BoosterPack Development Guide

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BoosterPack Development Guide | Manualzz

Stellaris

®

LM4F120 LaunchPad

Evaluation Kit

B o o s t e r P a c k D e v e l o p m e n t G u i d e

E K - L M 4 F 1 2 0 X L - D G - 0 1

S P M U 2 8 8

Build your own BoosterPack and take advantage of Texas

Instruments’ web site to help promote it!

From sharing a new idea or project, to designing, manufacturing, and selling your own BoosterPack kit,

TI offers a variety of avenues for you to reach potential customers with your solutions.

www.ti.com/stellaris-launchpad

C o p y r i g h t © 2 0 1 2 T e x a s I n s t r u m e n t s

Stellaris LaunchPad BoosterPack Design Guide

Copyright

Copyright © 2012 Texas Instruments, Inc. All rights reserved. Stellaris and StellarisWare are registered trademarks of Texas Instruments. ARM and

Thumb are registered trademarks, and Cortex is a trademark of ARM Limited. Other names and brands may be claimed as the property of others.

Texas Instruments

108 Wild Basin, Suite 350

Austin, TX 78746 http://www.ti.com/stellaris

August 24, 2012 2

Stellaris LaunchPad BoosterPack Development Guide

Table of Contents

Chapter 1: Stellaris® LaunchPad and BoosterPack Expansion Concept and Overview........................... 6

BoosterPack Functional Interface ....................................................................................................................... 7

BoosterPack XL Functional Interface ................................................................................................................. 9

LaunchPad Power Interface ............................................................................................................................. 10

Special Consideration for Shared Pins ............................................................................................................. 11

Stellaris LaunchPad Dimensions and Mating ................................................................................................... 11

BoosterPack Design Guidelines ....................................................................................................................... 12

Appendix A: Schematics................................................................................................................................ 13

Appendix B: References ................................................................................................................................ 17

August 24, 2012 3

Stellaris LaunchPad BoosterPack Development Guide

List of Figures

Figure 1-1. Stellaris® LM4F120 LaunchPad Evaluation Board ......................................................................... 7

August 24, 2012 4

Stellaris LaunchPad BoosterPack Development Guide

List of Tables

Table 1-1. LaunchPad BoosterPack Compatibility Summary........................................................................... 6

Table 1-2. J1Connector .................................................................................................................................... 8

Table 1-3. J2 Connector ................................................................................................................................... 8

Table 1-4. J3 Connector ................................................................................................................................... 9

Table 1-5. J4 Connector ................................................................................................................................... 9

Table 1-6. Stellaris® LaunchPad Jumper List ................................................................................................ 11

August 24, 2012 5

C H A P T E R 1

Stellaris® LaunchPad and BoosterPack Expansion

Concept and Overview

The Texas Instruments’ Stellaris® LM4F120 LaunchPad concept is an extremely low-cost, expandable evaluation system for TI microcontrollers. This concept began with the tremendously successful MSP430™ LaunchPad which introduced a large number of engineers to the TI

MSP430 family of microcontrollers. The TI Stellaris microcontroller family is expanding on that success by introducing the Stellaris® LM4F120 LaunchPad featuring the Stellaris ARM®

Cortex™-M4F LM4F120H5QRFIG microcontroller.

A Stellaris LaunchPad consists of a target microcontroller, an in-circuit debug interface (ICDI) such as JTAG, a regulated power supply, a minimal microcontroller support circuit, a user interface, and a set of expansion headers. The expansion headers are referred to as the BoosterPack interface.

A BoosterPack is an expansion card designed for this interface. This interface provides a mechanism for developers to easily extend the Stellaris LaunchPad with application- and user-specific functions.

The Stellaris LaunchPad provides a BoosterPack interface that is compatible with the MSP430

LaunchPad. In addition, the Stellaris LaunchPad provides access to additional Stellaris functionality through an extended BoosterPack interface called the BoosterPack XL Interface.

BoosterPack interfaces with highly similar functionality for expansion will be available for the

Stellaris LaunchPad, in addition to microcontroller-family-specific functionality available on a

BoosterPack XL Interface for additional options. Table 1-1 provides a summary of BoosterPack

interface compatibility.

