CPC1600 User Manual

CPC1600

PC/104-Plus

Intel Pentium M Based

Processor Module

User Manual

Rev. 001 E

July 2008

P r e l i m i n a r y

The product described in this manual is compliant to all related CE standards.

Product Title: CPC1600

Document Name: CPC1600 User Manual

Document Version: 001 E

Copyright © 2008 Fastwel Co. Ltd. All rights reserved.

Revision Record

Rev. Index

001

Brief Description

Initial version

Product Index

CPC1600

Date

July 2008

Contact Information

Address:

Tel.:

Fax:

E-mail:

Web:

Fastwel Co. Ltd

108 Profsoyuznaya st.,

Moscow 117437,

Russian Federation

+7 (495) 232-1681

+7 (495) 232-1654 [email protected]

http://www.fastwel.com/

Fastwel Corporation US

45 Main Street, Suite 319

Brooklyn, New York 11201

USA

+1 (718) 554-3686

+1 (718) 797-0600

Toll free: +1 (877) 787-8443 (1-877-RURUGGED) [email protected]

CPC1600

Table of Contents

1

2

Table of Contents ..............................................................................................................................................1

List of Tables .....................................................................................................................................................3

List of Figures ....................................................................................................................................................3

Notation Conventions.........................................................................................................................................4

General Safety Precautions................................................................................................................................5

Unpacking, Inspection and Handling...................................................................................................................6

Three Year Warranty..........................................................................................................................................8

Introduction...................................................................................................................................... 9

1.1

Overview ................................................................................................................................................9

1.2

CPC1600 Versions................................................................................................................................11

1.3

CPC1600 Diagrams ..............................................................................................................................12

1.3.1

Block Diagram ......................................................................................................................13

1.3.2

1.3.3

Board Appearance................................................................................................................14

Board Layout ........................................................................................................................15

1.3.4

Dimensions Diagram.............................................................................................................17

1.4

Technical Characteristics.......................................................................................................................18

1.4.1

1.4.2

1.4.3

1.4.4

Processor, Memory and Chipset............................................................................................18

Interfaces .............................................................................................................................19

Control and Monitoring..........................................................................................................20

General ................................................................................................................................21

1.4.5

Software ...............................................................................................................................21

1.5

Delivery Checklist..................................................................................................................................22

Detailed Description .......................................................................................................................23

2.1

Processor, Memory and Chipset ............................................................................................................23

2.1.1

2.1.2

Processor .............................................................................................................................23

System Memory....................................................................................................................23

2.1.3

Chipset.................................................................................................................................23

2.2

Internal Peripherals ...............................................................................................................................25

2.2.1

Flash Memory.......................................................................................................................25

2.2.1.1

CompactFlash ......................................................................................................25

2.2.1.2

Solid-State Disk ....................................................................................................25

2.2.1.3

BIOS Flash...........................................................................................................25

Timers ..................................................................................................................................25

2.2.2

2.2.3

Local SMBus Devices ...........................................................................................................26

2.2.3.1

Temperatures Monitoring ......................................................................................26

2.2.4

2.2.3.2

Serial EEPROM....................................................................................................26

Battery..................................................................................................................................26

2.3

Interfaces and Connectors.....................................................................................................................27

2.3.1

2.3.2

2.3.3

PC/104-Plus Connectors.......................................................................................................27

USB Interfaces......................................................................................................................32

Graphics Controller ...............................................................................................................33

2.3.3.1

DVM Technology ..................................................................................................33

2.3.4

2.3.5

2.3.6

2.3.7

2.3.3.2

Supported Resolutions..........................................................................................33

2.3.3.3

GMCH Core Voltage Selector................................................................................34

2.3.3.4

Video Interfaces and Connectors...........................................................................34

Ethernet Ports.......................................................................................................................36

EIDE Interface ......................................................................................................................37

2.3.5.1

HDD LED Connector.............................................................................................38

Serial ATA Ports ...................................................................................................................38

CompactFlash Socket ...........................................................................................................39

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CPC1600

3

4

5

6

7

2.3.8

2.3.9

2.3.10

GPIO Connector ...................................................................................................................40

Power Connector ..................................................................................................................40

Other Connectors and System Status LEDs...........................................................................41

Installation.......................................................................................................................................42

3.1

Safety Regulations ................................................................................................................................42

3.2

System Design Variants ........................................................................................................................43

3.3

Installation of the Board and Expansion Modules ...................................................................................44

3.4

Removal Procedure...............................................................................................................................45

3.5

Peripheral Devices Installation...............................................................................................................45

3.5.1

USB Devices Installation .......................................................................................................45

3.5.2

3.5.3

3.5.4

CompactFlash Cards Installation ...........................................................................................46

Battery Replacement.............................................................................................................46

PC/104 and PC/104-Plus Expansion Modules Installation ......................................................47

Configuration ..................................................................................................................................48

4.1

Clear CMOS Jumper Description...........................................................................................................48

4.2

PC/104-Plus VIO Selection....................................................................................................................48

4.3

GMCH Core Voltage Selection ..............................................................................................................49

4.4

Interrupts Handling................................................................................................................................49

4.4.1

On-board PCI Interrupts ........................................................................................................50

4.5

Memory Maps .......................................................................................................................................50

4.5.1

4.5.2

First Megabyte Memory Map .................................................................................................50

I/O Addresses.......................................................................................................................51

Phoenix® BIOS Setup .....................................................................................................................53

5.1

Boot Details ..........................................................................................................................................53

5.1.1

Booting without a Monitor, Keyboard or Mouse ......................................................................53

5.1.2

Booting from USB .................................................................................................................53

Thermal and Power Issues .............................................................................................................54

6.1

Temperature Control .............................................................................................................................54

6.1.1

Passive Regulation ...............................................................................................................54

6.1.2

Active Regulation..................................................................................................................55

6.2

System Power.......................................................................................................................................56

Appendices .....................................................................................................................................57

7.1

Supplementary Information....................................................................................................................57

7.1.1

Related Standards and Specifications....................................................................................57

7.2

Useful Abbreviations, Acronyms and Short-cuts .....................................................................................58

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CPC1600

List of Tables

Table 2-1: SMBus Devices.....................................................................................................................................26

Table 2-1: PC/104 Connector (Rows A and B) Contacts Designation ......................................................................28

Table 2-1: PC/104 Connector (Rows C and D) Contacts Designation ......................................................................29

Table 2-1: PC/104-Plus Connector Contacts Designation .......................................................................................30

Table 2-2: Onboard USB Connectors Pinouts.........................................................................................................32

Table 2-3: Supported Display Modes......................................................................................................................33

Table 2-4: SVGA Connector Pinout........................................................................................................................34

Table 2-5: LVDS Connector Pinout ........................................................................................................................35

Table 2-6: TFT Panel Control Connector Pinout......................................................................................................35

Table 2-7: Ethernet Connectors Pinouts .................................................................................................................36

Table 2-8: Ethernet LEDs Connectors Pinouts........................................................................................................36

Table 2-9: Standard EIDE HDD Connector Pinout ..................................................................................................37

Table 2-10: SATA Connector Pinout ........................................................................................................................38

Table 2-11: CompactFlash Socket Pinout.................................................................................................................39

Table 2-12: GPIO Connector Pinout.........................................................................................................................40

Table 2-13: Power Supply Connector Pinout ............................................................................................................40

Table 4-1: Interrupt Settings...................................................................................................................................49

Table 4-2: PCI Interrupt Routing.............................................................................................................................50

Table 4-3: First Megabyte Memory Map .................................................................................................................50

Table 4-4: I/O Address Map ...................................................................................................................................51

Table 6-1: DC Input Voltage Ranges and Limits......................................................................................................56

Table 6-2: Some CPC1600 Components Power Consumption ................................................................................56

Table 7-1: Related Standards ................................................................................................................................57

Table 7-2: Related Specifications...........................................................................................................................58

List of Figures

Figure 1-1: CPC1600 Block Diagram.......................................................................................................................13

Figure 1-2: CPC1600 Board Appearance ................................................................................................................14

Figure 1-3: CPC1600 Top Side Layout ....................................................................................................................15

Figure 1-4: CPC1600 Bottom Side Layout ...............................................................................................................16

Figure 1-5: CPC1600 Mounting Dimensions Diagram ..............................................................................................17

Figure 2-1: GMCH Core Voltage Selector................................................................................................................34

Figure 2-2: Ethernet Connectors .............................................................................................................................36

Figure 2-3: HDD Connector.....................................................................................................................................37

Figure 2-4: HDD LED Connector .............................................................................................................................38

Figure 2-5: Serial ATA Connectors ..........................................................................................................................38

Figure 2-6: CompactFlash Socket ...........................................................................................................................39

Figure 2-7: GPIO Connector ...................................................................................................................................40

Figure 2-8: External Power Supply Connector .........................................................................................................40

Figure 2-9: System Status LEDs .............................................................................................................................41

Figure 2-10: CPLD JTAG Header..............................................................................................................................41

Figure 2-11: LPC Header ..........................................................................................................................................41

Figure 4-1: PC/104-Plus VIO Selector Positions ......................................................................................................48

Figure 4-2: GMCH Core Voltage Selector................................................................................................................49

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CPC1600

All information in this document is provided for reference only, with no warranty of its suitability for any specific purpose. This information has been thoroughly checked and is believed to be entirely reliable and consistent with the product that it describes.

However, Fastwel accepts no responsibility for inaccuracies, omissions or their consequences, as well as liability arising from the use or application of any product or example described in this document.

Fastwel Co. Ltd. reserves the rights to change, modify, and improve this document or the products described in it, at Fastwel's discretion without further notice. Software described in this document is provided on an “as is” basis without warranty. Fastwel assumes no liability for consequential or incidental damages originated by the use of this software.

This document contains information, which is property of Fastwel Co. Ltd. It is not allowed to reproduce it or transmit by any means, to translate the document or to convert it to any electronic form in full or in parts without antecedent written approval of

Fastwel Co. Ltd. or one of its officially authorized agents.

Fastwel and Fastwel logo are trademarks owned by Fastwel Co. Ltd., Moscow, Russian Federation. Ethernet is a registered trademark of Xerox Corporation. IEEE is a registered trademark of the Institute of Electrical and Electronics Engineers Inc. Intel is a trademark of Intel Corporation. Pentium M and Celeron M are trademarks of Intel Corporation. Microsoft is a trademark of the Microsoft corporation. In addition, this document may include names, company logos and trademarks, which are registered trademarks and, therefore, are property of their respective owners.

Fastwel welcomes suggestions, remarks and proposals regarding the form and the content of this Manual.

Notation Conventions

Warning, ESD Sensitive Device!

This symbol draws your attention to the information related to electro static sensitivity of your product and its components. To keep product safety and operability it is necessary to handle it with care and follow the ESD safety directions.

Warning!

This sign marks warnings about hot surfaces. The surface of the heatsink and some components can get very hot during operation. Take due care when handling, avoid touching hot surfaces!

Caution: Electric Shock!

This symbol warns about danger of electrical shock (> 60 V) when touching products or parts of them. Failure to observe the indicated precautions and directions may expose your life to danger and may lead to damage to your product.

