MN150222/P0222 LSI User`s Manual

MN150222/P0222 LSI User`s Manual
MICROCOMPUTER
MN1500
MN150222/P0222
LSI User’s Manual
Pub.No.20122-030E
PanaXSeries is a trademark of Matsushita Electric Industrial Co., Ltd.
The other corporation names,logotype and product names written in this book are trademarks or registered trademarks of their
corresponding corporations.
Request for your special attention and precautions in using the technical
information and semiconductors described in this book
(1)
An export permit needs to be obtained from the competent authorities of the Japanese Government if any
of the products or technologies described in this book and controlled under the "Foreign Exchange and
Foreign Trade Law" is to be exported or taken out of Japan.
(2)
The contents of this book are subject to change without notice in matters of improved function. When
finalizing your design,therefore,ask for the most up-to-date version in advance in order to check for any
changes.
(3)
We are not liable for any damage arising out of the use of the contents of this book, or for any
infringement of patents or any other rights owned by a third party.
(4)
No part of this book may be reprinted or reproduced by any means without written permission from our
company.
(5)
This book deals with standard specifications. Ask for the latest individual Product Standards or Specifications
in advance for more detailed information required for your design,purchasing and applications.
If you have any inquiries or questions about this book or our semiconductors, please contact one of
our sales offices listed at the back of this book or Matsushita Electronics Corporation's Sales
Department.
C o n tents
CHAPTER 1 OVERVIEW
1.1 Overview
1.2 Features
1.3 Pin Assignment
1.4 Pin Descriptions
1.5 Unused Pins
1.6 Block Diagram
1.7 Electrical Characteristics
1.8 Package
CHAPTER 2 CPU CORE FUNCTIONS
2.1 Clock Generator and CPU Basic Timing
2.2 ROM and RAM
2.3 Stack Area
2.4 Flag Status
2.5 Backup Mode
2.6 Reset
2.7 Clock Switching Function
CHAPTER 3 I/O REGISTER FUNCTIONS
3.1 I/O Registers List
3.2 Allocation and Description of Registers
3.3 Available Instructions
3.4 Pin Structure Diagram
CHAPTER 4 INTERRUPT FUNCTIONS
4.1 Interrupt Control
4.2 Interrupt Receiving Operation
4.3 Interrupt Return Operation
4.4 Stack upon Interrupt
CHAPTER 5 TIMER FUNCTION
CHAPTER 6 TIME BASE FUNCTION
CHAPTER 7 A/D CONVERSION FUNCTION
CHAPTER 8 AC ZERO VOLTAGE DETECTION FUNCTION
CHAPTER 9 WATCHDOG TIMER FUNCTION
CHAPTER 10 INSTRUCTION SETS
CHAPTER 11 PRODUCT WITH ON-CHIP EPROM
* This document is based on an equivalent Japanese document that was revised on Dec. 1999.
-2-
CHAPTER 1 OVERVIEW
1.1 Overview
This is a high-performance, low power-consuming, 4-bit, single-chip CMOS microcomputer
LSI with each 2-Kbyte ROM and 96-nibble RAM.
For peripheral devices, the LSI incorporates a 10-bit A/D converter, AC zero voltage detection
circuit, each 8-bit timer/counter, time base block, LED direct drive pin, Hi-Z output port control
circuit, auto reset circuit and watchdog timer. The auto reset circuit and watchdog timer are
mask optional functions.
1.2 Features
[Hardware Features]
ROM capacity
: 2048 × 8 bits
RAM capacity
: 96 × 4 bits
Instruction execution frequency: 1/8 fosc
Machine cycle
: 1.00 µs
1/8 × 8.00 MHz
VDD=4.5 V to 5.5V
4.00 µs
1/8 × 2.00 MHz
VDD=2.0 V to 5.5 V without auto reset circuit
(VDD=VRSTL1 to 5.5 V with auto reset circuit)
8.00 µs
1/8 × 1.00 MHz
VDD=1.8 V to 5.5 V without auto reset circuit
(VDD=VRSTL1 or VRSTL2 to 5.5 V with auto reset circuit)
Interrupt
: 1 level
(Software is selected with timer, time base, external interrupt or
AC zero voltage detection interrupt.)
Backup mode
: STOP/HALT mode
Timer/Counter
: Timer/Event count function
Time base
: Time base and buzzer outputs function
Watchdog timer
: Resettable in approx. 33-ms cycle (at fosc=8.00 MHz) (Mask option)
A/D converter
: Max. 4-channel A/D conversion input, dividing into 1024 between
VDD and VSS voltages
AC zero voltage detection circuit: ACZ pin (shared with P31/IRQ)
LED direct drive pin : 7 V (breakdown voltage) ×4 pins
Auto reset circuit
: VRSTL1 can be used when one machine cycle is 4 ms or more.
VRSTL2 can be used when one machine cycle is 8 ms or more.
(Mask option)
I/O pins Hi-Z control : (Software selection)
Pull-up resistor setting : (Mask option)
I/O pin output type
: (Push-pull or N-ch open-drain type) (Mask option)
I/O pins: General-purpose I/O pins
15 pins
A/D converter input
Max. 4 pins (used in common with general-purpose I/O)
Timer output/Buzzer output
1 pin (used in common with general-purpose I/O)
IRQ/ACZ input
1 pin (used in common with general-purpose I/O)
LED direct drive output
4 pins (N-ch open-drain output)
(used in common with general-purpose input)
SYNC pin/Timer input
1 pin (used in common with general-purpose I/O)
Oscillator pin
2 pins
Package : 20-pin SOP, 22-pin SDIP
Process : Silicon gate CMOS
[Software Features]
-
Total 51 instructions
Direct addressing computation for all RAM areas
Non-page program counter
4-/1-bit operational instructions
-3-
1.3 Pin Assignment
20-PIN SOP TOP VIEW
MN150222 Pin Assignment 1
-4-
Note) No device is connected to the N.C. pin.
22-PIN SDIP TOP VIEW
MN150222 Pin Assignment 2
-5-
1.4 Pin Descriptions
Symbol
Name
I/O
Function
Initial
State
VDD
VSS
Power supply
pins
Apply +1.8 V to +5.5 V to VDD, and 0 V
to VSS.
OSC1
OSC2
Clock input
Clock output
I
O
Oscillator connection pins. A feedback
resistor is built in.
RST
Reset input
I/O
The LSI is reset with low-level input
into this pin. In order to reset the LSI
without fail,it is recommendable to turn
on low-level input into this pin for one
machine cycle or more.
The pin incorporates a Schmitt input
circuit.
The pull-up resistor connection is
specified according to the mask option.
Whenever reset input is cleared, the
LSI waits for a certain period for the
stabilization of oscillation.
After that, the internal reset status of
the LSI is cleared.
This pin is used as an output pin of the
mask optional auto reset circuit and
watchdog timer circuit as well.
P00 to
P03
Parallel data I/O I/O
4-bit parallel data I/O ports. Output
type is N-ch open-drain. Capable of
directly driving the LED.
Port input
P10 to
P13
Parallel data I/O I/O
4-bit parallel data I/O ports. Output
type
of N-ch open-drain or push-pull and a
pull-up resistor connection can be
specified by mask option.
Port input
P20/AD0
to
P23/AD3
Parallel data I/O I/O
(A/D converter
(I)
input)
4-bit parallel data I/O ports. Output
type of N-ch open-drain or push-pull
and a pull-up resistor connection can
be specified by mask option.
Each of these pins is switched in
single-bit increments with software so
that these pins will be available to A/D
conversion input for a maximum of four
channels.
Port input
-6-
Symbol
Name
I/O
Function
Initial
State
CPU
timing
output at
reset
Port input
after
clearing
reset
P30
/SYNC
/TCI
Parallel data I/O I/O
(Sync signal
(O)
output)
(I)
(Timer input)
Parallel data I/O port. Output type of
N-ch open-drain or push-pull and a
pull-up resistor connection can be
specified by mask option.
The SYNC internal timing signal is
output from this pin when the LSI is
reset or within two machine cycles after
the internal reset status of the LSI is
cleared.
The pin has push-pull output
regardless of mask optional
specifications while the SYNC timing
signal is output.
The TCI timer input pin incorporates a
Schmitt input circuit.
If the clock source of the timer is set to
the TCI input with software, the output
of P30/SYNC/TCI will be Hi-Z state.
P31
/IRQ
/ACZ
Parallel data I/O I/O
(External
(I)
interrupt)
(I)
(AC zero
voltage
input)
Parallel data I/O port.
The IRQ external interrupt pin
incorporates a Schmitt input circuit.
Output type of N-ch open-drain or
push-pull and a pull-up resistor
connection can be specified by mask
option.
The output of P31/IRQ/ACZ pin will be
Hi-Z state if the external interrupt
function or AC zero voltage detection
interrupt function is selected with
software.
Parallel data I/O I/O
(Timer output)
(O)
(Buzzer output) (O)
Parallel data I/O port. Output type of
N-ch open-drain or push-pull and a
pull-up resistor connection can be
specified by mask option.
This pin is switched over with software
so that timer or buzzer output from this
pin will be enabled.
P32
/TCO
/BZ
Port input
Port input
Note) The port input as an initial status described in the above table is applicable while the LSI
is under Hi-Z control. After the Hi-Z status is cleared, each pin has output according to
the mask option.
-7-
1.5 Unused Pins
It is recommendable to fix each unused pin to the status shown in the following table.
Pin name
Output type
Pull-up resistor
Fixation method
P00 to P03
N-ch open-drain
Selection disabled
Fixed to "L"
P10 to P13
N-ch open-drain
ON
OFF
Open
Fixed to "L"
ON
OFF
Open
N-ch open-drain
P20/AD0 to P23/AD3
I/O port selection
N-ch open-drain
N-ch open-drain
Fixed to "L"
P30/SYNC/TCI
N-ch open-drain
N-ch open-drain
ON
OFF
Open
Fixed to "L" via
a 1-kW resistor
P31/IRQ/ACZ
I/O port selection
N-ch open-drain
N-ch open-drain
ON
OFF
Open
Fixed to "L"
P32/TCO/BZ
I/O port selection
N-ch open-drain
N-ch open-drain
ON
OFF
Open
Fixed to "L"
P10 to P13, P20 to
CMOS push-pull
Selection disabled
(OFF)
Open
P23P30 to P32
I/O port selection
Make the above settings, provided that the LSI is not under Hi-Z control.
-8-
1.6 Block Diagram
VDD
OSC1
OSC2
CLOCK
GEN.
ROM
2048×8
I
R
LB
Y
S (4)
P
X
(4)
RAM
96×4
RST
AUTO
PC (11)
RESET
VSS
INT.FLG
HALT/
STOP
ALU
CF
ZF
INT.EN.FLAGF
TMB
A (4)
SYSTEM
CONTROL
WDT
TIMER
A/D CONVERTER
LB
LB
LB
LB
P0
P1
P2
P3
(P00 to P03) (P10 to P13) (P20/AD0 (P30/SYNC/TCI
P21/AD1 P31/IRQ/ACZ
P22/AD2 P32/TCO/BZ)
P23/AD3)
-9-
Description of Block Diagram
Block
Instruction
Execution
Control
Block
Register
Block
Function
IR
ROM
An instruction, which the CPU is about to execute, is read from the
ROM and latched into the instruction register.
The read only memory (ROM) is a program memory and stores a
program to be run.
PC
The program counter is a 11-bit register which controls the
execution sequence of the instructions in the program memory.
See Note.
SP
The stack pointer (SP) is a 4-bit register indicating the address of
the stack area which uses a part of the data RAM. The stack
area is used to save the PC, etc. when a subroutine call or
interrupt occurs.
X
X is a 4-bit register for indirect addressing of the RAM space.
Y
Y is a 4-bit register for indirect addressing of the RAM space.
Arithmetic
Block
ALU
The arithmetic and logic unit (ALU) performs arithmetic operations
(addition, subtraction, increment, decrement and comparison) and
logical operations (AND, OR, XOR, complement and rotate).
Flag Block
FS
The flag status (FS) consists of two kinds of flags which indicate
the running condition of the CPU. The carry flag (CF) is set when
an ALU operation result either overflows or underflows. The zero
flag (ZF) is set when an ALU operation result is zero, or otherwise,
reset.
(CF)
(ZF)
Data Memory
Block
RAM
The random access memory (RAM) is used both as a stack area
and a data area which accumulates the data required for running
the program.
Interrupt
Control Block
IF
IE
This block controls an interrupt using the interrupt control flag (IF)
and interrupt enable flag (IE).
Timer/Counter
Block
TM
TB
BC
The timer/counter consists of TM which sets either the timer or
event count mode and frequency dividing ratio, TB which sets a
timer value and BC, a binary counter, which counts pulses.
TMB
The time base block divides the frequency of the clock signal fosc
by the frequency dividing ratio selected with software.
Time Base
Block
Note) Set the bits of the program counter as indicated below.
(MSB)
10 9 8
PCh
7654
PCm
(LSB)
3210
PCl
- 10 -
Block
Function
Oscillation
Block
CLOCK
GENERATOR
Connect a system clock oscillator between OSC1 and OSC2.
Auto Reset
AUTO
RESET
The auto reset function enables the low-voltage detection circuit
to operate and sets the RST pin to low level when the VDD drops
to or below VRSTL voltage.
Watchdog
Timer
WDT
The clock of fosc/212 is divided by 26 through the watchdog timer.
The watchdog timer outputs a low-level signal to the RST pin if
an overflow occurs.
A/D Converter A/D
The A/D converter has a resolution of 10 bits with a maximum of
CONfour analog input channels. The analog input between the VDD
VERTER and VSS voltages are divided by 1024 to convert the analog input
into digital values.
Others
VSS
VDD
RST
VSS and VDD are power supply pins. Apply +1.8 V to +5.5 V to
VDD.
RST is a reset pin and activated when the RST pin is at high
level.
- 11 -
1.7 Electrical Characteristics (See Note 1.)
Type
MOS LSI
Function
CMOS 4-bit single-chip microcomputer
A. Absolute Maximum Ratings
Ta = 25 °C VSS = 0 V
Parameter
Symbol
Rating
A1
Supply voltage
VDD
-0.3 to +7.0
V
A2
Input clamp current
(P31/IRQ/ACZ)
IC
-0.5 to +0.5
mA
A3
Input pin voltage
VI
A4
Output pin voltage
VO
-0.3 to VDD +0.3
V
A5
High-current output
pin voltage
VOH
-0.3 to +7.0
V
A6
I/O pin voltage
VIO
-0.3 to VDD +0.3
V
A7
Peak output current
(Other than P0)
IOH(Peak)
IOL(Peak)
-10
20
mA
A8
Peak output current
(P0)
IOL(Peak)
40
mA
A9
Average output
current (See Note 2.)
