4.14 Charging Trouble .................................77

4.15 FM Radio Trouble ................................79

5. DOWNLOAD.......................................82

5.1 Download Setup.....................................82

5.2 Download Process .................................83

6. BLOCK DIAGRAM ..........................88

7. Circuit Diagram ..............................89

8. PCB LAYOUT ..................................93

9. ENGINEERING MODE ....................95

9.1 About Engineering Mode .......................95

9.2 Access Codes ........................................95

9.3 Key Operation ........................................95

9.4 Engineering Mode Menu Tree ...............95

10. CALIBRATION ..............................92

10.1 Test Equipment Setup .........................92

10.2 Calibration Steps..................................92

11. STAND ALONE TEST .................109

11.1 Test Program Setting .........................109

11.2 Tx Test ...............................................111

11.3 RX Test ..............................................112

12. EXPLODED VIEW &

REPLACEMENT PART LIST ..... 113

12.1 Exploded View .................................. 113

12.2 Replacement Parts ............................115

12.3 Accessory ......................................... 124

- 3 -

- 4 -

1. INTRODUCTION

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it.

The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

- 5 -

1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.

Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

- 6 -

2. PERFORMANCE

2.1 H/W Features

Item

Band

Type

Dimension

Weight

Battery

Talk Time

Stand-by Time

RTC

Antenna

LCD(Main)

Back Light

Back Light color

Vibrator

Speaker&Receiver

C-MIC

Earphone Jack

SIM

MIDI

I/O Connect

Specifications

GSM DUAL Band(900/1800)

Bar type

98 * 45 * 12.9mm

60g

750mAh Li-ion

Over 2hours @EGSM,TX Level : 5

Over 200 hours @Paging period : 5

Under 4 hours when removed battery.

Internal Type(Dual-band)

1.52"(128x128 pixels), 65K Color STN LCD

Yes

Blue

Yes

Yes(11x07 Receiver, 16®™ Speaker)

Yes

Mono or Stereo(Optional)

Yes(Plug in Type) : 3.0V

16 poly

18 Pins (included Earphone Jack)

- 7 -

2. PERFORMANCE

2. PERFORMANCE

2.2 S/W Features

Function

Camera

Audio

Detail Item

Operating System OS

Data Circuit

Connectivity

Packet

Infrared (IrDA)

Voice Function

Memory

Bluetooth

USB

USB Mass storage

RS232

Voice Recording

Voice Command

Answering machine

User Memory

Camera Module

Voice Codec

AMR

FM Radio

Integrated handsfree speaker

Specification

O

X

X

X

X

X

X

X

O OSE

O

X

O TBD

X MMS

X

Pictures (Still Image &

Moving Image)

X MP3 (Music Contents)

X Java Contents

O Wallpaper

O Ringtone

X external memory (microSD)

X

O FR, HR, EFR, AMR-NB

O

O

O Speaker phone mode

Etc.

Under 300KB

3 bitmap images

10 MIDI Ringtones

- 8 -

2. PERFORMANCE

Function Detail Item Specification

Display RSSI

Battery Level

RTC

Multi?Language

O 6 level

O 5 level

O

O Basic:English

Max. 4 language of Latin

2 or 3 language of etc.

X Quick Access Mode

PLMN/Service Indicator

Dimming Clock

Dual Clock

Normal Features Last Dialed Number

Last Received Number

Last Missed Number

Call

Manage-ment

Scratch Pad Memory

Call Waiting

Call Swap

Call Retrieve

Auto Answer

Automatic Redial

Calling Line dentification

Full Call divert

Speed Dialing

Last Number Redial

Multi-party Call (Conference Call) O

O

O

Explicit Call Transfer X

O

O

O

O

O

X

X

O

O

X

X Local Time / Selected Area Time

O 10

O 10

O 10

Etc.

- 9 -

2. PERFORMANCE

Function

Network

DTMF

Audio

Cell Broadcast

Phone Book

Detail Item

Automatic Network Selection

Manual Network Selection

Network Service Status

DTMF Signaling

DTMF Enable & Disable

Key Tone Volume

Ring Tone Volume

Ring Tone Pattern

Ring Type Silent

Earpiece Volume

Mute

Read Cell Broadcast

Cell Broadcast Categories

Cell Broadcast Message

Language

Entry

Field

Numeric Store and Recall

Alphabetic Store

Alphabetic Recall

Scroll by alphabetic or numeric order

Last Number Dialed

Last Number Missed

Last Number Received

Copy & Move

Fixed Dial Number

Barred Dial Number

Service Dial Number

Email Entry

Picture ID

Video Caller ID

My Name card

O

O

O

O

O 300

O Office,Mobile

X

X

X

O

X

O

X

O 10

O 10

O 10

O

Specification

O

O

O

O

O

O 6 Level (Include Mute)

O 6 Level (Include Mute)

O 10Type(fixed)

O

O

O

O

O Vibrator & Ring (Indicator)

O 6 Level (Include Mute)

- 10 -

Etc.

2. PERFORMANCE

Function Detail Item Specification Etc.

Supp. Services Call Forwarding

Call Barring

O All Incoming Calls,

O No Reply

O On Busy,

O Not reachable

O All Outgoing Calls,

SIM

Short Messaging

Manage-ment

Conference Call

Plug?In Type

SIM Lock

SIM Toolkit

Prepaid SIM Operation

Mega SIM

Read Message

Write and Edit Message

Send and Receive Message

Reply to Message

Forward Message

Extract Number from Message O

O

O

O

O

O

X

O International Calls,

Calls except to Home Country

O incoming Calls,

O All incoming Calls when roaming

O up to 3 calls

O 3 V only

O Service Provider / Network Lock

O Class 1, 2, 3

Not Support EMS

Message Status

Message Unread Indicator

Settable Message Center Number, O

Reply Path and Validity O

O

O

Visible and Audible Message

Receive Alerting

O

Voice Mail O

Settable Voice Mail Center Number O

Message Protocol

O

Normal, Fax, National Paging,

Email, X400, ERMES, Voice

Message Overflow Indicator

Message Center Number

Help Menu

O

O

X

- 11 -

2. PERFORMANCE

Function Detail Item Specification

Sound contents Ringtones

Karaoke

Stutter Sound

Flip tone

Miscellaneous

Function

Text Input

Scheduler

World Time

Button tone

Others

Development & Test Facility

Field Test Facility

Display Software Version

IMEI

Language

Predictive word input

Schedule

To Do List

Memo

D-day counter

Send via Bluetooth

O

X

X

X

O

X

O

O

O

O

O Selectable Auto Language

O

O

X

O

X

X

T9

20 input (20 character)

50 input

20 input (40 character)

Schedule, Memo, To Do list, Messaging

Setting Local Time O

Display Two Number of Cities Time X Dual clock

Daylight saving

NITS

X

X

Summer time calibration function

Automatic setting as country code in SIM

Unit converter

Stop watch

Calculator

PC Sync

Calculation

Phone Book Sync

Message Sync

Multimedia Contents Sync

Scheduler Sync

X

X

O Currency, Surface, Length, Weight,

Temperature, Volume, Velocity

O

O + - * /

X

X E-MAIL, EMS, Schedule, Phonebook,

Name card etc.

Sync ML DS

DM

Game

Menu Quick Access Mode (Profile)

External Interface Electrical Man Machine Interface O

X

X

Development and Test Facility

X

X

O

Etc.

- 12 -

2. PERFORMANCE

Function Detail Item

Handset

Security

Restore Factory Setting

Read Software Version

Battery Charging Mode

Emergency Call

Handset Lock

Security Code

SIM Lock

Key guard

Real Time Clock 12/24 hour

Calendar

Accessory

Time Zone

Daylight saving

Alarm Manager

Dimming Clock

Power-off Alarm

On Alarm Event

Hand strap

Embedded microSD Card microSD Adapter

Stereo earmic

Specification

O

O

O

O

O

O Delete all

O

O

O

O Automatic Leap Year Adjustment

O

X

O Once, Daily, Mon~Fri, Mon~Sat

X

X

X

X

O

O Display

O EarMic Type

Etc.

Provides optionally only for supporting

FM radio function.

earmic w/music remote controller X

Neck strap

LCD Cleaner

X

X

Holster

Data cable

CD

Holster charger

X

O RS232 cable

X

X Standard battery Back-up and Holster function additional standard battery

Extended Battery

Desktop Charger

Cigar Lighter Adapter

Portable Handsfree

Bluetooth headset

Bluetooth stereo earset controller X

Car kit X

Leather Pouch X

Stylus Pen

X

X

Compass

X

X

X

X

X

X

X

Option

- 13 -

3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.1 Digital Main Processor(PMB7880)

Figure. 3-1 PMB7880 FUNCTIONAL BLOCK DIAGRAM

- 14 -

3. TECHNICAL BRIEF

3.1.1 Overview of E-GOLDvoice

The E-GOLDvoice is a GSM baseband modem including RF transceiver covering the low bands

GSM850 /GSM900 and high bands GSM1800 / GSM1900 bands.

E-GOLDvoice is Dual Band, therefore, it supports by default a low / high pair of bands at the same time:

1. GSM850 / GSM1800

2. GSM850 / GSM1900

3. GSM900 / GSM1800

4. GSM900 / GSM1900

The E-GOLDvoice is optimized for voice-centric Mobile Phone applications.

The E-GOLDvoice is designed as a single chip solution that integrates the digital, mixed-signal, RF functionality and a direct-to-battery Power Management Unit.

The transceiver consists of:

• Constant gain direct conversion receiver with an analog I/Q baseband interface

• Fully integrated Sigma/Delta-synthesizer capability

• Fully integrated two-band RF oscillator

• Two-band digital GMSK modulator with digital TX interface

• Digitally controlled crystal oscillator generating system clocks.

The E-GOLDvoice supports a direct battery connection, hence eliminating the need for an external

Power Management Unit. The E-GOLDvoice has different power down modes and an integrated power up sequencer.

The E-GOLDvoice is powered by the C166®S MCU and TEAKLite® DSP cores. The operating temperature range from -40C to 85C. It is manufactured using the 0.13 •Ïm CMOS process.

- 15 -

3. TECHNICAL BRIEF

3.1.2 Features

] Baseband

• High performance fixed-point TEAKlite DSP

• C166S high performance microcontroller

• There are several Interfaces:

- I2S interface for DAI connections (for Tape Approval)

- High Speed SSC Interface for connection of external peripherals

- SIM Interface

- Keypad Interface (6x4 or 5x5 keys)

- EBU for external RAM/FLASH connection

- Asynchronous serial interface

- JTAG Interface

- Black & white and color displays are supported

- PWM source to drive vibrator

- Keypad and display backlight supported.

] Receiver

• Constant gain, direct conversion receiver with fully integrated blocking filter

• Two integrated LNAs

• No need of interstage and IF filter

• Highly linear RF quadrature demodulator

• Programmable DC output level

• Very low power budget.

] Transmitter

• Digital Sigma-Delta modulator for GMSK modulation, typical -163.5 dBc/Hz@20 MHz

• Single ended outputs to PA, Pout = +3.5 dBm

• Very low power budget.

] RF-Synthesizer

Σ∆Synthesizer for multi-slot operation

• Fast lock-in times (< 150 •Ïs)

• Integrated loop filter

• RF Oscillator

• Fully integrated RF VCO.

] Crystal Oscillator

• Fully digital controlled crystal oscillator core with a highly linear tuning characteristic.

- 16 -

3. TECHNICAL BRIEF

] Mixed Signal and Power Management Unit

• DC/DC boost for voltages up to 15V for driving White or Blue LEDs

• 8-Ohm loud speaker driver (250/350mW)

• 16-Ohm earpiece driver

• 32-Ohm headset driver

• 4 measurement interfaces (PA temperature, battery voltage, battery temperature,and ambient temperature)

• Differential microphone input

• System start up circuitry

• Charger circuitry for NiCd, NiMh and LiIon cells

• Integrated regulators for direct connection to battery.

- 17 -

3. TECHNICAL BRIEF

3.1.3 GSM System Description

The E-GOLDvoice is suited for mobile stations operating in the GSM850/900/1800/1900 bands.

In the receiver path the antenna input signal is converted to the baseband, filtered, and then amplified to target level by the RF transceiver chipset.

Two A-to-D converters generate two 6.5 Mbit/s data streams. The decimation and narrowband channel filtering is done by a digital baseband filter in each path.

The DSP performs:

1. The GMSK equalization of the received baseband signal (SAIC support available)

2. Viterbi channel decoding supported by an hardware accelerator.

The recovered digital speech data is fed into the speech decoder.

The E-GOLDvoice supports fullrate, halfrate, enhanced fullrate and adaptive multirate speech CODEC algorithms.

The generated voice signal passes through a digital voiceband filter. The resulting 4 Mbit/s data stream is D-to-A converted by a multi-bit-oversampling converter, postfiltered, and then amplified by a programmable gain stage.

The output buffer can drive a handset ear-piece or an external audio amplifier, an additional output driver for external loud speaker is implemented.

In the transmit direction the differential microphone signal is fed into a programmable gain amplifier.

The prefiltered and A-to-D converted voice signal forms a 2 Mbit/s data stream. The oversampled voice signal passes a digital decimation filter.

The E-GOLDvoice performs speech and channel encoding (including voice activity detection (VAD) and discontinuous transmission (DTX)) and digital GMSK modulation.

In the RF transceiver part, the baseband signal modulates the RF carrier at the desired frequency in the 850 MHz, 900 MHz, 1.8 GHz, and 1.9 GHz bands using an I/Q modulator. The E-GOLDvoice supports dual band applications.

Finally, an RF power module amplifies the RF transmit signal at the required power level. Using software, the E-GOLDvoice controls the gain of the power amplifier by predefined ramping curves (16 words, 11 bits).

