Tiva C Series TM4C123G LaunchPad Evaluation Kit User`s Manual

Tiva C Series TM4C123G LaunchPad Evaluation Kit User`s Manual

Tiva

C Series TM4C123G LaunchPad

Evaluation Board

User's Guide

Literature Number: SPMU296

April 2013

Contents

1

2

3

4

A

Board Overview

1.1

1.2

..................................................................................................................

4

Kit Contents

..................................................................................................................

5

Using the Tiva C Series LaunchPad

.....................................................................................

5

1.3

1.4

1.5

Features

......................................................................................................................

5

BoosterPacks

................................................................................................................

6

Specifications

................................................................................................................

6

Hardware Description

2.1

..........................................................................................................

7

Functional Description

......................................................................................................

7

2.1.1

Microcontroller

......................................................................................................

7

2.1.2

USB Connectivity

..................................................................................................

8

2.1.3

Motion Control

......................................................................................................

8

2.2

2.1.4

User Switches and RGB User LED

2.1.5

Headers and BoosterPacks

..............................................................................

9

.......................................................................................

9

Power Management

.......................................................................................................

11

2.2.1

Power Supplies

...................................................................................................

11

2.2.2

Hibernate

..........................................................................................................

11

2.3

2.2.3

Clocking

2.2.4

Reset

............................................................................................................

12

...............................................................................................................

12

In-Circuit Debug Interface (ICDI)

2.3.1

Virtual COM Port

........................................................................................

12

.................................................................................................

12

Software Development

3.1

3.2

.......................................................................................................

13

Software Description

Source Code

......................................................................................................

13

...............................................................................................................

13

3.3

3.4

Tool Options

................................................................................................................

13

Programming the Tiva C Series LaunchPad Evaluation Board

.....................................................

14

References, PCB Layout, and Bill of Materials

4.1

4.2

4.3

Bill of Materials (BOM)

......................................................................

15

References

.................................................................................................................

15

Component Locations

.....................................................................................................

16

....................................................................................................

17

Schematics

.......................................................................................................................

19

2

Contents

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List of Figures

1-1.

Tiva C Series TM4C123G LaunchPad Evaluation Board

..............................................................

4

2-1.

Tiva C Series LaunchPad Evaluation Board Block Diagram

..........................................................

7

4-1.

Tiva C Series LaunchPad Component Locations (Top View)

.......................................................

16

4-2.

Tiva C Series LaunchPad Dimensions

.................................................................................

17

List of Tables

1-1.

EK-TM4C123GXL Specifications

2-1.

USB Device Signals

.........................................................................................

6

........................................................................................................

8

2-2.

User Switches and RGB LED Signals

...................................................................................

9

2-3.

J1 Connector

................................................................................................................

9

2-4.

J2 Connector

...............................................................................................................

10

2-5.

J3 Connector

...............................................................................................................

10

2-6.

J4 Connector

...............................................................................................................

11

2-7.

In-Circuit Debug Interface (ICDI) Signals

..............................................................................

12

2-8.

Virtual COM Port Signals

.................................................................................................

12

4-1.

EK-TM4C123GXL Bill of Materials

.....................................................................................

17

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List of Figures

3

Chapter 1

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Board Overview

The Tiva™ C Series TM4C123G LaunchPad Evaluation Board ( EK-TM4C123GXL ) is a low-cost evaluation platform for ARM

®

Cortex™-M4F-based microcontrollers. The Tiva C Series LaunchPad design highlights the TM4C123GH6PMI microcontroller USB 2.0 device interface, hibernation module, and motion control pulse-width modulator (MC PWM) module. The Tiva C Series LaunchPad also features programmable user buttons and an RGB LED for custom applications. The stackable headers of the Tiva

C Series TM4C123G LaunchPad BoosterPack XL interface demonstrate how easy it is to expand the functionality of the Tiva C Series LaunchPad when interfacing to other peripherals on many existing

BoosterPack add-on boards as well as future products.

Figure 1-1

shows a photo of the Tiva C Series

LaunchPad.

Figure 1-1. Tiva C Series TM4C123G LaunchPad Evaluation Board

Power Select

Switch

USB Connector

(Power/ICDI)

Green Power LED

Tiva

TM4C123GH6PMI

Microcontroller

USB Micro-A/-B

Connector

(Device)

Tiva C Series

LaunchPad

BoosterPack XL

Interface (J1, J2, J3, and J4 Connectors)

MSP430

LaunchPad-Compatible

BoosterPack Interface

User Switch 1 User Switch 2

Tiva, MSP430, Code Composer Studio are trademarks of Texas Instruments.

Cortex is a trademark of ARM Limited.

ARM, RealView are registered trademarks of ARM Limited.

Microsoft, Windows are registered trademarks of Microsoft Corporation.

All other trademarks are the property of their respective owners.

4

Board Overview

Copyright © 2013, Texas Instruments Incorporated

Reset Switch

RGB User LED

Tiva C Series

LaunchPad

BoosterPack XL

Interface (J1, J2, J3, and J4 Connectors)

Tiva

TM4C123GH6PMI

Microcontroller

MSP430

LaunchPad-Compatible

BoosterPack Interface

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1.1

Kit Contents

The Tiva C Series TM4C123G LaunchPad Evaluation Kit contains the following items:

• Tiva C Series LaunchPad Evaluation Board (EK-TM4C123GXL)

• On-board In-Circuit Debug Interface (ICDI)

• USB micro-B plug to USB-A plug cable

• README First document

Kit Contents

1.2

Using the Tiva C Series LaunchPad

The recommended steps for using the Tiva C Series TM4C123G LaunchPad Evaluation Kit are:

1. Follow the README First document included in the kit. The README First document will help you get the Tiva C Series LaunchPad up and running in minutes. See the Tiva C Series LaunchPad web page for additional information to help you get started.

