ZTE MW3736Hardware Design User Manual Version

ZTE MW3736Hardware Design

User Manual

Version：V1.0

Copyright Statement

If you accept this manual of ZTE Corporation, it means that you have agreed to the following terms and conditions; if you don’t agree, please stop using this manual.

The copyright of this manual belongs to ZTE Corporation. ZTE Corporation reserves any rights not expressly granted in this manual. The contents in this manual are the proprietary information of

ZTE Corporation. This manual and any image, table, data or other information contained in this manual may not be reproduced, transferred, distributed utilized or disclosed without the prior written permission of ZTE Corporation.

and are the registered trademark of ZTE Corporation. All other trademarks appeared in this manual are owned by the relevant companies. Nothing contained in this manual should be construed as granting, by implication, estoppel, or otherwise, any license or right to use any trademarks displayed in this manual without the prior written permission of ZTE Corporation or third‐party obligee.

This product conforms to the design requirements of relevant environment protection and personal safety. The storage, usage and disposal of this product should comply with the product user manual, relevant contracts or requirements of laws and regulation in relevant countries.

ZTE Corporation keeps the right to modify or improve the product described in the manual without prior notice; and meanwhile keeps the right to modify or retract this manual.

If there is anything ambiguous in this manual, please consult ZTE Corporation or its distributor or agent promptly.

It’s not allowed to spread without the permission of ZTE Corporation. © ZTE Corporation. All rights reserved.

第 I 页

Version update description

Product version Document version

V1.0

Writer

Document version Date

V1.0

2012‐08‐07

Written by

Liu Changdi

Yu Xianwu

Document No.

Document update descriptions

Released for the first time

Requested by

Approved by

第 II 页

© ZTE Corporation. All rights reserved.

It’s not allowed to spread without the permission of ZTE Corporation

With strong technical force, ZTE Corporation can provide CDMA/GPRS/WCDMA/GSM module customers with the following all‐around technical support:

1. Provide complete technical documentation;

2. Provide the development board used for R&D, test, production, after‐sales, etc.

3. Provide evaluations and technical diagnosis for principle diagram, PCB, test scenarios;

4. Provide test environment;

ZTE Corporation provides customers with onsite supports, and also you could get supports through telephone, website, instant messenger, E‐mail, etc.


第 III 页

Preface

Summary

This user manual mainly describes ZTE MW3736 module’s product principle diagram, module’s PINs, hardware interfaces and module structure. This manual is used to instruct the users on the module’s hardware design, and on the basis of this module, quickly and conveniently design different kinds of wireless terminals.

Target Readers

z

System designing engineers z

Mechanical engineers z

Hardware engineers z

Software engineers z

Testing engineers

Description of contents:

This manual contains 5 chapters. See the table below:

1. Module’s General description. This chapter introduces MW3736 module’s basic technical specification, relevant documents and abbreviations.

2. Module’s External Interfaces. This chapter introduces MW3736 module’s pin name and functions.

3. Module’s Electrical Characteristics. This chapter describes MW3736 module’s interface level, power consumption, reliability, etc.

4. Description of Hardware Interfaces. This chapter describes MW3736’s hardware interfaces.

5. Mechanical Design. This chapter describes MW3736 module’s appearance diagram, assembly diagram and PCB layout on the main board.

第 IV 页



Contents

1

MODULE’S GENERAL DESCRIPTION .......................................................................... 1

1.1

INTRODUCTION TO MODULE’S FUNCTIONS ..................................................... 1

1.2

MODULE’S PRINCIPLE BLOCK DIAGRAM .......................................................... 2

1.3

ABBREVIATIONS ................................................................................................... 4

2

DESCRIPTION OF MODULE’S EXTERNAL INTERFACES ........................................... 7

2.1

DEFINITIONS OF MODULE’S INTERFACES ........................................................ 7

2.2

ANTENNA INTERFACE ......................................................................................... 9

2.3

ANTENNA INTERFACE’S RF PERFORMANCE ................................................. 10

3

MODULE’S ELECTRICAL CHARACTERISTICS ......................................................... 12

3.1

DESCRIPTIONS OF INTERFACE LEVEL ........................................................... 12

3.2

POWER ON/OFF TIME SEQUENCE ................................................................... 12

3.3

RELIABILITY ........................................................................................................ 14

3.4

ESD ...................................................................................................................... 14

