Isee IGEPv2 BOARD Hardware Reference Manual

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ISEE

MANUAL

ISEE IGEPv2 EXPANSION

Hardware Reference Manual

(Revision 01 - 24-Sep-2010)

ISEE ( Integration Software & Electronics Engineering )

Address: C/ Vallespir nº19 Planta 1 Modulo 1

PostCode: 08173

City: Sant Cugat

Country: SPAIN

Telf. : +34.93.576.39.31 [email protected]

http://www.iseebcn.com

IGEPv2 EXPANSION BOARD HARDWARE USER MANUAL

CONTENTS

1 COPYRIGHT NOTICE ................................................................................ 5

2 WARRANTY ............................................................................................. 5

3 ISEE IGEP LINKS ..................................................................................... 6

4 ISEE IGEPv2 EXPANSION FEATURES .......................................................... 7

4.1

INTRODUCTION ................................................................................ 7

4.2

GENERAL SPECIFICATIONS ............................................................... 10

5 IGEPv2 CONNECTION.............................................................................. 16

6 CONNECTORS DESCRIPTION ................................................................... 19

6.1

J201 - POWER JACK .......................................................................... 20

6.2

J301 - POWERTIP 4.3” DATA CONNECTOR ........................................... 21

6.3

J302, J303 and J304 - SEIKO 7” CONNECTORS .................................... 22

6.4

J405 - MODEM GSM/GPRS SIMCARD CONNECTOR ................................ 23

6.5

J404 - MODEM GSM/GPRS EXTERNAL ANTENNA CONNECTOR ................ 24

6.6

J501, J502 - VIDEO COMPOSITE INPUTS CONNECTOR .......................... 25

6.7

J601 and J602 - UART1 HEADER CONNECTOR...................................... 26

6.8

J603 - RS232 HEADER CONNECTOR ................................................... 27

6.9

J604 - RS232 DB9 CONNECTOR ......................................................... 28

6.10

J703 - CAN BUS CONNECTOR ......................................................... 29

6.11

J801 - VGA CONNECTOR ................................................................ 30

6.12

J5 - CAMERA CONNECTOR .............................................................. 31

6.13

J990 - IGEPv2 EXPANSION CONNECTOR .......................................... 32

6.14

J960 - IGEPv2 EXPANSION CONNECTOR .......................................... 33

6.15

JA41 - IGEPv2 EXPANSION CONNECTOR .......................................... 34

6.16

JA42 - IGEPv2 EXPANSION CONNECTOR .......................................... 35

6.17

JC30 - IGEPv2 EXPANSION CONNECTOR .......................................... 36

ISEE 2007 SL. All rights reserved, IGEP® is a registered trademark from ISEE 2007 SL. The following is provided for informational purposes only.

DOCUMENT FROM ISEE 2007 S.L. 24-Sep-2010

2

IGEPv2 EXPANSION BOARD HARDWARE USER MANUAL

7 MECHANICAL SPECIFICATION .................................................................. 37

8 BOARD REFERENCE ................................................................................ 38

9 LIST OF FIGURES ................................................................................... 39

10 CHANGELOG .......................................................................................... 41

3

ISEE 2007 SL. All rights reserved, IGEP® is a registered trademark from ISEE 2007 SL. The following is provided for informational purposes only.

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IGEPv2 EXPANSION BOARD HARDWARE USER MANUAL

4

VERSION CONTROL

REVISION

00

DATE

15/07/2010

01 1/09/2010

ORIGIN

PR

PR

DESCRIPTION

Initial version

Document release

ISEE 2007 SL. All rights reserved, IGEP® is a registered trademark from ISEE 2007 SL. The following is provided for informational purposes only.

DOCUMENT FROM ISEE 2007 S.L. 24-Sep-2010

IGEPv2 EXPANSION BOARD HARDWARE USER MANUAL

1 COPYRIGHT NOTICE

This document is copyrighted, 2010, by ISEE 2007 SL. All rights are reserved. ISEE reserves the right to make improvements to the products described in this manual at any time without notice. No part of this manual may be reproduced, copied, translated or transmitted in any form or by any means without the prior written permission of the original manufacturer. Information provided in this manual is intended to be accurate and reliable. However, the original manufacturer assumes no responsibility for its use, nor for any infringements upon the rights of third parties which may result from its use.

2 WARRANTY

Should this board not meet the specifications indicated in the User’s Guide, the board may be returned within 30 days from the date of delivery for a full refund.

THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY

SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES,

EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF

MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies ISEE 2007 SL from all claims arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge.

EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER

PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL,

INCIDENTAL, OR CONSEQUENTIAL DAMAGES.

ISEE 2007 SL currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. ISEE assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein.

Please read specifically, the Warnings and Restrictions notice in this manual prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on IGEP environmental and/or safety programs, please contact with ISEE ([email protected]).

5

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IGEPv2 EXPANSION BOARD HARDWARE USER MANUAL

No license is granted under any patent right or other intellectual property right of

ISEE covering or relating to any machine, process, or combination in which such

ISEE products or services might be or are used.

3 ISEE IGEP LINKS

IGEP platform web site: http://www.igep.es

ISEE IGEP wiki: http://labs.igep.es

ISEE shop: https://shop.igep.es

ISEE Software Repositories: http://git.igep.es

6

ISEE 2007 SL. All rights reserved, IGEP® is a registered trademark from ISEE 2007 SL. The following is provided for informational purposes only.

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7

4 ISEE IGEPV2 EXPANSION FEATURES

4.1

INTRODUCTION

Interfaces

Figure 1 ISEE IGEPV2 EXPANSION

Description

Modem GSM/GPRS based on TELIT GE865 module with SIMCARD connector and external cable Antenna.

LCD and touch interface for 7.0 inch SEIKO LCD: 3 connectors (40pin FFC for TFT interface + 4pin FFC for touch + 6pin FFC for LED backlight).

LCD and touch interface for 4.3 inch POWERTIP LCD: 40pin FFC for TFT interface, touch and LED backlight).

VGA interface on D-SUB15 connector.

2 x video composite inputs on RCA connector. Video Decoder based on

TEXAS Video Decoder TVP5150.

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Camera interface for e-con Systems e-CAM32_OMAP module.

CAN bus interface with 4 pin connector. CAN interface based on MICROCHIP

MCP2515 CAN controller.

LVDS video serializer (MAX9247) ( Optional )

Electrical

Connectors

Serial port on DB9 connector

Supply Voltage from 5 VDC +-10% from IGEPv2 board or 5VDC through

Power Jack connector

Power consumption: from 260mA to 500mA

Note: The electrical design for the Power supply should be made ensuring it will be capable of a peak current output of at least 2 A.

1 x DB9 for serial RS232 interface

2 x RCA for video composite input

1 x DB15 for VGA interface

1 x SIMCARD connector for MODEM GSM/GPRS

1 x Terminal block 5mm 4 pin

4 x Header for IGEPv2 interface

Environmental -40..+85 C temperature range / -25.. 80ºC / 0..70ºC

Indicators 1 x bicolor SMD led (green/red) for MODEM status

2 x bicolor SMD led (green/red) for CAN interface

WARNING: IGEPv2 EXPANSION CAN ONLY BE POWERED WITH

5VDC THROUGH J201 and J990 CONNECTORS

OR THE BOARD WILL BE DAMAGED!

8

ISEE 2007 SL. All rights reserved, IGEP® is a registered trademark from ISEE 2007 SL. The following is provided for informational purposes only.

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IGEPv2 EXPANSION BOARD HARDWARE USER MANUAL

9

Figure 2 IGEPv2 EXPANSION Top view

Figure 3 IGEPv2 EXPANSION Bottom view

The following sections provide more detail on each feature and components on the

ISEE IGEPV2 EXPANSION.

ISEE 2007 SL. All rights reserved, IGEP® is a registered trademark from ISEE 2007 SL. The following is provided for informational purposes only.

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IGEPv2 EXPANSION BOARD HARDWARE USER MANUAL

4.2

GENERAL SPECIFICATIONS

LCD Interface

IGEPv2 EXPANSION board can be directly connected to a SEIKO 7” LCD or to a

POWERTIP 4.3” LCD.

10

Figure 4 LCD view

IGEPv2 EXPANSION board integrates LCD backlight driver (Texas instruments

TPS61081) and touch screen controller (Texas instruments TSC2046), 4-wire touch screen controller which supports a low-voltage I/O interface from 1.5V to 5.25V

.

POWERTIP 4.3” LCD features:

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SEIKO 7” LCD features:

Module size

Active area

Dot pitch

Weight

Display size

Number of pixels

Dot layout

Interface

Number of colors

Display mode

Viewing angle(U/D/R/L)

Drive method

Back Light Unit

Touch-Panel

Surface treatment

Operating temperature

Storage temperature

165mm(W)x105.8mm(H)x(4.51)mm(t) (except FPC length)

152.4mm(W)x91.44mm(H)

0.0635mmx0.1905mm

( 170 ) g typ.

