TB-FMCH-3GSDI2A Hardware User Manual

TB-FMCH-3GSDI2A Hardware Specification
TB-FMCH-3GSDI2A
Hardware User Manual
Rev.1.02
Rev.1.02
1
TB-FMCH-3GSDI2A Hardware Specification
Revision History
Version
Date
Description
Publisher
Rev.1.00
2012/11/20
Initial Release
Rev.1.01
2013/01/09
Modify Table 4-4,Table 5-1
Amano
Rev.1.02
2014/04/15
Add EC Declaration of Conformity
Amano
Rev.1.02
Yoshioka
2
TB-FMCH-3GSDI2A Hardware Specification
Table of Contents
1.
2.
3.
4.
5.
Related Documents and Board Accessories ............................................................................... 9
Overview ...................................................................................................................................... 9
Feature ........................................................................................................................................ 9
TB-FMCH-3GSDI2A Board Description .................................................................................... 10
4.1.
Block Diagram .......................................................................................................................... 10
4.2.
External View of the Board ........................................................................................................11
4.3.
Board Specification .................................................................................................................. 12
4.4.
Coaxial Connector .................................................................................................................... 13
4.5.
Analog Video Sync Input .......................................................................................................... 13
4.6.
3G/HD/SD SDI input/output ..................................................................................................... 14
4.7.
Video Clock Generator ............................................................................................................. 15
4.8.
Clock Selector .......................................................................................................................... 16
4.9.
IO voltage ................................................................................................................................. 17
4.10.
FMC Connector to Carrier board ............................................................................................. 18
4.11.
FMC Connector to Stack-up 3GSDI2 board............................................................................. 26
4.12.
LED Display ............................................................................................................................. 26
Stack-up configuration ............................................................................................................... 27
Rev.1.02
3
TB-FMCH-3GSDI2A Hardware Specification
List of Figures
Figure 3-1 FMC Connector Pin Assignment....................................................................................... 9
Figure 4-1 Block Diagram ................................................................................................................ 10
Figure 4-2 External View of the Board (component side) .................................................................11
Figure 4-3 External View of the Board (solder side) .........................................................................11
Figure 4-4 TB-FMCH-3GSDI2A Board Dimensions ......................................................................... 12
Figure 4-5 Peripheral Circuit of the Analog Video Sync Input .......................................................... 13
Figure 4-6 Peripheral Circuit of 3G/HD/SD SDI Input / Output ........................................................ 14
Figure 4-7 Peripheral Circuit of a Video Clock Generator ................................................................ 15
Figure 4-8 Clock Selector Circuit ..................................................................................................... 16
Figure 4-9 Level Shifter circuit 1 ...................................................................................................... 17
Figure 4-10 Level Shifter circuit 2 .................................................................................................... 17
Figure 5-1 Connection of stack-up board ......................................................................................... 27
List of Tables
Table 4-1 Coaxial Connector Pin Assignment .................................................................................. 13
Table 4-2 Carrier board FMC Connector Signal Settings ................................................................. 16
Table 4-3 Select signals pin assign of FMC ..................................................................................... 16
Table 4-4 Carrier board FMC Connector Pin Assignments .............................................................. 18
Table 4-5 LED Status Display ........................................................................................................... 26
Table 5-1 Mezzanine board FMC Connector Pin Assignments........................................................ 28
Rev.1.02
4
TB-FMCH-3GSDI2A Hardware Specification
Introduction
Thank you for purchasing the TB-FMCH-3GSDI2A board.
Before using the product, be sure to
carefully read this user manual and fully understand how to correctly use the product.
First read
through this manual, then always keep it handy.
SAFETY PRECAUTIONS
Observe the instructions
Observe the precautions listed below to prevent injuries to you or other personnel or damage to property.
●Before using the product, read these safety precautions carefully to assure correct use.
●These precautions contain serious safety instructions that must be observed.
●After reading through this manual, be sure to always keep it handy.
The following conventions are used to indicate the possibility of injury/damage and classify precautions if
the product is handled incorrectly.
Danger
Indicates the high possibility of serious injury or death if the product is handled
incorrectly.
Warning
Indicates the possibility of serious injury or death if the product is handled
incorrectly.
Caution
Indicates the possibility of injury or physical damage in connection with houses or
household goods if the product is handled incorrectly.
The following graphical symbols are used to indicate and classify precautions in this manual.
(Examples)
Turn off the power switch.
Do not disassemble the product.
!
Rev.1.02
Do not attempt this.
5
TB-FMCH-3GSDI2A Hardware Specification
Warning
In the event of a failure, disconnect the power supply.
If the product is used as is, a fire or electric shock may occur.
Disconnect the power supply
immediately and contact our sales personnel for repair.
If an unpleasant smell or smoking occurs, disconnect the power supply.
If the product is used as is, a fire or electric shock may occur.
immediately.
Disconnect the power supply
After verifying that no smoking is observed, contact our sales personnel for
repair.
Do not disassemble, repair or modify the product.
Otherwise, a fire or electric shock may occur due to a short circuit or heat generation.
For
inspection, modification or repair, contact our sales personnel.
!
Do not touch a cooling fan.
As a cooling fan rotates in high speed, do not put your hand close to it.
cause injury to persons.
!
Otherwise, it may
Never touch a rotating cooling fan.
Do not place the product on unstable locations.
Otherwise, it may drop or fall, resulting in injury to persons or failure.
!
If the product is dropped or damaged, do not use it as is.
!
Do not touch the product with a metallic object.
!
Do not place the product in dusty or humid locations or where water may
Otherwise, a fire or electric shock may occur.
Otherwise, a fire or electric shock may occur.
splash.
Otherwise, a fire or electric shock may occur.
!
!
Do not get the product wet or touch it with a wet hand.
Otherwise, the product may break down or it may cause a fire, smoking or electric shock.
Do not touch a connector on the product (gold-plated portion).
Otherwise, the surface of a connector may be contaminated with sweat or skin oil, resulting
in contact failure of a connector or it may cause a malfunction, fire or electric shock due to
static electricity.
Rev.1.02
6
TB-FMCH-3GSDI2A Hardware Specification
Caution
Do not use or place the product in the following locations.
!
● Humid and dusty locations
● Airless locations such as closet or bookshelf
● Locations which receive oily smoke or steam
● Locations exposed to direct sunlight
● Locations close to heating equipment
● Closed inside of a car where the temperature becomes high
● Staticky locations
● Locations close to water or chemicals
Otherwise, a fire, electric shock, accident or deformation may occur due to a short circuit or heat
generation.
!
Do not place heavy things on the product.
Otherwise, the product may be damaged.
Rev.1.02
7
TB-FMCH-3GSDI2A Hardware Specification
■ Disclaimer
This product consists of an externally switchable transmit/receive 3G/HD/SD SDI equalizer/drive
component and an audio/video clock generation component.
and Samtec FMC (HPC) connector interfaces.
It also provides Samtec DIN connector
Tokyo Electron Device Limited assumes no
responsibility for any damages resulting from the use of this product for purposes other than those
stated.
Even if the product is used properly, Tokyo Electron Device Limited assumes no responsibility for any
damages caused by:
Earthquake, thunder, natural disaster or fire resulting from the use beyond our responsibility, acts by a
third party or other accidents, the customer’s willful or accidental misuse or use under other abnormal
conditions,
Secondary impact arising from use of this product or its unusable state (business interruption or others),
Use of this product against the instructions given in this manual or
Malfunctions due to connection to other devices.
