Panasonic TG3531 BXS, BXB, TG3532 BXS, BXB, TGA351 BXS, BXB telephone Service manual

ORDER NO. KM40611246CE

Telephone Equipment

KX-TG3531BXS

KX-TG3531BXB

KX-TG3532BXS

KX-TG3532BXB

KX-TGA351BXS

KX-TGA351BXB

2.4 GHz Expandable Digital Cordless

Answering System

Silver Version

Black Version

(for Asia, Middle Near East and Other areas)

© 2007 Panasonic Communications Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.

KX-TG3531BXS/KX-TG3531BXB/KX-TG3532BXS/TG3532BXB/KX-TGA351S/KX-TGA351B

2

TABLE OF CONTENTS

PAGE

1 Safety Precaution ------------------------------------------------ 4

1.1. For Service Technicians --------------------------------- 4

2 Warning -------------------------------------------------------------- 4

2.1. Battery Caution--------------------------------------------- 4

2.2. About Lead Free Solder (PbF: Pb free)-------------- 4

3 Specifications ----------------------------------------------------- 5

4 Technical Descriptions ----------------------------------------- 6

4.1. FHSS Description ----------------------------------------- 6

4.2. Explanation of Link Data Communication ----------- 9

4.3. Block Diagram (Base Unit_Main)---------------------10

4.4. Block Diagram (Base Unit_RF Part) -----------------11

4.5. Circuit Operation (Base Unit)--------------------------12

4.6. Block Diagram (Handset)-------------------------------20

4.7. Block Diagram (Handset_RF Part)-------------------21

4.8. Circuit Operation (Handset)----------------------------22

4.9. Circuit Operation (RF Part)-----------------------------26

4.10. Circuit Operation (Charger Unit) ----------------------29

4.11. Signal Route -----------------------------------------------30

5 Location of Controls and Components ------------------32

5.1. Controls -----------------------------------------------------32

5.2. Displays -----------------------------------------------------32

6 Installation Instructions ---------------------------------------33

6.1. Setting Up the Base Unit -------------------------------33

6.2. Setting Up the Handset ---------------------------------33

6.3. Battery Installation/Replacement ---------------------33

6.4. Battery Charge --------------------------------------------34

7 Operation Instructions-----------------------------------------35

7.1. Programmable Settings ---------------------------------35

7.2. Copying Handset Phonebook Items -----------------37

7.3. Dial Lock ----------------------------------------------------37

7.4. Error Messages -------------------------------------------38

7.5. Troubleshooting-------------------------------------------39

8 Test Mode ----------------------------------------------------------41

8.1. Adjustment and Test Mode Flow Chart -------------41

9 Service Mode -----------------------------------------------------51

9.1. How to Clear User Setting------------------------------51

9.2. Copying Phonebook Items when Repairing -------53

10 Troubleshooting Guide ----------------------------------------55

10.1. Troubleshooting Flowchart -----------------------------55

10.2. How to Replace the Flat Package IC ----------------68

10.3. How to Replace the LLP (Leadless Leadframe

Package) IC------------------------------------------------70

11 Disassembly and Assembly Instructions ---------------72

11.1. Disassembly Instructions -------------------------------72

11.2. How to Replace the Handset LCD -------------------76

11.3. Antenna soldering work ---------------------------------77

12 Measurements and Adjustments---------------------------78

12.1. Things to Do after Replacing IC or X'tal ------------78

12.2. Base Unit Reference Drawing-------------------------79

12.3. Handset Reference Drawing---------------------------80

12.4. Frequency Table ------------------------------------------81

13 Schematic Diagram ---------------------------------------------82

13.1. For Schematic Diagram---------------------------------82

13.2. Schematic Diagram (Base Unit_Main) --------------84

13.3. Schematic Diagram (Base Unit_RF Part) ----------86

13.4. Schematic Diagram (Base Unit_Operation) -------87

13.5. Schematic Diagram (Handset_Main) ----------------88

13.6. Schematic Diagram (Handset_RF Part) ------------90


PAGE

13.7. Schematic Diagram (Charger Unit)------------------ 91

14 Printed Circuit Board ------------------------------------------ 93

14.1. Circuit Board (Base Unit_Main) ---------------------- 93

14.2. Circuit Board (Base Unit_RF Part)------------------- 95

14.3. Circuit Board (Base Unit_Antenna)------------------ 96

14.4. Circuit Board (Base Unit_Operation)---------------- 97

14.5. Circuit Board (Handset_Main) ------------------------ 99

14.6. Circuit Board (Handset_RF Part) ------------------ 101

14.7. Circuit Board (Charger Unit)------------------------- 102

15 Appendix Information of Schematic Diagram------- 103

15.1. CPU Data (Base Unit) -------------------------------- 103

15.2. CPU Data (Handset) ---------------------------------- 104

15.3. Explanation of IC Terminals (RF Part) ------------ 105

15.4. Terminal Guide of the ICs, Transistors and

Diodes ---------------------------------------------------- 106

16 Exploded View and Replacement Parts List --------- 107

16.1. Cabinet and Electrical Parts (Base Unit) --------- 107

16.2. Cabinet and Electrical Parts (Handset)----------- 108

16.3. Cabinet and Electrical Parts (Charger Unit) ----- 109

16.4. Accessories and Packing Materials ----------------110

16.5. Replacement Parts List--------------------------------113

3


1 Safety Precaution

1.1.

For Service Technicians

ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on worktable.

4. Do not grasp IC or LSI pins with bare fingers.

2 Warning

2.1.

Battery Caution

1. Danger of explosion if battery is incorrectly replaced.

2. Replace only with the same or equivalent type recommended by the manufacturer.

3. Dispose of used batteries according to the manufacture’s Instructions.

2.2.

About Lead Free Solder (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),

Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder.

Caution

• PbF solder has a melting point that is 50 °F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with temperature control and adjust it to 700 °F ± 20° F (370°C ± 10°C).

• Exercise care while using higher temperature soldering irons.:

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600°C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the opposite side (See the figure below).

4


2.2.1.

Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper

(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other materials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

3 Specifications

5


4 Technical Descriptions

4.1.

FHSS Description

4.1.1.

Frequency

The frequency range of 2.4 GHz - 2.48 GHz is used. Transmitting and receiving channel between Base Unit and Handset is same frequency. Refer to Frequency Table (P.81).

4.1.2.

FHSS (Frequency Hopping Spread Spectrum)

This telephone is using an IC chip which has similar specification to WDCT (World Digital Cordless Telephone) and is the telephone system that can use multiple portable unit simultaneously. The explanation of this system is mentioned below. This system uses a Time Division Multiple Access/Time Division Duplex (TDMA/TDD) scheme:

transmitting and receiving frequencies of the Base Unit and Handset are shared in the same frequency. The construction of RX/

TX frequency data is shown below. It consists of 4 slots from the Base Unit to the Handset, and 4 slots from the Handset to the

Base Unit, total 8 slots in 10ms. By this slot system, simultaneous air link and communication between 4 Handsets and the Base

Unit can be realized. One communication between Handset and the Base Unit is done by one slot from the Base Unit to Handset, and another slot from Handset to the Base Unit.

DSS makes spectrum spread by multiplying carrier signal by PN code. The purpose to make spectrum spread is to reduce power density per time and per band. On the other hand, FHSS makes spectrum spread by changing channel every 10ms according to Hopping table. Also the purpose to make spectrum spread is to reduce power density per time andper band.

6

4.1.2.1.

TDD Frame Format


Sync Field (72bit): Preamble 56bit + SyncWord 16bit

Base Unit (Handset) adjusts the timing of reception so that reception of Base Unit (Handset) can correspond to transmission of

Handset (Base Unit).

It is necessary for sync-field that Handset gets synchronization.

A - field (64bit): Each kinds of DATA: ch data, line condition, etc.

B - field (320bit + 80bit): Sound data + parity

Z - field (4bit): Parity Check

4.1.2.2.

TDMA system

This system is the cycles of 10ms, and has four duplex paths, so it is possible to perform four duplex communications simultaneously.

In 1 slot 1.25ms, the 10ms of voice data is transmitted.

Each slot makes every frame frequency hop. (100hops/sec.)

Although each slot (UpLink3 and UpLink4) uses different frequency, UpLink3 and DownLink3 use the same frequency.

• 2 - Handsets Link

Traffic Bearer

A link is established between Base Unit and Handset.

The state where duplex communication is performed.

The hopping pattern of a 1800hops (18 seconds) cycle.

Dummy Bearer

The Base Unit sends Dummy-data to the all stand-by state Handsets.

The Handsets receive that data for keeping synchronization and monitoring request from the Base Unit.

Dummy Bearer doesn't contain B-field (sound) data.

7


4.1.3.

Signal Flowchart in the Whole System

Reception

CN101 of the Base Unit is connected to the TEL line, and signal is entered through the bridge diode D101. While talking, the relay (Q141) is turned ON and amplified at the Q171, then led to DSP (IC501). The DSP encodes ADPCM and TDD/TDMA with

FHSS to TX-DATA. The TX-DATA signal is entered to IC701 of RF UNIT, and modulated to 2.4 GHz. The RF signal is fed into

Tx/Rx switch (D704). The RF signal is passed through filter (FL701) and fed to ANTENNA.

As for the Handset, RF signal from the antenna passes through filter (FL701), then is routed by Tx/Rx switch (D704) and led to

IC701. The RF signal is amplified by LNA and down-converted to IF signal in IC701. The IF signal passing through internal filter is demodulated into RX-DATA, then enters DSP (IC501). The DSP performs TDD/TDMA and ADPCM decoding to convert the

RX-DATA into the voice signal, then it is output to the speaker.

Transmission

The voice signal entering from the microphone is led to DSP (IC501). The DSP encodes ADPCM and TDD/TDMA with FHSS to

TX-DATA. The TX-DATA signal enters IC101 of RF UNIT, and is modulated to 2.4 GHz. The RF signal is fed into Tx/Rx switch

(D704). The RF signal is passed through filter (FL701) and fed to ANTENNA.

As for the Base Unit, RF signal from the antenna passes through filter (FL701), then is routed by Tx/Rx switch (D704) and led to

IC701. The RF signal is amplified by LNA and down-converted to IF signal in IC701. The IF signal passing through internal filter is demodulated, then enters DSP (IC501). The DSP performs TDD/TDMA and ADPCM decoding to convert the RX-DATA into the voice signal. The voice signal is amplified at the TX amplifier (Q161), then output to the TEL line CN101 through the relay

(Q141) and bridge (D101).

8


4.2.

Explanation of Link Data Communication

4.2.1.

Calling

4.2.2.

To Terminate Communication

4.2.3.

Ringing

9


4.3.

Block Diagram (Base Unit_Main)

MSG_LED

IN USE_LED

ANSWER_LED

D

3

KEYA

KEY1

SPP

SPN

12

OSC-IN

SEG3

CLK,RST

SI,SO,CS,

INT_1

10


4.4.

Block Diagram (Base Unit_RF Part)

TC_CTRL

RSTN

RXEN

RXGAIN

TXEN

VCC

XIN

11


4.5.

Circuit Operation (Base Unit)

General Description:

(DSP, Flash Memory) is a digital speech/signal processing system that implements all the functions of speech compression, record and playback, and memory management required in a digital telephone answering machine.

The DSP system is fully controlled by a host processor DSP. The host processor provides activation and control of all that functions as follows.

4.5.1.

DSP (Digital Speech/Signal Processing: IC501)

• Voice Message Recording/Play back

The DSP system use a proprietary speech compression technique to record and store voice message in Flash Memory.

An error correction algorithm is used to enable playback of these messages from the Flash Memory.

• DTMF Generator

When the DTMF data from the Handset is received, the DTMF signal is output.

• Synthesized Voice (Pre-recorded message)

The DSP implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.

• Caller ID demodulation

The DSP implements monitor and demodulate the FSK signals that provide CID information from the Central Office.

• Digital Switching

The voice signal from telephone line is transmitted to the handset or the voice signal from handset is transmitted to the Telephone line, etc. They are determined by the signal path route operation of voice signal.

• Block Interface Circuit

RF part, LED, Key scan, Speaker, Microphone, Telephone line, LCD.

4.5.2.

Flash Memory (IC601)

Following information data is stored.

• Voice signal ex: Pre-recorded Greeting message, Incoming message

• Settings ex: message numbers, ID code, Flash Time, Tone/Pulse

12


4.5.3.

Power Supply Circuit

Function:

The power supply voltage from AC adaptor is converted to the desired voltage of each block.

Circuit Operation:

• Q300 and IC300: 4.0V DCDC Converter

• IC331: 3.3V Regulator

13


4.5.3.1.

Charge Circuit

The voltage from the AC adaptor is supplied to the charge circuits.

The charge is controlled by the handset.

14


4.5.4.

Reset Circuit

Function:

This circuit is used to initialize the microcomputer when it incorporates an AC adaptor.


When the AC Adaptor is inserted into the unit, then the voltage is shifted by IC331 and power is supplied to the DSP.

The set starts to operate when VCC goes up to 3.0V or more in the circuit voltage diagram.

Note:

(*1) The initializing time of the DSP chip is 28ms under normal conditions.

15


4.5.5.

