430BOOST-SENSE1 - Texas Instruments
430BOOST-SENSE1 - Capacitive Touch
BoosterPack for the LaunchPad
User's Guide
Literature Number: SLAU337B
April 2011 – Revised May 2013
Contents
Preface ....................................................................................................................................... 4
1
430BOOST-SENSE1 Overview .............................................................................................. 5
.................................................................................................................. 5
.............................................................................................................. 6
2
Getting Started With 430BOOST-SENSE1 BoosterPack ........................................................... 7
2.1
Hardware Preparation .................................................................................................. 7
2.2
Software Preparation ................................................................................................... 7
2.3
Capacitive Touch User Experience ................................................................................... 8
3
Capacitive Touch BoosterPack Hardware ............................................................................. 12
3.1
Driving the LEDs ....................................................................................................... 13
3.2
Capacitive Touch Sensors ............................................................................................ 14
4
LaunchPad Capacitive Touch BoosterPack User Experience Firmware .................................... 15
4.1
Import Project in CCS ................................................................................................. 15
4.2
Open Project and Workspace in IAR Embedded Workbench ................................................... 15
4.3
Capacitive Touch Software Library .................................................................................. 16
5
LaunchPad Capacitive Touch BoosterPack User Experience Software .................................... 18
5.1
LaunchPad Capacitive Touch BoosterPack User Experience GUI ............................................. 18
5.2
MediaPad ............................................................................................................... 18
5.3
UART Communication Protocol ...................................................................................... 19
6
Frequently Asked Questions (FAQ), Tips, and Tricks ............................................................. 20
7
References ....................................................................................................................... 20
8
Schematics and PCB Layout ............................................................................................... 21
8.1
Schematics ............................................................................................................. 21
8.2
PCB Layout ............................................................................................................. 22
8.3
Bill of Materials (BOM) ................................................................................................ 22
Revision History ......................................................................................................................... 23
2
1.1
Overview
1.2
Kit Contents
Table of Contents
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List of Figures
1
Capacitive Touch BoosterPack With LaunchPad ....................................................................... 5
2
PC GUI Looking for LaunchPad
3
4
5
6
7
8
9
10
11
12
..........................................................................................
PC GUI in Sleep Mode .....................................................................................................
PC GUI in Active Mode ...................................................................................................
MediaPad ...................................................................................................................
Capacitive Touch BoosterPack Hardware .............................................................................
Schematic LED Multiplexing .............................................................................................
Driving LEDs ...............................................................................................................
Capacitive Touch Sensor Areas .........................................................................................
Capacitive Touch BoosterPack Schematic.............................................................................
Capacitive Touch BoosterPack Layout, Top Layer ...................................................................
Capacitive Touch BoosterPack Layout, Bottom Layer and Silkscreen .............................................
9
9
10
11
12
13
13
14
21
22
22
List of Tables
1
2
....................................................................................................
Bill of Materials.............................................................................................................
BoosterPack Interface
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22
3
Preface
SLAU337B – April 2011 – Revised May 2013
Read This First
If You Need Assistance
If you have any feedback or questions, support for MSP430 devices, the MSP-EXP430G2 LaunchPad,
and the 430BOOST-SENSE1 Capacitive Touch BoosterPack for the LaunchPad is provided by the Texas
Instruments Product Information Center (PIC) and the TI E2E Forum
(https://community.ti.com/forums/12.aspx). Contact information for the PIC can be found on the TI web site
at support.ti.com. Additional device-specific information can be found on the MSP430 web site at
www.ti.com/msp430.
Related Documentation from Texas Instruments
The primary sources of MSP430 information are the device-specific data sheets and user's guides. The
most up-to-date versions of the user's guide documents available at www.ti.com/msp430 Information
specific to the MSP-EXP430G2 LaunchPad Experimenter Board and the different BoosterPacks can be
found at focus.ti.com/docs/toolsw/folders/print/msp-exp430g2.html or the LaunchPad wiki page at
processors.wiki.ti.com/index.php/MSP430_LaunchPad_(MSP-EXP430G2.
User's guides and detailed information on setting up a project for the MSP430 using Code Composer
Studio or IAR Embedded Workbench can be found at the Tools & Software section of the MSP430 landing
page www.ti.com/msp430.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can
radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable
protection against radio frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case, the user will be required to take whatever
measures may be required to correct this interference his own expense.
4
Preface
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User's Guide
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430BOOST-SENSE1 - Capacitive Touch BoosterPack for
the LaunchPad
1
430BOOST-SENSE1 Overview
1.1
Overview
The 430BOOST-SENSE1 Capacitive Touch BoosterPack is the first extension module for the MSPEXP430G2 MSP430 LaunchPad Value Line Development Kit (see Figure 1). Extension modules such as
this one, designed specifically for the LaunchPad, are called BoosterPacks, and each features an
application example for one of the MSP430 Value Line devices. The BoosterPacks can be connected to
the MSP-EXP430G2 with both 10-pin male headers (included in MSP-EXP430G2 kit) soldered onto the
board and, therefore, use all available pins on the MSP430G2452 Value Line device.