Warning!

Information marked by this symbol is essential for human and equipment safety.

Read this information attentively, be watchful.

Note...

This symbol and title marks important information to be read attentively for your own benefit.

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CPC1600

General Safety Precautions

This product was developed for fault-free operation. Its design provides conformance to all related safety requirements. However, the life of this product can be seriously shortened by improper handling and incorrect operation. That is why it is necessary to follow general safety and operational instructions below.

Warning!

All operations on this device must be carried out by sufficiently skilled personnel only.

Warning!

When handling this product, special care must be taken not to hit the heatsink (if installed) against another rigid object. Also, be careful not to drop the product, since this may cause damage to the heatsink, CPU or other sensitive components as well.

Please, keep in mind that any physical damage to this product is not covered under warranty.

Note:

This product is guaranteed to operate within the published temperature ranges and relevant conditions. However, prolonged operation near the maximum temperature is not recommended by

Fastwel or by electronic chip manufacturers due to thermal stress related failure mechanisms. These mechanisms are common to all silicon devices; they can reduce the MTBF of the product by increasing the failure probability. Prolonged operation at the lower limits of the temperature ranges has no limitations.

Caution, Electric Shock!

Before installing this product into a system and before installing other devices on it, always ensure that your mains power is switched off.

Always disconnect external power supply cables during all handling and maintenance operations with this module to avoid serious danger of electrical shock.

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CPC1600

Unpacking, Inspection and Handling

Please read the manual carefully before unpacking the module or mounting the device into your system. Keep in mind the following:

ESD Sensitive Device!

Electronic modules and their components are sensitive to static electricity. Even a non-perceptible by human being static discharge can be sufficient to destroy or degrade a component's operation!

Therefore, all handling operations and inspections of this product must be performed with due care, in order to keep product integrity and operability: n

Preferably, unpack or pack this product only at EOS/ESD safe workplaces. Otherwise, it is important to be electrically discharged before touching the product. This can be done by touching a metal part of your system case with your hand or tool. It is particularly important to observe anti-static precautions when setting jumpers or replacing components.

n

If the product contains batteries for RTC or memory back-up, ensure that the module is not placed on conductive surfaces, including anti-static mats or sponges. This can cause shortcircuit and result in damage to the battery and other components.

n

Store this product in its protective packaging while it is not used for operational purposes.

Unpacking

The product is carefully packed in an antistatic bag and in a carton box to protect it against possible damage and harmful influence during shipping. Unpack the product indoors only at a temperature not less than +15°C and relative humidity not more than 70%. Please note, that if the product was exposed to the temperatures below 0°

С for a long time, it is necessary to keep it at normal conditions for at least 24 hours before unpacking. Do not keep the product close to a heat source.

Following ESD precautions, carefully take the product out of the shipping carton box. Proper handling of the product is critical to ensure correct operation and long-term reliability. When unpacking the product, and whenever handling it thereafter, be sure to hold the module preferably by the front panel, card edges or ejector handles. Avoid touching the components and connectors.

Retain all original packaging at least until the warranty period is over. You may need it for shipments or for storage of the product.

Initial Inspection

Although the product is carefully packaged, it is still possible that shipping damages may occur.

Careful inspection of the shipping carton can reveal evidence of damage or rough handling. Should you notice that the package is damaged, please notify the shipping service and the manufacturer as soon as possible. Retain the damaged packing material for inspection.

After unpacking the product, you should inspect it for visible damage that could have occurred during shipping or unpacking. If damage is observed (usually in the form of bent component leads or loose socketed components), contact Fastwel's official distributor from which you have purchased the product for additional instructions. Depending on the severity of the damage, the product may even need to be returned to the factory for repair. DO NOT apply power to the product if it has visible damage. Doing so may cause further, possibly irreparable damage, as well as result in a fire or electric shock hazard.

If the product contains socketed components, they should be inspected to make sure they are seated fully in their sockets.

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CPC1600

Handling

In performing all necessary installation and application operations, please follow only the instructions supplied by the present manual.

In order to keep Fastwel’s warranty, you must not change or modify this product in any way, other than specifically approved by Fastwel or described in this manual.

Technical characteristics of the systems in which this product is installed, such as operating temperature ranges and power supply parameters, should conform to the requirements stated by this document.

Retain all the original packaging; you will need it to pack the product for shipping in warranty cases or for safe storage. Please, pack the product for transportation in the way it was packed by the supplier.

When handling the product, please, remember that the module, its components and connectors require delicate care. Always keep in mind the ESD sensitivity of the product.

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CPC1600

Three Year Warranty

Fastwel Co. Ltd. (Fastwel), warrants that its standard hardware products will be free from defects in materials and workmanship under normal use and service for the currently established warranty period. Fastwel’s only responsibility under this warranty is, at its option, to replace or repair any defective component part of such products free of charge.

Fastwel neither assumes nor authorizes any other liability in connection with the sale, installation or use of its products. Fastwel shall have no liability for direct or consequential damages of any kind arising out of sale, delay in delivery, installation, or use of its products.

If a product should fail through Fastwel's fault during the warranty period, it will be repaired free of charge. For out of warranty repairs, the customer will be invoiced for repair charges at current standard labor and materials rates.

Warranty period for Fastwel products is 36 months since the date of purchase.

The warranty set forth above does not extend to and shall not apply to:

1. Products, including software, which have been repaired or altered by other than

Fastwel personnel, unless Buyer has properly altered or repaired the products in accordance with procedures previously approved in writing by Fastwel.

2. Products, which have been subject to power, supply reversal, misuse, neglect, accident, or improper installation.

Returning a product for repair

1. Apply to Fastwel company or to any of the Fastwel's official representatives for the

Product Return Authorization.

2. Attach a failure inspection report with a product to be returned in the form, accepted by customer, with a description of the failure circumstances and symptoms.

3. Carefully package the product in the antistatic bag in which the product had been supplied. Failure to package in antistatic material will VOID all warranties. Then package the product in a safe container for shipping.

4. The customer pays for shipping the product to Fastwel or to an official Fastwel representative or dealer.

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Introduction

CPC1600

1 Introduction

1.1

Overview

The product described in this manual is

СРС1600, a РС/104-Plus single board computer designed for mission critical embedded systems operating in harsh environments. All components including memory are soldered onboard, thus providing superior shock/vibration resistance.

The board is based on Intel® Pentium® M processor in the mFCBGA479M package operating at frequencies of up to 2.0 GHz, and a Processor Side Bus (PSB) running at 400 or 533 MHz. The

Intel Pentium M processor core with integrated 64 KB L1 and up to 2048 KB L2 cache provides its unique performance to power consumption ratio.

The CPC1600 chipset comprising 82915GM GMCH and ICH6M provides a number of integrated modern communication and storage interfaces, thus eliminating the need for additional external controllers. The chipset also incorporates DDR2 memory interface. The board can bear up to 1 GB of PC4200 memory soldered onboard.

The board has wide range of interfaces for peripheral devices: six USB 2.0 and standard video interfaces, dual Gigabit Ethernet controller wired via PCI Express 4x bus. The chipset’s built-in video controller incorporates a 2D/3D graphics accelerator with up to 64 MB memory shared with system for enhanced graphics performance with VGA CRT-display and LVDS TFT panel.

CPC1600 supports storage devices with IDE UltraATA33 and CompactFlash interfaces, up to two

SerialATA channels. The board also has a 32 MB solid-state disk for embedded OS.

Compliant to PC/104-Plus standard, the board is equipped with 16-bit ISA and 32-bit PCI connectors.

The board is designed to support both conductive and convective (passive or active) heat sinking and is manufactured in two versions – for industrial temperature range (–40°C to +85°C) and for commercial temperature range (0°C to +70°C). Extra reliability of CPC1600 is provided by the hardware monitoring subsystem and built-in watchdog timer. This prevents accidental damage to the hardware under unfavourable thermal conditions.

CPC1600 is manufactured using high quality embedded industrial system components specially selected to ensure their long term availability.

The board is compatible with the Windows® 2000/XP/XP Embedded, QNX v.4.20, 6.0 and Linux®

2.4.20, 2.6.11 operating systems.

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Introduction

CPC1600

Some of the CPC1600's outstanding features are: n

Intel® Pentium® M processor family, up to 2.0 GHz

Up to 2 MB L2 on-die cache running at CPU speed n

Celeron M LV 1.0 MHz (option) n

Chipset: 82915GM GMCH and ICH6M n

400/533 MHz processor system bus n

Up to 1 GB of PC4200 DDR2 SDRAM soldered memory n

Integrated 3D high performance VGA controller

§

§

§

64 MB memory shared with system

CRT-displays support with resolutions of up to 2048 x 1536 pixels at 16 bits and 75 Hz (*)

LVDS TFT panels support (*) n

Two Gigabit Ethernet interfaces via PCI-Express bus: 10Base-T, 100Base-TX, 1000Base-T (*) n

EIDE Ultra ATA33 interface n

Up to two SATA channels n

Onboard 32 MB solid-state disk for embedded OS n

Onboard CompactFlash Type I/II socket n

Eight programmable GPIO lines n

Up to six USB 2.0 ports (*) n

PCI bus: 32-bit / 33 MHz, 3.3 / 5 V n

ISA bus 16-bit n

Hardware Monitor (LM87) n

Watchdog timer n

Additional counters and timers integrated in the ICH n

Real-time clock with battery backup n

Phoenix® BIOS with backup copy n

+5 V power supply via two-pin onboard connector, possibility to supply +5 V via PCI and ISA buses n

Conductive or convective heat sinking; passive or active air cooling variants n

Commercial (

0…+70

°C

) or industrial (

-40…+85

°C

) versions

(*) – Available via additional cable adapters

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Introduction

CPC1600

1.2

CPC1600 Versions

The board is offered in flexible configuration. Options include different processors, the size of supplied system memory, and other options described in this section.

Customer can choose necessary configuration options using the following template:

1 – 2 – 3 – 4 – 5 6

1

2

3

4

5

6

Basic product name:

CPC1600

Intergral part of the product code (configuration version):

01 Basic configuration version

Processor:

C1.0

P1.4

Celeron M 1.0 GHz, LV, 400 MHz FSB

Pentium M 1.4 GHz, 400 MHz FSB

Soldered memory:

RAM512

RAM1024

512 MB soldered DDR2 SDRAM

1024 MB soldered DDR2 SDRAM

Operating temperature range:

I

C

Industrial range, -40…+85

°C

Commercial range, 0…+70

°C

Other options:

CompactFlash memory module:

\CF128

\CF256

\CF512

\CF1024

\CF2048

\CF4096

128 MB CompactFlash, industrial (CF128C - commercial)

256 MB CompactFlash, industrial (CF256C - commercial)

512 MB CompactFlash, industrial (CF512C - commercial)

1024 MB CompactFlash, industrial (CF1024C - commercial)

2048 MB CompactFlash, industrial (CF2048C - commercial)

4096 MB CompactFlash, industrial (CF4096C - commercial)

Coating:

\COATED Protective coating

Operating System

\XPE

\QNX

\LNX

Windows XP Embedded

QNX 4.20, 6.0

Linux 2.4.20, 2.6.11

Example:

CPC1600 – 01 – P1.4–RAM512–C \CF512C \COATED \XPE

PC/104-Plus processor module, Intel® 82915GM, DDR2 SDRAM, SVGA, SATA, 2 Gigabit Ethernet

Pentium M 1.4 GHz, 400 MHz FSB

512 MB soldered DDR2 SDRAM

Commercial temperature range, 0…+70

°C

512 MB CompactFlash card, commercial range

Protective coating

Windows XP Embedded preinstalled

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Introduction

1.3

CPC1600 Diagrams

The diagrams in this section give visual information about the CPC1600 board design, its appearance, connectors and components layout. The diagrams may not reflect insignificant differences between the CPC1600 versions and generations.