2. Experiment with LaunchPad BoosterPacks. A selection of Tiva C Series BoosterPacks and compatible MSP430™ BoosterPacks can be found at the TI MCU LaunchPad web page .

3. Take your first step toward developing an application with Project 0 using your preferred ARM

tool-chain and the Tiva C Series TivaWare Peripheral Driver Library. Software applications are

loaded using the on-board In-Circuit Debug Interface (ICDI). See

Chapter 3

, Software Development, for the programming procedure. The TivaWare for C Series Peripheral Driver Library Software

Reference Manual contains specific information on software structure and function. For more information on Project 0, go to the Tiva C Series LaunchPad wiki page .

4. Customize and integrate the hardware to suit an end application. This user's manual is an important reference for understanding circuit operation and completing hardware modification.

You can also view and download almost six hours of training material on configuring and using the

LaunchPad. Visit the Tiva C Series LaunchPad Workshop for more information and tutorials.

1.3

Features

Your Tiva C Series LaunchPad includes the following features:

• Tiva TM4C123GH6PMI microcontroller

• Motion control PWM

• USB micro-A and micro-B connector for USB device, host, and on-the-go (OTG) connectivity

• RGB user LED

• Two user switches (application/wake)

• Available I/O brought out to headers on a 0.1-in (2.54-mm) grid

• On-board ICDI

• Switch-selectable power sources:

– ICDI

– USB device

• Reset switch

• Preloaded RGB quickstart application

• Supported by TivaWare for C Series software including the USB library and the peripheral driver library

• Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface, which features stackable headers to expand the capabilities of the Tiva C Series LaunchPad development platform

– For a complete list of available BoosterPacks that can be used with the Tiva C Series LaunchPad, see the LaunchPad web page .

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Board Overview

5

BoosterPacks

www.ti.com

1.4

BoosterPacks

The Tiva C Series LaunchPad provides an easy and inexpensive way to develop applications with the

TM4C123GH6PM microcontroller. Tiva C Series BoosterPacks and MSP430 BoosterPacks expand the available peripherals and potential applications of the Tiva C Series LaunchPad. BoosterPacks can be used with the Tiva C Series LaunchPad or you can simply use the on-board TM4C123GH6PM microcontroller as its processor. See

Chapter 2

for more information.

Build your own BoosterPack and take advantage of Texas Instruments’ website to help promote it! From sharing a new idea or project, to designing, manufacturing, and selling your own BoosterPack kit, TI offers a variety of avenues for you to reach potential customers with your solutions.

1.5

Specifications

Table 1-1

summarizes the specifications for the Tiva C Series LaunchPad.

Table 1-1. EK-TM4C123GXL Specifications

Parameter

Board supply voltage

Dimensions

Break-out power output

RoHS status

Value

4.75 V

DC to 5.25 V

DC from one of the following sources:

• Debugger (ICDI) USB Micro-B cable (connected to a

PC)

• USB Device Micro-B cable (connected to a PC)

2.0 in x 2.25 in x 0.425 in (5.0 cm x 5.715 cm x 10.795

mm) (L x W x H)

• 3.3 V

DC

(300 mA max)

• 5.0 V

DC mA)

(depends on 3.3 V

DC usage, 23 mA to 323

Compliant

6

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Chapter 2

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Hardware Description

The Tiva C Series LaunchPad includes a TM4C123GH6PM microcontroller and an integrated ICDI as well as a range of useful peripheral features (as the block diagram in

Figure 2-1

shows). This chapter describes how these peripherals operate and interface to the microcontroller.

Figure 2-1. Tiva C Series LaunchPad Evaluation Board Block Diagram

Debug Breakout Pads

ICDI

USB Debug

Connector

JTAG/SWD

UART0

GPIO

TM4C123GH6PMI

I/O

GPIO

I/O

USB Device

Connector

USB

GPIO

Power Select

Switch RGB LED

VDD

HIB WAKE

GPIO

User

Switches

Power

Management

Breakout Pads

2.1

Functional Description

2.1.1 Microcontroller

The TM4C123GH6PM is a 32-bit ARM Cortex-M4-based microcontroller with 256-kB Flash memory, 32kB SRAM, and 80-MHz operation; USB host, device, and OTG connectivity; a Hibernation module and

PWM; and a wide range of other peripherals. See the TM4C123GH6PM microcontroller data sheet

(literature number SPMS376 ) for complete device details.

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Functional Description

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Most of the microcontroller signals are routed to 0.1-in (2.54-mm) pitch headers. An internal multiplexer allows different peripheral functions to be assigned to each of these GPIO pads. When adding external circuitry, consider the additional load on the evaluation board power rails.

The TM4C123GH6PM microcontroller is factory-programmed with a quickstart demo program. The quickstart program resides in on-chip Flash memory and runs each time power is applied, unless the quickstart application has been replaced with a user program.

2.1.2 USB Connectivity

The EK-TM4C123GXL is designed and functions as a USB device without hardware modification. The

USB device signals are dedicated to USB functionality and are not shared with the BoosterPack headers.

The USB device signals are listed in

Table 2-1

.

GPIO Pin

PD4

PD5

Table 2-1. USB Device Signals

Pin Function

USB0DM

USB0DP

USB Device

D–

D+

The TM4C123GH6PM target device is also capable of USB embedded host and on-the-go (OTG) functions. OTG functionality can be enabled by populating R25 and R29 with 0Ω resistors. These resistors connect the USB ID and USB V

BUS signals to PB0 and PB1. When these resistors are populated,

PB0 and PB1 must remain in the respective USB pin mode configurations to prevent device damage. PB0 and PB1 are also present on the J1 BoosterPack header. Therefore, if R25 or R29 are populated, care must be taken not to conflict these signals with BoosterPack signals.

