BoosterPack Development Guide (Rev. A)

BoosterPack Development Guide (Rev. A)
Development Guide
SPMU288A – August 2012 – Revised April 2013
Tiva™ C Series EK-TM4C123GXL LaunchPad:
BoosterPack Development Guide
The Texas Instruments’ Tiva™ C Series TM4C123G LaunchPad concept is an extremely low-cost,
expandable evaluation system for TI microcontrollers. This concept began with the tremendously
successful MSP430™ LaunchPad which introduced a large number of engineers to the TI MSP430 family
of microcontrollers (MCUs). The Tiva Series of 32-bit ARM® Cortex™-M4 MCU family expands that
success by introducing the Tiva C Series TM4C123G LaunchPad featuring the Tiva C Series
TM4C123GH6PM microcontroller.
Build your own BoosterPack and take advantage of Texas Instruments’ website to help promote it! From
sharing a new idea or project, to designing, manufacturing, and selling your own BoosterPack kit, TI offers
a variety of avenues for you to reach potential customers with your solutions.
This document briefly discusses the design and architecture of the LaunchPad platform and presents
practical guidelines for application developers to build their own BoosterPacks for use with any of the
available TI MCU LaunchPad kits. For more information about the LaunchPad, or about the BoosterPacks
currently available for each LaunchPad kit, visit the LaunchPad site at www.ti.com.
1
2
3
4
5
6
7
8
Contents
LaunchPad and BoosterPack Expansion Concept and Overview ....................................................
BoosterPack Functional Interface .........................................................................................
BoosterPack XL Functional Interface ....................................................................................
LaunchPad Power Interface ...............................................................................................
Special Consideration for Shared Pins ...................................................................................
Tiva C Series LaunchPad Dimensions and Mating .....................................................................
BoosterPack Design Guidelines ..........................................................................................
References and Schematics ...............................................................................................
2
4
5
6
7
7
8
9
List of Tables
1
LaunchPad BoosterPack Compatibility Summary ...................................................................... 2
2
J1 Connector
4
3
J2 Connector
4
4
5
6
................................................................................................................
................................................................................................................
J3 Connector ................................................................................................................
J4 Connector ................................................................................................................
Tiva C Series LaunchPad Jumper List ...................................................................................
5
5
7
Tiva, MSP430 are trademarks of Texas Instruments.
Stellaris is a registered trademark of Texas Instruments.
Cortex is a trademark of ARM Limited.
ARM is a registered trademark of ARM Limited.
All other trademarks are the property of their respective owners.
SPMU288A – August 2012 – Revised April 2013
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Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development
Guide
Copyright © 2012–2013, Texas Instruments Incorporated
1
LaunchPad and BoosterPack Expansion Concept and Overview
1
www.ti.com
LaunchPad and BoosterPack Expansion Concept and Overview
The Texas Instruments’ Tiva C Series TM4C123G LaunchPad concept is an extremely low-cost,
expandable evaluation system for TI's Tiva C Series of ARM microcontrollers. This concept began with the
tremendously successful MSP430™ LaunchPad which introduced a large number of engineers to the TI
MSP430 family of microcontrollers. The TI Stellaris® LM4F120 LaunchPad expanded on that success.
Now, the LaunchPad evaluation kit platform introduces the Tiva C Series EK-TM4C123GXL LaunchPad,
featuring the Tiva C Series TM4C123GH6PM MCU.
A Tiva C Series LaunchPad consists of a target microcontroller, an in-circuit debug interface (ICDI) such
as JTAG, a regulated power supply, a minimal microcontroller support circuit, a user interface, and a set of
expansion headers. These expansion headers are referred to as the BoosterPack Interface. A
BoosterPack is an expansion card designed for this interface. The BoosterPack interface provides a
mechanism for developers to easily extend the Tiva C Series LaunchPad with application- and userspecific functions.
The EK-TM4C123GXL LaunchPad provides a BoosterPack interface that is compatible with the MSP430
LaunchPad. In addition, the TM4C123 LaunchPad provides access to additional Tiva C Series
functionality through an extended BoosterPack interface called the BoosterPack XL Interface.
