LG W1952TQ (W1952TQ-PFT.K*A) Color Monitor Service Manual

Internal Use Only

Website:http://biz.LGservice.com

COLOR MONITOR

SERVICE MANUAL

CHASSIS NO. : LM 84B

MODEL: W1952TQ(W1952TQ-PFT.K***A**)

( ) **Same model for Service

CAUTION

BEFORE SERVICING THE UNIT,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CONTENTS

SPECIFICATIONS ................................................... 2

PRECAUTIONS ....................................................... 4

TIMING CHART ....................................................... 8

DISASSEMBLY ........................................................ 9

BLOCK DIAGRAM ................................................. 10

DESCRIPTION OF BLOCK DIAGRAM...................11

ADJUSTMENT ...................................................... 13

TROUBLESHOOTING GUIDE .............................. 15

EXPLODED VIEW...................................................19

REPLACEMENT PARTS LIST ...............................21

SCHEMATIC DIAGRAM ......................................... 2

3

1. LCD CHARACTERISTICS

Type : TFT Color LCD Module

Active Display Area : 19 inch diagonal

Pixel Pitch

Size

Color Depth

: 0.285 (H) x 0.285 (V)

: 493.7(H) x 320.1(V) x 16.5(D)

: 16.7M colors

Electrical Interface : LVDS

Surface Treatment : AG(Haze 25%), Hard Coating(3H)

Operating Mode

Backlight Unit

: Normally White

: 4 CCFL

2. OPTICAL CHARACTERISTICS

2-1. Viewing Angle by Contrast Ratio

≥

5

Left : +80° min., +88°(Typ) Right : -80° min., -88°(Typ)

Top : +80° min., +85°(Typ) Bottom : -80° min., -85°(Typ)

2-2. Luminance

SPECIFICATIONS

: 180(Typ) (Typ. 30)-sRGB

: 210(min), 300(Typ)-6500K

: 150(min)-9300K

4. MAX. RESOLUTION

Analog

Digital

: 1440 x 900@60Hz

: 1440 x 900@60Hz

5. POWER SUPPLY

5-1. Power Adaptor(Built-in Power)

Input : AC 100-240V~, 50/60Hz,

0.8A

5-2. Power Consumption

MODE H/V SYNC VIDEO POWER CONSUMPTION LED COLOR less than 39 W(max)

POWER ON (NORMAL) ON/ON ACTIVE less than 36 W(typ)

BLUE

STAND BY

SUSPEND

OFF/ON

ON/OFF

DPMS OFF

POWER S/W OFF

OFF/OFF

-

OFF

OFF

OFF

less than 1 W less than 1 W less than 1 W less than 1 W

AMBER

AMBER

AMBER

OFF

2-3. Contrast Ratio : 500(min), 1000(Typ)

DFC ->

10000 : 1 (Typ)

3. SIGNAL (Refer to the Timing Chart)

3-1. Sync Signal

• Type : Separate Sync, SOG, Digital

3-2. Video Input Signal

1) Type : R, G, B Analog

2) Voltage Level : 0~0.7 V

3) Input Impedance : 75

Ω

3-3. Operating Frequency

Horizontal

Vertical

: 28 ~ 83kHz

: 56 ~ 75Hz

6. ENVIRONMENT

6-1. Operating Temperature : 10°C~35°C (50°F~95°F)

6-2. Relative Humidity : 10%~80% (Non-condensing)

6-3. MTBF : 50,000 HRS with 90%

Lamp Life

Confidence level

: 40,000 Hours (Min)

7. DIMENSIONS (with TILT/SWIVEL)

Width

Depth

Height

: 4

51.5 mm (17.78'')

:

386 mm (15.2'')

:

220 mm (8.66'')

8. WEIGHT (with TILT/SWIVEL)

Net. Weight

Gross Weight

:

3.9 kg (8.6 lbs)

:

5.02 kg (11.07 lbs)

Copyright 2007 LG Electronics. Inc. All right reserved.

Only for training and service purposes

- 2 -

LGE Internal Use Only

Signal Connector Pin Assignment

• DVI-D Connector (Digital)

1

9

17

8

16

24

11

12

13

14

15

7

8

9

10

5

6

3

4

1

2

Pin Signal (DVI-D)

T. M. D. S. Data2-

T. M. D. S. Data2+

T. M. D. S. Data2/4 Shield

T. M. D. S. Data4-

T. M. D. S. Data4+

DDC Clock

DDC Data

Analog Vertical Sync.

