SAMPLE
In-Depth Report
Reverse Engineering Analysis
[ Amazon Kindle Fire-D01400 ]
Dec. 2011
h t t p: / /www .D i s pl a y ba n k . com
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Contents
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1
Copyright© Displaybank Co., Ltd. All rights reserved.
No material contained in this report may be reproduced in whole or in part without the express written permission of
Displaybank Co., Ltd. This report is intended for the sole and exclusive use of the original purchaser and may not be
distributed or transferred in any form to any other person or entity.
Displaybank Co., Ltd. provides the information in this report for informational purposes only and does not grant any express
or implied warranty, guarantee, or representation concerning the information contained in this report, its merchantability, or
its fitness for a particular purpose or function. Any reference to any specific commercial product, process, or service by trade
name, trademark, manufacturer, or otherwise, does not necessarily constitute or imply its endorsement, recommendation, or
favoring by Displaybank Co., Ltd. Neither Displaybank nor any of its affiliates shall be liable to you or any third party in
damages of whatever kind that may result from any reliance on (or use of) any information contained in this report. By
receiving this report, you acknowledge that any reliance on information contained in this report shall be at your sole risk and
that no representations have been made to you that are inconsistent with the foregoing.
Displaybank Co., Ltd.
8F 801, Korea Design Center, 344-1 Yatap-dong,
Bundang-gu, Seongnam-si, Gyeonggi-do, Korea 463-954
Phone: (82) 31-704-7188, Fax: (82) 31-704-7187
URL: www.Displaybank.com
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Displaybank.
Copyright©
not
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Displaybank
oror
distribute.
Co.,
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Ltd., Confidential
remain
thethe
property
ofof
Displaybank.
Copyright©
Copyright©
Displaybank.
Displaybank.
Do
Do
not
not
copy
copy
or
distribute.
distribute.
Contents
Contents
remain
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Page : 2/100
2
Conditions & Description
◈ Description of Cost Table (SET)
Category
Major Components
Display
Mechanica
l
Circuit
Etc
Array
Array Processing Cost, Material Cost, Yield, etc
Cell
Cell Processing Cost, Material Cost, Yield, etc
Module
Module Processing Cost, Material Cost, Yield, etc
Touch Screen Panel
Touch Screen, Touch Board
Others
Etc
Back
Back Cover, Cushion, Screw, Films, etc
Middle
Button, Connector Cover
Packing
Package Box, etc
CPU
Memory
Application Processor
This sample is designed to help understand the composition of the report
DDR, NAND Flash
and the type of description.
Bluetooth/WLAN
Wireless
User Interface
MEMS Sensors
PM / Battery
Power Source, PMIC
Electro-Mechanical
Speaker, Antenna
Others
Others
Cables
External Cables
Manual
User Guide
Others
Accessory
SAMPLE
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3
Conditions & Description
◈ Description of Cost Table (Display)
Array
Processing
Cell
Module
Glass
①
Cost of Single Back Glass Substrate by Size
Target
②
Pixel Electrode-use Target of Array Process (Target: Al, Mo, Mo (Ti), Cu, etc. S/D, Gate electrode-use Target)
Chemical, Others
Electrode-use target needed in array process excluding various MRO wet chemical, gas, photo mask, photo-sensitive organic chemical material, and ITO (Wet Chemical: Etchant, Stripper, Developer, Thinner, Cleaner) (Gas: NF3, SF6, SiH4, etc.)
(Photo-sensitive organic chemical material: Photoresist, PAC)
Array Yield(%)
Array Process Yield
Color Filter
③
Cost of Single Color Filter (includes front glass substrate), In-house based
Liquid Crystal
④
Cost of Liquid Crystal Input in Single Panel
Polarizer
⑤
Cost of Two Sheets of Front and Back Polarizer Substrates which Pass Trough Specific Lights
Others
Cost of other materials including a material for fixed liquid crystal molecule orientation, sealant to adhere front and back substrate, and Ag which totalizes front and back substrates
Cell Yield(%)
Cell Process Yield
SAMPLE
BLU
⑥
Cost of backlight unit which includes protection sheet, prism sheet, diffusion sheet, light plate guide, reflective sheet, lamp, and lamp cover
Driver IC
⑦
Cost of IC which operates pixels to Display letters or images on LCD screen
PCB,Others
⑧
Cost of Gate PCB, Data PCB (printing circuit substrate), ACF, and Chassis used in modules
Module Yield(%)
Module Process Yield
Operation
Labor Costs
Direct and indirect labor cost
Depreciation Cost
Depreciation
O/H,R&D
R&D and OverHead expenses
This sample is designed to help understand the composition of the report
and the type of description.
Total Manufacturing Cost
SG&A(5%)
Total Manufacturing Cost - Depreciation Cost
Total Cost
Sale management cost, estimated to be 5% of the selling price
Module Price
Profit
④ Liguid Crystal
⑤ Polarizer
③ Color Filter
Market Typical Price
⑦ Driver IC
② ITO Target
① Glass
⑧ PCB
⑥ BLU
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4
Conditions & Description
◈ Description of Cost Table (Touch)
Material Cost
Front Cover Glass
Front Cover Glass is tempered glass
Glass
Glass/Film substrate for ITO layer supporting
Insulator
Insulator
ITO
ITO for touch Sensor
Touch Controller
Touch Controller located in Touch Module or Main board
Others
Others
Sub-Total
Processing Cost
Total Manufacturing Cost
SAMPLE
SG&A(3%)
Total Cost
BLU Price
This sample is designed to help understand the composition of the report
and the type of description.
Profit
Profit Ratio(%)
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5
Conditions & Description
◈ Description of Profit Estimation Table (Tablet SET)
Category
Description
Display Parts
LCD Module prices
Circuit Parts
Sub total of Circuit
Mechanical Parts
Mechanical cost depends on designe simplicity. 1 piece cover can save cost more than 2 or 3 piece cover.