BoosterPack interfaces with highly similar functionality for expansion will be available for the Tiva C Series
LaunchPad, in addition to microcontroller-family-specific functionality available on a BoosterPack XL
Interface for additional options. Table 1 provides a summary of current BoosterPack interface
compatibility.
Table 1. LaunchPad BoosterPack Compatibility Summary
LaunchPad Kit
2
Compatible with:
BoosterPack Interface
BoosterPack XL Interface
Yes
Stellaris LaunchPad
Yes
MSP430 LaunchPads
Yes
No
Tiva C Series LaunchPad
Yes
Yes
Other TI LaunchPads
Yes
No
Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development
Guide
SPMU288A – August 2012 – Revised April 2013
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LaunchPad and BoosterPack Expansion Concept and Overview
www.ti.com
This development guide provides necessary design information for developers who want to create
BoosterPacks that extend the functionality of the Tiva C Series or Stellaris LaunchPads using either the
original BoosterPack Interface or the BoosterPack XL Interface. Figure 1 shows a photo of the Tiva C
Series LaunchPad.
Figure 1. Tiva C Series TM4C123G LaunchPad Evaluation Board
Power Select
Switch
USB Connector
(Power/ICDI) Green Power LED
Tiva
TM4C123GH6PMI
Microcontroller
USB Micro-A/-B
Connector
(Device)
Reset Switch
RGB User LED
Tiva C Series
LaunchPad
BoosterPack XL
Interface (J1, J2, J3,
and J4 Connectors)
Tiva C Series
LaunchPad
BoosterPack XL
Interface (J1, J2, J3,
and J4 Connectors)
Tiva
TM4C123GH6PMI
Microcontroller
MSP430
LaunchPad-Compatible
BoosterPack Interface
MSP430
LaunchPad-Compatible
BoosterPack Interface
User Switch 1
SPMU288A – August 2012 – Revised April 2013
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User Switch 2
Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development
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Copyright © 2012–2013, Texas Instruments Incorporated
3
BoosterPack Functional Interface
2
www.ti.com
BoosterPack Functional Interface
The Tiva C Series LaunchPad BoosterPack Interface provides compatibility with the original MSP430
LaunchPad BoosterPack interface. This interface consists of the outer 10-pin headers. The pins are
spaced 0.10 in (2,54 mm) apart with the two headers located 1.8 in (4,572 cm) apart.
Table 2 and Table 3 both provide information about which Tiva C Series MCU peripherals are routed to
each of the interface pins. The J1 connector is located on the far left side of the Tiva C Series LaunchPad.
The J2 connector is located on the far right side of the TM4C123G LaunchPad. Software is used to
configure the TM4C123GH6PM pin for one of the functions found in the tables. Highlighted functions
indicate configuration for compatibility with the MSP430 LaunchPad.
Table 2. J1 Connector (1)
Analog
Function
J1 Pin
GPIO
GPIO
AMSEL
Onboard
Function
Tiva C
Series
MCU
Pin
1
2
3
GPIOPCTL Register Setting
1.01
(1)
4
5
6
7
8
9
14
15
3.3 V
1.02
PB5
AIN11
–
57
–
SSI2Fss
–
M0PWM3
–
–
T1CCP1
CAN0Tx
–
–
–
1.03
PB0
USB0ID
–
45
U1Rx
–
–
–
–
–
T2CCP0
–
–
–
–
1.04
PB1
USB0VBUS
–
46
U1Tx
–
–
–
–
–
T2CCP1
–
–
–
–
1.05
PE4
AIN9
–
59
U5Rx
–
I2C2SCL
M0PWM4
M1PWM2
–
–
CAN0Rx
–
–
–
1.06
PE5
AIN8
–
60
U5Tx
–
I2C2SDA
M0PWM5
M1PWM3
–
–
CAN0Tx
–
–
–
1.07
PB4
AIN10
–
58
–
SSI2Clk
–
M0PWM2
–
–
T1CCP0
CAN0Rx
–
–
–
1.08
PA5
–
–
22
–
SSI0Tx
–
–
–
–
–
–
–
–
–
1.09
PA6
–
–
23
–
–
I2C1SCL
–
M1PWM2
–
–
–
–
–
–
1.10
PA7
–
–
24
–
–
