Panasonic KX-TG4021 LAT, KX-TG4022 LAT, KX-TG4023 LAT, KX-TGA403 LAT digital cordless phone Service manual

ORDER NO. KM41006121CE

Model No.

Telephone Equipment

KX-TG4021LAT

KX-TG4022LAT

KX-TG4023LAT

KX-TGA403LAT

Expandable Digital Cordless Answering

System

T: Black Metallic Version

(for Latin America)

© Panasonic System Networks Co., Ltd. 2010

Unauthorized copying and distribution is a violation of law.

KX-TG4021LAT/KX-TG4022LAT/KX-TG4023LAT/KX-TGA403LAT

2

TABLE OF CONTENTS

PAGE

1 Safety Precautions----------------------------------------------- 4

1.1. For Service Technicians --------------------------------- 4

2 Warning -------------------------------------------------------------- 4

2.1. Battery Caution--------------------------------------------- 4

2.2. About Lead Free Solder (PbF: Pb free)-------------- 4

2.3. Discarding of P. C. Board-------------------------------- 5

3 Specifications ----------------------------------------------------- 6

4 Technical Descriptions ----------------------------------------- 7

4.1. US-DECT Description ------------------------------------ 7

4.2. Block Diagram (Base Unit_Main)---------------------- 9

4.3. Block Diagram (Base Unit_RF Part) -----------------10

4.4. Circuit Operation (Base Unit)-------------------------- 11

4.5. Block Diagram (Handset)-------------------------------18

4.6. Block Diagram (Handset_RF Part)-------------------19

4.7. Circuit Operation (Handset)----------------------------20

4.8. Circuit Operation (Charger Unit) ----------------------22

4.9. Signal Route -----------------------------------------------23

5 Location of Controls and Components ------------------25

6 Installation Instructions ---------------------------------------25

7 Operating Instructions-----------------------------------------25

8 Test Mode ----------------------------------------------------------26

8.1. Engineering Mode ----------------------------------------26

9 Service Mode -----------------------------------------------------30

9.1. How to Clear User Setting (Handset Only)---------30

10 Troubleshooting Guide ----------------------------------------31

10.1. Troubleshooting Flowchart -----------------------------31

11 Disassembly and Assembly Instructions ---------------43

11.1. Disassembly Instructions -------------------------------43

11.2. How to Replace the Handset LCD -------------------47

12 Measurements and Adjustments---------------------------48

12.1. Equipment Required -------------------------------------48

12.2. The Setting Method of JIG -----------------------------48

12.3. Adjustment Standard (Base Unit)---------------------51

12.4. Adjustment Standard (Charger Unit)-----------------52

12.5. Adjustment Standard (Handset) ----------------------53

12.6. Things to Do after Replacing IC or X'tal ------------54

12.7. Frequency Table ------------------------------------------56

13 Miscellaneous ----------------------------------------------------57

13.1. How to Replace the Flat Package IC ----------------57

13.2. How to Replace the Shield Case ---------------------59

13.3. How to Replace the LLP (Leadless Leadframe

Package) IC------------------------------------------------61

13.4. Terminal Guide of the ICs, Transistors and

Diodes -------------------------------------------------------63

14 Schematic Diagram ---------------------------------------------64

14.1. For Schematic Diagram---------------------------------64

14.2. Schematic Diagram (Base Unit_Main) --------------66

14.3. Schematic Diagram (Base Unit_Operation) -------68

14.4. Schematic Diagram (Handset_Main) ----------------70

14.5. Schematic Diagram (Charger Unit) -----------------72

15 Printed Circuit Board-------------------------------------------73

15.1. Circuit Board (Base Unit_Main)-----------------------73

15.2. Circuit Board (Base Unit_Operation) ----------------75

15.3. Circuit Board (Handset_Main)-------------------------77

15.4. Circuit Board (Charger Unit) ---------------------------79

16 Exploded View and Replacement Parts List -----------80

16.1. Cabinet and Electrical Parts (Base Unit) -----------80

16.2. Cabinet and Electrical Parts (Handset) -------------81

3


PAGE

16.3. Cabinet and Electrical Parts (Charger Unit) ------- 82

16.4. Accessories------------------------------------------------ 83

16.5. Replacement Parts List--------------------------------- 84


1 Safety Precautions

1.1.

For Service Technicians

• Repair service shall be provided in accordance with repair technology information such as service manual so as to

prevent fires, injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.

2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.

3. FASTON terminals shall be plugged straight in and unplugged straight out.

• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on worktable.

4. Do not grasp IC or LSI pins with bare fingers.

2 Warning

2.1.

Battery Caution

1. Danger of explosion if battery is incorrectly replaced.

2. Replace only with the same or equivalent type recommended by the manufacturer.

3. Dispose of used batteries according to the manufacturer’s Instructions.

2.2.

About Lead Free Solder (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),

Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder.

Caution

• PbF solder has a melting point that is 50

°F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with temperature control and adjust it to 700

°F ± 20 °F (370 °C ± 10 °C).

• Exercise care while using higher temperature soldering irons.:

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100

°F (600 °C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the opposite side (See the figure below).

4


2.2.1.

Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper

(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other materials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

2.3.

Discarding of P. C. Board

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

5


3 Specifications

Note:

• Design and specifications are subject to change without notice.

Note for Service:

• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.

• Analog telephone connection: Telephone Line

6


4 Technical Descriptions

4.1.

US-DECT Description

The frequency range of 1.91 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same frequency. Refer to Frequency Table (P.56).

4.1.1.

TDD Frame Format

4.1.2.

TDMA system

This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy bearer use.

In 1 slot 417

µs, the 10 ms of voice data is transmitted.

• 2 - Handsets Link

Traffic Bearer

A link is established between base unit and handset.

The state where duplex communication is performed.

Handset doesn't make up duplex in no free RF channels because of interference. (*1)

Dummy Bearer

Base unit sends Dummy-data to the all stand-by state handsets.

Handsets receive that data for synchronization and monitoring request from the base unit.

Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)

Note:

(*1) It is a feature under FCC 15 regulation and for interference avoidance.

In the case of checking RF parts, it is better in least interference condition.

7


4.1.3.

Signal Flowchart in the Radio Parts

Reception

A voice signal from TEL line is encoded to digital data "TXDATA" by BBIC (IC501) in a base unit.

Then TXDATA goes to RF PART and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.

As for a handset RF, RF signal is received in one antenna.

BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".

BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.

Transmission

A voice signal from microphone is encoded to digital data "TXDATA" by BBIC (IC1) in a handset.

Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a antenna.

As for a base unit RF, RF signal is received in two antennas.

BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".

BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.

8

4.2.

Block Diagram (Base Unit_Main)


3 KEY 1

KEY C, D, E

SPOUTP

SPOUTN

MSG_LED

ANS_LED

CLK,DO

DL,CS

STM/CKM

WP

SCL, SDA

VCCA

9


4.3.

Block Diagram (Base Unit_RF Part)

ANT1

ANT2

ANT2

TXp

TXn

DA801

TXON

RXON

RXp

RXn

KX-TG4021/4022/4023 BLOCK DIAGRAM (Base Unit_RF Part)

ANT1

10


4.4.

Circuit Operation (Base Unit)

General Description:

(BBIC, Flash Memory, EERROM) is a digital speech/signal processing system that implements all the functions of speech compression, record and playback, and memory management required in a digital telephone answering machine.

The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions as follows.

4.4.1.

BBIC (Base Band IC: IC501)

• Voice Message Recording/Play back

The BBIC system uses a proprietary speech compression technique to record and store voice message in Flash Memory.

An error correction algorithm is used to enable playback of these messages from the Flash Memory.

• DTMF Generator

When the DTMF data from the handset is received, the DTMF signal is output.

• Synthesized Voice (Pre-recorded message)

The BBIC implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.

• Caller ID demodulation

The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.

• Digital Switching

The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the

Telephone line, etc. They are determined by the signal path route operation of voice signal.

• Block Interface Circuit

RF part, LED, Key scan, Speaker, Telephone line.

4.4.2.

Flash Memory (IC601)

Following information data is stored.

• Voice signal ex: Pre-recorded Greeting message, Incoming message

4.4.3.

EEPROM (IC611)

Following information data is stored.

• Settings ex: message numbers, ID code, Flash Time, Tone/Pulse

11


4.4.4.

Power Supply Circuit/Reset Circuit

The power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is insulated from VBAT by Doubler of BBIC.

Circuit Operation:

12

4.4.4.1.

Charge Circuit

The voltage from the AC adaptor is supplied to the charge circuits.


13


4.4.5.

Telephone Line Interface

Telephone Line Interface Circuit:

Function

• Bell signal detection

• ON/OFF hook and pulse dial circuit

• Side tone circuit

Bell signal detection and OFF HOOK circuit:

In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T) and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:

T

→ L101 → R111 → C111 → Q111 → BBIC pin 5 [BELL]

When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through the circuit). Following signal flow is the DC current flow.

T

→ L101 → D101 → Q141 → Q161 → R163 → R167 → D101 → L102 → P101 → R

ON HOOK Circuit:

Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an onhook condition.

Pulse Dial Circuit:

Pin 6 of BBIC turns Q141 ON/OFF to make the pulse dialing.

Side Tone Circuit:

Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is canceled by the canceller circuit of BBIC.

14


4.4.6.

Parallel Connection Detect Circuit/Auto Disconnect Circuit

Function:

In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone connected in parallel is on hook or off hook by detecting changes in the T/R voltage.


Parallel connection detection when on hook:

When on hook, the voltage is monitored at pin 17 of IC501. There is no parallel connection if the voltage is

0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.

