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TQMLS102xA

Preliminary User's Manual

TQMLS102xA UM 0002

26.05.2015

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page i

TABLE OF CONTENTS

3.3

3.4

3.5

3.6

3.6.1

3.6.2

3.6.3

3.6.4

3.1.2

3.2

3.2.1

3.2.2

3.2.3

3.2.4

3.2.5

3.2.6

1.8

1.9

2.

2.1

2.2

3.

3.1

3.1.1

1.

1.1

1.2

1.3

1.4

1.5

1.6

1.7

4.3

4.4

4.5

4.6

4.7

5.

5.1

5.2

6.

3.7

3.7.1

3.8

3.8.1

3.8.2

4.

4.1

4.2

About this manual ...................................................................................................................................................................................... 1

Copyright and licence expenses ............................................................................................................................................................. 1

Registered trademarks ............................................................................................................................................................................... 1

Disclaimer ...................................................................................................................................................................................................... 1

Imprint ............................................................................................................................................................................................................ 1

Tips on safety ................................................................................................................................................................................................ 2

Symbols and typographic conventions ............................................................................................................................................... 2

Handling and ESD tips ............................................................................................................................................................................... 2

Naming of signals ........................................................................................................................................................................................ 3

Further applicable documents / presumed knowledge ................................................................................................................. 3

Brief description ........................................................................................................................................................................................... 4

Key functions and characteristics ........................................................................................................................................................... 5

Available versions ....................................................................................................................................................................................... 5

Electronics Specification ........................................................................................................................................................................... 6

System overview ......................................................................................................................................................................................... 6

System architecture / block diagram .................................................................................................................................................... 6

System components ................................................................................................................................................................................... 7

CPU LS102xA................................................................................................................................................................................................. 7

CPU versions ................................................................................................................................................................................................. 7

Boot options .............................................................................................................................................................................................. 11

Multiplexing ............................................................................................................................................................................................... 13

Pinout connectors .................................................................................................................................................................................... 14

JTAG interface ........................................................................................................................................................................................... 16

Deep Sleep ................................................................................................................................................................................................. 17

DDR3L SDRAM........................................................................................................................................................................................... 17

On-board flash .......................................................................................................................................................................................... 18

Reset structure .......................................................................................................................................................................................... 18

Housekeeping ........................................................................................................................................................................................... 19

Overview ..................................................................................................................................................................................................... 19

RTC ................................................................................................................................................................................................................ 20

Temperature supervision ....................................................................................................................................................................... 21

EEPROM ....................................................................................................................................................................................................... 23

Power supply ............................................................................................................................................................................................. 23

Power estimation ..................................................................................................................................................................................... 23

External interfaces .................................................................................................................................................................................... 23

SERDES ......................................................................................................................................................................................................... 23

USB3.0 .......................................................................................................................................................................................................... 23

Mechanics ................................................................................................................................................................................................... 24

Connectors ................................................................................................................................................................................................. 24

TQMLS102xA image ................................................................................................................................................................................ 24

Adaptation to the environment .......................................................................................................................................................... 25

Protection against external effects ..................................................................................................................................................... 25

Thermal management ............................................................................................................................................................................ 25

Structural requirements ......................................................................................................................................................................... 25

Notes of treatment................................................................................................................................................................................... 25

Technical data ........................................................................................................................................................................................... 26

Vibration load ............................................................................................................................................................................................ 26

Shock load .................................................................................................................................................................................................. 26

Software ...................................................................................................................................................................................................... 26

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page ii

TABLE OF CONTENTS (continued)

7.6.2

7.6.3

7.6.4

7.7

7.8

8.

8.1

8.2

7.

7.1

7.2

7.3

7.4

7.5

7.6

7.6.1

Safety requirements and protective regulations............................................................................................................................ 27

EMC ............................................................................................................................................................................................................... 27

ESD ................................................................................................................................................................................................................ 27

Operational safety and personal security ......................................................................................................................................... 28

Climatic and operational conditions .................................................................................................................................................. 28

Reliability and service life....................................................................................................................................................................... 28

Environment protection......................................................................................................................................................................... 28

RoHS ............................................................................................................................................................................................................. 28

WEEE ............................................................................................................................................................................................................. 28

REACH .......................................................................................................................................................................................................... 28

EuP ................................................................................................................................................................................................................ 28

Battery.......................................................................................................................................................................................................... 29

Other entries .............................................................................................................................................................................................. 29

Appendix .................................................................................................................................................................................................... 30

Acronyms and definitions...................................................................................................................................................................... 30

References .................................................................................................................................................................................................. 31

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page iii

TABLE DIRECTORY

Table 1:

