LG KS20 mobile phone Service manual

Table Of Contents

1. INTRODUCTION.................................. 5

1.1 Purpose ...................................................... 5

1.2 Regulatory Information ............................... 5

2. PERFORMANCE ..................................7

2.1 System Overview.........................................7

2.2 Usable environment.....................................8

2.3 Radio Performance......................................8

2.4 Current Consumption.................................14

2.5 RSSI BAR ..................................................14

2.6 Battery BAR ...............................................15

2.7 Sound Pressure Level ...............................16

2.8 Charging ....................................................16

4.13 SIM Detect Troubleshooting ..................115

4.14 Camera Troubleshooting .......................117

4.15 Keypad Backlight Troubleshooting ........120

4.16 Main LCD Troubleshooting ....................121

4.17 Receiver Path ........................................122

4.18 Headset path .........................................124

4.19 Speaker phone path ..............................126

4.20 Main microphone ...................................128

4.21 Headset microphone..............................130

4.22 Vibrator ..................................................132

5. DOWNLOAD.....................................133

5.1 KS20 DOWNLOAD..................................133

3. TECHNICAL BRIEF............................17

3.1 General Description ...................................17

3.2 GSM Mode.................................................19

3.3 UMTS Mode...............................................23

3.4 LO generation and distribution circuits ......25

3.5 Off-chip RF Components ...........................25

3.6 Digital Baseband(DBB/MSM7200) ............35

3.7 Hardware Architecture ...............................37

3.8. Subsystem(MSM7200) .............................39

3.9. Power Block..............................................42

3.10. External memory interface......................47

3.11. H/W Sub System ....................................49

3.12. Main Features.........................................76

6. BLOCK DIAGRAM ...........................146

6.1 GSM & UMTS RF Block ..........................146

6.2 Interface Diagram ....................................148

7. Circuit Diagram................................153

8. BGA IC PIN MAP..............................163

8. PCB LAYOUT ...................................169

9. Calibration & RF Auto Test

Program (Hot Kimchi) .....................177

9.1 Configuration of HOT KIMCHI .................177

9.2 How to use HOT KIMCHI.........................180

4. TROUBLE SHOOTING.......................82

4.1 RF Component ..........................................82

4.2 SIGNAL PATH_UMTS RF .........................85

4.3 SIGNAL PATH_GSM RF ...........................86

4.4 Checking VCTCXO Block ..........................87

4.5 Checking Front-End Module Block ............89

4.6 Checking UMTS Block...............................91

4.7 Checking GSM Block.................................96

4.8 Checking Bluetooth Block........................102

4.9 Checking WLAN Block.............................104

4.10 Power ON Troubleshooting ...................108

4.11 Charger Troubleshooting .......................110

4.12 USB Troubleshooting.............................113

10. Phone Test Mode _ 3G smart

Phone KS20 ...................................182

11. EXPLODED VIEW & REPLACEMENT

PART LIST ..................................... 189

11.1 EXPLODED VIEW ................................ 189

11.2 Replacement Parts

<Mechanic component> ....................... 191

<Main component> ............................... 193

11.3 Accessory ............................................. 209

Copyright © 2007 LG Electronics. Inc. All right reserved.

Only for training and service purposes

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LGE Internal Use Only


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1. INTRODUCTION

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system.

There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.



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1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.

Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.


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2. PERFORMANCE

2. PERFORMANCE

2.1 System Overview

Item

Shape

Size

Weight

Power

Talk Time

(with 800mAh)

Standby Time

Specification

GSM900/1800/1900 and WCDMA2100 - Bar type Handset

99.8 X 58 X 12.9 mm

Under 92.5g (with 1050mAh Battery)

3.7 V normal, 1050 mAh Li-Polymer

Over 100 min (WCDMA, Tx=-23 dBm, Voice)

Over 150 min (GSM, Tx=Level 5, Voice)

Over 300 Hrs (WCDMA, DRX=1.28)

(with 800mAh)

Antenna

LCD

LCD Backlight

Camera

Vibrator

LED Indicator

MIC

Over 400 Hrs (GSM, Paging period=9)

Internal type

Main 2.8” 262K 240 X 320 pixel (TFT)

White LED Back Light

Auto Focus - 2.0 Mega pixel (CMOS) + VGA Video Call Camera

Yes (Coin Type)

Yes

Yes

Receiver Yes

Earphone Jack Yes (18 pin)

Volume Key

External Memory

I/O Connect

Push Type(+, -)

Yes

18 Pin



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2. PERFORMANCE

2.2 Usable environment

1) Environment

Item

Voltage

Operation Temp

Storage Temp

Humidity

Specification

3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V]

-20 ~ +60

°C

-20 ~ +70

°C

85 % (Max)

2) Environment (Accessory)

Reference

TA Power

* CLA : 12 ~ 24 V(DC)

Spec.

Available power

Min

100

Typ.

220

Max

240

Unit

Vac

2.3 Radio Performance

1) Transmitter - GSM Mode

No Item

MS allocated

Channel

100k~1GHz

1G~12.75GHz

1

Conducted

Spurious

Emission

Idle Mode

100k~880MHz

880M~915MHz

915M~1GHz

1G~[A]MHz

[A]M~[B]MHz

[B]M~12.5GHz

* In case of DCS : [A] -> 1710, [B] -> 1785


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GSM DCS & PCS

9k ~ 1GHz -39dBm

-39dBm

1G~[A]MHz

[A]M~[B]MHz

-33dBm

[B]M~12.75GHz

-60dBm 100k~880MHz

-33dBm

-39dBm

-33dBm

-60dBm

-62dBm 880M~915MHz

-60dBm 915M~1GHz

-62dBm

-60dBm

-50dBm 1G~[A]MHz

-56dBm [A]M~[B]MHz

-50dBm

-56dBm

-50dBm [B]M~12.5GHz

-50dBm

* In case of PCS : [A] -> 1850, [B] -> 1910



2. PERFORMANCE

No

2

3

4

5

Radiated

Spurious

Emission

Item

MS allocated

Channel

Idle Mode

Frequency Error

Phase Error

Frequency Error

Under Multipath and

Interference Condition

30M ~ 1GHz

1G ~ 4GHz

915M~1GHz

1G~[A]MHz

[A]M~[B]MHz

[B]M~4GHz

±0.1ppm

±5(RMS)

±20(PEAK)

GSM

30M ~ 880MHz

880M ~ 915MHz

DCS & PCS

30M~1GHz -36dBm

-36dBm

1G~[A]MHz

[A]M~[B]MHz

-30dBm

[B]M~4GHz

-57dBm 30M~880MHz

-30dBm

-36dBm

-30dBm

-57dBm

-59dBm 880M~915MHz

-57dBm

-47dBm 1G~[A]MHz

-53dBm

915M~1GHz

[A]M~[B]MHz

-47dBm [B]M~4GHz

±0.1ppm

±5(RMS)

±20(PEAK)

-59dBm

-57dBm

-47dBm

-53dBm

-47dBm

3dB below reference sensitivity 3dB below reference sensitivity

RA250 : ±200Hz

HT100 : ±100Hz

RA250: ±250Hz

HT100: ±250Hz

TU50 : ±100Hz

TU3 : ±150Hz

0 ~ 100kHz

200kHz

+0.5dB

-30dB

TU50: ±150Hz

TU1.5: ±200Hz

0 ~ 100kHz

200kHz

6

Output RF

Spectrum

Due to

250kHz

400kHz modulation 600 ~ 1800kHz

Due to

Switching transient

* In case of DCS : [A] -> 1710, [B] -> 1785

-33dB

-60dB

250kHz

400kHz

1800 ~ 3000kHz

3000 ~ 6000kHz

≥6000kHz

400kHz

600kHz

1200kHz

-66dB 600 ~ 1800kHz

-69dB 1800 ~ 6000kHz

-71dB ≥6000kHz

-77dB

-19dB 400kHz

-21dB 600kHz

-21dB 1200kHz

1800kHz -24dB 1800kHz

* In case of PCS : [A] -> 1850, [B] -> 1910

+0.5dB

-30dB

-33dB

-60dB

-60dB

-65dB

-73dB

-22dB

-24dB

-24dB

-27dB



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2. PERFORMANCE

No

7

8

9

Item

Intermodulation attenuation

Transmitter Output Power

Burst timing

10

11

12

13

8

9

6

7

GSM

–

DCS & PCS

Frequency offset 800kHz

Intermodulation product should be Less than 55dB below the level of Wanted signal

Power control Power Tolerance Power control Power Tolerance

Level

5

(dBm)

33

(dB)

±3

Level

0

(dBm)

30

(dB)

±3

31

29

27

25

23

21

19

17

±3

±3

±3

±3

±3

±3

±3

±3

1

2

3

4

5

6

7

8

28

26

24

22

20

18

16

14

±3

±3

±3

±3

±3

±3

±3

±3

14

15

16

17

18

19

15

13

11

9

7

5

Mask IN

±3

±3

±5

±5

±5

±5

13

14

15

9

10

11

12

8

6

12

10

4

2

0

Mask IN

±4

±5

±5

±4

±4

±4

±4


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2. PERFORMANCE

2) Transmitter - WCDMA Mode

No

1

2

3

Item

Maximum Output Power

Frequency Error

Open Loop Power control in uplink

Specification

Class 3 : +24dBm(+1/-3dB)

±0.1ppm

±9dB@normal, ±12dB@extreme

Adjust output(TPC command) cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4.5

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

4 Inner Loop Power control in uplink

-1 -0.5/-1.5 -1/-3 -1.5/-4.5

Group (10 equel command group)

+1 +8/+12 +16/+24

-50dBm(3.84MHz) 5 Minimum Output Power

Qin/Qout : PCCH quality levels

6 Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB

7

8

9

Transmit OFF Power

Transmit ON/OFF Time Mask

Change of TFC

Ton@DPCCH/Ior : -24 -> -18dB

-56dBm(3.84MHz)

±25us

PRACH,CPCH,uplinlk compressed mode

±25us

Power varies according to the data rate

DTX : DPCH off

(minimize interference between UE)

10 Power setting in uplink compressed

11 Occupied Bandwidth(OBW)

12 Spectrum emission Mask

±3dB(after 14slots transmission gap)

5MHz(99%)

-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k

-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M

-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M

-49dBc@∆f=8.5~12.5MHz,1M



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2. PERFORMANCE

No Item

13 Adjacent Channel Leakage Ratio(ACLR)

14

Spurious Emissions

(*: additional requirement)

15 Transmit Intermodulation

16 Error Vector Magnitude (EVM)

17 Transmit OFF Power

Specification

33dB@5MHz, ACP>-50dBm

43dB@10MHz, ACP>-50dBm

-36dBm@f=9~150KHz, 1K BW

-36dBm@f=50KHz~30MHz, 10K BW

-36dBm@f=30MHz~1000MHz, 100K BW

-30dBm@f=1~12.5GHz, 1M BW

(*)-41dBm@f=1893.5~1919.6MHz, 300K

(*)-67dBm@f=925~935MHz, 100K BW

(*)-79dBm@f=935~960MHz, 100K BW

(*)-71dBm@f=1805~1880MHz, 100K BW

-31dBc@5MHz,Interferer -40dBc

-41dBc@10MHz, Interferer -40dBc

17.5%(>-20dBm)

(@12.2K, 1DPDCH+1DPCCH)

-15dB@SF=4.768Kbps, Multi-code transmission

3)Receiver - GSM Mode

No

1

2

Item

Sensitivity (TCH/FS Class II)

Co-Channel Rejection

(TCH/FS Class II, RBER, TU high/FH)

3 Adjacent Channel

Rejection

200kHz

400kHz

4

5

Intermodulation Rejection

Blocking Response

(TCH/FS Class II, RBER)

GSM

-105dBm

C/Ic=7dB

DCS & PCS

-105dBm

Storage -30 ~ +85

C/Ia1=-12dB

C/Ia2=-44dB

Wanted Signal :-98dBm 1st interferer:-44dBm 2nd

C/Ia1=-12dB

C/Ia2=-44dB

Wanted Signal :-96dBm 1st interferer:-44dBm 2nd interferer:-45dBm

Wanted Signal :-101dBm interferer:-44dBm

Wanted Signal :-101dBm

Unwanted : Depend on Frequency Unwanted : Depend on Frequency


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2. PERFORMANCE

4) Receiver - WCDMA Mode

No Item

1 Reference Sensitivity Level

2 Maximum Input Level

3 Adjacent Channel Selectivity (ACS)

4

5

6

7

8

In-band Blocking

Out-band Blocking

Spurious Response

Intermodulation Characteristic

Spurious Emissions



- 13 -

Specification

-106.7 dBm(3.84 MHz)

-25dBm(3.84MHz)

-44dBm/3.84MHz(DPCH_Ec)

UE@+20dBm output power(Class3)

33dB


-56dBm/3.84MHz@10MHz




-44dBm/3.84MHz@f=2050~2095 and

2185~2230MHz


-30dBm/3.84MHz@f=2025~2050 and

2230~2255MHz


-15dBm/3.84MHz@f=1~2025 and

2255~12500MHz


-44dBm CW


-46dBm CW@10MHz



-57dBm@f=9KHz~1GHz, 100K BW

-47dBm@f=1~12.5GHz, 1M BW

-60dBm@f=1920MHz~1980MHz, 3.84M BW

-60dBm@f=2110MHz~2170MHz, 3.84M BW


2. PERFORMANCE

2.4 Current Consumption

1) KS20 Current Consumption

WCDMA

GSM

Stand by

Under 4.00 mA

(DRX=1.28)

Under 3.00 mA

Paging=9 period

Voice Call

Under 600 mA

(Tx=23dBm)

Under 350 mA

(PCL=5)

VT

Under 800mA

(Tx=23dBm)

(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test

Condition : Speaker off, LCD backlight On)

2) KS20 Current Consumption

WCDMA

GSM

Stand by

Under 2.5 mA

(DRX=2.56)

Under 2.7 mA

Paging=5 period

Voice Call

Under 330 mA

(Tx=10dBm)

Under 270 mA

(PCL=7)

VT

Under 500mA

(Tx=10dBm)

(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test

Condition : Speaker off, LCD backlight On)

2.5 RSSI BAR

Level Change

BAR 4

→ 3

BAR 3

→ 2

BAR 2

→ 1

BAR 1

→ 0

WCDMA

-82

± 2 dBm

-92

± 2 dBm

-102

± 2 dBm

-112

± 2 dBm

GSM

-91

± 2 dBm

-96

± 2 dBm

-101

± 2 dBm

-106

± 2 dBm


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2.6 Battery BAR

Indication

Bar 4

Bar 4

→ 3

Bar 3

→ 2

Bar 2

→ 1

Bar 1

→ Empty

Low Voltage,

Warning message+ Blinking

Power Off

2. PERFORMANCE

Standby

100% ~ 76%

75%

50%

25%

5%

10%

5%

3.20 ± 0.05V / 0%



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2. PERFORMANCE

7

8

9

10

11

12

2

3

4

5

6

2.7 Sound Pressure Level

No

1

Test Item

Sending Loudness Rating (SLR)

Receiving Loudness Rating (RLR)

Side Tone Masking Rating (STMR)

Echo Loss (EL)

Idle Noise-Sending (INS)

Idle Noise-Receiving (INR)

Sending Loudness Rating (SLR)

Receiving Loudness Rating (RLR)

Side Tone Masking Rating (STMR)

Echo Loss (EL)

Idle Noise-Sending (INS)

Idle Noise-Receiving (INR)

TDMA Noise

-. GSM : Power Level : 5

DCS/PCS : Power Level : 0

(Cell Power : -90 ~ -105 dBm)

13

MS and

Headset

Max

-. Acoustic (Max Vol.)

MS/Headset SLR : 8 ± 3dB

MS/Headset RLR : -15 ± 3dB/-12dB

(SLR/RLR : Mid-value setting)

2.8 Charging

• Charging Method : CC & CV (Constant Current and Constant Voltage)

• Maximum Charging Voltage : 4.2 V

• Maximum Charging Current : 900 mA

• Normal Battery Capacity : 1050 mAh

• Charging Time : Max 2.5 hours (except for trickle charging time)

• Full charging indication current (charging icon stop current) : 60 mA

• Cut-off voltage : 3.20 V

MS

Headset

Nor

Max

Min

Min

Max

Nor

Max

Nor

Max

Min

Min

Max

Nor

Max

Specification

8 ±3 dB

2 ± 3 dB

-13 dB

23 dB

46 dB

-64 dBm0p

Under -54 dBPA

8±3dB

-1 ±3 dB

-12 ±3 dB

25 dB

40 dB

-55 dBm0p

Under -45 dBPA

Under -40 dBPA

Under -62 dBm


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3. TECHNICAL BRIEF


3.1 General Description

The KS20 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based

GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne 1 Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.

[Fig 1.1] Block diagram of RF part

1 QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.



- 17 -



A generic, high-level functional block diagram of KS20 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module).

The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF techniques. The RFIC’s Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same inputs to the MSM IC.

For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The

RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PAs. The high- and low-band UMTS RF transmit signals emerge from the RTR6275 transceiver.

In the GSM receive path, the received RF signals are applied through their bandpass filters and downconverted directly to baseband in the RTR6275 transceiver IC.

These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for further signal processing.

The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency, is divided into phase and amplitude components to produce an open-loop Polar topology:

1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated signal, to a constant envelope phase signal at RF;

2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power amplifier from a DAC within the MSM

KS20 power supply voltages are managed and regulated by the PM7540 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.


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3.2 GSM Mode

3.2.1 GSM Receiver

The Dual-mode KS20’s receiver functions are split between the three RFICs as follows:

• GSM-900, DCS-1800, and PCS-1900 UMTS-2100 modes bot use the RTR6275 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits

(with only one mode active at a time). All receiver control functions are beginning with SBI 2 -controlled parameters.

RF Front end consists of antenna, antenna switch module(LSHS-M090U) which includes 3 RX saw filters(GSM900, DCS and PCS). The antenna switch module allows multiple operating bands and modes to share the same antenna. In KS20, a common antenna connects to one of six paths: 1)

UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800, PCS-1900

Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. GSM900, DCS, and PCS operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required.

GSM 850/GSM 900 TX

GSM 1800/GSM 1900 TX

GSM 850 RX

GSM 900 RX

GSM 1800 RX

GSM 1900 RX

WCDMA

ANT_SEL0

HIGH

HIGH

-

LOW

LOW

LOW

HIGH

ANT_SEL1

HIGH

LOW

-

LOW

LOW

LOW

LOW

ANT_SEL2

LOW

LOW

-

LOW

LOW

HIGH

HIGH

[Table 1.1] Antenna Switch Module Control logic

2 The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application

Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS

Software documentation for details.



- 19 -



The GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiver front-end circuits(filters and antenna switch module). GSM900, DCS, and PCS receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins

Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers this is accomplished in the switch module.

The GSM900, DCS, and PCS receive signals are routed to the RTR6275 through band selection filters and matching networks that transform single-ended 50-Ω sources to differential impedances optimized for gain and noise figure. The RTR input uses a differential configuration to improve second-order intermodulation and common mode rejection performance. The RTR6275 input stages include

MSMcontrolled gain adjustments that maximize receiver dynamic range.

The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM7200 IC for further processing (an interface shared with the RFR6275 UMTS receiver outputs


- 20 -




[Fig 1.2] RTR6275 RX feature



- 21 -



3.2.2 GSM Transmitter

The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matching inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applictions and PCB characteristics based on pass-band symmetry about the band center frequency, the suggested starting value is shown in Figure1.2.

300Ω

300Ω

18Ω

18Ω

300Ω

300Ω

[Fig 1.3] GSM Transmitter matching

The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This design guideline shows a tri-band GSM application.

Both high-band and low band outputs are followed by resistive pads to ensure that the load Presented to the outputs remains close to 50ohm. The low-band GSM. Tx path also includes a Tx-band SAW filter to remove noise-spurious components and noise that would be amplified by the PA and appear in the

GSM Rx band


- 22 -




3.3 UMTS Mode

3.3.1 Receiver

The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter. This second stage input is configured differentially to optimize second-order intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RFto-baseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with

GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 is downconverting GSM signals and on when the UMTS is operating.

3.3.2 Transmitter

The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device.

These analog input signals are amplified, filtered, and applied to the quadrature upconverter mixers.

The up-converter output is amplified by multiple variable gain stages that provide transmit AGC control.

The AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that simplifies the external matching network to a single series capacitor to achieve the desired 50-Ω interface.

The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the antenna through the switch module.

The transceiver LO synthesizer is contained within the RTR6275 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for multimode applications.

The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital logic generator.

UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals for nine different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal directly from baseband to RF.

This requires FLO to equal FRF, and the RTR6275 IC design achieves this without allowing FVCO to equal FRF.

The RTR6275 IC is able to support UMTS 2100/1900 and UMTS 850 mode transmitting. This design guideline shows only UMTS 2100 applications.



- 23 -



WCDMA_2100_TX

WCDMA_2100_RX

[Figure 1.4] RTR6275 IC functional block diagram


- 24 -




3.4 LO generation and distribution circuits

The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE and UMTS band upconverters and downconverters; with the help of these LO generation and distribution circuits, true zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RF to baseband and from baseband to RF.

Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the

RTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS

2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM 850,

GSM 900, GSM 1800, and GSM 1900. The second synthesizer (PLL2) provides the LO for the UMTS

2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked.

The RTR6275 IC integrates most of PLL loop filter components on-chip except two off-chip loop filter series capacitors, and significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6275 has the advantages of more flexible loop bandwidth control, fast lock time, and low-integrated phase error

3.5 Off-chip RF Components

3.5.1 WCDMA PAM (U503: ACPM-7381)

The UMTS PA output power is monitored by l power detector circuits(U500 : RTR6275).

This detector voltage can be used for transmitter calibration and monitor to meet RF system specification.

RX_WCDMA_2100

L520

1nH

C554

3p

C553

33p

FL503

1

2

RX

TX

PGND

ANT

ACMD-7602

SDMY0001301

4

3

C560

33p

U502

SCDY0003402

20dB

VPWR

C563

1.5p

33p

C561

C555

10u

(1608)

C556

220p

C557

100p

C564

NA

R518

51

SMPY0015501

11

ACPM-7381

PGND

10

9

8

VCC2

GND3

7

6

RFOUT

GND2

GND1

U503

VCC1

RFIN

VMODE1

VMODE0

VEN

4

5

1

2

3

C566

C565

100p

C558

33p

10nH

L523

L521

2.7nH

WCDMA_PA_R0

WCDMA_PA_ON

4 5

O1

G2

3

G3

IN

G1

2

1

FL504

EFCH1950TDF1

C559

33p

L522

L524

10nH

4.7nH

WCDMA_2100_TX_OUT

R519

75

R520

91

10dB

R521

91

PWR_DET

[Figure 1.5] WCDMA PAM, Duplexer, Coupler



- 25 -



3.5.2 VCTCXO (X500 : TG-5010LH (19.2M))

The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the

MSM7200 IC. The oscillator frequency is controlled by the MSM7200 IC.s TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line.

The PM7540 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the MSM TCXO_EN line . The PM7540 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is enabled before most other regulated outputs.

Any GSM mode power control circuits within the MSM7200 IC require a reference voltage for proper operation and sufficient accuracy. Connecting the PM7540 IC REF_OUT directly to the MSM6275 IC

GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 µF low frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both sides, plus ground above and below if routed on internal layers.

3.5.3 Front-End Module (FL500 : LSHS-M090UE)

switch module select the operating frequency and band. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. The active connection is MSM-selected by three control lines (GPIO[75],

GPIO[74], and GPIO[731]). These GPIOs are programmed to be ANT_SEL0, ANT_SEL1, and

ANT_SEL2) respectively.

GSM 850/GSM 900 TX


GSM 850 RX

GSM 900 RX

GSM 1800 RX

GSM 1900 RX

WCDMA

ANT_SEL0

HIGH

HIGH

-

LOW

LOW

LOW

HIGH

ANT_SEL1

HIGH

LOW

-

LOW

LOW

LOW

LOW

[Table 1.2] Front End Module control logic

ANT_SEL2

LOW

LOW

-

LOW

LOW

HIGH

HIGH


- 26 -




3.5.4 PMIC Functional Block Diagram (U304 : PM7540)

• Complete power management, housekeeping, and user interface functions for wireless devices (CDMA, non-CDMA handsets, and PDAs)

• Input power management

- Valid external supply attachment and removal detection

- Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources

- Supports lithium-ion main batteries

- Trickle, constant current, constant voltage, and pulsed charging of the main battery

- Supports coin cell backup battery (including charging)

- Battery voltage detectors with programmable thresholds

- VDD collapse protection

- Charger current regulation and real-time monitoring for over-current protection

- Charger transistor protection by power limit control

- Control drivers for two external pass transistors and one external battery MOSFET (MOSFET is optional)

- Voltage, current, and power control loops

- Automated recovery from sudden momentary power loss

• Output voltage regulation

- One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting USB-OTG

- Four buck (step-down), switched-mode power supplies for efficiently generating MSMC1, MSMC2,

MSME, and PA supply voltages

- Supports dynamic voltage scaling (DVS) for MSMC1, MSMC2, and PA outputs

- 18 low-dropout regulator circuits with programmable output voltages, implemented using three different current ratings: 300 mA (four), 150 mA (ten), and 50 mA (four). These can be used to power MSMA,

MSMP, MSME2, MMC, RFRX1, RFRX2, RFTX, TCXO, SYNT, RUIM1, RUIM2, USB, WLAN, MDDI,

CAM, BT, AUX1, and AUX2 circuits.