Table 1-1.

LaunchPad BoosterPack Compatibility Summary

LaunchPad

Stellaris LaunchPad

MSP430 LaunchPad

Other TI LaunchPads

Yes

Yes

Yes

Compatible with...

BoosterPack Interface

BoosterPack XL

Interface

Yes

No

No

This development guide provides necessary design information for developers who want to create

BoosterPacks that extend the functionality of the Stellaris® LaunchPad using either the original

BoosterPack or the BoosterPack XL Interface. Figure 1-1 on page 7 shows a photo of the

Stellaris® LaunchPad.

August 24, 2012 6

Stellaris LaunchPad BoosterPack Development Guide

Figure 1-1.

Stellaris® LM4F120 LaunchPad Evaluation Board

BoosterPack Functional Interface

The Stellaris® LaunchPad's BoosterPack Interface provides compatibility with the original

MSP430 LaunchPad's BoosterPack interface. This interface consists of the outer 10 pin headers.

The pins are spaced 0.10-inch apart with the two headers located 1.8 inches apart.

Table 1-2, ”J1Connector” on page 8 and Table 1-3, ”J2 Connector” on page 8 provide information

for which Stellaris microcontroller peripherals are routed to each of the interface pins. The J1 connector is located on the far left side of the Stellaris LaunchPad. The J2 connector is located on the far right side of the Stellaris LaunchPad. Software is used to configure the LM4F120 pin for one of the functions found in the table. Highlighted functions indicate configuration for compatibility with the MSP430 LaunchPad.

August 24, 2012 7

Stellaris LaunchPad BoosterPack Development Guide

Table 1-2. J1Connector

J1 Pin GPIO Stellaris Pin

1.05

1.06

1.07

1.08

1.01

1.02

1.03

1.04

1.09

1.10

PB5

PB0

PB1

PE4

PE5

PB4

PA5

PA6

PA7

57

45

46

59

60

58

22

23

24

AIN11

-

-

AIN9

AIN8

AIN10

-

-

-

GPIOAMSEL 1

-

U1Rx

U1Tx

U5Rx

U5Tx

-

-

-

-

GPIOPCTL Register Setting

2 3

3.3 V

SSI2Fss

-

-

-

-

-

I2C2SCL -

I2C2SDA

SSI2Clk

SSI0Tx -

I2C1SCL -

I2C1SDA

7 8

T1CCP1 CAN0Tx

T2CCP0 -

T2CCP1

-

-

CAN0Rx

CAN0Tx

T1CCP0 CAN0Rx

-

-

-

-

-

-

9

-

-

-

-

-

-

-

-

-

14

Table 1-3. J2 Connector

GPIOPCTL Register Setting

J2 Pin GPIO Stellaris Pin

GPIOAMSEL 1 2 3 7 8 9 14

2.01

2.02

2.03

2.04

a

PB2

PE0

PF0

47

9

28

-

AIN3

-

-

U7Rx

U1RTS

GND

-

-

SSI1Rx

I2C0SCL

-

CAN0Rx

T3CCP0

-

T0CCP0

-

-

NMI

-

-

C0o

2.05

2.06

b

2.07

c

PB7

PB6

4

1

-

-

-

-

RESET

SSI2Tx -

-

T0CCP1

T0CCP0

-

-

-

SSI2Rx

SSI0Rx 2.08

2.09

PA4

PA3

21

20

-

-

-

-

-

-

-

-

-

-

-

SSI0Fss

SSI0Clk 2.10

PA2 19 a.

Not recommended for BoosterPack use. J2.04 is a TEST pin on the MSP430 LaunchPad. This signal tied to on-board function via 0-

Ω resistor.

b.

J2.06 (PB7) is also connected via 0-

Ω resistor to J3.04 (PD1) to provide MSP430 LaunchPad Compatible I2C SDA Signal.

c.

