HP ProLiant ML570 Generation 3 ML570 server Maintenance and Service Guide
Below you will find brief information for server ProLiant ML570 Generation 3 ML570. The HP ProLiant ML570 Generation 3 Server offers a range of features and capabilities, including support for up to four memory boards, each containing six DIMM slots, and a variety of expansion boards. The server also features a variety of AMP options to optimize server availability.
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HP ProLiant ML570 Generation 3 Server
Maintenance and Service Guide
March 2005 (First Edition)
Part Number 374185-001
© Copyright 2005 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services.
Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
Microsoft, Windows, and Windows NT are U.S. registered trademarks of Microsoft Corporation.
Linux is a U.S. registered trademark of Linus Torvalds.
HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
March 2005 (First Edition)
Part Number 374185-001
Audience assumptions
This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.
Contents
3
Removal and replacement procedures 15
4 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Server component identification 77
Contents 5
Acronyms and abbreviations 107
Illustrated parts catalog
7
In this section
Customer self repair
What is customer self repair?
HP's customer self-repair program offers you the fastest service under either warranty or contract. It enables HP to ship replacement parts directly to you so that you can replace them. Using this program, you can replace parts at your own convenience.
A convenient, easy-to-use program:
•
An HP support specialist will diagnose and assess whether a replacement part is required to address a system problem. The specialist will also determine whether you can replace the part.
•
Replacement parts are express-shipped. Most in-stock parts are shipped the very same day you contact HP. You may be required to send the defective part back to HP, unless otherwise instructed.
•
Available for most HP products currently under warranty or contract. For information on the warranty service, refer to the HP website
( http://h18004.www1.hp.com/products/servers/platforms/warranty/index.htm
l ).
For more information about HP's customer self-repair program, contact your local service provider. For the North American program, refer to the HP website
( http://www.hp.com/go/selfrepair ).
Customer replaceable parts are identified in the following tables.
8 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Mechanical components
*
*
*
*
*
*
*
3
*
*
*
Item Description
1
2a
2b
*
4
*
5
6
Assembly
Number
366264-002 Access panel, ProLiant ML570 G3
Server
Bezel, Rack, ProLiant ML570 G3
Server
Bezel, Tower, ProLiant ML570 G3
Server
Plastics Kit, ProLiant ML570 G3
Server
• Hot-plug basket, PCI-X
373317-001
373316-001
• Bezel assembly, media
• Retainer, tower bezel
• Latch, PCI, carbon
• Latch, PCI, blue
• Retainer, memory board
• Retainer, memory board
• Latch, center wall
• Latch, center wall
• Latch, center wall
• Retainer, PCI, carbon
• Retainer, PCI, blue
Hardware Kit, Misc, ProLiant ML570
G3 Server
Blank, tape drive
Blank, power supply
379046-001
379046-002
373318-001
366450-001
Cage, memory modules
Hold-down, processor power module
377569-001
372583-001
353829-001
373319-001
158475-003
228194-001
228194-002
366262-001
366263-001
366272-001
366273-001
366274-001
Spare Part
Number
374553-001
374557-001
374556-001
374550-001
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
374551-001 Yes
Customer
Self Repair
Yes
Yes
Yes
Yes
10 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
*
*
Item Description
7
*
*
*
Assembly
Number
374503-001 Cover, tower, ProLiant ML570 G3
Server
Kit, rack mount
Blank, hard drive
374503-001
302531-001
289720-003
Return kit, tower, ProLiant ML570 G3
Server
Return kit, rack, ProLiant ML570 G3
Server
Screwdriver, Torx, T-15
*Not shown
107473-001
Spare Part
Number
377839-001
377839-001
122759-001
296277-001
374554-001
374555-001
199630-001
Customer
Self Repair
Yes
Yes
Yes
Yes
Yes
Yes
Yes
System components
*
*
*
*
12 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Item Description Assembly
Number
Spare Part
Number
Customer
Self
Repair
3
*
*
*
*
13
1
2
4
System Components
Processor, 3.66 GHz, 1 MB, with heatsink
Processor, 3.33 GHz, 8 MB, with heatsink
Processor, 3.00 GHz, 8 MB, with heatsink
Processor, 3.16 GHz, 1 MB, with heatsink
Processor, 2.83 GHz, 4 MB, with heatsink
Power Supply, 910/1300 Watt
Boards
Board, SCSI Backplane, ProLiant
ML570 G3 Server
Board, Memory, ProLiant ML570 G3
Server
Board, Processor Power Module
337667-001 364360-001 Yes
367240-001 370718-001 Yes
012085-001 374547-001
14
15
Board, Power Backplane, ProLiant
ML570 G3 Server
Board, System, ProLiant ML570 G3
Server
Board, PCI Hot-Plug switch
Memory
DIMM, PC3200, DDR2 a) 512 MB b) 1 GB c) 2 GB, single rank
011077-001
345112-051
345113-051
345114-061
230981-001 Yes
359241-001 Yes
359242-001 Yes
359243-001 Yes
Item Description
*
*
*
*
5
*
11
12 d) 2 GB, dual rank
SCSI Ultra320 universal hot-plug
hard drive a) 36.4 GB 15K rpm b) 72.8 GB 10K rpm c) 72.8 GB 15K rpm d) 146.8 GB 10K rpm e) 300 GB 10k rpm
Removable Media Drives
DVD drive, 8x
Diskette drive, 3.5 in
Assembly
Number
345114-051
Spare Part
Number
Customer
Self
Repair
378021-001 Yes
271837-016
271837-008
271837-018
289241-001 Yes
289042-001 Yes
289243-001 Yes
271837-010
271837-021
289044-001 Yes
351126-001 Yes
168003-935/9D1 268795-001 Yes
263394-001 267132-001 Yes
*
*
*
*
*
*
Cables
Cable kit, power
• Cable, fan power
• Cable, power backplane, 12 pin
• Cable, power backplane, 14 pin
• Cable, power backplane, 22 pin
Cable kit, data
*
*
*
*
*
• Cable, power backplane
• Cable, jacketed, blue
• Cable, jacketed, yellow
• Cable, PCI HP
Miscellaneous
AC power cord, 15 A, 125 V
372618-001
372619-001
374549-001 Yes
—
—
372620-001
372621-001
—
—
374548-001 Yes
372616-001 —
372617-001 —
166298-041
166298-042
—
—
224999-002
178968-001
—
237457-001 Yes
14 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Item Description
7
*
*
*
AC power cord, C14-C19
Battery, 3 V, Lithium
Fan, 120 mm, Hot-plug
Keyboard, PS/2, US
Assembly
Number
287485-001
166899-001
364517-001
352750-001
Spare Part
Number
311582-001
153099-001
374552-001
355630-001
Customer
Self
Repair
Yes
Yes
Yes
Yes
103179-165 311060-001
*Not shown
Removal and replacement procedures
15
In this section
Required tools
You need the following items for some procedures:
•
•
•
T-10 Torx screwdriver
T-15 Torx screwdriver
Diagnostics Utility
16 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Safety considerations
Before performing service procedures, review all the safety information.
Preventing electrostatic discharge
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other staticsensitive devices. This type of damage may reduce the life expectancy of the device.
•
•
To prevent electrostatic damage:
•
Avoid hand contact by transporting and storing products in static-safe containers.
•
Keep electrostatic-sensitive parts in their containers until they arrive at staticfree workstations.
•
Place parts on a grounded surface before removing them from their containers.
Avoid touching pins, leads, or circuitry.
Always be properly grounded when touching a static-sensitive component or assembly.
Server warnings and cautions
Before installing a server, be sure that you understand the following warnings and cautions.
WARNING: To reduce the risk of electric shock or damage
to the equipment:
Removal and replacement procedures 17
•
•
•
Do not disable the power cord grounding plug. The grounding plug is an important safety feature.
Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times.
Unplug the power cord from the power supply to disconnect power to the equipment.
•
Do not route the power cord where it can be walked on or pinched by items placed against it. Pay particular attention to the plug, electrical outlet, and the point where the cord extends
from the server.
WARNING: To reduce the risk of personal injury from hot
surfaces, allow the drives and the internal system components to
cool before touching them.
CAUTION: Do not operate the server for long periods without the access panel. Operating the server without the access panel results in improper airflow and improper cooling that can lead to thermal damage.
Preparation procedures
To access some components and perform certain service procedures, you must perform one or more of the following procedures:
•
Extend the server from the rack ("Extending the server from the rack" on
page
If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack, you can use the locking feature of the rack rails to support the server and gain access to internal components.
For more information about telco rack solutions, refer to the
RackSolutions.com website ( http://www.racksolutions.com/hp ).
•
Power down the server ("Powering down the server" on page 20 ).
18 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
If you must remove a server from a rack or a non-hot-plug component from a server, power down the server.
•
Remove the server from the rack ("Removing the server from the rack" on
page
If the rack environment, cabling configuration, or the server location in the rack creates awkward conditions, remove the server from the rack.
•
Remove the access panel ("Access panel" on page 21 ).
If you are servicing server internal components, remove the access panel.
•
Remove the tower bezel ("Unlocking and removing the tower bezel" on page
If you are servicing front panel components or need to remove the access panel in a server configured as a tower, remove the tower bezel.
•
Remove the rack bezel ("Removing the rack bezel" on page 24 ).
