SH6622A

SH6622A
SH6622A
Mask 4-bit Microcontroller
Features
Oscillator (code option)
- X`tal oscillator:
32.768KHz ~ 4MHz
- Ceramic resonator: 400K ~ 4MHz
- RC oscillator:
400K ~ 4MHz
- External clock:
30K ~ 4MHz
Instruction cycle time:
- 4/32.768KHz (≈ 122us) for 32.768KHz OSC clock
- 4/4MHz (= 1us) for 4MHz OSC clock
Two low power operation modes: HALT and STOP
Built-in watchdog timer (code option)
SH6610C-based single-chip 4-bit microcontroller
ROM: 4K X 16 bits
RAM: 160 X 4 bits (Data memory)
Operation voltage: 2.2V - 6.0V (Typical 3.0V or 5.0V)
22 CMOS bi-directional I/O pins
4-level subroutine nesting (including interrupts)
One 8-bit auto re-load timer/counter
Warm-up timer for power on reset
Powerful interrupt sources:
- Internal interrupt (Timer0)
- External interrupts: PortB & PortC (Falling edge)
General Description
SH6622A is a 4-bit microcontroller. This chip integrates the SH6610C 4-bit CPU core with SRAM, 4K program ROM, Timer and
I/O Port.
Pin Configuration
1
28
PORTE.1
PORTE.3
2
27
PORTE.0
PORTF.1
3
26
PORTF.0
PORTA.2
4
25
PORTA.1
PORTA.3
5
24
PORTA.0
T0
6
23
OSCI
RESET
7
22
OSCO
GND
8
21
VDD
PORTB.0
9
20
PORTC.3
PORTB.1
10
19
PORTC.2
PORTB.2
11
18
PORTC.1
PORTB.3
12
17
PORTC.0
PORTD.0
13
16
PORTD.3
PORTD.1
14
15
PORTD.2
SH6622A
PORTE.2
1
V2.4
SH6622A
Block Diagram
OSCI
OSCO
RESET
XTAL/RC
OPTION ROM
OSC
CPU
RC
PORTA (4 BITS)
PRESCALER
WATCHDOG
TIMER (3-BIT)
PORTA [3:0]
PORTB (4 BITS)
PORTB [3:0]
PORTC (4 BITS)
PORTC [3:0]
PORTD (4 BITS)
REG
8-BIT TIMER
(UP COUNTER)
PORTD [3:0]
PORTE (4 BITS)
WDT TIME
OUT
PORTE [3:0]
ROM
4096 X 16BIT
PORTF (2 BITS)
TIMER
INTERRUPT
PORTF [1:0]
DATA RAM
160 X 4BIT
GND
VDD
T0
Pin Description
Pin No.
Designation
I/O
Descriptions
27, 28, 1, 2
PE.0 - PE.3
I/O
Bit programmable I/O
26, 3
PF.0 - PF.1
I/O
Bit programmable I/O
24, 25, 4, 5
PA.0 - PA.3
I/O
Bit programmable I/O
6
T0
I
Timer Clock/Counter input pin (Schmitt Trigger input)
7
RESET
I
Reset input (active low) (Schmitt Trigger input)
8
GND
P
Ground pin
9 - 12
PB.0 - PB.3
I/O
Bit programmable I/O. Vector Interrupt (Active falling edge)
13 - 16
PD.0 - PD.3
I/O
Bit programmable I/O
17 - 20
PC.0 - PC.3
I/O
Bit programmable I/O. Vector Interrupt (Active falling edge)
21
VDD
P
Power supply pin
22
OSCO
O
OSC output pin, There is a signal with a frequency of Fosc/4 for RC mode
23
OSCI
I
OSC input pin, connected to crystal, ceramic or external resistor
2
SH6622A
Function Description
1. CPU
Decimal adjustment for addition/subtraction (DAA, DAS)
Logic operations (AND, EOR, OR, ANDIM, EORIM, ORIM)
Decision (BA0, BA1, BA2, BA3, BAZ, BC)
Logic Shift (SHR)
The Carry Flag (CY) holds the ALU overflow, which the
arithmetic operation generates. During an interrupt servicing
or call instruction, the carry flag is pushed into the stack and
restored back from the stack by the RTNI instruction. It is
unaffected by the RTNW instruction.
The CPU contains the following function blocks: Program
Counter, Arithmetic Logic Unit (ALU), Carry Flag,
Accumulator, Table Branch Register, Data Pointer (INX,
DPH, DPM, and DPL), and Stack.
1.1. PC (Program Counter)
The Program Counter is used to address the 4K program
ROM. It consists of 12-bits: Page Register (PC11), and
Ripple Carry Counter (PC10, PC9, PC8, PC7, PC6, PC5,
PC4, PC3, PC2, PC1, PC0).
The program counter normally increases by one (+1) with
every execution of an instruction except in the following
cases:
(1) When executing a jump instruction (such as JMP, BA0,
BC),
(2) When executing a subroutine call instruction (CALL),
(3) When an interrupt occurs,
(4) When the chip is at the INITIAL RESET mode.
The program counter is loaded with data corresponding to
each instruction. The unconditional jump instruction (JMP)
can be set at 1-bit page register for higher than 2K.
1.3. Accumulator
Accumulator is a 4-bit register holding the results of the
arithmetic logic unit. In conjunction with ALU, data transfer
between the accumulator and system register, or data
memory can be performed.
1.4. Stack
A group of registers are used to save the contents of CY &
PC (11-0) sequentially with each subroutine call or interrupt.
It is organized in 13 bits X 4 levels. The MSB is saved for CY.
