QB-V850EMA3 In-Circuit Emulator UM

QB-V850EMA3 In-Circuit Emulator UM
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User’s Manual
QB-V850EMA3
In-Circuit Emulator
Target Devices
V850E/MA3
Document No. U18218EJ1V0UM00 (1st edition)
Date Published June 2006 NS CP(K)
© NEC Electronics Corporation 2006
Printed in Japan
[MEMO]
2
User’s Manual U18218EJ1V0UM
IECUBE is a registered trademark of NEC Electronics Corporation in Japan and Germany.
PC/AT is a trademark of International Business Machines Corporation.
MULTI, Green Hills Software, TimeMachine, and SuperTrace are trademarks of Green Hills Software, Inc.
• The information in this document is current as of June, 2006. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
User’s Manual U18218EJ1V0UM
3
[MEMO]
4
User’s Manual U18218EJ1V0UM
General Precautions for Handling This Product
1. Circumstances not covered by product guarantee
• If the product was disassembled, altered, or repaired by the customer
• If it was dropped, broken, or given another strong shock
• Use at overvoltage, use outside guaranteed temperature range, storing outside guaranteed
temperature range
• If power was turned on while the AC adapter, USB interface cable, or connection to the target
system was in an unsatisfactory state
• If the cable of the AC adapter, the USB interface cable, the extension probe, or the like was bent or
pulled excessively
• If an AC adapter other than the supplied product was used
• If the product got wet
• If this product is connected to the target system when there is a potential difference between the
GND of this product and GND of the target system.
• If the connectors or cables are plugged/unplugged while this product is in the power-on state.
• If excessive load is applied to the connectors or sockets.
• If a metal part of the power switch, cooling fan, or another such part comes in contact with an
electrostatic charge
2. Safety precautions
• If used for a long time, the product may become hot (50°C to 60°C). Be careful of low temperature
burns and other dangers due to the product becoming hot.
• Be careful of electrical shock. There is a danger of electrical shock if the product is used as
described above in 1. Circumstances not covered by product guarantee.
User’s Manual U18218EJ1V0UM
5
INTRODUCTION
Readers
This manual is intended for users who wish to perform debugging using the QBV850EMA3. The readers of this manual are assumed to be familiar with the device
functions and usage, and to have knowledge of debuggers.
Purpose
This manual is intended to give users an understanding of the basic specifications and
correct usage of the QB-V850EMA3.
Organization
This manual is divided into the following sections.
• General
• Setup procedure
• Settings at product shipment
• Notes
• Optional functions
How to Read This Manual
It is assumed that the readers of this manual have general knowledge in the fields of
electrical engineering, logic circuits, and microcontrollers.
This manual describes the basic setup procedures and how to set switches.
To understand the overall functions and usages of the QB-V850EMA3
→ Read this manual according to the CONTENTS.
To know the manipulations, command functions, and other software-related settings
of the QB-V850EMA3
→ See the user’s manual of the debugger (supplied with the QB-V850EMA3) to be
used.
Conventions
Note:
Footnote for item marked with Note in the text
Caution:
Information requiring particular attention
Remark:
Supplementary information
Numeric representation:
Binary ... xxxx or xxxxB
Decimal ... xxxx
Hexadecimal ... xxxxH
Prefix indicating power of 2
(address space, memory
capacity):
K (kilo): 210 = 1,024
M (mega): 220 = 1,0242
6
User’s Manual U18218EJ1V0UM
Terminology
The meanings of the terms used in this manual are described in the table below.
Term
Meaning
Target device
This is the device to be emulated.
Target system
This is the system to be debugged (system provided by the user).
This includes the target program and the hardware provided by the user.
IECUBE
TM
Generic name for NEC Electronics’ high-performance, compact in-circuit
emulator.
Related Documents
Please use the following documents in combination with this manual.
The related documents listed below may include preliminary versions. However,
preliminary versions are not marked as such.
Documents Related to Development Tools (User’s Manuals)
Document Name
Document Number
QB-V850EMA3 In-Circuit Emulator
CA850 Ver. 3.00 C Compiler Package
This manual
Operation
U17293E
C Language
U17291E
Assembly Language
U17292E
Link Directives
U17294E
ID850QB Ver. 3.20 Integrated Debugger
Operation
U17964E
SM+ System Simulator
Operation
U18010E
User Open Interface
U18212E
Basics
U13430E
Installation
U17419E
Technical
U13431E
Task Debugger
U17420E
Basics
U13773E
Installation
U17421E
Technical
U13772E
Task Debugger
U17422E
RX850 Ver. 3.20 Real-Time OS
RX850 Pro Ver. 3.20 Real-Time OS
AZ850 Ver. 3.30 System Performance Analyzer
U17423E
PM+ Ver. 6.20 Project Manager
U17990E
Caution
The related documents listed above are subject to change without
notice.
Be sure to use the latest version of each document for
designing, etc.