I2C1SDA
–
M1PWM3
–
–
–
–
–
–
Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
Table 3. J2 Connector (1)
J2
Pin
Analog
Function
GPIO
GPIO
AMSEL
On-board
Function
Tiva C
Series
MCU
Pin
GPIOPCTL Register Setting
1
2
2.01
4
5
6
7
8
9
14
15
GND
2.02
PB2
–
–
47
–
–
I2C0SCL
–
–
–
T3CCP0
–
–
–
–
2.03
PE0
AIN3
–
9
U7Rx
–
–
–
–
–
–
–
–
–
–
2.04 (2)
PF0
–
USR_SW2/
WAKE (R1)
28
U1RTS
SSI1Rx
CAN0Rx
–
M1PWM4
PhA0
T0CCP0
NMI
C0o
–
–
PB7
–
4
–
SSI2Tx
–
M0PWM1
–
–
T0CCP1
–
–
–
–
2.06
PD1
AIN6
Connected
for MSP430
Compatibility
(R10)
62
SSI3Fss
SSI1Fss
I2C3SDA
M0PWM7
M1PWM1
–
WT2CCP1
–
–
–
–
PB6
–
–
SSI2Rx
–
M0PWM0
–
–
T0CCP0
–
–
–
–
PD0
AIN7
Connected
for MSP430
Compatibility
(R9)
1
2.07
61
SSI3Clk
SSI1Clk
I2C3SCL
M0PWM6
M1PWM0
–
WT2CCP0
–
–
–
–
2.08
PA4
–
–
21
–
SSI0Rx
–
–
–
–
–
–
–
–
–
2.09
PA3
–
–
20
–
SSI0Fss
–
–
–
–
–
–
–
–
–
2.10
PA2
–
–
19
–
SSI0Clk
–
–
–
–
–
–
–
–
–
2.05
(1)
(2)
4
3
RESET
Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
Not recommended for BoosterPack use. J2.04 is a TEST pin on the MSP430 LaunchPad. This signal tied to on-board function
via 0-Ω resistor.
Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development
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BoosterPack XL Functional Interface
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3
BoosterPack XL Functional Interface
The BoosterPack XL Interface consists of the J1 and J2 connectors as well as the inner 10-pin headers
spaced 1.6 in (4,064 cm) apart directly inside of the MSP430 LaunchPad-compatible BoosterPack
interface headers. The pins are spaced on 0.10-inch (2,54-mm) centers. These inner 10-pin headers
(connectors J3 and J4) are not intended to be compatible with other TI LaunchPads or LaunchPad XL kits.
This feature is a Tiva C Series-only interface. TI recommends that LaunchPads provide analog functions
on the left side of the BoosterPack XL interface and timer or PWM functions on the right side of the
BoosterPack XL interface. The Tiva C Series board conforms to these recommendations. No effort has
been made to make this interface compatible with any other LaunchPad.
Table 4 and Table 5 show the Tiva C Series peripherals that are routed to each pin of the Tiva C Seriesonly BoosterPack XL Interface pins. J3 is the inner left BoosterPack XL Interface header. J4 is the inner
right BoosterPack XL Interface header. Software is used to configure the TM4C123GH6PM pin for one of
the functions found in the tables.
Table 4. J3 Connector (1)
Analog
Function
J3
Pin
GPIO
GPIO
AMSEL
On-board
Function
Tiva C
Series
MCU
Pin
GPIOPCTL Register Setting
1
2
3
3.01
5
6
7
8
9
14
15
M1PWM0
–
WT2CCP0
–
–
–
–
–
T0CCP0
–
–
–
–
5.0 V
3.02
3.03
4
GND
PD0
AIN7
PB6
–
Connected
for MSP430
Compatibilit
y (R9)
61
SSI3Clk
SSI1Clk
I2C3SCL
M0PWM6
1
–
SSI2Rx
–
M0PWM0
Connected
for MSP430
Compatibilit
y (R10)
92
SSI3Fss
SSI1Fss
I2C3SDA
M0PWM7
M1PWM1
–
WT2CCP1
–
–
–
–
4
–
SSI2Tx
–
M0PWM1
–
–
T0CCP1
–
–
–
–
63
SSI3Rx
SSI1Rx
–
M0FAULT0
–
–
WT3CCP0
USB0EPE
N
WT3CCP1
USB0PFLT
–
–
–
–
–
–
–
PD1
AIN6
3.04
PB7
–
3.05
PD2
AIN5
3.06
PD3
AIN4
–
64
SSI3Tx
SSI1Tx
–
–
–
–
3.07
PE1
AIN2
–
8
U7Tx
–
–
–
–
–
3.08
PE2
AIN1
–
7
–
–
–
–
–
–
–
–
–
–
–
3.09
PE3
AIN0
–
6
–
–
–
–
–
–
–
–
–
–
–
3.10
PF1
–
–
29
U1CTS
SSI1Tx
–
–
M1PWM5
–
T0CCP1
–
C1o
TRD1
–
(2)
(1)
(2)
Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
Not recommended for BoosterPack use. This signal tied to on-board function via 0-Ω resistor.