Parallel connection detection when off hook:

When off hook, the voltage is monitored at pin 18 of IC501; the presence/absence of a parallel connection is determined by detecting the voltage changes.

If the Auto disconnect function is ON and statuses are Hold, receiving ICM, OGM transmitting, BBIC disconnects the line after detecting parallel connection is off hook.

15


4.4.7.

Calling Line Identification (Caller ID)/Call Waiting Caller ID

Function:

Caller ID

The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK

(Frequency Shift Keying) * format. Data

"

1

"

is a 1200 Hz sine wave, and data

"

0

"

is a 2200 Hz sine wave. There are two types of the message format which can be received: i.e. the single message format and plural message format. The plural message format allows to transmit the name and data code information in addition to the time and telephone number data.

*: Also the telephone exchange service provides other formats.

16


Call Waiting Caller ID

Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call, to receive information about a calling party on a waited call. The transmission of the calling information takes place almost immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new call.

Function:

The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and

MARK data pass the following route.

Telephone Line

→ P101 → L101, L102 → C121, C122 → R121, R122 → IC501 (25, 24).

If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the information for the second and subsequent callers is not displayed on the portable handset display.

17


4.5.

Block Diagram (Handset)

3V

IC3

EEPROM

X1

10.368 MHz

BATTERY

CHARGE

Q4

D7

BATTERY

D1

BATTERY

Q2

1.8V

3V

LED

(KEY)

Q7

MIC

Receiver

C144

CHG_DET

CHG_CTL

RESET

Power_adj

TXn

TXp

VDD_PADRV

PSEL

PON

TXON

RXON

RF_RXn

RF_RXp

3V

AVD

LD0_CTRL

IC1

BBIC

CP_VOUT2

BATTERY

VDDPA

MICp

MICn

1.8V

LSRp

LSRn

VDD2

VDD1

KEY_LED

3V

LED

(BELL)

Monitor SP

CKM/STM

BELL_LED

PAOUTp

PAOUTn

CKM//STM

3V

LCD

KEYS

ANT1

IC801

RF PART

KX-TGA403 BLOCK DIAGRAM (Handset)

18

4.6.

Block Diagram (Handset_RF Part)

ANT

DA801


TXON

RXON

RF_RXn

RF_RXp

KX-TGA403 BLOCK DIAGRAM (Handset_RF Part)

19


4.7.

Circuit Operation (Handset)

4.7.1.

Outline

Handset consists of the following ICs as shown in Block Diagram (Handset) (P.18).

• DECT BBIC (Base Band IC): IC1

- All data signals (forming/analyzing ACK or CMD signal)

- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)

- PLL Oscillator

- Detector

- Compress/Expander

- Reception

• RF Power Amp: IC801

- Amplifier for transmission

• EEPROM: IC3

- Temporary operating parameters (for RF, etc.)

4.7.2.

Power Supply Circuit/Reset Circuit


When power on the Handset, the voltage is as follows;

BATTERY(2.2 V ~ 2.6 V: BATT+)

→ F1 → Q2 (1.8 V), IC1-43pin (2.5V)

The Reset signal generates IC1 (61 pin) and 1.8 V.

20


4.7.3.

Charge Circuit


When charging the handset on the Base Unit, the charge current is as follows;

DC+(6.5 V)

→ F301 → R371 → R372 →CHARGE+(Base) → CHARGE+(Handset) → Q4 → D7→ F1 → BATTERY+... Battery...

BATTERY-

→ R45 → GND → CHARGE-(Handset)→ CHARGE-(Base) → GND → DC-(GND)

In this way, the BBIC on Handset detects the fact that the battery is charged.

The charge current is controlled by switching Q9 of Handset.

Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.12).

4.7.4.

Battery Low/Power Down Detector


“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.

The detected voltage is as follows;

• Battery Low

Battery voltage: V(Batt) 2.25 V ± 50 mV

The BBIC detects this level and "

• Power Down

" starts flashing.

Battery voltage: V(Batt) 2.0 V ± 50 mV

The BBIC detects this level and power down.

4.7.5.

Speakerphone

The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.

21


4.8.

Circuit Operation (Charger Unit)

Charge control is executed at handset side so that the operation when using charger is also controlled by handset.

Refer to Circuit Operation (Handset) (P.20)

The route for this is as follows: DC+pin of J1(+)

→ F1 → R1 → CHARGE+pad → Handset → CHARGE-pad → DC-pin of J1(-).

22

4.9.

Signal Route


23


RF part signal route

24


5 Location of Controls and Components

Refer to the Operating Instructions.

Note:

You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

6 Installation Instructions


Note:


7 Operating Instructions


Note:


25


8 Test Mode

8.1.

Engineering Mode

8.1.1.

Base Unit

26

Frequently Used Items (Base Unit)

ex.)

Frequency

ID

Items Address

00 07 / 00 08

Default Data

00/01

00 02 ~ 00 06 Given value

-

-

New Data

-

-

Note:

(*1) When you enter the address or New Data, please refer to the table below.


Remarks

Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the computer system.

Desired Number (hex)

0

1

.

.

.

9

Input Keys

0

1

.

.

.

9

Desired Number (hex)

A

B

C

D

E

F

Input Keys

[Flash] + 0

[Flash] + 1

[Flash] + 2

[Flash] + 3

[Flash] + 4

[Flash] + 5

27


8.1.2.

Handset

28


Frequently Used Items (Handset)

ex.)

Items

Battery Low

Frequency

ID

Address

00 11 / 00 12

00 07 / 00 08

00 02 ~ 00 06

Default Data

00 / 00

00 / 01

Given value

New Data

-

-

-

Possible Adjusted

Value MAX (hex)

-

-

-

Note:

(*1) When you enter the address or New Data, please refer to the table below.

Possible Adjusted

Value MIN (hex)

-

-

-

Remarks

(*2)

Desired Number (hex.)

0

1

.

.

.

9

Input Keys

0

1

.

.

.

9

Desired Number (hex.)

A

B

C

D

E

F

Input Keys

[Flash] + 0

[Flash] + 1

[Flash] + 2

[Flash] + 3

[Flash] + 4

[Flash] + 5

(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the handset.

29


9 Service Mode

9.1.

How to Clear User Setting (Handset Only)

Handset

Press , , , simultaneously until a beep sound is heard. Then single handset is initialized.

(The contents of user setting are reset to factory default)

*Usage time is not cleared.

30

10 Troubleshooting Guide

10.1. Troubleshooting Flowchart


Cross Reference:

Check Power (P.32)

Check Playback (P.34)

Check Record (P.33)

Check Battery Charge (P.34)

Check Link (P.35)

Check the RF part (P.37)

Check Handset Transmission (P.42)

Check Handset Reception (P.42)

Check Caller ID (P.42)

31


10.1.1. Check Power

10.1.1.1. Base Unit


Power Supply Circuit/Reset Circuit (P.12)

10.1.1.2. Handset

Note:

BBIC is IC501.

(*1) Refer to Specifications (P.6) for part number and supply voltage of AC adaptor.

(*2) Refer to Circuit Board (Base Unit_Main) (P.73).



32

10.1.2. Check Record

10.1.2.1. Base Unit

A) Not record Incoming Message



Signal Route (P.23)

Telephone Line Interface (P.14)

Parallel Connection Detect Circuit/Auto Disconnect

Circuit (P.15)

Note:

Flash Memory is IC601.

BBIC is IC501.

33


10.1.3. Check Playback

10.1.3.1. Base Unit



10.1.4. Check Battery Charge

10.1.4.1. Base Unit

Note:

Flash Memory is IC601.

BBIC is IC1.

(*1) Refer to Circuit Board (Base Unit_Main) (P.73).


Charge Circuit (P.13)

10.1.4.2. Handset


Check Power (P.32)


10.1.4.3. Charger Unit



34

10.1.5. Check Link

10.1.5.1. Base Unit





Note:

*1 How to adjust +3.0V:

Execute the command "VDA"

Refer to Things to Do after Replacing IC or X'tal (P.54) for Base Unit.

*2 How to adjust the frequency of X501:

To see the frequency, execute the command “SFR“, then check the TP_CKM (IC501-57pin).

To adjust frequency, send command “SFR “ until the frequency counter becomes13.824 MHZ±55HZ.

35


10.1.5.2. Handset




Note:

*1 How to adjust the frequency of X1:

To see the frequency, execute the command “SFR“, then check the TP_CKM (IC1-46pin).

To adjust frequency, send command “SFR “ until the frequency counter becomes10.368 MHz±55HZ.

Refer to Things to Do after Replacing IC or X'tal (P.55) for Handset.

36


10.1.6. Check the RF part

10.1.6.1. Finding out the Defective part

After All the Checkings or Repairing

1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.

Note:

(*1) HS: Handset

(*2) BU: Base Unit

37


10.1.6.2. RF Check Flowchart

Each item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.39).

Please refer to the each item.

Note:

(*1) Refer to Check Link (P.35).

38


10.1.6.3. Check Table for RF part

No.

Item

1 Link Confirmation Normal

HS, BU Mode [Normal Mode]

2

X

' tal Frequency confirmation

BU (Base Unit) Check

1. Register Regular HS to BU (to be checked).

2. Press [Talk] key of the Regular HS to establish link.

Check X

' tal Frequency.

(13.824000 MHz ±100 Hz)

HS, BU Mode: [Adjustment]

3 TX confirmation

Regular HS (BU) Mode:

[Test RX Mode]

1. Place Regular HS 15 cm away from a checked BU.

2. Confirm "TXDATA" waveform of BU (*1) and “RXDATA“ waveform of Regular HS by

Digital Oscilloscope.