(Other than P0)
IOH(avg)
IOL(avg)
-0.3 to VDD +0.3
* Not applicable to P31/IRQ/ACZ
Unit
V
-2
10
mA
IOL(avg)
15
mA
A11 Power dissipation
PD
See Note 3.
mW
A12 Operating ambient
temperature
Topr
-40 to +85
°C
A13 Storage temperature
Tstg
-55 to +125
°C
A10 Average output
current (See Note 2.)
(P0)
Note 1) Those electrical characteristics are reference values. For details, refer to the
Product Standards.
Note 2) Applied to any 100 ms period.
Make sure that the total output current value of all output pins is 30 mA or less for
20-pin SOP and 50 mA or less for 22-pin SDIP.
Note 3) 22-pin SDIP: PD = 350 mW
20-pin SOP : PD = 180 mW
- 12 -
B. Operating Conditions
Ta = -40 °C to +85 °C, VDD = 1.8 V to 5.5 V (VRSTL1 or VRSTL2 to 5.5 V), VSS = 0 V
See Note.
Limits
Parameter
Symbol
Conditions
Unit
min
typ
max
B1
VDD1
Machine cycle: 1.0 µs
High-speed oscillation
mode
4.5
VDD2
Machine cycle: 4.0 µs
High-speed oscillation
mode without auto reset
2.0
5.5
VDD3
Machine cycle: 8.0 µs
High-speed oscillation
mode without auto reset
1.8
5.5
VDD4
Machine cycle: 64.0 µs
Low-speed oscillation
mode without auto reset
1.8
5.5
VDD5
Machine cycle: 4.0 µs
or more
High-/low-speed
oscillation modes with
auto reset
VRSTL1
5.5
VDD6
Machine cycle: 8.0 µs
or more
High-/low-speed
oscillation modes with
auto reset
VRSTL1
VRSTL2
5.5
Supply voltage
5.0
5.5
V
Note) VRSTL1 and VRSTL2 voltages refer to the supply voltages that are detected to reset the
LSI, which are applicable if the auto reset circuit is selected as a mask option.
Auto Reset Circuit 1
B2
Voltage
detection level
VRSTH1
3.1
VRSTL1
2.0
3.0
VH
0.05
0.1
∆ t/∆ V
1.00
4.0
V
Fig. 1
B3
Hysteresis width
B4
Supply voltage
change rate
ms/V
* The above values are applied when use of the auto reset function is selected as a
mask option and the LSI is operated by the normal 5-V supply voltage.
Auto Reset Circuit 2
B5
Voltage
detection level
VRSTH2
2.0
VRSTL2
1.2
1.9
VH
0.05
0.1
∆ t/∆ V
1.00
2.6
V
Fig. 1
B6
Hysteresis width
B7
Supply voltage
change rate
* The above values are applied when use of the auto reset function is selected as a
mask option and the LSI is operated by the normal 3-V supply voltage.
- 13 -
ms/V
Operating Speed Ta= -40 °C to +85 °C, VDD=1.8 V to 5.5 V (VRSTL1 or VRSTL2 to 5.5V),
VSS=0 V
Limits
Parameter
Symbol
Conditions
Unit
min
VDD=4.5 V to 5.5 V
High-speed oscillation mode
fosc=8.0 MHz
tc1
B8
Instruction
execution
time
tc3
tc4
Oscillation
B9
Oscillator
frequency
max
1.0
VDD=2.0 V (VRSTL1) to 5.5 V
High-speed oscillation mode
fosc=2.0 MHz
( ): At auto reset ON
tc2
typ
µs
4.0
VDD=1.8 V(VRSTL1 or VRSTL2)
to 5.5 V
High-speed oscillation mode
fosc=1.0 MHz
( ): At auto reset ON
8.0
VDD=1.8 V (VRSTL1 or VRSTL2)
to 5.5 V
Low-speed oscillation mode
fosc=125 kHz
( ): At auto reset ON
64.0
OSC1, OSC2 (See Note.)
fXtal1
VDD=1.8 V to 5.5 V
High-speed oscillation
mode
0.5
8.0
MHz
fXtal2
VDD=1.8 V to 5.5 V
Low-speed oscillation
mode
32
125 kHz
Note)
OSC1
(Self-excited
oscillation circuit)
OSC2
C12
C11
VSS VSS
- Have the sample of the above circuits evaluated by oscillator manufacturer to determine
the external capacitance each of C11 and C12. In most cases, the appropriate value of
each capacitor seems to be approx. 30 pF.
- The LSI has an on-chip feedback resistor.
- 14 -
External Clock Input 1
OSC1 (High-speed oscillation mode. OSC2 is open.)
Ta= -40 °C to +85 °C, VDD=1.8 V to 5.5 V (VRSTL1 or VRSTL2 to 5.5 V), VSS=0 V
Limits
Parameter
Symbol
Conditions
Unit
min
B10
B11
max
Clock frequency
fosc1
High-level pulse
width *
twh1
Low-level pulse
width *
twl1
Rise time
twr1
20
Fall time
twf1
20
Input voltage high
level
VIH1
Input voltage low
level
VIL1
External Clock Input 2
1.0
typ
Fig. 2
A clock duty ratio
should be 45 % to
55 %.
Fig. 2
8.0
MHz
40
40
ns
0.8VDD
VDD
VSS
0.2VDD
V
OSC1 (Low-speed oscillation mode. OSC2 is open.)
Clock frequency
fosc2
32
High-level pulse
width *
twh2
Low-level pulse
width *
twl2
Rise time
twr2
20
Fall time
twf2
20
Input voltage high
level
VIH2
Input voltage low
level
VIL2
Fig. 3
A clock duty ratio
should be 45 % to
55 %.
Fig. 3
- 15 -
125
MHz
0.8
0.8
ns
0.8VDD
VDD
VSS
0.2VDD
V
External Clock Input 3
TCI
Ta= -40 °C to +85 °C, VDD=1.8 V to 5.5 V (VRSTL1 or VRSTL2 to 5.5 V), VSS=0 V
Limits
Parameter
Symbol
Conditions
Unit
min
B12
Clock frequency
typ
ftci
max
5
MHz
VDD = 1.8 V to 5.5 V
High-level pulse
width *
twh3
Low-level pulse
width *
twl3
Clock frequency
ftci
100
Fig. 4
ns
100
2.5
MHz
VDD = VRSTL to 1.8 V
High-level pulse
width *
twh3
Low-level pulse
width *
twl3
Rise time
trcp
Fall time
tfcp
200
Fig. 4
200
ns
20
20
Fig. 4
Input voltage
high level
VIH3
Input voltage low
level
VIL3
0.8VDD
VDD
V
VSS
0.1VDD
VDD
VRSTH
VH
VRSTL
Approx. 1V
t
Operating mode
The status of
Indefinite
general-purpose
Hi-Z
port
Indefinite
Hi-Z
VH : hysteresis width
"L"
Reset cleared
"L"
The status
Indefinite
of RST pin
Fig. 1 Auto Reset Voltage
- 16 -
Indefinite
0.8 VDD
0.2 VDD
twh1
twl1
twr1
twf1
fosc1
Fig. 2 OSC1 Timing Chart
0.8 VDD
0.2 VDD
twh2
twl2
twr2
twf2
fosc2
Fig. 3 OSC1 Timing Chart
0.8 VDD
0.1 VDD
twh3
twl3
trcp
tfcp
ftci
Fig. 4 TCI Timing Chart
- 17 -
C. Electrical Characteristics (DC Characteristics)
Ta= -40 °C to +85 °C, VDD=1.8 V to 5.5 V (VRSTL1 or VRSTL2 to 5.5 V), VSS=0 V
Limits
Parameter
Symbol
Conditions
Unit
min
typ
max
Supply Current
C1
C2
Operating supply
current
IDD1
fosc = 8.0 MHz
VDD = 5.0 V
4.0
8.0
IDD2
fosc = 2.0 MHz
VDD = 3.0 V
1.2
2.5
IDD3
fosc = 32.768 kHz
VDD = 5.0 V
30.0
fosc = 32.768 kHz
VDD = 5.0 V
15.0
mA
60.0
Supply current in
HALT mode
IDD4
30.0
C3
Supply current in
STOP mode
IDD5
VDD = 5.0 V
0.5
5.0
C4
Auto reset
current
consumption
IDD6
VDD = 5.0 V
30.0
80.0
µA
* Make measurement at Ta = 25 °C while under no-load condition.
* To measure the operating supply current, IDD1, fix the I/O pins to VDD level in the
RESET mode, input an 8-MHz square wave, which swings between VDD and VSS
voltage levels, into the OSC1 pin.
* To measure the operating supply current, IDD2, fix the I/O pins to VDD level in the
RESET mode, input a 2-MHz square wave, which swings between VDD and VSS
voltage levels, into the OSC1 pin.
* To measure the operating supply current, IDD3, clear the reset mode and fix the I/O pins
to VDD level during execution of NOP instruction, input a 32.768-kHz square wave,
which swings between VDD and VSS voltage levels, into the OSC1 pin.
* To measure the supply current in HALT mode, IDD4, clear the RESET mode and set to
the HALT mode, and, after fixing the I/O pins to VDD level, input a 32.768-kHz square
wave, which swings between VDD and VSS voltage levels, into the OSC1 pin.
* To measure the supply current in STOP mode, IDD5, clear the RESET mode and set to
the STOP mode. Then fix the I/O pins to VDD level and open OSC1 pin.
* Auto reset current consumption,IDD6, refers to the constant current consumption of the
auto reset circuit with the auto reset function ON selected as a mask option. Therefore,
the value of current consumption is added to each supply current rating if the auto
reset circuit is enabled.
- 18 -
Ta= -40 °C to +85 °C, VDD=1.8 V to 5.5 V (VRSTL1 or VRSTL2 to 5.5 V), VSS=0 V
Limits
Parameter
Symbol
Conditions
Unit
min
High-Current I/O Pins
C5
VIH1
C6
Input voltage low
level
VIL1
C7
Output leakage
current
OLK1
Output: Hi-Z
VIN =0 V to 6 V
C8
Output voltage low
level
VOL1
IOL =20.0 mA
VDD =5.0 V
C9
0.7VDD
VDD
V
VSS
0.3VDD
VSS
±10
µA
2.0
V
P10 to P13
P20/AD0 to P23/AD3 (When the pins are used as P20 to P23 pins)
P30/SYNC/TCI, P31/IRQ/ACZ, P32/TCO/BZ
(When the pins are used as P30/SYNC, P31, P32/TCO/BZ pins)
Input voltage high
level
VIH2
C10
Input voltage low
level
VIL2
C11
Input current
II2
0.7VDD
VDD
V
C12
Input leakage current
C13
Output voltage high
level
VOH2
Output voltage low
level
VOL2
C14
max
P00 to P03 (N-ch open-drain)
Input voltage high
level
I/O Pins
typ
ILK2
VSS
With pull-up
resistor
VIN = 1.5 V
VDD = 5.0 V
-50
0.3VDD
-120
-300
µA
Without pull-up
resistor
VIN = 0 V to VDD
±1
IOH = -500 µA
VDD = 5.0 V
4.5
IOL = 3.5 mA
VDD = 5.0 V
VSS
VDD
V
0.5
Note) Use the P30/SYNC/TCI pin under the following condition:
The load must be set so that the output voltage high level will be more than 0.8 VDD
while the SYNC timing signal is output. That is, at the time the LSI is reset or within two
machine cycles after the reset status of the LSI is cleared.
- 19 -
Ta= -40 °C to +85 °C, VDD=1.8 V to 5.5 V (VRSTL1 or VRSTL2 to 5.5 V), VSS=0 V
Limits
Parameter
Symbol
Conditions
Unit
min
typ
max
Input Pins P20/AD0 to P23/AD3 (When the pins are used as A/D input pins)
C15
Converted voltage
range
C16
Resolution
C17
Relative precision
C18
Zero transition
voltage
V0T
C19
Full-scale transition
voltage
VFST
C20
A/D conversion time
C21
VAD
VDD = 5.0 V
VSS = 0.0 V
Analog input
voltage
C23
Analog input
leakage current
C24
Ladder resistance
VDD
V
10
bit
±3
10
LSB
30
mV
Sampling time
C22
VSS
VDD
-10
VDD
-30
fosc = 8 MHz
VDD = 5.0 V
VSS = 0.0 V
15.00
See
Note.
fosc = 8 MHz
VDD = 5.0 V
VSS = 0.0 V
5.00
See
Note.
µs
VDD
V
±.001
±1
µA
50
100
kΩ
VADIN
27.00
17.00
VSS
VADIN= 0 V to VDD
(VADIN when
channel is off.)
Rladd
10
µs
Note) The value is applied when bp3 (ADTC) of the A/D control register ADCL is set to
zero.
Relative precision:
The deviation of the converted straight line from the ideal straight line that results
after both the zero transition voltage and full-scale transition voltage are adjusted
to zero.
Zero transition voltage:
Indicates the difference between the analog input voltage and the nominal value
when the digital output code changes from 0 (000h) to 1 (001h).
Full-scale transition voltage:
Indicates the difference between the analog input voltage and the nominal value
when the digital output code (3FEh) reaches the full-scale value (3FFh).