4 levels are the maximum allowed for subroutine calls and
interrupts.
The contents of Stack are returned sequentially to the PC
with the return instructions (RTNI/RTNW). Stack is operated
on a first-in, last-out basis. This 4-level nesting includes both
subroutine calls and interrupts requests. Note that program
execution may enter an abnormal state if the number of calls
and interrupt requests exceed 4, and the bottom of stack will
be shifted out.
1.2. ALU and CY
ALU performs arithmetic and logic operations. The ALU
provides the following functions:
Binary addition/subtraction (ADC, SBC, ADD, SUB, ADI,
SBI)
2. ROM
The SH6622A can address up to 4096 X 16 bit of program area from $000 to $FFF.
Service routine as starting vector address.
Vector Address Area ($000 to $004)
The program is sequentially executed. There is an area address $000 through $004 that is reserved for a special interrupt
service routine such as starting vector address.
Address
Instruction
Function
$000H
JMP instruction
Jump to RESET service routine
$001H
NOP
Reserved
$002H
JMP instruction
Jump to TIMER0 service routine
$003H
NOP
Reserved
$004H
JMP instruction
Jump to PBC service routine
3
SH6622A
3. RAM
Built-in RAM consists of general-purpose data memory and system register. Direct addressing in one instruction can access d
ata memory and system register.
The following is the memory allocation map:
$000 - $01F: System register and I/O.
$020 - $0BF: Data memory (160 X 4 bits).
The configuration of system Register
Address
Bit3
Bit2
Bit1
$00
$01
$02
Bit0
R/W
-
IET0
-
IRQT0
-
TM0.2
Remarks
-
IEP
R/W
Interrupt enable flags
-
IRQP
R/W
Interrupt request flags
TM0.1
TM0.0
R/W
Timer0 Mode register (Prescaler)
$03
-
-
-
-
-
$04
TL0.3
TL0.2
TL0.1
TL0.0
R/W
Reserved
Timer0 load/counter register low digit
$05
TH0.3
TH0.2
TH0.1
TH0.0
R/W
Timer0 load/counter register high digit
$06
-
-
-
-
-
$07
LPD3
LPD2
LPD1
LPD0
W
$08
PA.3
PA.2
PA.1
PA.0
R/W
PORTA
Reserved
LPD Enable Control (LPD3 - 0):
1010: LPD Enable (Default);
0101: LPD Disable
$09
PB.3
PB.2
PB.1
PB.0
R/W
PORTB
$0A
PC.3
PC.2
PC.1
PC.0
R/W
PORTC
$0B
PD.3
PD.2
PD.1
PD.0
R/W
PORTD
$0C
PE.3
PE.2
PE.1
PE.0
R/W
PORTE
$0D
-
-
PF.1
PF.0
R/W
PORTF
$0E
TBR.3
TBR.2
TBR.1
TBR.0
R/W
Table Branch Register
$0F
INX.3
INX.2
INX.1
INX.0
R/W
Pseudo index register
$10
DPL.3
DPL.2
DPL.1
DPL.0
R/W
Data pointer for INX low nibble
$11
-
DPM.2
DPM.1
DPM.0
R/W
Data pointer for INX middle nibble
DPH.2
DPH.1
DPH.0
R/W
Data pointer for INX HIGH nibble
$12
$13 - $15
-
-
-
-
-
Reserved
$16
PA3OUT
PA2OUT
PA1OUT
PA0OUT
W
Set PORTA to be output port
$17
PB3OUT
PB2OUT
PB1OUT
PB0OUT
W
Set PORTB to be output port
$18
PC3OUT
PC2OUT
PC1OUT
PC0OUT
W
Set PORTC to be output port
$19
PD3OUT
PD2OUT
PD1OUT
PD0OUT
W
Set PORTD to be output port
$1A
PE3OUT
PE2OUT
PE1OUT
PE0OUT
W
Set PORTE to be output port
$1B
-
-
PF1OUT
PF0OUT
W
$1C
-
-
T0S
T0E
W
Set PORTF to be output port
Bit0:T0 signal edge;
Bit1: T0 signal source
$1D
-
-
-
-
-
$1E
WDT
-
-
-
W
$1F
-
-
-
-
-
Reserved
Bit3: WDT time-out (write 1 only)
Reserved
* System Register $00 - $12 (except $07H). Please refer to "SH6610C User’s manual".
4
SH6622A
Low Power Detection (LPD)
The LPD function is to monitor the supply voltage and applies an internal reset in the microcontroller at the time of battery
replacement. If the applied circuit satisfies the following conditions, the LPD can be incorporated by software control.
High reliability is not required.
Power supply voltage VDD = 2.2 to 6.0 V
Operating ambient temperature TA = -20℃ to + 70℃
Functions of LPD Circuit
The LPD circuit has the following functions:
Generates an internal reset signal when VDD ≤ VLPD.
Cancels the internal reset signal when VDD > VLPD.
Here, VDD: power supply voltage, VLPD: LPD detect voltage, it is about 1.6 - 1.7V and lower than VDD-MIN (2.2V).
LPD Control Register
The LPD circuit is controlled by software enable flag.