4

REFERENCE DESIGN OF INTERFACE CIRCUITS ..................................................... 15

4.1

POWER AND RESET .......................................................................................... 15

4.2

COM PORT .......................................................................................................... 16

4.3

UIM CARD INTERFACE ....................................................................................... 19

4.4

AUDIO INTERFACE (OPTIONAL) ....................................................................... 20

4.5

WORK STATUS INDICATORS ............................................................................ 21

5

MECHANICAL DESIGN ................................................................................................ 22

5.1

APPEARANCE DIAGRAM ................................................................................... 22

5.2

MODULE’S ASSEMBLY DIAGRAM ..................................................................... 23

5.3

MODULE’S PCB ENCAPSULATION DIMENSIONS ............................................ 24


第 V 页

1

Module’s General Description

With 36‐PIN stamp‐hole interface, MW3736 module developed by ZTE Corporation is a kind of

WCDMA/GSM industrial module, which can be built in the Set‐Top‐Box, vehicle‐mounted terminals, and enable users to get access to the Internet wirelessly and send/receive Emails, browse the web pages, download at high speed and play online videos, etc.

It enables users to get access to the Internet any time in a place where WCDMA/GSM network is covered. It also features in SMS, voice call, etc. and provides highly free and convenient solutions for users in mobile data communication, and truly realizes the dream of mobile office.

MW3736 module is divided into two products with different frequency bands, respectively named as MW3736_V1A and MW3736_V1B. They can be recognized through the silkscreen printed at the bottom of it. MW3736_V1A corresponds to the frequency band WCDMA850/1900,

GSM850/900/1800/1900; while MW3736_V1B corresponds to the frequency band

WCDMA850/900/2100, GSM850/900/1800/1900.

This chapter mainly introduces the module’s basic functions and logic block diagrams.

1.1 Introduction to Module’s Functions

Basic features

Parameters

Table 1‐1 Module’s functions

MW3736

Frequency band

Dimensions

Weight

Work temperature

Storage temperature

Performance

Work voltage

WCDMA850/1900、

GSM850/900/1800/1900(MW3736_V1A)

WCDMA850/900/2100、

GSM850/900/1800/1900(MW3736_V1B)

39.50mm×31.00mm×2.65mm

10g

‐25℃~+65℃

‐30℃~+85℃

Standard consumption

Maximum output power

3.3V~4.25V

Standard: 3.8V

Sleep current (Min.): 1mA

Idle current（Ave.）: 5mA@‐75dBm

Talk current: 230mA@‐75dBm

Maximum current (instantaneous value):

1800mA@‐102dBm

22.5dBm ~ 30dBm@‐102dBm


第 1 页

Parameters

Rx. signal sensitivity

Interface

Connection method

Antenna

Integrated full duplex port

UIM card socket level

Data service

Mode

Max. downlink data rate

Max. uplink data rate

Protocol

SMS

Audio (optional)

AT command settings

MW3736

‐108dBm

36 Pin stamp‐hole

U.FL‐R‐SMT 50ohm antenna connector

AT command, data transmission

1.8V /2.85V

HSPA+/WCDMA/ GSM/EDGE

14.4Mbps

5.76Mbps

Internal TCP/IP and UDP/IP protocol stack

TCP server

Embedded FTP

Support TEXT/PDU mode

PTP MO/MT

SMS Cell Broadcast

PCM audio

Headset

Audio encoder EVRC & 13K QCELP

Volume control

Support DTMF

Common AT commands

ZTE exclusive AT commands

1.2 Module’s Principle Block Diagram

See MW3736’s major logic functions in the following block diagram:

第 2 页



Figure 1‐1 Module’s principle diagram

MW3736_V1A principle diagram:

PCM(可选）

USB UART RF_ANT

PA

U850 TX

GSM HB

TX

GSM LB

TX

U1900 TX

PA

PA

SP10T

U850

SAW

GSM HB

U1900

GSM LB

SAW

MEMORY

RX

U850/G850

RF

RX

G900

G1800

G1900

SAW

RX

SAW

RX

BB

CPU

PM

USIM POWER


第 3 页

MW3736_V1B principle diagram:

PCM(可选)

USB UART

U850

U900

TX

TX

U2100 TX

SPDT

GSM HB TX

GSM LB

TX

PA

SPDT

U850

SAW

U900

SAW

U2100

SAW

GSM HB

GSM LB

U850/G85

0

RX RX

RF

RX

BB

MEMORY

RF_ANT

SP10T

G900

G1800

G1900

SAW

RX

SAW

RX

CPU

PM

USIM POWER

1.3

ASIC

B

BER

BTS

C

A

ADC

AFC

AGC

ARFCN

ARP

Abbreviations

Table 1‐2 Introduction to Abbreviations

Analog‐Digital Converter

Automatic Frequency Control

Automatic Gain Control

Absolute Radio Frequency Channel Number

Antenna Reference Point

Application Specific Integrated Circuit

Bit Error Rate

Base Transceiver Station

第 4 页



FR

G

GPRS

GSM

H

HR

I

EGSM

EMC

EMI

ESD

ETS

F

FDMA

DAI

DAC

DCE

DSP

DTE

DTMF

DTR

E

EFR

CDMA

CDG

CS

CSD

CPU

D

M

MCU

MMI

MS

P

PCB

PCL

IC

IMEI

ISO

ITU

L

LCD

LED

Code Division Multiple Access

CDMA Development Group

Coding Scheme

Circuit Switched Data

Central Processing Unit

Digital Audio interface

Digital‐to‐Analog Converter

Data Communication Equipment

Digital Signal Processor

Data Terminal Equipment

Dual Tone Multi‐Frequency

Data Terminal Ready

Enhanced Full Rate

Enhanced GSM

Electromagnetic Compatibility

Electro Magnetic Interference

Electronic Static Discharge

European Telecommunication Standard

Frequency Division Multiple Access

Full Rate

General Packet Radio Service

Global Standard for Mobile Communications

Half Rate

Integrated Circuit

International Mobile Equipment Identity

International Standards Organization

International Telecommunications Union

Liquid Crystal Display

Light Emitting Diode

Machine Control Unit

Man Machine Interface

Mobile Station

Printed Circuit Board

Power Control Level


第 5 页

TA

TDMA

TE

U

UART

UIM

USB

V

VSWR

Z

ZTE

RF

ROM

RMS

RTC

S

SIM

SMS

SRAM

T

PCS

PDU

PLL

PPP

R

RAM

Personal Communication System

Protocol Data Unit

Phase Locked Loop

Point‐to‐point protocol

Random Access Memory

Radio Frequency

Read‐only Memory

Root Mean Square

Real Time Clock

Subscriber Identification Module

Short Message Service

Static Random Access Memory

Terminal adapter

Time Division Multiple Access

Terminal Equipment also referred it as DTE

Universal asynchronous receiver‐transmitter

User Identifier Management

Universal Serial Bus

Voltage Standing Wave Ratio

ZTE Corporation

第 6 页



2

Description of Module’s External Interfaces

MW3736 module adopts 36pin stamp‐hole interface to connect externally.

2.1 Definitions of Module’s Interfaces

Table 2‐1 Definitions of module’s interface

1

VREG_USIM

2

USIM_RST

3

USIM_CLK

4

USIM_DATA

5

GND

6

7

8

NC

NC

NC

9

NC

10

11

NC

NC

12

GND

13

/PON_RESET

14

15

16

VBUS

NC

VBAT

17

V_MSME_1V8

MW3736

18

VBAT

Functions Pin

No.

Signal name

1 VREG_USIM

2 USIM_RST

I/O

SIM card interface

3 USIM_CLK

4 USIM_DATA

O

O

O

I/O

11 MIC1_N I

Basic functions

2.85V/1.8V power supply

USIM card reset signal

USIM card clock cable

USIM card data cable

Differential audio input

GND

GND

SIG_LED

36

35

34

PCM_DIN

PCM_CLK

USB_DM

USB_DP

ON/OFF

PCM_SYNC(/DSR

)

PCM_DOUT(DCD)

/DTR

/RTS

RI

TXD

RXD

/CTS

GND

33

32

31

30

29

28

23

22

21

20

27

26

25

24

RF_ANT

Remarks

19


第 7 页

Reset

Power

UART

PCM

(optional)