- 20 -
Ta= -40 °C to +85 °C, VDD=1.8 V to 5.5 V (VRSTL1 or VRSTL2 to 5.5 V), VSS=0 V
Limits
Parameter
Symbol
Conditions
Unit
min
typ
max
Input Pin P31/IRQ/ACZ (When this pin is used as ACZ pin)
C25
ACZ input
(high-level output)
VSH
ACZ input
(low-level output)
VSL
1.5
VDD
-1.5
VSS
0.5
VDD
-0.5
VDD
Fig. 5
V
C26
C27
C28
Input leakage
current
ILK3
Input clamp
current
IC3
VDD=4.5 V to 5.5 V
Without pull-up
resistor
VIN = 0 V to VDD
±1
µA
VIN > VDD
VIN > VSS
VDD = 5.0 V
±400
I/O Pin P31/IRQ/ACZ (Schmitt input when this pin is used as IRQ pin)
C29
Input voltage high
level
VIH4
0.8VDD
VDD
C30
Input voltage low
level
VIL4
VSS
0.1VDD
C31
Input current
II4
V
C32
Input leakage
current
ILK4
With pull-up
resistor
VIN = 1.5 V
VDD = 5.0 V
-50
-120
-300
µA
Without pull-up
resistor
VIN = 0 V to VDD
±1
I/O Pin P30/SYNC/TCI (Schmitt input when this pin is used as TCI pin)
C33
Input voltage high
level
VIH5
0.8VDD
VDD
C34
Input voltage low
level
VIL5
VSS
0.1VDD
C35
Input current
II5
V
C36
Input leakage
current
ILK5
With pull-up
resistor
VIN = 1.5 V
VDD = 5.0 V
Without pull-up
resistor
VIN = 0 V to VDD
- 21 -
-50
-120
-300
µA
±1
Ta= -40 °C to +85 °C, VDD=1.8 V to 5.5 V (VRSTL1 or VRSTL2 to 5.5 V), VSS=0 V
Limits
Parameter
Symbol
Conditions
Unit
min
I/O Pin
typ
max
RST (Schmitt input)
C38
Input voltage high
level
VIH6
0.8VDD
VDD
C39
Input voltage low
level
VIL6
VSS
0.1VDD
C40
Input current
II6
V
With pull-up
resistor
VIN = 1.5 V
VDD = 5.0 V
C41
Input leakage
current
ILK6
Without pull-up
resistor
VIN = 0 V to VDD
C42
Output voltage low
level
VOL6
VDD = 2 V,
IOL = 0.3 mA
- 22 -
-50
-120
-300
µA
±1
VSS
0.4
V
D. Electrical Characteristics (AC Characteristics)
Ta= -40 °C to +85 °C, VDD=1.8 V to 5.5 V (VRSTL1 or VRSTL2 to 5.5 V), VSS=0 V
Limits
Parameter
Symbol
Conditions
Unit
min
typ
max
RST Pin
D1
Effective pulse width
twRST
Fig. 5
1
mc
* The above pin may not be reset if the pulse width is shorter than the effective pulse width.
(mc: Machine cycle)
P31/IRQ/ACZ (When this pin is used as ACZ pin)
Rise time
D2
trs
30
Fig. 6
Fall time
D3
tfs
30
0.8 VDD
twRST
0.1 VDD
Fig. 5 RST Input Pulse Width
(Input)
trs
tfs
VDD
VSL
VSH
VSL
VSS
(Output)
Fig. 6 AC Zero Voltage Detection Circuit Operating Diagram
- 23 -
µs
1.8 Package
Package 1
PACKAGE CODE: SOP020-P-0300
- 24 -
Package 2
PACKAGE CODE: SDIP022-P-0300
- 25 -
Mask Option Check List
Part No.
MN150222
1. Operating supply voltage range
Operating
voltage
range
2. Clock
Usage
Used
Operating
mode
V to
V
HALT mode
V to
V
STOP mode
V to
V
----
Oscillatio
n mode
Xtal
Unused
----
32 kHz to
125 kHz
in low-speed
oscillation
mode
Oscillator
frequency
0.5 MHz to
8 MHz
in high-speed
oscillation
mode
Remarks
3. Auto reset function
* Use the LSI in auto reset function ON mode with one machine cycle set to 4.0 ms or
more when VRSTL1 reset voltage is selected and 8.0 ms or more when VRSTL2 reset
voltage is selected.
Auto reset function
ON
Reset voltage
OFF
Mark "P" on the
corresponding item
if ON is selected.
4. Pull-up resistor at reset pin
ON
VRSTL2
2.0 V to 4.0 V
(Use the LSI at
normal 5-V
supply voltage.)
1.2 V to 2.6 V
(Use the LSI at
normal 3-V
supply voltage.)
5. Watchdog timer function
OFF
ON
6. A/D conversion function
ON
VRSTL1
OFF
7. AC zero voltage detection function
OFF
ON
- 26 -
OFF
8.1 Pin Structure
Pin name
Function
Output type selection
N-ch open-drain
Push-pull
Pull-up resistor
ON
OFF
Output type selection
N-ch open-drain
Push-pull
Pull-up resistor
ON
OFF
Output type selection
N-ch open-drain
Push-pull
Pull-up resistor
ON
OFF
Output type selection
N-ch open-drain
Push-pull
Pull-up resistor
ON
OFF
Output type selection
N-ch open-drain
Push-pull
Pull-up resistor
ON
OFF
Output type selection
N-ch open-drain
Push-pull
Pull-up resistor
ON
Output type selection
N-ch open-drain
Push-pull
Pull-up resistor
ON
OFF
Output type selection
N-ch open-drain
Push-pull
P10
P11
P12
P13
P20
P20/AD0
Note 1)
AD0
P
OFF
P21
P21/AD1
Note 1)
AD1
Pull-up resistor
ON
P
OFF
Output type selection
N-chopen-drain
Push-pull
Pull-up resistor
ON
OFF
Output type selection
N-ch open-drain
Push-pull
Pull-up resistor
ON
Output type selection
N-ch open-drain
Push-pull
Pull-up resistor
ON
OFF
Output type selection
N-ch open-drain
Push-pull
Pull-up resistor
ON
P22
P22/AD2
AD2
P
OFF
P23
P23/AD3
Note 1)
AD3
P
OFF
Note 1) A pull-up resistor cannot be connected to the pin when AD pin is selected on
PTAD2-0 of ADCH X 'A' , A/D Control Register.
- 27 -
8.2 Pin Structure
Pin name
Function
Output type selection
N-ch open-drain
Push-pull
Pull-up resistor
ON
OFF
Output type selection
N-ch open-drain
Push-pull
Pull-up resistor
ON
OFF
Output type selection
N-ch open-drain
Push-pull
Pull-up resistor
ON
OFF
P30/SYNC/TCI
P31/IRQ/ACZ
Note 2)
P32/TCO/BZ
Note 2) A pull-up resistor cannot be connected when the AC zero voltage detection function is
used.
- 28 -
CHAPTER 2 CPU CORE FUNCTIONS
2.1 Clock Generator and CPU Basic Timing
This LSI incorporates the system clock oscillation circuits (OSC1 and OSC2). The circuit has
an oscillation element and capacitors connected externally. A Xtal oscillator or a ceramic
oscillator is utilized as the oscillation element.
When mounting the LSI on PCB, design a pattern so that the oscillation elements and
capacitors will be arranged as physically close to the LSI as possible.
Also provide a thick ground line that can be connected to VSS with the LSI at the shortest
distance possible. Note that long wiring pattern is susceptible to noise interference and
results in unstable oscillation. Fig. 2.1.1 shows a connection diagram. Optimum values for
the capacitors differ depending on the oscillator used. Use the values specified by each
oscillator maker.
VSS
OSC1
OSC2
VDD
Fig. 2.1.1 Oscillation Circuit Connection Diagram
This LSI constitutes a machine cycle (state) with 4-phase clocks, S0, S1, S2 and S3,
generated from the oscillation source (OSC1 and OSC2).
One machine cycle is 1.0 µs when oscillation source, fosc, is 8.0 MHz.
Machine Cycle
S3
S0
S1
S2
S3
Fetch Cycle n
Execution Cycle n-1
ROM Read
S0
S1
Fetch Cycle n+1
Execution Cycle n
Execution Cycle n+1
Instruction Decode
(JMP, CALL, RET and RETI interrupts)
PC+1
PC Load
RAM
RAM
Address Read
SP-1
RAM Write
SP+1
Fig. 2.1.2 Machine Cycle and CPU Basic Timing
- 29 -
2.2 ROM and RAM
This LSI has a 2-Kbyte instruction memory space (ROM) to store instructions, and a
96-nibble (including a 32-nibble stack area) data memory space (RAM) to store data
separately from each other.
Fig. 2.2.1 shows the ROM address space and Fig. 2.2.2 shows the RAM address space.
Interrupt sources
RESET
000
Interrupt Vector
00A
IRQ
00C
Interrupt
Vector
User Program
(incorporated
in ROM)
RESET
IRQ
X '000'
X '00A'
* IRQ factor is set with software selection.
timer, time base, external
interrupt, or
AC zero voltage detection
interrupt
7FF
Fig. 2.2.1 ROM Address Space
Lower Address
F E DCBA 9 8 7 6 5 4 3 2 1 0
Upper
Address
0
1
2
3
4
5
6
7
Data Area
Not used
Stack Area
Fig. 2.2.2 RAM Address Space
- 30 -
2.3 Stack Area
This LSI has assigned as a stack area the addresses (6, 0) to (7, F) in the RAM area. The
stack area is used to save the PC (Program Counter), flag statuses (ZF and CF) and A, X
and Y registers at the time of the CALL instruction, PSH instruction or an interrupt.
When the entire stack area is not used, it is also available as regular RAM. When only the
CALL instruction is executed, up to 8 levels can be used.
Fig. 2.3.1 shows the stack condition when the CALL instruction, PSH instruction or an
interrupt sequence is executed.
(Odd-number Address)
(Address)
3
2
1
0
(Even-number Address)
3
2
1
0
71-70
73-72
75-74
77-76
PCm
CF
After execution
of interrupt
LI
FF
ZF
79-78
PC1
PCh
X
7B-7A
7D-7C
7F-7E
PCm
CF
ZF
LI
FF
Y
After execution of
PSHXY instruction
A
After execution of
PSHEA instruction
PC1
After execution of
CALL instruction
PCh
Fig. 2.3.1 Stack Area Condition
Note 1) At reset time, the SP (Stack Pointer) points to 60. The stack data are used
sequentially, starting at address 7F to 60.
Note 2) The RET instruction does not return the flags (CF, ZF and LIFF).
Only the RETI instruction is returned.
Note 3) LIFF: This is FF to memorize that the instruction just before was LI.
It is used for an LI instruction stacking function.
Note 4) The values in the oblique-lined cells in Fig. 2.3.1 are indefinite.
- 31 -
2.4 Flag Status
The flag status is composed of a 2-bit register consisting of the arithmetic flags, that is, carry
flag (CF) and zero flag (ZF). CF is set when an arithmetic result of the ALU overflows or
underflows, or is otherwise reset. ZF is set when the arithmetic result of the ALU is zero, or
is otherwise reset.
2.5 Backup Mode
In order to reduce power consumption, there are two kinds of backup modes provided, which
can be controlled by the program.
- HALT mode: The system clock frequency divider is operating. However, system clock is
not supplied. It is returned by a reset operation or an interrupt.
- STOP mode: The power consumption can be reduced further because the system clock
frequency divider is also stopped. As with the HALT mode, it is returned
by a reset operation or an interrupt. (Software option)
Table 2.5.1 shows the STOP and HALT functions.
Table 2.5.1 STOP and HALT Functions
Mode
Operation
Operating
condition
STOP
HALT
1) The system clock oscillation circuit
stops.
1) The system clock oscillation circuit
is operating.
(System clock frequency divider
is operating. However, system
clock is not supplied.)
2) Timer/Counter
- It is operating in event count mode.
- It is stopped in timer mode.
2) Timer/Counter
- It is operating in event count mode.
- It is operating when the clock is
14
fosc/2 in timer mode.
- It is operating when the clock is
fsys/2 in timer mode.
3) Time base is stopped.
3) Time base is operating.
Register/RAM
condition
Holds the contents of the RAM and all registers.
Mode setting
method
Executes a WI instruction just after an
EDI instruction.
(Refer to Example: 2.5.1.)
Return
Executes the WI instruction after an
instruction other than an EDI
instruction. (Refer to Example: 2.5.2.)
- Interrupt: Identical operation with a normal interrupt
- Reset : Identical operation with a normal reset
Example: 2.5.1 Using the STOP Mode
ED 0.4
WI
NOP
Exits from the STOP mode when an IRQ (external interrupt) occurs.
Be sure to insert one or more NOPs next to the EDI and WI instructions
in order to stabilize operation.
Note) Following is an interrupt which enables return from the STOP mode.
IRQ (External interrupt, ACZ interrupt or timer in the event count mode.)
- 32 -
Example: 2.5.2 Using the HALT Mode
EDI 0.4
Returns from the HALT mode when an interrupt occurs.
(Instruction other than
EDI instruction)
WI
NOP
Note) Be sure to insert one or more NOPs next to the WI instruction. The currently provided
cross assembler inserts an NOP automatically.
Table 2.5.2 shows the comparison of STOP and HALT modes.
Table 2.5.2 STOP and HALT Modes Comparison Table
OSC
IRQ
CPU
RESET
STOP mode
-
P (Note 1)
-
P
HALT mode
P
P (Note 2)
-
P
P : Operates
- : Stops
Unless the MASKIR bit is set to zero, IRQ does not operate.
Note 1) The timer interrupt function operates in event count mode and does not operate in
timer mode. The time base interrupt function does not operate in STOP mode.
Note 2) The timer interrupt function operates in event count mode or timer mode with the
clock source of fosc/214 selected but does not operate in timer mode with the clock
source of fsys/2 selected. The time base interrupt function, however, operates.
- 33 -
Precautions for using the Backup Mode
1. Handling of the output ports
In the backup mode, the port level can be made floating in order to reduce power
consumption at the output ports. The port status can be set by controlling the corresponding
bit of the control register. (Refer to Table 2.5.3.)
Table 2.5.3 Interrupt Mode Register (CPUM: X'4' R/W) versus Output Ports
HIZC
Port Status
1
All output pins are floating (Hi-Z)
Note) The voltage level is set to "H" if a pull-up
resistor is selected as a mask option.
0
Normal output
(Set to "1" in RESET mode)
2. Handling of the input ports
A pull-up resistor for the input port should be specified according to the external circuit
voltage level in the backup operation, in order to reduce power consumption at the port. Set
the input port voltage level externally so that it will be turned to either "L" or "H" level in the
backup operation. When the port is at the middle level, a current flows internally and the
microcomputer consumes more power.
3. Return from the STOP mode
When the supply voltage is less than 1.8 V at the time of return, the RAM data cannot be
guaranteed after return. If this is the case, reset by means of an external circuit or use the
auto reset function.
4. Handling of the I/O ports
After first setting to the Hi-Z state, set the I/O ports externally so that the pin levels will be
turned to "L" or "H" level. When they are at the middle level, the microcomputer consumes
more power.