For baseband operation, the E-GOLDvoice supports:

• Making or receiving a voice call

• Sending or receiving an SMS.

- 18 -

3. TECHNICAL BRIEF

3.1.4 PMU Details

The E-GOLDvoice includes battery charger support (various sensor connections for temperature, battery technology, voltage, etc.) and a ringer buffer.

E-GOLDvoice avoids the need for an external power management component because its internal power management unit contains:

• Voltage regulators for the On-chip and Off-chip functional blocks

• Charger circuitry for NiCd, NiMh and LiIon cells.

3.1.5 Bus Concept

The E-GOLDvoice has two cores (a microcontroller and a DSP), each with its own bus.

There is an interconnection between the TEAKlite bus and the C166S X-Bus.

3.1.6 C166S Buses

The C166S is connected to three buses:

1. Local Memory (LM) bus

2. X-Bus

3. PD-Bus.

3.1.7 TEAKLite Bus

The TEAKlite is connected to the TEAKlite bus.

3.1.8 Bus Interconnections

The interconnection between the X-Bus and the TEAKlite Bus uses:

• Multicore Synchronization

• Shared Memory.

3.1.9 Clock Concept

The E-GOLDvoice has a flexible clock control.

3.1.10 Interrupt Concept

The C166 MCU carries out the E-GOLDvoice interrupt system.

3.1.11 Debug Concept

The E-GOLDvoice includes a multi-core debug. The C166 and TEAKlite cores can be debugged in parallel with:

• A single JTAG port (that is, on a single host)

• Mutual breakpoint control.

- 19 -

3. TECHNICAL BRIEF

3.1.12 C166 Debug Concept

The debugging of the C166 uses the OCDS and the Cerberus.

3.1.13 TEAKLite Debug Concept

TEAKlite debugging uses the OCEM and the SEIB.

3.1.14 Power Management

The E-GOLDvoice provides the power management unit (PMU) for the complete mobile phone application. The integrated PMU is directly connected to the battery and provides a set of linear voltage regulators (LDO’s).

These LDO’s generate all required supply voltages and currents needed in a low feature mobile phone. A charger control circuit charges NiCd, NiMH and LiIon batteries.

The charger control supports hardware controlled pre-charging and software controlled charging. It offers a wide charger voltage range, making halfwave/full-wave charging with cheap transformers possible.

White/blue backlight generation is supported with a special driver for very a low external parts count.

Power consumption during operation phases is minimized due to flexible clock switching In the

Standby Mode most parts of the device are switched off, only a small part is running at 32kHz and the controller RAM is switched to a power saving mode. The TEAKLite ROM can be switched off during

Standby via SW.

3.1.15 On-Chip Security Concept

Secure boot is based on a public/private key approach. Flash images that are not signed with the private key during phone manufacture cannot be loaded.

Verification of the Flash code is done with the public key. The public key as well as hash and verify algorithms are stored in the ROM, which ensures a hardware secured boot procedure.

The following security features are supported:

• Prevention of illegal Flash programming

• Flash programming makes use of the E-GOLDvoice ID for personalization checks with IMEI and

SIM-lock protection

- 20 -

3. TECHNICAL BRIEF

The security features use the following mechanism:

• Boot ROM flow:

- Controls the boot transition to external flash

- Controls the flash update

• Flash tied to the individual chip via an ID using e-fuses, that is, each E-GOLDvoice chip has its own fused ID.

Further details on the E-GOLDvoice security concept are not publicly documented.

3.1.16 Asynchronous Operation Mode Concept

The E-GOLDvoice can operate in either:

• The traditional synchronous mode with the 26MHz system clock synchronized on the base station

• A special asynchronous mode (XO concept).

In the asynchronous mode the 26MHz clock input is not synchronized with the base station; the residual frequency offset is compensated in the digital signal processing domain. This processing includes frequency and timing compensation of the baseband and voiceband signals.

- 21 -

3. TECHNICAL BRIEF

3.2 Power Amplifier Module (SKY77318)

Figure. 3-2 SKY77318 FUNCTIONAL BLOCK DIAGRAM

The SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.

The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation.

The module consists of separate GSM PA and DCS1800/PCS1900 PA blocks, impedance-matching circuitry for 50

Ω input and output impedances and a Power Amplifier Control (PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides the internal PAC function and interface circuitry.

Fabricated onto a single Gallium Arsenide (GaAs) die, one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM bands and the other supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to distribute current.

The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold.

- 22 -

3. TECHNICAL BRIEF

RF input and output ports of the SKY77318 are internally matched to a 50

Ω load to reduce the number of external components for a quad-band design. Extremely low leakage current (2.5

µA, typical) of the dual PA module maximizes handset standby time. The SKY77318 also contains bandselect switching circuitry to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the

Band Select (BS) signal.

In Figure 1 below, the BS pin selects the PA output (DCS/PCS_OUT orGSM_OUT) and the Analog

Power Control (VAPC) controls the level of output power.

The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power amplifier control (iPAC

) function, which is insensitive to variations in temperature, power supply, process, and input power.

The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain.

- 23 -

3. TECHNICAL BRIEF

3.3 26 MHz Clock (DCXO)

Figure. 3-3 E-GoldVoice DCXO Overview

DCXO (Digitally Controlled Crystal Oscillator) and VCTCXO (Voltage Controlled Temperature

Compensated Crystal Oscillator) are two different techniques used To maintain the mobile’s reference oscillator’s accuracy over time. The reference oscillator’s accuracy over time will vary due to initial crystal frequency offset, temperature drift and aging.

These static and dynamic frequency variations have to be compensated, otherwise the mobile would be in danger of losing connection to the network.

The technique used to perform the frequency compensation is generally termed Automatic Frequency

Control (AFC).

To summarize the operation of DCXO, GSM Baseband processor will calculate the AFC compensation

(which is continuously updated) required based on the measured frequency error. Then the required

AFC compensation is sent to the LUXO (Lineari-Zation Unit of Crystal Oscillator), which in turns control the DCXO core and generates The 26MHz system clock.

- 24 -

3. TECHNICAL BRIEF

3.4 RTC(32.768KHz Crystal)

32KIN

32.768KHZ CRYSTAL

X100

3

4

1 2

32KOUT

MC-146_12_5PF

32.768KHz

Figure. 3-4 E-Gold Voice RTC Interface

The integrated Real Time Clock (RTC) is able to provide programmable alarm functions and external interrupts. Due to its extreme low power consumption the RTC can be supplied from a small backup battery. This allows the generation of external interrupts, even when the main PMB7880 supply voltage is switched off. For this purpose the RTC is powered by own voltage supply pins VDD_RTC and VSS_RTC.

The RTC shall be driven by a 32.768 kHz (32k) clock which needs to be applied via the PMB7880

F32K and OSC32K pins. The clock can be fed from either an external clock source or use the on chip

32 KHz oscillator module.

The low clock frequency and the optimized low power design give the possibility to run the chip with a minimum of power dissipation. For example, for this specific application the 26 MHz reference oscillator can be switched off during system standby and a lowpower time reference can be kept when the 32k clock is provided to the RTC.

The RTC consists of an PMB7880 specific RTC shell, containing the RTC macro, as well as the 32 kHz oscillator, as described in the following sections. The module RTC Shell solely performs level translation of the 32KHz clock to the VDD_LD1 power supply domain, and is not functionally associated with the RTC.

- 25 -

3. TECHNICAL BRIEF

3.5 LCD Interface(3-wire SPI interface)

LCD_RESET

SSC0_CLK

MTPG

R205

R207

47

47

C208

NA

MLED

MLED2

C209

27p

C210

27p

R210

100K

11

13

7

9

3

5

1

CN200

8

10

12

14

15

2

4

6

IMSA-9671S-13Y902

(ENQY0013801)

2V8_VIO

MTPD

R206

R208

C221

1u

MLED1

LCD_ID

C211

27p

C212

27p

47

47

C213

NA

C214

NA

CS3

SSC0_MTSR

Figure 3-5-1. LCD Interface

MLED

W_LED_DRV

R202

100K

C202

27p

VBAT

CHARGE PUMP

5

U200

IN

AAT3157ITP-T1

10

C1+

8

11

4

CP

EN_SET

GND

C1-

C2+

9

7

C2-

6

D1

D2

D3

NC

1

2

3

12

C200

1u

C201

1u

C203

27p

C204

27p

MLED1

MLED2

Figure 3-5-2. Charge pump interface

- 26 -

3. TECHNICAL BRIEF

Signals

CS3

SSC0_MTSR

SSC0_CLK

LCD_RESET

MLED

MLED1/2

2V8_VIO

Description

This signal enable to access to the driver IC of LCD.

This signal transfer serial data to driver IC.

This signal transfer serial clock to driver IC.

This signal makes driver IC to HW default status.

This signal provide power to white LEDs.

This signal be feed back from white LEDs.

This signal provides power to LCD modules.(2.8V)

The AAT3157 is a low noise, constant frequency charge pump DC/DC converter that uses a trimode load switch (1X), fractional (1.5X), and doubling (2X) conversion to maximize efficiency for white LED applications. The AAT3157 is capable of driving up to three channels of LEDs at 20mA per channel from a 2.7V to 5.5V input.

The current sinks may be operated individually or in parallel for driving higher current LEDs. A low external parts count (two 1µF flying capacitors and two small 1µF capacitors at VIN and VOUT) make this part ideally suited for small, battery-powered applications. AnalogicTech's S2Cwire™ (Simple

Serial Control™) serial digital input is used to enable, disable, and set current for each LED with 16 settings down to 50µA.

The low-current mode supply current can be as low as 50µA to save power.

6

7

8

Data

1

2

3

4

5

Output (mA/Ch)

20.0

17.0

14.0

12.0

10.0

8.6

7.0

6.0

Data

9

10

11

12

13

14

15

16

Figure 3-5-3. Charge pump Output Current

Output (mA/Ch)

5.0

4.2

3.4

2.8

1.0

0.5

0.1

0.05

- 27 -

3. TECHNICAL BRIEF

3.6 SIM Card Interface

2V85_VSIM

2V85_VSIM

SIM_DATA

C310

22p

J300

4

5

6

8

GND

VPP

I_O

GND2

VCC

RST

CLK

GND1

1

2

3

7

2V85_VSIM

C311

0.1u

C312

22p

SIM_RST

SIM_CLK

Figure 3-6. SIM CARD Interface

The EGoldVoice provides SIM Interface Module. The AD6527 checks status Periodically During established call mode whether SIM card is inserted or not, but it doesn't check during deep sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST.

Signals

SIM_RST

SIM_CLK

SIM_DATA

This signal makes SIM card to HW default status.

This signal is transferred to SIM card.

This signal is interface datum.

Description

- 28 -

3. TECHNICAL BRIEF

3.7 KEYPAD Interface

KEY MATRIX

END_KEY

END

SW200

2V0_VRTC

SW201

1

KEY_OUT1

KEY_OUT2

KEY_OUT3

R201

680

C205

NA

R203

680

C206

NA

R204

680

C207

NA

KEY_IN0

KEY_IN1

KEY_IN2

KEY_IN3

KEY_IN4

KEY_OUT4

R209

680

C215

NA

R211 680

R212 680

R213 680

R214 680

R215 680

SW206

4

SW211

7

SW216

*

C216

NA

SW202

2

SW207

5

SW212

8

SW217

0

C217

NA

SW203

3

SW208

6

SW213

9

SW218

#

C218

NA

Figure 3-7 KEY MAXTRIX Interface

SW204

LEFT

SW205 MENU

SW209

UP

SW210

SEL

SW214

RIGHT

SW215

SEND

SW219

DOWN

C219

NA

C220

NA

The keypad interface is connected to the X-Bus, together with the XBIU and the Shared Memory

Register, using a single Bus Interface.

The keypad supports two scan modes:

• By default, the keypad is a 4x6 scan matrix (4 input and 6 output pins).

• To set the keypad to a 5x5 scan matrix (5 input and 5 output pins)

The scan mode should be determined at the very beginning of the system start because changes are not allowed later.

- 29 -

3. TECHNICAL BRIEF

3.8 Battery Charging Block Interface

CHARGING IC

2V8_VIO

CHARGE_DETECT

CHG_STATUS

VCHARGE

R119 1.8K

(10V,K,X5R)

R121

C126

NA

1u

C127

0.015u

R118

NA

3

4

TIME

5

11

U101

1

VIN

2

_FAULT

VBAT

10

VSEN_TEMP

9

_STATUS

GND

PGND

ISL9201IRZ-T

IREF

8

V2P8

7

EN

6

VBAT

(10V,K,X5R)

VCHARGE

C125

C128

1u

R124

160K

(1%)

1u

R120

NA

R122

R123

R125

100K

0

NA

CHG_EN_TEST

CHG_EN

Figure 3-8. Charging IC Interface

The AAT3681A is a high performance battery charger designed to charge single Cell lithiumion/polymer batteries with up to 500mA of current from an external power source.

It is a stand-alone charging solution, with just one external component required For complete functionality. The AAT3681A precisely regulates battery charge voltage and current for 4.2V lithiumion/polymer battery cells.

The adapter/USB charge input constant current level can be programmed up to 500mA for rapid charging applications.

The AAT3681A has four basic modes for the battery charge cycle: pre-conditioning/trickle charge; constant current/fast charge; constant voltage; and end of charge.