USB embedded host operation can be enabled in the same way for USB devices that are self-powered.

Providing power when acting as a USB host requires a BoosterPack with power switching and appropriate connectors. All USB host signals are available on the BoosterPack interface except D+ and D–, which are only available on the USB micro-A/-B connector and the two adjacent test points.

When connected as a USB device, the evaluation board can be powered from either the ICDI or the USB

Device connectors. The user can select the power source by moving the POWER SELECT switch (SW3) to the Device position. See the Power Management schematic (appended to this document).

2.1.3 Motion Control

The EK-TM4C123GXL includes the Tiva C-Series Motion Control PWM technology, featuring two PWM modules capable of generating 16 PWM outputs. Each PWM module provides a great deal of flexibility and can generate simple PWM signals—for example, those required by a simple charge pump—as well as paired PWM signals with dead-band delays, such as those required by a half-H bridge driver. Three generator blocks can also generate the full six channels of gate controls required by a 3-phase inverter bridge.

Two quadrature encoder interfaces (QEI) are also available to provide motion control feedback. See the

Headers and BoosterPacks

section of this document for details about the availability of these signals on the BoosterPack interface.

8

Hardware Description

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Functional Description

2.1.4 User Switches and RGB User LED

The Tiva C Series LaunchPad comes with an RGB LED. This LED is used in the preloaded RGB quickstart application and can be configured for use in custom applications.

Two user buttons are included on the board. The user buttons are both used in the preloaded quickstart application to adjust the light spectrum of the RGB LED as well as go into and out of hibernation. The user buttons can be used for other purposes in the user’s custom application.

The evaluation board also has a green power LED.

Table 2-2

shows how these features are connected to the pins on the microcontroller.

Table 2-2. User Switches and RGB LED Signals

GPIO Pin

PF4

PF0

PF1

PF2

PF3

Pin Function

GPIO

GPIO

GPIO

GPIO

GPIO

USB Device

SW1

SW2

RGB LED (Red)

RGB LED (Blue)

RGD LED (Green)

2.1.5 Headers and BoosterPacks

The two double rows of stackable headers are mapped to most of the GPIO pins of the TM4C123GH6PM microcontroller. These rows are labeled as connectors J1, J2, J3, and J4. Connectors J3 and J4 are located 0.1 in (2.54 mm) inside of the J1 and J2 connectors. All 40 header pins of the J1, J2, J3, and J4 connectors make up the Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface.

Table 2-3

through

Table 2-6

show how these header pins are connected to the microcontroller pins and which GPIO functions can be selected.

NOTE:

To configure the device peripherals easily and intuitively using a graphical user interface

(GUI), see the Tiva C Series Pinmux Utility found at www.ti.com/tool/lm4f_pinmux . This easyto-use interface makes setting up alternate functions for GPIOs simple and error-free.

Table 2-3. J1 Connector

(1)

J1 Pin GPIO

Analog

Function

GPIO

AMSEL

Onboard

Function

Tiva C

Series

MCU

Pin

1 2 3 4

GPIOPCTL Register Setting

5

1.01

1.02

1.03

1.04

1.05

1.06

1.07

1.08

1.09

PB5

PB0

PB1

PE4

PE5

PB4

PA5

PA6

AIN11

USB0ID

USB0VBUS

AIN9

AIN8

AIN10

57

45

46

59

60

58

22

23

U1Rx

U1Tx

U5Rx

U5Tx

SSI2Fss

SSI2Clk

SSI0Tx

3.3 V

M0PWM3

I2C2SCL M0PWM4 M1PWM2

I2C2SDA M0PWM5 M1PWM3

I2C1SCL

M0PWM2

M1PWM2

(1)

1.10

PA7 – – 24 – – I2C1SDA – M1PWM3

Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.

6

7

T1CCP1

T2CCP0

T2CCP1

T1CCP0

8

CAN0Tx

CAN0Rx

CAN0Tx

CAN0Rx

9

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Functional Description

Table 2-4. J2 Connector

(1)

J2

Pin

GPIO

Analog

Function

GPIO

AMSEL

On-board

Function

Tiva C

Series

MCU

Pin

1 2 3 4

GPIOPCTL Register Setting

5 6

2.01

2.02

2.03

2.04

PB2

PE0

PF0

AIN3

USR_SW2/

WAKE (R1)

47

9

28

U7Rx

U1RTS

SSI1Rx

GND

I2C0SCL

CAN0Rx

M1PWM4 PhA0

2.05

2.06

PB7

PD1

AIN6

Connected for MSP430

Compatibility

(R10)

4

62

– SSI2Tx

RESET

– M0PWM1 –

SSI3Fss SSI1Fss I2C3SDA M0PWM7 M1PWM1

(1)

2.07

2.08

2.09

2.10

PB6

PD0

PA4

PA3

PA2

AIN7

Connected for MSP430

Compatibility

(R9)

1

61

21

20

19

SSI3Clk

SSI2Rx – M0PWM0 –

SSI1Clk I2C3SCL M0PWM6 M1PWM0

SSI0Rx

SSI0Fss

SSI0Clk

Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.