Tokyo Electron Device Limited assumes no responsibility or liability for:
Erasure or corruption of data arising from use of this product
Any consequences or other abnormalities arising from use of this product, or
Damage of this product not due to our responsibility or failure due to modification
This product has been developed by assuming its use for research, testing or evaluation.
It is not
authorized for use in any system or application that requires high reliability.
Repair of this product is carried out by replacing it on a chargeable basis, not repairing the faulty devices.
However, non-chargeable replacement is offered for initial failure if such notification is received within
two weeks after delivery of the product.
The specification of this product is subject to change without prior notice.
The product is subject to discontinuation without prior notice.
Rev.1.02
8
TB-FMCH-3GSDI2A Hardware Specification
1. Related Documents and Board Accessories
All documents relating to this board can be downloaded from our website Club-X.
Accessories
Board Spacer Set
Transmission Cable Set
DIN - BNC: SAMTEC RF179-74BJ3-78SP4-0300 x 3
DIN – DIN: SAMTEC RF179-78SP4-78SP4-0300 x 1
2. Overview
The TB-FMCH-3GSDI2A board consists of National Semiconductor’s 3G/HD/SD SDI equalizer/driver
"LMH0387" x 6, video clock generator "LMH1983" and multi-format video sync separator "LMH1981".
The board uses Samtec‘s DIN coaxial connector "DIN7A-J-P-GFRA-BH1" for SDI equalizer/driver
input/output and multi-format video sync separator analog video input.
Also, The board has two Samtec’s FMC connectors, one is for connection with a Carrier board, and
other one is for increasing the number of input/output SDI equalizers/drivers.
3. Feature
3G/HD/SD SDI equalizer/driver IC: National Semiconductor’s LMH0387
Video clock generator IC:
National Semiconductor’s LMH1983
Video sync separator IC:
National Semiconductor’s LMH1981
75Ω coaxial connector:
Samtec’s DIN7A-J-P-GFRA-BH1
FMC connector:
Samtec’s ASP-134488-01 / ASP-134486-01
Figure 3-1 FMC Connector Pin Assignment
Rev.1.02
9
TB-FMCH-3GSDI2A Hardware Specification
4. TB-FMCH-3GSDI2A Board Description
4.1.
Block Diagram
Figure 4-1 shows a block diagram of TB-FMCH-3GSDI2A board.
Fixed TX Ch
LA Group
CH4_SDI_p/n
CH0_SDI_p/n
CH4_SDO_p/n
CH0_SDO_p/n
CH4_SD
CH4_SEL
LA Group
CH0R_SD
CH0R_SEL
Driver
[LMH0387]
Fixed RX Ch
Equalizer
[LMH0387]
Fixed TX Ch
FMC-HPC
(for stacked board)
ASP-134486-01
LA Group
CH1_SDI_p/n
CH5_SDO_p/n
CH1_SDO_p/n
CH5_SD
CH5_SEL
LA Group
CH1R_SD
CH1R_SEL
CH6_SDI_p/n
CH2_SDI_p/n
CH6_SDO_p/n
CH2_SDO_p/n
CH6_TXEN
CH6_SD/SEL
LA Group
CH2_TXEN
CH2_SD/SEL
CH7_SDI_p/n
CH3_SDI_p/n
CH7_SDO_p/n
CH3_SDO_p/n
CH7_TXEN
CH7_SD/SEL
FMC-HPC
(for Carrier Board)
ASP-134488-01
LA Group
CH5_SDI_p/n
CH3_TXEN
CH3_SD/SEL
Fout/Vout/Hout
DIN7A-J-P-GFRA-BH1
DIN7A-J-P-GFRA-BH1
Driver
[LMH0387]
Fixed RX Ch
DIN7A-J-P-GFRA-BH1
Equalizer
[LMH0387]
Bi-directional Ch
DIN7A-J-P-GFRA-BH1
Equalizer
/Driver
[LMH0387]
Bi-directional Ch
DIN7A-J-P-GFRA-BH1
Equalizer
/Driver
[LMH0387]
DIN7A-J-P-GFRA-BH1
Video Sync
Separator
[LMH1981]
DIN7A-J-P-GFRA-BH1
SCL/SDA
INIT
Fin/Vin/Hin
LA Group
LA Group
NO_REF/NO_ALIGN/NO_LOCK
CLKout1_p/n
Video Clock
Generator
CLKout4_p/n
[LMH1983]
CLKout2_p/n
CLKout3_p/n
Clock
Selector
OSC: 148.5M
OSC: 148.3516M
Figure 4-1 Block Diagram
All standard IO signals are buffered by level shifter.
Rev.1.02
10
TB-FMCH-3GSDI2A Hardware Specification
4.2.
External View of the Board
Figure 4-2, Figure 4-3 and Figure 4-4 show the external views of the TB-FMCH-3GSDI2A board.
Figure 4-2 External View of the Board (component side)
Figure 4-3 External View of the Board (solder side)
Rev.1.02
11
TB-FMCH-3GSDI2A Hardware Specification
4.3.
Board Specification
Figure 4-4 shows the TB-FMCH-3GSDI2A board specification.
External Dimensions: 84 mm x 94 mm (FMC Connector side is 69mm)
Number of Layers:
10
Board Thickness:
1.6mm
Material:
FR-4
Figure 4-4 TB-FMCH-3GSDI2A Board Dimensions
Rev.1.02
12
TB-FMCH-3GSDI2A Hardware Specification
4.4.
Coaxial Connector
Samtec DIN7A-J-P-GFRA-BH1 DIN connectors are used for SDI equalizer/driver input/output and
analog video sync input.
Table 4-1 shows the DIN connectors pin assignment.
Table 4-1 Coaxial Connector Pin Assignment
Connector #
J1
J2
J3
J4
J7
J8
J5
4.5.
Connected IC (Reference)
LMH0387(U1)
LMH0387(U2)
LMH0387(U3)
LMH0387(U4)
LMH0387(U15)
LMH0387(U16)
LMH1981(U5)
Purpose
3G/HD/SD SDI I/O channel-0 TX
3G/HD/SD SDI I/O channel-0 RX
3G/HD/SD SDI I/O channel-1 TX
3G/HD/SD SDI I/O channel-1 RX
3G/HD/SD SDI I/O channel-2 Bidirectional
3G/HD/SD SDI I/O channel-3 Bidirectional
Analog/video input
Analog Video Sync Input
Figure 4-5 shows the peripheral circuit of the analog/video input.
When video signals are input to the National Semiconductor’s video sync separator “LMH1981”, field
synchronization, vertical synchronization and horizontal synchronization signals are generated and
output to the Carrier board FMC connector.
Figure 4-5 Peripheral Circuit of the Analog Video Sync Input
Rev.1.02
13
TB-FMCH-3GSDI2A Hardware Specification
4.6. 3G/HD/SD SDI input/output
This board has two input, two output and two bi-directional channels.
National Semiconductor’s SDI equalizer/driver “LMH0387” can be used as a driver by setting TX_EN pin
to “H” or as an equalizer by setting the pin to ”L”.
Furthermore, SD (SMPTE 259M) mode can be selected by setting SD/HD pin to “H” or 3G/HD (SMPTE
424M/292M) mode by setting the pin to “L”.
Figure 4-6 shows the bi-directional channel circuit.
Input and output channels are use LMH0387 but direction is fixed.
Figure 4-6 Peripheral Circuit of 3G/HD/SD SDI Input / Output
Rev.1.02
14
TB-FMCH-3GSDI2A Hardware Specification
4.7. Video Clock Generator
Figure 4-7 shows the peripheral circuit of a video clock generator.