Accessory Parts
Net Material Cost
Net Material Cost means total sum of net material cost
Manufacturing
Etc.(CKD Pack+Tax+Freight+Loss+H/C)
Total Material Cost
Manufacturing O/H
Labor/Overhead, Warranty, etc
SAMPLE
Total Manufacturing Cost
Total Manufacturing Cost means total cost sum right after manufacturing completed.
Manufacturer Margin
Manufacturer Margin come from Distribution corporation to Manufacturing corporation.
FOB
Freight + Insurance + Handling & Land
CIF/CNF
This sample
is designed
to help
understand
the composition of the report
Insurance,
Handling Charge,
Land
Charge
and the type of description.
FOB, Insurance, H/C+L/C
Distribution
Distribution O/H
Duty/Procedure
Distribution Margin
Distribution margin come from Marketing corporation to Distribution corporation
EX-HUB
Marketing O/H
Marketing
Marketing Margin
Net Dealer Price
Sales Deduction
Average Dealer Price
Sales Deduction includes discount for pre purchasing on product
Average Dealer Price means product price for dealer
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6
Table of Contents
2.5.7. Block Diagram
2.5.8. CPU Comparison
1. Overview
1.1. Product Background
1.1.1. Product Category
1.1.2. Spec. Comparison
1.1.3. Kindle Series Spec. Comparison
1.1.4. Product Concept
2.6. Sub Board
2,6,1. Sub Board
2.7. Battery
2.7.1 Battery
1.2. Executive Summary
2.8. Component
1.2.1. Technology Review
1.2.2. Cost/Supply Chain
2.8.1. Component
3. Technical Issue
3.1. TSP Trend
2. Reverse Engineering
3.1.1. TSP Basic Structure and Classification by Driving Method
3.1.2. TSP Lamination Structure Comparison
3.1.3. TPK Supply Chain
2.1. Package Box
2.1.1. Box Design
2.1.2. Box Opening Process
3.2. CPU Trend
2.2. Covers
2.2.1. Front Cover Functions and Specification of Each Part
2.2.2. Back/Side Cover
2.2.3. Back Cover Disassembly
2.2.4. Battery Disassembly
2.2.5. Speaker & Main Board Disassembly
2.2.6. Board Bracket Disassembly
2.2.7. Front Cover Disassembly
This
2.3. Touch Screen Panel
2.3.1. Front Cover Separation
2.3.2. Touch Screen Pattern Structure
2.3.3. Touch Board
2.4. Display Module
2.5.1. Top of PCB
2,5,2, Bottom of PCB
2.5.3. Major IC
2.5.4. Major IC (CPU)
2.5.5. POP (Package On Package)
2.5.6. Major IC (RF Module)
SAMPLE
3.3. LCD Panel Product Roadmap
3.2.1. LGD LCD Panel PRM
3.4. Contents Service
sample is designed to help understand
the composition
of the report
3.2.1. Amazon
Service
and the type of description.
4. Cost Estimation
4.1. Net Material Cost Estimation
4.1.1. Total Material Cost
2.4.1. LCD Specification
2.4.2. LCD Module Structure
2.4.3. LCD Cell Structure Comparison by LCD Driving Mode
2.4.4. LCD Module Block Diagram
2.4.5. Characteristic of BLU
2.4.6. Prism Film of BLU
2.4.7. Light Guide Plate
2.4.8. LED Bar
2.4.9. Spec Comparison
2.5. Main Board
3.2.1. ARM Core
3.2.2. ARM Platform CPU Line-Up
3.2.3. TI CPU Family
3.2.4. Major CPU Manufactures Trend
4.2. Profit Estimation
4.2.1. Display & Touch Screen Panel
4.2.2. Set Profit Estimation
4.3. Major Supplier
4.3.1. Total Supply Chain Map
5. Appendix
5.1. Color Image
5.1.1. Mechanical Part
5.1.2. Circuit Part
5.1.3. Display Part
5.1.4. Major Parts
5.2. Major Supplier
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7
Table of Contents
•
Overview
Product Background
–
SAMPLE
•
Product Category
•
Spec. Comparison
•
This sample is designed to help understand the composition of the report
Kindle Series Spec. Comparison
•
Product Concept
and the type of description.
Executive Summary
–
•
Technology Review
•
Cost & Supply Chain
•
Reverse Engineering
•
Technical Issue
•
Cost Estimation & Major Supplier
•
Appendix
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8
Product Background
Product Category
• Table PC becomes a new application due to the advent of Apple's iPad
• Tablet PC market is expected to increase from 56.4M units in 2011 to 154.6M units in 2015
Personal Mobile Application Product Category
Usage
Document
Creation
180
Ultrabook
UMPC
SAMPLE
160
140
Notebook
120
100
Tablet
Mini-sample is designed to help understand
This
the composition of the report
80
Note
and the type of description.
