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Panasonic KX-TG4021 LAT, KX-TG4022 LAT, KX-TG4023 LAT, KX-TGA403 LAT digital cordless phone Service manual
Below you will find brief information for digital cordless phone KX-TG4021LAT, digital cordless phone KX-TG4022LAT, digital cordless phone KX-TG4023LAT, digital cordless phone KX-TGA403LAT. This manual will guide you through the features and functionalities of your new phone. You can easily make calls, manage your call history and enjoy other convenient features. The manual includes detailed information about installation, operation, and troubleshooting.
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ORDER NO. KM41006121CE
Model No.
Telephone Equipment
KX-TG4021LAT
KX-TG4022LAT
KX-TG4023LAT
KX-TGA403LAT
Expandable Digital Cordless Answering
System
T: Black Metallic Version
(for Latin America)
© Panasonic System Networks Co., Ltd. 2010
Unauthorized copying and distribution is a violation of law.
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
2
TABLE OF CONTENTS
PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4.1. US-DECT Description ------------------------------------ 7
4.2. Block Diagram (Base Unit_Main)---------------------- 9
4.3. Block Diagram (Base Unit_RF Part) -----------------10
4.4. Circuit Operation (Base Unit)-------------------------- 11
4.5. Block Diagram (Handset)-------------------------------18
4.6. Block Diagram (Handset_RF Part)-------------------19
4.7. Circuit Operation (Handset)----------------------------20
4.8. Circuit Operation (Charger Unit) ----------------------22
4.9. Signal Route -----------------------------------------------23
5 Location of Controls and Components ------------------25
6 Installation Instructions ---------------------------------------25
7 Operating Instructions-----------------------------------------25
8 Test Mode ----------------------------------------------------------26
8.1. Engineering Mode ----------------------------------------26
9 Service Mode -----------------------------------------------------30
9.1. How to Clear User Setting (Handset Only)---------30
10 Troubleshooting Guide ----------------------------------------31
10.1. Troubleshooting Flowchart -----------------------------31
11 Disassembly and Assembly Instructions ---------------43
11.1. Disassembly Instructions -------------------------------43
11.2. How to Replace the Handset LCD -------------------47
12 Measurements and Adjustments---------------------------48
12.1. Equipment Required -------------------------------------48
12.2. The Setting Method of JIG -----------------------------48
12.3. Adjustment Standard (Base Unit)---------------------51
12.4. Adjustment Standard (Charger Unit)-----------------52
12.5. Adjustment Standard (Handset) ----------------------53
12.6. Things to Do after Replacing IC or X'tal ------------54
12.7. Frequency Table ------------------------------------------56
13 Miscellaneous ----------------------------------------------------57
13.1. How to Replace the Flat Package IC ----------------57
13.2. How to Replace the Shield Case ---------------------59
13.3. How to Replace the LLP (Leadless Leadframe
Package) IC------------------------------------------------61
13.4. Terminal Guide of the ICs, Transistors and
Diodes -------------------------------------------------------63
14 Schematic Diagram ---------------------------------------------64
14.1. For Schematic Diagram---------------------------------64
14.2. Schematic Diagram (Base Unit_Main) --------------66
14.3. Schematic Diagram (Base Unit_Operation) -------68
14.4. Schematic Diagram (Handset_Main) ----------------70
14.5. Schematic Diagram (Charger Unit) -----------------72
15 Printed Circuit Board-------------------------------------------73
15.1. Circuit Board (Base Unit_Main)-----------------------73
15.2. Circuit Board (Base Unit_Operation) ----------------75
15.3. Circuit Board (Handset_Main)-------------------------77
15.4. Circuit Board (Charger Unit) ---------------------------79
16 Exploded View and Replacement Parts List -----------80
16.1. Cabinet and Electrical Parts (Base Unit) -----------80
16.2. Cabinet and Electrical Parts (Handset) -------------81
3
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
PAGE
16.3. Cabinet and Electrical Parts (Charger Unit) ------- 82
16.4. Accessories------------------------------------------------ 83
16.5. Replacement Parts List--------------------------------- 84
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
1 Safety Precautions
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacturer’s Instructions.
2.2.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50
°F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with temperature control and adjust it to 700
°F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100
°F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the opposite side (See the figure below).
4
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3.
Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
5
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
3 Specifications
Note:
• Design and specifications are subject to change without notice.
Note for Service:
• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
• Analog telephone connection: Telephone Line
6
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
4 Technical Descriptions
4.1.
US-DECT Description
The frequency range of 1.91 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same frequency. Refer to Frequency Table (P.56).
4.1.1.
TDD Frame Format
4.1.2.
TDMA system
This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy bearer use.
In 1 slot 417
µs, the 10 ms of voice data is transmitted.
• 2 - Handsets Link
Traffic Bearer
A link is established between base unit and handset.
The state where duplex communication is performed.
Handset doesn't make up duplex in no free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF parts, it is better in least interference condition.
7
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
4.1.3.
Signal Flowchart in the Radio Parts
Reception
A voice signal from TEL line is encoded to digital data "TXDATA" by BBIC (IC501) in a base unit.
Then TXDATA goes to RF PART and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.
As for a handset RF, RF signal is received in one antenna.
BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".
BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
A voice signal from microphone is encoded to digital data "TXDATA" by BBIC (IC1) in a handset.
Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a antenna.
As for a base unit RF, RF signal is received in two antennas.
BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.
8
4.2.
Block Diagram (Base Unit_Main)
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
3 KEY 1
KEY C, D, E
SPOUTP
SPOUTN
MSG_LED
ANS_LED
CLK,DO
DL,CS
STM/CKM
WP
SCL, SDA
VCCA
9
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
4.3.
Block Diagram (Base Unit_RF Part)
ANT1
ANT2
ANT2
TXp
TXn
DA801
TXON
RXON
RXp
RXn
KX-TG4021/4022/4023 BLOCK DIAGRAM (Base Unit_RF Part)
ANT1
10
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
4.4.
Circuit Operation (Base Unit)
General Description:
(BBIC, Flash Memory, EERROM) is a digital speech/signal processing system that implements all the functions of speech compression, record and playback, and memory management required in a digital telephone answering machine.
The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions as follows.
4.4.1.
BBIC (Base Band IC: IC501)
• Voice Message Recording/Play back
The BBIC system uses a proprietary speech compression technique to record and store voice message in Flash Memory.
An error correction algorithm is used to enable playback of these messages from the Flash Memory.
• DTMF Generator
When the DTMF data from the handset is received, the DTMF signal is output.
• Synthesized Voice (Pre-recorded message)
The BBIC implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.
• Caller ID demodulation
The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.
• Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the
Telephone line, etc. They are determined by the signal path route operation of voice signal.
• Block Interface Circuit
RF part, LED, Key scan, Speaker, Telephone line.
4.4.2.
Flash Memory (IC601)
Following information data is stored.
• Voice signal ex: Pre-recorded Greeting message, Incoming message
4.4.3.
EEPROM (IC611)
Following information data is stored.
• Settings ex: message numbers, ID code, Flash Time, Tone/Pulse
11
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
4.4.4.
Power Supply Circuit/Reset Circuit
The power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is insulated from VBAT by Doubler of BBIC.
Circuit Operation:
12
4.4.4.1.
Charge Circuit
The voltage from the AC adaptor is supplied to the charge circuits.
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
13
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
4.4.5.
Telephone Line Interface
Telephone Line Interface Circuit:
Function
• Bell signal detection
• ON/OFF hook and pulse dial circuit
• Side tone circuit
Bell signal detection and OFF HOOK circuit:
In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T) and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
T
→ L101 → R111 → C111 → Q111 → BBIC pin 5 [BELL]
When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through the circuit). Following signal flow is the DC current flow.
T
→ L101 → D101 → Q141 → Q161 → R163 → R167 → D101 → L102 → P101 → R
ON HOOK Circuit:
Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an onhook condition.
Pulse Dial Circuit:
Pin 6 of BBIC turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is canceled by the canceller circuit of BBIC.
14
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
4.4.6.
Parallel Connection Detect Circuit/Auto Disconnect Circuit
Function:
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone connected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook, the voltage is monitored at pin 17 of IC501. There is no parallel connection if the voltage is
0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:
When off hook, the voltage is monitored at pin 18 of IC501; the presence/absence of a parallel connection is determined by detecting the voltage changes.
If the Auto disconnect function is ON and statuses are Hold, receiving ICM, OGM transmitting, BBIC disconnects the line after detecting parallel connection is off hook.
15
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
4.4.7.
Calling Line Identification (Caller ID)/Call Waiting Caller ID
Function:
Caller ID
The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK
(Frequency Shift Keying) * format. Data
"
1
"
is a 1200 Hz sine wave, and data
"
0
"
is a 2200 Hz sine wave. There are two types of the message format which can be received: i.e. the single message format and plural message format. The plural message format allows to transmit the name and data code information in addition to the time and telephone number data.
*: Also the telephone exchange service provides other formats.
16
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
Call Waiting Caller ID
Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call, to receive information about a calling party on a waited call. The transmission of the calling information takes place almost immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new call.
Function:
The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and
MARK data pass the following route.
Telephone Line
→ P101 → L101, L102 → C121, C122 → R121, R122 → IC501 (25, 24).
If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the information for the second and subsequent callers is not displayed on the portable handset display.
17
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
4.5.