User’s Manual U18218EJ1V0UM
7
CONTENTS
CHAPTER 1 GENERAL........................................................................................................................... 10
1.1 Hardware Specifications.............................................................................................................. 11
1.2 System Specifications ................................................................................................................. 12
1.3 System Configuration .................................................................................................................. 13
1.4 Package Contents ........................................................................................................................ 15
CHAPTER 2 SETUP PROCEDURE ........................................................................................................ 16
2.1 Names and Functions of Hardware ............................................................................................ 17
2.2 Removal of Acrylic Board............................................................................................................ 19
2.3 Clock Settings............................................................................................................................... 19
2.4
2.5
2.6
2.7
2.8
2.3.1
Overview of clock settings ..................................................................................................................19
2.3.2
Clock setting methods ........................................................................................................................20
2.3.3
Procedure for changing oscillator .......................................................................................................21
Software Settings ......................................................................................................................... 22
2.4.1
When using ID850QB as debugger ....................................................................................................22
2.4.2
When using other than ID850QB (MULTI, etc.) as debugger .............................................................22
Mounting and Connecting Connectors ...................................................................................... 22
2.5.1
Mounting TC to target system.............................................................................................................22
2.5.2
Inserting EA into TC ...........................................................................................................................23
2.5.3
Precautions for handling TC, EA, MA, CA, and SA ............................................................................23
2.5.4
Precautions for mounting IC using MA ...............................................................................................24
Connecting QB-V850EMA3 to Target System ........................................................................... 25
2.6.1
When not using extension probe (QB-144-EP-02S) ...........................................................................25
2.6.2
When using extension probe (QB-144-EP-02S) .................................................................................26
Connecting USB Interface Cable and AC Adapter.................................................................... 30
Switching Power On and Off ....................................................................................................... 30
CHAPTER 3 SETTINGS AT PRODUCT SHIPMENT............................................................................ 31
CHAPTER 4 NOTES................................................................................................................................ 32
4.1 Notes on ROM Correction Function ........................................................................................... 32
4.2 Notes on Flash Self Programming Function ............................................................................. 32
4.3 Notes on Non-map Break............................................................................................................. 32
4.4 Notes on DBTRAP Instruction .................................................................................................... 32
4.5 PSC Register Access ................................................................................................................... 32
4.6 Notes on DBPC, DBPSW, and ECR Registers........................................................................... 33
4.7 Notes on Trace Display Sequence.............................................................................................. 33
4.8 Restrictions When Using External Bus...................................................................................... 33
4.9 Notes on Starting Debugger........................................................................................................ 33
4.10 Simultaneously Executing Two Instructions When Hardware Break Is Set .......................... 34
4.11 Notes on On-Chip Debug Function ............................................................................................ 36
4.12 Notes on Standby Mode............................................................................................................... 36
4.13 Operation during Break ............................................................................................................... 36
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User’s Manual U18218EJ1V0UM
4.14
4.15
4.16
4.17
Notes on Current Consumption...................................................................................................36
Bug Related to Mask Setting for Watchdog Timer Overflow Interrupts..................................36
When an Illegal Break Occurs during Program Execution in Internal RAM ...........................37
Notes on AC Characteristics........................................................................................................37
CHAPTER 5 OPTIONAL FUNCTIONS ...................................................................................................38
5.1 Memory Emulation Function ........................................................................................................39
5.2
5.3
5.4
5.5
5.1.1
Functional outline ...............................................................................................................................39
5.1.2
Differences from hardware specifications...........................................................................................39
Coverage Measurement Function ...............................................................................................40
5.2.1
Functional outline ...............................................................................................................................40
5.2.2
Differences from hardware specifications...........................................................................................40
TimeMachine Function .................................................................................................................41
Changes to Top Side of Product Consequent to Addition of Optional Functions.................41
How to Add Optional Functions ..................................................................................................42
User’s Manual U18218EJ1V0UM
9
CHAPTER 1 GENERAL
The QB-V850EMA3 is an in-circuit emulator for emulating the V850E/MA3.
Hardware and software can be debugged efficiently in the development of systems in which the V850E/MA3 is
used. This manual descries basic setup procedures, hardware specifications, system specifications, and how to set
switches.
10
User’s Manual U18218EJ1V0UM
CHAPTER 1 GENERAL
1.1
Hardware Specifications
Table 1-1. QB-V850EMA3 Hardware Specifications
Parameter
Specification
Target device
V850E/MA3
VDD = 2.5 V, EVDD = CVDD = AVDD0 = AVDD1 = 3.3 V
Target system interface voltage
VSS = EVSS = CVSS = AVSS0 = AVSS1 = 0 V
Clock-through mode: 5 to 25 MHz
Operating frequency
PLL mode: 5 to 80 MHz
(External bus operating frequency: 50 MHz max.)
Operating temperature range
0 to 40°C (No condensation)
Storage temperature range
−15 to 60°C (No condensation)
External dimensions
See Figure 1-1
Power
AC adapter
15 V, 1 A
consumption
Target system power supply
Same level or lower than target device
Weight
Approximately 400 g
Host interface
USB interface (1.1, 2.0)
Figure 1-1. External Dimensions
112.7 mm
Note 1
104 mm
Note 2
68 mm
Note 3
Rear spacer
Note 4
Front spacer
Notes 1.Does not include projection of power switch
2.Includes projection of screw that fixes rear spacer
3.Dimension when rear spacer is made shortest (98 mm when longest)
4.Front spacer can vary from 20 mm (longest) to 5 mm (shortest)
User’s Manual U18218EJ1V0UM
11
CHAPTER 1 GENERAL
1.2
System Specifications
This section shows the QB-V850EMA3 system specifications.
Table 1-2. QB-V850EMA3 System Specifications
Parameter
Specification
Emulation memory
Internal ROM
capacity
Internal RAM
60 KB max.
External memory
16 MB max. (optional) (mapping possible in 1 MB units)
Program execution
Real-time execution function
Go, Start from Here, Go & Go, Come Here, Restart, Return Out
functions
Non-real-time execution function
Step In, Next Over, Slowmotion
Break functions
Hardware break
Execution: 10 points
1 MB max.
Access: 6 points
Trace functions
Software break
2000 points
Fail-safe break
Non-map, I/O illegal, write protect
Other
Trace full break, forced break, timer overflow break
Trace data types
Branch-source PC, branch-destination PC, all PCs, all execution data,
access data, access address, R/W status, time stamp, DMA point
(start/end)
Trace modes
Real-time trace, Complete trace
Trace events
Delay trigger, section, qualify
Memory capacity
256K frames
Real-time RAM monitoring function
256 bytes × 8 points
Time measurement
Measurement clock
Measurement-dedicated clock
functions
Measurement objects
Beginning through end of program execution
Start event through end event
Maximum measurement time
Approximately 195 hours (When using measurement-dedicated clock)
Minimum resolution
20 ns
Number of timers for measurement
8
Measurement results
Execution time (Start through end of execution)
Maximum, minimum, average, pass count (between events)
Other
Coverage function
Detection of execution or pass (optional)
Measured range
Other functions
Timer overflow break function (1 point)
Internal ROM space + arbitrary 1 MB space
Mapping function, event function, register manipulation function,
memory manipulation function
Caution
12
Depending on the debugger, some functions are not supported.
User’s Manual U18218EJ1V0UM
CHAPTER 1 GENERAL
1.3
System Configuration
This section shows the system configuration when using the QB-V850EMA3 connected to a PC (PC-9821 series or
PC/AT
TM
compatible). Connection is possible even without optional products.
Figure 1-2. System Configuration
<5>
<1>
<3>
<4>
<2>
<6>
<7>
: Products enclosed by broken lines are optional.
<8>
<9>
<11>
<10>
<12>
<1>
<2>
<3>
<4>
<5>
<6>
<7>
<8>
<9>
<10>
<11>
<12>
<13>
Host machine:
ID850QB Disk/Accessory DiskNote 1:
USB interface cable:
AC adapter:
QB-V850EMA3:
Check pin adapter (optional):
Extension probe (optional)
Exchange adapter:
Check pin adapter (optional):
Space adapter (optional):
Mount adapter (optional):
Target connector:
Target system
<13>
PC-9821 series, IBM PC/AT compatible can be used
Debugger, USB drivers, manual, etc.