Telephone Line Interface

Telephone Line Interface Circuit:

Function

• Bell signal detection

• ON/OFF hook and pulse dial circuit

• Side tone circuit

Bell signal detection and OFF HOOK circuit:

In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T) and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:

T

→ L101 → R111 → C111 → Q111 → DSP pin 58 [BELL]

When the CPU (DSP) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through the circuit). Following signal flow is the DC current flow.

T

→ L101 → D101 → Q141 → Q161 → R163 → D101 → L102 → P101 → R

ON HOOK Circuit:

Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an onhook condition.

Pulse Dial Circuit:

Pin 59 of DSP turns Q141 ON/OFF to make the pulse dialing.

Side Tone Circuit:

Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is canceled by the canceller circuit of DSP.

16


4.5.6.

Auto Disconnect Circuit

Function:

This circuit is used to detect the fact that another telephone connected to the same line is OFF-HOOK while the unit is in a receiving status or OGM transmitting status.


The voltage of pin 90 of IC501 is monitored. If a parallel-connected telephone is put into OFF HOOK status, the presence/ absence of a parallel connection is determined when the voltage changes by 0.2V or more. When the set detects the parallelconnected telephone is OFF HOOK status, the line is disconnected.

You can enable or disable the Auto Disconnect function.

See Check Record (P.57)

17


4.5.7.

Parallel Connection Detect Circuit

Function:

In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone connected in parallel is on hook or off hook by detecting changes in the T/R voltage.


Parallel connection detection when on hook:

When on hook Q136 is ON, the voltage is monitored at pin 86 of IC501. There is no parallel connection if the voltage is

1.65 V or higher, while a parallel connection is deemed to exist if the voltage is lower.

Parallel connection detection when off hook:

When off hook Q136 is OFF, the voltage is monitored at pin 90 of IC501; the presence/absence of a parallel connection is determined when the voltage changes by 0.2 V or more.

18


4.5.8.

Calling Line Identification (Caller ID)

Function:

The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been entered for the circuit being used.

The Caller-ID data from exchange is supplied to the telephone using either method of FSK or DTMF. The method is chosen according to the exchange of telephone office. This unit is available to receive the data with both methods and displays the received data on LCD.

FSK (Frequency Shift Keying) format

DTMF format

It is the method to send the telephone number of calling party with DTMF to the telephone. DTMF is sent before the first bell signal.

The data is sent in turn; first the start code, secondly the telephone number of calling party, lastly end code.

The DTMF is chosen from A (1633 Hz and 697 Hz), B (1633 Hz and 770 Hz), C (1633 Hz and 852 Hz) and D (1633 Hz and 941

Hz) as the start code and end code according to the exchange.

19


4.6.

Block Diagram (Handset)

IC541

EEPROM

X501

13.824MHz

ANT

CHARGE

Q531

CHARGE

DETECT

Q361

D361

Q362, Q363

CHARGE

CONTROL

Q521

RESET

IC521

POWER DOWN

IC371

3.0V

REGULATOR

BATTERY

MIC

SP

Q551

LED551~554

Q555

LED561 LED555~556

Headset Jack

HSSPOUT

LINO (HS_MIC)

CN431

Q431

HEADSET

DETECT

HEADSET_DET

ANT_LED1

BL_LED

SPOUTP

SPOUTN

CI

CI

Monitor SP

LCD

IC381

3.3V

REGULATOR

IC382

2.5V

REGULATOR

CHG_DET

CHG_CTL

RESET

PDN

VCC

VCCA

VCCPA

MIP

MIN

LOUTO (SP)

IC501

DSP

OSC_IN

TX_DATA

RX_DATA

PA_CONT

RADIO_EN

CON_EN

SYN_LE2

SYN_OUT

SYN_DATA

SYN_CLK

SYN_LE1

RX_GAIN

RX_EN

TX_EN

SHCTRL

RF_RESET

RSSI

KEYS

V_PA

V_RF

RF part

KX-TGA351 BLOCK DIAGRAM (Handset)

20

4.7.

Block Diagram (Handset_RF Part)


TC_CTRL

RSTN

RXEN

RXGAIN

TXEN

VCC

XIN

21


4.8.

Circuit Operation (Handset)

4.8.1.

Construction

The circuit mainly consists of DSP and RF part as shown in the block diagram.

4.8.1.1.

DSP: IC501

Function

• Battery Low, Power down detect circuit

• Ringer Generation

• Interface circuit

RF part, Speaker, Mic, LED, Key scan, LCD, Headset

Initial waves

Note:

(*1) The initializing time of the DSP chip is 20ms under normal conditions.

4.8.1.2.

RF part

Mainly voice signal is modulated to RF, or it goes the other way.

4.8.1.3.

EEPROM: IC541

All setting data is stored.

ex: ID code, user setting (Phonebook, Caller ID data)

22

4.8.2.

Power Supply Circuit

Voltage is supplied separately to each block.


23


4.8.3.

Charge Circuit

When the Handset is put on the cradle of the Base unit or the charger, the power is supplied from CHARGE+ and CHARGE- terminals to charge the battery via D361 and R366 or Q361. The voltage between CHARGE+ and CHARGE- flows R531

→ Q531

→ pin38 of IC501, where the charge is detected. Then IC501 calculates the battery consumption amount from the previous charge, and it controls Q361/Q362/Q363 by pin80 of IC501 until charging is complete. When charging is complete, the control pattern is switched to Trickle charging form from Operational charging form.

4.8.4.

Ringer and Handset SP-Phone

24


4.8.5.

Sending Signal

The voice signal from the microphone is input to DSP (90, 91). CN431 is the headset jack. When the headphone is connected, the Q431 detect it. The input from the microphone of the Handset (MIM, MIP) is cut and the microphone signal from the headset is input to DSP (95). Also the power for the microphone is supplied from DSP (92) and the power is turned OFF on standby.

4.8.6.

Reception Signal

The voice signal from the Base Unit is output to DSP (98). This signal is led to the headset jack (CN431). The signal through the headset jack and the other signal output from DSP (97) drives the speaker. When the headset is inserted to the jack, the voice signal is cut at the jack, so the sound does not come out from the speaker, but from the headset only.

25


4.9.

Circuit Operation (RF Part)

General Description:

RF part includes Transmitter and Receiver functions. Digital signals (Mainly voice data) that come from DSP, are modulated and are transmitted. On the other hand, received signals are demodulated and go out to DSP.

26


4.9.1.

2.4GHz Mod/Demod Circuit (Base Unit RF Part)

IC701 incorporates all of the modulation and demodulation functions. TX Digital data (TX_DATA) from DSP is supplied to pin 27 of

IC701, and then 2.4 GHz TX modulated signal is output from pin1. This TX signal is filtered by BPF (FL701) and supplied to

Antenna. 2.4 GHz RX signal from the Antenna is filtered by BPF (FL701) and supplied to pin4 of IC701, then demodulated signal

(RX_DATA) comes out from pin 16. At the same time, RSSI (Received Signal Strength Indicator) outputs from pin 14. Reference clock (13.824 MHz) from DSP block is supplied to pin 11 of IC701. V_PA and V_RF supply 2.5V regulated voltage.

Note:

The exposed GND_PLATE on the bottom of the IC701 supplies the circuit ground(s) for the entire chip. It is very important that a good solder connection is made between this GND_PLATE and the ground plane of the PCB underlying the IC701.

27


4.9.2.

2.4GHz Mod/Demod Circuit (Handset RF Part)

IC701 incorporates all of the modulation and demodulation functions. TX Digital data (TX_DATA) from DSP is supplied to pin 27 of

IC701, and then 2.4 GHz TX modulated signal is output from pin1. This TX signal is filtered by BPF (FL701) and supplied to

Antenna. 2.4 GHz RX signal from the Antenna is filtered by BPF (FL701) and supplied to pin4 of IC701, then demodulated signal

(RX_DATA) comes out from pin 16. At the same time, RSSI (Received Signal Strength Indicator) outputs from pin 14. Reference clock (13.824 MHz) from DSP block is supplied to pin 11 of IC701. V_RF supplies 2.5 V regulated voltage. V_PA supplies 3.3 V regulated voltage.

Note:

The exposed GND_PLATE on the bottom of the IC701 supplies the circuit ground(s) for the entire chip. It is very important that a good solder connection is made between this GND_PLATE and the ground plane of the PCB underlying the IC701.

28


4.10. Circuit Operation (Charger Unit)

The voltage from the AC adaptor is supplied to the charge circuits. Main charge (180~250mA at the Battery) of maximum 7hours is started soon after the Handset is placed on the Charger Unit. Then it changes to Trickle charge to prevent from overcharging.

The route for this is as follows: DC + pin of CN1

→ R1 ~ R5, R7 ~ R13 → CHARGE + pad → Handset → CHARGE-pad → DCpin of CN1.

29


4.11. Signal Route

30

RF part signal route


31


5 Location of Controls and Components

5.1.

Controls

5.1.1.

Base Unit

5.1.2.

Handset

32

5.2.

Displays

5.2.1.

Handset Display Items

6 Installation Instructions

6.1.

Setting Up the Base Unit

6.1.1.

Connecting the AC Adaptor and

Telephone Line Cord


6.2.

Setting Up the Handset

6.2.1.

Connecting the AC Adaptor

6.3.

Battery Installation/

Replacement

33


6.4.

Battery Charge

6.4.2.

Panasonic Battery Performance

6.4.1.

Battery Level

34


7 Operation Instructions

7.1.

Programmable Settings

You can customize the unit by programming the following features using the handset.

To access the features, there are 2 methods:

- scrolling through the display menus

- using the direct commands

• Mainly the direct command method is used in these operating instructions.

7.1.1.

Programming by Scrolling through the Display Menus

35


7.1.2.

Programming using the Direct Commands

36


7.2.

Copying Handset Phonebook Items

You can copy one or all of the phonebook items from one handset to another.

7.2.1.

Copying all items

7.3.

Dial Lock

For Service Hint:

*: If the current password is forgetten, enter "726276642" and you will be able to go to step 3.

37


7.4.

Error Messages

38

7.5.

Troubleshooting


39


40


8 Test Mode

8.1.

Adjustment and Test Mode Flow Chart

8.1.1.

Test Burst Mode for Base Unit

Note:

(*1) Refer to Check Table for RF part (P.63).

41


8.1.2.

TX-CW Mode for Base Unit

Note:


42

8.1.3.

RX-CW Test Mode for Base Unit


Note:


43


8.1.4.

Test Link Mode for Base Unit

Note:

(*1) Refer to TX-CW Mode for Handset (P.47). If you can not proceed to the next step, refer to Registering a Handset (P.61).


(*3) for factory use only

44

8.1.5.

Adjustment Mode for Base Unit


p

Cross Reference

Check and Adjust Frequency (Base Unit) (P.78)

Note:

(*1) Refer to the table below, if using Frequency Counter for checking.

BCK

13.824 MHz

±30 Hz

±100 Hz

TEST MODE Frequency (1 Channel)

→

2400.724512 MHz

→

±5.20 kHz

→ ±17.36 kHz

45


8.1.6.

Test Burst Mode for Handset

Note:

(*1) LCD displays the Channel number.

(exception: default/ CH00 = 1ch.)


46

8.1.7.

TX-CW Mode for Handset


Note:




47


8.1.8.

RX-CW Test Mode for Handset

Note:




48

8.1.9.

Test Link Mode for Handset


Note:



(*2) If can not proceed to the next step, refer to Registering a Handset (P.61).

(*3) for factory use only.


49


8.1.10. Adjustment Mode for Handset

Cross Reference

(*1) Adjust Battery Low Detector Voltage (Handset) (P.78)

Note:

(*2) These are the default values.

(*3) These values may not be fixed depending on the battery strength.

(*4) Refer to the table below, if using Frequency Counter for checking.

BCK TEST MODE Frequency (1 Channel)

13.824 MHz → 2400.724512 MHz

±30 Hz → ±5.20 kHz

±100 Hz

→

±17.36 kHz

50


9 Service Mode

9.1.

How to Clear User Setting

Units are reset to the Factory settings by this operation (Erase recorded Voice messages, stored Phone numbers, Caller list and etc.).

This operation should not be performed for a usual repair.

9.1.1.

Base Unit

Note:

(*1) Telephone line must be connected.

51


9.1.2.

Handset

Note:

(*1) Be sure to short the battery terminals of the Handset with a lead wire, etc. for 2 seconds for discharge after removing the battery.

52


9.2.

Copying Phonebook Items when Repairing

You can copy the handset phonebook to another (compatible Panasonic) handset. This will help to save the original phonebook data which the customer has registered.

Refer to the following procedures.

53


Note:

• If the max number of handsets are already registered to the base unit, a new handset cannot be registered.

• To register the handset, refer to Registering a Handset (P.61).

• To cancel the handset, refer to Deregistering a Handset (P.61).

• To copy the handset phonebook, refer to Copying Handset Phonebook Items (P.37)

54

10 Troubleshooting Guide

10.1. Troubleshooting Flowchart


Cross Reference:

Check Power (P.56)

Check Playback (P.58)

Check Record (P.57)

Check Battery Charge (P.58)

Check Link (P.59)

Check the RF part (P.60)

Check Handset Transmission (P.67)

Check Handset Reception (P.67)

Check Caller ID (P.67)

Note:

(*1) When a user claims that the unit disconnects a call right after the greeting message and no incoming messages can be recorded, this symptom can not be reappeared with TEL simulator in the service center. In this case, try Check

Record (P.57) item (C), (D).