Address
Bit3
Bit2
Bit1
Bit0
R/W
$07
LPD3
LPD2
LPD1
LPD0
W
LPD3﹑ LPD2﹑ LPD1﹑ LPD0﹕
1
0
0
1
1
0
0
1
Remark
LPD Enable Control (LPD3 - 0):
1010: LPD Enable (Default);
0101: LPD Disable
LPD Enable/Disable flag
Enable LPD circuit (Power-on initial)
Disable LPD circuit
5
SH6622A
System Register $16 - $1B
Address
Bit3
Bit2
Bit1
Bit0
R/W
Remarks
$16
PA3OUT
PA2OUT
PA1OUT
PA0OUT
W
Set PORTA to be output port
$17
PB3OUT
PB2OUT
PB1OUT
PB0OUT
W
Set PORTB to be output port
$18
PC3OUT
PC2OUT
PC1OUT
PC0OUT
W
Set PORTC to be output port
$19
PD3OUT
PD2OUT
PD1OUT
PD0OUT
W
Set PORTD to be output port
$1A
PE3OUT
PE2OUT
PE1OUT
PE0OUT
W
Set PORTE to be output port
$1B
-
-
PF1OUT
PF0OUT
W
Set PORTF to be output port
Equivalent Circuit for a Single I/O Pin
VDD
DATA
D
Q
AND
DATA
WRITE
CK
SET
QB
RESET
I/O PIN
DATA IN
READ
CONTROL
D
Q
PXXOUT
WRITE
CK
RESET
OR
QB
GND
RESET
PAXOUT, PBXOUT, PCXOUT, PDXOUT, PEXOUT (X = 0, 1, 2, 3), PFXOUT (X = 0, 1)
1: Use as an output buffer.
0: Use as an input buffer (Power on initial).
T0 & WDT
System Register $1C
Address
BIT3
BIT2
BIT1
BIT0
R/W
$1C
-
-
T0S
T0E
W
T0E: T0 signal edge.
0: Increment on low-to-high transition T0 pin (Power on initial).
1: Increment on high-to-low transition T0 pin.
T0S: T0 signal source.
0: OSC 1/4 (Power on initial).
1: Transition on T0 pin.
6
Remark
Bit0: T0 signal edge
Bit1: T0 signal source
SH6622A
T0S
0
OSC/4
1
T0
M
U
X
TIMER0 (8 BITS)
EOR
TOE
3
BUILT-IN RC
OSCILLATOR
TM0 [2:0]
WDT ENABLE
( USER OPTION )
WDT & WARM
UP COUNTER
3
WDT TIMEOUT
System Register $1E
Address
Bit3
Bit2
Bit1
Bit0
R/W
Remark
$1E
WDT
-
-
-
W
Bit3:WDT time-out bit (write one only)
The input clock of watchdog timer is generated by a built-in RC oscillator. So that the WDT will always run even in the STOP
mode. SH6622A generates a RESET condition when watchdog is time-out. Watchdog can be enabled or disabled permanently
by user option. To prevent it from time-out and generating a device RESET condition, you should write this bit as "1" before
timing-out. The WDT has a time-out period of more than 7ms (VDD = 5V). If longer time-out periods are desired, a prescaler with
a divide ratio of up to 1:2048 can be assigned to the WDT under software controlled by writing to the TM0 register.
Prescaler divide ratio (valid for VDD = 5V):
TM0.2
TM0.1
TM0.0
Prescaler divide ratio
Timer-out period
1
1
1
1:1
7ms
1
1
0
1:2
14ms
1
0
1
1:4
28ms
1
0
0
1:8
56ms
0
1
1
1:32
224ms
0
1
0
1:128
896ms
0
0
1
1:512
3,584ms
0
0
0
1:2048 (Power on initial)
14,336ms
0.875ms
RC OSC
INTERNAL
WDT TIME
OUT PERIOD
7ms
WDT
PRESCALER TM0
SCALER_1
/8
/1
/2
/4 /8
/32 /128 /512 /2048
FINAL WDT
TIME OUT
PERIOD
7
SH6622A
4. Timer0
SH6622A has one 8-bit timer. The time/counter has the following features:
. 8-bit timer/counter
. Readable and writeable
. Automatic reloadable counter
. 8-prescaller scale is available
. Internal and external clock select
. Interrupt on overflow from $FF to $00
. Edge select for external event
Following is a simplified timer block diagram:
Fosc/4
T0C
SYSTEM CLOCK
T0
PRE-SCALER
8-BIT COUNTER
T0M
T0E
T0S
Read Operation:
4.1. Configuration and Operation
Timer-0 consists of an 8-bit write-only timer load register
(TL0L, TL0H), and an 8-bit read-only timer counter (TC0L,
TC0H). The counter and load register both have low order
digits and high order digits. The timer counter can be
initialized by writing data into the timer load register (TL0L,
TL0H). Load register programming: Write the low-order digit
first and then the high-order digit. The timer counter is loaded
with the content of load register automatically when the high
order digit is written or counter counts overflow from $FF to
$00.
Timer Load Register: Since the register H would control the
physical READ and WRITE operation. Please follow these
rules:
Write Operation:
High nibble first;
Low nibble followed.
Load Reg. L
Load Reg. H
8-bit timer counter
Latch Reg. L
Low nibble first;
High nibble to update the counter.
4.2. Timer0 Interrupt
The timer overflow will generate an internal interrupt request, when the counter counts overflow from $FF to $00. If the interrupt
enable flag is enabled, then a timer interrupt service routine will proceed. This can also be used to wake CPU from HALT mode.
8
SH6622A
4.3. Timer0 mode register
The timer can be programmed in several different prescaler ratios by setting Timer Mode register (TM0). The 8-bit counter
counts prescaler overflow output pulses. The timer mode registers (TM0) are 3-bit registers used for timer control as shown in
table1. These mode registers select the input pulse sources into the timer.