5. Handling of the A/D Control Registor
Setting from outside is not needed when A/D input is unused on AD, because P2 input gate is fixed
to stop feedthrough current. The pin which selects AD cannot be connected to a pull-up resistor
as a mask option.
- 34 -
2.6 Reset
The LSI is reset with the RST pin set to "L" level. When the LSI is reset, the register and
output port latch are initialized as shown in table 2.6.1.
The RST pin should be set to "L" level for a machine cycle or more for stabilized reset
operation, otherwise the LSI may not be reset.
Table 2.6.1 Initial Values of Registers and Data Memories
Register/Memory
Symbol
Initial Value
Program counter
PC
P
Accumulator
A
P
Register X
X
P
Register Y
Y
P
Carry flag
CF
P
Zero flag
ZF
P
Register/Memory
Interrupt accept flag
Interrupt
enable/disable flag
Symbol
IF
P
IE
Disabled
Output port latch
I/O register
RAM
Stack pointer
Initial Value
1
IR
1
Indefinite
SP
60
[Reset Clearing Timing]
14
7
This LSI clears an internal reset by counting 2 pulses (2 pulses in low-speed mode)
worth of OSC input clock after the RST pin is turned to "H". This is because the
microcomputer may malfunction if a reset is cleared when the oscillation source of system
clock is unstable.
When designing a system, design the reset timing taking the above point into account.
Refer to Fig. 2.7.2.
- 35 -
2.6.1 Auto Reset Function (Mask Option)
The auto reset circuit is enabled or disabled according to the mask option.
The auto reset function enables the low-voltage detection circuit to operate and sets the RST
pin to "L" level when the VDD drops to or below VRSTL level. The following diagram shows the
auto reset block.
VDD
Pull-up resistor
Mask option
RST
Reset delay circuit
Internal reset
VDD
Mask option
N-ch
O
R
Low-voltage detection circuit
(reset voltage at 2.0 V to 4.0 V)
Low-voltage detection circuit
(reset voltage at 1.2 V to 2.6 V)
Watchdog timer
Mask option
- 36 -
2.7 Clock Switching Function
The LSI operates in high- or low-speed Xtal oscillation mode according to the mask option.
As shown in Fig. 2.7.1, the oscillation starts from the reset cycle when the LSI is reset.
At CPU reset time, a hardware-wise waiting time, twait (osc), takes place in the return from
STOP mode automatically until the clock oscillation is stabilized.
The waiting time, twait (osc), on the oscillator side is a period in which 214 pulses are counted in
high-speed Xtal oscillation mode and 27 pulses are counted in low-speed Xtal oscillation
mode after the oscillation starts.
The clock oscillation starting time of the LSI varies with the type of crystal and the value of
the oscillation circuit capacitor. Generally, the lower the oscillator frequency is, the slower
the starting time is. For example, it requires a few hundreds of milliseconds at 32 kHz, which
should be taken into consideration to design the system. Refer to Fig. 2.7.1.
Fig. 2.7.1 CPU Operation Modes and Settings
Reset
HALT
fosc: Oscillates
1/8 fosc mode
CPU stops
WI
Interrupt
Reset Cleared
(Note 1)
EDI
NORMAL
WI
fosc: Oscillates
1/8 fosc mode
fosc: operates
Interrupt
(Note 1)
STOP
fosc: Stops
1/8 fosc mode
CPU stops
Note 1) The hardware awaits the stabilization of OSC oscillation.
Fig. 2.7.2 Wait at Oscillation Start
Oscillation
Start Time
twait
Operation
twait=214 ×
1
fosc
(High-speed Xtal oscillation mode)
twait=27 ×
1
fosc
(Low-speed Xtal oscillation mode)
- 37 -
CHAPTER 3 I/O REGISTER FUNCTIONS
3.1 I/O Registers List
Address
Name
Function
X'0'
PORT0
P0 port register
X'1'
PORT1
P1 port register
X'2'
PORT2
P2 port register
X'3'
PORT3
P3 port register
X'4'
CPUM
CPU control
X'5'
TBL
Timer control (Timer buffer lower 4 bits)
X'6'
TBH
Timer control (Timer buffer upper 4 bits)
X'7'
TM
Timer control (Timer mode)
X'8'
TMBC
Time base control
X'9'
ADCL
A/D control
X'A'
ADCH
A/D control
X'B'
ADDL
A/D control (A/D buffer lower 2 bits)
X'C'
ADDM
A/D control (A/D buffer middle 4 bits)
X'D'
ADDH
A/D control (A/D buffer upper 4 bits)
X'E'
Not used
X'F'
IRQC
Interrupt selection
- 38 -
3.2 Allocation and Description of Registers
3.2.1 I/O Port Registers
Data output to the pin is done by writing the output data into the port register,
and data input from the pin is done by reading the data from the port register.
Each register consists of 4 bits (one port worth).
Address
Name
Port
I/O
Description
X'0'
PORT0
P0
I/O
4-bit parallel data I/O port.
The output is N-ch open-drain type. Capable of
directly driving the LED.
X'1'
PORT1
P1
I/O
4-bit parallel data I/O port.
The output type and a pull-up resistor connection
can be specified by a mask option.
X'2'
PORT2
P2
I(P20)
I/O
4-bit parallel data I/O port. The P20 to P23 are
used in common with AD0 to AD3 respectively.
The output type and a pull-up resistor connection
can be specified by a mask option.
X'3'
PORT3
P3
I/O
4-bit parallel data I/O port.
The P30 is shared with the SYNC and TCI (timer
input). The P31 is shared with the IRQ and ACZ.
The P32 is shared with the TCO (timer output)
and BZ (buzzer) output.
3.2.2 CPU Control Register
The Hi-Z control of all I/O pins is specified through the CPU control register.
So are the control of the watchdog timer operation and the system clock frequency
dividing ratio.
CPUM
X '4'
bit
Name
0
HIZC
1
WDEN
R/W (bit 1 is write-only.)
Description
Initial Value
Specifies Hi-Z for all output pins. See Note 1.
1: Sets all the pins to Hi-Z.
0: Clears Hi-Z control for all the pins.
1
Specifies the operation of the watchdog timer. See Note 2.
1: Clear
0: Enabled
0
2
Always set to 1.
1
3
Unused
Note 1) Hi-Z control does not apply to the SYNC pin and pull-up selection pin.
Note 2) If WDEN is set to 1, the counter clear signal is output for one machine cycle. Then
WDEN is set to 0 and the watchdog timer restarts, provided that the watchdog timer
is selected as a mask option.
- 39 -
3.2.3 Timer Control Registers
This LSI incorporates an 8-bit timer.
Address
Name
Configuration
Function
Initial Value
X '5'
TBL
R/W Note)
Timer buffer lower 4 bits
F
X '6'
TBH
R/W Note)
Timer buffer upper 4 bits
F
X '7'
TM
R/W
Timer mode register
F
X '8'
TMBC
R/W
Time base mode register
Indefinite
Note) The value of the binary counter is read out at register read time.
(1) Timer buffer
This is a register to set the data to the timer binary counter. Since the value of the binary
counter is read out at register read time, a value different from the written one may be
read out while the timer is operating.
TBL
X '5'
R/W
bit
Description
0 to 3
TBH
bit
0 to 3
Timer buffer lower 4 bits
X '6'
Initial Value
F
R/W
Description
Timer buffer upper 4 bits
Initial Value
F
- 40 -
(2) Timer Mode Registers
The timer mode register is used to set the clock source and operation mode of timer.
TM
X '7' R/W
bit
Name
0
TMEN
1
TCOE
Description
Initial Value
Specifies timer operation.
1: The timer stops.
0: The timer operates.
1
Selects P32, TCO or BZ.
(Selects port I/O, timer output or buzzer output.)
1: Selects P32/BZ (port I/O or buzzer output).
0: Selects TCO (timer output).
Note) Selects P32 or BZ with bit 1 (BZOE) of the
X'8' port register.
1
Selects the clock of timer.
2
3
CLK0
CLK0
CLK1
Clock Source
0
0
TCI
input/26
See Note 1.
0
1
TCI
input
See Note 1.
1
0
fosc/214
1
1
fsys/2
See Notes 2 and 3.
CLK1
1
1
Note 1) The P30/SYNC/TCI output is set to Hi-Z.
Note 2) fsys = 1/8fosc.
Note 3) If fsys/2 is selected, the timer stops when the LSI is in HALT mode.
- 41 -
3.2.4 Time Base Control Register
This LSI incorporates a time base besides an 8-bit timer.
(1) Time Base Mode Register
This register is used for the selection of time base output and clock source setting.
TMBC
X '8' R/W (bit 0 is read-only)
bit
Name
0
TMB
1
BZOE
Description
When the IN instruction is executed, the clock
frequency, which is selected by the BZSEL0 and
BZSEL1 bits, is set in bit 0 of the accumulator.
Selects P32, TCO or BZ.
1: Selects P32.
0: Selects BZ (buzzer output).
Note) The setting in the BZOE bit is disabled if
TCO output is selected with the TCOE bit.
Initial Value
Indefinite
1
Selects clock output to be provided to the buzzer and
time base.
2
3
BZSEL0
BZSEL1
BZSEL0
BZSEL1
1
1
fosc/212
1
0
fosc/211
0
1
fosc/210
0
0
fosc/29
- 42 -
Clock Source
1
1
3.2.5 A/D Control Register
This LSI incorporates a 4-channel A/D converter.
The LSI uses a total of eight registers for channel selection, starting A/D conversion, or
stopping A/D conversion.
ADCL
bit
X '9'
R/W
Name
Description
Initial Value
Selects the channel for A/D conversion.
0
1
ADCHS0
ADCHS1
ADCHS1
ADCHS0
Channel
1
1
AD0
1
0
AD1
0
1
AD2
0
0
AD3
1
1
2
ADSTAT
Indicates the operation status of A/D conversion.
1: A/D conversion is completed or is not in process.
0: A/D conversion has started or is in process.
1
3
ADTC
Selects the A/D conversion rate.
1: 15 machine cycles
0: 27 machine cycles
1
ADDH
bit
X 'A'
R/W
Name
Description
Initial Value
Selects P20 to P23 or AD0 to AD3 signals.
0
PTAD0
1
PTA
D0
1
2
PTAD1
PTA
D1
Setting
PTA
D2
0
0
0
Selects AD0 to AD3
1
0
0
Selects AD0 to AD2 and P23
0
1
0
Selects AD0, AD1, P22 and P23
1
1
0
Selects AD0 and P21 to P23
*
*
1
Selects P20 to P23
1
PTAD2
1
*: Don't care
3
ADHAL
Disconnects the reference power supply in order to
save the current consumption of the A/D converter.
1: A/D converter not in use.
0: A/D converter in use.
1
Note) When the A/D converter is in use, set the analog data input pins to analog data
input only mode. On that occasion, the pin which selects AD cannot be
connented to a pull-up resister. To set the LSI to low-current consumption mode
(i.e., STOP or HALT mode), set the ADHALT bit to 1.
- 43 -
(1) A/D Buffer
The following A/D buffers are used for storing the results of A/D conversion.
ADDL
bit
0
1
X 'B'
R
Name
ADD0
ADD1
Description
A/D conversion result
Bits 1 and 0 (LSB)
2
Unused
3
Unused
ADDM
bit
0
1
2
3
ADDH
bit
0
1
2
3
X 'C'
ADD2
ADD3
ADD4
ADD5
Description
A/D conversion result
Bits 5 to 2
Initial Value
Indifinite
R
Name
ADD6
ADD7
ADD8
ADD9
Indifinite
R
Name
X 'D'
Initial Value
Description
A/D conversion result
Bits 9 (MSB) to 6
- 44 -
Initial Value
Indifinite
3.2.6 Interrupt Selection Registers
The interrupt selection registers are used for IRQ interrupt source selection, or the ON/OFF
setting of each interrupt mask.
IRQC
bit
0
X 'F'
R/W
Name
IRQSE0
Description
IRQ interrupt source selection. See Note 1.
IRQSE0
1
IRQSE1
2
MaskIR
3
IRQEC
Initial Value
1
IRQSE1
0
0
Time base (See Note 2.)
0
1
Timer
1
0
ACZ (See Notes 4 and 5.)
1
1
IRQ
(See Note 3.)
1
(See Note 5.)
Selects the IRQ interrupt masking.
1: Mask
0: Permit
Selects the IRQ interrupt edge. (See Note 1.)
Refer to the following chart.
1
1
Selection of IRQ enabled edge
IRQEC set
value
1
0
IRQ enabled
edge
Note 1) Select the IRQ interrupt source or enabled edge after masking IRQ interrupt
function with the MASKIR bit.
Note 2) Time base interrupt occurs at the rising or falling edge of buzzer output.
Note 3) Timer interrupt occurs in synchronization with a timer overflow. Therefore, no edge
selection is enabled.
Note 4) If ACZ interrupt is selected, IRQ or P31 input is disabled.
ACZ interrupt occurs at the rising or falling edge of AC zero voltage detection
output.
ACZ interrupt uses an edge trigger circuit. Therefore, more than one interrupt may
occur due to chattering if the rising or falling time of the input signal is comparative
long.
If the AC zero-cross is used, write an appropriate program for masking for the
prevention of detection errors.
Note 5) The P31 output is set to Hi-Z if the IRQ or ACZ input is used as an IRQ interrupt
source.
- 45 -
IRQSE1
P31/IRQ/ACZ
M
P
X
IRQ
interrupt
Mask
Edge
selection
M
P
X
P30/SYNC/TCI
M
P
X
MASKIR
IRQEC
AC zero
voltage
detection
Timer
IRQSE0
Time base
IRQSE1
P32/TCO/BZ
3.3 Available Instructions
The following instructions can access the I/O registers.
Addresses
Available Instructions
X '0' to X '4'
X '7' to X 'A', X 'F'
IN, OUT
X 'B' to X 'D'
IN
X '5' to X '6'
See Note 1.
IN, OUT
Note) The initial input of a register is indefinite and so is the input of the register while
the LSI is in operation, if the register is not set up.
Note 1) The binary counter value is read when the IN instruction is executed.
- 46 -
3.4 Pin Structure Diagram
The following shows the pin structure of this LSI.