55


10.1.1. Check Power


Power Supply Circuit (P.13)

Reset Circuit (P.15)

Note:

DSP is IC501.

(*1) Refer to Specifications (P.5) for part number and supply voltage of AC adaptor.

(*2) Refer to Circuit Board (Base Unit_Main) (P.93).

56

10.1.2. Check Record

BASE UNIT

A) Not record Greeting Message

B) Not record Incoming Message


C) How to change the Auto Disconnect activation (time)

Some Telephone Company lines (fiber or cable) ON Hook and OFF Hook voltages are lower than conventional lines, which may cause a malfunction of Auto Disconnect detection. To solve this problem, try changing the Auto Disconnect activation through the procedures below.

Auto Disconnect detect

Enable*1

Enable*1 [default]

Disable*2

Disable

CPC detect PROCEDURE at Stand-by mode

“STOP”+”GREETING CHECK”+“INTERCOM” simultaneously

“STOP”+“GREETING CHECK”+“VOL. ” simultaneously

“STOP”+“GREETING CHECK”+“VOL. ” simultaneously

Note:

*1 Both Auto Disconnect and CPC don’t detect for the first 2 seconds.

*2 If the “Disable” is selected, even if the parallel-connected telephone is OFF HOOK, the line isn’t disconnected.

D) How to change the VOX level

It makes easier to detect a small voice (caller) by raising the sensitivity of VOX level. Therefore, the recording of TAM is not turned off during a detection.

Normal [default]

6 dB Up

VOX Level sensitivity


Signal Route (P.30)

Telephone Line Interface (P.16)

Auto Disconnect Circuit (P.17)

Parallel Connection Detect Circuit (P.18)

Note:

PROCEDURE

Flash Memory is IC601.

DSP is IC501.

57


10.1.3. Check Playback


Power Supply Circuit (P.13)

10.1.4. Check Battery Charge

Note:

Flash Memory is IC601.

DSP is IC501.

Note:

(*1) Refer to Specifications (P.5) for part number and supply voltage of AC adaptor.

58

10.1.5. Check Link


Note:

DSP is IC501.

(*1) Refer to Check the RF part (P.60).


Check the RF part (P.60)

59


10.1.6. Check the RF part

10.1.6.1. Finding out the Defective part

After All the Checkings or Repairing

1. Re-register the checked Handset to the checked Base Unit, and Regular HS to Regular BU.

Note:

(*1) HS: Handset

(*2) BU: Base Unit

60

10.1.6.1.1. Registering a Handset


10.1.6.1.2. Deregistering a Handset

10.1.6.1.3. Deregistering all handsets by the base unit

61


10.1.6.2. RF Check Flowchart

Each item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.63).

Please refer to the each item.

Note:

(*1) Refer to Things to Do after Replacing IC or X'tal (P.78)

62


10.1.6.3. Check Table for RF part

No.

Item

1 Link Confirmation Normal

HS, BU Mode [Normal Mode]

2 Control signal confirmation

BU (Base Unit) Check

1. Register Regular HS to BU (to be checked).

2. Press [Talk] key of the Regular HS to establish link.

Check DSP interface. (*2)

HS, BU Mode: [Test Burst Mode] (*1)

3 X’tal Frequency confirmation (*7) Check X’tal Frequency.

(13.824000 MHz ± 100 Hz)

HS, BU Mode: [Adjustment] (*3)

4 TX Power confirmation

Regular HS, BU Mode:

[RX-CW Mode.] (*4)

HS, BU (to be checked) Mode:

[Test Burst Mode.] (*1)

5 RX Sensitivity confirmation

1. Place the Regular HS about 15cm away from the BU.

2. Confirm that RSSI of the Regular HS is approximately 2V by Oscilloscope. (*5)

Regular HS, BU Mode:

[Test Burst Mode.] (*1)

HS, BU (to be checked) Mode:

[RX-CW Mode.] (*4)

6 Range Confirmation Normal

1. Place the Regular HS about 15cm away from the BU.

2. Confirm that RSSI of the BU is approximately 2V by Oscilloscope. (*5)

HS, BU Mode: [Normal Mode]


2. Press [Talk] key of the Regular HS to establish link.

3. Compare the range of the BU (being checked) with that of the Regular BU.

Note:

(*1)(*3)(*4) Test Mode (P.41)

(*2) RF-DSP Interface Signal Wave Form (P.65)

(*5) Base Unit Reference Drawing (P.79)

(*6) Handset Reference Drawing (P.80)

(*7) Things to Do after Replacing IC or X'tal (P.78)

HS (Handset) Check

1. Register HS (to be checked) to Regular

BU.

2. Press [Talk] key of the HS to establish link.

Check DSP interface. (*2)

Check X’tal Frequency.

(13.824000MHz ±100Hz)

1. Place the HS about 15cm away from the

Regular BU.

2. Confirm that RSSI of the Regular BU is approximately 2V by Oscilloscope. (*6)

1. Place the HS about 15cm away from the

Regular BU.

2. Confirm that RSSI of the HS is approximately 2V by Oscilloscope. (*6)

1. Register HS (to be checked) to Regular

BU.

2. Press [Talk] key of the HS to establish link.

3. Compare the range of the HS (being checked) with that of the Regular HS.

63


10.1.6.4. TEST RANGE Check

Circuit block which range is defective can be found by the following check.

Item

Range Confirmation TX TEST

(TX Power check)

HS, BU Mode:

[Test Link Mode] (*1)

BU (Base Unit) Check


2. Set BU to “Test Link mode”.

3. Set Regular HS to “Test Link mode”.

*Set TX Power and RX Sensitivity of the BU and the

Regular HS by CHART1.

HS (HandSet) Check

1. Register HS (to be checked) to Regular BU.

2. Set Regular BU to “Test Link mode”.

3. Set HS to “Test Link mode”.

*Set TX Power and RX Sensitivity of the HS and the

Regular BU by CHART1.

Range Confirmation RX TEST

(RX sensitivity check)

* At distance of about 20m between HS and BU,

Link OK = TX Power of the BU is OK.

No Link = TX Power of the BU is NG.


2. Set BU to “Test Link mode”.

3. Set Regular HS to “Test Link mode”.

HS, BU Mode:

[Test Link Mode] (*1) *Set TX Power and RX Sensitivity of the BU and Regular

HS by CHART1.


Link OK = TX Power of the HS is OK.

No Link = TX Power of the HS is NG.

1. Register HS (to be checked) to Regular BU.

2. Set Regular BU to “Test Link mode”.

3. Set HS to “Test Link mode”.

* Set TX Power and RX Sensitivity of Checking_HS and

Regular_BU by CHART1.


Link OK= RX Sensitivity of the BU is OK.

No Link = RX Sensitivity of the BU is NG.


Link OK= RX Sensitivity of the HS is OK.

No Link = RX Sensitivity of the HS is NG

CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST

BU (Base Unit) TX Power Check

BU (Base Unit) RX Sensitivity Check

BU (to be checked)

TX Power

High

High

RX Sens.

High

High

TX Power

High

Low

Regular_HS

RX Sens.

Low

High

HS (Handset) TX Power Check

HS (Handset) RX Sensitivity Check

Note:

(*1) Test Mode (P.41)

HS (to be checked)

TX Power RX Sens.

High

High

High

High

TX Power

High

Low

Regular_BU

RX Sens.

Low

High

64

10.1.6.5. RF-DSP Interface Signal Wave Form

Test Burst Mode:


65


Test Burst Mode:

66

10.1.7. Check Handset Transmission




10.1.8. Check Handset Reception



Note:

When checking the RF part, Refer to Check the RF part

(P.60).

10.1.9. Check Caller ID


Telephone Line Interface (P.16)

Calling Line Identification (Caller ID) (P.19)

Note:

• Make sure the format of the Caller ID services of the Telephone company that the customer subscribes to.

• It is also recommended to confirm that the customer is really a subscriber of the service.

67


10.2. How to Replace the Flat Package IC

10.2.1. Preparation

• PbF (: Pb free) Solder

• Soldering Iron

Tip Temperature of 700

°F ± 20°F (370°C ± 10°C)

Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil.

• Flux

Recommended Flux: Specific Gravity

→ 0.82.

Type

→ RMA (lower residue, non-cleaning type)

Note: See About Lead Free Solder (PbF: Pb free) (P.4).

10.2.2. How to Remove the IC

1. Put plenty of solder on the IC pins so that the pins can be completely covered.

Note:

If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.

2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.

3. While the solder melts, remove it together with the IC pins.

When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is left at the joint on the board, the new IC will not be attached properly.

68


10.2.3. How to Install the IC

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.

*Check the accuracy of the IC setting with the corresponding soldering foil.

2. Apply flux to all pins of the FLAT PACKAGE IC.

3. Solder the pins, sliding the soldering iron in the direction of the arrow.

10.2.4. How to Remove a Solder Bridge

1. Lightly resolder the bridged portion.

2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.

69


10.3. How to Replace the LLP (Leadless Leadframe Package) IC



• Soldering Iron


°F ± 20°F (370°C ± 10°C)

Note:

We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil.

• Hot Air Desoldering Tool

Temperature: 608

°F ± 68°F (320°C ± 20°C)

10.3.2. Caution

• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.

• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

10.3.3. How to Remove the IC

1. Heat the IC with a hot air desoldering tool through the P. C. board.

2. Pick up the IC with tweezers, etc. when the solder is melted completely.

Note:

• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.

When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the P. C.

board.

3. After removing the IC, clean the P. C. board of residual solder.

70


10.3.4. How to Install the IC

1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached.

2. Place the solder a little on the land where IC pins are to be attached, then place the IC.

Note:

• When placing the IC, the positioning should be done very carefully.

3. Heat the IC with a hot air desoldering tool through the P. C. board until the solder on IC bottom is melted.

Note:

• Be sure to place it precisely, controlling the air volume of the hot air desoldering tool.

4. After soldering, confirm there are no short and open circuits with visual inspection.

10.3.5. How to Remove a Solder Bridge

When a solder bridge is found after soldering the bottom of the IC, remove it with a soldering iron.

71


11 Disassembly and Assembly Instructions

11.1. Disassembly Instructions

11.1.1. Base Unit

72

73



11.1.2. Handset

74

11.1.3. Charger Unit


75


11.2. How to Replace the Handset LCD

76

11.3. Antenna soldering work

Preparation


• Soldering Iron


°F ± 20°F (370°C ± 10°C)

Note:

We recommend a 30 to 40 Watt soldering iron.

Solder the antenna P.C. board as below.


77


12 Measurements and Adjustments

12.1. Things to Do after Replacing IC or X'tal


Equipment: Frequency counter

Check Point for measurement: BCK

Checking tolerance: 13.824MHz ± 100Hz (Base Unit)/13.824MHz ± 100Hz (Handset)

12.1.2. Check and Adjust Frequency (Base Unit)

1. Set up Base Unit in TEST mode.

2. Press following keys in order to Adjust Crystal mode. [LOCATOR], [LOCATOR], [LOCATOR], [ ], [CHECK] [ ], [ ]. Check

BCK frequency.

3. If the BCK frequency is out of the checking tolerance (± 100Hz), adjust to Adjustment tolelance (± 30Hz) by pressing [ ] or [ ] key.

Adjustment Tolerance: 13.824MHz ± 30Hz

4. Press [LOCATOR] key to write the new frequency factor in Memory.

5. Turn the power off. Then this value is available.


Test Link Mode for Base Unit (P.44)

12.1.3. Check and Adjust Frequency (Handset)

1. Set DC power supply to 3.9V.

2. Set up Handset in TEST mode (Adjustment flow).

3. Press [1] key to Adjust Crystal mode (“Clock Adj.” is displayed on LCD). Check BCK frequency.

4. If the BCK frequency is out of the checking tolerance (± 100Hz), adjust to Adjustment tolelance (± 30Hz) by pressing [ ] or [ ] key.

Adjustment Tolerance: 13.824MHz ± 30Hz

5. Press [TALK] key to write the new frequency factor in EEPROM.



RX-CW Test Mode for Handset (P.48)

12.1.4. Adjust Battery Low Detector Voltage (Handset)

After Handset's DSP (IC501) or EEPROM (IC541) replacement, Re-writing Battery Low voltage to EEPROM is required.

With following Handset Adjustment Flow, adjust DC power supply and DC voltmeter by the procedure below.

1. Set DC power supply to 3.9 V.

2. Set up Handset in TEST mode (Adjustment flow).

3. Press [1] key and [OFF] key to Adjust Batt Low mode. (“Bat Adj.” is displayed on LCD)

4. Change the voltage of the DC power supply to 3.51 V accurately. Check the voltage at P.C. board pads because some voltage drops occur due to the usage of long or thin cables.

5. Press [TALK] key twice to write voltage value in EEPROM.

6. Press [TALK] key twice to write charge value 1 in EEPROM.

7. Change the voltage of the DC power supply to 4.50 V accurately.

8. Press [TALK] key twice to write charge value 2 in EEPROM.


Note:

Refer to Handset Reference Drawing (P.80) for connection of DC power supply and voltmeter.