- One MIC bias regulator circuit

- All regulators can be individually enabled/disabled for power savings

- Low power mode available on most regulators

- All regulated outputs are derived from a common bandgap reference (close tracking)

• Integrated handset-level housekeeping functions reduces external parts count, size, and cost

- Analog multiplexer selects from five internal and up to 28 external inputs

- Multiplexer output's offset and gain are adjusted, increasing the effective ADC resolution

- Adjusted multiplexer output is buffered and routed to an MSM device ADC

- Dual oscillators: a 32.768 kHz off-chip crystal and an on-chip RC assure MSM device sleep clock

- Crystal oscillator detector and automated switch-over upon lost oscillation

- Real-time clock for tracking time and generating associated alarms

- On-chip adjustments minimize crystal oscillator frequency errors

- Control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal

- TCXO buffer control for optimal QPH/catnap timing

- Multistage over temperature protection (smart thermal control)

• Integrated handset-level user interfaces

- Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash, and general-purpose drivers



- 27 -



- Vibration motor driver programmable from 1.2 to 3.1 V in 100 mV increments

- Two-channel speaker driver with programmable gain, turn-on time, and muting; configurable inputs and outputs capable of stereo or mono operation (drives external 8-Ω speakers with volume controlled 500 mW, each channel)

- Video (TV) amplifier allows use as a camcorder or for slide presentations

• IC-level interfaces

- Configurable SBI (three-wire or single-wire) for efficient initialization, status, and control

- Supports MSM interrupt processing with an internal interrupt manager

- Many functions monitored and reported through real-time and interrupt status signals

- Dedicated circuits for controlled poweron sequencing, including the MSM device's reset signal

- Several events continuously monitored for triggering poweron/poweroff sequences

- Supports and orchestrates soft resets

- USB-OTG transceiver for full-speed (12 Mb/s) and low-speed (1.5 Mb/s) interfacing of the MSM device to computers as a USB peripheral, or connecting the MSM device to other peripherals

- Two sets of RUIM level translators enable MSM device interfacing with external modules

• 22 multipurpose pins that can be configured as digital or analog I/Os, bidirectional I/Os, or current sinks; default functions support the two sets of RUIM level translators, poweron circuits, analog multiplexer inputs, an LED driver, and a selectable reference voltage output.

• Highly integrated functionality in a small package - 137-pin CSP with a several center ground pins for electrical ground, mechanical stability, and thermal relief


[Figure 1.6] MSM7200 Interface

- 28 -




[Figure1.7] PM7540 Block Diagram



- 29 -



3.5.5. GSM PAM (U501:TQM7M5003)

The TQM7M5003 is an extremely small (7 x 7 mm), GSM/EDGE PAM for handset applications. This module has been optimized for excellent EDGE efficiency and Pout in a

Polar Loop environment at EDGE class E2+ operation while maintaining high GSM/GPRS efficiency.

The small size and high performance is achieved with high-reliability 3 rd generation InGaP HBT technology. With 50Ω and output, no external matching or bias components are required. The module incorporates two highly-integrated InGaP power amplifier die with a CMOS controller. Each amplifier has three gain stages with on-die inter-stage matching implemented with a high Q passives technology for optimal performance. The CMOS controller implements a fully integrated power control within the module for GSM operations, and serves as the AM/AM path in EDGE operations. This eliminates the need for any external couplers, power detectors, current sensing etc., to assure the output power level.

The module has Tx enable and band select inputs. Module construction is a low-profile overmolded landgrid array on laminate.

VBAT

C533

100p

GSM_PA_BAND

LOW

HIGH

MODE

GSM

DCS/PCS

C538

68p

R510

2.2K

(1608)

C534

22u

GSM_PA_RAMP

GSM_PA_BAND

GSM_PA_EN

C539

4.7p

L512

2.2nH

C540

33p

C541

15p

L514

12nH

L513

6.8nH

14

GND6

TQM7M5008

DCS_PCS_IN

1

13

GND5

12

VCC

11

GND4

10

GND3

9

GSM_OUT

8

GND2

U501

TQM7M5008

BS

2

TX_EN

3

VBATT

4

5

GND1

VRAMP

6

GSM_IN

7

FL501

EFCH897MTDB1

SFSY0030201

O1

G2

4 5

G3

G1

IN

1

3 2

R511

R512

300

18

3 dB

R513

300

R514

R515

300

18

3 dB

R516

300

DCS_PCS_TX

GSM_TX

[Figure 1. 8] GSM PAM Schematic


- 30 -




3.5.6 UMTS Duplexer(FL503:ACMD-7602)

A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include;

• Insertion loss . this component is also in the receive and transmit paths ; In the KS20 typical losses :

UMTS2100_ Tx = 1.28 dB, UMTS2100_ Rx = 1.46 dB

• Out-of-band rejection or attenuation . the duplexer provides input selectivity for the receiver, output filtering for the transmitter, and isolation between the two. Rejection levels for both paths are specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver performance:

• Rx-band isolation . the transmitter is specified for out-of-band noise falling into the Rx band. This noise leaks from the transmit path into the receive path, and must be limited to avoid degrading receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and

Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 46.7

dB.

• Tx-band isolation . the transmit channel power also leaks into the receiver. In this case, the leakage is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum duplexer Tx-band isolation value is about 51.7dB.

• Passband ripple . the loss of this fairly narrowband device is not flat across its passband. Passband ripple increases the receive or transmit insertion loss at specific frequencies, creating performance variations across the band.s channels, and should be controlled.

• Return loss . minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).

• Power handling . high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be used between the UMTS PA and duplexer to assure proper performance.



- 31 -



3.5.7 UMTS Rx RF filter (FL502 : EFCH2140TDE1)

• Frequency range : 2110 ~ 2170MHz

An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include:

• Out-of-band rejection or attenuation levels, usually specified to meet these conditions:

- Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency.

- Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage.

- Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.


[Table 1.3] WCDMA Rx SAW Filter Specification

- 32 -




3.5.8 Bluetooth (U403 : BCM2048SKUFBG)

The bluetooth components are an bluetooth module and Antenna. Figure1.5.12-1 shows the bluetooth system architecture in the KS20.

[Figure1.9] Bluetooth system architecture



- 33 -



3.5.9 WLAN (SWL-2700S)

The MSM7200 supports SDIO interface which can be used for WLAN baseband data communication with a WLAN module. Because WLAN module includes RF components, the RF parts for KS20 WLAN include only WLAN module and an antenna. Figure 1.10 shows KS20 WLAN system architecture.

[Figure1.10] WLAN system architecture


- 34 -




3.6 Digital Baseband(DBB/MSM7200)

3.6.1 General Description

A. Features(MSM7200)

• Support for multimode operation - WCDMA(UMTS),GSM/GPRS,EDGE, HSDPA

• The ARM1136-J microprocessor can operate at up to 400 MHz.

• The ARM926EJ-S microprocessor can operate up to 256 MHz.

• Internal 256 MBits stacked DDR memory.

• Java hardware acceleration for faster Java-based games and other applets.

• Supports low-power, low-frequency crystal to enable TCXO shutoff.

• Integrated USIM Controller for direct interface to USIM card

• Software-controlled power management feature

• Integrated Bluetooth 2.0 baseband processor for wireless connectivity to peripherals

• High-speed, serial mobile-display, digital interface that optimizes the interconnection cost between the MSM device and the LCD panel

• Receive chain diversity support for WCDMA, providing improved capacity and data throughput

• USB OTG core supports both slave and limited host functionality

• Integrated wideband stereo CODEC for digital audio applications

• Direct interface to digital camera module with video front end (VFE) image processing

• Vocoder support (GSM-HR, FR, EFR, AMR, W-AMR, and 4GV)

• Advanced 15 x 15 x 1.4 mm, 0.5 mm pitch, 543-pin lead-free CSP packaging technology

• HSDPA Features

- supports release 5, December 2004 standard for HSDPA

- HSDPA enables PS data speeds up to 7.2 Mbps on the downlink

• WCDMA Features

- supports release 99 June 2004 of the W-CDMA FDD standard

- PS data rates supporting 384kbps DL / 384kbps UL

- CS data rates supporting 64kbps DL / 64kbps UL

- AMR (all rates)



- 35 -



• GSM Features

- Voice features (FR,EFR,AMR,HR)

- Circuit-switched data features(9.6K,14.4K,Fax)

• GPRS Features

- Simple Class A operation

- Multi-slot class 12 data services

- CS schemes CS1,CS2,CS3,CS4

• EDGE Features

- EDGE E2 power class for 8PSK

- Simple Class A, multi-slot class 12

- Downlink/Uplink coding schemes (CS1-4, MCS1-9)

• Operation and Services

- LCD & Camera Interface

- USIM Interface

- Dual Memory Buses(EBI1-SDRAM & EBI2-NAND Flash)

- External Memory Interface (Micro SD)

• Data Communication

- BlueTooth

- Slave USB


- 36 -




3.7 Hardware Architecture

BCM2048

WLAN

SWL-2700S

- Touch Controller

- Joy Stick

- Send, End, Hot, Power

- Vol. Up/Down

- Camera Shutter

Int. Mic.

T Flash

SIM Card

LOUT/

RCV

UART1

CAMERA

SDIO1

GPIO

EBI1/

EBI2

MDDI

MIC1

SDIO2

RF

UART2

UART3

SBI

USB1.1

Speaker

Receiver

VGA

2M AF

2.8î QVGA LCD

DDR 1G

NAND 2G

WCDMA/HSDPA RF Block

Battery

1050mAh

[Figure1.11] Simplified Block Diagram of System



- 37 -



3.7.1. Block Diagram(MSM7200)

SDRAM

1G

NAND Flash

2G

LCD

(2.8 inch)

Camera 0.3M

Camera 2M

Stereo

Headset

18 PIN

M M I

Mono

Speaker

MIC

CAMERA

PROCESSING

(Default 8bit

Interface)

GRAPHICS

Open GL ES

3D, 2D

VIDEO

MPEG-4

H.263, H.264

EBI 1 EBI 2

DUAL MEMORY BUS

MSM7200

ARM1136-J APPS

PLL

APPS QDSP 4

Modem QDSP4

ARM 926ejs

With Jazelle

CONNECTIVITY

AUDIO

MP3, AAC,

EVRC, QCELP

AMR, CMX, MIDI

MDDI

GSM/GPRS/EDGE processor

UMTS, WCDMA, processor

BT 1.2

processor

GPIO

RF SBI

Rx ADC

Tx DAC

4 Bit

PM7540

[Figure1.12] Simplified Block Diagram of MSM7200

USIM


- 38 -




3.8. Subsystem(MSM7200)

3.8.1. ARM Microprocessor Subsystem

The MSM7200 device uses an embedded ARM1136-J, ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, SDRAM, and NANDFlash devices.

Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6275 and PM7540 devices..

3.8.2. UMTS Subsystem

The UMTS Subsystem performs the digital UMTS signal processing. Its components include:

• Searcher engine

• Demodulating fingers

• Combining block

• Frame deinterleaver

• Viterbi decoder

• Up-link subsystem

• Turbo decoder

On the down-link channel the UMTS subsystem searches, demodulates, and decodes incoming

CPICH, CCPCH, SCH, and Traffic Channel information. It extracts packet data from the downlink traffic channel and prepares the packet data for processing. For the up-link, the WCDMA subsystem processes the packet data and modulates the up-link traffic channel (DCH).

3.8.3. GSM Subsystem

The GSM/GPRS/EGPRS subsystem reuses the MSM6280 GSM core. It performs the digital GSM signal processing and PA gain controls for GPRS support. The PA output level is controlled by an analog signal generated on the MSM. In GSM mode, the power profile ramps up before the burst and ramps down after the burst. In GPRS mode, at the beginning of each burst (up to four active transmit slots), PA must be smoothly ramped up to some desired output power level, held at that level for the current slot, smoothly ramped down/up during the transition period and held to the new level for the next slot until the last slot. Then it must be smoothly ramped down to near-zero level. The MSM6275 support differential GSM PA power control output. The RF interface communicates with the mobile station external RF circuits. Signals to these circuits control signal gain in the Rx and Tx signal path, control DC offset errors, and maintain the system frequency reference.

3.8.4. RF Interface

The RF interface communicates with the mobile station’s external RF and analog baseband circuits.

Signals to these circuits control signal gain in the Rx and Tx signal path and maintain The system’s frequency reference.



- 39 -



3.8.5. Serial Bus Interface(SBI)

The MSM7200 device’s SBI is designed specifically to be a quick, low pin count control protocol for

QUALCOMM’s RTR6275 and PM7540 ASICs. Using the SBI, the RTR6275 and PM7540 devices can be configured for different operating modes and for minimum power consumption, extending battery life in Standby mode. The SBI also controls DC baseband offset errors.

3.8.6. Wideband CODEC

The MSM7200 device integrates a wideband voice/audio CODEC into the mobile station modem

(MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface.

The CODEC integrates the microphone and earphone amplifiers into the MSM6280 device, reducing the external component count to just a few passive components.

The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set externally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems.

3.8.7. Vocoder Subsystem

The MSM7200 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal

Echo Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable,

13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM7200 device’s integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.

3.8.8. ARM Microprocessor subsystem

The MSM7200 device uses an embedded ARM1136-J, ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM device, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a generic serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6275 and PM7540 devices.


- 40 -




3.8.9. Mode Select and JTAG Interfaces

The mode pins to the MSM7200 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation,

ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM7200 device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture.

3.8.10. General-Purpose Input/Output Interface

The MSM7200 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional

RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.

3.8.11. UART

The MSM7200 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share multiplexed pins.

• UART1 for Bluetooth

• UART2 for USIM interface

• UART3 for data

3.8.12. USB

The MSM7200 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral communicating with the USB host.



- 41 -



3.9. Power Block

3.9.1. General

MSM7200, included RF, is fully covered by PM7540(Qualcomm PMIC). PM7540 cover the power of

MSM7200, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are :

PM7540(U304) : Phone power supply

MAX8645Y(U702) : LCD Backlight/Flash charge pump

3.9.2. PM7540

The PM7540 device (Figure) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference.

A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (undervoltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions.

MSM device controls and statuses the PM7540 IC using Single Serial Bus Interface (SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.


- 42 -




[Figure1.13] PM7540 Functional Block Diagram



- 43 -



3.9.3. Charging control

A programmable charging block in PM7540 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM7540 circuits monitor voltages at VCHARGER and

ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.

PM7540

Input Power

Management

100~76 (%) 75~51 (%)

50~26 (%) 25~6 (%)

KS20 Battery Bar Display(Stand By Condition)

5~0 (%)


- 44 -




Trickle Charging

Trickle Charging of the main battery, enabled through SBI control and powered from V

DD, is provided by the PM7540 IC, The trickle charger is on-chip programmable current source that supplies current from

V

DD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its performance specified below (3.2V). The charging current is set to 80mA.

Parameter

Trickle Current

Min

60

Typ

80

Max

100

Unit

mA

PM7540

Input Power

Managemen t



- 45 -



Constant Current Charging

The PM7540 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.

Constant Voltage Charging

Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.

The end of constant voltage charging is commonly detected 10% of the full charging current.

• Charging Method : CC & CV (Constant Current & Constant Voltage)

¶U Maximum Charging Voltage : 4.2V

¶U Maximum Charging Current : 900mA

¶U Nominal Battery Capacity : 1050mAh

¶U Charging time : Max 2.5h (Except time trickle charging)

¶U Full charge indication current (icon stop current) : 60mA

¶U Cut-off voltage : 3.20V


- 46 -




3.10. External memory interface

A. MSM7200

The MSM7200 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting DDR synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SRAM, NOR flash etc. To support the highbandwidth, high-density, and low-latency requirements of the advanced on-chip applications, the

MSM7200 IC has two high-speed, high-performance memory slave interfaces: the external bus interface 1 (EBI1) and the stack memory interface (SMI). To achieve higher bandwidth and better use of the memory device interface, the SMI accepts multiple commands for the external memory device.

The SMI interface acts as a slave device to all of the bus masters within the MSM device. The masters arbitrate to gain access to the SMI, and upon obtaining the access, they issue commands to the SMI.

The bus masters are connected to the SMI through an advanced extensible interface (AXI) bus bridge

(or global interconnect block) and communicate over a 64-bit, non-blocking AXI bus protocol. The AXI bus bridge provides the arbitration logic for all of the bus masters.

• EBI1 Features

- Support for only low-power memories at 1.8-V I/O power supply voltage

- AXI bus frequencies up to 133 MHz

- A 16-bit/32-bit static and dynamic memory interface

• DDR SDRAM interface features include:

- Supports both 32-bit DDR SDRAM devices, up to 133-MHz bus speed

- Supports auto precharge and manual precharge

- Supports partial refresh

- Separate CKE pin per chip-select to support partial operation mode

- Idle powerdown to save idling power consumption

• EBI2 Features

- Support for asynchronous FLASH and SRAM(16bit & 8bit).

- Interface support for byte addressable 16bit devices(UB_N & LB_N signals).

- 2Mbytes of memory per chip select.

- Support for 8 bit/16bit wide NAND flash.

- Support for parallel LCD interfaces, port mapped of memory mapped(8 or 16 bit)

• Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package

• 2Gb NAND(8bit) flash memory + 1Gb DDR SDRAM (32bit)

Device

NAND

SDRAM

Part Name

KAL009001M-D1YY

Interface Spec

Maker

SS

SS

Read Access Time

45 ns

7.5 ns

[Table 1.4] External memory interface for KS20

Write Access Time

200 us

7.5 ns



- 47 -



DDR

SDRAM

1Gb

(128MB)

EBI1

ADDRESS[15:0]

DATA[31:0]

WE*

CS*

CAS*

RAS*

CLK_EN

CLK[0:1]

DQM[3:0]

DQS[3:0]

EBI2

MSM7200

NAND_CS*

NAND_RE*

NAND_WE*

NAND_CLE

NAND_WP*

NAND_ALE

NAND_READY

DATA[7:0]

NAND

2Gb

(256MB)

[Figure1.14] Simplified Block Diagram of Memory Interface


- 48 -




3.11. H/W Sub System

3.11.1. RF Interface

A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)

MSM7200 controls RF part(RTR6275) using these signals.

• SSBDT : SSBI I/F signals for control Sub-chipset

• TX_ON : Power AMP on RF part

• RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF

• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier

• DAC_REF : Reference input to the MSM Tx data DACs

[Figure1.15] Block Diagram of RF Interface



- 49 -



B. the others

• TRK_LO_ADJ : TCXO(19.2M) Control

• PA_ON0/PA_RANGE0 : WCDMA(2100) TX Power Amp Enable

• ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)

• GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp

• GSM_PA_RAMP : Power Amp Gain Control of APC_IC

• GSM_PA_EN : Power Amp Gain Control Enable of APC_IC


- 50 -




3.11.2. MSM Sub System

3.11.2.1. USIM Interface

SIM interface scheme is shown in Figure.

And, there control signals are followed

• USIM_CLK : USIM Clock

• USIM_Reset : USIM Reset

• USIM_Data : USIM Data T/Rx

MSM7200

USIM CLK

USIM Reset

USIM Data

PM7540

VREG_UIM 2.85V

USIM CLK

USIM Reset

USIM Data

USIM

[Figure1.16] SIM Interface

3.11.2.2. UART Interface

UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.

GPIO_Map

GPIO_86

GPIO_87

Name

UART3_RX

UART3_TX

Note

Data_Rx

Data_Tx

[Table 1.5] UART Interface



- 51 -



3.11.2.3. USB

The MSM7200 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the

MSM7200 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0.

The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the MSM7200.

Name

MSM_USB1_VM

MSM_USB1_VP nUSB_OE1

VUSB_5.0V

CRADLE_USB_DP

CRADLE_USB_DN

Note

Data to/from MSM

Data to/from MSM

Out-Put Enable of Transceiver

USB_Power From Host(PC)

USB Data+ to Host

USB Data- to Host

[Table 1.6] USB Signal Interface

MSM7200 nUSB_OE1

MSM_USB1_VM

MSM_USB1_VP

PM7540

VUSB_5.0V

CRADLE_USB_DP

CRADLE_USB_DN

MMI

Conn.

(18p)

[Figure1.17] USB block(MSM7200 Side & PM7540 Side)


- 52 -




3.11.3. Key Pad

There are 13 main key buttons that are controlled by MSM7200. Refer to the Keypad circuit. ‘Power

Button’ Key is connected to PMIC(PM7540:GPIO83).

[Table 1.7] Key Matrix Mapping Table

Power Button

KB105

KPDPWR_ON

[Figure1.18] Power Button Keypad circuit



- 53 -




KPD_COLUMN1

Button

Volume Up

KB100

KPD_ROW1

Volume Down

KB101

KPD_ROW2

Function Key

KB102

KPD_ROW3

D111

PRSB6.8C

SEND

KB104

D112

PRSB6.8C

KPD_ROW4

[Figure1.19] Main Keypad Circuit

Camera Button

KPD_COLUMN2

KPD_ROW1

KPD_ROW2

4 1

3 2

SW100

LS50D23

ESCY0004201

[Figure1.20] Camera Keypad Circuit

- 54 -




KPD_COLUMN0

END Button

KB103

KPD_COLUMN2

KPD_ROW0

D110

PRSB6.8C

[Figure1.21] END Keypad Circuit

5-Way Key

C

COM1

D

A

E

B

SW102

EVQQ7GA50

ESCY0004001

[Figure1.22] 5-Way Keypad Circuit

KPD_ROW0

KPD_ROW1

KPD_ROW2

KPD_ROW3

KPD_ROW4



- 55 -



3.11.4. Touch Interface

In KS20, 4-wire touch screen panel is used for user input method. Two resistive layers make up a 4wire touch screen panel and are separated by insulating dots. The inside surface of each layer is coated with a transparent metal oxide coating that generates a gradient across each layer when voltage is applied.

[Table 1.8] MSM7200 Touch screen connections

[Table 1.9] Recommeded operation conditions

TOUCH SCREEN CONNECTOR

CN101

G2

4

3

2

1

6

5

G1

ENQY0008602

04-6298-006-000-883

TOUCH_Y2YU

TOUCH_X2XL

TOUCH_Y1YD

TOUCH_X1XR


[Figure1.23] Touch screen circuit

- 56 -




3.11.5. Camera Interface

KS20 Installed a 2M Pixel with auto focus and 0.3M Pixel Camera.

The CAM-FPCB with 34pin Board to Board connector (AXK7L34227G) is connected to MSM7200. Its interface is dedicated camera interface port in MSM7200. The following figure is KS20 camera block diagram.

MSM7200

CAMERA I/F:

CIF_DATA[7:0]

CIF_LV

CIF_FV

CIF_PCLK

CIF_MCLK

CIF_RESET#

CAM_I2C_SCL

CAM_I2C_SDA

CAM_2M_PWDN

CAM_VGA_PWDN

8

GPIO I/F:

CAM_PWR_ON

FLASH_PWR_ON

CAM_PWR_ON

FLASH_PWR_ON

2M CAM

CAM_DATA[7:0]

CAM_HSYNC

CAM_VSYNC

CAM_PCLK

CAM_MCLK

CAM_RST#

CAM_I2C_SCL

CAM_I2C_SDA

CAM_2M_PWDN

VGA CAM

CAM_DATA[7:0]

CAM_HSYNC

CAM_VSYNC

CAM_PCLK

CAM_MCLK

CAM_RST#

CAM_I2C_SCL

CAM_I2C_SDA

CAM_VGA_PWDN

CAMERA

POWER

DVDD

IOVDD

LVDD

AVDD

CAM_PWR_ON

CAMERA

POWER

VDD

CAM_PWR_ON

FLASH LED

FLASH_PWR_ON

ENF

MAX8631

[Table 1.10] Interface between 2M/VGA Camera Module and MSM7200



- 57 -



The following figures show the flow of camera I/F signals between MSM7200 and camera modules.

The CAM-FPCB with 34pin Board to Board connector (AXK7L34227G) is connected to MSM7200. Its interface is dedicated camera interface port in MSM7200.

CAM_PCLK nCAM_RST

I2C_SDA

I2C_SCL

VCAM2_2.6V

VCAM3_2.6V

CAM_2M_PWDN

2M CAM CONNECTOR (T=0.9. SOCKET)

13

14

15

16

17

9

10

11

12

5

6

7

8

3

4

1

2

CN102

G1 G2

29

28

27

26

25

24

23

22

34

33

32

31

30

21

20

19

18

G3 G4

ENBY0015601

AXK7L34227G

CAM_DATA7

CAM_DATA6

CAM_DATA5

CAM_DATA4

CAM_DATA3

CAM_DATA2

CAM_DATA1

CAM_DATA0

CAM_MCLK

CAM_VSYNC

CAM_HSYNC

VCAM_1.8V

VCAM1_2.6V

CAM_VGA_PWDN

CAM_MCLK

CAM_PCLK

CAM_DATA0

CAM_DATA1

CAM_DATA2

CAM_DATA3

CAM_DATA4

CAM_DATA5

VGA CAM CONNECTOR

1

8

9

10

4

5

2

3

6

7

CN101

20

19

18

17

16

15

14

13

12

11

ENBY0039601

GB042-20S-H10-E3000 nCAM_RST

I2C_SCL

I2C_SDA

CAM_HSYNC

CAM_VSYNC

CAM_DATA7

CAM_DATA6

VCAM3_2.6V

VCAM1_2.6V

VCAM2_2.6V

VCAM3_2.6V

CAM_PCLK nCAM_RST

CAM_2M_PWDN

CAM_VGA_PWDN

I2C_SDA

I2C_SCL

FPCB to SUB Connector

11

12

13

14

15

16

17

1

2

8

9

10

3

4

5

6

7

CN103

G1

G2

30

29

28

27

26

25

34

33

32

31

24

23

22

21

20

19

18

CAM_DATA7

CAM_DATA6

CAM_DATA5

CAM_DATA4

CAM_DATA3

CAM_DATA2

CAM_DATA1

CAM_DATA0

CAM_MCLK

CAM_VSYNC

CAM_HSYNC

VCAM_1.8V

VCAM1_2.6V

[Figure1.24] Camera FPCB circuit


- 58 -




CAM_PCLK nCAM_RST

CAM_2M_PWDN

CAM_VGA_PWDN

I2C_SDA

I2C_SCL

C725

NA

C726

NA

VCAM_2.6V

SUB TO FPCB_CAM CONNECTOR (T=0.9. SOCKET)

VCAM_2.6V

FL600

3

4

1

2

INOUT_A1

INOUT_A2

INOUT_A4

ICVE21184E150R500FR

INOUT_B1

INOUT_B2

7

INOUT_B3

6

INOUT_B4

9

8

VCAM_2.6V

FB601

FB602

R603 0

9

10

11

12

13

14

15

16

17

1

2

3

6

7

4

5

8

CN601

G1 G2

34

33

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

G3 G4

ENBY0015601

AXK7L34227G

FL602

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

ICVE21184E150R500FR

INOUT_B1

INOUT_B2

9

8

7

INOUT_B3

INOUT_B4

6

CAM_DATA7

CAM_DATA6

CAM_DATA5

CAM_DATA4

FL603

1

2

INOUT_A2

3

INOUT_A1

INOUT_A3

4

INOUT_A4

ICVE21184E150R500FR

INOUT_B1

INOUT_B2

INOUT_B3

7

6

9

8

INOUT_B4

CAM_DATA3

CAM_DATA2

CAM_DATA1

CAM_DATA0

R621 0

FL604

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

ICVE21184E150R500FR

9

INOUT_B1

8

INOUT_B2

7 TP600

INOUT_B3

6 TP601

INOUT_B4

CAM_MCLK

CAM_VSYNC

CAM_HSYNC

BL_PWR_ON

FLASH_PWR_ON

CAM_PWR_ON

LCD BL/FLASH LED/CAMERA LDOs

VPWR

C715

10u

R720

DNI

1

2

U702

PIN

IN

MAX8631XETI

C1P

23

3

24

29

GND

PGND

BGND

C1N

C2P

22

26

C2N

OUT

27

25

20

19

21

18

28

17

8

ENM1

ENM2

ENF

ENLDO

P1

P2

SETM

7

SETF

6

REFBP

C720

EUSY0263101

0.01u

LDO1

LDO2

M1

M2

M3

M4

F1

F2

F3

F4

16

15

14

13

12

11

10

9

4

5

C714

1u

C716

1u

C721

2.2u

C722

2.2u

C717

10u

VOUT

BLED1

BLED2

BLED3

BLED4

FLED

VCAM_2.6V

VCAM_1.8V

[Figure1.25] Camera module I/F and Camera LDO circuit



- 59 -



The 2 MEGA Camera module is connected to CAM-FPCB with 34pin Board to Board connector

(AXK7L34227G). Its interface is dedicated camera interface port in MSM7200. The camera port supply 24.576MHz master clock to camera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM7200.