Figure 1. Capacitive Touch BoosterPack With LaunchPad
The Capacitive Touch BoosterPack is available for purchase from the TI eStore:
https://estore.ti.com/430BOOST-SENSE1-Capacitive-Touch-BoosterPack-P2361C42.aspx.
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430BOOST-SENSE1 Overview
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The Capacitive Touch BoosterPack features the new MSP430G2xx2 devices, which are capable of driving
up to 16 capacitive-touch enabled I/O pins. The included MSP430G2452 device allows for low-cost
capacitive-sensing and approximation-sensing applications without the use of any external components.
The BoosterPack includes a capacitive-touch board and an MSP420G2452 device that is preprogrammed
with a demo application. The user experience application demonstrates capacitive touch as standalone
feature by showing the user interaction directly with the onboard LEDs, by a GUI, or by an application
example on a Microsoft Windows PC.
430BOOST-SENSE1 features:
• Nine LEDs giving instant feedback to user interaction
• Six capacitive-touch areas (a button, a 4-element wheel, and a proximity sensor)
• One preprogrammed MSP430G2452 device
For latest information on the LaunchPad, other available BoosterPacks, software examples, and how to
program the included MSP430G2452 device, see the MSP-EXP430G2 LaunchPad Experimenter Board
User’s Guide (SLAU318) or the LaunchPad wiki page
processors.wiki.ti.com/index.php/MSP430_LaunchPad_(MSP-EXP430G2).
1.2
Kit Contents
The 430BOOST-SENSE1 kit includes two components:
• One Capacitive Touch BoosterPack board with nine LEDs and six sensor areas
• One preprogrammed MSP430G2452 device
This device is a low-power 16-bit microcontroller with an 8-channel 10-bit ADC, comparator, universal
serial interface that supports SPI and I2C, 8kB flash memory, and 256B RAM memory
6
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2
Getting Started With 430BOOST-SENSE1 BoosterPack
Getting Started With 430BOOST-SENSE1 BoosterPack
The following sections describe the preparation necessary to run the user experience application demo
and to start developing applications with the MSP430G2452 for the Capacitive Touch BoosterPack.
2.1
Hardware Preparation
To prepare the Capacitive Touch BoosterPack hardware for its first use:
1. Solder both 10-pin male headers onto the LaunchPad's breakout pin connections J1 and J2. These
two 10-pin male headers and two 10-pin female headers come with the original LaunchPad kit.
NOTE: If the 10-pin female headers are populated, use the 10-pin male headers as adapter to
further extend the connections to the LaunchPad. The additional distance adds minimal base
capacitance and does not affect the user experience of the kit.
2. Remove the J5 connections on the LaunchPad to disconnect the LaunchPad LEDs and keep them
from interfering with P1.0 and P1.6 functions of the Capacitive Touch BoosterPack.
3. Ensure jumpers VCC, TXD, and RXD of the J3 connection are populated for the user experience demo
to operate properly.
NOTE: The jumpers RST and TEST must also be populated when programming the device. They
are not required for normal application operation.
4. Replace the existing MSP430 device in the LaunchPad MCU socket with the MSP430G2452 device
that comes with the Capacitive Touch BoosterPack kit.
NOTE: Some revision 1.4 LaunchPad kits need a firmware update to support the MSP430G2452
devices; see FAQ #1 in Section 6.
5. Connect the Capacitive Touch BoosterPack board to the LaunchPad with proper orientation by
ensuring that the Texas Instruments logo and the text on the BoosterPack are in the same direction as
the text and logo on the Launchpad.
6. Connect the LaunchPad with an USB cable to a PC or connect an external power supply (2.7 V to
3.6 V) to J6. The user experience demo application lights the center LED when power is supplied to
the board.
NOTE: The 32-kHz crystal/oscillator on pins 18 and 19 is not required for the user experience
application to run.
2.2
Software Preparation
The steps described in the following sections are not required for a LaunchPad Capacitive Touch
BoosterPack stand-alone demo. For all other purposes that require PC software interaction, proper
installation of the hardware driver and the software is required. To develop applications, its also necessary
to install one of the IDEs shown on the Tools and Software section of the MSP430 landing page
www.ti.com/msp430. More information on how to start developing applications for the LaunchPad and how
to install the drivers and IDEs that it requires can be found on the LaunchPad wiki page
http://processors.wiki.ti.com/index.php/MSP430_LaunchPad_(MSP-EXP430G2).