7

T3CCP0

T0CCP0

T0CCP1

WT2CCP1

T0CCP0

WT2CCP0

8

NMI

9

C0o

– www.ti.com

14 15

J3

Pin

GPIO

Analog

Function

GPIO

AMSEL

3.01

3.02

3.03

PD0

PB6

AIN7

3.04

PD1

PB7

AIN6

On-board

Function

Connected for MSP430

Compatibilit y (R9)

Connected for MSP430

Compatibilit y (R10)

Tiva C

Series

MCU

Pin

61

1

92

4

3.05

PD2 AIN5 63

1

SSI3Clk

SSI3Fss

SSI3Rx

Table 2-5. J3 Connector

(1)

GPIOPCTL Register Setting

2 3 4

5.0 V

GND

SSI1Clk I2C3SCL M0PWM6

SSI2Rx – M0PWM0

SSI1Fss I2C3SDA M0PWM7

SSI2Tx – M0PWM1

SSI1Rx – M0FAULT0

5

M1PWM0

M1PWM1

3.06

PD3

3.07

PE1

3.08

PE2

3.09

PE3

AIN4

AIN2

AIN1

AIN0

64

8

7

6

SSI3Tx

U7Tx

SSI1Tx

3.10

PF1

(1)

– – 29 U1CTS SSI1Tx – – M1PWM5

Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.

6

7

WT2CCP0

T0CCP0

WT2CCP1

T0CCP1

8

9

14

15

WT3CCP0 USB0EPE

N

WT3CCP1 USB0PFLT

T0CCP1

C1o TRD1 –

10

Hardware Description

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J4

Pin

GPIO

4.01

PF2

4.02

PF3

4.03

4.04

4.05

4.06

PB3

PC4

PC5

PC6

4.07

4.08

4.09

4.10

PC7

PD6

PD7

PF4

Analog

Function

GPIO

AMSEL

C0–

C1–

C1+

C0+

Power Management

Table 2-6. J4 Connector

Onboard

Function

Blue LED

(R11)

Green

LED

(R12)

Tiva C

Series

MCU

Pin

30

31

48

16

15

14

1

U4Rx

U4Tx

U3Rx

2

SSI1Clk

3

SSI1Fss CAN0Tx

U1Rx

U1Tx

USR_SW

1 (R13)

13

53

10

5

U3Tx

U2Rx

U2Tx

4

M0FAULT0

GPIOPCTL Register Setting

5

M1PWM6

M1PWM7

6

7

T1CCP0

T1CCP1

8

9

14

I2C0SDA

M0PWM6

M0PWM7

M1FAULT0

IDX1

PhA1

PhB1

PhA0

PhB0

IDX0

T3CCP1

WT0CCP0

WT0CCP1

U1RTS

U1CTS

WT1CCP0 USB0EPE –

N

WT1CCP1 USB0PFLT –

WT5CCP0

WT5CCP1

T2CCP0

NMI

USB0EPE

N

15

TRD0

TRCLK

Connectors J1 and J2 of the Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface provide compatibility with MSP430 LaunchPad BoosterPacks. Highlighted functions (shaded cells) in

Table 2-3

through

Table 2-5

indicate configuration for compatibility with the MSP430 LaunchPad.

A complete list of Tiva C Series BoosterPacks and Tiva C Series LaunchPad-compatible MSP430

BoosterPacks is available at www.ti.com/tm4c123g-launchpad .

2.2

Power Management

2.2.1 Power Supplies

The Tiva C Series LaunchPad can be powered from one of two power sources:

• On-board ICDI USB cable (Debug, Default)

• USB device cable (Device)

The POWER SELECT switch (SW3) is used to select one of the two power sources. Select only one source at a time.

2.2.2 Hibernate

(1)

The Tiva C Series LaunchPad provides an external 32.768-kHz crystal (Y1) as the clock source for the

TM4C123GH6PM Hibernation module clock source. The current draw while in Hibernate mode can be measured by making some minor adjustments to the Tiva C Series LaunchPad. This procedure is explained in more detail later in this section.

The conditions that can generate a wake signal to the Hibernate module on the Tiva C Series LaunchPad are waking on a Real-time Clock (RTC) match and/or waking on assertion of the WAKE pin.

(1)

The second user switch (SW2) is connected to the WAKE pin on the microcontroller. The WAKE pin, as well as the

V

DD and HIB pins, are easily accessible through breakout pads on the Tiva C Series LaunchPad. See the appended schematics for details.

spacer spacer spacer spacer

If the board does not turn on when you connect it to a power source, the microcontroller might be in Hibernate mode (depending on the programmed application). You must satisfy one of the programmed wake conditions and connect the power to bring the microcontroller out of Hibernate mode and turn on the board.

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11

In-Circuit Debug Interface (ICDI)

www.ti.com

There is no external battery source on the Tiva C Series LaunchPad Hibernation module, which means the VDD3ON power control mechanism should be used. This mechanism uses internal switches to remove power from the Cortex-M4 processor as well as to most analog and digital functions while retaining I/O pin power.

To measure the Hibernation mode current or the Run mode current, the VDD jumper that connects the 3.3

V pin and the MCU_PWR pin must be removed. See the complete schematics (appended to this document) for details on these pins and component locations. An ammeter should then be placed between the 3.3 V pin and the MCU_PWR pin to measure I

DD microcontroller uses V

DD as its power source during V

DD3ON

(or I

HIB_VDD3ON

). The TM4C123GH6PM

Hibernation mode, so I

DD is the Hibernation mode (VDD3ON mode) current. This measurement can also be taken during Run mode, which measures

I

DD the microcontroller running current.

2.2.3 Clocking

The Tiva C Series LaunchPad uses a 16.0-MHz crystal (Y2) to complete the TM4C123GH6PM microcontroller main internal clock circuit. An internal PLL, configured in software, multiples this clock to higher frequencies for core and peripheral timing.

The Hibernation module is clocked from an external 32.768-KHz crystal (Y1).

2.2.4 Reset

The RESET signal into the TM4C123GH6PM microcontroller connects to the RESET switch and to the

ICDI circuit for a debugger-controlled reset.

External reset is asserted (active low) under any of three conditions:

• Power-on reset (filtered by an R-C network)

• RESET switch held down

• By the ICDI circuit when instructed by the debugger (this capability is optional, and may not be supported by all debuggers)

2.3

In-Circuit Debug Interface (ICDI)

The Tiva C Series LaunchPad evaluation board comes with an on-board In-Circuit Debug Interface (ICDI).