Table 5. J4 Connector
J4
Pin
Analog
Function
GPIO
GPIO
AMSEL
Onboard
Function
Tiva C
Series
MCU
Pin
1
2
3
4
5
6
7
8
9
14
15
GPIOPCTL Register Setting
4.01
PF2
–
Blue LED
(R11)
30
–
SSI1Clk
–
M0FAULT0
M1PWM6
–
T1CCP0
–
–
–
TRD0
4.02
PF3
–
Green
LED
(R12)
31
–
SSI1Fss
CAN0Tx
–
M1PWM7
–
T1CCP1
–
–
–
TRCLK
4.03
PB3
–
–
48
–
–
I2C0SDA
–
–
–
T3CCP1
–
–
–
–
4.04
PC4
C1–
–
16
U4Rx
U1Rx
–
M0PWM6
–
IDX1
WT0CCP0
U1RTS
–
–
–
4.05
PC5
C1+
–
15
U4Tx
U1Tx
–
M0PWM7
–
PhA1
WT0CCP1
U1CTS
–
–
–
4.06
PC6
C0+
–
14
U3Rx
–
–
–
–
PhB1
WT1CCP0
USB0EPE
N
–
–
–
4.07
PC7
C0–
–
13
U3Tx
–
–
–
–
–
WT1CCP1
USB0PFLT
–
–
–
4.08
PD6
–
–
53
U2Rx
–
–
–
–
PhA0
WT5CCP0
–
–
–
–
4.09
PD7
–
–
10
U2Tx
–
–
–
–
PhB0
WT5CCP1
NMI
–
–
–
4.10 (1)
PF4
–
USR_SW
1 (R13)
5
–
–
–
–
M1FAULT0
IDX0
T2CCP0
USB0EPE
N
–
–
–
(1)
Not recommended for BoosterPack use. This signal tied to on-board function via 0-Ω resistor.
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5
LaunchPad Power Interface
4
www.ti.com
LaunchPad Power Interface
The Tiva C Series LaunchPad has provisions to provide power to a BoosterPack through either the
BoosterPack Interface or the BoosterPack XL Interface. The configuration of power and ground pins on
both of these interfaces must be consistent across LaunchPads from all TI microcontroller families.
The TM4C123G LaunchPad draws power from either of the on-board USB interfaces as selected by the
power switch in the top left corner of the board. Typically, the USB connection provides 500 mA at 5 V to
the Tiva C Series LaunchPad. The selected USB power source is made directly available to the
BoosterPack XL Interface on the J3.01 pin. This pin is a direct connection with only small decoupling
capacitors provided on the Tiva C Series LaunchPad.
All LaunchPads, including the TM4C123G LaunchPad, also provide a 3.3-V supply on pin J1.01 of the
BoosterPack Interface. On the Tiva C Series LaunchPad, this supply is sourced by a TPS73633 LDO
voltage regulator which converts the selected 5-V USB power to 3.3 V. The regulator is capable of
sourcing 400 mA at 3.3 V. This 3.3-V supply is shared between the BoosterPack Interface, the in-circuit
debug interface (ICDI), and the target microcontroller. Therefore, under normal circumstances,
approximately 300 mA to 350 mA are available to the BoosterPack Interface. Detailed power management
is the responsibility of the BoosterPack developer who must also manage the application to be run on the
target microcontroller.