* I / O P in
P u ll-u p r e s i s t o r
P -ch
M a sk o p tion
RST
RST
M a sk o p tio n
A u to reset output
R e s e t v o l t a g e : 2 . 0 V to 4 . 0 V
Auto reset output
R e s e t v o l t a g e : 1 . 2 V to 2 . 6 V
N -ch
M a sk o p tion
W a t c h d o g t im e r o u t p u t
* I/O P i n s
H i-Z c o n t r o l
N -ch
O u t p u t d a ta
P00
to
P03
D a ta b u s
I n p u t i n s t r u c tio n
- 47 -
* I/O P ins
M ask option
P u l l - u p r e s i st o r
P -ch
M ask option
P -c h
P10
to
H i-Z c o n tro l
P13
N -c h
O u t p u t d a ta
D a ta b u s
In p u t instructio n
* I/O P ins
P ull-u p
r e s i st o r
M a s k o p tio n
M ask option
P -ch
P -c h
H i-Z c o n tro l
P20
/A D 0
to
N -c h
O u t p u t d ata
P23
/A D 3
P T A D 0 to 2
D a ta b u s
I n p u t i n s tructio n
A /D in p u t d a ta
- 48 -
* I / O P in
P u ll-u p
resistor
M a sk o p tion
P -ch
M a sk o p tion
P -ch
H i-Z c o n t r o l
P30
CLK0
/S Y N C
RST
N -ch
/T C I
M
P
X
S0
O utput data
TCI
D a ta b u s
Inp ut instruction
* I / O P in
P u ll- u p
resistor
M a sk o p tio n
M a sk o p tio n
P -ch
P -ch
H i - Z c o n tr o l
N -ch
O u t p u t d a ta
IR Q S E 0
P31
ACZ
A C z ero voltage
detection circuit
/I R Q
( I n t e r r u p t)
/A C Z
IR Q
( I n t e r r u p t)
IR Q S E 1
D a ta b u s
IR Q S E 1
IR Q S E 0
Inp u t instruction
- 49 -
IR Q S E 0
* I/O P in
M a s k o p t io n
P-ch
P u ll-u p
M a sk o p tio n
resisto r
P -c h
H i- Z c o n t r o l
P32
N -c h
BZOE
/T C O
TCOE
/B Z
M
P
X
M
P
X
BZ
O u t p u t d a ta
TCO
D a ta b u s
I n p u t in s tru ctio n
- 50 -
CHAPTER 4 INTERRUPT FUNCTIONS
4.1 Interrupt Control
The interrupt control block breaks the flow of the running program with an interrupt request,
saves the program status existing at break time to stack area, and controls the start of
execution of an interrupt servicing program commensurate with each interrupt source. The user
can use 4 kinds of interrupt sources except reset (These sources share the same first servicing
address.) (See Fig. 4.1.1). With a JMP instruction, the first address of the interrupt servicing
program can be freely specified from an interrupt start address (See Table 4.1.1).
An interrupt is received by the interrupt control block only when both the interrupt request flag
(IF) and interrupt enable flag (IE) are set.
When an interrupt is received, the interrupt serving program starts running.
Table 4.1.2 shows an example of the interrupt enable/disable program.
The IRQ selects the source of interrupt and permits or prohibits the source through the IRQC
(X'F').
Interrupt
Maskable
Interrupt
(With IE Flag)
Mack
Circuit
Interrupt
Edge
Control
Circuit
M
P
X
IRQ
M
IRQ
ACZ
P
X
M
P
X
Timer
Time Base
Fig. 4.1.1 Interrupt Sources
Table 4.1.1 Interrupt Servicing Program Start Address
Interrupt Source
(CPU reset)
External signal interrupt
Vector Address
(RESET)
(IRQ)
Priority
000
00A
High
Table 4.1.2 Example of Interrupt Setting Program
Setting Method
IRQ
Enable
EDI
0,4
- 51 -
Disable
EDI
4,0
4.2 Interrupt Receiving Operation
When an interrupt source such as timer is generated, the program is branched to the top of the
interrupt servicing program to receive an interrupt (See Fig. 4.2.1). When an interrupt source
is generated, the interrupt request flag (IF) is set.
When this is done, if the interrupt enable flag (IE) has been set, the generated interrupt source
obtains the right to be received.
Interrupt reception functions similarly to when a CALL instruction is executed. In the interrupt
reception cycle, the program counter (PC) and flag status (FS) are written (pushed) in the
stack area RAM.
Next, the program counter (PC) is set in the specified interrupt servicing program start address.
Then, the IE and IF are reset.
As desired, use the JMP instruction from the interrupt servicing program start address to run
each interrupt servicing program.
Main Program 10
Main Program 11
Start of Interrupt Servicing Program
Note 1)
Main Program 12
Interrupt Program 1
Interrupt Program 2
Note 2)
RETI
Main Program 13
End of Interrupt Servicing Program
Main Program 14
Main Program 15
Note 1) The interrupt program start address is set in the
program counter (PC), and the PC and flag status
(FS) values for the main program are pushed in
the stack area.
Note 2) The PC and FS values in the stack area are
popped.
Fig. 4.2.1 Interrupt Operation
The following shows an example of the interrupt servicing program.
Example) In case of IRQ
Absolute Address
000A JMP
LABEL: PSHXY
PSHEA
LABEL
Interrupt Servicing Program
POPEA
POPXY
EDI 0, 4
RETI
- 53 -
4.3 Interrupt Return Operation
A RETI (Return from Interrupt) instruction is used to return from execution of the interrupt
servicing program to the original program. The RETI instruction functions similarly to a RET
(Return) instruction which is used to return from a subroutine to a main routine.
That is, by executing the RETI instruction, the values of the program counter (PC) and flag
status (FS) just before an occurrence of an interrupt, pushed in the stack area RAM, are
returned to the PC and FS, and the program flow existing before interrupt generation is restored.
It takes 4 machine cycles to start an interrupt servicing program after an interrupt source is
generated. When there is an EDI instruction in the top address of the interrupt servicing
program, the interrupt is disabled for 3 to 4 machine cycles.
4.4 Stack upon Interrupt
When receiving an interrupt or returning from it, the stack level changes by how much the
program counter (PC) and flag status (FS) are pushed or popped.
In the case of a normal interrupt, the 4-word stack area RAM is required because the PC and
FS are pushed. Therefore, the value of the stack pointer (SP) is decremented by 4 upon
receiving the interrupt and incremented by 4 upon returning from the interrupt (See Fig. 4.4.1).
A return from interrupt is done by executing the RETI instruction. The RETI instruction restores
the original values of the FS and PC which have been pushed in the stack area RAM during the
interrupt reception cycle. The SP is incremented after reading out the values in the RAM
indicated by SP.
Address
61-60
Address
61-60
7B-7A
7B-7A
7D-7C
PCm
PCl
7D-7C
7F-7E
FS
PCh
7F-7E
When Servicing the Interrupt
When Returning from the Interrupt
: Address value indicated by the stack pointer (SP)
Fig. 4.4.1 Stack Pointer Operation
- 54 -
CHAPTER 5 TIMER FUNCTION
As shown in Fig. 5.1.1, this LSI incorporates an 8-bit timer/counter and operates in timer
mode or event count mode.
To start the timer, execute the OUT instruction to set the desired time value in the timer
buffer (TB) first and set the clock source in the timer control register (TM) next. Then the
value in the timer buffer (TB) is transferred to the binary counter (BC) and the clock selected
with the TM starts counting.
When the BC overflows, the interrupt reception flag (IF) is set and the TB value is set again
in the BC simultaneously, provided that the interrupt source of IRQ has been selected for the
timer with software with the mask option cleared. The BC repeats the above-mentioned
sequence unless the control mode is changed.
1. Timer Mode
In timer mode, one of the following clocks is selected by the TM and the BC uses the one
selected by the TM to start counting.
(1) 1/2 fsys (fsys: internal clock)
(2) 1/214 of OSC1 pin input pulse frequency
2. Event Count Mode
In event count mode, one of the following clocks is selected by the TM and the BC
uses the one selected by the TM to start counting.
(1) TCI pin input pulse as it is
(2) 1/26 of TCI pin input pulse frequency
Refer to the specifications of external clock input 3 for the waveform of TCI input.
P30 output is set to Hi-Z in event count mode with TCI input selected.
Note) The BC value cannot be read at a single time but in the order of the upper bits and
lower bits. Pay utmost attention to and take into consideration the timing that the BC
value changes while reading it.
- 55 -
5(6(7'(/$<
IV\V
&/.
;
3
0
&/.
;
&LUFXLW
$&= LQWHUUXSW UHTXHVW
,QWHUUXSW
&RQWURO
3RUW LQWHUUXSW UHTXHVW
2XWSXW
%X]]HU
;
7&2(
%=2(
3RUW 2XWSXW
3
7LPH EDVH LQWHUUXSW UHTXHVW
5
3
&/.
;
3
;
0
3
0
ELW %&
70(1
0
7%
:
0
)LJ 7LPHU )XQFWLRQ 2SHUDWLRQ %ORFN 'LDJUDP
IRVF
7&,
%XV VKDUHG ZLWK $GGUHVV DQG 'DWD
25
,1
,54&25(
+,= &/.
3RUW 2XWSXW
+,=
36<1&7&,
37&2%=
3
1) The following shows the bit allocation of the timer control register (TM).
TM
X '7' R/W
bit
0
1
Name
TMEN
TCOE
Description
Initial Value
Specifies timer operation.
1: The timer stops
0: The timer operates
1
Selects P32, TCO or BZ.
(Selects port I/O, timer output or buzzer output.)
1: Selects P32/BZ (port I/O or buzzer output)
0: Selects TCO (timer output)
Note) Select P32 or BZ with bit 1 (BZOE) of the
X '8' port register.
1
Selects the clock of timer.
2
CLK0
CLK0
CLK1
Clock Source
0
0
TCI input/26
See Note 1.
0
1
TCI input
1
See Note 1.
3
CLK1
1
1
0
fosc/214
1
1
fsys /2
See Notes 2 and 3.
Note 1) The P30/SYNC/TCI output is set to Hi-Z.
Note 2) fsys = 1/8 fosc.
Note 3) If fsys/2 is selected, the timer stops when the LSI is in HALT mode.
2) Timer buffer (TB) setting method
A timer buffer (TB) set value is obtained by the following expression.
Set value = 256 - Desired counts
(1 < Desired counts < 256)
Example 1) Timer buffer (TB) set value when counting 100 times
Set value = 256 - 100
= 156
= 9C (hex)
- 57 -
5.1 Description of Timer Function
Application
Mode
Timer Mode
Registers
CLK1
TB Set
Value
Output Frequency
CLK0
Timer mode
(fosc=4.19 MHz)
0
1
80
C0
E0
F0
1
2
4
8
Hz(1s)
Hz(0.5 s)
Hz(0.25 s)
Hz(0.125 s)
Event mode
(ftci=32.768 kHz)
0
0
00
80
C0
E0
1
2
4
8
Hz
Hz
Hz
Hz
Timer mode
(fosc=4.19 MHz)
1
1
80
C0
1.024 kHz
2.048 kHz
Timer mode
(fosc=4.0 MHz)
1
1
80
C0
0.976 kHz
1.953 kHz
Event mode
(ftci=32.768 kHz)
1
0
F0
F8
1.024 kHz
2.048 kHz
Timer mode
(fosc=4.0 MHz)
1
1
Clock
BZ
Table 7.2.1 Melody frequencies
(example)
Sound
n*
Melody
C7 Do
C7
D7 Re
D7
E7 Mi
F7 Fa
F7
G7 So
G7
A7 La
A7
B7 Si
C8 Do
60
57
54
51
48
45
43
40
38
36
34
32
30
TB
set
value
Output
frequency
(Hz)
Tempera-
C4
C7
CA
CD
D0
D3
D5
D8
DA
DC
DE
E0
E2
2083.3
2192.9
2314.8
2451
2604.2
2777.8
2907
3125
3289.5
3472.5
3676.5
3906.3
4166.7
2093
2217
2349.3
2489
2637
2793.8
2960
3136
3322
3520
3729
3351.1
4186
ment scale
(Hz)
*n = number of desired counts
- 58 -
CHAPTER 6 TIME BASE FUNCTION
As shown in Fig. 6.1.1, this LSI has a function to output clock signals that are generated by
dividing the frequency of oscillation source to the pin or accumulator. Furthermore, by
selecting time base interrupt with the IRQC in software control, the output can be used as an
interrupt source. Right after the P32/TCO/BZ pin is set to buzzer output, the initial buzzer
output value, the period until the first output signal's rising edge, or the period until the
signal's falling edge is indefinite or not guaranteed.
The following table shows the bit allocations of the time base control register (TMBC).
TMBC
X '8' R/W (Bit 0 is read-only)
bit
Name
0
TMB
1
BZOE
Description
When the IN instruction is executed, the clock value,
which is obtained by dividing the frequency of
oscillation source by the BZSEL0 signal and BZSEL1
signal, is set in bit 0 of the accumulator.
Selects P32, TCO or BZ.
1: Selects P32
0: Selects BZ (buzzer output)
Note) The setting in the BZOE bit is disabled if
TCO output is selected with the TCOE bit.
Initial Value
Indefinite
1
Selects clock output to be provided to the buzzer and
time base.
2
BZSEL0
BZSEL0
3
BZSEL1
BZSEL1
Clock Source
1
1
fosc/212
1
0
fosc/211
0
1
fosc/210
0
0
fosc/29
- 59 -
1
1
CHAPTER 7 A/D CONVERSION FUNCTION
7.1 Overview
This LSI incorporates a 10-bit A/D converter and sample-and-hold circuit.
7.2 A/D Conversion Function
Fig. 7.2.1 shows a block diagram of the A/D converter. The analog input between the VDD and
VSS voltages are divided by 1024 to convert the analog input into digital values. Therefore, VIN
voltage input into the P20/AD0 to P23/AD3 pins is converted into digital values for X '3FF' to
X '000' on condition that the voltage VIN is within a range between the voltages VSS and VDD.
(VDD > VIN > VSS)
A/D conversion starts with channel selection, followed by the start control of A/D conversion
through the A/D control register (ADC).
The A/D conversion result is set in the A/D buffer (ADD).
