Blue Gecko BGM111 Bluetooth Smart Module Data Sheet

Blue Gecko BGM111 Bluetooth Smart Module Data Sheet
Blue Gecko BGM111 Bluetooth® Smart
Module Data Sheet
The BGM111 is a Bluetooth® Smart module targeted for Bluetooth Smart applications
where good RF performance, low power consumption and easy application development
are key requirements. At +8 dBm TX power BGM111 has best-in-class RF performance
and can provide long range, robust Bluetooth Smart connectivity.
The BGM111 integrates all of the necessary elements required for a Bluetooth Smart
application: Bluetooth radio, software stack and GATT based profiles and it can also
host end user applications, which means no external microcontroller is required in size,
price or power constrained devices. The BGM111 Bluetooth Smart module also has
highly flexible hardware interfaces to connect to different peripherals or sensors.
Although the BGM111 Bluetooth Smart Module is targeted at applications requiring high
RF performance, it still has ultra-low power consumption and can be operated using a
standard 3 V coin cell battery.
BGM111 can be used in a wide variety of applications:
• Health and Fitness
• Point-of-Sales
• Consumer Electronics
KEY FEATURES
• Bluetooth 4.1 Compliant (Bluetooth Smart)
• Software upgradable to Bluetooth 4.2
• TX power: up to +8 dBm
• RX sensitivity: down to -93 dBm
• Range: up to 200 meters
• CPU core: 32-bit ARM® Cortex-M4
• Flash memory: 256 kB
• RAM: 32 kB
• Autonomous Hardware Crypto Accelerator
and True Random Number Generator
• Integrated DC-DC Converter
• Automotive Aftermarket
• Industrial and Home Automation
• Others
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This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
Preliminary Rev. 0.92
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Feature List
1. Feature List
The highlighted features are listed below.
Bluetooth Features
• Bluetooth 4.1 Compliant
• Software Upgradable to Bluetooth 4.2
• Central and Peripheral Roles
• Up to 8 x BLE Connections in Central Role
Radio Features
• Integrated Antenna
• TX Power (+8 dBm)
• RX Sensitivity (-93 dBm)
• Up to 200 meters LoS range
Software Features
• Integrated Bluetooth Smart Stack
• Any GATT based Bluetooth Smart Profile
• 100 kbps throughput over BLE
• BGAPI™ serial protocol API over UART for modem usage
Harware Interfaces
•
•
•
•
•
•
•
•
UART host interface
2 x SPI, UART and 2 x I2C peripheral interfaces
Up to 25 x GPIO with interrupts
4 x 12-bit ADC and 1 x 12-bit DAC
Internal temperature sensor
Internal battery voltage measurement option
Clock generator
Real-time counter
MCU Features
• ARM® Cortex-M4F
• 40 Mhz
• 32 kB RAM
• 256 kB Flash
• Advanced cryptography support
• BGLIB™ host API/library which implements BGAPI serial protoElectrical Characteristics
col
• Supply voltage: 1.8 V to 3.8 V with DC/DC bypass mode
• BGScript™ scripting language for standalone usage
• Supply voltage: 2.4 V to 3.8 V when using DC/DC
• Profile Toolkit™ for creating GATT based services
• 8.2 mA TX current at 0 dBM
• 7.5 mA RX current
• 59 μA/MHz @ Energy Mode 0
• 1.7 μA EM2 deep sleep current
Environmental/Regulatory
• Temperature range: -40C to +85C
• Bluetooth, CE, FCC and IC, Japan and South-Korea qualified
Dimensions
• W x L x H: 12.9 mm x 15.0 mm x 2.2 mm
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Preliminary Rev. 0.92 | 1
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Ordering Information
2. Ordering Information
Part Number
Description
Features
BGM111A256V1
BGM111 Bluetooth Smart Module with internal chip antenna
Radio:
Bluetooth Smart 4.1, +8 dBm TX
Cut reel
Core:
ARM Cortex M4
Memory:
32 kB RAM/256 kB flash
Antenna:
chip
Packaging:
100 pcs cut reel
Status:
pre-production samples
Production PN:
BGM111A256V2
BGM111 Bluetooth Smart Module with internal chip antenna
Radio:
Bluetooth Smart 4.1, +8 dBm TX
Full reel
Core:
ARM Cortex M4
Memory:
32 kB RAM/256 kB flash
Antenna:
chip
Packaging:
1000 pcs tape and reel
Status:
pre-production samples
Production PN:
BGM111A256V2R
BGM111A256V1R
SLWSTK6101A
Blue Gecko Bluetooth Smart
module development kit
BGM111 radio board
WSTK main board
Expansion board (buttons, leds, accelerometer, joystick)
Accessories
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Preliminary Rev. 0.92 | 2
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Pinout
3. Pinout
This section contains a description of the BGM111 pin-out. Each pin may have one or more functions which are all listed in tables. The
pin-out is shown in the figure below.