13

/PON_RESET

14 VBUS

16 VBAT

17 V_MSME_1V8

18 VBAT

ON/OFF

29

21

/CTS

22 RXD

23 TXD

24 RI

RTS

25

26

/DTR

27

28

32

PCM_DOUT

（

DCD）

PCM_SYNC

（

/DSR）

PCM_CLK

（

WAKEUP）

USB interface

33 PCM_DIN

30 USB_DP

31 USB_DM

SIG_LED

34 LED

Antenna 19 RF_ANT

5 GND

GND 12

20

I

I

O

O

O

I

O

I

I

I

I

I channel1 ‐

Reset signal

USB power

Module’s main power

Digital power

Module’s main power

Power on/off control

Clear to send

Receive data

Transmit data

Ringtone

Request to send

Data terminal ready

PCM data output

1.8V, valid upon low level

+5V

3.3V‐4.2V

Voltage output, 1.8V

3.3V‐4.2V



1.8V

1.8V

1.8V



1.8V，duplex with DCD

O

PCM frame SYNC clock

1.8V，duplex with /DSR

O

O

I

I/O

I/O

O

I/O

PCM data clock

PCM data input

USB data+

USB data‐

Module’s working status indicator

Antenna interface

1.8V, duplexing pin. See

Note (1) for detailed functions.

1.8V

第 8 页



35

36

Note:

（

1） The default function is WAKEUP, and generally it is at high level. After entering the USB sleep mode, the module needs to wake up the main controller (or PC) to trigger certain event (e.g., call or text message); in this case, it displays the level variation of “Low—High‐‐Low”, and each state lasts for 1 second; after that, the PIN automatically becomes high level, and the main controller (or PC) needs to send USB wakeup command to awaken the module.

（

2） As the PCM function is enabled, it’s used as the CLK pin of the PCM. As the module enters the sleep mode, there is high level at WAKEUP pin; when it needs to wake up the main controller

(or PC) if there is an incoming call at this moment, it displays the level variation of

“Low—High‐‐Low”, and each state lasts for 1 second; subsequently it displays the waveform of the PCM CLK PIN. When it needs to wake up the main controller (or PC) if there is other event such as text message, it displays the level variation of “Low—High‐‐Low”, and each state lasts for 1 second; subsequently the PIN automatically becomes high level

2.2 Antenna Interface

Proper measures should be taken to reduce the access loss of effective bands, and good shielding should be established between external antenna and RF connector. Besides, external RF cables should be kept far away from all interference sources such as high‐speed digital signal or switch power supply.

According to mobile station standard, stationary wave ratio of antenna should be between 1.1 and 1.5, and input impedance is 50 ohm. Different environments may have different requirements on the antenna’s gain. Generally, the larger gain in the band and smaller outside the band, the better performance the antenna has. Isolation degree among ports must more than 30dB when multi‐ports antenna is used. For example, between two different polarized ports on dual‐polarized antenna, two different frequency ports on dual‐frequency antenna, or among four ports on dual‐polarized dual‐frequency antenna, isolation degree should be more than 30dB.

Precautions of using PIN2 and RF connector:

Compatible design has been used on MW3736 RF external interface, therefore customers can select reasonably according to the product form during the second‐time development of the module to optimize the cost of BOM.

Program 1：

PIN2 is used as the antenna PIN. Pay attention to the following when using it as the antenna’s feed PIN:

（

1）The feed connected to PIN2 is 50ohm micro‐strip or strip line. To approach the module, put

π shape or F shape matching network for later tuning.

（

2）The RF wires must be kept away from the GND, and generally the distance should be 3 times of the width of RF wires.

（

3）It’s forbidden to put some interference sources such as DCDC, WIFI module around RF wires


第 9 页

or RF port

Program 2:

When using RF plug as the antenna feed, disconnect PIN2 from the main board and make sure there are some clean areas below or around PIN2. Keep 2mm distance between the surface of PIN2 and GND, and drill holes below PIN2. It’s not suggested to use the compatible design of PIN2 at the same time when using the RF connector.