6

CPC1600

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Introduction

1.3.1

Figure 1-1:

Block Diagram

CPC1600 Block Diagram

CPC1600

10/100/1000

BaseT

10/100/1000

BaseT

Hardware

Monitor

CK-410 &

SS Clocking

Intel

Pentium M/

Dothan

mBGA479M

FSB 400/533 MHz

915GM

GMCH

1257 mFCBGA

1 GB

Soldered

DDR2

SDRAM

DMI Interface

Dual

Gigabit

Ethernet

82571EB

PCI-E Bus

ICH6M

32-bit PCI Bus

16-bit

ISA Bus

PC104+ Connectors

32-bit PCI Bus

LPC Bus

CPLD

PCI-ISA

Bridge

5V DC power

NAND

Flash

32 MB

BIOS

Flash

2 MB

VGA CRT

LVDS with Backlight Control

Compact Flash

Type II Socket

PATA

SATA Ports 1-2

USB Ports

LPC

CPLD JTAG

8 GPIO Lines

Power Input

5V DC

CPU Core VR

GMCH VR

DDR VR

Power Supply

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Introduction

1.3.2

Figure 1-2:

Board Appearance

CPC1600 Board Appearance

CPC1600

The appearance may vary for different versions of the board.

Heatsinks are not shown.

(TBA)

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Introduction

1.3.3

Figure 1-3:

Board Layout

CPC1600 Top Side Layout

2.5” IDE Header

Reset

Clear CMOS

HDD LED

2 SATA Channels

8 GPIO Lines

ICH6M

CPLD JTAG

LPC

PC/104+ VIO

Selector

PC/104 PCI

Gb Eth 2 LEDs

Gb Eth 1 LEDs

Gb Ethernet 1

CPC1600

Power

USB 2.0

LEDs

Li Battery

PC/104 ISA

PCI-ISA

Bridge

LVDS

VGA

TFT Panel Control

GMCH VCC

Selector

The layout may slightly differ for various versions of the board.

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Introduction

Figure 1-4: CPC1600 Bottom Side Layout

Dual Gigabit Ethernet

DDR2 SDRAM

CompactFlash Type II

CPC1600

82915GM GMCH Pentium M CPU

The layout may slightly differ for various versions of the board.

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Introduction

1.3.4

Figure 1-5:

Dimensions Diagram

CPC1600 Mounting Dimensions Diagram

M4

CPC1600

15

29.6

6

6

12.3

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Introduction

1.4

Technical Characteristics

1.4.1

CPU

Processor, Memory and Chipset

Memory

The CPC1600 supports the following Intel processors:

Pentium® M Processor 90 nm (Dothan)

n n n n

Up to 2.0 GHz

Up to 2 MB L2 on-die cache

400/533 MHz PSB

Supports SpeedStep® III for low power mode

Celeron® M 373 ULV Processor 90 nm

n n n

1.0 GHz

512 KB L2 on-die cache

400 MHz PSB

Main memory:

n n

Up to 1 GB of DDR2 SDRAM memory soldered onboard

Memory frequency: 533 MHz (PC4200)

Flash memory:

n n n

2 MB flash memory for BIOS storage

32 MB NAND flash memory solid-state disk

CompactFlash card in CF Type I/II socket

Chipset

n n n n n n n

Intel® 82915GM Graphics and Memory Controller Hub (GMCH)

n n n

Intel® Pentium® M processor with 2 MB L2 cache support (533 MHz PSB)

Intel® Pentium® M processor LV and ULV support (400 MHz PSB)

§

32-bit host bus addressing

§

12-deep in-order queue

§

Enhanced Intel SpeedStep® technology

Intel® Celeron® M and Celeron® M ULV 90 nm processor support (400 MHz PSB)

§

32-bit host bus addressing support

§

12-deep in-order queue support

64-bit AGTL/AGTL+ based PSB interface at 400/533 MHz

64-bit System Memory interface, optimized for DDR or DDR2 SDRAM memory operating at 400 or 533 MHz

DDR2 dual channel memory symmetric and asymmetric modes

Integrated 2D/3D Graphics and H/W Motion Compensation Engines

Integrated DAC, 400 MHz

Intel® Graphics Media Accelerator 900

Intel® Stable Image Technology

CPC1600

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Introduction

CPC1600

Intel® I/O Controller Hub 6M (ICH6M, 82801FBM)

n n n n n n n n n n n n

PCI-Express bus rev. 1.0

PCI Bus rev. 2.3 interface at 33 MHz

Integrated Serial ATA host controller

Integrated IDE controller Ultra ATA33/66/100, BMIDE and PIO modes

USB 2.0 host interface

ACPI 2.0 compliant power management logic

Enhanced DMA controller

High precision event timers

Interrupt controller

System Management Bus

Low Pin Count (LPC) interface

Firmware Hub (FWH) interface support via LPC bus

1.4.2

Interfaces

PCI Bus Interface

Compliant with 2.3 Specification at 33 MHz n n n n n

System master operation

Support for 32-bit addressing on PCI using DAC protocol

Four available PCI REQ/GNT pairs

3.3/5.0 V compatible

120-pin PC/104-Plus connector

ISA Bus Interface

n n n n

16-bit interface

Available via PCI-ISA bridge

104-pin PC/104 connector

Up to four devices without additional buffering

USB Interface

GPIO Lines

n n n n

Up to six USB 2.0 ports supporting UHCI and EHCI: n n

Up to six USB 2.0 channels via three 10-pin on-board connectors

Require adapter cables

LAN Interface

8 general purpose I/O lines

3.3V LVCMOS signaling

Access via CPLD I/O port

10-pin connector on board

Two 10/100/1000 Mb/s Gigabit Ethernet interfaces based on Intel 82571EB Dual Ethernet PCI-E bus controller.

n n n n n

Two 16-pin onboard connectors

Automatic mode recognition

Automatic cabling configuration recognition

Cabling requirement: Category 5, UTP, four (two)-pair cabling

Gigabit Ethernet LEDs via two separate 4-pin onboard connectors

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Introduction

CPC1600

Video Interfaces

n n n n n

Built-in Intel 2D/3D high performance graphics accelerator

Intel® Graphics Media Accelerator 900

Hardware Motion Compensation Engine for software MPEG2 and MPEG4 decoding

Integrated DAC, 400 MHz

Intel® Stable Image Technology

Video memory up to 64 MB shared with system

VGA CRT

n n

Resolutions of up to 2048 x 1536, 16 bit at 75 Hz refresh rate

16-pin connector onboard

LVDS TFT

n n n n

Dual/Single channel interface

Resolutions of up to 1600 x 1200, 18 bpp

Spread spectrum clocking 25-112 MHz single/dual channel

16-pin connector onboard

Keyboard and Mouse

n

USB keyboard and mouse supported

Mass Storage

EIDE Ultra ATA33 n n

One channel is shared by CompactFlash interface and EIDE devices

44-pin onboard connector for 2.5” IDE drive

Serial ATA interface n n

Up to two standard SATA onboard connectors

Data transfer rates up to 150 MB/s

CompactFlash: n

CompactFlash on-board socket (true IDE mode) on bottom side, supports type I or type II CompactFlash cards n

DMA modes supported as per CompactFlash Specification v.4.1

1.4.3

Control and Monitoring

Thermal Management

The processor is protected from overheating by: n n n

Internal processor temperature control unit, which initiates CPU shut down

Processor die temperature monitor

Heat spreader or heatsink

Temperature Monitor

LM87 hardware monitor is used for supervision of the on-die CPU temperature and the board surface temperature

LEDs

System status: n n n n

Onboard Power LED (green)

Onboard Standby LED (red)

IDE/SATA activity (onboard 2-pin header)

Gigabit Ethernet LEDs – two 4-pin onboard connectors

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Introduction

Reset Input

n

Power Supply

n n

Onboard reset header

2-pin power connector

Power can be supplied via ISA and PCI bus

1.4.4

General

Mechanical

PC/104-Plus form factor

Dimensions: 115.5 × 96 mm (see

Figure 1-5 for details)

Board weight:

Shock/Vibration:

120 g (to be amended)

50G / 3G

Power Supply

8 A @ 5 V (to be amended)

See Chapter 6 for details on power supply requirements

Temperature Ranges

Operational:

Storage:

0°C ... +70°C – commercial range

-40

°C ... +85°C – industrial range

-55°C ... +95°C

Humidity

5% to 95% RH, non-condensing

Battery

3.0 V lithium battery for RTC in a battery holder. Use PANASONIC BR2032 or compatible

1.4.5

Software

Software BIOS

Flash memory based enhanced Phoenix® BIOS has the following features: n n n

BIOS boot support for USB keyboards

Software enable/disable function for Ethernet ports configuration

Plug&Play capability

Operating Systems

Supported operating systems: n n n

Microsoft® Windows® 2000, XP, XP Embedded

Linux® 2.4.20, 2.6.11

QNX® v.4.20, 6.0

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Introduction

1.5

Delivery Checklist

The CPC1600 supplied set includes:

1. CPC1600 SBC with installed heat conducting plate

2. Ribbed (*)

3. Cooling (*)

4. Set of adapter and power cables (to be specified)

5. CD-ROM with documentation and service software

7. Consumer box

(*) Ordered separately

Note:

Keep the antistatic bag and the original package at least until the warranty period is over. It can be used for future storage or warranty shipments.

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Detailed Description

CPC1600

2 Detailed Description

2.1

Processor, Memory and Chipset

2.1.1

Processor

The CPC1600 board is based on the Intel® Pentium® M processor (90 nm, Dothan) in mFCBGA479M package operating at frequencies of up to 2 GHz.

Intel® Pentium® M processor combines high performance and low power consumption. Its enhanced performance characteristics are provided by a newly designed processor core with an integrated 64 KB L1 (32 KB instruction cache and 32 KB write-back data cache) and 2048 KB L2 cache.

Intel® Pentium® M processor supports Intel SpeedStep® enhanced technology to control power consumption and processor die temperature by switching the processor core voltage and frequency between several modes without resetting the system.

Important performance features of the Intel Pentium M processor also include n

Intel® Architecture with Dynamic Execution n

Data Prefetch Logic n

L2 cache memory with Advanced Transfer Cache Architecture n

Streaming SIMD extensions 2 (SSE2) n

400/533 MHz, source-synchronous FSB n

Support for MMX™ technology and Internet Streaming SIMD instructions

The Ultra Low Voltage (ULV) Pentium M and 90 nm Celeron M/ Celeron M ULV processors are optional.