T. M. D. S. Data1-

T. M. D. S. Data1+


T. M. D. S. Data3-

T. M. D. S. Data3+

+5V Power

Ground

(return for +5V,

H. Sync. and V. Sync.)

T. M. D. S. (Transition Minimized Differential Signaling)

22

23

24

18

19

20

21

16

17

Pin Signal (DVI-D)

Hot Plug Detect

T. M. D. S. Data0-

T. M. D. S. Data0+


T. M. D. S. Data5-

T. M. D. S. Data5+

T. M. D. S. Clock Shield

T. M. D. S. Clock+

T. M. D. S. Clock-



- 3 -


PRECAUTION

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD monitor that are important for safety. These parts are

marked on the schematic diagram and the

replacement parts list. It is essential that these critical parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about

650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

AC Volt-meter

TAKE CARE DURING HANDLING THE LCD MODULE

WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged in four corners.

• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded through wrist band.

• Do not leave the module in high temperature and in areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the module.

• If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

To Instrument's exposed

METALLIC PARTS

1.5 Kohm/10W

Good Earth Ground such as WATER PIPE,

CONDUIT etc.



- 4 -


SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

9. Use with this receiver only the test fixtures specified in

this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator;

10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.

Always remove the test receiver ground lead last.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES)

Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with

ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device.

Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)



- 5 -


General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500 F to 600 F) b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction-type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal temperature (500 F to 600 F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device


1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor


1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.



- 6 -


Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or

"lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the

IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.



- 7 -


TIMING CHART

VIDEO A

E

D

B

SYNC

C mode section

1 polarity

DOT

CLOCK

[MHz]

H(Pixels) +

25.175

Frequency

[kHz]/[Hz]

31.469

2

V(Lines) -

H(Pixels) -

28.321

70.09

31.468

V(Lines) + 70.08

3

4

5

H(Pixels) -

V(Lines) -

H(Pixels) -

V(Lines) -

H(Pixels) +

25.175

31.5

40.0

31.469

59.94

37.5

75

37.879

6

7

8

V(Lines) +

H(Pixels) +

V(Lines) +

H(Pixels) +/ -

V(Lin es) +/ -

H(Pixels) -

V(Lines) -

49.5

57.283

65.0

60.317

46.875

75.0

49.725

74.55

48.363

60.0

9

10

11

12

13

14

15

16

H(Pixels) -

V(Lines) -

H(Pixels) +/ -

V(Lines) +/ -

H(Pixels) +/ -

V(Lines) +/ -

H(Pixels) +

V(Lines) +

H(Pixels) +

V(Lines) +

H(Pixels) +

V(Lines) -

H(Pixels) -

V(Lines) +

H(Pixels) -

V(Lines) +

78.75

100.0

92.978

108.0

135.0

88.750

106.500

136.750

79.976

75.035

55.5

59.90

55.935

59.887

70.635

74.984

60.123

75.029

68.681

75.062

61.805

65.96

63.981

60.02

Total

Period (E)

800

449

900

Display

(A)

640

350

720

Front

Porch (D)

16

37

18

1688

1066

1600

926

1904

934

1936

942

1312

800

1456

915

1504

937

1688

1066

628

1056

625

1152

667

1344

806

449

800

525

840

500

1056

400

640

480

640

480

800

600

800

600

832

624

1024

768

1024

768

1152

870

1152

900

1280

1024

1280

1024

1440

900

1440

900

1440

900

12

16

10

16

1

40

1

16

1

32

1

24

3

16

1

32

3

18

2

48

1

16

1

48

3

80

3

96

3

4

80

3

96

2

64

Sync.

(C)

Back

Porch (B)

Resolution

96

2

108 54

2

48

60

35

640 x

350

720 x

400

48

33

120

640 x

480

640 x

480

3 16

128 88 800 x

600

23

160

21

800 x

600

64

3

136

6

96

3

176

28

128 144

3 39

134

4

112 248

3

144 248

3 38

32

6

80

17

152

6

224

39

160

29

200

31

38

232

25

152 248

6 33

832 x

624

1024 x 768

1024 x 768

1152 x 870

1152 x 900

1280 x

1280 x

1024

1024

1440 x 900

1440x

900

1440x

900



- 8 -


1.