7.0 inch

800RGBx480 dots

Vertical stripes

24bit Parallel RGB

DE interface mode (DCLK,DE)

SYNC interface mode (DCLK,HSYNC,VSYNC)

16,194,277 colors (6bit DAC + dithering)

TN Mode, Transmissive Mode, Normally White

55/65/70/70 (@CR

10)

Dot inversion

Bottom edge type, 24 LEDs(8Serial x 3)

Film/Glass type

Anti glare type

From -20 to +70 °C (dry)

From -30 to +80 °C (dry)

MODEM GSM/GPRS

IGEPv2 EXPANSION board integrates a modem GSM/GPRS for mobile communication.

11

Figure 5 Modem view

GE865 is a small GSM/GPRS Ball-Grid-Array BGA module with next feature:

Quad-band EGSM 850 / 900 / 1800 / 1900 MHz

GSM/GPRS protocol stack 3GPP Release 4 compliant

Output power o Class 4 (2W) @ 850 / 900 MHz o Class 1 (1W) @ 1800 / 1900 MHz

Control via AT commands according to 3GPP 27.005, 27.007

Control via Remote AT commands

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Power consumption (typical values) o Power off: ‹ 62 uA o Idle (registered, power saving): 1.6 mA @ DRX=9

Serial port multiplexer 3GPP 27.010

TCP/IP stack access via AT commands

Sensitivity: o ≤ - 107 dBm (typ.) @ 850 / 900 MHz o ≤ - 106 dBm (typ.) @ 1800 / 1900 MHz

Extended temperature range o -40°C to +85°C (operational) o -40°C to +85°C (storage temperature)

RoHS compliant

Figure 6 Telit module view

VIDEO COMPOSITE INPUTS

IGEPv2 EXPANSION board integrates a Ultralow-Power NTSC/PAL/SECAM Video

Decoder, Texas Instruments TVP5151.

The TVP5151 device is an ultralow-power NTSC/PAL/SECAM video decoder.

Available in a space-saving 48-terminal PBGA package or a 32-terminal TQFP package, the TVP5151 decoder converts NTSC, PAL, and SECAM video signals to 8bit ITU-R BT.656 format. Discrete syncs are also available. The optimized architecture of the TVP5151 decoder allows for ultralow power consumption. The decoder consumes 138-mW power under typical operating conditions and consumes less than 1 mW in power-down mode, considerably increasing battery life in portable applications. The decoder uses just one crystal for all supported standards.

The TVP5151 decoder can be programmed using an I2C serial interface.

The TVP5151 decoder converts baseband analog video into digital YCbCr 4:2:2 component video.

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Composite and S-video inputs are supported. The TVP5151 decoder includes one 9bit analog-to-digital converter (ADC) with 2× sampling. Sampling is ITU-R BT.601

(27.0 MHz, generated from the 27.000-MHz crystal or oscillator input) and is line locked. The output formats can be 8-bit 4:2:2 or 8-bit ITU-R BT.656 with embedded synchronization.

The TVP5151 decoder utilizes Texas Instruments patented technology for locking to weak, noisy, or unstable signals. A Genlock/real-time control (RTC) output is generated for synchronizing downstream video encoders.

Complementary four-line adaptive comb filtering is available for both the luminance and chrominance data paths to reduce both cross-luminance and crosschrominance artifacts; a chrominance trap filter is also available.

Video characteristics including hue, brightness, saturation, and sharpness may be programmed using the industry standard I2C serial interface. The TVP5151 decoder generates synchronization, blanking, lock, and clock signals in addition to digital video outputs. The TVP5151 decoder includes methods for advanced vertical blanking interval (VBI) data retrieval. The VBI data processor slices, parses, and performs error checking on teletext, closed caption, and other data in several formats.

The TVP5151 decoder detects copy-protected input signals according to the

Macrovision™ standard and detects Type 1, 2, 3, and colorstripe processes.

The main blocks of the TVP5151 decoder include:

• Robust sync detector

• ADC with analog processor

• Y/C separation using four-line adaptive comb filter

• Chrominance processor

• Luminance processor

• Video clock/timing processor and power-down control

• Output formatter

• I2C interface

• VBI data processor

• Macrovision detection for composite and S-video

13

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IGEPv2 EXPANSION BOARD HARDWARE USER MANUAL

CAN BUS

IGEPv2 EXPANSION board integrates a Stand-Alone CAN controller with SPI interface, MICROCHIP MCP2515.