BU (HS) Mode:

[Test TX_Burst Mode]

4 RX confirmation

Regular HS (BU) Mode:

[Test TX_Burst Mode]

1. Place Regular HS 15 cm away from a checked BU.

2. Confirm "RXDATA" waveform of BU (*1) and “TXDATA“ waveform of Regular HS by


BU (HS) Mode:

[Test RX Mode]

5 Range Confirmation Normal

HS, BU Mode: [Normal Mode]


2. Press [Talk] key of the Regular HS to establish link.

3. Compare the range of the BU (being checked) with that of the Regular BU.

Note:

(*1) Adjustment Standard (Base Unit) (P.51)

(*2) Adjustment Standard (Handset) (P.53)

HS (Handset) Check

1. Register HS (to be checked) to Regular

BU.

2. Press [Talk] key of the HS to establish link.

Check X

' tal Frequency.

(10.368000 MHz ±100 Hz)

1. Place Regular BU 15 cm away from a checked HS.

2. Confirm "TXDATA" waveform of HS (*2) and "RXDATA" waveform of Regular BU by


1. Place Regular BU 15 cm away from a checked HS.

2. Confirm "RXDATA" waveform of HS (*2) and "TXDATA" waveform of Regular BU by


1. Register HS (to be checked) to Regular

BU.

2. Press [Talk] key of the HS to establish link.

3. Compare the range of the HS (being checked) with that of the Regular HS.

39


10.1.6.4. TEST RANGE Check

Circuit block which range is defective can be found by the following check.

Item

Range Confirmation TX TEST

(TX Power check)

BU (Base Unit) Check


HS (Handset) Check

1. Register HS (to be checked) to Regular BU.

HS, BU setting

Checked unit: Low TX power (*1)

Regular unit: High TX power (*1)

2. Set TX Power of the BU and the Regular HS according to CHART1.

3. At distance of about 20m between HS and BU,

Link OK = TX Power of the BU is OK.

No Link = TX Power of the BU is NG.


2. Set TX Power of the HS and the Regular BU according to CHART1.


Link OK = TX Power of the HS is OK.

No Link = TX Power of the HS is NG.

1. Register HS (to be checked) to Regular BU.

Range Confirmation RX TEST

(RX sensitivity check)

HS, BU setting

Checked unit: High TX power (*1)

Regular unit: Low TX power (*1)

2. Set TX Power of the BU and the Regular HS according to CHART1.


Link OK= RX Sensitivity of the BU is OK.

No Link = RX Sensitivity of the BU is NG.

2. Set TX Power of the Checking HS and the Regular BU according to CHART1.


Link OK= RX Sensitivity of the HS is OK.

No Link = RX Sensitivity of the HS is NG

CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST

BU (Base Unit) TX Power Check

BU (Base Unit) RX Sensitivity Check

BU (to be checked)

TX Power

Low

High

Regular_HS

TX Power

High

Low

HS (Handset) TX Power Check

HS (Handset) RX Sensitivity Check

Note:

(*1) Refer to Commands (P.50).

HS (to be checked)

TX Power

Low

High

Regular_BU

TX Power

High

Low

40

10.1.7. Registering a Handset to the Base Unit


10.1.8. Deregistering a Handset

10.1.9. Deregistering All Handsets by the Base Unit

41


10.1.10. Check Handset Transmission



10.1.11. Check Handset Reception



Note:

When checking the RF part, Refer to Check the RF part

(P.37).

10.1.12. Check Caller ID


Telephone Line Interface (P.14)

Calling Line Identification (Caller ID)/Call Waiting Caller

ID (P.16)

Note:

• Make sure the format of the Caller ID service of the

Telephone company that the customer subscribes to.

• It is also recommended to confirm that the customer is really a subscriber of the service.

42


11 Disassembly and Assembly Instructions

11.1. Disassembly Instructions

11.1.1. Base Unit

43


44

11.1.2. Handset


45


11.1.3. Charger Unit

46

11.2. How to Replace the Handset LCD

Note:

The illustrations are simplified in this page.

They may differ from the actual product.


47


12 Measurements and Adjustments

This chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in

Troubleshooting Guide (P.31)

12.1. Equipment Required

• Digital multi-meter (DMM): it must be able to measure voltage and current.

• Oscilloscope.

• Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; ±4 ppm)

Hewlett Packard, 53131A is recommended.

• DECT tester: Rohde & Schwarz, CMD 60 is recommended.

This equipment may be useful in order to precisely adjust like a mass production.

12.2. The Setting Method of JIG

<Preparation>

• Serial JIG cable: PQZZ1CD300E*

• PC which runs in DOS mode

• Batch file CD-ROM for setting: PNZZTG4021LA

Note:

*: If you have the JIG Cable for TCD500 series

(PQZZ1CD505E), change the following values of resistance. Then you can use it as a JIG Cable for both

TCD300 and TCD500 series. (It is an upper compatible JIG

Cable.)

R2

R3

R4

R7

Resistor Old value (k

Ω) New value (kΩ)

22 3.3

22

22

4.7

3.3

4.7

10

12.2.1. Connections (Base Unit)

Connect the AC adaptor.

Connect the JIG Cable GND (black).

Connect the JIG Cable RX (red) and TX (yellow).

Note:

*: COM port names may vary depending on what your PC calls it.

48

12.2.2. Connections (Handset)

Connect the DC Power or Battery to BATT+ and BATT-.

Connect the JIG cable GND (black) to GND.

Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.


Note:

*: COM port names may vary depending on what your PC calls it.

49


12.2.3. How to install Batch file into P.C.

Note:

• “*****” varies depending on the country or models.

12.2.4. Commands

See the table below for frequently used commands.

Command name rdeeprom readid writeid hookoff hookon getchk wreeprom

Function

Read the data of EEPROM

Read ID (RFPI)

Write ID (RFPI)

Off-hook mode on Base

On-hook mode on Base

Read checksum

Write the data of EEPROM

Example

Type “rdeeprom 00 00 FF”, and the data from address

“00 00” to “FF” is read out.

Type “readid”, and the registered ID is read out.

Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E

98” is written.

Type “hookoff”.

Type “hookon”.

Type “getchk”.

Type “wreeprom 01 23 45”. “01 23” is address and “45” is data to be written.

50

12.3. Adjustment Standard (Base Unit)

When connecting the simulator equipment for checking, please refer to below.

12.3.1. Bottom View


L361

F301

4

C142

C301

R301

D142

R165

C167

R507

R512

D143

R162

RA502

C479

3

R305

C307

R304

R307

C601

C512

C513

C184

R181

C186

R163

R601

R607

C475

C473

C472

C123

C133

R604

C521

R503

C332

C151

C124

C120

C525

R334

R167

C168

C115

C611

R505

C524

R506

R122

C126

Note:

(*1) is referred to No.2 of Check Check Table for RF part (P.39)

(*2) is referred to Power Supply Circuit/Reset Circuit (P.12)

51


12.4. Adjustment Standard (Charger Unit)



Digital

Volt Meter

12 /2 W

J1

1

2

A

DC POWER

DC 6.5 V

52

12.5. Adjustment Standard (Handset)


12.5.1. Component View


KX-TGA650XX

KX-TGA651XX

KX-TGA250XX

KX-TGA251XX

KX-TGA403XX

PNLB1734Y

PbF

TP_ANT1

TGA650XX

TGA651XX

C175

C70

C152

C71

R578

TGA250XX

TGA251XX

TGA403XX

C106

C104

C107

C103

R53

D21

R50

R231

C201

C200

C105

R236

C206

C203

R54

D22

BLK

BLK

C804

C811

C813

L802

C802

C837

C814

C

80

8

R805

R802

RED

C863

D14

C864

RA800

D13

R801

R808

C880

C73

C72

R880

C834

STM

R405

C44

R225

JTAG

R63

R66

1

R807

R203

C43

Q400

R402

D400

R400

C10

1.8V

RA4

C400

Q401

R27

C48

C40

C54

C52

C53

C55

R23

21

CLK

R37

R36

R249

C51

CP4.0V

C39 C30

R248

R20

CP3.0V

RA40

POWER

RECEIVER

RED

C332

Q12

Q11

R330

C342

R332

R331

C331

8

1

IC3

5

4

E

C341

C340

D7

R2

BATT+

F1

R30

R7

C147

R4

R8

R3

CHG(+)

C5

D3

C113

D4

CHG(-)

RCV-

RCV+

URX

MIC+

MIC-

BAT

UTX

GND

BATT-

A

MIC+ MIC-

Note:

(*1) is referred to No.2 of Check Check Table for RF part (P.39)

(*2) is referred to Power Supply Circuit/Reset Circuit (P.20)

CLK

CP 4.0V

CP 3.0V

1.8V

+

+

RX

TX

GND

53


12.6. Things to Do after Replacing IC or X'tal

If repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustment data, etc. in memory.

The set doesn't operate if it is not executed.

12.6.1. How to download the data

12.6.1.1. Base Unit

First, operate the PC setting according to The Setting Method of JIG(P.48).

Then download the appropriate data according to the following procedures.

EEPROM (IC611)

X'tal (X1)

Items

Adjusted parameter data is stored in memory.

(country version batch file, default batch file, etc.)

System clock

How to download/Required adjustment

1) Change the address “0001” of EEPROM to “55” to download the data.

2) Default batch file: Execute the command “default.bat”.

3) Country version batch file: Execute the command

“TG4021USLArevXXX_YYY.bat”. (*1)

4) Clock adjustment

Clock adjustment data is in EEPROM, adjust the data again after replacing it.

