Tiva C Series TM4C123G LaunchPad Evaluation Kit User`s Manual

Tiva C Series TM4C123G LaunchPad Evaluation Kit User`s Manual
Tiva™ C Series TM4C123G LaunchPad
Evaluation Board
User's Guide
Literature Number: SPMU296
April 2013
Contents
1
Board Overview
1.1
1.2
1.3
1.4
1.5
.................................................................................................................. 4
Kit Contents ..................................................................................................................
Using the Tiva C Series LaunchPad .....................................................................................
Features ......................................................................................................................
BoosterPacks ................................................................................................................
Specifications ................................................................................................................
5
5
5
6
6
A
.......................................................................................................... 7
2.1
Functional Description ...................................................................................................... 7
2.1.1 Microcontroller ...................................................................................................... 7
2.1.2 USB Connectivity .................................................................................................. 8
2.1.3 Motion Control ...................................................................................................... 8
2.1.4 User Switches and RGB User LED .............................................................................. 9
2.1.5 Headers and BoosterPacks ....................................................................................... 9
2.2
Power Management ....................................................................................................... 11
2.2.1 Power Supplies ................................................................................................... 11
2.2.2 Hibernate .......................................................................................................... 11
2.2.3 Clocking ............................................................................................................ 12
2.2.4 Reset ............................................................................................................... 12
2.3
In-Circuit Debug Interface (ICDI) ........................................................................................ 12
2.3.1 Virtual COM Port ................................................................................................. 12
Software Development ....................................................................................................... 13
3.1
Software Description ...................................................................................................... 13
3.2
Source Code ............................................................................................................... 13
3.3
Tool Options ................................................................................................................ 13
3.4
Programming the Tiva C Series LaunchPad Evaluation Board ..................................................... 14
References, PCB Layout, and Bill of Materials ...................................................................... 15
4.1
References ................................................................................................................. 15
4.2
Component Locations ..................................................................................................... 16
4.3
Bill of Materials (BOM) .................................................................................................... 17
Schematics ....................................................................................................................... 19
2
Contents
2
3
4
Hardware Description
SPMU296 April
List of Figures
1-1.
Tiva C Series TM4C123G LaunchPad Evaluation Board.............................................................. 4
2-1.
Tiva C Series LaunchPad Evaluation Board Block Diagram .......................................................... 7
4-1.
Tiva C Series LaunchPad Component Locations (Top View) ....................................................... 16
4-2.
Tiva C Series LaunchPad Dimensions ................................................................................. 17
List of Tables
1-1.
EK-TM4C123GXL Specifications ......................................................................................... 6
2-1.
USB Device Signals ........................................................................................................ 8
2-2.
2-3.
2-4.
2-5.
2-6.
2-7.
2-8.
4-1.
...................................................................................
................................................................................................................
J2 Connector ...............................................................................................................
J3 Connector ...............................................................................................................
J4 Connector ...............................................................................................................
In-Circuit Debug Interface (ICDI) Signals ..............................................................................
Virtual COM Port Signals .................................................................................................
EK-TM4C123GXL Bill of Materials .....................................................................................
User Switches and RGB LED Signals
9
J1 Connector
9
SPMU296 – April 2013
List of Figures
10
10
11
12
12
17
3
Chapter 1
SPMU296 – April 2013
Board Overview
The Tiva™ C Series TM4C123G LaunchPad Evaluation Board (EK-TM4C123GXL) is a low-cost
evaluation platform for ARM® Cortex™-M4F-based microcontrollers. The Tiva C Series LaunchPad design
highlights the TM4C123GH6PMI microcontroller USB 2.0 device interface, hibernation module, and motion
control pulse-width modulator (MC PWM) module. The Tiva C Series LaunchPad also features
programmable user buttons and an RGB LED for custom applications. The stackable headers of the Tiva
C Series TM4C123G LaunchPad BoosterPack XL interface demonstrate how easy it is to expand the
functionality of the Tiva C Series LaunchPad when interfacing to other peripherals on many existing
BoosterPack add-on boards as well as future products. Figure 1-1 shows a photo of the Tiva C Series
LaunchPad.
Figure 1-1. Tiva C Series TM4C123G LaunchPad Evaluation Board
Power Select
Switch
USB Connector
(Power/ICDI) Green Power LED
Tiva
TM4C123GH6PMI
Microcontroller
USB Micro-A/-B
Connector
(Device)
Reset Switch
RGB User LED
Tiva C Series
LaunchPad
BoosterPack XL
Interface (J1, J2, J3,
and J4 Connectors)
Tiva C Series
LaunchPad
BoosterPack XL
Interface (J1, J2, J3,
and J4 Connectors)
Tiva
TM4C123GH6PMI
Microcontroller
MSP430
LaunchPad-Compatible
BoosterPack Interface
MSP430
LaunchPad-Compatible
BoosterPack Interface
User Switch 1
4
Board Overview
User Switch 2
SPMU296 – April 2013
Kit Contents
1.1
Kit Contents
The Tiva C Series TM4C123G LaunchPad Evaluation Kit contains the following items:
• Tiva C Series LaunchPad Evaluation Board (EK-TM4C123GXL)
• On-board In-Circuit Debug Interface (ICDI)
• USB micro-B plug to USB-A plug cable
• README First document
1.2
Using the Tiva C Series LaunchPad
The recommended steps for using the Tiva C Series TM4C123G LaunchPad Evaluation Kit are:
1. Follow the README First document included in the kit. The README First document will help you
get the Tiva C Series LaunchPad up and running in minutes. See the Tiva C Series LaunchPad web
page for additional information to help you get started.