All LaunchPad Capacitive Touch BoosterPack User Experience firmware and software described in the
following sections are provided in both binary/executable and source code forms, along with drivers
and supporting documentation. [10] A zip file containing these items can be downloaded from
www.ti.com/lit/zip/slac490.
The same software package link and updates can also be found on the LaunchPad wiki page
http://processors.wiki.ti.com/index.php/MSP430_LaunchPad_(MSP-EXP430G2). When this package is
installed, all user experience application demos are stored in the Software folder in the selected
installation directory, and the source code for the projects can be found in the Source folder.
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2.2.1
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LaunchPad USB Driver
For the PC to communicate with the LaunchPad hardware, the LaunchPad USB driver must be installed. If
this is the first time the LaunchPad is connected to the PC, install the USB serial COM port driver located
at [INSTALL_PATH]\LaunchPad_Driver\LaunchPad_Driver.exe.
NOTE: The LaunchPad USB drivers are integrated into the IDE installer packages from Code
Composer Studio (version 4+) or IAR Embedded Workbench (version 5.20+) and do not
require a second installation if an IDE has already been installed.
2.2.2
Locate Software Programs
Two software programs are provided to work with the LaunchPad Capacitive Touch BoosterPack user
experience demo. They are both installed to the [INSTALL_PATH]\Software folder. All software and
firmware examples are also available as source code in the capacitive touch software package.
2.3
Capacitive Touch User Experience
The Capacitive Touch User Experience consists of three projects:
• The firmware application that can operate in stand-alone mode (LaunchPad Capacitive Touch
BoosterPack Firmware Demo)
• A processing GUI that displays the information from the LaunchPad Capacitive Touch BoosterPack
visually (LaunchPad Capacitive Touch BoosterPack GUI Demo)
• A Visual Studio program that uses the LaunchPad Capacitive Touch BoosterPack input to control
media in Windows (MediaPad).
2.3.1
LaunchPad Capacitive Touch BoosterPack Firmware Demo
The application described in this section can be used as either a stand-alone demo (no PC required) or as
a demo with PC applications running. If PC application is desired, make sure to start the PC application
execution before proceeding with step 2.
1. Plug the LaunchPad with Capacitive Touch BoosterPack into a USB source (such as USB port on PC,
USB hub, or USB battery pack) via the mini-USB connector or to a battery pack via the power pin
connector J6. The User Experience application starts up and remains in sleep mode, with only the
center LED on.
2. Slowly wave your hand or finger approximately 3 to 5 cm above the BoosterPack to trigger the
proximity sensor and to wake the device. During the wake-up period, the LEDs surrounding the wheel
light in a wake-up sequence, starting with a slow clockwise rotation and ending with a fast counterclockwise rotation. As this sequence ends, the device enters active mode.
3. To perform a touch, firmly press any position on the wheel or the center button. Make sure to keep
your finger between the circles of the wheel.
• Upon releasing a touch on the center button, the center LED toggles.
• Touching a wheel position lights up the corresponding LEDs.
4. To perform a gesture, slide your finger along the wheel without releasing it from the wheel. The
corresponding LEDs trace and follow the touch and gesture.
5. After a short time of no capacitive touch activity, the board returns to sleep mode. Only the center LED
stays on.
6. Go back to step 2 to re-enable the application active mode.
8
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2.3.2
LaunchPad Capacitive Touch BoosterPack GUI Demo
This section describes how to run the application on both the LaunchPad Capacitive Touch BoosterPack
and the PC. It assumes that the hardware is connected to the PC via USB cable (see step 1 of
Section 2.3.1) and that the software has been installed (see Section 2.2).
The following steps correspond to the instructions in Section 2.3.1.
1. Start the CapTouch_BoosterPack_UserExperience_GUI.exe application located at
[INSTALL_PATH]\Software\CapTouch_BoosterPack_UserExperience_GUI\.
When the GUI starts, it checks for a valid LaunchPad USB serial COM port. If no compatible port
connection is available, the GUI prompts user to plug in the LaunchPad Capacitive Touch BoosterPack
(see Figure 2). The GUI continues normally if it detects that a LaunchPad is plugged into the PC.
Figure 2. PC GUI Looking for LaunchPad
2. At start-up or after long period of inactivity, the device enters sleep mode and the GUI is disabled
(grayed out) to indicate sleep mode (see Figure 3). Upon proximity sensor detection (for example,
wave your hand approximately 3 to 5 cm above the BoosterPack) the device returns to active mode
and enables the GUI.
Figure 3. PC GUI in Sleep Mode
3. The 'Center Button' press data toggles the center circle color, mimicking the behavior of the center
LED on the BoosterPack.
The 'Wheel Tap' is represented by lighting up a single slice on the wheel and displaying the field
number on the top left corner of the PC GUI.
