UM10917 - NXP Semiconductors
UM10917
NXQ1TXA5DB1340 one-chip 5 V Qi wireless transmitter demo
board
Rev. 1 — 3 August 2015
User manual
Document information
Info
Content
Keywords
NXQ1TXA5DB1340, NXQ1TXA5, wireless charger, high efficiency,
CoolFlux DSP, A5, A11 Qi
Abstract
This user manual describes the NXQ1TXA5DB1340 wireless power
transmitter WPC1.1 demo board. It is designed for A11 Qi coils, based on
the NXP Semiconductors NXQ1TXA5 fully integrated wireless power
transmitter IC for Qi compliant 5 V low-power transmitters.
The hardware is described and a brief description for operating the board
is given.
UM10917
NXP Semiconductors
NXQ1TXA5DB1340 one-chip 5 V Qi wireless transmitter demo board
Revision history
Rev
Date
Description
v.1
20150803
first issue
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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User manual
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Rev. 1 — 3 August 2015
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UM10917
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NXQ1TXA5DB1340 one-chip 5 V Qi wireless transmitter demo board
1. Introduction
Fig 1.
NXQ1TXA5DB1340 demo board
This user manual describes the NXQ1TXA5DB1340 wireless power transmitter WPC1.1
demo board. The demo board is designed for A11 Qi coils, based on the
NXP Semiconductors NXQ1TXA5 fully integrated wireless power transmitter IC for Qi
compliant 5 V low-power transmitters. The NXQ1TXA5 comes in a 5 mm  5 mm
HVQFN32 package.
Necessary information is given for a quick start-up of the demo board (see Chapter 2 Setup and operation of the NXQ1TXA5DB1340 demo board). Additional general
information about the NXQ1TXA5 IC can be found in the “One-chip 5 V Qi wireless
transmitter” data sheet (Ref. 1). All relevant general application information can be found
in the “NXQ1TXA5 one-chip 5 V Qi wireless transmitter” application note (Ref. 2).
1.1 NXQ1TXA5 features
• Single-chip WPC 1.1.2 Qi-compliant device for A5/A11/A12/A16 5 V single-coil
low-power transmitter
• Operates from 5 V supply
• Integrated high-efficiency full-bridge power stage with low EMI radiation meeting
EN55022 radiated and conducted emission limits
•
•
•
•
•
•
UM10917
User manual
Very few external components required, minimizing cost and board space
Extremely low-power receiver detection circuitry; standby power 10 mW (typical)
Power stage fully protected against overcurrent and overtemperature
Fully integrated accurate coil current measurement
Demodulates and decodes communication packages from Qi-compliant receivers
PID regulation for closed-loop power drive and control
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NXQ1TXA5DB1340 one-chip 5 V Qi wireless transmitter demo board
•
•
•
•
•
•
Internal 1.8 V digital supply generation
LED (2) and buzzer outputs
NTC input for external temperature check and protection
On-chip thermal protection
Small HVQFN 32-pin package (5 mm  5 mm) with a 0.5 mm pitch
Foreign Object Detection (FOD) with automatic switching between version 1.1 and
version 1.0 for legacy receiver support
• FOD levels can be adjusted using external resistors to compensate for application
differences to meet Qi certification requirements
• Smart Power Limiting (SPL) function to adapt to power-limited 5 V supplies
• Static Power Reduction (SPR) function to limit power consumption
• Supports Near Field Communication (NFC) TAG applications with a delayed start-up
1.2 NXQ1TXA5DB1340 demo board features
The NXQ1TXA5DB1340 demo board is designed in such a way that it is easy to operate
the NXQ1TXA5 device for demonstration and development purposes. The demo board is
a good starting point for a fully qualified NXQ1TXA5-based application that can be
mass-produced. The demo board contains the following components and features:
•
•
•
•
NXQ1TXA5 integrated wireless power transmitter IC
A blue LED serving as power indicator
A red and green LED serving as functional (user interface) indicators
Resonant capacitors (NP0 type) which together with the Qi transmitter coil make up
the LC tank
• A female micro USB receptacle for powering the board with a standard USB charger
with rating of 1500 mA or more
•
•
•
•
A11 Qi transmitter coil
Resistors for FOD calibration settings
Resistors for LED mode settings
Solder jumpers for Smart Power Limiting (SPL) and Static Power Reduction (SPR)
settings
• Optional Negative Temperature Coefficient (NTC) connections to measure the coil
temperature
• Optional buzzer connection
• Optional communication interface (beyond the scope of this manual)
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2. Setup and operation of the NXQ1TXA5DB1340 demo board
2.1 NXQ1TXA5DB1340 board overview
Fig 2.
NXQ1TXA5DB1340 demo board assembly - top side
2.2 Connectors
The NXQ1TXA5DB1340 demo board incorporates an on-board female micro-USB
receptacle. Via this connector 5 V is supplied to the board. A standard USB adapter (5 V,
minimum 1.5 A) can be used to feed the board.