2. Experiment with LaunchPad BoosterPacks. A selection of Tiva C Series BoosterPacks and
compatible MSP430™ BoosterPacks can be found at the TI MCU LaunchPad web page.
3. Take your first step toward developing an application with Project 0 using your preferred ARM
tool-chain and the Tiva C Series TivaWare Peripheral Driver Library. Software applications are
loaded using the on-board In-Circuit Debug Interface (ICDI). See Chapter 3, Software Development,
for the programming procedure. The TivaWare for C Series Peripheral Driver Library Software
Reference Manual contains specific information on software structure and function. For more
information on Project 0, go to the Tiva C Series LaunchPad wiki page.
4. Customize and integrate the hardware to suit an end application. This user's manual is an
important reference for understanding circuit operation and completing hardware modification.
You can also view and download almost six hours of training material on configuring and using the
LaunchPad. Visit the Tiva C Series LaunchPad Workshop for more information and tutorials.
1.3
Features
Your Tiva C Series LaunchPad includes the following features:
• Tiva TM4C123GH6PMI microcontroller
• Motion control PWM
• USB micro-A and micro-B connector for USB device, host, and on-the-go (OTG) connectivity
• RGB user LED
• Two user switches (application/wake)
• Available I/O brought out to headers on a 0.1-in (2.54-mm) grid
• On-board ICDI
• Switch-selectable power sources:
– ICDI
– USB device
• Reset switch
• Preloaded RGB quickstart application
• Supported by TivaWare for C Series software including the USB library and the peripheral driver library
• Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface, which features stackable headers to
expand the capabilities of the Tiva C Series LaunchPad development platform
– For a complete list of available BoosterPacks that can be used with the Tiva C Series LaunchPad,
see the LaunchPad web page.
SPMU296 – April 2013
Board Overview
5
BoosterPacks
1.4
BoosterPacks
The Tiva C Series LaunchPad provides an easy and inexpensive way to develop applications with the
TM4C123GH6PM microcontroller. Tiva C Series BoosterPacks and MSP430 BoosterPacks expand the
available peripherals and potential applications of the Tiva C Series LaunchPad. BoosterPacks can be
used with the Tiva C Series LaunchPad or you can simply use the on-board TM4C123GH6PM
microcontroller as its processor. See Chapter 2 for more information.
1.5
Specifications
Table 1-1 summarizes the specifications for the Tiva C Series LaunchPad.
Table 1-1. EK-TM4C123GXL Specifications
Parameter
Board supply voltage
Dimensions
Break-out power output
RoHS status
6
Board Overview
Value
4.75 VDC to 5.25 VDC from one of the following sources:
• Debugger (ICDI) USB Micro-B cable (connected to a
PC)
• USB Device Micro-B cable (connected to a PC)
2.0 in x 2.25 in x 0.425 in (5.0 cm x 5.715 cm x 10.795
mm) (L x W x H)
• 3.3 VDC (300 mA max)
• 5.0 VDC (depends on 3.3 VDC usage, 23 mA to 323
mA)
Compliant
SPMU296 – April 2013
Chapter 2
SPMU296 – April 2013
Hardware Description
The Tiva C Series LaunchPad includes a TM4C123GH6PM microcontroller and an integrated ICDI as well
as a range of useful peripheral features (as the block diagram in Figure 2-1 shows). This chapter
describes how these peripherals operate and interface to the microcontroller.
Figure 2-1. Tiva C Series LaunchPad Evaluation Board Block Diagram
Debug Breakout Pads
UART0
I/O
TM
GPIO
Tiva C Series
LaunchPad-Specific
BoosterPackXL
Expansion Headers
JTAG/SWD
ICDI
GPIO
USB
Device
ICDI
USB Device
Connector
I/O
MSP430TM
LaunchPad-Compatible
Expansion Headers
TM4C123GH6PMI
USB Debug
Connector
GPIO
Power Select
Switch
RGB LED
VDD
HIB WAKE
GPIO
User
Switches
Power
Management
Breakout Pads
2.1
Functional Description
2.1.1 Microcontroller
The TM4C123GH6PM is a 32-bit ARM Cortex-M4-based microcontroller with 256-kB Flash memory, 32kB SRAM, and 80-MHz operation; USB host, device, and OTG connectivity; a Hibernation module and
PWM; and a wide range of other peripherals. See the TM4C123GH6PM microcontroller data sheet
(literature number SPMS376) for complete device details.
SPMU296 – April 2013
Hardware Description
7
Functional Description
Most of the microcontroller signals are routed to 0.1-in (2.54-mm) pitch headers. An internal multiplexer
allows different peripheral functions to be assigned to each of these GPIO pads. When adding external
circuitry, consider the additional load on the evaluation board power rails.