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4. The gesture tracking (Start, Stop, and Update) is visualized on the wheel with the coloring of the wheel
slices (see Figure 4). Gesture can be tracked for several revolutions of the wheel, in both clockwise
and counter-clockwise directions (1).
Figure 4. PC GUI in Active Mode
5. After a short time when no capacitive touch activity is detected, the board returns to sleep mode and
the GUI is disabled.
2.3.3
MediaPad
This section describes instructions to run the MediaPad application on the LaunchPad Capacitive Touch
BoosterPack and the PC. It assumes that the hardware is connected to the PC via USB cable (see step 1
of Section 2.3.1) and that the software has been installed (see Section 2.2).
1. Start the MediaPad.exe application located at [INSTALL_PATH]\Software\MediaPad\
2. At startup, the application searches for a LaunchPad or an eZ430 emulator compatible USB serial
COM port.
If no compatible COM port is found, the application displays an error message and then exits.
If a LaunchPad COM port is found, the application displays a greeting message. When the user closes
the message, the application minimizes itself to the taskbar.
3. When the LaunchPad Capacitive Touch BoosterPack is in sleep mode, no data is transferred and no
activity occurs in the program. Use hand/finger wave motion to trigger the proximity sensor and wake
up the device.
4. The following touches or gestures can be used for media control in a Windows system (see Figure 5).
(a) Center button press: Start media player (Windows Media Player by default)
(b) Bottom arrow button press: Play/Pause
(c) Left arrow button press: Previous Track
(d) Right arrow button press: Next Track
(e) Scroll wheel clockwise: Volume Up
(f) Scroll wheel counter-clockwise: Volume Down
(1)
10
Using the wheel, a hidden mode can be unlocked. Input the correct sequence (similar to a rotational combination lock) to reveal a secret.
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Getting Started With 430BOOST-SENSE1 BoosterPack
Figure 5. MediaPad
NOTE: The Microsoft .NET runtime library is required to run the MediaPad software. While most
recent Windows PCs have the .Net runtime library installed, a new or reinstall of the library
might be necessary.
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Capacitive Touch BoosterPack Hardware
3
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Capacitive Touch BoosterPack Hardware
As shown in Figure 6 and Table 1, the Capacitive Touch BoosterPack is a typical capacitive touch
application example for the new MSP430G2xx2 capacitive-touch enabled I/O pins. The board shows three
different capacitive sensor types: a single button in the middle, a wheel made of four single capacitive
sensors, and a proximity sensor around the edge of the PCB. In addition, there are nine LEDs on the
board to give instant feedback to user interaction. The eight LEDs around the wheel are multiplexed to
increase their number without using too many of the microcontrollers I/O pins. By using a time-shared
signal, only five I/O pins are used to drive all eight LEDs.
Figure 6. Capacitive Touch BoosterPack Hardware
Table 1. BoosterPack Interface
12
Pin
MSP430 Port
BoosterPack Signal
1
VCC
NC
Description
2
P1.0
LED9
3
P1.1/TXD
NC
Backchannel UART transmit data output, not connected to
BoosterPack
4
P1.2/RXD
NC
Backchannel UART receive data input, not connected to BoosterPack
5
P1.3
LEDx
LED base to drive the eight multiplexed LEDs
6
P1.4
LED1
LED1 positive and LED5 negative drive
7
P1.5
LED2
LED2 positive and LED6 negative drive
8
P2.0
SENS0
Capacitive-touch proximity sensor
9
P2.1
SENS1
Capacitive-touch wheel sensor left
10
P2.2
SENS2
Capacitive-touch wheel sensor down
11
P2.3
SENS3
Capacitive-touch wheel sensor right
12
P2.4
SENS4
Capacitive-touch wheel sensor up
13
P2.5
SENS5
Capacitive-touch center button sensor
14
P1.6
LED3
LED3 positive and LED7 negative drive
15
P1.7
LED4
LED4 positive and LED8 negative drive
16
RST/SBWTDIO
NC
Reset line for SBW JTAG data, not connected to BoosterPack
17
TEST/SBWTCK
NC
Test line for SBW JTAG clock, not connected to BoosterPack
18
P2.6/XOUT
NC
Oscillator output, not connected to BoosterPack
19
P2.7/XIN
NC
Oscillator input, not connected to BoosterPack
20
GND
GND
Supply voltage, not connected to BoosterPack
The white center LED
Supply ground
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3.1
Driving the LEDs
The white center LED is connected to port P1.0 of the Value Line device and can be turned on by setting
this port as output. The other eight LEDs are multiplexed as shown in Figure 7. Four LEDs are connected
with the diode cathodes to the ports P1.4 to P1.7, and the other four LEDs are connected with the diode
anodes. All LEDs are connected to port P1.3 to either source or drain four LEDs at any one time. To drive
a particular set of these eight LEDs, two steps are required:
1. Port P1.3 acts as GND drain, so that the first nibble can drive LED1 to LED4 directly. The other LEDs
are not active during this time.