2.1.2

System Memory

All system memory chips are soldered onboard. Total capacity of the installed DDR2 SDRAM memory is up to 1 GB. The installed memory is PC4200 compliant and supports PC SPD (Serial

Presence Detect) Specification.

2.1.3

Chipset

The CPC1600 chipset consists of the following devices: n

82915GM Graphics and Memory Controller Hub (GMCH) with

Accelerated Hub Architecture (AHA) bus n

ICH6M I/O Controller Hub with AHA bus

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Detailed Description

CPC1600

The GMCH provides interface for the microprocessor, the memory bus and includes a high performance graphics accelerator. The ICH is a centralized controller for I/O peripherals of the board, such as the PCI, PCI-Express, USB 2.0, EIDE, SATA and AC97 interface.

North Bridge

The 915GM Graphics and Memory Controller Hub (GMCH) in the 1257

μFCBGA package provides interfaces with the central processor and with the DDR2 SDRAM system memory. It also provides a DMI interface to the ICH.

The 915GM is optimized for the Intel® Pentium® M family of microprocessors. The chipset supports a PSB frequency of 400/533 MHz with AGTL+ signaling. For single processor systems the single ended AGTL termination is supported. It also supports 32-bit addressing for using up to

4 GB memory address space. The 915GM includes a system memory controller with a 64-bit interface. The chipset supports up to PC4200 dual or single channel DDR2 SDRAMs for use as system memory.

When running in internal graphics mode, high performance video capabilities of the 915GM are supported by a 2D/3D graphics accelerator and H/W Motion Compensation engines for software

MPEG2 decoding. The internal graphics controller allows connection of a standard CRT display and a LVDS TFT panel.

Integrated graphic adapter supports internal core frequencies 133-200 MHz with 1.05V of core voltage and 133-333 MHz with 1.5V of core voltage. So, more frequency provides more power consumption (about 4 Watts additionally). Core voltage may choose by Core Voltage Selector.

South Bridge

The ICH6M is a multifunctional I/O Controller Hub that provides interfaces to the PCI-Express and

PCI buses and to a number of PC interfaces, such as UltraDMA 100/66/33, USB 2.0 host interface,

LPC interface, FWH interface, SATA, and an AC'97 digital audio. The ICH communicates with the host controller directly via a dedicated DMI interface.

I/O Controller Hub features are: n

PCI 2.3 interface with eight IRQ inputs n

PCI-Express Bus four 1x or one 4x n

Bus Master EIDE controller UltraDMA 100/66/33 n

SATA interface, two channels n

USB controller supporting eight USB 2.0 ports n

DMI interface with 915GM n

LPC interface n

AC'97 2.1 interface or High Definition audio interface n

RTC controller n

Additional timer n

Power Management functions

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Detailed Description

CPC1600

2.2

Internal Peripherals

The following internal peripherals are available on the CPC1600 module:

2.2.1

Flash Memory

There are three flash devices available - one is used for the BIOS storage, one is a 32 MB NAND flash solid-state disk, and one is a CompactFlash card in the socket.

2.2.1.1

CompactFlash

CPC1600 has a standard Compact Flash type I/II socket, which can accept CompactFlash memory card for use as a disk drive connected to IDE channel. The CompactFlash socket is located on the bottom side of the board. Please, refer to a subsection “

CompactFlash Socket ” below in this

Chapter for details on this connector and its pinout.

2.2.1.2

Solid-State Disk

A 32 MB onboard solid state disk may be used for operating system storage.

2.2.1.3

BIOS Flash

CPC1600 has 2 MB flash memory for BIOS storage.

2.2.2

Timers

CPC1600 is equipped with the following timers:

¢

RTC – Real-Time Clock

The ICH contains a MC146818A-compatible real-time clock. The RTC includes 256 bytes of battery-backed CMOS RAM. RTC features include timekeeping with alarm function and 100-year calendar, as well as programmable periodic interrupt. A coin-cell battery powers the real-time clock and CMOS memory.

¢

Counter/Timer

Three 8254-type counters/timers are available on the CPC1600.

¢

Additional Timer

The ICH includes an additional programmable timer, which prevents system hang-ups during startups. After the first time-out period is over, it generates the SMI# signal, which starts the software hang-up recovery subroutine. If the second timeout ends, the "Reset" signal is issued to recover the system from the hardware hang-up state.

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Detailed Description

CPC1600

2.2.3

Local SMBus Devices

The CPC1600 incorporates a System Management Bus to access several system monitoring and control devices via a two-wire I

2

C™ bus interface. The following table presents functions and addresses of onboard SMBus devices.

Table 2-1:

1

2

4

SMBus Devices

SMB Address

0D2H

0A0H

9CH

Device

CY28411 System clock generator

SPD EEPROM Module

LM87 Temperature Sensor

2.2.3.1

Temperatures Monitoring

The integrated LM87 temperature sensor monitors the processor die and board surface temperatures to make sure that the system is operating at a safe temperature. On request, LM87 can report the current processor and board temperatures to the software responsible for the module operation mode.

2.2.3.2

Serial EEPROM

SPD serial EEPROM includes all necessary parameters of memory chips. This nonvolatile memory is used by the system and is not available for user.

2.2.4

Battery

The CPC1600 utilizes a 3.0 V lithium battery for the RTC and CMOS memory backup. Use

PANASONIC BR2032 or compatible.

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Detailed Description

CPC1600

2.3

Interfaces and Connectors

2.3.1

PC/104-Plus Connectors

CPC1600 is equipped with standard PC/104-Plus connectors. The PC/104 and PC/104-Plus connectors allow CPC1600 to interface with expansion modules such as A/D converters, digital I/O modules, etc. A maximum of four PC/104 or PC/104-Plus expansion modules may be stacked on the CPC1600 module to form a fully-integrated system.

PC/104 Interface

The PC/104 interface accepts an 8- or 16-bit PC/104 expansion modules. The PC/104 Bus uses a

104-pin 0.10” (2.54 mm) header located on the top of the board. This interface header will carry all of the appropriate 8 MHz ISA bus signals.

The processor module can accommodate maximum four PC/104 expansion modules without additional buffering.

The contact configuration of PC/104 header is shown in Figure 2-1. Tables 2-1 and 2-2 give the designation of this header contacts.

Figure 2-1: PC/104 Connector Contacts Layout

B1

A1

C0

D0

C19

D19

B32

A32

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Detailed Description

Table 2-2:

Pin #

A22

A23

A24

A25

A26

A27

A28

A29

A30

A31

A32

A14

A15

A16

A17

A18

A19

A20

A21

A8

A9

A10

A11

A12

A13

A4

A5

A6

A7

A1

A2

A3

In/Out

Out

Out

Out

Out

Out

Out

Out

Out

Out

Out

Out

Out

Out

Out

Out

Out

Out

Out

Ground

In/Out

In/Out

In

Out

Out

Out

In/Out

In/Out

In/Out

In/Out

In/Out

In/Out

PC/104 Connector (Rows A and B) Contacts Designation

Signal

SA9

SA8

SA7

SA6

SA5

SA4

SA3

SA17

SA16

SA15

SA14

SA13

SA12

SA11

SA10

SA2

SA1

SA0

GND

IOCHK#

SD7

SD6

SD5

SD4

SD3

SD2

SD1

SD0

IOCHRDY

AEN

SA19

SA18

Pin #

B22

B23

B24

B25

B26

B27

B28

B29

B30

B31

B32

B14

B15

B16

B17

B18

B19

B20

B21

B8

B9

B10

B11

B12

B13

B4

B5

B6

B7

B1

B2

B3

Signal

IOR#

DACK3#

DRQ3

DACK1#

DRQ1

REFRESH#

SYSCLK

IRQ7

IRQ6

IRQ5

IRQ4

IRQ3

DACK2#

TC

BALE

+5V

OSC

GND

GND

GND

RESETDRV

+5V

IRQ9

-5V

DRQ2

-12V

ENDXFR#

+12V

KEY

SMEMW#

SMEMR#

IOW#

In/Out

In

In

In

In

Out

Out

Out

Out

Out

In

Out

In

Out

Out

In

Power

Out

Ground

Ground

In

Power

Out

Out

Out

Ground

Out

Power

In

In

Power

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Detailed Description

Table 2-3:

Pin #

C7

C8

C9

C10

C11

C12

C3

C4

C5

C6

C0

C1

C2

C13

C14

C15

C16

C17

C18

C19

PC/104 Connector (Rows C and D) Contacts Designation

Signal

SD10

SD11

SD12

SD13

SD14

SD15

KEY

GND

SBHE#

LA23

LA22

LA21

LA20

LA19

LA18

LA17

MEMR#

MEMW#

SD8

SD9

In/Out

Out

Out

Out

Out

In/Out

In/Out

Ground

Out

Out

Out

Out

Out

Out

In/Out

In/Out

In/Out

In/Out

In/Out

In/Out

Pin #

D7

D8

D9

D10

D11

D12

D3

D4

D5

D6

D0

D1

D2

D13

D14

D15

D16

D17

D18

D19

Signal

GND

MEMCS16#

IOCS16#

IRQ10

IRQ11

IRQ12

IRQ13

IRQ14

DACK0#

DRQ0

DACK5#

DRQ5

DACK6#

DRQ6

DACK7#

DRQ7

+5V

MASTER#

GND

GND

In/Out

In

Out

In

Out

In

Out

In

In

In

In

Ground

In

In

In

Out

In

Power

In

Ground

Ground

Note:

In tables 2-1 and 2-2:

"–" - Not used;

"Power" - Power is supplied to the installed module

In/Out column shows the data transfer direction for a processor module being the bus master.

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Detailed Description

CPC1600

PC/104-Plus Interface

The PC/104-Plus uses a 120-pin (30x4) 2 mm header located on the top side of the board. This interface header accepts four stackable modules and carries all of the appropriate 32-bit 33 MHz

PCI signals. Three PCI bus mastering devices are supported on the PC/104-Plus header.