If you are servicing the SCSI drive cage in a server configured for rack mounting, remove the rack bezel.
•
Remove the processor air baffle ("Air baffle" on page 25 ).
If you are servicing a processor, PPM, or need to remove the system board, remove the processor air baffle.
•
Remove the center wall ("Center wall" on page 26 ).
If you need to remove the system board, remove the center wall.
NOTE: A T-15 Torx screwdriver is attached to the rear of the server.
Extending the server from the rack
1. Release the two levers on the lower outside corners of the rack.
NOTE: If the server is in a rack and in the shipping configuration, remove the two shipping screws directly behind the levers.
IMPORTANT: If the server is installed in a telco rack, remove the server from the rack to access internal components.
Removal and replacement procedures 19
2. Extend the server on the rack rails until the server rail-release latches engage.
WARNING: To reduce the risk of personal injury or
equipment damage, be sure that the rack is adequately stabilized
before extending a component from the rack.
WARNING: To reduce the risk of personal injury, be
careful when pressing the server rail-release latches and sliding
the server into the rack. The sliding rails could pinch your fingers.
3. After performing the installation or maintenance procedure, slide the server back into the rack by pressing the server rail release latches.
20 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
NOTE: The release latches will lock into place when the rails are fully extended.
Powering down the server
WARNING: To reduce the risk of personal injury, electric
shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC
power is removed.
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.
1. Shut down the OS as directed by the OS documentation.
2. Press the Power On/Standby button to place the server in standby mode.
When the server enters standby power mode, the system power LED changes to amber.
3. Disconnect the power cords.
The system is now without power.
Access panel
Removal and replacement procedures 21
WARNING: To reduce the risk of personal injury from hot
surfaces, allow the drives and the internal system components to
cool before touching them.
CAUTION: Do not operate the server for long periods without the access panel. Operating the server without the access panel results in improper airflow and improper cooling that can lead to thermal damage.
2. Open the locking latch, slide the access panel to the rear of the chassis, and remove the access panel.
NOTE: If the locking latch is locked, use a Torx T-15 screwdriver to unlock the latch.
After installing hardware options, replace the access panel. Be sure that the panel is securely locked into place before powering up the server.
Removing the server from the rack
To remove the server from an HP, Compaq branded, telco, or third-party rack:
22 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
1. Power down the server ("Powering down the server" on page 20 ).
2. Extend the server from the rack ("Extending the server from the rack" on
page
3. Disconnect the cabling and remove the server from the rack. For more information, refer to the documentation that ships with the rack mounting option.
4. Place the server on a sturdy, level surface.
Removal and replacement procedures
Unlocking and removing the tower bezel
23
Tower servers have a bezel that must be unlocked and opened before accessing the hard drive cage, diskette drive, DVD drive, and the power switch. In addition, the bezel is also removable when converting from a tower server to a rack server.
To unlock the tower bezel, use the key provided with the server to unlock the bezel with a counterclockwise turn.
24 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
If necessary, remove the tower bezel.
Removing the rack bezel
•
•
The rack bezel must remain installed during normal server operations. The rack bezel remains installed for all hardware options installations, except for the following situations:
Removing or replacing the SCSI hard drive cage
Converting the server from a rack model to a tower model
To remove the rack bezel:
1. Extend or remove the server from the rack ("Extending the server from the rack" on page 18
, "Removing the server from the rack" on page 21 ).
2. Remove the tape drive blank or the tape drive.
3. Using the Torx T-15 screwdriver, unscrew the three screws on each side of the rack bezel.
4. Push down on the snap and pull the rack bezel away from the chassis.
Removal and replacement procedures 25
5. Release the snap at the base of the rack bezel and remove the rack bezel.
Air baffle
To remove the component:
1. Power down the server ("Powering down the server" on page 20 ).
3. Remove the access panel ("Access panel" on page 21 ).
26 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
4. Remove the processor air baffle.
To replace the component, reverse the removal procedure.
Center wall
To remove the component:
1. Power down the server ("Powering down the server" on page 20 ).
2. Unlock and open the front bezel ("Unlocking and removing the tower bezel"
on page
3. Extend or remove the server from the rack ("Extending the server from the rack" on page 18
, "Removing the server from the rack" on page 21 ).
4. Remove the access panel ("Access panel" on page 21 ).
5. Remove all expansion boards.
6. Lift the three latches and loosen the thumbscrew that secures the center wall to the chassis.
Removal and replacement procedures 27
7. Remove the center wall from the server.
To replace the component, reverse the removal procedure.
Redundant hot-plug power supply
WARNING: To reduce the risk of electric shock, do not
disassemble the power supply or attempt to repair it. Replace it
only with the specified spare part.
CAUTION: If only one power supply is installed, do not remove the power supply unless the server has been powered down.
Removing the only operational power supply will cause an immediate power loss.
NOTE: If you remove or replace the primary hot-plug power supply, use the T-15 Torx screwdriver provided with the server to remove the shipping screw. It is located just under the port-colored plastic handle of the power supply unit.
To remove the component:
1. Disconnect the power cord from the power supply.
28 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
2. Remove the hot-plug power supply from the server.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
To replace the component, reverse the removal procedure.
Hard drive blank
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
To remove the component:
Removal and replacement procedures 29
1. Remove the hard drive blank.
To replace the component, reverse the removal procedure.
Hot-plug hard drives
CAUTION: Always power down the server if the boot partition resides on the drive you are replacing or if you are replacing the only drive in the server.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
To remove the component:
1. Determine the status of the hard drive from the hot-plug hard drive LEDs
("Hot-plug SCSI hard drive LED combinations" on page 92
, "Hot-plug SCSI hard drive LEDs" on page 91 ).
2. Back up all server data contained on the hard drive.
30 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
3. Remove the hard drive.
To replace the component, reverse the removal procedure.
Diskette drive blank
To remove the component:
1. Power down the server ("Powering down the server" on page 20 ).
2. Press the ejector button.
Removal and replacement procedures 31
3. Remove the diskette drive blank.
To replace the component, reverse the removal procedure.
Diskette drive
To remove the component:
1. Power down the server ("Powering down the server" on page 20 ).
2. Press the ejector button.
32 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
3. Remove the diskette drive from the server.
To replace the component, reverse the removal procedure.
Optical device
To remove the component:
1. Power down the server ("Powering down the server" on page 20 ).
IMPORTANT: The ejector button is recessed to prevent accidental ejection; it may be helpful to use a pen or similar shaped object to access the button.
2. Press the ejector button.
3. Remove the optical device.
Removal and replacement procedures 33
To replace the drive, slide the drive into the bay until it clicks.
Hot-plug fans
IMPORTANT: Remove and replace one fan at a time. If the system detects two fan failures while in full redundant mode, the server will shut down to avoid thermal damage.
When all redundant fans are installed, individual fans can be hot-swapped at any time. To remove the component:
2. Remove the access panel ("Access panel" on page 21 ).
34 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
3. Remove the hot-plug fan.
To replace the component, reverse the removal procedure.
Expansion boards
CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the expansion boards.
The server supports PCI-X, PCI Express, and hot-plug PCI-X expansion boards.
For location, refer to Rear Panel Components (on page 79 ).
Slot Expansion card type
Capable speed
plug plug plug plug
100 MHz* (slots 1 and 2 share the same bus)
100 MHz* (slots 1 and 2 share the same bus)
100 MHz* (slots 3 and 4 share the same bus)
100 MHz* (slots 3 and 4 share the same bus)
Removal and replacement procedures 35
Slot Expansion card type
Capable speed
9
10
Hot-plug PCI-X
Hot-plug PCI-X
133 MHz
133 MHz
*HP recommends that cards with speeds of at least 100 MHz be installed in these slots. If cards with lower bus speeds are installed, the bus speed will be reduced.
However, server performance will not suffer if the speed on one bus is slower than the speed on a different bus.
To remove the component:
1. Power down the server ("Powering down the server" on page 20 ).
2. Extend or remove the server from the rack ("Extending the server from the rack" on page 18
, "Removing the server from the rack" on page 21 ).
3. Remove the access panel ("Access panel" on page 21 ).
4. Disconnect any required internal or external cables from the expansion board.
36 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
5. Release the retaining clip.
6. Remove the expansion board.
To replace the component, reverse the removal procedure.
Removal and replacement procedures 37
Memory options
This server supports up to four memory boards. Each memory board contains six
DIMM slots for a total of 24 DIMM slots in the server. Memory can be expanded by installing PC2-3200R Registered DDR2 DRAM DIMMs.
The server supports a host of AMP options to optimize server availability:
•
Advanced ECC (hot-add enabled)
•
•
Advanced ECC (hot-add disabled)
Online Spare Memory (on page
•
Hot-Plug Mirrored Memory (dual- and quad-board) ("Hot-plug mirrored memory" on page 42 )
•
Hot-Plug RAID Memory (on page
Hot-plug operations can be hot-add or hot-replace. Hot-add makes additional memory resources available to the OS. Hot-replace allows failed or degraded
DIMMs to be replaced while the server is running.
The maximum supported memory per memory board is 16 GB using four 4-GB dual-rank DIMMs. Although six DIMM slots exist per board, the system architecture allows a maximum of only four dual-rank DIMMs per memory board to optimize performance.