RX-CW Test Mode for Handset (P.48)

78


12.2. Base Unit Reference Drawing

When connecting the Simulator Equipment for checking, please refer to below.

DC

9.0 V

DC

Spectrum analyzer

Frequency counter

(*1)

BMC-CLK

(BCK)

Oscilloscope

DC volt meter

Oscilloscope

RSSI

(RS)

INT_1

IC501

Pin77

CN101

CN301

ANT1

C743

C741

L790

C792

C744

R706

C746

C766

C765

FL701

C711

L703

D703

C710

TP_TESTN

C704

L701

L713

L704

L702

L706

C706

IC701

C717

C760

C780

E

Q111

S

Q300

JOINT1

E

Q340

CHARGE-

IC300

BCLK2

RSSI

INT0

50

51

RX1 RX2

1

IC301

26

25

TXO

IC501

RA501

75

INT1 76

HSSPOUT

100

1

JO

JC

JI

DVCC

JS

JG

4

IC601

1

URX2

RA120

UVCC

UGND

UTX2

5 8

JOINT2

VCC

MIP

MIN

PQUP11457Z

E

Q171

RST

1

SPP2

SPN

NC1

SPP

KEYS

_D

KEYS

_C

KEY

IN3

KEYS_A

KEYS_B

KEYIN1

IC331

LED677

MIC- MIC+

KX-TG3021/22/31/32

CHARGE+

SPN2

NC2

ANS_LED

2APVCC

NC

INUSE_LED

MEG_LED

KEYIN2

PbF

A

MIP MIN

MIC

AF

OSC

Note:

(*1) is referred to No.3 of Check Table for RF part (P.63).

8

SP

AF volt meter

Oscilloscope

79


12.3. Handset Reference Drawing

When connecting the Simulator Equipment for checking, please refer to below.

A

MIC

IC541

RA401

1

RA402

R540

C540 1

100 76

75

IC501

1

RED

BLK

RED

BLK

5

2

3

4

RA403

E

25

26

RA551

E

5

8

1

50

51

4

1

1

IC382

C371

C382

C427

RA501

VBAT2

C762

C776

C779

C763

C777

C761

C764

C756

R741

R743

R731

R740

R742

C795

R732

R730

R719

C737

R733

R791

RA701

C793

C784

C783

L705

C739

C740

C710

L711

C738

C718

C790

C791

TP_TESTN

C742

L709

C797

C796

C798

C722

D704

R709

C752

PbF

PQUP11462Z

KX-TGA30 R

Note:

(*1) is referred to No.3 of Check Table for RF part (P.63).

80


12.4. Frequency Table

35

36

37

38

39

30

31

32

33

34

25

26

27

28

29

20

21

22

23

24

15

16

17

18

19

10

11

12

13

14

7

8

5

6

9

3

4

1

2

55

56

57

58

59

50

51

52

53

54

60

61

62

63

45

46

47

48

49

40

41

42

43

44

Channel TX/RX Frequency

(MHz)

TEST MODE Frequency

(MHz)

2400.914355 2400.724512

2401.808203 2401.618359

2402.698096 2402.508252

2403.591943 2403.402100

2404.481836 2404.291992

2405.375684 2405.185840

2406.265576 2406.075732

2407.159424 2406.969580

2408.049316 2407.859473

2408.943164 2408.753320

2409.833057 2409.643213

2410.726904 2410.537061

2411.616797 2411.426953

2412.510645 2412.320801

2413.400537 2413.210693

2414.294385 2414.104541

2415.184277 2414.994434

2416.078125 2415.888281

2416.968018 2416.778174

2417.861865 2417.672021

2418.751758 2418.561914

2419.645605 2419.455762

2420.535498 2420.345654

2421.429346 2421.239502

2422.319238 2422.129395

2423.213086 2423.023242

2424.102979 2423.913135

2424.996826 2424.806982

2425.886719 2425.696875

2426.780566 2426.590723

2427.670459 2427.480615

2428.564307 2428.374463

2429.454199 2429.264355

2430.348047 2430.158203

2431.237939 2431.048096

2432.131787 2431.941943

2433.021680 2432.831836

2433.915527 2433.725684

2434.805420 2434.615576

2435.699268 2435.509424

2436.589160 2436.399316

2437.483008 2437.293164

2438.372900 2438.183057

2439.266748 2439.076904

2440.156641 2439.966797

2441.050488 2440.860645

2441.940381 2441.750537

2442.834229 2442.644385

2443.724121 2443.534277

2444.617969 2444.428125

2445.507861 2445.318018

2446.401709 2446.211865

2447.291602 2447.101758

2448.185449 2447.995605

2449.075342 2448.885498

2449.969189 2449.779346

2450.859082 2450.669238

2451.752930 2451.563086

2452.642822 2452.452979

2453.536670 2453.346826

2454.426563 2454.236719

2455.320410 2455.130566

2456.210303 2456.020459

81

77

78

79

80

81

72

73

74

75

76

67

68

69

70

71

64

65

66

87

88

89

90

82

83

84

85

86

Channel TX/RX Frequency

(MHz)

TEST MODE Frequency

(MHz)

2457.104150 2456.914307

2457.994043 2457.804199

2458.887891 2458.698047

2459.777783 2459.587939

2460.671631 2460.481787

2461.561523 2461.371680

2462.455371 2462.265527

2463.345264 2463.155420

2464.239111 2464.049268

2465.129004 2464.939160

2466.022852 2465.833008

2466.912744 2466.722900

2467.806592 2467.616748

2468.696484 2468.506641

2469.590332 2469.400488

2470.480225 2470.290381

2471.374072 2471.184229

2472.263965 2472.074121

2473.157813 2472.967969

2474.047705 2473.857861

2474.941553 2474.751709

2475.831445 2475.641602

2476.725293 2476.535449

2477.615186 2477.425342

2478.509033 2478.319189

2479.398926 2479.209082

2480.292773 2480.102930


13 Schematic Diagram

13.1. For Schematic Diagram

13.1.1. Base Unit (Schematic Diagram (Base Unit_Main))

13.1.1.1. Acoustic Testing Mode

Notes:

1. DC voltage measurements are taken with voltmeter from the negative voltage line.

2. The schematic diagrams may be modified at any time with the development of new technology.

13.1.2. Handset (Schematic Diagram (Handset_Main))

Notes:

1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.

2. The schematic diagrams may be modified at any time with the development of new technology.

13.1.3. Charger Unit (Schematic Diagram (Charger Unit))

Notes:

1. DC voltage measurements are taken with voltmeter from the negative voltage line.

2. The schematic diagram may be modified at any time with the development of new technology.

82

Memo


83


13.2. Schematic Diagram (Base Unit_Main)

RF Interface

2.5 V

V_PA

V_RF

PA_CONT

V_PA

V_RF

PA_CONT

PA_CONT

2.5 V

SYN_OUT

SYN_DATA

SYN_CLK

SYN_EN

TX_DATA

RX_GAIN

RX_EN

TX_EN

SH_CTRL

RX_DATA

RF_RSTN

RSSI

BCLK

ANT1

GND

SYN_OUT

SYN_DATA

SYN_CLK

SYN_EN

TX_DATA

RX_GAIN

RX_EN

TX_EN

SH_CTRL

RX_DATA

RF_RSTN

RSSI

BCLK

ANT1

GND

SYN_OUT

SYN_DATA

SYN_CLK

SYN_EN

RX2 RX1

ANT_HOT

ANT_GND

TX_DATA

RX_GAIN

RX_EN

TX_EN

SH_CTRL

RF_RSTN

RSSI

BCLK2 BCLK

C521

K0.1

VCC

NC

5 VIN

VOUT

1

VSS

2

4

NC

CE

IC612

3

IC301

3

VOUT

VIN

VSS

1

2

VCC

3.3 V

RST

L473

L472

6.8u

6.8u

SPP

SPN

+

-

RSSI

FCLK

FRST

FSI FCS FSO

R604

R605

NC

NC

1

SI

2

SCK

3

*RESET

4

*CS

SO

8

GND

7

VCC

6

*WP

5

IC601

FLASH

R602 NC

R603

NC

SYN_EN

DVCC

INT0

C503

K0.1

C501

K0.1

47

48

49

50

42

43

44

45

46

38

39

40

41

33

34

35

36

37

26

27

28

29

30

31

32

GND

VCC

SYN_EN

SYN_CLK

SYN_DATA

RX_EN

TX_EN

RX_GAIN

RX_DATA

NC

NC

NC

NC

NC

NC

NC

EROM_DATA

EROM_CLK

EROM_WP

NC

GND

VCC

INT0

FLASH_SCK

NC

C611 NC

1 A0

2 A1

3 A2

4 GND

NC

VCC

WP

8

7

SCL

6

SDA

5

C612

NC

IC611

EEPROM

IC501

X501

13.824MHz

R509 NC

R459

2.7k

C457

K0.012

MIP2

MIP

1

2

R460 C458

2.7k

K0.012

MIN

MIN2

C513 K0.1

C514 10u

RA120

NC

1 4

2 3

C177 D10p

SPN

VCCPA

NC(HSOUT)

LOUT0

LIN0

VCCA

CID_IN

CID_IN

GNDA

NC

MIN

MIP

VREF

DCIN1

PDN

GND

MSG_LED

UART_RX

UART_TX

UCFG2

UCFG1

BANK2

INT1

ANS_LED

88

87

86

85

84

83

82

81

80

79

78

77

76

100

99

98

97

96

95

94

93

92

91

90

89

INT1

C516 10u

C515 K1.0

ANALOG_GND

C518 10uF

C517 K0.1

C120 1000p

R533 4.7k

R134 1k

UVCC

URX2

URX

UTX

UTX2

UGND

R591

R592

R594

R593

NC

NC

NC

NC

(for FLASH BOOT)

R178

1k

R154

1k

4

3

5

6

2 7

1

RA501

8

4.7k

28 ms

KEY1

KEY2

KEY3/TE

KEYB

Power ON

(Reset)

4.0 V

(1)

(2)

(3)

(8)

(14)

(15)

(16)

(9)

(10)

(11)

(12)

(13)

(4)

(5)

(6)

(7)

2 1

SW661

NC

NC: No Components

WBX01 WBX02

Operational P.C.board Interface

84


(9)

(10)

(11)

(12)

(13)

4.0 V

(1)

(2)

3.3 V

IC331

6

7

5

8

VOUT

NC2

GND

CD

VIN

4

VDET

3

*RESET

2

NC1

1

4.0V CONVERTOR

L300 22uH

Q300

(3)

IC300

1 ON/*OFF

VIN

2

VSS

5

3 VOUT

EXT

DCDC_IC

4

(4)

RF_GND DIGITAL_GND

(5)

(6)

(7)

RX

120 mVp-p

R172 100k

C172

K2700P(50V)

(8)

E

C

B

Q171

C174

NC

C167

K0.22

R167

1k

TX

800 mVp-p

C

E

B

Q161

R164

47

C163

K4700P(50V)

*R162

39k

*Q156

NC

B

C

E

R183

2.2k

C185

K0.018

R185

33k

TX

80 mVp-p

(14)

(15)

(16)

CHARGE+(2)

CHARGE PAD

CHARGE+

L371

NC

CHARGE-(2)

CHARGE-

R342 NC

E

C

B

Q340

NC

Power failure detection

Q143

NC

Q141

C141 NC

R141 100k

B

Q142

C

E

R121 390k

R122 390k

C121 K680P(50V)

C122 K680P(50V)

CID

C101

680p(3216)

3 2

4

D101

1

C102 680p(3216)

R115 NC

C115

NC

L101

33u

L102

33u

E

C

Q111

B

Bell detection

11~13 V

REFERENCE

1XX : TEL LINE

3XX : POWER, CHARGE

4XX : RESET, MIC, SP

5XX : DSP, RF I/F

6XX : FLASH, KEY, LCD

7XX : RF(2.4G)

8XX : RF(5.8G)

DCP DCP2

1

2

CN301

DCM DCM2

RX

L1T

P101 22

TX

L1R

1

2

CN101

TEL JACK

Test Signal

Frequency: 1 kHz

Rx

(MIC Mute: ON)

-25 dBm/600 IN

100 mVp-p

Tx

-10 dBm/600

700 mVp-p

NC: No Components

KX-TG3531/3532BX SCHEMATIC DIAGRAM (Base Unit_Main)

85


13.3. Schematic Diagram (Base Unit_RF Part)

2.5 V

L702

10nH

2.4 GHz TX

2.4 GHz RF

ANT1

L709

1.5nH

2

FL701

4

1 3

C711

4p

L703

4.7nH

2.4 GHz RX

C718

C5P

C738 D10P

L711

C739

3.9nH

D10P

C740 K0.01

C790 K1000P

C791 5p

L705

10nH

C783

K1000P

C784

J100P

C760 D10P

C737 K470P

C717

D10P

TP_TESTP

TP_TESTN

6

7

8

3

4

1

2

5

TX

GND_ISO1

GND_ISO2

RX

VCC_RF

VCC_IF2

TESTP

TESTN

IC701

VCC_PLL2A

VCC_PLL2B

2.4G_RF

PADDLE_GND

RXEN

TXEN

VCC_PLL1B

VCC_PLL1A

VCC_DIG

TC_CTRL

24

23

22

21

20

19

18

17

R740

4.7

R743

0

R741

10

R742

10

2.5 V

R719

R730

1k

1k

R731 1k

R732 1k

R733 330

PA_CONT

(MOD_EN)