In A/D conversion operation, sampling is performed for the Ts period. Then if the conversion
result with its MSB set to 1 is larger than 1/2 VDD, (1/2 + 1/4) VDD is compared with the
voltage VIN with both MSB and the second most significant bit set to 1. If the voltage VIN is
smaller than 1/2 VDD, 1/4 VDD is compared with the voltage VIN with MSB set to 0 and the
second most significant bit set to 1. Value comparison with the voltage VIN is repeated 10
times in sequence in this way to complete A/D conversion.
Provided that the A/D conversion reference clock cycle, TAD, is 1 ms at 8 MHz (i.e., 1/8 fosc),
the whole A/D conversion period is 15 µs, that is, 15×TAD (1 µs).
If the impedance of the analog signal to be converted is high, drop the conversion speed by
setting the ADTC of the A/D control register (ADCH) to zero. In that case, it takes 27 µs (i.e.,
27×TAD) to complete A/D conversion, provided that the TAD is 1 ms at 8 MHz (i.e., 1/8 fosc).
Refer to Fig. 7.2.2.
Bus shared with Address and Data
A/D Control Register ADCH, ADCL
2 bits
A/D Control Circuit
VDD
P23/AD3
A/D
Input
4-ch
MPX
10-bit
A/D Buffer
A/D
Comparator
ADDH
ADDM
ADDL
P20/AD0
VSS
Fig. 7.2.1 A/D Conversion Control Circuit Block Diagram
- 61 -
TAD
TAD
1 to 5
1 to 17
6
18
15
27
(ADTC=1)
(ADTC=0)
ADSTAT
A/D conversion
Start
Ts
Sampling
Completes
Hold
bp9 comparison
bp9
decided
bp0 comparison
bp1
decided
bp0
decided
Ts = 5 × TAD (i.e., 1.0 µs at 8 MHz = 1/8 fosc) : ADTC = 1
Ts = 17 × TAD (i.e., 1.0 µs at 8 MHz = 1/8 fosc) : ADTC = 0
Fig. 7.2.2 A/D Conversion Timing Chart
As shown in Fig. 7.2.3, this A/D converter is of capacitor array construction. Right after the
start of the conversion of an analog signal, a change in the voltage of the analog signal may
result if the impedance of the analog signal to be converted is high.
In order to ensure the accuracy of A/D conversion, be sure to use the microcomputer under
the following conditions, otherwise proper A/D conversion cannot be guaranteed.
(1) The recommendable impedance of the analog signal to be converted is 100 kΩ maximum
and the signal is input into the A/D input pin through a minimum capacitance of 500 pF.
One of the following condition is also required according to the impedance.
100 k W max.
: A minimum conversion time of 27 µs is required.
100 kΩ to 400 kΩ : A minimum conversion time of 50 µs is required.
400 k Ω min.
: Input the analog signal through a capacitor of minimum 1000 pF.
(2) For the prevention of the fluctuation of the power supply voltage during A/D conversion,
do not change the output level of the microcomputer to low from high or vice versa or turn
the peripheral load circuit on or off.
During sampling
ON
AD3
AD0
Channel selection
Fig. 7.2.3 A/D Input Equivalent Circuit
- 62 -
7.3 Functional Registers of A/D Converter
The A/D converter incorporates the A/D control register (ADC) and A/D buffer (ADD). The
ADC controls A/D conversion and the ADD stores the result of A/D conversion.
7.4 A/D Buffer
The A/D buffer is a 4-bit, read-only register that is allocated to the addresses X 'B', X 'C' and
X 'D' in the RAM.
ADDL
bit
0
1
X 'B'
R
Name
ADD0
ADD1
Description
A/D conversion result
Bits 1 and 0 (LSB)
2
Unused
3
Unused
ADDM
bit
0
1
2
3
ADDH
bit
0
1
2
3
X 'C'
ADD2
ADD3
ADD4
ADD5
Description
A/D conversion result
Bits 5 to 2
Initial Value
Indifinite
R
Name
ADD6
ADD7
ADD8
ADD9
Indifinite
R
Name
X 'D'
Initial Value
Description
A/D conversion result
Bits 9 (MSB) to 6
- 63 -
Initial Value
Indifinite
7.5 A/D Control Register
This is a 4-bit read/write register that is allocated to the addresses X '9' and X 'A' of port
register.
ADCL
X '9'
R/W
bit
Name
Description
Initial Value
Selects the channel for A/D conversion.
0
1
ADCHS0
ADCHS1
2
ADSTAT
3
ADTC
ADCH
bit
ADCHS0
X 'A'
ADCHS1
Channel
1
1
AD0
1
0
AD1
0
1
AD2
0
0
AD3
1
1
Indicates the operation status of A/D conversion.
1: A/D conversion is completed or is not in process.
0: A/D conversion has started or is in process.
1
Selects the A/D conversion rate.
1: 15 machine cycles
0: 27 machine cycles
1
R/W
Name
Description
Initial Value
Selects P20 to P23 or AD0 to AD3 signals.
PTAD0
0
PTAD1
1
Setting
PTAD0
PTAD1
PTAD2
0
0
0
Selects AD0 to AD3
1
0
0
Selects AD0 to AD2 and P23
0
1
0
Selects AD0, AD1, P22 and P23
1
1
0
Selects AD0 and P21 to P23
*
*
1
Selects P20 to P23
1
1
PTAD2
2
1
* : Don't care
3
ADHAL
Disconnects the reference power supply in order to save the
current consumption of the A/D converter.
1: A/D converter not in use.
0: A/D converter in use.
1
Note) When the A/D converter is in use, set the analog data input pins to analog data
input only mode. On that occasion, the pin which selects AD cannot be connented
to a pull-up resister. To set the LSI to low-current consumption mode (i.e., STOP
or HALT mode), set the ADHALT bit to 1.
- 64 -
CHAPTER 8 AC ZERO VOLTAGE DETECTION FUNCTION
The ACZ pin is the input pin of the AC zero voltage detection circuit.
The AC zero voltage detection circuit usually has low-level output, but when the input level is
middle, the circuit has high-level output.
The ACZ input signal shares the pin with the P31 and IRQ interrupt input signals.
It is possible to select the output of the AC zero voltage detection circuit, timer output, time
base output or the IRQ pin as an IRQ interrupt source with software. Refer to Interrupt
Selection Register for details.
An input clamp diode is connected to the ACZ input circuit.
IRQSE1
M
P
X
AC Zero Voltage
Detection Circuit
ACZ
IRQSE0
M
P
X
IRQSE1, IRQSE0
Edge
Selection
Circuit
IRQ
Interrupt
Control
Circuit
Timer
and Time
Base
Interrupt
P31 Input Circuit
IRQSE1, IRQSE0
Fig. 8.1.1 AC Zero Voltage Detection Circuit Block Diagram
trs
tfs
ACZ input
VDD
VSL
VSH
VSL
VSS
AC Zero Voltage
Detection Circuit
Output
Fig. 8.1.2 Timing Chart
- 65 -
CHAPTER 9 WATCHDOG TIMER FUNCTION
This LSI has a function to divide the frequency of oscillation source and turns on the low-level
output of the reset pin when an overflow occurs. This function is selectable as a mask option.
The watchdog timer starts when the internal reset status of the CPU is cleared while the LSI
awaits the stabilization of OSC oscillation after the LSI is turned on or reset.
By setting the WDEN bit of the CPU control register (CPUM X '4') to 1 before an overflow of
the divide-by-26 counter, the divide-by-26 counter is cleared. After clearing, the counter starts
operating again.
The counter of the watchdog timer overflows within a range between 32256 and 32768
machine cycles after the counter is cleared.
Internal Circuit
Mask Option
1/2
fosc/211
1/26
Overflow
O
R
RST
WDEN
Auto Reset
Mask Option
Fig. 9.1.1 Watchdog Timer
CPUM
X '4'
bit
Name
0
HIZC
1
WDEN
2
3
R/W(Bit 1 is write-only.)
Description
Initial Value
Sets the Hi-Z of all output pins. (See Note 1.)
1
Clears or enables the watchdog timer. (See Note 2.)
1: Cleared
0: Enabled
0
Always set to 1.
1
Not used.
Note 1) The SYNC pin and the pull-up selection pins are excluded from Hi-Z control.
Note 2) The watchdog timer restarts after the watchdog timer is cleared with the WDEN
bit set to 1, provided that the watchdog timer is selected as a mask option.
- 66 -
INSTRUCTIONS LIST
Transfer Instructions
:Logical Sum (OR)
Instruction
InstructionCode
(HEX)
L
LD
LX
17
1F,da
44
45
Fn
21
57
53,da
54
55
22
47
Cn
68
**
LY
LI
LICY
*
ST
STD
**
STX
STY
STICY *
EX
LYI
PSHEA
":Exclusive Logical Sum (XOR)
Affected
Flag
ZF
ZF
ZF
ZF
Operation
ZF
A
M(X,Y)
A
M(da)
A
X
A
Y
A
n
A
M(X,Y) ; Y
Y+1
M(X,Y)
A
M(da)
A
X
A
Y
A
M(X,Y)
A;Y
Y+1
A
M(X,Y)
Y
n
SP
SP - 1;M(SP)
A
SP
SP - 1
SP
SP + 1
A
M(SP);SP
SP + 1
SP
SP - 1;M(SP)
X
SP
SP - 1;M(SP)
Y
Y
M(SP) ; SP
SP + 1
X
M(SP) ; SP
SP + 1
ZF
POPEA
6C
PSHXY
69
POPXY
6D
AI
AC
SB
O
X
N
C
CI
ICM
DCM
ICY
DCY
CPL
Dn
11
13
14
15
16
0F
En
60
64
20
24
02
CF,ZF
CF,ZF
CF,ZF
ZF
ZF
ZF
CF,ZF
CF,ZF
CF,ZF
CF,ZF
ZF
ZF
ZF
A
A+n
A
A + M(X,Y) + CF
A
A - M(X,Y) - CF
A
A M(X,Y)
A
A "M(X,Y)
A
A M(X,Y)
A
M(X,Y)
(A unchanged)
A
n
(A unchanged)
M(X,Y)
M(X,Y) + 1
M(X,Y)
M(X,Y) - 1
Y
Y+1
Y
Y-1
A
A
08
3(8+b),da
3(C+b),da
CF,ZF
ZF
ZF
C
M(da;b)
M(da;b)
- 68 -
<
ROL
RBMD **
SBMD **
>
Operational Instruction
>
<
:Logical Product (AND)
A
0
1
73,pn
72,pn
NOP
WI
RC
SC
JMP
EDI
**
**
00
4A
03
07
Ah,ml
5B,mn
CALL
**
9h,ml
RET
RETI
JBZ
*
*
**
34
35
7(8+b),ml
JBNZ
**
7(C+b),ml
JZ
**
6E,ml
JNZ
**
6A,ml
JC
**
6F,ml
JNC
**
6B,ml
CYIJ
**
Bn,ml
CF
CF
CF,ZF
ZF
Operation
A
PORT(p)
PORT(p)
A
CF
CF
PC
IE
n
0
1
hml
IE m
>
**
**
IN
OUT
Affected
Flag
<
Control Instructions
Instruction Code
(HEX)
< <
I/O Instructions
Instruction
n
n
SP
SP - 2
M(SP)
PC ; PC
hml
PC
M(SP) ; SP
SP + 2
CF/ZF/PC
M(SP) ; SP
SP + 2
if A(b) = 0 then PCm/l
ml
else PC
PC + 2
if A(b) = 1 then PCm/l
ml
else PC
PC + 2
if ZF = 1 then PCm/l
ml
else PC
PC + 2
if ZF = 0 then PCm/l
ml
else PC
PC + 2
if CF = 1 then PCm/l
ml
else PC
PC + 2
if CF = 0 then PCm/l
ml
else PC
PC + 2
if Y = n then PC
PC + 2
else PCm/l
ml
* 1-byte 2-cycle instruction (1 ROM byte used, 2.0-ms execution time (fosc=8 MHz,1/8 fosc))
** 2-byte 2-cycle instruction (2 ROM byte used, 2.0-ms execution time (fosc=8 MHz,1/8 fosc))
Other than * and **
1-byte 1-cycle instruction (1 ROM byte used, 1.0-ms execution time (fosc=8 MHz,1/8 fosc))
- 69 -
CHAPTER 11 PRODUCT WITH ON-CHIP EPROM
11.1 Overview
The MN15P0222 is a product incorporating the components of the MN150222 except for the
mask ROM, which is replaced with a 2-Kbyte EPROM (i.e., an electrically programmable
ROM), and two additional comparator systems. This EPROM is the same as the on-chip
EPROM of the MN150120. For the functions of the comparators, refer to the specifications
of the MN150120.
The on-chip EPROM has write and verify specifications conforming to Intel's 27C512. The
MN15P0222, however, consists of 20 pins. Therefore, the MN15P0222 cannot fully meet the
specifications of the 27C512, which has 28 pins. Therefore, the MN15P0222 incorporates an
address generation circuit to address indirectly with an external circuit mounted to a
dedicated adapter. In this method, a PROM writer (EPP) as an in-circuit emulator for the
PanaX1500 series or a general-purpose PROM writer can be used to write programs to the
EPROM. Due to the circuit configuration of the MN15P0222, however, no data can be
written to or read from the EPROM with direct addressing. Be aware that not all
general-purpose PROM writer models are available for writing data to or reading data from
the EPROM.
The MN15P0222-SOP in 20-pin SO package construction and the MN15P0222-SDP in
22-pin SDIL package construction are resin-sealed products. Each of them incorporates an
EPROM to which data can be written but the written data cannot be erased.
The PX-AP150222-SOC in 20-pin SO package construction and the PX-AP150222-SDC in
20-pin SDIL package construction are ceramic-sealed products. Each of them incorporates
an EPROM to which data can be written and the written data can be erased by applying
ultraviolet rays.
11.2 Operation of On-chip EPROM
By setting the CPU of the MN15P0222 to EPROM mode, the MN15P0222 stops functioning
as a microcomputer, and the on-chip EPROM is programmable.
Fig 11.2.1 shows the pin assignment in EPROM mode.
(1) Write
By applying 12.5 V to the OE/VPP pin and setting the CE pin to low level after setting the
supply voltage (VDD) to 6 V, the EPROM is set to program mode. Then the parallel 8-bit
data that is input from the data I/O pins D0 to D7 is written to the addresses A0 to A15
generated from the internal address circuit. Refer to Fig. 11.8.1 for the I/O timing in this
mode.