For an overview of single- and dual-rank DIMMs, refer to "Single- and Dual-
Rank DIMMs."
General memory configuration requirements
The following configuration requirements apply regardless of the AMP mode.
•
•
DIMMs must be installed in pairs.
DIMM pairs in a memory bank must contain DIMMs with the same part number.
38 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
•
Always populate the memory boards in sequential order: Board 1, Board 2,
Board 3, and Board 4. Any deviation from this requirement results in the server booting in Advanced ECC mode and Advanced ECC guidelines apply.
•
Always populate the DIMMs in sequential order per bank: Bank A, Bank B, and Bank C.
•
•
Dual-rank DIMMs must be populated before single-rank DIMMs (see table).
If dual-rank DIMMs are installed in Bank A and Bank B, no additional
DIMMs may be installed in Bank C.
•
The following table lists all seven valid combinations of single- and dualrank DIMM configurations for a memory board. "Single" indicates a bank of single-rank DIMMs. "Dual" indicates a bank of dual-rank DIMMs.
NOTE: A bank contains 2 DIMMs.
Configuration Bank A Bank B Bank C
1 Single
2 Single Single
3 Single Single Single
4 Dual
•
7 Dual Dual
The system can be configured for any AMP mode in RBSU. RBSU displays a warning message if the selected AMP mode is not supported by the current configuration. However, if the DIMM configuration at POST does not meet the requirements for the AMP mode selected in RBSU, the server defaults to
Advanced ECC. The system indicates this by displaying a message during
POST and the status LED for the configured AMP mode flashes amber.
•
Unpopulated memory boards (those without any installed DIMMs) can be installed in the server for storing extra memory boards.
•
If the server contains more than 4 GB of memory, consult the OS documentation about accessing the full amount of installed memory.
Configuring the memory
Removal and replacement procedures 39
Configuring the memory system of the server requires configuring both hardware and software.
To configure the memory:
1. Install the correct amount of memory for the desired AMP mode. For a list of
AMP options, refer to "Memory Options (on page
information, refer to "General Memory Configuration Requirements."
2. Test the DIMMs for all AMP modes, except Advanced ECC, before configuring the AMP mode in RBSU. The two testing methods are:
−
POST memory test
−
ROM-Based Diagnostics test
NOTE: If the total amount of memory has changed, the POST Memory
Test will run automatically. Additional memory testing is not necessary.
3. Select the AMP mode.
Advanced ECC Memory
Advanced ECC Memory is the default memory protection mode for this server.
In Advanced ECC, the server is protected against correctable memory errors. The server provides notification if the level of correctable errors exceeds a predefined threshold rate. The server does not fail because of correctable memory errors. Advanced ECC provides additional protection over Standard ECC in that it is possible to correct certain memory errors that would otherwise be uncorrectable and result in a server failure. Whereas Standard ECC can correct single-bit memory errors, Advanced ECC can correct single-bit memory errors and multi-bit memory errors if all failed bits are on the same DRAM device on the DIMM.
The following guidelines apply to Advanced ECC Memory:
•
•
•
All general memory requirements apply.
Advanced ECC mode is supported with 1, 2, 3, or 4 memory boards.
Hot-add is always enabled for Advanced ECC.
40 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
•
•
•
•
Board insertions do not convert the AMP mode while the server is running.
A server cannot be converted from Advanced ECC to Online Spare Memory, mirrored memory, or Hot-Plug RAID memory by inserting a board while the server is running. Board insertions in Advanced ECC are solely for making additional memory resources available to the OS.
Advanced ECC is the only mode in which hot-add operations are supported.
This is the only mode in which the amount of memory available to the OS can be increased without a reboot.
Hot-add is performed by adding a memory board while the server is running, and the additional memory is made available to the OS without a reboot. The following rules apply to hot-add operations:
−
Boards must be inserted sequentially.
−
Multiple hot-add board insertions can be performed on the same server.
For example, if a server has three empty memory board slots, three hotadd board insertions can be performed.
−
If multiple hot-add operations are performed, allow one board insertion operation to complete (as indicated by the memory board LEDs and OS logs) before inserting another memory board.
If a memory board (which contains DIMMs) is unlocked while in Advanced
ECC mode, audio alarms and visual alerts occur.
CAUTION: When the memory board locking switch is unlocked in a mode that does not support hot-add or hot-replace capabilities, audio alarms and visual alerts occur. Removing the memory board at this point causes server failure.
To end the audio alarms and visual alerts, move the memory board locking switch back to the locked position. This action does not result in data corruption or server failure.
If removal of a single memory board is required and it is the only memory board, power down the server and make the necessary memory changes.
Online spare memory
Online Spare Memory provides a higher level of memory protection than
Advanced ECC. With Online Spare Memory, the probability of a server failing because of uncorrectable memory errors is reduced.
Removal and replacement procedures 41
In this mode, memory that is receiving a high rate of correctable memory errors is automatically disengaged and a replacement set of memory is used in its place.
Since DIMMs that are receiving a high rate of correctable memory errors have an increased probability of receiving an uncorrectable memory error (which results in a server failure), the server experiences higher availability. The degraded memory can be replaced during scheduled downtime and poses no additional risk to the server.
Online Spare Memory is supported with one to four memory boards installed. On this server, each installed memory board is protected by its own spare memory.
No OS support is required.
•
•
The following guidelines apply to Online Spare Memory:
•
•
•
All general memory requirements apply.
Online Spare Memory is supported with 1, 2, 3, or 4 memory boards.
•
Each board must have a valid Online Spare configuration. No dependencies exist for the configuration between different memory boards.
Each memory board includes its own Online Spare Bank. All boards operate independently in Online Spare mode. Each board can failover to its Online
Spare Bank independent of the other memory boards. Some boards can be in
Online Spare degraded mode while others are still in operational Online
Spare mode.
•
The minimum valid Online Spare configuration for a memory board requires at least one bank of dual-rank DIMMs or two banks of single-rank DIMMs.
If the server does not meet these requirements, an error message is displayed during POST and the server defaults to Advanced ECC and Advanced ECC guidelines apply.
The server automatically configures the optimal Online Spare solution.
Online Spare Memory does not support any hot-plug operations.
HP recommends the following configurations. These configurations result in optimal use of memory. Other configurations are valid, but do not result in the maximum amount of installed memory being available to the OS.
•
If only single-rank DIMMs are used on a memory board, all DIMMs should be of the same size on that memory board.
42 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
•
If only dual-rank DIMMs are used on a memory board, all DIMMs should be of the same size on that memory board.
•
If a mixture of single- and dual-rank DIMMs are used on a memory board, the dual-rank DIMMs should be two times the size of any single-rank
DIMM.
After installing DIMMs, use RBSU to configure the system for online spare memory support.
Hot-plug mirrored memory
Hot-Plug mirrored memory (mirrored memory) provides a higher level of memory protection than either Advanced ECC or Online Spare Memory. With mirrored memory, the server is protected against uncorrectable memory errors that would otherwise result in server failure. Mirrored memory allows the server to keep two copies of all memory data on separate memory boards.
If an uncorrectable error is encountered, the proper data is retrieved from the memory board that does not contain the error. In addition, mirrored memory allows failed or degraded DIMMs to be replaced while the server is running without requiring server downtime. The memory board with the failed DIMM(s) can be removed, failed DIMMs replaced, and the board re-inserted into the server without any interruption to the OS.
Mirrored memory is supported with either two or four memory boards installed.
No OS support is required.
Mirrored memory has two configurations: dual-board and quad-board. Singleboard mirrored memory is not supported. For either mode, choose "Mirrored" in
RBSU.
The following guidelines apply to mirrored memory:
•
•
All general memory requirements apply.
Mirrored memory is supported with two or four memory boards.
Removal and replacement procedures 43
•
•
•
Memory boards 1 and 2 are populated for dual-board mirrored memory.
Boards 1, 2, 3, and 4 are populated for quad-board mirrored memory. Any deviation from these guidelines results in the server booting in Advanced
ECC mode and Advanced ECC guidelines apply.
Memory boards 1 and 2 form a mirrored pair for dual-board mirrored memory. For quad-board mirrored memory, memory boards 3 and 4 form an additional mirrored pair.
Memory boards within a mirrored pair must have the same amount of total memory. However, each board of the mirrored pair may have different
DIMM configurations as long as they have equal total size. For example, memory boards 1 and 2 could each contain 2 GB of physical memory per board with board 1 containing two 1-GB DIMMs and board 2 containing four 512-MB DIMMs.
•
•
•
•
•
•
The amount of memory between mirrored pairs can be different in quadboard mirrored memory mode. For example, memory pair 1 (boards 1 and 2) can contain 2 GB each while memory pair 2 (boards 3 and 4) contain 4 GB each.
In quad-board mirrored memory, the two pairs of memory boards operate independently. One of the pairs of memory boards can be degraded while the other pair of memory boards can still be fully mirrored.
Hot-add operations are not permitted. Board removals and insertions in mirrored memory are solely for the purpose of hot-replace operations.
For hot-replace to function properly, the memory board must be re-inserted into the location from which it was removed. If the board is placed into the incorrect slot (for example, if board 2 is removed in dual-board mirroring mode and re-inserted into memory slots 3 or 4), a configuration error occurs.
