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UM2617
User manual
Discovery kit with STM32L562QE MCU
Introduction
The STM32L562E-DK Discovery kit is designed as a complete demonstration and development platform for STMicroelectronics
Arm ® Cortex ® -M33 core-based STM32L562QEI6Q microcontroller with TrustZone ® . It features 256 Kbytes of internal SRAM and 512 Kbytes of internal Flash memory, one flexible memory controller (FMC) interface, one Octo-SPI memory interface, one
LCD-TFT controller, one RTC, up to 16 timers, one USB Type-C ® device FS port with UCPD controller, two SAI ports, four
I²C buses, six USART ports, three SPI, one CAN-FD port, one SDMMC interface, 2x 12-bit ADC, 2x 12-bit DAC, 2 low-power comparators, 4 digital filters for sigma-delta modulation, touch-sensing capability, an embedded step down converter, and JTAG and ETM debugging support.
application development, although it is not considered as the final application.
The full range of hardware features on the board helps the user to evaluate all the peripherals (USB, USART, digital microphones, ADC and DAC, TFT LCD, Octo-SPI Flash memory device, microSD ™ card, audio codec, joystick, user button,
Bluetooth ® Low Energy, accelerometer and gyroscope) and to develop applications. Extension headers allow easy connection of a daughterboard or wrapping board for a specific application.
An STLINK-V3E is integrated on the board, as embedded in-circuit debugger and programmer for the STM32 MCU and the
USB Virtual COM port bridge.
Figure 1. STM32L562E-DK Discovery kit (top view)
Picture is not contractual.
UM2617 - Rev 6 - June 2021
For further information contact your local STMicroelectronics sales office.
www.st.com
1
Note:
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Features
Features
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•
•
•
•
•
•
•
•
•
•
•
•
• STM32L562QEI6Q microcontroller featuring 512 Kbytes of Flash memory and 256 Kbytes of SRAM in
BGA132 package
1.54" 240 × 240 pixel-262K color TFT LCD module with parallel interface and touch-control panel
USB Type-C ® Sink device FS
On-board energy meter: 300 nA to 150 mA measurement range with a dedicated USB interface
SAI Audio CODEC
MEMS digital microphones
512-Mbit Octal-SPI Flash memory
Bluetooth ® V4.1 Low Energy module iNEMO 3D accelerometer and 3D gyroscope
2 user LEDs
User and reset push-buttons
Board connectors:
– USB Type-C ®
– microSD ™ card
– Stereo headset jack including analog microphone input
– JTAG debugger
– DPM dynamic-power measurement interface for external device
– STMod+ expansion connector with fan-out expansion board for Wi ‑ Fi ® compatible connectors
, Grove, and mikroBUS ™
– Pmod ™ expansion connector
– Audio MEMS daughterboard expansion connector
– ARDUINO ® Uno V3 expansion connector
Flexible power-supply options: ST-LINK, USB V
BUS
, or external sources
On-board STLINK-V3E debugger/programmer with USB re-enumeration capability: mass storage, Virtual
COM port, and debug port
Comprehensive free software libraries and examples available with the STM32CubeL5 MCU Package
Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded
Workbench ® , MDK-ARM, and STM32CubeIDE
Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
UM2617 - Rev 6 page 2/63
2
2.1
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Ordering information
Ordering information
To order the STM32L562E-DK Discovery kit, refer to
. Additional information is available from the datasheet and reference manual of the target STM32.
Order code
STM32L562E-DK
1. Fan-out board.
•
•
Table 1. Ordering information
Board references
MB1373
MB1280
Target STM32
STM32L562QEI6Q
Codification
The meaning of the codification is explained in Table 2
. The order code is mentioned on a sticker placed on the top or bottom side of the board.
STM32TTXXY-DK
STM32TT
XX
Y
Table 2. Codification explanation
Description
MCU series in STM32 32-bit Arm Cortex MCUs
MCU product line in the series
•
STM32 Flash memory size:
E for 512 Kbytes
Example: STM32L562E-DK
STM32L5 Series
STM32L562
512 Kbytes
UM2617 - Rev 6 page 3/63
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Development environment
3
3.1
Note:
Development environment
•
•
System requirements
Windows ® OS (7, 8, or 10), Linux ® 64-bit, or macOS ®
USB Type-A or USB Type-C ® to Micro-B cable macOS ® is a trademark of Apple Inc. registered in the U.S. and other countries.
Linux ® is a registered trademark of Linus Torvalds.
All other trademarks are the property of their respective owners.
3.2
•
•
•
Development toolchains
IAR Systems ® - IAR Embedded Workbench ®
Keil ® - MDK-ARM
STMicroelectronics - STM32CubeIDE
1. On Windows ® only.
3.3
Demonstration software
The demonstration software, included in the STM32Cube MCU Package corresponding to the on-board microcontroller, is preloaded in the STM32 Flash memory for easy demonstration of the device peripherals in standalone mode. The latest versions of the demonstration source code and associated documentation can be downloaded from www.st.com
.
UM2617 - Rev 6 page 4/63
4 Conventions
provides the conventions used for the ON and OFF settings in the present document.
Convention
Jumper JPx ON
Jumper JPx OFF
Jumper JPx [1-2]
Solder bridge SBx ON
Solder bridge SBx OFF
Resistor Rx ON
Resistor Rx OFF
Table 3. ON/OFF convention
Definition
Jumper fitted
Jumper not fitted
Jumper fitted between Pin 1 and Pin 2
SBx connections closed by 0 Ω resistor
SBx connections left open
Resistor soldered
Resistor not soldered
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Conventions
UM2617 - Rev 6 page 5/63
5
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Delivery recommendations
Delivery recommendations
Before first use, check the board for any damage that might have occurred during shipment, that all socketed components are firmly fixed in their sockets and that none are loose in the plastic bag.
UM2617 - Rev 6 page 6/63
6
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Hardware layout and configuration
Hardware layout and configuration
illustrates STM32L562QEI6Q connections with peripheral components.
shows the location of the main components on the top side of the Discovery board and
shows the location of the main components on the bottom side of the Discovery board.
Figure 2. Hardware block diagram
5V_SELECTION
3V3 POWER
SUPPLY
1V8 POWER
SUPPLY
3V3
1V8
3V3
Power consumption metering
32 kHz crystal
Optional
16 MHz crystal
STLINK-V3E
USB
STDC14
TAG
LCD TFT connector
1.54" 240x240
Multi-point capacitive touch screen
Octo-SPI Flash
512 KBytes
USB Type-C ® connector FS microSD™ connector
I2C1
I2C1
Octal-
SPI
USB FS
UCPD
SDMMC
RTC
HSI
VCP
UART
SWD
FMC
STM32L562QEI6Q
SAI
DFSDM
GPIOs
GPIOs
GPIOs
GPIO
GPIO
SPI1
User interface
2 LEDs
User Interface
RESET and USER buttons
BLE V4.1
3D accelerometer
3D gyrometer
I2C1
Switch
Audio DAC and amplifier
Stereo jack
Line out / Mic_IN
External STM module. Up to 4 microphones
ARDUINO ® Uno connectors
STMod+ connectors
Pmod™ connectors
UM2617 - Rev 6 page 7/63
UM2617 - Rev 6
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Hardware layout and configuration
Figure 3. STM32L562E-DK PCB layout (top view)
Figure 4. STM32L562E-DK PCB layout (bottom view) page 8/63
6.1
6.1.1
6.1.2
Note:
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Embedded STLINK-V3E
Embedded STLINK-V3E
•
•
Description
There are two different ways to program and debug the onboard STM32 MCU:
Using the embedded STLINK-V3E
Using an external debug tool connected to CN8 STDC14/MIPI-10 connector
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•
The STLINK-V3E facility for debugging and flashing is integrated into the STM32L562E-DK Discovery kit.
The STLINK-V3E makes the STM32L562E-DK Discovery kitArm ® Mbed Enabled ™ .
The embedded STLINK-V3E supports only SWD and VCP for STM32 devices.
•
•
Features supported in STLINK-V3E:
• 5 V power supplied by the CN17 USB connector
USB 2.0 high-speed-compatible interface
JTAG and serial wire debugging (SWD) specific features:
– 3 to 3.6 V application voltage on the JTAG/SWD interface and 5V tolerant inputs
– JTAG
– SWD and serial viewer (SWV) communication
STDC14 (MIPI10) compatible connector (CN8)
LD3 status LED (COM) which blinks during communication with the PC
LD11 fault red LED (OC) alerting on USB overcurrent request
5 V / 500 mA output power supply capability (U47) with current limitation and LD11 LED
5 V power green LD12 LED (5V)
describes the CN17 USB Micro-B connector pinout.
Pin
3
4
1
2
5
Pin name
VBUS
DM
DP
ID
GND
Table 4. CN17 USB Micro-B connector pinout
Signal name
5V_USB_CHGR
USB_DEV_HS_CN_N
USB_DEV_HS_CN_P
-
GND
STLINK-V3E STM32 pin
-
PB14
PB15
GND
GND
Function
VBUS Power
DM
DP
ID
GND
Drivers
Before connecting the STM32L562E-DK board to a Windows PC via USB, the user must install a driver for the
STLINK-V3E (not required for Windows 10). It is available on the www.st.com
website.
In case the STM32L562E-DK board is connected to the PC before the driver is installed, some STM32L562E-DK interfaces may be declared as “Unknown” in the PC device manager. In this case, the user must install the dedicated driver files, and update the driver of the connected device from the device manager as shown in
.
Prefer using the USB Composite Device handle for a full recovery.
UM2617 - Rev 6 page 9/63
Figure 5. USB composite device
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Embedded STLINK-V3E
Note:
6.1.3
6.1.4
37xx:
• 374E for STLINK-V3E without bridges functions
• 374F for STLINK-V3E with bridges functions
STLINK-V3E firmware upgrade
The STLINK-V3E embeds a firmware upgrade mechanism for in-situ upgrades through the USB port. As the firmware may evolve during the lifetime of the STLINK-V3E product (for example new functionalities, bug fixes, support for new microcontroller families), it is recommended to visit the www.st.com
website before starting to use the STM32L562E-DK Discovery kit and periodically, to stay up-to-date with the latest firmware version.
Using an external debug tool to program and debug the onboard STM32
There are 2 basic ways to support an external debug tool:
1.
Keep the embedded STLINK-V3E running. Power on the STLINK-V3E at first until the COM LED lights RED.
Then connect the external debug tool through CN8 STDC14/MIPI-10 debug connector.
2.
Set the embedded STLINK-V3E in a high impedance state. When setting the jumper JP6 (STLK_RST) ON, the embedded STLINK-V3E is in RESET state and all GPIOs are in high impedance. Then the user can connect his external debug tool to the debug connector CN8.
Figure 6. Connecting an external debug tool to program the on-board STM32L5
UM2617 - Rev 6 page 10/63
shows the CN8 STDC14 connector pinout.
Figure 7. CN8 STDC14 connector pinout
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Embedded STLINK-V3E
UM2617 - Rev 6
describes the CN8 STDC14/MIPI10 debug connector pinout.