The TM4C123G LaunchPad can be powered through an external supply on a BoosterPack. If providing
power to the Tiva C Series LaunchPad from a BoosterPack, move the power select switch to select an
unused USB connection to prevent power bus contention between the BoosterPack and the USB
connection. Power may be supplied to either the 3.3-V or the 5.0-V system, but not both. Providing
external power to both 5 V and 3.3 V would result in a contention between the external power supplies
and the TM4C123G LaunchPad voltage regulator. Providing only 3.3 V results in some lost functionality
(for example, the on-board LEDs may not illuminate). It may also result in reverse current leakage through
the on-board voltage regulator. Therefore, if providing power externally, it is recommended to use either
the existing USB connections or an external 5-V supply from a BoosterPack.
Ground connections are available on pins J2.01 and J3.02. These pins provide a ground connection for
both the BoosterPack Interface and the BoosterPack XL Interface, respectively.
Additional power and ground pins are available through labeled pins located in the extreme lower corners
of the Tiva C Series LaunchPad. These pins are connected to the same 3.3 V, 5 V, and ground
connections as the pins on the BoosterPack Interface and the BoosterPack XL Interface.
6
Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development
Guide
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Special Consideration for Shared Pins
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5
Special Consideration for Shared Pins
To provide compatibility with the MSP430 LaunchPad's BoosterPack interface as well as to provide a
maximum number of signals to the BoosterPack Interface and BoosterPack XL Interface, it was necessary
to route some signals to more than one pin. In addition, certain on-board functions such as the button and
LED signals are available on the BoosterPack Interface and BoosterPack XL Interface. A 0-Ω jumper
resistor was installed for signals that are used for more than one purpose or routed to more than one
GPIO. Removal of this jumper disconnects the functions. All jumpers are installed by default. A listing of
these jumpers and the respective use of each is provided in Table 6.
Table 6. Tiva C Series LaunchPad Jumper List
6
Resistor
Primary Function
Alternate Function
R1
Right User Switch
J2.04
Test pin on MSP430 LaunchPad. This connection
along with R13 provides Hibernate wake to
BoosterPack Interface
Comments
R2
Red LED
To PF1 and J3.10
If removed: allows extra GPIO to the BoosterPack
XL Interface.
If installed (default): allows BoosterPack to drive
LED or sense LED state. Also provides Embedded
Trace signal TRD1.
R8
Hibernate Wake
To PF0 and J2.04 via
R1
R9
PB6 SSI2 TX on J2.07
PD0 I2C SCL on J2.07
Routes I2C from PD0 to J2.07 for MSP430-Tiva C
Series LaunchPad compatibility. If using PD0 or
PB6, the unused GPIO must be configured as an
input or R9 removed.
R10
PB7 SSI2 RX on J2.06
PD1 I2C SDA on J2.06
Routes I2C from PD1 to J2.06 for MSP430-Tiva C
Series LaunchPad compatibility. If using PD1 or
PB7, the unused GPIO must be configured as an
input or R9 removed.
R11
Blue LED
To PF2 and J4.01
If removed: allows extra GPIO to the BoosterPack
XL Interface.
If installed (default): allows BoosterPack to drive
LED or sense LED state Also provides Embedded
Trace signal TRD0.
R12
Green LED
To PF3 and J4.02
If removed: allows extra GPIO to the BoosterPack
XL Interface.
If installed (default): allows BoosterPack to drive
LED or sense LED state. Also provides Embedded
Trace signal TRDCLK.
R13
Left User Switch
To PF4 and J4.10
If removed: allows extra GPIO to the BoosterPack
XL Interface.
If installed (default): allows BoosterPack to
simulate switch press or sense switch state.
Allows user switch 2 to wake device from
hibernate. Also ties wake to J2.04 to allow
BoosterPack to wake Stellaris LaunchPad from
Hibernate.
Tiva C Series LaunchPad Dimensions and Mating
See Figure 2 for a dimensional drawing of the Stellaris LaunchPad. J1 and J2 are 1.8 in (4,572 cm) apart
and constitute the BoosterPack interface. J3 and J4 are 1.6 in (4,064 cm) apart and constitute the
BoosterPack XL Interface. Other major board signals are available on unpopulated headers on a 0.1-in
(2,54-mm) grid. Dimensions to these signals are provided for convenience. These signals are subject to
change or move across revisions of the Tiva C Series LaunchPad or future LaunchPads. It is
recommended that BoosterPacks use only the BoosterPack Interface and BoosterPack XL Interface. Use
of other pins and signals is acceptable, but these pins and signals can change at any time.