Table 1. Timer 0 Mode Register ($02)
TM0.2
TM0.1
0
0
0
0
0
1
TM0.0
Prescaler Divide Ratio
0
1
0
2048 (initial)
9
512
7
128
5
32
3
8
4
4
1
2
0
1
/2
/2
/2
0
1
1
/2
1
0
0
/2
1
0
1
1
1
1
1
0
1
Ratio N
11
/2
/2
/2
4.4. External Clock/Event T0 as Timer0 Source
When external clock/event input is used for TM0, it is synchronized with CPU system clock. Therefor the external source must
follow certain constrains. The output from T0M multiplex is T0C. It is sampled by system clock in instruction frame cycle.
Therefore it is necessary for T0C to be high at least 2 tOSC and low at least 2 tOSC. When prescaler ratio selects /20, T0C is the
same as the system clock input. Therefore the requirements are as follows:
T0H = T0CH = T0 high time ≥ 2 tOSC + ∆T
T0L = T0CL = T0 low time ≥ 2 tOSC + ∆T
When other prescaler ratio is selected, the TM0 is scaled by the asynchronous ripple counter and so the prescaler output is
symmetrical.
Then:
T0C high time = T0C low time =
N * T0
2
Where
T0 = Timer0 input period
N = prescaler value
The requirement is , therefore:
N * T0
4 * t OSC + 2ΔT
≥ 2 tOSC + ∆T , or T0 ≥
2
N
The limitation is applied for T0 period time only. The pulse width is not limited by this equation. It is summarized as follows:
T0 = Timer0 period ≥
4 * t OSC + 2∆T
N
9
SH6622A
5. Port Interrupt
PBC interrupt (PORTB & PORTC, 8bits) is falling edge active. It means that if an interrupt request (IEx is set to 1 and one port
bit is high go low) is been touched and that the condition is the other port bits are high level. Only input port can generate
interrupt.
6. System Clock and Oscillator
System clock generator produces the basic clock pulses that provide the system clock with CPU and peripherals.
Instruction cycle time
(1) 4/32.768KHz (≈ 122us) for 32.768KHz system clock
(2) 4/4MHz (≈ 1us) for 4MHz system clock
Oscillator
(1) Crystal oscillator: 32.768KHz - 4MHz.
C1
C1, C2 Setting :
Crystal
32.768K ~ 4MHz
Crystal 32.768KHz :
C1, C2 < 56p (V DD = 5V);
C1, C2 < 56p (V DD = 3V).
Crystal 4MHz :
C1, C2 < 33p (V DD = 5V);
C1, C2 < 10p (V DD = 3V).
C2
(2) Ceramic resonator: 400KHz - 4MHz.
C1
C1, C2 Setting :
Ceramic
400K ~ 4MHz
Ceramic 400KHz :
20p < C1, C2 < 470p (V DD = 5V);
20p < C1, C2 < 150p (V DD = 3V).
Ceramic 4MHz :
20p < C1, C2 < 100p (V DD = 5V);
C1, C2 < 10p (V DD = 3V).
C2
(3) RC oscillator: 400KHz - 4MHz.
VDD
R
OSCI
OSCO
Fosc/4
(4) External input clock: 30KHz - 4MHz.
OSCI
External clock source
OSCO
10
SH6622A
Initial State
Hardware
After power on reset
Program counter
$000
CY
Undefined
Data memory
Undefined
System register
Undefined
AC
Undefined
Timer counter
0
Timer load register
0
WDT counter
0
WDT prescaler
0
I/O ports
Input
LPD3 ~ 0
1010 (Enable LPD)
T0S T0E
00
WDT
0
11
SH6622A
Instruction Set
All instructions are one cycle and one word instructions. The characteristic is memory-oriented operation.
Arithmetic and Logical Instruction
Accumulator Type
Mnemonic
Instruction Code
Function
Flag Change
ADC
X (, B)
00000 0bbb xxx xxxx
AC
← Mx + AC + CY
CY
ADCM
X (, B)
00000 1bbb xxx xxxx
AC, Mx ← Mx + AC + CY
CY
ADD
X (, B)
00001 0bbb xxx xxxx
AC
ADDM
X (, B)
00001 1bbb xxx xxxx
AC, Mx ← Mx + AC
SBC
X (, B)
00010 0bbb xxx xxxx
AC
← Mx + -AC + CY
CY
SBCM
X (, B)
00010 1bbb xxx xxxx
AC, Mx ← Mx + -AC + CY
CY
SUB
X (, B)
00011 0bbb xxx xxxx
AC
← Mx + -AC + 1
CY
SUBM
X (, B)
00011 1bbb xxx xxxx
AC, Mx ← Mx + -AC + 1
CY
EOR
X (, B)
00100 0bbb xxx xxxx
AC
EORM
X (, B)
00100 1bbb xxx xxxx
AC, Mx ← Mx ⊕ AC
OR
X (, B)
00101 0bbb xxx xxxx
AC
ORM
X (, B)
00101 1bbb xxx xxxx
AC, Mx ← Mx | AC
AND
X (, B)
00110 0bbb xxx xxxx
AC
ANDM
X (, B)
00110 1bbb xxx xxxx
AC, Mx ← Mx & AC
SHR
11110 0000 000 0000
← Mx + AC
CY
CY
← Mx ⊕ AC
← Mx | AC
← Mx & AC
0 → AC [3]; AC [0] →CY;
AC shift right one bit
CY
Immediate Type
Mnemonic
Instruction Code
Function
Flag Change
ADI
X, I
01000 iiii xxx xxxx
AC
← Mx + I
CY
ADIM
X, I
01001 iiii xxx xxxx
AC, Mx ← Mx + I
CY
SBI
X, I
01010 iiii xxx xxxx
AC
← Mx + -I +1
CY
SBIM
X, I
01011 iiii xxx xxxx
AC, Mx ← Mx + -I + 1
CY
EORIM
X, I
01100 iiii xxx xxxx
AC, Mx ← Mx ⊕ I
ORIM
X, I
01101 iiii xxx xxxx
AC, Mx ← Mx | I
ANDIM
X, I
01110 iiii xxx xxxx
AC, Mx ← Mx & I
* In the assembler ASM66 V1.0, EORIM mnemonic is EORI. However, EORI has the operation identical with EORIM. Same for
the ORIM with respect to ORI, and ANDIM with respect to ANDI.