13

14

15

16

17

18

19

20

21

8

9

10

11

12

No

1

2

5

6

3

4

7

26

27

28

29

30

31

32

33

34

22

23

24

25

Name

GND

CAM_PCLK

GND

GND

M_CAM_RESET_N

GND

NC

I2C_SDA

I2C_SCL

NC

NC

GND

M_CAM_PWDN

2M_CAM_LVDD_2.6V

2M_CAM_LVDD_2.6V

2M_CAM_AVDD_2.6V

2M_CAM_AVDD_2.6V

HSYNC

VSYNC

GND

CLKIN

GND

CAM_DATA(0)

CAM_DATA(1)

CAM_DATA(2)

CAM_DATA(3)

CAM_DATA(4)

CAM_DATA(5)

CAM_DATA(6)

CAM_DATA(7)

2M_CAM_CVDD_1.8V

2M_CAM_CVDD_1.8V

2M_CAM_AVDD_2.6V

2M_CAM_AVDD_2.6V

Port

I

GND

GND

GND

I

GND

O

O

Note

GND

Master Clock(45.152M)

GND

GND

Camera reset signal

GND

I2C Data

I2C Clock

GND

I

I

I

I

I

O

O

GND

I

O

O

O

O

O

O

O

O

O

GND

O

O

O

GND

Data

Data

Data

Data

Data

Data

Data

Data

CVDD1

CVDD2

AVDD1

AVDD2

GND

Camera power down

LVDD1

LVDD2

AVDD1

AVDD2

Horizontal Synch

Vertical Synch

GND

Master Clock(24.576M)

[Table 1.11] Interface of 2 MEGA AF Camera Module


- 60 -




The VGA Camera module is connected to LCD FPCB with 20pin Board to Board connector. Its interface is dedicated camera interface port in MSM7200. The camera port supply 24.576MHz

master clock to camera module and receive 12.288MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM7200.

9

10

11

12

7

8

5

6

13

14

15

16

17

18

19

20

No

1

2

3

4

Name

CAM_PWDN

CAM_MCLK

GND

CAM_PCLK

CAM_DATA(0)

CAM_DATA(1)

CAM_DATA(2)

CAM_DATA(3)

CAM_DATA(4)

CAM_DATA(5)

CAM_DATA(6)

CAM_DATA(7)

CAM_VSYNC

CAM_HSYNC

GND

I2C_SCD

I2C_SCL

CAM_RESET_N

VREG_MSMP_2.6V

VREG_CAM_2.6V

I

I

I

I

O

O

O

O

O

O

O

O

O

O

I

GND

Port i

I

GND

O

Note

Camera power down

Master Clock(24M)

GND

Clock for Camera Data Out(12M)

Data

Data

Data

Data

Data

Data

Data

Data

Vertical Synch

Horizontal Sync

GND

I2C Clock

I2C Clock

Camera reset signal

Camera I/O Power

Camera I/O Power

[Table 1.12] Interface of VGA Camera Module



- 61 -



3.11.6. LED(KEY/Indicator) Light

There are 4 White LEDs in Main key backlight circuit, which are driven by KPD_DR_N line from

PM7540.

VPWR

Power Keypad LED

100ohm R100

100ohm R101

100ohm R102

100ohm R103

LD101

SSC-TWH104-HLS

LD102

SSC-TWH104-HLS

LD103

SSC-TWH104-HLS

LD104

SSC-TWH104-HLS

KPD_DRV_N

D107

PRSB6.8C

[Figure1.26] Schematic of Power Keypad back light circuit

In addition, there is 1 RGB LED in LED Notification-RGB backlight circuit, which are driven by

KEBY_BACKLIGHT line from MSM7200 GPIO78/84/85.

LED Notification-RGB

VPWR

LEMC-S11G LD100

LEDCB1

LEDCR1

LEDCG1

BLUE

RED

GREEN

[Figure1.27] Schematic of KEY back light circuit


- 62 -




3.11.7. LCD Module Interface

- The LCD module is a Color TFT supplied by EPSON Imaging Devices.

This LCD Module has a 2.8 inch diagonally measured active display area with 240(RGB)X320 resolution. each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes.

* Features

- Display mode(Main LCD) : Normally Black, Transmissive VA mode 265K colors

- LCD Driver IC: S6D0165(SS)

- Driving Method : A-Si TFT Active Matrix

- 4 bit MDDI(Mobile Display Digital interface) I/F

MSM7200

MDDI I/F

MDDI_P_STB_P

MDDI_P_STB_M

MDDI_P_DATA_P

MDDI_P_DATA_M

GPIO

LCD_RESET

FLM(VSYNC)

LCD_PWR_ON

BL_PWR_ON

2.8 QVGA MDDI LCD

MDDI I/F

MDDI_STB+

MDDI_STB-

MDDI_DT+

MDDI_DT-

LCD

POWER

Vci(2.6)

VccIO(1.8)

RESET

FLM(VSYNC)

LCD

BLIGHT

LED(AN)

LED(CA)

LDO

LCD PWR

LCD_PWR_ON

Charge Pump

BL PWR

BL_PWR_ON

[Figure1.28] LCD Module Block Diagram



- 63 -



LCD Connector

27

26

25

23

22

21

20

19

18

17

24

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

CN702

04-6293-027-001-829

ENQY0014201

R706

0

VOUT

BLED1

BLED2

BLED3

BLED4

FLM

TP700

TP701

MDDI_P_STB_M

MDDI_P_STB_P

VLCD_1.8V

6

FXLP34L6X

VCC

5

NC

4

Y

U700

1

VCC1

A

2

3

GND

VLCD_2.6V

LCD_RESET

VLCD_2.6V

VLCD_1.8V

TP702

TP703

MDDI_P_DATA_M

MDDI_P_DATA_P

D707

PG05DBTFC

C710

2.2u

C711

0.01u

C712

2.2u

C713

0.01u

BL_PWR_ON

FLASH_PWR_ON

CAM_PWR_ON


VPWR

C715

10u

R720

DNI

1

2

U702

PIN

IN

MAX8631XETI

C1P

23

3

24

29

GND

PGND

BGND

C1N

C2P

22

26

C2N

OUT

20

19

21

18

28

17

8

ENM1

ENM2

ENF

ENLDO

P1

P2

SETM

7

SETF

6

REFBP

C720

EUSY0263101

0.01u

LDO1

LDO2

M1

M2

M3

M4

F1

F2

F3

F4

27

25

16

15

14

13

12

11

10

9

4

5

C714

1u

C716

1u

C721

2.2u

C722

2.2u

C717

10u

VOUT

BLED1

BLED2

BLED3

BLED4

FLED

VCAM_2.6V

VCAM_1.8V

[Figure1.29] Display/ LCD FPCB I/F and LCD BL circuit


- 64 -




3.11.8. Audio and Sound

3.11.8.1. Overview of Audio & Sound path

MSM7200

(U100-1)

Headset

AMP

(U402)

Head_Set

Analog switch

(U400)

Receiver and

Loud Speaker

SPK

AMP

(U401)

MIC

Head_set MIC

[Figure1.30] Audio Path Block Diagram



- 65 -



3.11.8.2. Audio Signal Processing & Interface

The MSM7200 device integrates a wideband audio CODEC into the mobile station modem. The wideband codec allows the MSM device to support stereo music/ringer Melody applications in addition to the 8 kHz voice band applications on the forward link. In the audio transmit path, the device operates as 13-bit linear converter with software selectable 8 kHz and 16 kHz sampling rate. In the audio receive path, the device operates as a software selectable 13-bit or 16-bit linear converter with software selectable 8 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz sampling rate.

Through software, the Rx path can be configured as either a mono or stereo output.

The integrated CODEC contains all of the required conversion and amplification stages for the audio front end. The CODEC operates as a 13-bit linear CODEC with the transmit (Tx) and receive (Rx) filters designed to meet ITU-T G.712 requirements. The CODEC includes a programmable sidetone path for summing a portion of the Tx audio into the Rx path. An on-chip Voltage/Current reference is provided to generate the precise voltages and currents required by the CODEC. The on-chip voltage reference also provides a microphone bias voltage required for electret condenser microphones typically used in handset applications. The MICBIAS output pin is designed to provide 1.8 Volts DC while delivering as much as 1 mA of current. Audio decoder summing and headset switch detection are included.

The CODEC interface includes the amplification stages for both the microphone and earphone. The interface supports two differential microphone inputs and a differential auxiliary input, each of which can be configured as single-ended if desired. In addition, the interface supports one differential earphone output, one single-ended earphone output, and one differential auxiliary output or two singleended line outputs. The CODEC is configured through the QDSP4000 command types and is not directly controlled by the microprocessor. The CODEC configuration command is sent to the

QDSP4000 and then the QDSP4000 executes the command and configures the CODEC. Data is exchanged between the codec interface and the QDSP4000 through its DMA interface. The

QDSP4000 uses the Ex_DMA_4 channel for reading data from the codec and uses the Ex_DMA_5 channel to transfer data to the codec. The CODEC interface is shown in more detail in Figure below.


[Figure1.31] Audio Interface Detailed Diagram(MSM7200)

- 66 -



MSM7200 BLK


MIC_Feedback

VDD_RX

WLNA_OUT

C543

22p

L516

1nH

WCDMA LNA Circuit

C547

33p

FL502

EFCH2140TDE1

L518

C550

0.75p

3.3nH

1

5

G2

IN

G1

4

O2

O1

2 3

C546

0.5p

L517

1nH

L519

1nH

WCDMA_MIX_IN_P

WCDMA_MIX_IN_M

Head Set Jack BLK

CN300

21

19

10

11

12

13

14

15

16

7

8

9

5

6

3

4

1

2

17

18

20

22

HSEJ-18S04-25

ENRY0006001

SD12T1G

D306

FM_ANT

6

5

4

D307

1

2

3

PLR0504F

FB300

FB301

0

0

R305

R306

HS_MIC

CVBS

HSL

HSR

USC2

USC1 nEAR_DET

REMOTE_PWR_ON

CRADLE_UART_TX

CRADLE_UART_RX

VBAT

VADP_5.0V

VUSB_5.0V



- 67 -



Handset main MIC BLK

CN100

1

2

OSF213-42DC

SUMY0010508

MIC Connector

INTERNAL_MIC_P

Audio Amp for loud Speaker

LINE_ON

LINE_OP nSPEAKER_SHDN

VPWR

C401

C402

Speaker Amp

R400

R401

47K

47K

1u

C400

0.1u R402

0.1u

R403

20K

20K

TP400

B1

U401 LM4898ITLX-NOPB

C3

VDD VO2

C1

IN-

A1

IN+

VO1

A3

BYPASS

A2

C2

SD_SEL SD_MODE

GND

B2

B3

C403 1u

AMP_OUT_P

AMP_OUT_N


MODEM_RCV_P

AMP_OUT_N

MODEM_RCV_N

AMP_OUT_P

VPWR

1

2

1B0

1B1

3

4

2B0

2B1

U400

FSA2267AL10X

1A

1S

9

8

2S

2A

7

6

SPKR_N nRECEIVER_SW

SPKR_P

- 68 -




3.11.8.3. Audio Mode

There are three audio modes (Voice call, speaker phone, MIDI/MP3).

MODE

Voice Call

Speaker phone

MIDI

MP3

Device

Receiver Mode

Loud Mode

Headset

Loud Mode

Loud Mode

Headset

Loud Mode

Headset

Description

Receiver Voice Call

Speaker Phone

Headset Voice Call

Speaker Phone

Speaker MIDI Bell

Headset MIDI Bell

Speaker MP3

Headset MP3

[Table 1.13] Audio Mode



- 69 -



Voice Call Receiver Mode Path

MSM7200

(U100-1)

Headset

AMP

(U402)

Head_Set

Analog switch

(U400)

Receiver and

Loud Speaker

AMP

(U401)

Voice

Voice + MP3 + MIDI

MIC

Head_set MIC

Voice Call Receiver Mode is routed as below

MSM7200 EAR1ON,EAR1OP -> Analog Switch( U400) -> Receiver


- 70 -




Voice Call Headset Mode Path & Head video Telephony Mode

Headset

AMP

(U402)

MSM7200

(U100-1)

Head_Set

Analog switch

(U400)

Receiver and

Loud Speaker

AMP

(U401)

MIC

Head_set MIC

Voice


Voice Call Headset Mode is routed as below

MSM7200 HPH_L, HPH_R -> 18Pin MMI -> Headset



- 71 -



Voice Call Speaker Phone Mode

MSM7200

(U100-1)

Headset

AMP

(U402)

Head_Set

Receiver and

Loud Speaker

Analog switch

(U400)

AMP

(U401)

Voice


MIC

Head_set MIC

Voice Call Speaker Phone Mode is routed as below

MSM7200 LINE_ON, LINE_OP -> AMP(U401) ->Analog Switch( U400 ) -> Loud speaker


- 72 -




MIDI Ring Tone/MP3 (Speaker)

MSM7200

(U100-1)

Headset

AMP

(U402)

Head_Set

Analog switch

(U400)

Receiver and

Loud Speaker

AMP

(U401)

Voice


MIC

Head_set MIC

MIDI Ring Tone/MP3 Mode is routed as below

MSM7200 HPH_L -> AMP(U401) -> Loud speaker



- 73 -



MIDI Ring Tone/MP3 (Headset)

MSM7200

(U100-1)

Headset

AMP

(U402)

Head_Set

Analog switch

(U400)

Receiver and

Loud Speaker

AMP

(U401)

Voice


MIC

Head_set MIC

MIDI Ring Tone/MP3 Headset Mode is routed as below

MSM7200 HPH_L, HPH_R -> 18PIn MMI ->Headset


- 74 -




Audio & Sound Main Component

There are 6 main components in CU320.

5

6

1

2

3

4

Component

MSM7200

Audio amp

Analog Switch

Receiver &

Load Speaker

MIC

MMI Conn

Design No.

Maker Part No.

U100

U401

U400

CN701

MSM7200

LM4898

FSA2267AL10X

EMS1810TPB1P

CN100

CN300

OSF213-42DC

HSEJ-18S04-25R

[Table 1.14] Audio main component list

Note

Base-Band Modem

Class-AB Audio Amp

1 Channel Analog SW

8 ohm receiver & Load

Speaker

-42 dB microphone

18Pin MMI Connector



- 75 -



3.12. Main Features

1. LG KS20 Main Features

- Bar Type Simple & Stylish design

- UMTS 2100 + GSM 900 + DCS 1800 + PCS 1900 based GSM/GPRS/EDGE/UMTS

- HSDPA 3.6Mbps

- 2.8” QVGA LCD (262K TFT)

- Touch Sensitive User Interface

- Dual Camera (2M Pixel w AF + VGA(0.3M Pixel))

- Stereo Headset & Speaker phone

- 72 Poly Sound

- MP3/AAC/AMR/MIDI/3GP/SMAF decoder and play

- MPEG4 encoder/decoder and play/save

- JPEG en/decoder

- Supports Bluetooth and USB

- Supports WLAN

- Internal User Memory over 128MB

- 1050 mAh (Li-Ion Polymer)

- Windows MobileTM 6 Professional

- Microsoft Office Mobile


- 76 -




2. KS20 Main Component

RF Bluetooth PMIC BB/MEM/Logic

Logic

Main board, Top Main board, Bottom

SD/SIM

Socket

CAM WLAN

Sub board, Top



- 77 -

Sub board, Bottom



KEY-FPCB/Folder Assy, Top

Folder Assy, Bottom

CAM-FPCB


- 78 -




RF

SW500

ANT501

FL500 FL503

U503

L504

U403

U500

FL502

X500 U501 FL501

Reference

U500

FL502

FL503

U503

FL504

U501

Description

RTR6275

UMTS2100 RX SAW filter

UMTS 2100 Duplexer

UMTS PA

UMTS 2100 TX SAW Filter

TX Dual PAM

Reference

FL500

SW500

X500

U403

FL501

Description

Switch

Test Connector

VCTCXO

Bluetooth RF Transceiver

UMTS2100 RX SAW filter



- 79 -



Logic / BB / MEM / Audio

LD400

U304

ANT400

U301

U303

U100

CN301 U201 U300

U302

Reference

LD400

U304

ANT400

U301

U303

U100

CN301

Description

Camera Flash

PMIC, PM7540

Bluetooth ANT.

Switch, UART

Switch, USB

MCU, MSM7200

Battery Connector

Reference

U201

U300

U302

CN300

U402

U400

U401

Description

Memory, MCP

Charging/Power Switch

Over-voltage Protection

MMI Connector(18p)

Audio, Headset Amp

Audio Sig. Switch

Audio, Speaker Amp

U401

U400

U402

CN300


- 80 -




Logic

CN700

CN601

CN701

CN600

U702

M600

CN702

CN602

BAT700

CN603

F1_CN101

F1_CN103

F1_CN102

CN100

CN101

Ref.

U702

U701

CN601

CN702

BAT700

F1_CN101

F1_CN103

CN101

ANT100

Description

LCD BL/Flash Driver / 2

LDO

Speaker Contact PAD

Sub board to CAM

FPCB connector .

LCD connector(27p)

Backup Battery

VGA connector(20p)

CAM FPCB to Sub board connector(34p)

Touch connector(6p)

WLAN Antenna

Ref.

CN600

CN700

CN602

M600

CN603

F1_CN102

SW101

CN100

Description

Sub Board to KEY

FPCB connector(27p)

Vibrator Connector

Sub board to Main

Board connector(90p)

WLAN

WLAN Cable connector

2M connector(34p)

WLAN Cable connector

MIC

SW101

ANT100



- 81 -


4. TROUBLE SHOOTING


4.1 RF Component

TOP SIDE


- 82 -



BOTTOM SIDE




- 83 -




- 84 -



4.2 SIGNAL PATH_UMTS RF


➞

Common Tx/Rx

➞

UMTS 2100 Tx/Rx

➞ UMTS 2100 Tx

➞

UMTS 2100 Rx

➞

Tx I/Q

➞

LO

➞

Rx I/Q



- 85 -



4.3 SIGNAL PATH_GSM RF


➞

Common Tx/Rx

➞

GSM900 Tx

➞ DCS/PCS Tx

➞

DCS Rx

➞

PCS Rx

➞

EGSM900 Rx

➞

Tx I/Q

➞

LO

➞

Rx I/Q

- 86 -




4.4 Checking VCTCXO Block

The reference frequency (19.2MHz) from X100 (TCXO) is used in UMTS TX part, GSM part and BB part.

TP1

RTR_TRK_LO_ADJ

TP2

TCXO Circuit

R517

100ohm

C551

0.01u

X500

1

VCONT VCC

2

GND

19.2MHz

OUT

4

3

EXSK0007802

TG-5010LH_19_2M_75A

VTCXO_2.85V

C542

1000p

C544

0.1uF

TP4

100p C548

1000p C552

TCXO_PM_19.2MHz

TCXO_RTR_19.2MHz

TP3

Schematic of the TCXO Block

TP4 TP2

TP3

Test Point of the TCXO Block

TP1



- 87 -



T

Check C355 of PMIC (U304)

Check R112 of MSM (U100)

T


- 88 -




4.5 Checking Front-End Module Block

ANT500 ANT501

R500

0

L500

3.9nH

C505

1.5p

C502

C506

NA

4.7p

SW500

ANT

G2

KMS-506

RF

G1

ENWY0002301

C503

L502

100nH

33p

ANT_SEL0

ANT_SEL1

ANT_SEL2

C514

33p

C515

33p

C516

33p

Rev.F

FL500

LSHS-M090UE

14

15

16

VC1

VC2

VC3

1

2

4

5

8

10

12

17

18

25

26

GND1

GND2

GND3

GND4

GND5

GND6

GND7

GND8

GND9

PGND1

PGND2

ANT

11

VDD

13

NC

7

DCS_PCS_TX

EGSM_TX

UMTS_TX_RX

DCS_RX2

DCS_RX1

PCS_RX2

PCS_RX1

EGSM_RX2

EGSM_RX1

3

6

9

19

20

21

22

23

24

SFAY0010001

Schematic of the Front-End Module Block

TP1

L501

15nH

C509

0.1u

VRF_SMPS

ANT_SEL0

ANT_SEL1

ANT_SEL2

TP1

Test Point of the Front-End Module Block



- 89 -



Logic Table of the FEM

GSM 850/GSM 900 TX


GSM 850 RX

GSM 900 RX

GSM 1800 RX

GSM 1900 RX

WCDMA

ANT_SEL0

HIGH

HIGH

-

LOW

LOW

LOW

HIGH

ANT_SEL1

HIGH

LOW

-

LOW

LOW

LOW

LOW

ANT_SEL2

LOW

LOW

-

LOW

LOW

HIGH

HIGH

Check VCC

TP1 VRF_SMPS


- 90 -



4.6 Checking UMTS Block

4.6.1 Checking Tx level


ANT500 ANT501

R500

0

L500

3.9nH

C505

1.5p

C502

C506

NA

4.7p

SW500

ANT

G2

KMS-506

RF

G1

ENWY0002301

TP1

MA

C554

3p

C553

33p

L515

2.7nH

C545

0.5p

C549

33p

TP2

VDD_RX

WLNA_OUT

C543

22p

L516

1nH

WCDMA LNA Circuit

C547

33p

FL502

EFCH2140TDE1

L518

C550

0.75p

3.3nH

5

G2

4

O2

1

IN

G1 O1

2 3

C546

0.5p

L517

1nH

L519

1nH

FL503

1

2

RX

TX

PGND

ANT

ACMD-7602

SDMY0001301

4

3

TP3

C560

33p

U502

SCDY0003402

20dB

VPWR

C563

1.5p

33p

C561

C555

10u

(1608)

C556

220p

C557

100p

C564

NA

TP4

SMPY0015501

11

10

9

8

7

6

ACPM-7381

PGND

VCC2

GND3

RFOUT

GND2

GND1

U503

VCC1

RFIN

VMODE1

VMODE0

VEN

1

2

3

4

5

C566

C565

100p

C558

33p

10nH

L523

L521

2.7nH

4

O1 G

G2 G

3

WCDMA_PA_R0

WCDMA_PA_ON

FL5

EFCH

R518

51

R519

75

R520

91

10dB

R521

91

PWR_DET

For testing, Max power of UMT 2100 is needed.



- 91 -



Run a FTM program set RF mode to IMT set uplink freq. To

9750 click Tx on and

WCDMA set PA range

R1 on set Tx AGC to

410

Check Tx SAW

Filter

Check PAM block

Check coupler U103

U502

Check Duplexer

FL104

FL503


- 92 -



4.6.2 Checking UMTS PAM Control Block

• PAM control signal

1. PWR_DET : UMTS Tx Power Detected value (Check R519)

2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control

3. +VPWR: UMTS PAM Main Voltage (3V < +VPWR < 4.2V)

4. PA_ON : Turns the PA on and off

5. PA_R0 : Control signals that step the active PA mode and bias




- 93 -



4.6.3 Checking RF Rx Level

ANT500 ANT501

R500

0

L500

3.9nH

C505

1.5p

C502

C506

NA

4.7p

SW500

ANT

G2

G1

KMS-506

RF

ENWY0002301

TP1

WCDMA

TP3

RX_WCDMA_2100

L520

1nH

C554

3p

C553

33p

L515

2.7nH

C545

0.5p

C549

33p

FL503

1

2

RX

TX

PGND

ANT

ACMD-7602

SDMY0001301

4

3

TP2

VDD_RX

WLNA_OUT

C543

22p

L516

1nH

Vbias

WCDMA LNA Circuit

C547

33p

FL502

EFCH2140TDE1

L518

C550

0.75p

3.3nH

5

G2

4

O2

1

IN

G1 O1

2 3

C546

0.5p

C560

33p

U502

SCDY0003402

20dB

VPWR

C563

1.5p

33p

C561

C555

10u

(1608)

C556

220p

C557

100p

C564

NA

TP4

SMPY0015501

11

ACPM-7381

10

9

PGND

VCC2

GND3

8

7

6

RFOUT

GND2

GND1

U503

VCC1

RFIN

VMODE1

VMODE0

VEN

1

2

3

4

5

C566

C565

100p

C558

33p

10nH

L523

L521

2.7nH

WCDMA_PA_R

WCDMA_PA_O

R518

51

R520

91

R519

75

R521

91

PWR_DET


- 94 -




Check Vbias over 2V?

Check TP2

Signal exist?

Check TP3

Signal exist?

Check TP4

Signal exist?