Attempting to insert a board into the improper position results in audio alarms and visual alerts.
Replace only one board at a time. That is, if memory boards 2 and 4 both contain memory errors, remove board 2, replace the failed DIMMs, and replace board 2 before proceeding to board 4.
If a board is inserted into a valid memory slot but with an invalid DIMM configuration (including too much or too little memory), a DIMM configuration error occurs and a visual alert occurs. Refer to Memory Board
LEDs ("Memory board LEDs and components" on page 93 ).
44 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
•
If you remove a board while the server is running and do not replace the board, the next reboot results in the system defaulting to Advanced ECC and
Advanced ECC guidelines apply.
Hot-plug RAID memory
Hot-plug RAID memory (RAID memory) provides a similar level of memory protection as mirrored memory but obtains this protection using less total memory. For example, in a RAID memory configuration, 25% of the installed memory is not available to the OS. In a mirrored memory configuration, however, 50% of the installed memory is not available to the OS. RAID memory protects the server against uncorrectable memory errors that would otherwise result in a server failure.
Although mirrored memory keeps two copies of all memory data, RAID memory keeps only one copy of all memory data and additional parity information. If an uncorrectable memory error is encountered, the server can create the proper data using the parity information and the information from the other memory boards that contain no failures.
As with mirrored memory, RAID memory allows failed or degraded DIMMs to be replaced while the server is running without requiring server downtime. The memory board with the failed DIMM(s) can be removed, failed DIMMs replaced, and the board re-inserted into the server without any interruption to the
OS.
RAID memory is only supported if all four memory boards are installed. No OS support is required.
The following guidelines apply to Hot-Plug RAID memory:
•
•
•
All general memory requirements apply.
RAID memory is only supported with four memory boards.
•
All four memory boards must have the same amount of total memory.
However, each board may have different DIMM configurations as long as they have equal total size. Any deviation from this rule results in the server booting in Advanced ECC mode and Advanced ECC guidelines apply.
No hot-add operations are supported in RAID memory, only hot-replace.
Removal and replacement procedures 45
•
If you remove a board while the server is running and do not replace it, the next reboot results in the system reverting to Advanced ECC and Advanced
ECC guidelines apply.
Memory boards and DIMMs
Memory board and DIMM installation, removal, and replacement procedures can be either hot-plug or non-hot-plug, depending on how the server is configured.
Hot-plug operations can be hot-add or hot-replace. Hot-add makes additional memory resources available to the OS. Hot-replace allows failed or degraded
DIMMs to be replaced while the server is running. Hot-add is only supported with Microsoft® Windows® 2003 or later. Hot-replace has no OS requirements.
The following table illustrates AMP modes that support hot-plug features.
Advanced Memory
Protection Mode
Hot-
Replace
Supported
Hot-Add
Supported
Advanced ECC
Online Spare Memory
X
Hot-Plug Mirrored Memory
Hot-Plug RAID Memory
X
X
When the server is configured for mirrored or RAID memory, you can perform a hot-replacement procedure in the following manner without powering down the server or experiencing server downtime:
1. Remove a memory board.
2. Replace failed or degraded DIMM(s).
3. Reinstall the memory board in the slot from which it was removed.
The replacement procedures in this section apply to both hot-plug and non-hotplug memory procedures, except as noted.
IMPORTANT: Be sure to power down the server when performing board removal procedures in a server that is not configured for Mirrored or Hot-Plug RAID Memory.
46 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Observe the following warnings when performing a hot-plug replacement procedure.
WARNING: Always comply with all electrostatic and
thermal guidelines to prevent bodily injury and ensure a properly
functioning system when performing hot-plug operations.
•
•
WARNING: To prevent personal injury from hazardous
energy:
•
Remove watches, rings, or other metal objects.
Use tools with insulated handles.
Do not place tools or metal parts on top of batteries.
Removing a memory board (non-hot-plug)
2. Remove the access panel ("Access panel" on page 21 ).
3. Determine which memory board is to be removed by locating the memory board that displays an amber Board Status LED. Take note of the failed
DIMM, if applicable.
4. Power down the server ("Powering down the server" on page 20 ).
5. Unlock the memory board locking switch.
6. Unlock and open the memory board ejector lever.
7. Remove the memory board.
Removal and replacement procedures 47
DIMMs
8. Replace the DIMM ("DIMMs" on page 47 ).
9. Install the memory board ("Installing a memory board" on page 48 ).
To remove the component:
1. Remove the memory board ("Removing a memory board (non-hot-plug)" on
page
48 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
To replace the component, reverse the removal procedure.
Installing a memory board
1. Align the memory board with the memory board guide clips.
2. Install the memory board into the server and close the ejector lever.
3. Move the locking switch to the locked position.
Removal and replacement procedures 49
NOTE: In hot-plug procedures, all LEDs now turn off except the board status LED, which flashes green while the board is rebuilding. This process may take several minutes.
4. If this is a non-hot-plug procedure, power up the server and configure the
memory ("Configuring the memory" on page 39 ). If this is a hot-plug
procedure, proceed to step 5.
5. Observe the LEDs on the top of the memory board to be sure that the
memory is functioning properly ("Memory board LEDs and components" on
page
93 ). The LED states will be valid when the memory board has finished
rebuilding for hot-plug operations and when the server has completed booting after a non-hot-plug operation.
6. Reinstall the access panel ("Access panel" on page 21 ).
Processor
The server supports up to four processors. With two or more processors installed, the server supports boot functions through the processor installed in processor socket 1. However, if processor 1 fails, the system attempts to boot from processor 2 and provides a processor failure message.
CAUTION: To prevent thermal instability and damage to the server, do not separate the processor from the heatsink. The processor, heatsink, and retaining clip make up a single assembly.
CAUTION: To prevent possible server malfunction and damage to the equipment, do not mix processors of different types.
IMPORTANT: If upgrading processor speed, update the system ROM before installing the processor.
IMPORTANT: Processor socket 1 and PPM slot 1 must be populated at all times or the server will not function properly.
IMPORTANT: Always install a PPM when you install a processor. The system fails to boot if the PPM is missing.
IMPORTANT: To ensure proper cooling, be sure the processor baffle is installed at all times.
To remove the component:
50 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
1. Power down the server ("Powering down the server" on page 20 ).
3. Remove the access panel ("Access panel" on page 21 ).
4. Remove the processor air baffle ("Air baffle" on page 25 ).
5. Open the processor retaining bracket.
6. Release the processor locking lever.
7. Remove the processor.
Removal and replacement procedures 51
CAUTION: Failure to completely open the processor locking lever prevents the processor from seating during installation, leading to hardware damage.
CAUTION: To prevent possible server malfunction or damage to the equipment, be sure to align the pins on the socket with the corresponding guide holes on the processor assembly.
To replace the component, reverse the removal procedure.
52
PPM
HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
The server PPMs provide the proper power to each processor. Each PPM must be installed in the slot adjacent to its processor.
IMPORTANT: Processor socket 1 and PPM slot 1 must be populated at all times or the server will not function properly.
IMPORTANT: Always install a PPM when you install a processor. The system fails to boot if the PPM is missing.
IMPORTANT: To ensure proper cooling, be sure the processor baffle is installed at all times.
To remove the component:
1. Power down the server ("Powering down the server" on page 20 ).
3. Remove the access panel ("Access panel" on page 21 ).
4. Remove the processor air baffle ("Air baffle" on page 25 ).
5. Open the latches on the PPM retaining bracket and remove the PPM retaining bracket.
Removal and replacement procedures 53
IMPORTANT: Always install a PPM when you install a processor. The system fails to boot if the corresponding PPM is missing.
To replace the component, reverse the removal procedure.
SCSI backplane board
To remove the component:
1. Power down the server ("Powering down the server" on page 20 ).
3. Unlock and open the tower bezel ("Unlocking and removing the tower bezel"
on page
4. Remove the access panel ("Access panel" on page 21 ).
5. Remove the processor air baffle ("Air baffle" on page 25 ).
6. Remove the center wall ("Center wall" on page 26 ).
7. If the server is rack mounted, remove the rack bezel ("Removing the rack bezel" on page 24 ).
8. Remove the media bezel.
54 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
9. Disconnect all cabling.
10. Remove the SCSI cage from the server chassis.
Removal and replacement procedures 55
11. Remove the SCSI backplane board.
To replace the component, reverse the removal procedure.
NOTE: In some configurations, it may be necessary to route the SCSI cables over the fan cage.
System board
To remove the component:
1. Power down the server ("Powering down the server" on page 20 ).
3. Unlock and open the tower bezel ("Unlocking and removing the tower bezel"
on page
4. Place the chassis on its side with the access panel facing upwards.
5. Remove the access panel ("Access panel" on page 21 ).
6. Remove the processor air baffle ("Air baffle" on page 25 ).
7. Remove all expansion boards.
8. Remove all memory boards ("Removing a memory board (non-hot-plug)" on
page
56 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
9. Remove all processors ("Processor" on page 49 ).
10. Remove all PPMs ("PPM" on page 52 ).
11. Remove the center wall ("Center wall" on page 26 ).
12. Disconnect all power and data cables ("Cable connector identification" on
page
13. Remove the memory board.
14. Remove the system board ("System board" on page 55 ).
15. Remove the PCI-X Hot Plug basket from the system board.
Removal and replacement procedures 57
To replace the component, reverse the removal procedure.