The TM4C123GH6PM microcontroller is factory-programmed with a quickstart demo program. The
quickstart program resides in on-chip Flash memory and runs each time power is applied, unless the
quickstart application has been replaced with a user program.
2.1.2 USB Connectivity
The EK-TM4C123GXL is designed and functions as a USB device without hardware modification. The
USB device signals are dedicated to USB functionality and are not shared with the BoosterPack headers.
The USB device signals are listed in Table 2-1.
Table 2-1. USB Device Signals
GPIO Pin
Pin Function
USB Device
PD4
USB0DM
D–
PD5
USB0DP
D+
The TM4C123GH6PM target device is also capable of USB embedded host and on-the-go (OTG)
functions. OTG functionality can be enabled by populating R25 and R29 with 0-Ω resistors. These
resistors connect the USB ID and USB VBUS signals to PB0 and PB1. When these resistors are populated,
PB0 and PB1 must remain in the respective USB pin mode configurations to prevent device damage. PB0
and PB1 are also present on the J1 BoosterPack header. Therefore, if R25 or R29 are populated, care
must be taken not to conflict these signals with BoosterPack signals.
USB embedded host operation can be enabled in the same way for USB devices that are self-powered.
Providing power when acting as a USB host requires a BoosterPack with power switching and appropriate
connectors. All USB host signals are available on the BoosterPack interface except D+ and D–, which are
only available on the USB micro-A/-B connector and the two adjacent test points.
When connected as a USB device, the evaluation board can be powered from either the ICDI or the USB
Device connectors. The user can select the power source by moving the POWER SELECT switch (SW3)
to the Device position. See the Power Management schematic (appended to this document).
2.1.3 Motion Control
The EK-TM4C123GXL includes the Tiva C-Series Motion Control PWM technology, featuring two PWM
modules capable of generating 16 PWM outputs. Each PWM module provides a great deal of flexibility
and can generate simple PWM signals—for example, those required by a simple charge pump—as well
as paired PWM signals with dead-band delays, such as those required by a half-H bridge driver. Three
generator blocks can also generate the full six channels of gate controls required by a 3-phase inverter
bridge.
Two quadrature encoder interfaces (QEI) are also available to provide motion control feedback. See the
Headers and BoosterPacks section of this document for details about the availability of these signals on
the BoosterPack interface.
8
Hardware Description
SPMU296 – April 2013
Functional Description
2.1.4 User Switches and RGB User LED
The Tiva C Series LaunchPad comes with an RGB LED. This LED is used in the preloaded RGB
quickstart application and can be configured for use in custom applications.
Two user buttons are included on the board. The user buttons are both used in the preloaded quickstart
application to adjust the light spectrum of the RGB LED as well as go into and out of hibernation. The user
buttons can be used for other purposes in the user’s custom application.
The evaluation board also has a green power LED. Table 2-2 shows how these features are connected to
the pins on the microcontroller.
Table 2-2. User Switches and RGB LED Signals
GPIO Pin
Pin Function
USB Device
SW1
PF4
GPIO
PF0
GPIO
SW2
PF1
GPIO
RGB LED (Red)
PF2
GPIO
RGB LED (Blue)
PF3
GPIO
RGD LED (Green)
2.1.5 Headers and BoosterPacks
The two double rows of stackable headers are mapped to most of the GPIO pins of the TM4C123GH6PM
microcontroller. These rows are labeled as connectors J1, J2, J3, and J4. Connectors J3 and J4 are
located 0.1 in (2.54 mm) inside of the J1 and J2 connectors. All 40 header pins of the J1, J2, J3, and J4
connectors make up the Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface. Table 2-3
through Table 2-6 show how these header pins are connected to the microcontroller pins and which GPIO
functions can be selected.