1) Apply 6.5V between DCP ad DCM with DC power.

2) Input Command "sendchar sfr", then you can confirm the current value.

3) Check X'tal Frequency.(13.824 MHz ± 100 Hz).

4) If the frequency is not 13.824 MHz ± 100 Hz, adjust the frequency of CLK executing the command "sendchar sfr xx xx

(where xx is the value)" so that the reading of the frequency counter is 13.824000 MHz ± 15 Hz.

Note:

(*1) XXX_YYY: revision number

“XXX”, “YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting

Method of JIG (P.48).

54


12.6.1.2. Handset

First, operate the PC setting according to The Setting Method of JIG (P.48).

Then download the appropriate data according to the following procedures.

EEPROM (IC3)

Battery Monitor Check

Battery Clock Adjustment

(X1)

Items

Adjusted parameter data is stored in memory.

(country version batch file, default batch file, etc.)

How to download/Required adjustment

1) Default batch file: Execute the command “default.bat”.

2) Default batch file (remaining): Execute the command

“TGA402USDEFrevXXX_YYY.bat”. (*2)

3) Country version batch file: Execute the command

“TGA402USLArevXXX_YYY.bat”. (*2)

4) Clock adjustment

5) 2.35 V setting and battery low detection

Battery Low Confirmation

-

-

CLK

1) Apply 2.25 V between BATT+ and BATT-.

2) Execute the command

sendchar PAD

sendchar LED 0

sendchar CRX 0 1

sendchar AD1

It assumes that the return value is XX.

a) 6c XX 71: No need to adjust

b) XX: 6A ~ 6B: Need to adjust

XX: 72 ~ 74: Need to adjust

Write AD value of 2.25 V to EEPROM.

ex) read data: XX = 6A, write data:YY = 6A

read data: XX =73, write data: YY = 73

EEPROM = 0009 (Low Voltage) write “YY“

Execute the command “wreeprom 00 09 01 YY“.

EEPROM = 000A (No Voltage) write “YY - 1D“

Execute the command “xwreeprom 00 0A 01 ZZ“.

Note:

No Voltage writing data limit is “00“.

c) XX: 00 ~ 69: Reject

XX: 75 ~ FF: Reject

1) Apply 2.40 V between BATT+ and BATT-.

2) Confirm that there is no flashing of Battery lcon.

3) Apply 2.25 V ± 0.08 V between BATT+ and BATT-.

4) Confirm that there is flashing of Battery lcon.

1) Apply 2.6 V between BATT+ and BATT- with DC power.

2) Input Command “sendchar sfr“, then you can confirm the current value.

3) Check X’tal Frequency. (10.368 MHz ± 100 Hz).

4) If the frequency is not 10.368 MHz ± 100 Hz, adjust the frequency of CLK execute in the command “sendchar sfr xx xx (where xx is the value)“ so that the reading of the frequency counter is 10.368000 MHz ± 5 Hz.

Note:

(*2) XXX_YYY: revision number

“XXX” and “YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting

Method of JIG (P.48).

55


12.7. Frequency Table

Channel 0

Channel 1

Channel 2

Channel 3

Channel 4

Ch. (hex)

00

01

02

03

04

TX/RX Frequency (MHz)

1928.448

1926.720

1924.992

1923.264

1921.536

56


13 Miscellaneous

13.1. How to Replace the Flat Package IC

Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

13.1.1. Preparation

• PbF (: Pb free) Solder

• Soldering Iron

Tip Temperature of 700

°F ± 20 °F (370 °C ± 10 °C)

Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil.

• Flux

Recommended Flux: Specific Gravity

→ 0.82.

Type

→ RMA (lower residue, non-cleaning type)

Note: See About Lead Free Solder (PbF: Pb free) (P.4)

13.1.2. How to Remove the IC

1. Put plenty of solder on the IC pins so that the pins can be completely covered.

Note:

If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.

2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.

3. While the solder melts, remove it together with the IC pins.

When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is left at the joint on the board, the new IC will not be attached properly.

57


13.1.3. How to Install the IC

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.

*Check the accuracy of the IC setting with the corresponding soldering foil.

2. Apply flux to all pins of the FLAT PACKAGE IC.

3. Solder the pins, sliding the soldering iron in the direction of the arrow.

13.1.4. How to Remove a Solder Bridge

1. Lightly resolder the bridged portion.

2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.

58


13.2. How to Replace the Shield Case



• Soldering Iron


°F ± 20°F (370°C ± 10°C)

Note:

We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil.

• Hot Air Desoldering Tool

Temperature: 608

°F ± 68°F (320°C ± 20°C)

13.2.2. Caution

• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.

• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

13.2.3. How to Remove the Shield Case

Note:

If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.

1. Cut the case along perforation.

2. Remove the cut part.

3. Cut the four corners along perforation.

4. Remove the reminds by melting solder.

59


13.2.4. How to Install the Shield Case

Note:

• If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.

• Shield case’s No. : PNMC1013Z

1. Put the shield case.

2. Solder the surroundings.

60


13.3. How to Replace the LLP (Leadless Leadframe Package) IC

Note:

This description is only applied on the model with Shield case.



• Soldering Iron


°F ± 20 °F (370 °C ± 10 °C)

Note:

We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil.

• Hot Air Desoldering Tool

Temperature: 608

°F ± 68 °F (320 °C ± 20 °C)

13.3.2. Caution

• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.

• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

13.3.3. How to Remove the IC

1. Heat the IC with a hot air desoldering tool through the P.C.Board.

2. Pick up the IC with tweezers, etc. when the solder is melted completely.

Note:

• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.

When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the

P.C.Board.

3. After removing the IC, clean the P.C.Board of residual solder.

61


13.3.4. How to Install the IC

1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached.

2. Place the solder a little on the land where IC pins are to be attached, then place the IC.

Note:

• When placing the IC, the positioning should be done very carefully.

3. Heat the IC with a hot air desoldering tool through the P.C.Board until the solder on IC bottom is melted.

Note:

• Be sure to place it precisely, controlling the air volume of the hot air desoldering tool.

4. After soldering, confirm there are no short and open circuits with visual inspection.

13.3.5. How to Remove a Solder Bridge

When a Solder Bridge is found after soldering the bottom of the IC, remove it with a soldering iron.

62


13.4. Terminal Guide of the ICs, Transistors and Diodes

13.4.1. Base Unit

13.4.2. Handset

63


14 Schematic Diagram

14.1. For Schematic Diagram

14.1.1. Base Unit (Schematic Diagram (Base Unit_Main))

Notes:

1. DC voltage measurements are taken with voltmeter from the negative voltage line.

2. The schematic diagrams may be modified at any time with the development of new technology.

14.1.2. Handset (Schematic Diagram (Handset_Main))

Notes:

1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.


14.1.3. Charger Unit (Schematic Diagram (Charger Unit))

Notes:

1. DC voltage measurements are taken with voltmeter from the negative voltage line.


64

Memo


65


14.2. Schematic Diagram (Base Unit_Main)

ANT2

CL2

ANT2

GND

C894

2.2p

W 0.2mm

L 10mm

1st layer

C892

5p

W 0.2mm

L mm

1st layer

GND

R807

470

W 0.15mm

L 20mm

3rd layer

GND

C822

10p

GND

C827

10p

C826

10p

RXON

RXn

C820

1.5p

RXp

GND

CL1

ANT1

GND

C893

3p

W 0.2mm

L 10mm

1st layer

GND

GND

1

3

2

DA802

W 0.2mm

L mm

1st layer

C891

5p

C895

GND

1.2p

C896 C859

2.2p

2.2p

GND

GND

GND

3

DA801

2

1

W 0.15mm

L 20mm

3rd layer

W 0.15mm

L 5.0mm

1st layer

L809

7.5n

W 0.15mm

L 5.0mm

1st layer

C825

10p

GND

R806

470

GND

C812

0.9p

W 0.2mm

L 10.0mm

1st layer

GND

GND

GND

C811

10p

C810

2.4p

GND

10

2APVCC

MSG_LED

ANS_LED

NC

KEYIN1

KEYIN2

KEYIN3

KEYS_C

KEYS_D

KEYS_E

1

VBAT

*R651

*R652

680

680

*WBX01 10pin

PARALLEL WIRE

AP1

*Q651

5

C1 B1

1

E

2

4

C2 B2

3

MSG_LED

ANS_LED

KEYIN1

KEYIN2

KEYIN3

KEYS_C

KEYS_D

KEYS_E

2

*SW1

1

NC

*C661

NC

C805

2.7p

GND

GND

C806

2.7p

TXp

TXn

VBAT

ANT1

TXON

TXn

TXp

RXp

RXn

RXON

ANT2

TO RF BLOCK

VBAT

TXON

ANT1

(1)

(2)

(3)

(4)

* Start Monitor

* When "SFR" command

is executed, 13.824MHz

frequency will be output.