Table 5. STDC14 connector pinout
STM32 pin
-
VDD
GND
GND
-
-
PA10
Board function
-
Power
Power
Power
KEY
GNDDetect: Pull-down
T.VCP_RX: Target RX used for VCP (can be a UART supported bootloader)
Pin
1
3
5
7
9
11
13
Pin
2
4
6
8
10
12
14
Board function
-
T.SWDIO: Target SWDIO using SWD protocol or Target
JTMS (T.JTMS) using JTAG protocol
T.SWCLK: Target SWCLK using SWD protocol or Target
JCLK (T.JCLK) using JTAG protocol
T.SWO: Target SWO using
SWD protocol or Target
JTDO (T_JTMS) using JTAG protocol
T.JTDI
: Not used by SWD protocol, Target JTDI (T.JTDI) using JTAG protocol, only for external tools
NRST: Target NRST using
SWD protocol or Target JTMS
(T.JTMS) using JTAG protocol
T.VCP_TX: Target TX used for VCP (can be a UART supported bootloader)
STM32 pin
-
PA13
PA14
PB3
PA15
NRST
PA9
1. PA15 is used by default for the UCPD_CC1 feature. To use PA15 for JTDI, add the R42 resistor. In this case, the
UCPD_CC1 feature cannot be used.
page 11/63
6.2
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TAG footprint
TAG footprint
The CN9 TAG footprint can also output a debug interface compatible with the TAG probe TC2050-IDC-NL.
shows the TAG connector pinout.
Figure 8. CN9 TAG connector pinout
describes the CN9 TAG connector pinout.
Table 6. CN9 TAG connector pinout
STM32 pin
VDD
Board function
Power
Pin
1
Pin
10
Board function
NRST: Target NRST using
SWD protocol or Target JTMS
(T.JTMS) using JTAG protocol
STM32 pin
NRST
PA13
T.SWDIO: Target SWDIO using SWD protocol or Target
JTMS (T.JTMS) using JTAG protocol
2 9 NC -
GND Power 3 8
T.JTDI
: Not used by SWD protocol, Target JTDI (T.JTDI) using JTAG protocol, only for external tools
PA15
PA14
T.SWCLK: Target SWCLK using SWD protocol or Target
JCLK (T.JCLK) using JTAG protocol
4 7 NC -
GND Power 5 6
T.SWO: Target SWO using
SWD protocol or Target
JTDO (T_JTMS) using JTAG protocol
PB3
1. PA15 is used by default for the UCPD_CC1 feature. To use PA15 for JTDI, add the R42 resistor. In this case, the
UCPD_CC1 feature cannot be used.
UM2617 - Rev 6 page 12/63
6.3
6.3.1
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Power supply
Power supply
5 V power supply general view
The STM32L562E-DK Discovery kit is designed to be powered from a 5 V DC power source.
•
•
One of the following 5 V DC power inputs can be used, upon an appropriate board configuration:
• 5V_STLK provided by a host PC connected to CN17 through a Micro-B USB cable (default configuration)
• 5V_VIN provided by an external 7-12V power supply connected to CN18 pin 8 (ARDUINO ® )
5V_UCPD provided by a host PC connected to CN15 through a USB Type-C
®
cable.
•
5V_PM provided by a host PC connected to CN16 through a Micro-B USB cable (This one is used for the energy meter function).
5V_CHG provided by a 5 V USB charger connected to CN17 through a Micro-B USB cable
• 5V_DC provided by an external 5V_DC source on ARDUINO ® CN18 pin 5, or directly after the JP4 connector for 5 V selection
When 5V_VIN, 5V_CHG, 5V_DC, or 3V3 is used to power the STM32L562E-DK board, this power source must comply with the standard EN-60950-1: 2006+A11/2009 and must be Safety Extra Low Voltage (SELV) with limited power capability
LD12 Green LED turns on when the voltage on the power line marked as 5 V is present. All supply lines required for the operation of the components on STM32L562E-DK are derived from that 5 V line.
When the power supply is external 3V3 or 5V_CHG on CN17, the STLINK-V3E can not be used.
describes the 5 V power supply capabilities.
Input power name
5V_STLK
5V_VIN
5V_UCPB
5V_PM
5V_CHG
5V_DC
Connector pins
CN17 pin 1
JP4 [1-2]
CN18 pin 8
JP4 [3-4]
CN15
JP4 [5-6]
CN16 pin 1
JP4 [7-8]
CN17 pin 1
JP4 [9-10]
CN18 pin 5
JP4 pin
2/4/6/8/10
JUMPER OFF
Table 7. Power supply capabilities
Input voltage range
7 to 12 V
Max.
current
-
Limitation
4.75 to 5.25 V 500 mA
•
•
The maximum current depends on the USB enumeration:
100 mA without enumeration
500 mA with correct enumeration
•
•
•
From 7 V to 12 V only and input current capability is linked to input voltage:
800 mA input current when VIN=7 V
450 mA input current when 7V<VIN<9 V
250 mA input current when 9 V<VIN<12 V
4.75 to 5.25 V
4.75 to 5.25 V
1 A
-
The maximum current depends on the USB host used to power the board.
4.75 to 5.25 V 500 mA
•
•
The maximum current depends on the USB enumeration:
100 mA without enumeration.
500 mA with correct enumeration
The maximum current depends on the USB charger used to power the board.
4.75 to 5.25 V -
The maximum current depends on the 5V_DC used to power the board.
UM2617 - Rev 6 page 13/63
6.3.2
UM2617
Power supply
Power supply input from STLINK-V3E USB connector (default setting): 5V/500mA
5V_STLK is a DC power with limitation from CN17 STLINK-V3E USB connector, the USB type Micro-B connector of STLINK-V3E. In this case, the JP4 jumper must be on pin [1-2] to select the 5V_STLK power source on the
JP4 silkscreen. This is the default setting. If the USB enumeration succeeds, the 5V_STLK power is enabled, by asserting the PWR_ENn signal (from the STLINK-V3E MCU). This pin is connected to a power switch
STMPS2151STR, which powers the board. This power switch features also a 500 mA current limitation to protect the PC in case of an onboard short-circuit.
The Discovery board and its shield on it can be powered from the CN17 STLINK-V3E USB connector, but only
STLINK-V3E circuit has the power before USB enumeration because the host PC only provides 100 mA to the board at that time. During the USB enumeration, the Discovery board asks for 500 mA current to the host PC. If the host can provide the required power, the enumeration finishes by a SetConfiguration command, and then, the power switch is switched ON, the green LED LD12 turned ON, thus the Discovery board and its shield on it can consume 500 mA current, but no more. If the host is not able to provide the requested current, the enumeration fails. Therefore the power switch remains OFF and the MCU part including the expansion board is not powered.
As a consequence, the green LED LD12 remains turned OFF. In this case, it is mandatory to use another power supply.
5V_STLK power source configuration for jumper JP4 [1-2] is described in
.
Figure 9. JP4 [1-2]: 5V_STLK PWR SOURCE
UM2617 - Rev 6 page 14/63
6.3.3
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Power supply
5V_VIN power source: 7 to 12 V, 800 mA maximum
5V_VIN is the DC power coming from the CN18 ARDUINO
®
connector. In this case, the JP4 jumper must be on pin [3-4] to select the 5V_VIN power source on the JP4 silkscreen.
A dedicated LDO (U10) is used to generate the 5V_VIN from the 7 to 12 V VIN input.
5V_VIN power source configuration for jumper JP4 [3-4] is described in Figure 10
.
Figure 10. JP4 [3-4]: 5V_VIN PWR SOURCE
6.3.4
5V_UCPD power source: 5 V, 1 A maximum
5V_UCPD is the DC power supply connected to the CN15 user USB Type-C ® connector for Power Delivery. To select the 5V_UCPD power source on the JP4 silkscreen, the JP4 jumper must be on pins [5-6].
5V_UCPD power source configuration for jumper JP4 [5-6] is described in
Figure 11. JP4 [5-6]: CN15 5V_USB_TYPE_C PWR SOURCE
UM2617 - Rev 6 page 15/63
6.3.5
UM2617
Power supply
5V_PM power source: 5 V, 500 mA
5V_PM is the DC power coming from the energy metering part on the CN16 USB connector. In this case, the JP4 jumper must be on pin [7-8] to select the 5V_PM power source on the JP4 silkscreen.
When the 5V_PM is selected, the SW1 switch must be set in position “PM_MEAS” to be able to provide and measure VDD.
5V_PM power source configuration for jumper JP4 [7-8] is described in
.
Figure 12. JP4 [7-8]: CN16 5V_PM PWR SOURCE
6.3.6
5V_CHG power source: 5 V
5V_CHG is the DC power charger connected to CN17 USB STLINK-V3E. To select the 5V_CHG power source on
JP4 silkscreen, the JP4 jumper must be on pins [9-10]. In this case, if the STM32L562E-DK board is powered by an external USB charger, then the debug on the STLINK-V3E USB connector is not available.
UM2617 - Rev 6 page 16/63
5V_CHG power source configuration for jumper JP4 [9-10] is described in Figure 13
.
Figure 13. JP4 [9-10]: CN17 5V_CHG PWR SOURCE
UM2617
Power supply
Note:
6.3.7
With this JP4 configuration: 5V_CHG, the USB_PWR protection is bypassed. Never use this configuration with a computer connected instead of the charger, because the USB_PWR_protection is bypassed, and if the board consumption is more than 500mA, this can damage the computer. If a 500 mA current is enough, it is recommended to prefer the 5V_STLK source instead of the 5V_CHG source.
5V_DC power source
5V_DC is the DC power coming from external (5V DC power from CN5 pin5 ARDUINO ® or JP4 pin 2, 4, 6, 8, or
10 jumper connectors. In this case, the JP4 jumper must be OFF.
5V_DC power source configuration for jumper JP4 [-] is described in Figure 14
.
Figure 14. JP4 [-]: 5V_DC PWR SOURCE
UM2617 - Rev 6 page 17/63
UM2617
Power supply
6.3.8
6.3.9
6.3.10
Programing/debugging when the power supply is not from STLINK-V3E (5V_STLK)
5V_VIN, 5V_PM, 5V_DC, or 5V_UCPD can be used as an external power supply, in case the current consumption of the STM32L562E-DK Discovery kit, with expansion boards, exceeds the allowed current on USB.
In such a condition, it is still possible to use USB for communication for programming or debugging only.
In this case, it is mandatory to power the board first using 5V_VIN, 5V_PM, 5V_DC or 5V_UCPD then connect a
USB cable to the PC. Proceeding this way, the enumeration succeeds thanks to the external power source.
The following power sequence procedure must be respected:
1.
Connect the JP4 jumper according to the external 5V power source selected.
2.
Connect the external power source according to JP4.
3.
Power ON the external power supply.
4.
Check 5V GREEN LED LD12 is turned ON.
5.
Connect the PC to the CN17 USB connector.