NOTE: To configure the device peripherals easily and intuitively using a graphical user interface
Table 2-3. J1 Connector (1)
Analog
Function
J4 Pin
GPIO
GPIO
AMSEL
Onboard
Function
Tiva C
Series
MCU
Pin
1
2
3
GPIOPCTL Register Setting
1.01
(1)
4
5
6
7
8
9
14
15
3.3 V
1.02
PB5
AIN11
–
57
–
SSI2Fss
–
M0PWM3
–
–
T1CCP1
CAN0Tx
–
–
–
1.03
PB0
USB0ID
–
45
U1Rx
–
–
–
–
–
T2CCP0
–
–
–
–
1.04
PB1
USB0VBUS
–
46
U1Tx
–
–
–
–
–
T2CCP1
–
–
–
–
1.05
PE4
AIN9
–
59
U5Rx
–
I2C2SCL
M0PWM4
M1PWM2
–
–
CAN0Rx
–
–
–
1.06
PE5
AIN8
–
60
U5Tx
–
I2C2SDA
M0PWM5
M1PWM3
–
–
CAN0Tx
–
–
–
1.07
PB4
AIN10
–
58
–
SSI2Clk
–
M0PWM2
–
–
T1CCP0
CAN0Rx
–
–
–
1.08
PA5
–
–
22
–
SSI0Tx
–
–
–
–
–
–
–
–
–
1.09
PA6
–
–
23
–
–
I2C1SCL
–
M1PWM2
–
–
–
–
–
–
1.10
PA7
–
–
24
–
–
I2C1SDA
–
M1PWM3
–
–
–
–
–
–
Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
SPMU296 – April 2013
Hardware Description
9
Functional Description
Table 2-4. J2 Connector (1)
J4
Pin
Analog
Function
GPIO
GPIO
AMSEL
On-board
Function
Tiva C
Series
MCU
Pin
1
2
3
GPIOPCTL Register Setting
2.01
4
5
6
7
8
9
14
15
–
GND
2.02
PB2
–
–
47
–
–
I2C0SCL
–
–
–
T3CCP0
–
–
–
2.03
PE0
AIN3
–
9
U7Rx
–
–
–
–
–
–
–
–
–
–
2.04
PF0
–
USR_SW2/
WAKE (R1)
28
U1RTS
SSI1Rx
CAN0Rx
–
M1PWM4
PhA0
T0CCP0
NMI
C0o
–
–
PB7
–
–
4
–
SSI2Tx
–
M0PWM1
–
–
T0CCP1
–
–
–
–
PD1
AIN6
Connected
for MSP430
Compatibility
(R10)
62
SSI3Fss
SSI1Fss
I2C3SDA
M0PWM7
M1PWM1
–
WT2CCP1
–
–
–
–
2.05
2.06
2.07
RESET
PB6
–
–
1
–
SSI2Rx
–
M0PWM0
–
–
T0CCP0
–
–
–
–
PD0
AIN7
Connected
for MSP430
Compatibility
(R9)
61
SSI3Clk
SSI1Clk
I2C3SCL
M0PWM6
M1PWM0
–
WT2CCP0
–
–
–
–
2.08
PA4
–
–
21
–
SSI0Rx
–
–
–
–
–
–
–
–
–
2.09
PA3
–
–
20
–
SSI0Fss
–
–
–
–
–
–
–
–
–
2.10
PA2
–
–
19
–
SSI0Clk
–
–
–
–
–
–
–
–
–
9
14
15
(1)
Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
Table 2-5. J3 Connector (1)
Analog
Function
J4
Pin
GPIO
GPIO
AMSEL
On-board
Function
Tiva C
Series
MCU
Pin
GPIOPCTL Register Setting
1
2
3
3.01
3.02
5
M1PWM0
AIN7
–
61
SSI3Clk
SSI1Clk
I2C3SCL
M0PWM6
PB6
–
Connected
for MSP430
Compatibilit
y (R9)
1
–
SSI2Rx
–
M0PWM0
PD1
AIN6
–
92
SSI3Fss
SSI1Fss
I2C3SDA
M0PWM7
PB7
–
Connected
for MSP430
Compatibilit
y (R10)
4
–
SSI2Tx
–
M0PWM1
3.05
PD2
AIN5
63
SSI3Rx
SSI1Rx
–
3.04
6
7
8
GND
PD0
3.03
–
WT2CCP0
–
–
–
–
–
T0CCP0
–
–
–
–
M1PWM1
–
WT2CCP1
–
–
–
–
–
–
T0CCP1
–
–
–
–
M0FAULT0
–
–
WT3CCP0
USB0EPE
N
WT3CCP1
USB0PFLT
–
–
–
–
–
–
–
3.06
PD3
AIN4
–
64
SSI3Tx
SSI1Tx
–
–
–
–
3.07
PE1
AIN2
–
8
U7Tx
–
–
–
–
–
3.08
PE2
AIN1
–
7
–
–
–
–
–
–
–
–
–
–
–
3.09
PE3
AIN0
–
6
–
–
–
–
–
–
–
–
–
–
–
3.10
PF1
–
–
29
U1CTS
SSI1Tx
–
–
M1PWM5
–
T0CCP1
–
C1o
TRD1
–
(1)
10
4
5.0 V
Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
Hardware Description
SPMU296 – April 2013
Power Management
Table 2-6. J4 Connector
J4
Pin
Analog
Function
GPIO
GPIO
AMSEL
Onboard
Function
Tiva C
Series
MCU
Pin
1
2
3
4
5
6
7
8
9
14
15
GPIOPCTL Register Setting
4.01
PF2
–
Blue LED
(R11)
30
–
SSI1Clk
–
M0FAULT0
M1PWM6
–
T1CCP0
–
–
–
TRD0
4.02
PF3
–
Green
LED
(R12)
31
–
SSI1Fss
CAN0Tx
–
M1PWM7
–
T1CCP1
–
–
–
TRCLK
4.03
PB3
–
–
48
–
–
I2C0SDA
–
–
–
T3CCP1
–
–
–
–
4.04
PC4
C1–
–
16
U4Rx
U1Rx
–
M0PWM6
–
IDX1
WT0CCP0
U1RTS
–
–
–
4.05
PC5
C1+
–
15
U4Tx
U1Tx
–
M0PWM7
–
PhA1
WT0CCP1
U1CTS
–
–
–
4.06
PC6
C0+
–
14
U3Rx
–
–
–
–
PhB1
WT1CCP0
USB0EPE
N
–
–
–
4.07
PC7
C0–
–
13
U3Tx
–
–
–
–
–
WT1CCP1
USB0PFLT
–
–
–
4.08
PD6
–
–
53
U2Rx
–
–
–
–
PhA0
WT5CCP0
–
–
–
–
4.09
PD7
–
–
10
U2Tx
–
–
–
–
PhB0
WT5CCP1
NMI
–
–
–
4.10
PF4
–
USR_SW
1 (R13)
5
–
–
–
–
M1FAULT0
IDX0
T2CCP0
USB0EPE
N
–
–
–
Connectors J1 and J2 of the Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface provide
compatibility with MSP430 LaunchPad BoosterPacks. Highlighted functions (shaded cells) in Table 2-3
through Table 2-5 indicate configuration for compatibility with the MSP430 LaunchPad.