- 30 -

3. TECHNICAL BRIEF

3.9 RF Interface

VC1

VC2

C417

27p

C418

27p

FL400 LMSP2PAA-575TEMP

9

3

7

IN GSM1800_1900TX

GSM1800_1900RX

VC_GSM850_900TX

VC_GSM1800_1900TX

1

6

5

8

10

GND1

GND2

GND3

GSM850_900TX

GSM850_900RX

2

4

Figure 3-9-1. ASM interface

C419 3p

2 3 5 10

4

I2 O2_2

6

O2_1

O1_2

7

8

1

I1

FL401

O1_1

9

B9308

PART_NO SFSB0001401

IN CASE OF GSM850/PCS1900

CHANGE THIS DUAL SAW FILTER

TO PART_NO SFSB0001301

C420 3p

C421 3p

C422 3p

L403

18nH

L404

5.1nH

GSM_RXN

GSM_RXP

DCS_RXN

DCS_RXP

Figure 3-9-2. SAW Filter interface

E-GOLDvoice features a fully integrated constant-gain direct conversion receiver, i.e. there is no interstage filter needed and the baseband level at the analogue IQinterface follows directly the RF input level. Depending on the baseband ADC dynamic range, single- or multiple-step gain switching schemes are possible.

An integrated, selfaligning, low-pass filter ensures the receivers to function under blocking and reference interference conditions and avoids aliasing by baseband sampling. An automatic DC-offset compensation is implemented and can be switched depending on the gain setting.

- 31 -

3. TECHNICAL BRIEF

VBAT

VBAT

C403

12p

C404

0.01u

C402

10u

(2012)

C405

33p

C406

18p

C407

27p

C408

0.01u

C411

NA

R406

0

C412

NA

C415

NA

R410

0

C416

NA

15

DCS_PCS_OUT

11

EGSM_OUT

U400

SKY77318

DCS_PCS_IN

3

EGSM_IN

4

19

RSVD_GND ENABLE

18

21

P_GND BS

1

(50V,J,NP0) (16V,K,X7R)

C413

27p

C414

27p

TXON_PA

BS

R404

0

R405

0

L402

NA

C409

NA

DCS_PCS_OUT

R407

0

R408

NA

R409

NA

GSM_OUT

Figure 3-9-3. PAM(Power Amplifier Module) interface

The digital transmitter architecture is based on a fractional-N sigma-delta synthesizer for constant envelope GMSK modulation. This configuration allows a very low power design with a reduced external component count.

The modulation is transferred between baseband- and RF-part of the PMB7880 via a digital interface signal into the digital modulator.

The following Gaussian filter shapes the digital data stream for the GMSK modulation. Additionally a pre-distortion filter compensates the attenuation of the PLL transfer function resulting in a very low distortion at the transmit output.

The filtered digital data stream is scaled appropriately and added to the channel word. This sum is fed into the MASH modulator. The output of the MASH modulator is a sequence of integer divider values representing the high resolution fractional input signal. This sequence controls the MMD (multi modulus divider) at a sample rate of 26MHz. Thus a tightly controlled frequency modulation of the

VCO is achieved.

- 32 -

3. TECHNICAL BRIEF

3.10 Audio Interface

LOUD2

LOUD1

K14

L15

VMIC

MICP2

MICN2

MICP1

MICN1

EPPA1

EPP1

EPN1

P12

P11

R12

P15

R13

M14

M12

N15

SPK_N

SPK_P

VMIC

AUXIP

AUXIN

VINNORP

VINNORN

EPPA1

REC_P

REC_N

C124

1000p

Figure 3-10-1 Audio interface

The audio front-end of E-GOLDvoice offers the digital and analog circuit blocks for both receive and transmit audio operation and ringing. It features a high-quality, digital-to-analog path with amplifying stages for connecting acoustic transducers to the E-GOLDvoice. In the transmit direction the supply voltage generation for microphones, low-noise amplifier and analog to digital conversion are integrated on the E-GOLDvoice.

For E-GOLDvoice the EPp1/EPn1 driver are used as differntial Earpiece-Driver, EPPa1 is used as single-ended Headset-Driver.

The audio front-end itself can be considered to be organized in three sub-blocks:

• Interface to processor cores (TEAKlite and - indirectly - C166S)

• Digital filters

• Analog part.

- 33 -

3. TECHNICAL BRIEF

The interface to the processor cores consists of a direct physical connection to the TEAKlite DSP bus and a set of firmware commands to handle communication between the C166S and the audio frontend which serves as the interface peripheral for audio algorithms running on the DSP or the controller.

The audio front-end Generates interrupts on certain occasions, for example, when exchange of data is requested. The core interface part of the audio front-end also contains the control and status registers which are used to set up certain operation modes of the peripheral.

The section next to the core interface contains the digital filters for interpolation and decimation of the audio signals being received and transmitted. The data path for the receive direction can be set up to process sampling rates between 8kHz and 48kHz.

The interpolation filters for the respective sampling rates are implemented in a dedi-cated hardware block and are automatically selected to suite the chosen sampling rate.

Low-pass interpolation filtering, which produces an unsigned 16-bit data stream with a sampling rate of

4 MHz, is performed digitally. D-to-A conversion, postfiltering, and final amplification are performed on the analog part. The amplifier buffer for voiceband receive does also support ringer functionality. The ringer functionality is activated by Setting bits RINGSELPN or RINGSELPA in the voiceband part of the analog control register.

In transmit direction, amplification, prefiltering and A-to-D conversion (analog ∑∆ modulation) are performed on the analog part. The resulting 2-Mbit/s data stream is filtered by a digital low-pass decimation filter for further processing by DSP firmware.

Two sampling rates, 8kHz and 16kHz, are supported.

The analog section contains all the necessary analog functional blocks including microphone supply generation, output and input amplifiers and analog filtering.

Signals

EPp1

EPn1

EPpa1

Loud1

Loud2

MICP1

MICN1

MICP2

MICN2

VMIC

Description

Main Receiver Positive signal(Differential signal)

Main Receiver Negative signal(Differential signal)

Headset signal(Single Ended signal)

Speaker Output Positive signal(Differential signal)

Speaker Output Negative signal(Differential signal)

Main Microphone Positive signal(Differential signal)

Main Microphone Negative signal(Differential signal)

Headset Microphone Positive signal(Differential signal)

Headset Microphone Negative signal(Differential signal)

Main/Headset Microphone supply power

- 34 -

3. TECHNICAL BRIEF

REC_P

RECEIVER

C100

39p

REC_N

C102

39p

C103

39p

L100

L101

22nH

22nH

CN100

1

2

11*07*3T receiver

(SURY0013001)

Figure 3-10-2 Main Receiver interface

SPK_N

SPK_P

RADIO_SPK_L

C116

C117 0.1u

NA

R103

SPEAKER AMPLIFIER

R102

82K

NA

R104

U100

A3

INP

NCP2890AFCT2G

C2

OUTB

20K

R105

C118 0.1u

A1

INM OUTA

A2

C3

_SD VM

B2

0.1u

20K

R106

C119 C1

BYPASS VP

B3

20K

VBAT

LOUD_SPK_EN

C120

1 uF

(2012)

(10V,K)

Gain : Rf/Rin

SPEAKER

D100

C122

0.1u

C123

0.1u

D101

L103

L104

27nH

CN101

1

27nH

2

16pi 3.4T speaker

(SUSY0025801)

Figure 3-10-3 Main Speaker interface

- 35 -

3. TECHNICAL BRIEF

VINNORP

VINNORN

MAIN_MIC

R300

1K

VMIC

R301

2.2K

R304

100ohm

C306 0.1u

C307

0.1u

R307

100ohm

C309 0.1u

R309

2.2K

C303

39p

C304

10u

C308

39p

OB4-15L42-C33L

2

1

MIC300

Figure 3-10-4 Main Microphone interface

VMIC

AUXOP_FML

AUXOP_FMR

TXD

RXD

AUXIN

C317

0.1u

C318

NA

AUXIP

C320 0.1u

R318

2.2K

C319

10u

2V8_VIO 2V8_VIO

C323

C324

10u

10u

EAR_MIC

I/O CONNECTOR

HS_DET

RPWRON

DSR

BATT_TEMP

FOR RADIO

FB300 1800

FB301

FB302

1800

1800

2V8_VIO

R324

100K

VBAT

VCHARGE

CN301

C327

10u

(2012)

(10V,Z,Y5V)

C328

56p

(50V,J,NP0)

7

8

9

10

11

2

3

4

5

6

21

19

1

12

13

14

15

16

17

18

20

22

L300

270nH

1608

FOR RADIO

2 : AUDIO

4 : EAR_L

5 : EAR_R

6 : TXD

7 : RXD

8 : JACK_D

9,10 : BATT

11 : R/ON

12,13 : CHG

C322

10p

HSEJ-18S04-25R

VBAT

FM_ANT

R332 0

C336

3p

C337

18p

(50V,J,NP0)

1

CN302

3

2

(50V,C,NP0)

(TOL:0.25P)

Figure 3-10-5 Headset interface

- 36 -

3. TECHNICAL BRIEF

3.11 Key LED Interface

KEY BACKLIGHT

VBAT

(10V,K,X5R)

KEY_BACKLIGHT

R222 1K

R223

10K

2SC5585

Q200

(10V,K,X5R)

Figure 3-11 Key LED interface

This handset has 6 LEDs that illuminates blue color.

Control signal is controlled by EGold-voice with PWM and handset has 3 methods, ON, OFF and

Dimming.

- 37 -

3. TECHNICAL BRIEF

3.12 Vibrator Interface

VIBRATOR

VBAT VBAT

(50V,J,NP0)

C302

27p

CN300

1

2

VIBRATOR

R306

1K

C305

27p

R305

10

(1608)

Q300

2SC5585

Figure 3-12 Vibrator interface

This handset has vibrator operation. Control signal is controlled by EGold-voice with PWM.

- 38 -

3. TECHNICAL BRIEF

3.13 Memory Interface

VBAT

C300

NA

(NOT MOUNTED)

2V8_VMEM_S

1

2

3

U300

STBY

GND

VIN

BH28FB1WHFV

5

NC

6

BGND

VOUT

4

C301

NA

2V8_VMEM

C315

0.1u

2V8_VMEM_S

DATA00

DATA01

DATA02

DATA03

DATA04

DATA05

DATA06

DATA07

DATA08

DATA09

DATA10

DATA11

DATA12

DATA13

DATA14

DATA15

R310 0

R311 NA

2V8_VIO

R315 NA

C316

0.1u

MEMORY

DQ0

DQ1

DQ2

DQ3

DQ4

DQ5

DQ6

DQ7

DQ8

DQ9

DQ10

DQ11

DQ12

DQ13

DQ14

DQ15

H2

F3

G3

H4

G6

F6

F5

H6

E6

G7

H7

F7

G2

E3

H3

F4

G4

VCCF

G5

VCCS

G8

E2

C8

D8

E7

F8

H5

U301

VSS1

VSS2

RFU0

RFU1

RFU2

RFU3

RFU4

S71GL032A40BAW0F

E1

A0

D1

A1

A2

C1

B1

A3

A4

D2

A5

A6

C2

B2

A7

A2

A6

A8

A9

C6

A10

D6

A11

A7

A12

B7

A13

C7

D7

A14

B8

A15

E8

A16

D3

A17

C3

A18

A19

B6

A20

C5

_OE

_WE

_LB

_UB

_CE1F

_CE1S

CE2S

RY__BY

WP_ACC

_RSTF

F2

A5

A3

B3

F1

G1

B5

C4

A4

B4

TP300

_RY_BY

ADD11

ADD12

ADD13

ADD14

ADD15

ADD16

ADD17

ADD18

ADD19

ADD20

ADD21

ADD01

ADD02

ADD03

ADD04

ADD05

ADD06

ADD07

ADD08

ADD09

ADD10

_OE

_WR

ADD00

BHE_N

CS0n

CS1n

2V8_VMEM

2V8_VMEM

Figure 3-13 Memory interface

In E-GOLDvoice, the 16bits demultiplex X-bus interface is used for memory device support. NOR

Flash memory is supported. (The NAND Flash memory is not supported). The page mode can be supported for flash memories.

Up to 8MBytes of external RAM and/or ROM can be connected to the MCU via its external bus interface.

Up to 3 external CS signals can be generated to save external glue logic.

Access to very slow memories is supported via a special ‘Ready’ function.

The system MCU clock is set to run with 26Mhz.

- 39 -

3. TECHNICAL BRIEF

3.14 Power Block Interface

3V2_VBUF

VRF1

(1608)

2V0_VRTC

R100

6.8K

BAT100

C111

1u

L102

18nH

C113

1u

VBAT

REXT

D12

XOX

XO

A9

A8

C115

2.2u

(1608)

(16V,K,X5R)

Figure 3-14-1 Power Block interface

The E-GOLDvoice integrated power management unit (PMU) supports direct connection to battery

(DCB). That means all supply voltages needed are generated on-chip with integrated linear voltage regulators. The input of these linear voltage regulators is the battery voltage. The external memory and

SIM card supply is provided by the on-chip voltage regulators. Table 144 is an overview of the internal generated supply voltages.

The integrated power management also provides the control state machine for system start up, including start up with discharged batteries, trickle charging and system reset control. After system start up several methods are implemented for active and idle power saving.

- 40 -

3. TECHNICAL BRIEF

Name

LRTC

LD1

LIO

LRFXO

LMEM

LANA

LSIM

LBUF

LRFRX

LRFTRX

Output Voltage(V) Output Current (mA) Comment

2.0

4 Used for the real time and digital PMU supply

1.2/1.5

1.8/2.85

2.5

2.5

150

30

10

100

Used for the core supplies (MCU and DSP via switch)

Used for the I/O pad supply and, for example, the display

Used for the crystal oscillator supply

Used for the external memory supply, voltage can be

2.5

1.8/2.85

2.6/2.8/3.0/3.2

2.5

1.5

100

30

300

100

120 configured during startup

Used for analog (audio and baseband processing) and headset driver

Used of the SIM card supply

Used for the loudspeaker and earpiece driver

Used for the RF RX part

Used for the RF TX/TX part

Figure 3-14-2 EGold Voice PMU

LDO output voltage selection

• LD1, LIO, LSIM, LBUF output voltage programmable by software.