If this sequence is not respected, the board may be powered by V
BUS risk may be encountered:
first from STLINK-V3E, and the following
•
•
If more than 500 mA current is needed by the board, the PC may be damaged or current can be limited by
PC, As a consequence the board is not powered correctly.
500mA is requested at enumeration, so there is a risk that the request is rejected and enumeration does not succeed if the PC does not provide such current. Consequently, the board is not powered (LED LD12 remains OFF).
External power supply output
5V: When the STM32L562E-DK board is powered by 5V_STLK, 5V_VIN, 5V_PM, 5V_UCPD, or 5V_CHG, the 5V on ARDUINO ® CN18 pin 5 can be used as an output power supply for an expansion board plugged on CN18. In this case, the maximum current of the power source specified in
must be respected.
3V3: ARDUINO ® CN18 pin 4 can also be used as a power supply output. The current is limited by the maximum
300 mA current capability of the U46 DC-DC converter (TPS62743), concerning the STM32L562E-DK board and its shield consumption.
Internal power supply
For all general information concerning Design recommendations for STM32L562QEI6Q with INTERNAL SMPS, and design guide for ultra-low-power applications with performance, refer to the application note Getting started with STM32L5 Series hardware development ( AN5211 ) at the www.st.com
website.
3V3
Regardless of the 5V power source, a U46 DC-DC converter is used to deliver a fixed 3.3 V power supply, with a current capability of 300 mA. This power source of 3.3 V is shared between the STM32L562E-DK and its expansion board.
1V8
Regardless of the 5V power source, a U44 DC-DC converter is used to deliver a fixed 1.8 V voltage, with a current capability of 300 mA. This power source of 3.3 V is shared between the STM32L562E-DK and its expansion board.
When VDD_MCU is connected to 1V8, the MCU switches to LDO mode instead of SMPS mode.
Warning:
The power sequence is not respected when using 1V8 VDD. Refer to the application note
Getting started with STM32L5 Series hardware development ( AN5211 ), and STM32L5xx product datasheets for power sequencing.
DYN_OUT
The STM32L562E-DK Discovery kit offers the possibility to make dynamic current consumption measurements with a range of 300nA to 150mA. This function is done according to an energy meter embedded part. Refer to
Section 6.19 MCU energy meter tools
.
UM2617 - Rev 6 page 18/63
UM2617
Power supply
VDD_MCU selection
•
•
VDD_MCU used to supply the STM32 can be powered by the U46 DC-DC converter (3V3) by setting JP3 [1-2], or by the U44 DC-DC converter (1V8) by setting JP3 [2-3]. For both configurations, the SW1 must be in the VDD position.
VDD_MCU can be also powered by energy meter tools. To use the energy meter tools, follow the configuration below:
Set the SW1 switch to the position PM_MEAS.
Power the board through the 5V_PM with the CN16 USB connector.
• JP4 jumper must be on pin [7-8] to select the 5V_PM power source on JP4 silkscreen.
With this configuration, it is recommended to set JP3 to the correct position, 3V3 or 1V8, to respect the I/O level compatibility between MCU and onboard I/Os.
VDD_MCU power selection schematic is described in Figure 15
.
Figure 15. VDD_MCU power selection schematics
UM2617 - Rev 6
Figure 15 details the VDD_MCU power selection.
JP6
JP3 [1-2]
JP3 [2-3]
SW1
SW1 [1-2] [5-6]
SW1 [2-3] [6-7]
SW1 [1-2] [5-6]
SW1 [2-3] [6-7]
JP3 [x-x] SW1 [2-3] [6-7]
Table 8. VDD_MCU power selection
DCDC U46 3V3
NA
U44 DC-DC 1V8
NA
Current measurement selection
Comment
U46 is used to provide 3V3 VDD_MCU.
U46 is used to provide 3V3 only for the onboard device, not the MCU.
U44 is used to provide 1V8 VDD_MCU.
U44 is used to provide 3V3 only for the onboard device, not the MCU.
The energy metering part is used to supply
VDD_MCU and to perform current consumption measurement.
1. The default configuration is shown in bold.
page 19/63
Figure 16 describes the VDD_MCU power selection on the STM32L562E-DK board.
Figure 16. VDD_MCU power selection
UM2617
RSS/bootloader
6.4
6.4.1
RSS/bootloader
The bootloader is located in the system memory, programmed by ST during production. It is used to reprogram the Flash memory by using USART, I 2 C, SPI, CAN FD, or USB FS in device mode through the DFU (device firmware upgrade). The bootloader is available on all devices. Refer to the application note STM32 microcontroller system memory boot mode (AN2606) for more details.
The Root Secure Services (RSS) are embedded in a flash area named Secure information block, programmed during ST production. For example, it enables Secure Firmware Installation (SFI) thanks to the RSS extension firmware (RSSe SFI). This feature allows customers to protect the confidentiality of the FW to be provisioned into the STM32 when production is sub-contracted to an untrusted 3rd party. The RSS is available on all devices, after enabling the TrustZone ® through the TZEN option bit.
The bootloader version can be identified by reading the bootloader ID at the address 0x0BF97FFE .
Limitation
The STM32L5 part soldered on STM32L562E-DK on the product version DK32L562E$AT1 (sticker available on the top side of the board) embeds the bootloader V9.0 affected by the limitations to be worked around, as described hereunder. The bootloader ID of the bootloader V9.0 is 0x90 .
The following limitations exist in the bootloader V9.0:
Issue observed:
Option Byte programming in RDP level 0.5
: The user can not program non-secure option bytes in RDP level
0.5 through the bootloader.
Proposed workaround:
The user can program option bytes thanks to STM32CubeProgrammer GUI or command-line interfaces through
JTAG. To know how to program option bytes through STM32CubeProgrammer, refer to the user manual
STM32CubeProgrammer software description ( UM2237 ).
Issue observed:
Impossible to set TZEN option bit : The user can not set the TZEN option bit through the bootloader interfaces.
UM2617 - Rev 6 page 20/63
UM2617
RSS/bootloader
Caution:
6.4.2
Proposed workaround:
Instead of the bootloader interface, the user can use JTAG to set the TZEN option bit.
Issue observed:
Go command on USB-DFU interface : The user can not use the Go command through bootloader on the
USB-DFU interface.
Proposed workaround:
Instead of the USB-DFU interface, the user can use JTAG or any other communication ports supported by the bootloader to run Go command, like USART, I 2 C, SPI, or CAN FD.
Only SFI through JTAG is fully supported on bootloader V9.0. SFI through bootloader interfaces is partially supported because some option bytes cannot be managed by the bootloader and they must be set through
JTAG.
Boot from RSS
On STM32L562E-DK, the PH3-BOOT0 is fixed to a LOW level allowing the boot from the memory address defined by the SECBOOTADD0 option byte. To change the boot from RSS, it is needed to set the PH3-BOOT0 to the HIGH level by removing R32 and soldering R31, or just by applying 3V3 on the PH3-BOOT0 signal between
R32 and R31. In this second case, it is not necessary to remove R32 or to add R31.
Figure 17 explains how to connect 3V3 to BOOT0.
Figure 17. BOOT0 modification to set the HIGH level
UM2617 - Rev 6 page 21/63
6.5
6.5.1
6.5.2
6.6
UM2617
Clock source
Clock source
•
LSE clock reference
The LSE clock reference on the STM32L562QEI6Q microcontroller is done by an external crystal X2.
32.768 kHz crystal from NDK referenced NX2012SA
•
HSE clock reference
The HSE clock references on the STM32L562QEI6Q microcontroller can be done by:
• Internal RC for MSI clock reference (Default configuration)
• STLK_MCO from STLINK-V3E: 8MHz optional clock not connected by default
16 MHz crystal X1, for HSE clock generator. This one is optional and not mounted by default.
describes the I/O configuration for the optional HSE.
I/O
PH0
PH1
Resistor
R28
R27
R26
Table 9. I/O configuration for the optional HSE
Setting
OFF
ON
OFF
ON
OFF
ON
Configuration
PH0 OSC_IN terminal is not connected to STLK_MCO
MSI is used
PH0 is used as GPIO LCD_PWR-ON (R29 connected)
PH0 OSC_IN is connected to STLK_MCO 8 MHz
MSI not used
PH0 not used as GPIO
PH0 OSC_IN terminal is not connected to the HSE crystal
MSI is used
PH0 is used as GPIO LCD_PWR-ON (R29 connected)
PH0 OSC_IN is connected to the 16 MHz HSE crystal
MSI not used
PH0 not used as GPIO
PH1 OSC_OUT terminal is not connected to the HSE crystal
MSI is used
PH1 is used as GPIO MEMS LED (R25 connected)
PH1 OSC_OUT is connected to the 16 MHz HSE crystal
MSI not used
PH1 not used as GPIO
1. The default configuration is shown in bold.
Reset source
The reset signal of the STM32L562E-DK Discovery kit is active low. Internal PU forces the RST signal to a high level.
•
•
Sources of reset are:
• B1 RESET button (black button)
Embedded STLINK-V3E
CN8 JTAG/SWD STDC connector and CN9 TAG connector (reset from debug tools)
• CN18 pin 3 ARDUINO ® connector (reset from daughterboard)
• PD12 from energy meter part included in the STM32L562E-DK Discovery kit
UM2617 - Rev 6 page 22/63
6.7
6.7.1
6.7.2
6.7.3
6.7.4
UM2617
Audio
Audio
Description
A codec CS42L51-CNZ (U1) is connected to the SAI interface of STM32L562QEI6Q which supports the TDM feature of the SAI port. The TDM feature offers STM32L562QEI6Q the capability to stream stereo audio channels.
There is one low-power digital microphone on-board the STM32L562E-DK. The Discovery kit offers the possibility to connect a MEMS expansion module.
Operating voltage
The microphone is supplied by VDD and is compatible with the VDD_MCU voltage range from 1.8 to 3.3 V. The audio codec has two supplies:
• VL connected to VDD compatible with VDD_MCU voltage selection 1V8 or 3V3 according to audio codec datasheet
• 1V8_CODEC source provided by U44
Audio codec interface
The audio codec interface is the MCU SAI1 and an I 2 C interface.
Table 10 describes the I/O configuration for the audio codec interface.
I/O
PG1
PE2
PE3
PE4
PE5
PE6
PB6
PB7
Table 10. I/O configuration for the audio interface
Configuration
PG1 is used as Audio RESET (active LOW).
PE2 is used as SAI.MCLK_A.
PE3 is used as SAI.SD_B.
PE4 is used as SAI.FS_A.
PE5 is used as SAI.SCK_A.
PE6 is used as SAI.SD_A.
PB6 is used as I2C1_SCL shared between ARDUINO ® , CTP, STMod+, 3D accelerometer, and 3D gyrometer.
PB7 is used as I2C1_SDA shared between ARDUINO ® , CTP, STMod+, 3D accelerometer, and 3D gyrometer.