Block Diagram (Handset)
3V
IC3
EEPROM
X1
10.368 MHz
BATTERY
CHARGE
Q4
D7
BATTERY
D1
BATTERY
Q2
1.8V
3V
LED
(KEY)
Q7
MIC
Receiver
C144
CHG_DET
CHG_CTL
RESET
Power_adj
TXn
TXp
VDD_PADRV
PSEL
PON
TXON
RXON
RF_RXn
RF_RXp
3V
AVD
LD0_CTRL
IC1
BBIC
CP_VOUT2
BATTERY
VDDPA
MICp
MICn
1.8V
LSRp
LSRn
VDD2
VDD1
KEY_LED
3V
LED
(BELL)
Monitor SP
CKM/STM
BELL_LED
PAOUTp
PAOUTn
CKM//STM
3V
LCD
KEYS
ANT1
IC801
RF PART
KX-TGA403 BLOCK DIAGRAM (Handset)
18
4.6.
Block Diagram (Handset_RF Part)
ANT
DA801
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
TXON
RXON
RF_RXn
RF_RXp
KX-TGA403 BLOCK DIAGRAM (Handset_RF Part)
19
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
4.7.
Circuit Operation (Handset)
4.7.1.
Outline
Handset consists of the following ICs as shown in Block Diagram (Handset) (P.18).
• DECT BBIC (Base Band IC): IC1
- All data signals (forming/analyzing ACK or CMD signal)
- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)
- PLL Oscillator
- Detector
- Compress/Expander
- Reception
• RF Power Amp: IC801
- Amplifier for transmission
• EEPROM: IC3
- Temporary operating parameters (for RF, etc.)
4.7.2.
Power Supply Circuit/Reset Circuit
Circuit Operation:
When power on the Handset, the voltage is as follows;
BATTERY(2.2 V ~ 2.6 V: BATT+)
→ F1 → Q2 (1.8 V), IC1-43pin (2.5V)
The Reset signal generates IC1 (61 pin) and 1.8 V.
20
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
4.7.3.
Charge Circuit
Circuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;
DC+(6.5 V)
→ F301 → R371 → R372 →CHARGE+(Base) → CHARGE+(Handset) → Q4 → D7→ F1 → BATTERY+... Battery...
BATTERY-
→ R45 → GND → CHARGE-(Handset)→ CHARGE-(Base) → GND → DC-(GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q9 of Handset.
Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.12).
4.7.4.
Battery Low/Power Down Detector
Circuit Operation:
“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
• Battery Low
Battery voltage: V(Batt) 2.25 V ± 50 mV
The BBIC detects this level and "
• Power Down
" starts flashing.
Battery voltage: V(Batt) 2.0 V ± 50 mV
The BBIC detects this level and power down.
4.7.5.
Speakerphone
The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.
21
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
4.8.
Circuit Operation (Charger Unit)
Charge control is executed at handset side so that the operation when using charger is also controlled by handset.
Refer to Circuit Operation (Handset) (P.20)
The route for this is as follows: DC+pin of J1(+)
→ F1 → R1 → CHARGE+pad → Handset → CHARGE-pad → DC-pin of J1(-).
22
4.9.
Signal Route
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
23
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
RF part signal route
24
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
5 Location of Controls and Components
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
6 Installation Instructions
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
7 Operating Instructions
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
25
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
8 Test Mode
8.1.
Engineering Mode
8.1.1.
Base Unit
26
Frequently Used Items (Base Unit)
ex.)
Frequency
ID
Items Address
00 07 / 00 08
Default Data
00/01
00 02 ~ 00 06 Given value
-
-
New Data
-
-
Note:
(*1) When you enter the address or New Data, please refer to the table below.
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
Remarks
Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the computer system.
Desired Number (hex)
0
1
.
.
.
9
Input Keys
0
1
.
.
.
9
Desired Number (hex)
A
B
C
D
E
F
Input Keys
[Flash] + 0
[Flash] + 1
[Flash] + 2
[Flash] + 3
[Flash] + 4
[Flash] + 5
27
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
8.1.2.
Handset
28
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
Frequently Used Items (Handset)
ex.)
Items
Battery Low
Frequency
ID
Address
00 11 / 00 12
00 07 / 00 08
00 02 ~ 00 06
Default Data
00 / 00
00 / 01
Given value
New Data
-
-
-
Possible Adjusted
Value MAX (hex)
-
-
-
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Possible Adjusted
Value MIN (hex)
-
-
-
Remarks
(*2)
Desired Number (hex.)
0
1
.
.
.
9
Input Keys
0
1
.
.
.
9
Desired Number (hex.)
A
B
C
D
E
F
Input Keys
[Flash] + 0
[Flash] + 1
[Flash] + 2
[Flash] + 3
[Flash] + 4
[Flash] + 5
(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the handset.
29
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
9 Service Mode
9.1.
How to Clear User Setting (Handset Only)
Handset
Press , , , simultaneously until a beep sound is heard. Then single handset is initialized.
(The contents of user setting are reset to factory default)
*Usage time is not cleared.
30
10 Troubleshooting Guide
10.1. Troubleshooting Flowchart
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
Cross Reference:
Check Power (P.32)
Check Playback (P.34)
Check Record (P.33)
Check Battery Charge (P.34)
Check Link (P.35)
Check the RF part (P.37)
Check Handset Transmission (P.42)
Check Handset Reception (P.42)
Check Caller ID (P.42)
31
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
10.1.1. Check Power
10.1.1.1. Base Unit
Cross Reference:
Power Supply Circuit/Reset Circuit (P.12)
10.1.1.2. Handset
Note:
BBIC is IC501.
(*1) Refer to Specifications (P.6) for part number and supply voltage of AC adaptor.
(*2) Refer to Circuit Board (Base Unit_Main) (P.73).
Cross Reference:
Power Supply Circuit/Reset Circuit (P.20)
32
10.1.2. Check Record
10.1.2.1. Base Unit
A) Not record Incoming Message
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
Cross Reference:
Signal Route (P.23)
Telephone Line Interface (P.14)
Parallel Connection Detect Circuit/Auto Disconnect
Circuit (P.15)
Note:
Flash Memory is IC601.
BBIC is IC501.
33
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
10.1.3. Check Playback
10.1.3.1. Base Unit
Cross Reference:
Power Supply Circuit/Reset Circuit (P.12)
10.1.4. Check Battery Charge
10.1.4.1. Base Unit
Note:
Flash Memory is IC601.
BBIC is IC1.
(*1) Refer to Circuit Board (Base Unit_Main) (P.73).
Cross Reference:
Charge Circuit (P.13)
10.1.4.2. Handset
Cross Reference:
Check Power (P.32)
Charge Circuit (P.21)
10.1.4.3. Charger Unit
Cross Reference:
Charge Circuit (P.21)
34
10.1.5. Check Link
10.1.5.1. Base Unit
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
Cross Reference:
Power Supply Circuit/Reset Circuit (P.12)
Check the RF part (P.37)
Note:
*1 How to adjust +3.0V:
Execute the command "VDA"
Refer to Things to Do after Replacing IC or X'tal (P.54) for Base Unit.
*2 How to adjust the frequency of X501:
To see the frequency, execute the command “SFR“, then check the TP_CKM (IC501-57pin).
To adjust frequency, send command “SFR “ until the frequency counter becomes13.824 MHZ±55HZ.
35
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
10.1.5.2. Handset
Cross Reference:
Power Supply Circuit/Reset Circuit (P.20)
Check the RF part (P.37)
Note:
*1 How to adjust the frequency of X1:
To see the frequency, execute the command “SFR“, then check the TP_CKM (IC1-46pin).
To adjust frequency, send command “SFR “ until the frequency counter becomes10.368 MHz±55HZ.
Refer to Things to Do after Replacing IC or X'tal (P.55) for Handset.
36
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
10.1.6. Check the RF part
10.1.6.1. Finding out the Defective part
After All the Checkings or Repairing
1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.
Note:
(*1) HS: Handset
(*2) BU: Base Unit
37
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
10.1.6.2. RF Check Flowchart
Each item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.39).
Please refer to the each item.
Note:
(*1) Refer to Check Link (P.35).
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KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
10.1.6.3. Check Table for RF part
No.
Item
1 Link Confirmation Normal
HS, BU Mode [Normal Mode]
2
X
' tal Frequency confirmation
BU (Base Unit) Check
1. Register Regular HS to BU (to be checked).
2. Press [Talk] key of the Regular HS to establish link.
Check X
' tal Frequency.
(13.824000 MHz ±100 Hz)
HS, BU Mode: [Adjustment]
3 TX confirmation
Regular HS (BU) Mode:
[Test RX Mode]
1. Place Regular HS 15 cm away from a checked BU.
2. Confirm "TXDATA" waveform of BU (*1) and “RXDATA“ waveform of Regular HS by
Digital Oscilloscope.
BU (HS) Mode:
[Test TX_Burst Mode]
4 RX confirmation
Regular HS (BU) Mode:
[Test TX_Burst Mode]
1. Place Regular HS 15 cm away from a checked BU.
2. Confirm "RXDATA" waveform of BU (*1) and “TXDATA“ waveform of Regular HS by
Digital Oscilloscope.
BU (HS) Mode:
[Test RX Mode]
5 Range Confirmation Normal
HS, BU Mode: [Normal Mode]
1. Register Regular HS to BU (to be checked).
2. Press [Talk] key of the Regular HS to establish link.
3. Compare the range of the BU (being checked) with that of the Regular BU.
Note:
(*1) Adjustment Standard (Base Unit) (P.51)
(*2) Adjustment Standard (Handset) (P.53)
HS (Handset) Check
1. Register HS (to be checked) to Regular
BU.
2. Press [Talk] key of the HS to establish link.
Check X
' tal Frequency.
(10.368000 MHz ±100 Hz)
1. Place Regular BU 15 cm away from a checked HS.
2. Confirm "TXDATA" waveform of HS (*2) and "RXDATA" waveform of Regular BU by
Digital Oscilloscope.