60
PMP
40
MID
20
Smart
phone
0
2010
2011(E)
2012(E)
2013(E)
2014(E)
2015(E)
PND
Contents
Watching
e-Reader
Type
Tablet PC (M)
UMPC: Ultra Mobile PC
PMP: Portable Media Player
MID: Mobile Internet Device
PND: Portable Navigation Device
Size
2”
4”
6”
8”
10”
12”
13 ~18”
Growth Rate (%)
2010
16.9
2011
2012
2013
2014
2015
56.4
93.4
115.7
135.7
154.6
233%
66%
24%
17%
14%
* Source : Displaybank forecast in 4Q2011
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9
Product Background
Kindle Series Spec Comparison
• Amazon Kindle introduced 5 types of products until today, the functions of those products are limited to use only the
services that Amazon provides
• Kindle Fire evolves from the product line-up focusing on e-book terminals that employing E-Ink to a table PC that is
favorable to the consumption of contents of the company‟s own
• Employs a TFT-LCD display that can utilize video, App, and etc. from the contents focused on text and music
Classification
Item
Kindle Touch
Wi-Fi / 3G
Kindle Fire
Kindle Dx
Kindle
SAMPLE
Image
General
Network Type
OS
Display
Touch Screen
Weight
External/Internal
Linux
6”, 600 x 800 Resolution E Ink Display
IR Type (Multi Touch)
6.8" (172mm) L x 4.7" (120mm) W x
0.4" (10.1mm) D
~7.5oz (~213g) / ~7.8oz (~220g)
4GB
Headphone Port
3.5mm Ear jack
3.5mm Ear jack
Connection Port
Battery Life
Micro USB (USB 2.0 High-Speed)
Micro USB (USB 2.0 High-Speed)
Micro USB (USB 2.0 High-Speed)
Micro USB (USB 2.0 High-Speed)
8 Hours
2 Months
3 Weeks
1 Month
Size
Memory
Connection
Battery
Other Features
Released
date/Price
This sample is designed to help understand the composition of the report
Wifi / 3G
3G
and the type of description.
Wi-Fi
Android™ 2.3 platform (Customized)
7”, 1024 x 600 LCD, 16:9
Glass, Capacitive (Multi Touch)
7.5" (190mm) L x 4.7" (120mm) W x
0.45" (11.4mm) D
~14.6oz (~413g)
8GB
Linux (2.6 kernel)
9.7”, 1200 x 824 Resolution E-paper
n/a (Keyboard)
10.4" (264mm) L x 7.2" (182mm) W x
0.38" (9.6mm) D
~18.9oz (~536g)
4GB
3.5mm Ear jack
Wi-Fi
Linux
6”, 600 x 800 Resolution E Ink Display
n/a (Buttons)
6.5" (165mm) L x 4.5" (114mm) W x
0.34" (8.6mm) D
~5.98oz (~170g)
2GB
3.5mm Ear jack
Supported File
Kindle (AZW), TXT, PDF, unprotected MOBI, P
RC natively, Audible (Audible Enhanced (AA, A
AX)), DOC, DOCX, JPEG, GIF, PNG, BMP, nonDRM AAC, MP3, MIDI, OGG, WAV, MP4, VP8.
Moving Picture
Yes
No
No
No
Date/USD$
2010.11.15/$199
2011.11.15 ($99) / ($149)
2010.07.07 $489
2009.11. ($79)
Kindle (AZW), TXT, PDF, unprotected MOBI, PRC natively; HTML, DOC, DOCX, JPEG, GIF, PNG, BMP through conversion.
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10
Product Background
Product Concept
• Amazon's Kindle Fire is a table PC optimized to the consumption of contents of the company's own
• The performance for its price is excellent, LCD display is adopted instead of E-ink display adopted to a conventional e-book
reader (LCD display is adopted to use diverse applications such as magazine/video/game, and etc. in black-and-white
screen focusing on conventional E-book
• This product is sold at lower prices than the production cost and induces to utilize the company's diverse paid contents
Main Concept
• Conventional E-ink Display is converted to LCD-based color display
• A portable device for the consumption of contents of world's largest
shopping mall and online bookstore, Amazon (extensive contents such as
books, magazines, and newspapers are equipped)
• The lowest price of the tablet products currently being sold ($199)
Amazon
Cloud Storage
is supported
free of charge
This sample is designed •to help
understand
the composition
of the report
SAMPLE
and the type of description.
Major Technology
Kindle Fire
•
•
•
•
LCD Display : HYDIS Panel (AFFS+ method) is employed
Touch Screen Panel : TPK‟s capacitive type is applied
Main Processor : Texas Instruments OMAP4430 is applied
Battery : High-capacity Battery (4,400mAh) is applied
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11
Executive Summary
Technology Review
• Applies HYDIS‟s LCD panel (uses either LG Display panel or BOE LCD Panel)
• Touch Screen Panel applies a TPK‟s capacitive type
•
A tablet PC product that applied LCD display based on TI‟s AP and e-book platform
Display
Circuit
• Applies HYDIS‟s Edge LED panel
• LED Bar applies a Horizontal 1Bar, and the power is
supplied from LCD Drive Board
• CPU applies TI‟s e-book platform인 „POP-type
“OMAP4330”
SAMPLE
• Most ICs like LVDS Transmitter, PMIC, AUDIO AMP
applies TI‟s products
• TSP is supplied from TPK
• WIFI and BT Module apply JORJIN‟s products
• Touch Controller IC applies ILITEK‟s products
This sample is designed to help understand the composition of the report
and the type of description.
D01400
• Applies a plastic (Mold) flame in order to cut a price
down and to reduce weight
• Supplies only Power Adapter
• Employs Android 2.3 OS‟s customizing Version
• Uses EMI gasket and tape for the approval of safety
standards and attaches a SUS panel for the heat
radiation to back cover
Mechanical
Etc
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12
Executive Summary
Cost & Supply Chain
• Touch control board is attached to a touch screen panel, however, is added to display & touch part in terms of cost
• Battery is added to a circuit part
Component
Touch Screen Panel
Maker
Component
Maker
Battery
FRONT COVER GLASS
ITO SENSOR
Touch Controller
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
Component
Maker
CPU
Memory
PAM,AUDIO AMP,LVDS
WLAN,BT,FM Module
Category
Component
Maker
Kindle Fire (USD $)
Display & Touch
LCD CELL
Mechanical
DRIVE BOARD PCB
Circuit
BLU
Etc
Sub-Total
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13
Table of Contents
•
Overview
•
Reverse Engineering
–
–
–
–
–
–
–
–
SAMPLE
Package Box
This sample is designed to help understand the composition of the report
Covers
and the type of description.