Table 2:

Table 3:

Table 4:

Table 5:

Table 6:

Table 7:

Table 8:

Table 9:

Table 10:

Table 11:

Table 12:

Table 13:

Table 14:

Table 15:

Table 16:

Table 17:

Table 18:

Table 19:

Table 20:

Terms and Conventions ..................................................................................................................................................................... 2

Functional differences of the LS102x family CPUs .................................................................................................................... 8

LS102x function blocks ................................................................................................................................................................... 10

Configuration of the boot source ................................................................................................................................................ 11

Further configuration pins with optional wiring .................................................................................................................... 12

Pin multiplexing options ................................................................................................................................................................ 13

Pinout appraisal connector X1 ..................................................................................................................................................... 14

Pinout appraisal connector X2 ..................................................................................................................................................... 15

Pinout appraisal connector X3 ..................................................................................................................................................... 16

I²C bus addresses .............................................................................................................................................................................. 19

SA56004X slave addresses ............................................................................................................................................................. 21

Pin assignment CPU-internal PN junction ................................................................................................................................. 22

Power estimation .............................................................................................................................................................................. 23

Plug connectors on the TQMLS102xA ........................................................................................................................................ 24

Suitable carrier board mating plug connectors ...................................................................................................................... 24

Vibration test ...................................................................................................................................................................................... 26

Shock test ............................................................................................................................................................................................ 26

Climate and operational conditions ........................................................................................................................................... 28

Acronyms ............................................................................................................................................................................................ 30

Further applicable documents ..................................................................................................................................................... 31

ILLUSTRATION DIRECTORY

Illustration 1: Block diagram TQMLS102xA (simplified) ..................................................................................................................................... 4

Illustration 2: Block diagram TQMLS102xA ............................................................................................................................................................ 6

Illustration 3: TQMLS102xA product family ........................................................................................................................................................... 7

Illustration 4: LS1021A CPU Block diagram ......................................................................................................................................................... 10

Illustration 5: IFC interface at the connector ...................................................................................................................................................... 12

Illustration 6: Block diagram PBL ............................................................................................................................................................................ 12

Illustration 7: JTAG interface .................................................................................................................................................................................... 16

Illustration 8: On-board flash maximum expansion ......................................................................................................................................... 18

Illustration 9: Connection of the eMMC at the SDHC interface ..................................................................................................................... 18

Illustration 10: I²C bus components on the TQMLS102xA ................................................................................................................................ 19

Illustration 11: RTC function block (1) ..................................................................................................................................................................... 20

Illustration 12: RTC function block (2) ..................................................................................................................................................................... 20

Illustration 13: Wiring of temperature sensor ....................................................................................................................................................... 22

Illustration 14: TQMLS102xA ...................................................................................................................................................................................... 24

REVISION HISTORY

Rev. Date Name

0001 13.04.2015 Petz

0002 26.05.2015 Petz

Pos. Modification

First issue (German / English)

Document translated

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 1

1. ABOUT THIS MANUAL

1.1 Copyright and licence expenses

Copyright protected © 2015 by TQ-Systems GmbH.

This Preliminary User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the used components as well as the BIOS are subject to the copyrights of the respective manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Boot loader-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be separately calculated / declared.

1.2 Registered trademarks

TQ-Systems GmbH aims to adhere to the copyrights of all the graphics and texts used in all publications, and strives to use original or license-free graphics and texts.

All the brand names and trademarks mentioned in the publication, including those protected by a third party, unless specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by of a third party.

1.3 Disclaimer

TQ-Systems GmbH does not guarantee that the information in this Preliminary User's Manual is up-to-date, correct, complete or of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-

Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in the Preliminary User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this Preliminary User's Manual or parts of it without special notification.

1.4 Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 (0) 8153 9308 0

Fax: +49 (0) 8153 9308 134

Email:

[email protected]

Web:

http://www.tq-group.com/

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 2

1.5 Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6 Symbols and typographic conventions

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, contents, file names, or menu items.

1.7 Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when switching on, changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMLS102xA and be dangerous to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQproduct in an ESD-safe environment. Especially when you switch modules on, change jumper settings, or connect other devices.

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 3

1.8 Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9 Further applicable documents / presumed knowledge

Specifications and manual of the used modules:

These documents describe the service, functionality and special characteristics of the used module (incl. BIOS).

Specifications of the used components:

The manufacturer's specifications of the used components, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of. ice should be followed.

Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

Circuit diagram MBLS102xA

Documentation of boot loader U-Boot

Documentation of PTXdist (

(

http://www.denx.de/wiki/U-Boot/Documentation http://www.ptxdist.de

)

)

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

2. BRIEF DESCRIPTION

This Preliminary User's Manual describes the TQMLS102xA, and refers to some software settings.