1. Place Regular BU 15 cm away from a checked HS.
2. Confirm "RXDATA" waveform of HS (*2) and "TXDATA" waveform of Regular BU by
Digital Oscilloscope.
1. Register HS (to be checked) to Regular
BU.
2. Press [Talk] key of the HS to establish link.
3. Compare the range of the HS (being checked) with that of the Regular HS.
39
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
10.1.6.4. TEST RANGE Check
Circuit block which range is defective can be found by the following check.
Item
Range Confirmation TX TEST
(TX Power check)
BU (Base Unit) Check
1. Register Regular HS to BU (to be checked).
HS (Handset) Check
1. Register HS (to be checked) to Regular BU.
HS, BU setting
Checked unit: Low TX power (*1)
Regular unit: High TX power (*1)
2. Set TX Power of the BU and the Regular HS according to CHART1.
3. At distance of about 20m between HS and BU,
Link OK = TX Power of the BU is OK.
No Link = TX Power of the BU is NG.
1. Register Regular HS to BU (to be checked).
2. Set TX Power of the HS and the Regular BU according to CHART1.
3. At distance of about 20m between HS and BU,
Link OK = TX Power of the HS is OK.
No Link = TX Power of the HS is NG.
1. Register HS (to be checked) to Regular BU.
Range Confirmation RX TEST
(RX sensitivity check)
HS, BU setting
Checked unit: High TX power (*1)
Regular unit: Low TX power (*1)
2. Set TX Power of the BU and the Regular HS according to CHART1.
3. At distance of about 20m between HS and BU,
Link OK= RX Sensitivity of the BU is OK.
No Link = RX Sensitivity of the BU is NG.
2. Set TX Power of the Checking HS and the Regular BU according to CHART1.
3. At distance of about 20m between HS and BU,
Link OK= RX Sensitivity of the HS is OK.
No Link = RX Sensitivity of the HS is NG
CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST
BU (Base Unit) TX Power Check
BU (Base Unit) RX Sensitivity Check
BU (to be checked)
TX Power
Low
High
Regular_HS
TX Power
High
Low
HS (Handset) TX Power Check
HS (Handset) RX Sensitivity Check
Note:
(*1) Refer to Commands (P.50).
HS (to be checked)
TX Power
Low
High
Regular_BU
TX Power
High
Low
40
10.1.7. Registering a Handset to the Base Unit
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
10.1.8. Deregistering a Handset
10.1.9. Deregistering All Handsets by the Base Unit
41
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
10.1.10. Check Handset Transmission
Cross Reference:
Signal Route (P.23)
10.1.11. Check Handset Reception
Cross Reference:
Signal Route (P.23)
Note:
When checking the RF part, Refer to Check the RF part
(P.37).
10.1.12. Check Caller ID
Cross Reference:
Telephone Line Interface (P.14)
Calling Line Identification (Caller ID)/Call Waiting Caller
ID (P.16)
Note:
• Make sure the format of the Caller ID service of the
Telephone company that the customer subscribes to.
• It is also recommended to confirm that the customer is really a subscriber of the service.
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KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
11 Disassembly and Assembly Instructions
11.1. Disassembly Instructions
11.1.1. Base Unit
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KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
44
11.1.2. Handset
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
45
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
11.1.3. Charger Unit
46
11.2. How to Replace the Handset LCD
Note:
The illustrations are simplified in this page.
They may differ from the actual product.
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
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KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
12 Measurements and Adjustments
This chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in
Troubleshooting Guide (P.31)
12.1. Equipment Required
• Digital multi-meter (DMM): it must be able to measure voltage and current.
• Oscilloscope.
• Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; ±4 ppm)
Hewlett Packard, 53131A is recommended.
• DECT tester: Rohde & Schwarz, CMD 60 is recommended.
This equipment may be useful in order to precisely adjust like a mass production.
12.2. The Setting Method of JIG
<Preparation>
• Serial JIG cable: PQZZ1CD300E*
• PC which runs in DOS mode
• Batch file CD-ROM for setting: PNZZTG4021LA
Note:
*: If you have the JIG Cable for TCD500 series
(PQZZ1CD505E), change the following values of resistance. Then you can use it as a JIG Cable for both
TCD300 and TCD500 series. (It is an upper compatible JIG
Cable.)
R2
R3
R4
R7
Resistor Old value (k
Ω) New value (kΩ)
22 3.3
22
22
4.7
3.3
4.7
10
12.2.1. Connections (Base Unit)
Connect the AC adaptor.
Connect the JIG Cable GND (black).
Connect the JIG Cable RX (red) and TX (yellow).
Note:
*: COM port names may vary depending on what your PC calls it.
48
12.2.2. Connections (Handset)
Connect the DC Power or Battery to BATT+ and BATT-.
Connect the JIG cable GND (black) to GND.
Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
Note:
*: COM port names may vary depending on what your PC calls it.
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KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
12.2.3. How to install Batch file into P.C.
Note:
• “*****” varies depending on the country or models.
12.2.4. Commands
See the table below for frequently used commands.
Command name rdeeprom readid writeid hookoff hookon getchk wreeprom
Function
Read the data of EEPROM
Read ID (RFPI)
Write ID (RFPI)
Off-hook mode on Base
On-hook mode on Base
Read checksum
Write the data of EEPROM
Example
Type “rdeeprom 00 00 FF”, and the data from address
“00 00” to “FF” is read out.
Type “readid”, and the registered ID is read out.
Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E
98” is written.
Type “hookoff”.
Type “hookon”.
Type “getchk”.
Type “wreeprom 01 23 45”. “01 23” is address and “45” is data to be written.
50
12.3. Adjustment Standard (Base Unit)
When connecting the simulator equipment for checking, please refer to below.
12.3.1. Bottom View
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
L361
F301
4
C142
C301
R301
D142
R165
C167
R507
R512
D143
R162
RA502
C479
3
R305
C307
R304
R307
C601
C512
C513
C184
R181
C186
R163
R601
R607
C475
C473
C472
C123
C133
R604
C521
R503
C332
C151
C124
C120
C525
R334
R167
C168
C115
C611
R505
C524
R506
R122
C126
Note:
(*1) is referred to No.2 of Check Check Table for RF part (P.39)
(*2) is referred to Power Supply Circuit/Reset Circuit (P.12)
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KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
12.4. Adjustment Standard (Charger Unit)
When connecting the simulator equipment for checking, please refer to below.
12.4.1. Bottom View
Digital
Volt Meter
12 /2 W
J1
1
2
A
DC POWER
DC 6.5 V
52
12.5. Adjustment Standard (Handset)
When connecting the simulator equipment for checking, please refer to below.
12.5.1. Component View
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
KX-TGA650XX
KX-TGA651XX
KX-TGA250XX
KX-TGA251XX
KX-TGA403XX
PNLB1734Y
PbF
TP_ANT1
TGA650XX
TGA651XX
C175
C70
C152
C71
R578
TGA250XX
TGA251XX
TGA403XX
C106
C104
C107
C103
R53
D21
R50
R231
C201
C200
C105
R236
C206
C203
R54
D22
BLK
BLK
C804
C811
C813
L802
C802
C837
C814
C
80
8
R805
R802
RED
C863
D14
C864
RA800
D13
R801
R808
C880
C73
C72
R880
C834
STM
R405
C44
R225
JTAG
R63
R66
1
R807
R203
C43
Q400
R402
D400
R400
C10
1.8V
RA4
C400
Q401
R27
C48
C40
C54
C52
C53
C55
R23
21
CLK
R37
R36
R249
C51
CP4.0V
C39 C30
R248
R20
CP3.0V
RA40
POWER
RECEIVER
RED
C332
Q12
Q11
R330
C342
R332
R331
C331
8
1
IC3
5
4
E
C341
C340
D7
R2
BATT+
F1
R30
R7
C147
R4
R8
R3
CHG(+)
C5
D3
C113
D4
CHG(-)
RCV-
RCV+
URX
MIC+
MIC-
BAT
UTX
GND
BATT-
A
MIC+ MIC-
Note:
(*1) is referred to No.2 of Check Check Table for RF part (P.39)
(*2) is referred to Power Supply Circuit/Reset Circuit (P.20)
CLK
CP 4.0V
CP 3.0V
1.8V
+
+
RX
TX
GND
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KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
12.6. Things to Do after Replacing IC or X'tal
If repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustment data, etc. in memory.
The set doesn't operate if it is not executed.
12.6.1. How to download the data
12.6.1.1. Base Unit
First, operate the PC setting according to The Setting Method of JIG(P.48).
Then download the appropriate data according to the following procedures.
EEPROM (IC611)
X'tal (X1)
Items
Adjusted parameter data is stored in memory.
(country version batch file, default batch file, etc.)
System clock
How to download/Required adjustment
1) Change the address “0001” of EEPROM to “55” to download the data.
2) Default batch file: Execute the command “default.bat”.
3) Country version batch file: Execute the command
“TG4021USLArevXXX_YYY.bat”. (*1)
4) Clock adjustment
Clock adjustment data is in EEPROM, adjust the data again after replacing it.
1) Apply 6.5V between DCP ad DCM with DC power.
2) Input Command "sendchar sfr", then you can confirm the current value.
3) Check X'tal Frequency.(13.824 MHz ± 100 Hz).
4) If the frequency is not 13.824 MHz ± 100 Hz, adjust the frequency of CLK executing the command "sendchar sfr xx xx
(where xx is the value)" so that the reading of the frequency counter is 13.824000 MHz ± 15 Hz.
Note:
(*1) XXX_YYY: revision number
“XXX”, “YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.48).
54
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
12.6.1.2. Handset
First, operate the PC setting according to The Setting Method of JIG (P.48).
Then download the appropriate data according to the following procedures.