The ICDI allows for the programming and debug of the TM4C123GH6PM using the LM Flash Programmer and/or any of the supported tool chains. Note that the ICDI supports only JTAG debugging. An external debug interface can be connected for Serial Wire Debug (SWD) and SWO (trace).

Table 2-7

shows the pins used for JTAG and SWD. These signals are also mapped out to easily accessible breakout pads and headers on the board.

Table 2-7. In-Circuit Debug Interface (ICDI) Signals

GPIO Pin

PC0

PC1

PC2

PC3

Pin Function

TCK/SWCLK

TMS/SWDIO

TDI

TDO/SWO

2.3.1 Virtual COM Port

When plugged in to a PC, the device enumerates as a debugger and a virtual COM port.

Table 2-8

shows the connections for the COM port to the pins on the microcontroller.

Table 2-8. Virtual COM Port Signals

GPIO Pin

PA0

PA1

Pin Function

U0RX

U0TX

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Chapter 3

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Software Development

This chapter provides general information on software development as well as instructions for Flash memory programming.

3.1

Software Description

The TivaWare software provided with the Tiva C Series LaunchPad provides access to all of the peripheral devices supplied in the design. The Tiva C Series Peripheral Driver Library is used to operate the on-chip peripherals as part of TivaWare.

TivaWare includes a set of example applications that use the TivaWare Peripheral Driver Library. These applications demonstrate the capabilities of the TM4C123GH6PM microcontroller, as well as provide a starting point for the development of the final application for use on the Tiva C Series LaunchPad evaluation board.

3.2

Source Code

The complete source code including the source code installation instructions are provided at www.ti.com/tm4c123g-launchpad . The source code and binary files are installed in the DriverLib tree.

3.3

Tool Options

The source code installation includes directories containing projects and/or makefiles for the following toolchains:

• Keil ARM RealView

®

Microcontroller Development System

• IAR Embedded Workbench for ARM

• Sourcery CodeBench

• Texas Instruments' Code Composer Studio™ IDE

Download evaluation versions of these tools from the TI website. Due to code size restrictions, the evaluation tools may not build all example programs. A full license is necessary to re-build or debug all examples.

Instructions on installing and using each of the evaluation tools can be found in the Quickstart guides (for example, Quickstart-Keil, Quickstart-IAR) which are available for download from the evaluation kit section of the TI website at www.ti.com/tiva-c .

For detailed information on using the tools, see the documentation included in the tool chain installation or visit the respective web site of the tool supplier.

SPMU296 – April 2013

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Copyright © 2013, Texas Instruments Incorporated

Software Development

13

Programming the Tiva C Series LaunchPad Evaluation Board

www.ti.com

3.4

Programming the Tiva C Series LaunchPad Evaluation Board

The Tiva C Series LaunchPad software package includes pre-built binaries for each of the example applications. If you have installed TivaWare to the default installation path of

C:\ti\TivaWare_C_Series_<version>, you can find the example applications in

C:\ti\TivaWare_C_Series_<version>\examples\boards\ek-tm4c123gxl . The on-board ICDI is used with the

LM Flash Programmer tool to program applications on the Tiva C Series LaunchPad.

Follow these steps to program example applications into the Tiva C Series LaunchPad evaluation board using the ICDI:

1. Install LM Flash Programmer on a PC running Microsoft

®

Windows

®

.

2. Switch the POWER SELECT switch to the right for Debug mode.

3. Connect the USB-A cable plug to an available port on the PC and the Micro-B plug to the Debug USB port on the board.

4. Verify that the POWER LED D4 on the board is lit.

5. Run the LM Flash Programmer.

6. In the Configuration tab, use the Quick Set control to select the EK-TM4C123GXL evaluation board.

7. Move to the Program tab and click the Browse button. Navigate to the example applications directory

(the default location is C:\ti\TivaWare_C_Series_<version>\examples\boards\ek-tm4c123gxl ).

8. Each example application has its own directory. Navigate to the example directory that you want to load and then into the directory which contains the binary (*.bin) files. Select the binary file and click

Open.

9. Set the Erase Method to Erase Necessary Pages, check the Verify After Program box, and check

Reset MCU After Program.

Program execution starts once the Verify process is complete.

14

Software Development

Copyright © 2013, Texas Instruments Incorporated

SPMU296 – April 2013

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Chapter 4

SPMU296 – April 2013

References, PCB Layout, and Bill of Materials

4.1

References

In addition to this document, the following references are available for download at www.ti.com

:

• Tiva C Series TM4C123GH6PM Microcontroller Data Sheet (literature number SPMS376 ).

• LM Flash Programmer tool. Available for download at www.ti.com/tool/lmflashprogrammer .

• TivaWare for C Series Driver Library. Available for download at www.ti.com/tool/sw-tm4c-drl .

• TivaWare for C Series Driver Library User’s Manual (literature number SPMU298 ).

• TPS73633 Low-Dropout Regulator with Reverse Current Protection Data Sheet (literature number

SBVS038 )

• Texas Instruments’ Code Composer Studio IDE website: www.ti.com/ccs

Additional support:

• RealView MDK ( www.keil.com/arm/rvmdkkit.asp

)

• IAR Embedded Workbench ( www.iar.com

).

• Sourcery CodeBench development tools ( www.codesourcery.com/gnu_toolchains/arm ).

SPMU296 – April 2013

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References, PCB Layout, and Bill of Materials

Copyright © 2013, Texas Instruments Incorporated

15

Component Locations

www.ti.com

4.2

Component Locations

Plots of the top-side component locations are shown in

Figure 4-1

and the board dimensions are shown in

Figure 4-2 .