2.2
Power Management
2.2.1 Power Supplies
The Tiva C Series LaunchPad can be powered from one of two power sources:
• On-board ICDI USB cable (Debug, Default)
• USB device cable (Device)
The POWER SELECT switch (SW3) is used to select one of the two power sources. Select only one
source at a time.
2.2.2 Hibernate
The Tiva C Series LaunchPad provides an external 32.768-kHz crystal (Y1) as the clock source for the
TM4C123GH6PM Hibernation module clock source. The current draw while in Hibernate mode can be
measured by making some minor adjustments to the Tiva C Series LaunchPad. This procedure is
explained in more detail later in this section.
The conditions that can generate a wake signal to the Hibernate module on the Tiva C Series LaunchPad
are waking on a Real-time Clock (RTC) match and/or waking on assertion of the WAKE pin. (1) The second
user switch (SW2) is connected to the WAKE pin on the microcontroller. The WAKE pin, as well as the
VDD and HIB pins, are easily accessible through breakout pads on the Tiva C Series LaunchPad. See the
appended schematics for details.
spacer
spacer
spacer
spacer
(1)
If the board does not turn on when you connect it to a power source, the microcontroller might be in Hibernate mode (depending on the
programmed application). You must satisfy one of the programmed wake conditions and connect the power to bring the microcontroller
out of Hibernate mode and turn on the board.
SPMU296 – April 2013
Hardware Description
11
In-Circuit Debug Interface (ICDI)
There is no external battery source on the Tiva C Series LaunchPad Hibernation module, which means
the VDD3ON power control mechanism should be used. This mechanism uses internal switches to
remove power from the Cortex-M4 processor as well as to most analog and digital functions while
retaining I/O pin power.
To measure the Hibernation mode current or the Run mode current, the VDD jumper that connects the 3.3
V pin and the MCU_PWR pin must be removed. See the complete schematics (appended to this
document) for details on these pins and component locations. An ammeter should then be placed
between the 3.3 V pin and the MCU_PWR pin to measure IDD (or IHIB_VDD3ON). The TM4C123GH6PM
microcontroller uses VDD as its power source during VDD3ON Hibernation mode, so IDD is the Hibernation
mode (VDD3ON mode) current. This measurement can also be taken during Run mode, which measures
IDD the microcontroller running current.
2.2.3 Clocking
The Tiva C Series LaunchPad uses a 16.0-MHz crystal (Y2) to complete the TM4C123GH6PM
microcontroller main internal clock circuit. An internal PLL, configured in software, multiples this clock to
higher frequencies for core and peripheral timing.
The Hibernation module is clocked from an external 32.768-KHz crystal (Y1).
2.2.4 Reset
The RESET signal into the TM4C123GH6PM microcontroller connects to the RESET switch and to the
ICDI circuit for a debugger-controlled reset.
External reset is asserted (active low) under any of three conditions:
• Power-on reset (filtered by an R-C network)
• RESET switch held down
• By the ICDI circuit when instructed by the debugger (this capability is optional, and may not be
supported by all debuggers)
2.3
In-Circuit Debug Interface (ICDI)
The Tiva C Series LaunchPad evaluation board comes with an on-board In-Circuit Debug Interface (ICDI).
The ICDI allows for the programming and debug of the TM4C123GH6PM using the LM Flash Programmer
and/or any of the supported tool chains. Note that the ICDI supports only JTAG debugging. An external
debug interface can be connected for Serial Wire Debug (SWD) and SWO (trace).
Table 2-7 shows the pins used for JTAG and SWD. These signals are also mapped out to easily
accessible breakout pads and headers on the board.
Table 2-7. In-Circuit Debug Interface (ICDI) Signals
GPIO Pin
Pin Function
PC0
TCK/SWCLK
PC1
TMS/SWDIO
PC2
TDI
PC3
TDO/SWO
2.3.1 Virtual COM Port
When plugged in to a PC, the device enumerates as a debugger and a virtual COM port. Table 2-8 shows
the connections for the COM port to the pins on the microcontroller.