V_PA

V_RF

SYN_OUT

SYN_DATA

SYN_EN

SYN_CLK

TX_DATA

RX_GAIN

RX_EN

TX_EN

SH_CTRL

RX_DATA

RF_RSTN

RSSI

BCLK

GND

SHIELD

2.5 V

NC: No Components

KX-TG3531/3532 SCHEMATIC DIAGRAM (Base Unit_RF Part)

86


13.4. Schematic Diagram (Base Unit_Operation)

SPP2

SPN2

NC1

NC2

2APVCC

MEG_LED

ANS_LED

INUSE_LED

NC3

KEYS_A

KEYS_B

KEYS_C

KEYS_D

KEYIN3

KEYIN2

KEYIN1

SPP

SPN

LED904

LED903

LED902

2

2

2

1

1

1

DOWN

1 2

1

RPT

2

ERASE

1 2

2

REC

1

1

UP

2

1

SKIP

2

LOCAT/INT

1 2

1

STOP

2

2

CHK

1

MSG/VM

1 2

1

ANS

2

NC: No Components

KX-TG3531/3532 SCHEMATIC DIAGRAM (Base Unit_Operation)

87


13.5. Schematic Diagram (Handset_Main)

RF circuit

BCLK

RSSI

TX_DATA

PA_CONT

RX_EN

TX_EN

RX_GAIN

RX_DATA

RXI TXE RXE TXO BCLK

RSSI

TX_DATA

PA_CONT

RX_EN

TX_EN

RX_GAIN

RX_DATA

Flash memory for booting

1

SI

2

SCK

3

*RESET

4

*CS

NC

SO

8

GND

7

VCC

6

*WP

5

IC546

RF control line

R540 NC

C540 K0.1

SHCTRL

RF_RSTN

SYN_DATA

SYN_EN

SYN_CLK

SYN_OUT

V_PA

V_RF

SHCTRL

RF_RSTN

SYN_DATA

SYN_EN

SYN_CLK

SYN_OUT

V_PA

V_RF

R574 NC

3.3V

GND

2.5 V

5 VIN

VOUT

1

VSS

2

4

NC

CE

IC382

3

2.5V

Regulator for RF unit

2

VIN

VOUT

VSS

1

3

IC381

BACK

1 2

DOWN

FLASH

*

LEFT

7

TALK

4

MENU

UP

NEXT

0

SYA

HOLD

8

9

RIGHT

5

6

OFF

3.3 V

SP

KIN_5

1

KIN_4

2

3

PAUSE

KIN_3

TE

KIN_2

KIN_1

SHCTRL

29

SYN_EN

SYN_CLK

30

31

SYN_DATA

32

RX_EN

TX_EN

RX_GAIN

RX_DATA

33

34

35

36

37

38

R503

10k

R504

NC

DB4

DB5

DB6

DB7

39

40

41

42

43

44

RESETB

45

46

47

48

49

50

26

27

28

SHCTRL

HEAD_DET

GND

VCC

SYN_LE1

SYN_CLK

SYN_DATA

RX_EN

TX_EN

RX_GAIN

RX_DATA

NC

CHG_DET

NC

NC

NC

NC

NC

DB4

DB5

DB6

DB7

GND

VCC

RESETB

IC501

DSP Part (control circuit)

RS

RST

X501

13.824MHZ

R501 NC

(1)

(2)

(3)

(4)

(5)

100

99

98

97

96

95

94

93

92

91

90

89

88

87

86

85

84

83

82

81

80

79

78

77

76

VREF

IBAT1

PDN

GND

EE_WP

UART_RX

UART_TX

EE_SDA

EE_SCL

CHG_CLT

FB

KIN_5

KIN_4

KIN_3

SPPN

VCC

SPN

SPP

IBAT2

HSM

VCCA

GND

MICBIAS

MIM

MIP

(6)

CI

RESETB

TCK

TMS

TDI

TDO

(7)

(8)

(9)

(10)

Q556

NC

E

C

Q552

B

NC

E *Q551

B

C

*RA551

C573 K0.1

R573 820K (1%) R572

430K (1%)

CA571

1 4

2 3

0.47uF

20 ms

R542 1k

R541 10k

(11)

(12)

3L_DOT_LCD

Power ON

(Reset)

VE(RED)

Talk(GREEN)

KEY_BACKLIGHT ANT_LED LCD_BACKLIGHT

Batt(RED) (Amber) (Amber) (Amber)

(13)

Parameter saving EEPROM

(14)

(15)

(16)

(17)

NC: No Components

88


(13)

(14)

(15)

(16)

(17)

(1)

(2)

(3)

(4)

(5)

(6)

(7)

R525 1k

(8)

(9)

(10)

(11)

(12)

E

EEPROM

Writing protection TR

C

B

Q543

C508

6.3V

10uF

R508 10

C503 K1.0

C594 NC

C526

K0.1

R431 10k

PDN

TEST SIGNAL

FREQUENCY: 1kHz

R433

R417

1k

390

Headset detection TR

C

Q431

B

E

C435

10uF

6.3V

Voice circuit

L427 NC

C427

Rear speaker

D10P

-

+

L426 NC

L431

L432

L434

NC

SP phone TX

-43 dBm/600 IN

30 mVp-p

SP phone RX

(MIC Mute: ON)

1.8 Vp-p/8

(Vol. Max)

Headset TX

-37 dBm/600

50 mVp-p

CN431

3

4

5

1

2

HEADSET_JACK

Headset jack

Headset RX

170 mVp-p/150

(Vol. Max)

SPP

Handset receiver

IN

2

1

RA403

68

3

4

-

+

C433 K6800P

R435

NC

SPM

Handset RX

(MIC Mute: ON)

590 mVp-p/150

(Vol. Max)

MICM

R434 2.2k

C414

6800P

RA401

4

3

1k

2

1

C415

RA402

3

4

2.2k

2

1

6800P

2

1

MICP

MIC

Microphone

Handset TX

-33 dBm/600 IN

88 mVp-p

Reset circuit

R505

R506

R507

NC

NC

NC

R509 100k

RX

TX

UART

R543 270k

DSP regulator

3.0 V

IC371

3.0V_REG

3.6~4.2 V

3

VOUT

VIN

VSS

1

2

C

Q521

B

E

VBAT2 VBAT1

BATTP

R370 1.2

R522

22k

C522

K0.1

D361

2 1

Charging control circuit

R366 3.3k

Q361

R361 47k

IC521

1

OUT

VSS

4

2

VDD

NC

3

3.2V_Reset

L351 NC

CHG1

BATTM

VSS2 VSS1

CHG2

B

Q363

C

E

C

B

Q362

E

L352 NC

R363 47k

C

E

Q531

B

R531 NC

Charging detection circuit

NC: No Components

KX-TGA351 SCHEMATIC DIAGRAM (Handset)

89


13.6. Schematic Diagram (Handset_RF Part)

3.3 V

L702

10nH

2.4 GHz RF

ANT

L709

1.5n

2

FL701

4

1 3

C711

4p

L705

10nH

C790 K1000P

C791 8p

C783

K1000P

C760

C737

C717

D10P

D10P

K470P

2.4 GHz TX

L703

4.7n

C718

C5P

C784

J100P

C738 D10P

L711 3.9n

C739 D10P

C740 K0.01

TP_TESTP

TP_TESTN

2.4 GHz RX

7

8

5

6

3

4

1

2

TX

GND_ISO1

GND_ISO2

RX

VCC_RF

VCC_IF2

TESTP

TESTN

IC701

2.4G_RF

VCC_PLL2A

VCC_PLL2B

RXEN

TXEN

PADDLE_GND

VCC_PLL1B

VCC_PLL1A

VCC_DIG

TC_CTRL

24

23

22

21

20

19

18

17

R740

4.7

R742

10

R743

0

R741

10

2.5 V

R719

R730

1k

1k

R731 1k

R732 1k

R733 330

PA_CONT

(MOD_EN)

V_PA

V_RF

SYN_OUT

SYN_DATA

SYN_EN

SYN_CLK

TX_DATA

RX_GAIN

RX_EN

TX_EN

SHCTRL

RX_DATA

RF_RSTN

2.5 V

2.5 V

RSSI

BCLK

GND

SHIELD

NC: No Components

KX-TGA351 SCHEMATIC DIAGRAM (Handset_RF Part)

90


13.7. Schematic Diagram (Charger Unit)

DCP

CP

1

2

CN1

CM

R1 270

R2 270

R3 270

R4 270

R5 270

R6 NC

R7 270

R8 270

R9 270

R10 270

R11 270

R12 270

R13 270

DCM

G

NC: No Components

SCHEMATIC DIAGRAM (Charger Unit)

91


Memo

92

14 Printed Circuit Board

14.1. Circuit Board (Base Unit_Main)

14.1.1. Component View

V_PA V_RF


CN101

CN301

AV_RF

V_PA 2.5 V

BCLK

(13.824 MHz)

RSSI

SP Vcc

4 INT1

C Analog Vcc

3.3 V

ANT1

C743

C741

L790

C792

C744

R706

C746

C766

C765

FL701

C711

L703

D703

C710

TP_TESTN

C704

L701

L713

L704

L702

L706

C706

IC701

C717

C760

C780

E

Q111

S

Q300

JOINT1

E

Q340

1 DC

IC300

BCLK2

RSSI

INT0

50

51

RX1 RX2

1

IC301

26

25

TXO

IC501

RA501

75

INT1 76

HSSPOUT

100

1

JO

JC

JI

DVCC

JS

JG

4

IC601

1

URX2

RA120

UVCC

UGND

UTX2

5 8

JOINT2

VCC

MIP

MIN

PQUP11457Z

E

Q171

RST

1

SPP2

SPN

NC1

SPP

KEYS

_D

KEYS

_C

KEY

IN3

KEYS_A

KEYS_B

KEYIN1

IC331

LED677

MIC- MIC+

KX-TG3031/32/33/34

CHARGE-

CHARGE+

D Digital Vcc

3.3 V

2 Vcc

SPN2

NC2

ANS_LED

2APVCC

NC

INUSE_LED

MEG_LED

KEYIN2

3 Reset

PbF

A

KX-TG3531/3532 CIRCUIT BOARD (Base Unit_Main (Component View))

93


14.1.2. Flow Solder Side View

DCM DCM2

DCP2

DCP

L1R

L1T

ANT_HOT

ANT_GND

KEY2

KEY3/TE

KEY1

KEYB

PbF

D101

E

Q141

E

Q143

E

Q156

E

Q142

E

Q161

IC612

3 1

4 5

RXI

RXE

BCLK

TXE

MIC1

MIN2 MIP2

8 5

IC611

1 4

FCS

FSO

FCLK

FRST

FSI

URX UTX

PQUP11457Z

A

KX-TG3531/3532 CIRCUIT BOARD (Base Unit_Main (Flow Solder Side View))

94

14.2. Circuit Board (Base Unit_RF Part)


C743

C741

L790

C792

C744

R706

C746

C766

C765

FL701

C711

L703

D703

C710

TP_TESTN

C704

L701

L713

L704

L702

L706

C706

IC701

C717

C760

C780

KX-TG3531/3532 CIRCUIT BOARD (Base Unit_RF Part (Component View))

95


14.3. Circuit Board (Base Unit_Antenna)

A

A

KX-TG3531/3532 CIRCUIT BOARD (Base Unit_Antenna)

96


14.4. Circuit Board (Base Unit_Operation)


LED903

REC CHK ERASE ANS

BLACK

SP

STOP

RED

RPT

MSG/VM

LED904

DOWN

UP

LED902

SKIP

PbF

PQUP11459Z

KX-TG3031/32

LOCAT/INT

A

KX-TG3531/3532 CIRCUIT BOARD (Base Unit_Operation (Component View))

97



1

WBX02

1

PbF

8

WBX01

8

KX-TG3031H

PQUP11459Z

A

KX-TG3531/3532 CIRCUIT BOARD (Base Unit_Operation (Flow Solder Side View))

98

14.5. Circuit Board (Handset_Main)



KX-TGA30 R

PQUP11462Z

PbF

C752

R709

C722

C796

C798

D704

L709

C797

C738

C718

L711

C710

TP_TESTN

L705

C790

C783

C791

C784

C739

C740

C793

RA701

R791

R719

C737

R730

C756

C761

R740

C777

C776

R743

C762

R731

C763

C779

R741

R742

C764

R733

C795

R732

C742

V_RF

2.5 V

V_DSP

3.0 V

CI

IC501(pin52)

VBAT1

3.5~4.2 V

(Battery)

RA501

C427

RED

BLK

C382

1

1

4

C371

IC382

1

8

E

RA551

5

E

5

4

3

2

RA403

BLK

RED

1

51

50 26

25

IC501

75

76 100

1 C540

R540

RA402

1

PDN

(Power down)

IC541

RA401

V_PA

3.3 V

RST

(Reset)

RSSI

(RS)

BCLK

(13.824 MHz)