J2.07 (PB6) is also connected via 0-

Ω resistor to J3.03 (PD0) to provide MSP430 LaunchPad Compatible I2C SCL Signal

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

August 24, 2012 8

Stellaris LaunchPad BoosterPack Development Guide

BoosterPack XL Functional Interface

The BoosterPack XL Interface consists of the J1 and J2 connectors as well as the inner 10-pin headers spaced 1.6 inches apart directly inside of the MSP430 LaunchPad-compatible

BoosterPack interface headers. The pins are spaced on 0.10-inch centers. These inner 10-pin headers (connectors J3 and J4) are not intended to be compatible with other TI LaunchPads or

LaunchPad XL's. This is a Stellaris-only interface. TI recommends that LaunchPads provide analog functions on the left side of the BoosterPack XL interface and timer or PWM functions on the right side of the BoosterPack XL interface. Stellaris conforms to these recommendations. No effort has been made to make this interface compatible with any other LaunchPad.

Table 1-4 and Table 1-5 show which Stellaris peripherals are routed to each pin of the

Stellaris-only BoosterPack XL Interface pins. J3 is the inner left BoosterPack XL Interface header.

J4 is the inner right BoosterPack XL Interface header. Software is used to configure the LMF4120 pin for one of the functions found in the table.

Table 1-4. J3 Connector

GPIOPCTL Register Setting

J3 Pin GPIO Stellaris Pin

GPIOAMSEL 1 2 3 7

3.01

3.02

3.03

3.04

3.05

3.06

3.07

3.08

PD0

PD1

PD2

PD3

PE1

PE2

61

62

63

64

8

7

AIN7

AIN6

AIN5

AIN4

AIN2

AIN1

SSI3Clk

SSI3Fss

SSI3Rx

SSI3Tx

U7Tx

-

5.0V

GND

SSI1Clk

SSI1Fss

SSI1Rx

SSI1Tx

-

-

I2C3SCL

I2C3SDA

-

-

-

-

WT2CCP0

WT2CCP1

WT3CCP0

WT3CCP1

-

-

3.09

PE3 6 AIN0 -

3.10

a

PF1 29 U1CTS SSI1Tx T0CCP1 a.

Not recommended for BoosterPack use. This signal tied to on-board function via 0-

Ω resistor.

Table 1-5. J4 Connector

J4 Pin GPIO Stellaris Pin

4.01

a

4.02

a

PF2

PF3

30

31

GPIOAMSEL

-

-

1

-

-

GPIOPCTL Register Setting

2

SSI1Clk

SSI1Fss

3

-

CAN0Tx

7

T1CCP0

T1CCP1

8

-

-

8

-

-

-

-

-

-

-

-

9

-

-

9

-

-

-

C1o

-

-

-

-

14

-

-

-

TRD1

-

-

-

-

4.03

4.04

4.05

4.06

PB3

PC4

PC5

PC6

48

16

15

14

-

C1-

C1+

C0+

-

U4Rx

U4Tx

U3Rx

-

U1Rx

U1Tx

-

I2C0SDA

-

-

-

T3CCP1 -

WT0CCP0 U1RTS

WT0CCP1 U1CTS

WT1CCP0 -

-

-

-

-

14

TRD0

TRCL

K

-

-

-

-

August 24, 2012 9

Stellaris LaunchPad BoosterPack Development Guide

Table 1-5. J4 Connector (Continued)

GPIOPCTL Register Setting

J4 Pin GPIO Stellaris Pin

GPIOAMSEL 1 2 3 7

4.07

4.08

PC7

PD6

13

53

C0-

-

U3Tx

U2Rx

-

-

-

-

WT1CCP1

WT5CCP0

4.09

PD7 10 U2Tx WT5CCP1

4.10

a

PF4 5 T2CCP0 a.

Not recommended for BoosterPack use. This signal tied to on-board function via 0-

Ω resistor.

8

-

-

NMI

-

9

-

-

-

-

14

-

-

-

-

LaunchPad Power Interface

The Stellaris LaunchPad has provisions to provide power to a BoosterPack through either the

BoosterPack interface or the BoosterPack XL Interface. The configuration of power and ground pins on both of these interfaces must be consistent across LaunchPads from all TI microcontroller families.