Check the RF S/W

Check FEM

Check the Duplexer

Check the RTR6275



- 95 -



4.7 Checking GSM Block


- 96 -



4.7.1 Checking RF Tx level


4.7.2 Schematic of RF Tx level

ANT500 ANT501

R500

0

TP1

L500

3.9nH

C505

1.5p

C502

C506

NA

4.7p

SW500

G2

ANT

G1

KMS-506

RF

ENWY0002301

ANT_SEL0

ANT_SEL1

ANT_SEL2

C514

33p

C515

33p

C516

33p

C503

33p

L502

100nH

Rev.F

FL500

LSHS-M090UE

14

15

16

VC1

VC2

VC3

1

2

4

5

8

10

12

17

18

GND1

GND2

GND3

GND4

25

26

GND5

GND6

GND7

GND8

GND9

PGND1

PGND2

ANT

11

VDD

13

NC

7

DCS_PCS_TX

EGSM_TX

UMTS_TX_RX

DCS_RX2

DCS_RX1

PCS_RX2

PCS_RX1

EGSM_RX2

EGSM_RX1

3

6

9

19

20

21

22

23

24

SFAY0010001

ANTENNA SWITCH MODULE LOGIC

GSM 850/GSM 900 TX


GSM 850 RX

GSM 900 RX

GSM 1800 RX

GSM 1900 RX

WCDMA

ANT_SEL0 ANT_SEL1 ANT_SEL2

HIGH

HIGH

HIGH

LOW

LOW

LOW

-

LOW

LOW

LOW

HIGH

-

LOW

LOW

LOW

LOW

-

LOW

LOW

HIGH

HIGH

TP2

L501

15nH

C509

0.1u

VRF_SMPS

TP3

VBAT

DCS(1805-1880 MHz)

PCS(1930-1990 MHz)

GSM(925-960 MHz)

GSM_PA_BAND

LOW

HIGH

MODE

GSM

DCS/PCS

C533

100p

(1608)

C534

22u

C53

68p

C539

4.7p

L512

2.2nH

C540

33p

C541

15p

L514

12nH

L513

6.8nH

14

GND6

TQM7M5008

DCS_PCS_IN

1

13

GND5

12

VCC

11

GND4

10

GND3

9

GSM_OUT

8

GND2

U501

TQM7M5008

BS

2

TX_EN

3

VBATT

4

GND1

5

6

VRAMP

GSM_IN

7

GSM

LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.


- 97 -


4.7.3 Checking RF Tx level


- 98 -




4.7.4 Checking PAM Block

TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.6V

TP2. GSM_PA_EN : Power Amp Enable

(Power ON : higher than 1.25V , Power OFF : lower than 0.4V)

TP3. GSM_PA_BAND : Power Amp Band Selection Control

(GSM Mode : -0.2V < VBS < 0.4V , DCS/PCS Mode : 1.25V < VBS < 3.0V)

TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.0V

Schematic of GSM PAM Block

VBAT

TP4

C533

100p

(1608)

C534

22u

C538

68p

R510

2.2K

TP1

TP2

GSM_PA_RAMP

GSM_PA_BAND

GSM_PA_EN

C539

4.7p

L512

2.2nH

C540

33p

C541

15p

L514

12nH

L513

6.8nH

14

GND6

TQM7M5008

DCS_PCS_IN

13

GND5

12

VCC

11

GND4

10

GND3

9

GSM_OUT

8

GND2

U501

TQM7M5008

1

BS

2

TX_EN

3

4

VBATT

GND1

5

6

VRAMP

GSM_IN

7

FL501

EFCH897MTDB1

SFSY0030201

O1

4 5

G3

G2 G1

IN

1

3 2

TP3



- 99 -



4.7.5 Checking RF Rx Block

TP1. DCS RX INPUT

TP2. PCS RX INPUT

TP3. GSM RX INPUT

Schematic of `GSM900/DCS/PCS Rx Block

C503

L502

100nH

33p

0

DCS_PCS_TX

EGSM_TX

UMTS_TX_RX

DCS_RX2

DCS_RX1

PCS_RX2

PCS_RX1

EGSM_RX2

EGSM_RX1

11

ANT

13

VDD

NC

7

20

21

22

23

24

3

6

9

19

010001

L501

15nH

C509

0.1u

VRF_SMPS

TP3

TP1

TP2

PCS(1930-1990 MHz)

TP3

DCS(1805-1880 MHz)

GSM(925-960 MHz)

L503 5.6nH

L504

15nH

L505 5.6nH

L506 5.6nH

L508

5.6nH

L509 27nH

L507

12nH

L510

33nH

L511 27nH


- 100 -






- 101 -



4.8 Checking Bluetooth Block

Test Point of the Bluetooth Block

Top

TP1. VBT_2.6V

TP2. VBT_CORE_2.6V

TP3. TCXO_BT

TP4. BT ANT Output

Bottom


- 102 -




Schematic of the Bluetooth Block

TP4

ISCA TYPE

SNGF0017401

GND3

GND2

ANT400

FEED

GND1

SNGF0022801

10OL21C7AJ00005

BLUETOOTH_Broadcom

C410

C412

NA

33p

L405

10nH

FM_ANT

TP3

FL400 LFB212G45SG8A166

IN

GND1

OUT

GND2

C411 2.2p

L400

3.3nH

L401

NA

C414 1000p

ELCH0012503

C415

47p

L402

100nH

C417

47p

L403

56 nH

C422

10p

4

X400

26MHz

1

3

2

TSX-3225_26MHZ

EXXY0024401

VBT_2.6V

VREG_FM_1.5V

FM_R

FM_L

BT_32KHz

FM_IRQ

WLAN_ACTIVE

BT_HOST_WAKEUP

BT_WAKEUP C423

10p

R408 NA

BT_ACTIVE

BT_PRIORITY

BT_PCM_OUT

BT_PCM_IN

BT_PCM_SYNC

BT_PCM_CLK

C426

0.1u

R406

C416

C418

150K H2

F1

G1

RES

RFIOP

RFION

NA

0.1u

D4

D1

C1

A3

A2

A1

K6

K5

J5

FMPLLCAP

FMRF_INP

FMRF_INN

FMVCO_LP

FMVCO_LN

FM_CVAR

AUDIOL

AUDIOR

AUDIOGND

K2

K3

B4

XTALP

XTALN

LPOIN

H10

E7

B7

K9

E9

TP402 A10

TP403 B10

TP404 C10

TP405 B9

D10

B8

G6

E6

G9

F10

H9

GPIO7

GPIO6

GPIO5

GPIO4

GPIO3

GPIO2

GPIO1

GPIO0

A_GPIO7

A_GPIO6

A_GPIO5

A_GPIO4

A_GPIO3

A_GPIO2

A_GPIO1

A_GPIO0

D6

RST_N

UART_CTS_N

UART_RTS_N

UART_RXD

UART_TXD

TM3

TM2

TM1

TM0

J6

F6

J7

K7

F7

C9

J9

K10

U403

BCM2048SKUFBG

VREG_CTL

VREG_BT

VREGFM_DAC

VDDR5V

VDDR3V

VDDO18_1

VDDO18_2

VDDO18_3

VDDC1

VDDC2

VDDC3

VDDC4

VDDC5

VDDRF1

VDDRF2

VDDPLL

VDDXO

VDDLO

VDDFM1

VDDFM2

VDDFM3

VDDFM4

VDDFM5

VDDO33_1

VDDO33_2

VDDO33_3

D5

B5

A5

F9

G5

D9

G7

A7

A6

B6

K8

A8

J10

E1

E2

K1

J3

J1

A4

B1

B3

J4

K4

A9

E10

J8 nBT_RESET

D400

PG05DBTFC

TP1

BT_UART_RTS

BT_UART_CTS

BT_UART_TXD

BT_UART_RXD

VBT_2.6V

R407

NA

BT_REG_CTL

FB400

SFBH0008101

VREG_BT_1.5V

C421 1.8p

VBT_2.6V

C424

0.1u

C425

1u

VREG_FM_1.5V

TP2

VREG_BT_1.5V

VREG_FM_1.5V

VBT_CORE_2.6V



- 103 -



Start

TP1,TP2

Signals exits?

YES

TP3

Is clock ok? 26MHz

YES

TP4

Signals exits?

YES

Change the Main

NO

Change th Main board

NO

Change the X400

NO

Change the U403


- 104 -




4.9 Checking WLAN Block

KS20 WLAN initial power sequence is :

WLAN_PWD controlled by MSM7200 GPIO goes to high (2.6V), SYS_RST_L in the WLAN module goes to low by inverting WLAN_PWD signals -> WLAN_PWR_ON controlled by MSM7200 GPIO goes to high (2.6V) ◊ VWLAN_3.3V goes to 3.3V first ◊ VWLAN_2.6V and VWLAN_1.8V go to 2.6V and

1.8V, respectively. -> WLAN_PWD is low, and SYS_RST_L is high after all WLAN power signals go on

KS20 WLAN initial operation is :

32KHZ_ON controlled by MSM7200 GPIO goes to low for turning on sleep clock oscillator -> A WLAN

32.768 kHz sleep clock starts to operate -> WLAN power goes to high -> WLAN module scans access points for network access, for which RF parts in the module start to operate -> After association process to the wireless network in the KS20 set, users can use Wireless LAN.

Start

NO

Change Key FPCB or

Check WLAN antenna in the Key FPCB

YES

RF cable is connected?

YES

Check Sleep Clock in the R632

YES

Check WLAN power in the C610 (1.8V),

611 (3.3V), and 613 (2.6V)

YES

Check WLAN_PWD and SYS_RST_L power sequence in the R651 and C624.

YES

Change the Sub board

NO

NO

NO

NO

Connect RF cable to RF switch

Check X600 sleep clock oscillator

Check U600 for 1.8V, and U601 for

3.3V, and U605 for 2.6V

Check Q603 inverter



- 105 -



[ WLAN part 2 ( RF cable ) ]

[ WLAN part 1 ( Key FPCB Front ) ]

WLAN RF Switch

WLAN Antenna

WLAN RF Switch

[ WLAN part 3 ( Sub Board Bottom ) ]


- 106 -




R651 to check WLAN_PWD

C624 to check SYS_RST_L

R632 (32.768kHz sleep clock measurement point)


U600 1.8V DC-DC converter

C 611 (3.3V)

C 610 ( 1.8V)

C 613 (2.6V)




- 107 -



U601 3.3V LDO

U605 2.6V LDO

X600 Sleep Clock Oscillator

[ WLAN part 6 ( Sub Board Top ) ]

Waveform - R632 (32.768kHz sleep clock measurement point)


- 108 -




4.10 Power ON Troubleshooting

Power On sequence of KS20 is :

PWR key press(Key FPCB) -> KPDPWR_ON go to low(D119),PM7540 KPDPWR_N pin(C12) ->

PM7540 Power Up -> VMSMC1_1.2V(C338), VMSMC2_1.2V(C339), VMSME_1.8V(C340),

VMSMP_2.6V(C352), VMSMA_2.6V(C351), VTCXO_2.85V(C355) power up and system reset assert to MSM -> Phone booting and PS_HOLD(D311) assert to PMIC

Start

Battery voltage. higher than 3.20V?

YES

NO

NO

D119 high to low when key press?

YES

Change or charging the

Battery

Check the Key Dome

VMSMC1_1.2V, VMSMC2_1.2V,

VMSMP_2.6V, VMSME_1.8V,

VTCXO_2.85V, VMSMA_2.6V power up?

NO

Change the Main board

YES

Is clock ok?

R314 : 19.2M

X300 : 32.768Khz

YES

Check an U100 SMT status by X-ray

Exchange U100 or


And Retest

NO

Check the TXCO



- 109 -



Waveform : R314, 19.2MHz

Waveform :

X300, 32.768Khz


- 110 -




D319

[ KS20 KEY FPCB Front ]

VMSMA_2.6V

VTCXO_2.85V

R314 : 19.2Mhz

VMSMP_2.6V

VMSMC1_1.2V

VMSMC1_1.2V

[ KS20 Main PCB Bottom ]

X300 : 32.768Khz

VMSME_1.8V



- 111 -



4.11 Charger Troubleshooting

TA

(4.8V)

VADP_5.0V

C313

1u

TA OVP Circuit

NUS3065MUTAG

9

DRAIN_THERMAL

8

VCC

7

OUT

6

GATE

5

SRC

U302

IN

1

2

GND

3

CNTRL

DRAIN

4

1

IN

FL300

2

OUT

3

G1 G2

4

NFM21PC105B1A3

VCHG_5.0V

Battery Charging Circuit

USB

Cable

VPWR

VBAT

VCHG_5.0V

VUSB_5.0V

ISNS_P

ISNS_M

C304

22u

C305

0.01u

10

U300

P_DRAIN

NUS3116MTR2G

P_COLLECTOR

9

8 1

EMITTER1

2

EMITTER2

BASE1

BASE2

7

3

COLLECTOR

4

SOURCE

6

GATE

DRAIN

5

Charging

Current Flow

CHG_CTL_N

USB_CTL_N

BAT_FET_N

Pass Tr

(ON)

Pass Tr

(ON)

Battery FET

(ON)

VBAT

Main

Battery

Charging Procedure

- Connect TA or USB Cable

- Control the charging current by PM7540 IC

- Charging current flows into the battery

Check Point

- Connection of TA or USB Cable

- Charging current path

- Battery

Troubleshooting Setup

- Connect TA and battery to the phone

Troubleshooting Procedure

- Check the charger (TA or USB Cable) connector

- Check the OVP Circuit

- Check the charging current Path

- Check the battery


- 112 -




Start

Check the pin and battery

Connect terminals of I/O connector

NO

Change I/O connector

Connection OK?

Yes

Is the TA (or USB Cable) voltage 4.8V (or 5.0V)?

Yes

NO

Change TA

(or USB Cable)

Is it charging properly

After turning on U302, U300

Yes

END

NO




And Retest

[ Charger Troubleshooting Flow ]



- 113 -



R304

U300

[ Charging part ( Main PCB Front ) ]

U302


- 114 -




4.12 USB Troubleshooting

USB Initial sequence of KS20 is :

USB connected to KS20 power on

→ VBUS_5.0V(Q400) go to 5V → MSM7200 48M PLL work →

USB_DAT is triggered

→ USB_CTL_N go to 0V → USB work.

Start

Power is on?

YES

Cable is inserted?

YES

C314 is 5V?

YES

USB_CTL_N is 0V?

YES




And Retest

NO

NO

NO

NO

Go to power on trouble shooting

Insert cable

Check C314, CN300#16

Check U300 (pin 7)



- 115 -



C314

VUSB_5.0V

VCHG_5.0V

R309 10

1u

C320

C314

2.2u

[ USB part 1 ( Main PCB) ]


VBAT

VCHG_5.0V

VUSB_5.0V

ISNS_P

ISNS_M

10

U300

P_DRAIN

NUS3116MTR2G

P_COLLECTOR

9

8 1

EMITTER1

2

EMITTER2

3

COLLECTOR

BASE1

BASE2

GATE

7

6

4

SOURCE DRAIN

5

CHG_CTL_N

USB_CTL_N

BAT_FET_N

VBAT

VPWR

C304

22u

C305

0.01u


[ USB part 2 ( Main PCB ) ]

- 116 -




4.13 SIM Detect Troubleshooting

USIM Initial sequence of KS20 is :

SIM_CLK,SIM_RST,SIM_IO triggered

→ VRUIM_3.0V go to 2.8V → SIM IF work

Start

Re-insert the SIM card

Work well?

No

VRUIM_3.0V is 2.85V?

SIM_CLK is run?

YES

Change SIM card

Yes

NO

Work well?

No


Yes

End

Check CN400

End



- 117 -



3

7

1

2

VRUIM_3.0V

SIM_RST

SIM_CLK

SIM_IO

1 2 3 5 6 7


0

R701

4

5

6

PLR0504F

D701

3

2

1

C701

C702

0.1u

33p

C703 33p

C704 33p

1

2

3

D702

6

5

4

PLR0504F

S700

ENSY0018601

49448-1611

S8

T8

T7

T6

T5

T4

T3

T2

T1

S4

10

9

8

7

6

5

4

3

2

1

ST1

ST2

17

18

Figure .USIM part schematics

1

2

D706

- 118 -




4.14 Camera Troubleshooting

Camera control signals are generated by MSM7200.

4.14.1 2M AF CAMERA

Start

Check the camera connector and reconnect the camera

Yes

Camera is OK?

NO

VCAM_2.6V(FB600, FB601,

FB602 or C721) is 2.6V?

Yes

VCAM_1.8V(C722) is 1.8V?

Yes

Check the CAM_MCLK

(R621)

Yes

Change the camera

NO

NO

NO

Camera is OK

NO




And Retest

Yes

END




END



- 119 -



4.14.2 VGA CAMERA

Start

Check the camera connector and reconnect the camera

Camera is OK?

NO

VCAM_2.6V(FB600, FB601,

FB602 or C721) is 2.6V?

Yes

Check the CAM_MCLK

(R621)

Yes

Change the camera

Yes

NO

NO

Camera is OK

NO




And Retest

Yes

END



END


- 120 -




VCAM_2.6V

CN601:

14,15,16,17,31,32

VCAM_1.8V

CN601: 33,34

C722

C721

R621

VCAM_2.6V

FL600

3

4

1

2

INOUT_A1

INOUT_A2

INOUT_A4

ICVE21184E150R500FR

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

7

6

9

8

VCAM_2.6V

FB601

FB602

R603 0

4

5

6

7

8

9

1

2

3

14

15

16

17

10

11

12

13

CN601

G1 G2

34

33

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

G3 G4

ENBY0015601

AXK7L34227G

19

21

18

28

17

ENM2

ENF

ENLDO

P1

P2

8

SETM

7

SETF

6

REFBP

C720

EUSY0263101

0.01u

LDO1

LDO2

M1

M2

M3

M4

F1

F2

F3

F4

16

15

14

13

12

11

10

9

4

5

C721

2.2u

C722

2.2u

BLED1

BLED2

BLED3

BLED4

FLED

VCAM_2.6V

VCAM_1.8V



- 121 -



4.15 Keypad Backlight Troubleshooting

Key Pad Back Light is on as below :

Key pressing -> KPD_DRV_N go to 0V -> Key Backlight LED On

Start

Key press

NO

+VPWR is above 2.6V?

Yes

KPD_DRV_N is 0V ?

Yes




And Retest

NO

VPWR

Check battery

Yes

Change the Main board or Check the Key FPCB

VPWR

Power Keypad LED

100ohm R100

100ohm R101

100ohm R102

100ohm R103

LD101

SSC-TWH104-HLS

LD102

SSC-TWH104-HLS

LD103

SSC-TWH104-HLS

LD104

SSC-TWH104-HLS

KPD_DRV_N

D107

PRSB6.8C

KPD_DRV_N


- 122 -




4.16 Main LCD Troubleshooting

Main LCD control signals are generated by MSM7200. The signal path is :

MSM7200

→ CN400 → CN602 → CN702 LCD Module

Start

Press END key

NO

Key LED is on?

Yes

Disconnect and reconnect

The LCD connector(CN702)

GO to power on trouble shooting

Yes

LCD display OK?

No

Change the LCD module

END

Yes

LCD display OK?

No


END

Yes

LCD display OK?

No

Change the LCD FPCB

END



- 123 -



4.17 Receiver Path

MSM7200 EAR1_OP, EAR1_ON

→ R103, R104 → Analog Switch(U400) → R421, R420 →

CN400

→ CN602 → R751, R750 → L703, L702 → CN701 → Speaker

Start

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

YES

Can you hear the tone?

NO

NO

Sine wave appears at

R103, R104?

YES

NO

The sine wave appears at

SPK+?

YES


SPKR_N,SPKR_P SUB PCB

NO

YES


Pin 4, 1 CN400?

NO




And Retest

YES

END



Change speaker

Check SUB PCB.

Check CN602


- 124 -




R103, R104

Analog

Switch

SPK

+



- 125 -



4.18 Headset path

MSM7200 HPH_R, HPH_L

→ C409, C406 → HEADSET AMP(U402) → R405, R404 → FB301,

FB300

→ CN300 (MMI Connector)→

Start

Connect the phone to network equipment and setup call.

Setup 1KHz tone out and insert headset.

YES

Can you hear the tone?

NO


FB301/FB300?

NO




And Retest

YES

END

Change the Headset


- 126 -




FB301

FB300



- 127 -



4.19 Speaker phone path

MSM7200 LINE_OP,LINE_ON

→ C402/R403, C401/R402 → Speaker AMP(U401) → Analog

Switch(U400)

→ R421, R420 → CN400 → CN602 → R751, R750 L703, L702 → CN701 →

Speaker

Start

Connect the phone to network equipment and setup call

Setup 1KHz tone out


C402/R403 and C401/R402?

NO


YES nSPEAKER_SHDN(TP400) is

2.6V?

YES

NO

NO


SPK+?

YES


SPKR_N,SPKR_P SUB PCB

NO


Pin 4, 1 CN400?

NO




And Retest

YES

YES



Change speaker

Check SUB PCB.

Check CN602


- 128 -



Speaker Amplifier

Analog

Switch


SPK

+



- 129 -



4.20 Main microphone

MIC (OSF213-42DC)

→ CN602 → CN400 → C106 → MIC1P(MSM7200)

Start

Make a call

VMIC_BIAS(R102) is 2.6V

YES

Make sound to MIC

NO


C106?

YES


NO

NO

Change main board

Change the MIC

Work well?

YES

END


- 130 -



MIC


R102

C106



- 131 -



4.21 Headset microphone

HS MIC (18 pin Connector)

→ C105 → MIC2P(MSM7200)

Start

Make a call

OK

Change the headset and retry

NO nEAR_DET

(C312) is 0V?

Yes

VMIC_BIAS2 is biased by 2.6V? (R301)

Yes

NO

NO

NO


C105 ?

Yes

END

END

YES

Change the MAIN board

Change MAIN board

Change the headset or

Main board and retry.


- 132 -




MIC Input

R301 nEAR_DET

C105



- 133 -



4.22 Vibrator

The PM7540 IC supports silent incoming-call alarms with its vibration motor driver. The vibration driver is a programmable voltage output that is referenced to VDD; when off, its output voltage is

VDD. The motor is connected between VDD and pin N2 (VIB_DRV_N); the voltage across the motor is Vm = VDD - Vout where Vout is the PM7540 IC voltage at pin N2.

A flyback diode is connected across the motor terminals to prevent inductive kickback during turn-off and suppress voltage transients that could damage the IC. Short circuit current limiting is also provided to limit the current when the motor is stalled or shorted. The driver is programmable from

1.2 to 3.1 V in 100-mV increments.

VPWR

VIB_DRV_ON

KDS160E D700

C700

1u

L700

68nH

CN700

1

2

L701

68nH

ENEY0003801

24-8000-002-000-829


- 134 -



Waveform :

CN700, Vibrator




- 135 -


5. DOWNLOAD

5. DOWNLOAD

5.1 KS20 DOWNLOAD

5.1.1 Introduction

LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG KS20 USB modem driver (Ver 1.0 or later) is installed.

Additionally, LGMDP allows multi downloading up to 9 handsets at the same time.

* KS20 does NOT use LG USB driver but LG KS20 USB driver. LG KS20 USB driver is used only for

KS20.

5.1.2 Downloading Procedure

* Before the image download, we must set the KS20 USB diag port as a composite USB port.

1. Press “2676625720#” in the phone dialer application to enter engineering menu.

2. 4. Port Setting

→ 1. Diag Setting → 1. USB Set for Diag → “OK” → “Back”.

3. (4. Port Setting

→ 1. Diag Setting →) 2. USB Switching → “LG Composite -DUN, DIAG”.

4. Press “Done” and reset the KS20.

Reset KS20


- 136 -



5. DOWNLOAD

• Connect the phone to your desktop PC using the USB cable and run the LGMDP application.

Before getting started, set up LGMDP preferences from the Preferences of the file menu the way you want. Click on the File menu and select Preferences.

➢ Play a success sound

It will be played a .wav file when the download has been completed. To enable this simply check the box.

➢ Always on Top

Check if LGMDP always appears at the top of the window so that user can monitor it all the time.

➢ Automatically run Select Port When LGMDP starts

When LGMDP starts, it will automatically select Select Port button to download new image file.



- 137 -


5. DOWNLOAD

5.1.2.1 Connecting to PC

• Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button.

(The port number(COM7) shall be different from that of the port number in the snapshot.)

• The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed.


- 138 -



5. DOWNLOAD

1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse… button. The edit box shows the file path where images are located.

Please note that all images should be located in a selected folder.

2) Click on the Browse… button to select image files to be downloaded on the handset.

3) NV Backup/Restore: Backup the NV data and restore the backed up NV data automatically.

1)

2)

3)

5)

4)

6)

7)

4) Reset database & Contents:

User related data including the setting data on the EFS is reset in the handset. The user contents in the handset will be erased. If you want to reset all the user data back to the way they were before you started downloading new images, check the option.

Erase_EFS:

The calibration data, user contents, media, and module are erased. Only calibration data is kept when NV backup/restore is checked. The user contents and file system physically are wiped out.

Keep All Contents:

Maintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading a new S/W images. User data stated above are maintained if this option is selected.

5) Additional Options:

Display Information is defaultly not selected.

6) Clear: Clearing all directory paths of images in the dialog.

7) Start: Starting downloading the selected individual image.



- 139 -


5. DOWNLOAD

5.1.2.2 Choosing image files

• Select the image folder, where all the image files are located, by clicking on the Browse…. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.)


- 140 -



5. DOWNLOAD

• Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically load images accordingly. Also you can select images by manually. For instance, select the path of

AMSS Modem Image file by clicking on the Browse… button. The selected AMSS image will be downloaded to the handset from the path directory in the PC. Make sure that you have chosen correct file. In case of wrong AMSS Modem file is file is selected, the phone may not work.

(The file name shall be different from that of the file name in the snapshot.)



- 141 -


5. DOWNLOAD

• If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the

NV file from the LGMDP installation directory by clicking on the Browse… button.

• Click on the START button to start downloading. A summary of the selected images and option information window will be displayed. Click on the No button if this is not the setting you are downloading for. Otherwise click on the Yes button to continue downloading selected image file with options.


- 142 -



5.1.2.3 Downloading



- 143 -

5. DOWNLOAD

• This message box informs that a new file for

NV backup will be created in the displayed file name in the LGMDP installation directory.

• Backing up NV data and backed up NV data will be stored in the LGMDP installation directory.

• Rebooting the handset and re-establishing the connection. The handset will go emergency mode.

• Downloading the all images.


5. DOWNLOAD

• Rebooting the handset and re-establishing the connection.

• Restoring NV data which backed up in the

Backing up process. User can also restore

NV data using NV Default image selection.

• Downloading process has completed successfully.


- 144 -



5. DOWNLOAD

5.1.3 Troubleshooting Download Errors

1) When the phone does not work after downloading has been completed.

5.1.3.1 When the phone does not work

• Reboot the phone in the emergency mode (Turn off the KS20 and turn on wile pressing “SEND” +

“Function” Key simultaneously) and then try to download all the images.

The phone supports a special mode called emergency mode. In this mode, minimum units for downloading is running so that users can download the images again in case of emergency situation.

Emergency Mode

USB Cable

Check the LCD is off.

Send Key

Check the LED is green.

Function Key



- 145 -


5. DOWNLOAD

• The below dialog shows parameters of Select Port when phone is booted in Emergency mode.

Click on the Connect button to continue.