MIC

A

KX-TGA351 CIRCUIT BOARD (Handset (Component View))

99



LED561

TAPE

SYN_CLK SYN_EN

SYN_OUT

LCD

LED557

LED555

LED558

LED559

LED556

LEFT MENU

UP

RIGHT

TALK OFF

SP

BACK

DOWN

NEXT

PAUSE

1

4

2

5

7 8

0

FLASH

MIC

HOLD

9

#

3

6

A

KX-TGA351 CIRCUIT BOARD (Handset (Flow Solder Side View))

100

14.6. Circuit Board (Handset_RF Part)


C752

R709

C722

C796

C798

D704

L709

C797

C738

C718

C790

C783

C784

C791

L711

C710

TP_TESTN

L705

C739

C740

C793

R719

RA701

R791

C756

C737

R730

R740

R731

R743

C761

C777

C776

C762

C763

C779

R741

R742

C764

R733

C795

R732

C742

KX-TGA351 CIRCUIT BOARD (Handset_RF Part (Component View))

101


14.7. Circuit Board (Charger Unit)


R1

R2

R3

R4

R5

PQJT01

PQHG01

PQHG

R7

R8

PQHG02

PQHG

R10

R13 R9

PQJT02

PQLV30054

PbF

R11

R6

R12

PQUP11464Z

A

CIRCUIT BOARD (Charger Unit (Component View))


PQUP11464Z

PbF

PQLV30054

A

CIRCUIT BOARD (Charger Unit (Flow Solder Side View))

102


15 Appendix Information of Schematic Diagram

15.1. CPU Data (Base Unit)

15.1.1. IC501

37 NC

38 NC

39 NC

40 NC

41 NC

42 NC

43 NC

44 NC

45 NC

46 GND

47 VCC

48 INT0(NC)

49 FLASH_ SCK

50 NC

51 KEY_STB _E

52 KEY_STB _D

53 KEY_STB _C

54 KEY_STB _B

55 KEY_STB _A

56 NC (LINE_SZ)

57 NC

58 BELL

59 RLY

PIN Description

1 GNDPA

2 SPOUTP

3 BCLK

4 TXMOD

5 RSSI

6 XIN

7 XOUT

8 VDD

9 VCCIN

10 GND

11 RESET

12 FLASH_ RST

13 FLASH_SO

14 FLASH_SI

15 FLASH_CS

16 NC

17 SYN_OUT

18 TX_DATA

19 PA_CONT

20 SYN_LE2

D.I

D.O

D.O

D.O

21 AC_DOWN _DET D.I

22 RF_RST

23 RADIO_EN

24 SHCTRL

25 ANT0

26 GND

D.O

D.O

D.O

D.O

GND

27 VCC

28 SYN_LE1

29 SYN_CLK

30 SYN_DATA

31 RXEN

32 TXEN

33 RXGAIN

34 RXI

35 NC

36 NC

D.O

D.O

D.I

D.O

D.O

VCC

D.O

D.O

D.O

D.O

A.O

D.O

VCC

GND

D.I

*

*

*

*

D.O

I/O

GND

A.O

A.O

A.O

A.I

A.I

GND

VCC

D.I.O

*

D.O

D.O

D.O

D.O

D.O

D.O

D.O

D.O

D.O

D.O

D.O

D.O

D.O

D.O

D.O

D.O

D.O

--

--

D.I

OFF

D.O

Off Hook

--

--

--

--

--

--

--

--

--

--

VCC

--

High

--

--

--

Active

Active

Active

VCC

Not

High

High

Active

Active

--

High

--

--

High

High

High

--

High

--

Active

--

--

--

--

--

--

--

Normal

High

High

High

High

--

High

--

--

--

--

--

--

--

Active

Low

Low

Off

Off

--

Low

--

--

Low

Low

Low

--

Low

--

Not

--

--

GND

--

--

--

GND

Reset

Low

Low

Low

Low

--

Low

--

--

--

--

--

--

--

--

--

--

--

GND

--

--

Low

--

--

--

--

--

--

--

--

--

--

--

--

ON

On Hook

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

High_Z

--

--

--

--

--

--

Middle

Middle

Middle

Middle

--

--

--

--

--

--

--

--

--

Middle

--

--

--

Not

Not

Not

--

--

--

--

--

--

--

--

--

--

--

--

--

GND

A.I

A.I

A.O

A.I

A.I

A.I

A.O

GND

A.I

D.O

D.I.O

D.I.O

D.O

D.O

D.O

D.O

D.O

D.I

D.I.O

A.I

VCC

A.I

A.O

A.O

VCC

A.O

D.I

D.O

D.O

D.O

D.O

D.I

D.I

GND

VCC

D.O

I/O

D.I

D.I

D.I

D.I

PIN Description

60 KEY_IN6

61 KEY_IN5

62 KEY_IN4

63 KEY_IN3

64 KEY_IN2

65 KEY_IN1

66 GND

67 VCC

68 TCK

69 TMS

70 TDI

71 TD0

72 NC

73 NC

74 NC

75 INUSE_ LED

76 ANS_LED

77 NC(INT1)

78 NC

79 NC

80 NC

81 UART_TX

82 UART_RX

83 MSG_LED

84 GND

85 PDN

86 IBAT

87 VREF

88 MIP

89 MIN

90 DCIN2

91 NC

92 GNDA

93 CID_IN

94 CID_IN

95 VCCA

96 LIN0

97 LOUT0

98 NC

99 VCCA

100 SPOUTN

Note:

• The mark “*” in the I/O column means the port is controlled by the firmware.

--

--

--

--

--

--

--

--

--

--

--

--

High

High

--

--

--

--

--

--

--

--

--

--

--

--

--

High

Non

Non

Non

Non

--

--

--

--

--

Non

Non

--

VCC

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

Off

--

Off

Off

--

--

--

--

--

--

--

--

--

High_Z

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

GND

--

--

--

--

--

--

Low

Low

On

--

On

On

--

--

--

--

--

--

--

--

--

Low

Key In

Key In

Key In

Key In

--

--

--

--

--

Key In

Key In

GND

--

--

103


15.2. CPU Data (Handset)

15.2.1. IC501

PIN Description

1 GNDPA

2 SPOUTP

3 BCLK

4 RSSI

5 XIN

6 XOUT

7 VDD

8 VCCIN

9 GND

10 GND

11 GND

VDD

VCC

GND

GND

A.I

12 GND

13 RESET

A.O

D.I

14 (FLASH_ RESET) D.O

15 (FLASH_ SO) D.O

I/O

GND

A.O

A.O

A.I

A.I

A.O

16 (FLASH_ SI)

17 (FLASH_ CS)

18 BL LED

19 SYN_OUT

20 TX_DATA

21 MOD_EN

22 (SYN_LE2)

23 (CON_EN)

24 RF_RESET

25 RF_POWER

26 SHCTRL

27 HEADSET_ DET

28 GND

29 VCC

30 SYN_EN

31 SYN_CLK

32 SYN_DATA

33 RX_EN

34 TX_EN

35 RXGAIN

D.O

D.O

D.O

D.I

D.O

High

--

Off

High

High

D.O

D.O

High

On

D.O

High

D.O

Normal

D.O

On

D.O

On

D.I Headset In

GND

VCC

D.O

--

VCC

High

D.O

D.O

D.O

D.O

D.O

High

High

Active

Active

High

--

VCC

--

--

--

--

Normal

--

--

High

--

--

--

--

--

--

36 RXI

37 NC

38 CHARGE_ DET

39 CHARGE_ CNT

40 EEPROM_ DET

41 NC

42 NC

43 NC

44 DOT_LCD_ D4

45 DOT_LCD_ D5

D.O

D.O

D.O

D.O

D.O

D.I

D.O

--

--

D.I Off Charge

D.O

Trickle

D.I

64M

--

--

--

High

High

46 DOT_LCD_ D6

47 DOT_LCD_ D7

48 GND

49 VCC

50 DOT_LCD_

RESET

51 (FLASH_SCK)

D.O

D.O

GND

VCC

D.O

Normal

52 CI

53 NC

54 NC

55 ANT_LED1

56 DOT_LCD_RS

57 DOT_LCD_

RW_WR

D.O

58 DOT_LCD_ E_RD D.O

59 DOT_LCD_

POWER_SW

D.O

D.O

D.O

D.O

D.O

D.O

D.O

High

High

--

VCC

High

--

--

--

Off

Data

Read

Active

On

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

High_Z

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

Off

Non

GND

--

Low

Low

Low

Off

Off

Low

Low

Normal

On

Low

Low

Low

Off

Low

Reset

Off

--

--

GND

GND

--

--

Reset

Normal

Normal

Low

GND

--

--

--

--

--

--

Normal

On Charge

Normal

16M

Normal

Normal

Normal

Low

Low

Low

Low

GND

--

Reset

Low

Normal

Normal

Normal

On

Instruct

Write

Not

Off

High

--

--

--

--

--

--

--

--

--

VCC

--

--

--

--

VCC

--

--

--

--

VCC

--

--

--

--

--

--

High

WP

--

--

--

Non

Non

Non

Non

Non

--

--

High

High

High

PIN

60 NC

61 NC

Description I/O

D.O

D.O

62 NC D.O

63 KEYSTROBE _E D.O

64 KEYSTROBE _D D.O

65 KEYSTROBE _C D.O

66 KEYSTROBE _B D.O

67 KEYSTROBE _A D.O

68 GND GND

69 VCC

70 TEST_CLK

71 TEST_MODE

_SELECT

72 TEST_DATA _IN

VCC

D.I

D.I

D.I

D.O

73 TEST_DATA

_OUT

74 KEYIN1

75 KEYIN2

76 KEYIN3

77 KEYIN4

D.I

D.I

D.I

D.I

78 KEYIN5

79 NC(INT1)

80 NC(INT0)

81 EEPROM_ CLK

D.I

D.O

D.O

D.O

82 EEPROM_ DATA D.I.O

83 UART_TX D.O

84 UART_RX

85 EEPROM_ WP

86 GND

87 PDN

88 Battlow

89 VREF

90 MIP

91 MIN

92 DCIN2

93 GNDA

94 VCCA

95 Headset_ MIC_in

96 DCIN0

97 LOUT0

98 HSSPOUT

99 VCCPA

100 SPOUTN

VCC

A.I

A.I

A.O

A.O

VCC

A.O

D.I

D.O

GND

A.I

A.I

A.O

A.I

A.I

A.I

GND

104

Low

Normal

Normal

Normal

Active

Active

Active

Active

Active

GND

--

--

--

--

--

--

--

--

--

--

--

--

Low

Write

GND

--

--

--

--

--

--

GND

Key In

Key In

Key In

Key In

Key In

Normal

Normal

Low

Low

Low

High_Z

--

--

--

Not

--

--

--

Not

Not

Not

Not

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--


15.3. Explanation of IC Terminals (RF Part)

15.3.1.

IC701

105


15.4. Terminal Guide of the ICs, Transistors and Diodes

15.4.1. Base Unit

15.4.2. Handset

106


16 Exploded View and Replacement Parts List

16.1. Cabinet and Electrical Parts (Base Unit)

107


16.2. Cabinet and Electrical Parts (Handset)

Note:

(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.76).

(*2) Attach the spacer (No. 121) to the exact location described above.

108


16.3. Cabinet and Electrical Parts (Charger Unit)

109


16.4. Accessories and Packing Materials

16.4.1. KX-TG3531BXS/BXB

110

16.4.2. KX-TG3532BXS/BXB


111


16.4.3. KX-TGA351BXS/BXB

112

16.5. Replacement Parts List

Note:

1. RTL (Retention Time Limited)

The marking (RTL) indicates that the Retention Time is limited for this item.

After the discontinuation of this assembly in production, the item will continue to be available for a specific period of time. The retention period of availability depends on the type of assembly and the laws governing parts and product retention.

At the end of this period, the assembly will no longer be available.

2. Important safety notice

Components identified by the mark indicates special characteristics important for safety. When replacing any of these components, only use specified manufacture's parts.

3. The S mark means the part is one of some identical parts.

For that reason, it may be different from the installed part.

4. ISO code (Example: ABS-94HB) of the remarks column shows quality of the material and a flame resisting grade about plastics.

5. RESISTORS & CAPACITORS

Unless otherwise specified;

All resistors are in ohms ( Ω) K=1000Ω, M=1000kΩ

All capacitors are in MICRO FARADS ( µF) P=µµF

*Type & Wattage of Resistor


Ref.

No.

Part No.

Part Name & Description Remarks

6

7

8

9

10

11

12

6

12

13

14

14

PQSX10340W

TG3531BXS) (for KX-TG3532BXS)

KEYBOARD SWITCH (for KX-

TG3531BXB) (for KX-TG3532BXB)

L0AA02A00072 SPEAKER

PQHG10729Z

PQHR11303Z

RUBBER PARTS, SPEAKER

GUIDE, SP HOLDER PS-HB

PQHR11276Z

PQMG10025Z

GUIDE, JACK HOLDER PS-HB

RUBBER PARTS, MIC

PQKF10731Y3 CABINET COVER (for KX-


PS-HB

PQKF10731Y4 CABINET COVER (for KX-


PS-HB

PQHA10023Z CUSHION

PQGT19647Z NAME PLATE (for KX-TG3531BXS)

(for KX-TG3532BXB)

PQGT19718Z NAME PLATE (for KX-TG3531BXB)

(for KX-TG3532BXB)

16.5.1.2. Main P.C. Board Parts

Note:

(*1) When you have replaced IC501, IC601 or X501, make the adjustment. Refer to Check and Adjust Frequency

(Base Unit) (P.78).