Put a cushion or soft cloth on a flat surface.

2.

Place the monitor face down on the cushion or soft cloth.

DISASSEMBLY

3.

Slide the Cable Deco Cover out from the stand body.

4.

Press the hook,Take off the stand base from stand body.

5.

Please pull the stand body lightly to separate it from the hinge body.

6.

Remove the screws.

7.

Pull the front cover upward,then separate all the latches.

8.

Place the monitor face down,then disassemble back cover.

- 9 -

Module

BLOCK DIAGRAM

KEY

D-Sub

DVI-D



- 10 -


DESCRIPTION OF BLOCK DIAGRAM

1. Video Controller Part.

This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock.

The pixel clock for each mode is generated by the PLL.

The range of the pixel clock is 136MHz In W1952TQ.

This part consists of the Scaler, ADC convertor, TMDS receiver and LVDS transmitter.

The Scaler gets the video signal converted analog to digital, interpolates input to 1440X900(W1952TQ) resolution signal and outputs 8-bit R, G, B signal to transmitter.

2. Power Part.

This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.

15V is provided for inverter in

W1952TQ.

Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.

The inverter converts from DC 15V to AC 700Vrms and operates back-light lamps of module in

W1952TQ.

3. MICOM Part.

This part is include video controller part. And this part consists of EEPROM IC , control data, Reset IC and the Micom.

The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.

The controlled data of each modes is stored in EEPROM.



- 11 -


LIPS Board Block Diagram

50 ~ 60Hz

LINE

100 ~ 240V

EMI

COMPONENTS

INPUT RECTIFIER

AND FILTER

HVDC

ENERGY

TRANSFER

67KHz

15V

5V

OUTPUT RECTIFIER

AND FILTER

GND

PRIMARY

PWM

CONTROL

CIRCUIT

PHOTO-

COUPLER

ISOLATION

SIGNAL

COLLENT-

ION

SECONDARY

Operation description_Power

1. EMI components.

This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the circuit included a line-filter, across line capacitor and of course the primary protection fuse.

2. Input rectifier and filter.

This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.

3. Energy Transfer.

This part function is for transfer the primary energy to secondary through a power transformer.

4. Output rectifier and filter.

This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and also the over power protection is also monitor by this part.

5. Photo-Coupler isolation.

This part function is to feed back the DC output changing status through a photo transistor to primary controller to achieve the stabilized DC output voltage.

6. Signal collection.

This part function is to collect the any change from the DC output and feed back to the primary through photo transistor.



- 12 -


ADJUSTMENT

Windows EDID V1.0 User Manual

Operating System: MS Windows 98, 2000, XP

Port Setup: Windows 98 => Doesn’t need setup

Windows 2000, XP => Need to Port Setup.

This program is available for LCD Monitor only.

1. Port Setup a) Copy “UserPort.sys” file to

“c:\WINNT\system32\drivers” folder b) Run Userport.exe

2. EDID Read & Write

1) Run WinEDID.exe

2) Edit Week of Manufacture, Year of Manufacture,

Serial Number a) Input User Info Data b) Click “Update” button c) Click “ Write” button c) Remove all default number d) Add 300-3FF e) Click Start button.

f) Click Exit button.



- 13 -


SERVICE OSD

1) Turn off the power switch at the right side of the display.

2) Wait for about 5 seconds and press MENU, POWER switch for 1 second interval.

3) The SVC OSD menu contains additional menus that the User OSD menu as described below.

a) CLEAR ETI : To initialize using time.

c) Auto Color : W/B balance and Automatically sets the gain and offset value.

(press key for over 3 sec) d) AGING : Select Aging mode(on/off).

b) Module : To select applied module.

d) NVRAM INIT : EEPROM initialize.(24C16, press key for over 3 sec) e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.

f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.

g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)

Video Signal

Generator

IBM

Compatible PC

15

10

5

C

N o u t es d

R

S

2

3

2

C

P

A

R

A

L

L

E

L

A

PARALLEL PORT

V

G

S

M

O

N

I

T

O

R

V

S-

NY

C

TS

P

O

W

RE

B

220

Power inlet (required)

Power Select Switch

(110V/220V)

Power LED

E ST Switch

5V

OFF

F

ON

F V-Sync On/Off Switch

(Switch must be ON.)