Touch Screen Panel
Display Module
Main Board
Sub Board
Battery
Component List
•
Technical Issue
•
Cost Estimation & Major Supplier
•
Appendix
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14
Package Box
Box Opening Process
• Uses a standing-type box. If tearing off the dotted line on the top of the box , a tablet appears
• Quick service manual is in the top of the box, an adapter for charging is enclosed on the bottom of tablet
1
2
SAMPLE
Box unpacking
This sample is designed to help understand the composition of the report
and the type of description.
3
4
Adaptor
Quick Install Guide
Kindle Fire
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15
Covers
Front Cover
• It is a 7" product, 190mm x 120mm x 11.4mm
• Bezel thickness of top and left/ right sides are all equally 14.7mm, and that of the bottom is 20.6mm
• On the front, there is a lighting sensor on the top of left side
120mm
14.7mm
SAMPLE
14.7mm
This sample
11.4mm
14.7mm
is designed to help understand the composition
of the report
and the type of description.
190mm
20.6mm
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16
Covers
Back Cover Disassembly
• Separates into front cover module and back cover to lift the gap below the USB port in the bottom
• A SUS panel is attached for the heat radiation of battery on the back cover, high-capacity battery accounts for the
majority
Speaker
Back Cover
Speaker Cable
SAMPLE
SUS Panel
Battery
This sample is designed to help understand the composition of the report
and the type of description.
Gap pad
Main Board
Insulation Sheet
Front Cover
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17
Touch Screen Panel
Touch Screen Pattern Structure
• TPK's projected capacitive type GG type (Single side ITO) is applied to a touch screen panel
• The shape of pattern is a grid structure, is uniformly distributed in the whole area
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
Shape of Touch Pattern
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18
Display Module
Specification
• LCD applied to Kindle Fire is HYDIS' HV070WS1-101 panel. The specification of the panel is as below
Spec
Maker
HYDIS
Model
HV070WS1-101
Panel Type
Display Inch
LCD (Color TFT/ AFFS)
7.01”
SAMPLE
Resolution
LCD 7”(17.8mm)
1024 x 600 (WSVGA)
Pixel arrange
RGB Vertical Stripe
Aspect Ratio
16 : 9
Colors
16.7 million (8-bit)
This sample is designed to help understand the composition of the report
and
the typeratio
of description.
Contrast
800:1 (Typ)
Brightness
LC mode
BLU
Depth (mm)
Interface
400cd/m2 (Typ)
AFFS
Bottom edge side, LED type
20 LED Package ( 5 x 4 Array )
2,47mm
LVDS (1 Channel)
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19
Display Module
LCD Module Block Diagram
Power (DC/DC
Gamma
Vcom
SAMPLE
TFT-LCD Panel
(1024 x 600)
This sample is designed to help understand the composition of the report
and the type of description.
LVDS / Timing control
Gate Driver : COG Type
LCD Module Block diagram
Source Driver : 2ea (COG Type)
30pin connector
BackLight
20 LEDs
Main Board
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20
Display Module
Prism Film of BLU
• Applies 2 sheets of prism films, protects the pattern of #2 prism film and prevents Moire by the Matt processing on
the front of #1 Prism Film
• A grid pattern that each prism direction intersects by ± 45 degrees
Prism1 Film
Prism2 Film
SAMPLE
This sample is designed to help understand the composition of the report
Back
Front
and the type of description.
Front
Back
Prism film <Cross Array>
Prism 1
Prism 2
Diffusion Film
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21
Display Module
Spec. Comparison
• In terms of the LCD panels applied to Kindle Fire, provides the specifications equivalent to the ones applied to other table
PCs, and uses either HYDIS or LGD panel
Amazon Kindle Fire
(HV070WS1-101)
Maker
Size
Aspect Ratio
Panel Type
Color
BLU
Resolution
Contrast
NOOK TABLET
(LD070W2(SL)(02)
HYDIS
LG Display
7" diagonal with Multi-touch
7" diagonal with Multi-touch
16:9
16:9
AFFS/LCD (Color TFT/AFFS/a-Si TFT)
16.7M
SAMPLE
AH-IPS/LCD (Color TFT/IPS/a-Si TFT)
16.7M
This sample
is designed
to help understand the Edge
composition
of (Downside
the report 1bar)/20 LED Package)
Edge type LED (Downside
1bar)/20
LED Package
type LED
and the type of description.
1024 x 600 (WSVGA)
1024 x 600
800 : 1
800 : 1
400cd/m2 (Typ)
400cd/m2 (Typ)
0.15mm X 0.15mm
0.15mm X 0.15mm
163.60(H) X 102.90(V) X 2.47(D)
Active : 153.6 x 90.0
162.8(H) X 102.9(V) X 2.47(D)
Active : 153.6 x 90.0
Power
Max 2.32W, (Logic:0.96W / BLU : 1.36W)
Max 2.31W (Logic : 0.95W / BLU : 1.36W)
Weight
LCD : 95g
LCD : 95g
Brightness
Pixel Pitch (mm)
Outline dimension
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22
Main Board
Bottom of PCB
• Input/output ports, audio amp, and bus transceiver are located on the back of mainboard
• TI AIC3110 internally equipped with audio codec is applied to audio amp, TI's bus transceiver is applied
• A tact switch for power button is installed, Micro B type USB and earphone 3.5mm port are installed
Power Button Switch
USB Port (Micro B Type)
Earphone Jack 3.5mm
TI TLV320AIC3110
Audio AMP 1.3W Stereo Class-D
USB
Earphone
Switch
SAMPLE
Light sensor connector
Audio
AMP
This sample is designed to help understand the composition of the report
and the type of description.