When field synchronization, vertical synchronization and horizontal synchronization signals from the
Carrier board FMC connector are input to the National Semiconductor’s video clock generator
“LMH1983”, synchronized video clocks (CLKout 1-4) and frame timing signals (Fout 1-4) are generated
and output to the FMC expansion connector.
Figure 4-7 Peripheral Circuit of a Video Clock Generator
Rev.1.02
15
TB-FMCH-3GSDI2A Hardware Specification
4.8. Clock Selector
This clock selector provide clock from Video Clock Generator(LMH1983), OSC 148.5MHz or OSC
148.3516MHz.
Clock select signals(S10,S11,S20,S21) connect to FMC connector.
The following figure shows the clock selector circuit.
Figure 4-8 Clock Selector Circuit
Table 4-2 Clock Select Settings
S10
S11
CLKout2 output to Carrier board
Low
Low
Onboard CLKout2
Low
High
Onboard CLKout3
High
Low
OSC 148.5MHz
High
High
OSC 148.3516MHz
S20
S21
CLKout3 output to Carrier board
Low
Low
Onboard CLKout2
Low
High
Onboard CLKout3
High
Low
OSC 148.5MHz
High
High
OSC 148.3516MHz
Table 4-3 Select signals pin assign of FMC
Signals
Rev.1.02
Pin
S10
LA11_P
S11
LA11_N
S20
LA15_P
S21
LA15_N
16
TB-FMCH-3GSDI2A Hardware Specification
4.9. IO voltage
All of standard IO signals through Level Shifter. Signal level is converting to voltage of VADJ.
Please check the VADJ of carrier board before design FPGA.
Figure 4-9 Level Shifter circuit 1
Figure 4-10 Level Shifter circuit 2
Rev.1.02
17
TB-FMCH-3GSDI2A Hardware Specification
4.10. FMC Connector to Carrier board
The board uses Samtec ASP-134488-01 (High-Pin Count) on the solder side of the board for mounting
onto the Carrier board.
Table 4-4 FMC Connector Pin Assignments to Carrier board
A-column (FMC Connector for Carrier board)
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
FMC Spec
GND
DP1_M2C_P
DP1_M2C_N
GND
GND
DP2_M2C_P
DP2_M2C_N
GND
GND
DP3_M2C_P
DP3_M2C_N
GND
GND
DP4_M2C_P
DP4_M2C_N
GND
GND
DP5_M2C_P
DP5_M2C_N
GND
GND
DP1_C2M_P
DP1_C2M_N
GND
GND
DP2_C2M_P
DP2_C2M_N
GND
GND
DP3_C2M_P
DP3_C2M_N
GND
GND
DP4_C2M_P
DP4_C2M_N
GND
GND
DP5_C2M_P
DP5_C2M_N
GND
Rev.1.02
I/O
O
O
O
O
O
O
O
O
O
O
I
I
I
I
I
I
I
I
I
I
-
Signal Name
CH1_SDO_p
CH1_SDO_n
CH2_SDO_p
CH2_SDO_n
CH3_SDO_p
CH3_SDO_n
EX_CH0_SDO_p
EX_CH0_SDO_n
EX_CH1_SDO_p
EX_CH1_SDO_n
CH1_SDI_p
CH1_SDI_n
CH2_SDI_p
CH2_SDI_n
CH3_SDI_p
CH3_SDI_n
EX_CH0_SDI_p
EX_CH0_SDI_n
EX_CH1_SDI_p
EX_CH1_SDI_n
-
Description
SDI signal output from LMH0387 on CH1
(positive)
SDI signal output
from LMH0387 on CH1
(negative)
SDI signal output from LMH0387 on CH2
(positive)
SDI signal output
from LMH0387 on CH2
(negative)
SDI signal output from LMH0387 on CH3
(positive)
SDI signal output
from LMH0387 on CH3
(negative)
CH0-RX of Stacked Board(POS)
CH0-RX of Stacked Board(NEG)
CH1-RX of Stacked Board(POS)
CH1-RX of Stacked Board(NEG)
SDI signal input to LMH0387 on CH1
(positive)
SDI signal input
to LMH0387 on CH1
(negative)
SDI signal input to LMH0387 on CH2
(positive)
SDI signal input
to LMH0387 on CH2
(negative)
SDI signal input to LMH0387 on CH3
(positive)
SDI signal input
to LMH0387 on CH3
(negative)
CH0-TX of Stacked Board(POS)
CH0-TX of Stacked Board(NEG)
CH1-TX of Stacked Board(POS)
CH1-TX of Stacked Board(NEG)
-
18
TB-FMCH-3GSDI2A Hardware Specification
B-column (FMC Connector for Carrier board)
No.
FMC Spec
I/O
Signal Name
Description
1
RES1
-
N/C
-
2
GND
-
-
-
3
GND
-
-
-
4
DP9_M2C_P
-
N/C
-
5
DP9_M2C_N
-
N/C
-
6
GND
-
-
-
7
GND
-
-
-
8
DP8_M2C_P
-
N/C
-
9
DP8_M2C_N
-
N/C
-
10
GND
-
-
-
11
GND
-
-
-
12
DP7_M2C_P
O
EX_CH3_SDO_p
CH3-RX of Stacked Board(POS)
13
DP7_M2C_N
O
EX_CH3_SDO_n
CH3-RX of Stacked Board(NEG)
14
GND
-
-
-
15
GND
-
-
-
16
DP6_M2C_P
O
EX_CH2_SDO_p
CH2-RX of Stacked Board(POS)
17
DP6_M2C_N
O
EX_CH2_SDO_n
CH2-RX of Stacked Board(NEG)
18
GND
-
-
-
19
GND
-
-
20
GBTCLK1_M2C_P
O
F_CLKout3_p
21
GBTCLK1_M2C_N
O
F_CLKout3_n
22
GND
-
-
CLKout3 output from selected LMH1983
(positive)
CLKout3 output from selected LMH1983
(negative)
-
23
GND
-
-
-
24
DP9_C2M_P
-
N/C
-
25
DP9_C2M_N
-
N/C
-
26
GND
-
-
-
27
GND
-
-
-
28
DP8_C2M_P
-
N/C
-
29
DP8_C2M_N
-
N/C
-
30
GND
-
-
-
31
GND
-
-
-
32
DP7_C2M_P
I
EX_CH3_SDI_p
CH3-TX of Stacked Board(POS)
33
DP7_C2M_N
I
EX_CH3_SDI_n
CH3-TX of Stacked Board(NEG)
34
GND
-
-
-
35
GND
-
-
-
36
DP6_C2M_P
I
EX_CH2_SDI_p
CH2-TX of Stacked Board(POS)
37
DP6_C2M_N
I
EX_CH2_SDI_n
CH2-TX of Stacked Board(NEG)
38
GND
-
-
-
39
GND
-
-
-
40
RES0
-
N/C
-
Rev.1.02
19
TB-FMCH-3GSDI2A Hardware Specification
C-column (FMC Connector for Carrier board)
No.