Table 2-8. Virtual COM Port Signals
12
Hardware Description
GPIO Pin
Pin Function
PA0
U0RX
PA1
U0TX
SPMU296 April 2013
Programming the Tiva C Series LaunchPad Evaluation Board
3.4
Programming the Tiva C Series LaunchPad Evaluation Board
The Tiva C Series LaunchPad software package includes pre-built binaries for each of the example
applications. If you have installed TivaWare to the default installation path of
C:\ti\TivaWare_C_Series_<version>, you can find the example applications in
C:\ti\TivaWare_C_Series_<version>\examples\boards\ek-tm4c123gxl . The on-board ICDI is used with the
LM Flash Programmer tool to program applications on the Tiva C Series LaunchPad.
Follow these steps to program example applications into the Tiva C Series LaunchPad evaluation board
using the ICDI:
1. Install LM Flash Programmer on a PC running Microsoft® Windows®.
2. Switch the POWER SELECT switch to the right for Debug mode.
3. Connect the USB-A cable plug to an available port on the PC and the Micro-B plug to the Debug USB
port on the board.
4. Verify that the POWER LED D4 on the board is lit.
5. Run the LM Flash Programmer.
6. In the Configuration tab, use the Quick Set control to select the EK-TM4C123GXL evaluation board.
7. Move to the Program tab and click the Browse button. Navigate to the example applications directory
(the default location is C:\ti\TivaWare_C_Series_<version>\examples\boards\ek-tm4c123gxl ).
8. Each example application has its own directory. Navigate to the example directory that you want to
load and then into the directory which contains the binary (*.bin) files. Select the binary file and click
Open.
9. Set the Erase Method to Erase Necessary Pages, check the Verify After Program box, and check
Reset MCU After Program.
Program execution starts once the Verify process is complete.
14
Software Development
SPMU296 April 2013
Component Locations
4.2
Component Locations
Plots of the top-side component locations are shown in Figure 4-1 and the board dimensions are shown in
Figure 4-2.
Figure 4-1. Tiva C Series LaunchPad Component Locations (Top View)
16
References, PCB Layout, and Bill of Materials
SPMU296 April 2013
Bill of Materials (BOM)
Figure 4-2. Tiva C Series LaunchPad Dimensions
NOTE: Units are in mils (one thousandth of an inch): 1 mil = 0.001 inch (0.0254 mm).
4.3
Bill of Materials (BOM)
Table 4-1 shows the bill of materials for the EK-TM4C123GXL evaluation board.
Table 4-1. EK-TM4C123GXL Bill of Materials
Item
Ref Des
Qty
Description
Manufacturer
Manufacturer Part No
1
C1-2, C7, C12, C14
5
Capacitor, 0402, X5R, 10 V, Low
ESR
Johanson Dielectrics
Inc
100R07X105KV4T
2
C25-26, C31-32
4
Capacitor, 10 pF, 50 V, 5%,
NPO/COG, 0402
Murata
GRM1555C1H100JZ01D
3
C28-29
2
Capacitor, 24 pF, 50 V, 5%,
NPO/COG, 0402
TDK
C1005C0G1H240J
4
C3, C5, C8, C15,
C18-19, C21
7
Capacitor, 0.01 μF 25 V, 10%
0402 X7R
Taiyo Yuden
TMK105B7103KV-F
5
C4, C6, C10-11, C17,
C20, C23-24
8
Capacitor, 0.1 μF 16 V, 10% 0402
X7R
Taiyo Yuden
EMK105B7104KV-F
6
C9, C22
2
Capacitor, 2.2 μF, 16 V, 10%,
0603, X5R
Murata
GRM188R61C225KE15D
7
D1
1
LED, Tri-Color RGB, 0404 SMD
Common Anode
Everlight
18-038/RSGHBHC1-S02/2T
8
D4
1
LED, Green 565 nm, Clear 0805
SMD
Lite-On
LTST-C171GKT
9
H24
1
Header, 1x2, 0.100, T-Hole,
Vertical Unshrouded, 0.220 Mate
3M
961102-6404-AR
FCI
68001-102HLF
10
H25
1
Jumper, 0.100, Gold, Black,
Closed
Sullins
SPC02SYAN
11
J1, J3
2
Header, 2x10, T-Hole Vertical
unshrouded stacking
Samtec
SSW-110-23-S-D
SPMU296 – April 2013
References, PCB Layout, and Bill of Materials
17
Bill of Materials (BOM)