Figure 2‐1 Antenna interface diagram

2.3 Antenna Interface’s RF Performance

See the antenna interface’s RF performance in table 2‐2:

Table 2‐2 Antenna Interface’s RF Performance

MW3736_V1A:

Antenna

Interface’s RF

Performance

Module’s uplink

（

MS‐>BTS）

WCDMA850 824MHz‐849MHz


GSM850 824MHz‐849MHz

GSM900

GSM1800

GSM1900

880MHz‐915MHz

1710MHz‐1785MHz

1850MHz‐1910MHz

Module’s downlink

（

BTS‐>MS）

869MHz‐894MHz

1930MHz‐1990MHz

869MHz‐894MHz

925MHz‐960MHz

1805MHz‐1880MHz

1930MHz‐1990MHz

Power

（ dBm）

23±2

23±2

33±2

33±2

30±2

30±2

Antenna interface Rx. sensitivity

< ‐110dBm

< ‐110dBm

< ‐108dBm

< ‐108dBm

< ‐108dBm

< ‐108dBm

第 10 页



MW3736_V1B:

Antenna

Interface’s RF

Performance

WCDMA850

WCDMA900

Module’s uplink

（

MS‐>BTS）

824MHz‐849MHz

880MHz‐915MHz


GSM850 824MHz‐849MHz

GSM900

GSM1800

GSM1900

880MHz‐915MHz

1710MHz‐1785MHz

1850MHz‐1910MHz

Module’s downlink

（

BTS‐>MS）

869MHz‐894MHz

925MHz‐960MHz

2110MHz‐2170MHz

869MHz‐894MHz

925MHz‐960MHz

1805MHz‐1880MHz

1930MHz‐1990MHz

Power

（ dBm）

23±2

23±2

23±2

33±2

33±2

30±2

30±2

Antenna interface Rx. sensitivity

< ‐110dBm

< ‐110dBm

< ‐110dBm

< ‐108dBm

< ‐108dBm

< ‐108dBm

< ‐108dBm


第 11 页

3

Module’s Electrical Characteristics

This chapter mainly introduces the module’s electrical characteristics, including module’s interface level, power consumption, reliability, etc.

3.1 Descriptions of interface level

Table 3‐1 Description of level of module’s main external interfaces

External interfaces

UART

High/low level

0

1

Min.

0.7*V_UART

Typical

0

V_UART

Max.

0.3*V_UART

UIM 0

1

0

0.7*VREG_RUIM VREG_RUIM

0.3*VREG_RUIM

Among them, V_UART is 1.8V, and VREG_RUIM is 1.8V/2.85V.

Remarks

Internal voltage conversion

3.2 Power on/off Time Sequence

The time sequence diagram indicates the whole power on/off process.

第 12 页



Figure 3‐1 Power on/off time sequence diagram

Table 3‐2 Power on/off circuit time characteristics


第 13 页

3.3 Reliability

Before leaving the factory, the module has gone through a series of reliability tests, such as: high/low temperature operation, high/low temperature storage, thermal shock, alternating temperature humidity, etc. The test results conform to the requirements in the industry. List the module’s work temperature in the table below:

Table 3‐3 Module’s temperature characteristics

Parameters Descriptions

To Normal temperature work

Min.

‐25℃

Max.

+65℃

Ta

Ts

Limited work temperature

‐30℃

Module’s storage temperature

‐40℃

+75℃

+85℃

Remarks

Basic functions are normal, but the RF performance slightly drops.

3.4 ESD

The module’s interface, antenna interface and UIM card interface all pass the standard ESD performance testing.

Interface

Table 3‐4 Module’s ESD characteristics

Test items

Test requirements

±8 kV

Antenna interface

Air discharging

Contact discharging

UIM interface card

Air discharging

Contact discharging

±６ kV

±8 kV

±６ kV

Performance

Nothing wrong

Nothing wrong

Nothing wrong

Nothing wrong

第 14 页



4

Reference Design of Interface Circuits

This chapter describes the reference design of interface circuits and precautions according to the module’s functions.

4.1 Power and Reset

See the reference design of power circuit in figure 4‐1.

Figure 4‐1 Power and reset circuit reference design diagram

z

Power design

The module is powered by VBAT. See the voltage characteristics in table 4‐1.