Optionally, a 10-pole dual-in-line connector can be mounted in the X2 position. With this
connector, it is possible to communicate with the NXQ1TXA5 IC via I2C. Because
communication with the NXQ1TXA5 IC is outside the scope of this manual, no further
details are given here.
The two-wire connection X14 can be used to connect a buzzer. In that case, resistor R34
(1 k) must also be mounted. The voltage on the CONFIG pin (pin 12) defines the
behavior of the buzzer (See Section 2.4 and “NXQ1TXA5 one-chip 5 V Qi wireless
transmitter” application note (Ref. 2)).
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NXQ1TXA5DB1340 one-chip 5 V Qi wireless transmitter demo board
2.3 Jumpers
The NXQ1TXA5DB1340 demo board contains two mounting positions for very low-ohmic
0805-size jumpers in the 5 V supply section (R43 and R44). By default these jumpers are
mounted. When the jumpers are removed, a common-mode choke must be mounted in
the L3 position. The mounted common-mode choke offers the opportunity to suppress
residual conducted EMI that originates from the NXQ1TXA5 operation. However, in most
applications using the L3 common mode choke is not necessary.
SPR and SPL can be configured with the solder jumpers in the R30, R31, R32 and R33
position. By default, R30 and R32 are open and R31 and R33 are closed (SPR1 and
SPR2 pins both grounded). Consequently, on delivery the SPR function is disabled.
Details about alternative options are given in the “NXQ1TXA5 one-chip 5 V Qi wireless
transmitter” application note (Ref. 2).
Table 1.
SPL status and SPR level
SPR1
SPR2
SPL status and SPR level
0 (ground)
0 (ground)
SPL on; no SPR limiting
0 (ground)
1 (VDDP)
SPL on; 500 mA
1 (VDDP)
0 (ground)
SPL on; 1000 mA
1 (VDDP)
1 (VDDP)
SPL off; no SPR limiting
By default, the 0603-size jumper in position R15 sets the logic level on the NFC_FD_N pin
(pin 6) high. By this setting there is no start-up delay that would allow NFC communication
to finalize before power transfer begins.
2.4 Configuration and FOD settings
To set the LED/buzzer mode configuration and the FOD parameters, four pairs of resistors
are used:
• The R5/R6 pair sets the voltage level on the CONFIG pin (pin 12). The voltage on this
pin defines the operation mode of LEDs and the buzzer (see also Section 2.5). In the
default configuration mode, "Two LED 1" is selected. Table 2 lists the modes that are
available. Table 3 and Table 4 describe the behavior of the LEDs and the buzzer for
each of these modes.
• The R11/R12 pair sets the voltage on the FOD1 pin (pin 9). The voltage on the FOD1
pin sets the FOD threshold level. In the default configuration (R11 = 390 k;
R12 = 68 k), the FOD threshold level is set to 0.5 W. Table 5 gives an overview of
the selectable FOD1 voltage levels and the consequences for FOD behavior.
• The R9/R10 pair sets the voltage on the FOD2 pin (pin 10). The voltage on the FOD2
pin sets the B-coefficient in FOD power loss estimation equation. For details, see the
“One-chip 5 V Qi wireless transmitter” data sheet (Ref. 1) and the “NXQ1TXA5
one-chip 5 V Qi wireless transmitter” application note (Ref. 2). In the default
configuration (R9 = 390 k; R10 = 82 k), the B-coefficient is set to 0.108.
Table 6 gives an overview of the selectable FOD2 voltage levels and the
consequences for FOD behavior.
• The R7/R8 pair sets the voltage on the FOD3 pin (pin 11). The voltage on the FOD3
pin sets the C-coefficient in FOD power loss estimation equation. For details, see the
“One-chip 5 V Qi wireless transmitter” data sheet (Ref. 1) and the “NXQ1TXA5
one-chip 5 V Qi wireless transmitter” application note (Ref. 2). In the default
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NXQ1TXA5DB1340 one-chip 5 V Qi wireless transmitter demo board
configuration (R7 = 390 k; R10 = OPEN), the C-coefficient is set to 0.012.
Table 7 gives an overview of the selectable FOD3 voltage levels and the
consequences for FOD behavior.
Summary
Upon delivery, FOD is enabled with the FOD threshold level set to 0.5 W, B = 0.108,
and C = 0.012. Additional details concerning FOD (FOD1, FOD2 and FOD3) settings
and calibration can be found in the “One-chip 5 V Qi wireless transmitter” data sheet
(Ref. 1) and the “NXQ1TXA5 one-chip 5 V Qi wireless transmitter” application note
(Ref. 2).
Table 2.