• Choose Image file after clicking on the Browse… button. Make sure that you have chosen the right image file. After choosing valid images, then click on the Start button to start downloading selected images. The selected image will be downloaded to the handset from the path directory in the PC.

After downloading images successfully, it will boot to normal mode.


- 146 -



5. DOWNLOAD

5.1.4 Caution

1) Multi-downloading using the USB hub is not recommendable.

2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and images download.

3) The NV data saved at LGMDP folder as following format.

D:\LGMDP\004400-01-429926\_COM14_

LGMDP folder name

IMEI number

Port number

4) Recommended that the AMSS and Windows OS Image have to be downloaded at the same time.

5) Erase EFS option will erase everything (nv items, and some settings) in the EFS area.



- 147 -


6. BLOCK DIAGRAM


6.1 GSM & UMTS RF Block

RTR6275

LO Generation

& Distribution

WCDMA

Duplexer

IMT

IMT

2

IMT SAW

4

GSM HB

2

GSM SAW

4

GSM LB

RF Mobile

SW

IMT

PA

IMT SAW

GSM

PA

LB

HB

AGC

LO Generation

& Distribution

32.768 kHz (Sleep X-tal)

MSM7200

VC-TCXO

19.2MHz

Camera

Graphics

PLL

USB OTG

UART 1

Video

HK ADCs

MODE Select

Interface

RX ADCs

UART 2 / USIM

UART 3

ARM1136J

Memory I/F

UMTS/HSDPA

EBI1

EBI2

SBI

ARM926EJS

Vocoder

MP3 / MIDI gpsOne

TX DACs Integrated

CODEC

RF Interface

GPIO

GSM/GPRS/EDGE

19.2MH

3

4

2

2

Data

DDR SDRAM

2

NAND

TX,RX

USB

Data

USIM

NAND Flash: 256MB

DDR SDRAM : 64MB

MIC

HPH

RCV +/-

2

2

I/O Port

BT

DM Port

MMC JTAG Interface

48.00 MHz(for USB)

[Fig 2.1] KS20 RF Functional Block Diagram


- 148 -




[Table 2.1] RF Block Component



- 149 -



6.2 Interface Diagram

6.2.1 RTR6275 & MSM7200 Interface Diagram

RTR6275

LO Generation

& Distribution

WCDMA

Duplexer

IMT

IMT

2

IMT SAW

4

GSM HB

2

GSM SAW

4

GSM LB

RF Mobile

SW

IMT

PA

IMT SAW

GSM

PA

LB

HB

AGC

LO Generation

& Distribution

32.768 kHz (Sleep X-tal)

MSM7200

VC-TCXO

19.2MHz

Camera

Graphics

PLL

USB OTG

UART 1

Video

HK ADCs

MODE Select

Interface

RX ADCs

UART 2 / USIM

UART 3

ARM1136J

Memory I/F

UMTS/HSDPA

EBI1

EBI2

SBI

ARM926EJS

Vocoder

MP3 / MIDI gpsOne

TX DACs Integrated

CODEC

RF Interface

GPIO

GSM/GPRS/EDGE

19.2MH

3

4

2

2

Data

DDR SDRAM

2

NAND

TX,RX

USB

Data

USIM

NAND Flash: 256MB

DDR SDRAM : 64MB

MIC

HPH

RCV +/-

2

2

I/O Port

BT

DM Port

MMC JTAG Interface

48.00 MHz(for USB)

[Fig 2.2] RTR6275 & MSM7200 Interface Diagram


- 150 -




Main RF signal

Main RF signal

GSM 900 TX

DCS TX

PCS TX

UMTS2100 TX

GSM 900 RX

DCS RX

PCS RX

UMTS2100 RX

TX_I/Q

RX_I/Q

Description

GSM 900 TX RF Signal

DCS TX RF Signal

PCS TX RF Signal

UMTS2100 TX RF Signal

GSM 900 RX RF Signal

DCS RX RF Signal

PCS RX RF Signal

UMTS2100 RX RF Signal

I/Q for Tx of RF

I/Q for Rx of RF

Comment

Control signal

Control signal

UMTS PA_CTL signal

Description

PA_R1 UMTS Tx High/Low Power Control

GSM PA_CTL signal

GSM_PA_BAND DCS or PCS /GSM Mode Selection

GSM_PA_EN Power Amp Gain Control Enable

GSM_PA_RAMP Power Amp Gain Control

ANT_SEL 0,1,2,3 Ant Switch Module Mode Selection

Comment

UMTS,

GSM900Tx/Rx,

DCS Tx/Rx,

PCS Tx/Rx



- 151 -



- 152 -



7. CIRCUIT DIAGRAM

A

B

C

D

C

D

E

F

E

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

VMSMP_2.6V

nJTAG_RESOUT nPON_RST

KDS114E

KDS114E

10K

R100

D100

D101

1K

R101 nSDRAM_WE nSDRAM_RAS nSDRAM_CS

SDRAM_CKE

SDRAM_CLK0

SDRAM_CLK1 nRESETOUT1

SDRAM_DQS3

SDRAM_DQS2

SDRAM_DQS1

SDRAM_DQS0

SDRAM_DQM3

SDRAM_DQM2

SDRAM_DQM1

SDRAM_DQM0

SDRAM_ADDR23

SDRAM_ADDR16

SDRAM_ADDR15

SDRAM_ADDR12

SDRAM_ADDR11

SDRAM_ADDR10

SDRAM_ADDR9

SDRAM_ADDR8

SDRAM_ADDR7

SDRAM_ADDR6

SDRAM_ADDR5

SDRAM_ADDR4

SDRAM_ADDR3

SDRAM_ADDR2

SDRAM_ADDR1

SDRAM_ADDR0

SDRAM_D31

SDRAM_D30

SDRAM_D29

SDRAM_D28

SDRAM_D27

SDRAM_D26

SDRAM_D25

SDRAM_D24

SDRAM_D23

SDRAM_D22

SDRAM_D21

SDRAM_D20

SDRAM_D19

SDRAM_D18

SDRAM_D17

SDRAM_D16

SDRAM_D15

SDRAM_D14

SDRAM_D13

SDRAM_D12

SDRAM_D11

G10

H10

D11

E11

G11

H11

G12

H12

A13

B13

D13

E13

A14

E14

G13

H13

EBI1_DQ31

EBI1_DQ30

EBI1_DQ29

EBI1_DQ28

EBI1_DQ27

EBI1_DQ26

EBI1_DQ25

EBI1_DQ24

EBI1_DQ23

EBI1_DQ22

EBI1_DQ21

EBI1_DQ20

EBI1_DQ19

EBI1_DQ18

G14

H14

H15

G15

G16

EBI1_DQ17

EBI1_DQ16

EBI1_DQ15

EBI1_DQ14

EBI1_DQ13

EBI1_DQ12

EBI1_DQ11

J25

G19

EBI1_WE

EBI1_RAS

D17

L22

D22

E20

E21

D21

H19

B21

A23

EBI1_WAIT0

EBI1_OE

EBI1_CS5

EBI1_CS4

EBI1_CS3

EBI1_CS2

EBI1_CS1

EBI1_CS0

EBI1_CKE1

H18

B24

B25

EBI1_CKE0

EBI1_DCLK

EBI1_DCLKB

D14

EBI1_MEM_CLK

K25

E12

B14

D16

A21

D12

D15

E15

EBI1_RESOUT

EBI1_DQS3

EBI1_DQS2

EBI1_DQS1

EBI1_DQS0

EBI_DM3

EBI_DM2

EBI_DM1

B23

EBI_DM0

A26

B26

B27

D23

E23

D24

G20

E22

F24

E25

L15

G21

EBI1_ADR27

EBI1_ADR26

EBI1_ADR25

EBI1_ADR24

EBI1_ADR23

EBI1_ADR22

EBI1_ADR21

EBI1_ADR20

EBI1_ADR19

EBI1_ADR18

L16

J21

H20

F25

L17

G24

H22

G25

H24

K24

H25

L21

J24

K21

J22

K22

EBI1_ADR17

EBI1_ADR16

EBI1_ADR15

EBI1_ADR14

EBI1_ADR13

EBI1_ADR12

EBI1_ADR11

EBI1_ADR10

EBI1_ADR9

EBI1_ADR8

EBI1_ADR7

EBI1_ADR6

EBI1_ADR5

EBI1_ADR4

EBI1_ADR3

EBI1_ADR2

EBI1_ADR1

EBI1_ADR0

U100-1

MSM7200_A

LINE_ON

LINE_OP

CCOMP

AUXOUT

MICBIAS

YM_LR

YP_UR

XM_LL

XP_UL

A8

B8

E4

G8

E5

D1

E1

D2

E2

AA17

AD17

AB17

AE17

AA18

AG18

AD18

AH18

AE18

AB18

AD19

AE19

AA19

AB20

AB19

AH20

AA20

AE20

AD20

AG22

AE21

AH22

AD21

AE22

AB21

N8

M1

L8

M7

M8

P5

P11

M11

N11

M2

L4

M4

M5

L7

N7

L5

AD8

AH6

AE8

AD9

AA11

AH8

AG23

AB22

AA10

AG6

AB9

AA9

V13

AD11

AE10

AB11

V7

V8

W7

V11

Y7

GPIO13

GPIO14

GPIO15

GPIO16

GPIO17

GPIO18

GPIO19

GPIO20

GPIO21

GPIO22

GPIO23

GPIO24

GPIO25

GPIO26

GPIO27

GPIO28

GPIO29

GPIO30

GPIO31

GPIO32

GPIO33

GPIO34

GPIO35

GPIO36

GPIO0

GPIO1

GPIO2

GPIO3

GPIO4

GPIO5

GPIO6

GPIO7

GPIO8

GPIO9

GPIO10

GPIO11

GPIO12

GPIO37

GPIO38

GPIO39

GPIO40

GPIO41

GPIO42

GPIO43

GPIO44

GPIO45

GPIO46

GPIO47

GPIO48

GPIO49

GPIO50

GPIO51

GPIO52

GPIO53

GPIO54

GPIO55

GPIO56

GPIO57

GPIO58

GPIO59

GPIO60

GPIO61

C111 0.1u

LINE_ON

LINE_OP C112

10u

C113

0.1u

TOUCH_Y1YD

TOUCH_Y2YU

TOUCH_X2XL

TOUCH_X1XR nCAM_RST

CAM_2M_PWDN

CAM_VGA_PWDN

CAM_PWR_ON

CAM_DATA0

CAM_DATA1

CAM_DATA2

CAM_DATA3

CAM_DATA4

CAM_DATA5

CAM_DATA6

CAM_DATA7

CAM_PCLK

CAM_HSYNC

CAM_VSYNC

CAM_MCLK

REMOCON_SW nEAR_DET

CALL_KEY

BL_PWR_ON nHEADSET_SHDN nPM_INT

PS_HOLD

FM_IRQ nTF_DETECT nREM_INT

UART_SW nSPEAKER_SHDN

FLASH_PWR_ON

KPD_COLUMN0

KPD_COLUMN1

KPD_COLUMN2

KPD_ROW0

KPD_ROW1

KPD_ROW2

KPD_ROW3

KPD_ROW4

BAT_I2C_SCL

BAT_I2C_SDA

BT_UART_RTS

BT_UART_CTS

UART1_RX

UART1_TX

MSM_USIM_CLK

MSM_USIM_RST

MSM_USIM_DATA

WLAN_SD_D3

WLAN_SD_D2

WLAN_SD_D1

WLAN_SD_D0

WLAN_SD_CMD

WLAN_SD_CLK

LCD_PWR_ON nRECEIVER_SW

SSBDT_RTR

I2C_SCL

I2C_SDA

VMIC_BIAS

VBAT

VUSB_5.0V

Array TP

CRADLE_UART_RX

CRADLE_UART_TX

REMOTE_PWR_ON

CRADLE_USB_DN

CRADLE_USB_DP

2.5G

UAT100

3G

9

10

11

7

8

3

4

5

6

1

2

12

GND

RX

TX

NC1

GND

RX

TX

VCHAR

ON_SW ON_SW

VBAT

VBAT

NC2

NC3

NC4

DSR

PWR

URXD

UTXD

RTS

CTS

ARM9 JTAG

MSM_TDI

JTAG_PS_HOLD nJTAG_RESOUT

MSM_RTCK

VMSMP_2.6V

1

4

5

2

3

CN100

G1 G2

10

9

8

7

6

G3 G4

AXT410164

ENBY0033101

MSM_TCK

MSM_TMS nMSM_TRST

MSM_TDO

CRADLE_UART_RX

CRADLE_UART_TX

REMOTE_PWR_ON

Test TP

TP100

TP101

TP102

C

D

E

F

C

D

E

B

A

F

LG(42)-A-5505-10:01

1 2 3



4 5 6 7 8 9

- 153 -

LGMC

LG Electronics Inc.



C

D

E

F

C

B

A

1 2 3 4 5

MSM7200 Power Part

6 7

C200

2200p

8 9 10 11 12 13

MCP

NAND 2G/DDR 1G

14 15 16

A

A3

A4

A10

A16

A18

A22

D25

E24

G22

H21

J8

J28

K1

K2

K4

K5

K7

K8

L1

VSS_DIG0

VSS_DIG1

VSS_DIG2

VSS_DIG3

VSS_DIG4

VSS_DIG5

VSS_DIG6

VSS_DIG7

VSS_DIG8

VSS_DIG9

VSS_DIG10

VSS_DIG11

VSS_DIG12

VSS_DIG13

VSS_DIG14

VSS_DIG15

VSS_DIG16

VSS_DIG17

L12

L13

L14

L18

M12

M13

M14

M15

M16

M17

M18

M28

N12

N13

N14

N15

N16

N17

P12

P13

P14

P15

P16

P17

R12

R13

R14

R15

R16

R17

T12

T13

T14

T15

T16

T17

U12

U13

U14

U15

U16

U17

VSS_DIG42

VSS_DIG43

VSS_DIG44

VSS_DIG45

VSS_DIG46

VSS_DIG47

VSS_DIG48

VSS_DIG49

VSS_DIG50

VSS_DIG51

VSS_DIG52

VSS_DIG53

VSS_DIG54

VSS_DIG55

VSS_DIG56

VSS_DIG57

VSS_DIG58

VSS_DIG59

VSS_DIG60

VSS_DIG18

VSS_DIG19

VSS_DIG20

VSS_DIG21

VSS_DIG22

VSS_DIG23

VSS_DIG24

VSS_DIG25

VSS_DIG26

VSS_DIG27

VSS_DIG28

VSS_DIG29

VSS_DIG30

VSS_DIG31

VSS_DIG32

VSS_DIG33

VSS_DIG34

VSS_DIG35

VSS_DIG36

VSS_DIG37

VSS_DIG38

VSS_DIG39

VSS_DIG40

VSS_DIG41

U100-2

MSM7200_B

VSS_THERMAL1

VSS_THERMAL2

VSS_THERMAL3

VSS_THERMAL4

VSS_THERMAL5

VSS_THERMAL6

VSS_THERMAL7

VSS_THERMAL8

VSS_THERMAL9

VSS_THERMAL10

VSS_THERMAL11

VSS_THERMAL12

VSS_THERMAL13

VSS_THERMAL14

VSS_THERMAL15

VSS_THERMAL16

VSS_THERMAL17

VSS_THERMAL18

VDD_DIG_0

VDD_DIG_1

VDD_DIG_2

VDD_DIG_3

VDD_DIG_4

VDD_DIG_5

VDD_DIG_6

VDD_DIG_7

VDD_DIG_8

VDD_DIG_9

VDD_DIG_10

VDD_DIG_11

VDD_DIG_12

Y27

M27

AG12

J27

B22

AG20

B3

B18

B10

L2

Y2

AG17

AG24

A1

A2

A27

A28

B1

B28

U7

U8

AA22

AB13

AB24

AB25

AG1

AG28

AH1

AH2

AH27

AH28

VSS_EBI_1P_0

VSS_EBI_1P_1

VSS_EBI_1P_2

VSS_EBI_1P_3

VSS_EBI_1P_4

VSS_EBI_1P_5

VSS_EBI_1P_6

VSS_EBI_1P_7

VSS_EBI_1P_8

A20

A19

A17

F28

E28

A24

A15

A12

A11

VSS_EBI_2P_0

VSS_EBI_2P_1

VSS_EBI_2P_2

AA28

U28

N28

VSS_SMIC_0

VSS_SMIC_1

VSS_SMIC_2

VSS_SMIC_3

VSS_SMIC_4

C28

L28

R28

V28

AF28

VMSMC1_1.2V

VMSME_1.8V

SDRAM_ADDR0

SDRAM_ADDR1

SDRAM_ADDR2

SDRAM_ADDR3

SDRAM_ADDR4

SDRAM_ADDR5

SDRAM_ADDR6

SDRAM_ADDR7

SDRAM_ADDR8

SDRAM_ADDR9

SDRAM_ADDR10

SDRAM_ADDR11

SDRAM_ADDR12

SDRAM_ADDR15

SDRAM_ADDR16

SDRAM_CLK0

SDRAM_CLK1

SDRAM_CKE nSDRAM_RAS

SDRAM_ADDR23 nSDRAM_WE nSDRAM_CS

SDRAM_DQM0

SDRAM_DQM1

SDRAM_DQM2

SDRAM_DQM3

SDRAM_DQS0

SDRAM_DQS1

SDRAM_DQS2

SDRAM_DQS3 nNAND_FLASH_CS nWE2 nOE2 nLB2 nUB2 nRESETOUT1

NAND_FLASH_READY

VMSME_1.8V

R200

R201

10K

10K

C4

B4

ALE

CLE

C3

WP_

C6

R_B_

M4

M7

N4

P3

P4

P5

P10

N7

N8

P1

P2

B1

B2

B10

F3

G1

M3

NC1

NC2

NC3

NC4

NC5

NC6

NC7

NC8

NC9

NC10

NC11

NC12

NC13

NC14

NC15

NC16

NC17

A2

A9

A10

R1

R2

R9

R10

DNU1

DNU2

DNU3

DNU4

DNU5

DNU6

DNU7

U201

A0

A5

A6

A7

A8

A9

A1

A2

A3

A4

A10

A11

A12

K4

L1

L2

L3

C2

D2

E1

D3

E2

D4

K3

F2

F1

J3

K2

BA0

BA1

CK

CK_

CKE

RAS_

CAS_

WED_

CS_

DQM0

DQM1

DQM2

DQM3

DQS0

DQS1

DQS2

DQS3

G8

J2

J8

G6

F8

E7

H8

E3

G2

H2

K1

J7

G5

H7

E5

C9

D10

E9

F10

G9

J10

K9

L9

M10

N9

VDDQ1

VDDQ2

VDDQ3

VDDQ4

VDDQ5

VDDQ6

VDDQ7

VDDQ8

VDDQ9

VDDQ10

B6

B7

B3

CE_

WEN_

RE_

KAL009001M-D1YY

IO0

IO1

IO2

IO3

IO4

IO5

IO6

IO7

N1

N2

N3

M5

P7

M6

N6

M8

VCC1

VCC2

B5

N5

VSSQ1

VSSQ2

VSSQ3

VSSQ4

VSSQ5

VSSQ6

VSSQ7

VSSQ8

VSSQ9

VSSQ10

VSS1

VSS2

VSS3

VSS4

VSS5

VSS6

VSS7

VSS8

B9

C1

C5

H9

J1

M2

P6

P9

C10

D9

E10

F9

G10

J9

K10

L10

M9

N10

DQ7

DQ8

DQ9

DQ10

DQ11

DQ12

DQ13

DQ14

DQ15

DQ16

DQ17

DQ18

DQ0

DQ1

DQ2

DQ3

DQ4

DQ5

DQ6

DQ19

DQ20

DQ21

DQ22

DQ23

DQ24

DQ25

DQ26

DQ27

DQ28

DQ29

DQ30

DQ31

VDD1

VDD2

VDD3

VDD4

VDD5

VDD6

B8

D1

H1

H10

M1

P8

L4

L5

L6

L7

K8

L8

K7

K5

K6

G7

J6

J5

H6

H5

J4

F5

H3

H4

E6

F7

F6

G3

G4

F4

E4

D5

E8

D6

D8

D7

C8

C7

B

SDRAM_D0

SDRAM_D1

SDRAM_D2

SDRAM_D3

SDRAM_D4

SDRAM_D5

SDRAM_D6

SDRAM_D7

SDRAM_D8

SDRAM_D9

SDRAM_D10

SDRAM_D11

SDRAM_D12

SDRAM_D13

SDRAM_D14

SDRAM_D15

SDRAM_D16

SDRAM_D17

SDRAM_D18

SDRAM_D19

SDRAM_D20

SDRAM_D21

SDRAM_D22

SDRAM_D23

SDRAM_D24

SDRAM_D25

SDRAM_D26

SDRAM_D27

SDRAM_D28

SDRAM_D29

SDRAM_D30

SDRAM_D31

VMSME_1.8V

EBI2_DATA0

EBI2_DATA1

EBI2_DATA2

EBI2_DATA3

EBI2_DATA4

EBI2_DATA5

EBI2_DATA6

EBI2_DATA7

VMSME_1.8V

C

D

E

F

C

D D

E

F

1

LG(42)-A-5505-10:01

2 3

C223

10u

Near by U100

VMSME_1.8V_SENSE

VMSME_1.8V

VMSMA_2.6V

VMSMP_2.6V

4 5 6 7

C227

10u

C220

10u

VMSMC1_1.2V

VMSMC2_1.2V

8 9

E

LG Electronics Inc.


- 154 -




A

B

C

D

E

F

C

D

E

F

1

TV_OUT

2

TV OUT Filter

C300 NA

FI-D2012-153KJT

L302 15uH

VIDEO_IN

3

VUSB_5.0V

VCHG_5.0V

R309 10

1u

C320

C314

2.2u

MSM_USIM_DATA

Route together

CRADLE_USB_DP

CRADLE_USB_DN

MSM_USB1_VP

MSM_USB1_VM

Route together

REMOTE_PWR_ON

MSM_USIM_RST

SIM_RST

GSM_PA_DAC_REF

MSM_USIM_CLK

SIM_CLK

SIM_IO nUSB_OE1

VMSMP_2.6V

PMIC_SSBI nPM_INT

VIDEO_IN

CVBS

VIB_DRV_ON

KPD_DRV_N

75 R315

M7

N5

D8

B12

D4

A1

L12

M11

K8

K9

K5

K6

M3

N1

N3

M5

B3

D5

F4

G4

J2

K2

MPP_1

MPP_2

MPP_3

MPP_4

MPP_5

MPP_6

MPP_7

MPP_8

MPP_9

MPP_10

MPP_11

MPP_12

MPP_13

MPP_14

MPP_15

MPP_16

MPP_17

MPP_18

MPP_19

MPP_20

MPP_21

MPP_22

H2

L2

M2

H4

J4

K4

USB_ID

USB_D_P

USB_D_M

USB_OE_N

USB_DAT

USB_SE0

J10

H10

K10

D10

SBST

SBCK

SBDT_SSBI

MSM_INT_N

B6

B7

A6

A7

B4

B5

A4

A5

SPKR_IN_L_M

SPKR_IN_L_P

SPKR_OUT_L_M

SPKR_OUT_L_P

SPKR_IN_R_P

SPKR_IN_R_M

SPKR_OUT_R_P

SPKR_OUT_R_M

B2

B1

N2

E1

F1

H1

VIDEO_IN

VIDEO_OUT

VIB_DRV_N

KPD_DRV_N

LCD_DRV_N

FLSH_DRV_N

4 5

UART Switch

Route together

U304

PM7540

6

UART1_TX

UART_SW

BT_UART_RXD

3

4

1

2

NC_A1

SAB

NO_B0

COM_B

U301

NLAST9431MT

COM_D

NO_D0

SCD

NC_C1

12

11

10

9

CRADLE_UART_RX

UART1_RX

UART3_TX

7

VPWR

VBAT

VCHG_5.0V

VUSB_5.0V

ISNS_P

ISNS_M

C304

22u

C305

0.01u

8 9


10

U300

P_DRAIN

NUS3116MTR2G

P_COLLECTOR

9

8 1

EMITTER1

2

EMITTER2

BASE1

BASE2

7

3

COLLECTOR

4

SOURCE

GATE

DRAIN

6

5

CHG_CTL_N

USB_CTL_N

BAT_FET_N

VBAT

10

VADP_5.0V

C313

1u

TA OVP Circuit

NUS3065MUTAG

9

DRAIN_THERMAL

8

VCC

7

OUT

6

GATE

5

SRC

U302

IN

1

2

GND

CNTRL

3

DRAIN

4

1

IN

FL300

OUT

2

3

G1 G2

NFM21PC105B1A3

4

VCHG_5.0V

C317

C318

C319

C321

C322

C323

C324

C325

C326

C327

C328

C329

C330

C331

C332

C333

0.1u

0.1u

0.1u

0.1u

0.1u

0.1u

0.1u

0.1u

0.1u

0.1u

0.1u

0.1u

1000p

4.7u

1000p

4.7u

Place close to PM7540 pins

Place in PM7540 room at shield edge

These CAPs close to inductors

VSW_5V

VREG_5V

VSW_MSMC1

VREG_MSMC1

VSW_MSMC2

VREG_MSMC2

VSW_MSME

VREG_MSME

VSW_PA

VREG_PA

VREG_GP1

VREG_GP2

VREG_GP3

VREG_GP4

VREF_GP5

VREG_GP6

VREG_MMC

VREG_MSMA

VREG_MSME2

VREG_MSMP

VREG_RFRX1

VREG_RFRX2

VREG_RFTX

VREG_RUIM1

VREG_SYNT

VREG_TCXO

VREG_USB

VREG_WLAN

MIC_BIAS

REF_ISET

REG_GND

REF_BYP

A12

A13

C13

TCXO_IN

TCXO_EN

TCXO_OUT

H12

D9

G10

E12

D13

M1

G1

G12

E13

K13

A11

G13

H13

A8

A10

A3

N11

A2

J13

N12

A9

B13

K1

J1

N8

M8

N6

M6

N10

M9

N4

M4

XTAL_IN

XTAL_OUT

M13

N13

SLEEP_CLK

AMUX_OUT

K7

M12

KPD_PWR_N

PON_RESET_N

PS_HOLD

C12

F10

E10

C344 2.2u

1u

R313

0.1u

C356

R314

C345

121K

51

1%

VMSMC1_1.2V_SENSE

VMSMC2_1.2V_SENSE

VMSME_1.8V_SENSE

VRF_SMPS_SENSE

4.7uH

L303

4.7uH

L304

4.7uH

L305

4.7uH L306

VMIC_BIAS2

TCXO_PM_19.2MHZ

TCXO_EN

PMIC_TCXO

SLEEP_CLK

AMUX_OUT

KPDPWR_ON nPON_RST

Route together

R316

1K

D310

KDS114E

X300

FC-135

32.768KHz

PS_HOLD

JTAG_PS_HOLD

R317 200K

D311

PG05DBTFC

VHDAMP_3.0V

VBT_2.6V

VAUX2_2.85V

VBT_CORE_2.6V

VTFLASH_3.0V

VMSMA_2.6V

VMSMP_2.6V

VRUIM_3.0V

VSYNT_2.85V

VTCXO_2.85V

VMSMC1_1.2V

VMSMC2_1.2V

VMSME_1.8V

VRF_SMPS

Place crystal and load caps close to PM7540

11 12 13

IO Connector

VMIC_BIAS2

14 15 16

CN300

21

19

8

9

10

11

12

6

7

4

5

1

2

3

13

14

15

16

17

18

20

22

HSEJ-18S04-25

ENRY0006001

SD12T1G

D306

FM_ANT

C360

10u

D300

PG05DBTFC

6

5

4

D307

1

2

3

PLR0504F

L300

68nH

C301

1u

2SA2030

Q300

CALL_KEY

FB300

FB301

0

0

R305

R306

HS_MIC

CVBS

HSL

HSR

USC2

USC1 nEAR_DET

REMOTE_PWR_ON

CRADLE_UART_TX

CRADLE_UART_RX

VBAT

VADP_5.0V

VUSB_5.0V

B

C

Main Battery Connector

A

D

VBAT

BAT_I2C_SCL

BAT_I2C_SDA

VMSMP_2.6V

CN301

1

7

2

6

3

5

4

ENZY0018901

HSBC-4P30-20

USB Switch

Differential lines, Line Width 0.2mm, at intervals of 0.3mm.