FMC Spec
I/O
Signal Name
Description
1
GND
-
-
2
DP0_C2M_P
I
CH0_SDI_p
3
DP0_C2M_N
I
CH0_SDI_n
4
GND
-
-
SDI signal input to LMH0387 on EXP CH0
(positive)
SDI signal input to LMH0387 on EXP CH0
(negative)
-
5
GND
-
-
6
DP0_M2C_P
O
CH0_SDO_p
7
DP0_M2C_N
O
CH0_SDO_n
8
GND
-
-
SDI signal output from LMH0387 on CH0
(positive)
SDI signal output from LMH0387 on CH0
(positive)
-
9
GND
-
-
-
10
LA06_P
I
F_CH0T_SD
SD/HD pin input to LMH0387 on CH0 TX
11
LA06_N
I
F_CH0R_SD
SD/HD pin input to LMH0387 on CH0 RX
12
GND
-
-
13
GND
-
-
-
14
LA10_P
I
F_CH1T_SD
SD/HD pin input to LMH0387 on CH1 TX
15
LA10_N
I
F_CH1R_SD
SD/HD pin input to LMH0387 on CH1 RX
16
GND
-
-
-
17
GND
-
-
-
18
LA14_P
I
F_CH2_SD
SD/HD pin input to LMH0387 on CH2
19
LA14_N
I
F_CH3_SD
SD/HD pin input to LMH0387 on CH3
20
GND
-
-
-
21
GND
-
-
-
22
LA18_P_CC
I
F_CH2_TXEN
TX_EN pin input to LMH0387 on CH2
23
LA18_N_CC
I
F_CH3_TXEN
TX_EN pin input to LMH0387 on CH3
24
GND
-
-
-
25
GND
-
-
-
26
LA27_P
I
EX_SCL_1983
SCL of stacked LMH1983
27
LA27_N
I/O
EX_SDA_1983
SDA of stacked LMH1983
28
GND
-
-
-
29
GND
-
-
-
30
SCL
I
SCL
M24C02-WDW6(U21) SCL pin
31
SDA
I/O
SDA
M24C02-WDW6(U21) SDA pin
32
GND
-
-
-
33
GND
-
-
-
34
GA0
I
E0 of U21
M24C02-WDW6(U21) E0 pin
35
12P0V
-
+12V
+12V power supply
36
GND
-
-
-
37
12P0V
-
+12V
+12V power supply
38
GND
-
-
-
39
3P3V
-
+3.3V
+3.3V power supply
40
GND
-
-
-
Rev.1.02
20
TB-FMCH-3GSDI2A Hardware Specification
D-column (FMC Connector for Carrier board)
No.
FMC Spec
I/O
Signal Name
Description
1
PG_C2M
-
N/C
-
2
GND
-
-
-
3
GND
-
-
4
GBTCLK0_M2C_P
O
F_CLKout2_p
5
GBTCLK0_M2C_N
O
F_CLKout2_n
6
GND
-
-
CLKout2 output from selected LMH1983
(positive)
CLKout2 output from selected LMH1983
(negative)
-
7
GND
-
-
-
8
LA01_P_CC
I
F_CH0T_SEL
SS pin input to LMH0387 on CH0 TX
9
LA01_N_CC
I
F_CH0R_SEL
SS pin input to LMH0387 on CH0 RX
10
GND
-
-
-
11
LA05_P
I
F_CH1T_SEL
SS pin input to LMH0387 on CH1 TX
12
LA05_N
I
F_CH1R_SEL
SS pin input to LMH0387 on CH1 RX
13
GND
-
-
-
14
LA09_P
I
F_CH2_SEL
SS pin input to LMH0387 on CH2
15
LA09_N
I
F_CH3_SEL
SS pin input to LMH0387 on CH3
16
GND
-
-
-
17
LA13_P
I
F_MOSI
MOSI pin input to LMH0387 on all CHs
18
LA13_N
O
F_MISO
MISO pin output from LMH0387 on all CHs
19
GND
-
-
-
20
LA17_P_CC
I
F_SCLK
SCK pin input to LMH0387 on all CHs
21
LA17_N_CC
-
N/C
-
22
GND
-
-
-
23
LA23_P
I
EX_S10
Clock Select signal of stacked board
24
LA23_N
I
EX_S11
Clock Select signal of stacked board
25
GND
-
-
-
26
LA26_P
I
EX_S20
Clock Select signal of stacked board
27
LA26_N
I
EX_S21
Clock Select signal of stacked board
28
GND
-
-
-
29
TCK
-
N/C
-
30
TDI
-
N/C
-
31
TDO
-
N/C
-
32
3P3VAUX
-
+3.3V_AUX
+3.3V_AUX power supply
33
TMS
-
N/C
-
34
TRST_L
-
N/C
-
35
GA1
I
E1 of U21
M24C02-WDW6(U21) E1 pin
36
3P3V
-
+3.3V
+3.3V power supply
37
GND
-
-
-
38
3P3V
-
+3.3V
+3.3V power supply
39
GND
-
-
-
40
3P3V
-
+3.3V
+3.3V power supply
Rev.1.02
21
TB-FMCH-3GSDI2A Hardware Specification
E-column (FMC Connector for Carrier board)
F-column (FMC Connector for Carrier board)
No.
FMC Spec
I/O
Signal
Name
Description
No.
FMC Spec
I/O
Signal
Name
Description
1
GND
-
-
-
1
PG_M2C
-
Test Pad
TP5
2
HA01_P_CC
-
N/C
-
2
GND
-
-
-
3
HA01_N_CC
-
N/C
-
3
GND
-
-
-
4
GND
-
-
-
4
HA00_P_CC
-
N/C
-
5
GND
-
-
-
5
HA00_N_CC
-
N/C
-
6
HA05_P
-
N/C
-
6
GND
-
-
-
7
HA05_N
-
N/C
-
7
HA04_P
-
N/C
-
8
GND
-
-
-
8
HA04_N
-
N/C
-
9
HA09_P
-
N/C
-
9
GND
-
-
-
10
HA09_N
-
N/C
-
10
HA08_P
-
N/C
-
11
GND
-
-
-
11
HA08_N
-
N/C
-
12
HA13_P
-
N/C
-
12
GND
-
-
-
13
HA13_N
-
N/C
-
13
HA12_P
-
N/C
-
14
GND
-
-
-
14
HA12_N
-
N/C
-
15
HA16_P
-
N/C
-
15
GND
-
-
-
16
HA16_N
-
N/C
-
16
HA15_P
-
N/C
-
17
GND
-
-
-
17
HA15_N
-
N/C
-
18
HA20_P
-
N/C
-
18
GND
-
-
-
19
HA20_N
-
N/C
-
19
HA19_P
-
N/C
-
20
GND
-
-
-
20
HA19_N
-
N/C
-
21
HB03_P
-
N/C
-
21
GND
-
-
-
22
HB03_N
-
N/C
-
22
HB02_P
-
N/C
-
23
GND
-
-
-
23
HB02_N
-
N/C
-
24
HB05_P
-
N/C
-
24
GND
-
-
-
25
HB05_N
-
N/C
-
25
HB04_P
-
N/C
-
26
GND
-
-
-
26
HB04_N
-
N/C
-
27
HB09_P
-
N/C
-
27
GND
-
-
-
28
HB09_N
-
N/C
-
28
HB08_P
-
N/C
-
29
GND
-
-
-
29
HB08_N
-
N/C
-
30
HB13_P
-
N/C
-
30
GND
-
-
-
31
HB13_N
-
N/C
-
31
HB12_P
-
N/C
-
32
GND
-
-
-
32
HB12_N
-
N/C
-
33
HB19_P
-
N/C
-
33
GND
-
-
-
34
HB19_N
-
N/C
-
34
HB16_P
-
N/C
-
35
GND
-
-
-
35
HB16_N
-
N/C
-
36
HB21_P
-
N/C
-
36
GND
-
-
-
37
HB21_N
-
N/C
-
37
HB20_P
-
N/C
-
38
GND
-
-
-
38
HB20_N
-
N/C
-
39
GND
-
-
-
40
VADJ
-
FMC_VADJ
VADJ
power
supply
39
VADJ
-
FMC_VADJ
VADJ
power
supply
40
GND
-
-
-
Rev.1.02
22
TB-FMCH-3GSDI2A Hardware Specification