Figure 3.1. BGM111 Pinout (Top View)
3.1 Power, Ground, and Reset Pins
Power supply, ground, and reset signal related pins are listed in the table below.
Table 3.1. Power, Ground, and Reset Pins
Pad Number Function Description
29
VDD
Module power supply
1, 12, 20, 31
GND
Ground, connected together internally but should all be connected directly to a solid ground plane with vias
in close proximity to the pads, especially on the antenna end.
30
RESET
Module reset signal. Pulling RESET low will reset the internal processor. This pin has an internal pull-up and
can be left floating if not needed.
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Preliminary Rev. 0.92 | 3
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Pinout
3.2 GPIO Pins
The 25 GPIO pins of BGM111 module are organized into ports with up to 16 pins each. These GPIO pins can individually be configured
as either an output or input. More advanced configurations like open-drain, open-source, and glitch-filtering can be configured for each
individual GPIO pin. GPIO pins can also be overridden by peripheral pin connections like TIMER PWM outputs or USART communication, which can be routed to several locations on the device. The GPIO supports up to 16 asynchronous external pin interrupts, which
enable interrupts from any pin on the device. Also, the input value of a pin can be routed through the Peripheral Reflex System to other
peripherals. Except for a few special functions, the internal signal crossbar allows various peripheral functions to be assigned freely to
any GPIO pad, simplifying application board layout.
Table 3.2. BGM111 GPIO Assignments Related to Functionalities and Peripherals
GPIO Assignments
Port Name
PA
PB
PC
11 13 6
7
8
PD
Port Pin
0 1 2 3 4 5
9
Pad Number
5 6 7 8 9 10 11 13 14 15 16 17 18 19 2
PF
10 11 13 14 15 0
3
4
1
2
3
Comment
4
5
6
7
21 22 23 24 25 26 27 28
BOOTLOADER
BOOT_RX
•
BOOT_TX
•
DEBUG
DBG_SWCLKTCK
•
DBG_SWDIOTMS
•
DBG_SWO
•
•
•
•
DBG_TDI
•
DBG_TDO
•
WAKE UP
GPIO_EM4WU0
•
GPIO_EM4WU1
•
GPIO_EM4WU4
GPIO_EM4WU8
•
•
GPIO_EM4WU9
•
GPIO_EM4WU12
•
I2C
I2CO_SCL
• • • • •
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
I2CO_SDA
• • • • •
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
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•
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•
USART 0
UART SPI
US0_CTS US0_CLK • • • • •
•
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CTS
CLK
US0_RTS US0_CS
• • • • •
•
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•
•
•
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RTS
CS
US0_RX
MISO
• • • • •
•
•
•
•
•
•
•
•
•
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•
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RX
MISO
US0_TX
MOSI
• • • • •
•
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TX
MOSI
USART 1
UART SPI
US1_CTS US1_CLK • • • • •
•
•
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CTS
CLK
US1_RTS US1_CS
•
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•
•
•
•
•
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•
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•
•
•
•
•
•
RTS
CS
• • • • •
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Preliminary Rev. 0.92 | 4
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Pinout
GPIO Assignments
Port Name
PA
PB
PC
11 13 6
7
8
PD
Port Pin
0 1 2 3 4 5
9
Pad Number
5 6 7 8 9 10 11 13 14 15 16 17 18 19 2
US1_RX
MISO
• • • • •
•
•
•
•
•
•
•
•
•
US1_TX
MOSI
• • • • •
•
•
•
•
•
•
•
•
LEU0_RX
• • • • •
•
•
•
•
•
•
•
LEU0_TX
• • • • •
•
•
•
•
•
•
TIM0_CC0
• • • • •
•
•
•
•
•
TIM0_CC1
• • • • •
•
•
•
•
TIM0_CC2
• • • • •
•
•
•
TIM0_CDTI0
• • • • •
•
•
TIM0_CDTI1
• • • • •
•
TIM0_CDTI2
• • • • •
TIM1_CC0
PF
10 11 13 14 15 0
1
2
3
Comment
4
5
6
7
3
4
21 22 23 24 25 26 27 28
•
•
•
•
•
•
•
•
•
•
•
RX
MISO
•
•
•
•
•
•
•
•
•
•
•
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TX
MOSI
•
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• • • • •
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TIM1_CC1
• • • • •
•
•
•
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•
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•
•
•
•
•
•
•
•
•
•
•
•
•
•
TIM1_CC2
• • • • •
•
•
•
•
•
•
•
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•
•
•
•
•
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•
•
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TIM1_CC3
• • • • •
•
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•
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•
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•
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LETIM0_OUT0
• • • • •
•
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LETIM0_OUT1
• • • • •
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LEUART 0
TIMER
LOW ENERGY TIMER
ACMP0
1X
•