Bus
Transceiver
TI SN74AVCH4T245
4Bit Dual Supply Bus Transceiver
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Page : 23/100
23
Main Board
Major IC (CPU)
• OMAP4430 is internally equipped with GPU/Image Processor/Display Controller
• TI's OMAP platform is optimizedly designed to have a good compatibility with its own ICs ( IC(PAM/Audio AMP/WLAN)
• Display maximum support resolution can support up to WUXGA (1920x1200)
Feature
• Dual-core ARM Cortex-A9 MP Core SMP general-purpose
processors for higher performance and efficiency
• IVA 3 Hardware accelerator
- Delivers true 1080p multi-standard HD record and playback
with the industry‟s broadest support for multimedia codecs
available today as well as programmability to add support for
future codecs
- Provides support for high definition stereoscopic 3D
encode/decode (OMAP4430: 720p, OMAP4460: 1080p)
• Image Signal Processor (ISP) for high-quality image and video
capture, delivering digital SLR-like performance with
20 megapixel still image capture
• Imagination Technologies POWERVR™
SGX540 3D graphics core for stunning 3D user interfaces and
designed to help understand the composition
of the report
high intensity 3D mobile gaming
and the type of description.
• Audio back end (ABE) processor provides a virtual low power
audio chip for significant power savings
• Flexible system support
- Composite TV output
- HDMI v1.3 output to drive HD Displays
- WUXGA Display support
- Peripheral interfaces: MIPI serial camera and serial Display
interfaces, MIPI®
SLIMbusSM, MMC/SD, USB 2.0 On-The-Go High Speed, UART,
SPI, and more
• Support for leading mobile OSes: Microsoft Windows Mobile,
Symbian and Linux (Android, Limo)
• 45-nm mobile process technology for improved performance
and power efficiency
• Optimized power and audio management
companion chips: TWL6030 and TWL6040
SAMPLE
This sample is
Block Diagram <OMAP
4430>
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24
Main Board
CPU Comparison
Amazon Kindle Fire
Apple iPAD2
TEXAS INSTRUMNENTS
OMAP TM
X4430FCBS
Picture
Samsung Galaxy Tab 10.1
APPLE
A5
APL0498 339S0137
NVIDIA
2225123 1110A3
N3V716.S4M
T20-HP-A3
SAMPLE
Model
OMAP4430
A5
Tegra 2-250
Maker
Texas Instruments
APPLE
NVIDIA
CPU
This sample is designed to help understand the composition of the report
Dual Core ARM Cortex A9
Core ARM
Cortex A9
and Dual
the type
of description.
Dual Core ARM Cortex A9
Package Type
POP
POP
SOC
Frequency
1 GHz,per core
1GHz dual-core
1 GHz
L2 Cache
1MB
1MB
1MB
L1 Cache
(32KB/32KB) per core
(32KB/32KB) per core
(32KB/32KB) per core
Memory
Size
Up to 1GB
512MB
Up to 1GB
Feature size
45um
45um
40um
GPU
PowerVR SGX540
PowerVR SGX543mp2
ULP Geforce
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25
Table of Contents
•
•
•
Overview
Reverse Engineering
Technical Issue
–
TSP Trend
•
•
•
–
LGD LCD Panel PRM
Contents Service
•
•
•
ARM Core
TEXAS INSTRUMENTS CPU Family
TI CPU Family
Major CPU Manufactures Trend
LGD LCD Panel Product Roadmap
•
–
This sample is designed to help understand the composition of the report
the type of description.
TSP Basic Structure and Classification by Driving Method
and
TSP Lamination Structure Comparison
TPK Supply Chain
CPU Trend
•
•
•
•
–
SAMPLE
Amazon Service
Cost Estimation & Major Supplier
Appendix
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26
TSP Trend
Basic TSP Structure and Classification by Driving Method
• TSP is composed of panel part and driving part (controller IC), panel part is composed of the touch sensor that
ITO (Indium Tin Oxide) is deposited
• Electrode analog signal transmits to controller IC when touched by human's hand or an object, driver drives the
display by receiving the digital signal coming from the controller IC
Touch Panel Structure (Capacitive Type)
Structure of TSP (Resistive-type)
Classification by Driving Method
Function diagram of TSP
Technology 1
SAMPLE
Touching Signal
TSP
Spacer
ITO
PET
Cover Window
TSP
Glass/Plastic
TFT-LCD
Display
Panel
Driver
Function diagram
Structure of TSP (Resistive-type)
Chip
of TSP
FPCB
TSP
Spacer
PET
P
Capacitive
Touch Sensor
•RTP : Resistive Touch Panel
TFT-LCD
•SAW : Surface
AcousticPanel
Wave
•IR : Infra-Red
PCB
Film/Glass
5-wire
Film/Film/Plastic
8-wire
Film/Film/Glass
Digital
Glass/Glass
Film
Digital (Projected)
Glass/Film
Glass
Plastic
Amplifier & A/D
Glass
IR/Optical
Display
Driver
Plastic
APR
MCU
FPC
TFT-LCD
Panel
Glass
Analog (Surface)
SAW
Controller
• CTP : Capacitive
Touch Panel
Glass/Plastic
4-wire
Film/Film/Film
Touching Signal
ITO
Resistive
Structure
Controller
This
sample is designed to help understand the composition of the report
MCU
and the type of description.