UM10917
User manual
Mode selection
Input voltage on pin CONFIG
Mode name
VCONFIG < 40 mV
two LED 1
85 mV < VCONFIG < 165 mV
two LED 2
210 mV < VCONFIG < 290 mV
two LED 3
335 mV < VCONFIG < 415 mV
two LED 4
460 mV < VCONFIG < 540 mV
two LED 5
585 mV < VCONFIG < 665 mV
two LED 6
710 mV < VCONFIG < 790 mV
two LED 7
835 mV < VCONFIG < 915 mV
two LED 8
960 mV < VCONFIG < 1040 mV
one LED 1 & 2
1085 mV < VCONFIG < 1165 mV
one LED 3 & 4
1210 mV < VCONFIG < 1290 mV
one LED 5 & 6
VCONFIG > 1335 mV
debug LED
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LED modes
LED Mode Digital_Ping - LED_G
Charging - LED_G
(Power_Transfer mode)
Receiver
Fault detected[2]
[1]
charged
LED_R
LED_G
Two LED 1 blink for 100 ms every 4 seconds
blink for 100 ms every 400 ms when object detected
on: full power
blink at 0.5 Hz: limited power
(SPL, SPR or average current
exceeds 2 A)
off
Two LED 2 off
Two LED 3 blink for 100 ms every 4 seconds
blink for 100 ms every 400 ms when device detected
blink at 1 Hz
off
off
off
off
Two LED 5 blink for 100 ms every 4 seconds
blink for 100 ms every 400 ms when device detected
off
Two LED 6 off
off
Two LED 7 off
blink at 0.5 Hz
blink at 1 Hz
blink at 1 Hz
off
blink at 2 Hz
blink at 2 Hz
off
x
blink at 2 Hz for
TX/RX error; no
blink on FOD
off
off
x
LED_G: off
off
x
blink at 2 Hz for
TX/RX error; no
blink on FOD
LED_R
Two LED 8 reserved
LED_G: blink for 100 ms every 4 seconds
on: full power
blink for 100 ms every 400 ms when device detected blink at 0.5 Hz: limited power
(SPL, SPR or average current
exceeds 2 A)
LED_R blink for 100 ms every 4 seconds
blink for 100 ms every 400 ms when device detected
One LED
3 & 4[3]
One LED
5 & 6[3]
off
off
x
LED_G: blink for 100 ms every 4 seconds
blink at 0.5 Hz
blink for 100 ms every 400 ms when device detected
off
on
x
blink at 2 Hz for
TX/RX error; no
blink on FOD
LED_R
on
off
x
off
[1]
‘charge complete’ or ‘charge status 100 %’ message received via RX (NXQ1TXA5 remains in Power_Transfer mode while ‘charge status 100 %’ is reported; it switches to Charged
mode when a ‘charge complete’ message is received).
[2]
Receiver reports ‘internal fault’, ‘overtemperature’, ‘battery failure’, or ‘no response’. Transmitter reports OTP or FOD. If the receiver reports ‘overcurrent’, ‘overvoltage’, or
‘unknown’, the device restarts and goes back to ping state.
[3]
User can connect LED to either LED_R or LED_G; so the voltage on CONFIG could be used to enable two separate One LED modes.
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Debug LED reserved
NXQ1TXA5DB1340 one-chip 5 V Qi wireless transmitter demo board
Rev. 1 — 3 August 2015
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Two LED 4 off
One LED
1 & 2[3]
NXP Semiconductors
UM10917
User manual
Table 3.
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NXP Semiconductors
UM10917
User manual
Table 4.
Buzzer modes
LED mode
Buzzer mode
Receiver fully charged
Error (FOD, OTP, RX); ASK time-out
not an error
Two LED 1
two short beeps on entering state
off
one short beep every 4 S while in state
Two LED 2
two short beeps on entering state
off
one short beep every 4 S while in state
Two LED 3
two short beeps on entering state
4 short beeps on entering state
one short beep every 4 S while in state
Two LED 4
two short beeps on entering state
4 short beeps on entering state
one short beep every 4 S while in state
Two LED 5
two short beeps on entering state
off
one short beep every 4 S while in state
Two LED 6
two short beeps on entering state
off
one short beep every 4 S while in state
Two LED 7
two short beeps on entering state
4 short beeps on entering state
one short beep every 4 S while in state
Two LED 8
two short beeps on entering state
4 short beeps on entering state
one short beep every 4 S while in state
One LED 1&2
two short beeps on entering state
off
one short beep every 4 S while in state
One LED 3&4
two short beeps on entering state
4 short beeps on entering state
one short beep every 4 S while in state
One LED 5&6
two short beeps on entering state
off
one short beep every 4 S while in state
Debug LED
two short beeps on entering state
4 short beeps on entering state
one short beep every 4 S while in state
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Start charging
UM10917
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NXQ1TXA5DB1340 one-chip 5 V Qi wireless transmitter demo board
Table 5.
FOD threshold difference
Input voltage on pin FOD1
FOD threshold level
VFOD1 < 0.04 V
no FOD
0.25 V < VFOD1  1.29 V
VFOD1 (V) / 1.5 W[1]
1.335 V < VFOD1  VDDP
(VDDP is maximum input level)
0.5 W (default value)
[1]
This equation assumes VDDP = 5 V. To compensate for changes in the supply voltage level, the results are
automatically adjusted.
Table 6.