The Stellaris LaunchPad draws power from either of the on-board USB interfaces as selected by the power switch in the top left corner of the board. Typically, the USB connection provides

500 milliamps at 5 V to the Stellaris LaunchPad. The selected USB power source is made directly available to the BoosterPack XL Interface on the J3.01 pin. This is a direct connection with only small decoupling capacitors provided on the Stellaris LaunchPad.

All LaunchPads, including the Stellaris LaunchPad, also provide a 3.3-V supply on pin J1.01 of the

BoosterPack interface. On the Stellaris LaunchPad, this is sourced by a TPS73633 LDO voltage regulator which converts the selected 5-V USB power to 3.3 V. The regulator is capable of sourcing 400 milliamps at 3.3 V. This 3.3-V supply is shared between the BoosterPack interface, the in-circuit debug interface (ICDI), and the target microcontroller. Therefore, under normal circumstances, about 300 to 350 milliamps are available to the BoosterPack interface. Detailed power management is left to the BoosterPack developer who must also manage the application to be run on the target microcontroller.

The Stellaris LaunchPad can be powered through an external supply on a BoosterPack. If providing power to the Stellaris LaunchPad from a BoosterPack, move the power select switch to select an unused USB connection to prevent power bus contention between the BoosterPack and the USB connection. Power may be supplied to either the 3.3 V or the 5.0-V system but not both.

Providing external power to both 5 V and 3.3 V would result in a contention between the external power supplies and the Stellaris LaunchPad's voltage regulator. Providing only 3.3 V will result in some lost functionality such as the on-board LED’s. It may also result in reverse current leakage through the on-board voltage regulator. Therefore, it is recommended if providing power externally to use either the existing USB connections or an external 5-V supply from a BoosterPack.

Ground connections are available on pins J2.01 and J3.02. These provide a ground connection for both the BoosterPack interface and the BoosterPack XL Interface respectively.

Additional power and ground pins are available through labeled pins located in the extreme lower corners of the Stellaris LaunchPad. These are connected to the same 3.3 V, 5 V, and ground connections as the pins on the BoosterPack interface and the BoosterPack XL Interface.

August 24, 2012 10

Stellaris LaunchPad BoosterPack Development Guide

Special Consideration for Shared Pins

To provide compatibility with the MSP430 LaunchPad's BoosterPack interface and to provide a maximum number of signals to the BoosterPack interface and BoosterPack XL Interface, it was necessary to route some signals to more than one pin. In addition, certain on-board functions such as the button and LED signals are available on the BoosterPack interface and BoosterPack XL

Interface. A 0-

Ω jumper resistor was installed for signals that are used for more than one purpose or routed to more than one GPIO. Removal of this jumper disconnects the functions. All jumpers

are installed by default. A listing of these jumpers and their use is provided in Table 1-6.

Table 1-6. Stellaris® LaunchPad Jumper List

Resistor

R1

R2

R8

R9

R10

R11

R12

R13

Primary Function Alternate Function Comments

Right User Switch

Red LED

Hibernate Wake

PB6 SSI2 TX on J2.07

PB7 SSI2 RX on J2.06

Blue LED

Green LED

Left User Switch

J2.04

To PF1 and J3.10

To PF0 and J2.04 via R1 Allows user switch 2 to wake device from hibernate. Also ties wake to J2.04 to allow BoosterPack to wake Stellaris LaunchPad from

Hibernate.

PD0 I2C SCL

on J2.07

Routes I2C from PD0 to J2.07 for MSP430 Stellaris LaunchPad compatibility. If using PD0 or PB6, the unused GPIO must be configured as an input or R9 removed.

PD1 I2C SDA on J2.06

To PF2 and J4.01

Routes I2C from PD1 to J2.06 for MSP430 Stellaris LaunchPad compatibility. If using PD1 or PB7, the unused GPIO must be configured as an input or R9 removed.

If removed: allows extra GPIO to the BoosterPack XL interface. If installed (default): allows BoosterPack to drive LED or sense LED state.

Also provides Embedded Trace signal TRD0.

To PF3 and J4.02

To PF4 and J4.10

Test pin on MSP430 LaunchPad. This connection along with R13 provides Hibernate wake to BoosterPack interface

If removed: allows extra GPIO to the BoosterPack XL interface. If installed (default): allows booster pack to drive LED or sense LED state.