Cable used for connecting QB-V850EMA3 to host machine
Can support 100 to 240 V by replacing AC plug
This product
Adapter used for monitoring waveforms with oscilloscope
Adapter that performs pin conversion
Note 2
Adapter used for monitoring waveforms with oscilloscope
Note 2
Adapter used for height adjustment
Adapter used for mounting target device
Connector to be soldered to target system
Notes 1. Download the device file from the NEC Electronics website.
http://www.necel.com/micro/index_e.html
2. If both <9> and <10> are used, connection sequence of <9> and <10> may be reversed.
User’s Manual U18218EJ1V0UM
13
CHAPTER 1 GENERAL
Table 1-3. List of Probe/Connector
No.
Order Name
Name
V850E/MA3 (144-Pin GJ)
<6>
Check pin adapter
QB-144-CA-01 (sold separately)
<7>
Extension probe
QB-144-EP-02S (sold separately)
<8>
Exchange adapter
QB-144GJ-EA-02S (sold separately)
<9>
Check pin adapter
QB-144-CA-01S (sold separately)
<10>
Space adapter
QB-144-SA-01S (sold separately)
<11>
Mount adapter
QB-144GJ-MA-01S (sold separately)
<12>
Target connector
QB-144GJ-TC-01S (sold separately)
Note
Note
Note These accessories are supplied depending on the part number ordered.
• If QB-V850EMA3-ZZZ is ordered
The exchange adapter and target connector are not supplied.
• If QB-V850EMA3-S144GJ is ordered
The QB-144GJ-EA-02S and QB-144GJ-TC-01S are supplied.
Remark
For notes on target system design and package drawings, refer to [Related Information] on the
following webpage.
URL: http://www.necel.com/micro/english/iecube/index.html
14
User’s Manual U18218EJ1V0UM
CHAPTER 1 GENERAL
1.4
Package Contents
The following items have been placed in the QB-V850EMA3 packing box. Please check the contents.
Products supplied with QB-V850EMA3-ZZZ
1:
QB-V850EMA3
2:
AC adapter
3:
USB interface cable
4:
ID850QB Disk (CD-ROM)
5:
Accessory Disk (CD-ROM)
6:
IECUBE Setup Manual (J/E)
7:
User registration (Guarantee card and software contract in one)
8:
Simplified flash programmer (PG-FPL or QB-MINI2)
9:
Probe holder
Products supplied with QB-V850EMA3-S144GJ
1 to 9
10:
Exchange adapter QB-144GJ-EA-02S
11:
Target connector QB-144GJ-TC-01S
User’s Manual U18218EJ1V0UM
15
CHAPTER 2 SETUP PROCEDURE
This chapter explains the QB-V850EMA3 setup procedure.
Setup can be completed by performing installation/setup in the order in which it appears in this chapter.
Perform setup along the lines of the following procedure.
See 2.1 Names and Functions of Hardware for jumper and clock board positions.
Clock settings
The setting does not have to be changed when using the product with the clocks generated from the
resonator/oscillator that is mounted at shipment for the oscillator.
If modification is necessary, see 2.2 Removal of Acrylic Board and 2.3 Clock Settings.
Software settings
See 2.4 Software Settings.
Mounting and connecting connectors
See 2.5 Mounting and Connecting Connectors.
Connecting QB-V850EMA3 to target system
See 2.6 Connecting QB-V850EMA3 to Target System.
• When not using the extension probe (QB-144-EP-02S): see 2.6.1.
• When using the extension probe (QB-144-EP-02S): see 2.6.2.
Connecting USB interface cable and AC adapter
See 2.7 Connecting USB Interface Cable and AC Adapter.
Switching power on and off
See 2.8 Switching Power On and Off
16
User’s Manual U18218EJ1V0UM
CHAPTER 2 SETUP PROCEDURE
2.1
Names and Functions of Hardware
Figure 2-1. Names of Parts of QB-V850EMA3
Top View
Bottom View
Power switch
Connector for parts board
CN8
JP1
POWER
TARGET
CN3 CN2 CN1
User’s Manual U18218EJ1V0UM
17
CHAPTER 2 SETUP PROCEDURE
(1) CN1, CN2, CN3
These connectors are used to connect the exchange adapter or extension probe.
(2) Parts board connector (for clock)
This parts board is used to mount the resonator.
(For details, refer to 2.3 Clock Settings.)
(3) JP1
This jumper is used to set the clock. Pins 1-2 are left open, 3-4 are shorted, and 5-6 are left open at shipment.
(For details, refer to 2.3 Clock Settings.)
(4) CN8
This jumper is used for delivery inspection.
All the pins of this jumper are open at shipment. Other settings are prohibited.
(5) POWER (Red LED)
This is an LED that shows whether or not the power supply of the QB-V850EMA3 is switched on.
LED State
QB-V850EMA3 State
Lit
Power switch ON
Not lit
Power switch OFF or AC adapter not connected to QB-V850EMA3
Blinking
Internal error occurred (Contact an NEC Electronics sales representative or distributor)
(6) TARGET (Green LED)
This is an LED that shows whether or not the power supply of the target system is switched on.
LED State
Target System State
Lit
Target system power supply ON
Not lit
Target system power supply OFF or target system not connected
(7) Power switch
This is the power switch of the QB-V850EMA3.
It is OFF at shipment.
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User’s Manual U18218EJ1V0UM
CHAPTER 2 SETUP PROCEDURE
2.2
Removal of Acrylic Board
To change the jumper or clock setting, the acrylic board on the bottom of the QB-V850EMA3 must be removed.
The acrylic board can be removed by lifting it up.
Figure 2-2. Acrylic Board Removal Method
2.3
2.3.1
Clock Settings
Overview of clock settings
The following types of clock settings are available.
For details, see 2.3.2 Clock setting methods.
(1) Using a clock generated from an 8 MHz oscillator mounted in the QB-V850EMA3 as a clock (fx).
(2) Using a clock generated from an oscillator other than the 8 MHz oscillator mounted in the QB-V850EMA3 as
a clock (fx).
(3) Input a square wave clock from the target system.
Caution
Emulation with an oscillator using pins X1 and X2 on the target system is not possible.
Be sure to input a square wave when inputting the main clock from the target system.