• LMEM output voltage is selectable by pin configuration upon startup.

Active and idle power saving options:

• The flexible clock switching options allow minimizing the power consumption during the operation phases of the E-GOLDvoice.

• Current consumption during the standby mode is minimized by reducing the clock to 32 kHz and switching it off for most of the device. In addition, the power supply for the TEAKLite ROM is switched off and the controller RAM is switched to a power saving mode.

Start-up and Reset Control State Machine Features

• Power up upon battery insertion, push button, alarm, charger connection.

• Detection of battery exchange or re-insertion.

• Complete start-up sequence management.

• System turn-on, system turn-off operation management including emergency (under-voltage) and programmed shutdown functions.

• Internal reset of the baseband, including silent reset.

• Tri-state function of the baseband module.

• Standby mode controlled by VCXO_EN provided by SCCU module.

- 41 -

3. TECHNICAL BRIEF

3.15 FM Radio Interface

RADIO_AMP_SHDN

(FOR FM RADIO)

FM_INT

RADIO_AMP_SHDN

FM_INT

TP301

GPIO3

VA

GPIO2

GPIO1

PGND

NC2

21

20

18

19

17

16

SCLK

_SEN

RCLK

VIO

SDIO

7

8

6

9

10

0.1u

C339

R337

4.7K

4.7K

R336

NA C334

- 42 -

3. TECHNICAL BRIEF

3.15.1 FM Tunner

The Si4702 patented digital low-IF architecture reduces external components and eliminates the need for factory adjustments. The receive (RX) section integrates a low noise amplifier (LNA) supporting the worldwide FM broadcast band (76 to 108 MHz). An automatic gain control (AGC) circuit controls the gain of the LNA to optimize sensitivity and rejection of strong interferers.

For two-wire operation, a transfer begins with the START condition. The control word is latched internally on rising SCLK edges and is eight bits in length, comprised of a seven bit device address equal to 0010000b and a read/write bit (write = 0 and read = 1). The device acknowledges the address by setting SDIO low on the next falling SCLK edge. For write operations, the device acknowledge Is followed by an eight bit data word latched internally on rising edges of SCLK.

The device always acknowledges the data by setting SDIO low on the next falling SCLK edge. An internal address counter automatically increments to allow continuous data byte writes, starting with the upper byte of register 02h, followed by the lower byte of register 02h, and onward until the lower byte of the last register is reached. The internal address counter then automatically wraps around to the upper byte of register 00h and proceeds from there until continuous writes cease. Data transfer ceases with the STOP command. After every STOP Command, The internal address counter is reset.

For read operations, the device acknowledge is followed by an eight bit data word shifted out on falling

SCLK edges. An internal address counter automatically increments to allow continuous data byte reads, starting with the upper byte of register 0Ah, followed by the lower byte of register 0Ah, and onward until the lower byte of the last register is reached. The internal address counter then automatically wraps around to the upper byte of register 00h and proceeds from there until continuous reads cease. After each byte of data is read, the controller IC should return an acknowledge if an additional byte of data will be requested. Data transfer ceases with the STOP command. After every

STOP command, the internal address counter is reset.

3.15.2 Headphone Amplifier

The MAX4411 fixed-gain, stereo headphone driver features Maxim’s patented DirectDrive architecture, eliminating the large output-coupling capacitors required By conventional single-supply headphone drivers. The device consists of two 80mW Class AB headphone drivers, internal feedback network

(fixed -1.5V/V gain), undervoltage lockout (UVLO)/shutdown control, charge pump, and comprehensive click-and-pop suppression circuitry.

- 43 -

4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.1 RF Trouble

SW400

U400

FL400

FL401

X101

U102

REFERENCE

U400

X101

FL400

SW400

FL401

PART Description

PAM (Power Amp. Module)

DCXO (26MHz)

ASM (Antenna Switch Module)

Mobile Switch

RX SAW Filter

- 44 -

4. TROUBLE SHOOTING

RF Trouble

TEST POINT

Antenna Matching component

Antenna.Contact Point

SW400

CIRCUIT DIAGRAM

TP400 TP401 TP402 TP403 TP404 TP405

R400

NA

R401 0

C400 1p

Antenna Matching component

L401 22nH

Mobile SW

SW400

RF500

Coupling Capacitor

C410

22p

- 45 -

4. TROUBLE SHOOTING

CHECKING FLOW

START

Check

Antenna PAD&

Intenna Contact

NG

Change Antenna

Check

Matching component

OK

Check

Mobile SW

OK

Download

And

Calibration

NG

Change PCB

NG

Resolder component

NG

Change SW400

- 46 -

4. TROUBLE SHOOTING

RX Trouble

TEST POINT

SW400

U400

X101

U102

FL400

FL401

CHECKING FLOW

START

Setup Test Equipment

Cell Power :-74d Bm

GSM850 CH190

PCS CH660

Check point.

DCXO(X101)

Check point mobile SW &

ASM & SAW

Filter(SW400,F

L400,FL401)

Re-Download S/W &

CAL

- 47 -

4. TROUBLE SHOOTING

RX Trouble

(1) Checking VCTCXO Circuit

TEST POINT

SW400

U400

FL400

FL401

CHECKING FLOW

Is the waveform of Pin3 similar to

DCXO(X101)

Waveform?

Yes

DCXO Circuit is OK.

See next page to check

PLL Circuit.

No

Replace

X101

X101

U102

CIRCUIT

X101

NX3225SA

2V8_VIO

( NX3225SA(W-188-34-7)

R107

NA

- 48 -

Waveform

Waveform

Pin 2

Pin 1

4. TROUBLE SHOOTING

RX Trouble

TEST POINT

SW400

U400

Pin 4

U102

FL400

Pin 6

FL401

CHECKING FLOW

Check Pin 1, 2 of

SW400 with RF Cable

Signal is

OK ?

Yes

N o

Replace

Mobile SW

(SW400)

Check Pin 4,6 of

FL400 ?

Yes

N o

Replace ASM

(FL400)

Check Pin 6,7 and 8,9 of

FL401 ?

N o

Replace SAW

Filter (FL401)

Yes

Mobile SW & ASM is OK.

See next page

* FL401 6,7 and 8,9 output are balanced

- 49 -

4. TROUBLE SHOOTING

4.2 TX Trouble

TEST POINT

SW400

U400

X101

U102

FL400

FL401

CHECKING FLOW

Setup Test Equipment

Cell Power : - 74dBm

GSM850 CH190

PCS CH661

Check point

DCXO(X101)

Check point

ULC2(U102)Outp ut Signal

Check point

PAM(U400)

Control Signal

Check

ASM & Mobile

S/W & SAW

(FL400,SW400

,FL401)

Re-Download S/W & RF

CAL

- 50 -

4. TROUBLE SHOOTING

TX Trouble

TEST POINT CIRCUIT

U400

HB RF Input

LB RF Input

VBAT

VBAT

C403

12p

C404

0.01u

C402

10u

(2012)

C405

33p

C406

18p

C407

27p

C408

0.01u

C411

NA

R406

0

C412

NA

C415

NA

R410

0

C416

NA

15

DCS_PCS_OUT

11

19

EGSM_OUT

RSVD_GND

U400

SKY77318

DCS_PCS_IN

3

EGSM_IN

4

ENABLE

18

21

P_GND BS

1

(50V,J,NP0) (16V,K,X7R)

C413

27p

C414

27p

R404

0

R405

0

L402

NA

C409

NA

DCS_PCS_OUT

TXON_PA

BS

R407

0

R408

NA

R409

NA

GSM_OUT

U102

Waveform

Paon & BS ASM

Vapc

CHECKING FLOW

Check Control

Signals

Signals are

Normal ?

Yes

PAM Control

Signal is OK.

See next page to check

ASM & Mobile SW

Circuit.

N o

Check

ULC2(U102)

- 51 -

4. TROUBLE SHOOTING

TX Trouble

TEST POINT

SW400

U400

X101

U102

FL400

FL401

CIRCUIT

TP400 TP401 TP402 TP403 TP404 TP405

R400

NA

R401 0

C400 1p

L401 22nH

SW400

RF500

VC1

VC2

C417

27p

C418

27p

C410

22p

FL400 LMSP2PAA-575TEMP

9

3

7

IN GSM1800_1900TX

GSM1800_1900RX

VC_GSM850_900TX

VC_GSM1800_1900TX

1

6

5

8

10

GND1

GND2

GND3

GSM850_900TX

GSM850_900RX

2

4

Mode

VC1

VC2

GSM900 TX

H(2.7V)

L

DCS1800 TX

L

H(2.7V)

GSM800 RX

L

L

DCS1800 RX

L

L

- 52 -

4. TROUBLE SHOOTING

RX Trouble

TEST POINT

SW400

Pin 1

Pin 2

U400

Pin 3

CHECKING FLOW

Check Pin 1, 2 of

SW400 with RF Cable

U102

Signal is

OK ?

Yes

N o

Replace Mobile

SW (SW400)

FL400

Pin 7

FL401

Check Pin 1,2

Yes

Control

Signal is

OK ?

Yes

No

Check ULC2

(U102)

Pin 3,7

Signal is normal ?

Yes

Mobile SW & ASM is

OK.

Check Antenna.

N o

Replace ASM

(FL400)

- 53 -

4. TROUBLE SHOOTING

4.3 Power On Trouble

TEST POINT

Check Points

-Battery Voltage( Need to over 3.35V)

-Power-On Key detection (PWRON signal)

-Outputs of LDOs from EGV

LDO VOLTAGE PART

V_BUF 3.2V

C101

V_MEM

V_IO

2.8V

2.8V

C109

C107

V_SIM

VRF0

V_ANA

2.85V

1.5V

2.5V

C108

C110

C113

C110

C106

26Mhz

CIRCUIT

3V2_VBUF

C111

C107

C101

C109

EGV

IC

VRF1

(1608)

L102

18nH

C113

1u

2V0_VRTC

R100

6.8K

BAT100

C111

1u

VBAT

REXT

D12

XOX

XO

A9

A8

C115

2.2u

(1608)

(16V,K,X5R)

- 54 -

4. TROUBLE SHOOTING

Power On Trouble

CHECKING FLOW

START

Check Battery Voltage

> 3.35V

YES

Push power-on key

And check the level change of PWRKEY

YES

Check the voltage of

The LDO outputs at U102

NO

NO

Charge or Change Battery

NO

Check the contact of power key

Or dome-switch

Replace U102

YES

THE PHONE WILL

POWER ON.

LDO VOLTAGE PART

V_BUF

V_MEM

3.2V

2.8V

C101

C109

V_IO

V_SIM

VRF0

V_ANA

2.8V

2.85V

1.5V

2.5V

C107

C108

C110

C113

- 55 -

4. TROUBLE SHOOTING

4.4. SIM Card Trouble

TEST POINT

R302/C310

J300.PIN1

C331/C332

CIRCUIT DIAGRAM

2V85_VSIM

2V85_VSIM

SIM_DATA

C310

22p

J300

4

5

6

8

GND VCC

VPP

I_O

RST

CLK

GND2 GND1

3

7

1

2

2V85_VSIM

C311

0.1u

C312

22p

SIM_RST

SIM_CLK

- 56 -

4. TROUBLE SHOOTING

Checking Flow

START

R302/C310/

C311/C312

Does the SIM cards supports 3V ?

NO

Change the SIM Card. Our phone supports only 3V SIM card.

YES

Check soldering status of J300 and

Other component

OK

NG

Resolder J300 or other component

J300.PIN1 = 2.85V

Check J300.PIN1

NG

OK

Change board

Re-download SW

Check Operation

OK

Change board

- 57 -

4. TROUBLE SHOOTING

4.5. Vibrator Trouble

TEST POINT

Q300.PIN3

R306

R308

R305

CIRCUIT DIAGRAM

VBAT VBAT

(50V,J,NP0)

C302

27p

CN300

1

2

VIBRATOR

R306

1K

C305

27p

R305

10

(1608)

Q300

2SC5585

- 58 -

4. TROUBLE SHOOTING

Checking Flow

START

Enter the engineering mode, and set vibrator on.

R306=2.8V

R308=0.7V

Check Voltage Level of

R306/R308

NG

OK

Change PCB

Q300.PIN3=0V

R305=0V

Check Voltage Level of

Q300.PIN3 and R305

NG

Change Q300

OK

Replace Vibrator

- 59 -

4. TROUBLE SHOOTING

4.6. Keypad Trouble

TEST POINT

R215

R201

R211

R203

R214

R212

R209

R204

CIRCUIT DIAGRAM

KEY MATRIX

END_KEY

END

SW200

2V0_VRTC

R213

SW201

1

KEY_OUT1

KEY_OUT2

R201

680

C205

NA

R203

680

C206

NA

KEY_OUT3

R204

680

C207

NA

KEY_IN0

KEY_IN1

KEY_IN2

KEY_IN3

KEY_IN4

KEY_OUT4

R209

680

C215

NA

R211 680

R212 680

R213 680

R214 680

R215 680

SW206

4

SW211

7

SW216 *

C216

NA

SW202

2

SW207

5

SW212

8

SW217 0

C217

NA

SW203

3

SW208

6

SW213

C218

NA

9

SW218 #

SW204

LEFT

SW205

MENU

SW209

UP

SW214

RIGHT

SW219

C219

NA

DOWN

SW210

SW215

SEND

C220

NA

SEL

- 60 -

4. TROUBLE SHOOTING

Checking Flow

START

Check Metal Doom

NG

Change Metal Doom

OK

R201/R203/R204

R209/R211/R212

R213/R214/R215

Check soldering status

Of component

NG

Resolder component

OK

Change PCB

- 61 -

4. TROUBLE SHOOTING

4.7 RTC Trouble

CIRCUIT

Check Points

- 32.768KHz is right clock

- The power of RTC is right.