Table 4-1. EK-TM4C123GXL Bill of Materials (continued)
Item
Ref Des
Qty
Description
12
J11
1
USB Connector, Micro B Recept
RA SMT BTTM MNT
13
J2, J4
2
Header, 1x2, 0.100, SMT,
Horizontal Unshrouded, 0.230
Mate
14
J9
15
16
17
Manufacturer
Hirose
Manufacturer Part No
ZX62-B-5PA
Samtec
TSM-110-01-S-DH-A-P-TR
4UCON
10995
Major League
Electronics
TSHSM-110-D-02-T-H-APTR-P-LF
Hirose
ZX62-AB-5PA
1
USB Connector, Micro A/B
Receptacle SMD
Q1-3
3
NPN SC70 pre-biased
Diodes Inc
DTC114EET1G
R1-2, R9-16, R20,
R26
12
Resistor, 0 Ω 1/10W 0603 SMD
Panasonic
ERJ-3GEY0R00V
R18-19, R21-23, R28
6
Resistor, 10 kΩ, 1/10W, 5%, 0402
Thick Film
Yageo
RC0402FR-0710KL
18
R3-5, R8, R27
5
Resistor, 330 Ω, 1/10W, 5%, 0402
Yageo
RC0402FR-07330RL
19
R31
1
Resistor, 1 MΩ 1/10W, 5%, 0402
Rohm
MCR01MRTF1004
20
RESET SW1, SW2
3
Switch, Tact 6 mm SMT, 160gf
Omron
21
SW3
1
Switch, DPDT, SMT 300 mA × 2 at C K Components
6V
JS202011SCQN
22
U1, U2
2
Tiva C Series MCU
TM4C123GH6PM
Texas Instruments
TM4C123GH6PMI
B3S-1000
23
U8
1
Regulator, 3.3 V, 400 mA, LDO
Texas Instruments
TPS73633DRBT
24
Y1
1
Crystal, 32.768 kHz Radial Can
Abracon
AB26TRB-32.768KHZ- T
25
Y2, Y5
2
Crystal, 16.00 MHz 5.0x3.2mm
SMT
NDK
NX5032GA-16.000000 MHz
Abracon
ABM3-16.000 MHz-B2- T
PCB Do Not Populate List
(Shown for information only)
18
26
C31, C34
2
Capacitor, 0.1 μF 16 V, 10% 0402
X7R
Taiyo Yuden
EMK105B7104KV-F
27
D2
1
Diode, Dual Schottky, SC70,
BAS70 Common Cathode
Diodes Inc
BAS70W-05-7-F
28
R17
1
Resistor, 10 kΩ 1/10W 5%, 0402
Thick Film
Yageo
RC0402FR-0710KL
29
R24
1
Resistor, 330 Ω, 1/10W, 5%, 0402
Yageo
RC0402FR-07330RL
30
R25, R29-30
3
Resistor, 0 Ω, 1/10W 0603
Panasonic
ERJ-3GEY0R00V
31
U4
1
IC, Single Voltage Supervisor, 5V,
DBV
Texas Instruments
TLV803MDBZR
References, PCB Layout, and Bill of Materials
SPMU296 – April 2013
PC4
PC5
PC6
PC7
52
51
50
49
16
15
14
13
PE0
PE1
PE2
PE3
PE4
PE5
9
8
7
6
59
60
DEBUG_PC0/TCK/SWCLK
DEBUG_PC1/TMS/SWDIO
DEBUG_PC2/TDI
DEBUG_PC3/TDO/SWO
USB_DM
USB_DP
VB
PF0
PF1
PF2
PF3
PF4
PD0
PD1
PD2
PD3
1
PE0
PE1
PE2
PE3
PE4
PE5
61
62
63
64
43
44
53
10
D-
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
2
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
0
9
8
D+
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
3
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
4
PA2
PA3
PA4
PA5
PA6
PA7
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
G
GPIO
J9
CON-USB-MICROAB
GPIO
45
46
47
48
58
57
1
4
ID
U1-A
17
18
19
20
21
22
23
24
PA0/U0RX_VCP_TXD
PA1/U0TX_VCP_RXD
5
DEBUG/VCOM
7
6
R14
+USB_VBUS
0
R29
PB1
0
PB0
PD6
PD7
R25
USB_DP
USB_DM
28
29
30
31
5
J1 and J2 provide compatability with
PF0
PF1
PF2
PF3
PF4
Booster Packs designed for MSP430 Launchpad
J3 and J4 sit 100 mils inside J1 and J2 to provide
extended functions specific to this board.
TM4C123G
See the board user manual for complete table of pin mux functions
GPIO
0
0
0
0
0
R1
R2
R11
R12
R13
+3.3V
USR_SW2
LED_R
LED_B
LED_G
USR_SW1
J1
0
PD0
PD1
PB6
R9
0
PB7
R10
J2
1
2
3
4
5
6
7
8
9
10
PB5
PB0
PB1
PE4
PE5
PB4
PA5
PA6
PA7
1
2
3
4
5
6
7
8
9
10
PB2
PE0
PF0
PB7
PB6
PA4
PA3
PA2
TARGETRST
CON_110_100
CON_110_100
+VBUS
SW1
USR_SW1
J3
R3
C
LED_R
330
Q1
DTC114EET1G
B
E
+VBUS
SW2
USR_SW2
D1
R5
C
LED_G
330
Q3
DTC114EET1G
B
2
3
4
R
G
B
A
1
RGB_LED_0404_COMA
J4
1
2
3
4
5
6
7
8
9
10
PD0
PD1
PD2
PD3
PE1
PE2
PE3
PF1
PF2
PF3
PB3
PC4
PC5
PC6
PC7
PD6
PD7
PF4
CON_110_100
1
2
3
4
5
6
7
8
9
10
CON_110_100
R8
WAKE
330
E
R4
C
LED_B
330
Q2
DTC114EET1G
B
E
DESIGNER
REVISION
DATE
DGT
0.3
2/20/2013
PROJECT
Tiva TM4C123G LaunchPad
DESCRIPTION
Microcontroller, USB, Expansion, Buttons and LED
FILENAME
EK-TM4C123GXL Rev A.sch
PART NO.