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19
CHAPTER 2 SETUP PROCEDURE
2.3.2
Clock setting methods
This section shows the clock (fx) settings methods.
Table 2-1. Clock (fx) settings methods
Type of Clock Used
Parts Board
(1) The clock generated from an 8 MHz oscillator mounted in the QBV850EMA3 is used as the clock (fx)
Setting at shipment.
(2) The clock generated from an oscillator other than the 8 MHz
oscillator mounted in the QB-V850EMA3 is used as the clock (fx)
(oscillator frequency that can be used is the same as that of the
target device)
Mounted on parts board supplied
(3) Input a square wave clock from the target system.
Caution
Not mounted
Settings other than above are prohibited.
The settings methods of CKSEL pin and PSEL pin differ depending on the above setting. Refer to the following
table for setting the JP1.
Table 2-2. CKSEL and PSEL pin settings methods
Type of Clock Used
The clock mounted in the QB-
CKSEL Pin
L
PSEL Pin
L
V850EMA3 is used
(When (1) or (2) is selected in Table
2-1)
L
H
JP1 Setting
2
6
1
5
2
6
1
5
Setting at shipment
H
x
2
6
1
5
5-6 setting is arbitrary.
Input a square wave clock from the
Settings of pins CKSEL and
target system.
PSEL on the target system are
(When (3) is selected in Table 2-1)
valid.
2
6
1
5
3-4 and 5-6 setting is arbitrary.
Caution
20
Settings other than above are prohibited.
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CHAPTER 2 SETUP PROCEDURE
2.3.3
Procedure for changing oscillator
• Remove the oscillator etc. from the parts board.
• Make pin 1 of the parts board and pin 1 of the oscillator match.
Figure 2-3. Mounting Oscillator
14-pin type
8-pin type
(socket)
Caution
Use an oscillator that satisfies the following specifications.
Supply voltage: 5 V
Output level:
CMOS
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CHAPTER 2 SETUP PROCEDURE
2.4
2.4.1
Software Settings
When using ID850QB as debugger
For details, refer to the V850 Series Integrated Debugger ID850QB Operating Precautions supplied with the
debugger (ID850QB).
2.4.2
When using other than ID850QB (MULTI, etc.) as debugger
Refer to the user’s manual of the debugger used and the V850 IECUBE Setup Manual (supplied).
2.5
Mounting and Connecting Connectors
This section describes the methods for connecting the QB-V850EMA3 to the target system.
Make connections with both the QB-V850EMA3 and target system powered off.
The following abbreviations are used in this section.
• TC: Target connector
• EA: Exchange adapter
• MA: Mount adapter
• CA: Check pin adapter
• SA: Space adapter
2.5.1
Mounting TC to target system
(1) Apply cream solder to the foot pattern of the target system for mounting an IC.
(2) A circular projection is at the center of the bottom side of the TC (refer to Figure 2-4). Sparingly apply twoliquid hardening epoxy adhesive (type that hardens in 15 to 30 minutes is recommended) to temporarily secure
the connector at the specified position on the target system. At this time, match the position of pin 1 (position
where a corner is cut) with the position of pin 1 from the target system.
(3) Soldering condition of TC
Figure 2-4. TC Projection
(a) Reflow soldering
At 245°C for a maximum of 20 seconds (main heating)
(b) Manual soldering
At 320°C for a maximum of 5 seconds (per pin)
(4) Precautions on flux splatter
If the solder flux splatters when the connector is soldered, faulty
contact may occur. Be sure to cover the upper part of the connector with aluminum foil. Do not clean the
connector because the flux solvent may remain inside the connector.
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CHAPTER 2 SETUP PROCEDURE
2.5.2
Inserting EA into TC
Match the pin 1 position of the EA, MA, CA, or SA to the pin 1 position of the TC and insert it (corner cuts match in
both).
(a) When inserting or removing, hold down the TC with your fingers so that there is no force on the TC.
(b) When inserting or removing, be careful of the direction of wiggling (refer to Figure 2-5).
As a tool when removing, insert some kind of thin non-conductive material such as a wooden stick in between
the TC and EA and wiggle it in the direction shown in Figure 2-5 while slowly removing. Be careful since the
connector will be damaged if this is done in the wrong direction.
Figure 2-5. Inserting and Removing
SA
TC
2.5.3
Precautions for handling TC, EA, MA, CA, and SA
(1) Cause of faulty contact of connector
(a) If flux gets inside the connector when the TC is soldered
It is easy for flux to get inside of the connector. Clean the connector several times with a solvent such as
alcohol if flux gets inside.
If conduction is still unstable, repeat cleaning.
(b) If dust gets inside the connector
Faulty contact occurs if dust such as a thread gets inside the connector. Remove dust with a brush.
(c) Cautions on using the CA or SA
When the CA or SA is used, a fractional delay time of signal propagation and a little capacitance are
generated as a result of inserting the adapter. Make a thorough evaluation by connecting the target
system.
(2) Cautions on inserting and removing the connector
(a) When inserting or removing the connector, be sure to hold down the lower (mating) connector or board
with your fingers.
(b) Before inserting a connector, make sure that the connectors are correctly positioned.
If the connector is inserted incorrectly positioned, it may be damaged.
(c) When removing a connector, insert some kind of thin non-conductive material such as a wooden stick
beneath the connector to protect the board from being damaged. Do not remove the connector all at once.
Remove it slowly.
If only a metallic object such as a screwdriver is available, wind a soft cloth around its tip.
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CHAPTER 2 SETUP PROCEDURE
2.5.4
Precautions for mounting IC using MA
(1) Confirm that there is no weld flash in the resin (sealant part) of the IC. If there is weld flash, remove it using a
knife or the like.
(2) Confirm that there is no weld flash breaking or bending of IC leads. In particular, confirm the planarity of IC
leads. If there is abnormality in the planarity, correct that portion.
(3) Viewing the contact pins on the bottom of the MA (IC mounting part) from the top, if there are foreign bodies on
them, remove them using a brush or the like.
After confirming (1) to (3), fit the IC to the bottom of the MA. Also fit the top (cover) of the MA.
(4) Put the supplied M2 × 6 mm screws in the four accessory holes on the top (cover) of the MA and fasten the
screws in opposite corners. At that time, use either the dedicated screwdriver that is supplied or a torque
driver to fasten them equally in turn with a tightening torque of 0.054 Nm (MAX.). Since the contact is poor if
tightening is too great, once you have lightly fastened the screws on the top of the MA, tighten them again.