Figure 2-2: PC/104-Plus Connector Contacts Layout

Table 2-4:

Pin

26

27

28

23

24

25

29

30

18

19

20

21

22

14

15

16

17

11

12

13

8

9

10

6

7

4

5

1

2

3

PC/104-Plus Connector Contacts Designation

A

REQ0#

GND

GNT1#

+5V

CLK2

GND

+12V

-12V

GND

AD18

AD21

+3.3V

IDSEL0

AD24

GND

AD29

+5V

GND/5.0V_KEY2

VI/O

AD05

C/BE0#

GND

AD11

AD14

+3.3V

SERR#

GND

STOP#

+3.3V

FRAME#

B

AD16

+3.3V

AD20

AD23

GND

C/BE3#

AD26

+5V

AD30

GND

REQ2#

VI/O

CLK0

+5V

INTD#

INTA#

Reserved

Reserved

AD02

GND

AD07

AD09

VI/O

AD13

C/BE1#

GND

PERR#

+3.3V

TRDY#

GND

C

+3.3V

AD17

GND

AD22

IDSEL1

VI/O

AD25

AD28

GND

REQ1#

+5V

GNT2#

GND

CLK3

+5V

INTB#

Reserved

+5

AD01

AD04

GND

AD08

AD10

GND

AD15

Reserved

+3.3V

LOCK#

GND

IRDY#

D

AD00

+5V

AD03

AD06

GND

M66EN

AD12

+3.3V

PAR

Reserved

GND

DEVSEL#

+3.3V

C/BE2#

GND

AD19

+3.3V

IDSEL2

IDSEL3

GND

AD27

AD31

VI/O

GNT0#

GND

CLK1

GND

RST#

INTC#

GND/3.3V_KEY

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Detailed Description

CPC1600

The PC/104-Plus VIO selector is located on the top side of the module next to the PC/104-Plus header and allows to set the voltage supplied to PCI interface I/O buffers.

Figure 2-3: PC/104-Plus VIO Selector Positions

3 2 1

3 2 1

There is a standard 3-pin header for PC/104-Plus voltage selection.

The explanation of its jumper positions is presented below.

Contacts 1-2 closed, +5 V power is supplied to PCI interface

I/O buffers

Contacts 2-3 closed, +3.3 V

3 2 1

Note:

If you use PC/104 or PC/104-Plus power supply, I/O voltage could be set on the power supply module. In this case the jumper must be removed from VIO Selector

(all contacts OPEN)

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Detailed Description

CPC1600

2.3.2

USB Interfaces

The CPC1600 supports up to six USB 2.0 ports. They are available via three 10-pin onboard connectors. All USB ports support high-speed, full-speed, and low-speed operation. Hi-speed USB

2.0 supports data transfer rate of up to 480 Mb/s.

One USB device may be connected to each port. To connect more than six USB devices use an external hub. The USB power supply is protected by a self-resettable 500 mA fuse.

Figure 2-4: Onboard USB Header

1 2

Six USB ports are available via three onboard IDC2-10 connectors with the following pinouts:

Table 2-5:

Pin Number

9

2

4

5

7

1

3

6

8

10

9 10

Onboard USB Connectors Pinouts

Signal

VCC

UV0-

UV0+

GND

NC

VCC

UV0-

UV0+

GND

GND

Function

VCC signal

Differential USB-

Differential USB+

GND signal

VCC signal

Differential USB-

Differential USB+

GND signal

GND signal

In/Out

Note:

The maximum current for each USB port is limited to the amount of 0.5 A by the board's circuitry. All signal lines are EMI-filtered.

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Detailed Description

CPC1600

2.3.3

Graphics Controller

A highly integrated 2D/3D graphics accelerator is included in the 915GM GMCH. The internal graphics controller provides interfaces to a standard analog monitor and/or to a digital TFT panel with LVDS interface. VGA and LVDS headers are located on the top side of the module and require adapter cables for connection of the monitors.

Integrated 2D/3D Graphics features: n

Resolutions up to 1600

´1200 at 100 Hz, 1920´1440 at 85 Hz and 2048´1536 at 75 Hz.

n

3D Setup and Render Engine n

3D Graphics Rasterization Enhancements n

High Quality Texture Engine n

Full 2D hardware acceleration n

Intel® 915GM DVMT graphics core n

Intelligent Memory Management n

Integrated 400 MHz DAC

2.3.3.1

DVM Technology

The Intel® 915GM chipset supports the Dynamic Video Memory Technology (DVMT) v.3.0. This technology provides use of all available memory in the most efficient way for maximum graphics performance. DVMT dynamically responds to requests from applications allocating the required amount of video memory. The Intel® 915GM graphics driver is allowed to request up to 64 MB of system memory. When not needed by the graphics subsystem, the memory is freed up for other applications. Thus, memory usage is balanced for optimal graphics and system memory performance.

To support legacy VGA devices the internal video-controller needs at least 1 MB of system memory. Thus, the reported system memory size is always 1 MB less than available amount of physical memory.

2.3.3.2

Supported Resolutions

The integrated 400 MHz RAMDAC of the 915GM chipset allows direct connection of a progressive scan analog monitor with a resolution of up to 2048

´ 1536 at 75 Hz. The supported resolution depends on the color depth and on the vertical scanning frequency, as illustrated in the table below.

Table 2-6:

Display Mode

640

800

1024

´ 480

´ 600

´ 768

1280

´ 1024

1600

´ 1200

1920

´ 1440

2048

´ 1536

Supported Display Modes

60

´

´

´

´

´

´

´

8-bit Indexed

75

´

´

´

´

´

´

´

85

´

´

´

´

´

´

100

´

´

´

´

´

Color Resolution vs. Vertical Frequency

16- bit

60

´

´

´

´

´

´

´

75

´

´

´

´

´

´

´

85

´

´

´

´

´

´

100

´

´

´

´

´

60

´

´

´

´

´

´

´

75

´

´

´

´

´

´

´

32- bit

85

´

´

´

´

´

´

100

´

´

´

´

´

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Detailed Description

CPC1600

2.3.3.3

GMCH Core Voltage Selector

The range of integrated graphic adapter core frequencies is 133-200 MHz at core voltage of 1.05 V and 133-333 MHz at core voltage of 1.5 V.

Figure 2-1: GMCH Core Voltage Selector

1

GMCH Core Voltage Selector allows to switch between core voltage values of 1.05 or 1.5 V. In open position the core voltage is set to 1.5 V; in closed position the core voltage is set to 1.05 V.

Note:

Increasing internal core frequency leads to CPC1600’s power consumption growth by up to 4 Watts.

2.3.3.4

Figure 2-2:

Video Interfaces and Connectors

SVGA, LVDS, and TFT Panel Control Connectors

8

2

16

7

1

15

16

15

One 2-row 16-pin connector on the top side is used to connect a CRT monitor to the CPC1600 module.

The 75 ohm termination resistors for the red, green and blue video signals are installed on the

CPC1600.

Another 16-pin connector is used to connect devices with LVDS interface to the CPC1600 module.

8-pin connector is used for TFT panel control.

2 1 2 1

For connection of external devices all three connectors require adapter cables, supplied with

CPC1600. Pinouts of these connectors can be found in the following tables.

Table 2-7:

Pin Number

5

8

10

1

2

3

12

14

4, 9, 11, 13, 15

6, 7, 16

SVGA Connector Pinout

Signal

Red

VGA_VCC

Green

Blue

DDCdata

Hsync

Vsync

DDCclk

GND

NC

Function

Red video signal output

Power +5V 200 mA

Green video signal output

Blue video signal output

I

2

C™ data

Horizontal sync.

Vertical sync.

I

2

C™ clock

Signal ground

In/Out

Out

Out

Out

Out

In/Out

TTL out

TTL out

Out

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Detailed Description

Table 2-8:

Pin Number

6

7

4

5

1

2

3

8

LVDS Connector Pinout

Signal

LVDS_A_DATA0+

LVDS_A_DATA0-

LVDS_A_DATA1+

LVDS_A_DATA1-

LVDS_A_DATA2+

LVDS_A_DATA2-

LVDS_A_CLK+

LVDS_A_CLK-

Pin Number

12

13

14

15

9

10

11

16

Table 2-9:

Pin Number

1

2

3

4

TFT Panel Control Connector Pinout

Signal

LVDS_DDC_CLK

BACKLIGHT_CONTROL

LVDS_DDC_DATA

BACKLIGHT_ENABLE

Pin Number

9

10

11

12

Signal

LVDS_B_DATA0+

LVDS_B_DATA0-

LVDS_B_DATA1+

LVDS_B_DATA1-

LVDS_B_DATA2+

LVDS_B_DATA2-

LVDS_B_CLK+

LVDS_B_CLK-

Signal

+5V

VDD_ENABLE

+3.3V

GND

CPC1600

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Detailed Description

CPC1600

2.3.4

Figure 2-2:

Ethernet Ports

Ethernet Connectors

1 1

1

15

16

2

2

16

15

1

Two 2-row 16-pin Ethernet headers are located on the top side of CPC1600. They are used by two

Gigabit Ethernet interfaces.

Two 4-pin headers allow connection of Ethernet

LEDs.

All these headers require cable adapters to connect network cables to standard RJ45 connectors.

CPC1600 is equipped with two 10Base-T/100Base-

TX/1000Base-T Ethernet ports based on Intel®

82571EB Dual Gigabit Ethernet PCI-Express bus controller. Host interface is one 4x PCI Express lanes.

The Intel® 82571EB Gigabit Ethernet controller architecture combines high performance and low power consumption. The controller's features include independent transmit and receive queues to limit PCI-Express bus traffic, and PCI-Express interface providing efficient bus utilization by increased use of bursts.

The interfaces provide auto-detection and switching between 10Base-T, 100Base-TX, and

1000Base-T operation modes. Each of the two Ethernet channels may be disabled via the BIOS

Setup or user software utility to free up system resources.

The following table presents pinouts of these connectors.

Table 2-10:

Pin Number

7

8

5

6

3

4

1

2

Ethernet Connectors Pinouts

Signal

MDI0+

MDI0-

SHLD

SHLD

MDI1+

MDI1-

SHLD

SHLD

Pin Number

13

14

15

16

9

10

11

12

Signal

MDI2+

MDI2-

SHLD

SHLD

MDI3+

MDI3-

SHLD

SHLD

Table 2-11:

Pin Number

1

2

Ethernet LEDs Connectors Pinouts

Signal

LINK_UP

ACTIVITY

Pin Number

3

4

Signal

LINK100

LINK1000

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Detailed Description

CPC1600

2.3.5

EIDE Interface

The EIDE interface supports several operation modes: PIO mode, 8237-type DMA mode,

Ultra DMA, ATA-33. In PIO mode the central processor controls the data transfers. In all the DMA modes, the CPU is not engaged in data transfer. DMA modes are similar to each other, but differ in data transfer protocols details and DMA clock frequency, thus providing different transfer rates.

The current version of CPC1600 supports one EIDE channel to accommodate a maximum of two devices (with no CompactFlash card in slot).

Figure 2-3: HDD Connector

1 2

The EIDE channel is routed to standard 44-pin on-board connector and to the CompactFlash socket. It is possible to connect both master and slave devices to this EIDE channel. Maximum IDE cable length is 50 cm.

The pinout of the standard HDD connector is shown in the table below.

43 44

Table 2-12:

Pin Number

13

14

15

9

10

11

12

7

8

5

6

3

4

1

2

20

21

22

16

17

18

19

Standard EIDE HDD Connector Pinout

Signal

D14

D0

D15

GND

NC

REQ

GND

D4

D11

D3

D12

D2

D13

D1

RESET#

GND

D7

D8

D6

D9

D5

D10

Pin Number

35

36

37

31

32

33

34

27

28

29

30

23

24

25

26

42

43

44

38

39

40

41

Signal

IOWR#

GND

IORD#

GND

IORDY

CSEL#

DACK#

GND

INTRQ

IOCS16#

A1

PDIAG#

A0

A2

CS0#

CS1#

DASP#

GND

+5V

+5V

GND

NC

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Detailed Description

CPC1600

2.3.5.1

Figure 2-4:

HDD LED Connector

HDD LED Connector

1

The onboard HDD LED connector is used to control an external

HDD activity LED indicator. It is lit when any of IDE or SATA channel is active, the data are read or written from/to an external disk drive. Contact “1” should be connected to “+”.