EEPROM (IC3)
Battery Monitor Check
Battery Clock Adjustment
(X1)
Items
Adjusted parameter data is stored in memory.
(country version batch file, default batch file, etc.)
How to download/Required adjustment
1) Default batch file: Execute the command “default.bat”.
2) Default batch file (remaining): Execute the command
“TGA402USDEFrevXXX_YYY.bat”. (*2)
3) Country version batch file: Execute the command
“TGA402USLArevXXX_YYY.bat”. (*2)
4) Clock adjustment
5) 2.35 V setting and battery low detection
Battery Low Confirmation
-
-
CLK
1) Apply 2.25 V between BATT+ and BATT-.
2) Execute the command
sendchar PAD
sendchar LED 0
sendchar CRX 0 1
sendchar AD1
It assumes that the return value is XX.
a) 6c XX 71: No need to adjust
b) XX: 6A ~ 6B: Need to adjust
XX: 72 ~ 74: Need to adjust
Write AD value of 2.25 V to EEPROM.
ex) read data: XX = 6A, write data:YY = 6A
read data: XX =73, write data: YY = 73
EEPROM = 0009 (Low Voltage) write “YY“
Execute the command “wreeprom 00 09 01 YY“.
EEPROM = 000A (No Voltage) write “YY - 1D“
Execute the command “xwreeprom 00 0A 01 ZZ“.
Note:
No Voltage writing data limit is “00“.
c) XX: 00 ~ 69: Reject
XX: 75 ~ FF: Reject
1) Apply 2.40 V between BATT+ and BATT-.
2) Confirm that there is no flashing of Battery lcon.
3) Apply 2.25 V ± 0.08 V between BATT+ and BATT-.
4) Confirm that there is flashing of Battery lcon.
1) Apply 2.6 V between BATT+ and BATT- with DC power.
2) Input Command “sendchar sfr“, then you can confirm the current value.
3) Check X’tal Frequency. (10.368 MHz ± 100 Hz).
4) If the frequency is not 10.368 MHz ± 100 Hz, adjust the frequency of CLK execute in the command “sendchar sfr xx xx (where xx is the value)“ so that the reading of the frequency counter is 10.368000 MHz ± 5 Hz.
Note:
(*2) XXX_YYY: revision number
“XXX” and “YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.48).
55
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
12.7. Frequency Table
Channel 0
Channel 1
Channel 2
Channel 3
Channel 4
Ch. (hex)
00
01
02
03
04
TX/RX Frequency (MHz)
1928.448
1926.720
1924.992
1923.264
1921.536
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KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
13 Miscellaneous
13.1. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
13.1.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700
°F ± 20 °F (370 °C ± 10 °C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity
→ 0.82.
Type
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4)
13.1.2. How to Remove the IC
1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is left at the joint on the board, the new IC will not be attached properly.
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KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
13.1.3. How to Install the IC
1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
13.1.4. How to Remove a Solder Bridge
1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
58
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
13.2. How to Replace the Shield Case
13.2.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700
°F ± 20°F (370°C ± 10°C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608
°F ± 68°F (320°C ± 20°C)
13.2.2. Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.2.3. How to Remove the Shield Case
Note:
If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.
1. Cut the case along perforation.
2. Remove the cut part.
3. Cut the four corners along perforation.
4. Remove the reminds by melting solder.
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KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
13.2.4. How to Install the Shield Case
Note:
• If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.
• Shield case’s No. : PNMC1013Z
1. Put the shield case.
2. Solder the surroundings.
60
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
13.3. How to Replace the LLP (Leadless Leadframe Package) IC
Note:
This description is only applied on the model with Shield case.
13.3.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700
°F ± 20 °F (370 °C ± 10 °C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608
°F ± 68 °F (320 °C ± 20 °C)
13.3.2. Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.3.3. How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the P.C.Board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely.
Note:
• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the
P.C.Board.
3. After removing the IC, clean the P.C.Board of residual solder.
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KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
13.3.4. How to Install the IC
1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached.
2. Place the solder a little on the land where IC pins are to be attached, then place the IC.
Note:
• When placing the IC, the positioning should be done very carefully.
3. Heat the IC with a hot air desoldering tool through the P.C.Board until the solder on IC bottom is melted.
Note:
• Be sure to place it precisely, controlling the air volume of the hot air desoldering tool.
4. After soldering, confirm there are no short and open circuits with visual inspection.
13.3.5. How to Remove a Solder Bridge
When a Solder Bridge is found after soldering the bottom of the IC, remove it with a soldering iron.
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KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
13.4. Terminal Guide of the ICs, Transistors and Diodes
13.4.1. Base Unit
13.4.2. Handset
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KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
14 Schematic Diagram
14.1. For Schematic Diagram
14.1.1. Base Unit (Schematic Diagram (Base Unit_Main))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.2. Handset (Schematic Diagram (Handset_Main))
Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.3. Charger Unit (Schematic Diagram (Charger Unit))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
64
Memo
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
65
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
14.2. Schematic Diagram (Base Unit_Main)
ANT2
CL2
ANT2
GND
C894
2.2p
W 0.2mm
L 10mm
1st layer
C892
5p
W 0.2mm
L mm
1st layer
GND
R807
470
W 0.15mm
L 20mm
3rd layer
GND
C822
10p
GND
C827
10p
C826
10p
RXON
RXn
C820
1.5p
RXp
GND
CL1
ANT1
GND
C893
3p
W 0.2mm
L 10mm
1st layer
GND
GND
1
3
2
DA802
W 0.2mm
L mm
1st layer
C891
5p
C895
GND
1.2p
C896 C859
2.2p
2.2p
GND
GND
GND
3
DA801
2
1
W 0.15mm
L 20mm
3rd layer
W 0.15mm
L 5.0mm
1st layer
L809
7.5n
W 0.15mm
L 5.0mm
1st layer
C825
10p
GND
R806
470
GND
C812
0.9p
W 0.2mm
L 10.0mm
1st layer
GND
GND
GND
C811
10p
C810
2.4p
GND
10
2APVCC
MSG_LED
ANS_LED
NC
KEYIN1
KEYIN2
KEYIN3
KEYS_C
KEYS_D
KEYS_E
1
VBAT
*R651
*R652
680
680
*WBX01 10pin
PARALLEL WIRE
AP1
*Q651
5
C1 B1
1
E
2
4
C2 B2
3
MSG_LED
ANS_LED
KEYIN1
KEYIN2
KEYIN3
KEYS_C
KEYS_D
KEYS_E
2
*SW1
1
NC
*C661
NC
C805
2.7p
GND
GND
C806
2.7p
TXp
TXn
VBAT
ANT1
TXON
TXn
TXp
RXp
RXn
RXON
ANT2
TO RF BLOCK
VBAT
TXON
ANT1
(1)
(2)
(3)
(4)
* Start Monitor
* When "SFR" command
is executed, 13.824MHz
frequency will be output.