Decimal Adjustment
Mnemonic
Instruction Code
Function
Flag Change
DAA X
11001 0110 xxx xxxx
AC; Mx ← Decimal adjustment for add.
CY
DAS X
11001 1010 xxx xxxx
AC; Mx ← Decimal adjustment for sub.
CY
12
SH6622A
Transfer Instruction
Mnemonic
Instruction Code
LDA
X (, B)
00111 0bbb xxx xxxx
AC
← Mx
STA
X (, B)
00111 1bbb xxx xxxx
Mx
← AC
LDI
X, I
01111 iiii xxx xxxx
AC, Mx ← I
Function
Flag Change
Function
Flag Change
Control Instruction
Mnemonic
Instruction Code
BAZ X
10010 xxxx xxx xxxx
PC
← X if AC = 0
BNZ X
10000 xxxx xxx xxxx
PC
← X if AC ≠ 0
BC X
10011 xxxx xxx xxxx
PC
← X if CY = 1
BNC X
10001 xxxx xxx xxxx
PC
← X if CY ≠ 1
BA0 X
10100 xxxx xxx xxxx
PC
← X if AC (0) = 1
BA1 X
10101 xxxx xxx xxxx
PC
← X if AC (1) = 1
BA2 X
10110 xxxx xxx xxxx
PC
← X if AC (2) = 1
BA3 X
10111 xxxx xxx xxxx
PC
← X if AC (3) = 1
CALL X
11000 xxxx xxx xxxx
ST
← CY; PC + 1
PC
← X (Not including p)
RTNW H; L
11010 000h hhh llll
PC
←ST; TBR ← hhhh;
RTNI
11010 1000 000 0000
HALT
11011 0000 000 0000
STOP
11011 1000 000 0000
JMP X
1110p xxxx xxx xxxx
PC
← X (Include p)
TJMP
11110 1111 111 1111
PC
← (PC11-PC8) (TBR) (AC)
NOP
11111 1111 111 1111
No Operation
AC← llll
CY; PC ← ST
CY
Where,
PC
Program counter
I
Immediate data
AC
Accumulator
⊕
Logical exclusive OR
-AC
Complement of accumulator
|
Logical OR
CY
Carry flag
&
Logical AND
Mx
Data memory
p
ROM page = 0
ST
Stack
13
bbb
RAM bank = 000
TBR
Table Branch Register
SH6622A
Option
Code Option
1. OSC:
osc2 osc1 osc0
OSC type
0
0
0
External (Default)
1 0
0
RC
1 1
0
X’tal 400K - 4MHz
1 0
1
Ceramic
1 1
1
X’tal 32.768KHz
2. WDT_EN:
0: Enable (Default);
1: Disable.
14
SH6622A
Absolute Maximum Rating*
*Comments
DC Supply Voltage . . . . . . . . . . . . . . .-0.3V to +7.0V
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device. These
are stress ratings only. Functional operation of this device
under these or any other conditions above those indicated in
the operational sections of this specification is not implied or
intended. Exposure to the absolute maximum rating conditions
for extended periods may affect device reliability.
Input Voltage . . . . . . . . . . . . . . . -0.3V to VDD + 0.3V
Operating Ambient Temperature . . . . -10℃ to +60℃
Storage Temperature . . . . . . . . . . . .-55℃ to +125℃
DC Electrical Characteristics (VDD = 5.0V GND = 0V, TA = 25℃, FOSC = 4MHz, unless otherwise specified.)
Parameter
Symbol
Min.
Operating Voltage
VDD
4.5
Operating Current
IOP
Stand by Current (HALT)
ISB1
Stand by Current (STOP)
ISB2
Input Low Voltage
VIL1
Input Low Voltage
Typ.
Max.