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1Y
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2X
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2Y
3X
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4X
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3Y
4Y
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ACMP 1
1X
•
•
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1Y
•
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•
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2X
•
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•
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2Y
3X
•
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•
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Preliminary Rev. 0.92 | 5
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Pinout
GPIO Assignments
Port Name
PA
PB
PC
11 13 6
7
8
PD
Port Pin
0 1 2 3 4 5
9
Pad Number
5 6 7 8 9 10 11 13 14 15 16 17 18 19 2
PF
10 11 13 14 15 0
3
4
3Y
•
•
•
•
•
•
•
4X
•
•
•
•
•
•
•
4Y
•
•
•
1
2
3
Comment
4
5
6
7
21 22 23 24 25 26 27 28
•
END
ADC0
1X
•
•
•
•
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•
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1Y
•
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2X
•
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2Y
3X
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3Y
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4X
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4Y
•
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IDAC0
1X
1Y
•
•
•
•
•
•
•
PULSE COUNTER
PCNT0_S0IN
• • • • •
•
•
•
•
•
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PCNT0_S1IN
• • • • •
•
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CLOCK MANAGEMENT
CMU_CLK0
CMU_CLK1
•
•
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Preliminary Rev. 0.92 | 6
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Interfaces
4. Interfaces
4.1 USART
The Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O module. It supports full duplex asynchronous
UART communication with hardware flow control as well as SPI.
If UART is used as BGAPI serial protocol host interface it is strongly recommended to use RTS and CTS signals for reliable data transmission.
Figure 4.1. USART
4.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART)
The unique LEUART™ provides two-way UART communication on a strict power budget. Only a 32.768 kHz clock is needed to allow
UART communication up to 9600 baud. The LEUART includes all necessary hardware to make asynchronous serial communication
possible with a minimum of software intervention and energy consumption.
4.3 I2C
The I2C module provides an interface between the MCU and a serial I2C bus. It is capable of acting as both a master and a slave.
Standard-mode, fast-mode and fast-mode plus speeds are supported, allowing transmission rates from 10 kbit/s up to 1 Mbit/s.
Figure 4.2. I2C
4.4 Timer/Counter (TIMER)
TIMER peripherals count events, generate PWM outputs. The core of each TIMER is a 16-bit counter.
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Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Interfaces
4.5 Real Time Counter
The Real Time Counter is a 32-bit counter providing timekeeping in all energy modes and it is capable of providing system wake-up at
user defined instances. The RTCC includes 128 bytes of general purpose data retention, allowing easy and convenient data storage in
all energy modes.
4.6 Low Energy Timer (LETIMER)
The unique LETIMER™ is a 16-bit timer that is available in energy mode EM2 DeepSleep in addition to EM1 Sleep and EM0 Active.
This allows it to be used for timing and output generation when most of the device is powered down, allowing simple tasks to be performed while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety of
waveforms with minimal software intervention.
4.7 Ultra Low Power Wake-Up Timer (CRYOTIMER)
The CRYOTIMER is a 32-bit counter that is capable of running in all energy modes. It can be clocked by either the 32.768 kHz crystal
oscillator (LFXO), the 32.768 kHz RC oscillator (LFRCO) or the 1 kHz RC oscillator (ULFRCO). It can provide periodic Wakeup events
and PRS signals which can be used to wake up peripherals from any energy mode. The CRYOTIMER provides a wide range of interrupt periods, facilitating flexible ultra-low energy operation.
4.8 Pulse Counter (PCNT)
The Pulse Counter (PCNT) peripheral can be used for counting pulses on a single input or to decode quadrature encoded inputs.
4.9 General Purpose Input/Output (GPIO)
BGM111 has 25 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input. More
advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin. The
GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to several
GPIO pins on the device. The GPIO subsystem supports asynchronous external pin interrupts.