32KIN

32KOUT

SWITCH_ON

OSC32K

F32K

CLKOUT

N7

P6

R5

B4

X100

4

1

MC-146_12_5PF

32.768KHz

2

3

PWRON

32KOUT

32KIN

CHG_STATUS

R100

6.8K

BAT100

- 62 -

4. TROUBLE SHOOTING

CHECKING FLOW

START

Is the frequency about 32Khz?

YES

Is VRTC about 2.0V?

YES

RTC will work properly

Replace X100 and try again.

Replace BAT100

- 63 -

4. TROUBLE SHOOTING

4.8. Key backlight Trouble

TEST POINT

D203

R204

R203

Q200.PIN3

Q200.PIN2

D20 4

CIRCUIT DIAGRAM

KEY BACKLIGHT

VBAT

D205

D200

D201

D202

(10V,K,X5R)

KEY_BACKLIGHT

R222 1K

R223

10K

2SC5585

Q200

- 64 -

(10V,K,X5R)

4. TROUBLE SHOOTING

Checking Flow

START

R222=2.8V

Check Voltage Level

Of R222

YES

R222=0.7V

Check Voltage Level

Of R222 and Q200.PIN2

NO

Change PCB

NO

Replace component

NG

Check component

R222 and Q200

LD200~LD205

R216~R221

YES

Check LED component

YES

Change PCB

NO

Replace component

- 65 -

4. TROUBLE SHOOTING

4.9. LCD Trouble

TEST POINT

CN200

R207R205 R206R208

C221

CIRCUIT DIAGRAM

LCD_RESET

SSC0_CLK

MTPG

R205

R207

47

47

C208

NA

MLED

MLED2

C209

27p

C210

27p

R210

100K

11

13

7

9

3

5

1

CN200

2

4

6

8

10

12

14

15

IMSA-9671S-13Y902

(ENQY0013801)

2V8_VIO

MTPD

R206

R208

C221

1u

MLED1

LCD_ID

C211

27p

C212

27p

47

47

C213

NA

C214

NA

CS3

SSC0_MTSR

- 66 -

4. TROUBLE SHOOTING

Checking Flow

START

Backlight is OK?

YES

NO

Change PCB

Check Operation

After LCD changes

OK

Change LCD

NG

C221=2.8V

Control Signal=

Refer to next page

Check Control

Signal and Power

Including soldering status

NG

Replace component

Or change PCB

OK

NG

Check soldering status of CN200

Replace CN200

OK

Change PCB

- 67 -

4. TROUBLE SHOOTING

WAVEFORM

SS0_SCK

LCD_CS

]SS0_MTSR pattern is out randomly when clock is fluctiatied.

, clock frequency is 13MHz and LCD_RESET is High(2.8V).

- 68 -

4. TROUBLE SHOOTING

4.10. Microphone Trouble

TEST POINT

Microphone component

R300

MIC.P

CIRCUIT DIAGRAM

MAIN_MIC

R300

1K

VMIC

VINNORP

VINNORN

R301

2.2K

R304

100ohm

C306 0.1u

C307

0.1u

R307

100ohm

C309 0.1u

R309

2.2K

C303

39p

C304

10u

C308

39p

OB4-15L42-C33L

2

1

MIC300

- 69 -

4. TROUBLE SHOOTING

Checking Flow

Make a call

R300.VMIC=2.5V

Check voltage level of R300

YES

NO

Replace PCB

Check component status around MIC

OK

NG

NG

Check status of MIC

OK

Check the voltage Level of MIC_P

MIC_P= about 1.2~1.5V DC with a few tens mV

OK

Replace PCB

NG

Re-solder or replace the Component

Re-solder or replace Microphone

Change Microphone

- 70 -

4. TROUBLE SHOOTING

4.11. Receiver Trouble

TEST POINT

L101

C103

REC.N

REC.P

L100

C102

CIRCUIT DIAGRAM

RECEIVER

REC_P

C100

39p

REC_N

C102

39p

C103

39p

L100

L101

22nH

22nH

CN100

1

2

11*07*3T receiver

(SURY0013001)

- 71 -

4. TROUBLE SHOOTING

Checking Flow

Press any Key

Check L100/L101

C102/103

Check component status

YES

L100&L101 bias will

Fluctiate signal above

1.2V

Check L100 &

L101

OK

Check Receiver

OK

Replace PCB

NG

NG

NG

Re-solder or replace the Component

Re-solder or replace the Component replace Receiver

- 72 -

4. TROUBLE SHOOTING

4.12 Speaker Trouble

TEST POINT

Check Points

- Speaker spring contact

- Audio amp soldering

L103

C117

C118

L104 CN101íS 1PIN

CN101íS 2PIN

C120

CN200

AMP IC

R111

CIRCUIT

C116 NA

R103

SPEAKER AMPLIFIER

R102

82K

C117 0.1u

NA

R104

SPK_N

SPK_P

RADIO_SPK_L

C118

C119

20K

R105

0.1u

0.1u

20K

R106

20K

A3

U100

INP

A1

INM

C3

_SD

C1

BYPASS

NCP2890AFCT2G

C2

OUTB

A2

OUTA

B2

VM

VP

B3

VBAT

LOUD_SPK_EN

C120

1 uF

(2012)

(10V,K)

Gain : Rf/Rin

SPEAKER

D100

C122

0.1u

C123

0.1u

D101

L103

L104

27nH

CN101

1

27nH

2

16pi 3.4T speaker

(SUSY0025801)

- 73 -

4. TROUBLE SHOOTING

Checking Flow

Start

Check the voltage level of U100 = Vbat?

Yes

Check the Signal,

C117,C118

Yes

Check the Level of

U100.C3 = Low ?

Yes

Check the Signal,

L102,L103

Yes

Check the Contact

Of CN101

Yes

Try again or Change the Board

No

Check

The battery

No

Check

U102

No

No

No

Check

U102

Re-solder

L102,L103

Re-Assemble or Re-place

Speaker

- 74 -

4. TROUBLE SHOOTING

4.13 Headphone Trouble

TEST POINT

Check Points

-18pin IO connector

-Passive Parts slodering Status

C321

C322

FB300

FB302 FB301

CN301

CIRCUIT DIAGRAM

VMIC

AUXOP_FML

AUXOP_FMR

TXD

RXD

AUXIN

C317

0.1u

C318

NA

AUXIP

C320 0.1u

R318

2.2K

C319

10u

2V8_VIO 2V8_VIO

C323

C324

10u

10u

EAR_MIC

I/O CONNECTOR

HS_DET

RPWRON

DSR

BATT_TEMP

FOR RADIO

FB300 1800

FB301

FB302

1800

1800

2V8_VIO

R324

100K

VBAT

VCHARGE

CN301

C327

10u

(2012)

(10V,Z,Y5V)

C328

56p

(50V,J,NP0)

10

11

12

13

14

15

16

17

18

5

6

7

8

9

3

4

1

2

21

19

20

22

L300

270nH

1608

FOR RADIO

2 : AUDIO

4 : EAR_L

5 : EAR_R

6 : TXD

7 : RXD

8 : JACK_D

9,10 : BATT

11 : R/ON

12,13 : CHG

C322

10p

HSEJ-18S04-25R

VBAT

FM_ANT

R332 0

C336

3p

C337

18p

(50V,J,NP0)

3

2

1

CN302

(50V,C,NP0)

(TOL:0.25P)

- 75 -

4. TROUBLE SHOOTING

CHECKING FLOW

START

Does the audio profile of the phone change to the earphone mode?

No

Check the voltage Level

CN301.8 = Low?

No

Yes

Yes

Re-solder CN301 or Change another Ear- Mic set and Try again

Replace U100 or Change Board

Mic

Go to MIC

Trouble section

Earphone

Acoustic

Check the signal Level at AUX_MIC.

Is it about 1.2~1.5V DC with a few tens mV AC?

No

Re-solder causal component

(CN301)

Yes

Change another Ear-Mic set and Try again

Does waveform at

U102.EPPA1

fluctuate?

Yes

No

Replace U100 or

Change the board

Does waveform at

CN301.4 and CN301.5

fluctuate?

No

Re-solder causal component

(CN302,C322 etc.)

Change another Ear-Mic set and Try again

- 76 -

4. TROUBLE SHOOTING

4.14 Charging Trouble

TEST POINT

Check Points

-Connection of TA (check TA voltage 5.2V)

-Charging Current Path component voltage drop

-Battery voltage

-Charging IC

R124

Charger

IC

U101

C125

VBAT

VCHARGE

=5.2V

C126

CN301

CIRCUIT

CHARGING IC

2V8_VIO

CHARGE_DETECT

CHG_STATUS

VCHARGE

R119 1.8K

(10V,K,X5R)

R121

C126

NA

1u

C127

0.015u

R118

NA

3

4

TIME

5

11

U101

1

VIN

2

_FAULT

VBAT

10

VSEN_TEMP

9

_STATUS

GND

PGND

ISL9201IRZ-T

IREF

8

V2P8

7

EN

6

VBAT

(10V,K,X5R)

VCHARGE

C125

C128

1u

R124

160K

(1%)

1u

R120

NA

R122

R123

R125

100K

0

NA

CHG_EN_TEST

CHG_EN

- 77 -

4. TROUBLE SHOOTING

Checking Flow

START

I/O Connector(CN301)

Is well-soldered ?

YES

Is The Voltage of C126

5.2V ?

YES

The Voltage of C128

Is 2.8V

YES

Check the voltage of R124

High or Low?

YES

Battery is charged?

NO

NO

LOW

NO

NO

Resolder the CN300

Pin 12,13 : VCHARGE

The TA is out of order

Change the TA

Replace the

U101

Check the U102

The battery may have problems.

Change the battery.

YES

Charging is properly operating

- 78 -

4. TROUBLE SHOOTING

4.15. FM Radio Trouble

TEST POINT

U304.P1

U304.P4

R327

R331

R338/R337/R336

R332

U303 R329/R330

C332/C333

U302

- 79 -

4. TROUBLE SHOOTING

CIRCUIT DIAGRAM

RADIO_AMP_SHDN

(FOR FM RADIO)

FM_INT

RADIO_AMP_SHDN

FM_INT

TP301

GPIO3

VA

GPIO2

NC2

GPIO1

PGND

20

19

21

17

18

16

RCLK

VIO

SCLK

_SEN

SDIO

7

6

9

8

10

0.1u

C339

R337

4.7K

4.7K

R336

NA C334

- 80 -

4. TROUBLE SHOOTING

Checking Flow

Connector Headset and

Turn on Radio and tuned channel

U304.PIN1 = High

U304.PIN4=2.8V

R336/R337/338

Check I2C signal and 32K clock

R329/R330

C332/C333

R327/R331

Check LDO

Power

YES

Check

Control Signal

OK

Check

Audio Output

Of Transceiver

OK

Check

Audio Output

Of Amplifier

OK

Change PCB

NO

NG

NG

NG

Change U304

Change PCB

Change U302

Change U303

- 81 -

5. DOWNLOAD

5. DOWNLOAD

5.1 Download Setup

Configure system like figure 5-1.

Figure 9-1. Download Setup

- 82 -

5.2 Download Process

5.2.1. Download step[1]

5. DOWNLOAD

: Start or Stop download

: Selected configuration DLL file

: File name donwloading

File(F)

→ Exit(X) : End program

Setting(S)

→ Configuration : configuration download condition DLL, SW files and etc.

About(H)

→ MultiGSM : Provide version information

First, select Setting Menu.

- 83 -

5. DOWNLOAD

5.2.2. Download step[2]

: Select a appropriated DLL file

- You must select KG270_xxxxxx.DLL file.

: Select configuration file

You must select cmd.m0 file

: Select download speed

You must 460800. System supports maximum 460800bps.

: Select port select start and end port be operated

- 84 -

5.2.3. Download step[3]

5. DOWNLOAD

: Select files downloaded

KG270 have 4 files, *.eep, *.fls, *.dffs and *.cust.

But You must not select *.eep file.

- 85 -

5. DOWNLOAD

5.2.4. Download step[4]

: Start download and stop download next step.

If configuration is finished, then push start button and then button is changed to STOP.

Turn on power of multi download and connector phones.

If download is started, then push start button else program will download repeatedly.

- 86 -

5.2.5. Download step[5]

5. DOWNLOAD

: This region appears donwload status.

If download is finished, PASS or FAIL.message is showed.