Classification

Input voltage

Input current

Table 4‐1 Voltage characteristics

MIN

3.3 V

< 3mA (average)

TYPICAL

3.8 V

‐‐

MAX（instantaneous）

4.2 V

530mA（WCDMA）

1800mA（GSM） z

Power on

The module will be normally powered off after connected to the power normally.

Provide one 4S ~ 6S low pulse to the module’s ON/OFF pin to turn on the module.

The time required to power on at each time depends on the module’s status. Usually, the low level must last for at least 4 seconds. z

Power off

Provide one 4S ~ 6S low pulse to the module’s ON/OFF pin to turn off the module.


第 15 页

z

Reset

Provide one 3S low pulse to the module’s /RESET pin to reset the module.

After reset, the module will enter the power‐off status. Provide one at least 4S low pulse to the module’s ON/OFF pin to turn on the module again.

V_MSME_1V8

There is a voltage output pin with current adjuster on MW3736 module, which can be used to supply external power to the board. The voltage of this pin and the voltage of baseband processor/memory come from the same voltage adjuster. The voltage output is available only when the module is on. The normal output voltage is 1.8V, and the user should absorb the current from this pin as little as possible (less than 10mA). Generally, it is recommended to use this pin for pull‐up when matching the level.

Other Advice

In order to make sure the data is saved safely, please don’t cut off the power when the module is on. It’s strongly recommended to use the soft switch to turn off the mobile phone. If the interval between the cut‐off and power‐on is less than 2 seconds, it would cause the module to automatically power on.

4.2 COM Port

The module provides a full duplex UART interface, whose maximal data rate is 230.4kbps and typical data rate is 115.2kbps. The external I/O level is 1.8V CMOS signal.

Precautions：

1）The module’s I/O level is 1.8V CMOS, and the level conversion is required when connected with standard 3.3V logic circuit.(e.g., MCU or RS232 driver chip MAX3238). Otherwise, it might cause unstable com ports because the level is not matched or cause damage to the module because it is at high level for a long time.

For non 1.8V external UART, it needs to convert the level. Normally a dynatron is used to realize the level conversion. As shown in figure 4‐2, the resistance is just for your information, please calculate again during the design. The diode in the figure is Schottky diode (forward voltage drop:

0.3V). If you select other diode, please select one with smaller forward voltage drop to guarantee that

RXD_1V8’s level is below the threshold when inputting low level.

2）Port baud rate 115200 (by default), can be used for AT commands and MODEM. The hard flow control is OFF by default.

第 16 页



Figure 4‐2 UART interface level conversion

4）Connect to RXD and TXD only when there is no flow control in use;

When using hardware flow control to connect other processors, use RXD, TXD, /CTS and /RTS; when used as Modem to connect to the PC, connect all IO signal cables (8 wires). Besides, the ringtone signal will produce low level interruption upon an incoming call or text message. Select the port IO signals for level conversion according to the specific conditions.


第 17 页

Descriptions of UART interface:

Figure 4‐3 UART DCE－DTE connection relationship diagram

See the definitions of UART1 interface in table 4‐2.

Table 4‐2 Definitions of UART1 interface

Classification No. Definitions I/O Descriptions

UART

(1.8V）

22 UART_RX I

25 UART_RTS O

Receive data

Ready to send

23 UART_TX O

26 UART_DTR I

21 UART_CTS I

24 UART_RI O

28 UART_DSR O

27 UART_DCD O

GND

Transmit data

Data terminal ready

Clear to send

Ringtone indication

Data set ready

Carrier wave detection

GND

Remarks

DTE transmits serial data

DTE informs DCE to send

DTE receives serial data

DTE is ready

DCE has switched to Rx. mode

Inform DTE upon a remote call

DCE is ready

Data link connected

第 18 页



4.3 UIM card Interface

The module supports 1.8V/2.85V UIM card. See the design in figure 4‐3. It’s recommended to add

ESD to protect the UIM card.

Table 4‐3

UIM card interface definitions

Classification No. Definitions I/O

UIM 1 V_RUIM O

2

3

4

UIM_RST

UIM_CLK

UIM_DATA

O

O

I/O

Descriptions

RUIM card voltage

RUIM card rest

RUIM card clock

RUIM card data

Remarks

The typical rate value of UIM card interface is about 3.25MHz, therefore the UIM card socket should be put near the module’s interface to avoid serious waveform deformation caused by overlong wiring

(it’s advised that the wiring should not exceed 100mm), otherwise, it will affect the signal communication.