2. Port P1.3 acts as a VCC source to light LED5 to LED8. The pattern for the second nibble must be
inverted and set to port P1.4 to P1.7.
Figure 7. Schematic LED Multiplexing
Switching between modes can be controlled by a timer and has to be at least 100 times a second to
generate the illusion of a constant light pattern. To reduce glitches while switching the LED modes, it is
recommended to set the LED signals that are not being driven to input mode. Figure 8 shows the signals
of all the LED driving pins required to light up LED1, LED3, LED6, and LED7. The mode on P1.3 can be
set before or after the LED settings, as long as the unused LEDs are set to input mode.
NOTE: The current user experience implementation is not using a time-shared approach to drive the
LEDs, due to the shared CPU and timer resources utilized by the Capacitive Touch Software
Library [7] functions and the UART transmissions.
Figure 8. Driving LEDs
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Capacitive Touch Sensors
The six different capacitive touch sensor areas are connected to the Port 2 of the device. On the MSP430
Value Line devices with capacitive-touch enabled I/Os, Port 2 I/Os have no analog functionality. These
I/Os also have a smaller internal capacitance than Port 1, which make these them more sensitive than the
capacitive touch sensors on Port 1.
Figure 9 shows the connection of the capacitive touch sensor areas to the MSP430.
Figure 9. Capacitive Touch Sensor Areas
To enable the capacitive-touch feature of the I/Os, set the secondary port select PxSEL2 and clear the
PxSEL bit. The selected pins start oscillating immediately, and the frequency is a direct indication of the
capacitance connected to the port pin. The capacitive-touch I/Os oscillate within a frequency range of 1 to
2 MHz, which is strongly dependant on the supply voltage, the device package, and environmental
influences. For more information about the capacitive-touch feature of the Value Line devices, to download
code example, or to find application examples, go to the Capacitive Touch BoosterPack wiki page
(http://processors.wiki.ti.com/index.php/MSP430_LaunchPad_(MSP-EXP430G2)) or get the MSP430
Capacitive Touch Software Library (http://focus.ti.com/docs/toolsw/folders/print/capsenselibrary.html),
which is used in the application demo included in this kit.
NOTE: The Capacitive Touch BoosterPack hardware can also be used with other MSP430 devices.
Resistors R10 to R15 must be populated with a resistor to realize a RC discharge that can
be measured with a timer.
14
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4
LaunchPad Capacitive Touch BoosterPack User Experience Firmware
LaunchPad Capacitive Touch BoosterPack User Experience Firmware
This section describes the firmware application that is provided with the project. Detailed information on
the project construction, use of the Capacitive Touch Software Library, and how to set up and import the
projects is included. Source code for the MSP430G2452 firmware application is installed to the
[INSTALL_PATH]\Source\ folder as described in Section 2.2.
The User Experience application operates on the LaunchPad platform using the MSP430G2452 device
and the Capacitive Touch BoosterPack plugin board. The capacitive touch and proximity sensing are
enabled by the pin oscillator feature, which is new to the MSP430G2xx2 family devices. The User
Experience application also uses the Capacitive Touch Software Library [7] to realize and measure the
capacitive touch and proximity sensors. The Capacitive Touch Software Library provides layers of
abstraction to generate higher logical outputs such as logical touches and their position (in this hardware,
a four-button wheel).
The User Experience application starts in sleep mode, sampling the proximity sensor approximately every
8.3 ms (VLO / 100 = 12 kHz / 100 = 120 Hz). Upon registering a valid proximity event (for example, a
hand, finger, or object hovering approximately 3 to 5 cm from the BoosterPack), the application enters the
active mode. During the wake-up period, the LEDs surrounding the wheel light in a wake-up sequence,
starting with a slow clockwise sequence and ending with a fast counter-clockwise sequence. As this
sequence ends, the device enters active mode.
In active mode, the application samples and registers individual finger touches on the 16-position wheel or
the center button. It also recognizes simple gestures (clockwise and counter-clockwise) when the finger
moves along and remains on the wheel. Upon wheel position detection, the corresponding LEDs
surrounding the wheel light up accordingly. Each individual tap on the center capacitive touch button
toggles the center LED.
After a short time without any touch activity (on the wheel or on the center button), the application returns
to sleep mode, enabling only the proximity sensor periodically.
A 9600-baud UART link is also implemented using software Timer_A to provide application and capacitive
sensing data to the PC via the UART-USB back channel. The application sends UART data on events
such as wake up, sleep, touch, or gesture.
For more detailed information on the firmware project, see the source code and the associated
ReadMe.txt.
4.1
Import Project in CCS
To
1.
2.
3.
4.
5.
6.
import the project into CCS:
Open CCS.
Select a new project workspace outside of the project folder (1).