(*2) When replacing IC701, refer to How to Replace the

LLP (Leadless Leadframe Package) IC (P.70).

16.5.1. Base Unit

16.5.1.1. Cabinet and Electrical Parts

3

4

1

2

Ref.

No.

2

5

5

Part No.


PQQT23193Z

PQKM10746Y4

LABEL, CHARGE

PQKM10746Y3 CABINET BODY (for KX-


PS-HB

CABINET BODY (for KX-


PS-HB

PQWE10037Z

PQHR11283Z

BATTERYTERMINAL PS-HB

OPTIC CONDUCTIVE PARTS, LED

LENS (IN USE)

PS-HB

PQBC10488Z3 BUTTON, MESSAGE (for KX-


AS-HB

PQBC10488Z4 BUTTON, MESSAGE (for KX-


AS-HB

L101

L102

L300

L361

L472

L473

L501

L701

L702

L703

L704

L705

L706

L709

D101

D113

D133

D142

D300

D361

D472

D473

D703

D704

Ref.

No.

Part No.

Part Name & Description

PCB1 PQWP13531BXH MAIN P.C.BOARD ASS'Y (with

ANTENNA P.C.B.)(RTL)

PCB1-1 PQWP33531BXH MAIN P.C.BOARD ASS'Y (without

ANTENNA P.C.B.)(RTL)

(ICs)

Remarks

IC300

IC301

IC331

IC501

IC601

IC701

C0DBAGZ00023

C2HBBY000069

PQWIG3531BXH

C1CB00002285

IC

C0CBAAD00018 IC

C0DBFGD00017 IC

IC (*1)

IC (*1)

IC (*2)

(TRANSISTORS)

S

Q111

Q141

Q142

Q161

Q171

Q300

2SC6054JSL TRANSISTOR(SI)

B1ADGP000008 TRANSISTOR(SI)

B1BBAP000021 TRANSISTOR(SI)

2SD0874AS

2SC6054JSL

TRANSISTOR(SI)

TRANSISTOR(SI)

B1CHND000004 TRANSISTOR(SI)

(DIODES)

PQVDMD5S

MA111

MA111

DIODE(SI)

DIODE(SI)

DIODE(SI)

S

S

S

S MA1Z300 DIODE(SI)

B0JCME000035 DIODE(SI)

MA8220

MAZ805100L

DIODE(SI)

DIODE(SI)

MAZ805100L DIODE(SI)

B0DCCD000011 DIODE(SI)


PQLQXF330K

PQLQXF330K

(COILS)

COIL

COIL

G1C220M00037 COIL

S

S

S

S

G1C6R8MA0072 COIL



PQLQR2KA213

MQLRF18NJFB

MQLPF10NJFB

MQLRF4N7DFB

MQLRF22NJFB

MQLRF10NJFB

MQLPF10NJFB

MQLRF1N5DFB

COIL

COIL

COIL

COIL

COIL

COIL

COIL

COIL

S

113


R677

R706

R709

R719

R730

R731

R732

R733

R740

R741

R742

R743

R791

R454

R459

R460

R517

R533

R675

R673

R183

R185

R303

R304

R308

R343

R371

R372

R380

R421

R422

R423

R453

R142

R145

R151

R152

R154

R160

R162

R111

R112

R113

R114

R121

R122

R131

R133

R134

R141

R163

R164

R165

R167

R168

R171

R172

R175

R176

R178

Ref.

No.

L711

L713

L790

CN101

CN301

RA501

RA701

SA102

SA103

Part No.


220

10K

330

1K

1K

1K

1K

330

4.7

10

10

0

1K

2.2K

2.7K

2.7K

0

4.7K

330

330

2.2K

33K

220

220

120

1K

47

47

0

47K

1K

1K

2.2K

ERJ2GEJ222

ERJ3GEYJ333

ERJ3GEYJ221

ERJ3GEYJ221

ERJ3GEYJ121

ERJ3GEYJ102

ERG2SJ470

ERG2SJ470

ERJ3GEY0R00

ERJ2GEJ473

ERJ2GEJ102

ERJ2GEJ102

ERJ2GEJ222

ERJ2GEJ222

ERJ2GEJ272

ERJ2GEJ272

ERJ2GE0R00

ERJ2GEJ472X

ERJ2GEJ331

ERJ2GEJ331

ERJ2GEJ221

ERJ2RKF103X

ERJ2GEJ331

ERJ2GEJ102

ERJ2GEJ102

ERJ2GEJ102

ERJ2GEJ102

ERJ2GEJ331

ERJ2GEJ4R7

ERJ2GEJ100

ERJ2GEJ100

ERJ2GE0R00

ERJ2GEJ102

ERJ3GEYJ104

ERJ3GEYJ104

ERJ3GEYJ103

ERJ3GEYJ473

ERJ3GEYJ394

ERJ3GEYJ394

ERJ3GEYJ106

ERJ3GEYJ105

ERJ3GEYJ102

ERJ3GEYJ104

PQ4R18XJ472

ERJ2GEJ103

ERJ3GEYJ106

ERJ3GEYJ395

ERJ3GEYJ102

ERJ3GEYJ751

ERJ3GEYJ393

ERJ12YJ330

ERJ3GEYJ470

ERJ3GEYJ561

ERJ2GEJ102

ERJ3GEY0R00

ERJ2GEJ220

ERJ2GEJ104

ERJ3GEYJ561

ERJ2GEJ101

ERJ2GEJ102

MQLRF3N9DFB

MQLRF18NJFB

COIL

COIL

G1C1R0KA0096 COIL

(JACKS)

K2LB102B0053 JACK, MODULAR

K2ECYB000001 JACK, DC

(COMPONENTS PARTS)

D1H84724A013 RESISTOR ARRAY

D1H810240004 RESISTOR ARRAY

(VARISTORS)

S

S

PQVDDSS301L

PQVDDSS301L

ABSORBER) S

ABSORBER) S

33

47

560

1K

0

22

100K

560

100

1K

4.7K

10K

10M

3.9M

1K

750

39K

(RESISTORS)

100K

100K

10K

47K

390K

390K

10M

1M

1K

100K

S

C710

C711

C717

C718

C722

C737

C738

C739

C740

C741

C742

C744

C746

C601

C660

C687

C688

C689

C704

C706

C501

C503

C504

C508

C509

C513

C514

C515

C516

C517

C518

C521

C531

C185

C300

C304

C305

C306

C308

C331

C162

C163

C164

C165

C166

C167

C172

C176

C177

C178

C101

C102

C111

C112

C113

C120

C121

C122

C132

C142

C152

C161

C341

C342

C347

C352

C380

C381

C422

C457

C458

C459

Ref.

No.

Part No.


(CAPACITORS)

F1K2J681A006 680P

F1K2J681A006 680P

F1J2A473A024 0.047

F1J2A473A024 0.047

PQCUV1A684KB 0.68

ECUV1H102KBV 0.001

ECUV1H681JCV 680P


ECUV1H103KBV 0.01

S

S

ECUV1H103KBV 0.01

ECUV1H103KBV 0.01

EEE1EA100WR 10


ECUV1H472KBV 0.0047

ECUE1H100DCQ 10P

ECUV1C473KBV 0.047

EEE1CA100SR 10

ECUV1A224KBV 0.22

ECUE1H272KBQ 0.0027

PQCUV0J106KB 10


ECUE1C223KBQ 0.022

ECUE1C183KBQ 0.018

PSEA1VXF470 47

ECUV1A105KBV 1

ECUV1H103KBV 0.01

ECEA1EU101 100

ECUV1E104KBV 0.1

ECUV1C474KBV 0.47

ECEA0JSJ331 330

ECUV1A105KBV 1

ECUE1A104KBQ 0.1

ECUV1C104KBV 0.1

ECA1CM101 100P

ECUV1A105KBV 1


ECUE1C123KBQ 0.012

ECUE1C123KBQ 0.012

ECUE1C103KBQ 0.01




ECUE1H6R0CCQ 6P

ECUE1H6R0CCQ 6P


PQCUV0J106KB 10

ECUV1A105KBV 1

PQCUV0J106KB 10


PQCUV0J106KB 10





ECUE1H331KBQ 330P



ECUE1H2R0CCQ 2P

ECUE1H2R0CCQ 2P

ECUE1H010CCQ 1P

ECUE1H4R0CCQ 4P


ECUE1H5R0CCQ 5P





ECUE1C103KBQ 0.01

ECUE1H102KBQ 0.001

PQCUV0J475MB 4.7


ECUE1H222KBQ 0.0022

S

S

S

S

114

MIC1

E1

E2

E3

E4

FL701

P101

X501

C780

C783

C784

C790

C791

C792

C793

C796

C797

C798

Ref.

No.

C752

C756

C760

C762

C763

C764

C765

C776

C777

C779

Part No.


ECUE1H2R0CCQ 2P



ECUE1H101JCQ 100P


ECUE1H102KBQ 0.001



ECUE1H102KBQ 0.001

ECUE1H102KBQ 0.001

ECUE1C103KBQ 0.01

ECUE1H102KBQ 0.001


ECUE1H102KBQ 0.001

ECUE1H5R0CCQ 5P




ECJ0EC1H0R5C 0.5P

ECJ0EC1H0R5C 0.5P

(OTHERS)

L0CBAB000052 MICROPHONE

PQUP11466Z ANTENNA P.C.BOARD ASS'Y (RTL)

S

S

PQMC10493Z

PQMC10494Z

MAGNETIC SHIELD, COVER

MAGNETIC SHIELD, FRAME

WBX08SH-9SS PARALLEL WIRE

J0E2457B0008 IC FILTER

PFRT002 THERMISTOR (POSISTOR)

H0J138500003 CRYSTAL OSCILLATOR (*1)

S

16.5.1.3. Operational P.C. Board Parts

Ref.

No.

PCB2

Part No.


PQWP2TG3031H OPERATIONAL P.C.BOARD ASS'Y

(RTL)

(LEDS)

LED902 LNJ308G8JRA

LED903 PQVDBR1111C

LED904 PQVDBR1111C

LED

LED

LED

Remarks

S

S

16.5.2. Handset


103

104

105

106

107

108

109

110

111

112

113

114

115

116

117

Ref.

No.

101

101

102

102

108

Part No.


PQGP10320Z3

PQGP10320Z2

PQHR11282Z

PQHS10762Z

PQBC10492Z1

PQSX10338N

KX-TGA351BXS)

KX-TGA351BXB)

PQKM10747Z2

PQKM10747Z1

PQHS10658Z

CABINET BODY (for KX-

TGA351BXS)

PS-HB

CABINET BODY (for KXPS-HB

TGA351BXB)

SPACER, RECEIVER NET

L0AD02A00023 RECEIVER

GUIDE, RECEIVER HOLDER

PC

PC

SPACER, CUSHION LCD

BUTTON, NAVIGATOR KEY

ABS-HB

ABS-HB

PQSX10338P


TGA351BXS)


TGA351BXB)

PQWE10047Z

PQJT10247Z

PQJT10246Z

PQHR11198Z

PQHG10729Z

BATTERY TERMINAL ABS-HB

CHARGE TERMINAL (L)

CHARGE TERMINAL (R)

GUIDE, SP HOLDER

RUBBER PARTS, SPEAKER CUSHION

ABS-HB

L0AA02A00072 SPEAKER

PQHS10622Z SPACER, SPEAKER NET

PQKE10471Y2

PQHR11280Z

COVER, EARPHONE CAP

OPTIC CONDUCTIVE PARTS, LED

LENS

PS-HB


119

119

120

121

122

Ref.

No.

118

118

122

Part No.


PQKF10729Z3

PQKF10729Z4

PQKK10600Z4

CABINET COVER (for KX-

TGA351BXS)

ABS-HB

CABINET COVER (for KX-

TGA351BXB)

ABS-HB

PQGT19650Z NAME PLATE (for KX-TGA351BXS)

PQGT19717Z NAME PLATE (for KX-TGA351BXB)

HHR-P107 BATTERY

PQHS10681Y

PQKK10600Z3

SPACER, BATTERY

LID, BATTERY COVER (for KX-

TGA351BXS)

ABS-HB

LID, BATTERY COVER (for KX-

TGA351BXB)

ABS-HB

16.5.2.2. Main P.C.Board Parts

Note:

(*1) When you have replaced IC501, IC541 or X501, make the adjustment. Refer to Check and Adjust Frequency

(Handset) (P.78) and Adjust Battery Low Detector Volt-

age (Handset) (P.78).

(*2) When replacing IC701, refer to How to Replace the

LLP (Leadless Leadframe Package) IC (P.70).

(*3) When replacing the handset LCD, See How to

Replace the Handset LCD (P.76).

115

Ref.

No.

Part No.