Headphones outputs
The STM32L562E-DK Discovery kit can drive stereo headphones. The STM32L562QEI6Q sends up the stereo audio channels, via its SAI1 TDM port, to the codec device. The codec device converts the digital audio stream to stereo analog signals. It then boosts them for direct drive of headphones connecting to CN13 3.5 mm stereo jack receptacles on the board.
The audio codec is set by an I²C-bus. The address is a 7-bit address, with an additional bit to read or write (High to read, low to write). The AD0 pin connected to GND gives the least significant bit of the address. The address of the audio codec is 0b1001010x . The hexadecimal code is 0x94 to write, and 0x95 to read.
UM2617 - Rev 6 page 23/63
6.7.5
Audio jack connector
Figure 18 shows the CN13 audio jack connector.
Figure 18. CN13 audio jack connector
UM2617
Audio
6.7.6
Table 11 describes the CN13 audio jack connector pinout.
Pin
2
3
4
5
6
7
Table 11. CN13 audio jack connector pinout
Signal name
MIC_IN
GND
AOUTB
-
AOUTA
-
Codec pin
MICIN1
GND
AOUTB
NA
AOUTA
NA
Function
Microphone IN
GND
OUT_SPEAKER_LEFT
-
OUT_SPEAKER_RIGHT
NA
Digital microphone interface
A low ‑ power digital microphone U16 is available on STM32L562E-DK.
The interface used for this microphone is the DFSDM1 with DFSDM1_CKOUT and DFSDM1_DATIN1. The microphone is supplied with a programmable clock directly generated by STM32L562QEI6Q.
The STM32L562QEI6Q DFSDM interface is shared and exclusive between the embedded microphone U13, the
MEMs expansion module on connector CN2 and with the CN3 STMod+ connector.
A quad SPDT switch U2 driven by a jumper JP1 routs the DFSDM interface to the selected application.
Table 12 describes the I/O configuration for the Audio DFSDM interface.
I/O
PG7
PB12
Table 12. I/O configuration for the U13 AUDIO MEMS
Configuration
PG7 used as DFSDM_CKOUT
PB12 used as DFSDM_DATIN1
UM2617 - Rev 6 page 24/63
UM2617
Audio
Table 13 describes the I/O configuration for the Audio DFSDM interface.
Function
STM32 pin
GND -
-
DFSDM DATA3 PC7
-
-
-
-
-
-
3V3 -
-
-
-
-
-
Table 13. CN13 audio jack connector pinout
Signal name
GND
-
DFSDM_DATIN3
-
-
-
-
-
-
3V3
Pin
9
1
13
15
17
19
1
3
5
7
Pin
12
14
16
18
20
2
4
6
8
10
Signal name
STM32 pin
Function
3V3 3V3
DFSDM_CKOUT_EXT PG7 DFSDM CLK
DFSDM_DATIN1_EXT PB12 DFSDM DATA1
-
DETECTn -
-
Module detection
MEMS_LED
-
PH1
-
Module LED
-
-
-
GND -
-
-
-
GND
Table 14 describes the I/O configuration for the Audio DFSDM interface.
6.7.7
Caution:
Table 14. I/O configuration for the Audio DFSDM interface
JP1 jumper
OFF
OFF
ON
MEMS module on CN2
NOT
CONNECTED
CONNECTED
NOT
CONNECTED
STMod+ shield on CN3
NOT
CONNECTED
NOT
CONNECTED
CONNECTED
Configuration
The U2 switch connects directly the DFSDM interface to the U16 onboard MEMS (signal DETECTn low).
The U2 switch disconnects DFSDM of the U16 onboard MEMS, and connects the DFSDM to the CN2 connector (signal DETECTn switched
HIGH by the module on CN2 pin10).
The U2 switch disconnects DFSDM of the U16 onboard MEMS, and connects the DFSDM to the CN2 connector (signal DETECTn switched
HIGH by the jumper JP1).
1. The default configuration is shown in bold.
I/O restriction to other features
Due to the sharing of some I/Os of STM32L562QEI6Q by multiple peripherals, and because STM32L562QEI6Q only supports one DFSDM interface, the following limitations apply in using the Audio DFSDM features:
The U16 onboard MEMS, the MEMS module on CN2, and the STMod+ DFSDM interface cannot be operated simultaneously.
UM2617 - Rev 6 page 25/63
6.8
6.8.1
6.8.2
6.8.3
6.8.4
UM2617
USB Type-C® FS port
USB Type-C ® FS port
Description
The STM32L562E-DK Discovery kit supports USB full-speed (FS) communication. The CN15 USB connector is a
USB Type-C
®
connector.
The STM32L562E-DK Discovery kit supports USB Type-C ® sink mode only.
A green LED LD2 lits up when V
BUS a USB device.
is powered by a USB host when the STM32L562E-DK Discovery kit works as
Operating voltage
The STM32L562E-DK Discovery kit supports USB voltage, from 4.75 to 5.25 V.
MCU VDD_USB only supports the 3.3 V voltage.
USB FS device
When a USB host connection to the CN15 USB Type-C ® connector of STM32L562E-DK is detected, the
STM32L562E-DK Discovery kit starts behaving as a USB device . Depending on the powering capability of the
USB host , the board can take power from the V
BUS
terminal of CN15. In the board schematic diagrams, the corresponding power voltage line is called 5V_UCPD.
Section 6.3 Power supply provides information on how to use the powering option.
Table 15 describes the HW configuration for the USB interface.
I/O
PA11
PA12
Table 15. I/O configuration for the USB interface
PA11 used as USB_FS_N diff pair interface
Configuration
PA12 used as USB_FS_P diff pair interface
UCPD
USB Type-C ® introduces the USB Power Delivery feature. The STM32L562E-DK Discovery kit supports the dead battery and the SINK mode.
In addition to the DP/DM I/Os directly connected to the USB Type-C ® connector, 5 I/Os are also used for UCPD configuration: Configuration Channel (CCx), VBUS-SENSE, UCPD dead battery (DBn), and UCPD_FAULT (FLT) feature.
To protect STM32L562E-DK from USB over-voltage, a USB Type-C ® PPS-compliant port protection is used,
TCPP01-M12, IC compliant with IEC6100-4-2 level 4.
• Configuration Channel I/O: UCPD_CCx: These signals are connected to the associated CCx line of the
USB Type-C ® connector through the STM USB port Protection TCPP01-M12. These lines are used for the configuration channel lines (CCx) to select the USB Type-C ® current mode. STM32L562E-DK only supports
SINK current mode.
•
•
Dead battery I/O: UCPD_DBn: This signal is connected to the associated DBn line of the TCPP01-M12. The
STM USB port Protection TCPP01-M12 manages internally the dead battery resistors.
V
BUS
fault detection: UCPD_FLT: This signal is provided by the STM Type-C port Protection. It is used as fault reporting to MCU after a bad V
BUS
V
BUS
protection is set to 6 V maximum.
level detection. By design, R45 set to 2.7 kΩ, the STM32L562E-DK
UM2617 - Rev 6 page 26/63
6.8.5
UM2617
USB Type-C® FS port
Table 16 describes the I/O configuration for the UCPD feature.
PA15
PB15
PA4
PB5
I/O
-
R42
R33
JP5
HW
Table 16. I/O configuration for the UCPD feature
Setting
OFF
ON
-
OFF
ON
ON
PB14 -
1. The default configuration is shown in bold.
Configuration
PA15 used as USB_C.CC1
PA15 shared between USB_C.CC1 and JTAG JTDI
PB15 used as USB_C.CC2 (No other muxing)
PA4 not used as VBUS_SENSE
PA4 shared between VBUS_SENSE and ARD_ADC.A2
PB5 shared between USB-C.DB1 (Dead battery mode supported),
ARD.D11 and STMod+
PB14 used as USB-C.FLT (over-voltage fault reporting to MCU)
USB Type-C
®
connector
Figure 19 shows the pinout of the CN15 USB Type-C
® connector.
A1
GND
GND
B12
A2
TX1+
RX1+
B11
A3
TX1-
RX1-
B10
Figure 19. CN15 USB Type-C ® connector pinout
A4 A5 A6 A7 A8 A9
V
BUS
V
BUS
CC1
SBU2
D+
D-
D-
D+
SBU1
CC2
V
BUS
V
BUS
A10
RX2-
TX2-
B9 B8 B7 B6 B5 B4 B3
A11
RX2+
TX2+
B2
A12
GND
GND
B1
Table 17 describes the pinout of the CN15 USB Type-C
® connector.
STM32 pin
-
-
-
-
PA15
PA12
PA11
-
-
-
-
-
Table 17. CN15 USB Type-C ® connector pinout
Signal name
GND
TX1+
TX1-
VBUSc
CC1
D+
D-
SBU1
VBUSc
RX2-
RX2+
GND
B7
B6
B5
B4
B3
B2
B1
Pin
B12
B11
B10
B9
B8
A6
A7
A8
A9
A10
A11
A12
Pin
A1
A2
A3
A4
A5
Signal name
GND
RX1+
RX1-
VBUSc
SBU2
D-
D+
CC2
VBUSc
TX2-
TX2+
GND
STM32 pin
-
-
-
-
-
PA11
PA12
PB15
-
-
-
-
UM2617 - Rev 6 page 27/63
UM2617 microSD™ card
6.8.6
Caution:
I/O restriction to other features
Due to the sharing of some I/Os of STM32L562QEI6Q by multiple peripherals, the following limitations apply in using the USB features:
The USB UCPD cannot be operated simultaneously with full JTAG (JTDI).
• If PA15 is used as USB_CC1 (USB peripheral), JTDI cannot be used for JTAG peripheral.
The USB UCPD imposes some restrictions on the ARDUINO ® and the STMod+.
• If PB5 is used as USB_DBn (USB peripheral) and JP5 is OFF, ARDUINO ® D11 (SPI_MOSI or timer) cannot be used, and STMod+ SPI3_MOSIP cannot be used.
6.9
6.9.1
6.9.2
6.9.3
microSD™ card
Description
The CN1 slot for the microSD ™ card is routed to the STM32L562QEI6Q SDIO port. This interface is compliant with SD Memory Card Specification Version 4.1: SDR104 SDMMC_CK speed limited to the maximum allowed I/O speed. UHS-II mode is not supported.
Operating voltage
The SD card interface is only compatible with the 3.3 V voltage range, from 2.7 to 3.6 V.
The SD card interface does not support the MCU low voltage 1.8 V range.
SD card interface
The SD card interface is used in 4 data lines D [0:3], one CLK, one CDM, and a card detection signal.
Table 18 describes the HW configuration for the SDIO interface.
I/O
PF2
PC8
PC9
PC10
PC11
PC12
PD2
Table 18. I/O configuration for the SDIO interface
Configuration
PF2 is connected to SDCARD DETECT.
PC8 is connected to SDCARD SDIO_D0.
PC8 is shared with STMod+ pin 14 (Timer function).
PC9 is connected to SDCARD SDIO_D1.
PC9 is shared with Pmod ™ pin 8 / STMod+ pin 12 (RST function).
PC10 is connected to SDCARD SDIO_D2.