FCT
+3.0V
JTAG_TDO
JTAG_TDI
JTAG_TCK
JTAG_TMS
JTAG_RTCK
RSTN
STM/CKM/P15
GND
RA501 33
7
8
5
6
4
3
2
1
C516 0.1u
C517 0.1u
C518 0.1u
61
62
63
58
59
60
64
65
66
54
55
56
57
51
52
53
48
49
50
45
46
47
TXp
RXp
RXn
GND_RF
TRSW_p
ANT_n
ATST_n
ATST_p
TEST
RSTN
NC
VCC_VCO
GPIO[27]
VDDUSB
DM_USB/GPI28
DP_USB/GPI29
VDDC1
JTAG_TDO
JTAG_TDI
JTAG_TCK
JTAG_TMS
JTAG_RTCK
*IC501
VDDC
RA502
10k
+3.0V
(5)
(6)
NC: No Components
66
SPN
SPP
+3.0V
R160
910
C
R172
100k
C173
C175 1000p
K0.22u
B
Q171
E
C174 NC
R181
0
Rx
C165 NC
E
C
Q161
B
C163 NC
R164
2.7k
R161
100k
Tx
C184
K1.0u
R151
100k
Q143
NC
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
Q141
R141
100k
REFERENCE
1XX : TEL LINE
3XX : POWER, CHARGE
4XX : MIC, SP
5XX : BBIC
6XX : FLASH, EEPROM, KEY, LCD
7XX : FOR DK
8XX : RF
Q142
B
C
E
C101 680p
D101
3 2
4 1
C102 680p
C115
NC
R115
NC
L101
33u
L102
33u
L1T
(YELLOW)
P101 22
L1R
(GREEN)
GAP
(1)
(2)
(3)
(4)
(5)
(6)
X501
13.824M
R509 NC
C120
1000p
3.0V
+3.0V
+3.0V
R121 390k C121 680p
R122 390k C122 680p
Caller ID
VDDC
HOOK
+3.0V
Bell
+6.5V
+6.5V
F301
3.0A
DCP
*IC501
GND
+3.0V
*IC601
8M FLASH
1
*CE
2
SO
3
*WP
4
VSS
VDD
*HOLD
SCK
SI
8
7
6
5
C
*C601 0.1u
E
R602
NC
B
Q601
NC
R603
NC
VCCA
VBG
VREF C505
MIN
VCCA
VREF
DCIN3/LIN1
DCIN2
DCIN1
DCIN0/LIN0
DOUBOUT
DOUBCAPP1
DOUBCAPP
DOUBCAPN
DOUBCAPN1
VBAT
COREOUT
VDDC2
GPIO[26]
GPIO[25]
GPIO[24]
GPIO[23]
GPIO[22]
GPIO[21]
GPIO[20]
19
18
17
16
15
14
22
21
20
10u
C506
1u
3
2
1
6
5
4
9
8
7
13
12
11
C504
C521
10
1u
1u
C502
10u
C524 NC
VDDC
C501
0.1u
4
3
VDDC
+3.0V
2
R136
NC
3
1
RA151
1k
4
L501
100n
1
2
RA504
68
PDN_DET
HOOK
BELL
KEYS_E
KEYS_D
KEYS_C
UTX
URX
BELL
C
Q111
B
E
3.0V
+3.0V
VBAT
VBAT
IC302
2
4
VOUT1
INPUT
VOUT2
ADJ
1
3
VBAT +6.5V
DCDC_OUT
*L361
220nH
*L371
220nH
L362
NC
L372
NC
JJ301 NC
DC/DC CONVERTOR
L301
NC
Q301 NC
1.2V
PDN_DET
R335
0
*IC331
2.7V
1
VOUT VIN
2
3
NC
VSS
4
2
1
IC301
NC
ON/*OFF
VIN
5
VSS
3
VOUT
EXT
4
DCDC_IC
+3.0V
C611 0.1u
IC611
64K EEPROM
1
A0
2
A1
3
A2
4
GND
VCC
WP
SCL
SDA
8
7
6
5
R605
R606
3.3k
3.3k
GND GND
ZA1 NC
11
12
10 9 8 7
6
1 2 3 4 5
DCM
CHARGE+
CHARGE-
CHG+2
CHG-2
+6.5V
NC: No Components
KX-TG4021/4022/4023LA SCHEMATIC DIAGRAM (Base Unit_Main)
67
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
14.3. Schematic Diagram (Base Unit_Operation)
2APVCC
MEG_LED
ANS_LED
KEYS_B
KEYIN1
KEYIN2
KEYIN3
KEYS_C
KEYS_D
KEYS_E
LED902
LED901
K
K
A
A
1
ERASE
2
1
RPT
2
1
STOP
2
1
UP
2 1
ANS1
2
1
MSG2
2
1
MSG1
2 1
SKIP
2
1
DOWN
2
LOCAT/INT
1 2
NC: No Components
KX-TG4021/4022/4023 SCHEMATIC DIAGRAM (Base Unit_Operation)
68
Memo
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
69
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
14.4. Schematic Diagram (Handset_Main)
C harge Current
BATTERY
BATT+
F1
5.6n
BATTERY
BATT-
R2
Q4
NC
D7
CHG(+)
CHARGE
Terminal
CHG(-)
GND GND
GND
+1.8V
R4
NC
R6
NC
R31
100
C121
NC
GND
R3
1k
Q9
GND
BAT
UTX
URX
GND
JTAG
R45
0.1
GND
C35
J56p
GND
2 3
1
RA61
220
4
R63
100
COL0
COL1
C1CP1
6.3V
330u
GND GND
UTX
URX
JTAG
Power_adj
PON
PSEL
VDD_PADRV
TXp
TXn
TXON
To PA
+1.8V
D400
NC
R406
NC
R401
NC
R407
NC
Q400
NC
R400
NC
C400
NC
GND
R403
NC
R404
NC
GND
GND
Q401
NC
GND
+1.8V
C340
NC
C341
J39p
GND
BATTERY
C342
NC
GND GND
R330
1M
Q11
C331
1u
GND
Q12
R331
27k
GND
R332
27k
GND GND
C332
1u
CKM
D1
C2 CP2
6.3V
330u
GND
R20
10
3.0V
4.0V
CP+3.0V
CP+4.0V
CP3.0V
CP4.0V
GND
Q2
(MAX500mA
+1.8V
1.8V
1.8V
GND
C10
K2.2u
(1)
(2)
(3)
C53
C52
K10u
K10u
POWER
C51
K1u
GND
C54 D10p
GND
C55
D10p
GND
C38
NC
1
S1
2
LCD_CSB
LCD_RESET
BELL_LED_A
C44
K0.1u
R225
0
STM
C45
K0.1u
TX _RF
C46
10p
72
73
74
75
76
68
69
70
71
77
78
79
80
61
62
63
64
65
66
67
BATTERY
RSTn
JTAG
P2_5/PCM_FSC/SF
P2_4/SCL1/PCM_DO/DP3
P2_3/SDA1/PCM_DI/DP2
P2_2/PCM_CLK/CLK100
P2_1/ECZ2/PWM1/LED4
P2_0/ECZ1/PWM0/LED3
VDD2
LDORF_CTRL
RF_SUPPLY2
RFP0n
RFP4
RFP3
VDD_PADR
VSS_PADR1
RF_TXp
RF_TXn
VSS_PADR2
RFP2
81
*IC1
GND
VBAT2
CP_C1y
CP_C2x
CP_C1x
VBAT1
PAOUTn/P3_0
VDDPA
PAOUTp/P3_1
P1_7/CHARGE
CHARGE_CTRL
SOCn
SOCp
NTC/ADC2
ADC1/INT0/P1_0
ADC0/P3_3
PARADET/P3_4
RINGOUT/RINGING/P3_5
RINGn/P3_6
RINGp/P3_7
CIDINp/VREFp
33
32
31
30
29
28
27
26
25
24
23
22
21
40
39
38
37
36
35
34
L47
CHARGE
CHARGE_CTRL
L46
SOCn
SOCp
COL0
COL1
COL2
COL3
COL4
GND
(4)
(5)
(6)
COL2
COL3
COL4
COL5
RF_RXp
RF_RXn
RXON
TO RF BLOCK
GND
RX _RF
0.75V
0V
GND
250 mVp-p
*X1
3
10.368M
2
GND
1
R215
0
C17
D10p
C18
D10p
RA4
3.3k
VREFm
R27 820
R28 820
VREFm
(7)
(8)
(9)
(10
(12)
(11
(14)
(13
(15
BATTERY
[EX /FX]
CP+3.0V
[RU]
CP+4.0V
*R248
0
*R249
NC
LCD B/L
BELL LED
(Amber)
*LED12 GND
KEY B/L
RF-SHIELD
RE2
GND
GND
*RA31
330
*RA30
330
*RA32
120
Q7
GND
NC: No Components
70
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
(1)
(2)
(3)
(4)
(5)
(6)
TP_ANT1
GND
C803
1.5p
L801
27n
C827
10p
W 0.15mm
L 20+/-2mm
3rd layer
2
3
1
DA801
GND
R807
220
*C826
4p
GND
RXON
RX_RF
RF_RXn
BATTERY
C30
NC
R37
NC
R36
NC
CP+3.0V
Q10
NC
GND
RA40
10k
C172
K0.1u
8
VCC
7
WP
6
SCL
5
SDA
*IC3
A0
A1
A2
GND
3
4
1
2
GND
BATTERY
C188
K1u
GND
GND GND
W 0.15mm
L 5.0mm
1st layer
BPF
GND GND
W 0.15mm
L 5.0mm
1st layer
GND
W 0.125mm
L 7.6mm
Gap 0.125mm
1st layer
RF_RXp
BATTERY
R801:220k
R808:NC
W 0.15mm
L 20+/-1mm
3rd layer
Q880
NC
GND GND
GND
GND
C812
10p
W 0.15mm
L 20+/-2mm
3rd layer
GND
GND
GND
GND GND
11
GND
10
9
8
7
6
VCC
PO
POX
PSEL
PAON
GND
PSET
VCCS
PI
PIX
PRAMP
3
4
5
1
2
IC801
W 0.15mm
L 3.0mm x2
1st layer
R806
220
Balun
GND
Pre-matching
GND
TXON
2
1
RA800
1k
3
4
PSEL
PON
GND
GND
S p-phone RX/Beep
GND
GND
GND
*C834
1p
R805 47
Power_adj
TXn
TX_RF
TXp
VDD_PADRV
1
2
+
-
SP-PHONE_SPEAKER
GND
GND
GND
GND
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
LSRp
LSRn
LSRp
RX-AF (H andset)
LCD_SDA
LCD_SCL
LCD_CD
LCD_RESET
LCD_CSB
R55
1k
*R233
NC
GND GND GND GND GND
*C204
0.1
CP+3.0V
GND
*C186
NC
*C187
NC
GND
GND
GND to LCD UNIT (Monochrome 1.4inc 3Line/for TGA250) to LCD UNIT (Monochrome 1.8inc FullDot/for TGA651)
LSRp
LSRn
TX _AF
MICp
MICn
C152 k1000p
RCV+
1
+
2
RCV-
-
RECEIVER
MIC+
MIC-
D4
NC
GND
R73
GND
GND
GND
C113 D10p
1
82
R74
82
2
D3
NC
C75
D10p
C74
D10p
VREFm
GND
GND
VREFm
MIC AP1
71
KX-TGA403 SCHEMATIC DIAGRAM (Handset_Main)
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
14.5. Schematic Diagram (Charger Unit)
TP3
J1
1
2
F1
TP4
G
R1 12 TP2
TP1
SCHEMATIC DIAGRAM (Charger Unit)
72
15 Printed Circuit Board
15.1. Circuit Board (Base Unit_Main)
15.1.1. Component View
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
for JIG
}
GND
UTX
URX
VDDC
+3.0V
R122
C126
C115
R167
C168
R163
R181
C186
C184
D142
D143
R162 C142
R165
C167
C524
R505
R506
C611
C475
C525
C473
C120
C124
C472
C123
C151
C133
C521
C332
R604
R334
R503
C512
C513
C601
C479
R507
R512
3
R601
R607
RA502
C301
R304
R305
R307
C307
R301
F301
4
L361
KX-TG4021/4022/4023 CIRCUIT BOARD (Base Unit_Main (Component View))
STM/CKM
VBAT
73
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
15.1.2. Bottom View
C893
SA101
L101
SA103
D101
C859
C896
C306
Q142
R144
R807
R892
C515
L809 C812
C813
C805
C810
C516
C518
RA501
R891
R806
R142
C508
IC301
C303
C305
Q301
L301
C519
R509
X501
C185
C304
R160
C509
C505
C506
C172
C503
R501
R333
C342
C173
C164
C161
L102
R111
E
R171
C174
Q171