G-column (FMC Connector for Carrier board)
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Rev.1.02
FMC Spec
GND
CLK0_M2C_P
CLK0_M2C_N
GND
GND
LA00_P_CC
LA00_N_CC
GND
LA03_P
LA03_N
GND
LA08_P
LA08_N
GND
LA12_P
LA12_N
GND
LA16_P
LA16_N
GND
LA20_P
LA20_N
GND
LA22_P
LA22_N
GND
LA25_P
LA25_N
GND
LA29_P
LA29_N
GND
LA31_P
LA31_N
GND
LA33_P
LA33_N
GND
VADJ
GND
I/O
O
O
O
O
O
O
O
O
O
I
I
I
I
I
I
I
I
I
I
I
I
-
Signal Name
CLKout4_p
CLKout4_n
F_Fout2
F_Fout3
F_Fout1
F_Fout4
F_Vout
F_Hout
F_Fout
F_INIT
F_Vin
F_Hin
F_Fin
EX_CH0T_SD
EX_CH0R_SD
EX_CH1T_SD
EX_CH1R_SD
EX_CH2_SD
EX_CH3_SD
EX_CH2_TXEN
EX_CH3_TXEN
N/C
N/C
FMC_VADJ
-
Description
CLKout4 output from LMH1983
(positive)
CLKout4 output
from LMH1983
(negative)
Fout2 output from LMH1983
Fout3 output from LMH1983
Fout1 output from LMH1983
Fout4 output from LMH1983
Vout ouput from LMH1981
Hout output from LMH1981
Fout output from LMH1981
INIT pin input to LMH1983
Vin pin input to LMH1983
Hin pin input to LMH1983
Fin input to LMH1983
SD/HD pin of stacked CH0 TX
SD/HD pin of stacked CH0 RX
SD/HD pin of stacked CH1 TX
SD/HD pin of stacked CH1 RX
SD/HD pin of stacked CH2
SD/HD pin of stacked CH3
TXEN pin of stacked CH2
TXEN pin of stacked CH3
VADJ power supply
-
23
TB-FMCH-3GSDI2A Hardware Specification
H-column (FMC Connector for Carrier board)
No.
FMC Spec
I/O
Signal Name
Description
1
VREF_A_M2C
-
Test Pad
-
2
PRSNT_M2C_L
-
N/C
-
3
GND
-
-
4
CLK0_M2C_P
O
CLKout1_p
5
CLK0_M2C_N
O
CLKout1_n
6
GND
-
-
CLKout1 output from LMH1983
(positive)
CLKout1 output from LMH1983
(negative)
-
7
LA02_P
O
F_NO_REF
8
LA02_N
O
F_NO_ALIGN
9
GND
-
-
NO_REF pin output from LMH1983
NO_ALIGN pin output from
LMH1983
-
10
LA04_P
O
F_NO_LOCK
NO_LOCK pin output from LMH1983
11
LA04_N
-
N/C
-
12
GND
-
-
-
13
LA07_P
I
F_CL_1983
14
LA07_N
I/O
F_DA_1983
15
GND
-
-
SCL pin input to LMH1983
SDA pin input/output to/from
LMH1983
-
16
LA11_P
I
F_S10
Clock Select Signal S10
17
LA11_N
I
F_S11
Clock Select Signal S11
18
GND
-
-
-
19
LA15_P
I
F_S20
Clock Select Signal S20
20
LA15_N
I
F_S21
Clock Select Signal S21
21
GND
-
-
-
22
LA19_P
I
EX_CH0T_SEL
SS pin of stacked CH0 TX
23
LA19_N
I
EX_CH0R_SEL
SS pin of stacked CH0 RX
24
GND
-
-
-
25
LA21_P
I
EX_CH1T_SEL
SS pin of stacked CH1 TX
26
LA21_N
I
EX_CH1R_SEL
SS pin of stacked CH1 RX
27
GND
-
-
-
28
LA24_P
I
EX_CH2_SEL
SS pin of stacked CH2
29
LA24_N
I
EX_CH3_SEL
SS pin of stacked CH3
30
GND
-
-
-
31
LA28_P
I
EX_MOSI
MOSI pin of stacked board
32
LA28_N
I/O
EX_MISO
MISO pin of stacked board
33
GND
-
-
-
34
LA30_P
I
EX_SCLK
SCLK pin of stacked board
35
LA30_N
-
N/C
-
36
GND
-
-
-
37
LA32_P
-
N/C
-
38
LA32_N
-
N/C
-
39
GND
-
-
-
40
VADJ
-
FMC_VADJ
VADJ power supply
Rev.1.02
24
TB-FMCH-3GSDI2A Hardware Specification
J-column (FMC Connector for Carrier board)
K-column (FMC Connector for Carrier board)
No.
FMC Spec
I/O
Signal
Name
Description
No.
FMC Spec
I/O
Signal
Name
Description
1
GND
-
-
-
1
VREF_B_M2C
-
Test
Pad
TP3
2
CLK3_M2C_P
-
N/C
-
2
GND
-
-
-
3
CLK3_M2C_N
-
N/C
-
3
GND
-
-
-
4
GND
-
-
-
4
CLK2_M2C_P
-
N/C
-
5
GND
-
-
-
5
CLK2_M2C_N
-
N/C
-
6
HA03_P
-
N/C
-
6
GND
-
-
-
7
HA03_N
-
N/C
-
7
HA02_P
-
N/C
-
8
GND
-
-
-
8
HA02_N
-
N/C
-
9
HA07_P
-
N/C
-
9
GND
-
-
-
10
HA07_N
-
N/C
-
10
HA06_P
-
N/C
-
11
GND
-
-
-
11
HA06_N
-
N/C
-
12
HA11_P
-
N/C
-
12
GND
-
-
-
13
HA11_N
-
N/C
-
13
HA10_P
-
N/C
-
14
GND
-
-
-
14
HA10_N
-
N/C
-
15
HA14_P
-
N/C
-
15
GND
-
-
-
16
HA14_N
-
N/C
-
16
HA17_P_CC
-
N/C
-
17
GND
-
-
-
17
HA17_N_CC
-
N/C
-
18
HA18_P
-
N/C
-
18
GND
-
-
-
19
HA18_N
-
N/C
-
19
HA21_P
-
N/C
-
20
GND
-
-
-
20
HA21_N
-
N/C
-
21
HA22_P
-
N/C
-
21
GND
-
-
-
22
HA22_N
-
N/C
-
22
HA23_P
-
N/C
-
23
GND
-
-
-
23
HA23_N
-
N/C
-
24
HB01_P
-
N/C
-
24
GND
-
-
-
25
HB01_N
-
N/C
-
25
HB00_P_CC
-
N/C
-
26
GND
-
-
-
26
HB00_N_CC
-
N/C
-
27
HB07_P
-
N/C
-
27
GND
-
-
-
28
HB07_N
-
N/C
-
28
HB06_P_CC
-
N/C
-
29
GND
-
-
-
29
HB06_N_CC
-
N/C
-
30
HB11_P
-
N/C
-
30
GND
-
-
-
31
HB11_N
-
N/C
-
31
HB10_P
-
N/C
-
32
GND
-
-
-
32
HB10_N
-
N/C
-
33
HB15_P
-
N/C
-
33
GND
-
-
-
34
HB15_N
-
N/C
-
34
HB14_P
-
N/C
-
35
GND
-
-
-
35
HB14_N
-
N/C
-
36
HB18_P
-
N/C
-
36
GND
-
-
-
37
HB18_N
-
N/C
-
37
HB17_P_CC
-
N/C
-
38
GND
-
-
-
38
HB17_N_CC
-
N/C
-
39
VIO_B_M2C
-
Test
Pad
TP6
39
GND
-
-
-
40
GND
-
-
-
40
VIO_B_M2C
-
Test
Pad
TP7
Rev.1.02
25
TB-FMCH-3GSDI2A Hardware Specification
4.11. FMC Connector to Stack-up 3GSDI2 board
The board uses Samtec ASP-134486-01(High-Pin Count) on the component side of the board for
mounting onto the Carrier board.