Power backplane
To remove the component:
1. Remove the system board ("System board" on page 55 ).
2. Remove the power backplane.
To replace the component, reverse the removal procedure.
Tape drive blank
To remove the component:
1. Unlock and open the tower bezel ("Unlocking and removing the tower bezel"
on page
CAUTION: Always populate each media bay with either a device or a blank. Proper airflow can only be maintained when the bays are populated. Unpopulated drive bays can lead to improper cooling and thermal damage.
58 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
2. Pull the tape drive blank out of the chassis.
To replace the component, reverse the removal procedure.
Tape drive
To remove the component:
1. Unlock and open the tower bezel ("Unlocking and removing the tower bezel"
on page
Removal and replacement procedures 59
2. Slide the tape drive out of the server far enough to reach the cables.
3. Disconnect the data and power cables from the tape drive.
4. Remove the plastic guides from the tape drive: a. Lift the plastic retainer from the slot closest to the front of the drive. b. Repeat for the opposite plastic clip.
To replace the component, reverse the removal procedure.
Battery
If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.
WARNING: The computer contains an internal lithium
manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not
properly handled. To reduce the risk of personal injury:
60 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
•
•
•
•
Do not attempt to recharge the battery.
Do not expose the battery to temperatures higher than
60°C (140°F).
Do not disassemble, crush, puncture, short external contacts,
or dispose of in fire or water.
Replace only with the spare designated for this product.
To locate the battery:
To remove the component:
1. Power down the server ("Powering down the server" on page 20 ).
2. Extend or remove the server from the rack ("Extending the server from the rack" on page 18
, "Removing the server from the rack" on page 21 ).
3. Remove the access panel ("Access panel" on page 21 ).
4. Remove the PPM holddown ("PPM" on page 52 ).
5. Remove the battery.
Removal and replacement procedures 61
To replace the component, reverse the removal procedure.
Run RBSU to configure the system after replacing the batter. Refer to the
HP ROM-Based Setup Utility User Guide for more detailed information.
Re-entering the server serial number and product ID
After you replace the system board, you must re-enter the server serial number and the product ID.
1. During the server startup sequence, press the F9 key to access RBSU.
3. Select Serial Number. The following warning is displayed:
WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. This option should only be used by qualified service personnel. This value should always match the serial number sticker located on the chassis.
5. Enter the serial number and press the Enter key.
62 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
7. Enter the product ID and press the Enter key.
10. Press the F10 key to confirm exiting RBSU. The server will automatically reboot.
Server cabling
63
In this section
Storage device cabling guidelines
CAUTION: To prevent damage to the equipment, be sure that the server is powered down, all cables are disconnected from the back of the server, and the power cord is disconnected from the grounded
(earthed) AC outlet before installing devices.
CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure.
Improper grounding can cause electrostatic discharge.
64 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Cable connector identification
Item Description
1 PCI Hot-Plug board
4
5
6
7
Fan board signal
Fan board signal
Fan board power
Power supply connectors
10 Power supply signal
Server cabling
SCSI cabling
The following are the standard SCSI cabling configurations for this server:
•
Standard SCSI cabling to the SCSI ports (on page
•
Standard SCSI cabling to an expansion board ("External SCSI cabling configuration" on page 65 )
NOTE: The appropriate cables should ship in the individual option kits or with the device being installed.
65
Standard SCSI cabling to the SCSI ports
NOTE: In some configurations, it may be necessary to route the SCSI cables over the fan cage.
External SCSI cabling configuration
In order to connect an external device to the server:
1. Reconfigure the internal SCSI cabling (to SCSI Port 2).
NOTE: It may be necessary to slide the SCSI cable service loop from under the system board.
66 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
NOTE: It may be necessary to run RBSU to assign boot order to SCSI
Port 2.
2. Connect the external device.
Server cabling
Tape drive cabling to the USB port
IMPORTANT: Route the USB cable under the mid fan cage.
67
Item Description
1
2
USB connector on the system board
USB connector on the media device
RILOE II cabling
The 30-pin Remote Insight cable ships with the RILOE II cable kit.
68 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
IMPORTANT: Install the RILOE II board into slot 3 or 4 for ease of cabling.
Diagnostic tools
69
In this section
SmartStart software
SmartStart is a collection of software that optimizes single-server setup, providing a simple and consistent way to deploy server configuration. SmartStart has been tested on many ProLiant server products, resulting in proven, reliable configurations.
SmartStart assists the deployment process by performing a wide range of configuration activities, including:
•
Configuring hardware using embedded configuration utilities, such as RBSU and ORCA
•
Preparing the system for installing "off-the-shelf" versions of leading operating system software
•
Installing optimized server drivers, management agents, and utilities automatically with every assisted installation
70 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
•
Testing server hardware using the Insight Diagnostics Utility ("HP Insight
•
Installing software drivers directly from the CD. With systems that have internet connection, the SmartStart Autorun Menu provides access to a complete list of ProLiant system software.
•
Enabling access to the Array Configuration Utility, Array Diagnostic Utility, and Erase Utility
SmartStart is included in the HP ProLiant Essentials Foundation Pack. For more information about SmartStart software, refer to the HP ProLiant Essentials
Foundation Pack or the HP website ( http://www.hp.com/servers/smartstart ).
SmartStart Scripting Toolkit
The SmartStart Scripting Toolkit is a server deployment product that delivers an unattended automated installation for high-volume server deployments. The
SmartStart Scripting Toolkit is designed to support ProLiant BL, ML, and DL servers. The toolkit includes a modular set of utilities and important documentation that describes how to apply these new tools to build an automated server deployment process.
Using SmartStart technology, the Scripting Toolkit provides a flexible way to create standard server configuration scripts. These scripts are used to automate many of the manual steps in the server configuration process. This automated server configuration process cuts time from each server deployed, making it possible to scale server deployments to high volumes in rapid fashion.
For more information, and to download the SmartStart Scripting Toolkit, refer to the HP website ( http://www.hp.com/servers/sstoolkit ).
HP Instant Support Enterprise Edition
ISEE is a proactive remote monitoring and diagnostic tool to help manage your systems and devices, a feature of HP support. ISEE provides continuous hardware event monitoring and automated notification to identify and prevent potential critical problems. Through remote diagnostic scripts and vital system configuration information collected about your systems, ISEE enables fast restoration of your systems. Install ISEE on your systems to help mitigate risk and prevent potential critical problems.
For more information on ISEE, refer to the HP website
( http://www.hp.com/hps/hardware/hw_enterprise.html
).
To download HP ISEE, visit the HP website
( http://www.hp.com/hps/hardware/hw_downloads.html
).
For installation information, refer to the HP ISEE Client Installation and Upgrade
Guide ( ftp://ftp.hp.com/pub/services/hardware/info/isee_client.pdf
).
Option ROM Configuration for Arrays
Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign RAID levels, and establish online spare configurations.
The utility also provides support for the following functions:
•
•
•
Reconfiguring one or more logical drives
Viewing the current logical drive configuration
Deleting a logical drive configuration
If you do not use the utility, ORCA will default to the standard configuration.
For more information regarding array controller configuration, refer to the controller user guide.
For more information regarding the default configurations that ORCA uses, refer to the HP ROM-Based Setup Utility User Guide on the Documentation CD.
72 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
HP ROM-Based Setup Utility
RBSU, an embedded configuration utility, performs a wide range of configuration activities that may include:
•
•
•
•
•
Configuring system devices and installed options
Displaying system information
Selecting the primary boot controller
Configuring memory options
Language selection
For more information on RBSU, refer to the HP ROM-Based Setup Utility User
Guide on the Documentation CD or the HP website
( http://www.hp.com/servers/smartstart ).
ROMPaq utility
Flash ROM enables you to upgrade the firmware (BIOS) with system or option
ROMPaq utilities. To upgrade the BIOS, insert a ROMPaq diskette into the diskette drive and boot the system.
The ROMPaq utility checks the system and provides a choice (if more than one exists) of available ROM revisions. This procedure is the same for both system and option ROMPaq utilities.
For more information about the ROMPaq utility, refer to the HP website
( http://www.hp.com/servers/manage ).
System Online ROM flash component utility
The Online ROM Flash Component Utility enables system administrators to efficiently upgrade system or controller ROM images across a wide range of servers and array controllers. This tool has the following features:
•
Works offline and online
•
Supports Microsoft® Windows NT®, Windows® 2000, Windows® Server
2003, Novell Netware, and Linux operating systems
IMPORTANT: This utility supports operating systems that may not be supported by the server. For operating systems supported by the server, refer to the HP website ( http://www.hp.com/go/supportos ).
•
Integrates with other software maintenance, deployment, and operating system tools
•
Automatically checks for hardware, firmware, and operating system dependencies, and installs only the correct ROM upgrades required by each target server
To download the tool and for more information, refer to the HP website
( http://h18000.www1.hp.com/support/files/index.html
).
Integrated management log
The IML records hundreds of events and stores them in an easy-to-view form.
The IML timestamps each event with 1-minute granularity.