B-coefficient value set via FOD2
Input voltage on pin FOD2
FOD parameter B
VFOD2 < 0.04 V
default value for parameters B and C:
B = 0.11 and C = 0.012
0.085 V < VFOD2  1.29 V
0.067  VFOD2 (V) + 0.05[1]
1.335 V < VFOD2  VDDP
(VDDP is maximum input level)
reserved
[1]
This equation assumes VDDP = 5 V. To compensate for changes in the supply voltage level, the results are
automatically adjusted.
Table 7.
C-coefficient value set via FOD3
Input voltage on pin FOD3
FOD parameter C
0.210 V < VFOD3 < 0.290
V[1]
0.006
0.585 V < VFOD3 < 0.665
V[1]
0.008
0.960 V < VFOD3 < 1.040
V[1]
0.010
VFOD3 > 1.335 V
(VDDP is maximum input level)[1]
0.012
other voltage levels
reserved
[1]
This condition assumes VDDP = 5 V. To compensate for changes in the supply voltage level, the conditions
are automatically adjusted.
2.5 Indicators
The NXQ1TXA5DB1340 demo board incorporates 3 on-board LED indicators:
• H1: Green LED; user interface information (see Table 3)
• H2: Red LED; user interface information (see Table 3)
• H3: Blue LED; Power-on status (ON when 5 V supply present)
Optionally, a buzzer can be connected to X14. When the buzzer is connected, resistor
R34 (1 k) must be mounted as well. Table 4 gives the behavior of the buzzer.
When the NXQ1TXA5DB1340 demo board is powered on, the green and red LEDs blink
alternately followed by both LEDs being turned on and turned off. After that sequence, the
NXQ1TXA5 enters analog ping mode. It checks once every 400 ms if a device is placed
on the charger. The green LED H1 blinks every 4 s (indicating a digital ping being
performed). Once a Qi compliant receiver is put on top of the Qi transmitter coil and the
NXQ1TXA5 detects the receiver, it starts wireless power transmission. The green LED H2
turns on permanently until the receiver is removed again. If the power supply capability is
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limited, the NXQ1TXA5 enters Smart Power Limiting mode. To avoid that the supply
voltage drops below 4.2 V, SPL reduces the output power. The green LED H2 then blinks
with 1 s intervals.
When a fault is detected, the red LED H2 blinks once every 1 s.
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3. Schematic
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4. Bill Of Materials (BOM)
Table 8.
NXQ1TXA5 bill of materials
Reference
Description and values
Part number
Manufacturer
C1; C2
capacitor; 6.8 nF; 50 V; 0603
-
-
C3; C4
capacitor; 82 nF; 50 V; NP0; 1206
GRM31C5C1H823JA01L
Murata
C5; C6
capacitor; 100 nF; 50 V; NP0; 1206
CGA5L2C0G1H104J160AA
TDK
C7; C8
capacitor; 10 nF; 50 V; NP0; 0603
-
-
C9; C10
capacitor; 22 F; 10 V; X7R; 1206
GRM31CR61A226KE19L
Murata
C11
capacitor; 100 nF; 50 V; X7R; 0603
-
-
C12
capacitor; 2.2 pF; 50 V; 0603
-
-
C13
capacitor; 100 F; 6.3 V; X5R; 1206
GRM31CR60J107ME39L
Murata
C26
capacitor; 10 nF; 50 V; X7R; 0805
-
-
C27
capacitor; not mounted; 100 nF; 25 V;
X7R; 0603
-
-
C28
capacitor; not mounted; 1 F; 25 V;
X7R; 0805
-
-
D4
diode; array; not mounted; CA;
SOT363
BAW56S
NXP Semiconductors
G1
crystal; XTAL; 32.768 kHz; SMT
S3215
Yoketan Corporation
G2
crystal; XTAL; not mounted;
32.768 kHz; SMT
AB26TRQ-32.768kHz-T
Abracon Corporation
H1
LED (green); 0402
KPHHS-1005MGCK
Allied Electronics
H2
LED (red); 0402
KPHHS-1005SURCK
Allied Electronics
H3
LED (blue); 0402
KPHHS-1005QBC-D-V
Allied Electronics
L3
inductor; common-mode choke; not
mounted
DLW5BTM251SQ2L
Murata
N1
IC
NXQ1TXA5
NXP Semiconductors
R1; R2
resistor; 1 ; 0603
-
-
R3
resistor; not mounted; 215 k; 1 %;
0603
R4
thermistor; NTC; not mounted; 100 k; NXFT15WF104FA2B050
1 %; 4250 K
Murata
R5; R7; R9; R11
resistor; 390 k; 1 %; 0603
-
-
R6; R15
resistor; 0 ; 0805
-
-
R8
resistor; not mounted; 22 k; 1 %;
0805
-
-
R10
resistor; 82 k; 1 %; 0805
-
-
R12
resistor; 68 k; 1 %; 0805
-
-
R13
resistor; 820 ; 0603
-
-
R14
resistor; 1 k; 0603
-
-
R30; R32
resistor; not mounted; 0 
-
-
R31; R33
resistor; 0 ; solder closed
-
-
R34
resistor; not mounted; 1 k; 1 %; 0603 -
-
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Table 8.