PC10 is shared with Pmod ™ pin 2 / STMod+ pin 2 (UART_TX function).
PC11 is connected to SDCARD SDIO_D3.
PC11 is shared with Pmod ™ pin3 / STMod+ pin 3 (UART_RX function).
PC12 is connected to SDCARD SDIO_CLK.
PD2 is connected to SDCARD SDIO_CMD.
PD2 is shared with Pmod ™ pin 4 / STMod+ pin 3 (UART_RTS function).
UM2617 - Rev 6 page 28/63
Figure 20 shows the CN1 SD card connector.
Figure 20. CN1 SD card connector
UM2617 microSD™ card
Table 19 describes the CN1 SD card connector pinout.
Pin
1
2
3
4
5
6
7
8
9
10/11/12/13
Pin names
DAT2
DAT3_CD
CMD
VDD
CLK
VSS
DAT0
DAT1
CARD_DETECT
GND
Table 19. CN1 SD card connector pinout
Signal name
SDIO.D2
SDIO.D3
SDIO.CMD
VDD
SDIO.CLK
GND
SDIO.D0
SDIO.D1
SDIO.DETECT
GND
STM32 pin
PC10
PC11
PD2
-
PC12
-
PC8
PC9
PF2
-
Function
SDIO.D2
SDIO.D3
SDIO.CMD
VDD_SDCARD
SDIO.CLK
GND
SDIO.D0
SDIO.D1
SDCARD_DETECT active LOW
GND pin
6.9.4
Caution:
I/O restriction to other features
Due to the sharing of some I/Os of STM32L562QEI6Q by multiple peripherals, the following limitations apply in using the SDIO features:
The microSD™ card cannot be operated simultaneously with Pmod ™ .
The microSD™ card cannot be operated simultaneously with STMod+.
UM2617 - Rev 6 page 29/63
UM2617
User LEDs
6.10
6.10.1
6.10.2
Caution:
6.10.3
User LEDs
Description
Two general-purpose color LEDs (LD9 and LD10) are available as light indicators. Each LED is in light-emitting state when a low level is applied to the corresponding ports.
The green LD10 and the red LD9 user LEDs are directly connected to STM32L562QEI6Q.
Operating voltage
As LEDs are driven by the I/O LOW level, they are compatible with VDD_MCU 3.3 V and 1.8 V.
With this configuration, consumption is not optimized because of the I/Os at 1.8 V and LEDs VDD at 3.3 V. A small leakage current can appear.
LED interface
Table 20 describes the I/O configuration for the LED interface.
I/O
PG12
PD3
Table 20. HW configuration for the LED interface
Configuration
PG12 is connected to the green LED LD10 and active low.
PD3 is connected to the red LED LD9 and active low.
6.11
6.11.1
6.11.2
6.11.3
Physical input devices: buttons
Description
The STM32L562E-DK Discovery kit provides two push buttons for physical human control.
• The USER button (B2),
• The RST reset button (B1).
Operating voltage
Input devices for physical human control are connected to VDD or are referenced to GND. So input devices are compatible with VDD_MCU voltage range from 1.8 to 3.3 V.
Physical input I/O interface
Table 21 describes the I/O configuration for the physical user interface.
I/O
NRST
PC13
Table 21. I/O configuration for the physical user interface
Configuration
RST reset button (active LOW)
USER button (active HIGH, connected as MCU WKUP2 function) (shared with PM_WAKE-UP)
UM2617 - Rev 6 page 30/63
UM2617
Octo-SPI memory devices
6.12
6.12.1
6.12.2
6.12.3
PB2
PC0
PC1
PC2
PC3
NRST
I/O
PA2
PA3
PA6
PA7
PB0
PB1
Octo-SPI memory devices
Description
MX25LM51245GXDI00, a 512-Mbit Octal-SPI Flash memory device, is fitted on STM32L562E-DK, in the U6 position. It is used when evaluating the STM32L562QEI6Q Octo-SPI interface.
MX25LM51245GXDI00 can operate in both single (STR) and double (DTR) transfer-rate modes.
Operating voltage
The voltage of the MX25LM51245GXDI00 Octo-SPI Flash memory device is in the range of 2.7 to 3.6 V.
The OCTO-SPI memory does not support the low voltage MCU 1.8 V.
Octo-SPI I/O interface
Table 22 describes the HW configuration for the Octo-SPI interface.
Table 22. I/O configuration for the Octo-SPI interface
Configuration
PA2 is connected to Octo-SPI FLASH as NCS.
PA3 is connected to Octo-SPI FLASH as CLK.
PA6 is connected to Octo-SPI FLASH as IO3.
PA7 is connected to Octo-SPI FLASH as IO2.
PB0 is connected to Octo-SPI FLASH as IO1.
PB1 is connected to Octo-SPI FLASH as IO0.
PB2 is connected to Octo-SPI FLASH as DQS.
PC0 is connected to Octo-SPI FLASH as IO7.
PC1 is connected to Octo-SPI FLASH as IO4.
PC2 is connected to Octo-SPI FLASH as IO5.
PC3 is connected to Octo-SPI FLASH as IO6.
NRST is connected to Octo-SPI FLASH as RESET.
UM2617 - Rev 6 page 31/63
UM2617
Bluetooth® Low Energy (BLE)
6.13
6.13.1
6.13.2
6.13.3
6.14
6.14.1
6.14.2
6.14.3
Bluetooth ® Low Energy (BLE)
Description
The STM32L562E-DK Discovery kit supports a Bluetooth ® Low Energy module (BLE) V4.1. This function is supported by the STM module SPBTLE-RFTR. This module is driven by an SPI interface.
The Bluetooth antenna is integrated into the SPBTLE-RFTR module.
Operating voltage
The SPBTLE module supports the voltage range from 1.8 to 3.3 V.
BLE I/O interface
Table 23 describes the I/O configuration for the BLE interface.
I/O
PG8
PG6
PG5
PG4
PG3
PG2
Table 23. I/O configuration for the BLE I/O interface
Configuration
PG8 is connected to BLE_RSTN.
PG6 is connected to BLE_INT.
PG5 is connected to SPI1.BLE_CS.
PG4 is connected to SPI1.MOSI.
PG3 is connected to SPI1.MISO.
PB0 is connected to SPI1.SCK.
3D-accelerometer and 3D-gyroscope
Description
The STM32L562E-DK Discovery kit supports a 3d accelerometer and a 3d gyroscope. These functions are supported by the STM module LSM6DSO. This module is driven by an I 2 C interface.
Operating voltage
The LSM6DSO module supports the voltage range from 1.8 to 3.3 V.
3D accelerator and gyrometer interface
The 3D ACC/GYRO is set by an I 2 C-bus. The address is a 7-bit address with an additional R/W bit (HIGH for reading, LOW for writing). The SD0/SA0 pin connected to GND gives the least significant bit address. The 3D
ACC/GYRO address is 0b1101010x : 0xD4 to write, and 0xD5 to read.
Table 24 describes the I/O configuration for the 3D ACC/GYRO interface.
I/O
PF3
PB6
PB7
Table 24. I/O configuration for the 3D ACC/GYRO interface
Configuration
PF3 is connected to GYRO_ACC_INT.
PB6 used as I2C1_SCL shared between ARDUINO ® , Audio, STMod+, and CTP.
PB7 used as I2C1_SDA shared between ARDUINO ® , Audio, STMod+, and CTP.
UM2617 - Rev 6 page 32/63
UM2617
TFT LCD
6.15
6.15.1
6.15.2
TFT LCD
Description
The CN7 29-pin FCP connector is used to connect a TFT LCD module supporting the FMC interface. It is associated with the CN14 10-pin connector used for the Touch panel.
The LCD module is composed of the TFT LCD module FRQ154BP2902 with an LCD driver ST7789H2. The LCD supports a resolution of 240 (RGB) x 240 dots 262K-color, 1.54”. and a touch-sensitive panel driven by a self capacitive controller FT6236.
Operating voltage
The LCD module supports several power supplies: core power supply connected to 3V3, and I/O power supply connected to VDD and compatible with 1V8 and 3V3 voltage.
The touch panel supports several power supplies: core power supply connected to 3V3, and I/O power supply connected to VDD and compatible with 1V8 and 3V3 voltage.
The backlight of the LCD is driven by an external IC U7 STLD40DPUR connected directly to 5V.
UM2617 - Rev 6 page 33/63
UM2617
TFT LCD
6.15.3
PE12
PE13
PE14
PE15
PD8
PE7
PE8
PE9
PE10
PE11
I/O
PD7
PD5
PD4
PF0
PD14
PD15
PD0
PD1
PD9
PD10
PE1
PF1
PA8
PF14
PF15
PH0
PB6
PB7
LCD interface
Table 25 describes the I/O configuration for the LCD and CTP interface.
Table 25. I/O configuration for the LCD and CTP interface
Configuration
PD7 is used as LCD.FMC_NE1_CS.
PD5 is used as LCD.FMC_NWE.
PD4 is used as LCD.FMC_NOE.
PF0 is used as LCD.FMC_A0_RS.
PD14 is used as LCD.FMC_D0.
PD15 is used as LCD.FMC_D1.
PD0 is used as LCD.FMC_D2.
PD1 is used as LCD.FMC_D3.
PE7 is used as LCD.FMC_D4.
PE8 is used as LCD.FMC_D5.
PE9 is used as LCD.FMC_D6.
PE10 is used as LCD.FMC_D7.
PE11 is used as LCD.FMC_D8.
PE12 is used as LCD.FMC_D9.
PE13 is used as LCD.FMC_D10.
PE14 is used as LCD.FMC_D11.
PE15 is used as LCD.FMC_D12.
PD8 is used as LCD.FMC_D13.
PD9 is used as LCD.FMC_D14.
PD10 is used as LCD.FMC_D15.
PE1 is used as LCD_BL_CTRL.
PF1 is used as LCD.CTP_INT for the touch panel.
PA8 is used as LCD.TE.
PF14 is used as LCD.RST.
PF15 is used as CTP.RST.
PH0 is used to switch OFF the LCD power supplies.
PB6 is used as I2C1_SCL shared between ARDUINO ® , Audio, STMod+, 3D ACC & 3D GYRO.
PB7 is used as I2C1_SDA shared between ARDUINO ® , Audio, STMod+, 3D ACC & 3D GYRO.
UM2617 - Rev 6 page 34/63
Figure 21 shows the CN7 LCD connector pinout.
Figure 21. CN7 LCD connector pinout
UM2617
TFT LCD
UM2617 - Rev 6 page 35/63
UM2617 - Rev 6
UM2617
TFT LCD
Table 26 describes the CN7 LCD interface and connector pinout.