Differential lines, route as parallel as possible !! --> USC2, USC1

Differential lines, route as parallel as possible !! --> CRADLE_USB_DP, CRADLE_USB_DN nREM_INT

USC2

CRADLE_USB_DP

VPWR

1

4

U303

V+

2

NO1

3

COM1

IN1

MAX4717ETB+T

11

P_GND

10

NO2

9

COM2

IN2

8

NC2

7

5

NC1

GND

6

REM_ADC

USC1

REMOCON_SW

CRADLE_USB_DN

E

F

C

D

E

1

LG(42)-A-5505-10:01

2 3 4 5 6 7 8 9

LG Electronics Inc.

LGMC



- 155 -



A

B

C

D

E

1 2 3 4 5 6 7 8 9

MODEM_RCV_P

AMP_OUT_N

MODEM_RCV_N

AMP_OUT_P

Audio Switch

VPWR

1

2

1B0

1B1

3

4

2B0

2B1

U400

FSA2267AL10X

1A

1S

9

8

2S

2A

7

6

SPKR_N nRECEIVER_SW

SPKR_P

Speaker Amp

LINE_ON

LINE_OP nSPEAKER_SHDN

VPWR

C401

C402

R400

R401

47K

47K

1u

C400

0.1u

R402

0.1u

R403

20K

20K

TP400

B1

U401 LM4898ITLX-NOPB

VDD VO2

C3

C1

IN-

A1

IN+

VO1

BYPASS

C2

SD_SEL SD_MODE

GND

A3

A2

B2

B3

C403 1u

SD_MODE

0

0

1

1

SD_SEL

0

1

0

1

AMP_OUT_P

AMP_OUT_N

SD_MODE

SD

ON

ON

SD

Headset Amp

10 nHEADSET_SHDN

HPH_R

HPH_L

VHDAMP_3.0V

TP401

220n

C409

220n

C406

B2

B1

U402

_SDL

_SDR

A1

INR

C1

INL

A3

D1

PVDD

SVDD

TPA4411YZH

PGND

B4

A2

SGND

D2

OUTL

C2

OUTR

PVSS

SVSS

D4

D3

R404

R405

56

56

C408

1u

HSL

HSR

11 12 13 14

MAIN to SUB Connector

INTERNAL_MIC_P

VPWR

VOUT

SPKR_N

32KHZ_ON

SPKR_P

KPD_ROW0

KPD_ROW1

KPD_ROW2

KPD_ROW3

KPD_COLUMN0

KPD_COLUMN1

KPD_ROW4

C404

NA

BT_32KHZ

VIB_DRV_ON

KPD_DRV_N nCAM_RST

CAM_2M_PWDN

CAM_VGA_PWDN

CAM_PWR_ON

CAM_DATA0

CAM_DATA1

CAM_DATA2

CAM_DATA3

CAM_DATA4

CAM_DATA5

CAM_DATA6

CAM_DATA7

CAM_PCLK

CAM_HSYNC

CAM_VSYNC

CAM_MCLK

FLASH_PWR_ON

VCOIN

SIM_IO

SIM_CLK

SIM_RST

I2C_SCL

I2C_SDA

1

1

R420

R421

19

20

21

22

15

16

17

18

11

12

13

14

27

28

29

30

31

23

24

25

26

32

33

34

1

2

3

4

5

6

7

8

9

10

39

40

41

42

35

36

37

38

43

44

45

CN400

91

92

ENBY0035301

AXK890225WG

68

67

66

65

64

63

62

61

60

59

58

57

80

79

78

77

76

75

74

73

72

71

70

69

56

55

54

53

52

51

50

49

48

47

46

90

89

88

87

86

85

84

83

82

81

FLED

KPD_COLUMN2

WLAN_SD_D0

WLAN_SD_D1

WLAN_SD_D2

WLAN_SD_D3

WLAN_SD_CMD

WLAN_SD_CLK

BT_ACTIVE

BT_PRIORITY

WLAN_ACTIVE

WLAN_PWR_ON

KPDPWR_ON

TOUCH_Y2YU

TOUCH_X2XL

TOUCH_Y1YD

TOUCH_X1XR

SDMC_DAT3

SDMC_DAT2

SDMC_DAT1

SDMC_DAT0

SDMC_CMD

SDMC_CLK nTF_DETECT

LEDR1

LEDG1

LEDB1

WLAN_PWD

LCD_PWR_ON

FLM

LCD_RESET

BL_PWR_ON

MDDI_P_DATA_M

MDDI_P_DATA_P

MDDI_P_STB_P

MDDI_P_STB_M

VMSMP_2.6V

VTFLASH_3.0V

VRUIM_3.0V

15 16

A

B

C

D

E

F F

C

D

E

F

1

LG(42)-A-5505-10:01

2

ISCA TYPE

SNGF0017401

ANT400

GND3

GND2

FEED

GND1

SNGF0022801

10OL21C7AJ00005

BLUETOOTH_Broadcom

C410

C412

33p

NA

L405

10nH

FM_ANT

FL400

IN

GND1

LFB212G45SG8A166

OUT

GND2

C411 2.2p

L400

3.3nH

L401

NA

C414 1000p

ELCH0012503

C415

47p

L402

100nH

C417

47p

L403

56 nH

C422

10p

X400

26MHz

4

1

3

2

TSX-3225_26MHZ

EXXY0024401

VBT_2.6V

VREG_FM_1.5V

FM_R

FM_L

BT_32KHz

FM_IRQ

WLAN_ACTIVE

BT_HOST_WAKEUP

BT_WAKEUP

C423

10p

R408 NA

BT_ACTIVE

BT_PRIORITY

BT_PCM_OUT

BT_PCM_IN

BT_PCM_SYNC

BT_PCM_CLK

C426

0.1u

R406

C416

C418

150K H2

F1

G1

RES

RFIOP

RFION

NA

0.1u

D4

D1

C1

A3

A2

A1

K6

K5

J5

FMPLLCAP

FMRF_INP

FMRF_INN

FMVCO_LP

FMVCO_LN

FM_CVAR

AUDIOL

AUDIOR

AUDIOGND

K2

K3

B4

XTALP

XTALN

LPOIN

K9

E9

TP402 A10

TP403 B10

TP404 C10

TP405 B9

D10

B8

G6

E6

G9

F10

H9

H10

E7

B7

GPIO7

GPIO6

GPIO5

GPIO4

GPIO3

GPIO2

GPIO1

GPIO0

A_GPIO7

A_GPIO6

A_GPIO5

A_GPIO4

A_GPIO3

A_GPIO2

A_GPIO1

A_GPIO0

D6

RST_N

U403

BCM2048SKUFBG

VREG_CTL

VREG_BT

VREGFM_DAC

VDDR5V

VDDR3V

VDDO18_1

VDDO18_2

VDDO18_3

VDDC1

VDDC2

VDDC3

VDDC4

VDDC5

VDDRF1

VDDRF2

VDDPLL

VDDXO

VDDLO

VDDFM1

VDDFM2

VDDFM3

VDDFM4

VDDFM5

VDDO33_1

VDDO33_2

VDDO33_3

UART_CTS_N

UART_RTS_N

UART_RXD

UART_TXD

TM3

TM2

TM1

TM0

J6

F6

J7

K7

F7

C9

J9

K10

A7

J10

E1

E2

K1

J3

J1

A8

F9

G5

D9

G7

D5

B5

A5

A6

B6

K8

A4

B1

B3

J4

K4

A9

E10

J8 nBT_RESET

D400

PG05DBTFC

3 4 5 6 7 8 9

BT_UART_RTS

BT_UART_CTS

BT_UART_TXD

BT_UART_RXD

VBT_2.6V

R407

NA

BT_REG_CTL

FB400

SFBH0008101

C421 1.8p

VREG_BT_1.5V

VREG_FM_1.5V

VBT_2.6V

C424

0.1u

C425

1u

VREG_BT_1.5V

VREG_FM_1.5V

VBT_CORE_2.6V

FLASH LED

VOUT

LD400

LMFL2P010

EDLM0008803

FLED

LGMC


- 156 -

C

D

4/5

E

LG Electronics Inc.




F

E

D

C

F

E

D

C

A

B

ANT500 ANT501

1

R500

0

2 3

L500

3.9nH

C505

1.5p

C502

C506

NA

4.7p

SW500

KMS-506

ANT

G2

G1

RF

ENWY0002301

ANT_SEL0

ANT_SEL1

ANT_SEL2

C514

33p

C515

33p

C516

33p

C503

L502

100nH

33p

4

5

8

1

2

10

12

17

18

25

26

14

15

16

Rev.F

FL500

LSHS-M090UE

VC1

VC2

VC3

GND1

GND2

GND3

GND4

GND5

GND6

GND7

GND8

GND9

PGND1

PGND2

ANT

11

DCS_PCS_TX

EGSM_TX

UMTS_TX_RX

DCS_RX2

DCS_RX1

PCS_RX2

PCS_RX1

EGSM_RX2

EGSM_RX1

13

VDD

NC

7

3

6

9

19

20

21

22

23

24

SFAY0010001

ANTENNA SWITCH MODULE LOGIC

GSM 850/GSM 900 TX


GSM 850 RX

GSM 900 RX

GSM 1800 RX

GSM 1900 RX

WCDMA

ANT_SEL0 ANT_SEL1

HIGH

HIGH

HIGH

LOW

-

LOW

LOW

LOW

HIGH

-

LOW

LOW

LOW

LOW

ANT_SEL2

LOW

LOW

-

LOW

LOW

HIGH

HIGH

4

L501

15nH

C509

0.1u

VRF_SMPS

5

VBAT

6 7

DCS(1805-1880 MHz)

PCS(1930-1990 MHz)

GSM(925-960 MHz)

C539

4.7p

L512

2.2nH

C540

33p

C541

15p

L514

12nH

L513

6.8nH

14

GND6

TQM7M5008

DCS_PCS_IN

13

GND5

12

VCC

11

GND4

10

GND3

9

GSM_OUT

8

GND2

U501

TQM7M5008

1

BS

2

TX_EN

3

VBATT

4

5

GND1

6

VRAMP

GSM_IN

7

L503 5.6nH

L505 5.6nH

L506 5.6nH

L508

5.6nH

L509 27nH

L504

15nH

L507

12nH

L510

33nH

L511 27nH

C533

100p

GSM_PA_BAND

LOW

HIGH

MODE

GSM

DCS/PCS

C538

68p

R510

2.2K

(1608)

C534

22u

FL501

EFCH897MTDB1

SFSY0030201

8

4 5

O1

G2

3

G3

G1

IN

1

2

GSM_PA_RAMP

GSM_PA_BAND

GSM_PA_EN

GSM

9

WCDMA_2100_TX_OUT

DCS_PCS_TX

GSM_TX

RTR_TX_ON

RTR_TX_AGC_ADJ

RTR_DAC_REF

SSBDT_RTR

RX_WCDMA_2100

WLNA_OUT

WCDMA_MIX_IN_P

WCDMA_MIX_IN_M

R511

R512

300

18

3 dB

R513

300

R514

R515

300

18

3 dB

R516

300

DCS_PCS_TX

GSM_TX

10 11 12 13

C517

12p

C504

C507

C510

6p

6p

4p

R501

12K

(1%)

55

ENV_OUT

46

44

HB_RF_OUT1

HB_RF_OUT2

43

42

LB_RF_OUT1

LB_RF_OUT2

24

RF_ON

56

VCONTROL

54

DAC_REF

14

SBDT

3

27

R_BIAS1

R_BIAS2

R502

680

(1%)

Rev.H

Rev.F

31

30

GCELL_INP

GCELL_INN

32

33

EGSM_INP

EGSM_INN

38

39

DCS_INP

DCS_INN

36

37

GPCS_INP

GPCS_INN

22

23

CAL_INP

CAL_INN

26

WLNA_IN

ENV_LNP

ENV_LNN

2

1

TX_IP

TX_IN

TX_QP

TX_QN

51

50

53

52

TCXO

7

VTUNE1

VTUNE2

5

18

U500

RTR6275

RX_IP

RX_IN

12

13

RX_QP

RX_QN

10

11

PWD_DET_IN

TEST

40

21

VDDA1

VDDA2

VDDA3

VDDA4

VDDA5

VDDA6

VDDA7

VDDA8

VDDA9

VDDA10

VDDA11

VDDA12

VDDA13

VDDA14

20

28

41

45

47

48

49

4

6

8

9

15

16

19

C512

C513

3300p

1000p

VTUNE-Connected directly to GND

14

C500

180p

C501

180p

C508

180p

C511

180p

R503

R504

5.1

2.2

R505

R506

R507

R508

DNI

2.2

5.1

10

15 16

RTR_TXIP

RTR_TXIM

RTR_TXQP

RTR_TXQM

TCXO_RTR_19.2MHz

RTR_RXIP

RTR_RXIM

RTR_RXQP

RTR_RXQM

PWR_DET

VSYNT_2.85V

C518

1u

C519

10u smd_1608h_9_r

C520

1000p

VRF_SMPS

VRF_SMPS_SENSE

VDD_RX

A

B

C

VMSMP_2.6V

R509

100

C535

0.01u

C536

1000p

C537

22p

D

E

F

WCDMA

L515

2.7nH

C545

0.5p

C549

33p

VDD_RX

WLNA_OUT

C543

22p

L516

1nH

WCDMA LNA Circuit

C547

33p

L518

C550

0.75p

3.3nH

FL502

EFCH2140TDE1

1

5

G2

IN

G1

4

O2

O1

2 3

C546

0.5p

L517

1nH

L519

1nH

WCDMA_MIX_IN_P

WCDMA_MIX_IN_M

RTR_TRK_LO_ADJ

TCXO Circuit

R517

100ohm

C551

0.01u

1

X500

VCONT

2

GND

19.2MHz

VCC

OUT

4

3

EXSK0007802

TG-5010LH_19_2M_75A

VTCXO_2.85V

C542

1000p

C544

0.1uF

100p C548

1000p C552

TCXO_PM_19.2MHz

TCXO_RTR_19.2MHz

C

RX_WCDMA_2100

L520

1nH

C554

3p

C553

33p

FL503

1

2

RX

TX

PGND

ANT

ACMD-7602

SDMY0001301

4

3

D

C560

33p

U502

SCDY0003402

20dB

VPWR

C563

1.5p

33p

C561

C555

10u

(1608)

C556

220p

C557

100p

C564

NA

R518

51

SMPY0015501

8

7

6

11

10

9

ACPM-7381

PGND

VCC2

GND3

RFOUT

GND2

GND1

U503

VCC1

RFIN

VMODE1

VMODE0

VEN

3

4

5

1

2

C566

C565

100p

C558

33p

10nH

L523

L521

2.7nH

WCDMA_PA_R0

WCDMA_PA_ON

O1

4

G2

5

G3

G1

IN

3 2

1

FL504

EFCH1950TDF1

C559

33p

L522

L524

10nH

4.7nH

WCDMA_2100_TX_OUT

R520

91

R519

75

10dB

R521

91

PWR_DET

Thermistor circuit deleted

E

1

LG(42)-A-5505-10:01

2 3 4 5 6 7 8 9

LG Electronics Inc.

LGMC

- 157 -





1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

A

SUB to MAIN 90Pin Connector

SUB to FPCB_KEYPAD Connector

VCAM_2.6V

SUB TO FPCB_CAM CONNECTOR (T=0.9. SOCKET)

B

C

D

E

F

C

D

E

F

INTERNAL_MIC_P

VPWR

VOUT

SPKR_N

32KHZ_ON

SPKR_P

KPD_ROW0

KPD_ROW1

KPD_ROW2

KPD_ROW3

KPD_COLUMN0

KPD_COLUMN1

KPD_ROW4

BT_32KHZ

C602

NA VIB_DRV_ON

KPD_DRV_N nCAM_RST

CAM_2M_PWDN

CAM_VGA_PWDN

CAM_PWR_ON

CAM_DATA0

CAM_DATA1

CAM_DATA2

CAM_DATA3

CAM_DATA4

CAM_DATA5

CAM_DATA6

CAM_DATA7

CAM_PCLK

CAM_HSYNC

CAM_VSYNC

CAM_MCLK

FLASH_PWR_ON

VCOIN

SIM_IO

SIM_CLK

SIM_RST

R721

$V

0

I2C_SCL

I2C_SDA

23

24

25

26

19

20

21

22

27

28

29

30

35

36

37

38

39

31

32

33

34

13

14

15

16

17

18

9

10

11

12

40

41

42

43

44

45

1

2

3

4

5

6

7

8

91

92

CN602

68

67

66

65

64

63

62

61

72

71

70

69

60

59

58

57

56

55

54

53

52

82

81

80

79

78

77

76

75

74

73

51

50

49

48

47

46

90

89

88

87

86

85

84

83

AXK790327G

ENBY0035401

FLED

KPD_COLUMN2

WLAN_SD_D0

WLAN_SD_D1

WLAN_SD_D2

WLAN_SD_D3

WLAN_SD_CMD

WLAN_SD_CLK

BT_ACTIVE

BT_PRIORITY

WLAN_ACTIVE

WLAN_PWR_ON

KPDPWR_ON

TOUCH_Y2YU

TOUCH_X2XL

TOUCH_Y1YD

TOUCH_X1XR

SDMC_DAT3

SDMC_DAT2

SDMC_DAT1

SDMC_DAT0

SDMC_CMD

SDMC_CLK nTF_DETECT

LEDR1

LEDG1

LEDB1

WLAN_PWD

LCD_PWR_ON

FLM

LCD_RESET

BL_PWR_ON

MDDI_P_DATA_M

MDDI_P_DATA_P

MDDI_P_STB_P

MDDI_P_STB_M

VMSMP_2.6V

VTFLASH_3.0V

VRUIM_3.0V

TOUCH_Y2YU

TOUCH_X1XR

TOUCH_Y1YD

TOUCH_X2XL

INTERNAL_MIC_P

NA

C603

KPDPWR_ON

VPWR

VMSMP_2.6V

KPD_ROW4

R606

R608

R610

R612

47

47

47

47

R600 680

R615 680

04-6293-027-001-829

ENQY0014201

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

CN600

R620 10K

R604

R605

R607

R609

R611

R613

R614

680

680

680

680

680

680

680

CN603

20369-001E

G1

G2

G3 ANT

WLAN_SD_CLK

WLAN_SD_CMD

WLAN_SD_D0

WLAN_SD_D1

WLAN_SD_D2

WLAN_SD_D3

L602

NA

L603

NA

VWLAN_2.6V

CAM_PCLK nCAM_RST

CAM_2M_PWDN

CAM_VGA_PWDN

VCAM_2.6V

KPD_DRV_N

LEDCR1

LEDCG1

LEDCB1

KPD_COLUMN2

KPD_COLUMN1

KPD_COLUMN0

KPD_ROW3

KPD_ROW2

KPD_ROW1

KPD_ROW0

VMSMP_2.6V

I2C_SDA

I2C_SCL

C725

NA

C726

NA

VCAM_2.6V

FL600

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

ICVE21184E150R500FR

9

INOUT_B1

8

INOUT_B2

7

INOUT_B3

6

INOUT_B4

FB601

FB602

R603 0

8

9

10

11

6

7

4

5

12

13

14

15

1

2

3

16

17

CN601

G1 G2

34

33

32

27

26

25

24

23

22

21

20

31

30

29

28

19

18

G3 G4

ENBY0015601

AXK7L34227G

WLAN 802.11 b/g

C610

1u

38

RF_IN_OUT_1

R638 68 12

16

SDIO_CLK

SDIO_CMD

18

19

20

21

SDIO_DATA_0

SDIO_DATA_1

SDIO_DATA_2

SDIO_DATA_3

49

1

2

48

SPI_CK

SPI_CS0_L

SPI_MISO

SPI_MOSI

1u 1u

C613

1u

C617

1u

M600

SWL-2700S

BT_ACTIVE

BT_FREQ

BT_PRIORITY

RX_CLEAR

6

5

4

7

LFXTALI

LFXTALO

23

24

CLK_REQ

CHIP_PWD

SYS_RST_L

SDIO_LDO_BYPASS

LDO_BYPASS

GPIO_9

TDO

GPIO_8

GPIO_10

EJTAG_SEL

14

9

17

29

47

10

15

3

46

30

R628

R629

R630

R631

R632

R634

0

10K

0

0

100K

51K

VWLAN_1.8V

VWLAN_1.8V

VWLAN_1.8V

WLAN_32KHZ

R644

R646

R648

R649

R650

100K

10K

10K

10K

10K

R642 100K

WLAN_PWD

VWLAN_2.6V

VWLAN_3.3V

VWLAN_2.6V

D606

PG05DBTFC

D

Q603

KTK5132E

G

S

WLAN_PWD

6

FXLP34L6X

VCC

5

NC

4

Y

U602

1

VCC1

2

A

3

GND

6

FXLP34L6X

VCC

5

NC

4

Y

U603

VCC1

1

A

2

3

GND

1

U604

VCC1

2

A

3

GND

FXLP34L6X

6

VCC

5

NC

Y

4

32KHZ_ON

VWLAN_2.6V

BT_ACTIVE

VWLAN_2.6V

BT_PRIORITY

VWLAN_2.6V

WLAN_ACTIVE

VMSMP_2.6V

WLAN_PWR_ON

WLAN/BT 32.768KHz

2

3

4

5

1

X600

VIO

6

GND

NC1

NC2

NC3

NC4

SG-3030LC-32.768

12

VDD

7

OUT

NC8

NC7

NC6

NC5

11

10

9

8

32.768MHz

R653

0

WLAN_32KHZ

BT_32KHZ

VPWR

C614

1u

C621

1u

VPWR

VPWR

C608

4.7u

POWER WLAN

VWLAN_1.8V

1

U600 LM3671IMFX-1.8NOPB

VIN SW

5

2

GND

3

EN FB

4

L600

2.2uH

C609

10u

VWLAN_3.3V

1

U601

VIN

5

6

GND

STBY

BH33MA3WHFV

VOUT1

VOUT2

NOISE

PPAD

2

3

4

7

4

6

1

U605

VDD

NC

CE

R1114D261D-TR-F

VOUT

3

GND1

GND2

2

5

OJ600

C615

0.1u

C616

1u

VWLAN_2.6V

C622

1u

LEDCG1

LEDCR1

LEDCB1

FL602

1

INOUT_A1

2

3

INOUT_A2

4

INOUT_A3

INOUT_A4

ICVE21184E150R500FR

INOUT_B1

9

8

INOUT_B2

7

INOUT_B3

6

INOUT_B4

CAM_DATA7

CAM_DATA6

CAM_DATA5

CAM_DATA4

FL603

1

4

INOUT_A1

2

INOUT_A2

3

INOUT_A3

INOUT_A4

ICVE21184E150R500FR

INOUT_B1

9

INOUT_B2

8

7

INOUT_B3

6

INOUT_B4

CAM_DATA3

CAM_DATA2

CAM_DATA1

CAM_DATA0

R621 0

FL604

1

INOUT_A1

2

3

INOUT_A2

INOUT_A3

4

INOUT_A4

ICVE21184E150R500FR

INOUT_B1

9

8

INOUT_B2

INOUT_B3

7

6

INOUT_B4

TP600

TP601

CAM_MCLK

CAM_VSYNC

CAM_HSYNC


LEDB1

LEDR1

LEDG1

KTK5132E

Q600

G

D

S

KTK5132E

Q601

G

D

S

KTK5132E

Q602

G

D

S

1

LG(42)-A-5505-10:01

2 3 4 5 6 7 8 9

A

B

C

D

E

F

C

D

E

LG Electronics Inc.