You can view recorded events in the IML in several ways, including the following:
•
•
•
•
From within HP SIM
From within Survey Utility
From within operating system-specific IML viewers
−
For NetWare: IML Viewer
−
For Windows®: IML Viewer
−
For Linux: IML Viewer Application
From within HP Insight Diagnostics
For more information, refer to the Management CD in the HP ProLiant Essentials
Foundation Pack.
74 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Integrated Lights-Out technology
The iLO subsystem is a standard component of selected ProLiant servers that provides server health and remote server manageability. The iLO subsystem includes an intelligent microprocessor, secure memory, and a dedicated network interface. This design makes iLO independent of the host server and its operating system. The iLO subsystem provides remote access to any authorized network client, sends alerts, and provides other server management functions.
Using iLO, you can:
•
•
•
•
Remotely power up, power down, or reboot the host server.
Send alerts from iLO regardless of the state of the host server.
Access advanced troubleshooting features through the iLO interface.
Diagnose iLO using HP SIM through a web browser and SNMP alerting.
For more information about iLO features, refer to the Integrated Lights-Out User
Guide on the Documentation CD or on the HP website
( http://www.hp.com/servers/lights-out ).
Automatic server recovery
ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer. However, when the operating system fails, the timer expires and restarts the server.
ASR increases server availability by restarting the server within a specified time after a system hang or shutdown. At the same time, the HP SIM console notifies you by sending a message to a designated pager number that ASR has restarted the system. You can disable ASR from the HP SIM console or through RBSU.
HP Systems Insight Manager
HP SIM is a web-based application that allows system administrators to accomplish normal administrative tasks from any remote location, using a web browser. HP SIM provides device management capabilities that consolidate and integrate management data from HP and third-party devices.
IMPORTANT: You must install and use HP SIM to benefit from the Pre-
Failure Warranty for processors, hard drives, and memory modules.
For additional information, refer to the Management CD in the HP ProLiant
Essentials Foundation Pack or the HP SIM website
( http://www.hp.com/go/hpsim ).
HP Insight Diagnostics
HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation.
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, launch the
SmartStart CD.
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft® Windows® and Linux versions, the utility helps to ensure proper system operation.
For more information or to download the utility, refer to the HP website
( http://www.hp.com/servers/diags ).
76 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
USB support
HP provides both standard USB support and legacy USB support. Standard support is provided by the operating system through the appropriate USB device drivers. HP provides support for USB devices before the operating system loading through legacy USB support, which is enabled by default in the system
ROM. HP hardware supports USB version 1.1 or 2.0, depending on the version of the hardware.
•
•
•
•
•
Legacy USB support provides USB functionality in environments where USB support is normally not available. Specifically, HP provides legacy USB functionality for:
POST
RBSU
Diagnostics
DOS
Operating environments which do not provide native USB support
For more information on ProLiant USB support, refer to the HP website
( http://h18004.www1.hp.com/products/servers/platforms/usb-support.html
).
Internal USB functionality
An internal USB connector is available for use with USB backup tape drives.
The internal connector is not shared with any of the external USB connectors.
One internal USB device and up to three external devices can be supported at the same time.
Server component identification
77
In this section
Front panel components
78 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Item Description
4
5
6
Tape drive blank
SCSI channel 2 (channels 0 and 1)
SCSI channel 1 (channels 0-7)
Front panel LEDs and buttons
Item Description
1 UID switch and LED
2 Internal system health
LED
Status
Blue = Activated
Flashing blue = System being managed remotely
Off = Deactivated
Green = Normal (system on)
Flashing Amber = System health is degraded
Flashing Red = System health is critical
Server component identification
Item Description
3
4
5
6
External system health
(power supply) LED
NIC 1 link/activity LED
(embedded NIC only)
NIC 2 link/activity LED
(embedded NIC)
Power on/Standby button and LED
Status
Green = Normal (system on)
Flashing Amber = Redundant power supply failure
Flashing Red = Power supply failure. No operational power supplies.
Green = Linked to network
Flashing green = Linked with activity on the network
Off = No network connection
Green = Linked to network
Flashing green = Linked with activity on the network
Off = No network connection
Green = System has AC power and is powered on
Amber = System has AC power and is in standby mode
Off = System has no AC power
Rear panel components
79
80 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Item Description
4 iLo
6
7
8
9
10
11
12
64-bit/100-MHz PCI-X slot 1
64-bit/100-MHz PCI-X slot 2
64-bit/100-MHz PCI-X slot 3
64-bit/100-MHz PCI-X slot 4
PCI Express x4 slot 5
PCI Express x4 slot 6
PCI Express x4 slot 7
13
14
15
16
PCI Express x4 slot 8
64-bit/133-MHz PCI-X hot-plug slot 9
64-bit/133-MHz PCI-X hot-plug slot 10
Power supply (primary)
17 Power blank
18 T-15 Torx screwdriver
Rear panel LEDs and buttons
Server component identification 81
Item Description
1 Unit ID LED Blue
2
3
4
5
NIC Activity LED
(Integrated NC7782)
NIC Link LED
(Integrated NC7782) iLO NIC Activity LED iLO NIC Link LED
Green
Green
Green
Green
6 Power LED
(primary and redundant)
7 Power LED
(primary and redundant)
Green
Amber
On = Activated
Flashing = System remotely managed
Off = Deactivated
On or flashing = Linked to network
Off = Not linked to network
On = Network activity
Off = No network activity
On or flashing = Network activity
Off = No network activity
On = Linked to network
Off = Not linked to network
Refer to Hot-plug Power Supply LEDs (on page
Refer to Hot-plug Power Supply LEDs (on page
82 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
System board components
11
12
13
14
15
7
8
5
6
9
10
Item Description
1 64-bit/133-MHz PCI-X Hot-Plug slot 10
2
3
4
64-bit/133-MHz PCI-X Hot-Plug slot 9
PCI Express x4 slot 8
PCI Express x4 slot 7
PCI Express x4 slot 6
PCI Express x4 slot 5
64-bit/100-MHz PCI-X slot 4
64-bit/100-MHz PCI-X slot 3
64-bit/100-MHz PCI-X slot 2
64-bit/100-MHz PCI-X slot 1
Memory board slot 1
Memory board slot 2
Memory board slot 3
Memory board slot 4
PPM slot 1
Server component identification 83
22
23
24
25
26
27
28
29
Item Description
16
17
PPM slot 2
QuickFind diagnostic display
18 System maintenance switch (SW-2)
19 Miscellaneous (SW-1)
20 PPM slot 4
31
PPM slot 3
Processor socket 4
Fan board signal connector
Processor socket 3
Processor socket 2
Fan board signal connector
Fan board power connector
Processor socket 1
RILOE II connector
35
36
37
38
39
Power supply signal connector
USB option connector
SCSI connector 2
SCSI connector 1
PCI hot-plug board connector
84 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
System maintenance switches
The system miscellaneous switch (SW1) is an eight-position switch that is reserved. The default position for all eight positions is Off.
1 Reserved
2 Reserved
3 Reserved
4 Reserved
5 Reserved
6 Reserved
7 Reserved
8 Reserved
The system maintenance switch (SW2) is an eight-position switch that is used for system configuration. The default position for all eight positions is Off.
Position Description Function
S1 iLO Security Off = iLO security is enabled
On = iLO security is disabled lock be changed
On = System configuration is locked protection override
On = Clears power-on password and administrator password
Server component identification 85
Position Description Function
S6 Invalid configuration
Off = Normal
On = ROM treats system configuration as invalid
S7 Reserved
S8 Reserved
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM.
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly configure the server or data loss could occur.
DIMM slot locations
86 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
6
4
5
DIMM
Slot
1
2
3
Description Bank
PC2-3200R DIMM slot
PC2-3200R DIMM slot
PC2-3200R DIMM slot
PC2-3200R DIMM slot
PC2-3200R DIMM slot
PC2-3200R DIMM slot
Bank A
Bank A
Bank B
Bank B
Bank C
Bank C
Internal health LED combinations
When the internal health LED on the front panel illuminates either flashing amber or flashing red, the server is experiencing a health event. Combinations of illuminated system board LEDs (on page
87 ) and the internal health LED
indicate system status.
Server component identification
System board LEDs
In normal operations, all the LEDs are off unless one of the components fails.
When a component fails, the LED illuminates amber.
87
Code Component
01
04
05
06
07
Power supply cable(s)
Explanation
System board to power supply cables: defective cables or cables not installed
Fan board cable(s)
Memory board
Fan board power or signal cables are not installed.
Base memory failure (memory board 1 is not installed or no valid memory configuration is present)
SCSI board power cable SCSI board or cable is not present
08 f1 t2
PCI hot-plug switch board
System interlock
PCI Hot Plug switch board or cable is not present.
Main system interlock catch-all.
Indicates an interlock problem not flagged by codes 01 to 07.
Processor 1 unsupported Processor 1 unsupported. Replace with a supported processor.
Processor 2 unsupported Processor 2 unsupported. Replace with a supported processor.
88 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Code Component
t3 Processor 3 unsupported
Explanation
Processor 3 unsupported. Replace with a supported processor. t4
P1
U1
U2
Processor 4 unsupported Processor 4 unsupported. Replace with a supported processor.
Processor 1 is missing Processor 1 is missing, and is required to boot. Install Processor 1. If processor 4 is installed and the system is booting up, the P1 code and Port
84/85 will be displayed one second each to show the unit is booting.