(2) Verify
The written data is output from the data I/O pins D0 to D7 by setting both the CE pin and
OE/VPP pin to low level. Then the contents of the data can be verified. Refer to Fig. 11.8.1
for the I/O timing in this mode.
The following table shows the status of each pin according to the mode.
Mode Pin
VDD
OE/VPP
CE
D0 to D7
A0 to A15
Write
+6 V
+12.5 V
VIL
Data In
Address In
Verify
+6 V
VIL
VIL
Data Out
Address In
Write/Verify inhibited
+6 V
+12.5 V
VIH
Hi-Z
Don't Care
Read
+5 V
VIL
VIL
Data Out
Address In
Output inhibited
+5 V
VIH
VIL
Hi-Z
Don't Care
Standby
+5 V
Don't Care
VIH
Hi-Z
Don't Care
- 70 -
VDD
External
Circuit
1 VDD
P32/TCO/BZ 20
AO
GND
2 OSC1
P31/IRQ/ACZ 19
GND
GND
3 OSC2
P30/SYNC/TCI 18
GND
GND
4 VSS
RST 17
GND
OE/VPP
5 P00
P23/AD3/COMP1-16
D7
ADCRST
6 P01
P22/AD2/COMP1+15
D6
CE
7 P02
P21/AD1/COMP0-14
D5
CLK
8 P03
P20/AD0/COMP0+13
D4
D0
9 P10
P13 12
D3
D1
10 P11
P12 11
D2
A0 to A15
20-Pin SO Package
VDD
External
Circuit
1 VDD
P32/TCO/BZ 22
AO
GND
2 OSC1
P31/IRQ/ACZ 21
GND
GND
3 OSC2
P30/SYNC/TCI 20
GND
OPEN
4 N.C.
RST 19
GND
GND
5 VSS
N.C. 18
OPEN
OE/VPP
6 P00
P23/AD3/COMP1-17
D7
ADCRST
7 P01
P22/AD2/COMP1+16
D6
CE
8 P02
P21/AD1/COMP0-15
D5
CLK
9 P03
P20/AD0/COMP0+14
D4
D0
10 P10
P13 13
D3
D1
11 P11
P12 12
D2
A0 to A15
22-Pin SDIL Package
Fig. 11.2.1 EPROM Mode Pin Assignment
- 71 -
11.3 EPROM Programmable Option
Mask options can be set in the addresses X 'FFF0' to X 'FFFF' of the on-chip EPROM of the
MN15P0222. Table 11.3.1 shows the addresses and corresponding options.
Table 11.3.1 Corresponding Options
Bit
7
6
5
4
3
2
1
0
Address
FFF0
FFF1
FFF2
P13
P12
P11
P10
OFF/ON
OFF/ON
OFF/ON
OFF/ON
P33
P32
P31
P30
P23
P22
P21
P20
OFF/ON
OFF/ON
OFF/ON
OFF/ON
OFF/ON
OFF/ON
OFF/ON
OFF/ON
P13
P12
P11
P10
PP/N-OD PP/N-OD PP/N-OD PP/N-OD
FFF3
P33
P32
P31
P30
P23
P22
P21
P20
Classification
Pull-up
resistor
ON/OFF
setting
Pin type
selection
(See
Note 1)
PP/N-OD PP/N-OD PP/N-OD PP/N-OD PP/N-OD PP/N-OD PP/N-OD PP/N-OD
FFF4
Model selection
(See Note 2)
MN150222
/MN150120
Watchdog Reset
timer
voltage
OFF/ON VRSTL1/
VRSTL2
Oscillator
frequency
High/Low
Others
Selection of options in the above table indicates the setting of each bit to 1 or 0. For example,
the P13 pull-up resistor OFF is selected with the bit 7 of address X 'FFF0' set to 1 and the
P13 pull-up resistor ON is selected with the bit set to 0.
*1: In the above table, "PP" stands for "push-pull" and "N-OD" stands for "N-ch open-drain."
*2: Make the following settings for model selection.
Both bits 5 and 4 of address X 'FFF4' set to 1: MN150222
Both bits 5 and 4 of address X 'FFF4' set to 0: MN150120
Note 1) Set bits to 1 if the bits are not set to any options.
Note 2) No options are available to the following items.
- Auto reset ON/OFF: Fixed to ON i.e., incorporated. (Select either VRSTL1 or VRSTL2.)
- RST pin pull-up resistor ON/OFF: Fixed to ON i.e., incorporated.
Note 3) Optional data set condition (Either one of the following conditions.)
- The VDD has exceeded the auto reset clearing voltage VRSTH1.
- The reset status is cleared with high-level input applied to the RST pin.
Note 4) While low-level input is applied to the RST pin, the oscillator frequency is set to high
regardless of the setting in bit 1 of address X 'FFF4'. Therefore, the low-frequency
oscillator may abnormally oscillate.
- 72 -
11.4 MN15P0222 Operational Precautions
(1) Unlike the 27C512, data can be written to the 2-Kbyte user area (addresses X '0000' to X
'07FF') and the EPROM optional area (addresses X 'FFF0 to X 'FFFF') of the on-chip
EPROM of the MN15P0222. Any other address area prohibits data from being written.
Therefore, when writing programs, the data in addresses X '0800' to X 'FFEF' must be X
'FF'.
FFFF
EPROM optional area
FFF0
Not used
0800
User area
0000
EPROM area
(2) Before writing programs with the PROM writer, be sure to check that the RPOM writer and
the CPU are connected properly through a socket adapter. If they are not connected
properly, the CPU may be damaged.
(3) Be aware that the MN15P0222 is partly different from the MN150222 and MN150120 in
electric characteristics.
(4) After programs are written to the PX-AP15P0222-SOC or PX-AP15P0222-SDC, in order to
prevent the data from being lost, put a little baffle seal on the glass portion on the upper
side of the package to shut off ultraviolet rays.
(5) It is recommendable to perform high-temperature storage screening after programs are
written until the LSI is mounted.
Program/Read
High-temperature storage
125° - 48H
Read
Mounting
(6) It is not possible to conduct data writing test on all bits of the MN15P0222-SOP or
MN15P0222-SDP due to the nature of the device. Therefore, the reliability of the data
storage of the device may not be 100% guaranteed.
- 73 -
11.6 Writing Data to On-chip EPROM
(1) Writing PROM Data with Standard PROM Writer
1) Write the PROM data to the PROM writer.
2) Mount the MN15P0222 to the PROM writer through a socket adapter.
3) Write the data in Intel 27C512 mode.
To operate the PROM writer, refer to the operation manual of the PROM writer.
(2) Writing PC Data with Standard PROM Writer
1) Connect the PC (personal computer) to the PROM writer through an RS-232C cable.
2) Open the conversion utility software EX2EF15.EXE and convert the executable file
XXX.EX into the Intel HEX format file XXX.HEX with the following command input.
EX2EF15
/i
/
XXX. EX
Option
Extension
(Note) The Intel HEX file is not generated but only an EF file is generated if no option is input.
The extension (.EF) means that the file is in the version 2.0 assembler format or an
older assembler format.
(Supplemental Information)
The following setting options are displayed when "EX2EF15" is input.
/e: Message output in English.
/h: No help menu output.
/S: No symbol output to the EF file.
/W: Executing with less memory capacity.
/I: Output in Intel HEX format.
3) Set the PROM writer to Intel 27C512 mode.
4) Clear all the data in the PROM writer (set to X 'FF').
5) Set the mode of the PROM writer so that data can be received in the Intel HEX format over
RS-232C.
6) Use the Copy command of the MS-DOS and transfer XXX.HEX from the PC to the PROM
writer.
7) Mount the MN15P0222 to the PROM writer through a socket adapter.
8) Write the data in Intel 27C512 mode.
Refer to the operation manual of the PROM writer for details.
- 75 -
Table 11.6.1 PROM Writer Evaluation
Manufacturer
Product name
Device type
Resul
t
Conditions
MATSUSHITA
ELECTRONICS
CORPORATION
EPP
Intel
Fast12.5V
OK
Exclusive software
(EPP222.EXE) used
Data I/O
Corporation
2900
Intel 27C512
OK
3900
Intel 27C512
OK
Connection test
Continuity check = No
Electronic signature read
Compare electric ID = No
LabSite
Intel 27C512
OK
PSX500
Intel 27C512
OK
Minato
M1890A/OU910
E610(27512)
Electronics Inc.
M1892/TYPE-9132A E610(27512)
OK
AVAL DATA
Corporation
OK
M1930/SU3000
E610(27512)
OK
PKW-1100+RX1
Intel 27C512
NG
PKW-3100+ADP. B Intel 27C512
NG
PKW-5100+GX1
OK
Intel 27C512
- 76 -
Contact test
Device test = No
Electronic signature read
Electric ID test = No
Verify mode (Normal setting)
11.7 Difference between MN15P0222 and MN150222 or MN150120
Parameter
MN15P0222
ROM
2048 × 8 bits
ROM
96 × 4 bits
Operating
ambient
tempertaure
MN150222/MN150120
Remarks
2048 × 8 bits/1024 × 8 bits
96 × 4 bits/64 × 4 bits
-20 °C to +70 °C
-40 °C to +85 °C
Operating surpply
voltage
Refer to B1 of Chapter 11.8.
Refer to B1 of Chapter 1.7.
See Note 1)
Operating supply
current
Refer to C1 to C4 of
Chapter 11.8.
Refer to C1 to C4 of
Chapter 1.7.
See Note 2)
Refer to A5 and C7 of
Chapter 11.8.
Refer to A5 and C7 of
Chapter 1.7.
Refer to B5 of Chapter 11.8.
Refer to B5 of Chapter 1.7.
P00
Auto reset voltage
level
A/D conversion
relative accuracy
Option
±6
Shared with
VPP pin.
±3
EPROM option
(Refer to Chapter 11.4.)
Mask option
(Refer to check list.)
- For latch-up prevention, insert a bypass capacitor that has a minimum capacitance of 680
pF between the MN15P0222's power supply and ground pins.
- Evaluate the oscillation and EMC (electro-magnetic compatibility) noise characteristics of
each model individually because they may change according to the mask pattern layout.
Note 1) The minimum guaranteed operating voltage of the MN15P0222 is 2.35 V.
Note 2) The current consumption of the MN15P0222 is a little higher than that of the
MN150222 or MN150120.
- 77 -
11.8 Electrical Characteristics (See Note 1.)
Type
MOS LSI
Function
CMOS 4-bit single-chip microcomputer
A. Absolute Maximum Ratings
Parameter
Ta = 25 °C, VSS = 0V
Symbol
Rating
Unit
A1
Supply voltage
(See Note 2)
VDD
-0.3 to +7.0
V
A2
Input clamp current
(P31/IRQ/ACZ)
IC
-0.5 to +0.5
mA
A3
Input pin voltage
VI
A4
Output pin voltage
VO
A5
High-current output
pin voltage
VOH
A6
I/O pin voltage
VIO
A7
Peak output current
(Other than P0)
IOH(Peak)
IOL(Peak)
-10
20
mA
A8
Peak output current
(P0)
IOL(Peak)
40
mA
A9
Average output
current (See Note 3.)
(Other than P0)
IOH(avg)
IOL(avg)
-2
10
mA
A10
Average output
current (See Note 3.)
(P0)
IOL(avg)
15
mA
A11
Power dissipation
PD
See Note 4.
A12
Operating ambient
temperature
Topr
-20 to +70
°C
A13
Storage temperature
Tstg
-55 to +125
°C
-0.3 to VDD +0.3
* Not applicable to
P31/IRQ/ACZ
V
-0.3 to VDD +0.3
V
-0.3 to +7.0
* Not applicable to P00
-0.3 to VDD +0.3
V
V
mW
Note 1) Those electrical characteristics are reference values. For details, refer to the
Product Standards.
Note 2) To prevent latch-up, connect one or more 680 pF or larger bypass capacitors
between the power supply pins and ground.
Note 3) Applied to any 100ms period.
Make sure that the total output current value of all output pins is 30 mA or less
for 20-pin SOP and 50 mA or less for 22-pin SDIP.
Note 4) 22-pin SDIP: PD = 350 mW
20-pin SOP : PD = 180 mW
- 78 -
B. Operating Conditions
Ta = -20 °C to +70 °C, VDD = 2.35 V to 5.5 V (VRSTL1 to 5.5 V), VSS = 0 V
See Note.
Limits
Parameter
B1
Supply
voltage
Symbol
Conditions
Unit
min
typ
max
4.5
5.0
5.5
VDD1
Machine cycle: 1.0 ms
High-speed oscillation mode
VDD2
Machine cycle: 4.0 ms
2.35
High-speed oscillation mode See
with auto reset
Note 2)
(Standard VDD = 3 V)
5.5
VDD3
Machine cycle: 4.0 ms
VRSTL1
High-speed oscillation mode
with auto reset
(Standard VDD = 5V)
5.5
VDD4
Machine cycle: 64.0 ms
Low-speed oscillation mode
with auto reset
(Standard VDD = 3V)
5.5
VDD5
Machine cycle: 64.0 ms
Low-speed oscillation mode
with auto reset
(Standard VDD = 5 V)
V
2.35
See
Note 2)
VRSTL1
5.5
Note 1) The VRSTL1 voltage refers to the supply voltage that is detected to reset the LSI,
which is applied if the auto reset voltage is set to a standard VDD of 5 V as an
EPROM option.
Note 2) The product incorporates an auto reset function that is always available. If the
operation voltage is comparatively low, set the auto reset voltage to a standard VDD
of 3 V as an EPROM option. In that case, however, the auto reset function may be
activated regardless of the minimum guaranteed voltage of VDD (i.e., 2.35 V) and
the microcomputer may be reset.
Auto Reset Circuit 1
B2
Voltage
detection level
VRSTH1
3.1
VRSTL1
2.0
3.0
0.05
0.1
4.0
V
Fig. 1
B3
Hysteresis width
B4
Supply voltage
change rate
VH
D t/D V
1.00
ms/V
* The above values are applied if the auto reset voltage is set to a standard VDD of 5 V as
an EPROM option.
- 79 -
Auto Reset Circuit 2
B5
Voltage
detection level
VRSTH2
2.4
VRSTL2
1.5
2.2
VH
0.05
0.1
D t/D V
1.00
2.6
V
Fig. 1
B6
Hysteresis width
B7
Supply voltage
change rate
ms/V
* The above values are applied if the auto reset voltage is set to a standard VDD of 3 V
as an EPROM option.