A certain derivative of the TQMLS102xA

This Preliminary User's Manual does also not replace the Freescale Reference Manuals of the CPU.

The TQMLS102xA is a universal Minimodule based on the Freescale ARM CPU Dual Cortex A7 with QorIQ technology

(Layerscape). The Cortex A7 cores of this CPU are clocked with up to 1 GHz.

The TQMLS102xA extends the TQC product range and offers an outstanding computing performance.

A suitable CPU derivative (LS1020, LS1021, and LS1022) can be selected for each requirement.

Page 4

Illustration 1: Block diagram TQMLS102xA (simplified)

Attention: Malfunction

The SERDES lines are multiplexed and can therefore not be used simultaneously.

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 5

2.1 Key functions and characteristics

The TQMLS102xA provides the following key functions and characteristics:

Graphics

SD card interface

On-Board flash (NOR, eMMC, NAND)

DDR3L SDRAM

USB 2.0 Hi-Speed interface with PHY

USB 3.0 Hi-Speed interface with PHY

Ethernet 10/100/1000

CAN

SATA

PCIe

I²C, I²S, SPI, UART

RTC (optional)

Software support possible for: o

Linux o

VxWorks o

QNX o

PikeOS

All essential CPU pins are routed to the connectors.

There are therefore no restrictions for customers using the TQMLS102xA with respect to an integrated customised design.

2.2 Available versions

The default versions offer the following basic features:

CPUs: LS1020, LS1021, LS1022

DDR3/4L-RAM:

QSPI NOR flash:

EEPROM:

1 Gbyte + ECC

512 Mbyte

64 kbit

All versions of the TQMLS102xA are fully pin-compatible and therefore interchangeable.

The functionality of the different TQMLS102xA is mainly determined by the features provided by the respective CPU.

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 6

3. ELECTRONICS SPECIFICATION

preinstalled on every TQMLS102xA (see also section 6) and the BSP provided by TQ-Systems GmbH.

3.1 System overview

TQMLS102xA, which is

3.1.1 System architecture / block diagram

Illustration 2: Block diagram TQMLS102xA

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

3.1.2 System components

CPU: LS1020A / LS1021A / LS1022A

DDR3L SDRAM

On-board flash (NOR and eMMC)

Power supply

Voltage supervision

Power management or Housekeeping Microcontroller (PMC)

RTC

Temperature sensor

EEPROM

All CPU pins with useful functionality are routed to the connectors.

3.2 CPU LS102xA

3.2.1 CPU versions

The following CPUs from the LS102x family are used for the TQMLS102xA:

LS1020A

LS1021A

LS1022A

Page 7

Illustration 3: TQMLS102xA product family

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

In the following tables more details of the different features is shown.

Table 2: Functional differences of the LS102x family CPUs

Page 8

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

Table 2: Functional differences of the LS102x family CPUs (continued)

Page 9

The LS1022A CPU contains some function blocks like both other CPUs, but a lower number of the corresponding blocks, see following table:

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

Table 3: LS102x function blocks

Page 10

In this User's Manual the TQMLS102xA is referred to, since it offers the greatest expansion stage.

Illustration 4: LS1021A CPU Block diagram

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

IFC_AD08

IFC_AD09

IFC_AD10

IFC_AD11

IFC_AD12

IFC_AD13

IFC_AD14

IFC_AD15

IFC_CLE

3.2.2 Boot options

The LS102x provides the following boot options:

Parallel NOR flash

NAND flash

QSPI

SD/MMC (eSDHC)

The SDHC interface is part of the pin-multiplexing and routed to the connectors.

The boot options Parallel NOR, NAND and QSPI are connected via the configurable IFC interface.

The serial NOR flash on the TQMLS102xA is connected via QSPI (see 3.4).

The whole IFC interface is routed to a connector to use the CPU to its full extent.

The IFC interface also offers the option to run a parallel bus (NOR / NAND / GPCM / GASIC).

The multiplexing is configured to boot the TQMLS102xA from the On-Board SPI flash.

Table 4: Configuration of the boot source

Signal cfg_rcw_src0 cfg_rcw_src1 cfg_rcw_src2 cfg_rcw_src3 cfg_rcw_src4 cfg_rcw_src5 cfg_rcw_src6 cfg_rcw_src7 cfg_rcw_src8

Parallel NOR 8 bit

X

X

1

X

X

0

0

0

0

Parallel NOR 16 bit

X

X

0

X

X

0

1

0

0

Page 11

QSPI

1

0

0

0

X

1

0

0

0

SDHC

0

0

0

0

0

1

0

0

0

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 12

The QSPI interfaces 1 and 2 are routed to the connector as well. Depending on how the QSPI interface is used, SPI1 and I²C_3 are available by suitable multiplexing. These signals are also routed to the connector.