(5) Depending on the use environment, when starting up a device that has been left for a long time, starting it may
be difficult. In this case, loosen the screws slightly and then retighten them.
(6) If startup still is difficult after (5) above, check (1) to (3) again.
(7) Tightening the screws on the top of the MA too much may give rise to cracks in the molded part of the MA
(plastic part) and bend the mold into a bowed shape, making contact poor.
(8) After soldering the MA, do not perform cleaning by flux immersion or vapor.
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CHAPTER 2 SETUP PROCEDURE
2.6
2.6.1
Connecting QB-V850EMA3 to Target System
When not using extension probe (QB-144-EP-02S)
The QB-V850EMA3 can be connected to the target system without using an extension probe.
Adjust the height by using the spacer at the rear part of the QB-V850EMA3, so that no stress is applied to the
exchange adapter, the target connector, and other connectors.
Sufficiently insulate the target system.
Figure 2-6. Connection without Extension Probe
QB-V850EMA3
Height adjustable
Exchange adapter
Rear spacer
Target connector
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CHAPTER 2 SETUP PROCEDURE
2.6.2
When using extension probe (QB-144-EP-02S)
When using the extension probe (QB-144-EP-02S), connect the QB-V850EMA3 to the target system using the
following procedure.
(a) Connecting probe holder
Use the probe holder (supplied with the QB-V850EMA3) to connect the extension probe to the QB-V850EMA3,
as shown below.
Figure 2-7. Using Probe Holder
<1> Connect the QB-V850EMA3 to the probe.
Extension probe holder
Probe holder
Insert
QB-V850EMA3
<2> Insert the probe holder into the QB-V850EMA3.
Insert the probe holder into the QB-V850EMA3 until
you hear a click (note the direction).
(b) Connection of extension probe GND wire
There are three GND wires in the extension probe. Connect them to the QB-V850EMA3 and target system.
<1> Fasten the GND wire on the QB-V850EMA3 side of the extension probe to the nut on the bottom of the
QB-V850EMA3 using a #0 or #1 Phillips precision screwdriver (connection of B to A in Figure 2-8).
<2> Next insert the connector on the top of the extension probe into the connector at the opening on the
bottom of the QB-V850EMA3 from below being careful of the insertion direction (connection of C in
Figure 2-8 to QB-V850EMA3).
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CHAPTER 2 SETUP PROCEDURE
Figure 2-8. GND Wire
QB-V850EMA3
(A)
(B)
(C)
(D)
(D)
(D)
(G)
(H)
Target system
<3> Connect the exchange adapter and extension probe to the target connector.
<4> Connect the two GND wires on the target system side of the extension probe to the target system GND.
If a pin or screw is fastened to the target system GND, remove the transparent terminal cover on the end
of the GND wire and fasten the Y terminal of the GND wire to the target system (G in Figure 2-8). If the
GND on the target system is an exposed pad, likewise fasten the Y terminal to the pad on the target
system by soldering (H in Figure 2-8) (recommended soldering iron temperature setting: 300°C).
<5> If the target system has only one GND, connect only one of the GND wires of the extension probe. Cut off
the other GND wires with a nipper or leave it as is without removing the pin cover.
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CHAPTER 2 SETUP PROCEDURE
<6> Since the length of the GND wire below the head (insulated part) is approximately 60 mm, there must be
at least a GND to which it can be connected to within the range of the three approximately 60 mm radius
sections of the target system for connecting the extension probe, as shown in Figure 2-9. The GND wire
of the extension probe is soldered to positions J and K in Figure 2-9.
Figure 2-9. Where GND Wire Can Be Connected
34.3 mm
K
L = 60 mm
24.7 mm
L = 60 mm
J
Target system
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CHAPTER 2 SETUP PROCEDURE
(c) Ensuring isolation
When connecting the target system to the QB-V850EMA3 using an extension probe, adjust the height using
the front spacer or rear spacer of the QB-V850EMA3 to ensure isolation from the target system.
Figure 2-10. Connection Using Extension Probe
QB-V850EMA3
Extension probe
Exchange adapter
Rear spacer
(Height adjustable)
Front spacer
(Height adjustable)
Target connector
(d) Cautions related to extension probe
The following cautions pertain to using the extension probe.
<1> Be careful that stress of the extension probe is not placed on the target connector. Moreover, when
removing the extension probe, remove it slowly while holding down on the exchange adapter with a finger
so that there is no stress on the target connector.
<2> Be sure to connect the GND wire of the extension probe to the QB-V850EMA3 and the target system. If
not, the impedance of the cable becomes unstable, resulting in the lowering of signal transmission
characteristics or distortion of the output waveform for an input waveform.
<3> When using the external bus interface with the extension probe, add a data wait state by increasing the
set value of the DWC register by one.
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CHAPTER 2 SETUP PROCEDURE
2.7
Connecting USB Interface Cable and AC Adapter
Plug the USB interface cable supplied with the QB-V850EMA3 into the USB connector of the host machine, and
plug the other side into the USB connector on the rear of the QB-V850EMA3.
Plug the AC adapter supplied with the QB-V850EMA3 into a receptacle and plug the other side into the power
supply connector on the rear of the QB-V850EMA3.
For QB-V850EMA3 connector positions, see Figure 2-11.
By replacing the AC plug, the AC adapter can support the voltage from 100 to 240 V. The AC plug for 100 V is
attached when shipped. Replace it with the AC plug for 220 or 240 V (supplied with the QB-V850EMA3) when the AC
adapter is used at 220 or 240 V.
Figure 2-11. Connector Positions
Power supply connector
(Connect AC adapter)
USB connector
(Connect USB interface cable)
2.8
Switching Power On and Off
Be sure to switch the power on and off according to the following procedures.
• Switching power on
• Switching power off
<1> QB-V850EMA3 power on
Note
<1> Debugger termination
Note
<2> Target system power on
<2> Target system power off
<3> Debugger startup
<3> QB-V850EMA3 power off
Note In the procedures, <2> is unnecessary if the target system is not connected.
Caution
30
If the wrong sequence was used for the operation, the target system or QB-V850EMA3 may fail.
User’s Manual U18218EJ1V0UM
CHAPTER 3 SETTINGS AT PRODUCT SHIPMENT
Table 3-1. Settings at Shipment
Item
JP1
Setting
Remarks
2
6
1
5
1 and 2 are left open, 3 and 4 are shorted, and 5 and 6 are left
open.