SPMU288A – August 2012 – Revised April 2013
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Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development
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Copyright © 2012–2013, Texas Instruments Incorporated
7
BoosterPack Design Guidelines
www.ti.com
Figure 2. Tiva C Series LaunchPad Dimensions
NOTE: Units are in mils (one thousandth of an inch): 1 mil = 0.001 inch (0.0254 mm).
7
BoosterPack Design Guidelines
Follow these guidelines when designing your BoosterPack:
• BoosterPacks should not extend more than 0.350 in (8,89 mm) above the center of the top
BoosterPack Interface pin.
• BoosterPacks should not extend more than 0.150 in (3,81 mm) below the center of the bottom pin of
the BoosterPack Interface.
NOTE: BoosterPacks that extend more than 0.150 in (3,81 mm) below the center of the bottom pin
will partially cover the Tiva C Series LaunchPad user switches, which can result in lost user
access to those user inputs.
•
•
•
•
8
BoosterPacks are not restricted in width and may extend as much as desired left and right of the Tiva
C Series LaunchPad.
For BoosterPacks with RF antennas, place the antenna to the left or right of the Tiva C Series
LaunchPad for minimal interference and signal attenuation.
The BoosterPack interface does not provide any means of keying or alignment guidance. It is
recommended that visual cues be provided on the BoosterPack to assist user in proper orientation of
the BoosterPack.
If possible, design the BoosterPack so that incorrect mating to a Tiva C Series LaunchPad does not
damage the BoosterPack.
Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development
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SPMU288A – August 2012 – Revised April 2013
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Copyright © 2012–2013, Texas Instruments Incorporated
References and Schematics
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8
References and Schematics
8.1
References
In addition to this document, the following references are available for download at www.ti.com:
• Tiva C Series TM4C123GH6PM Microcontroller Data Sheet (literature number SPMS376).
• Tiva C Series LaunchPad (EK-TM4C123GXL) User Guide. Available for download at
www.ti.com/tool/ek-tm4c123gxl
• TivaWare for C Series Driver Library. Available for download at www.ti.com/tool/sw-tm4c-drl.
• TivaWare for C Series Driver Library User’s Manual (literature number SPMU298).
• TPS73633 Low-Dropout Regulator with Reverse Current Protection Data Sheet (literature number
SBVS038)
8.2
Schematics
This section contains the complete schematics for the Tiva C Series LaunchPad board.
• Microcontroller, USB, Expansion, Buttons, and LED
• Power Management
• In-Circuit Debug Interface
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Copyright © 2012–2013, Texas Instruments Incorporated
9
PC4
PC5
PC6
PC7
52
51
50
49
16
15
14
13
PE0
PE1
PE2
PE3
PE4
PE5
9
8
7
6
59
60
DEBUG_PC0/TCK/SWCLK
DEBUG_PC1/TMS/SWDIO
DEBUG_PC2/TDI
DEBUG_PC3/TDO/SWO
USB_DM
USB_DP
VB
PF0
PF1
PF2
PF3
PF4
PD0
PD1
PD2
PD3
1
PE0
PE1
PE2
PE3
PE4
PE5
61
62
63
64
43
44
53
10
D-
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
2
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
0
9
8
D+
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
3
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
4
PA2
PA3
PA4
PA5
PA6
PA7
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
G
GPIO
J9
CON-USB-MICROAB
GPIO
45
46
47
48
58
57
1
4
ID
U1-A
17
18
19
20
21
22
23
24
PA0/U0RX_VCP_TXD
PA1/U0TX_VCP_RXD
5
DEBUG/VCOM
7
6
R14
+USB_VBUS
0
R29
PB1
0
PB0
PD6
PD7
R25
USB_DP
USB_DM
28
29
30
31
5
J1 and J2 provide compatability with
PF0
PF1
PF2
PF3
PF4
Booster Packs designed for MSP430 Launchpad
J3 and J4 sit 100 mils inside J1 and J2 to provide
extended functions specific to this board.