Illustration 5: IFC interface at the connector

If the IFC interface is not used, because the TQMLS102xA only boots from NOR flash, some pins of this interface can be configured as GPIOs by suitable pin multiplexing. These are available at the connectors.

The POR pin strapping-pins according to Table 4 define the source for the RCW (Reset Configuration Word).

Illustration 6: Block diagram PBL

The following configuration pins are used as follows:

Table 5: Further configuration pins with optional wiring

Configuration Signal cfg_ifc_te cfg_dram_type cfg_gpinput[0:7]

IFC_TE

IFC_A21

IFC_AD[0:7]

Implementation

Required for IFC Boot

Sets the polarity

Signal at optional X3, but with active pin strapping on the TQMLS102xA

Defines the type of DDR

Active pin strapping on the TQMLS102xA, fix configured to DDR3L

Available at X3

No PU/PD option on the TQMLS102xA planned

1111 1111

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

3.2.3 Multiplexing

Freescale provides a pin multiplexing table in Excel format for registered users:

Table 6: Pin multiplexing options

Page 13

The respective power rail of a certain block has to be taken into account.

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

3.2.4 Pinout connectors

The following pinout is a preliminary appraisal.

Table 7: Pinout appraisal connector X1

Page 14

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

Table 8: Pinout appraisal connector X2

Page 15

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

Table 9: Pinout appraisal connector X3

Page 16

3.2.5 JTAG interface

The JTAG interface is routed to the connector.

Illustration 7: JTAG interface

Attention: Power rail OVDD

The power rail OVDD (1.8 V) is used for the JTAG interface. An external level conversion is necessary, if applicable.

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 17

3.2.6 Deep Sleep

Deep Sleep is an especially efficient energy-saving mode (LPM35), a variation of the LPM20, with which parts of the Core Supply are switched off.

The transition into Deep Sleep is a complicated multistage process, which is partly controlled by software, and partly by a CPUinternal State Machine, which also has to be configured by software.

Note: Supply PROG_SFP

The supply PROG_SFP is exclusively required to program the Security Fuses. In case it is used, a suitable switchable supply must be provided on the carrier board for this special use case.

3.3 DDR3L SDRAM

The maximum memory size is 2 Gbyte, plus ECC. 1 Gbyte is assembled by default, plus ECC.

The LS102x CPU provides the following DDR features:

DDR3L memory interface

Data bus width 32-/36 Bit incl. ECC (LS1022 16Bit + ECC)

There are the following options:

2 × 8 Gbit = 2 Gbyte + ECC

2 × 4 Gbit = 1 Gbyte + ECC

2 × 2 Gbit = 512 Mbyte + ECC

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

3.4 On-board flash

The following flash expansion is possible:

Page 18

Illustration 8: On-board flash maximum expansion

QSPI is used as an interface. NOR flashes are connected at QSPI_A.

QSPI_A, chip select A0, is used as a boot source. The flashes support the 4-bit QSPI interface.

The following illustration shows how the eMMC is connected:

Illustration 9: Connection of the eMMC at the SDHC interface

The SDHC interface is connected with 8 bit to the eMMC and is also routed with 4 bit to the connector to connect an SD card.

Attention: eMMC and SD card eMMC and SD card cannot operate simultaneously! eMMC memory

Manufacturer:

Series:

Size:

Functions:

Micron

2, 4, 8, 16, or 32 Gbyte

ECC, bad block management, wear levelling

Optionally the reset signal is connected to PORESET.

3.5 Reset structure

A LED indicates the RESET condition. A suitable driver is provided.

The system RESET is routed to the connector via a buffer.

-up to OVDD is provided at RESET_REQ# of the CPU. pull-up to OVDD (1.8 V) is required.

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

3.6 Housekeeping

3.6.1 Overview

The following components are present on the TQMLS102xA:

RTC (optional)

Temperature sensor (local and remote in the CPU)

EEPROM

The components are connected via the I²C_1 interface.

The following illustration shows the implementation:

Page 19

Illustration 10: I²C bus components on the TQMLS102xA

I²C_1 is supplied via voltage block D1VDD. D1VDD is supplied with 3.3 V, therefore, the I²C bus subscribers also have to be supplied with 3.3 V.

The addresses of the respective I²C-bus subscribers are configurable using address pins, or already hardwired by the manufacturer.