FCT

+3.0V

JTAG_TDO

JTAG_TDI

JTAG_TCK

JTAG_TMS

JTAG_RTCK

RSTN

STM/CKM/P15

GND

RA501 33

7

8

5

6

4

3

2

1

C516 0.1u

C517 0.1u

C518 0.1u

61

62

63

58

59

60

64

65

66

54

55

56

57

51

52

53

48

49

50

45

46

47

TXp

RXp

RXn

GND_RF

TRSW_p

ANT_n

ATST_n

ATST_p

TEST

RSTN

NC

VCC_VCO

GPIO[27]

VDDUSB

DM_USB/GPI28

DP_USB/GPI29

VDDC1

JTAG_TDO

JTAG_TDI

JTAG_TCK

JTAG_TMS

JTAG_RTCK

*IC501

VDDC

RA502

10k

+3.0V

(5)

(6)

NC: No Components

66

SPN

SPP

+3.0V

R160

910

C

R172

100k

C173

C175 1000p

K0.22u

B

Q171

E

C174 NC

R181

0

Rx

C165 NC

E

C

Q161

B

C163 NC

R164

2.7k

R161

100k

Tx

C184

K1.0u

R151

100k

Q143

NC


Q141

R141

100k

REFERENCE

1XX : TEL LINE

3XX : POWER, CHARGE

4XX : MIC, SP

5XX : BBIC

6XX : FLASH, EEPROM, KEY, LCD

7XX : FOR DK

8XX : RF

Q142

B

C

E

C101 680p

D101

3 2

4 1

C102 680p

C115

NC

R115

NC

L101

33u

L102

33u

L1T

(YELLOW)

P101 22

L1R

(GREEN)

GAP

(1)

(2)

(3)

(4)

(5)

(6)

X501

13.824M

R509 NC

C120

1000p

3.0V

+3.0V

+3.0V

R121 390k C121 680p

R122 390k C122 680p

Caller ID

VDDC

HOOK

+3.0V

Bell

+6.5V

+6.5V

F301

3.0A

DCP

*IC501

GND

+3.0V

*IC601

8M FLASH

1

*CE

2

SO

3

*WP

4

VSS

VDD

*HOLD

SCK

SI

8

7

6

5

C

*C601 0.1u

E

R602

NC

B

Q601

NC

R603

NC

VCCA

VBG

VREF C505

MIN

VCCA

VREF

DCIN3/LIN1

DCIN2

DCIN1

DCIN0/LIN0

DOUBOUT

DOUBCAPP1

DOUBCAPP

DOUBCAPN

DOUBCAPN1

VBAT

COREOUT

VDDC2

GPIO[26]

GPIO[25]

GPIO[24]

GPIO[23]

GPIO[22]

GPIO[21]

GPIO[20]

19

18

17

16

15

14

22

21

20

10u

C506

1u

3

2

1

6

5

4

9

8

7

13

12

11

C504

C521

10

1u

1u

C502

10u

C524 NC

VDDC

C501

0.1u

4

3

VDDC

+3.0V

2

R136

NC

3

1

RA151

1k

4

L501

100n

1

2

RA504

68

PDN_DET

HOOK

BELL

KEYS_E

KEYS_D

KEYS_C

UTX

URX

BELL

C

Q111

B

E

3.0V

+3.0V

VBAT

VBAT

IC302

2

4

VOUT1

INPUT

VOUT2

ADJ

1

3

VBAT +6.5V

DCDC_OUT

*L361

220nH

*L371

220nH

L362

NC

L372

NC

JJ301 NC

DC/DC CONVERTOR

L301

NC

Q301 NC

1.2V

PDN_DET

R335

0

*IC331

2.7V

1

VOUT VIN

2

3

NC

VSS

4

2

1

IC301

NC

ON/*OFF

VIN

5

VSS

3

VOUT

EXT

4

DCDC_IC

+3.0V

C611 0.1u

IC611

64K EEPROM

1

A0

2

A1

3

A2

4

GND

VCC

WP

SCL

SDA

8

7

6

5

R605

R606

3.3k

3.3k

GND GND

ZA1 NC

11

12

10 9 8 7

6

1 2 3 4 5

DCM

CHARGE+

CHARGE-

CHG+2

CHG-2

+6.5V

NC: No Components

KX-TG4021/4022/4023LA SCHEMATIC DIAGRAM (Base Unit_Main)

67


14.3. Schematic Diagram (Base Unit_Operation)

2APVCC

MEG_LED

ANS_LED

KEYS_B

KEYIN1

KEYIN2

KEYIN3

KEYS_C

KEYS_D

KEYS_E

LED902

LED901

K

K

A

A

1

ERASE

2

1

RPT

2

1

STOP

2

1

UP

2 1

ANS1

2

1

MSG2

2

1

MSG1

2 1

SKIP

2

1

DOWN

2

LOCAT/INT

1 2

NC: No Components

KX-TG4021/4022/4023 SCHEMATIC DIAGRAM (Base Unit_Operation)

68

Memo


69


14.4. Schematic Diagram (Handset_Main)

C harge Current

BATTERY

BATT+

F1

5.6n

BATTERY

BATT-

R2

Q4

NC

D7

CHG(+)

CHARGE

Terminal

CHG(-)

GND GND

GND

+1.8V

R4

NC

R6

NC

R31

100

C121

NC

GND

R3

1k

Q9

GND

BAT

UTX

URX

GND

JTAG

R45

0.1

GND

C35

J56p

GND

2 3

1

RA61

220

4

R63

100

COL0

COL1

C1CP1

6.3V

330u

GND GND

UTX

URX

JTAG

Power_adj

PON

PSEL

VDD_PADRV

TXp

TXn

TXON

To PA

+1.8V

D400

NC

R406

NC

R401

NC

R407

NC

Q400

NC

R400

NC

C400

NC

GND

R403

NC

R404

NC

GND

GND

Q401

NC

GND

+1.8V

C340

NC

C341

J39p

GND

BATTERY

C342

NC

GND GND

R330

1M

Q11

C331

1u

GND

Q12

R331

27k

GND

R332

27k

GND GND

C332

1u

CKM

D1

C2 CP2

6.3V

330u

GND

R20

10

3.0V

4.0V

CP+3.0V

CP+4.0V

CP3.0V

CP4.0V

GND

Q2

(MAX500mA

+1.8V

1.8V

1.8V

GND

C10

K2.2u

(1)

(2)

(3)

C53

C52

K10u

K10u

POWER

C51

K1u

GND

C54 D10p

GND

C55

D10p

GND

C38

NC

1

S1

2

LCD_CSB

LCD_RESET

BELL_LED_A

C44

K0.1u

R225

0

STM

C45

K0.1u

TX _RF

C46

10p

72

73

74

75

76

68

69

70

71

77

78

79

80

61

62

63

64

65

66

67

BATTERY

RSTn

JTAG

P2_5/PCM_FSC/SF

P2_4/SCL1/PCM_DO/DP3

P2_3/SDA1/PCM_DI/DP2

P2_2/PCM_CLK/CLK100

P2_1/ECZ2/PWM1/LED4

P2_0/ECZ1/PWM0/LED3

VDD2

LDORF_CTRL

RF_SUPPLY2

RFP0n

RFP4

RFP3

VDD_PADR

VSS_PADR1

RF_TXp

RF_TXn

VSS_PADR2

RFP2

81

*IC1

GND

VBAT2

CP_C1y

CP_C2x

CP_C1x

VBAT1

PAOUTn/P3_0

VDDPA

PAOUTp/P3_1

P1_7/CHARGE

CHARGE_CTRL

SOCn

SOCp

NTC/ADC2

ADC1/INT0/P1_0

ADC0/P3_3

PARADET/P3_4

RINGOUT/RINGING/P3_5

RINGn/P3_6

RINGp/P3_7

CIDINp/VREFp

33

32

31

30

29

28

27

26

25

24

23

22

21

40

39

38

37

36

35

34

L47

CHARGE

CHARGE_CTRL

L46

SOCn

SOCp

COL0

COL1

COL2

COL3

COL4

GND

(4)

(5)

(6)

COL2

COL3

COL4

COL5

RF_RXp

RF_RXn

RXON

TO RF BLOCK

GND

RX _RF

0.75V

0V

GND

250 mVp-p

*X1

3

10.368M

2

GND

1

R215

0

C17

D10p

C18

D10p

RA4

3.3k

VREFm

R27 820

R28 820

VREFm

(7)

(8)

(9)

(10

(12)

(11

(14)

(13

(15

BATTERY

[EX /FX]

CP+3.0V

[RU]

CP+4.0V

*R248

0

*R249

NC

LCD B/L

BELL LED

(Amber)

*LED12 GND

KEY B/L

RF-SHIELD

RE2

GND

GND

*RA31

330

*RA30

330

*RA32

120

Q7

GND

NC: No Components

70


(1)

(2)

(3)

(4)

(5)

(6)

TP_ANT1

GND

C803

1.5p

L801

27n

C827

10p

W 0.15mm

L 20+/-2mm

3rd layer

2

3

1

DA801

GND

R807

220

*C826

4p

GND

RXON

RX_RF

RF_RXn

BATTERY

C30

NC

R37

NC

R36

NC

CP+3.0V

Q10

NC

GND

RA40

10k

C172

K0.1u

8

VCC

7

WP

6

SCL

5

SDA

*IC3

A0

A1

A2

GND

3

4

1

2

GND

BATTERY

C188

K1u

GND

GND GND

W 0.15mm

L 5.0mm

1st layer

BPF

GND GND

W 0.15mm

L 5.0mm

1st layer

GND

W 0.125mm

L 7.6mm

Gap 0.125mm

1st layer

RF_RXp

BATTERY

R801:220k

R808:NC

W 0.15mm

L 20+/-1mm

3rd layer

Q880

NC

GND GND

GND

GND

C812

10p

W 0.15mm

L 20+/-2mm

3rd layer

GND

GND

GND

GND GND

11

GND

10

9

8

7

6

VCC

PO

POX

PSEL

PAON

GND

PSET

VCCS

PI

PIX

PRAMP

3

4

5

1

2

IC801

W 0.15mm

L 3.0mm x2

1st layer

R806

220

Balun

GND

Pre-matching

GND

TXON

2

1

RA800

1k

3

4

PSEL

PON

GND

GND

S p-phone RX/Beep

GND

GND

GND

*C834

1p

R805 47

Power_adj

TXn

TX_RF

TXp

VDD_PADRV

1

2

+

-

SP-PHONE_SPEAKER

GND

GND

GND

GND

(7)