R175
R113
C113
R176
C176
D113
R371
D331
R652
R651
C660
C658
C659
C652
C653
C654
C651
C655
C656
KX-TG4021/4022/4023 CIRCUIT BOARD (Base Unit_Main (Bottom View))
74
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
15.2. Circuit Board (Base Unit_Operation)
PNLB1753Z
KX-TG4021/31H
ERASE
RPT
MSG1
MSG3
MSG2
LED902
MSG4
SKIP
PbF
LED901
ANS1
UP
DOWN
STOP LOCAT/INT
A
KX-TG4021/4022/4023 CIRCUIT BOARD (Base Unit_Operation (Component View))
75
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
Memo
76
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
15.3. Circuit Board (Handset_Main)
15.3.1. Component View
KX-TGA650XX
KX-TGA651XX
KX-TGA250XX
KX-TGA251XX
KX-TGA403XX
PNLB1734Y
PbF
BATT+
CHG (+)
TP_ANT1
RECEIVER
RED
BLK
TGA650XX
TGA651XX
C175
C70
C152
C71
R578
TGA250XX
TGA251XX
TGA403XX
C106
C104
C107
C103
R53
D21
R50
R231 C201
C200
C105
R236
C206
C203
R54
D22
BLK
C804
C811
C813
L802
C802
C834
STM
R405
C44 R225
JTAG
R63
R66
C837
1
D400
Q400
R402
R400
C400
Q401
C10
1.8V
RA4
R27
R807
R203
C43
C48
R23
21
C40
C54
C52
C53
CLK
R37
R36
C39 C30
R249
C51
CP4.0V
R248
CP3.0V
R20
C55
RA40
POWER
C814
C808
R805
R802
RED
D13
C863
D14
C864
RA800
R880
R801
R808
C880
C73
C72
C332
Q12
Q11
R330
C342
R332
R331
C331
8
1
IC3
5
4
E
C341
BATT+
C340
D7
R2
F1
R30
R7
C147
R4
R8
R3
C5
CHG(+)
D3
C113
D4
CHG(-)
RCV-
RCV+
URX
MIC+
MIC-
BAT
UTX
GND
BATT-
A
MIC+ MIC-
RCV+
RCV-
SP-
SP+
X_CLK
(10.368MHZ)
URX
UTX
GND
}
BAT
BATT-
CHG (-)
KX-TGA403 CIRCUIT BOARD (Handset_Main (Component View))
JIG
77
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
15.3.2. Bottom View
LED12
PbF
PNLB1734Y
KX-TGA650XX
KX-TGA651XX
KX-TGA250XX
KX-TGA251XX
KX-TGA403XX
CN5
12 1
TGA650XX
TGA651XX
CN51
R51
R52
TGA250XX
TGA251XX
TGA403XX
SOFT_A SOFT_B SOFT_C
UP
TALK S1
LED8
SP
LEFT
DOWN
RIGHT
LED6
R
1
4
2
5
3
6
7
8 9
0 #
A
MIC
KX-TGA403 CIRCUIT BOARD (Handset_Main (Bottom View))
78
15.4. Circuit Board (Charger Unit)
15.4.1. Component View
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
R1
J1
15.4.2. Bottom View
A
CIRCUIT BOARD (Charger unit (Component View) )
TP4 (GND)
J1
1
2
TP3
CIRCUIT BOARD (Charger unit (Bottom View) )
A
79
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
16 Exploded View and Replacement Parts List
16.1. Cabinet and Electrical Parts (Base Unit)
1
2
3
9
10
11
12
PCB2
5
4
6
8
13
7
A
14(*1)
A
E1
PCB1
13
14(*1)
15
16
A
Ref.No.
Figure
A
2.6 x 8mm
Note:
(*1) The SPACERs (No.14) are cut from the excess parts of SPACER (No.108) of Cabinet and Electrical Parts (Handset)
(P.81).
80
16.2. Cabinet and Electrical Parts (Handset)
105
106
107
E101(*1)
E103
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
111
B
E106
E105
E107
103
104
102
E102
108 E104
113
B
109
110
MIC100
PCB100
112
101
118
120
115
116 (*2)
119 (*3)
114
117
B
Ref.No.
B
Figure
Ǿ
2
8 mm
Battery cover
Spacer (No.119)
Stick it between ribs.
Put it in the center.
Note:
(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.47).
(*2) The rechargeable Ni-MH battery HHR-4DPA or HHR-4MRT is available through sales route of Panasonic.
(*3) Attach the SPACER (No. 119) to the exact location described above.
81
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
16.3. Cabinet and Electrical Parts (Charger Unit)
200
200-1
PCB200
200-2
B
200-3
B
200-4
Ref.No.
B
Figure
82
16.4. Accessories
A1 A2
A3
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
83
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
16.5. Replacement Parts List
1. RTL (Retention Time Limited)
Note:
The “RTL” marking indicates that its Retention Time is
Limited.
When production is discontinued, this item will continue to be available only for a specific period of time.
This period of time depends on the type of item, and the local laws governing parts and product retention.
At the end of this period, the item will no longer be available.
2. Important safety notice
Components identified by the mark indicates special characteristics important for safety. When replacing any of these components, only use specified manufacture's parts.
3. The S mark means the part is one of some identical parts.
For that reason, it may be different from the installed part.
4. ISO code (Example: ABS-94HB) of the remarks column shows quality of the material and a flame resisting grade about plastics.
5. RESISTORS & CAPACITORS
Unless otherwise specified;
All resistors are in ohms (
Ω) k=1000Ω, M=1000kΩ
All capacitors are in MICRO FARADS (
µF) p=µµF
*Type & Wattage of Resistor
16.5.1. Base Unit
16.5.1.1. Cabinet and Electrical Parts
Safety Ref.
No.
1
2
3
4
5
6
7
8
9
10
11
12
Part No.
Part Name & Description Remarks
PNKM1132V3
K2ECYZ000001 JACK, DC
PQJJ1T039S JACK, MODULAR
L0AA02A00087 SPEAKER
PQHG10729Z
PQHR11313Z
PNKE1056Z1
PNJT1047Z
PNBC1307Z1
PNHR1259Z
PNBC1308Z1
PNJK1079Z
RUBBER PARTS, SPEAKER
GUIDE, SPEAKER
GUIDE, BUTTON HOLDER
BUTTON, MESSAGE
KEYBOARD SWITCH
PS-HB
ABS-HB
CASE, CHARGE TERMINAL PS-HB
CHARGE TERMINAL
BUTTON, NAVIGATOR KEY PS-HB
PS-HB
AS-HB
Safety Ref.
No.
13
14
15
16
Part No.
PNLA1030Z
PNYE1027Z
PNKF1099Y1
PQHA10023Z
Part Name & Description Remarks
ANTENNA
SPACER, ANTENNA
CABINET COVER
RUBBER PARTS, FOOT
CUSHION
PS-HB
16.5.1.2. Main P.C. Board Parts
Note:
(*1) When replacing IC611 or X501, make the adjustment using PNZZTG4021LA. Refer to How to download the
data (P.54) of Things to Do after Replacing IC or X'tal.
Safety Ref.
No.
PCB1
Part No.
Part Name & Description Remarks
PNWP14021LAH MAIN P.C.BOARD ASS'Y
(RTL)
(ICs)
IC302 C0CBAYG00016 IC S
IC331 C0EBE0000124 IC
IC501 C2HBCY000064 IC(BBIC)
IC601 PNWI24021LAH IC(FLASH)
IC611 PNWI14021LAH IC(EEPROM) (*1)
(TRANSISTORS)
Q111 2SC6054JSL TRANSISTOR(SI)
Q141
Q142
Q161
Q171
Q651
B1ACGP000008 TRANSISTOR(SI)
PQVTBF822T7 TRANSISTOR(SI)
2SD0874AS
2SC6054JSL
TRANSISTOR(SI)
TRANSISTOR(SI)
B1GFCFEN0011 TRANSISTOR(SI) S
(DIODES)
PQVDMD5S DIODE(SI) D101
D113
D133
D143
D473
MA111
MA111
MANV250GEL
MAZ805100L
DIODE(SI) S
DIODE(SI) S
DIODE(SI)
DIODE(SI)
DA801 B0DDCD000001 DIODE(SI)
DA802 B0DDCD000001 DIODE(SI)
(COILS)
L101
L102
L361
PQLQXF330K
PQLQXF330K
COIL S
COIL S
G1CR22J00006 COIL
L371
L476
L501
L809
G1CR22J00006 COIL
G1CR22J00006 COIL
G1CR10J00010 COIL
G1C7N5JA0044 COIL
(RESISTOR ARRAYS)
RA151 D1H410220001 RESISTOR ARRAY
RA501 EXB28V330 RESISTOR ARRAY
RA502 EXB28V103 RESISTOR ARRAY
RA504 D1H468020001 RESISTOR ARRAY
(VARISTOR)
R141
R142
R145
R151
R152
R160
R161
R162
R163
R164
R165
SA101 J0LF00000048 VARISTOR (SURGE
ABSORBER)
(RESISTORS)
R111
R112
PQ4R10XJ104 100k S
PQ4R10XJ104 100k S
R113
R114
R121
R122
R131
R133
ERJ3GEYJ103 10k S
ERJ3GEYJ473 47k S
ERJ3GEYJ394 390k S
ERJ3GEYJ394 390k S
PQ4R18XJ106 10M S
ERJ3GEYJ334 330k S
ERJ3GEYJ104 100k S
PQ4R18XJ272 2.7k S
ERJ2GEJ222 2.2k S
ERJ2GEJ104 100k S
ERJ2GEJ474X 470k S
ERJ3GEYJ911 910 S
ERJ3GEYJ104 100k S
ERJ3GEYJ473 47k S
ERJ12YJ120 12
ERJ3GEYJ272 2.7k S
ERJ3GEYJ273 27k S
84
C132
C142
C151
C152
C161
C167
C171
C173
C175
C176
C101
C102
C111
C112
C113
C120
C121
C122
C123
C126
C178
C184
C186
C302
C306
C321
C322
C341
C342
C343
C351
C352
C476
C477
C478
C479
C501
C502
C503
C504
C505
C506
Safety Ref.