The following addresses are used:

Table 10: I²C bus addresses

Function block

RTC

EEPROM

Temperature sensor

PMC

Device

PCF85063

M24C64

SA56004EDP,118

Kinetis µController

Address Remark

1010 001b

1010 000b

1011 000b

E0 / E1 / E2 connected to GND

1001 100b freely programmable

Address is defined by order code

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 20

3.6.2 RTC

An RTC is optionally available. The NXP PCF85063TP is used as an RTC.

It has the following characteristics:

Real-Time clock / calendar

1.

I²C interface (up to 400 kHz)

Current consumption max. 50 µA in operation / <0.6 µA in standby

Programmable register offset to increase precision

The following functions of the RTC are available:

RTC function block, INT at the connector

The RTC on the TQMLS102xA is a separate function block. It can be configured using the CPU (I²C). The interrupt signal is routed to the connector, so every reaction / wakeup sequence must be carried out external.

RTC function with power management µController

The RTC is also an independent function block. It can be configured during runtime using the CPU. In Standby mode the RTC can wake the PMC with a wakeup event, which then wakes the CPU.

Since the RTC is optionally, the CLKOUT signal is routed to the connector and is not used on the TQMLS102xA.

A simple implementation of the RTC function block is shown in the following block diagram:

Illustration 11: RTC function block (1)

When the RTC is supplied with the standby voltage, it can be configured or read by the CPU via I²C during runtime. In standby mode all further operations can be initiated using the low-active interrupt, which is available at the connector.

The logic to wake the TQMLS102xA must therefore be provided externally.

An alternative with independent RTC wakeup function is described in the following block diagram:

Illustration 12: RTC function block (2)

The RTC interrupt can be used to wake the TQMLS102xA from standby.

The PMC reacts to the RTC interrupt and starts the Power-Sequencing.

The current consumption is approximately 0.8 µA, in addition to power mode VLLS1

The µController is specified with a maximum of 5.5 µA at +85 °C in power mode VLLS1.

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

3.6.3 Temperature supervision

The NXP SA56004X is used.

The parameters are:

Local and remote temperature sensor

Accuracy: ±1 °C remote / ±2 °C local

11 bit resolution / 0.125 °C

I²C bus

3.3 V supply

Programmable ALERT# and T_CRIT# outputs

Table 11: SA56004X slave addresses

Page 21

The communication is done via the I²C bus. The slave address of the device is "factory programmed".

Programmable warning signals:

ALERT#:

The trigger level of the open-drain signal is freely programmable and can be used as a warning. The signal is routed to the connector.

No pull-up is provided on the TQMLS102xA to remain variable. If this is implemented on the carrier board, any voltage can be switched.

T_CRIT#:

The trigger level of the open-drain signal is freely programmable. Depending on the programming this value can also signal the most critical value. This signal provides the option to trigger RESET# independently, or to send the signal to the power management µController (placement option). The signal is routed to the connector without pull-up.

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

The following Illustration shows the connection of the temperature sensor:

Page 22

Illustration 13: Wiring of temperature sensor

For the remote temperature measurement a 2.2 nF capacitor is recommended between D + and D (noise suppression).

The CPU-internal PN junction for temperature measurement is connected here:

Table 12: Pin assignment CPU-internal PN junction

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 23

3.6.4 EEPROM

An EEPROM with 64 kBit is assembled on the TQMLS102xA. The ST M24C64 series is used.

64 Kbit

I²C interface ( 100 kHz, 400 kHz, 1 MHz)

The EEPROM is supplied with 3.3 V.

According to the I²C bus addresses (see section 3.6.1) E0/E1/E2 are connected to GND.

3.7 Power supply

3.7.1 Power estimation

The single values are estimated and assume an average load.

Table 13: Power estimation

Component Power consumption

CPU

DDR3L SDRAM

NOR flash

Other

Total

3.8 External interfaces

1.5 W

1.0 W

0.2 W

0.5 W

3.2 W

3.8.1 SERDES

All three SERDES interfaces require 100 nF AC-coupled capacitors.

The coupling capacitors are not assembled on the TQMLS102xA to enable the usage of the interface for other purposes.

3.8.2 USB3.0

According to the specification the AC-transmit lines are AC-

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 24

4. MECHANICS

4.1 Connectors

The TQMLS102xA is connected to the carrier board with 280 pins on three connectors.

The following table shows details of the plug connector used.

Table 14: Plug connectors on the TQMLS102xA

Manufacturer Part number Remark

TE connectivity

TE connectivity

120-pin: 5177985-5

40-pin: 5177985-1

0.8 mm pitch

Plating: Gold 0.2 µm

40 °C to 125 °C

0.8 mm pitch

Plating: Gold 0.2 µm

40 °C to 125 °C

The TQMLS102xA is held in the plug connectors with a considerable retention force.