B

A

1

11

6

5

9

ON

OFF

E

6

1

13

25

C

5V

74LS06

4.7K

5V

4.7K

4.7K

74LS06

14

1

Figure 1. Cable Connection



- 14 -


TROUBLESHOOTING GUIDE

1. NO POWER

NO POWER

(POWER INDICATOR OFF)

NO

CHECK POWER BOARD,

AND FIND OUT A SHORT

POINT AS OPENING

EACH POWER LINE

1

2

CHECK P704 VOLTAGE

PIN5, PIN6 (5V)?

YES

IS IC703 PIN2(3.3V)

IC702 PIN2(1.8V)

YES

CHECK U501 PIN127

PULSE

YES

CHECK U501

NO

NO

CHECK IC703(3.3V)

IC702(1.8V) LINE

CHECK CRYSTAL(X501)

Waveforms

1

P704-#5,6

2

IC703-#2

3

IC702-#2

4

U501-#127



- 15 -


2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS

NO RASTER

(OSD IS NOT DISPLAYED)

NO

1

2

CHECK P704

VOLTAGE PIN5,6

(5V)?

YES

P704 PIN9 3.3V?

YES

3

CHECK P704

PIN10

YES

4

CHECK

PULSE AS

CONTACTING PROBE

TO THE LAMP

WIRE OF THE

LCD MODULE

YES

REPLACE LCD MODULE

NO

NO

NO

1

P704-#5,6

CHECK POWER BOARD

(LIPS)

CHECK U501 INVERTER

ON/OFF PORT

1. CONFIRM BRIGHTNESS

OSD CONTRL STATUS

2. CHECK MICOM DIM-ADJ

PORT

POWER BOARD (LIPS)

Waveforms

2

P704-#9

3

P704-#10 (Brightness 100)

3

P704-#10 (Brightness 0)

5

LAMP CURRENT



- 16 -


3. NO RASTER (OSD IS NOT DISPLAYED) - MAIN

NO RASTER

(OSD IS NOT DISPLAYED)

1

CHECK U501

PIN114(3.3V)

PIN21(1.8V)

YES

U501

PIN 127,128

14.3MHZ?

YES

CHECK U501

PIN32(H-SYNC) AND

PIN33(V-SYNC).

IS PULSE APPEARED AT

SIGNAL PINS?

YES

TROUBLE IN CABLE

OR LCD MODULE

NO

NO

NO

CHECK IC703(3.3V),

IC702(1.8V)

1. CHECK PIN 127,128

SOLDERING CONDITION

2. CHECK X501

3. TROUBLE IN U501

CHECK CONNECTION LINE

FROM D-SUB TO U501

Waveforms

1

U501-#127



- 17 -


TROUBLE IN DPM

1

2

CHECK R71

7 AND

R71

8, SYNC

APPEARED?

YES

CHECK

U501 PIN 32,33

SYNC PULSE

YES

TROUBLE IN U501

4. TROUBLE IN DPM

NO

NO

CHECK PC

PC IS GOING

INTO DPM MODE

CHECK H/V SYNC LINE

Waveforms

1

H-SYNC

2

V-SYNC



- 18 -





EXPLODED VIEW PARTS LIST

Ref. No.

200

300

400

410

420

Part No.

EAJ35661001

EAJ36290802

EAJ42097502

EAJ32175201

EAJ38022802

EAJ41390301

ABJ35702302

ABJ35702304

ABJ36830002

ACQ35704405

Description

72% 16/9 700:1 4CCFL, 160/160, 5ms BOE HYDIS TECHNOLOGY

LCD,Module-TFT,LM190WX1-TLC2 DRIVER 19INCH 1440X900 300CD COLOR 72% 16/10 850:1 P7,

19"W WXGA+,Non-ZBD,Non-Glare, TN, 16.7M, Response time:5ms,Viewing angle:170/

Cabinet Assembly,W1952 S 19" CABINET ASSY FOR LPL/CMO/MTD

Cabinet Assembly,W1952 S 19" CABINET ASSY, 02 CKD

Cabinet Assembly,W1952 CABINET ASSY FOR AUO/BOE/NEC/CMO+

Cover Assembly,Rear,W1952 S 19" W1952 BACKCOVER

ACQ35704407

AGF35751203

MGJ41193201

Cover Assembly,Rear,W1952 S 19" W1952 BACKCOVER

Package Assembly,MAIN W52 series ODC Mstar

Plate,Shield,PRESS SPTE 0.3 SHIELD SPTE 0.3T, Lamp Shield, L1755/W1952/W2252

430

500

510

900

910

920

930

MGJ41193202 Plate,Shield,PRESS SPTE 0.3 SHIELD SPTE 0.3T, Lamp Shield, L1755/W1952/W2252