2.3.6

Figure 2-5:

Serial ATA Ports

Serial ATA Connectors

1

1

CPC1600 has two standard SerialATA connectors installed on board.

The connector's pinout is presented in the table below.

Table 2-13:

Contact Number

6

7

4

5

1

2

3

SATA Connector Pinout

Function

GND

TXP

TXN

GND

RXN

RXP

GND

It is recommended to use a 45 cm cable for connection of SATA drives.

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Detailed Description

CPC1600

2.3.7

Figure 2-6:

CompactFlash Socket

CompactFlash Socket

To enable usage of CF memory cards CPC1600 has a

CompactFlash Type I/II socket located on the bottom side of the board. CF removable mass storage devices are fully compatible with 16-bit ATA/ATAPI-4 IDE interface with DMA support (CF Specification v.4.1).

CompactFlash socket is connected to the EIDE port as master at the current version of CPC1600.

Table 2-14: CompactFlash Socket Pinout

42

43

44

45

38

39

40

41

46

47

48

49

34

35

36

37

30

31

32

33

23

24

25

26

19

20

21

22

15

16

17

18

11

12

13

14

27

28

29

50

7

8

9

10

Pin Number

3

4

1

2

5

6

Signal

GND

D03

D04

D05

D06

D07

IDE_CS0

GND (A10)

GND (ATASEL)

GND (A09)

GND (A08)

GND (A07)

3.3 V

GND (A06)

GND (A05)

GND (A04)

GND (A03)

A02

A01

A00

D00

D01

D02

NC (IOCS16)

NC (CD2)

NC (CD1)

D11

D12

D13

D14

D15

IDE_CS1

NC (VS1)

DIOR

DIOW

3.3 V (WE)

INTRQ

3.3 V

CSEL (GND pull-up)

NC (VS2)

Reset

IORDY

REQ#

ACK#

NC (ACTIVE)

NC (PDIAG)

D08

D09

D10

GND

Function

Ground signal

Data 3

Data 4

Data 5

Data 6

Data 7

Chip select 0

3.3 V power

Address 2

Address 1

Address 0

Data 0

Data 1

Data 2

Data 11

Data 12

Data 13

Data 14

Data 15

Chip select 1

I/O read

I/O write

3.3 V power

Interrupt

3.3 V power

Master/Slave

Reset

I/O ready

DMA request

DMA acknowledge

Data 08

Data 09

Data 10

In/Out

In/Out

In/Out

In/Out

In/Out

In/Out

Out

Out

Out

In

Out

In

In/Out

In/Out

Out

Out

Out

In

In/Out

In/Out

In/Out

Out

Out

In/Out

In/Out

In/Out

Out

In/Out

In/Out

In/Out

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Detailed Description

CPC1600

2.3.8

GPIO Connector

Figure 2-7: GPIO Connector

10 1

10-pin GPIO connector is located on the top side of the board near the PC/104-Plus connector. It provides eight general purpose I/O lines that can be used for data exchange with such external devices as data acquisition modules.

The pinout of this connector is shown in the table below.

Table 2-15:

Pin Number

3

4

1

2

5

GPIO Connector Pinout

Signal

GND

GPIO 0

GPIO 1

GPIO 2

GPIO 3

Pin Number

8

9

6

7

10

Signal

+3.3V

GPIO 4

GPIO 5

GPIO 6

GPIO 7

2.3.9

Figure 2-8:

Power Connector

External Power Supply Connector

1

The standard 2-pin connector for power supply is located on the top side of the board. As an option, power can also be supplied via PCI and ISA buses.

The pinout of this connector is shown in the table below.

Table 2-16:

Pin Number

1

2

Power Supply Connector Pinout

Function

+5V

GND

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Detailed Description

CPC1600

2.3.10 Other Connectors and System Status LEDs

A group of three 2-pin connectors next to PC/104-Plus connector consists of Remote reset switch connector, Clear CMOS jumper switch, and HDD LED connector (described above).

3-pin PC/104-Plus VIO selection switch is described above in a section devoted to PC/104-Plus connectors. The details on jumper switches use can be found in

Chapter 4

of this Manual.

Figure 2-9: System Status LEDs

Two on-board system status LEDs are located on the top side of the module next to the central opening.

Green power LED is lit when the module is in power up state. Red Standby LED indicates the module in standby mode.

Figure 2-10: CPLD JTAG Header

6 1

6-pin CPLD JTAG header located next to PC/104-Plus connector is used for initial CPLD programming at the factory.

Figure 2-11: LPC Header

20-pin LPC header is used for manufacturing purposes.

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Installation

CPC1600

3 Installation

The CPC1600 is easy to install. However, it is necessary to follow the procedures and safety regulations below to install the module correctly without damage to the hardware, or harm to personnel.

The installation of the peripheral drivers is described in the accompanying information files. For details on installation of an operating system, please refer to the relevant software documentation.

3.1

Safety Regulations

The following safety regulations must be observed when installing or operating the CPC1600.

Fastwel assumes no responsibility for any damage resulting from infringement of these rules.

Warning!

When handling or operating the module, special attention should be paid to the heatsink, because it can get very hot during operation.

Do not touch the heatsink when installing or removing the module.

Moreover, the module should not be placed on any surface or in any kind of package until the module and its heatsink have cooled down to ambient temperature.

Caution!

If your module does not allow hotswapping, switch off the system power before installing the module in a free slot. Disregarding this requirement could be harmful for your life or health and can damage the module or entire system.

ESD Sensitive Equipment!

This product comprises electrostatically sensitive components.

Please follow the ESD safety instructions to ensure module's operability and reliability: n

Use grounding equipment, if working at an anti-static workbench. Otherwise, discharge yourself and the tools in use before touching the sensitive equipment.

n

Try to avoid touching contacts, leads and components.

Extra caution should be taken in cold and dry weather.

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Installation

3.2

System Design Variants

CPC1600

In case of placing most heat emitting components, namely the processor and the north bridge chips, on the top side, the heat sinking system hight is limited by PC/104 expansion cards to be installed on the processor module. CPC1600 has these components placed on the bottom side of the module in order to make heat sinking easier. Moreover, this provides additional system design possibilities.

CPC1600 is supplied with a heat-conducting plate that is installed on the bottom (processor) side of the board. In this configuration it is possible to provide conduction heat sinking by mounting the unit directly on system cabinet or chassis, therefore turning the cabinet into large heatsink.

Heat is drawn from the CPU and GMCH chips via the heat conducting plate and transferred to the

PC/104 cabinet. This solution provides lower overall heat transmission resistance compared to systems where heat pipes are used for heat transfer.

Optionally, a ribbed heatsink and a cooling fan are supplied with CPC1600. The heatsink is installed on the heat-conducting plate using four M4 screws and thermal compound.

This configuration is used in a system case, where centralized forced air cooling is available.

An optional cooling fan can be installed on the ribbed heatsink to further intensify heat dissipation.

Power is supplied to the fan from the system power supply unit.

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Installation

3.3

Installation of the Board and Expansion Modules

CPC1600

To install CPC1600, follow the instructions below.

1. Keep to the safety regulations of the Section 3.1 when performing the following operations.

Warning!

Failure to accomplish the following instruction may damage the module or result in incorrect system operation.

2. Ensure that the module configuration corresponds to the application requirements before installing. For information regarding the configuration of the CPC1600, refer to

Chapter 4

.

For the installation of CPC1600 specific peripheral devices, expansion modules, and I/O devices refer to the appropriate sections in

Chapter 3

.

3. To install the CPC1600:

1. Make sure that no power is connected to the system.

2. Depending on the application, system configuration, and thermal requirements

CPC1600 can be installed in different ways: a. For CPC1600 with only heatspreader mounted on board:

Mount the module on a plane surface of the system case or chassis using four

M4 srews. To reduce heat transfer resistance use thermal compound. Please, refer to

Figure 1-5 for mounting openings coordinates.

b. For CPC1600 with an optional ribbed heatsink (with or without cooling fan):

Mount the heatsink on the heat spreader using four M4 srews and thermal compound. Mount the module on a surface using stud spacers replacing four corner heat spreader fixing screws. Provide conditions for sufficient cooling air flow. Mount the cooling fan on the ribbed heatsink using four screws, if required. The fan air flow should be directed to the heatsink. Connect the fan power cable to the system power supply unit.

3. Connect the required external interfacing cables to the module's connectors and make sure that the module and all connected cables are properly fixed.

The CPC1600 is now ready for operation. Please, refer to appropriate software, application, and system manuals to get further instructions.

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Installation

CPC1600

3.4

Removal Procedure

To remove the module from the system case do the following:

1. When performing the next actions, keep to safety regulations of the

Section 3.1

.

Pay special attention to the temperature of the heatsink!

2. Ensure that the system power is switched off before proceeding.

3. Disconnect all cables that may be connected to the module.

4. Unscrew the retaining screws. Do not touch the heatsink, since it can get very hot during operation.

6. Dispose of the module at your discretion. The module should not be placed on any surface or in any form of package until the board and the heatsink have cooled down to room temperature.

3.5

Peripheral Devices Installation

Many peripheral devices can be connected to the CPC1600. Their installation procedures differ significantly. Therefore, the following sections provide mainly general guidelines regarding installation of peripheral devices.

The details on external devices connection can be found in documentation supplied with these devices.

3.5.1

USB Devices Installation

The CPC1600 can accept Plug&Play connection of USB 2.0 computer peripheral devices (printers, keyboards, mice, etc.) All USB devices may be connected or disconnected while the host power is on.

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Installation

CPC1600

3.5.2

CompactFlash Cards Installation

CompactFlash socket of CPC1600 supports only 3.3 V CompactFlash ATA type I/II cards.

Note:

Connection of the CompactFlash cards while the power is on may damage your system.

Carefully slide in the correctly oriented card and gently press to engage the contacts completely.

Note:

It is recommended to use CompactFlash-cards, which has been initialized and formatted in this module.

By default, CPC1600 utilizes LBA mode. Utilization of CompactFlash cards, which has been initialized and formatted in another mode, may lead to errors in operation of the module.

3.5.3

Battery Replacement

The lithium battery must be replaced with Panasonic BR2032 or a battery with similar characteristics.

The expected life of a 190 mAh battery (Panasonic BR2032) is about 5 years. However, this typical value may vary because battery life depends on the operating temperature and the shutdown time of the system in which the battery is installed.

Note...

It is recommended to replace the battery after approximately 4 years to be sure it is operational.

Important:

Replacing the battery, make sure the polarity is correct ("+" up).

Dispose of used batteries according to the local regulations.