Figure 4-1. Tiva C Series LaunchPad Component Locations (Top View)

16

References, PCB Layout, and Bill of Materials

Copyright © 2013, Texas Instruments Incorporated

SPMU296 – April 2013

Submit Documentation Feedback

www.ti.com

Figure 4-2. Tiva C Series LaunchPad Dimensions

Bill of Materials (BOM)

NOTE:

Units are in mils (one thousandth of an inch): 1 mil = 0.001 inch (0.0254 mm).

4.3

Bill of Materials (BOM)

Table 4-1

shows the bill of materials for the EK-TM4C123GXL evaluation board.

Item

1

2

3

4

5

6

7

8

9

10

11

Ref Des

C1-2, C7, C12, C14

C25-26, C31-32

C28-29

C3, C5, C8, C15,

C18-19, C21

C4, C6, C10-11, C17,

C20, C23-24

C9, C22

D1

D4

H24

H25

J1, J3

Table 4-1. EK-TM4C123GXL Bill of Materials

Qty

5

4

2

7

8

2

1

1

1

1

2

Description

Capacitor, 10 pF, 50 V, 5%,

NPO/COG, 0402

Manufacturer Manufacturer Part No

Capacitor, 0402, X5R, 10 V, Low Johanson Dielectrics 100R07X105KV4T

ESR Inc

Murata GRM1555C1H100JZ01D

Capacitor, 24 pF, 50 V, 5%,

NPO/COG, 0402

Capacitor, 0.01

μ F 25 V, 10%

0402 X7R

TDK

Taiyo Yuden

C1005C0G1H240J

TMK105B7103KV-F

EMK105B7104KV-F Capacitor, 0.1

μ F 16 V, 10% 0402 Taiyo Yuden

X7R

Murata Capacitor, 2.2

μ F, 16 V, 10%,

0603, X5R

LED, Tri-Color RGB, 0404 SMD

Common Anode

Everlight

Lite-On LED, Green 565 nm, Clear 0805

SMD

Header, 1x2, 0.100, T-Hole,

Vertical Unshrouded, 0.220 Mate

3M

FCI

Sullins Jumper, 0.100, Gold, Black,

Closed

Header, 2x10, T-Hole Vertical unshrouded stacking

Samtec

GRM188R61C225KE15D

18-038/RSGHBHC1-S02/2T

LTST-C171GKT

961102-6404-AR

68001-102HLF

SPC02SYAN

SSW-110-23-S-D

SPMU296 – April 2013

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References, PCB Layout, and Bill of Materials

Copyright © 2013, Texas Instruments Incorporated

17

26

27

28

29

30

31

22

23

24

25

17

18

19

20

21

14

15

16

Bill of Materials (BOM)

Item

12

13 www.ti.com

J11

J2, J4

J9

Ref Des

Q1-3

R1-2, R9-16, R20,

R26

R18-19, R21-23, R28

Table 4-1. EK-TM4C123GXL Bill of Materials (continued)

Qty

1

2

1

Description

USB Connector, Micro B Recept

RA SMT BTTM MNT

Header, 1x2, 0.100, SMT,

Horizontal Unshrouded, 0.230

Mate

Manufacturer

Hirose

Samtec

4UCON

Major League

Electronics

Hirose

3

12

USB Connector, Micro A/B

Receptacle SMD

NPN SC70 pre-biased

Resistor, 0 Ω 1/10W 0603 SMD

Diodes Inc

Panasonic

6

R3-5, R8, R27

R31

RESET SW1, SW2

SW3

U1, U2

U8

Y1

Y2, Y5

C31, C34

D2

R17

R24

R25, R29-30

U4

1

3

1

1

1

2

5

1

3

1

2

2

1

1

Resistor, 10 k Ω , 1/10W, 5%, 0402 Yageo

Thick Film

Resistor, 330 Ω , 1/10W, 5%, 0402 Yageo

Resistor, 1 M Ω 1/10W, 5%, 0402 Rohm

Switch, Tact 6 mm SMT, 160gf Omron

Switch, DPDT, SMT 300 mA × 2 at C K Components

6 V

Tiva C Series MCU

TM4C123GH6PM

Texas Instruments

Regulator, 3.3 V, 400 mA, LDO

Crystal, 32.768 kHz Radial Can

Texas Instruments

Abracon

Crystal, 16.00 MHz 5.0x3.2mm

SMT

NDK

Abracon

PCB Do Not Populate List

(Shown for information only)

Capacitor, 0.1

μ F 16 V, 10% 0402 Taiyo Yuden

X7R

Diode, Dual Schottky, SC70,

BAS70 Common Cathode

Diodes Inc

Resistor, 10 k Ω 1/10W 5%, 0402 Yageo

Thick Film

Resistor, 330 Ω , 1/10W, 5%, 0402 Yageo

Resistor, 0 Ω , 1/10W 0603 Panasonic

IC, Single Voltage Supervisor, 5V, Texas Instruments

DBV

Manufacturer Part No

ZX62-B-5PA

TSM-110-01-S-DH-A-P-TR

10995

TSHSM-110-D-02-T-H-AP-

TR-P-LF

ZX62-AB-5PA

DTC114EET1G

ERJ-3GEY0R00V

RC0402FR-0710KL

RC0402FR-07330RL

MCR01MRTF1004

B3S-1000

JS202011SCQN

TM4C123GH6PMI

TPS73633DRBT

AB26TRB-32.768KHZ- T

NX5032GA-16.000000 MHz

ABM3-16.000 MHz-B2- T

EMK105B7104KV-F

BAS70W-05-7-F

RC0402FR-0710KL

RC0402FR-07330RL

ERJ-3GEY0R00V

TLV803MDBZR

18

References, PCB Layout, and Bill of Materials

Copyright © 2013, Texas Instruments Incorporated

SPMU296 – April 2013

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This section contains the complete schematics for the Tiva C Series LaunchPad board.