Unit
6
V
2
mA
0.5
mA
2
µA
GND
0.2 X VDD
V
LPD off (If LPD on, ISB2X = ISB2 + 3µA)
WDT off (If WDT on, ISB2X = ISB2 + 15µA)
I/O ports, pins tri-state
VIL2
GND
0.15 X VDD
V
RESET , T0
Input Low Voltage
VIL3
GND
0.15 X VDD
V
OSCI (Driven by external clock)
Input High Voltage
VIH1
0.8 X VDD
VDD
V
I/O ports, pins tri-state
Input High Voltage
VIH2
0.85 X VDD
VDD
V
RESET , T0
Input High Voltage
VIH3
0.85 X VDD
VDD
V
OSCI (Driven by external Clock)
Input Leakage Current
IIL1
-1
1
µA
I/O ports, GND < VI/O < VDD
Input Leakage Current
IIL2
-5
1
5
µA
GND < V RESET < VDD
Input Leakage Current
IIL4
-3
1
3
µA
T0, GND < Vt0 < VDD
Input Leakage Current
IIL5
-3
1
3
µA
For OSCI
Output High Voltage
VOH
VDD - 0.7
V
I/O ports, IOH = -10mA, VDD = 6.0V
OSCORC, IOH = -0.7mA, VDD = 6.0V
Output Low Voltage
VOL
V
I/O ports, IOL = 20mA, VDD = 6.0V
OSCORC, IOL = 1.6mA, VDD = 6.0V
1
Condition
All output pins unloaded
(Execute NOP instruction)
All output pins unloaded
All output pins unloaded,
1
GND + 0.6
15
SH6622A
AC Electrical Characteristics (VDD = 5.0V GND = 0V, TA = 25℃, FOSC = 4MHz, unless otherwise specified.)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Oscillator start time
TOSC1
1
s
X’tal Osc = 32.768KHz, VDD = 5.0V
Oscillator start time
TOSC2
20
ms
Ceramic Osc = 400KHz, VDD = 5.0V
Oscillator start time
TOSC3
2
ms
RC Osc = 400KHz, VDD = 5.0V
WDT period
TWDT
ms
VDD = 5.0V
Frequency stability (crystal)
∆ F/F
1
PPM
Crystal oscillator: [F(5.0) - F(4.5)]/F(5.0)
Frequency variation(crystal)
∆ F/F
10
PPM
Crystal oscillator: C1 = C2 = 5 - 30P
Frequency stability(ceramic)
∆ F/F
0.1
%
Ceramic resonator Osc: [F(5.0) - F(4.5)]/F(5.0)
Frequency Variation (RC)
∆ F/F
± 20
%
Include supply voltage and chip to chip variation
User Notice:
7
18
Max. Current into VDD = 50mA;
Max. Current out of VSS = 150mA
Max. Output current sunk by any I/O port = 25mA;
Max. Output current sourced by any I/O port = 20mA
Max. Output current sunk by all ports (A, B, C, D, E, F) = 50mA;
Max. Output current sourced by all ports (A, B, C, D, E, F) = 40mA
16
SH6622A
DC Electrical Characteristics (VDD = 3.0V, GND = 0V, TA = 25℃, FOSC = 4MHz, unless otherwise specified)
Parameter
Symbol
Min.
Operating Voltage
VDD
2.2
Operating Current
IOP
Stand-by Current (HALT)
ISB1
Stand-by Current (STOP)
ISB2
Input Low Voltage
VIL1
Input Low Voltage
Typ
Max.
Unit
4.5
V
1.3
mA
0.2
mA
2
µA
GND
0.2 X VDD
V
LPD off (If LPD on, ISB2X = ISB2 + 3µA)
WDT off (If WDT on, ISB2X = ISB2 + 5µA)
I/O ports, pins tri-state
VIL2
GND
0.15 X VDD
V
RESET , T0
Input Low Voltage
VIL3
GND
0.15 X VDD
V
OSCI (Driven by external clock)
Input High Voltage
VIH1
0.8 X VDD
VDD
V
I/O ports, pins tri-state
Input High Voltage
VIH2
0.85 X VDD
VDD
V
RESET , T0
Input High Voltage
VIH3
0.85 X VDD
VDD
V
OSCI (Driven by external Clock)
Input Leakage Current
IIL1
-1
1
µA
I/O ports, GND < VI/O < VDD
Input Leakage Current
IIL2
-5
5
µA
GND < V RESET < VDD
Input Leakage Current
IIL4
-3
1
3
µA
T0, GND < Vt0 < VDD
Input Leakage Current
IIL5
-3
1
3
µA
For OSCI
Output High Voltage
VOH
VDD - 0.7
V
I/O ports, IOH = -7mA, VDD = 3V
OSCORC, IOH = -0.7mA, VDD = 3V
Output Low Voltage
VOL
V
I/O ports, IOL = 8mA, VDD = 3V
OSCORC, IOL = 1.0mA, VDD = 3V
0.7
Condition
All output pins unloaded
(Execute NOP instruction)
All output pins unloaded
All output pins unloaded,
1
GND + 0.4
AC Electrical Characteristics (VDD = 3.0V, GND = 0V, TA = 25℃, FOSC = 4MHz, unless otherwise specified)
Parameter
Symbol
Min.
Typ
Max.
Unit
s
Condition
Oscillator start time
TOSC1
1
Oscillator start time
TOSC2
35
ms
Ceramic Osc = 400KHz, VDD = 3.0V
Oscillator start time
TOSC3
5
ms
RC Osc = 400KHz, VDD = 3.0V
WDT period
TWDT
ms
VDD = 3.0V
Frequency stability (crystal)
∆ F/F
1
PPM
Crystal oscillator: [F(3.0) - F(2.7)]/F(3.0)
Frequency variation (crystal)
∆ F/F
10
PPM
Crystal oscillator: C1 = C2 = 5 ~ 30P
Frequency stability (ceramic)
∆ F/F
0.1
%
Ceramic resonator OSC:[F(3.0) - F(2.7)]/F(3.0)
Frequency Variation (RC)
∆ F/F
± 20
%
Include supply voltage and chip to chip variation
7
18
Operation frequency vs. ISB1
ISB1X = (Frequency/4MHz) X ISB1
Operation frequency vs. lOP
IOPX = (Frequency/4MHz) X IOP
32K Max. Halt current
32KHz Halt current < [email protected]; (WDT is disabled)
17
Crystal Osc = 32.768KHz, VDD = 3.0V
SH6622A
AC Characteristics
Symbol
Parameter
Min.
Typ.
1
Max.