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Installation

CPC1600

3.5.4

PC/104 and PC/104-Plus Expansion Modules Installation

The PC/104 and PC/104-Plus connectors allow you to install interface expansion modules. They can be stacked to form a highly integrated control system. CPC1600 is capable to communicate with up to four PC/104 or PC/104-Plus expansion modules.

Warning!

When installing any PC/104 or PC/104-Plus module, avoid excessively flexing the CPC1600 board. Mate pins correctly and use the required mounting hardware.

Note...

Before installing and operating the PC/104-Plus expansion modules it is necessary to set the voltage supplied to PCI interface I/O buffers using the PC/104-Plus VIO selector. See details in

Section 4.2

.

PC/104 and PC/104-Plus Mounting Fasteners(*)

1. Brass hex standoff spacer, PCHSN-15 – 8 items

2. Plain washer 3, DIN 125Z – 4 items

3. Toothed washer M3, DIN 6798

А – 4 items

4. Nut M3, DIN 934Z – 4 items

5. Screw M3x8, DIN7985 – 4 items

(*) Proposed set. The items are not included in delivery checklist.

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Configuration

CPC1600

4 Configuration

4.1

Clear CMOS Jumper Description

If the system does not boot (due to, for example, the wrong BIOS configuration or incorrect password) the settings stored in CMOS may be cleared using jumper “Clear CMOS”.

Procedure for clearing CMOS settings:

1. Switch off the system power

2. Set the “Clear CMOS” jumper into the closed position

3. Wait for at least 10 seconds. CMOS setting are reset to factory defaults

4. Set the “Clear CMOS” jumper back to the open position

5. Switch the power on

6. Configure the system using the BIOS Setup program

4.2

PC/104-Plus VIO Selection

The PC/104-Plus VIO selector is located on the top side of the module next to the PC/104-Plus header and allows to set the voltage supplied to PCI interface I/O buffers.

Warning!

All actions should be performed when the power is disconnected.

Figure 4-1: PC/104-Plus VIO Selector Positions

3 2 1

3 2 1

There is a standard 3-pin header for PC/104-Plus voltage selection.

The explanation of its jumper positions is presented below.

Contacts 1-2 closed, +5 V power is supplied to PCI interface

I/O buffers

Contacts 2-3 closed, +3.3 V

3 2 1

Note:

If you use PC/104 or PC/104-Plus power supply, I/O voltage could be set on the power supply module. In this case the jumper must be removed from VIO Selector

(all contacts OPEN)

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Configuration

1

CPC1600

4.3

GMCH Core Voltage Selection

GMCH VCC selector is a 2-pin jumper switch, which allows to set the North Bridge core voltage.

Default position is “closed”, in this case the voltage is set to 1.05 V. “Open” position provides 1.5 V power to GMCH.

Figure 4-2: GMCH Core Voltage Selector

GMCH Core Voltage Selector allows to switch between core voltage values of 1.05 or 1.5 V. In open position the core voltage is set to 1.5 V; in closed position the core voltage is set to 1.05 V.

Warning!

All actions should be performed when the power is disconnected.

4.4

Interrupts Handling

Interrupt handling of the CPC1600 module corresponds to the standard AT IRQ mapping (8259

IRQ controller integrated in the chipset). The functions of the interrupts described below are the default ones, but can be modified via the BIOS Setup.

Table 4-1:

IRQ

IRQ7

IRQ8

IRQ9

IRQ10

IRQ11

IRQ12

IRQ13

IRQ0

IRQ1

IRQ2

IRQ3

IRQ4

IRQ5

IRQ6

IRQ14

IRQ15

NMI

Interrupt Settings

Priority

6

7

8

4

5

15

3

9

10

12

13

14

1

2

11

Standard Function

System Timer

Keyboard Controller

Second IRQ controller input (IRQ8-IRQ15)

COM2

COM1

Reserved

Floppy Disk Controller

LPT

System RTC

PCI or ACPI

PCI or Ethernet ports

PCI

PCI or PS/2 mouse

Coprocessor error

Primary IDE channel

Secondary IDE channel

Reserved

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Configuration

CPC1600

4.4.1

On-board PCI Interrupts

The ICH handles up to 8 PCI interrupt inputs. The table below describes the connected to these

PIRQs PCI devices and their functions.

Table 4-2:

ICH IRQ Input

PIRQA

PIRQB

PIRQC

PIRQD

PIRQE

PIRQF

PIRQG

PIRQH

PCI Interrupt Routing

PCI Device

PCI IRQA or MINI PCI Socket

PCI IRQB or MINI PCI Socket

PCI IRQC

PCI IRQD

Free

Free

Free

Security

Internal ICH Function

USB 1.0 controller #1

AC97 + MODEM + SMBUS

Storage (IDE/SATA) native mode

USB 1.0 controller #2

Free

Free

Free

USB 2.0 controller

The details can be found in the ICH technical documentation.

4.5

Memory Maps

The CPC1600 module employs the standard AT ISA memory mapping. The details of memory mapping are presented in the following subsections.

4.5.1

First Megabyte Memory Map

The following table shows the memory map for the first megabyte:

Table 4-3: First Megabyte Memory Map

Memory Address Range

0xE0000 – 0xFFFFF

0xD0000 – 0xDFFFF

0xCC000 – 0xCFFFF

0xC0000 – 0xCC800

0xA0000 – 0xBFFFF

0x00000 – 0x9FFFF

Size

128 k

64 k

16 k

48 k

128 k

640 k

Function

BIOS implemented in FWH

Reset vector 0xFFFF0

Free

Free

VGA card BIOS

Normally used as video RAM according to:

CGA:

Monochrome:

EGA/VGA:

DOS memory space

0xB8000-0xBFFFF

0xB0000-0xB7FFF

0xA0000-0xAFFFF

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Configuration

4.5.2

I/O Addresses

The following table presents the I/O memory mapping:

I/O Address Map

Read Target

DMA Controller

RESERVED

DMA Controller

DMA Controller

RESERVED

DMA Controller

Interrupt Controller

Interrupt Controller

Interrupt Controller

Interrupt Controller

LPC SIO

Interrupt Controller

Interrupt Controller

Interrupt Controller

Interrupt Controller

Timer/Counter

RESERVED

LPC SIO

Timer/Counter

RESERVED

Microcontroller

NMI Controller

Microcontroller

Microcontroller

Microcontroller

RESERVED

RTC Controller

RTC Controller

RTC Controller

RTC Controller

RTC Controller

RTC Controller

RTC Controller

DMA Controller, or LPC, or PCI

DMA Controller

DMA Controller

DMA Controller

DMA Controller

DMA Controller

DMA Controller

DMA Controller

DMA Controller

Reset Generator

DMA Controller

Interrupt Controller

Interrupt Controller

Interrupt Controller

Interrupt Controller

Interrupt Controller

Table 4-4:

I/O Address

53h

60h

61h

62h

64h

66h

38h–39h

3Ch–3Dh

40h–42h

43h

4E–4F

50h–52h

70h

71h

72h

73h

74h

00h–08h

09h–0Eh

0Fh

10h–18h

19h–1Eh

1Fh

20h–21h

24h–25h

28h–29h

2Ch–2Dh

2E–2F

30h–31h

34h–35h

75h

76h

77h

80h

81h–83h

84h–86h

87h

88h

89h–8Bh

8Ch–8Eh

08Fh

90h–91h

92h

93h–9Fh

A0h–A1h

A4h–A5h

A8h–A9h

ACh–ADh

B0h–B1h

Write Target

DMA Controller

DMA Controller

DMA Controller

DMA Controller

DMA Controller

DMA Controller

Interrupt Controller

Interrupt Controller

Interrupt Controller

Interrupt Controller

LPC SIO

Interrupt Controller

Interrupt Controller

Interrupt Controller

Interrupt Controller

Timer/Counter

Timer/Counter

LPC SIO

Timer/Counter

Timer/Counter

Microcontroller

NMI Controller

Microcontroller

Microcontroller

Microcontroller

NMI and RTC Controller

RTC Controller

NMI and RTC Controller

RTC Controller

NMI and RTC Controller

RTC Controller

NMI and RTC Controller

RTC Controller

DMA Controller and LPC or PCI

DMA Controller

DMA Controller and LPC or PCI

DMA Controller

DMA Controller and LPC or PCI

DMA Controller

DMA Controller and LPC or PCI

DMA Controller

DMA Controller

Reset Generator

DMA Controller

Interrupt Controller

Interrupt Controller

Interrupt Controller

Interrupt Controller

Interrupt Controller

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CPC1600

Internal Unit

DMA

DMA

DMA

DMA

DMA

Processor I/F

DMA

Interrupt

Interrupt

Interrupt

Interrupt

Interrupt

RTC

RTC

RTC

DMA

DMA

DMA

DMA

DMA

DMA

DMA

DMA

DMA

DMA

Interrupt

Interrupt

Interrupt

Interrupt

Forwarded to LPC

Interrupt

Interrupt

RTC

RTC

RTC

RTC

RTC

Interrupt

Interrupt

PIT (8254)

PIT

Forwarded to LPC

PIT

PIT

Forwarded to LPC

Processor I/F

Forwarded to LPC

Forwarded to LPC

Forwarded to LPC

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Configuration

I/O Address

B2h–B3h

B4h–B5h

B8h–B9h

BCh–BDh

C0h–D1h

D2h–DDh

DEh–DFh

F0h

170h–177h

1F0h–1F7h

376h

3F6h

CF9h

Read Target Write Target

Power Management

Interrupt Controller

Interrupt Controller

Interrupt Controller

Power Management

Interrupt Controller

Interrupt Controller

Interrupt Controller

DMA Controller

RESERVED

DMA Controller

DMA Controller

DMA Controller

PCI and Master Abort1

IDE Controller, SATA Controller, or PCI

DMA Controller

FERR#/IGNNE# / Interrupt Controller

IDE Controller, SATA Controller, or PCI

IDE Controller, SATA Controller, or PCI 2 IDE Controller, SATA Controller, or PCI

IDE Controller, SATA Controller, or PCI IDE Controller, SATA Controller, or PCI

IDE Controller, SATA Controller, or PCI 2 IDE Controller, SATA Controller, or PCI

Reset Generator

Interrupt Controller

Reset Generator

Internal Unit

Power Management

Interrupt

Interrupt

Interrupt

DMA

DMA

DMA

Processor I/F

Forwarded to IDE or SATA

Forwarded to IDE or SATA

Forwarded to IDE or SATA

Forwarded IDE or SATA

Interrupt

Processor I/F

Notes:

1. A read to this address will subtractively go to PCI, where it will master abort.

2. Only if IDE I/O space is enabled (D31:F1:40 bit 15) and the IDE controller is in legacy mode. Otherwise, the target is PCI.

CPC1600

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Phoenix® BIOS Setup

CPC1600

5 Phoenix® BIOS Setup

The Phoenix® BIOS in your SBC is an adapted version of a standard BIOS for IBM PC

AT-compatible personal computers equipped with Intel®x86 and compatible processors. The BIOS provides low-level support for the central processing, memory, and I/O system units.