Function
D7
D5
D3
D1
NOE
GND
D15
D13
D11
D9
RS
LCD_RST
IOVCC
GND
LEDK
STM32 pin
PE10
PE8
PD1
PD15
PD4
-
PD10
PD8
PE14
PE12
PF0
PF14
-
-
-
Table 26. CN7 LCD connector pinout
Signal name
GND
LCD.FMC_D15
LCD.FMC_D13
LCD.FMC_D11
LCD.FMC_D9
LCD.FMC_D7
LCD.FMC_D5
LCD.FMC_D3
LCD.FMC_D1
LCD.FMC_NOE
LCD.FMC_A0_RS
LCD.RST
VDD_LCD
GND
LEDK
Pin name Pin Pin Pin name Signal name
GND
DB15
DB13
DB11
DB9
DB7
DB5
DB3
DB1
RDn
RS
RESET
IOVCC
GND
LEDK
1
3
5
7
9
11 12
13 14
15 16
17 18
19 20
21
23 24
25 26
27
29
2
4
6
8
10
22
28
-
FMARK
DB14
DB12
DB10
DB8
DB6
DB4
DB2
DB0
WRn
CS
IM
VCI
LEDA
-
LCD.TE
LCD.FMC_D14
LCD.FMC_D12
LCD.FMC_D10
LCD.FMC_D8
LCD.FMC_D6
LCD.FMC_D4
LCD.FMC_D2
LCD.FMC_D0
LCD.FMC_NWE
LCD.FMC_CS
IM
3V3_LCD
LEDA
-
STM32 pin
PE9
PE7
PD0
PD14
PD5
PA8
PD9
PE15
PE13
PE11
PD7
-
-
-
-
Figure 22 shows the CN14 touch panel connector pinout.
Figure 22. CN14 LCD touch panel connector pinout
Function
LCD.TE
D14
D12
D10
D8
D6
D4
D2
D0
NWE
CS
IM
VCI
LEDA
page 36/63
UM2617
Pmod™ connector
6.16
6.16.1
6.16.2
6.16.3
Table 27 describes the CN14 touch panel interface and connector pinout.
Function
GND
CTP_INT
GND
I2C1_SDA
I2C1_SCL
STM32 pin
-
PF1
-
PB7
PB6
Table 27. CN14 touch panel connector pinout
Signal name Pin name Pin Pin Pin name
GND
LCD.CTP_INT
GND
I2C1_SDA
I2C1_SCL
GND
INT
GND
SDA
SCL
1
2
3
4
5
10
9
8
7
6
GND
VDD
IOVCC
RESET
GND
Signal name
GND
VDD_LCD
VDD_LCD
LCD.CTP_RST
GND
STM32 pin
-
-
-
PF15
-
Function
GND
VDD
IOVCC
LCD.RST
GND
Pmod™ connector
Description
The CN4 Pmod ™ standard connector is in the STM32L562E-DK board to support flexibility in small form factor applications. The Pmod ™ connector implements the Pmod ™ type 2A and 4A on the STM32L562E-DK board.
Operating voltage
The Pmod ™ module is directly supplied by 3.3 V. VDD and VDD_MCU must be set to 3.3 V to be I/O compatible with the Pmod ™ module.
Pmod
™
interface
A quad SPDT switch driven by two I/Os is used to connect three different interfaces: SPI, UART, and mikroBUS™ interfaces to the Pmod ™ connector.
connector.
Table 28. I/O configuration for the Pmod ™ interface
I/O PF12
STMod+
SEL_34
0
0
1
1
I/O PF11
STMod+
SEL_12
0
1
0
1
SPI interface PB13/PB5/PB4/PG9 used for SPI mode mikroBUS™ interface PC10/PC11 for UART mode and PB13/PG9 for SPI mode
Not used
UART interface PB13/PC10/PC11/PD2 used for UART mode
1. The default configuration is shown in bold.
UM2617 - Rev 6 page 37/63
™ connector pinout.
Figure 23. CN4 Pmod ™ connector pinout
UM2617
Pmod™ connector
™ interface and connector pinout.
6.16.4
Caution:
Function
SPI3
USART3
SPI3
USART3
SPI3
USART3
SPI3
USART3
GND
Power
STM32 pin
PB13
PB13
PB5
PC10
PB4
PC11
PG9
PD2
-
-
Table 29. CN4 Pmod ™ connector pinout
Signal name Signal name Pin name Pin Pin Pin name
SPI_NSS
UART_CTS
SPI_MOSI
UART_TX
SPI_MISO
UART_RX
SPI_SCK
UART_RTS
GND
VDD
1
2
3
4
5
6
1
2
3
4
5
6
7
8
9
10
11
12
7
8
9
10
11
12
PMOD_INT
PMOD_RST
NC
NC
GND
VDD
STM32 pin
PF5
Function
INT5
PC9
NC
NC
-
-
Reset
NC
NC
GND
Power
I/O restriction to other features
Due to the sharing of some I/Os of STM32L562QEI6Q by multiple peripherals, the following limitations apply in using the Pmod ™ features:
• The Pmod ™ cannot be operated simultaneously with the UCPD function.
•
•
The Pmod ™ cannot be operated simultaneously with the STMod+ function.
The Pmod ™ cannot be operated simultaneously with the SD card function.
UM2617 - Rev 6 page 38/63
UM2617
STMod+ connector
6.17
6.17.1
6.17.2
6.17.3
STMod+ connector
Description
The CN3 STMod+ standard connector is on the STM32L562E-DK board to support flexibility in small form factor application. The STMod+ expansion connector supports the MB1280 fan-out expansion board for Wi ‑ Fi and mikroBUS™ compatible connectors
® , Grove,
Operating voltage
The STMod+ module is directly supplied by 5V. STM32L562E-DK I/O level can be set according to STMod+ module 3.3 V. The fan-out board also embeds a 3.3 V regulator and I 2 C level shifters. For more detailed information, refer to the ST fan-out board user manual and relevant datasheets of associated modules.
STMod+ interface
A quad SPDT switch driven by two I/Os is used to connect three different interfaces: SPI, UART, and mikroBUS ™ interface to the STMod+ connector.
Table 30 describes the I/O configuration to select the SPI, UART, or mikroBUS
™ interface to the STMod+ connector.
For more detailed information about the MB1280 fan-out expansion board, refer to the user manual STMod+ fan-out expansion board for STM32 Discovery kits and Evaluation boards ( UM2695 ).
Table 30. I/O configuration for the STMod+ interface
IO PF12
STMod+
SEL_34
0
0
1
1
IO PF11
STMod+
SEL_12
0
1
0
1
SPI interface PB13/PB5/PB4/PG9 used for SPI mode mikroBUS ™ interface PC10/PC11 for UART mode and PB13/PG9 for SPI mode
Not used
UART interface PB13/PC10/PC11/PD2 used for UART mode
1. The default configuration is shown in bold.
Figure 24 shows the STMod+ connector pinout.
Figure 24. CN3 STMod+ connector pinout
UM2617 - Rev 6 page 39/63
UM2617
ARDUINO® connectors
Table 31 describes the CN3 STMod+ interface and connector pinout.
6.17.4
Caution:
Table 31. CN3 STMod+ interface and connector pinout
MCU Function
SPI3
USART3
STM32 pin
PB13
PB13
PB5
Function
SPI_NSS
UART_CTS
Pin
1
Pin
11
Function
PMOD_INT
STM32 pin
PF5
SPI3
USART3
SPI_MOSIp
UART_TX
2 12 PMOD_RST PC9
SPI3
USART3
SPI3
USART3
GND
Power
I2C1
SPI3
SPI3
I2C1
PC10
PB4
PC11
PG9
PD2
-
-
PB6
PD6
PG10
PB7
SPI_MISOp
UART_RX
SPI_SCK
UART_RTS
GND
5V
I2C1_SCL
SPI3_MOSIs
SPI3_MISOs
I2C1_SDA
3
4
7
8
9
10
5
6
13
14
15
16
17
18
19
20
STMod+ ADC
STMod+ _TIM
5V
GND
DFSDM1_DATIN1
DFSDM1_CKOUT
DFSDM1_DATIN3
DFSDM1_CKOUT
1. To use PB5 as SPI_MOSI, it is recommended to remove JP5 to disconnect the USB_DBn function.
PA0
PC8
-
-
PB12
PG7
PC7
PG7
MCU Function
INT5
Reset
ADC1_IN5
TIM8_CH3
Power
GND
DFSDM
DFSDM
DFSDM
DFSDM
I/O restriction to other features
•
•
Due to the sharing of some I/Os of STM32L562QEI6Q by multiple peripherals, the following limitations apply in using the STMod+ features:
• The STMod+ cannot be operated simultaneously with the UCPD function.
The STMod+ cannot be operated simultaneously with the Pmod ™ function.
The STMod+ cannot be operated simultaneously with the SDCARD function.
• The STMod+ cannot be operated simultaneously with the ARDUINO ® function.
• The STMod+ cannot be operated simultaneously with onboard MEMS and module CN2 MEMS.
6.18
6.18.1
6.18.2
ARDUINO ® connectors
Description
The ARDUINO ® Uno V3 connectors (CN11, CN12, CN18, and CN19) are available on the STM32L562E-DK board. Most shields designed for ARDUINO ® can fit with the STM32L562E-DK Discovery kit to offer flexibility in small form factor application
Operating voltage
The ARDUINO ® Uno V3 connector supports 5 V, 3.3 V, and VDD for I/O compatibility. VIN, voltage range from 7 to 12 V is also available to supply the STM32L562E-DK Discovery kit from an ARDUINO ® shield.
Section 6.3 Power supply provides information on how to use the powering option.
UM2617 - Rev 6 page 40/63
6.18.3
ARDUINO
®
interface
® connector pinouts.
Figure 25. ARDUINO ® connector pinouts
UM2617
ARDUINO® connectors
UM2617 - Rev 6 page 41/63
UM2617 - Rev 6
UM2617
ARDUINO® connectors
Table 32 describes the I/O configuration for the ARDUINO
® interface.
Table 32. I/O configuration for the ARDUINO ® interface
I/O
PA0
PA1
PA4
PA5
PC4
PC5
PB10
PA10
PB11
PA9
PD11
PD12
PF4
PD13
PB8
PC6
PG0
PB9
PE0
PB5
PB4
PG9
PB7
PB6
HW
R131 ON
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R33 OFF
-
-
-
-
R33 ON
R125 OFF
R125 ON
R124 OFF
R124 ON
R133 OFF
R133 ON
R131 OFF
PA0 is used as ARD.A0: ADC1_IN5.
shared with STMod+.
PA1 is used as ARD.A1: ADC1_IN6.
PA4 is used as ARD.A2: ADC1_IN9 only.
PA4 is used as ARD.A2: ADC1_IN9.
Shared with USB_C.VBUS_SENSE
PA5 is used as ARD.A3: ADC1_IN10.
PC4 is used as ARD.A4: ADC1_IN13.
PC5 is used as ARD.A5: ADC1_IN14.
PB10 is not used as ARD.D0:
PB10 can be used for VCP UART.
PB10 is used as ARD.D0: LPUART1_RX.
PA10 is not used as ARD.D0:
PA10 is used for VCP UART.
PA10 can be used as ARD.D0: USART1_RX
PB11 is not used as ARD.D1: LPUART1_TX.
PB11 can be used for VCP UART.