Also provides Embedded Trace signal TRD1.

If removed: allows extra GPIO to the BoosterPack XL interface. If installed (default): allows BoosterPack to drive LED or sense LED state.

Also provides Embedded Trace signal TRDCLK.

If removed: allows extra GPIO to the BoosterPack XL interface. If installed (default): allows BoosterPack to simulate switch press or sense switch state.

Stellaris LaunchPad Dimensions and Mating

Figure 1-1 on page 7 shows a dimensional drawing of the Stellaris LaunchPad. J1 and J2 are

1.8 inches apart and constitute the BoosterPack interface. J3 and J4 are 1.6 inches apart and constitute the BoosterPack XL Interface. Other major board signals are available on unpopulated headers on a 0.1 inch grid. Dimensions to these signals are provided for convenience. These signals are subject to change or move across revisions of the Stellaris LaunchPad or future

LaunchPads. It is recommended that BoosterPacks use only the BoosterPack interface and

BoosterPack XL Interface. Use of other pins and signals is acceptable but these pins and signals can change at any time.

August 24, 2012 11

Stellaris LaunchPad BoosterPack Development Guide

BoosterPack Design Guidelines

Follow these guidelines when designing your BoosterPack:

„ BoosterPacks should not extend more than 0.350 inches above the center of the top

BoosterPack interface pin.

„ BoosterPacks should not extend more than 0.150 inches below the center of the bottom pin of the BoosterPack interface.

Note: BoosterPacks that extend more than 0.150 inches below the center of the bottom pin will partially cover the Stellaris LaunchPad user switches which can result in lost user access to those user inputs.

„ BoosterPacks are not restricted in width and may extend as much as desired left and right of the Stellaris LaunchPad.

„ For BoosterPacks with RF antennas, place the antenna to the left or right of the Stellaris

LaunchPad for minimal interference and signal attenuation.

„ The BoosterPack interface does not provide any means of keying or alignment guidance. It is recommended that visual cues be provided on the BoosterPack to assist user in proper orientation of the BoosterPack.

„ If possible, design the BoosterPack so that incorrect mating to a Stellaris LaunchPad will not damage the BoosterPack.

August 24, 2012 12

A P P E N D I X A

Schematics

This section contains the schematics for the Stellaris® LaunchPad evaluation board:

„ Microcontroller, USB, Expansion, Buttons, and LED on page 14

„ Power Management on page 15

„ Stellaris In-Circuit Debug Interface (ICDI) on page 16

August 24, 2012 13

Microcontroller, USB, Expansion, Buttons, and

LED

DEBUG/VCOM

PA0/U0RX_VCP_TXD

PA1/U0TX_VCP_RXD GPIO

PA2

PA3

PA4

PA5

PA6

PA7

DEBUG_PC0/TCK/SWCLK

DEBUG_PC1/TMS/SWDIO

DEBUG_PC2/TDI

DEBUG_PC3/TDO/SWO

PC4

PC5

PC6

PC7

PE0

PE1

PE2

PE3

PE4

PE5

U1-A

17

18

19

20

21

22

23

24

52

51

50

49

16

15

14

13

59

60

9

8

7

6

PE0

PE1

PE2

PE3

PE4

PE5

PC0

PC1

PC2

PC3

PC4

PC5

PC6

PC7

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

LM4F120

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PD0

PD1

PD2

PD3

PD4

PD5

PD6

PD7

61

62

63

64

43

44

53

10

PF0

PF1

PF2

PF3

PF4

28

29

30

31

5

1

4

45

46

47

48

58

57

PD0

PD1

PD2

PD3

USB_DM

USB_DP

PD6

PD7

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PF0

PF1

PF2

PF3

PF4

GPIO

+USB_VBUS

0

R15

9

8

J9

CON-USB-MICROB

7

6

+USB_VBUS

0

R14

USB_DP

USB_DM

Used for VBUS detection when configured as a self-powered USB Device

0

0

0

0

0

R1

R2

R11

R12

R13

USR_SW2

LED_R

LED_B

LED_G

USR_SW1 PD0

PD1

0

R9

0

R10

PB6

PB7

SW1

USR_SW1

LED_R

LED_G

LED_B

B

B

B

C

R3

330

Q1

DTC114EET1G

E

C

R5

330

Q3

DTC114EET1G

E

C

R4

330

Q2

DTC114EET1G

E

+VBUS

2

3

4

R

G

B

D1

A

1

RGB_LED_0404_COMA

WAKE

USR_SW2

R8

330

SW2

DESIGNER

DGT

PROJECT

REVISION

0.1

Stellaris Launchpad

DESCRIPTION

J1 and J2 provide compatability with

Booster Packs designed for MSP430 Launchpad

J3 and J4 sit 100 mils inside J1 and J2 to provide extended functions specific to this board.

See the board user manual for complete table of pin mux functions

GPIO

J1

7

8

5

6

3

4

1

2

9

10

CON_110_100

+3.3V

PB5

PB0

PB1

PE4

PE5

PB4

PA5

PA6

PA7

PB2

PE0

PF0

PB7

PB6

PA4

PA3

PA2

TARGETRST

J2

7

8

5

6

3

4

1

2

9

10

CON_110_100

+VBUS

J3

7

8

5

6

3

4

1

2

9

10

CON_110_100

PD0

PD1

PD2

PD3

PE1

PE2

PE3

PF1

PF2

PF3

PB3

PC4

PC5

PC6

PC7

PD6

PD7

PF4

J4

7

8

5

6

3

4

1

2

9

10

CON_110_100

DATE

8/23/2012

TEXAS INSTRUMENTS

Microcontroller, USB, Expansion, Buttons and LED

FILENAME

EK-LM4F120XL Rev A.sch

PART NO.

EK-LM4F120XL

108 WILD BASIN ROAD, SUITE 350

AUSTIN TX, 78746 www.ti.com/stellaris

SHEET

1 OF 3

Power Management

+USB_VBUS

H18

+ICDI_VBUS

H19

6

4

1

Power Select

SW3

2

3

5

+VBUS

+VBUS

H17 H23

+3.3V 400mA Regulator

8

5

U8

TPS73633DRB

IN OUT

1

3

EN

GND

NR

PAD C14

1.0uF

H22

C18

0.01uF

+3.3V

+VBUS

+3.3V

TLV803

3

RESET

VDD

GND

2

1

U4

R17

10k

3

K

D2

A

1

A

2

TARGETRST

ICDI_RST

+MCU_PWR

RESET

RESET

R28

10k

C13

0.1uF

OMIT

H20

Y2

16MHz

C31

10pF

C32

10pF

32.768Khz

Y1

TARGETRST

38

41

40

34

35

36

3

12

27

39

55

RESET

OSC1

OSC0

U1-B

WAKE

32

HIB

33

VBAT

37

XOSC0

GNDX

XOSC1

GNDA

VDDA

VDD

VDD

VDD

VDD

2

11

26

42

54

GND

GND

GND

GND

VDDC

VDDC

25

56

LM4F120

H21

WAKE

HIB

H24 and H25 installed as a single 1x2 header on 100 mil center with jumper

+MCU_PWR

H24 H25

+3.3V

0

R30

OMIT

C3

0.01uF

C4

0.1uF

C10

0.1uF

C11

0.1uF

C5

0.01uF

C6

0.1uF

+MCU_VDDC

C8

0.01uF

C7

1.0uF

C12

1.0uF

C22

2.2uF

H13 H10

H11 H12

DESIGNER

DGT

REVISION

0.1

PROJECT

Stellaris Launchpad

DESCRIPTION

DATE

8/23/2012

Power Management

FILENAME

EK-LM4F120XL Rev A.sch

TEXAS INSTRUMENTS

108 WILD BASIN ROAD, SUITE 350

AUSTIN TX, 78746 www.ti.com/stellaris

PART NO.