Unit
122
µs
TCY
Instruction cycle time
TIW
T0 input width
(TCY + 40)/N
ns
TIWH
High pulse width
1/2 tIW
ns
TIWL
LOW pulse width
1/2 tIW
ns
Condition
N = Prescaler divide ratio
Timing Waveform
T0 Input Waveform
TiwH
TiwL
T0
Tiw
RC OSCO Timing Waveform
RC - OSC
T1 T2 T3 T4 T5 T6 T7 T8 T1 T2 T3 T4 T5 T6
PORT
OSCO - RC
Built-in RC Oscillator
RESET
OSC
WDT
Built-in RC
Tosc1
Twdt
(Tosc2, Tosc3)
18
SH6622A
Typical RC oscillator Resistor vs. VDD: (for reference only)
F = 4MHz
45
460
40
R (KΩ)
R (KΩ)
F = 400KHz
480
440
420
400
35
30
25
2.0
4.0
VDD (Volts)
6.0
2.0
3.0
4.0
VDD (Volts)
5.0
410
400
390
380
370
360
350
F (KHz)
F (KHz)
Typical RC oscillator Frequency vs. VDD: (for reference only)
2.0
3.0
4.0
VDD (Volts)
5.0
4200
4000
3800
3600
3400
3200
3000
2.0
3.0
4.0
VDD (Volts)
Typical RC oscillator Resistor vs. Frequency: (for reference only)
R (KΩ)
R-F (VDD = 3.0V)
500
450
400
350
300
250
200
150
100
50
0
100
1000
F (KHz)
19
10000
5.0
SH6622A
Application Circuit (for reference only)
AP1:
(1) Operating voltage: 3.0V.
(2) Oscillator: Crystal 32.768KHz.
(3) For high reliability, C1 is better to be added.
(4) PORTA - F: I/O
20p
VDD
22K
OSCI
T0
SH6622A
47KΩ
RESET
C1
0.1µ
GND
20p
OSCO
PORTA
~
PORTF
I/O
AP2
(1) Operating voltage: 5.0V.
(2) Oscillator: Ceramic resonator 400KHz.
(3) For high reliability, C1 is better to be added.
(4) T0 input timer clock / counter
(5) PORTA - F: I/O
T0
47K Ω
RESET
C1
OSCI
SH6622A
VDD
0.1µ
GND
100P
OSCO
100P
PORTA
~
PORTF
I/O
AP3
(1) Operating voltage: 5.0V.
(2) Oscillator: RC 400KHz.
(3) For high reliability, C1 is better to be added.
(4) PORTA - E: I/O
VDD
T0
47KΩ
C1
0.1µ
RESET
GND
SH6622A
22KΩ
470KΩ
OSCI
OSCO
PORTA
~
PORTF
20
1000pF
I/O
SH6622A
AP4
(1) PORTA - C: as scan KEYBOARD (32 keys)
(2) PORTD - F: I/O
VDD
Pull-high
resistor
47K Ω
I/O
PORTD
~
PORTF
SH6622A
PC0
PC1
PC2
PC3
PB0
PB1
PB2
PB3
PA0
PA1
PA2
PA3
21
SH6622A
AP5 (Weight Scale)
(1) Operating voltage: 5.0V
(2) Oscillator: Ceramic resonator 4MHz
(3) Port A0: External interrupt input for ON/OFF switch
(4) Port E2, E3, F1, A2: S4 - S1 analog switch control signals that control Vil to be charged and discharged by both the reference
voltage (Vref) and the amplified voltage (Vo). The charged and discharged times are determined by the values of C1, R4 and
the threshold voltage of T0 input pin and the ADC resolution could be up to 8 bit
(5) Other Ports: Sink seven-segment LED current directly. 0 - 199 can be displayed in this configuration
VDD
VDD
Load
Cell
Vref
R5
S1
R3
Vi
R2
ON/OFF
S2
R1
Vi1
Vo
R3
S3
R4
C1
S4
Instrumentation Amplifier
R6
100Ω
Vo = (1 + 2R2/R1) (R4/R3) Vi
47K
0.1u
1
S1
PE2
2
S2
PE3
3
S3
PF1
4
S4
PA2
5
PA3
6
7 T0
8 RESET
GND
9
PB0
10
PB1
11
PB2
12
PB3
13
PD0
14
PD1
28
27
26
25
24
23
22
21
VDD
20
19
18
17
16
PD3 15
PD2
PE1
PE0
PF0
PA1
PA0
OSCI
OSCO
VDD
PC3
PC2
PC1
PC0
abc de f g
22
C
1
4MHz
R2
2
abc de f g
120P - 470P
XC1
C
120P - 470P
abc de f g
SH6622A
AP6:
Reset Protection Circuit 1
VDD
10K
RESET
SH6622A
33K
40K
RESET will be pulled to GND when VDD goes lower than Zener voltage + 0.7V.
AP7:
Reset Protection Circuit 2
VDD
R1
RESET
R2
SH6622A
10K
40K
RESET will be pulled to GND when (VDD X R1/(R1 + R2)) is lower than 0.7V
23
SH6622A
Bonding Diagram
P
C
2
P
C
1
P
C
0
P
D
3
P
D
2
P
D
1
P
D
0
19
18
17
16
15
14
13
21
VDD
P
B
2
P
B
1
P
B
0
12
11
10
9
G
N
D
2
20
PC3
P
B
3
SH6622A
GND3
OSCO
22
OSCI
23
8
GND
7
RESET
NC
G
N
D
1
24
25
26
27
28
1
2
3
4
5
6
P
A
0
P
A
1
P
F
0
P
E
0
P
E
1
P
E
2
P
E
3
P
F
1
P
A
2
P
A
3
T
0
NOTE:
1. GND1, GND2 & GND3 BONDING TO GROUND.
2. SUBSTRATE CONNECTED TO GROUND.
unit: µm
Pad No
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Designation
X
Y
Pad No
PE 2
PE 3
GND1
PF 1
PA 2
PA 3
T0
-94.00
38.40
164.40
290.40
422.80
543.80
700.60
-586.55
-586.55
-586.55
-586.55
-586.55
-586.55
-584.30
15
16
17
18
19
20
21
RESET
GND
PB 0
PB 1
PB 2
PB 3
GND2
PD 0
PD 1
700.60
-441.40
700.60
754.40
605.50
485.50
353.10
213.75
74.40
-58.00
-188.65
537.75
586.55
586.55
586.55
586.55
586.55
586.55
22
23
24
25
26
27
28
24
Designation
PD 2
PD 3
PC 0
PC 1
PC 2
PC 3
VDD
GND3
OSCO
OSCI
PA 0
PA 1
PF 0
PE 0
PE 1
X
Y
-178.00
-310.40
-430.40
-562.80
-701.95
-717.50
-713.70
-717.05
-717.05
-717.05
-721.30
-598.80
-466.40
-346.40
-214.00
586.55
586.55
586.55
586.55
586.55
276.80
95.10
-34.40
-188.10
-311.10
-586.55
-586.55
-586.55
-586.55
-586.55
SH6622A
Ordering Information
Part No.
Package
Packing
SH6622AH-yyxxx/000HR
Chip Form
Tray
SH6622AK-yyxxx/028DU
28L DIP
Tube
SH6622AM-yyxxx/028MU
28L SOP
Tube
Note:
(1) “-yyxxx”: “yy” means 2 bits option and “xxx” means 3 bits code seriary number. If the product is OTP type and in blank order,
those bits should be none.
(2) The data after mark “/” in Part No. block is the package and packing information for ordering.
(3) The size of those package types are showed in “Package Information” (Page26 - Page27).
(4) Any other package or packing request, please refer to following table.
Package
Packing
D
DIP
R
Normal package size and in tray packing
F
QFP
U
Normal package size and in tube packing
H
CHIP
A
Normal package size and in tape & reel packing
J
CER-DIP
D
Larger package size and in tray packing
K
SKINNY
L
Larger package size and in tube packing
L
PLCC
B
Larger package size and in tape & reel packing
M
SOP
T
Smaller package size and in tray packing
N
OTHER
S
Smaller package size and in tube packing
Q
GOOD DIE ON WAFER
N
Smaller package size and in tape & reel packing
S
SOJ
T
TO92
V
VSOP/TSOP
W
WAFER
X
TSSOP
25
SH6622A
Package Information
DIP-28L Outline Dimensions
unit: inches/mm
D
15
E1
28
14
1
E
A1
A2
Base Plane
L
A
C
S
Mounting Plane
B
e1
eA
α
B1
Symbol
Dimensions in inches
Dimensions in mm
4.45 Max.
A
0.175 Max.
A1
0.010 Min.
0.25 Min.
A2
0.130 ± 0.005
3.30 ± 0.13
B
B1
C
0.018 + 0.004
0.46 + 0.10
- 0.002
- 0.05
0.060 + 0.004
1.52 + 0.10
- 0.002
- 0.05
0.010 + 0.004
0.25 + 0.10
- 0.002
D
1.388 Typ. (1.400 Max.)
- 0.05
35.26 Typ. (35.56 Max.)
E
0.310 ± 0.010
7.87 ± 0.25
E1
0.288 ± 0.005
7.32 ± 0.13
e1
0.100 ± 0.010
2.54 ± 0.25
L
0.130 ± 0.010
3.30 ± 0.25
α
0° ~ 15°
0° ~ 15°
eA
0.350 ± 0.020
8.89 ± 0.51
S
0.055 Max.
1.40 Max.
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E1 does not include resin fins.
3. Dimension S includes end flash.
26
SH6622A
SOP 28L Outline Dimensions
unit: inches/mm
28
15
e1
E
HE
~
~
L
1
14
b
Detail F
e1
D
Seating Plane
LE
A1
e
s
A
A2
c
D
y
See Detail F
Symbol
Dimensions in inches
Dimensions in mm
A
0.112 Max.
2.85 Max.
A1
0.004 Min.
0.10 Min.
A2
0.098 ± 0.005
2.49 ± 0.13
b
0.016 + 0.004
0.41 + 0.10
- 0.002
- 0.05
0.010 + 0.004
0.25 + 0.10
- 0.002
- 0.05
D
0.713 ± 0.020
18.11 ± 0.51
E
0.331 ± 0.010
8.41 ± 0.25
c
e
0.050 ± 0.006
1.27 ± 0.15
e1
0.429 NOM.
10.90 NOM.
HE
0.465 ± 0.012
11.81 ± 0.31
L
0.036 ± 0.008
0.91 ± 0.20
LE
0.067 ± 0.008
1.70 ± 0.20
S
0.047 Max.
1.19 Max.
y
0.004 Max.
0.10 Max.
θ
0° ~ 10°
0° ~ 10°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension e1 is for PC Board surface mount pad pitch design
reference only.
4. Dimension S includes end flash.
27
SH6622A
Data Sheet Revision History
Version
Content
Date
2.4
Add package and packing information in ordering information
Jul. 2004
2.3
Change RC Frequency Variation to ±20%
Apr. 2002
2.2
Add Reset Protection Circuit (AP6 and AP7)
Feb. 2002
1.0
Original
Jul. 1999
28
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