The wiring of UIM_CLK and USIM_DATA should be enveloped by the ground wires. Add one 0.1uF or

0.22uF capacitance to V_RUIM, and add 33pF capacitance to UIM_CLK, UIM_DATA & UIM_RST to filter the interference of antenna signals. Besides, the anti‐static performance of these four signals can be realized through the TVS tube or ESD component. See the figure below for the reference design.

Figure 4‐4 UIM card circuit reference design

Note:

The PCB wiring of UIM card should be laid closely around the module as possible as you can, and the

ESD component should be put near the UIM card socket.


第 19 页

4.4 Audio Interface (optional)

The module provides one PCM interface, which must connect one CODEC externally to input and output audios. The module’s PCM interface provides PCM_CLK, PCM_SYNC, PCM_DIN, PCM_DOUT，and it supports 2.048MHz PCM clock data rate and 8K frame data rate. PCM clock will stop the output when it enters the dormant mode.

The module’s PCM interface must work under Master mode, and the clock and SYNC signal must be sent by the module. The device connected with the interface can work under Slave mode only.

See the audio interface circuit in figure 4‐4.

Figure 4‐5 Audio interface circuit reference design principle diagram z

Codec audio interface design on the headset

The two microphone interfaces MIC_N and MIC_P are both differential interfaces, which could also be used for single‐end input. It’s recommended to use differential mode to reduce the noises.

Refer to the connection of EAR left/right channel in the figure.

See the time sequence of PCM interface in figure 4‐5.

第 20 页



4.5 Work Status Indicators

The SIG_LED PIN output status is defined by the software. The SIG_LED PIN is MPP port, which can drive 20mA current. See the reference design of indicators in figure 4‐5.

Module status

Power‐on status

Network status

IDLE status

Traffic status

Table 4‐4 Description of work status indicators

Indicator status

Slow flash searching

Standard flash

Slow flash

Fast flash

Frequency

1Hz

3Hz

1Hz

5Hz

Figure 4‐5 Indicator reference design principle diagram


第 21 页

5

Mechanical Design

5.1 Appearance Diagram

See MW3736 module’s appearance in figure 5‐1.

Figure 5‐1 MW3736

module’s appearance diagram

z

Dimensions: 39.50mm×31.00mm×2.65mm z

Weight: 10g

第 22 页



5.2 Module’s Assembly Diagram

See the assembly diagram of the module in figure 5‐2.

Figure 5‐1 Module’s assembly diagram


第 23 页

5.3 Module’s PCB Encapsulation Dimensions

See the module’s PCB encapsulation dimensions in figure 5‐3.

Figure 5‐2 PCB encapsulation diagram of relevant female socket (top view)

第 24 页



Figure 5‐4 PCB encapsulation diagram of relevant female socket (bottom view)

Precautions while designing PCB:

1） Copper‐clad and wiring are forbidden on each layer of the PCB at the area below the RF test points.

2） For the convenience of testing and maintenance, it might be necessary to drill holes on the

PCB to expose J‐TAG test points.


第 25 页

ZTE MW3736Hardware Design User Manual Version

ZTE MW3736Hardware Design

User Manual

Version：V1.0

Copyright Statement

Version update description

Writer

Preface

Summary

Target Readers

Description of contents:

Contents

Module’s General Description

1.1 Introduction to Module’s Functions

1.2 Module’s Principle Block Diagram

PCM(可选）

USB UART RF_ANT

MEMORY

RF

BB

CPU

PM

USIM POWER

PCM(可选)

USB UART

RF

BB

MEMORY

RF_ANT

CPU

PM

USIM POWER

1.3

Abbreviations

Description of Module’s External Interfaces

2.1 Definitions of Module’s Interfaces

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

MW3736

18

36

35

34

33

32

31

30

29

28

23

22

21

20

27

26

25

24

19

2.2 Antenna Interface

2.3 Antenna Interface’s RF Performance

Module’s Electrical Characteristics

3.1 Descriptions of interface level

3.2 Power on/off Time Sequence

3.3 Reliability

3.4 ESD