EK-LM4F120XL

SHEET

2 OF 3

Stellaris In-Circuit Debug Interface (ICDI)

ICDI_RST

+3.3V

R19

10k

C34

0.1uF

OMIT

Y5

16MHz

C25

10pF

C26

10pF

DEBUG/VCOM

PA1/U0TX_VCP_RXD

PA0/U0RX_VCP_TXD

+MCU_PWR

R18

10k

DEBUG_PC0/TCK/SWCLK

DEBUG_PC1/TMS/SWDIO

DEBUG_PC3/TDO/SWO

DEBUG_PC2/TDI

TARGETRST

EXTDBG

+3.3V

R23

10k

H14

R21

10k

R22

10k

ICDI_TCK

ICDI_TMS

ICDI_TDI

ICDI_TDO

+3.3V

38

41

40

34

35

36

3

12

27

39

55

RESET

U2-B

WAKE

OSC1

OSC0

XOSC0

GNDX

XOSC1

GNDA

32

HIB

33

VBAT

VDD

VDD

VDD

VDD

37

VDDA

2

11

26

42

54

GND

GND

GND

GND

VDDC

VDDC

25

56

LM4F120

+3.3V

C15

0.01uF

C17

0.1uF

C19

0.01uF

C20

0.1uF

C21

0.01uF

C1

1.0uF

C23

0.1uF

C24

0.1uF

C2

1.0uF

C9

2.2uF

Stellaris In-Circuit Debug Interface (ICDI)

+3.3V

U2-A

17

18

19

20

21

22

23

24

52

51

50

49

16

15

14

13

59

60

9

8

7

6

PE0

PE1

PE2

PE3

PE4

PE5

PC0

PC1

PC2

PC3

PC4

PC5

PC6

PC7

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

LM4F120

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PD0

PD1

PD2

PD3

PD4

PD5

PD6

PD7

PF0

PF1

PF2

PF3

PF4

28

29

30

31

5

61

62

63

64

43

44

53

10

45

46

47

48

1

4

58

57

R24

330

DEBUG_PC3/TDO/SWO

DEBUG_PC1/TMS/SWDIO

DEBUG_PC0/TCK/SWCLK

+ICDI_VBUS

3

4

5

1

2

VB

D-

D+

ID

G

0

R16

ICDI_TCK

ICDI_TMS

3

2

1

5

4

ICDI JTAG

J5

6

7

8

9

10

TC2050-IDC-NL

ICDI_TDO

ICDI_TDI

ICDI_RST

DESIGNER

DGT

REVISION

0.1

PROJECT

Stellaris Launchpad

DESCRIPTION

SStellaris In Circuit Debug Interface

DATE

8/23/2012

FILENAME

EK-LM4F120XL Rev A.sch

TEXAS INSTRUMENTS

108 WILD BASIN ROAD, SUITE 350

AUSTIN TX, 78746 www.ti.com/stellaris

PART NO.

EK-LM4F120XL

SHEET

3 OF 3

A P P E N D I X B

References

In addition to this document, the following references are included on the Stellaris LaunchPad

Evaluation Kit CD and are also available for download at www.ti.com

.

„ Stellaris LaunchPad (EK-LM4120XL) User's Manual, publication EK-LM4F120-XL

„ Stellaris LM4F120H5QRFIG Microcontroller Data Sheet, publication DS-LM4F120H5QR

„ StellarisWare® Driver Library

„ StellarisWare® Driver Library User’s Manual, publication SW-DRL-UG

Information on development tool being used:

„ Texas Instruments’ Code Composer Studio™ IDE web site, www.ti.com/ccs

August 24, 2012 17

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.

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Products

Audio

Amplifiers

Data Converters

DLP® Products

DSP

Clocks and Timers

Interface www.ti.com/audio amplifier.ti.com

dataconverter.ti.com

www.dlp.com

dsp.ti.com

www.ti.com/clocks interface.ti.com

Applications

Automotive and Transportation www.ti.com/automotive

Communications and Telecom www.ti.com/communications

Computers and Peripherals www.ti.com/computers

Consumer Electronics

Energy and Lighting

Industrial

Medical www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical

Logic

Power Mgmt

Microcontrollers

RFID logic.ti.com

power.ti.com

microcontroller.ti.com

www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

Security www.ti.com/security

Space, Avionics and Defense www.ti.com/space-avionics-defense

Video and Imaging www.ti.com/video

TI E2E Community

e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2012, Texas Instruments Incorporated

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