For details, refer to 2.3 Clock Settings.
An 8 MHz oscillator is mounted.
Parts board
For details, refer to 2.3 Clock Settings.
All pins are left open.
CN8
6
4
2
Power switch
5
3
1
Do not change this setting.
Set to OFF at shipment.
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31
CHAPTER 4 NOTES
This chapter explains the points to be noted when the QB-V850EMA3 is used.
4.1
Notes on ROM Correction Function
The ROM correction function cannot be emulated. To use this function, make an evaluation by using the target
device.
4.2
Notes on Flash Self Programming Function
The QB-V850EMA3 does not support emulation of the self programming function. To use this function, make an
evaluation by using an on-chip debug emulator or the target device.
Note that the debugger may support a pseudo-emulation function. Refer to the documents supplied with the
debugger for the target devices, usage, and restrictions.
4.3
Notes on Non-map Break
Figure 4-1. Break at Fetching Unused Area
If a program is fetched from an area not used by a
program (unused area) with an emulator, a non-map break
usually occurs. However, a non-map break does not occur
Used area
(Non-map break does not occur)
in the first 16-byte space of each unused area (refer to
Unused area
(Non-map break occurs)
Figure 4-1).
4.4
16 bytes
Notes on DBTRAP Instruction
Used area
(Non-map break does not occur)
The DBTRAP instruction cannot be used.
4.5
Non-map break does
not occur in this area
Unused area
(Non-map break occurs)
PSC Register Access
16 bytes
Data is written to the PSC register in the following
sequence. If a software break is set to the NOP instruction
Used area
(Non-map break does not occur)
immediately after the register has been accessed, the
debugger hangs up.
Example:
mov 0x2,r1
st.b r1,prcmd
st.b r1,psc
nop
← Debugger hangs up if a software break is set here.
nop
← There is no problem if a software break is set here or later.
To set a break immediately after the PSC register has been written, use a hardware break.
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CHAPTER 4 NOTES
4.6
Notes on DBPC, DBPSW, and ECR Registers
The DBPC, DBPSW, and ECR registers cannot be accessed during a break.
If a value is written to any of these registers during a break, the written value is ignored.
If these registers are read, 0 is always read.
4.7
Notes on Trace Display Sequence
When the trace mode that displays the access history is used, the display sequence may be reversed.
• If read and write instructions are successively executed
• If a bit manipulation instruction that executes read-modify-write is executed (such as SET, NOT, or CLR)
In both the cases, the trace results of write and read are displayed in that order.
4.8
Restrictions When Using External Bus
When using an external bus to access an SRAM or an external ROM, it is normally necessary to insert one or more
programmable waits such as shown below. This also applies to both multiplexed and separate bus cycles. This
restriction does not apply, however, when a WAIT pin is used during wait control.
• 50 MHz operation: at least two data waits
• 40 MHz operation: at least one data wait
The number of waits is not uniformly set because they depend on factors of the target system such as memory
characteristics, wiring length, and capacitance. Since the measurement results above were obtained in the evaluation
environment of NEC Electronics, refer to them as an index. For debugging, which also includes the characteristics,
mount the target device onto the target system, and debug with the on-chip debug emulator or by operating the actual
device.
4.9
Notes on Starting Debugger
When the debugger is started, the following warning or error may occur depending on the setting of the debugger
and the status of the target system. This is because the status of the target system is not in accordance with the
setting of the debugger. If a warning or error occurs, check the status of the target system or the setting of the
debugger.
It is recommended that the conversion adapter be connected to the QB-V850EMA3 even when the target system is
not connected. If the conversion adapter is not connected, the value of the input port may not be correctly read.
• ID850QB
Error No.
Error Message
“Target” Field of ID850QB
Target System
Exchange
Target System
Configuration Window
Connection
Adapter
Power
Connect
Not Connect Connected
Not
Connected
Ff606
Used
Not
ON
OFF
Used
Check connection with the
target and turn on power to
√
√
the target.
Wf607
Check the connection of the
conversion adapter.
Ff608
Disconnect the target.
Ff609
Turn off power to the target
and disconnect the target.
√
√
√
√
√
√
√
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√
√
33
CHAPTER 4 NOTES
• MULTI
Error Message
“-tc” of 850eserv Start
Target System
Exchange
Target System
Option
Connection
Adapter
Power
With -tc
Without
Connected
-tc
Check the target power on.
Not
Used
Connected
Not
ON
√
Or please delete “-tc” option.
√
√
Check the exchange adapter is connected.
Remove the target. Or please add “-tc”
√
option and power on the target.
Power off and remove the target. Or
√
√
√
√
√
please add “-tc” option.
OFF
Used
√
√
4.10 Simultaneously Executing Two Instructions When Hardware Break Is Set
If a hardware break is set at the first or the next of two instructions that are executed at the same time, the
following phenomena may occur.
• Break occurs at a place different from where it has been set.
• The set break does not occur.
To prevent these phenomena, set a software break.
The conditions under which two instructions are simultaneously executed are shown on the following pages.
[Combination of instructions for the occurrence of the simultaneous execution of two instructions]
• Condition where “mov + operation instruction” are executed as one instruction
If dst of mov and dst of the operation instruction are the same register, except r0, in combination of “mov src,
dst” and one of the following instructions:
Format I
satsubr/satsub/satadd/mulh
or/xor/and
subr/sub/add
Format II
Remark
shr/sar/shl/mulh
“mov + operation instruction” are executed as one instruction only when the mov instruction is the
first instruction of the above combinations of instructions.
• Condition of parallel execution of instructions
<1> Combination of one of the following instructions and br instruction
Format I
nop/mov/not/sld
satsubr/satsub/satadd/mulh
or/xor/and/tst
subr/sub/add/cmp
Format II
mov/satadd/add/cmp
Format IV
sld.b/sst.b/sld.h/sst.h/sld.w/sst.w
shr/sar/shl/mulh
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CHAPTER 4 NOTES
<2> Combination of one of the following instructions (instructions that do not update flags) and bcc
instruction except br instruction
Format I
nop/mov/sld
Format II
mov/mulh
Format IV
sld.b/sst.b/sld.h/sst.h/sld.w/sst.w
mulh/sxb/sxh/zxb/zxh
<3> Combination of one of the following instructions and sld instruction
Format I
nop/mov/not
satsubr/satsub/satadd/mulh
or/xor/and/tst
subr/sub/add/cmp
Format II
mov/satadd/add/cmp
shr/sar/shl/mulh
Remark
Of <1> to <3>, two instructions are simultaneously executed only when the second instruction of
the above combinations of instructions is br/brcc/sld
Caution
Formats I, II, and IV are the instruction formats described in the V850E1 Architecture User’s
Manual (U14559E).