To avoid damaging the plug connectors of the TQMLS102xA as well as the carrier board plug connectors while removing the

TQMLS102xA the use of an extraction tool is strongly recommended. See section 4.7 for further information.

The following table shows some suitable mating plug connectors for the carrier board.

Table 15: Suitable carrier board mating plug connectors

Manufacturer Stack height (X)

TE connectivity

TE connectivity

TE connectivity

TE connectivity

Part number

40-pin: 5177986-1

120-pin: 5177986-5

40-pin: 1-5177986-1

120-pin: 1-5177986-5

40-pin: 2-5177986-1

120-pin: 2-5177986-5

40-pin: 3-5177986-1

120-pin: 3-5177986-5

5 mm

6 mm

7 mm

8 mm

4.2 TQMLS102xA image

Illustration 14: TQMLS102xA

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 25

4.3 Adaptation to the environment

The overall dimensions (length × width) of the TQMLS102xA are 55 × 44 mm².

The maximum height of the TQMLS102xA above the carrier board is approximately 8.5 mm.

4.4 Protection against external effects

As an embedded module the TQMLS102xA is not protected against dust, external impact and contact (IP00).

Adequate protection has to be guaranteed by the surrounding system.

4.5 Thermal management

To cool the TQMLS102xA, approximately 3 W have to be dissipated.

The power dissipation originates primarily in the CPU, the DDR3L-SDRAM and the PMIC.

The power dissipation also depends on the software used and can vary according to the application.

See Freescale Application Note (3) for further information.

Attention: Destruction or malfunction

The CPU belongs to a performance category in which a cooling system may be essential in certain applications. It is the responsibility of the customer to define a suitable cooling method depending on the specific mode of operation (e.g., dependence on clock frequency, stack height, airflow, and software).

4.6 Structural requirements

The TQMLS102xA is held in the mating plug connectors by the retention force of the pins (a total of 280). For high requirements with respect to vibration and shock firmness an additional holder has to be provided in the final product to hold the

TQMLS102xA in its position. For this purpose TQ-Systems GmbH can provide a suitable solution. As no heavy and big components are used, no further requirements are given.

4.7 Notes of treatment

To avoid damage caused by mechanical stress, the TQMLS102xA may only be extracted from the carrier board by using the extraction tool MOZI8XXL that can also be obtained separately.

Attention: Note with respect to the component placement of the carrier board

2.5 mm should be kept free on the carrier board, along the longitudinal edges on both sides of the

TQMLS102xA for the extraction tool.

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 26

5.

5.1

TECHNICAL DATA

Vibration load

Table 16: Vibration test

Parameter

Oscillation, sinusoidal

Frequency ranges

Wobble rate

Excitation axes

Number of frequency cycles

Amplitude

Details

According to DIN EN 60068-2-6

2 9 Hz, 9 200 Hz, 200 500 Hz

1.0 octaves / min

X-Y-Z axis

20 frequency cycles

9 Hz: 3.5 ms

-2

200 Hz: 10 ms

-2

500 Hz: 15 ms

-2

5.2 Shock load

Table 17: Shock test

Parameter Details

Shocks

Shock form

Acceleration

Residence time

According to DIN EN 60068-2-27

Half sine

30 g

18 ms

Number of shocks

Excitation axes

3 shocks per direction

6X, 6Y, 6Z

The values shown are based on the guidelines of the standard DIN ETS 300019 (Environmental tests for telecommunications equipment).

6. SOFTWARE

The TQMLS102xA is delivered with a preinstalled boot loader and a BSP which is configured for the Starterkit STK-MBLS102xA.

The boot loader provides module-specific as well as board-specific settings, e.g.:

CPU configuration

PMIC configuration

RAM configuration and timing

 eMMC configuration

Multiplexing

Clocks

Pin configuration

Driver strengths

More information can be found in the

Support Wiki for the TQMLS102xA

.

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 27

7. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS

7.1 EMC

The TQMLS102xA was developed according to the requirements of electromagnetic compatibility (EMC). Depending on the target system, anti-interference measures may still be necessary to guarantee the adherence to the limits for the overall system.