Microchip Technology’s MCP2515 is a stand-aloneController Area Network (CAN) controller that implements the CAN specification, version 2.0B. It is capable of transmitting and receiving both standard and extended data and remote frames.

The MCP2515 has two acceptance masks and six acceptance filters that are used to filter out unwanted messages, thereby reducing the host MCUs overhead. The

MCP2515 interfaces with microcontrollers (MCUs) via an industry standard Serial

Peripheral Interface (SPI).

MCP2515 features:

• Implements CAN V2.0B at 1 Mb/s:

0 – 8 byte length in the data field

Standard and extended data and remote frames

• Receive buffers, masks and filters:

Two receive buffers with prioritized message storage

Six 29-bit filters

Two 29-bit masks

• Data byte filtering on the first two data bytes (applies to standard data frames)

• Three transmit buffers with prioritization and abort features

• High-speed SPI Interface (10 MHz):

SPI modes 0,0 and 1,1

• One-shot mode ensures message transmission is attempted only one time

• Clock out pin with programmable prescaler:

Can be used as a clock source for other device(s)

• Start-of-Frame (SOF) signal is available for monitoring the SOF signal:

• Can be used for time-slot-based protocols and/or bus diagnostics to detect early bus degradation

• Interrupt output pin with selectable enables

• Buffer Full output pins configurable as:

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IGEPv2 EXPANSION BOARD HARDWARE USER MANUAL

15

Interrupt output for each receive buffer

General purpose output

• Request-to-Send (RTS) input pins individually configurable as:

Control pins to request transmission for each transmit buffer

General purpose inputs

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5 IGEPV2 CONNECTION

IGEPv2 EXPANSION board is connected to IGEPv2 board by using J990, JA41, JA42,

JC30 and J960 headers. Just take a look on the figure below.

16

Figure 7 IGEPv2 and IGEPv2 EXPANSION bottom entry assembly

IGEPv2 board connectors:

J990: SAMTEC TSW-114-15-F-D

JA41: SAMTEC FTS-114-01-L-D

JA42: SAMTEC FTS-110-01-L-D

JC30: SAMTEC FTS-114-01-L-D

IGEPv2 EXPANSION connector:

J990: SAMTEC HLE-114-92-L-DV-BE

JA41: SAMTEC SFMC-114-01-L-D

JA42: SAMTEC SFMC-111-01-L-D

JC30: SAMTEC SFMC-115-01-L-D

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17

SAMTEC

HLE Serie

BOTTOM ENTRY

3.66mm

4.57mm

SAMTEC

SFMC Serie

SAMTEC

SFMC Serie

3.05mm

1.27mm SAMTEC

FTS Serie

SAMTEC

FTS Serie

SAMTEC

TSW Serie

5,85mm

2.54mm

5.84mm

SAMTEC

HLE Serie

BOTTOM ENTRY

SAMTEC

SFMC Serie

SAMTEC

FTS Serie

SAMTEC

SFMC Serie

SAMTEC

FTS Serie

SAMTEC

TSW Serie

Figure 8 IGEPv2 Bottom entry assembly

Figure 9 IGEPv2 connector detail

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Figure 10 IGEPv2 connector detail

Figure 11 IGEPv2 and IGEPv2 EXPANSION bottom entry assembly

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19

6 CONNECTORS DESCRIPTION

This section will guide you through the IGEPv2 EXPANSION connectors:

J201 POWER JACK

J301 POWERTIP 4.3” DATA CONNECTOR

J302 SEIKO 7” DATA CONNECTOR

J303 SEIKO 7” BACKLIGHT CONNECTOR

J304 SEIKO 7” TOUCHSCREEN CONNECTOR

J405 MODEM GSM/GPRS SIMCARD CONNECTOR

J404 MODEM GSM/GPRS EXTERNAL ANTENNA CONNECTOR

J501, J502 VIDEO COMPOSITE INPUTS CONNECTOR

J601 UART1 HEADER CONNECTOR

J602 UART1 JST CONNECTOR

J603 RS232 HEADER CONNECTOR

J604 RS232 DB9 CONNECTOR

• J703 CAN BUS CONNECTOR

• J801 VGA CONNECTOR

• J991 LVDS CONNECTOR

• J5 CAMERA CONNECTOR

• J990 IGEPv2 EXPANSION CONNECTOR

• J960 IGEPv2 EXPANSION CONNECTOR

• JA41 IGEPv2 EXPANSION CONNECTOR

• JA42 IGEPv2 EXPANSION CONNECTOR

• JC30 IGEPv2 EXPANSION CONNECTOR

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6.1

J201 - POWER JACK

The J201 connector is a power jack for main 5 VDC power.