• Microcontroller, USB, Expansion, Buttons, and LED

• Power Management

• In-Circuit Debug Interface

Appendix A

SPMU296 – April 2013

Schematics

SPMU296 – April 2013

Submit Documentation Feedback

Copyright © 2013, Texas Instruments Incorporated

Schematics

19

DEBUG/VCOM

PA0/U0RX_VCP_TXD

PA1/U0TX_VCP_RXD

GPIO

PA2

PA3

PA4

PA5

PA6

PA7

DEBUG_PC0/TCK/SWCLK

DEBUG_PC1/TMS/SWDIO

DEBUG_PC2/TDI

DEBUG_PC3/TDO/SWO

PC4

PC5

PC6

PC7

PE0

PE1

PE2

PE3

PE4

PE5

17

18

19

20

21

22

23

24

6

59

60

9

8

7

52

51

50

49

16

15

14

13

U1-A

PC0

PC1

PC2

PC3

PC4

PC5

PC6

PC7

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

PE0

PE1

PE2

PE3

PE4

PE5

TM4C123G

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PD0

PD1

PD2

PD3

PD4

PD5

PD6

PD7

PF0

PF1

PF2

PF3

PF4

28

29

30

31

5

61

62

63

64

43

44

53

10

45

46

47

48

1

4

58

57

PD0

PD1

PD2

PD3

USB_DM

USB_DP

PD6

PD7

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PF0

PF1

PF2

PF3

PF4

GPIO

0

0

0

0

0

R1

R2

R11

R12

R13

USR_SW2

LED_R

LED_B

LED_G

USR_SW1

9

8

PB0

USB_DP

USB_DM

0

R25

J9

CON-USB-MICROAB

7

6

+USB_VBUS

0

R14

0

R29

PB1

PD0

PD1

0

R9

0

R10

PB6

PB7

SW1

USR_SW1

LED_R

LED_G

LED_B

B

B

B

C

R3

330

Q1

DTC114EET1G

E

C

R5

330

Q3

DTC114EET1G

E

C

R4

330

Q2

DTC114EET1G

E

+VBUS

2

R

3

G

4

B

D1

A

1

RGB_LED_0404_COMA

WAKE

USR_SW2

R8

330

SW2

DESIGNER

DGT

PROJECT

Tiva TM4C123G LaunchPad

DESCRIPTION

REVISION

0.3

J1 and J2 provide compatability with

Booster Packs designed for MSP430 Launchpad

J3 and J4 sit 100 mils inside J1 and J2 to provide extended functions specific to this board.

See the board user manual for complete table of pin mux functions

GPIO

J1

5

6

7

8

9

10

1

2

3

4

CON_110_100

+3.3V

PB5

PB0

PB1

PE4

PE5

PB4

PA5

PA6

PA7

PB2

PE0

PF0

PB7

PB6

PA4

PA3

PA2

TARGETRST

J2

7

8

9

10

5

6

1

2

3

4

CON_110_100

+VBUS

J3

3

4

1

2

5

6

7

8

9

10

CON_110_100

PD0

PD1

PD2

PD3

PE1

PE2

PE3

PF1

PF2

PF3

PB3

PC4

PC5

PC6

PC7

PD6

PD7

PF4

J4

8

9

10

3

4

1

2

5

6

7

CON_110_100

DATE

2/20/2013

TEXAS INSTRUMENTS

R

TIVA MICROCONTROLLERS

108 WILD BASIN ROAD, SUITE 350

AUSTIN TX, 78746 www.ti.com

Microcontroller, USB, Expansion, Buttons and LED

FILENAME

EK-TM4C123GXL Rev A.sch

PART NO.

EK-TM4C123GXL

SHEET

1 OF 3

+USB_VBUS

H18

+ICDI_VBUS

H19

6

4

Power Select

SW3

1

2

3

5

+VBUS

+VBUS

H17 H23

+3.3V 400mA Regulator

8

U8

TPS73633DRB

IN OUT

5

EN NR

GND PAD

1

3

C14

1.0uF

H22

C18

0.01uF

+3.3V

+VBUS

+3.3V

R17

10k

TLV803

3

RESET

VDD

GND

2

1

U4

3

K

D2

A

1

A

2

OMIT this SVS Section for Tiva. Errata Fixed

TARGETRST

ICDI_RST

+MCU_PWR

RESET

RESET

R28

10k

C13

0.1uF

OMIT

H20

Y2

16MHz

C31

10pF

C32

10pF

32.768Khz

Y1

TARGETRST

38

41

40

34

35

36

3

12

27

39

55

RESET

OSC1

OSC0

XOSC0

GNDX

XOSC1

GNDA

U1-B

WAKE

VDD

VDD

VDD

VDD

32

HIB

33

VBAT

37

VDDA

2

11

26

42

54

GND

GND

GND

GND

VDDC

VDDC

25

56

TM4C123G

H21

WAKE

HIB

H24 and H25 installed as a single 1x2 header on 100 mil center with jumper

+MCU_PWR

H24 H25

+3.3V

0

R30

OMIT

C3

0.01uF

C4

0.1uF

C10

0.1uF

C11

0.1uF

C5

0.01uF

C6

0.1uF

+MCU_VDDC

C8

0.01uF

C7

1.0uF

C12

1.0uF

C22

2.2uF

H13 H10

H11 H12

DESIGNER

DGT

REVISION

0.3

PROJECT

Tiva Launchpad

DESCRIPTION

DATE

2/20/2013

Power Management

FILENAME

EK-TM4C123GXL Rev A.sch

TEXAS INSTRUMENTS

R

TIVA MICROCONTROLLERS

108 WILD BASIN ROAD, SUITE 350

AUSTIN TX, 78746 www.ti.com

PART NO.