NXQ1TXA5 bill of materials …continued
Reference
Description and values
R35
thermistor; NTC; not mounted; 100 k; NCP18WF104J03RB
5 %; 4250 K
Part number
Manufacturer
Murata
R36
resistor; not mounted; 100 k; 1 %;
0603
-
-
R37
resistor; not mounted; 2 M; 1 %;
0603
-
-
R38
resistor; 1 M; 1 %; 0603
-
-
R42
resistor; 3.9 k; 1 %; 0603
-
-
R43; R44
resistor; true 0 ; 0805
5106
Keystone
X1
connector; micro-USB PCB socket
10104111-0001LF
FCI
X2
receptacle; straight; not mounted;
2  5-way; 2.54 mm
M20-7830546
Harwin
X14
header; straight; not mounted;
1  2-way; 2.54 mm
-
Molex
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5. PCB layout
The layout of an NXQ1TXA5 wireless power transmitter application is critical from an
electrical and a thermal point of view. The PCB layout of the NXQ1TXA5DB1340 demo
board as well as the aspects that are essential for proper operation are briefly explained
below. More detailed explanations are given in the “NXQ1TXA5 one-chip 5 V Qi wireless
transmitter” application note (Ref. 2).
a. Top copper
Fig 4.
b. Component silk screen
c. Bottom copper
NXQ1TXA5DB1340 demo board layout
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Fig 5.
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Fig 6.
Top side with via pattern
5.1 Electrical layout aspects
• To enhance electrical conduction, the top and the bottom copper layer have a
thickness of 70 m (2 Oz.).
• The bottom layer is a shielding GND plane. It has been made maximally
uninterrupted.
• Shielding (non-current conducting) GND planes in the top copper layer are stitched to
the non-current conducting GND areas of the bottom layer GND plane. The stitching
is done with vias on the edges of the planes. It can easily be recognized on the
right-hand side of Figure 6.
• To prevent unnecessary power loss, VDD power traces to pins 15 and 16 and to pins
25 and 26 are wide low-impedance/low-loss traces.
• Decoupling capacitors C10 and C8 are placed very close to pins 15 and 16. They
have a low-impedance connection to GND. The same applies to capacitors C9 and
C7 which are very close to pins 25 and 26. In this way, the two supply loops
(see Figure 5) are kept as small as possible.
• Snubber circuit capacitor C1 and resistor R1 and capacitor C2 and resistor R2 are
mounted close to the output pins (pins 17 and 18; pins 23 and 24). The GND
connections of the snubber circuits are close to IC GNDP pins 19, 20, 21, and 22. In
this way, the two snubber loops (see Figure 5) are kept as small as possible.
• The output pins of the NXQ1TXA5 IC have very wide (low-impedance) traces to the
LC-tank.
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• Decoupling capacitor C11 is placed very close to pin 28. It has a low-impedance
connection to GND.
• To prevent overtones, the length of the traces leading to the crystal in series with the
C12 capacitor is approximately 1 cm.
5.2 Thermal layout aspects
• The NXQ1TXA5 IC is placed more or less in the center of the PCB. In that way, the IC
benefits most from its cooling circle.
• To ensure good thermal conduction, the GND pins and the power conducting pins of
the IC are attached to large copper areas.
• Underneath the NXQ1TXA5 IC, a pattern of 16 copper-filled thermal vias
(see Figure 6) conducts heat from the top side to the bottom side of the PCB.
Figure 7 shows the footprint that was used for soldering.
• Many thermal vias surround the NXQ1TXA5 IC. The IC is the dominant dissipating
component.
• The top and bottom layers of the PCB are covered with standard solder resist.
Standard solder resist has a fairly good emissivity, which enhances thermal radiation.
Uncovered and shiny areas on the PCB are kept to a minimum.
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Application-specific reflow soldering footprint
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6. Performance
6.1 Efficiency
In the power transfer path from the USB receptacle input to the load/battery at the output
of the Qi receiver, power is lost due to conversion and transfer mechanisms. Below in blue
the typical efficiency of the NXQ1TXA5DB1340 demo board alone is shown. The typical
efficiency of the demo board is the fraction of input power that the NXQ1TXA5 application
manages to convert into magnetic energy for transfer to the Qi receiver. Typically, this
efficiency level is approximately 87 %.
However, the system efficiency is more important to the end user. The system efficiency
concerns the efficiency of the whole power chain from the USB input receptacle up to the
load/battery. The typical system efficiency is shown in the gray curve in Figure 8. Typically,
the system efficiency is approximately 74 % when the transmitter and receiver coils are
aligned properly.
DDD
Ș
3R:
(1) TX efficiency (RX_Pin/TX_Pin)
(2) RX efficiency (RX_Pout/RX_Pin)
(3) System efficiency (RX_Pout/TX_Pin)
Fig 8.
NXQ1TXA5DB1340 efficiency plots
Figure 9 shows the system efficiency plot for a Samsung Galaxy S5 back cover Qi
receiver (Ref. 3) with the NXQ1TXA5DB1340 demo board. For this combination, the
system efficiency is also approximately 74 % (typical).