• Cases in which two instructions are not simultaneously executed
In the following cases, two instructions are not simultaneously executed.
(a) If the first instruction is the first instruction after execution branches to an address that is not word
aligned.
Example
0x1006
mov r10,r12
0x1008
sld.b 0x8[ep],r11
If a branch to address 0x1006 occurs, the two instructions are not executed simultaneously because the
first instruction is not word aligned (because the lower 1 byte of the address is not 0, 4, 8, A, or C).
(b) If the second instruction is sld and writing to the ep register is not completed.
Example
0x1004
mov r10,ep
0x1006
sld.b 0x8[ep],r11
In this case, the value of r10 is written to the ep register by the mov instruction at address 0x1004.
However, the two instructions are not executed simultaneously because WB (writeback) of the mov
instruction is not completed when the sld.b instruction at address 0x1006 is executed.
(c) If the second instruction is bcc (conditional branch instruction) and a flag hazard occurs (the instruction
immediately before or the instruction before that instruction may update the flags).
Example
0x1004
cmp r0,r10
0x1006
bn 0xf0
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CHAPTER 4 NOTES
The bn instruction that references the S flag and branches must wait for execution of the cmp instruction
at address 0x1004 because the S flag is changed by the cmp instruction. As a consequence, the bn
instruction causes a flag hazard and the two instructions are not executed simultaneously.
(d) If the second instruction is sld and both of the load buffers are in the WB wait status.
Example
Suppose that the following instructions are located in the memory.
0x1000
nop
0x1002
nop
0x1004 ld.w 0x3000[r10],r11
0x1008 ld.w 0x3004[r10],r12
0x100c mov r8,r9
0x100e sld.b 0x10[ep],r13
If ld.w at addresses 0x1004 and 0x1008 accesses the external memory, several clocks of wait states are
inserted. If the instruction at address 0x100e is executed, then the load buffer is in the “WB wait” status
because WB of the ld.w instructions at addresses 0x1004 and 0x1008 is not completed, and the two
instructions at address 0x100c and 0x100e are not simultaneously executed.
4.11 Notes on On-Chip Debug Function
The on-chip debug function cannot be emulated.
4.12 Notes on Standby Mode
The IDLE and software STOP set/release timings differ in the target device and the in-circuit emulator. When the
standby mode is set, the timing difference is within 1 clock, and when it is released, the difference is 2 to 3 clocks.
4.13 Operation during Break
Since various peripheral functions operate even during breaks in the in-circuit emulator, interrupts due to peripheral
functions, generated during breaks, are suspended and, when re-executing after the breaks, execution may occur
after processing of suspended interrupts. The watchdog timer counter, however, stops during the breaks.
4.14 Notes on Current Consumption
The current consumption of the in-circuit emulator differs from that of the target device. This is because the incircuit emulator uses the target system power supply only for detection and it uses the power supply which is
generated in the emulator for the actual operation.
4.15 Bug Related to Mask Setting for Watchdog Timer Overflow Interrupts
Interrupts are generated even when overflow interrupts of the watchdog timer are masked by the debugger mask
function. When using the ID850QB, overflow interrupts are generated, even when NMI1 in the MASK column of the
configuration window is checked.
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CHAPTER 4 NOTES
4.16 When an Illegal Break Occurs during Program Execution in Internal RAM
An illegal break may occur when a peripheral I/O register is accessed during program execution in the internal
RAM.
A non-map break occurs if all of the following conditions are satisfied, even if the program itself is correct.
• A program is executed in the internal RAM area.
• Data access for the internal RAM area is performed twice in succession.
• An execution branches to the internal ROM area using a JR or JARL instruction immediately after the above
successive data access, or one NOP instruction after the above successive data access.
In order not to generate the break, cancel the fail-safe break setting for the internal RAM in the debugger.
<When using ID850QB>
Click the [Detail] button in the Fail-safe Break field in the Configuration window and clear the check in the check
box for “Internal RAM”.
<When using MULTI>
Cancel the fail-safe break for “ramgrd” and “ramgrdv” using the Target flsf command.
4.17 Notes on AC Characteristics
When the in-circuit emulator is used, emulation results of the functions installed in target devices are similar to
those of the functions when the on-chip emulator or actual device is used.
However, slight differences in the
emulation results of the pin I/O characteristics arise. For debugging, which also includes the characteristics, mount
the target device onto the target system, and debug with the on-chip debug emulator or by operating the actual device.
User’s Manual U18218EJ1V0UM
37
CHAPTER 5 OPTIONAL FUNCTIONS
The following functions can be added to the QB-V850EMA3. This chapter explains the functional outline and
specifications of the optional functions, and how to obtain them.
• Memory emulation function
• Coverage measurement function
• TimeMachineTM function
The support status of each optional function differs depending on the debugger used. The following table lists the
support statuses as of June 2006.
If you have any questions regarding the support status, consult an NEC
Electronics sales representative or distributor.
Function
Support Status
ID850QB
Memory emulation function
Supported in V2.90, V3.10 and later
MULTI
Supported in 850eserv V2.233 and later
and earlier than V3.000, as well as in
850eserv V3.233
38
Coverage measurement function
Supported in V2.90, V3.10 and later
Support under consideration
TimeMachine function
Not supported
Supported in 850eserv2 V1.000 and later
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CHAPTER 5 OPTIONAL FUNCTIONS
5.1
Memory Emulation Function
This section explains the functional outline of the memory emulation function and differences in specifications that
occur after the addition of this function.
5.1.1
Functional outline
Using the memory emulation function, the QB-V850EMA3 can be substituted for the external memory on the target
system, so that programs and data can be allocated to the QB-V850EMA3.
This function was designed for use in cases such as the following.
• Development of the target system is delayed, so program development for external spaces cannot be started.
Through memory substitution, program development can be started in advance.
• Writing to the flash memory on the target system takes too much time and thus development is inefficient.
Through memory substitution, the program development efficiency can be improved.
Refer to the user’s manual for the debugger for details on use of the memory emulation function.
5.1.2
Differences from hardware specifications
After addition of the memory emulation function, differences from the hardware specifications described in this
manual are as follows.
• External dimensions
The height increases by 9 mm.