LGMC


- 158 -




A

B

1 2 3

Power Vibrator

VPWR

VIB_DRV_ON

KDS160E D700

C700

1u

L700

68nH

L701

68nH

CN700

1

2

ENEY0003801

24-8000-002-000-829

4 5 6 7

RTC Battery

2V, 0.5mA

NBL414R-F9J

SBCL0001701

VCOIN

VA702

EVL5M02200

8 9

C

D

E

F

C

D

E

F

1

LG(42)-A-5505-10:01

LCD Connector

04-6293-027-001-829

ENQY0014201

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

CN702

R706

0

D707

PG05DBTFC

VOUT

BLED1

BLED2

BLED3

BLED4

FLM

TP700

TP701

MDDI_P_STB_M

MDDI_P_STB_P

VLCD_1.8V

6

FXLP34L6X

VCC

5

NC

4

Y

U700

1

VCC1

A

2

3

GND

VLCD_2.6V

LCD_RESET

VLCD_2.6V

VLCD_1.8V

TP702

TP703

MDDI_P_DATA_M

MDDI_P_DATA_P

C710

2.2u

C711

0.01u

C712

2.2u

C713

0.01u

Power LCD

LCD_PWR_ON

VPWR VLCD_2.6V

C719

1u

4

6

1

U701

VDD

NC

CE

R1114D261D-TR-F

3

VOUT

GND1

GND2

2

5

C718

1u

LCD_PWR_ON

VPWR VLCD_1.8V

C724

1u

4

6

1

U703 R1114D181D

3

VDD VOUT

NC

CE

GND1

GND2

2

5

C723

1u

BL_PWR_ON

FLASH_PWR_ON

CAM_PWR_ON

Speaker Connector

CN701

1

2

SUSY0026601

EMS1810TPB1P

L702

68nH

L703

68nH

1

1

R750

$V

R751

$V

SPKR_N

SPKR_P


VPWR

C715

10u

R720

DNI

1

2

U702

PIN

IN

MAX8631XETI

C1P

23

3

24

29

GND

PGND

BGND

C1N

C2P

22

26

C2N

OUT

20

19

21

18

28

17

8

ENM1

ENM2

ENF

ENLDO

P1

P2

SETM

7

SETF

6

REFBP

C720

0.01u

EUSY0263101

LDO1

LDO2

M1

M2

M3

M4

F1

F2

F3

F4

27

25

4

5

12

11

10

9

16

15

14

13

C714

1u

C716

1u

C721

2.2u

C722

2.2u

C717

10u

VOUT

BLED1

BLED2

BLED3

BLED4

FLED

VCAM_2.6V

VCAM_1.8V

2 3 4 5 6 7 8 9

10 11 12 13

MICRO SD I/F-TransFLASH

14

0

R701

4

5

6

PLR0504F

D701

3

2

1

C701 0.1u

C702 33p

C703 33p

C704 33p

1

2

3

D702

6

5

4

S700

ENSY0018601

49448-1611

S8

T8

T7

T6

T5

T4

T3

T2

T1

S4

3

2

1

5

4

10

9

8

7

6

ST1

ST2

17

18

PLR0504F

1

2

D706

3

PLR0504F

6

5

4

1

2

D703

3

6

5

4

PLR0504F

LGMC

15 16

SDMC_DAT1

SDMC_DAT0

SDMC_CLK

SDMC_CMD

SDMC_DAT3

SDMC_DAT2 nTF_DETECT

D

E

C

A

B

C

D

E

F

LG Electronics Inc.



- 159 -



A

B

C

1 2 3 4

VPWR

KPD_ROW4

INTERNAL_MIC_P

TOUCH_Y2YU

TOUCH_X2XL

TOUCH_Y1YD

TOUCH_X1XR

KPDPWR_ON

FPCB_KEYPAD to SUB Connector

15

14

13

12

20

19

18

17

16

27

26

25

24

23

22

21

11

10

9

8

7

6

5

4

3

2

1

FPCB_EDGE_CONN

KPD_DRV_N

LEDCR1

LEDCG1

LEDCB1

KPD_COLUMN2

KPD_COLUMN1

KPD_COLUMN0

KPD_ROW3

KPD_ROW2

KPD_ROW1

KPD_ROW0

5

D

E

F

C

D

E

F

1

LG(42)-A-5505-10:01

2

KPD_COLUMN1

Button

Volume Up

KB100

KPD_ROW1

Volume Down

KB101

KPD_ROW2

Function Key

KB102

KPD_ROW3

D111

PRSB6.8C

SEND

KB104

D112

PRSB6.8C

KPD_ROW4

Power Button

KB105

KPDPWR_ON

3 4 5

6

6

7 8 9 10 11 12 13 14 15 16

Camera Button

KPD_COLUMN2

KPD_ROW1

KPD_ROW2

4 1

3 2

SW100

LS50D23

ESCY0004201

END Button

KB103

KPD_COLUMN2

KPD_ROW0

D110

PRSB6.8C

7 8 9

CN100

1

2

OSF213-42DC

SUMY0010508

MIC Connector

INTERNAL_MIC_P

TOUCH SCREEN CONNECTOR

CN101

G2

4

3

2

1

6

5

G1

ENQY0008602

04-6298-006-000-883

TOUCH_Y2YU

TOUCH_X2XL

TOUCH_Y1YD

TOUCH_X1XR


VPWR

LEMC-S11G LD100

LEDCB1

LEDCR1

LEDCG1

BLUE

RED

GREEN

VPWR

Power Keypad LED

100ohm R100

100ohm R101

100ohm R102

100ohm R103

LD101

SSC-TWH104-HLS

LD102

SSC-TWH104-HLS

LD103

SSC-TWH104-HLS

LD104

SSC-TWH104-HLS

KPD_DRV_N

D107

PRSB6.8C

WLAN ANTENNA

SW101

20369-001E

G1

G2

G3 ANT

ENWY0005601

ISCA TYPE

KPD_COLUMN0

5-Way Key

C

COM1

D

A

B

E

SW102

EVQQ7GA50

ESCY0004001

D

E

F

C

KPD_ROW0

KPD_ROW1

KPD_ROW2

KPD_ROW3

KPD_ROW4

D

E

A

B

C

LG Electronics Inc.

LGMC


- 160 -




1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

D

E

F

A

B

C

C

D

CAM_PCLK nCAM_RST

I2C_SDA

I2C_SCL

VCAM2_2.6V

VCAM3_2.6V

CAM_2M_PWDN

2M CAM CONNECTOR (T=0.9. SOCKET)

1

2

9

10

11

12

5

6

7

8

3

4

13

14

15

16

17

CN102

G1 G2

34

33

27

26

25

24

23

22

21

32

31

30

29

28

20

19

18

G3 G4

ENBY0015601

AXK7L34227G

CAM_DATA7

CAM_DATA6

CAM_DATA5

CAM_DATA4

CAM_DATA3

CAM_DATA2

CAM_DATA1

CAM_DATA0

CAM_MCLK

CAM_VSYNC

CAM_HSYNC

VCAM_1.8V

VCAM1_2.6V

VGA CAM CONNECTOR

CAM_VGA_PWDN

CAM_MCLK

CAM_PCLK

CAM_DATA0

CAM_DATA1

CAM_DATA2

CAM_DATA3

CAM_DATA4

CAM_DATA5

1

2

7

8

9

10

5

6

3

4

CN101

20

19

18

17

16

15

14

13

12

11

ENBY0039601

GB042-20S-H10-E3000 nCAM_RST

I2C_SCL

I2C_SDA

CAM_HSYNC

CAM_VSYNC

CAM_DATA7

CAM_DATA6

VCAM3_2.6V

VCAM1_2.6V

E

F

1

LG(42)-A-5505-10:01

2 3



4 5 6 7 8 9

- 161 -

VCAM2_2.6V

VCAM3_2.6V

CAM_PCLK nCAM_RST

CAM_2M_PWDN

CAM_VGA_PWDN

I2C_SDA

I2C_SCL

FPCB to SUB Connector

1

5

6

7

8

2

3

4

9

10

11

12

13

14

15

16

17

CN103

G1

G2

34

28

27

26

25

24

23

22

33

32

31

30

29

21

20

19

18

CAM_DATA7

CAM_DATA6

CAM_DATA5

CAM_DATA4

CAM_DATA3

CAM_DATA2

CAM_DATA1

CAM_DATA0

CAM_MCLK

CAM_VSYNC

CAM_HSYNC

VCAM_1.8V

VCAM1_2.6V

LGMC

LG Electronics Inc.


D

E

F

A

B

C

C

D

E


- 162 -



8. BGA IC PIN MAP

8.1 MSM7200 (EUSY0318901) : U101-1, U101-2


Fig.1 MSM7200 Pin Function Map (Top View)



- 163 -



MSM7200 (EUSY0318901) : U101-1, U101-2


: Us ed

: Not us ed

Fig.2 MSM7200 Pin Map (Bottom View)

- 164 -



8.2 KAL009001M-D1YY (EUSY0316502) : U201


: Us ed

: Us ed

: Not us ed

Fig.3 KAL009001M Pin Map (Top View)



- 165 -



8.3 PM7540 (EUSY0342201) : U304

Fig.4 PM7540 Pin Function Map (Top View)


- 166 -



PM7540 (EUSY0342201) : U304


: Us ed

: Not us ed

Fig.5 PM7540 Pin Map (Bottom View)



- 167 -



8.4 BCM2048SKUFBG (EUSY0319601) : U403

: Used

: Not us ed

Fig.4 BCM2048 Pin Map (Bottom View)


- 168 -



9. PCB LAYOUT

FL503 ACMD7602

Can’t make a call

Low UMTS Tx Power

Low UMTS Rx Sensitivity

No Service

FL500 FEM

Can’t make a call

Low Tx Power

Low Rx Sensitivity

No Service

U500 RTR6275

(UMTS/GSMTransceiver)

Can’t make a call

Low Tx Power

Low Rx Sensitivity

No Service



- 169 -

U503 ACPM-7381

UMTS PAM

Low UMTS Tx Power

U403 BCM2048

No Bluetooth/FM Radio

Functions

U501 TQM7M5008

GSM TX Dual PAM

Low GSM Tx Power

X500 TCXO 19.2MHz

No Boot

CN400 Main to Sub 90P Con

No LCD/Camera/WLAN/

Touch/Key/Speaker/

Vibrator Functions

CN301

No Boot


9. PCB LAYOUT

LD400

No Camera Flash LED

X400

No Bluetooth/FM Function

U304(PMIC)

No Power On

No USB/USIM Function

ANT400

Low Bluetooth Tx Power

Low Bluetooth Rx Sensitivity

X300(32.768kHz)

RTC Reset

U303

No USB Function

U301

No UART Function

No Bluetooth Power On


U401

Low Speaker Sound

U400

No Speaker/Receiver Sound

U402

No Headset Sound

U100 (BB/Modem)

No Power/Boot On

No Display No Service

U201(Memory)

No Boot

U300

No TA/USB Charging

U302

No TA Charging

- 170 -



9. PCB LAYOUT

U702

No Camera On

No Backlight/Flash On

X600

Can’t make WLAN/Bluetooth

Sleep



- 171 -

CN701

No Speaker/Receiver Sound

CN600

No Touch/Camera

Shutter/LED/SEND/

END/Power/Jog Key

Functions


9. PCB LAYOUT

CN601

No 2M/VGA Camera

Functions

S700

No USIM/T-Flash Functions

CN602

No LCD/Camera/WLAN/

Touch/Key/Speaker/

Vibrator Functions

CN603

Low WLAN Tx Power

Low WLAN Rx Sensitivity


CN700

No Vibrator Function

M600

No WLAN Function

CN702

No Display

- 172 -



9. PCB LAYOUT

CN103

No 2M/VGA Camera

Functions

CN101

No VGA Camera Function

CN102

No 2M AF Camera Function



- 173 -


9. PCB LAYOUT

KB100

No Volume Up Key

KB101

No Volume Down Key

SW102

No 5-Way Key / Navigation

Key

LD102

No Key LED On

KB104

No SEND Key

CN100

Tx Mute

No Record Function

CN101

No Touch Function


- 174 -

LD100

No Indicator LED On

KB105

No Power On

No Sleep/Resume Function

KB102

No Function Key

KB103

No END Key

SW100

Can’t take a picture

No AF Function

LD103

No Key LED On

SW101

WLAN connector Low WLAN

Tx Power


ANT100

Low WLAN Tx Power




9. PCB LAYOUT



- 175 -



- 176 -



9. Calibration & RF Auto Test Program (Hot Kimchi)


9.1 Configuration of HOT KIMCHI

9.1.1 Configuration of directory

C:

Cm_Grut Common Qualcomm

Log

At_Serial_Cmd.xml

Diag_Common.dll

DLL_E5515CD.DLL

DLL_PwrControlD.dll

Dll_SerialATD.dll

LG_CL_019.dll

PwrSupply_Cmd.xml

Diag_NV6280.dll

Diag_NV.dll

Debug Auto

Cal

CalAuto

KS20

KS20

KS20

: Directory

: File



- 177 -



: Directory

: File

Hot_Kimchi Log

ComLMPLib_1_11.dll

ComLMPLib_2_11.dll

Dll_EzLooksMQ_015.dll

GuiTk115d.dll

HK_33.exe

ShieldBox_DllD.dll

Model KS20

LG_NsTest_E5515C_241.dll

LG_RfTest_E5515C_108.dll

QMSL_MSVC6R.dll

Log

AutoSetup_001.xml

Cal_Setup_Test.xml

Ezlooks.xml

LG_RfCal_Q3G6280TRev_100.dll

NstProcedure_KS20_001.xml

script_001.xml

Spec_FullBand_013.xml


- 178 -



: Directory

: File

9. Calibration & RF Auto Test Program (Hot Kimchi) dll,ocx

Result

UI

Multi_HK.reg

(Win98)MFCD DLL COPY.bat

(Win2000)MFCD DLL COPY.bat

(WinXP)MFCD DLL COPY.bat

MFC42D.DLL

MFCD42D.DLL

MFCN42D.DLL

MFCO42D.DLL

MSVCP60D.DLL

MSVCRTD.DLL

Vsflex7L.ocx

vsflex7l_ocx_regist.bat

Auto

Cal

CalAuto

LG_UI_Qu6275_004.dll

KS20

KS20

KS20



- 179 -



9.2 How to use HOT KIMCHI

1

2

3

* Procedure

1. Click “Logic Operation” of “SETTING” menu bar

2. Select “UART Port” that PC can communicate with the phone

3. Select “LOGIC MODE” that you want

- Logic Mode -> 1: Calibration Only

2: Auto Test Only

3: Calibration + Auto


- 180 -




* Procedure

4. Select the model name “KS20”

5. Click “Start” button

5

Click "Start"

4

Select "KS20"



- 181 -


10. Phone Test Mode _ 3G smart Phone KS20


1. Run Dialer, then insert “2676625720#” by tapping keypad

2. Tap 3. Device Test

3. Tap 6. Q_Test Program

4. Tap PTM(Phone Test Mode) Button.


- 182 -




Phone Test Mode Scenario_ 3G smart Phone KS20(1)

Item Order

* Phone Test mode

(1) Camera Test

Description

1

2

Internal Camera

Off

Internal Camera

On

3

Internal(Front)

Recording

& Save

To start, press "Send" button

Internal Camera Record for 3 seconds.

Recorded file is saved in

/My Documents/My Pictures



- 183 -



Phone Test Mode Scenario_ 3G smart Phone KS20(2)

Item

(1) Camera Test

Order

4

External Camera

Off

5

External Camera

On

6

External(Rear)

Camera Preview

7

External(Rear)

Recording

& Save

Description

Flash LED Always ON during External camera testing

For next test, press "SEND" button


- 184 -




Phone Test Mode Scenario_ 3G smart Phone KS20 Case(3)

Item

(2) External

Memory

Test

1

Check On

Break

Order

(3) File Transfer

1

Check On

Break

(4) Indicator LED

Test

1

Color Test

Break

Description

Test Creating/Writing/Deleting a file in /Storage card. if Pass, move next test automatically.

if not, the test is stopped.

z

SD card should be inserted!!

Test Creating/Writing/Deleting a file in root(/) if Pass, move next test automatically.

if not, the test is stopped.

Red / Green / Blue

1) Red LED ON

2) If OK, press ìS end

3) Green LED ON


5) Blue LED ON




- 185 -




Item

(5) Vibrator Test

Order

1

Vibrator On

Break

2

Vibrator Off

Description

Vibrating by pressing "Send" Key


- 186 -





Item

(6) Key Press Test

Order

Description

OK

- Press a key that Red arrow indicate

(7) Acoustic Loop

Test

Break

(8) Sound Test

Break

1. Enable Handset acoustic loop Test

2. Enable Headset acoustic loop Test

Ringtone(MP3) is played repeatly.



- 187 -



- 188 -



11. EXPLODED VIEW & REPLACEMENT PART LIST

11.1 EXPLODED VIEW

5

3

2

4

7 8

9

59

73

1

12

64

13

26

6

15

17

60

55

31

21

29

30

23

32

16

24

25

40

19

20

62

22

72

28

75

10

61

27

54

11

63

74

41

67

43

14

44

18 71 70

34

33

39

77

78

42

38

66

58

65

36

68

37

56

46

69

45

48

50 52 53

78

76

47

49 51 35

57



- 189 -

MGAD0137801


ASS'Y EXPLODED VIEW

A

D

F

G

I

H

J

B

C

E

P

Q

R

S

B'

D'

E'

K

L

M

N

T

U

Y

V

Z

C'

W

A'

O

X

F'

D

C

F

E

B

A

I

H

K

J

G

P

O

N

M

L

U

T

S

R

Q

Z

Y

X

W

V

F'

E'

D'

C'

B'

A'


- 190 -




11.2 Replacement Parts

<Mechanic component>

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level

3

4

1

2

4

4

4

4

4

4

4

4

4

3

4

5

5

5

5

5

5

5

5

5

5

5

5

5

5

5

5

5

5

Location

No.

Description

GSM,BAR/FILP

AAAY00 ADDITION

MLAZ00 LABEL

MDAD00 DECO,CAMERA

Part Number

TGSM0048902

AAAY0257802

Spec

MLAZ0037104 PRINTING, (empty), , , , ,

MDAD0028901 ELECTROFORMING, Cu, 0.2, , , ,

MPBZ00 PAD

MPBZ01 PAD

MTAB00 TAPE,PROTECTION


MTAZ00 TAPE

MTAZ01 TAPE

MTAZ02 TAPE

MWAE00 WINDOW,CAMERA

MPBZ0175301

MPBZ0175401

MTAB0185501

MTAB0185601

MTAZ0184801

MTAZ0191001

MTAZ0191101

MWAE0024201

COMPLEX, (empty), , , , ,







CUTTING, PMMA MR 200, , , , ,

MWAH00 WINDOW,FLASH MWAH0008501 MOLD, PC LUPOY GP-1000L, , , , ,

ACHA00 COVER SUB ASSY,FRONT ACHA0002502

ACGK00 COVER ASSY,FRONT ACGK0101602

MBFF00 BRACKET,LCD

MBJC00 BUTTON,FUNCTION

MBJL00 BUTTON,SIDE

MBJN00 BUTTON,VOLUME

MBJP00 BUTTON,SHUTTER

MCCC00 CAP,EARPHONE JACK

MCCG00 CAP,MULTIMEDIA CARD

MCJK00 COVER,FRONT

MICA00 INSERT,FRONT

MIDZ00 INSULATOR

MIDZ01 INSULATOR

MIDZ02 INSULATOR

MLAB00 LABEL,A/S

MLAR00 LABEL,WARNING

MLEA00 LOCKER,BATTERY

MPBZ00 PAD

MSDC00 SPRING,LOCKER

MSIY00 SHAFT

MBFF0012401 MOLD, PA MXD6 RENY NXG5945S, , , , ,

MBJC0021601 COMPLEX, (empty), , , , ,

MBJL0039001 COMPLEX, (empty), , , , ,

MBJN0011801 COMPLEX, (empty), , , , ,

MBJP0006301 COMPLEX, (empty), , , , ,

MCCC0043001 COMPLEX, (empty), , , , ,

MCCG0007501 COMPLEX, (empty), , , , ,

MCJK0068701 MOLD, PC LUPOY SC-1004A, , , , ,

MICA0019901 M1.4 D2.2 L1.5

MIDZ0126601 COMPLEX, (empty), , , , ,



MLAB0001102 C2000 USASV DIA 4.0

MLAR0005301 COMPLEX, (empty), , , , ,

MLEA0037401 MOLD, PC LUPOY SC-1004A, , , , ,

MPBZ0190801 COMPLEX, (empty), , , , ,

MSDC0009201

MSIY0001101 CUTTING, STS, , , , ,

Color Remark

Black

Metal Silver

Silver

Black

Black

Transparent

Transparent

Black

Black

Black

Black

Milk

Black

Silver

Green

Green

White

Yellow

Silver

Black

Black

Silver

Silver

Silver

Silver

Silver

Black

Silver

Silver

Silver

Gold

Green



- 191 -



4

4

4

4

4

4

4

4

4

4

4

4

4

4

4

4

5

5

5

5

5

5

5

5

5

5

5

5

5

4

5

5

5

Level

Location

No.

MTAZ00 TAPE

Description

MTAZ01 TAPE

ACGN00 COVER ASSY,CAMERA

MBFP00 BRACKET,CAMERA

MTAK00 TAPE,CAMERA

MTAK01 TAPE,CAMERA

MTAZ00 TAPE

MCJZ00 COVER

MFBC00 FILTER,SPEAKER

MFBD00 FILTER,MIKE

MICC00 INSERT,FRONT(UPPER)

MPBH00 PAD,MIKE

MPBN00 PAD,SPEAKER

MPBZ00 PAD

MPBZ01 PAD

MTAD00 TAPE,WINDOW

MTAF00 TAPE,MOTOR

MBJZ00 BUTTON

MGAD00 GASKET,SHIELD FORM




MIDZ00 INSULATOR

MIDZ01 INSULATOR

MIDZ02 INSULATOR

MKBZ00 KNOB

MLAZ00 LABEL

MPBU00 PAD,CONNECTOR

MPBU01 PAD,CONNECTOR

MPBZ00 PAD

MPBZ01 PAD


MWAC00 WINDOW,LCD

7 M600 MODULE,ETC

Part Number Spec

MTAZ0184401 COMPLEX, (empty), , , , ,


ACGN0006801

MBFP0006801 MOLD, PC LUPOY HI-1002M, , , , ,

MTAK0001701 COMPLEX, (empty), , , , ,

MTAK0003001 COMPLEX, (empty), , , , ,


MCJZ0039001 MOLD, PC LUPOY SC-1004A, , , , ,

MFBC0029301 COMPLEX, (empty), , , , ,

MFBD0022801 COMPLEX, (empty), , , , ,

MICC0010001 D2.2 L2.0 KURL 45

MPBH0030501 COMPLEX, (empty), , , , ,

MPBN0043201 COMPLEX, (empty), , , , ,



MTAD0067601 COMPLEX, (empty), , , , ,

MTAF0011101 CUTTING, NS, , , , ,

MBJZ0011001 COMPLEX, (empty), , , , ,

MGAD0137801 COMPLEX, (empty), , , , ,







MKBZ0002001 COMPLEX, (empty), , , , ,

MLAZ0038303 PRINTING, (empty), , , , ,

MPBU0001601 COMPLEX, (empty), , , , ,

MPBU0001701 COMPLEX, (empty), , , , ,



MTAB0200801 COMPLEX, (empty), , , , ,

MWAC0088503 COMPLEX, (empty), , , , ,

SMZY0015501

WLAN Module(IEEE 802.11b/g, 12mm*10mm*1.2mm,

Atheros chip)

Color

Black

Gold

Gold

Gold

Black

Green

Blue

Yellow

Silver

White

Black

Black

Black

Black

Transparent

Black

Black

Black

Black

Black

Black

Black

Black

Gold

Black

Black

Black

Black

Black

Black

Black

Black

Black

Remark


- 192 -




11.2 Replacement Parts

<Main component>


7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

4

5

6

6

Location

No.

Description

SACY00 PCB ASSY,FLEXIBLE

SACE00 PCB ASSY,FLEXIBLE,SMT

SACC00

PCB ASSY,FLEXIBLE,SMT

BOTTOM

D101

D102

DIODE,TVS

DIODE,TVS

D108 DIODE,TVS

D109 DIODE,TVS

SACD00

PCB ASSY,FLEXIBLE,SMT

TOP

Part Number

SACY0060901 MAIN FPCB

SACE0055401

SACC0034501

EDTY0008606

EDTY0008606

EDTY0008606

EDTY0008606

SACD0045101

Spec

DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE




ANT100

CN100

CN101

D103

D104

D105

D106

D107

D110

D111

D112

D113

D114

D115

D116

D117

D118

D119

LD100

LD101

LD102

LD103

LD104

R100

ANTENNA,GSM,FIXED

MICROPHONE

CONNECTOR,FFC/FPC

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,LED,7-SEG

DIODE,LED,CHIP

DIODE,LED,CHIP

DIODE,LED,CHIP

DIODE,LED,CHIP

RES,CHIP

SNGF0022802

3.0 ,-2 dBd, ,WLAN, SMD, 8.0*3.0*1.5, RDL 8.5, ISCA-

D5 ,; ,SINGLE ,-2.0 ,50 ,3.0

SUMY0010507 UNIT ,42 dB,4*1.35 ,SMD

ENQY0008602 6 PIN,0.5 mm,ETC ,AU ,H:1.2MM

EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE















EDLS0001102 7 ,3 DIGIT,R/TP ,R,G,B 1.6*1.6*0.4

EDLH0012501 Snow White ,1608 ,R/TP ,color concept




ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

Color

Black

Black

Black

Remark



- 193 -



7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

5

5

6

4

7

7

7

6

7

7

7

7

Level

Location

No.

R101

Description

RES,CHIP

R102

R103

RES,CHIP

RES,CHIP

SW100 SWITCH,TACT

7 SW101 CONN,RF SWITCH

SW102

VA100

VA101

SAJC00

SWITCH,TACT

VARISTOR

VARISTOR

SPCY00 PCB,FLEXIBLE

SAJY00 PCB ASSY,SUB

SAJB00 PCB ASSY,SUB,INSERT

SAJE00 PCB ASSY,SUB,SMT

PCB ASSY,SUB,SMT

BOTTOM

BAT700 BATTERY,CELL,LITHIUM

7

7

C609

C610

C611

C612

C613

C617

C618

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C624

CN601

CAP,CERAMIC,CHIP

CONNECTOR,BOARD TO

BOARD

CN602

CONNECTOR,BOARD TO

BOARD

CN603 CONN,RF SWITCH

7

7

CN700

CN702

D606

FB600 FILTER,BEAD,CHIP

FL602

FL603

L600

CONN,RECEPTACLE

CONNECTOR,FFC/FPC

DIODE,TVS

FILTER,EMI/POWER

FILTER,EMI/POWER

INDUCTOR,SMD,POWER


ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ESCY0004201 12 V,0.02 A,HORIZONTAL ,0.2 G,

ENWY0005601

,SMD , dB, ,; ,0.30MM ,STRAIGHT ,SOCKET ,SMD

,[empty] ,[empty] , ,

ESCY0004001 15 V,0.02 A,VERTICAL ,1.3 G,

SEVY0001001 14 V, ,SMD ,50pF, 1005

SEVY0001001 14 V, ,SMD ,50pF, 1005

SPCY0099601 POLYI ,0.2 mm,DOUBLE , ,; , , , , , , , , ,

SAJY0023601

SAJB0010601

SAJE0018001

SAJC0016401

SBCL0001701

2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi 4.8, Pb-Free

ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP





ECCH0000109 8 pF,50V,D,NP0,TC,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ENBY0015601 34 PIN,0.4 mm,STRAIGHT ,AU ,0.9MM HEIGHT

ENBY0035401 90 PIN,0.4 mm,ETC , ,H=3.0, Socket

ENWY0005601

,SMD , dB, ,; ,0.30MM ,STRAIGHT ,SOCKET ,SMD

,[empty] ,[empty] , ,

ENEY0003801 2 PIN, , ,

ENQY0014201

27 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FFC/FPC

,STRAIGHT ,BOTH ,SMD ,R ,LOCKING ,

EDTY0008501 TFSC ,5 V,50 W,R/TP ,small size

SFBH0000903 600 ohm,1005 ,

SFEY0007103

SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),

Pb-free

SFEY0007103


Pb-free

ELCP0010001

2.2 uH,M ,2.5x2.0x1.0 ,R/TP ,chip MLCI ,; , ,20% , , , , ,

,NON SHIELD ,2.5X2X1MM ,[empty] ,R/TP

Color

Black

Black

Black

Black

Remark


- 194 -




R651

R655

R656

R657

R658

S700

U600

R642

R644

R646

R648

R632

R633

R634

R638

R649

R650

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

Location

No.