MGJ41204901 Plate,Metal,PRESS SBHG 0.8T SUPPORTER EGI W1952 METAL SUPPORT EGI 0.8T



EBR42021801 PCB Assembly,LED & P/SW T.T LM84 W52 series - -

EBR41684101 PCB Assembly,CONTROL T.T LM84A W52 series RD -

ACQ33707101 Cover Assembly,L1954T LM57B 19" Cover, Hinge Assy, Normal Stand, L1954T

ACQ33707107 Cover Assembly,L1954T,L207W LM57B 20" Cover, Hinge Assy Normal Stand, 01-CKD

MCK41193001 Cover,MOLD ABS L1755/WX52 ABS HF 350, Stand Body(L1755/WX52)

MCK41193003 Cover,MOLD ABS L1755/WX52 ABS HF 350, Stand Body(L1755/WX52) BLACK CKD

MCK41193101 Cover,MOLD ABS L1755/WX52 ABS HF 350, Cover Cable

MCK41193103 Cover,MOLD ABS L1755/WX52 ABS HF 350, Cover Cable Black CKD

AAN35706801 Base Assembly,STAND W1952, W2252 - W1952, W2252 stand base assy

AAN35706802 Base Assembly,STAND W1952, W2252 - W1952, W2252 stand base assy



- 20 LGE Internal Use Only

REPLACEMENT PARTS LIST

LOC NO. PART NO. DESCRIPTION/SPECIFICATON

CAPACITORs

C715

C716

C717

C719

C720

C722

C723

C725

C707

C708

C709

C710

C711

C712

C713

C714

C541

C700

C701

C702

C703

C704

C705

C706

C533

C534

C535

C536

C537

C538

C539

C540

C525

C526

C527

C528

C529

C530

C531

C532

C517

C518

C519

C520

C521

C522

C523

C524

C509

C510

C511

C512

C513

C514

C515

C516

C501

C502

C503

C504

C505

C506

C507

C508

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CC680CK41A

0CC680CK41A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK475CC94A

0CK103CK51A

0CE107EF610

0CE107EF610

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CC080CK11A

0CC080CK11A

0CC080CK11A

0CC101CK41A

0CC101CK41A

0CC680CK41A

0CK104CK56A

0CC680CK41A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK104CF56A

0CK473CH56A

0CK473CH56A

0CK473CH56A

0CK473CH56A

0CC102CK41A

0CK473CH56A

0CK473CH56A

0CC270CK41A

0CC270CK41A

0CK103CK51A

0CK103CK51A

0CK104CF56A

0CK224CF56A

0CE106CF638

0CK104CF56A

“Capacitor,Ceramic,Chip,0603B104K160CT 100nF”

“Capacitor,Ceramic,Chip,C1608X7R1E473KT 47nF”




“Capacitor,Ceramic,Chip,C1608C0G1H102JT 1nF”



“Capacitor,Ceramic,Chip,C1608C0G1H270JT 27pF”






“Capacitor,AL,Radial,SHL5.0TP16VB10M 10uF”













“”Capacitor,Ceramic,Chip,0603B104K160CT 100nF”











“Capacitor,Ceramic,Chip,C1608C0G1H080DT 8pF”



“Capacitor,Ceramic,Chip,C1608C0G1H101JT 100p”



















“Capacitor,Ceramic,Chip,C1608Y5V0J475ZT 4.7u”


“Capacitor,AL,Radial,KMG16VB100M 100uF 20”


D708

D709

D710

D711

D712

ZD10

ZD700

ZD701

D700

D701

D702

D703

D704

D705

D706

D707

ZD702

ZD703

ZD704

ZD707

ZD708

ZD709

ZD9

ICs

DATE:2007.11.20

C726

C727

C728

C729

C730

C731

C732

C733

C734

C738

C739

C740

C780

DIODEs


0CE107EF610

0CE107EF610

0CK105CD56A

0CK105CD56A

0CK105CD56A

0CK102CK56A

0CK102CK56A

0CK102CK56A

0CE107EF610

0CK104CF56A

0CK105CD56A

0CC101CK41A

0CE106CF638



“Capacitor,Ceramic,Chip,C1608X7R1A105KT 1uF”