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DDD
Ș
Fig 9.
3R:
System efficiency for the combination of the NXQ1TXA5DB1340 demo board and
a Samsung Galaxy S5 back cover Qi receiver
6.2 Thermal performance
When operating under maximum load conditions (5 W transferred to the load/battery on
the Qi receiver side), the maximum temperature on the NXQ1TXA5DB1340 demo board
is an important performance parameter.
Figure 10 shows a thermal image (FLIR infrared thermal imaging camera) of the
NXQ1TXA5DB1340 demo board under maximum load conditions and optimal alignment
between the transmitter and the receiver coil. The Samsung Galaxy S5 back cover Qi
receiver was used as the receiver.
The maximum temperature difference (between the ambient and the hottest spot on the
board) was 21.2 C. If the transmitter coil and the receiver coil are misaligned
approximately 1 cm and the delivered power is still 5 W, the maximum temperature
difference increases to 43.0 C.
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Fig 10. Thermal image at 5 W delivered power and optimal alignment
Fig 11. Thermal image at 5 W delivered power and approximately 1 cm misalignment
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6.3 EMI performance
The NXQ1TXA5DB1340 demo board meets the CISPR22 (EN55022) requirements for
both conducted and radiated emissions. All measurements were done at 5 W delivered to
a load connected to the Samsung Galaxy S5 back cover Qi receiver under optimal
alignment conditions.
Figure 12 shows the conducted EMI spectrum for the NXQ1TXA5DB1340 demo board
only. The 5 V supply to the board was from an EMI free linear power supply. Both the peak
and the average emissions have over 30 dB margin compared to the limits.
Figure 13 shows the radiated EMI under the same conditions. For radiated EMI, the
margin compared to the limit is typically 20 dB and at no frequency less than 10 dB.
Fig 12. Conducted EMI for the NXQ1TXA5DB1340 demo board only
Fig 13. Radiated EMI for the NXQ1TXA5DB1340 demo board only
EMI performance was also measured in combination with two regular 5 V USB adapters:
• Samsung EP-TA10
• Nokia AC-60E
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Figure 14 shows the conducted EMI spectrum for the NXQ1TXA5DB1340 demo board in
combination with the Samsung EP-TA10 USB adapter. Both peak and average emission
have typically around 20 dB margin compared to the limits. At no frequency, the margin is
less than 10 dB.
Figure 15 shows the radiated EMI under the same conditions. For radiated EMI, the
margin compared to the limit is typically in the range of 15 dB to 20 dB. At no frequency, it
is less than 8 dB.
Fig 14. Conducted EMI for the NXQ1TXA5DB1340 board with the Samsung EP-TA10
Fig 15. Radiated EMI for the NXQ1TXA5DB1340 board with the Samsung EP-TA10
Figure 16 shows the conducted EMI spectrum for the NXQ1TXA5DB1340 demo board in
combination with the Nokia AC-60E USB adapter. The peak and the average emissions
typically have an approximately 15 dB margin compared to the limits. At no frequency, the
margin is less than 10 dB.
Figure 17 shows the radiated EMI under the same conditions. For radiated EMI, the
margin compared to the limit is typically in the range of 15 dB to 20 dB. At no frequency, it
is less than 10 dB.
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Fig 16. Conducted EMI for the NXQ1TXA5DB1340 board with the Nokia AC-60E
Fig 17. Radiated EMI for the NXQ1TXA5DB1340 board with the Nokia AC-60E
The NXQ1TXA5DB1340 demo board mainly contributes to the radiated EMI spectrum of
above 100 MHz. Most of the other noise can usually be attributed to the USB adapter.
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7. NXQ1TXA5DB1340 demo board options and modifications
Various alternative circuit options exist that can be realized on the NXQ1TXA5DB1340
demo board.
7.1 Smart Power Limiting (SPL) and Smart Power Reduction (SPR)
Alternative Smart Power Limiting and Smart Power Reduction levels can be set with the
jumpers in the R30, R31, R32 and R33 position. Details about the settings are given in
Table 1 and in the “NXQ1TXA5 one-chip 5 V Qi wireless transmitter” application note
(Ref. 2). Never install the (solder) jumpers in position R30 and R31 or the jumpers in
position R32 and R33 simultaneously.
7.2 NFC
The NXQ1TXA5 can also be used with an NFC (reader) enabled receiver. When the
NFC_FD_N pin is LOW, a start-up delay of about 2 s is inserted when an NFC enabled
receiver is placed on the charger. This delay allows the NFC enabled receiver to finalize
communication with an NFC TAG before charging begins. The NXQ1TXA5 starts up after
this delay. When it has detected a WPC-compliant Qi receiver, it starts to charge this
device and disables the NFC functionality in the NFC reader via the NFC_DIS pin.
If this feature is required, the jumper in position R15 must be removed and pin 6 of the IC
must be connected to GND.