FPC
TFT-LCD Panel
PCB
Amplifier & A/D
Technology 2
Others
WIR
EMR
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APR: Acoustic Pulse Recognition
WIR: Waveguide Infrared Rays
EMR: Electronic Magnetic Resonance
Page : 27/100
27
CPU Trend
ARM Core
• ARM-based CPUs are applied to mobile products, ARM is the company to design the core architecture
• ARM-based CPU has strengths of fast speed and low power consumption that meet the level required to mobile devices
(Accounts for about 95% market share in the mobile CPU market through the strengths such as increase in battery life,
decrease in die size, alleviation of heat radiation, and etc. in the specifications that are required to mobile devices)
• Intel is developing Medifield and Moorestown to respond to ARM's Coretex, ARM is expected to enhance the targeting of Intel's
market with the CPU equivalent to note PC level by releasing a 2.5GHz Core named Cortex-A15 in 2012. (Microsoft's Windows
will also support ARM)
ARM Platform Product Line-up
x86 (32/28nm)
MHz
SAMPLE
32/28nm
• ARM9(ARMv5)
Cortex-A15
Medfield
Android1.6,
This sample is designed to help understand the composition of- the
report e-book, cartoon, music, moving
40nmG
and the type of description.
picture (encoded)
2,500
2,000
40nmG
Cortex-A9
Moorestown
1,500
65nmG
40nmG
Cortex-A5
Cortex-A8
ARM11
65nmG
40nmLP
500
• ARM11(ARMv6): <1,000MHz
- Android2.2, e-book, cartoon, music,
documentation, moving picture (not-encoded),
40nmG
1,000
[Support Features by Major ARM CPU]
3D
65nmG
• Cortex A8 (ARMv7): 500~1,000MHz
Cortex-A9
- e-book, cartoon, music, documentation, moving
65nmLP
ARM11
65nmLP
Cortex-A5
picture(not-encoded), 3D
Cortex-A8
ARM11
• Cortex A9 (ARMv7) : 1,000~2,000MHz
- e-book, cartoon, music, documentation, moving
picture(not-encoded), 3D
0.2
0.4
0.6
0.8
1
mW/MHz
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CPU Trend - CPU Overview_PRM
ARM Platform CPU Line-up
• 1.2GHz dual-core products were released from 1H'11 (OMAP 4430 included)
• 2.0Ghz TI OMAP 5 platform is expected to be released in 1H'12, even Quad Core products are predicted to be introduce in
2012
GHz
Quad-core
2.0
Tri-core
TEXAS INSTRUMENTS
MARVELL
1.5
Armada628
Tri-Core/40nm
Cortex A9 1.5GHz
QUALCOMM
QSD8x50A
One-core/45nm
1.3GHz
SAMPLE
ST ERICSSON
1.3
Dual-core
SAMSUNG
NVIDIA
Armada618
One-Core/45nm
ARMv7/Scorpion 1.3GHz
QUALCOMM
QSD8960
Dual-core/28nm
1.5GHz
OMAP4440
Dual-Core/45nm
Cortex A9 1.3GHz
QSD8260/8660
Dual-core/45nm
1.3GHz/1.0GHz
U8500
Dual-core/45nm
OMAP5430
Dual-core/28nm
2.0GHz
QSD8x72
Dual-core/45nm
1.5GHz
TEXAS INSTRUMENTS
QUALCOMM
MARVELL
QUALCOMM
EXINOS 4210/Mali-400
Dual-Core/45nm
Tegra2
This sample is designed to help Dual-core/45nm
understand the composition of the report
ARMv7 rev1 1.2GHz
Cortex A9 1000MHz
and the type of description.
TEXAS INSTRUMENTS
QUALCOMM
1. 0
QUALCOMM
QSD8x50
One-core/65nm
ARMv7/Scorpion 1.0GHz
TEXAS INSTRUMENTS
OMAP3640
One-Core/45nm
Cortex A8 1.0GHz
2009
Core
One
Clock
1GHz
Process
65nm
QSD8x55
One-core/45nm
ARMv7/Scorpion 1.3GHz
SAMSUNG
OMAP4430
Dual-Core/45nm
ARMv7 1.0GHz
S5PC100/SGX535
One-Core/45nm
Cortex A8 1.0GHz
SAMSUNG
S5PC110/SGX540
One-Core/45nm
Cortex A8 1.0GHz
2010
2011
45nm
Quad
Tri
Dual
1.3GHz
2012
1.5GHz
2GHz
40nm
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2.5GHz
28nm
Page : 29/100
29
Contents Service
Amazon Service
• Provides diverse services based on a massive amount of contents of the world's largest internet bookstore/shopping mall,
Amazon
• Small storage space (about 6GB) of hardware can be supplemented by the offer of cloud services. This service is
considered to be a good marketing tool for the sales of contents
Amazon Kindle Fire Service
Amazon
Internet Mall
Internet Book Store
• Contents available to use Kindle Fire
SAMPLE
- More than 1 million books are available
- Diverse games/applications such as Netflix, Hulu Plus, Pandora,
ESPN ScoreCenter, ComiXology are available
- More than 1,000 children's books are available
- More than 18,000,000 sound sources are available
• Primeof
members:
$ 79 per year
This sample is designed to help understand the composition
the report
- About 10,000 movies/TV programs upgraded on a monthly
and the type of description.
basis are available unlimitedly by real-time streaming
- About 30,000 books are available free of charge
- 2 times free shopping mall shipping
Amazon
Cloud Service
Kindle Fire $199
• Amazon Cloud Service (Amazon EC2)
- Provides the cloud service that can use a separate Web-hard as
the capacity of actually available storage space of hardware is no
more than 6GM
- The service that enables to store the music purchased at
Amazon by using a cloud player in a cloud drive, to listen to the
music by streaming, and to read the e-books purchased by using a
cloud reader anywhere.