PB11 is used as ARD.D1: LPUART1_TX.
PA9 is not used as ARD.D1: USART1_TX.
PA9 is used for VCP UART.
PA9 can be used as ARD.D1: USART1_TX.
PD11 is used as ARD.D2: I/O.
PD12 is used as ARD.D3: TIM4_CH1.
PF4 is used as ARD.D4: INT.
PD13 is used as ARD.D5: TIM4_CH2.
PB8 is used as ARD.D6: TIM4_CH3.
PC6 is used as ARD.D7: I/O.
PG0 is used as ARD.D8: I/O.
PB9 is used as ARD.D9: TIM4_CH4.
PE0 is used as ARD.D10: SPI_CSn and TIM16_CH1.
PB5 is used as ARD.D11: SPI3_MOSI and TIM3_CH2 shared with UCPD, Pmod ™ and
STMod+.
PB4 is used as ARD.D12: SPI3_MISO shared with Pmod ™ and STMod+.
PG9 is used as ARD.D13: SPI3_SCK shared with Pmod ™ and STMod+.
PB7 is used as ARD.D14: I2C1_SDA shared between STMod+, Audio, LCD, and 3D accelerometer and 3D gyrometer.
PB6 is used as ARD.D15: I2C1_SCL shared between STMod+, Audio, LCD, and 3D accelerator and 3D gyrometer.
1. The default configuration is shown in bold.
page 42/63
UM2617 - Rev 6
UM2617
ARDUINO® connectors
Table 33 describes the ARDUINO connector pinout.
Table 33. ARDUINO ® connector pinout
Connector
CN18
CN19
CN12
1
2
3
4
5
2
3
4
8
1
5
6
Pin names
1
2
3
4
5
6
7
6
7
8
1
2
3
4
5
Function
NC
VDD
NRST
3V3
5V
GND
GND
VIN
ARD_ADC.A0
ARD_ADC.A1
ARD_ADC.A2
ARD_ADC.A3
ARD_ADC.A4
ARD_ADC.A5
ARD_D0
ARD_D1
ARD_D2
ARD_D3
ARD_D4
ARD_D5
ARD_D6
ARD_D7
ARD_D8
ARD_D9
ARD_D10
ARD_D11
ARD_D12
PD13
PB8
PC6
PG0
PB9
PE0
PB5
PB4
STM32 pin
-
-
NRST
-
-
-
-
MCU Function
NC (reserved for the test)
IOREF (VDD 1V8 or 3V3)
NRST
3V3
5V
GND
GND
-
PA0
PA1
PA4
PA5
PC4
PC5
VIN 7V-12V
ADC1_IN5
ADC1_IN6
ADC1_IN9
ADC1_IN10
ADC1_IN13
ADC1_IN14
PB10 /PA10 LPUART1_RX / USART1_RX
PB11 /PA9
PD11
LPUART1_TX
I/O
/ USART1_TX
PD12
PF4
TIM4_CH1
INT4
TIM4_CH2
TIM4_CH3
I/O
I/O
TIM4_CH4
SPI_CSn and TIM16_CH1
SPI3_MOSI and TIM3_CH2
SPI3_MISO
CN11
8
9
6
7
10
ARD_D13
GND
VREFP
ARD_D14
ARD_D15
PG9
-
-
PB7
PB6
SPI3_SCK / ARD LED
GND
VREFP (AVDD)
I2C1_SDA
I2C1_SCL
1. A blue LED is connected to ARD-D13. This LED can be disconnected by removing the resistor R87 to help to increase SPI frequency communication.
page 43/63
UM2617
MCU energy meter tools
6.19
6.19.1
6.19.2
6.19.3
MCU energy meter tools
Description
The STM32L562E-DK Discovery kit embeds energy meter tools.
This function is performed with the support of the U22 STM32L496VGT6 MCU. The energy meter tools included on the STM32L562E-DK are a part of the standalone board X-NUCLEO-LPM01A, also called PowerShield.
The X-NUCLEO-LPM01A expansion board is a programmable power supply source, from 1.8 to 3.3 V, with advanced power consumption measurement capability.
Operating voltage
The power metering part is independent and has its power supplies, 3V3_PM, and 3V3_MCU_PM for the
STM32L562QEI6Q.
•
•
•
IDD measurement
•
•
The STM32L562E-DK Discovery kit has a circuit to measure the STM32L562QEI6Q current consumption (IDD) within a range of 300 nA to 150 mA.
To measure MCU current lower than 300 nA, a JP2 jumper can be configured to use an external ammeter.
The recommendations for the power metering measurement are the following ones:
Supply the STM32L562E-DK Discovery kit with USB_PM through the CN16 USB connector.
Set JP4 jumper [7-8] to select 5V_PM power.
Keep JP3 to correct voltage, to be aligned with energy metering setting: 1.8 or 3.3 V for the device I/O compatibility. By default, the energy meter tools start at 3.3 V.
Keep the jumper on the JP2 header (to measure a current below 300nA, remove it and add an external ammeter connected on JP2).
Set the SW1 switch to PM_MEAS position, to perform the current consumption measurement.
Section 6.3 Power supply provides information on how to use the powering option.
Figure 26 shows the energy metering hardware configuration.
Figure 26. Energy metering hardware configuration
UM2617 - Rev 6 page 44/63
UM2617
MCU energy meter tools
6.19.4
Energy meter firmware update
The Energy meter firmware can be upgraded with the following procedure:
1.
Get the PowerShield firmware binary file on www.st.com: firmware binary file has the extension “.dfu” standing for Device Firmware Upgrade (DFU).
2.
Download and install USB-DFU driver and utility: software reference: STSW-STM320803.
3.
Set the board in bootloader mode: Set switch SW2 to “BOOT” mode.
4.
Download file “.dfu” with USB-DFU utility software. Connect energy meter part with a USB cable on CN16, launch USB-DFU utility software. Only two buttons to use:
– “Choose”: Load the “.dfu” file
– “Upgrade”: Upgrade into STM32L496VGT6 Flash memory
5.
Set the board in application mode (SW2 on the left to “APPLI”). Reset the board by pressing the “RESET” button or unplug and plug the USB cable.
Figure 27. Energy metering firmware update hardware
UM2617 - Rev 6 page 45/63
Figure 28. Energy metering firmware upgrade software
UM2617
MCU energy meter tools
UM2617 - Rev 6
For more information about energy meter measurement firmware update, refer to the user manual Getting started with PowerShield firmware ( UM2269 ).
page 46/63
7
7.1
7.2
7.2.1
7.2.2
UM2617
STM32L562E-DK Discovery kit information
STM32L562E-DK Discovery kit information
Product marking
The stickers located on the top or bottom side of the PCB provide product information:
• Product order code and product identification for the first sticker
• Board reference with revision, and serial number for the second sticker
On the first sticker, the first line provides the product order code, and the second line the product identification.
On the second sticker, the first line has the following format: “MBxxxx-Variant-yzz”, where “MBxxxx” is the board reference, “Variant” (optional) identifies the mounting variant when several exist, "y" is the PCB revision and "zz" is the assembly revision, for example B01. The second line shows the board serial number used for traceability.
Evaluation tools marked as “ES” or “E” are not yet qualified and therefore not ready to be used as reference design or in production. Any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering sample tools as reference designs or in production.
“E” or “ES” marking examples of location:
• On the targeted STM32 that is soldered on the board (For an illustration of STM32 marking, refer to the
STM32 datasheet “Package information” paragraph at the www.st.com
website).
• Next to the evaluation tool ordering part number that is stuck or silk-screen printed on the board.
Some boards feature a specific STM32 device version, which allows the operation of any bundled commercial stack/library available. This STM32 device shows a "U" marking option at the end of the standard part number and is not available for sales.
In order to use the same commercial stack in his application, a developer may need to purchase a part number specific to this stack/library. The price of those part numbers includes the stack/library royalties.
STM32L562E-DK product history
Product identification DK32L562$AT1
This product revision is composed of the MB1373-L562QEQ-C01 mother board and the MB1280-B01 fan-out expansion board.
The STM32L562QEI6Q sample used on this product is the silicon revision code ”B” with the bootloader V9.0. This silicon may feature some limitations which are detailed in the corresponding errata sheet STM32L552xx/562xx device errata ( ES0448 ).
RSS and bootloader limitation:
The STM32L562QEI6Q part soldered on DK32L562E$AT1 that embeds the bootloader V9.0 is affected by the
RSS and bootloader limitations are described in
Proposed workaround:
Refer to
to detail workaround.
Product identification DK32L562$AT2
This product revision is composed of the MB1373-L562QEQ-C01 mother board and the MB1280-B01 fan-out expansion board.
The STM32L562QEI6Q sample used on this product is the silicon revision code ”B” with the bootloader V9.1 or more. This bootloader corrects the limitation explained in
Section 6.4.1 Limitation . This silicon may feature some
limitations which are detailed in the corresponding errata sheet STM32L552xx/562xx device errata ( ES0448 ).
UM2617 - Rev 6 page 47/63
7.2.3
7.3
7.3.1
UM2617
Board revision history
Product identification DK32L562$AT3
This product revision is composed of the MB1373-L562QEQ-C01 mother board and the MB1280-B01 fan-out expansion board.
The STM32L562QEI6Q sample used on this product is the silicon revision code ”Z” with the bootloader V9.1
or more. This silicon may feature some limitations which are detailed in the corresponding errata sheet
STM32L552xx/562xx device errata ( ES0448 ).
Board revision history
MB1373 mother board
Revision C01
The revision C01 of the MB1373 is the first official version.
Limitations
No limitation is identified for this board.
UM2617 - Rev 6 page 48/63
UM2617 - Rev 6
UM2617
STM32L562E-DK jumper summary
Appendix A STM32L562E-DK jumper summary
Figure 29 and Figure 30 summarize the default setting of the STM32L562E-DK jumpers and switches.