68 mm
77 mmNote
Note When the rear spacer is adjusted to the lowest height (107 mm max.)
• Weight
The weight increases by approximately 70 g.
User’s Manual U18218EJ1V0UM
39
CHAPTER 5 OPTIONAL FUNCTIONS
5.2
Coverage Measurement Function
This section explains the functional outline of the coverage measurement function and differences in specifications
that occur after the addition of this function.
5.2.1
Functional outline
The coverage measurement function is used to measure the percentage of the executed code in a load module,
section, or other such area. After the addition of this function, the Code Coverage window will be added and the
Source and Assemble windows will be modified in the debugger ID850QB, as follows.
• Code Coverage window
Displays the coverage (%)
of the executed code for
total code in a load module.
Displays the coverage (%)
of the executed code
separately by functions,
sections and vectors.
• Source window and Assemble window
The executed lines are
highlighted.
Refer to the user’s manual for the debugger for details on use of the coverage measurement function.
5.2.2
Differences from hardware specifications
After addition of the coverage measurement function, differences from the hardware specifications described in this
manual are as follows.
• External dimensions
The height increases by 9 mm.
68 mm
Note When the rear spacer is adjusted to the lowest height (107 mm max.)
• Weight
The weight increases by approximately 70 g.
40
User’s Manual U18218EJ1V0UM
77 mmNote
CHAPTER 5 OPTIONAL FUNCTIONS
5.3
TimeMachine Function
This function is supported by the Green Hills Software (GHS) debugger. For details on the functional outline and
specifications, consult a GHS tool distributor.
5.4
Changes to Top Side of Product Consequent to Addition of Optional Functions
After the addition of the optional functions, the following stickers will be attached to the top of the QB-V850EMA3.
The addition of the optional functions can be confirmed through the presence of these stickers.
A sticker is attached to this position
according to the function added, as
follows.
For the memory emulation function:
For the coverage measuring function:
For the TimeMachine function:
QB-V850EMA3 Top View
User’s Manual U18218EJ1V0UM
41
CHAPTER 5 OPTIONAL FUNCTIONS
5.5
How to Add Optional Functions
To add the optional functions, the option board corresponding to each function, as listed in the following, must be
mounted.
Function
Option Board Required for Adding Function
Memory emulation function
Emulation memory board
Coverage measurement function
Coverage memory board
TimeMachine function
SuperTrace
Note 1
TM
Probe board
Notes 1, 2
Notes 1. Either the coverage memory board or the SuperTrace Probe board can be added, but not both.
2. To use the TimeMachine function, the SuperTrace Probe (Green Hills Software (GHS)) must be
mounted in the QB-V850EMA3, in addition to the SuperTrace Probe board.
For details on specifications and purchases, consult a GHS tool distributor.
The following two methods have been provided for mounting the option boards.
For more information on ordering, price and schedule, consult an NEC Electronics sales representative or
distributor.
• New purchase
By adding one of the following suffixes at the end of the ordering code, you can purchase the QB-V850EMA3
with the corresponding option board mounted.
-M:
Emulation memory board mounted
-C:
Coverage memory board mounted
-S:
SuperTrace Probe board mounted
-CM: Coverage memory board and emulation memory board mounted
-SM: SuperTrace Probe board and emulation memory board mounted
Part number examples: QB-V850EMA3-S144GJ-M
QB-V850EMA3-S144GJ-CM
• System upgrade
Using this method, the option board can be mounted in your QB-V850EMA3.
42
User’s Manual U18218EJ1V0UM
For further information,
please contact:
NEC Electronics Corporation
1753, Shimonumabe, Nakahara-ku,
Kawasaki, Kanagawa 211-8668,
Japan
Tel: 044-435-5111
http://www.necel.com/
[America]
[Europe]
[Asia & Oceania]
NEC Electronics America, Inc.
2880 Scott Blvd.
Santa Clara, CA 95050-2554, U.S.A.
Tel: 408-588-6000
800-366-9782
http://www.am.necel.com/
NEC Electronics (Europe) GmbH
Arcadiastrasse 10
40472 Düsseldorf, Germany
Tel: 0211-65030
http://www.eu.necel.com/
NEC Electronics (China) Co., Ltd
7th Floor, Quantum Plaza, No. 27 ZhiChunLu Haidian
District, Beijing 100083, P.R.China
TEL: 010-8235-1155
http://www.cn.necel.com/
Hanover Office
Podbielski Strasse 166 B
30177 Hanover
Tel: 0 511 33 40 2-0
NEC Electronics Shanghai Ltd.
Room 2509-2510, Bank of China Tower,
200 Yincheng Road Central,
Pudong New Area, Shanghai P.R. China P.C:200120
Tel: 021-5888-5400
http://www.cn.necel.com/
Munich Office
Werner-Eckert-Strasse 9
81829 München
Tel: 0 89 92 10 03-0
Stuttgart Office
Industriestrasse 3
70565 Stuttgart
Tel: 0 711 99 01 0-0
United Kingdom Branch
Cygnus House, Sunrise Parkway
Linford Wood, Milton Keynes
MK14 6NP, U.K.
Tel: 01908-691-133
Succursale Française
9, rue Paul Dautier, B.P. 52180
78142 Velizy-Villacoublay Cédex
France
Tel: 01-3067-5800
Sucursal en España
Juan Esplandiu, 15
28007 Madrid, Spain
Tel: 091-504-2787
NEC Electronics Hong Kong Ltd.
12/F., Cityplaza 4,
12 Taikoo Wan Road, Hong Kong
Tel: 2886-9318
http://www.hk.necel.com/
Seoul Branch
11F., Samik Lavied’or Bldg., 720-2,
Yeoksam-Dong, Kangnam-Ku,
Seoul, 135-080, Korea
Tel: 02-558-3737
NEC Electronics Taiwan Ltd.
7F, No. 363 Fu Shing North Road
Taipei, Taiwan, R. O. C.
Tel: 02-2719-2377
NEC Electronics Singapore Pte. Ltd.
238A Thomson Road,
#12-08 Novena Square,
Singapore 307684
Tel: 6253-8311
http://www.sg.necel.com/
Tyskland Filial
Täby Centrum
Entrance S (7th floor)
18322 Täby, Sweden
Tel: 08 638 72 00
Filiale Italiana
Via Fabio Filzi, 25/A
20124 Milano, Italy
Tel: 02-667541
Branch The Netherlands
Limburglaan 5
5616 HR Eindhoven
The Netherlands
Tel: 040 265 40 10
G05.12A
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