When configured as GPIO output drive strength can be applied to pins on port by port basis and it can be either 1 mA or 10 mA.
4.10 Analog Comparator (ACMP)
The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is higher. Inputs are selected from among internal references and external pins. The tradeoff between response time and current consumption
is configurable by software. The ACMP can also be used to monitor the supply voltage from software. An interrupt can be generated
when the supply falls below or rises above a programmable threshold.
4.11 Analog to Digital Converter (ADC)
The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits up to 1 Msamples/sec. The output sample resolution is configurable and additional resolution is possible using integrated hardware for averaging over multiple samples. The ADC includes integrated voltage references and an integrated temperature sensor. Inputs are selectable from a wide range of
source, including pins configurable as either single-ended or differential.
4.12 Digital to Analog Current Converter (IDAC)
The Digital to Analog Current Converter can source or sink a configurable constant current. This current can be driven on an output pin
or routed to the selected ADC input pin for capacitive sensing. The current is programmable between 0.05 μA and 64 μA with several
ranges with various step sizes.
4.13 Integrated DC-DC Converter (DC-DC)
The DC-DC buck converter covers a wide range of load currents and provides high efficiency in energy modes EM0, EM1, EM2 and
EM3. The converter operates in active and bypass operating modes. Bypass mode may be entered when the input voltage is too low
for efficient operation of the DC-DC converter. In Bypass mode, the DC-DC input supply is internally connected directly to its output
through a low resistance switch. Bypass mode also supports in-rush current limiting to avoid dipping the input supply due to excessive
current transients.
Note:
• When DC/DC is enabled, supply voltage range is 2.4 V to 3.8 V.
• When DC/DC is disabled, supply voltage range is 1.8 V to 3.8 V.
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Preliminary Rev. 0.92 | 8
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Antenna
5. Antenna
This section contain design guidelines and recommendations for the BGM111 antenna.
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Preliminary Rev. 0.92 | 9
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Antenna
5.1 PCB Design Guidelines
For optimal performance of the BGM111, please follow the following guidelines:
• Place the module at the edge of the PCB as shown in the the figure below.
• Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna.
• Connect all the GND pins directly to a solid GND plane.
• Place the GND vias as close to the GND pins as possible.
• Do not place plastic or any other dielectric material in touch with the antenna.
Figure 5.1. Recommended Layout for BGM111
Figure 5.2. Poor Layouts for BGM111
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Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Antenna
Figure 5.3. Impact of the Size of GND Plane to the BGM111 Range
5.2 Effect of Plastic and Metal Materials
Do not place plastic or any other dielectric material in touch with the antenna.
Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB
ground planes.
5.3 Effect of Human Body
Human body is quite conductive and has a strong effect on the antenna. If the application is hand held, at least 3 mm of clearance
should be kept between the hand and the antenna. This can be achieved with the help of an air gap inside the outer casing of the end
product and the antenna of the module.
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Preliminary Rev. 0.92 | 11
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Hardware Design Guidelines
6. Hardware Design Guidelines
The BMG111 is an easy-to-use module with regard to hardware application design but certain design guidelines must be followed to
guarantee optimal performance. These guidelines are listed in the next sub-sections.
6.1 Power Supply Requirements
Coin cell batteries cannot withstand high peak currents (e.g. higher than 15 mA). If the peak current exceeds 15 mA it’s recommended
to place 47 - 100 µF capacitor in parallel with the coin cell battery to improve the battery life time. Notice that the total current consumption of your application is a combination of the radio, peripherals and MCU current consumption so you must take all of these into account. BGM111 should be powered by a unipolar supply voltage with nominal value of 3.3 V. Operating voltage range of the module is
2.4 - 3.8 V when using the built-in DC/DC converter.
External high frequency bypass capacitors are not needed because the module contains the required supply filter capacitors. However,
care should be taken to prevent strong switching noise from being superimposed on the supply line. Such noise can be generated e.g.
by on-board charge pump converters used in RS232 level shifters. If this type of switching noise is present, a power filter circuit on the
VDD input is recommended. Note that there is a total of about 4.8 µF of low ESR ceramic capacitors on the VDD line inside the module.
When using low-dropout linear regulators to generate a regulated supply for the VDD line, the stability of the regulator with the low ESR
provided by these capacitors should be checked. Many linear regulators and also some switched mode regulators are not stable when
using ceramic output capacitors. The datasheet of the regulator typically lists recommendations concerning suitable capacitors including data on ESR range and/or stability curves. A regulator which is stated “stable with ceramic capacitors” is recommended.