Figure 29. Default jumper and switch setting of the STM32L562E-DK (top view)
Figure 30. Default jumper and switch setting of the STM32L562E-DK (bottom view) page 49/63
UM2617 - Rev 6
UM2617
STM32L562E-DK I/O assignment
BGA pinout
B4
B5
B6
B7
B8
A11
A12
B1
B2
B3
B9
B10
B11
B12
C1
C2
C3
C4
C5
A6
A7
A8
A9
A10
A1
A2
A3
A4
A5
C6
C7
C8
C9
C10
C11
C12
D1
Appendix B STM32L562E-DK I/O assignment
Pin name
PA15
VDDUSB
VBAT
PE4
PE2
V15
PH3
PB4
PG9
PD4
PD1
PC12
PC10
PA12
PC14
PE6
PC13
PE0
PB8
PG12
PD6
PD5
PD2
PC11
PE5
PE3
PE1
PB9
PB6
PB3
PG10
PD3
PD0
PA13
PA14
PA11
PC15
Table 34. STM32L562E-DK I/O assignment
Main function pinout assignment
SAI.SCK_A
SAI.SD_B
LCD.BL_CTRL
ARD.D9_TIM
I2C1_SCL
LED_GREEN
-
LCD.FMC_NWE
SDIO.CMD
SDIO.D3
USB_C.CC1
POWER / VDD_USB
POWER / VBAT
SAI.FS_A
SAI.MCLK_A
POWER / V15SMPS
PH3_BOOT0
ARD.D12_SPI_MISO
ARD.D13_SPI_SCK
LCD.FMC_NOE
LCD.FMC_D3
SDIO.CLK
SDIO.D2
USB_C.FS_P
PC14-OSC32_IN
SAI.SD_A
USER BUTTON (WKUP2)
ARD.D10_TIM_SPI_CSN
ARD.D6_TIM
T.SWO
-
LED_RED
LCD.FMC_D2
T.SWDIO
T.SWCLK
USB_C.FS_N
OSC32_OUT
Optional function pinout assignment
-
-
-
-
-
-
STMod+ 8_SPI_MOSIs
-
STMod+ 4_UART_RTS
STMod+ 3_UART_RX
T.JTDI
-
-
-
-
-
-
STMod+ 3_SPI_MISOp
STMod+ 4_SPI_SCK
-
-
-
STMod+ 2_UART_TX
-
PM_WAKE-UP
-
-
-
-
-
STMod+ 9_SPI_MISOs
-
-
-
-
-
page 50/63
UM2617 - Rev 6
Pin name
PF0
PF3
VDD
PB7
PB5
PC2
PC3
VSS
VDD
PG6
PC7
PC9
PC8
PH0
PF5
PD7
VDDIO
VDD
PA9
PA10
PA8
PF2
PF1
PF4
VSS
VSS
PC1
PA1
VDD
VSS
PG4
PG7
PC6
PG8
PH1
NRST
PG2
PG3
PG5
BGA pinout
D2
D3
D4
D5
D6
F3
F4
F6
F7
F9
E10
E11
E12
F1
F2
D11
D12
E1
E2
E3
E4
E9
D7
D8
D9
D10
G3
G4
G6
G7
G9
F10
F11
F12
G1
G2
G10
G11
G12
DFSMD_DATIN3
SDIO.D1
SDIO.D0
LCD_PWR_ON
-
OCTOSPI.IO5
OCTOSPI.IO6
POWER / GND
POWER / VDD_MCU
BLE_INT
DFSMD_CKOUT
ARD.D7_IO
BLE_RSTN
MEMS_LED
NRST
OCTOSPI.IO4
ARD.ADC_A1
POWER / VDD_MCU
POWER / GND
SPI1.MOSI
SPI1.SCK
SPI1.MISO
SPI1.BLE_CS
Main function pinout assignment
LCD.FMC_A0_RS
GYRO_ACC_INT
POWER / VDD_MCU
I2C1_SDA
USB_C.DBn
ARD.D11_TIM_SPI_MOSI
LCD.FMC_NE1_CS
POWER / VDDIO2
POWER / VDD_MCU
T.VCP_TX
T.VCP_RX
LCD.TE
SDIO.DETECT
LCD.CTP_INT
ARD.D4_INT
POWER / GND
POWER / GND
UM2617
STM32L562E-DK I/O assignment
Optional function pinout assignment
-
-
-
-
STMod+ 2_SPI_MOSIp
-
-
-
ARD.D1_TX
ARD.D0_RX
-
-
-
-
-
-
-
STMod+ 12_RST
STMod+ 14_TIM
OSC_IN
STMod+ 11_INT
-
-
-
-
-
-
-
-
-
-
-
-
-
OSC_OUT
-
-
-
page 51/63
UM2617 - Rev 6
Pin name
PB13
PB14
PB15
PA3
PA6
PA4
PB1
PF12
PF15
PE11
PE15
VDD
PD9
PD11
PD12
VDDA
VDD
PF14
PE8
PE10
PE12
PA2
PA7
PB2
PF11
PG1
PE7
PE14
PB10
VSSA
PC0
OPAM1_VINM
VSS
VSS
PD14
PD13
PD15
VREFP
PA0
PC5
K10
K11
K12
L1
L2
L3
L4
L5
L6
L7
L8
J9
J10
J11
J12
K1
J4
J5
J6
J7
J8
K5
K6
K7
K8
K9
K2
K3
K4
H9
H10
H11
H12
J1
J2
J3
BGA pinout
H1
H2
H3
H4
Main function pinout assignment
POWER / GND
OCTOSPI.IO7
-
POWER / GND
POWER / GND
LCD.FMC_D0
ARD.D5_TIM
LCD.FMC_D1
POWER / VREFP
ARD_ADC.A0
ARD_ADC.A5
POWER / VDD_MCU
LCD.RST
LCD.FMC_D5
LCD.FMC_D7
LCD.FMC_D9
POWER / VDD_MCU
LCD.FMC_D14
ARD.D2_IO
ARD.D3_TIM
POWER / VDDA
OCTOSPI.NCS
OCTOSPI.IO2
OCTOSPI.DQS
-
AUDIO_RESETN
LCD.FMC_D4
LCD.FMC_D11
ARD.D0_RX
-
USB_C.FLT
USB_C.CC2
OCTOSPI.CLK
OCTOSPI.IO3
ARD_ADC.A2
OCTOSPI.IO0
-
LCD.CTP_RST
LCD.FMC_D8
LCD.FMC_D12
UM2617
STM32L562E-DK I/O assignment
-
-
-
-
-
-
-
-
-
-
Optional function pinout assignment
-
-
-
-
-
-
-
-
-
STMod+ 13_ADC
-
-
-
-
STMod+ SEL_12
-
-
-
T.VCP_RX
STMod+ 1_UART_CTS / STMod+
1_SPI_CSN
-
-
-
-
USB_C.VBUS_VSENSE
-
STMod+ SEL_34
-
-
page 52/63
M1
M2
M3
M4
M5
M6
M7
BGA pinout
L9
L10
L11
L12
M8
M9
M10
M11
M12
Pin name
PB11
VSS_SMPS
PB12
PD8
PA5
OPAM2_VINM
PC4
PB0
PF13
PG0
PE9
PE13
VDD_SMPS
VLX
V15
PD10
Main function pinout assignment
ARC.D1_TX
POWER / GND
DFSDM_DATIN1
LCD.FMC_D13
ARD_ADC.A3
-
ARD_ADC.A4
OCTOSPI.IO1
-
ARD.D8_IO
LCD.FMC_D6
LCD.FMC_D10
POWER / VDDSMPS
POWER / VLX
POWER / V15SMPS
LCD.FMC_D15
UM2617
STM32L562E-DK I/O assignment
Optional function pinout assignment
T.VCP_TX
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
UM2617 - Rev 6 page 53/63
UM2617
Federal Communications Commission (FCC) and Innovation, Science and Economic Development Canada (ISED) Compliance Statements
Appendix C Federal Communications Commission (FCC) and Innovation,
Science and Economic Development Canada (ISED) Compliance Statements
C.1
Note:
C.2
C.3
FCC Compliance Statement
Part 15.19
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
This product contains the SPBTLE ‑ RFTR module from STMicroelectronics: FCC ID: S9NSPBTLERF / IC:
8976C ‑ SPBTLERF.
Part 15.21
Any changes or modifications to this equipment not expressly approved by STMicroelectronics may cause harmful interference and void the user's authority to operate this equipment.
Part 15.105
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.
Use only shielded cables.
Responsible party (in the USA)
Terry Blanchard
Americas Region Legal | Group Vice President and Regional Legal Counsel, The Americas
STMicroelectronics, Inc.
750 Canyon Drive | Suite 300 | Coppell, Texas 75019
USA
Telephone: +1 972-466-7845
ISED-Canada User Manual Notice for Licence-Exempt Radio Apparatus
This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic
Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions:
1.
This device may not cause interference.
2.
This device must accept any interference, including interference that may cause undesired operation of the device.
L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation,
Sciences et Développement économique Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes :
1.
L’appareil ne doit pas produire de brouillage;
2.
L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.
FCC and ISED-Canada RF Exposure statements
To satisfy FCC and ISED-Canada RF Exposure requirements for mobile devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
UM2617 - Rev 6 page 54/63
C.4
UM2617
CE / RED
Pour satisfaire aux exigences FCC et IC concernant l'exposition aux champs RF pour les appareils mobile, une distance de séparation de 20 cm ou plus doit être maintenu entre l'antenne de ce dispositif et les personnes pendant le fonctionnement. Pour assurer la conformité, il est déconseillé d'utiliser cet équipement à une distance inférieure. Cet émetteur ne doit pas être co-situé ou fonctionner conjointement avec une autre antenne ou un autre émetteur.
CE / RED
EN 55032 / CISPR32 Class A product
Warning: this device is compliant with Class A of EN55032 / CISPR32. In a residential environment, this equipment may cause radio interference.
Simplified CE declaration of conformity:
ST Microelectronics hereby declares that the device STM32L562E-DK conforms with the essential requirements of Directive 2014/53/EU. The declaration of conformity can be found at www.st.com
.
UM2617 - Rev 6 page 55/63
UM2617
Revision history
Date
29-Nov-2019
28-Jan-2020
17-Mar-2020
30-Jun-2020
8-Feb-2021
2-Jun-2021
2
3
4
5
6
Table 35. Document revision history
Revision
1
Changes
Initial release.
Added Section 7 Limitations
Updated Section 6.4 RSS/bootloader
Added DK32L562E$AT2 to impacted parts in SMPS limitation
Updated Limitation regarding limited support to SFI through the bootloader towards JTAG
Added Section 7 STM32L562E-DK Discovery kit information with moved
Section 7.1 Product marking from Section 2 Ordering information
Updated Section Appendix C Federal Communications Commission (FCC) and Innovation, Science and Economic Development Canada (ISED)
Compliance Statements
Updated Figure 17. BOOT0 modification to set the HIGH level
UM2617 - Rev 6 page 56/63
UM2617
Contents
Contents
Using an external debug tool to program and debug the onboard STM32. . . . . . . . . . . . . 10
Power supply input from STLINK-V3E USB connector (default setting): 5V/500mA . . . . . 14
Programing/debugging when the power supply is not from STLINK-V3E (5V_STLK) . . . . 18
UM2617 - Rev 6 page 57/63
UM2617
Contents
UM2617 - Rev 6 page 58/63
UM2617
Contents
UM2617 - Rev 6 page 59/63
UM2617
Contents
Appendix C Federal Communications Commission (FCC) and Innovation, Science and
Economic Development Canada (ISED) Compliance Statements . . . . . . . . . . . . . . . . . . .54
ISED-Canada User Manual Notice for Licence-Exempt Radio Apparatus . . . . . . . . . . . . . . 54
UM2617 - Rev 6 page 60/63
UM2617
List of tables
List of tables
UM2617 - Rev 6 page 61/63
UM2617
List of figures
List of figures
UM2617 - Rev 6 page 62/63
UM2617
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks . All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2021 STMicroelectronics – All rights reserved
UM2617 - Rev 6 page 63/63
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