No.
R167
R171
R172
R175
R176
R178
R181
R321
R322
R331
R332
R334
R335
R371
R372
R501
R502
R505
R512
R604
R605
R606
R607
R612
R651
R652
R806
R807
R891
R892
Part No.
Part Name & Description Remarks
ERJ12YJ270
ERJ2GEJ220
ERJ2GEJ104
ERJ2GEJ561
27
22 S
100k S
560 S
ERJ2GEJ101
ERJ2GEJ102
100 S
1k S
ERJ2GE0R00 0
ERJ2RKF1400 140
S
ERJ2RKF1000 100
ERJ3EKF4702 47k
ERJ3EKF6802 68k
ERJ2GEJ473
ERJ2GE0R00
47k S
0 S
ERJ1TYJ5R6U 5.6
ERJ1TYJ5R6U 5.6
ERJ3GEYJ100 10
ERJ2GEJ330 33
ERJ2GEJ222
S
S
2.2k S
ERJ2GEJ102
ERJ2GEJ103
ERJ2GEJ332
1k S
10k S
3.3k S
ERJ2GEJ332
ERJ2GE0R00
ERJ2GEJ103
3.3k S
0 S
10k S
ERJ3GEYJ681 680
ERJ3GEYJ681 680
ERJ2GEJ471
ERJ2GEJ471
ERJ2GEJ471
ERJ2GEJ471
470
470
470
470
(CAPACITORS)
F1K2H681A008 680p
F1K2H681A008 680p
F1J2A473A024 0.047
S
S
S
S
S
S
F1J2A473A024 0.047
PQCUV1A684KB 0.68
ECUE1H102KBQ 0.001
F1K2H681A008 680p
F1K2H681A008 680p
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUV1H103KBV 0.01
ECUV1H103KBV 0.01
ECUE1H100DCQ 10p
ECUE1C103KBQ 0.01
F2G1H1000009 10
ECUV1H102KBV 0.001
ECUV1C223KBV 0.022
ECUV1A224KBV 0.22
ECUE1H102KBQ 0.001
PQCUV0J106KB 10
ECUE1C223KBQ 0.022
ECUV1A105KBV 1
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
F2A1C1010119 100
ECUV1A105KBV 1
ECUE1H100DCQ 10p
F2A1A3310040 330
ECUV1C104KBV 0.1
ECUE1H100DCQ 10p
ECUV1C105KBV 1
ECUV1C104KBV 0.1
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1A104KBQ 0.1
ECJ1VB0G106M 10
ECJ1VB0G106M 10
ECUE0J105KBQ 1
ECJ1VB0G106M 10
ECUV1A105KBV 1
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
Safety Ref.
No.
C507
C508
C509
C510
C511
C512
C513
C514
C515
C516
C517
C518
C519
C520
C521
C522
C530
C601
C611
C805
C806
C810
C811
C812
C813
C820
C822
C825
C826
C827
C859
C863
C891
C892
C893
C894
C895
C896
Part No.
Part Name & Description Remarks
E1
P101
F301
X501
ECUV1A225KB 2.2
ECUE1H100DCQ 10p
ECUE1H120JCQ 12p
ECUV1A105KBV 1
ECJ1VB0G106M 10
ECUE1A104KBQ 0.1
ECUV1A225KB 2.2
ECUE1A104KBQ 0.1
ECUV1A105KBV 1
ECUE1A104KBQ 0.1
ECUE1A104KBQ 0.1
ECUE1A104KBQ 0.1
ECUE1A104KBQ 0.1
ECUE1A104KBQ 0.1
ECUE0J105KBQ 1
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1A104KBQ 0.1
ECUE1A104KBQ 0.1
F1G1H2R7A480 2.7p
F1G1H2R7A480 2.7p
F1G1H2R4A480 2.4p
F1G1H100A723 10p
F1G1HR90A480 0.9p
F1G1H2R0A480 2p
F1G1H1R5A480 1.5p
F1G1H100A723 10p
F1G1H100A723 10p
F1G1H100A723 10p
F1G1H100A723 10p
F1G1H2R2A480 2.2p
F1G1H1R5A480 1.5p
F1G1H5R0A480 5p
F1G1H5R0A480 5p
F1G1H3R0A480 3p
F1G1H2R2A480 2.2p
F1G1H1R2A480 1.2p
F1G1H2R2A480 2.2p
(OTHERS)
WBX10SH-3.5G LEAD WIRE, PARALLEL
WIRE
D4DAY220A022 THERMISTOR (POSISTOR) S
K5H302Y00003 FUSE
H0J138500011 CRYSTAL OSCILLATOR (*1)
16.5.1.3. Operational P.C. Board Parts
Safety Ref.
No.
PCB2
Part No.
Part Name & Description Remarks
PNWP2TG4031H OPERATIONAL
ASS'Y (RTL)
(DIODES)
LED901 LNJ237W82RA LED
LED902 LNJ237W82RA LED
S
S
16.5.2. Handset
16.5.2.1. Cabinet and Electrical Parts
Safety Ref.
No.
101
102
103
104
105
106
107
108
109
110
111
Part No.
Part Name & Description Remarks
PNGP1087Y5
PNYE1026Z
PNKM1123Y6
PNHS1072Z
PANEL, LCD PMMA-HB
TAPE, DOUBLESIDED
CABINET BODY PS-HB
SPACER, RECEIVER NET
PQHS10467Z COVER, SPEAKER NET
L0AD02A00043 RECEIVER
PQHG10729Z RUBBER PARTS, RECEIVER
PNYE1027Z
PNBC1003Y3
PNJK1071V
PNHX1165Z
SPACER, CUSHION LCD
BUTTON, VOLUME KEY ABS-HB
KEYBOARD SWITCH
COVER, LCD SHEET
85
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
Safety Ref.
No.
112
113
114
115
116
117
118
119
120
Part No.
Part Name & Description Remarks
PNJT1027Z
PNJT1026Z
PQHR11315Z
CHARGE TERMINAL (L)
CHARGE TERMINAL (R)
GUIDE, SPEAKER ABS-HB
L0AA02A00095 SPEAKER
PQHS10784Y
PQJC10056W
PNKF1093Z1
PNHS1079Z
PNKK1038Y1
SPACER, SPEAKER NET
BATTERY TERMINAL
CABINET COVER
SPACER, BATTERY
LID, BATTERY
ABS-HB
ABS-HB
16.5.2.2. Main P.C. Board Parts
Note:
(*1) Reconfirm the model No. written on the handset's name plate when replacing PCB100. Because the model No. of the optional handset may differ from the included handset.
(*2) When replacing IC3 or X1, make the adjustment using PNZZTG4021LA. Refer to Handset (P.55) of Things to Do after Replacing IC or X'tal.
(*3) When replacing the handset LCD, See How to
Replace the Handset LCD (P.47).
(*4) When removing E106, use special tools (ex. Hot air disordering tool).
Safety Ref.
No.
Part No.
Part Name & Description Remarks
PCB100 PNWPGA403LAR MAIN P.C.BOARD ASS'Y
(RTL) (*1)
IC1
IC3
IC801
Q2
Q4
Q7
Q9
Q11
Q12
(ICs)
C1CB00003361 IC (BBIC (FLASH))
PNWIGA403LAR IC (EEPROM) (*2)
C1CB00001842 IC
(TRANSISTORS)
B1ADGE000004 TRANSISTOR(SI)
B1ADGE000004 TRANSISTOR(SI)
UN9219J
2SC6054JSL
TRANSISTOR(SI) S
TRANSISTOR(SI)
B1ADCF000161 TRANSISTOR(SI)
B1ADCF000161 TRANSISTOR(SI)
(DIODES)
MA2YD2120L DIODE(SI) D1
D7
D13
D14
D21
D22
DA801
MA2ZD0200L
MA8043M
MA8043M
MA8043M
MA8043M
DIODE(SI)
DIODE(SI) S
DIODE(SI) S
DIODE(SI) S
DIODE(SI) S
B0DDCD000001 DIODE(SI)
(LEDS)
LED4
LED5
LED6
LED7
LED8
LED9
LED21
LED22
LED23
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000216 LED
B3ACB0000216 LED
B3ACB0000216 LED
(COILS)
F1
L801
L802
L803
RA1
RA4
RA30
RA31
RA32
RA40
RA61
RA800
PQLQR2M5N6K COIL S
G1C27NJ00010 COIL
G1C3N6ZA0063 COIL
G1C3N6ZA0063 COIL
(RESISTOR ARRAYS)
D1H810240004 RESISTOR ARRAY
D1H433220001 RESISTOR ARRAY
S
D1H83314A013 RESISTOR ARRAY
D1H433120001 RESISTOR ARRAY
EXB28V121JX RESISTOR ARRAY
EXB28V103 RESISTOR ARRAY
D1H422120001 RESISTOR ARRAY
D1H410220001 RESISTOR ARRAY
(IC FILTERS)
S
C47
C49
C50
C51
C52
C53
C54
C35
C40
C43
C44
C45
C46
C1
C2
C5
C10
C11
C12
C13
C17
C18
C55
C74
C75
C96
C97
C103
C104
C105
C107
C113
C152
C172
R232
R248
R330
R331
R332
R801
R802
R805
R806
R807
R66
R73
R74
R203
R215
R225
R231
R27
R28
R30
R31
R45
R50
R51
R3
R7
R8
R20
R23
R52
R53
R54
R55
R63
R64
Safety Ref.