Select Project-->Import Existing Project.
Browse to the [PROJECT_ROOT]\CCS folder.
Make sure that "Copy projects into workspace" is not checked.
Click Finish
NOTE: For CCS, while project root is in the outer directory, the CCS project files are located inside
CCS. To enable the portability of the project, the file macros.ini is created to define the root.
Additionally, all project code files (.c, .h) are added as linked resources with their relative
path to the project root.
4.2
Open Project and Workspace in IAR Embedded Workbench
To open the project in IAR Embedded Workbench:
1. Browse to the [PROJECT_ROOT]\IAR folder.
2. Open the Sense_BoosterPack_UserExperience.eww workspace.
(1)
The workspace should be in an independent folder, not containing or contained by the project/package folder.
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Capacitive Touch Software Library
The Capacitive Touch Software Library (CAPSENSELIBRARY) is a configurable tool to abstract the
various peripheral settings from the application and perform several capacitive touch functions through
API calls. The following describes the configuration of the library to support the Capacitive Touch
BoosterPack, the methodology to calibrate the different elements, and how the API calls are used in the
application to create the user experience.
1. Configuration
The first step in the configuration process is identifying the methodology used to measure the
capacitance. For the Capacitive Touch BoosterPack, the goal is to highlight the new PinOsc feature;
therefore, an RO implementation is chosen, and the relaxation oscillator is implemented with the
PinOsc. The RO implementation requires two timers (hardware or software timers): an interval timer
(gate) and a frequency counter. The frequency counter is implemented with the Timer_A0 peripheral,
and the interval timer is implemented with the WDT+.
The Capacitive Touch BoosterPack is represented in the various structures defined in the file
structure.c. The element structures define the GPIO and the performance characteristics of each
element. The GPIOs are defined first, the appropriate sensor characteristics are defined, and the
performance characteristics are measured and added.
The sensor structure groups elements as appropriate and identifies the measurement characteristic for
that group, namely the interval period. For the RO method, increasing the interval time increases the
sensitivity; however, this is at the cost of response time, which is critical for supporting the PC GUI in
this application.
The proximity sensor uses an SMCLK of 125 kHz. For the button and wheel, the frequency is
increased to 1 MHz. The interval count is 8192: 8.192-ms gate time for the button and wheel elements
and 65.5-ms gate time for the proximity element. The wheel is a special kind of sensor in which each
element contributes to the sensor performance. The wheel is made up of four elements divided into 64
points or sections and requires that the cumulative response exceed 75 percent. This percentage is
based upon the normalized response where meeting the threshold would represent 0% and the
maximum response would represent 100%. This is to account for cases when the interaction is near
the edges of the wheel instead of the middle.
2. Calibration
The calibration of the middle button and the proximity sensor are relatively straight forward, because
the desired output is a binary indication of whether or not the threshold is exceeded. Using a controlled
test fixture to represent the minimum touch (distance in the case of the proximity sensor), the values
are recorded and input as the threshold value in the element structure.
The calibration for the wheel is more complicated, as several measurements are required at various
positions. See the "Sensor Arrays: Wheels and Sliders" section in the Capacitive Touch Software
Library User's Guide (SLAA490) for a detailed explanation.
The calibration values for each element are recorded in the element structure in the file structure.c.
16
430BOOST-SENSE1 - Capacitive Touch BoosterPack for the LaunchPad
Copyright © 2011–2013, Texas Instruments Incorporated
SLAU337B – April 2011 – Revised May 2013
Submit Documentation Feedback
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LaunchPad Capacitive Touch BoosterPack User Experience Firmware
3. API Calls
There are five API functions that are called several times in the application.
• The TI_CAPT_Init_Baseline and TI_CAPT_Update_Baseline functions initialize and update,
respectively, the baseline tracking performed by the library. Typically, these functions are called at
the beginning of an application or after long periods of inactivity. In this application, the initialization
and updates are performed after a power-up sequence and before a transition from the sleep
(polling proximity sensor only) to active (polling button and wheel only). These functions are used at
the transitions, because it is unknown how old the previous measurements are and if these still
represent the current environment.
• The TI_CAPT_Custom function measures the proximity sensor. The variable dCnt is updated with
the measured value. In this application, this variable is compared to a threshold value. Because this
is a simple On/Off function, the TI_CAPT_Button function could have been used but, for
demonstration purposes, the TI_CAPT_Custom function was chosen. When a threshold crossing is
detected, an LED sequence is started, and the application transitions to the active state (polling the
wheel and middle button). One possible enhancement of the proximity sensor application is to
enable several different thresholds and indicate how close the user is with the LEDs on the
BoosterPack.
• The TI_CAPT_Button function determines if the middle button has been detected. This function
returns either a 1 to indicate a threshold crossing (touch) or a 0 to indicate that no touch was
detected. The middle LED is illuminated to indicate a touch.