Please refer to Section 5 Stack-up configuration.
4.12. LED Display
Table 4-5 shows the status information provided by onboard LEDs.
Table 4-5 LED Status Display
No
Circuit#
Description
Status
1
2
3
4
5
6
7
D2
D4
D8
D9
D5
D6
D7
LMH0387 carrier detection on CH0 RX
LMH0387 carrier detection on CH1 RX
LMH0387 carrier detection on CH2
LMH0387 carrier detection on CH3
LMH1983 NO_LOCK pin
LMH1983 NO_ALIGN pin
LMH1983 NO_REF pin
OFF: Detect, ON: Non-detect
OFF: Detect, ON: Non-detect
OFF: Detect, ON: Non-detect
OFF: Detect, ON: Non-detect
OFF: Detect, ON: Non-detect
OFF: Detect, ON: Non-detect
OFF: Detect, ON: Non-detect
Rev.1.02
26
TB-FMCH-3GSDI2A Hardware Specification
5. Stack-up configuration
TB-FMCH-3GSDI2A support stack-up configuration. In this case, SDI channel is 4ch input, 4ch output
and 4ch bi-directional. At same time, Genlock circuit of stacked board is disabled.
FMC-HPC
(for stacked board)
ASP-134486-01
FMC-HPC
(for Carrier Board)
ASP-134488-01
EX_CH0_SDO_p/n
DP0
CH0_SDI_p/n
DP4
DP0
EX_CH0_SDI_p/n
EX_CH4R_SD/SEL
LA Group
CH0_SDO_p/n
CH0R_SD/SEL
LA Group
EX_CH1_SDO_p/n
EX_CH1R_SD/SEL
CH0R_SD/SEL
LA Group
EX_CH2_SDO_p/n
EX_CH2_TXEN/SD/SEL
DP2
CH2_SDI_p/n
DP6
DP2
EX_CH2_SDI_p/n
LA Group
EX_CH3_SDO_p/n
DP3
CH3_SDI_p/n
DP7
DP3
CH2_SDO_p/n
CH2_TXEN/SD/SEL
LA Group
EX_CH3_SDI_p/n
EX_CH3_TXEN/SD/SEL
CH3_SDO_p/n
CH3_TXEN/SD/SEL
EX_MOSI/EX_MISO/EX_SCLK
MOSI/MISO/SCLK
Fout/Vout/Hout
Fout/Vout/Hout
TP
EX_SCL_1983/EX_SDA_1983
INIT
SCL_1983/SDA_1983
INIT
TP
Fin/Vin/Hin
LA Group
CH1_SDO_p/n
TP
NO_REF/NO_ALIGN/NO_LOCK
TP
CLKout1_p/n
TP
CLKout4_p/n
TP
EX_S10, EX_S11
EX_S20, EX_S21
Fin/Vin/Hin
LA Group
NO_REF/NO_ALIGN/NO_LOCK
CLKout1_p/n
CLKout4_p/n
CLKout2_p/n
S10,S11
S20,S21
Clock
Selector
LA Group
DP1
CH1_SDI_p/n
DP5
DP1
EX_CH1_SDI_p/n
CLKout3_p/n
148.5M
148.3516M
Figure 5-1 Connection of stack-up board
Rev.1.02
27
TB-FMCH-3GSDI2A Hardware Specification
Table 5-1 FMC Connector Pin Assignments for Mezzanine board
A-column (FMC Connector for Mezzanine board)
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
FMC Spec
GND
DP1_M2C_P
DP1_M2C_N
GND
GND
DP2_M2C_P
DP2_M2C_N
GND
GND
DP3_M2C_P
DP3_M2C_N
GND
GND
DP4_M2C_P
DP4_M2C_N
GND
GND
DP5_M2C_P
DP5_M2C_N
GND
GND
DP1_C2M_P
DP1_C2M_N
GND
GND
DP2_C2M_P
DP2_C2M_N
GND
GND
DP3_C2M_P
DP3_C2M_N
GND
GND
DP4_C2M_P
DP4_C2M_N
GND
GND
DP5_C2M_P
DP5_C2M_N
GND
Rev.1.02
I/O
I
I
I
I
I
I
O
O
O
O
O
O
-
Signal Name
EX_CH1_SDO_p
EX_CH1_SDO_n
EX_CH2_SDO_p
EX_CH2_SDO_n
EX_CH3_SDO_p
EX_CH3_SDO_n
N/C
N/C
N/C
N/C
EX_CH1_SDI_p
EX_CH1_SDI_n
EX_CH2_SDI_p
EX_CH2_SDI_n
EX_CH3_SDI_p
EX_CH3_SDI_n
N/C
N/C
N/C
N/C
-
Description
CH1-RX of Stacked Board(POS)
CH1-RX of Stacked Board(NEG)
CH2-RX of Stacked Board(POS)
CH2-RX of Stacked Board(NEG)
CH3-RX of Stacked Board(POS)
CH3-RX of Stacked Board(NEG)
CH1-TX of Stacked Board(POS)
CH1-TX of Stacked Board(NEG)
CH2-TX of Stacked Board(POS)
CH2-TX of Stacked Board(NEG)
CH3-TX of Stacked Board(POS)
CH3-TX of Stacked Board(NEG)
-
28
TB-FMCH-3GSDI2A Hardware Specification
B-column (FMC Connector for Mezzanine board)
No.
FMC Spec
I/O
Signal Name
Description
1
RES1
-
N/C
-
2
GND
-
-
-
3
GND
-
-
-
4
DP9_M2C_P
-
N/C
-
5
DP9_M2C_N
-
N/C
-
6
GND
-
-
-
7
GND
-
-
-
8
DP8_M2C_P
-
N/C
-
9
DP8_M2C_N
-
N/C
-
10
GND
-
-
-
11
GND
-
-
-
12
DP7_M2C_P
-
N/C
-
13
DP7_M2C_N
-
N/C
-
14
GND
-
-
-
15
GND
-
-
-
16
DP6_M2C_P
-
N/C
-
17
DP6_M2C_N
-
N/C
-
18
GND
-
-
-
19
GND
-
-
-
20
GBTCLK1_M2C_P
-
N/C
-
21
GBTCLK1_M2C_N
-
N/C
-
22
GND
-
-
-
23
GND
-
-
-
24
DP9_C2M_P
-
N/C
-
25
DP9_C2M_N
-
N/C
-
26
GND
-
-
-
27
GND
-
-
-
28
DP8_C2M_P
-
N/C
-
29
DP8_C2M_N
-
N/C
-
30
GND
-
-
-
31
GND
-
-
-
32
DP7_C2M_P
-
N/C
-
33
DP7_C2M_N
-
N/C
-
34
GND
-
-
-
35
GND
-
-
-
36
DP6_C2M_P
-
N/C
-
37
DP6_C2M_N
-
N/C
-
38
GND
-
-
-
39
GND
-
-
-
40
RES0
-
N/C
-
Rev.1.02
29
TB-FMCH-3GSDI2A Hardware Specification
C-column (FMC Connector for Mezzanine board)
No.