- 87 -

6. BLOCK DIAGRAM

6. BLOCK DIAGRAM

- 88 -

7. CIRCUIT DIAGRAM

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

A A

B

3

C

D

E

F

C

D

E

F

LG(42)-A-5505-10:01

1

32.768KHZ CRYSTAL

X100

3

32KIN

4

1 2

32KOUT

MC-146_12_5PF

32.768KHz

ON BOARD ARM9 JTAG & ETM INTERFACE

R113

NA

(R110 will be changed to NA for mass production)

TRSTn

TDI

TMS

TCK

TDO

TRIG_IN

TRIG_OUT

EXTRSTn

R114

NA

R117

NA

(NOT MOUNTED)

(FOR SW DEBUGGING / NOT MOUNTED)

11

12

13

14

15

9

10

7

8

3

4

5

6

1

2

G1

CN102

G2

19

18

17

16

24

23

22

21

20

30

29

28

27

26

25

G3 G4

UA100

3G 2.5G

GND

RX

TX

UFLS

ON_SW

RX

TX

NC1

ON_SW

VBAT

PWR

URXD

UTXD

GND

VBAT

NC2

NC3

NC4

DSR

RTS

CTS

3

4

5

1

2

6

7

8

9

10

11

12

VBAT

UART PORT

RXD

TXD

RPWRON

R196

R197

R198

R199

MODEL

KG278, MG160b, KG275

KG270

MG160a

R196

0

R197

NA

R198

NA

R199

NA

(1608)

3V2_VBUF

L102

18nH

C113

1u

SSC0_CLK

CHG_EN_TEST

SSC0_MTSR

LCD_RESET

(FOR FM RADIO)

(FOR FM RADIO)

FM_SCL

FM_SDA

SIM_DATA

(FOR FM RADIO)

FM_INT

SIM_CLK

SIM_RST

LOUD_SPK_EN

2V0_VRTC

TDO

TDI

TMS

R115

100K

TCK

TRSTn

TRIG_OUT

TRIG_IN

CHG_EN

KEY_OUT1

KEY_OUT2

KEY_OUT3

KEY_OUT4

KEY_IN0

KEY_IN1

KEY_IN2

KEY_IN3

KEY_IN4

RXD

TXD

HS_DET

DSR

(FOR 2.8V VMEM SELECTION)

DATA00

DATA01

DATA02

DATA03

DATA04

DATA05

DATA06

DATA07

DATA08

DATA09

DATA10

DATA11

DATA12

DATA13

DATA14

DATA15

ADD00

ADD01

ADD02

ADD03

ADD04

ADD05

ADD06

ADD07

ADD08

ADD09

ADD10

RXD

TXD

DSR

C8

D6

D7

C7

D9

C6

C9

D8

F9

F8

KP0

KP1

KP2

KP3

KP4

KP5

KP6

KP7

KP8

KP9

G7

H7

H8

G8

RXD

TXD

RTS_N

CTS_N

J6

K6

G6

H6

SSC0_CLK

SSC0_MRST

SSC0_MTSR (FOR LCD SPI INTERFACE)

DISP_REST

H9

H10

SCL

SDA

R8

M9

P7

R10

N8

CCIO

CCVZ_N

CCLK

CCRST

CCIN

MON100

P8

M10

P9

R9

K9

B5

C5

F7

N6

N9

TDO

TDI

TMS

TCK

TRST_N

TRIG_OUT

TRIG_IN

NMI_N (FOR CHARGING IC)

MON1

MON2

D0

D1

D2

D3

D4

D5

D6

D7

D8

D9

D10

D11

D12

D13

D14

D15

R4

P1

P2

N2

L1

M2

K1

N1

L2

K2

J1

M4

J2

P3

R2

M1

C2

D5

F4

E4

D4

G4

D2

H4

C1

F1

F2

A0

A1

A2

A3

A4

A5

A6

A7

A8

A9

A10

PMB7880

U102

1V5_VRF0 VD1

VRF1

VRF2

2V0_VRTC

VRF1

REC_P

REC_N

RECEIVER

C100

39p

C102

39p

C103

39p

L100

L101

22nH

22nH

CN100

1

2

11*07*3T receiver

(SURY0013001)

R100

6.8K

BAT100

C111

1u

VBAT

REXT

D12

XOX

XO

A9

A8

TX2

TX1

A13

A14

M0,2 : ~1.92V

M7,9 : ~0.96V

(30uA)

(VOLTAGE SENSING)

(30uA)

(90uA)

RX34

RX34X

RX12

RX12X

M9

M0

M7

M2

E15

D15

C15

B15

N10

R14

R11

P10

P13

PAOUT1

LOUD2

LOUD1

K14

L15

VMIC

MICP2

MICN2

MICP1

MICN1

EPPA1

EPP1

EPN1

P12

P11

R12

P15

R13

M14

M12

N15

T2IN

VIB_CONTROL

BACK_LIGHT

W_LED_DRV

CC00IO

RSTOUT_N

RESET_N

SAFE_RES

SWITCH_ON

OSC32K

F32K

CLKOUT

A4

A3

P5

M7

N7

P6

B2

B1

B3

A2

R5

B4

T_OUT8

T_OUT4

T_OUT3

T_OUT2

T_OUT0

B7

A5

A6

B6

A7

E1

H1

D1

F3

L3

K4

J4

H3

J3

H2

G2

N5

M6

E3

E2

R3

M5

K3

P4

G1

OE_N

ADV_N

BHE_N

WR_N

RD_N

CS3_N

CS1_N

CS0_N

A22

A21

A20

A19

A18

A17

A16

A15

A14

A13

A12

A11

BHE_N

_WR

CS100

C115

2.2u

(1608)

(16V,K,X5R)

_RESET

DCS_PCS_OUT

GSM_OUT

X101

NX3225SA

2V8_VIO

DCS_RXP

DCS_RXN

GSM_RXP

GSM_RXN

RADIO_DETECT

DEFAULT_BANDSEL

( NX3225SA(W-188-34-7)

(FOR FM RADIO)

R109

68K

R107

NA

LCD_ID

BATT_TEMP

TX_RAMP

SPK_N

SPK_P

VMIC

R111

100K

R112

47K

AUXIP

AUXIN

VINNORP

VINNORN

EPPA1

REC_P

REC_N

1000p

HEADSET_RADIO_SEL

VIBRATOR

KEY_BACKLIGHT

(FOR FM RADIO)

W_LED_DRV

RADIO_EN

FM_RST

(FOR FM RADIO)

(FOR FM RADIO)

R116 0

PWRON

32KOUT

32KIN

CHG_STATUS

BS

FM_32K

VC2

VC1

TXON_PA

(FOR FM RADIO)

_OE

BHE_N

_WR

CS3

CS1n

CS0n

ADD21

ADD20

ADD19

ADD18

ADD17

ADD16

ADD15

ADD14

ADD13

ADD12

ADD11

C124

C116 NA

R103

NA

R104

SPK_N

SPK_P

RADIO_SPK_L

C117 0.1u

C118

C119

20K

R105

0.1u

0.1u

20K

R106

20K

SPEAKER AMPLIFIER

R102

82K

A3

U100

INP

A1

INM

C3

_SD

C1

BYPASS

NCP2890AFCT2G

OUTB

C2

OUTA

A2

B2

VM

VP

B3

VBAT

LOUD_SPK_EN

C120

1 uF

(2012)

(10V,K)

Gain : Rf/Rin

SPEAKER

D100

C122

0.1u

C123

0.1u

D101

L103

L104

27nH

CN101

1

27nH

2

16pi 3.4T speaker

(SUSY0025801)

CHARGING IC

2V8_VIO

VCHARGE

CHARGE_DETECT

R119 1.8K

CHG_STATUS

(10V,K,X5R)

R121

C126

NA

1u

C127

0.015u

R118

NA

1

VIN

U101

VBAT

10

2

_FAULT

3

_STATUS

VSEN_TEMP

IREF

9

8

4

TIME

5

11

GND

PGND

ISL9201IRZ-T

V2P8

7

EN

6

VBAT VCHARGE

(10V,K,X5R)

C125

1u

R120

NA

R122

C128

1u

R124

160K

(1%)

R125

100K

R123

0

NA

CHG_EN_TEST

CHG_EN

E_FUSE

2

5

6

3

4

7

8

1

2

9

3

SC100

27

26

25

24

23

22

21

20

19

4

VBAT VBAT

VBAT1 VBAT2 GND1 GND2

5 6 7 8 9

Iss.

Notice No.

Date Name

Section

Designer

Checked

Approved

Date

11/16

2006

Sign & Name

SANG-YOEN.LEE

MODEL

LG Electronics Inc.

DRAWING

NAME

DRAWING

NO.

GB3_RADIO

SPFY0144601

BB

VER-1.1

B

C

D

E

F

C

D

Sheet/

Sheets

1/4

E

LG Electronics Inc.

- 89 -

7. CIRCUIT DIAGRAM

A

1 2 3 4

KEY MATRIX

END_KEY

END

SW200

2V0_VRTC

SW201

1

KEY_OUT1

KEY_OUT2

KEY_OUT3

R201

680

C205

NA

R203

680

C206

NA

R204

680

C207

NA

KEY_IN0

KEY_IN1

KEY_IN2

KEY_IN3

KEY_IN4

KEY_OUT4

R209

680

C215

NA

R211 680

R212 680

R213 680

R214 680

R215 680

SW206

4

SW211

7

SW216

*

C216

NA

SW202

2

SW207

5

SW212

8

SW217

0

C217

NA

SW203

SW208

SW213

SW218

#

C218

NA

3

6

9

SW204

LEFT

SW205 MENU

SW209

UP

SW214

RIGHT

SW219

C219

NA

DOWN

SW210

SEL

SW215

SEND

C220

NA

5 6 7 8 9 10

A

MLED

W_LED_DRV

R202

100K

C202

27p

VBAT

CHARGE PUMP

5

U200

IN

AAT3157ITP-T1

10

C1+

8

11

4

CP

EN_SET

GND

C1-

C2+

9

7

C2-

6

D1

D2

D3

NC

1

2

3

12

C200

1u

C201

1u

C203

27p

C204

27p

MLED1

MLED2

MAKER

SII

SHARP

GP

ID

HIGH

LOW

150Kohm pull up

Voltage

1.9V

0V

0.9V

LCD_RESET

SSC0_CLK

MTPG

R205

R207

47

47

C208

NA

MLED

MLED2

C209

27p

C210

27p

R210

100K

11

13

7

9

3

5

1

CN200

8

10

12

14

15

2

4

6

IMSA-9671S-13Y902

(ENQY0013801)

2V8_VIO

MTPD

R206

R208

C221

1u

MLED1

LCD_ID

C211

27p

C212

27p

47

47

C213

NA

C214

NA

CS3

SSC0_MTSR

B

C

D

E

1

LGIC(42)-A-5505-10:01

KEY BACKLIGHT

VBAT

2

(10V,K,X5R)

KEY_BACKLIGHT

R222 1K

R223

10K

2SC5585

Q200

(10V,K,X5R)

3 4 5

Iss.

Notice No.

Date Name

Section

Designer

Checked

Approved

Date

11/16

2006

Sign & Name

HYUN-OK.LEE

MODEL

DRAWING

NAME

GB3_RADIO

AUDIO,LCD,KEY

Sheet/

Sheets

2/4

LG Electronics Inc.

DRAWING

NO.

REV-1.1

LG Electronics Inc.

D

- 90 -

7. CIRCUIT DIAGRAM

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

A A

B

C

VBAT

C300

NA

(NOT MOUNTED)

2V8_VMEM_S

1

U300

STBY

2

GND

3

VIN

BH28FB1WHFV

5

NC

BGND

6

VOUT

4

C301

NA

2V8_VMEM

C315

0.1u

2V8_VMEM_S

DATA00

DATA01

DATA02

DATA03

DATA04

DATA05

DATA06

DATA07

DATA08

DATA09

DATA10

DATA11

DATA12

DATA13

DATA14

DATA15

R310 0

R311 NA

2V8_VIO

R315 NA

C316

0.1u

MEMORY

G4

VCCF

G5

VCCS

G8

E2

C8

D8

E7

F8

H5

U301

G2

E3

H3

F4

F5

H6

E6

G7

H2

F3

G3

H4

G6

F6

H7

F7

DQ0

DQ1

DQ2

DQ3

DQ4

DQ5

DQ6

DQ7

DQ8

DQ9

DQ10

DQ11

DQ12

DQ13

DQ14

DQ15

VSS1

VSS2

RFU0

RFU1

RFU2

RFU3

RFU4

S71GL032A40BAW0F

E1

A0

D1

A1

A2

C1

B1

A3

A4

D2

C2

A5

A6

B2

A2

A7

A8

A6

C6

A9

D6

A10

A7

A11

A12

B7

A13

C7

A14

D7

A15

B8

A16

E8

D3

A17

C3

A18

B6

A19

C5

A20

_OE

_WE

_LB

_UB

_CE1F

_CE1S

CE2S

RY__BY

WP_ACC

_RSTF

F2

A5

A3

B3

F1

G1

B5

C4

A4

B4

TP300

_RY_BY

ADD01

ADD02

ADD03

ADD04

ADD05

ADD06

ADD07

ADD08

ADD09

ADD10

ADD11

ADD12

ADD13

ADD14

ADD15

ADD16

ADD17

ADD18

ADD19

ADD20

ADD21

_OE

_WR

ADD00

BHE_N

CS0n

CS1n

2V8_VMEM

2V8_VMEM

SIM_DATA

SIM_CONNECTOR

2V85_VSIM

2V85_VSIM

2V85_VSIM

C310

22p

4

5

6

8

GND

VPP

I_O

GND2

J300

VCC

RST

CLK

GND1

3

7

1

2

C311

0.1u

C312

22p

SIM_RST

SIM_CLK

D

REMOTE POWER ON

RPWRON

END_KEY

RPWRON R317

R319

47

0

R320

100K

PWRON

E

F

C

D

E

F

LG(42)-A-5505-10:01

1

RADIO

FM_ANT

R328 0

2V8_VIO

R325 NA 2V8_RADIO

2V8_RADIO

C331 100p

FM_RST

FM_RST

3

4

5

1

2

NC1

FMIP

RFGND

GND1

_RST

U302

SI4702-B16

GND3

LOUT

ROUT

GND2

VD

15

14

13

12

11

C329

1u 2V8_RADIO

C332

C333

0.1u

0.1u

C335

22n

2V8_RADIO

2V8_RADIO

R334

10K

R329

R330

20K

20K

RADIO_AMP_SHDN

R335

100K

C330

1u

C338

0.1u

R326 39K

7

U303

VDD

LM4809LD

VOUT1

8

1

VIN1

VOUT2

6

5

VIN2

2

4

BYPASS

_SHDN

GND

BGND

3

9

R333 39K

R327 0

R331 0

RADIO_SPK_L

RADIO_SPK_R

FM_SCL

FM_SDA

RADIO_DETECT

R339

27K

RADIO

NO RADIO

RADIO_DETECT

27K

2.7K

RADIO_EN

R343

100K

VBAT

C341

1u

(10V,K,X5R)