TM4C123G
See the board user manual for complete table of pin mux functions
GPIO
0
0
0
0
0
R1
R2
R11
R12
R13
+3.3V
USR_SW2
LED_R
LED_B
LED_G
USR_SW1
J1
0
PD0
PD1
PB6
R9
0
PB7
R10
J2
1
2
3
4
5
6
7
8
9
10
PB5
PB0
PB1
PE4
PE5
PB4
PA5
PA6
PA7
1
2
3
4
5
6
7
8
9
10
PB2
PE0
PF0
PB7
PB6
PA4
PA3
PA2
TARGETRST
CON_110_100
CON_110_100
+VBUS
SW1
USR_SW1
J3
R3
C
LED_R
330
Q1
DTC114EET1G
B
E
+VBUS
SW2
USR_SW2
D1
R5
C
LED_G
330
Q3
DTC114EET1G
B
2
3
4
R
G
B
A
1
RGB_LED_0404_COMA
J4
1
2
3
4
5
6
7
8
9
10
PD0
PD1
PD2
PD3
PE1
PE2
PE3
PF1
PF2
PF3
PB3
PC4
PC5
PC6
PC7
PD6
PD7
PF4
1
2
3
4
5
6
7
8
9
10
CON_110_100
CON_110_100
R8
WAKE
330
E
R4
C
LED_B
330
Q2
DTC114EET1G
B
E
DESIGNER
REVISION
DATE
DGT
0.3
2/20/2013
TEXAS INSTRUMENTS
R
PROJECT
TIVA MICROCONTROLLERS
Tiva TM4C123G LaunchPad
108 WILD BASIN ROAD, SUITE 350
AUSTIN TX, 78746
DESCRIPTION
www.ti.com
Microcontroller, USB, Expansion, Buttons and LED
FILENAME
EK-TM4C123GXL Rev A.sch
PART NO.
EK-TM4C123GXL
SHEET
1 OF 3
+MCU_PWR
RESET
R28
10k
H20
H24 and H25 installed as a single 1x2
RESET
+USB_VBUS
header on 100 mil center with jumper
TARGETRST
H18
C13
0.1uF
OMIT
+VBUS
Power Select
SW3
U1-B
2
38
3
WAKE
41
OSC1
40
OSC0
6
5
34
XOSC0
35
GNDX
36
XOSC1
C28
24pF
C29
24pF
0
R26
Y2
16MHz
3
C31
10pF
+3.3V
+VBUS
H17 H23
RESET
+3.3V 400mA Regulator
H22
GNDA
12
GND
27
GND
39
GND
55
GND
C32
10pF
32.768Khz
Y1
HIB
VBAT
VDDA
32
H1
1
4
H25
WAKE
33
+3.3V
0
R30
OMIT
HIB
37
2
11
VDD
26
VDD
42
VDD
54
VDD
25
VDDC
56
VDDC
TM4C123G
C3
C4
C5
C6
C8
C7
0.01uF
0.1uF
0.01uF
0.1uF
0.01uF
1.0uF
H2
H19
+MCU_PWR
H24
H21
1M
R31
+ICDI_VBUS
C10
0.1uF
+MCU_VDDC
C11
0.1uF
C12
C22
2.2uF
1.0uF
U8
TPS73633DRB
OUT
4
NR
PAD
C18
0.01uF
D4
1.0uF
3
9
EN
GND
C14
1
R27
IN
5
330
8
Green
H11
H13
H12
H10
+VBUS
+3.3V
R17
10k
D2
TLV803
RESET 2
3
VDD
GND 1
A1
3
K
A2
TARGETRST
ICDI_RST
U4
OMIT this SVS Section for Tiva. Errata Fixed
DESIGNER
REVISION
DATE
DGT
0.3
2/20/2013
TEXAS INSTRUMENTS
R
PROJECT
TIVA MICROCONTROLLERS
Tiva Launchpad
108 WILD BASIN ROAD, SUITE 350
AUSTIN TX, 78746
DESCRIPTION
www.ti.com
Power Management
FILENAME
EK-TM4C123GXL Rev A.sch
PART NO.