(8)

(9)

(10)

(11)

(12)

(13)

(14)

(15)

LSRp

LSRn

LSRp

RX-AF (H andset)

LCD_SDA

LCD_SCL

LCD_CD

LCD_RESET

LCD_CSB

R55

1k

*R233

NC

GND GND GND GND GND

*C204

0.1

CP+3.0V

GND

*C186

NC

*C187

NC

GND

GND

GND to LCD UNIT (Monochrome 1.4inc 3Line/for TGA250) to LCD UNIT (Monochrome 1.8inc FullDot/for TGA651)

LSRp

LSRn

TX _AF

MICp

MICn

C152 k1000p

RCV+

1

+

2

RCV-

-

RECEIVER

MIC+

MIC-

D4

NC

GND

R73

GND

GND

GND

C113 D10p

1

82

R74

82

2

D3

NC

C75

D10p

C74

D10p

VREFm

GND

GND

VREFm

MIC AP1

71

KX-TGA403 SCHEMATIC DIAGRAM (Handset_Main)


14.5. Schematic Diagram (Charger Unit)

TP3

J1

1

2

F1

TP4

G

R1 12 TP2

TP1

SCHEMATIC DIAGRAM (Charger Unit)

72

15 Printed Circuit Board

15.1. Circuit Board (Base Unit_Main)



for JIG

}

GND

UTX

URX

VDDC

+3.0V

R122

C126

C115

R167

C168

R163

R181

C186

C184

D142

D143

R162 C142

R165

C167

C524

R505

R506

C611

C475

C525

C473

C120

C124

C472

C123

C151

C133

C521

C332

R604

R334

R503

C512

C513

C601

C479

R507

R512

3

R601

R607

RA502

C301

R304

R305

R307

C307

R301

F301

4

L361

KX-TG4021/4022/4023 CIRCUIT BOARD (Base Unit_Main (Component View))

STM/CKM

VBAT

73



C893

SA101

L101

SA103

D101

C859

C896

C306

Q142

R144

R807

R892

C515

L809 C812

C813

C805

C810

C516

C518

RA501

R891

R806

R142

C508

IC301

C303

C305

Q301

L301

C519

R509

X501

C185

C304

R160

C509

C505

C506

C172

C503

R501

R333

C342

C173

C164

C161

L102

R111

E

R171

C174

Q171

R175

R113

C113

R176

C176

D113

R371

D331

R652

R651

C660

C658

C659

C652

C653

C654

C651

C655

C656

KX-TG4021/4022/4023 CIRCUIT BOARD (Base Unit_Main (Bottom View))

74


15.2. Circuit Board (Base Unit_Operation)

PNLB1753Z

KX-TG4021/31H

ERASE

RPT

MSG1

MSG3

MSG2

LED902

MSG4

SKIP

PbF

LED901

ANS1

UP

DOWN

STOP LOCAT/INT

A

KX-TG4021/4022/4023 CIRCUIT BOARD (Base Unit_Operation (Component View))

75


Memo

76


15.3. Circuit Board (Handset_Main)


KX-TGA650XX

KX-TGA651XX

KX-TGA250XX

KX-TGA251XX

KX-TGA403XX

PNLB1734Y

PbF

BATT+

CHG (+)

TP_ANT1

RECEIVER

RED

BLK

TGA650XX

TGA651XX

C175

C70

C152

C71

R578

TGA250XX

TGA251XX

TGA403XX

C106

C104

C107

C103

R53

D21

R50

R231 C201

C200

C105

R236

C206

C203

R54

D22

BLK

C804

C811

C813

L802

C802

C834

STM

R405

C44 R225

JTAG

R63

R66

C837

1

D400

Q400

R402

R400

C400

Q401

C10

1.8V

RA4

R27

R807

R203

C43

C48

R23

21

C40

C54

C52

C53

CLK

R37

R36

C39 C30

R249

C51

CP4.0V

R248

CP3.0V

R20

C55

RA40

POWER

C814

C808

R805

R802

RED

D13

C863

D14

C864

RA800

R880

R801

R808

C880

C73

C72

C332

Q12

Q11

R330

C342

R332

R331

C331

8

1

IC3

5

4

E

C341

BATT+

C340

D7

R2

F1

R30

R7

C147

R4

R8

R3

C5

CHG(+)

D3

C113

D4

CHG(-)

RCV-

RCV+

URX

MIC+

MIC-

BAT

UTX

GND

BATT-

A

MIC+ MIC-

RCV+

RCV-

SP-

SP+

X_CLK

(10.368MHZ)

URX

UTX

GND

}

BAT

BATT-

CHG (-)

KX-TGA403 CIRCUIT BOARD (Handset_Main (Component View))

JIG

77



LED12

PbF

PNLB1734Y

KX-TGA650XX

KX-TGA651XX

KX-TGA250XX

KX-TGA251XX

KX-TGA403XX

CN5

12 1

TGA650XX

TGA651XX

CN51

R51

R52

TGA250XX

TGA251XX

TGA403XX

SOFT_A SOFT_B SOFT_C

UP

TALK S1

LED8

SP

LEFT

DOWN

RIGHT

LED6

R

1

4

2

5

3

6

7

8 9

0 #

A

MIC

KX-TGA403 CIRCUIT BOARD (Handset_Main (Bottom View))

78

15.4. Circuit Board (Charger Unit)



R1

J1


A

CIRCUIT BOARD (Charger unit (Component View) )

TP4 (GND)

J1

1

2

TP3

CIRCUIT BOARD (Charger unit (Bottom View) )

A

79


16 Exploded View and Replacement Parts List

16.1. Cabinet and Electrical Parts (Base Unit)

1

2

3

9

10

11

12

PCB2

5

4

6

8

13

7

A

14(*1)

A

E1

PCB1

13

14(*1)

15

16

A

Ref.No.

Figure

A

2.6 x 8mm

Note:

(*1) The SPACERs (No.14) are cut from the excess parts of SPACER (No.108) of Cabinet and Electrical Parts (Handset)

(P.81).

80

16.2. Cabinet and Electrical Parts (Handset)

105

106

107

E101(*1)

E103


111

B

E106

E105

E107

103

104

102

E102

108 E104

113

B

109

110

MIC100

PCB100

112

101

118

120

115

116 (*2)

119 (*3)

114

117

B

Ref.No.

B

Figure

Ǿ

2

8 mm

Battery cover

Spacer (No.119)

Stick it between ribs.

Put it in the center.

Note:

(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.47).

(*2) The rechargeable Ni-MH battery HHR-4DPA or HHR-4MRT is available through sales route of Panasonic.

(*3) Attach the SPACER (No. 119) to the exact location described above.

81


16.3. Cabinet and Electrical Parts (Charger Unit)

200

200-1

PCB200

200-2

B

200-3

B

200-4

Ref.No.

B

Figure

82

16.4. Accessories

A1 A2

A3


83


16.5. Replacement Parts List

1. RTL (Retention Time Limited)

Note:

The “RTL” marking indicates that its Retention Time is

Limited.

When production is discontinued, this item will continue to be available only for a specific period of time.

This period of time depends on the type of item, and the local laws governing parts and product retention.

At the end of this period, the item will no longer be available.

2. Important safety notice

Components identified by the mark indicates special characteristics important for safety. When replacing any of these components, only use specified manufacture's parts.

3. The S mark means the part is one of some identical parts.

For that reason, it may be different from the installed part.

4. ISO code (Example: ABS-94HB) of the remarks column shows quality of the material and a flame resisting grade about plastics.

5. RESISTORS & CAPACITORS

Unless otherwise specified;

All resistors are in ohms (

Ω) k=1000Ω, M=1000kΩ

All capacitors are in MICRO FARADS (

µF) p=µµF

*Type & Wattage of Resistor

16.5.1. Base Unit

16.5.1.1. Cabinet and Electrical Parts

Safety Ref.

No.

1

2

3

4

5

6

7

8

9

10

11

12

Part No.

Part Name & Description Remarks

PNKM1132V3

K2ECYZ000001 JACK, DC

PQJJ1T039S JACK, MODULAR

L0AA02A00087 SPEAKER

PQHG10729Z

PQHR11313Z

PNKE1056Z1

PNJT1047Z

PNBC1307Z1

PNHR1259Z

PNBC1308Z1

PNJK1079Z

RUBBER PARTS, SPEAKER

GUIDE, SPEAKER

GUIDE, BUTTON HOLDER

BUTTON, MESSAGE

KEYBOARD SWITCH

PS-HB

ABS-HB

CASE, CHARGE TERMINAL PS-HB

CHARGE TERMINAL

BUTTON, NAVIGATOR KEY PS-HB

PS-HB

AS-HB

Safety Ref.

No.

13

14

15

16

Part No.

PNLA1030Z

PNYE1027Z

PNKF1099Y1

PQHA10023Z


ANTENNA

SPACER, ANTENNA

CABINET COVER

RUBBER PARTS, FOOT

CUSHION

PS-HB

16.5.1.2. Main P.C. Board Parts

Note:

(*1) When replacing IC611 or X501, make the adjustment using PNZZTG4021LA. Refer to How to download the

data (P.54) of Things to Do after Replacing IC or X'tal.

Safety Ref.

No.

PCB1

Part No.