“Capacitor,Ceramic,Chip,0603B102K500CT 1nF 1”







“Capacitor,AL,Radial,SHL5.0TP16VB10M 10uF”

0DSIH00018A

0DSIH00018A

0DSIH00018A

0DSIH00018A

0DSIH00018A

0DSIH00018A

0DSIH00018A

0DSIH00018A

0DSIH00018A

0DSIH00018A

0DSIH00018A

0DSON00138A

0DD184009AA

0DZ560009GB

0DZ560009GB

0DZ560009GB

0DZ560009GB

0DZ560009GB

0DZ560009GB

0DZ560009GB

0DZ560009GB

0DZ560009GB

0DZ560009GB

“Diode,Switching,ENKMC2837-T112 1.2V”











“Diode,Schottky,MMBD301LT1G 600MV 30”

“Diode Assembly,KDS184 KDS184 TP KEC”

“Diode,Zener,BZT52C5V6S-(F) 5.6V”










“IC,EEPROM,M24C02-RMN6TP 2KBIT”

“IC,LDO Voltage Regulator,AZ1086S-1.8TRE1 3.2T”

“IC,LDO Voltage Regulator,AZ1117H-3.3 4.75TO10”

“IC,Video Processors,FE253MOH-LF 300MVTO3”

“IC,Serial Flash Memory,W25X20VSNIG 2MBIT 25”

“IC,EEPROM,M24C16-WMN6TP 16KBIT”

IC700

IC702

IC703

U501

U502

U503

FILTERs

0IMMR00014A

0IPMG78403A

0IPMGA0010A

0IPRP00784C

EAN37157001

0IMMRSG036B

L700

L701

L702

0LCML00003B

0LCML00003B

0LCML00003B

TRANSISTORs

Q501

Q700

Q701

Q705

Q706

Q707

Q760

Q761

RESISTORs

0TRKE80046A

0TRKE80046A

EBK39150701

0TRKE80046A

0TR390609DC

0TR390609DC

0TR390609DC

0TRKE80046A

R1

R2

R3

0RJ1602D677

0RJ1602D677

0RJ1801D677

“Filter,Bead,MLB-201209-0120P-N2”



“TR,Bipolar,2N3904S NPN 6V 60V 4”


“TR,Bipolar,KTA1241 PNP -8V -35V”


“TR,Bipolar,2N3906S-RTK PNP -5V”




“Resistor,Chip,MCR03EZPJ163 16KOHM”


“Resistor,Chip,MCR03EZPJ182 1.8KOHM”

- 21 -


R730

R731

R734

R735

R749

R750

R751

R752

R720

R721

R723

R725

R726

R727

R728

R729

R753

R754

R755

R758

R711

R712

R713

R715

R716

R717

R718

R719

R702

R703

R704

R705

R706

R707

R708

R709

R524

R525

R526

R527

R530

R6

R700

R701

R516

R517

R518

R519

R520

R521

R522

R523

R507

R508

R509

R510

R511

R512

R513

R514

R4

R5

R501

R502

R503

R504

R505

R506

0RJ0752D677

0RJ0752D677

0RJ3601D677

0RJ1002D677

0RJ3900D677

0RJ1002D677

0RJ3900D677

0RJ4701D677

0RJ4701D677

0RJ4701D677

0RX0331K668

0RH1002D622

0RJ2001D677

0RJ2700D677

0RJ2700D677

0RJ1000D677

0RJ1000D677

0RJ0000D677

0RJ1001D677

0RJ4701D677

0RJ0332D677

0RJ0102D677

0RJ0102D677

0RJ0102D677

0RJ0102D677

0RJ0102D677

0RJ0102D677

0RJ0332D677

0RJ0102D677

0RJ0102D677

0RJ1001D677

0RJ0332D677

0RJ0752D677

0RJ0682D677

0RJ0682D677

0RJ0332D677

0RJ3900D677

0RJ1002D677

0RJ1000D677

0RJ1502D677

0RJ0000D677

0RJ0000D677

0RJ4701D677

0RJ1000D677

0RJ1002D677

0RJ4701D677

0RJ0332D677

0RJ0332D677

0RJ1002D677

0RJ2201D677

0RJ4701D677

0RJ4701D677

0RJ1801D677

0RJ2201D677

0RJ1000D677

0RJ0562D677

0RJ1000D677

0RJ0562D677

0RJ4700D677

0RJ1000D677

0RJ0562D677

0RJ4701D677

0RJ4701D677

0RJ4701D677

0RJ4701D677

0RJ4700D677

0RJ4700D677

0RJ0000D677



“Resistor,Chip,MCR03EZPJ101 100OHM”