FMC Spec
I/O
Signal Name
Description
1
GND
-
-
-
2
DP0_C2M_P
O
EX_CH0_SDI_p
CH0-TX of Stacked Board(POS)
3
DP0_C2M_N
O
EX_CH0_SDI_n
CH0-TX of Stacked Board(NEG)
4
GND
-
-
-
5
GND
-
-
-
6
DP0_M2C_P
I
EX_CH0_SDO_p
CH0-RX of Stacked Board(POS)
7
DP0_M2C_N
I
EX_CH0_SDO_n
CH0-RX of Stacked Board(NEG)
8
GND
-
-
-
9
GND
-
-
-
10
LA06_P
O
EX_CH0T_SD
SD/HD pin of stacked CH0 TX
11
LA06_N
O
EX_CH0R_SD
SD/HD pin of stacked CH0 RX
12
GND
-
-
-
13
GND
-
-
-
14
LA10_P
O
EX_CH1T_SD
SD/HD pin of stacked CH1 TX
15
LA10_N
O
EX_CH1R_SD
SD/HD pin of stacked CH1 RX
16
GND
-
-
-
17
GND
-
-
-
18
LA14_P
O
EX_CH2_SD
SD/HD pin of stacked CH2
19
LA14_N
O
EX_CH3_SD
SD/HD pin of stacked CH3
20
GND
-
-
-
21
GND
-
-
-
22
LA18_P_CC
O
EX_CH2_TXEN
TXEN pin of stacked CH2
23
LA18_N_CC
O
EX_CH3_TXEN
TXEN pin of stacked CH3
24
GND
-
-
-
25
GND
-
-
-
26
LA27_P
-
N/C
-
27
LA27_N
-
N/C
-
28
GND
-
-
-
29
GND
-
-
-
30
SCL
-
N/C
-
31
SDA
-
N/C
-
32
GND
-
-
-
33
GND
-
-
-
34
GA0
-
N/C
Connect to Test pad
35
12P0V
-
+12V
+12V power supply
36
GND
-
-
-
37
12P0V
-
+12V
+12V power supply
38
GND
-
-
-
39
3P3V
-
+3.3V
+3.3V power supply
40
GND
-
-
-
Rev.1.02
30
TB-FMCH-3GSDI2A Hardware Specification
D-column (FMC Connector for Mezzanine board)
No.
FMC Spec
I/O
Signal Name
Description
1
PG_C2M
-
N/C
-
2
GND
-
-
-
3
GND
-
-
-
4
GBTCLK0_M2C_P
-
N/C
-
5
GBTCLK0_M2C_N
-
N/C
-
6
GND
-
-
-
7
GND
-
-
-
8
LA01_P_CC
O
EX_CH0T_SEL
SS pin of stacked CH0 TX
9
LA01_N_CC
O
EX_CH0R_SEL
SS pin of stacked CH0 RX
10
GND
-
-
-
11
LA05_P
O
EX_CH1T_SEL
SS pin of stacked CH1 TX
12
LA05_N
O
EX_CH1R_SEL
SS pin of stacked CH1 RX
13
GND
-
-
-
14
LA09_P
O
EX_CH2_SEL
SS pin of stacked CH2
15
LA09_N
O
EX_CH3_SEL
SS pin of stacked CH3
16
GND
-
-
-
17
LA13_P
O
EX_MOSI
MOSI pin of stacked board
18
LA13_N
I
EX_MISO
MISO pin of stacked board
19
GND
-
-
-
20
LA17_P_CC
O
EX_SCLK
SCK pin of stacked board
21
LA17_N_CC
-
N/C
-
22
GND
-
-
-
23
LA23_P
-
N/C
-
24
LA23_N
-
N/C
-
25
GND
-
-
-
26
LA26_P
-
N/C
-
27
LA26_N
-
N/C
-
28
GND
-
-
-
29
TCK
-
N/C
-
30
TDI
-
N/C
-
31
TDO
-
N/C
-
32
3P3VAUX
-
+3.3V_AUX
+3.3V_AUX power supply
33
TMS
-
N/C
-
34
TRST_L
-
N/C
-
35
GA1
-
N/C
Connect to Test pad
36
3P3V
-
+3.3V
+3.3V power supply
37
GND
-
-
-
38
3P3V
-
+3.3V
+3.3V power supply
39
GND
-
-
-
40
3P3V
-
+3.3V
+3.3V power supply
Rev.1.02
31
TB-FMCH-3GSDI2A Hardware Specification
E-column (FMC Connector for Mezzanine board)
F-column (FMC Connector for Mezzanine board)
No.
FMC Spec
I/O
Signal
Name
Description
No.
FMC Spec
I/O
Signal
Name
Description
1
GND
-
-
-
1
PG_M2C
-
Test Pad
TP5
2
HA01_P_CC
-
N/C
-
2
GND
-
-
-
3
HA01_N_CC
-
N/C
-
3
GND
-
-
-
4
GND
-
-
-
4
HA00_P_CC
-
N/C
-
5
GND
-
-
-
5
HA00_N_CC
-
N/C
-
6
HA05_P
-
N/C
-
6
GND
-
-
-
7
HA05_N
-
N/C
-
7
HA04_P
-
N/C
-
8
GND
-
-
-
8
HA04_N
-
N/C
-
9
HA09_P
-
N/C
-
9
GND
-
-
-
10
HA09_N
-
N/C
-
10
HA08_P
-
N/C
-
11
GND
-
-
-
11
HA08_N
-
N/C
-
12
HA13_P
-
N/C
-
12
GND
-
-
-
13
HA13_N
-
N/C
-
13
HA12_P
-
N/C
-
14
GND
-
-
-
14
HA12_N
-
N/C
-
15
HA16_P
-
N/C
-
15
GND
-
-
-
16
HA16_N
-
N/C
-
16
HA15_P
-
N/C
-
17
GND
-
-
-
17
HA15_N
-
N/C
-
18
HA20_P
-
N/C
-
18
GND
-
-
-
19
HA20_N
-
N/C
-
19
HA19_P
-
N/C
-
20
GND
-
-
-
20
HA19_N
-
N/C
-
21
HB03_P
-
N/C
-
21
GND
-
-
-
22
HB03_N
-
N/C
-
22
HB02_P
-
N/C
-
23
GND
-
-
-
23
HB02_N
-
N/C
-
24
HB05_P
-
N/C
-
24
GND
-
-
-
25
HB05_N
-
N/C
-
25
HB04_P
-
N/C
-
26
GND
-
-
-
26
HB04_N
-
N/C
-
27
HB09_P
-
N/C
-
27
GND
-
-
-
28
HB09_N
-
N/C
-
28
HB08_P
-
N/C
-
29
GND
-
-
-
29
HB08_N
-
N/C
-
30
HB13_P
-
N/C
-
30
GND
-
-
-
31
HB13_N
-
N/C
-
31
HB12_P
-
N/C
-
32
GND
-
-
-
32
HB12_N
-
N/C
-
33
HB19_P
-
N/C
-
33
GND
-
-
-
34
HB19_N
-
N/C
-
34
HB16_P
-
N/C
-
35
GND
-
-
-
35
HB16_N
-
N/C
-
36
HB21_P
-
N/C
-
36
GND
-
-
-
37
HB21_N
-
N/C
-
37
HB20_P
-
N/C
-
38
GND
-
-
-
38
HB20_N
-
N/C
-
39
GND
-
-
-
40
VADJ
-
FMC_VADJ
VADJ
power
supply
39
VADJ
-
FMC_VADJ
VADJ
power
supply
40
GND
-
-
-
Rev.1.02
32
TB-FMCH-3GSDI2A Hardware Specification
G-column (FMC Connector for Mezzanine board)
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Rev.1.02
FMC Spec
GND
CLK0_M2C_P
CLK0_M2C_N
GND
GND
LA00_P_CC
LA00_N_CC
GND
LA03_P
LA03_N
GND
LA08_P
LA08_N
GND
LA12_P
LA12_N
GND
LA16_P
LA16_N
GND
LA20_P
LA20_N
GND
LA22_P
LA22_N
GND
LA25_P
LA25_N
GND
LA29_P
LA29_N
GND
LA31_P
LA31_N
GND
LA33_P
LA33_N
GND
VADJ
GND
I/O
I
I
I
I
I
I
I
I
I
I
I
I
I
-
Signal Name
EX_CLKout4_p
EX_CLKout4_n
EX_F_Fout2
EX_F_Fout3
EX_F_Fout1
EX_F_Fout4
EX_F_Vout
EX_F_Hout
EX_F_Fout
EX_F_INIT
EX_F_Vin
EX_F_Hin
EX_F_Fin
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
FMC_VADJ
-
Description
Connect to Test pad
Connect to Test pad
Connect to Test pad
Connect to Test pad
Connect to Test pad
Connect to Test pad
Connect to Test pad
Connect to Test pad
Connect to Test pad
Connect to Test pad
Connect to Test pad
Connect to Test pad
Connect to Test pad
VADJ power supply
-
33
TB-FMCH-3GSDI2A Hardware Specification
H-column (FMC Connector for Mezzanine board)
No.