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30
Table of Contents
•
Overview
•
Reverse Engineering
•
Technical Issue
•
Cost Estimation & Major Supplier
•
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
–
Net Material Cost Estimation
–
Profit Estimation
–
Major Supplier
Appendix
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31
Net Material Cost Estimation
Total Material Cost
Category
US$
%
Array Process
Cell Process
Display
Module Process
Touch Screen Panel
OTHERS
Sub-Total
MECHANICAL
Back
SAMPLE
Bracket
Packing
Sub-Total
Application Processor
Memory
CIRCUIT
Bluetooth/WLAN
This sample is designed to help understand the composition of the report
and the type of description.
User Interface
PM / Battery
Electro-Mechanical
Others
Sub-Total
Charger
ETC
Manual
Sub-Total
Total
 Total Cost of Kindle Fire is $000.0
 Taking a look at part by part, display parts (TSP
included), circuit parts, mechanical parts, and
accessory & other parts account for 00.0%,
00.0%, 0.0%, and 0.0% respectively
* Array, cell, and module of display part add up the material cost and process cost following
the order of a production process
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32
Profit Estimation
Display & Touch Screen Panel
Category
US$
%
Category
Glass
Array
Chemical, Others
Array Sum
Array Yield(%)
Yielded Array Total
Color Filter
Liquid Crystal
Material
Others
Cell Sum
TSP Price
Yielded Cell Total
Profit
Profit Ratio(%)
BLU
Driver IC
PCB,Others
Module Sum
Module Yield(%)
Front Cover Glass
Glass
Insulator
ITO
Touch Controller
Others
Sub-Total
SAMPLE
Cell Yield(%)
Module
%
Processing Cost
Total Manufacturing Cost
SG&A(3%)
Total Cost
Polarizer
Cell
Material Cost
Target
US$
* Array,
cell,composition
and module of display
partreport
add up the material cost and process cost following the
This sample is designed to help understand
the
of the
order of a production process
and the type of description.
Yielded Module Total
Sub-Total
Processing
Labor Costs
Depreciation Cost
O/H,R&D
Sub-Total
Total Manufacturing Cost
SG&A(5%)
Total Cost
Module Price
Profit
Profit Ratio(%)
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33
Profit Estimation
SET Profit Estimation
US$
%
• An OEM manufacture, Quanta, is analyzed to
make a manufacturer margin of about *%
Display Parts
Circuit Parts
Mechanical Parts
Etc.(Accessory) Parts
Manufacturing
Net Material Cost
Etc.(CKD Pack+Tax+Freight+Loss+H/C)
Total Material Cost
• As a result of profit estimation based on
released time, Kindle Fire is **.*% based on
Linkage profit/loss
Manufacturing O/H
Distribution
• However, Amazon is considered to target the
profits through the sales of contents such as
Manufacturer Margin
book/music/magazine and etc. at its own
FOB
stores and through the products purchase
Freight + Insurance + Handling & Land
CIF/CNF
inducement that Amazon sells rather than the
This sample is designed to help understand the composition
the report
Distribution O/H
hardwareofsales
profit through Kindle Fire
Total Manufacturing Cost
SAMPLE
and the type of description.
Duty/Procedure
Distribution Margin
EX-HUB
Marketing O/H
Marketing Margin
Marketing
Net Dealer Price
Sales Deduction
Average Dealer Price
Dealer Margin
Average Retail Price
Consolidated Brand Profit (Brand Total)
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Major Supplier
Total Supply Chain Map
• LCD module suppliers are *** and ***, touch screen panels are supplied from ***
• Applies Texas Instruments' products to CPU, and also uses Texas Instruments' products to PMIC and Audio
• OEM production is carried out by Quanta and supplied to Amazon
Total Part Supplier
Brand
AMAZON
SAMPLE
LCD CELL
Prism Film
LCD Module
CPU
Main Board
OEM
Memory
Diffusion Film
This sample is designed to help understand the composition of the report
and the type of description.
PAM
LGP
AUDIO AMP
BLU
Reflection Film
E-MMC
Touch Module
LED BAR
Wireless
Touch IC
Touch SENSOR
Front Cover Glass
PCB
Semi-Assembly
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SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
Amazon Tablet PC Kindle Fire, Structure and Cost Analysis
End of Report
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copy
Displaybank
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distribute.
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ofof
Displaybank.
Copyright©
Copyright©
Displaybank.
Displaybank.
Do
Do
not
not
copy
copy
or
distribute.
distribute.
Contents
Contents
remain
remain
property
property
of
Displaybank.
Displaybank.
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36
Table of Contents
•
Overview
•
Reverse Engineering
•
Technical Issue
•
Cost Estimation & Major Supplier
•
Appendix
–
Mechanical
–
Circuit
–
Display
–
Major Parts
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Mechanical – Package
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Mechanical – Package
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Mechanical – Front/Back
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Mechanical – Front (Illuminance sensor)
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Mechanical – Bottom (Earphone, USB Connector, Power BTN)
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Mechanical – Back Cover
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Mechanical – Layout
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Circuit – Mainboard (Front)
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Circuit – Mainboard (RF Module)
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Display – Touch Screen Panel & LCD Module
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Display – Touch Screen Driving part
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Display – LCD Module (Cell)
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Display – BLU (LED Bar & Package)
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Display – BLU (Light Guide Plate Pattern)
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Display – BLU (Light Guide Plate)
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Display – BLU (Prism Film #2, Back)
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Display – BLU (Optical Films)
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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Kindle Fire – Overview
SAMPLE
This sample is designed to help understand the composition of the report
and the type of description.