With the help of BIOS Setup program, you can modify the BIOS configuration parameters and control the special features of your module. The Setup program is started by pressing the F2 key and offers a convenient menu interface to modify basic system configuration settings and switching between the subsystems operation modes. These settings are stored in a dedicated batterybacked memory, CMOS RAM, which keeps the information when the power is switched off.

5.1

Boot Details

5.1.1

Booting without a Monitor, Keyboard or Mouse

To boot without a monitor, keyboard or mouse set the item "POST Errors" to "Disabled" at the page "Main" in PhoenixBIOS Setup program. This setting is a default one.

5.1.2

Booting from USB

To boot from a device connected to USB: n

Connect the device to boot from to a USB port. The appropriate USB controller should be enabled; n

Enter the PhoenixBIOS Setup program; n

Find this USB device in Boot Priority list at the "Boot" page and use «+» or «–» buttons to move it up or down in order to change its boot priority.

In case the device is not in the Boot Priority list, find it in Excluded from Boot Order list, press “x” to move it to the Boot Priority list and set the boot order with

«+» or «–» buttons; n

Save changes and reboot the module.

To get the on-line help about the details of BIOS Setup program operation, please apply to the screen tips and the integrated help system.

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Thermal and Power Issues

CPC1600

6 Thermal and Power Issues

6.1

Temperature Control

Intensive operation of Intel Pentium M processor in harsh environment requires a special technology to keep the processor’s die temperature within allowed limits. The following sections provide system integrators with the information, which will help to meet thermal requirements when developing systems based on CPC1600.

6.1.1

Passive Regulation

The thermal management concept of CPC1600 module includes four separate but correlated functions. Their main purpose is to protect the processor from overheating and reduce its power consumption. Dedicated thermal control subsystem allows the processor to operate within safe temperature range without the need for special software or interrupt handling.

The four thermal protection functions provided by the processor are:

1.

Thermal Throttling: The Pentium M internal thermal monitor controls the temperature of the processor. The internal temperature sensor is located near the hottest area of the processor die. Each processor is individually adjusted at the factory to compensate the potential manufacturing variations of its characteristics. To reduce the processor power dissipation the internal thermal monitor switches the processor core clock on and off with a duty cycle factor of 50%.

2. The Intel® Pentium® M processor supports the Intel SpeedStep® enhanced technology.

It allows to switch the processor core voltage and frequency between several modes from

High Frequency Mode to Low Frequency Mode without resetting the system. For example, the processor operating at 1.6 GHz and 1.484 V (HFM) can be switched down to 600 MHz and 0.956 V (LFM), thus reducing the processor power consumption in approx. 4 times.

3.

Thermtrip function is always on to protect the processor in any event. In case of a serious cooling subsystem failure, the processor will automatically shut down when the die temperature has reached approximately 125°C. Once Thermtrip is activated, the system does not return to the normal operation mode automatically, it is necessary to reset the

BIOS settings and to cold restart the system. The BIOS settings can be reset by lifting the contact plate of the battery holder for a period of more than 5 seconds.

4.

External thermal monitor (LM87) gathers information about the processor and board surface temperatures from two sensors. This information may then be requested by a program to undertake the appropriate actions.

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Thermal and Power Issues

CPC1600

Recommendations

Generally, there is no need to enable the Thermal Management functions if the module is operated in an optimally designed environment with sufficient air flow. However, to guarantee a stable system in unsteady environment, both the internal and the external thermal monitors should be enabled. These two monitors protect the processor and the whole system against overheating.

Note:

Thermal Management functions should be disabled when performing

Benchmarks and performance tests, otherwise the results will be incorrect due to the power reduction processes influence.

6.1.2

Active Regulation

To provide controlled active heat dissipation CPC1600 is equipped with standard heatsinks.

Together with a system chassis with adjustable forced airflow capability, this provides a basis for reliable and steady operation. Forced airflow of sufficient volume is vital for high performance processors operating in high temperature environments.

When developing applications using the CPC1600, the system integrator must take into account the overall system thermal requirements. System chassis must satisfy these requirements. When performing thermal calculations for certain application, the developer must consider the contribution of peripherals to be used with the CPC1600 to the total heat emission. These devices must also be capable to operate at the temperatures within the system operating range, especially those, which are attached directly to the CPC1600 processor module.

Warning!!!

Since Fastwel does not assume responsibility for any damage to the

CPC1600 module or other system parts resulting from overheating of the central processor, it is important to ensure that the CPC1600 operational environment parameters conform to the thermal requirements described in this Manual.

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Thermal and Power Issues

CPC1600

6.2

System Power

The Intel Pentium M processor family requires special characteristics of the power supply unit and the baseboard.

The CPC1600 module itself has been designed to provide best possible power supply for each system unit. However, in order to guarantee reliable and faultless operation the following requirements must be taken into account. Absolute maximum input voltage presented in the table below must not be exceeded to guarantee that the CPC1600 is not damaged. The range for the input power voltage, within which the module is functional, is also presented.

Table 6-1:

Power Voltage, V

+5

DC Input Voltage Ranges and Limits

Maximum Permitted Value, V Absolute Limits, V

+5.5

4.9 to 5.25

Recommended Range, V

5.0 to 5.25

Power supplies to be used with the CPC1600 should comply with these requirements.

Input power connections to the baseboard itself should provide minimum power loss. Avoid using long input lines, low carrying capacity cables, and high resistance connections.

To select the appropriate system power supply, it is necessary to consider the CPC1600 own power consumption (about 35 watts), the consumption of the remaining system components, possible variations of power consumption during operation (e.g. due to temperature changes) and some reserve. Taking all this into account, it is recommended to use a 150 watt power supply. If possible, power supplies with voltage sensing should be used. This may require an appropriate baseboard.

Table 6-2: Some CPC1600 Components Power Consumption

System Modules

Pentium M 1.6 CPU

915GM+ICH6M Chipset

DDR SDRAM SODIMM PC2700 1 GB

Gigabit Ethernet chips 2pcs

CompactFlash card

Keyboard

(2.5 V)

(3.3 V)

(5 V)

Power Consumption

24.5 W

6 + 2.3 W

5 W

1548x2 mW

100 to 300 mW

100 mW

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Appendices

7 Appendices

7.1

Supplementary Information

7.1.1

Related Standards and Specifications

The Fastwel’s CPC1600 module comply with the requirements of the following standards:

Table 7-1: Related Standards

Type Standard

CE: Emission

CE: Immission

EN50081-1

EN61000-6-2

CE: Electrical safety EN60950

Mechanical dimensions IEEE 1101.10

Vibration (sinusoidal) IEC60068-2-6-82; Fc

Permanent shock

Single shock

Reduced atmospheric pressure

IEC60068-2-29-87; Eb

IEC60068-2-27-87; Ea

IEC 60068-2-13-83, M

Test Parameters

5 g / 10-500 Hz / 10

(acceleration / frequency range / test cycles per axis)

50 g / 11 ms / 1000

±10 / 1 s

(peak acceleration / shock duration half sine / number of shocks / recovery time)

100 g / 9 ms / 18 / 3 s

(peak acceleration / shock duration / number of shocks / recovery time in seconds)

9 kPa (1.305 psi); approx. corresponds to 17000 m

(over 55700 ft) above sea level

Important...

Some versions of the module may have the test results differing from the ones presented in the above table. For more information, please contact

Fastwel’s official representatives.

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Appendices

CPC1600

Information related to this product and its components can be found in the following specifications:

Table 7-2:

Product

PICMG

PCI Bus

PCI Express

MiniPCI

Related Specifications

CompactFlash Cards

Specification

PICMG 1.0, Rev. 2.0

PCI 2.3 Compliant Specifications

For latest revision of the PCI specifications, contact the PCI Special Interest Group

Office at: http://www.pcisig.com

PCI Express 1.0a Specification

MiniPCI Specification, Rev. 1.0

CF+ and CompactFlash Specification, Revision 4.1

The Internet site of the PCI Industrial Computer Manufacturers Group (PICMG) provides information related to these standards ( http://www.picmg.org/ ).

7.2

Useful Abbreviations, Acronyms and Short-cuts

GMCH

USB

LPC

SMB

UART

UHCI

EHCI

UTP

CRT-display

Abbreviation

BMC

PM

IPMI

IPMB

I

2

C™

KCS interface

BT interface

DDR SDRAM

SODIMM

ECC

FWH

Meaning

Baseboard Management Controller

Peripheral Management Controller

Intelligent Platform Management Interface

Intelligent Platform Management Bus

Inter Integrated Circuit

Two-thread serial protocol, used in SMB and IPMI

Keyboard Controller Style interface

Interface for communication between control software and BMC, similar to a keyboard controller interface

Block Transfer interface

Block transfer interface for communication between control software and BMC

Double Data Rate Synchronous Dynamic Random Access Memory

Small Outline Dual In-Line Memory Module

Error Correction Code

Data error correction technology used in memory modules

Firmware Hub

Nonvolatile memory chip, part of Intel chipset, used for main and reserve BIOS copies in CPC1600

Graphics and Memory Controller Hub

Universal Serial Bus

Low Pin Count

External devices communication interface

System Management Bus

Universal Asynchronous Receiver-Transmitter

Universal Host Controller Interface

USB Host Controller Interface

Enhanced Host Controller Interface (Universal Serial Bus specification)

Unshielded Twisted Pair

Cathode Ray Tube Display

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58

Appendices

Abbreviation

PMC

CMC

LVDS

RTC

BIOS

PC

PICMG

AHA

AGP

AGTL

SMBus

EEPROM

NAND Flash

SSD

PLCC

RAMDAC

DAC

DVMT

TTL

ECP/EPP

FDD

EIDE

DMA

PIO

Rear I/O Board

PWM output

ESD

ACPI

POST cPCI

EOS

MDI

Meaning

PCI (Peripheral Component Interconnect) Mezzanine Card

Common Mezzanine Card

Low Voltage Differential Signal

Digital monitors communication specification

Real Time Clock

Basic Input-Output System

Personal Computer

PCI Industrial Computer Manufacturers Group

Accelerated Hub Architecture

GMCH and ICH communication bus specification

Accelerated Graphics Port

Advanced Gunning Transceiver Logic

PSB (Processor Side Bus) signal exchange specification

System Management Bus

Electrically Erasable Programmable Read-Only Memory

Not And (electronic logic gate)

Flash memory specification

Solid State Disk

Plastic Leaded Chip Carrier

Random Access Memory Digital-to-Analog Converter

Digital-to-Analog Converter

Dynamic Video Memory Technology

Transistor-Transistor Logic

Extended Capabilities Port / Enhanced Parallel Port

Parallel port specifications

Floppy Disk Drive

Enhanced Integrated Drive Electronics

Mass storage devices interface

Direct Memory Access

Programmed Input/Output

EIDE: Directly processor controlled data exchange

Rear Input-Output Board

Auxiliary interface board, which is connected to the cPCI backplane rear connectors

Pulse-W idth Modulation

Cooling fan control technique

Electrostatically Sensitive Device

Electrostatic Discharge

Advanced Configuration and Power Interface

Power On Self Test

CompactPCI

Industrial automation systems standard

Electrical Overstress

Media Dependent Interface

Interface with connection type automatical detection

CPC1600

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