PNWP14021LAH MAIN P.C.BOARD ASS'Y

(RTL)

(ICs)

IC302 C0CBAYG00016 IC S

IC331 C0EBE0000124 IC

IC501 C2HBCY000064 IC(BBIC)

IC601 PNWI24021LAH IC(FLASH)

IC611 PNWI14021LAH IC(EEPROM) (*1)

(TRANSISTORS)

Q111 2SC6054JSL TRANSISTOR(SI)

Q141

Q142

Q161

Q171

Q651

B1ACGP000008 TRANSISTOR(SI)

PQVTBF822T7 TRANSISTOR(SI)

2SD0874AS

2SC6054JSL

TRANSISTOR(SI)

TRANSISTOR(SI)

B1GFCFEN0011 TRANSISTOR(SI) S

(DIODES)

PQVDMD5S DIODE(SI) D101

D113

D133

D143

D473

MA111

MA111

MANV250GEL

MAZ805100L

DIODE(SI) S

DIODE(SI) S

DIODE(SI)

DIODE(SI)

DA801 B0DDCD000001 DIODE(SI)

DA802 B0DDCD000001 DIODE(SI)

(COILS)

L101

L102

L361

PQLQXF330K

PQLQXF330K

COIL S

COIL S

G1CR22J00006 COIL

L371

L476

L501

L809

G1CR22J00006 COIL

G1CR22J00006 COIL

G1CR10J00010 COIL

G1C7N5JA0044 COIL

(RESISTOR ARRAYS)

RA151 D1H410220001 RESISTOR ARRAY

RA501 EXB28V330 RESISTOR ARRAY

RA502 EXB28V103 RESISTOR ARRAY

RA504 D1H468020001 RESISTOR ARRAY

(VARISTOR)

R141

R142

R145

R151

R152

R160

R161

R162

R163

R164

R165

SA101 J0LF00000048 VARISTOR (SURGE

ABSORBER)

(RESISTORS)

R111

R112

PQ4R10XJ104 100k S

PQ4R10XJ104 100k S

R113

R114

R121

R122

R131

R133

ERJ3GEYJ103 10k S




PQ4R18XJ106 10M S



PQ4R18XJ272 2.7k S

ERJ2GEJ222 2.2k S

ERJ2GEJ104 100k S

ERJ2GEJ474X 470k S

ERJ3GEYJ911 910 S



ERJ12YJ120 12

ERJ3GEYJ272 2.7k S


84

C132

C142

C151

C152

C161

C167

C171

C173

C175

C176

C101

C102

C111

C112

C113

C120

C121

C122

C123

C126

C178

C184

C186

C302

C306

C321

C322

C341

C342

C343

C351

C352

C476

C477

C478

C479

C501

C502

C503

C504

C505

C506

Safety Ref.

No.

R167

R171

R172

R175

R176

R178

R181

R321

R322

R331

R332

R334

R335

R371

R372

R501

R502

R505

R512

R604

R605

R606

R607

R612

R651

R652

R806

R807

R891

R892

Part No.


ERJ12YJ270

ERJ2GEJ220

ERJ2GEJ104

ERJ2GEJ561

27

22 S

100k S

560 S

ERJ2GEJ101

ERJ2GEJ102

100 S

1k S

ERJ2GE0R00 0

ERJ2RKF1400 140

S

ERJ2RKF1000 100

ERJ3EKF4702 47k

ERJ3EKF6802 68k

ERJ2GEJ473

ERJ2GE0R00

47k S

0 S

ERJ1TYJ5R6U 5.6

ERJ1TYJ5R6U 5.6

ERJ3GEYJ100 10

ERJ2GEJ330 33

ERJ2GEJ222

S

S

2.2k S

ERJ2GEJ102

ERJ2GEJ103

ERJ2GEJ332

1k S

10k S

3.3k S

ERJ2GEJ332

ERJ2GE0R00

ERJ2GEJ103

3.3k S

0 S

10k S

ERJ3GEYJ681 680

ERJ3GEYJ681 680

ERJ2GEJ471

ERJ2GEJ471

ERJ2GEJ471

ERJ2GEJ471

470

470

470

470

(CAPACITORS)

F1K2H681A008 680p

F1K2H681A008 680p

F1J2A473A024 0.047

S

S

S

S

S

S

F1J2A473A024 0.047

PQCUV1A684KB 0.68

ECUE1H102KBQ 0.001

F1K2H681A008 680p

F1K2H681A008 680p

ECUE1H100DCQ 10p


ECUV1H103KBV 0.01

ECUV1H103KBV 0.01


ECUE1C103KBQ 0.01

F2G1H1000009 10

ECUV1H102KBV 0.001

ECUV1C223KBV 0.022

ECUV1A224KBV 0.22

ECUE1H102KBQ 0.001

PQCUV0J106KB 10

ECUE1C223KBQ 0.022

ECUV1A105KBV 1



F2A1C1010119 100

ECUV1A105KBV 1


F2A1A3310040 330

ECUV1C104KBV 0.1


ECUV1C105KBV 1






ECUE1A104KBQ 0.1

ECJ1VB0G106M 10

ECJ1VB0G106M 10

ECUE0J105KBQ 1

ECJ1VB0G106M 10

ECUV1A105KBV 1


Safety Ref.

No.

C507

C508

C509

C510

C511

C512

C513

C514

C515

C516

C517

C518

C519

C520

C521

C522

C530

C601

C611

C805

C806

C810

C811

C812

C813

C820

C822

C825

C826

C827

C859

C863

C891

C892

C893

C894

C895

C896

Part No.


E1

P101

F301

X501

ECUV1A225KB 2.2


ECUE1H120JCQ 12p

ECUV1A105KBV 1

ECJ1VB0G106M 10


ECUV1A225KB 2.2


ECUV1A105KBV 1






ECUE0J105KBQ 1





F1G1H2R7A480 2.7p

F1G1H2R7A480 2.7p

F1G1H2R4A480 2.4p

F1G1H100A723 10p

F1G1HR90A480 0.9p

F1G1H2R0A480 2p

F1G1H1R5A480 1.5p

F1G1H100A723 10p

F1G1H100A723 10p

F1G1H100A723 10p

F1G1H100A723 10p

F1G1H2R2A480 2.2p

F1G1H1R5A480 1.5p

F1G1H5R0A480 5p

F1G1H5R0A480 5p

F1G1H3R0A480 3p

F1G1H2R2A480 2.2p

F1G1H1R2A480 1.2p

F1G1H2R2A480 2.2p

(OTHERS)

WBX10SH-3.5G LEAD WIRE, PARALLEL

WIRE

D4DAY220A022 THERMISTOR (POSISTOR) S

K5H302Y00003 FUSE

H0J138500011 CRYSTAL OSCILLATOR (*1)

16.5.1.3. Operational P.C. Board Parts

Safety Ref.

No.

PCB2

Part No.


PNWP2TG4031H OPERATIONAL

ASS'Y (RTL)

(DIODES)

LED901 LNJ237W82RA LED

LED902 LNJ237W82RA LED

S

S

16.5.2. Handset


Safety Ref.

No.

101

102

103

104

105

106

107

108

109

110

111

Part No.


PNGP1087Y5

PNYE1026Z

PNKM1123Y6

PNHS1072Z

PANEL, LCD PMMA-HB

TAPE, DOUBLESIDED

CABINET BODY PS-HB

SPACER, RECEIVER NET

PQHS10467Z COVER, SPEAKER NET

L0AD02A00043 RECEIVER

PQHG10729Z RUBBER PARTS, RECEIVER

PNYE1027Z

PNBC1003Y3

PNJK1071V

PNHX1165Z

SPACER, CUSHION LCD

BUTTON, VOLUME KEY ABS-HB

KEYBOARD SWITCH

COVER, LCD SHEET

85


Safety Ref.

No.

112

113

114

115

116

117

118

119

120

Part No.


PNJT1027Z

PNJT1026Z

PQHR11315Z

CHARGE TERMINAL (L)

CHARGE TERMINAL (R)

GUIDE, SPEAKER ABS-HB

L0AA02A00095 SPEAKER

PQHS10784Y

PQJC10056W

PNKF1093Z1

PNHS1079Z

PNKK1038Y1

SPACER, SPEAKER NET

BATTERY TERMINAL

CABINET COVER

SPACER, BATTERY

LID, BATTERY

ABS-HB

ABS-HB


Note:

(*1) Reconfirm the model No. written on the handset's name plate when replacing PCB100. Because the model No. of the optional handset may differ from the included handset.

(*2) When replacing IC3 or X1, make the adjustment using PNZZTG4021LA. Refer to Handset (P.55) of Things to Do after Replacing IC or X'tal.

(*3) When replacing the handset LCD, See How to

Replace the Handset LCD (P.47).

(*4) When removing E106, use special tools (ex. Hot air disordering tool).

Safety Ref.

No.

Part No.