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55
Major Supplier
LG Display
Date of
Establishmen • 1985.02.28
t
2011 3Q Revenue • (mil) $ 16,074
Capital Stock • (mil) $ 9,733.8
Location of
• Seoul
Headquarter
No. of
Employees
• 2010 Employees 46,705
•
•
•
Main Product
•
•
•
TFT-LCD
OLED
Flexible Display
Note PC
Television
Application Products
2011 3Q Profit
• (mil) $
2010 Revenue
• (mil) $ 22,501.2
2010 Profit
• (mil) $ 3,290.4
[Asia]
• Tokyo branch
• China Nanjing branch
• China Shanghai branch
• China Guangzhou branch
• China Shenzhen branch
• China Xiamen branch
• China Puching branch
• China Yantai branch
[America]
This sample is designed to help understand the composition of the report
• Austin branch
and the type of description.
Local Corporates • Houston branch
• LA branch
• Service Center
SAMPLE
[Europe, Middle East]
Affiliates
• Suzhou Raken Technology Ltd, Guangzhou New
Vision Technology Research and Development
Limited, Global OLED Technology LLC, Paju
Electronic Glass Co., Ltd, TLi Inc, New Optics Ltd.,
LIG ADP Co., Ltd, Wooree LED Co Ltd., Dynamic
Solar Design Co., Ltd., RPO Inc, LB Gemini No. 16
New Growth Fund, Can Yang Investments Limited,
YAS Co., Ltd., Eralite Optoelectoronics(Jiangsu) co,
Ltd,
•
•
•
•
•
Web Site
Finland branch
European Corporate
Turkey branch
Poland branch
Germany branch
• www.lgDisplay.com
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About Displaybank
Reverse
Engineering
- New
Reports
Reports
[Tablet PC & Smart phone]
•BARNES & NOBLE 7” Tablet PC NOOK Color Structure and Cost Analysis
•Apple iPad 2 Structure and Cost Analysis
•Apple iPad 1 Structure and Cost Analysis
•Motorola 10.1" Tablet PC XOOM Structure and Cost Analysis
•Samsung 7” Tablet PC Galaxy Tab Structure and Cost Analysis
•Apple iPhone 4 Structure and Cost Analysis
•Samsung 10.1” Tablet PC Galaxy Tab Structure and Cost Analysis
•Apple iPhone 4S Structure and Cost Analysis
•Amazon Kindle Fire Structure and Cost Analysis
[TV]
•Samsung 3D Smart LED TV UN46D7000LF Structure and Cost Analysis
•LG Electronics FPR 3D LED TV 47LW5700 Structure and Cost Analysis
•Toshiba Non-Glasses 3D LED TV 20GL1 Structure and Cost Analysis
•LGE 15LE9500 vs. SONY XEL-1 Structure and Cost Analysis Comparison
•3D TV Structure and Cost Analysis Comparison of 3 Major TV Makers
•LG Electronics 3D TV '47LX6500' Structure and Cost Analysis
•Sony 3D TV 46" KDL-46NX710 Structure and Cost Analysis
•Samsung 3D LED TV UN46C7000WF Structure and Cost Analysis
[Monitor]
•BenQ 18.5"/21.5" LED Monitor GL930/GL2230 Structure and Cost Analysis
•LG Electronics 23" LED Monitor E2350V-PN Structure and Cost Analysis
Inquiry
– Jae Shin([email protected]), +1-408-432-5046, Amy Lee ([email protected]), +82-31-704-7188 (Ext. 101)
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or distribute.
Co.,
Contents
Ltd., Confidential
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About Displaybank - Global Operations
• Global leader in Display industry research and consulting services
• With over 10 years of industry-wide research experience, Displaybank provides market intelligence as well as technical research to industry leaders
• Besides end-user market, especially strong in the Component/Material research that is basis of the overall Display industry
• Headquartered in Korea, the region known as the leader in Display industry, Displaybank operates regional offices in Japan, China, Taiwan and the US.
CHINA (Beijing,
Shenzhen)
TAIWAN (Taipei)
JAPAN (Tokyo)
USA (San Jose)
E-mail: [email protected]
Tel: +81-3-5521-5088
Fax: +81-3-5521-5089
E-mail: [email protected]
Tel: +1-408-432-5046
Fax: +1-408-432-5080
E-mail: [email protected]
m
E-mail: [email protected]
KOREA (Bundang) Headquarters
▶▶
8F 801, Korea Design Center 344-1 Yatap-dong, Bundang-gu, Seongnam-si, Gyeonggi-do, Korea, 432-954
Tel : +82-31-704-7188, Fax: +82-31-704-7187
E-mail : [email protected]
Representative : CEO Peter Kwon
Copyright© Displaybank. Copyright©
Do not copyDisplaybank
or distribute.
Co.,
Contents
Ltd., Confidential
remain the property of Displaybank.
Page : 58/100
58
About Displaybank - Research Coverage
{
}
Panel / MODULE
Shipment Trend & Forecast
LCD Panel
• PDP Module
• OLED Panel
•
SET
Price Trend & Forecast
TV
Tablet
• e-Reader
• Notebook
• Tablet PC
• Public Information Display
•
•
Supply/Demand Trend & Forecast
Cost Comparison/Analysis
Supply Chain Analysis
Line Status Analysis by Maker
COMPONENT / MATERIAL
LED
• Polarizer
• BLU
• Touch Panel
• Wet Chemical
• Organic Materials
• Metal Layer
• Driver IC
• Glass
• Color Filter
• Optical Films
•
Corporate Analysis and Investment Trend
NEW TECHNOLOGY
Development Strategy by Maker
Roadmap Analysis by Maker
Tech. Trend and Analysis
Flexible Display
3D Display
• e-Paper Display
• Transparent Display
• Graphene, CNT
•
•
Patent Analysis
Reverse Engineering Analysis
(Product Structure & Cost Analysis)
Copyright© Displaybank. Copyright©
Do not copyDisplaybank
or distribute.
Co.,
Contents
Ltd., Confidential
remain the property of Displaybank.
Page : 59/100
59
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