PCB100 PQWPG3521BXR MAIN P.C.BOARD ASS'Y (RTL)

IC371

IC381

IC382

IC501

IC521

IC541

IC701

(ICs)

C0CBABD00019 IC

C0CBABD00011 IC

C0CBAAC00083

C2HBBY000067

IC

IC (*1)

C0EBF0000179 IC

PQWIG3521BXR IC (*1)

C1CB00002285 IC (*2)

(TRANSISTORS)

B1ADGE000004 TRANSISTOR(SI) Q361

Q362

Q363

Q431

Q521

Q531

Q543

Q551

Q555

D361

D523

D703

D704

2SC6054JSL

UNR921LJ0L

UNR921LJ0L

2SC6054JSL

TRANSISTOR(SI)

TRANSISTOR(SI)

TRANSISTOR(SI)

TRANSISTOR(SI)

UNR921EJ0L

UNR9215J0L

TRANSISTOR(SI)

TRANSISTOR(SI)

TRANSISTOR(SI) UNR911LJ0L

XP0111L00L TRANSISTOR(SI)

(DIODES)

DIODE(SI) MA2ZD0200L

MA111 DIODE(SI)



LED551 B3ACB0000115 DIODE(SI)




LED555 B3ACB0000115 LED

LED556 B3ACB0000115 LED

LED561 B3ACB0000134 LED

L432

L434

L701

L702

L703

L704

L705

L706

L709

(COILS)

PQLQR2KB113T COIL

PQLQR2KB113T COIL

MQLRF18NJFB

MQLPF10NJFB

MQLRF4N7DFB

MQLRF22NJFB

MQLRF10NJFB

MQLPF10NJFB

MQLRF1N5DFB

COIL

COIL

COIL

COIL

COIL

COIL

COIL

L711

L713

L790

CA571

MQLRF3N9DFB

MQLRF18NJFB

COIL

COIL

G1C1R0KA0096 COIL

(COMPONENTS PARTS)

F5A424740002 CAPACITOR ARRAY

Remarks

S

S

S


Remarks

C371

C377

C379

C381

C386

C414

C415

C416

C417

C421

C427

C433

C435

C437

C438

R361

R362

R363

R366

R370

R376

R377

R378

R379

R417

R431

R433

R434

R503

R508

R509

R522

R523

R525

R526

R528

R534

R541

R542

R543

R561

R562

R563

R572

R573

R706

R709

R719

R730

R731

R732

R733

R740

R741

R742

R743

R791

Ref.

No.

CA574

RA401

RA402

RA403

RA501

RA551

RA701

D412

D413

D423

D424

D426

D427

Part No.


F5A841040004 CAPACITOR ARRAY




D1H84724A013 RESISTOR ARRAY

D1H83314A013 COMPONENTSPARTS


(VARISTORS)

D4ED1180A013 VARISTOR






(RESISTORS)

ERJ2GEJ473 47K

ERJ2GEJ561

ERJ2GEJ473

ERJ3GEYJ332

ERJ8GEYJ1R2

ERJ2GEJ155

ERJ2GEJ225

ERJ2GEJ155

560

47K

3.3K

1.2

1.5M

2.2M

1.5M

ERJ2GEJ225

ERJ2GEJ391

ERJ2GEJ103

ERJ2GEJ102

ERJ2GEJ222

ERJ2GEJ103

ERJ3GEYJ100

ERJ2GEJ104

ERJ2GEJ223

ERJ2GEJ224

ERJ2GEJ102

ERJ2GEJ223

ERJ2GEJ104

ERJ2GEJ103

ERJ2GEJ103

ERJ2GEJ102

ERJ2GEJ274

ERJ2GEJ101

ERJ2GEJ121

ERJ2GEJ121

100

120

120

D1BB4303A055 430K

D1BB8203A055 820K

ERJ2RKF103X 10K

ERJ2GEJ331

ERJ2GEJ102

ERJ2GEJ102

ERJ2GEJ102

ERJ2GEJ102

ERJ2GEJ331

ERJ2GEJ4R7

330

1K

1K

1K

1K

330

4.7

100K

22K

220K

1K

22K

100K

10K

10K

1K

270K

2.2M

390

10K

1K

2.2K

10K

10

ERJ2GEJ100

ERJ2GEJ100

ERJ2GE0R00

ERJ2GEJ102

10

10

0

1K

(CAPACITORS)




EEE0JA101SP 100


ECUE1E682KBQ 0.0068

ECUE1E682KBQ 0.0068

ECUE1E562KBQ 0.0056

PQCUV0J106KB 10

ECUV1A105KBV 1


ECUE1E682KBQ 0.0068

PQCUV0J106KB 10



S

S

C738

C739

C740

C741

C742

C744

C746

C752

C756

C760

C706

C710

C711

C717

C718

C722

C737

C762

C763

C764

C765

C776

C777

C779

C780

C783

C784

C790

C791

C792

C521

C522

C524

C525

C526

C531

C540

C541

C542

C572

C573

C596

C704

Ref.

No.

C501

C502

C503

C504

C506

C508

C511

C512

C514

C515

Part No.

ECUE1H100DCQ

ECUE1H100DCQ

ECUE0J105KBQ

ECUE1A104KBQ


PQCUV0J106KB 10

EEE0GA331WP


ECUE1C103KBQ 0.01

PQCUV0J106KB 10

ECUE1A104KBQ

ECUE1C103KBQ 0.01


ECUE1A104KBQ



ECUE1A104KBQ




ECUV1C474KBV 0.47



ECUE1H2R0CCQ

ECUE1H2R0CCQ

ECUE1H010CCQ

ECUE1H4R0CCQ

ECUE1H100DCQ

ECUE1H5R0CCQ

ECUE1H100DCQ

ECUE1H471KBQ

10P

10P

1

0.1

330

0.1

0.1

0.1

2P

2P

1P

4P

10P

5P

10P

470P



ECUE1C103KBQ 0.01

ECUE1H102KBQ 0.001

PQCUV0J475MB 4.7


ECUE1H222KBQ 0.0022

ECUE1H2R0CCQ 2P





ECUE1H102KBQ 0.001



ECUE1H102KBQ 0.001

ECUE1H102KBQ 0.001

ECUE1C103KBQ 0.01

ECUE1H102KBQ 0.001


ECUE1H102KBQ 0.001

ECUE1H8R0CCQ 8P


Remarks

S

C793

C796

C797

C798

ECUE1A104KBQ

ECUE1A104KBQ

ECJ0EC1H0R5C

ECJ0EC1H0R5C

0.1

0.1

0.5P

0.5P

(OTHERS)

MIC100 L0CBAY000018 MICROPHONE

E101 L5DCBYY00003 LIQUID CRYSTAL DISPLAY (*3)

S

S

E102

E103

E104

E105

E106

E107

CN431

FL701

X501

PQHX11327Z

PQHR11285Z

PQHR11284Z

PQHS10683Z

PQMC10494Z

PQMC10493Z

COVER, LCD COVER SHEET

TAPE, ADHESIVE

PLATE PMMA

GUIDE, LCD HOLDER ABS-HB

MAGNETIC SHIELD, FRAME

MAGNETIC SHIELD, COVER

K2HD103D0001 JACK

J0E2457B0008 IC FILTER

H0J138500003 CRYSTAL OSCILLATOR (*1)

116

16.5.3. Charger Unit



16.5.4.2. KX-TG3532BXS/BXB

Ref.

No.

200

200

200-1

200-1

200-2

200-2

200-3

200-4

200-4

Part No.


PQLV30054SS CHARGER UNIT ASS'Y (RTL) (for

KX-TG3532BXS) (for KX-

TGA351BXS)

PQLV30054SB CHARGER UNIT ASS'Y (RTL) (for

KX-TG3532BXB) (for KX-

TGA351BXB)

PQKM10751Z2 CABINET BODY (for KXPS-HB

KX-TGA351BXS)

PQKM10751Z1 CABINET BODY (for KXPS-HB

KX-TGA351BXB)

PQKF10734Y3 CABINET COVER (for KXPS-HB

KX-TGA351BXS)

PQKF10734Y4 CABINET COVER (for KXPS-HB

KX-TGA351BXB)

PQHA10023Z RUBBER PARTS

PQGT19665Y NAME PLATE (for KX-TG3532BXS)

(for KX-TGA351BXS)

PQGT19719Y NAME PLATE (for KX-TG3532BXB)

(for KX-TGA351BXB)

16.5.3.2. Main P.C.Board Parts

Ref.

No.

A101

A102

A103

A104

A105

Part No.


ADAPTOR Base

Unit)

PQJA10075Z CORD, TELEPHONE

PQKL10084Z2 STAND, WALL MOUNT PS-HB

English) (*1)

A106

Arabic)

A107

P101

P102

P103

P104

XZB21X35A03

XZB08X25B02

Persian)

PROTECTION COVER (for Base

Unit)

PROTECTION COVER (for Handset)

XZB13X19C03 PROTECTION COVER (for Charger

Unit)

PQPK15863Z GIFT BOX

16.5.4.3. KX-TGA351BXS/BXB

Ref.

No.

Part No.


PCB200 PQWPTGA600CH MAIN P.C.BOARD ASS'Y (RTL)

(JACK)

CN1 K2ECYB000001 JACK, DC

(RESISTORS)

R1 ERDS2TJ271 270

R2 ERDS2TJ271 270

R3 ERDS2TJ271 270

R4 ERDS2TJ271 270

R5 ERDS2TJ271 270

R7 ERDS2TJ271 270

R8 ERDS2TJ271 270

R9 ERDS2TJ271 270

R10 ERDS2TJ271 270

R11 ERDS2TJ271 270

R12 ERDS2TJ271 270

R13 ERDS2TJ271 270

(OTHERS)

E201

E202

PQJT10200Z CHARGE TERMINAL

PQHG10584Z SPACER, RUBBER

Remarks

S

16.5.4. Accessories and Packing Materials

Note:

(*1) You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

16.5.4.1. KX-TG3531BXS/BXB

Ref.

No.

A201

A202

Part No.


PQLV208BXZ AC ADAPTOR

A203

English) (*1)

PQQX15852Z INSTRUCTION BOOK (for Arabic)

(*1)

Remarks

A204

P201

P202

P203

XZB08X25B02 sian) (*1)

PROTECTION COVER (for Handset)

XZB13X19C03 PROTECTION COVER (for Charger

Unit)


16.5.5. Screws

A

B

Ref.

No.

Part No.

XTW26+T8PFJ

XTW2+R10PFJ


TAPPING SCREW

TAPPING SCREW

Remarks

16.5.6. Fixtures and Tools

Note:

When replacing the Handset LCD, See How to Replace

the Handset LCD (P.76).

Part No.

PQZZ430PIR

PQZZ430PRB


TIP OF SOLDERING IRON

RUBBER OF SOLDERING IRON

Remarks

A1

Ref.

No.

A2

A3

A4

Part No.


PQLV203BXZ AC (for Unit)

PQJA10075Z CORD, TELEPHONE

PQKL10084Z2 STAND, WALL MOUNT PS-HB

English) (*1)

A5

Arabic)

A6

P1

P2

P3

XZB21X35A03

Persian)

PROTECTION COVER (for Base

Unit)

XZB08X25B02 PROTECTION COVER (for Handset)


K.I/N

KXTG3531BXS

KXTG3531BXB

KXTG3532BXS

KXTG3532BXB

KXTGA351BXS

KXTGA351BXB

117

Panasonic TG3531 BXS, BXB, TG3532 BXS, BXB, TGA351 BXS, BXB telephone Service manual

Assistant Bot

Telephone Equipment

2.4 GHz Expandable Digital Cordless

Answering System

Silver Version

Black Version

(for Asia, Middle Near East and Other areas)

TABLE OF CONTENTS

1 Safety Precaution

1.1.

For Service Technicians

2 Warning

2.1.

Battery Caution

2.2.

About Lead Free Solder (PbF: Pb free)

3 Specifications

4 Technical Descriptions

4.1.

FHSS Description

4.2.

Explanation of Link Data Communication

4.3.

Block Diagram (Base Unit_Main)

4.4.

Block Diagram (Base Unit_RF Part)

4.5.

Circuit Operation (Base Unit)

4.6.

Block Diagram (Handset)

4.7.

Block Diagram (Handset_RF Part)

4.8.

Circuit Operation (Handset)

4.9.

Circuit Operation (RF Part)

4.10. Circuit Operation (Charger Unit)

4.11. Signal Route

5 Location of Controls and Components

5.1.

Controls

5.2.

Displays

6 Installation Instructions

6.1.

Setting Up the Base Unit

6.2.

Setting Up the Handset

6.3.

Battery Installation/

Replacement

6.4.

Battery Charge

7 Operation Instructions

7.1.

Programmable Settings

7.2.

Copying Handset Phonebook Items

7.3.

Dial Lock

7.4.

Error Messages

7.5.

Troubleshooting

8 Test Mode

8.1.

Adjustment and Test Mode Flow Chart

9 Service Mode

9.1.

How to Clear User Setting

9.2.

Copying Phonebook Items when Repairing

10 Troubleshooting Guide

10.1. Troubleshooting Flowchart

10.2. How to Replace the Flat Package IC

10.3. How to Replace the LLP (Leadless Leadframe Package) IC

11 Disassembly and Assembly Instructions

11.1. Disassembly Instructions

11.2. How to Replace the Handset LCD