No.
L46
L47
Part No.
Part Name & Description Remarks
J0JDC0000045 IC FILTER
J0JDC0000045 IC FILTER
(RESISTORS)
ERJ2GEJ102 1k S
ERJ2GEJ122
ERJ2GEJ101
ERJ2GEJ100
ERJ2GEJ102
1.2k S
100
10
S
S
1k S
ERJ2GEJ821
ERJ2GEJ821
820
820
S
S
ERJ3GEYJ152 1.5k S
ERJ2GEJ101 100
ERJ6RSJR10V 0.1
ERJ2GEJ103
ERJ2GEJ471
S
10k S
470 S
ERJ2GEJ102
ERJ2GEJ332
ERJ2GEJ103
ERJ2GEJ102
ERJ2GEJ101
ERJ2GEJ103
1k S
3.3k S
10k S
1k S
100 S
10k S
ERJ2GEJ102
ERJ2GEJ820
ERJ2GEJ820
1k S
82 S
82 S
D0GA563ZA006 56k
ERJ2GE0R00 0 S
ERJ2GE0R00
ERJ2GEJ824
0 S
820k S
ERJ2GEJ434X 430k S
ERJ2GE0R00 0 S
ERJ2GEJ105X 1M S
ERJ2GEJ273X 27k S
ERJ2GEJ273X 27k S
ERJ2GEJ122 1.2k S
ERJ2GEJ101
ERJ2GEJ470
ERJ2GEJ221
ERJ2GEJ221
100
47
220
220
S
S
S
S
(CAPACITORS)
F2A0J3310067 330
F2A0J3310067 330
ECUV1A105KBV 1
ECUV1A225KB 2.2
ECUE1A104KBQ 0.1
PQCUV0J106KB 10
ECUE1A104KBQ 0.1
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H560JCQ 56p
ECUE1A104KBQ 0.1
ECUE1H100DCQ 10p
ECUE1A104KBQ 0.1
ECUE1A104KBQ 0.1
ECUE1H100DCQ 10p
ECUV1A105KBV 1
ECUV1A105KBV 1
ECUV1A105KBV 1
ECUV1A105KBV 1
PQCUV0J106KB 10
PQCUV0J106KB 10
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H101JCQ 100p
F1G1H100A723 10p
ECUE1H101JCQ 100p
ECUE1H330JCQ 33p S
ECUE1H100DCQ 10p
ECUE1H102KBQ 0.001
ECUE1A104KBQ 0.1
86
Safety Ref.
No.
C182
C188
C200
C201
C203
C204
C331
C332
C341
C802
C803
C804
C805
C806
C808
C809
C810
C811
C812
C813
C814
Part No.
Part Name & Description Remarks
F1G1H3R0A480 3p
ECUE0J105KBQ 1
ECUV1C105KBV 1
ECUV1C105KBV 1
ECUV1C105KBV 1
ECUV1C104KBV 0.1
ECUE0J105KBQ 1
ECUE0J105KBQ 1
ECUE1H390JCQ 39p
F1G1H2R0A480 2.0p
F1G1H1R5A480 1.5p
F1G1H2R0A480 2.0p
F1G1H3R3A480 3.3p
F1G1H3R3A480 3.3p
ECUE1A104KBQ 0.1
F1G1H100A723 10p
F1G1H1R6A480 1.6p
F1G1H100A723 10p
F1G1H100A723 10p
F1G1H1R6A480 1.6p
ECUE1H332KBQ 0.0033
C819
C822
C825
C826
C827
C834
C860
C861
F1G1H100A723 10p
F1G1H100A723 10p
F1G1H100A723 10p
F1G1H4R0A480 4p
F1G1H100A723 10p
F1G1H1R0A480 1p
F1G1H100A723 10p
F1G1H3R0A480 3p
(OTHERS)
MIC100 L0CBAY000032 MICROPHONE
E101
E102
L5DYBYY00012 LIQUID CRYSTAL DISPLAY
PNHR1247Z
(*3)
TRANSPARENT PLATE, LCD PMMA-HB
E103
E104
E105
E106
PNHR1246Z
PNHX1254Z
PNLA1020Z
PNMC1013Z
GUIDE, LCD
COVER, LCD
ANTENNA
CASE,MAGNETIC SHIELD
(*4)
ABS-HB
E107
X1
PNVE1002Z BATTERY TERMINAL
H0J103500033 CRYSTAL OSCILLATOR (*2)
16.5.3. Charger Unit
16.5.3.1. Cabinet and Electrical Parts
KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT
16.5.4. Accessories
Note:
You can download and refer to the Operating Instructions
(Instruction book) on TSN Server.
Safety Ref.
No.
A1
A2
A3
Part No.
PQLV219Y
PQJA10075Z
PNKL1010Z1
16.5.5. Screws
Part Name & Description Remarks
AC ADAPTOR
CORD, TELEPHONE
STAND, WALLMOUNT ABS-HB
Safety Ref.
No.
Part No.
Part Name & Description Remarks
A XTB26+8GFJ TAPPING SCREW
B XTB2+8GFJ TAPPING SCREW
16.5.6. Fixtures and Tools
Note:
(*1) See Equipment Required (P.48), and The Setting
Method of JIG (P.48)
(*2) When replacing the Handset LCD, See How to
Replace the Handset LCD (P.47)
Safety Ref.
No.
Part No.
Part Name & Description Remarks
PQZZ1CD300E JIG CABLE (*1)
PNZZTG4021LA BATCH FILE CD-ROM (*1)
PQZZ430PIR
PQZZ430PRB
TIP OF SOLDERING IRON
(*2)
RUBBER OF SOLDERING IRON
(*2)
Safety Ref.
No.
200
Part No.
PNLC1010ZT
Part Name & Description Remarks
CHARGER UNIT ASS'Y without NAME PLATE
(RTL)(for KX-
TG4022LAT)(for KX-
TG4023LAT)
PS-HB
200-4 PQHA10023Z RUBBER PARTS, FOOT
CUSHION
PS-HB
16.5.3.2. Main P.C. Board Parts
Safety Ref.
No.
Part No.
Part Name & Description Remarks
PCB200 PNWPTGA641CH MAIN P.C.BOARD ASS'Y
(RTL)
(JACK)
J1 K2ECYB000001 JACK
(RESISTOR)
S
R1
F1
ERG2SJ120 12
(FUSE)
K5H302Y00003 FUSE
T.I
KXTG4021LAT
KXTG4022LAT
KXTG4023LAT
KXTGA403LAT
87
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Key Features
- Caller ID Compatible
- Expandable Digital Cordless Answering System
- Up to 6 Handsets
- Black Metallic Version
- For Latin America
- Multiple message format
- FSK/DTMF signals
- Synthesized Voice
- DTMF Generator
- Speech compression technique
Frequently Answers and Questions
How many handsets can I use with this phone?
What are the different models available?
What features are included in this phone?
Related manuals
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Table of contents
- 4 1.1. For Service Technicians
- 4 2.1. Battery Caution
- 4 2.2. About Lead Free Solder (PbF: Pb free)
- 5 2.3. Discarding of P. C. Board
- 7 4.1. US-DECT Description
- 9 4.2. Block Diagram (Base Unit_Main)
- 10 4.3. Block Diagram (Base Unit_RF Part)
- 11 4.4. Circuit Operation (Base Unit)
- 18 4.5. Block Diagram (Handset)
- 19 4.6. Block Diagram (Handset_RF Part)
- 20 4.7. Circuit Operation (Handset)
- 22 4.8. Circuit Operation (Charger Unit)
- 23 4.9. Signal Route
- 26 8.1. Engineering Mode
- 30 9.1. How to Clear User Setting (Handset Only)
- 31 10.1. Troubleshooting Flowchart
- 43 11.1. Disassembly Instructions
- 47 11.2. How to Replace the Handset LCD
- 48 12.1. Equipment Required
- 48 12.2. The Setting Method of JIG
- 51 12.3. Adjustment Standard (Base Unit)
- 52 12.4. Adjustment Standard (Charger Unit)
- 53 12.5. Adjustment Standard (Handset)
- 54 12.6. Things to Do after Replacing IC or X'tal
- 56 12.7. Frequency Table
- 57 13.1. How to Replace the Flat Package IC
- 59 13.2. How to Replace the Shield Case
- 61 Package) IC
- 63 Diodes
- 64 14.1. For Schematic Diagram
- 66 14.2. Schematic Diagram (Base Unit_Main)
- 68 14.3. Schematic Diagram (Base Unit_Operation)
- 70 14.4. Schematic Diagram (Handset_Main)
- 72 14.5. Schematic Diagram (Charger Unit)
- 73 15.1. Circuit Board (Base Unit_Main)
- 75 15.2. Circuit Board (Base Unit_Operation)
- 77 15.3. Circuit Board (Handset_Main)
- 79 15.4. Circuit Board (Charger Unit)
- 80 16.1. Cabinet and Electrical Parts (Base Unit)
- 81 16.2. Cabinet and Electrical Parts (Handset)
- 82 16.3. Cabinet and Electrical Parts (Charger Unit)
- 83 16.4. Accessories
- 84 16.5. Replacement Parts List