6.2 Power Saving Functions
EM power saving modes are automatically controlled by the firmware and it always enters the lowest possible power save mode possible depending on the radio, peripheral and software activity.
6.3 Reset Functions
The BGM111 can be reset by three different methods: by pulling the RESET line low, by the internal watchdog timer or software command. The reset state in BGM111 does not provide any power saving functionality and thus is not recommended as a means to conserve power. BGM111 has an internal system power-up reset function. The RESET pin includes an on-chip pull-up resistor and can
therefore be left unconnected if no external reset switch or source is needed.
6.4 Debug and Firmware Updates
6.4.1 JTAG
It is recommended to expose the JTAG debug pins in your own hardware design for firmware update and debug purposes. The following table lists the required pins for JTAG connection.
The debug pins have pull-down and pull-up enabled by default, so leaving them enabled may increase current consumption if left connected to supply or ground. If enabling the JTAG pins the module must be power cycled to enable a SWD debug session.
Table 6.1. JTAG Pads
PAD NAME PAD NUMBER JTAG SIGNAL NAME COMMENTS
PF3
24
TDI
This pin is disabled after reset. Once enabled the pin has a built-in pull-up.
PF2
23
TDO
This pin is disabled after reset
PF1
22
TMS
Pin is enabled after reset and has a built-in pull-up
PF0
21
TCK
Pin is enabled after reset and has a built-in pull-down
6.4.2 DFU
It is also possible to update the firmware over UART using DFU protocol. However the bootloader cannot be updated using DFU but
requires that the firmware is updated using JTAG.
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Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Bluetooth Stack Software
7. Bluetooth Stack Software
Silicon Labs’ Bluetooth Smart Software is a complete Bluetooth Smart software stack for the BGM111 Bluetooth Smart module. The
software implements a full Bluetooth LE compatible stack and L2CAP, RFCOMM, SMP and ATT protocols along with any GATT based
Bluetooth Smart profiles.
The Bluetooth Smart Ready Software also is supported by a complete SDK for developing Bluetooth Smart applications using either an
external host with the BGAPI™ serial protocol over UART or fully standalone applications based on a simple scripting language called
BGScript™.
Several profiles and software project examples are offered as part of the Bluetooth Smart SDK to help expedite the development of
Bluetooth Smart compatible end-user products.
The main parts of the Bluetooth Smart software stack are shown below.
Figure 7.1. Bluetooth Smart Ready Software Stack
Note: To learn more about the Bluetooth Smart software stack, the SDK, and the APIs please read QSG108: Blue Gecko Bluetooth
Smart Software Quick-Start Guide.
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Preliminary Rev. 0.92 | 13
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Host Interface
8. Host Interface
8.1 UART
The BGM111 can be controlled over the UART interface as a peripheral to an external processor. In order for the communication to be
reliable, hardware flow control signals (RTS and CTS) must be present between the host and the module. For baud rates exceeding
115.200 kbps the controlling processor should have a clock frequency accurate to within 1% in order for the UART signaling to work
reliably.
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Preliminary Rev. 0.92 | 14
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Electrical Characteristics
9. Electrical Characteristics
Table 9.1. Absolute Maximum Ratings
Parameter
Min Max
Unit
Storage temperature
-50 150
°C
VDD
-0.3 3.8
V
5V tolerant GPIO voltages -0.3 5.251
Other terminal voltages
V
-0.3 VDD+0.3 V
Note:
1. 5.25 V or VDD + 2 V, whichever is less.