It is a switchcraft connector ref. RASM722, Plug/Mating Plug Diameter 2.1mm ID,

5.5mm OD.

20

Figure 12 J200 detail

WARNING: IGEPv2 EXPANSION BOARD CAN ONLY BE

POWERED WITH 5V DC.

The connector is located as shows the figure below.

Figure 13 J201 location

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6.2

J301 - POWERTIP 4.3” DATA CONNECTOR

J301 is a FPC connector 40pos 0.5mm pitch upper contact.

The connector is located as shows the figure below.

Figure 14 J301 location

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6.3

J302, J303 AND J304 - SEIKO 7” CONNECTORS

J302 is a FPC connector 40pos 0.5mm pitch bottom contact.

J303 is a FPC connector 6pos 0.5mm pitch dual sided contact.

J304 is a FPC connector 4pos 1mm pitch dual sided contact.

The connectors are located as shows the figure below.

Figure 15 J302, J303 and J304 location

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6.4

J405 - MODEM GSM/GPRS SIMCARD CONNECTOR

The connector is located as shows the figure below.

Figure 16 J405 location

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6.5

J404 - MODEM GSM/GPRS EXTERNAL ANTENNA CONNECTOR

J404 is a GSC connector for the external GSM/GPRS antenna. It is a MURATA GSC connector, Part number MM9329-2700RA1.

24

Figure 17 J404 specification

Figure 18 J404 location

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6.6

J501, J502 - VIDEO COMPOSITE INPUTS CONNECTOR

The connectors are located as shows the figure below.

Figure 19 J501 and J502 location

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6.7

J601 AND J602 - UART1 HEADER CONNECTOR

The connectors are located as shows the figure below.

Figure 20 J601 and J602 location

Figure 21 J601 and J602 schematic

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6.8

J603 - RS232 HEADER CONNECTOR

The connector is located as shows the figure below.

Figure 22 J603 location

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6.9

J604 - RS232 DB9 CONNECTOR

The connector is located as shows the figure below.

Figure 23 J604 location

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6.10

J703 - CAN BUS CONNECTOR

The connector is located as shows the figure below.

Figure 24 J703 location

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6.11

J801 - VGA CONNECTOR

The connector is located as shows the figure below.

Figure 25 J801 location

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6.12

J5 - CAMERA CONNECTOR

The connector is located as shows the figure below.

Figure 26 J5 location

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32

6.13

J990 - IGEPV2 EXPANSION CONNECTOR

J990 is used for IGEPv2 board connection.

The J960 connector is a 14x2 pins double row 2.54mm pitch.

The connectors is located as shows the figure below.

Figure 27 J990 location

Figure 28 J990 schematic detail

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6.14

J960 - IGEPV2 EXPANSION CONNECTOR

J960 is used for IGEPv2 board connection.

The J960 connector is a 5x2 pins double row 2.54mm pitch.

The connector is located as shows the figure below.

Figure 29 J960 location

Figure 30 J960 schematic detail

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6.15

JA41 - IGEPV2 EXPANSION CONNECTOR

JA41 is used for IGEPv2 board connection.

The JA41 connector is a 14x2 pins double row 1.27mm pitch.

The connector is located as shows the figure below.

Figure 31 JA41 location

Figure 32 JA41 schematic detail

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6.16

JA42 - IGEPV2 EXPANSION CONNECTOR

JA42 is used for IGEPv2 board connection.

The JA42 connector is a 11x2 pins double row 1.27mm pitch.

The connector is located as shows the figure below.

Figure 33 JA42 location

Figure 34 JA42 schematic detail

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6.17

JC30 - IGEPV2 EXPANSION CONNECTOR

JC30 is used for IGEPv2 board connection.

The JC30 connector is a 15x2 pins double row 1.27mm pitch.

The connector is located as shows the figure below.

Figure 35 JC30 location

Figure 36 JC30 schematic detail

ISEE 2007 SL. All rights reserved, IGEP® is a registered trademark from ISEE 2007 SL. The following is provided for informational purposes only.