• The TI_CAPT_Wheel function indicates the position on the wheel if it was touched or returns a
defined value if no touch was detected. This information is used by the application for gesture
recognition (which is sent to the PC) and for illuminating the eight LEDs around the board.
For more information on the library, see the Capacitive Touch Software Library User's Guide (SLAA490).
SLAU337B – April 2011 – Revised May 2013
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430BOOST-SENSE1 - Capacitive Touch BoosterPack for the LaunchPad
Copyright © 2011–2013, Texas Instruments Incorporated
17
LaunchPad Capacitive Touch BoosterPack User Experience Software
www.ti.com
5
LaunchPad Capacitive Touch BoosterPack User Experience Software
5.1
LaunchPad Capacitive Touch BoosterPack User Experience GUI
Written in Processing, this Windows PC GUI application communicates with the LaunchPad to receive
specific capacitive touch data from the LaunchPad Capacitive Touch BoosterPack and provides the
visualization of that data in the GUI. Processing is a platform-independent open-source programming
language and environment, specializing in visual arts, graphics, and interactive applications.
The GUI uses a small .NET utility (FindAppUART.exe) to automatically detect a proper
LaunchPad/430Emulator device connected to the PC USB port. Upon correct USB COM port discovery,
the application initiates a 9600-baud UART connection and starts receiving data.
The GUI processes event and capacitive touch data and visualizes the data on the GUI in a 16-slice
wheel formation. Individual touches as well as gestures can be tracked in real time.
Further description of the behavior can be found in Section 2.3.2 and the ReadMe.txt in the project source
code directory.
The application also takes advantage of the serial library for USB COM serial communication, and the
sound library pitaru.sonia_v2_9 (available at http://sonia.pitaru.com/download.htm) for audio effects.
5.1.1
Requirements
The following utilities and libraries are required when modifying the User Experience source code.
• Processing (www.processing.org)
• Serial library (included with Processing installation)
• pitaru.sonia_v2_9 sound library (sonia.pitaru.com/download.htm)
• FindAppUART.exe (included .NET utility)
5.2
MediaPad
The program MediaPad, written using Visual Studio, translates capacitive touch data from from the
LaunchPad Capacitive Touch BoosterPack into Microsoft Windows virtual keystrokes for Windows media
control. The application implements auto-detection code that automatically finds a LaunchPad-compatible
USB COM port before establishing the proper connection. Further behavior of the application is described
in Section 2.3.2 and the ReadMe.txt in the project source code directory.
5.2.1
Requirements
When modifying the MediaPad source code, Microsoft Visual C++ 2010 Redistributable Package (included
in any version of Visual Studio 2010) (available at http://www.microsoft.com/downloads) is required.
18
430BOOST-SENSE1 - Capacitive Touch BoosterPack for the LaunchPad
Copyright © 2011–2013, Texas Instruments Incorporated
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LaunchPad Capacitive Touch BoosterPack User Experience Software
www.ti.com
5.3
UART Communication Protocol
For each event (wake up, go to sleep, touch/press, or gesture), a UART packet of two bytes is sent via the
application UART backchannel of the LaunchPad. The packets are specified as follows:
• WAKE UP [due to proximity sensor detection]: 0xBE 0xEF
• SLEEP [after period of inactivity]: 0xDE 0xAD
• CENTER BUTTON PRESS: 0x80 0x80
• WHEEL POSITION TOUCH/PRESS: 0x3z 0x3z
z = touch position 0x0 to 0xF, one nibble
• GESTURE START: 0xFC 0x2z
z = touch position 0x0 to 0xF, one nibble
• GESTURE STOP: 0xFB 0xFB
• GESTURE and GESTURE END POSITION : 0xGG 0x2
GG = a binary number
MSB is direction: 0 = clockwise, 1 = counter-clockwise
7 LSBs = count of gesture movement
z = ending position of the immediate gesture, 0x0 to 0xF, one nibble.
The PC application can receive and decipher the UART information to translate it into appropriate actions.
SLAU337B – April 2011 – Revised May 2013
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430BOOST-SENSE1 - Capacitive Touch BoosterPack for the LaunchPad
Copyright © 2011–2013, Texas Instruments Incorporated
19
Frequently Asked Questions (FAQ), Tips, and Tricks
6
www.ti.com
Frequently Asked Questions (FAQ), Tips, and Tricks
1. The LaunchPad is unable to program the MSP430G2452.
Some of the revision 1.4 LaunchPad kits must have a firmware update to support the MSP430G2452
devices. Update the LaunchPad firmware with the application provided at
processors.wiki.ti.com/index.php/MSP430_LaunchPad_Firmware_Update.