7.3 LEDs and buzzer
By default, the user interface is built with 3 LEDs:
• The blue LED indicates the power status
• The green LED gives information about the operational status of the
NXQ1TXA5DB1340 demo board
• The red LED informs the user about faults that occur
7.3.1 Blue LED
The blue power status LED can be eliminated when no presentation of the power status
information is required. When the blue LED is eliminated, R42 can be eliminated as well.
Adapting the R42 resistor value can change the brightness level of the blue LED. Do not
select a value below 150  because the dissipation level in the blue LED can become too
high.
7.3.2 Green LED
The green LED can be eliminated when no information about the operational status is
required. When the green LED is eliminated, R14 can be eliminated as well.
The green LED can be set to behave differently by selecting another mode on the
CONFIG pin (pin 12) of the NXQ1TXA5 IC. A specific mode is selected by presenting a
specific voltage level (VCONFIG) to pin 12.
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Table 2 gives an overview of the available modes and related voltage levels (VCONFIG).
Table 3 gives an overview of the way the green LED behaves for a specific mode. Set a
specific mode by selecting a different resistance value for resistor R6.
R6
V CONFIG = --------------------  5.0
R5 + R6
(1)
Adapting the R14 resistor value can change the brightness level of the green LED. Do not
select a value below 150  because the dissipation level in the green LED can become
too high.
7.3.3 Red LED
The red LED can be eliminated when no information about fault conditions is required or
when the fault condition information is combined with operational information. The latter is
implemented through selecting one of the One LED x & y modes listed in Table 2. When
the red LED is eliminated, R13 can be eliminated as well.
The way the red LED behaves is selected through the CONFIG pin (pin 12; see Table 3).
Adapting the R13 resistor value can change the brightness level of the red LED. Do not
select a value below 150  because the dissipation level in the red LED can become too
high.
7.3.4 Buzzer
If, in addition to visual information, audial information is required, a buzzer can be
connected to the X14 connector. If a buzzer is connected, resistor R34 must be mounted
as well. Table 4 gives an overview of how the buzzer behaves when a certain mode is
selected through the CONFIG pin.
7.4 FOD
The NXQ1TXA5DB1340 demo board is delivered with the FOD threshold level set to
0.5 W (with VFOD1), the B-coefficient set to 0.108 (with VFOD2), and the C-coefficient set to
0.012 (with VFOD3). By applying other voltage levels to pins FOD1 (pin 9), FOD2 (pin 10),
and FOD3 (pin 11), other settings can be realized. See Table 5 to Table 7 and the
“NXQ1TXA5 one-chip 5 V Qi wireless transmitter” application note (Ref. 2).
If no FOD is required, pin FOD1 can be connected to GND. Consequently, pins FOD2 and
FOD3 can be grounded as well. Resistors R5, R6, R7, R8, R9, and R10 can be
eliminated.
If no flexibility in setting the threshold level is required and the 0.5 W level is appropriate,
pin FOD1 can be connected to VDDP. So, resistors R11 and R12 can be eliminated.
When the coefficients B = 0.11 and C = 0.012 are appropriate, pin FOD2 can be
connected to GND and pin FOD3 to VDDP. Resistors R5, R6, R7 and R8 can be
eliminated.
In this way, two 'standard' configurations (No FOD and default FOD) can be implemented
without using configuration resistors.
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7.5 NTC
One or two temperature sensors can be used on the NXQ1TXA5DB1340 demo board.
One sensor is intended to measure the temperature on the NXQ1TXA5DB1340 board
close to the NXQ1TXA5 IC. The other sensor is intended to measure the temperature of
the transmitter coil.
7.5.1 Monitoring NXQ1TXA5 temperature
If monitoring the NXQ1TXA5 IC temperature is required and if the application must react
to that temperature accordingly, an SMT thermistor must to be mounted in the R35
position. Additionally, R36 and C27 must be mounted as well. Resistor R38 must be
eliminated from the board. Finally, all 6 contacts of the D4 diode array must be shorted
with a drop of solder.
The values of resistor R36 and thermistor R35 determine the trip and resume temperature
levels. For details and instructions regarding the calculation, see the
“NXQ1TXA5 one-chip 5 V Qi wireless transmitter” application note (Ref. 2).
1
T trip = ----------------------------------------------------------------------------1
1
4
R36
---------------- + ---  ln  ------ + ln  ---------- 
 R35 
298.15    21
1
T res = ----------------------------------------------------------------------------1
1   11
R36
---------------- + --- ln ------ + ln  ---------- 
 R35 
298.15    39
(2)
(3)
Example:
• R36 = 100 k
• R35 = 100 k (at 25 C)
•  = 4250 K
The trip temperature (Ttrip) is 64 C and the resume temperature (Tres) is 54 C. For more
information, see the “NXQ1TXA5 one-chip 5 V Qi wireless transmitter” application note
(Ref. 2)
7.5.2 Monitoring transmitter coil temperature
If monitoring the transmitter coil temperature is required and if the application must react
to that temperature accordingly, a wired thermistor must to be connected to the R4 wire
holes (physically located between the transmitter coil soldering islands). Additionally, R3
and C27 must be mounted. Resistor R38 must be eliminated from the board. Finally, all 6
contacts of the D4 diode array must be shorted with a drop of solder.