“Resistor,Chip,MCR03EZPJ560 56OHM 5”












“Resistor,Chip,MCR03EZPJ000 0OHM 5%”



























“Resistor,Chip,MCR03EZPJ102 1KOHM 5”
















“Resistor,Metal Oxide Film,RSD02F4J3R30 3.3OHM”

“Resistor,Chip,MCR10EZHJ103 10KOHM”









P1

P2

P3

P700

P701

P702

P704

P705


R759

R760

R761

R762

R766

R767

R768

R769

R773

R8

0RJ4701D677

0RJ2001D677

0RJ4701D677

0RJ4701D677

0RJ1002D677

0RJ1001D677

0RJ1000D677

0RJ0000D677

0RJ2001D677

0RJ2701D677

CONNECTORs











SWITCHs

6602T12005E

6602T12005C

6602T12005C

6630TGA005B

6630G100316

6630V90220E

6630V90220K

EAG37060101

“Connector,Wafer,12505WR-06A00 6P 1.2”



“Connector,DSUB,QH11121-DN0-D DVI 24”

“Connector,DSUB,DZ11AA1-HVG-PF D-SUB”

“Connector,Wafer,TJC2004-6A 6P 2.0MM”

“Connector,Wafer,TJC2004-11A 11P 2.0M”

“Connector,FFC/FPC/PIC,10031HR-30 30P 1.00M”

SW1

SW2

SW3

SW4

SW5

SW6

SW7

OTHERs

LD2

X501

EBF37991701

EBF37991701

EBF37991701

EBF37991701

EBF37991701

EBF37991701

6600R000133

0DLGP0128AA

6212AA2001G

“Switch,Tact,KMB-903/TMB-901 1C1P”






“Switch,Tact,JTP1280A6 1C1P 12VDC”

“LED,Chip,GPTD1210YBC BLUE/YEL”

“Crystal,HLX-U-F-14.31818M-18”

- 22 -

SCHEMATIC DIAGRAM

1. SCALER



- 23 -


2. POWER & WAFER



- 24 -


3. CONTROL



- 25 -


P/NO : MFL30290856

Nov. 2007

Printed in China

LG W1952TQ (W1952TQ-PFT.K***A**) Color Monitor Service Manual

Assistant Bot

Internal Use Only

Website:http://biz.LGservice.com

COLOR MONITOR

SERVICE MANUAL

CHASSIS NO. : LM 84B

( ) **Same model for Service

CAUTION

BEFORE SERVICING THE UNIT,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CONTENTS

SPECIFICATIONS

Signal Connector Pin Assignment

PRECAUTION

WARNING

CAUTION

SERVICING PRECAUTIONS

TIMING CHART

DISASSEMBLY

BLOCK DIAGRAM

DESCRIPTION OF BLOCK DIAGRAM

LIPS Board Block Diagram

PRIMARY

SECONDARY

Operation description_Power

ADJUSTMENT

SERVICE OSD

TROUBLESHOOTING GUIDE

1. NO POWER

2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS

3. NO RASTER (OSD IS NOT DISPLAYED) - MAIN

4. TROUBLE IN DPM

EXPLODED VIEW PARTS LIST

REPLACEMENT PARTS LIST

SCHEMATIC DIAGRAM

1. SCALER

2. POWER & WAFER

3. CONTROL

Key Features

Frequently Answers and Questions

What is the resolution of this monitor?

What are the viewing angles of this monitor?

What is the contrast ratio of this monitor?

Related manuals

LG

Flatron L1900E

LG

L1730 PSNPM

LG

FLATRON W2243S

LG

Flatron W1942S W1942S(W1942S-PFT.A***QF)

LG

L1942HE-BF

LG

N1642W-PF

LG

FLATRON L246WH

LG

Flatron W2284F

LG

FLATRON W2253V-PFV.A

LG

Flatron L1742P

LG

FLATRONS W2241S

LG

FLATRON W1946S-BFW

LG W1952TQ (W1952TQ-PFT.K*A) Color Monitor Service Manual