2V8_RADIO

1

2

3

U304

STBY

GND

VIN

BH28FB1WHFV

5

NC

6

BGND

4

VOUT

C342

1u

R338

47

FM_32K

C340

0.1u

RADIO_SPK_R

AUXOP_FMR

FOR RADIO

EPPA1

R342

NA

2V8_VIO

1

U305

NLAS5223BMNR2G

10

VCC NO2

2

NO1

3

COM1

COM2

9

IN2

8

4

IN1

5

NC1

NC2

7

GND

6

R340

NA

RADIO_SPK_L

AUXOP_FML

FOR RADIO

R345

100K

HEADSET_RADIO_SEL

2V8_VIO

R341

330K

R344

240K

EPPA1

2 3 4 5 6 7 8 9

VIBRATOR

VBAT VBAT

(50V,J,NP0)

C302

27p

CN300

1

2

VIBRATOR

R306

1K

C305

27p

R305

10

(1608)

Q300

2SC5585

VINNORP

VINNORN

MAIN_MIC

R300

1K

VMIC

R301

2.2K

R304

100ohm

C306 0.1u

C307

0.1u

R307

100ohm

C309 0.1u

R309

2.2K

C303

39p

C304

10u

C308

39p

OB4-15L42-C33L

2

1

MIC300

VMIC

AUXOP_FML

AUXOP_FMR

TXD

RXD

AUXIN

C317

0.1u

C318

NA

AUXIP

C320 0.1u

R318

2.2K

C319

10u

2V8_VIO 2V8_VIO

C323

C324

10u

10u

EAR_MIC

I/O CONNECTOR

HS_DET

RPWRON

DSR

BATT_TEMP

FOR RADIO

FB300 1800

FB301

FB302

1800

1800

2V8_VIO

R324

100K

VBAT

VCHARGE

CN301

C327

10u

(2012)

(10V,Z,Y5V)

C328

56p

(50V,J,NP0)

9

10

11

12

13

14

7

8

5

6

15

16

17

18

2

3

4

1

21

19

20

22

L300

270nH

1608

FOR RADIO

2 : AUDIO

4 : EAR_L

5 : EAR_R

6 : TXD

7 : RXD

8 : JACK_D

9,10 : BATT

11 : R/ON

12,13 : CHG

C322

10p

HSEJ-18S04-25R

VBAT

FM_ANT

R332 0

C336

3p

C337

18p

(50V,J,NP0)

(50V,C,NP0)

(TOL:0.25P)

3

2

1

CN302

B

C

D

E

F

C

D

Iss.

Notice No.

Date Name

Section

Designer

Checked

Approved

Date

11/16

2006

2006

2006

Sign & Name

SANG-YEON.LEE

MODEL

DRAWING

NAME

LG Electronics Inc.

DRAWING

NO.

GB3_RADIO

SPFY0144601

RADIO,MEMORY,AUDIO,I/O

Sheet/

Sheets

3/4

E

VER-1.1

LG Electronics Inc.

- 91 -

7. CIRCUIT DIAGRAM

7 8

A

1 2

TP400 TP401 TP402 TP403 TP404 TP405

R400

NA

R401 0

C400 1p

L401 22nH

SW400

RF500

B

C410

22p

3

C

VC1

VC2

C417

27p

C418

27p

FL400 LMSP2PAA-575TEMP

9

3

7

IN GSM1800_1900TX

GSM1800_1900RX

VC_GSM850_900TX

VC_GSM1800_1900TX

1

6

5

8

10

GND1

GND2

GND3

GSM850_900TX

GSM850_900RX

2

4

4 5

D

E

1

LGIC(42)-A-5505-10:01

2 3 4

6 9 10

A

A

5

VBAT

VBAT

C403

12p

C404

0.01u

C402

10u

(2012)

C405

33p

C406

18p

C407

27p

C408

0.01u

R406

C411

NA

0

C412

NA

C415

NA

R410

0

C416

NA

15

DCS_PCS_OUT

11

EGSM_OUT

U400

SKY77318

19

RSVD_GND

21

P_GND

DCS_PCS_IN

3

EGSM_IN

ENABLE

BS

4

18

1

(50V,J,NP0) (16V,K,X7R)

C413

27p

C414

27p

TXON_PA

BS

R404

0

R405

0

L402

NA

C409

NA

DCS_PCS_OUT

R407

0

R408

NA

R409

NA

GSM_OUT

4

2 3 5 10

I2

O2_2

6

O2_1

7

O1_2

8

1

I1

FL401

O1_1

9

B9308

PART_NO SFSB0001401

IN CASE OF GSM850/PCS1900

CHANGE THIS DUAL SAW FILTER

TO PART_NO SFSB0001301

C419 3p

L403

18nH

C420 3p

C421 3p

C422 3p

L404

5.1nH

GSM_RXN

GSM_RXP

DCS_RXN

DCS_RXP

TP406

DEFAULT_BANDSEL

6

C

D

7

Section

Designer

Checked

Approved

Date

11/16

2006

2006

2006

Sign & Name

KEE-OUN.PARK

MODEL

DRAWING

NAME

LG Electronics Inc.

DRAWING

NO.

GB3_RADIO

RF

Sheet/Sheets

4/4

VER-1.1

LG Electronics Inc.

- 92 -

8. PCB LAYOUT

- 93 -

8. PCB LAYOUT

- 94 -

9. ENGINEERING MODE

9. ENGINEERING MODE

9.1 About Engineering Mode

Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset.

9.2 Access Codes

The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.

9.3 Key Operation

Use Up and Down key to select a menu and press ‘select’ key to progress the test. Pressing ‘back’ key will switch back to the original test menu.

9.4 Engineering Mode Menu Tree

ENGINEERING MODE

1. BB TEST

2. Model Version

3. Eng Mode

4. Call Timer

5. Factory Reset

6. MF Test

- 95 -

9. ENGINEERING MODE

BB TEST

1. Backlight

2. LCD

1. LCD Color

1. Backlight On

2. Backlight Off

3. Backlight Value

2. Contrast

1. Red

2. Green

3. Blue

4. Black

5. White

6. Auto LCD

3. Battery Info

4. Vibrator 1. Vibrator On

2. Vibrator Off

5. Audio 1. Audio Test

2. Close

*

6. FM Radio

* FM Radio function is not supported

- 96 -

9. ENGINEERING MODE

9.4.1 BB Test

9.4.1.1 Backlight

➀ backlight on : LCD backlight is off.

➁ backlight off : LCD backlight is on.

➂ backlight value : LCD backlight brightness is controlled by 20% from 100 to 0.

9.4.1.2 LCD

➀ LCD color : This menu includes 5 color menu and automatic color change.

5 color menu is Red, Green, Blue, Black and White.

➁ LCD contrast : This menu displays a contrast value and LCD maker.

9.4.1.3 Battery Info

This menu displays the information of battery, as example battery voltage level and temperature.

In line 2, battery voltage level is displayed with average and instant value.

In line 3. battery temperature value is displayed, but this value is ADC value.

In line 4. Icon number of battery voltage is displayed.

9.4.1.4 Vibrator

This menu can control vibrator on and off operation.

9.4.1.5 Audio

This menu can control MIDI operation

- 97 -

9. ENGINEERING MODE

Model Version

9.4.2 Model Version

This menu displays the Model software version.

Eng Mode

1. Serving Cell

2. Neighbour Cells

3. Reset Information

- 98 -

9. ENGINEERING MODE

9.4.3 Eng Mode

9.4.3.1 Serving Cell

This Menu dispays the the informations of Serving Cell environment.

For example, ARFCN, RF Level etc.

ARFCN : Absolut Radio Frequency Channel Number (Frequency Number) of Serving Cell while Idle mode

RxLev : RX level of Serving Cell while Idle mode

C1 : C1 Value of Serving Cell, This value will be used to decide cell reselection.

C2 : C2 Value of Serving Cell, This value will be used to decide cell reselection.

BPM : Paging period of Serving Cell

ARFCND : Absolut Radio Frequency Channel Number (Frequency Number) of Serving Cell while

Dedicated mode

RxLf : Full RX level of Serving Cell

RxLs : Sub RX level of Serving Cell

RxQf : Full RX qual of Serving Cell

RxQs : Sub RX qual of Serving Cell

DSC : Downlink Signal Counter

RLL : Radio Link Loss Counter

Chtyp : Channel type of Serving Cell

Chmod : Channel Mode of Serving Cell

DTX : Discontinuous Transmission mode of Serving Cell

MCC : Mobile Country Code of Serving Cell

MNC : Mobile Country Code of Serving Cell

LAC : Location Area Code of Serving Cell

CID : Cell ID of Serving Cell

BSIC : Base Tranceiver Station Identity Code of Serving Cell

TxPwrMax : MS_TXPWR_MAX_CCH value of Serving Cell

RxMin : RXLEV_ACCESS_MIN value of Serving Cell

C2vld : C2_VALID value of Serving Cell

CRoff : CELL_RESELECT_OFFSET value of Serving Cell

TMPoff : TEMPORARY_OFFSET value of Serving Cell

PTime : PENALTY_TIME value of Serving Cell

RF# : Number of frequencies in MA(Mobile Allocation)

T3212 : Periodic Location Update Timer

TxPwrLev : Current Tx power of MS

ACC : Access Control Class

Band : Current Band Information

TA : Current Timing Advance

Cipher : Cipher mode of Serving Cell

CBQ : Cell Bar Quality flag of Serving Cell

CBA : Cell Bar Access flag of Serving Cell

- 99 -

9. ENGINEERING MODE

9.4.3.2 Neighbour Cells

This menu displays the informations of Neighbour Cells.

ARFCN : Absolut Radio Frequency Channel Number (Frequency Number) of Neighbour Cell

RxLev : Rx Level of Neighbour Cell

C1 : C1 Value of Neighbour Cell, This value will be used to decide cell reselection.

C2 : C2 Value of Neighbour Cell, This value will be used to decide cell reselection.

MCC : Mobile Country Code of Neighbour Cell

MNC : Mobile Network Code of Neighbour Cell

LAC : Location Area Code of Neighbour Cell

CID : Cell ID of Neighbour Cell

BSIC : Base Tranceiver Station Identity Code of Neighbour Cell

9.4.3.3 Reset Information

This menu displays the information of reset point in source code, call stack.

- 100 -

9. ENGINEERING MODE

Call Timer

9.4.4 Call Timer

This menu displays the time of all calls, including the received calls.

Factory Reset

9.4.5 Factory Reset

This menu is to format data block in the flash memory and this procedure set up the default value in data block.

- 101 -

9. ENGINEERING MODE

MF TEST

1. All auto Test

2. Backlight

3. Audio

4. Vibrator

5. LCD

6. Key Pad

*

7. Mic Speaker

*

8. FM radio

* function is not supported

- 102 -

9. ENGINEERING MODE

9.4.6 MF TEST

This manufacturing mode is designed to do the baseband test automatically.

Selecting this menu will process the test automatically, and phone displays the previous menu after completing the test.

9.4.6.1 All auto Test

LCD, Backlight, Vibrator, Buzzer, Key Pad

9.4.6.2 Backlight

LCD Backlight is on for about 1.5 seconds at the same time, then off.

9.4.6.3 Audio

This menu is to test the volume of Melody. It rings in the following sequence.

Volume 1, Volume 2, Volume 3, Volume 0 (mute), Volume 4, Volume 5.

9.4.6.4 Vibrator

Vibrator is on for about 1.5 seconds.

9.4.6.5 LCD

Main LCD screen resolution tests horizontally and vertically one by one and fills the screen.

9.4.6.6 Key Pad

When a pop-up message shows ‘Press Any Key’, you may press any keys.

If the key is working properly, name of the key is displayed on the screen.

- 103 -

10. CALIBRATION

10. CALIBRATION

10.1 Test Equipment Setup

4.000V 0.0000A

10.2 Calibration Steps

10.2.1 Tune on the phone

10.2.2 Execute “HK_28.exe”

- 104 -

10.2.3 Click “SETTING” Memu

KG278

10.2.4 Setup “Ezlooks” menu such as the following fugure

10. CALIBRATION

- 105 -

10. CALIBRATION

10.2.5 Setup “Line System” menu such as the following fugure

KG278

Adjust the number of times.

10.2.6 Setup Logic operation such as the following figure

KG278

Operation Mode

1. By-Pass: not control by GPIB

2. Normal : control by GPIB

Setup UART Port

PWR : Power Supply

CELL :Call-Test Equipment

- 106 -

10.2.7 Select “MODEL”

10.2.8 Click “START” for RF calibration

KG278

10. CALIBRATION

10.2.9 RF Calibration finish

- 107 -

10. CALIBRATION

10.2.10 Calibration data will be saved to the following folder

- 108 -

11. STAND ALONE TEST

11.1 Test Program Setting

11.1.1 Set COM Port

11.1.2 Check PC Baud rate(115200)

11.1.3 Confirm EEPROM & Delta file prefix name

11. STAND ALONE TEST

11.1.4 Click “V24AT#ON” and then “Update Info” for communicating Phone and Test Program

Not Connected

- 109 -

11. STAND ALONE TEST

Connected

11.1.5 For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the “Reset” bar.

11.1.6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished.