Table 9.2. Recommended Operating Conditions
Rating
Min Max Unit
Operating temperature range
-40 85
°C
VDD (when using internal DC/DC)
2.4 3.8
V
VDD (when DC/DC is in bypass mode) 1.8 3.8
V
VDD (when operating ADC or DAC)
V
1.8 3.8
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Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Electrical Characteristics
Logic Signal Characteristics
Table 9.3. I/O Terminal Electrical Characteristics
I/O Terminals
Min
Typ Max
Unit
VIL input logic level low 1.7V ≤ VDD ≤ 3.6V
-0.3
-
0.3VDD
V
VIH input logic level high 1.7V ≤ VDD ≤ 3.6V
0.7 VDD
-
VDD + 0.3 V
VOL output logic level low, Vdd = 3.3 V, Iol = 3 mA, weak driver
-
-
0.2 x VDD V
VOH output logic level high Vdd = 3.3 V, Ioh = -3 mA, weak driver
0.8 x VDD -
Input voltage levels
Output voltage levels
VOH output logic level high Vdd = 3.3 V, Ioh = 20 mA, strong driver -
-
VOH output logic level high Vdd = 3.3 V, Ioh = -20 mA, strong driver 0.8 x VDD -
-
V
0.2 x VDD V
-
V
Table 9.4. Reset Signal Characteristics
Power-on Reset
Min Typ Max Unit
Power on reset threshold (rising edge) 1.84 1.92 2.00 V
Power on reset threshold (falling edge) 1.80 1.88 1.96 V
RESET signal pulse width (pulled low) 500 -
-
ns
Table 9.5. Analog Digital Converter (ADC) Characteristics
Power-on Reset
Min Typ Max
Unit
ADC input impedance
-
670 -
kohm
ADC input voltage range
0
-
2 x VREF V
Resolution (Programmable) 6
-
12
bits
Sampling Rate
-
-
1
MSps
Offset Error
-
1
-
LSB
Differential nonlinearity error -1
-
1
LSB
Integral nonlinearity error
-
3
LSB
-3
Table 9.6. Current Digital Analog Converter (IDAC) Characteristics
Power-on Reset
Min Typ Max Unit
Steps per range
-
31
-
DAC output current range (range 0) 0.05 -
1.6
μA
DAC output current range (range 1) 1.6
-
4.6
μA
DAC output current range (range 2) 0.5
-
16
μA
DAC output current range (range 3) 2
-
64
μA
Total error (continuous mode)
-
1
%
-1
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Preliminary Rev. 0.92 | 16
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Electrical Characteristics
Power-on Reset
Min Typ Max Unit
Total error (duty cycle mode)
-2
-
2
%
Settling time to 1% (range changed) -
-
5
μs
Settling time to 1% (step changed)
-
1
μs
-
Power Consumption
Table 9.7. Typical Power Consumption of Different Operating Modes
Operation state
Current Unit
Description
Transmit, +8dBm, 1Mbps TBD
mA
Transmit, 0dBm
8.2
mA
Receive
7.5
mA
Radio off, CPU active
TBD
µA/MHz
Radio off, CPU idle
TBD
µA/MHz
Deep sleep mode
TBD
µA
RTC running, full RAM retention
Shutdown mode
TBD
µA
RTC running, 128B RAM retention
Full shutdown mode
TBD
µA
No RTC, no RAM retention
Table 9.8. Typical Power Consumption in Practical Use Cases
Operating mode
Current Unit Description
LE advertising, discoverable TBD
µA
LE connected, master
TBD
µA
LE connected, slave
TBD
µA
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Preliminary Rev. 0.92 | 17
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
RF Characteristics
10. RF Characteristics
Table 10.1. Supported Frequencies and Channels
Parameter Min
Max Unit
Frequency 2402 2480 MHz
Table 10.2. Typical Receiver Sensitivity
Packet type -40°C 20°C 85°C Unit
LE
TBD
-93
TBD dBm
Table 10.3. Transmitter Output Power at Maximum Setting
Modulation type Min Typ Max Unit
LE
+6.5 +8
+9
dBm
10.1 Antenna Characteristics
Table 10.4. BGM111 Antenna Efficiency and Peak Gain
Parameter With optimal layout Note
Efficiency -2 dB
Efficiency and peak gain depend on the application PCB layout and mechanical design
Peak gain +1 dBi
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Preliminary Rev. 0.92 | 18
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
RF Characteristics
10.2 2D Radiation Pattern Plots
Figure 10.1. Typical 2D Radiation Pattern – Front View
Figure 10.2. Typical 2D Radiation Pattern – Side View
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Preliminary Rev. 0.92 | 19
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
RF Characteristics
Figure 10.3. Typical 2D Radiation Pattern – Top View
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Preliminary Rev. 0.92 | 20
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Physical Dimensions
11. Physical Dimensions
Figure 11.1. Module Physical Dimensions
Figure 11.2. Module Recommended PCB Pad Pattern
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Preliminary Rev. 0.92 | 21
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Physical Dimensions
Figure 11.3. Module Side View Dimensions
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Preliminary Rev. 0.92 | 22
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Soldering Recommendations
12. Soldering Recommendations
The BGM111 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations.
The following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering.
Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide.
• Refer to technical documentations of particular solder paste for profile configurations
• Avoid using more than one flow.
• Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150 mm stencil
thickness is recommended.
• Aperture size of the stencil should be 1:1 with the pad size.
• A low residue, “no clean” solder paste should be used due to low mounted height of the component.
• If the vias used on the application board have a diameter larger than 0.3 mm, it is recommended to mask them at the module side to
prevent solder wicking through the via holes. Solders have a tendency to fill holes and leave voids in the thermal pad solder junction,
as well as form solder balls on the other side of the application board which can in some cases be problematic.
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Preliminary Rev. 0.92 | 23
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Certifications
13. Certifications
Note: The certification for the BGM111 are pending.
13.1 Bluetooth
Bluetooth qualifications are pending
13.2 CE
The BGM111 is in conformity with the essential requirements and other relevant requirements of the R&TTE Directive (1999/5/EC).
This device is compliant with the following standards:
• Safety: EN 60950
• EMC: EN 301 489
• Spectrum: EN 300 328
• RF Exposure: EN 62479
Formal DoC is available from www.silabs.com.
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Preliminary Rev. 0.92 | 24
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Certifications
13.3 FCC and IC
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired operation.
Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.
FCC RF Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmittermeets both portable and mobile limits as demonstrated
in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter
except in accordance with FCC multi-transmitter product procedures. As long as the condition above is met, further transmitter testing
will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
Please contact www.silabs.com for detailed information.
OEM Responsibilities to Comply with FCC and Industry Canada Regulations
The BGM111 Module has been certified for integration into products only by OEM integrators under the following conditions:
• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures.
As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital
device emissions, PC peripheral requirements, etc.).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number
cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC and Industry Canada authorization.
End Product Labeling
The BGM111 module is labeled with its own FCC ID and IC Certification Number. If the FCC ID and IC Certification Number are not
visible when the module is installed inside another device, then the outside of the device into which the module is installed must also
display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:
“Contains Transmitter Module FCC ID: TBD”
or
“Contains FCC ID: TBD"
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or
change RF related parameters in the user manual of the end product.
To comply with FCC and Industry Canada RF radiation exposure limits for general population, the antenna(s) used for this
transmitter must be installed such that a minimum separation distance of 15 mm (FCC) / 20 mm (IC) is maintained between the
radiator (antenna) and all persons at all times and must not be co-located or operating in conjunction with any other antenna
or transmitter.
IC
This radio transmitter has been approved by Industry Canada to operate with the embedded chip antenna. Other antenna types are
strictly prohibited for use with this device.
This device complies with Industry Canada’s license-exempt RSS standards. Operation is subject to the following two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired operation of the device
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Preliminary Rev. 0.92 | 25
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Certifications
RF Exposure Statement
Exception from routine SAR evaluation limits are given in RSS-102 Issue5. BGM111 meets the given requirements when the minimum
separation distance to human body is less than equal to 15 mm. RF exposure or SAR evaluation is not required when the separation
distance is 15 mm or more. If the separation distance is less than 15 mm the OEM integrator is responsible for evaluating the SAR.
OEM Responsibilities to Comply with IC Regulations
The BGM111 Module has been certified for integration into products only by OEM integrators under the following conditions:
• The antenna(s) must be installed such that a minimum separation distance of 15 mm is maintained between the radiator (antenna)
and all persons at all times.
• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.
As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital
device emissions, PC peripheral requirements, etc.).
Note: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the IC
authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate IC authorization
End Product Labeling
The BGM111 module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the
outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final
end product must be labeled in a visible area with the following:
“Contains Transmitter Module IC: TBD”
or
“Contains IC: TBD
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or
change RF related parameters in the user manual of the end product.
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Preliminary Rev. 0.92 | 26
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Certifications
13.4 FCC et IC
Cet émetteur radio (IC : TBD) a reçu l'approbation d'Industrie Canada pour une exploitation avec l'antenne puce incorporée. Il est
strictement interdit d'utiliser d'autres types d'antenne avec cet appareil.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est
autorisée aux deux conditions suivantes :
1. l’appareil ne doit pas produire de brouillage;
2. l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre
le fonctionnement.
Déclaration relative à l'exposition aux radiofréquences (RF)
Les limites applicables à l’exemption de l’évaluation courante du DAS sont énoncées dans le CNR 102, 5e édition. L'appareil BGM111
répond aux exigences données quand la distance de séparation minimum par rapport au corps humain est inférieure ou égale à 15
mm. L'évaluation de l'exposition aux RF ou du DAS n'est pas requise quand la distance de séparation est de 15 mm ou plus. Si la
distance de séparation est inférieure à 15 mm, il incombe à l'intégrateur FEO d'évaluer le DAS.