DOCUMENT FROM ISEE 2007 S.L. 24-Sep-2010

IGEPv2 EXPANSION BOARD HARDWARE USER MANUAL

37

7 MECHANICAL SPECIFICATION

Board size 93x64mm.

Figure 37 Mechanical drawing Top view

Figure 38 Mechanical drawing bottom view.

ISEE 2007 SL. All rights reserved, IGEP® is a registered trademark from ISEE 2007 SL. The following is provided for informational purposes only.

DOCUMENT FROM ISEE 2007 S.L. 24-Sep-2010

IGEPv2 EXPANSION BOARD HARDWARE USER MANUAL

38

8 BOARD REFERENCE

Product Name: IGEPv2_EXPANSION-R z-yy

IGEPv2_EXPANSION R z

Product Name Where z is A,B,C,… and details revision family yy

Where yy is

FULL: All features on board.

Example:

IGEPV2_EXPANSION-RA-FULL: All features on board.

ISEE 2007 SL. All rights reserved, IGEP® is a registered trademark from ISEE 2007 SL. The following is provided for informational purposes only.

DOCUMENT FROM ISEE 2007 S.L. 24-Sep-2010

IGEPv2 EXPANSION BOARD HARDWARE USER MANUAL

9 LIST OF FIGURES

Figure 1 ISEE IGEPV2 EXPANSION ................................................................... 7

Figure 2 IGEPv2 EXPANSION Top view ............................................................. 9

Figure 3 IGEPv2 EXPANSION Bottom view ........................................................ 9

Figure 4 LCD view ......................................................................................... 10

Figure 5 Modem view .................................................................................... 11

Figure 6 Telit module view ............................................................................. 12

Figure 7 IGEPv2 and IGEPv2 EXPANSION bottom entry assembly ....................... 16

Figure 8 IGEPv2 Bottom entry assembly .......................................................... 17

Figure 9 IGEPv2 connector detail .................................................................... 17

Figure 10 IGEPv2 connector detail .................................................................. 18

Figure 11 IGEPv2 and IGEPv2 EXPANSION bottom entry assembly ..................... 18

Figure 12 J200 detail .................................................................................... 20

Figure 13 J201 location ................................................................................. 20

Figure 14 J301 location ................................................................................. 21

Figure 15 J302, J303 and J304 location ........................................................... 22

Figure 16 J405 location ................................................................................. 23

Figure 17 J404 specification ........................................................................... 24

Figure 18 J404 location ................................................................................. 24

Figure 19 J501 and J502 location .................................................................... 25

Figure 20 J601 and J602 location .................................................................... 26

Figure 21 J601 and J602 schematic................................................................. 26

Figure 22 J603 location ................................................................................. 27

Figure 23 J604 location ................................................................................. 28

Figure 24 J703 location ................................................................................. 29

ISEE 2007 SL. All rights reserved, IGEP® is a registered trademark from ISEE 2007 SL. The following is provided for informational purposes only.

DOCUMENT FROM ISEE 2007 S.L. 24-Sep-2010

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IGEPv2 EXPANSION BOARD HARDWARE USER MANUAL

Figure 25 J801 location ................................................................................. 30

Figure 26 J5 location ..................................................................................... 31

Figure 27 J990 location ................................................................................. 32

Figure 28 J990 schematic detail...................................................................... 32

Figure 29 J960 location ................................................................................. 33

Figure 30 J960 schematic detail...................................................................... 33

Figure 31 JA41 location ................................................................................. 34

Figure 32 JA41 schematic detail ..................................................................... 34

Figure 33 JA42 location ................................................................................. 35

Figure 34 JA42 schematic detail ..................................................................... 35

Figure 35 JC30 location ................................................................................. 36

Figure 36 JC30 schematic detail ..................................................................... 36

Figure 37 Mechanical drawing Top view ........................................................... 37

Figure 38 Mechanical drawing bottom view. ..................................................... 37

40

ISEE 2007 SL. All rights reserved, IGEP® is a registered trademark from ISEE 2007 SL. The following is provided for informational purposes only.

DOCUMENT FROM ISEE 2007 S.L. 24-Sep-2010

IGEPv2 EXPANSION BOARD HARDWARE USER MANUAL

41

10 CHANGELOG

Revision 00

Initial draft

Revision 01

Release version

ISEE 2007 SL. All rights reserved, IGEP® is a registered trademark from ISEE 2007 SL. The following is provided for informational purposes only.

DOCUMENT FROM ISEE 2007 S.L. 24-Sep-2010

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