PCB100 PNWPGA403LAR MAIN P.C.BOARD ASS'Y

(RTL) (*1)

IC1

IC3

IC801

Q2

Q4

Q7

Q9

Q11

Q12

(ICs)

C1CB00003361 IC (BBIC (FLASH))

PNWIGA403LAR IC (EEPROM) (*2)

C1CB00001842 IC

(TRANSISTORS)

B1ADGE000004 TRANSISTOR(SI)

B1ADGE000004 TRANSISTOR(SI)

UN9219J

2SC6054JSL

TRANSISTOR(SI) S

TRANSISTOR(SI)

B1ADCF000161 TRANSISTOR(SI)

B1ADCF000161 TRANSISTOR(SI)

(DIODES)

MA2YD2120L DIODE(SI) D1

D7

D13

D14

D21

D22

DA801

MA2ZD0200L

MA8043M

MA8043M

MA8043M

MA8043M

DIODE(SI)

DIODE(SI) S

DIODE(SI) S

DIODE(SI) S

DIODE(SI) S

B0DDCD000001 DIODE(SI)

(LEDS)

LED4

LED5

LED6

LED7

LED8

LED9

LED21

LED22

LED23

B3ACB0000190 LED

B3ACB0000190 LED

B3ACB0000190 LED

B3ACB0000190 LED

B3ACB0000190 LED

B3ACB0000190 LED

B3ACB0000216 LED

B3ACB0000216 LED

B3ACB0000216 LED

(COILS)

F1

L801

L802

L803

RA1

RA4

RA30

RA31

RA32

RA40

RA61

RA800

PQLQR2M5N6K COIL S

G1C27NJ00010 COIL

G1C3N6ZA0063 COIL

G1C3N6ZA0063 COIL

(RESISTOR ARRAYS)

D1H810240004 RESISTOR ARRAY


S

D1H83314A013 RESISTOR ARRAY


EXB28V121JX RESISTOR ARRAY

EXB28V103 RESISTOR ARRAY



(IC FILTERS)

S

C47

C49

C50

C51

C52

C53

C54

C35

C40

C43

C44

C45

C46

C1

C2

C5

C10

C11

C12

C13

C17

C18

C55

C74

C75

C96

C97

C103

C104

C105

C107

C113

C152

C172

R232

R248

R330

R331

R332

R801

R802

R805

R806

R807

R66

R73

R74

R203

R215

R225

R231

R27

R28

R30

R31

R45

R50

R51

R3

R7

R8

R20

R23

R52

R53

R54

R55

R63

R64

Safety Ref.

No.

L46

L47

Part No.


J0JDC0000045 IC FILTER

J0JDC0000045 IC FILTER

(RESISTORS)

ERJ2GEJ102 1k S

ERJ2GEJ122

ERJ2GEJ101

ERJ2GEJ100

ERJ2GEJ102

1.2k S

100

10

S

S

1k S

ERJ2GEJ821

ERJ2GEJ821

820

820

S

S

ERJ3GEYJ152 1.5k S

ERJ2GEJ101 100

ERJ6RSJR10V 0.1

ERJ2GEJ103

ERJ2GEJ471

S

10k S

470 S

ERJ2GEJ102

ERJ2GEJ332

ERJ2GEJ103

ERJ2GEJ102

ERJ2GEJ101

ERJ2GEJ103

1k S

3.3k S

10k S

1k S

100 S

10k S

ERJ2GEJ102

ERJ2GEJ820

ERJ2GEJ820

1k S

82 S

82 S

D0GA563ZA006 56k

ERJ2GE0R00 0 S

ERJ2GE0R00

ERJ2GEJ824

0 S

820k S


ERJ2GE0R00 0 S

ERJ2GEJ105X 1M S



ERJ2GEJ122 1.2k S

ERJ2GEJ101

ERJ2GEJ470

ERJ2GEJ221

ERJ2GEJ221

100

47

220

220

S

S

S

S

(CAPACITORS)

F2A0J3310067 330

F2A0J3310067 330

ECUV1A105KBV 1

ECUV1A225KB 2.2


PQCUV0J106KB 10










ECUV1A105KBV 1

ECUV1A105KBV 1

ECUV1A105KBV 1

ECUV1A105KBV 1

PQCUV0J106KB 10

PQCUV0J106KB 10








F1G1H100A723 10p


ECUE1H330JCQ 33p S


ECUE1H102KBQ 0.001


86

Safety Ref.

No.

C182

C188

C200

C201

C203

C204

C331

C332

C341

C802

C803

C804

C805

C806

C808

C809

C810

C811

C812

C813

C814

Part No.


F1G1H3R0A480 3p

ECUE0J105KBQ 1

ECUV1C105KBV 1

ECUV1C105KBV 1

ECUV1C105KBV 1


ECUE0J105KBQ 1

ECUE0J105KBQ 1


F1G1H2R0A480 2.0p

F1G1H1R5A480 1.5p

F1G1H2R0A480 2.0p

F1G1H3R3A480 3.3p

F1G1H3R3A480 3.3p


F1G1H100A723 10p

F1G1H1R6A480 1.6p

F1G1H100A723 10p

F1G1H100A723 10p

F1G1H1R6A480 1.6p

ECUE1H332KBQ 0.0033

C819

C822

C825

C826

C827

C834

C860

C861

F1G1H100A723 10p

F1G1H100A723 10p

F1G1H100A723 10p

F1G1H4R0A480 4p

F1G1H100A723 10p

F1G1H1R0A480 1p

F1G1H100A723 10p

F1G1H3R0A480 3p

(OTHERS)

MIC100 L0CBAY000032 MICROPHONE

E101

E102

L5DYBYY00012 LIQUID CRYSTAL DISPLAY

PNHR1247Z

(*3)

TRANSPARENT PLATE, LCD PMMA-HB

E103

E104

E105

E106

PNHR1246Z

PNHX1254Z

PNLA1020Z

PNMC1013Z

GUIDE, LCD

COVER, LCD

ANTENNA

CASE,MAGNETIC SHIELD

(*4)

ABS-HB

E107

X1

PNVE1002Z BATTERY TERMINAL

H0J103500033 CRYSTAL OSCILLATOR (*2)

16.5.3. Charger Unit



16.5.4. Accessories

Note:

You can download and refer to the Operating Instructions

(Instruction book) on TSN Server.

Safety Ref.

No.

A1

A2

A3

Part No.

PQLV219Y

PQJA10075Z

PNKL1010Z1

16.5.5. Screws


AC ADAPTOR

CORD, TELEPHONE

STAND, WALLMOUNT ABS-HB

Safety Ref.

No.

Part No.


A XTB26+8GFJ TAPPING SCREW

B XTB2+8GFJ TAPPING SCREW

16.5.6. Fixtures and Tools

Note:

(*1) See Equipment Required (P.48), and The Setting

Method of JIG (P.48)

(*2) When replacing the Handset LCD, See How to

Replace the Handset LCD (P.47)

Safety Ref.

No.

Part No.


PQZZ1CD300E JIG CABLE (*1)

PNZZTG4021LA BATCH FILE CD-ROM (*1)

PQZZ430PIR

PQZZ430PRB

TIP OF SOLDERING IRON

(*2)

RUBBER OF SOLDERING IRON

(*2)

Safety Ref.

No.

200

Part No.

PNLC1010ZT


CHARGER UNIT ASS'Y without NAME PLATE

(RTL)(for KX-

TG4022LAT)(for KX-

TG4023LAT)

PS-HB

200-4 PQHA10023Z RUBBER PARTS, FOOT

CUSHION

PS-HB


Safety Ref.

No.

Part No.


PCB200 PNWPTGA641CH MAIN P.C.BOARD ASS'Y

(RTL)

(JACK)

J1 K2ECYB000001 JACK

(RESISTOR)

S

R1

F1

ERG2SJ120 12

(FUSE)

K5H302Y00003 FUSE

T.I

KXTG4021LAT

KXTG4022LAT

KXTG4023LAT

KXTGA403LAT

87

Panasonic KX-TG4021 LAT, KX-TG4022 LAT, KX-TG4023 LAT, KX-TGA403 LAT digital cordless phone Service manual

Assistant Bot

Model No.

Telephone Equipment

Expandable Digital Cordless Answering

System

T: Black Metallic Version

(for Latin America)

TABLE OF CONTENTS

1 Safety Precautions

1.1.

For Service Technicians

2 Warning

2.1.

Battery Caution

2.2.

About Lead Free Solder (PbF: Pb free)

2.3.

Discarding of P. C. Board

3 Specifications

4 Technical Descriptions

4.1.

US-DECT Description

4.2.

Block Diagram (Base Unit_Main)

4.3.

Block Diagram (Base Unit_RF Part)

4.4.

Circuit Operation (Base Unit)

4.5.

Block Diagram (Handset)

4.6.

Block Diagram (Handset_RF Part)

DA801

TXON

RXON

RF_RXn

RF_RXp

4.7.

Circuit Operation (Handset)

4.8.

Circuit Operation (Charger Unit)

4.9.

Signal Route

5 Location of Controls and Components

6 Installation Instructions

7 Operating Instructions

8 Test Mode

8.1.

Engineering Mode

9 Service Mode

9.1.

How to Clear User Setting (Handset Only)

10 Troubleshooting Guide

10.1. Troubleshooting Flowchart

11 Disassembly and Assembly Instructions

11.1. Disassembly Instructions

11.2. How to Replace the Handset LCD

12 Measurements and Adjustments

12.1. Equipment Required

12.2. The Setting Method of JIG

12.3. Adjustment Standard (Base Unit)

12.4. Adjustment Standard (Charger Unit)

12.5. Adjustment Standard (Handset)

12.6. Things to Do after Replacing IC or X'tal

12.7. Frequency Table

13 Miscellaneous

13.1. How to Replace the Flat Package IC

13.2. How to Replace the Shield Case

13.3. How to Replace the LLP (Leadless Leadframe Package) IC

13.4. Terminal Guide of the ICs, Transistors and Diodes

14 Schematic Diagram

14.1. For Schematic Diagram

14.2. Schematic Diagram (Base Unit_Main)

14.3. Schematic Diagram (Base Unit_Operation)

14.4. Schematic Diagram (Handset_Main)

14.5. Schematic Diagram (Charger Unit)

F1

15 Printed Circuit Board

15.1. Circuit Board (Base Unit_Main)