The values of resistor R3 and thermistor R4 determine the trip and resume temperature
levels. For details and instructions regarding the calculation, see the
“NXQ1TXA5 one-chip 5 V Qi wireless transmitter” application note (Ref. 2).
1
T trip = -------------------------------------------------------------------------1
1
4
R3
---------------- + ---  ln  ------ + ln  ------- 
 R4 
298.15    21
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1
T res = -------------------------------------------------------------------------1
1
11
R3
---------------- + ---  ln  ------ + ln  ------- 
 R4 
298.15    39
(5)
Example:
• R3 = 215 k
• R4 = 100 k (at 25 C)
•  = 4250 K
The trip temperature (Ttrip) is 45 C and the resume temperature (Tres) is 36 C.
7.5.3 Monitoring the NXQ1TXA5 and transmitter coil temperature
If monitoring both the NXQ1TXA5 IC and the transmitter coil temperature is required and if
the application must react to these temperatures accordingly, an SMT thermistor must to
be mounted in position R35. A wired thermistor must be connected to the R4 wire holes.
Resistors R3, R36, R37, and capacitor C27 must be mounted as well. Finally, the D4
diode array must be mounted. The diode array operates as an "OR-ing" circuit for the two
monitored temperatures.
The values of resistor R36 and thermistor R35 determine the trip and resume temperature
levels for the NXQ1TXA5 IC temperature. The values of resistor R3 and thermistor R4
determine the trip and resume temperature levels for the coil temperature. For details and
instructions regarding the calculation, see the “NXQ1TXA5 one-chip 5 V Qi wireless
transmitter” application note (Ref. 2).
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8. Abbreviations
Table 9.
Abbreviations
Acronym
Description
EMI
ElectroMagnetic Interference
FOD
Foreign Object Detection
LED
Light-Emitting Diode
NFC
Near Field Communication
NTC
Negative Temperature Coefficient
SPL
Smart Power Limiting
SPR
Static Power Reduction
WPC
Wireless Power Consortium
9. References
UM10917
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[1]
One-chip 5 V Qi wireless transmitter — Data sheet, NXP Semiconductors, 2015
[2]
NXQ1TXA5 one-chip 5 V Qi wireless transmitter — Application note, NXP
Semiconductors, 2015
[3]
Samsung Wireless charging cover — Model EP-CG900IBE
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10. Legal information
10.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
10.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express, implied
or statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of this
product remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
to customer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business, business
interruption, loss of use, loss of data or information, and the like) arising out
the use of or inability to use the product, whether or not based on tort
(including negligence), strict liability, breach of contract, breach of warranty or
any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by customer
for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
law, even if any remedy fails of its essential purpose.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
10.3 Trademarks
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
GreenChip — is a trademark of NXP Semiconductors N.V.
UM10917
User manual
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 3 August 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
31 of 32
UM10917
NXP Semiconductors
NXQ1TXA5DB1340 one-chip 5 V Qi wireless transmitter demo board
11. Contents
1
1.1
1.2
2
2.1
2.2
2.3
2.4
2.5
3
4
5
5.1
5.2
6
6.1
6.2
6.3
7
7.1
7.2
7.3
7.3.1
7.3.2
7.3.3
7.3.4
7.4
7.5
7.5.1
7.5.2
7.5.3
8
9
10
10.1
10.2
10.3
11
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
NXQ1TXA5 features . . . . . . . . . . . . . . . . . . . . . 3
NXQ1TXA5DB1340 demo board features . . . . 4
Setup and operation of the NXQ1TXA5DB1340
demo board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
NXQ1TXA5DB1340 board overview. . . . . . . . . 5
Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Jumpers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Configuration and FOD settings . . . . . . . . . . . . 6
Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Bill Of Materials (BOM) . . . . . . . . . . . . . . . . . . 13
PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Electrical layout aspects . . . . . . . . . . . . . . . . . 17
Thermal layout aspects. . . . . . . . . . . . . . . . . . 18
Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Thermal performance . . . . . . . . . . . . . . . . . . . 21
EMI performance . . . . . . . . . . . . . . . . . . . . . . 23
NXQ1TXA5DB1340 demo board options and
modifications . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Smart Power Limiting (SPL) and Smart
Power Reduction (SPR) . . . . . . . . . . . . . . . . . 26
NFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
LEDs and buzzer . . . . . . . . . . . . . . . . . . . . . . 26
Blue LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Green LED . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Red LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Buzzer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
FOD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
NTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Monitoring NXQ1TXA5 temperature. . . . . . . . 28
Monitoring transmitter coil temperature . . . . . 28
Monitoring the NXQ1TXA5 and transmitter
coil temperature . . . . . . . . . . . . . . . . . . . . . . . 29
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 30
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Legal information. . . . . . . . . . . . . . . . . . . . . . . 31
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 3 August 2015
Document identifier: UM10917
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