PPM1 is missing
PPM2 is missing
Processor 1 is installed without PPM 1.
Install PPM 1.
Processor 2 is installed without PPM 2.
Install PPM 2.
U3 PPM3 is missing
U4
A0
P5
_5
PPM4 is missing
Pre POST code
Power supply
Power backplane
Processor 3 is installed without PPM 3.
Install PPM 3.
Processor 4 is installed without PPM 4.
Install PPM 4.
Standby mode
No power from the power supply
No 5-V power from the power supply backplane board
33
15
Ut
5U nb
Power backplane
1.5V Regulator
VTT Regulator
PPM Failure
No boot
No 3.3-V power from the power supply backplane board
No 1.5-V power from the voltage regulator on the system board
No power from the VTT voltage regulator on the system
No power from the PPM
Indicates a no-boot situation
Hot-plug power supply LEDs
Server component identification 89
Item Description
1 Primary power supply power LED (green)
2 Primary power supply fail LED (amber)
3
4
Redundant power supply power LED (green)
Redundant power supply fail LED (amber)
Power Supply Condition Power LED
(Green)
Fail LED
(Amber)
No AC power to all power supply units
No AC power to this power supply unit only or power supply failure (includes over voltage and over temperature)
Off Off
Off On
AC present/Standby outputs on
Power supply DC outputs On and OK
Power supply failure (current limit)
Flashing Off
On Off
Off Flashing
90 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
SCSI IDs
The server supports two simplex SCSI channels.
•
•
Channel 1 supports up to eight drives (channels 0 to 7).
Channel 2 supports up to two drives (channels 0 to 1).
The SCSI IDs for both channel configurations are illustrated. HP recommends populating hard drive bays starting with the lowest SCSI ID.
NOTE: These SCSI ID designations apply regardless of the controller or the configuration used.
NMI jumper
The NMI jumper allows administrators to perform a memory dump before performing a hard reset. Crash dump analysis is an essential part of eliminating reliability problems, such as hangs or crashes in OSs, device drivers, and applications. Many crashes can freeze a system, requiring you to do a hard reset.
Resetting the system erases any information that would support root cause analysis.
Server component identification 91
Systems running Microsoft® Windows® experience a blue-screen trap when the
OS crashes. When this happens, Microsoft® recommends that system administrators perform an NMI event by temporarily shorting the NMI header with a jumper. The NMI event enables a hung system to become responsive again.
Hot-plug SCSI hard drive LEDs
1 Activity status
2 Online status
3 Fault status
Status
On = Drive activity
Flashing = High activity on the drive or drive is being configured as part of an array.
Off = No drive activity
On = Drive is part of an array and is currently working.
Flashing = Drive is actively online.
Off = Drive is offline.
On = Drive failure
Flashing = Fault-process activity
Off = No fault-process activity
92 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Hot-plug SCSI hard drive LED combinations
Activity
LED (1)
Online
LED (2)
Fault LED
(3)
Interpretation
On, off, or flashing
On or off Flashing A predictive failure alert has been received for this drive.
Replace the drive as soon as possible.
On, off, or flashing
On Off The drive is online and is configured as part of an array.
If the array is configured for fault tolerance and all other drives in the array are online, and a predictive failure alert is received or a drive capacity upgrade is in progress, you may replace the drive online.
On or flashing
Flashing Off
Do not remove the drive. Removing a drive may terminate the current operation and cause data loss.
The drive is rebuilding or undergoing capacity expansion.
On Off Off Do not remove the drive.
The drive is being accessed, but (1) it is not configured as part of an array; (2) it is a replacement drive and rebuild has not yet started; or
(3) it is spinning up during the POST sequence.
Flashing Flashing Flashing Do not remove the drive. Removing a drive may cause data loss
in non-fault-tolerant configurations.
Off Off On
Either (1) the drive is part of an array being selected by an array configuration utility; (2) Drive Identification has been selected in
HP SIM; or (3) drive firmware is being updated.
The drive has failed and has been placed offline.
You may replace the drive.
Off Off Off Either (1) the drive is not configured as part of an array; (2) the drive is configured as part of an array, but it is a replacement drive that is not being accessed or being rebuilt yet; or (3) the drive is configured as an online spare.
If the drive is connected to an array controller, you may replace the drive online.
Server component identification
Memory board LEDs and components
Error indicators remain illuminated when the system is powered off so that the status of the LEDs can still be seen. This matches the behavior of all the other error indicators in the server.
Error indicators will only be cleared if:
•
•
•
The locking switch is locked after the board is reinstalled
The system has been rebooted
The board is removed from the system
93
CAUTION: When the memory board locking switch is unlocked in a mode that does not support hot-add or hot-replace capabilities, audio alarms and visual alerts occur. Removing the memory board at this point causes server failure.
To end the audio alarms and visual alerts, move the memory board locking switch back to the locked position. This action does not result in data corruption or server failure.
If removal of a single memory board is required and it is the only memory board, power down the server and make the necessary memory changes.
94 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Item Description Status
4
5
6
7
8
9
Removable
DIMM 1 LED
DIMM 2 LED
DIMM 3 LED
DIMM 4 LED
DIMM 5 LED
Green = OK to remove the board
Off = Do not remove if the system is on
Green = DIMM installed
Amber = Failed or degraded DIMM
Flashing amber = DIMM configuration error
Off = No DIMM installed
Green = DIMM installed
Amber = Failed or degraded DIMM
Flashing amber = DIMM configuration error
Off = No DIMM installed
Green = DIMM installed
Amber = Failed or degraded DIMM
Flashing amber = DIMM configuration error
Off = No DIMM installed
Green = DIMM installed
Amber = Failed or degraded DIMM
Flashing amber = DIMM configuration error
Off = No DIMM installed
Green = DIMM installed
Amber = Failed or degraded DIMM
Flashing amber = DIMM configuration error
Off = No DIMM installed
Server component identification 95
Item Description Status
10 DIMM 6 LED Green = DIMM installed
Amber = Failed or degraded DIMM
Flashing amber = DIMM configuration error
Off = No DIMM installed
11 Online Spare LED Green = Online spare mode
Amber = Degraded online spare mode
Flashing amber = Invalid AMP mode*
Off = Not in Online Spare mode
13
LED
Amber = Degraded mirrored mode
Flashing amber = Invalid AMP mode*
Off = Not in Mirrored mode
Hot-Plug RAID LED Green = RAID mode
Amber = Degraded RAID mode
Flashing amber = Invalid AMP mode*
Off = Not in RAID mode
14 Board Status LED Off = Power off - memory board locking switch not engaged or invalid memory configuration.
Green = Normal operation
Flashing green = Board is rebuilding
Flashing amber = DIMM on this board encountered memory errors
Amber Flashing = one of the following conditions:
•
•
Unlocking a memory board that should not be removed
Attempting to insert a memory board at runtime that fails
*The following applies to an invalid AMP error. This error occurs when the current memory configuration is not valid for the configured AMP mode:
96 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
−
If the mode selected is the desired mode, modify the DIMM/board configuration to support the desired mode. Refer to the memory overview section.
−
If the mode selected is not the desired mode, run RBSU and change the
AMP mode. Refer to "HP ROM-Based Setup Utility ("HP ROM-Based
Setup Utility" on page 72 )" for more information.
NOTE: If the Online Spare, Mirrored, and RAID LEDs are off, the server is in Advanced ECC mode. Refer to "HP ROM-Based Setup
Utility (on page 72 )" for more information.
The following table illustrates the different LED combinations for a correctly configured memory board.
ECC Memory Spare
Memory
Hot-Plug
Mirrored
Memory
Hot-Plug RAID
Memory
Board status Green Green Green Green
DIMM 1 to
6, if populated
Online
Spare status
Mirrored status
RAID status Off
Board
Removable
Off Off Green
Fan locations
Server component identification 97
Item Description Configuration
Redundant
Primary
Redundant
Primary
Redundant
Primary
Specifications
99
In this section
Server specifications
The following information pertains to the rack configuration.
Dimension Specification
Height 26.67 cm (10.5 in)
Depth
Width
Weight (maximum)
Weight (no drives installed)
Input requirement
Rated input voltage
67.31 cm (26.5 in)
44.45 cm (17.5 in)
63.5 kg (140 lb)
41.28 kg (91 lb)
Rated input frequency
Rated input current
Rated input power
BTUs per hour
Specification
100-127 VAC
200 - 240 VAC
50 Hz - 60 Hz
@ 100VAC - 12 A
@ 200VAC - 8 A
@100 VAC - 1161 W
@200 VAC - 1598 W
@100 VAC - 3960
@200 VAC - 5450
100 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Power supply output 910 W (low line)
1300 W (high line)
Environmental specifications
Temperature range* Specification
Operating
10
°
C to 35
°
C (50
°
F to 95
°
F)
Shipping
-40
°
C to 70
°
C (-40
°
F to 158
°
F)
Maximum wet bulb temperature 28
°
C (82.4
°
F)
Specification Relative humidity
(noncondensing)**
Operating 10% to 90%
Non-operating 5% to 95%
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m
(1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C
(113°F). Altitude maximum for storage corresponds to a pressure minimum of 70 KPa.