2. The capacitive-touch I/Os are not working when the LaunchPad is picked up.
Place the board flat on a table or other stable horizontal surface before using the Capacitive Touch
BoosterPack. Do not hold the board while it is in use; the contacts on the back of the Capacitive Touch
BoosterPack may be touched, which prevents the capacitive-touch I/Os from detecting user interaction.
3. My application is not able to light up all the LEDs.
The LEDs around the wheel are multiplexed; therefore, they cannot all be turned on simultaneously. Its
required to use a time-shared approach to light up all LEDs at once (see Section 3.1).
4. The button or the wheel is sometimes fails to detect the first touch.
Make sure to wave your hand 3 to 5 cm above the board to wake the device before actually touch the
wheel or button. The capacitive sensors are activated immediately after the wake-up sequence is
finished.
5. Windows Media Player is not starting.
Loading Windows Media Player might take some time, depending on the system. On some systems,
another media player program is associated with the Windows media keys.
7
References
The primary sources of MSP430 information are the device-specific data sheets and user's guides. The
most up-to-date versions of the documents can be found at the Texas Instruments MSP430 web page. [1]
All MSP430 LaunchPad and BoosterPack information can be found at the MSP430 LaunchPad wiki. [2]
The MSP430 LaunchPad and Value Line devices are supported in the latest versions of Code Composer
Studio [3] and IAR Embedded Workbench [4]. In-depth details on the supported IDEs (CCS and IAR) can
be found in the documentation folders of the IDE installation. IAR tool documentation (Workbench/C-SPY,
the assembler, the C compiler, the linker, and the library) is in the common\doc and 430\doc folders. CCS
documents is in the msp430\doc folder under the CCS installation path.
The FET user's guides [5] [6] also include detailed information on how to set up a project for the MSP430
using CCS or IAR Embedded Workbench. These user's guide are also included in the latest IDE releases.
1. http://www.ti.com/msp430
2. http://processors.wiki.ti.com/index.php/MSP430_LaunchPad_(MSP-EXP430G2)
3. http://processors.wiki.ti.com/index.php/Download_CCS
4. http://focus.ti.com/docs/toolsw/folders/print/iar-kickstart.html
5. Code Composer Studio v4.2 for MSP430(tm) User’s Guide (SLAU157)
6. IAR Embedded Workbench Version 3+ for MSP430(tm) User's Guide (SLAU138)
7. Capacitive Touch Software Library (CAPSENSELIBRARY) (http://www.ti.com/tool/capsenselibrary)
8. Capacitive Touch Software Library User's Guide (SLAA490)
9. Capacitive Touch Software Library Quick Start Guide (SLAA491)
10. Capacitive Touch BoosterPack Software and Design Documentation (SLAC490)
20
430BOOST-SENSE1 - Capacitive Touch BoosterPack for the LaunchPad
Copyright © 2011–2013, Texas Instruments Incorporated
SLAU337B – April 2011 – Revised May 2013
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Schematics and PCB Layout
www.ti.com
8
Schematics and PCB Layout
8.1
Schematics
Figure 10. Capacitive Touch BoosterPack Schematic
SLAU337B – April 2011 – Revised May 2013
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430BOOST-SENSE1 - Capacitive Touch BoosterPack for the LaunchPad
Copyright © 2011–2013, Texas Instruments Incorporated
21
Schematics and PCB Layout
8.2
www.ti.com
PCB Layout
Figure 11. Capacitive Touch BoosterPack Layout, Top Layer
Figure 12. Capacitive Touch BoosterPack Layout, Bottom Layer and Silkscreen
8.3
Bill of Materials (BOM)
Table 2. Bill of Materials
22
Pos.
Ref Name
Number per
Board
1
R1 to R8
8
390-Ω SMD0603 resistor
2
R9
1
180-Ω SMD0603 resistor
3
LED1 to LED8
8
Top LED red wtr clr 631NM 1206
4
LED9
1
LED white round diffused 1206
5
J1, J2
2
Female header SSM-110-L-SV 2.54 mm
6
R10 to R15
0
SMD0603 resistor (not populated)
Description
430BOOST-SENSE1 - Capacitive Touch BoosterPack for the LaunchPad
Copyright © 2011–2013, Texas Instruments Incorporated
SLAU337B – April 2011 – Revised May 2013
Submit Documentation Feedback
Revision History
www.ti.com
Revision History
Changes from A Revision (September 2011) to B Revision .......................................................................................... Page
•
Removed all variations of "TouchSense" (a trademark of Immersion Corporation) throughout document
...................
5
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
SLAU337B – April 2011 – Revised May 2013
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Revision History
Copyright © 2011–2013, Texas Instruments Incorporated
23
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3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
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3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
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Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
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can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
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3.2.1
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Concerning EVMs Including Radio Transmitters:
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Concerning EVMs Including Detachable Antennas:
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Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
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3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
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by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
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Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
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1.
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HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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