L603

Description

INDUCTOR,CHIP

L700

L701

INDUCTOR,CHIP

INDUCTOR,CHIP

L702

L703

Q603

R629

INDUCTOR,CHIP

INDUCTOR,CHIP

TR,FET,N-CHANNEL

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

CONN,SOCKET

IC

7

7

7

7

7

7

7

7

6

7

7

U602

U603

U604

IC

IC

IC

SAJD00 PCB ASSY,SUB,SMT TOP

C608 CAP,CERAMIC,CHIP

C614

C615

C616

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C621

C622

C625

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP


ELCH0004705 8.2 nH,J ,1005 ,R/TP ,

ELCH0005019 68 nH,J ,1005 ,R/TP ,

ELCH0005019 68 nH,J ,1005 ,R/TP ,

ELCH0005019 68 nH,J ,1005 ,R/TP ,

ELCH0005019 68 nH,J ,1005 ,R/TP ,

EQFN0005601 ESM ,100 mW,30 V,100 mA,R/TP ,

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000466 33 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000295 51 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000466 33 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000466 33 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000466 33 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000466 33 Kohm,1/16W ,J ,1005 ,R/TP

ENSY0018601 16 PIN,ETC , ,2.54 mm,UIM 8P, Micro SD Dupli-Socket

EUSY0234701 SOT23-5 ,5 PIN,R/TP ,

EUSY0240001

MICROPAK ,6 PIN,R/TP ,SINGLE BIT UNIT-

DIRECTIONAL TRANSLATOR / PB FREE

EUSY0240001



EUSY0240001



SAJD0018501

ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP


ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP





Color Remark

Black



- 195 -



7

7

7

7

7

7

7

7

7

7

C720

C721

C722

C723

C724

C716

C717

C718

C719

C710

C711

C712

C713

C705

C706

C707

C709

C714

C715

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

Location

No.

C626

Description

CAP,CERAMIC,CHIP

C627

C700

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C701

C702

C703

C704

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CN600 CONNECTOR,FFC/FPC

D700

D701

D702

D703

D704

D705

D706

D707

D708

DIODE,SWITCHING

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS





ECZH0003504 100 nF,25V ,K ,X7R ,HD ,1608 ,R/TP

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP



ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP


ECZH0003504 100 nF,25V ,K ,X7R ,HD ,1608 ,R/TP

















ENQY0014201

27 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FFC/FPC

,STRAIGHT ,BOTH ,SMD ,R ,LOCKING ,

EDSY0009901 ESC ,80 V,300 A,R/TP ,1.6*0.8*0.6(t)

EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE








Color Remark


- 196 -




7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

Location

No.

D709

Description

DIODE,TVS

D710

D711

DIODE,TVS

DIODE,TVS

FB601

FB602

FILTER,BEAD,CHIP

FILTER,BEAD,CHIP

7 FL600 FILTER,EMI/POWER

FL604 FILTER,EMI/POWER

Q600

Q601

Q602

TR,FET,N-CHANNEL

TR,FET,N-CHANNEL

TR,FET,N-CHANNEL

Q604 TR,FET,P-CHANNEL

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R615

R616

R617

R618

R611

R612

R613

R614

R619

R620

R624

R605

R606

R607

R608

R600

R601

R602

R604

R609

R610

R625

R626

R635





SFBH0000903 600 ohm,1005 ,

SFBH0000903 600 ohm,1005 ,

SFEY0007103


Pb-free

SFEY0007103


Pb-free




EQFP0004501

SOT-323 ,.29 W,1.8 V,.86 A,R/TP ,P-Chanel MOSFET,

Pb free

ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000243 2200 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000243 2200 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000529 1.5 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000506 6800 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

Color Remark



- 197 -



7

7

7

7

7

7

7

6

4

7

7

R713

R714

R715

R716

R709

R710

R711

R712

R717

R718

R719

R730

R750

R751

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

Location

No.

R636

Description

RES,CHIP,MAKER

R637

R639

RES,CHIP,MAKER

RES,CHIP,MAKER

R652

R702

R703

R705

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

U601 IC 7

7 U605 IC

U700 IC

U701 IC

U702

U703

VA600

VA700

VA701

VA702

X600

IC

IC

VARISTOR

VARISTOR

VARISTOR

VARISTOR

OSCILLATOR

SPJY00 PCB,SUB

SJMY00 VIBRATOR,MOTOR


ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000466 33 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000466 33 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000466 33 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000466 33 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000466 33 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0000127 13K ohm,1/16W,F,1005,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000311 6800 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP

EUSY0239302

HVSOF6 ,6 PIN,R/TP ,300mA CMOS LDO WITH

OUTPUT CONTROL / 3.3V

EUSY0294901 SON1612-6 ,6 PIN,R/TP ,2.6V 150mA LDO Pb-Free

EUSY0240001




EUSY0263101

QFN (4x4) ,28 PIN,R/TP ,1x/1.5x/2x White LED Charger

Pump , 2 LDO and Flash LED


SEVY0003801 18 V, ,SMD ,

SEVY0004401 18 V, ,SMD ,40pF, 1005

SEVY0004401 18 V, ,SMD ,40pF, 1005

SEVY0004101 5.6 V, ,SMD ,360pF, 1005

EXSY0020701 32.768 KHz, PPM,15 pF,SMD ,3.6*2.8(2.4)*1.1 ,

SPJY0039401 FR-4 ,0.8 mm,BUILD-UP 6 , ,; , , , , , , , , ,

SJMY0008407 3 V,80 mA,10*2.7 ,17mm Elco8000 ,; ,3V , , ,12000 , , , ,

Color Remark


- 198 -




4

3

3

3

4

4

3

4

4

5

3

4

5

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

4

4

4

Location

No.

SNGF00 ANTENNA,GSM,FIXED

SUSY00

SVLM00

Description

SPEAKER

LCD MODULE

SWCC00 CABLE,COAXIAL

AFBA00 FRAME ASSY,SHIELD

MFEA00 FRAME,SHIELD


MIDZ00 INSULATOR

GMEY00 SCREW MACHINE,BIND

MEBY00 EJECTOR

MLAA00 LABEL,APPROVAL

SAFY00 PCB ASSY,MAIN

SAFB00 PCB ASSY,MAIN,INSERT

SAFF00 PCB ASSY,MAIN,SMT

MLAZ00 LABEL

SAFC00

PCB ASSY,MAIN,SMT

BOTTOM

ANT400 ANTENNA,GSM,FIXED

C112

C113

C200

C201

C108

C109

C110

C111

C202

C203

C100

C101

C103

C105

C106

C107

C204

C205

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP


SNGF0024802

3.0 ,-2 dBd, ,GSM900/1800/1900+WCDMA2100,

INTERNAL, GOLD ,; ,QUAD ,-2.0 ,50 ,3.0

SUSY0026601 PIN ,8 ohm,88 dB, mm, ,; , , , , , ,18*10*3T ,PIN

SVLM0024501

MAIN ,240*320 (2.8") ,48.3*68*2.5(t) ,262k ,TFT ,TM

,S6D0165 (SEC) ,VA, MDDI

SWCC0004101

74.5 mm, LINE,Height 1.5T including RF switch ,;

,[empty] ,[empty] ,0.075M , ,BLACK , ,N

AFBA0006601

MFEA0014501 MOLD, PC LUPOY HI-1002M, , , , ,



GMEY0010601 1.4 mm,2.5 mm,MSWR3(BK) ,N ,+ ,NYLOK

MEBY0000201 PRESS, STS, , , , ,

MLAA0050601 COMPLEX, (empty), , , , ,

SAFY0188202

SAFB0069902

SAFF0117502

MLAZ0038301 PID Label 4 Array

SAFC0088301

SNGF0022801

3.0 ,-2 dBd, ,BLUETOOTH, SMD, 8.0*3.0*1.5, RDR 7.5,

ISCA-D5 ,; ,SINGLE ,-2.0 ,50 ,3.0

ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP



ECCH0000149 3.3 nF,50V,K,X7R,HD,1005,R/TP















Color

Black

Silver

Gold

Blue

Black

Aluminum

Silver

White

Black

Black

Without Color

Black

Remark



- 199 -



6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

C206

Description

CAP,CHIP,MAKER

C207

C208

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C209

C210

C211

C212

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C227

C228

C229

C230

C223

C224

C225

C226

C301

C304

C305

C217

C218

C219

C220

C213

C214

C215

C216

C221

C222

C318

C319

C320

C321

C322

C312

C313

C314

C317

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,TANTAL,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER




























ECTH0004101 22 uF,6.3V ,M ,STD ,1608 ,R/TP



ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP








Color Remark


- 200 -




6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

C323

Description

CAP,CHIP,MAKER

C324

C325

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C326

C327

C328

C329

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C344

C345

C346

C347

C340

C341

C342

C343

C348

C349

C350

C334

C335

C336

C337

C330

C331

C332

C333

C338

C339

C355

C356

C357

C358

C360

C351

C352

C353

C354

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP




















ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP



















Color Remark



- 201 -



6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

C400

Description

CAP,CHIP,MAKER

C401

C402

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C403

C405

C406

C407

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

D102

D300

D301

D302

C408

C409

C410

C411

D303

D310

D311

6

6

6

6

6

6

6

6

6

6

6

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,SWITCHING

DIODE,TVS

FL400 FILTER,CERAMIC 6

6 L300 INDUCTOR,CHIP

6 L303 INDUCTOR,SMD,POWER

6

6

L304 INDUCTOR,SMD,POWER

L305

L306

L400

L405

INDUCTOR,SMD,POWER

LD400 DIODE,LED,MODULE

Q300 TR,BJT,PNP

R100

R102

R103

R104

R105

R106

INDUCTOR,SMD,POWER

INDUCTOR,CHIP

INDUCTOR,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER







ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP



ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP


ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP






EDSY0010501 ESC ,30 V,100 mA,R/TP ,SWITCH DIODE


SFCY0000901

2450 MHz,2.00*1.25*0.95 ,SMD ,Bluetooth Band Pass

Filter

ELCH0005019 68 nH,J ,1005 ,R/TP ,

ELCP0008004

4.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD

,2.5X2X1MM ,11MM ,R/TP

ELCP0008004



ELCP0008004



ELCP0008004



ELCH0004709 3.3 nH,S ,1005 ,R/TP ,

ELCH0001041 10 nH,S ,1005 ,R/TP ,PBFREE

EDLM0008803 WHITE ,1 LED,3.5*2.8*1.0 ,R/TP ,PB-FREE

EQBP0006501 VMT3 ,150 mW,R/TP ,

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000243 2200 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000270 33 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000270 33 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000286 4700 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000243 2200 ohm,1/16W ,F ,1005 ,R/TP

Color Remark


- 202 -




6

6

6

6

6

6

6

6

R400

R401

R402

R403

R404

R405

U100

R310

R313

R314

R315

R301

R304

R308

R309

R316

R317

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

R107

Description

RES,CHIP,MAKER

R108

R110

RES,CHIP,MAKER

RES,CHIP,MAKER

R111

R112

R200

R201

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

IC

6 U201 IC

6 U300 IC

U301 IC

U302

U303

U304

U400

U401

IC

IC

IC

IC

IC

U402 IC

X300 X-TAL


ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0003901 .1 ohm,1/4W ,F ,2012 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0004201 121000 ohm,1/16W ,F ,1005 ,R/TP

ERHY0000105 51 ohm,1/16W,F,1005,R/TP

ERHZ0000509 75 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000238 200 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000287 47 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000287 47 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000237 20 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000237 20 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000495 56 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000495 56 ohm,1/16W ,J ,1005 ,R/TP

EUSY0318901 CSP ,543 PIN,R/TP ,HSUPA & Convergence Platform

EUSY0316502

FBGA ,137 PIN,ETC ,FULLY 1.8V 2G(LB/256Mx8)

NAND+1G(DDR/8Mx4x32) SDRAM , ,IC,MCP

EUSY0332901

WDFN ,8 PIN,R/TP ,-12V, 6.3A, Single P-MOSFET &

DUAL Transistor

EUSY0342401

WQFN16 ,16 PIN,R/TP ,Dual DPDT Analog Switch ,;

,IC,Analog Switch

EUSY0333701 TLLGA ,8 PIN,R/TP ,OVP

EUSY0308803 TDFN ,10 PIN,R/TP ,Analog S/W

EUSY0342201 CSP ,137 PIN,R/TP ,PMIC, for MSM7xxx ,; ,IC,PMIC

EUSY0303501 MicroPak ,10 PIN,R/TP ,1.6*2.1mm

EUSY0196101 BUMP MICRO SMD ,9 PIN,R/TP ,1W AUDIO AMP

EUSY0261501

WCSP ,16 PIN,R/TP ,80-mW Capless Stereo Headphone

Driver

EXXY0018701

32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9

,

Color Remark



- 203 -



Level

6

6

6

6

6

6

5

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Location

No.

X400

C315

C501

C502

C503

C504

C424

C425

C426

C500

C505

C507

C418

C419

C420

C421

C316

C414

C415

C417

C422

C423

C508

C509

C510

C511

C512

C513

X-TAL

Description

SAFD00 PCB ASSY,MAIN,SMT TOP


C306

C307

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C308

C309

C310

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP


CAP,TANTAL,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP


EXXY0024401

26 MHz,10 PPM,10 pF,.5 ohm,SMD ,32*25*0.6 ,. ,. ,.

,10PPM ,10 ,. ,. ,SMD ,P/TP

SAFD0087601




ECCH0000138 390 pF,50V,K,X7R,HD,1005,R/TP

ECCH0000138 390 pF,50V,K,X7R,HD,1005,R/TP



ECTH0005501

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,-55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]














ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP


ECZH0000839 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP







ECCH0000105 4 pF,50V,C,NP0,TC,1005,R/TP




Color

Black

Remark


- 204 -




6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

C514

Description

CAP,CHIP,MAKER

C515

C516

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C517

C518

C519

C520

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C536

C537

C538

C539

C532

C533

C534

C535

C540

C541

C542

C526

C527

C528

C529

C521

C523

C524

C525

C530

C531

C547

C548

C549

C550

C551

C543

C544

C545

C546

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,TANTAL,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP





















ECTH0004101 22 uF,6.3V ,M ,STD ,1608 ,R/TP










ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP

ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP






Color Remark



- 205 -



6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

C552

Description

CAP,CERAMIC,CHIP

C553

C554

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C555

C556

C557

C558

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

6

C559

C560

C561

C563

C565

C566

CN300

CN301

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CONNECTOR,I/O

CONNECTOR,ETC

CN400

CONNECTOR,BOARD TO

BOARD

D100

D101

D103

DIODE,SWITCHING

DIODE,SWITCHING

DIODE,TVS

D304

D305

D306

D307

DIODE,TVS

DIODE,TVS

DIODE,TVS

DIODE,TVS

D308

D309

DIODE,TVS

DIODE,TVS

D400 DIODE,TVS




FL300 FILTER,EMI/POWER

6 FL500 FILTER,SEPERATOR

6

6

FL501

FL502

FILTER,SAW

FILTER,SAW




ECCH0000104 3 pF,50V,C,NP0,TC,1005,R/TP


ECCH0000133 220 pF,50V ,K ,X7R ,HD ,1005 ,R/TP









ENRY0006001 18 PIN,0.4 mm,ETC , ,H=2.5

ENZY0018901 4 PIN,3.0 mm,ETC , ,H=2.0

ENBY0035301 90 PIN,0.4 mm,ETC , ,H=3.0, Header






EDTY0007401 SMD ,12 V,350 W,R/TP ,





SFBH0000903 600 ohm,1005 ,

SFBH0000903 600 ohm,1005 ,

SFBH0008101 600 ohm,1005 ,

SFEY0006501 SMD ,3 TERMINAL EMI FILTER

SFAY0010001

900.1800 ,1900.2100 ,3.5 dB,3.5 dB,25 dB,25 dB,ETC

,GSM Triple,UMTS Single, 5.4X4.0 Size Rx FEM

SFSY0030201

897.5 MHz,1.4*1.1*0.6 ,SMD ,Pbfree_SAW_GSM900_Tx

SFSY0031201

2140 MHz,1.4*1.1*0.62 ,SMD ,2110M~2170M, IL 2.0,

5pin, U-B, 50-100_10, WCDMA BAND I Rx ,; ,2140

,1.4*1.1*0.62 ,SMD ,R/TP

Color Remark


- 206 -




Level

Location

No.

6 FL503

Description

DUPLEXER,IMT

FL504 FILTER,SAW

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

L520

L521

L522

L523

L516

L517

L518

L519

L524

R101

R311

R312

R406

R420

L510

L511

L512

L513

L506

L507

L508

L509

L514

L515

L501

L502

L503

L504

L505

L301

L402

L403

L500

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6


SDMY0001301

1950 MHz,2140 MHz,1.6 dB,2.0 dB,53 dB,44 dB,3.0*2.5*1.2 ,SMD ,FBAR, WCDMA duplexer ,; ,2140

,44 ,1950 ,53 ,2.0 ,1.6 ,3.0X2.5X1.2 ,DUAL ,SMD ,R/TP

SFSY0031101

1950 MHz,1.4*1.1*0.62 ,SMD ,RF Filter for WCDMA

2Ghz ,; ,1950 ,1.4*1.1*0.62 ,SMD ,P/TR

ELCH0010402 270 nH,M ,1005 ,R/TP ,CHIP

ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0012503 56 nH,J ,1005 ,R/TP ,1005,Coil-type,J

ELCH0001420 3.9 nH,S ,1005 ,R/TP ,PBFREE

ELCH0004710 15 nH,J ,1005 ,R/TP ,

ELCH0004727 100 nH,J ,1005 ,R/TP ,


ELCH0004710 15 nH,J ,1005 ,R/TP ,


ELCH0005014 5.6 nH,S ,1005 ,R/TP ,

ELCH0005003 12 nH,J ,1005 ,R/TP ,

ELCH0005014 5.6 nH,S ,1005 ,R/TP ,

ELCH0004715 27 nH,J ,1005 ,R/TP ,

ELCH0004725 33 nH,S ,1005 ,R/TP ,

ELCH0004715 27 nH,J ,1005 ,R/TP ,

ELCH0001427 2.2 nH,S ,1005 ,R/TP ,Pb Free

ELCH0004713 6.8 nH,J ,1005 ,R/TP ,

ELCH0004701 12 nH,J ,1005 ,R/TP ,


ELCH0004703 1 nH,S ,1005 ,R/TP ,

ELCH0004703 1 nH,S ,1005 ,R/TP ,

ELCH0004709 3.3 nH,S ,1005 ,R/TP ,

ELCH0004703 1 nH,S ,1005 ,R/TP ,

ELCH0004703 1 nH,S ,1005 ,R/TP ,

ELCH0003815 2.7 nH,S ,1005 ,R/TP ,

ELCH0005013 4.7 nH,S ,1005 ,R/TP ,

ELCH0003824 10 nH,J ,1005 ,R/TP ,chip inductor,PBFREE

ELCH0001409 10 nH,J ,1005 ,R/TP ,PBFREE

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000222 150 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP

Color Remark



- 207 -



6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

R421

Description

RES,CHIP,MAKER

R501

R502

RES,CHIP,MAKER

RES,CHIP,MAKER

R503

R504

R506

R507

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R508

R509

R510

R511

R512

R513

R514

R515

R516

R517

R518

R519

R520

R521

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

SPFY00 PCB,MAIN

SW500 CONN,RF SWITCH

U403 IC

U500 IC 6

6

6

U501

U502

PAM

COUPLER,RF

DIRECTIONAL

6 U503 PAM

VA300

VA301

VA302

VARISTOR

VARISTOR

VARISTOR

X500 VCTCXO

ZD300 DIODE,TVS


ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000212 12 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000456 2.2 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000456 2.2 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000428 18 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000458 300 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000458 300 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000428 18 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000458 300 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000458 300 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000509 75 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP

SPFY0143401 FR-4 ,0.8 mm,STAGGERED-10 , ,; , , , , , , , , ,

ENWY0002301 ANGLE ,SMD ,0.8 dB,

EUSY0319601 SKUFBG ,80 PIN,R/TP ,Bluetooth+FM (5.5*5.5*0.6)

EUSY0300501

QFN ,56 PIN,R/TP ,GSM, WCDMA Single RF

Transceiver, 8X8X0.9

SMPY0016501 dBm, %, A, dBc, dB, ,SMD , ,; , , , , , , , ,R/TP ,R/TP ,

SCDY0003402

-20 dB,-0.25 dB,-35 dB,1.0*0.58*0.35 ,SMD ,1850M ~

1910M, 4pin, Pb Free

SMPY0015501

28 dBm,40 %,90 mA,-40 dBc,26.5 dB,4x4x1.1 ,SMD

,MSM6280. Tr Switch Func included ,; , , , , , , , ,R/TP

,R/TP ,10

SEVY0004401 18 V, ,SMD ,40pF, 1005

SEVY0001001 14 V, ,SMD ,50pF, 1005

SEVY0003801 18 V, ,SMD ,

EXSK0007802

19.2 MHz,1.5 PPM,10 pF,SMD ,3.3*2.5*1.0 , ,; , ,2PPM

,2.8V , , , , ,SMD ,P/TP

EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE

Color Remark


- 208 -




11.3 Accessory


Level

3

Location

No.

Description

ADEY00 DATA KIT

4

4

3

MCHZ00

MEAY00

COMPACT DISK

ENVELOPE

SBPP00

BATTERY PACK,LI-

POLYMER

3

3

3 SGDY00 DATA CABLE

SGEY00

EAR PHONE/EAR MIKE

SET

SSAD00 ADAPTOR,AC-DC

ADAPTOR,AC-DC

ADAPTOR,AC-DC

ADAPTOR,AC-DC

ADAPTOR,AC-DC

ADAPTOR,AC-DC

Part Number Spec Color

ADEY0009710

MCHZ0041101

KS20 CD assy for SFR


MEAY0000401 PRINTING, (empty), , , , ,

SBPP0023301

3.7 V,1050 mAh,1 CELL,PRISMATIC ,KS20 BATT,

PCM(Fuel guage), Pb-Free ,; ,3.7 ,1050 ,0.2 ,PRISMATIC

,40x42x57 , ,ALLTEL SILVER ,Innerpack ,Europe Label,

Fuel IC

SGDY0010904

; ,[empty] ,[empty] ,[empty] ,18 ,BLACK ,6.2mm Plug

Datacable ,[empty]

SGEY0005544

; ,10mW ,16ohm ,111dB ,20HZ ,20HZ ,[empty] ,BLACK

,18P MMI CONNECTOR ,Plug Mold( Abnormal)

,Earphone,Stereo

Without Color

SILVER

SNOW

Without Color

SSAD0021002 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug




SSAD0021008

100-240V ,5060 Hz,4.8 V,0.9 A,CE&CB ,18pin Plug ,; , , ,

, , ,[empty] ,I/O CONNECTOR ,

SSAD0021009

100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug ,; , ,

, , , ,[empty] ,I/O CONNECTOR ,

Remark



- 209 -


Note

Note

LG KS20 mobile phone Service manual

Assistant Bot

Table Of Contents

- 3 -

1.1 Purpose

1.2 Regulatory Information

A. Security

B. Incidence of Harm

C. Changes in Service

D. Maintenance Limitations

E. Notice of Radiated Emissions

F. Pictures

G. Interference and Attenuation

H. Electrostatic Sensitive Devices

ATTENTION

2.1 System Overview

2. PERFORMANCE

2.2 Usable environment

1) Environment

Item

Specification

2) Environment (Accessory)

Reference

Spec.

Min

Typ.

Max

Unit

2.3 Radio Performance

1) Transmitter - GSM Mode

No Item

- 8 -

GSM DCS & PCS

2) Transmitter - WCDMA Mode

3)Receiver - GSM Mode

4) Receiver - WCDMA Mode

2.4 Current Consumption

1) KS20 Current Consumption

2) KS20 Current Consumption

2.5 RSSI BAR

2.6 Battery BAR

2.7 Sound Pressure Level

2.8 Charging

3.1 General Description

3.2 GSM Mode

3.2.1 GSM Receiver

3.2.2 GSM Transmitter

3.3 UMTS Mode

3.3.1 Receiver

3.3.2 Transmitter

3.4 LO generation and distribution circuits

3.5 Off-chip RF Components

3.5.1 WCDMA PAM (U503: ACPM-7381)

3.5.2 VCTCXO (X500 : TG-5010LH (19.2M))

3.5.3 Front-End Module (FL500 : LSHS-M090UE)

3.5.4 PMIC Functional Block Diagram (U304 : PM7540)

3.5.5. GSM PAM (U501:TQM7M5003)

3.5.6 UMTS Duplexer(FL503:ACMD-7602)

3.5.7 UMTS Rx RF filter (FL502 : EFCH2140TDE1)

3.5.8 Bluetooth (U403 : BCM2048SKUFBG)

3.5.9 WLAN (SWL-2700S)

3.6 Digital Baseband(DBB/MSM7200)

3.6.1 General Description

A. Features(MSM7200)

3.7 Hardware Architecture

3.7.1. Block Diagram(MSM7200)

3.8. Subsystem(MSM7200)

3.8.1. ARM Microprocessor Subsystem

3.8.2. UMTS Subsystem

3.8.3. GSM Subsystem

3.8.4. RF Interface

3.8.5. Serial Bus Interface(SBI)

3.8.6. Wideband CODEC

3.8.7. Vocoder Subsystem

3.8.8. ARM Microprocessor subsystem

3.8.9. Mode Select and JTAG Interfaces

3.8.10. General-Purpose Input/Output Interface

3.8.11. UART

3.8.12. USB

3.9. Power Block