EK-TM4C123GXL

SHEET

2 OF 3

ICDI_RST

+3.3V

R19

10k

C34

0.1uF

OMIT

Y5

16MHz

C25

10pF

C26

10pF

DEBUG/VCOM

PA1/U0TX_VCP_RXD

PA0/U0RX_VCP_TXD

+MCU_PWR

R18

10k

DEBUG_PC0/TCK/SWCLK

DEBUG_PC1/TMS/SWDIO

DEBUG_PC3/TDO/SWO

DEBUG_PC2/TDI

TARGETRST

EXTDBG

+3.3V

R23

10k

H14

R21

10k

R22

10k

ICDI_TCK

ICDI_TMS

ICDI_TDI

ICDI_TDO

+3.3V

38

41

40

34

35

36

3

12

27

39

55

RESET

OSC1

OSC0

XOSC0

GNDX

XOSC1

GNDA

U2-B

WAKE

32

HIB

33

VBAT

37

VDDA

2

VDD

VDD

VDD

VDD

11

26

42

54

GND

GND

GND

GND

VDDC

VDDC

25

56

TM4C123G

+3.3V

C15

0.01uF

C17

0.1uF

C19

0.01uF

C20

0.1uF

C21

0.01uF

C1

1.0uF

C23

0.1uF

C24

0.1uF

C2

1.0uF

C9

2.2uF

In-Circuit Debug Interface (ICDI)

+3.3V

U2-A

17

18

19

20

21

22

23

24

52

51

50

49

16

15

14

13

6

59

60

9

8

7

PE0

PE1

PE2

PE3

PE4

PE5

PC0

PC1

PC2

PC3

PC4

PC5

PC6

PC7

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

TM4C123G

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PD0

PD1

PD2

PD3

PD4

PD5

PD6

PD7

PF0

PF1

PF2

PF3

PF4

28

29

30

31

5

61

62

63

64

43

44

53

10

45

46

47

48

1

4

58

57

R24

330

DEBUG_PC3/TDO/SWO

DEBUG_PC1/TMS/SWDIO

DEBUG_PC0/TCK/SWCLK

+ICDI_VBUS

4

5

2

3

1

VB

D-

D+

ID

G

0

R16

ICDI_TCK

ICDI_TMS

3

2

5

4

1

ICDI JTAG

J5

8

9

6

7

10

TC2050-IDC-NL

ICDI_TDO

ICDI_TDI

ICDI_RST

DESIGNER

DGT

REVISION

0.3

PROJECT

Tiva TM4C123G LaunchPad

DATE

2/20/2013

DESCRIPTION

In Circuit Debug Interface

FILENAME

EK-TM4C123GXL Rev A.sch

TEXAS INSTRUMENTS

R

TIVA MICROCONTROLLERS

108 WILD BASIN ROAD, SUITE 350

AUSTIN TX, 78746 www.ti.com

PART NO.

EK-TM4C123GXL

SHEET

3 OF 3

EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS

Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods.

Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO

BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF

MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH

ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL

DAMAGES.

Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or contact TI.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein.

REGULATORY COMPLIANCE INFORMATION

As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal

Communications Commission (FCC) and Industry Canada (IC) rules.

For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,

DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.

General Statement for EVMs including a radio

User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization.

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant

Caution

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

FCC Interference Statement for Class A EVM devices

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.

These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.

FCC Interference Statement for Class B EVM devices

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.

These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

For EVMs annotated as IC – INDUSTRY CANADA Compliant

This Class A or B digital apparatus complies with Canadian ICES-003.

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

Concerning EVMs including radio transmitters

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Concerning EVMs including detachable antennas

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.

This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.

Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement.

Concernant les EVMs avec appareils radio

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente

(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.

Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

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Important Notice for Users of this Product in Japan

This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan

If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:

1.

Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and

Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of

Japan,

2.

Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product, or

3.

Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.

Texas Instruments Japan Limited

(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan

http://www.tij.co.jp

【ご使用にあたっての注】

本開発キットは技術基準適合証明を受けておりません。

本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。

1.

電波法施行規則第 6 条第 1 項第 1 号に基づく平成 18 年 3 月 28 日総務省告示第 173 号で定められた電波暗室等の試験設備でご使用いただく。

2.

実験局の免許を取得後ご使用いただく。

3.

技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

   上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。

日本テキサス・インスツルメンツ株式会社

東京都新宿区西新宿6丁目24番1号

西新宿三井ビル http://www.tij.co.jp

EVALUATION BOARD/KIT/MODULE (EVM)

WARNINGS, RESTRICTIONS AND DISCLAIMERS

For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end product.

Your Sole Responsibility and Risk. You acknowledge, represent and agree that:

1.

You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug

Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.

2.

You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard.

3.

You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to perform as described or expected.

4.

You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.

Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the

EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs.

Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.

Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate

Assurance and Indemnity Agreement.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2013, Texas Instruments Incorporated

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio

Amplifiers

Data Converters

DLP® Products

DSP

Clocks and Timers

Interface

Logic

Power Mgmt

Microcontrollers

RFID

OMAP Applications Processors

Wireless Connectivity www.ti.com/audio amplifier.ti.com

dataconverter.ti.com

www.dlp.com

dsp.ti.com

www.ti.com/clocks interface.ti.com

logic.ti.com

power.ti.com

microcontroller.ti.com

www.ti-rfid.com

www.ti.com/omap

Automotive and Transportation www.ti.com/automotive

Communications and Telecom www.ti.com/communications

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

Medical

Security www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security

Space, Avionics and Defense www.ti.com/space-avionics-defense

Video and Imaging

TI E2E Community

www.ti.com/wirelessconnectivity www.ti.com/video e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2013, Texas Instruments Incorporated

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