The TQMLS102xA it designed to pass the following tests:

EMC-Interference radiation:

Measurement of the electrically radiated emission for standard, residential, commercial and light industrial environments in the range of 30 MHz to 1 GHz according to

DIN EN 61000-6-3 or DIN EN 55022

EMC-Interference radiation:

Measurement of the electrically radiated emission for industrial environments in the range of 30 MHz to 1 GHz according to DIN EN 61000-6-4 or DIN EN 55011

EMC-Immunity according to EN 61000-4-2 1) :

Electrostatic discharge immunity (ESD)

EMC-Immunity according to EN 61000-4-3

1)

:

Radiated radio frequency, electromagnetic field immunity

EMC-Immunity to fast transients according to EN 61000-4-4

1)

:

Electrical fast transient (BURST)

EMC-Immunity to surge according to EN 61000-4-5 1) :

Surge immunity test (SURGE).

In DC networks an inlet length of less than 10 m is assumed.

For the audit a reference power supply has to be defined / supplied.

Signal and I/O lines >30 m must be checked for SURGE.

EMC-Immunity according to EN 61000-4-6

1)

:

Immunity to conducted disturbances, induced by radio-frequency fields

EMC-Immunity according to EN 61000-4-11 1) :

Immunity to voltage dips, voltage variation and short interruptions in the mains supply (VOLTAGE DIPS)

EMC-Immunity according to EN 61000-4-29

2)

:

Immunity to voltage dips and short interruptions on the DC input power supply

1)

: The test level and test criteria are taken from the generic standards: the EN 61000-6-1 generic standard; immunity for standard, residential, commercial and light industrial environments, and the EN 61000-6-2 generic standard for industrial environments.

2) : The test criteria are not fixed here yet, because there are still no generic standards or product standards on, which to base this standard. When required the test criteria have to be defined with the customer.

The following measures are recommended:

Robust ground planes (adequate ground planes) on the printed circuit board

A sufficient number of blocking capacitors in all supply voltages

Fast or permanent clocked lines (e.g., clock) should be kept short; avoid interference of other signals by distance and / or shielding besides, take note of not only the frequency, but also the signal rise times

Filtering of all signals, which can be connected externally

(also "slow signals" and DC can radiate RF indirectly)

Because the TQMLS102xA is used on an application-specific carrier board, EMC or ESD tests only make sense for the whole device.

7.2 ESD

In order to avoid interspersion on the signal path from the input to the protection circuit in the system, the protection against electrostatic discharge should be arranged directly at the inputs of a system. As these measures always have to be implemented on the carrier board, no special preventive measures were planned on the TQMLS102xA.

Following measures are recommended for a carrier board:

Generally applicable: Shielding of the inputs

Supply voltages:

Slow signal lines:

Fast signal lines:

(shielding connected well to ground / housing on both ends)

Protection by suppressor diode(s)

RC filtering / Zener diode(s)

Integrated protective devices (e.g., suppressor diode arrays)

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 28

7.3 Operational safety and personal security

Due to the occurring voltages (

7.4 Climatic and operational conditions

The possible temperature range strongly depends on the installation situation (heat dissipation by heat conduction and convection); hence, no fixed value can be given for the whole assembly.

In general, a reliable operation is given when following conditions are met:

Table 18: Climate and operational conditions

Parameter Range Remark

Permitted Environment temperature

Permitted storage temperature

40 85 °C

40 °C

Relative humidity (operating / storage) 10 90 % Not condensing

Detailed information concerning the thermal characteristics of the CPU is to be taken from Freesc

Sheet (1) and (2).

7.5 Reliability and service life

No detailed MTBF calculation has been done for the TQMLS102xA.

The TQMLS102xA is designed to be insensitive to vibration and impact.

Middle grade connectors, which guarantee at least 100 mating cycles, were used for the TQMLS102xA.

7.6 Environment protection

7.6.1 RoHS

The TQMLS102xA is manufactured RoHS compliant.

All used components and assemblies are RoHS compliant

RoHS compliant soldering processes are used

7.6.2 WEEE

The company placing the product on the market is responsible for the observance of the WEEE regulation.

To be able to reuse the product, it is produced in such a way (a modular construction) that it can be easily repaired and disassembled.

7.6.3 REACH

The EU-chemical regulation 1907/2006 (REACH regulation) stands for registration, evaluation, certification and restriction of substances SVHC (Substances of very high concern, e.g., carcinogen, mutagen and/or persistent, bio accumulative and toxic).

Within the scope of this juridical liability TQ-Systems GmbH meets the information duty within the supply chain with regard to the SVHC substances, insofar as TQ-Systems GmbH is informed by suppliers accordingly.

7.6.4 EuP

The guideline 2005/32/EC (EuP) is the next step after WEEE and RoHS for an environmentally friendly production of electric and electronic products. The consideration of environmental requirements with the product design "creation appropriate for the environment" ("ecological design") with the aim to improve the environmental compatibility of the product during its whole life cycle should be taken into consideration.