Change "ptest mode"

- 110 -

11. STAND ALONE TEST

11.2 Tx Test

11.2.1 Click “Non signaling mode” bar and then confirm “OK” test in the command line

11.2.2 Put the number of TX Channel in the ARFCN

11.2.3 Select “TX” in the RF mode menu and “PCL” in the PA Level menu

11.2.4 Finally, Click “Write All” bar and try the efficiency test of Phone

- 111 -

11. STAND ALONE TEST

11.3 RX Test

11.3.1 Put the number of RX Channel in the ARFCN

11.3.2 Select “RX” in the RF mode menu

11.3.3 Finally, Click “Write All” bar and try the efficiency test of Phone

- 112 -

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.1 EXPLODED VIEW

21

7

14

12

13

10

22

1

9

4

2

20

15

18

6

17

19

5

23

11

16

3

8

- 113 -

- 114 -

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.2 Replacement Parts

<Mechanic component>

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level

Location

No.

1

Description

GSM,BAR/FILP

2

2

AAAY00

APEY00

ADDITION

PHONE

3

4

ACGK00 COVER ASSY,FRONT

MCJK00 COVER,FRONT

4 MPBG00 PAD,LCD

4 MPBM00 PAD,RECEIVER

4 MTAB00 TAPE,PROTECTION

4

3

4

4

4

4

4

4

MTAD00 TAPE,WINDOW

MWAC00 WINDOW,LCD

SURY00 RECEIVER

ACGM00 COVER ASSY,REAR

ENZY00 CONNECTOR,ETC

MCCZ00 CAP

MCJN00 COVER,REAR

MLAB00 LABEL,A/S

4 MPBN00 PAD,SPEAKER

3

3

3

3

5

GMEY00 SCREW MACHINE,BIND

MBJA00 BUTTON,DIAL

MCCF00 CAP,MOBILE SWITCH

MLAK00 LABEL,MODEL

ADCA00 DOME ASSY,METAL

5 MLAZ00 LABEL

6 SC100 CAN,SHIELD

Part Number

TGSM0050103

AAAY0203337

APEY0429703

ACGK0085205

MCJK0069001 MOLD, PC LUPOY SC-1004A, , , , ,

MPBG0058101

MPBM0016401

MTAB0168901

MTAD0065701

MWAC0077002

SURY0013001

ACGM0086801

ENZY0019901

MCCZ0024001

MCJN0065001

MLAB0000601

MPBN0039901

Specification

COMPLEX, (empty), , , , ,

COMPLEX, (empty), , , , ,

COMPLEX, (empty), , , , ,

COMPLEX, (empty), , , , ,

CUTTING, PMMA MR 200, , , , ,

PIN ,109 dB,32 ohm,11*7 ,3T ,; , , , , , ,CONTACT ,

3 PIN,3 mm,STRAIGHT , ,

MOLD, Urethane Rubber S185A, , , , ,

MOLD, PC LUPOY SC-1004A, , , , ,

HUMIDITY STICKER

COMPLEX, (empty), , , , ,

GMEY0002001 1.4 mm,3 mm,MSWR3(BK) ,B ,+ ,HEAD t=0.6, HEAD d2.7

Black

Black

Without

Color

Without

Color

Color

Black

Black

Black

Black

Black

Without

Color

Without

Color

Without

Color

Without

Color

Black

Remark

7

14

15

20

21

22

18

Black

3

4

8

2

16

23

MBJA0023209 COMPLEX, (empty), , , , ,

MCCF0042301 MOLD, Urethane Rubber S185A, , , , ,

MLAK0006901

ADCA0063901

Black

Black

12

5

10

MLAZ0038301

MCBA0016401

PID Label 4 Array

PRESS, NS, 0.2, , , ,

Without

Color

Without

Color

Without

Color

19

- 115 -

12. EXPLODED VIEW & REPLACEMENT PART LIST

<Main component>

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

5

4

5

4

4

3

4

5

Level

4

Location

No.

Description

SJMY00 VIBRATOR,MOTOR

VIBRATOR,MOTOR

SNGF00 ANTENNA,GSM,FIXED

SUSY00 SPEAKER

SAFY00 PCB ASSY,MAIN

SAFB00 PCB ASSY,MAIN,INSERT

SUMY00 MICROPHONE

SVLM00 LCD MODULE

SAFF00 PCB ASSY,MAIN,SMT

SAFC

PCB ASSY,MAIN,SMT

BOTTOM

BAT100 BATTERY,CELL,LITHIUM

C100

C101

C104

C105

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C106

C107

C108

C109

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C110

C111

C112

C113

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C114

C115

C117

C118

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C119

C120

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

Part Number Specification

SJMY0007903 3 V,0.85 A,4*8 ,Height 5.8T Cylinder ,; ,3V , , ,11000 , , , ,

SJMY0007904 3 V,.1 A,4*8 ,height 5.8mm ,; ,3V , , ,11000 , , , ,

SNGF0022402

3.0 ,-2.0 dBd,, ,internal, GSM900/1800 ,; ,DUAL ,-2.0 ,50

,3.0

SUSY0025801 PIN ,8 ohm,89 dB,16 mm, ,; , , , , , , ,CONTACT

SAFY0193036

SAFB0061605

SUMY0003802 FPCB ,-42 dB,4*1.5 ,

SVLM0024402

MAIN ,128*128 ,35.78*39.7*2.7 ,65k ,CSTN ,TM ,S6B33BG

,1.52" Serial IF Only for CI

SAFF0114336

Color

SAFC0086602

SBCL0001901

3.3 V,0.025 mAh,COIN ,Capacitor type Backup Batt. Pb-Free

,; ,3.3 ,0.025mAh ,COIN

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP

ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0002101 1 uF,10V ,K ,B ,TC ,2012 ,R/TP

Remark

9

11

1

17

13

- 116 -

12. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

6

Location

No.

C121

Description

CAP,CERAMIC,CHIP

6

6

C122

C123

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C124

C125

C126

C127

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C128

C129

C130

C131

C132

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C133

C200

C201

C202

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C203

C204

C209

C210

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C211

C212

C221

C222

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C223

C302

C303

C304

C305

C306

C307

C308

C309

C310

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

Part Number Specification

ECCH0002004 0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000157 15 nF,16V,K,X7R,HD,1005,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001106 4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP

ECZH0001106 4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECCH0006501 10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP

ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

Color Remark

- 117 -

12. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

6

Location

No.

C311

Description

CAP,CERAMIC,CHIP

6

6

C312

C313

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C314

C315

C316

C317

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C319

C320

C321

C322

C323

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C324

C325

C326

C327

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C328

C329

C330

C331

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C332

C333

C335

C336

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C337

C338

C339

C340

C341

C342

C400

C401

C402

C403

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

Part Number Specification

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0006501 10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECCH0006501 10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP

ECCH0006501 10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECCH0003002 10 uF,10V ,Z ,Y5V ,HD ,2012 ,R/TP

ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000104 3 pF,50V,C,NP0,TC,1005,R/TP

ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECCH0003002 10 uF,10V ,Z ,Y5V ,HD ,2012 ,R/TP

ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

- 118 -

Color Remark

12. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

6

Location

No.

C404

Description

CAP,CERAMIC,CHIP

6

6

C405

C406

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C407

C408

C410

C413

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C414

C417

C418

C419

C420

C421

C422

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CN200 CONNECTOR,FFC/FPC

CN301 CONNECTOR,I/O

D300 DIODE,SWITCHING

FB300 FILTER,BEAD,CHIP

FB301 FILTER,BEAD,CHIP

FB302 FILTER,BEAD,CHIP

FL400 FILTER,SEPERATOR

6

6

6

6

6

6

6

6

6

6

6

FL401

J300

L102

L103

L104

L300

L400

L401

L403

L404

Q200

FILTER,SAW,DUAL

CONN,SOCKET

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

TR,BJT,NPN

Part Number Specification

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP

ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0009505 22 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP

ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000104 3 pF,50V,C,NP0,TC,1005,R/TP

ECCH0000104 3 pF,50V,C,NP0,TC,1005,R/TP

ECCH0000104 3 pF,50V,C,NP0,TC,1005,R/TP

ECCH0000104 3 pF,50V,C,NP0,TC,1005,R/TP

ENQY0013801

13 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FPC ,STRAIGHT

,TOP ,SMD ,R/TP ,[empty] ,

ENRY0006401 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type

EDSY0005301 SC-70 ,80 V,0.1 A,R/TP ,

SFBH0008105 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP

SFBH0008105 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP

SFBH0008105 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP

SFAY0010101

850.1900 ,900.1800 ,2.0 dB,2.0 dB,2.0 dB,2.0 dB,ETC

,Dual Band ASM, 2.5x2.5x1.2

SFSB0001401

942.5 MHz,35 MHz,2.1 dB,20 dB,1842.5 MHz,75 MHz,2.3

dB,12 dB,2.0*1.6*0.68 ,SMD

,925M~960M,1805M~1880M,10p,B,150_82,150_15,EGSM

+DCS Rx ,; ,942.5, 1842.5 ,2.0*1.6*0.68 ,SMD ,R/TP

ENSY0018101 6 PIN,ETC , ,2.54 mm,H=1.5

ELCH0001032 18 nH,J ,1005 ,R/TP ,PBFREE

ELCH0004715 27 nH,J ,1005 ,R/TP ,

ELCH0004715 27 nH,J ,1005 ,R/TP ,

ELCH0001556 270 nH,J ,1608 ,R/TP ,

ELCH0004721 2.2 nH,S ,1005 ,R/TP ,

ELCH0001413 22 nH,J ,1005 ,R/TP ,PBFREE

ELCH0001032 18 nH,J ,1005 ,R/TP ,PBFREE

ELCH0003814 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005

EQBN0007101 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY

Color Remark

- 119 -

12. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

6

Location

No.

Q300

Description

TR,BJT,NPN

6

6

R100

R101

RES,CHIP,MAKER

RES,CHIP,MAKER

R102

R104

R105

R106

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R108

R109

R110

R111

R112

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R115

R116

R119

R122

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

R124

R125

R197

R202

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R205

R206

R207

R208

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R210

R222

R223

R300

R301

R302

R303

R304

R305

R306

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

Part Number Specification

EQBN0007101 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY

ERHZ0000506 6800 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000244 22 Kohm,1/16W ,F ,1005 ,R/TP

ERHY0000278 82K ohm,1/16W,J,1005,R/TP

ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0000278 82K ohm,1/16W,J,1005,R/TP

ERHZ0000507 68 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000287 47 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003401 1800 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHY0008402 160 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000702 10 ohm,1/10W ,J ,1608 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

- 120 -

Color Remark

12. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

6

Location

No.

R307

Description

RES,CHIP

6

6

R308

R309

RES,CHIP,MAKER

RES,CHIP,MAKER

R310

R312

R313

R314

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R316

R317

R318

R319

R320

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R321

R323

R324

R326

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R327

R328

R329

R330

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R331

R332

R333

R334

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R335

R336

R337

R338

R339

R341

R343

R344

R345

R401

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

Part Number Specification

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000529 1.5 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000476 39 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000476 39 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000454 27 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000467 330 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000450 240 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

Color Remark

- 121 -

6

6

6

6

6

12. EXPLODED VIEW & REPLACEMENT PART LIST

Color Remark

- 122 -

12. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

Level

6

Location

No.

R203

Description

RES,CHIP,MAKER

6

6

R204

R209

RES,CHIP,MAKER

RES,CHIP,MAKER

R211

R212

R213

R214

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R215

R216

R217

R218

R219

RES,CHIP,MAKER

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

R220

R221

RES,CHIP

RES,CHIP

SPFY00 PCB,MAIN

Part Number Specification

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

SPFY0144601 FR-4 ,.0.8mm,BUILD-UP 4 ,KG270/KG278 Main PCB

Color Remark

- 123 -

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.3 Accessory

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level

3

Location

No.

Description

MCJA00 COVER,BATTERY

3

3

3

Part Number Specification

SSAD00 ADAPTOR,AC-DC

ADAPTOR,AC-DC

MCJA0040301 MOLD, PC LUPOY SC-1004A, , , , ,

SBPL00 BATTERY PACK,LI-ION

BATTERY PACK,LI-ION

SBPL0089503

3.7 V,750 mAh,1 CELL,PRISMATIC ,WLT, BATT, Europe

Label, Pb-Free ,; ,3.7 ,750 ,0.2C ,PRISMATIC ,43x34x46 ,

,ALLTEL SILVER ,Innerpack ,Europe Label

SBPL0088203

3.7 V,750 mAh,1 CELL,PRISMATIC ,GB3 BATT(CMW standard batt), Europe, Pb-Free ,; ,3.7 ,750 ,0.2C

,PRISMATIC ,43x34x46 , ,ALLTEL SILVER ,Innerpack

,Europe Label

SGEY00 EAR PHONE/EAR MIKE SET SGEY0003209

; ,10mW ,16 OHM ,105dB ,10KHZ ,450HZ ,[empty]

,BLACK,EARPHONE HOUSING:SILVER ,18P MMI

CONNECTOR ,MONO18P(5P)LOW COST

SSAD0024901

100-240V ,5060 Hz,5.1 V,.7 A,CB/GOST ,AC-DC

ADAPTOR ,; ,100Vac~350Vac ,5.1V (+0.15, -0.2) ,700mA

,5060 , ,WALL 2P ,I/O CONNECTOR ,

SSAD0024902

100-240V ,5060 Hz,5.2 V,0.7 A,CB/GOST ,AC-DC

ADAPTOR ,; ,100Vac~350Vac ,5.2±0.3V ,700mA ,5060 ,

,WALL 2P ,I/O CONNECTOR ,

Color

Black

Remark

6

- 124 -

Note

Note

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