EK-TM4C123GXL
SHEET
2 OF 3
PA1/U0TX_VCP_RXD
PA0/U0RX_VCP_TXD
+MCU_PWR
In-Circuit Debug Interface (ICDI)
DEBUG/VCOM
+3.3V
U2-A
TARGETRST
H14
EXTDBG
52
51
50
49
16
15
14
13
+3.3V
R21
10k
R22
10k
9
8
7
6
59
60
ICDI_TCK
ICDI_TMS
ICDI_TDI
ICDI_TDO
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PE0
PE1
PE2
PE3
PE4
PE5
PF0
PF1
PF2
PF3
PF4
45
46
47
48
58
57
1
4
61
62
63
64
43
44
53
10
28
29
30
31
5
R24
330
VB
1
D-
2
DEBUG_PC3/TDO/SWO
D+
3
ID
4
DEBUG_PC1/TMS/SWDIO
DEBUG_PC0/TCK/SWCLK
CON-USB-MICROB
J11
DEBUG_PC0/TCK/SWCLK
DEBUG_PC1/TMS/SWDIO
DEBUG_PC3/TDO/SWO
DEBUG_PC2/TDI
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
6
7
17
18
19
20
21
22
23
24
0
R16
G
5
8
9
R23
10k
H15
R18
10k
+ICDI_VBUS
TM4C123G
+3.3V
R19
10k
ICDI_RST
C34
0.1uF
OMIT
ICDI JTAG
+3.3V
U2-B
38
RESET
WAKE
34
XOSC0
35
GNDX
36
XOSC1
0
R20
41
OSC1
40
OSC0
Y5
16MHz
3
C25
10pF
C26
10pF
GNDA
12
GND
27
GND
39
GND
55
GND
HIB
VBAT
VDDA
J5
32
33
ICDI_TCK
37
ICDI_TMS
+3.3V
5
4
3
2
1
6
7
8
9
10
ICDI_TDO
ICDI_TDI
ICDI_RST
2
11
VDD
26
VDD
42
VDD
54
VDD
TC2050-IDC-NL
C15
C17
C19
C20
C21
C1
0.01uF
0.1uF
0.01uF
0.1uF
0.01uF
1.0uF
25
VDDC
56
VDDC
TM4C123G
C23
0.1uF
C24
0.1uF
C2
1.0uF
C9
2.2uF
DESIGNER
REVISION
DATE
DGT
0.3
2/20/2013
TEXAS INSTRUMENTS
R
PROJECT
TIVA MICROCONTROLLERS
Tiva TM4C123G LaunchPad
108 WILD BASIN ROAD, SUITE 350
AUSTIN TX, 78746
DESCRIPTION
In Circuit Debug Interface
FILENAME
EK-TM4C123GXL Rev A.sch
www.ti.com
PART NO.
EK-TM4C123GXL
SHEET
3 OF 3
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO
BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
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ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL
DAMAGES.
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety
programs, please visit www.ti.com/esh or contact TI.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
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therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,
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REGULATORY COMPLIANCE INFORMATION
As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal
Communications Commission (FCC) and Industry Canada (IC) rules.
For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,
DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer
use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency
interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will
be required to take whatever measures may be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and
power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local
laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this
radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and
unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory
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For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
For EVMs annotated as IC – INDUSTRY CANADA Compliant
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs including radio transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs including detachable antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
【Important Notice for Users of this Product in Japan】
】
This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan
If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:
1.
2.
3.
Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this
product, or
Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with
respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note
that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.
Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan
http://www.tij.co.jp
【ご使用にあたっての注】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
http://www.tij.co.jp
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
EVALUATION BOARD/KIT/MODULE (EVM)
WARNINGS, RESTRICTIONS AND DISCLAIMERS
For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished
electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in
laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks
associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end
product.
Your Sole Responsibility and Risk. You acknowledge, represent and agree that:
1.
2.
3.
4.
You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug
Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,
affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.
You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable
regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,
contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)
between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to
minimize the risk of electrical shock hazard.
You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even
if the EVM should fail to perform as described or expected.
You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.
Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the
user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and
environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact
a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the
specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or
interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the
load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures
greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include
but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the
EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please
be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable
in electronic measurement and diagnostics normally found in development environments should use these EVMs.
Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives
harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in
connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims
arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.
Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such
as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices
which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate
Assurance and Indemnity Agreement.
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Copyright © 2013, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
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