The guideline appropriate for the product (embedded PC) is applied.

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group Page 29

7.7 Battery

No batteries are used on the TQMLS102xA.

7.8 Other entries

By environmentally friendly processes, production equipment and products, we contribute to the protection of our environment.

The energy consumption of this subassembly is minimised by suitable measures.

Printed PC-boards are delivered in reusable packaging.

Modules and devices are delivered in an outer packaging of paper, cardboard or other recyclable material.

Due to the fact that at the moment there is still no technical equivalent alternative for printed circuit boards with brominecontaining flame protection (FR4 material), such printed circuit boards are still used.

No use of PCB containing capacitors and transformers (polychlorinated biphenyls).

These points are an essential part of the following laws:

The law to encourage the circular flow economy and assurance of the environmentally acceptable removal of waste as at 27.9.94

(source of information: BGBl I 1994, 2705)

Regulation with respect to the utilization and proof of removal as at 1.9.96

(source of information: BGBl I 1996, 1382, (1997, 2860)

Regulation with respect to the avoidance and utilization of packaging waste as at 21.8.98

(source of information: BGBl I 1998, 2379)

Regulation with respect to the European Waste Directory as at 1.12.01

(source of information: BGBl I 2001, 3379)

This information is to be seen as notes. Tests or certifications were not carried out in this respect.

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

8. APPENDIX

8.1 Acronyms and definitions

The following acronyms and abbreviations are used in this document:

Table 19: Acronyms

Acronym

PMIC

QSPI

RAM

RC

RCW

REACH

RF

RoHS

RTC

SATA

SD card

SD/MMC

LPM

MOZI

MTBF

NAND

NOR

PBL

PCB

PCIe

PCMCIA

PHY

PMC

SDHC

SDRAM

SERDES

SPI

SVHC

UART

UM

USB

WEEE® eSDHC

ETS

EuP

FR4

GPCM

GPIO

IFC

IP00

I²C

I²S

JTAG

LED

ARM®

ATA

BIOS

BSP

CPU

DC

DDR3L

DIN

ECC

EEPROM

EMC

EMI eMMC

EN

ESD

Meaning

Advanced RISC Machine

Advanced Technology Attachment

Basic Input/Output System

Board Support Package

Central Processing Unit

Direct Current

Double Data Rate 3 Low voltage

German industry standard (Deutsche Industrienorm)

Error Checking and Correction

Electrically Erasable Programmable Read-Only Memory

Electromagnetic Compatibility

Electromagnetic Interference embedded MultiMedia Card (Flash)

European Standard (Europäische Norm)

Electrostatic Discharge enhanced Secure Digital High Capacity

European Telecommunications Standards

Energy using Products

Flame Retardant-4

General Purpose Programmable Machines

General Purpose Input/Output

Integrated Flash-Controller

Ingress Protection 00

Inter-Integrated Circuit

Integrated Interchip Sound

Joint Test Action Group

Light Emitting Diode

Low Power Mode

Module extractor (Modulzieher)

Mean operating Time Between Failures

Not-And

Not-Or

Pre-Boot Loader

Printed Circuit Board

Peripheral Component Interconnect express

People Can t Memorize Computer Industries Acronyms

Physical (layer of the OSI model)

Power Management Controller

Power Management IC

Queued Serial Peripheral Interface

Random Access Memory

Resistor-Capacitor

Reset Configuration Word

Registration, Evaluation, Authorisation (and restriction of) Chemicals

Radio Frequency

Restriction of (the use of certain) Hazardous Substances

Real-Time Clock

Serial ATA

Secure Digital Card

Secure Digital Multimedia Card

Secure Digital High Capacity

Synchronous Dynamic Random Access Memory

Serializer/Deserializer

Serial Peripheral Interface

Substances of Very High Concern

Universal Asynchronous Receiver/Transmitter

User's Manual

Universal Serial Bus

Waste Electrical and Electronic Equipment

Page 30

Preliminary User's Manual l TQMLS102xA UM 0002 l © 2015 TQ-Group

8.2 References

Table 20: Further applicable documents

No.: Name

(1) QorIQ LS1021A Family Communications Processor Product Brief

LS1021APB

(2) QorIQ LS1021A - Fact Sheet

LS1021AFS

(3) Thermal Solutions

AN4871

Page 31

Rev. / Date Company

9/10/2014

Freescale

2/4/2015

Freescale

2/7/2014

Freescale

TQ-Systems GmbH

Mühlstraße 2 l Gut Delling l 82229 Seefeld [email protected]

l www.tq-group.com

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