EK-TM4C123GXL
SHEET
1 OF 3
+MCU_PWR
RESET
R28
10k
H20
H24 and H25 installed as a single 1x2
RESET
+USB_VBUS
header on 100 mil center with jumper
TARGETRST
H18
C13
0.1uF
OMIT
+VBUS
Power Select
SW3
U1-B
2
38
3
WAKE
41
OSC1
40
OSC0
6
5
34
XOSC0
35
GNDX
36
XOSC1
C28
24pF
C29
24pF
0
R26
Y2
16MHz
3
C31
10pF
+3.3V
+VBUS
H17 H23
RESET
+3.3V 400mA Regulator
H22
GNDA
12
GND
27
GND
39
GND
55
GND
C32
10pF
32.768Khz
Y1
HIB
VBAT
VDDA
32
H1
1
4
H25
WAKE
33
+3.3V
0
R30
OMIT
HIB
37
2
11
VDD
26
VDD
42
VDD
54
VDD
25
VDDC
56
VDDC
TM4C123G
C3
C4
C5
C6
C8
C7
0.01uF
0.1uF
0.01uF
0.1uF
0.01uF
1.0uF
H2
H19
+MCU_PWR
H24
H21
1M
R31
+ICDI_VBUS
C10
0.1uF
+MCU_VDDC
C11
0.1uF
C12
C22
2.2uF
1.0uF
U8
TPS73633DRB
OUT
EN
GND
C18
0.01uF
D4
1.0uF
3
9
NR
PAD
4
C14
1
R27
IN
5
330
8
Green
H11
H13
H12
H10
+VBUS
+3.3V
R17
10k
D2
TLV803
RESET 2
3
VDD
GND 1
A1
3
K
A2
TARGETRST
ICDI_RST
U4
OMIT this SVS Section for Tiva. Errata Fixed
DESIGNER
REVISION
DATE
DGT
0.3
2/20/2013
PROJECT
Tiva Launchpad
DESCRIPTION
Power Management
FILENAME
EK-TM4C123GXL Rev A.sch
PART NO.
EK-TM4C123GXL
SHEET
2 OF 3
PA1/U0TX_VCP_RXD
PA0/U0RX_VCP_TXD
+MCU_PWR
In-Circuit Debug Interface (ICDI)
DEBUG/VCOM
+3.3V
U2-A
TARGETRST
H14
EXTDBG
52
51
50
49
16
15
14
13
+3.3V
R21
10k
R22
10k
9
8
7
6
59
60
ICDI_TCK
ICDI_TMS
ICDI_TDI
ICDI_TDO
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PE0
PE1
PE2
PE3
PE4
PE5
PF0
PF1
PF2
PF3
PF4
45
46
47
48
58
57
1
4
61
62
63
64
43
44
53
10
28
29
30
31
5
R24
330
VB
1
D-
2
DEBUG_PC3/TDO/SWO
D+
3
ID
4
DEBUG_PC1/TMS/SWDIO
DEBUG_PC0/TCK/SWCLK
CON-USB-MICROB
J11
DEBUG_PC0/TCK/SWCLK
DEBUG_PC1/TMS/SWDIO
DEBUG_PC3/TDO/SWO
DEBUG_PC2/TDI
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
6
7
17
18
19
20
21
22
23
24
0
R16
G
5
8
9
R23
10k
H15
R18
10k
+ICDI_VBUS
TM4C123G
+3.3V
R19
10k
ICDI_RST
C34
0.1uF
OMIT
ICDI JTAG
+3.3V
U2-B
38
RESET
WAKE
34
XOSC0
35
GNDX
36
XOSC1
0
R20
41
OSC1
40
OSC0
Y5
16MHz
3
C25
10pF
C26
10pF
GNDA
12
GND
27
GND
39
GND
55
GND
HIB
VBAT
VDDA
J5
32
33
ICDI_TCK
37
ICDI_TMS
+3.3V
5
4
3
2
1
6
7
8
9
10
ICDI_TDO
ICDI_TDI
ICDI_RST
2
11
VDD
26
VDD
42
VDD
54
VDD
TC2050-IDC-NL
C15
C17
C19
C20
C21
C1
0.01uF
0.1uF
0.01uF
0.1uF
0.01uF
1.0uF
25
VDDC
56
VDDC
TM4C123G
C23
0.1uF
C24
0.1uF
C2
1.0uF
C9
2.2uF
DESIGNER
REVISION
DATE
DGT
0.3
2/20/2013
PROJECT
Tiva TM4C123G LaunchPad
DESCRIPTION
In Circuit Debug Interface
FILENAME
EK-TM4C123GXL Rev A.sch
PART NO.
EK-TM4C123GXL
SHEET
3 OF 3
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