Responsabilités du FEO ayant trait à la conformité avec les règlements IC
Le module BGM111 a été certifié pour une intégration dans des produits uniquement par les intégrateurs FEO dans les conditions suivantes :
• La ou les antennes doivent être installées de telle façon qu'une distance de séparation minimum de 15 mm soit maintenue entre le
radiateur (antenne) et toute personne à tout moment.
• Le module émetteur ne doit pas être installé au même endroit ou fonctionner conjointement avec toute autre antenne ou émetteur.
Dès lors que les deux conditions ci-dessus sont respectées, d'autres tests de l'émetteur ne sont pas obligatoires. Cependant, il incombe toujours à l'intégrateur FEO de tester la conformité de son produit final vis-à-vis de toute exigence supplémentaire avec ce module installé (par exemple, émissions de dispositifs numériques, exigences relatives aux matériels périphériques PC, etc).
REMARQUE IMPORTANTE : S'il s'avère que ces conditions ne peuvent être respectées (pour certaines configurations ou la colocation avec un autre émetteur), alors l'autorisation IC n'est plus considérée comme valide et l'identifiant IC ne peut plus être employé sur
le produit final. Dans ces circonstances, l'intégrateur FEO aura la responsabilité de réévaluer le produit final (y compris l'émetteur) et
d'obtenir une autorisation IC distincte.
Étiquetage du produit final
L'étiquette du module BGM111 porte son propre identifiant IC. Si l'identifiant IC n'est pas visible quand le module est installé à l'intérieur d'un autre appareil, l'extérieur de l'appareil dans lequel le module est installé doit aussi porter une étiquette faisant référence au
module qu'il contient. Dans ce cas, une étiquette comportant les informations suivantes doit être collée sur une partie visible du produit
final :
« Contient le module émetteur IC : TBD »
ou
« Contient IC : TBD »
L'intégrateur FEO doit être conscient de ne pas fournir d'informations à l'utilisateur final permettant d'installer ou de retirer ce module
RF ou de changer les paramètres liés aux RF dans le mode d'emploi du produit final.
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Preliminary Rev. 0.92 | 27
Blue Gecko BGM111 Bluetooth® Smart Module Data Sheet
Revision History
14. Revision History
Revision 0.9
• Preliminary
Revision 0.91
• Style Changes
Revision 0.92
• Corrected supply voltage range
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Preliminary Rev. 0.92 | 28
Table of Contents
1. Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3. Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.1 Power, Ground, and Reset Pins .
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3.2 GPIO Pins .
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4. Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 USART .
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4.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART) .
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4.3 I2C
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4.4 Timer/Counter (TIMER)
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4.5 Real Time Counter .
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4.6 Low Energy Timer (LETIMER) .
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4.7 Ultra Low Power Wake-Up Timer (CRYOTIMER) .
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4.8 Pulse Counter (PCNT) .
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4.9 General Purpose Input/Output (GPIO).
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4.10 Analog Comparator (ACMP)
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4.11 Analog to Digital Converter (ADC).
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4.12 Digital to Analog Current Converter (IDAC)
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4.13 Integrated DC-DC Converter (DC-DC) .
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5. Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1 PCB Design Guidelines
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5.2 Effect of Plastic and Metal Materials .
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5.3 Effect of Human Body .
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6.1 Power Supply Requirements .
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6.2 Power Saving Functions .
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6.3 Reset Functions .
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6.4 Debug and Firmware Updates .
6.4.1 JTAG . . . . . . . . .
6.4.2 DFU . . . . . . . . .
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7. Bluetooth Stack Software. . . . . . . . . . . . . . . . . . . . . . . . . .
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8. Host Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14
8.1 UART
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9. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
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10. RF Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18
Table of Contents
29
10.1 Antenna Characteristics .
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10.2 2D Radiation Pattern Plots .
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11. Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . .
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12. Soldering Recommendations . . . . . . . . . . . . . . . . . . . . . . . .
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13. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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13.1 Bluetooth .
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14. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Table of Contents
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Smart.
Connected.
Energy-Friendly
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Quality
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Disclaimer
Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers
using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific
device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories
reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy
or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply
or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific
written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected
to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no
circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.
Trademark Information
Silicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®, EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations
thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®,
USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of
ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders.
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
USA
http://www.silabs.com
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