FMC Spec
I/O
Signal Name
Description
1
VREF_A_M2C
-
Test Pad
-
2
PRSNT_M2C_L
-
N/C
-
3
GND
-
-
-
4
CLK0_M2C_P
I
EX_CLKout1_p
Connect to Test pad
5
CLK0_M2C_N
I
EX_CLKout1_n
Connect to Test pad
6
GND
-
-
-
7
LA02_P
I
EX_NO_REF
Connect to Test pad
8
LA02_N
I
EX_NO_ALIGN
Connect to Test pad
9
GND
10
LA04_P
I
EX_NO_LOCK
Connect to Test pad
11
LA04_N
-
N/C
-
12
GND
-
-
-
13
LA07_P
O
EX_SCL_1983
SCL of stacked LMH1983
14
LA07_N
I/O
EX_SDA_1983
SDA of stacked LMH1983
15
GND
-
-
-
16
LA11_P
O
EX_S10
Clock Select signal of stacked board
17
LA11_N
O
EX_S11
Clock Select signal of stacked board
18
GND
-
-
-
19
LA15_P
O
EX_S20
Clock Select signal of stacked board
20
LA15_N
O
EX_S21
Clock Select signal of stacked board
21
GND
-
-
-
22
LA19_P
-
N/C
-
23
LA19_N
-
N/C
-
24
GND
-
-
-
25
LA21_P
-
N/C
-
26
LA21_N
-
N/C
-
27
GND
-
-
-
28
LA24_P
-
N/C
-
29
LA24_N
-
N/C
-
30
GND
-
-
-
31
LA28_P
-
N/C
-
32
LA28_N
-
N/C
-
33
GND
-
-
-
34
LA30_P
-
N/C
-
35
LA30_N
-
N/C
-
36
GND
-
-
-
37
LA32_P
-
N/C
-
38
LA32_N
-
N/C
-
39
GND
-
-
-
40
VADJ
-
FMC_VADJ
VADJ power supply
Rev.1.02
34
TB-FMCH-3GSDI2A Hardware Specification
J-column (FMC Connector for Mezzanine board)
K-column (FMC Connector for Mezzanine board)
No.
FMC Spec
I/O
Signal
Name
Description
No.
FMC Spec
I/O
Signal
Name
Description
1
GND
-
-
-
1
VREF_B_M2C
-
Test
Pad
TP3
2
CLK3_M2C_P
-
N/C
-
2
GND
-
-
-
3
CLK3_M2C_N
-
N/C
-
3
GND
-
-
-
4
GND
-
-
-
4
CLK2_M2C_P
-
N/C
-
5
GND
-
-
-
5
CLK2_M2C_N
-
N/C
-
6
HA03_P
-
N/C
-
6
GND
-
-
-
7
HA03_N
-
N/C
-
7
HA02_P
-
N/C
-
8
GND
-
-
-
8
HA02_N
-
N/C
-
9
HA07_P
-
N/C
-
9
GND
-
-
-
10
HA07_N
-
N/C
-
10
HA06_P
-
N/C
-
11
GND
-
-
-
11
HA06_N
-
N/C
-
12
HA11_P
-
N/C
-
12
GND
-
-
-
13
HA11_N
-
N/C
-
13
HA10_P
-
N/C
-
14
GND
-
-
-
14
HA10_N
-
N/C
-
15
HA14_P
-
N/C
-
15
GND
-
-
-
16
HA14_N
-
N/C
-
16
HA17_P_CC
-
N/C
-
17
GND
-
-
-
17
HA17_N_CC
-
N/C
-
18
HA18_P
-
N/C
-
18
GND
-
-
-
19
HA18_N
-
N/C
-
19
HA21_P
-
N/C
-
20
GND
-
-
-
20
HA21_N
-
N/C
-
21
HA22_P
-
N/C
-
21
GND
-
-
-
22
HA22_N
-
N/C
-
22
HA23_P
-
N/C
-
23
GND
-
-
-
23
HA23_N
-
N/C
-
24
HB01_P
-
N/C
-
24
GND
-
-
-
25
HB01_N
-
N/C
-
25
HB00_P_CC
-
N/C
-
26
GND
-
-
-
26
HB00_N_CC
-
N/C
-
27
HB07_P
-
N/C
-
27
GND
-
-
-
28
HB07_N
-
N/C
-
28
HB06_P_CC
-
N/C
-
29
GND
-
-
-
29
HB06_N_CC
-
N/C
-
30
HB11_P
-
N/C
-
30
GND
-
-
-
31
HB11_N
-
N/C
-
31
HB10_P
-
N/C
-
32
GND
-
-
-
32
HB10_N
-
N/C
-
33
HB15_P
-
N/C
-
33
GND
-
-
-
34
HB15_N
-
N/C
-
34
HB14_P
-
N/C
-
35
GND
-
-
-
35
HB14_N
-
N/C
-
36
HB18_P
-
N/C
-
36
GND
-
-
-
37
HB18_N
-
N/C
-
37
HB17_P_CC
-
N/C
-
38
GND
-
-
-
38
HB17_N_CC
-
N/C
-
39
VIO_B_M2C
-
Test
Pad
TP6
39
GND
-
-
-
40
GND
-
-
-
40
VIO_B_M2C
-
Test
Pad
TP7
Rev.1.02
35
TB-FMCH-3GSDI2A Hardware Specification
Rev.1.02
36
TB-FMCH-3GSDI2A Hardware Specification
PLD Solution Dept. PLD Division
URL: http://solutions.inrevium.com/
E-mail: psd-support@teldevice.co.jp
HEAD Quarter: Yokohama East Square, 1-4 Kinko-cho, Kanagawa-ku, Yokohama City,
Kanagawa, Japan 221-0056
TEL: +81-45-443-4016
FAX: +81-45-443-4058
Rev.1.02
37
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