Hot-plug power supply calculations
For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, refer to the HP Enterprise Configurator website
( http://h30099.www3.hp.com/configurator/ ).
DDR SDRAM DIMM specifications
NOTE: Use only 512-MB, 1-GB, 2-GB, or 4-GB; 72-bit wide; 2.5-V;
PC2-3200 Registered ECC DDR2 SDRAM. Use HP DDR2 SDRAM only.
Item Description
Size 512 MB, 1 GB, 2 GB, or 4 GB
Specifications 101
Item Description
Upgrade requirement Any combination of like-paired DDR SDRAM DIMMs that provide a minimum of 1 GB
1.44-MB diskette drive specifications
Item Description
Dimensions
Height
Width
12.7 mm (0.5 in)
96 mm (3.8 in)
Depth
LEDs (front panel)
Read/write capacity per diskette
High density
130 mm (5.1 in)
Green = On
Low density
Drives supported
Drive height
Drive rotation
Transfer rate
1.44 MB
720 KB
1
One-third height
300 rpm
Bytes/sector 512
Sectors per track (high/low) 18/9
Tracks per side (high/low) 80/80
Access times
Track-to-track (high/low)
Average (high/low)
3 ms/6 ms
169 ms/94 ms
102 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Item Description
Setting time
Latency average
15 ms
100 ms
Cylinders (high/low)
Read/write heads
80/80
2
CD-ROM drive specifications
Item Description
Applicable disk CD-ROM (modes 1 and 2); mixed mode (audio and data combined); CD-DA;
Photo CD (single/multiple-session), CD-XA ready; CDi ready
Capacity 550 MB (mode 1, 12 cm)
640 MB (mode 2, 12 cm)
Block size 2368, 2352 bytes (mode 0)
2352, 2340, 2336, 2048 bytes (mode 1)
2352, 2340, 2336, 2048 bytes (mode 2)
Dimensions
Height
Depth
Width
Weight
Data transfer rate
Sustained
12.7 mm (0.50 in)
132.08 mm (5.20 in)
132.08 mm (5.20 in)
0.34 kg (0.75 lb)
150 KB/s (sustained 1X), 1500/3600 KB/s (10X to 24X)
Access times (typical)
Full stroke 300 ms
Diameter
Thickness
12 cm, 8 cm (4.70 in, 3.15 in)
1.2 mm (0.05 in)
Item Description
Track pitch 1.6 µm (6.3 × 10
-7
in)
Specifications 103
Startup time
Stop time
Laser parameters
Type
Wave length
< 10 s
< 5 s (single); < 30 s (multisession)
Semiconductor laser GaAs
700 ± 25 nm
Divergence angle
Output power
53.5° ± 1.5°
0.14 mW
Operating conditions
Temperature 5°C to 45°C (41°F to 118°F)
Humidity 5% to 90%
DVD-ROM drive specifications
Item Description
Disk formats
Capacity
DVD (single and double layer), DVD-5, DVD-9, DVD-10, DVD-R, CD-ROM Mode
1 & 2, CD-DA, CD-XA (Mode 2, Form 1 & 2), CD-I (Mode 2, Form 1 & 2), CD-I ready,
CD-Bridge, CD-R, PhotoCD (single and multi-session)
4.7 GB (DVD-5), 8.5 GB (DVD-9), 9.4 GB (DVD10), 550 Mb (Mode 1, 12 cm),
640 Mb (Mode 2, 12 cm), 180 Mb (8 cm)
Block size 2352 bytes (mode 0)
2352, 2340, 2336, 2048 bytes (mode 1)
2352, 2340, 2336, 2048 bytes (mode 2)
2048 bytes (DVD)
Dimensions
Height
Depth
Width
12.7 mm (0.50 in)
132.08 mm (5.20 in)
132.08 mm (5.20 in)
104 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
Item Description
Weight
Data transfer rate
0.34 kg (0.75 lb)
Sustained
Burst
Access times (typical)
4463 - 10,800 KB/s (8X CAV DVD mode), 150 KB/s (sustained 1X CD-ROM),
1552 3600 KB/s (24X CAV CD-ROM)
16.6 MB/s with DMA support
Full stroke
Random
<200 ms CD
<300 ms DVD
<110 ms CD
<180 ms DVD
12 cm, 8 cm (4.70 in, 3.15 in) Diameter
Thickness
Track pitch
1.2 mm (0.05 in)
0.74
µ m (3.15 × 10
-7
in) DVD-ROM
1.6 µm (6.3 × 10
-7
in) CD-ROM
Cache/buffer
Startup time
Stop time
Laser parameters
< 10 s
< 5 s (single); < 30 s (multisession)
128 KB
Type
Wave length
Divergence angle
Output power
Semiconductor laser GaAs
700 ± 25 nm
53.5° ± 1.5°
0.14 mW
Operating conditions
Temperature 5°C to 45°C (41°F to 118°F)
Humidity 5% to 90%
Specifications 105
Ultra320 SCSI hard drive specifications
Item 36.4-GB 72.8-GB 300-GB
Capacity
Height
Width
Interface
Transfer rate
36,419.6 MB
1.0 in
(One-third height)
4.0 in
72,837.2 MB
1.0 in
(One-third height)
4.0 in
72,837.2 MB
1.0 in
(One-third height)
4.0 in
146,815.74 MB 300,000 MB
1.0 in
(One-third height)
4.0 in
1.0 in
(One-third height)
4.0 in
Ultra320 SCSI Ultra320 SCSI Ultra320 SCSI Ultra320 SCSI Ultra320SCSI
320 MB/sec 320 MB/sec 320 Mb/sec 320 MB/sec 320 MB/sec
Rotational speed 15,000 rpm 10,000 rpm 15,000 rpm 15,000 rpm 10,000 rpm
Logical blocks 71,132,000
Operating temperature
10°C to 35°C
(50°F to 95°F)
142,264,000 142,264,000 286,749,488 585,937,500
10°C to 35°C
(50°F to 95°F)
10°C to 35°C
(50°F to 95°F)
10°C to 35°C
(50°F to 95°F)
10°C to 35°C
(50°F to 95°F)
Acronyms and abbreviations
ABEND
abnormal end
ACU
Array Configuration Utility
AMP
Advanced Memory Protection
ASR
Automatic Server Recovery
BBWC
battery-backed write cache
DDR
double data rate
DU
driver update
EFS
Extended Feature Supplement
107
108 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
IEC
International Electrotechnical Commission
iLO
Integrated Lights-Out
IML
Integrated Management Log
IPL
initial program load
IRQ
interrupt request
MPS
multi-processor specification
NEMA
National Electrical Manufacturers Association
NFPA
National Fire Protection Association
NIC
network interface controller
NVRAM
non-volatile memory
Acronyms and abbreviations 109
ORCA
Option ROM Configuration for Arrays
PCI Express
peripheral component interconnect express
PCI-X
peripheral component interconnect extended
PDU
power distribution unit
POST
Power-On Self-Test
PPM
Processor Power Module
PSP
ProLiant Support Pack
PXE
preboot eXecution environment
RBSU
ROM-Based Setup Utility
RILOE II
Remote Insight Lights-Out Edition II
110 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
SATA
serial ATA
SCSI
small computer system interface
SDRAM
synchronous dynamic RAM
SIM
Systems Insight Manager
SIMM
single inline memory module
SPM
system power module
SSD
support software diskette
TMRA
recommended ambient operating temperature
UID
unit identification
USB
universal serial bus
VCA
version control agent
VHDCI
very high density cable interconnect
WOL
Wake-on LAN
Acronyms and abbreviations 111
Index
A
ASR (Automatic Server Recovery) 74, 107
Automatic Server Recovery (ASR) 74, 107
B
C
CSR (customer self repair) 7 customer self repair 7
D
diagnostic tools 69, 72, 73, 74, 75
E
environmental requirements 100
113
environmental specifications 100
F
H
hard drives, determining status of 90, 91
HP ProLiant Essentials Foundation Pack 75
HP Systems Insight Manager, overview 75
I
iLO (Integrated Lights-Out) 74
IML (Integrated Management Log) 73
Instant Support Enterprise Edition 71
Integrated Lights-Out (iLO) 74
Integrated Management Log (IML) 73
L
114 HP ProLiant ML570 Generation 3 Server Maintenance and Service Guide
M
N
NIC (network interface controller) 108
O
Online ROM Flash Component Utility 72
Option ROM Configuration for Arrays
ORCA (Option ROM Configuration for
S
server setup 16 server warnings and cautions 16
SmartStart Scripting Toolkit 70
specifications, server 99, 100, 101, 102
T
P
U
utilities 69, 71, 72, 73, 74, 75
R
RBSU (ROM-Based Setup Utility) 39, 72
rear panel buttons 81 rear panel LEDs 81
remote support and analysis tools 71
removal and replacement procedures 15
RILOE II (Remote Insight Lights-Out Edition
advertisement
Key Features
- Support for up to 24 DIMMs
- Variety of AMP options to optimize server availability
- Support for PCI-X, PCI Express, and hot-plug PCI-X expansion boards
- Supports a variety of hot-plug components, including hard drives, fans, and power supplies
- Features an integrated management log
- Integrated Lights-Out technology
- Automatic server recovery
- HP Systems Insight Manager
- HP Insight Diagnostics
- Internal USB functionality