Note ) The guaranteed operating VDD range of the product is between 2.35 V and 5.50 V.
Therefore, the microcomputer may be out of control before the reset function is
activated in the above case.
- 80 -
Operating Speed
Ta = -20 °C to +70 °C, VDD = 2.35 V to 5.5 V (VRSTL1 to 5.5 V), VSS = 0 V
Limits
Parameter
Symbol
Conditions
Unit
min
tc1
B8
Instruction
execution
time
tc2
tc3
tc4
tc5
Oscillation
B9
VDD = 4.5 V to 5.5 V
High-speed oscillation mode
fosc = 8.0 MHz
typ
max
1.0
VDD = 2.35 V to 5.5 V
High-speed oscillation mode
fosc = 2.0MHz
Auto reset: ON
(Standard VDD = 3 V)
4.0
ms
VDD = VRSTL1 to 5.5 V
High-speed oscillation mode
fosc = 2.0 MHz
Auto reset: ON
(Standard VDD = 5 V)
4.0
VDD = 2.35 V to 5.5 V
Low-speed oscillation mode
fosc = 125 kHz
Auto reset: ON
(Standard VDD = 3 V)
64.0
VDD = VRSTL1 to 5.5 V
Low-speed oscillation mode
fosc = 125 kHz
Auto reset: ON
(Standard VDD = 5 V)
64.0
OSC1, OSC2 (See Note 1.) (Select the oscillation mode as an EPROM option.)
Oscillator
frequency
fXtal1
VDD = 2.35 V to 5.5 V
High-speed oscillation mode
0.5
8.0
MHz
fXtal2
VDD = 2.35 V to 5.5 V
Low-speed oscillation mode
32
125
kHz
* Regardless of EPROM optional settings in the product, the product is fixed at
high-frequency oscillation mode in the external RST status (i.e., the RST pin is at low
level), when there may be no oscillation.
Note 1)
OSC1
(Self-excited
oscillation circuit)
OSC2
C12
C11
VSS VSS
- Have the sample of the above circuits evaluated by oscillator manufacturer to
determine the external capacitance each of C11 and C12. In most cases, the
appropriate value of each capacitor seems to be approx. 30 pF.
- The LSI has an on-chip feedback resistor.
- 81 -
External Clock Input 1 OSC1 (High-speed oscillation mode as an EPROM option. OSC2 is open.)
Ta = -20 °C to +70 °C, VDD = 2.35 V to 5.5 V (VRSTL1 to 5.5 V), VSS = 0 V
Limits
Parameter
Symbol
Conditions
Unit
min
B10
B11
max
Clock frequency
fosc1
High-level pulse
width *
twh1
Low-level pulse
width *
twl1
Rise time
twr1
20
Fall time
twf1
20
Input voltage
high level
VIH1
Input voltage low
level
VIL1
External Clock Input 2
1.0
typ
Fig. 2
A clock duty ratio
should be 45 % to
55 %.
Fig. 2
8.0
MHz
40
40
ns
0.8VDD
VDD
VSS
0.2VDD
V
OSC1 (Low-speed oscillation mode as an EPROM option. OSC2 is open.)
Clock frequency
fosc1
32
High-level pulse
width *
twh1
Low-level pulse
width *
twl1
Rise time
twr1
20
Fall time
twf1
20
Input voltage
high level
VIH1
Input voltage low
level
VIL1
Fig. 2
A clock duty ratio
should be 45% to
55%.
Fig. 2
- 82 -
125
MHz
0.8
0.8
ns
0.8VDD
VDD
VSS
0.2VDD
V
External Clock Input 3 TCI
Ta = -20 °C to +70 °C, VDD = 2.35 V to 5.5 V (VRSTL1 to 5.5 V), VSS = 0 V
Limits
Parameter
Symbol
Conditions
Unit
min
B12
Clock frequency
High-level pulse
width *
typ
max
ftci
5
twh2
VDD = 2.35 V to
5.5 V
MHz
100
ns
Fig. 3
Low-level pulse
width *
twl2
Rise time
trcp
Fall time
tfcp
100
20
20
Fig. 3
Input voltage
high level
VIH2
Input voltage low
level
VIL2
0.8VDD
VDD
V
VSS
0.1VDD
VDD
VRSTH
VH
VRSTL
Approx. 1V
t
Operating mode
The status of Indefinite
general-purpose
Hi-Z
port
Indefinite
Hi-Z
VH : hysteresis width
"L"
The status
of RST pin
"L"
Reset cleared
Indefinite
Fig. 1 Auto Reset Voltage
- 83 -
Indefinite
0.8 VDD
0.2 VDD
twh1
twl1
twr1
twf1
fosc1
Fig. 2 OSC1 Timing Chart
0.8 VDD
0.1 VDD
twh2
twl2
trcp
tfcp
ftci
Fig. 3 TCI Timing Chart
- 84 -
C. Electrical Characteristics (DC Characteristics)
Ta = -20 °C to +70 °C, VDD = 2.35 V to 5.5 V (VRSTL1 to 5.5 V), VSS = 0 V
Limits
Parameter
Symbol
Conditions
Unit
min
typ
max
Supply Current
IDD1
fosc = 8.0 MHz
VDD = 5.0 V
4.0
8.0
IDD2
fosc = 32.768 kHz
VDD = 5.0 V
0.7
2.0
Supply current in
HALT mode
IDD3
fosc = 32.768 kHz
VDD = 5.0 V
15.0
30.0
C3
Supply current in
STOP mode
IDD4
VDD = 5.0 V
0.5
5.0
C4
Auto reset
current
consumption
IDD5
VDD = 5.0 V, 3.0 V
8.0
80.0
C1
C2
Operating supply
current
mA
mA
- Make measurement at Ta = 25 °C while under no-load condition.
- The operating supply current, IDD1, applies if the high-speed oscillation mode is selected
as an EPROM option. To measure this current, fix the I/O pins to VDD level in the
RESET mode, and input an 8-MHz square-wave, which swings between VDD and VSS
voltage levels, into the OSC1 pin.
- The operating supply current, IDD2, applies if the low-speed oscillation mode is selected
as an EPROM option. To measure this current, clear the RESET mode, fix the I/O pins
to VDD level during execution of NOP instruction, and input a 32.768-kHz square wave,
which swings between VDD and VSS voltage levels, into the OSC1 pin.
- The supply current in HALT mode, IDD3, applies if the low-speed oscillation mode is
selected as an EPROM option. To measure this current, clear the RESET mode,
and set to the HALT mode, and, after fixing the I/O pins to VDD level, input a
32.768-kHz square wave, which swings between VDD and VSS voltage levels, into
the OSC1 pin.
- To measure the supply current in STOP mode, IDD4, clear the RESET mode and set
to the STOP mode. Then fix the I/O pins to VDD level and open OSC1 pin.
- Auto reset current consumption, IDD5, refers to the constant current consumption of
the auto reset circuit. Therefore, the value of current consumption is added to each
supply current rating.
- 85 -
Ta = -20 °C to +70 °C, VDD = 2.35 V to 5.5 V (VRSTL1 to 5.5 V), VSS = 0 V
Limits
Parameter
Symbol
Conditions
Unit
min
High-Current I/O Pin
typ
max
P00 (N-ch open-drain)
C5
Input voltage high level
VIH1
0.7VDD
VDD
C6
Input voltage low level
VIL1
VSS
0.3VDD
C7
Output leakage current
OLK1
Output: Hi-Z
VIN = 0 V to VDD
C8
Output voltage low level
VOL1
IOL = 20.0 mA
VDD = 5.0 V
V
High-Current I/O Pins
±10
mA
VSS
2.0
V
P01 to P03 (N-ch open-drain)
C9
Input voltage high level
VIH1
0.7VDD
VDD
C10
Input voltage low level
VIL1
VSS
0.3VDD
C11
Output leakage current
OLK1
Output: Hi-Z
VIN = 0 V to 6 V
C12
Output voltage low level
VOL1
IOL = 20.0 mA
VDD = 5.0 V
V
VSS
±10
mA
2.0
V
I/O Pins P10 to P13
P20/AD0/COMP0+ to P23/AD3/COMP1- (When the pins are used as P20 to P23
pins)
P30/SYNC/TCI, P31/IRQ/ACZ, P32/TCO/BZ
(When the pins are used as P30/SYNC, P31, P32/TCO/BZ pins)
C13
Input voltage high level
VIH2
0.7VDD
VDD
C14
Input voltage low level
VIL2
VSS
0.3VDD
C15
Input current
II2
C16
Input leakage current
V
ILK2
C17
C18
Output voltage high
level
VOH2
Output voltage low level
VOL2
With pull-up resistor
VIN = 1.5 V
VDD = 5.0 V
-50
Without pull-up
resistor
VIN = 0 V to VDD
-120
-300
±1
IOH = -500 mA
VDD = 5.0 V
4.5
IOL = 3.5 mA
VDD = 5.0 V
VSS
mA
VDD
V
0.5
Note) Use the P30/SYNC/TCI pin under the following condition:
The load must be set so that the output voltage high level will be more than 0.8 VDD
while the SYNC timing signal is output. That is, at the time the LSI is reset or within
two machine cycles after the reset status of the LSI is cleared.
* Setting of each pin is possible as an EPROM option.
- 86 -
Ta = -20 °C to +70 °C, VDD = 2.35 V to 5.5 V (VRSTL1 to 5.5 V), VSS = 0 V
Limits
Parameter
Symbol
Conditions
Unit
min
typ
max
Input Pins P20/AD0 to P23/AD3 (When the pins are used as A/D input pins)
C19
Converted voltage
range
C20
Resolution
C21
Relative precision
C22
Zero transition
voltage
V0T
C23
Full-scale transition
voltage
VFST
C24
A/D conversion time
C25
VAD
VSS
VDD = 5.0 V
VSS = 0.0 V
VDD
V
10
bit
±6
20
LSB
60
mV
Sampling time
C26
Analog input voltage VADIN
C27
Analog input
leakage current
C28
Ladder resistance
VDD
-20
fosc = 8 MHz
VDD = 5.0 V
VSS = 0.0 V
15.00
fosc = 8 MHz
VDD = 5.0 V
VSS = 0.0 V
4.00
27.00
See
Note.
ms
16.00
VSS
VADIN = 0 V to VDD
(VADIN when
channel is off.)
Rladd
VDD
-60
10
See
Note.
ms
VDD
V
±.001
±1
mA
50
100
kW
Note) The value is applied when bp3 (ADTC) of the A/D control register ADCL is set to zero.
Relative precision:
The deviation of the converted straight line from the ideal straight line that results
after both the zero transition voltage and full-scale transition voltage are adjusted
to zero.
Zero transition voltage:
Indicates the difference between the analog input voltage and the nominal value
when the digital output code changes from 0 (000h) to 1 (001h).
Full-scale transition voltage:
Indicates the difference between the analog input voltage and the nominal value
when the digital output code (3FEh) reaches the full-scale value (3FFh).
* Be sure to select a necessary EPROM option so that no pull-up resistor will be
connected to any pins working as A/D input pins.
- 87 -
Ta = -20 °C to +70 °C, VDD = 2.35 V to 5.5 V (VRSTL1 to 5.5 V), VSS = 0 V
Limits
Parameter
Symbol
Conditions
Unit
min
typ
max
Input Pin P31/IRQ/ACZ (When this pin is used as ACZ pin)
C29
ACZ input
(high-level output)
VSH
ACZ input
(low-level output)
VSL
1.5
VDD
-1.5
VSS
0.5
VDD
-0.5
VDD
Fig. 5
V
C30
C31
C32
Input leakage
current
Input clamp current
ILK3
IC3
VDD = 4.5 V
to 5.5 V
Without pull-up
resistor
VIN = 0 V to VDD
±1
mA
VIN > VDD
VIN < VSS
VDD = 5.0 V
±400
* Be sure to select a necessary EPROM option so that no pull-up resistor will be
connected to any pins working as ACZ pins.
I/O Pin P31/IRQ/ACZ (Schmitt input when this pin is used as IRQ pin)
C33
Input voltage highlevel
VIH4
0.8VDD
VDD
C34
Input voltage low level
VIL4
VSS
0.1VDD
C35
Input current
C36
Input leakage
current
II4
ILK4
With pull-up
resistor
VIN = 1.5 V
VDD = 5.0 V
-50
-120
V
-300
mA
Without pull-up
resistor
VIN = 0 V to VDD
±1
* Pull-up resistor is set to ON or OFF by selecting a necessary EPROM option.
I/O Pin P30/SYNC/TCI (Schmitt input when this pin is used as TCI pin)
C37
Input voltage high
level
VIH5
0.8VDD
VDD
C38
Input voltage low
level
VIL5
VSS
0.1VDD
C39
Input current
V
C40
Input leakage
current
II5
ILK5
With pull-up
resistor
VIN =1.5V
VDD =5.0V
Without pull-up
resistor
VIN = 0 V to VDD
-50
-120
-300
mA
±1
* Pull-up resistor is set to ON or OFF by selecting a necessary EPROM option.
- 88 -
Ta = -20 °C to +70 °C, VDD = 2.35 V to 5.5 V (VRSTL1 to 5.5 V), VSS = 0 V
Limits
Parameter
Symbol
Conditions
Unit
min
I/O Pin
C41
typ
max
RST (Schmitt input)
Input voltage high
level
VIH6
0.8VDD
VDD
V
C42
Input voltage low
level
C43
Input current
C44
Output voltage low
level
VIL6
II6
VOL6
VSS
With pull-up
resistor
VIN = 1.5 V
VDD = 5.0 V
-50
VDD = 2 V,
IOL = 0.3 mA
VSS
0.1VDD
-120
-300
mA
0.4
V
Input Pins P20/COMP0 + to P23/COMP1 - (When those pins are used as comparator input pins)
C45
Input offset voltage
C46
Common-mode
input voltage range
C47
Input leakage
current
VIOF7
VIN =1.5V to 3.5V
20
100
V
VDD = 5.0 V
ILK7
Without pull-up
resistor
VIN = 0 V to VDD
1.5
3.5
±1
mA
* If the comparator function is used, select necessary EPROM options so that the
MN150120 will be selected and no pull-up resistor will be connected to any pins working
as comparator input pins.
- 89 -
D. Electrical Characteristics (AC Characteristics)
Ta = -20 °C to +70 °C, VDD = 2.35 V to 5.5 V (VRSTL1 to 5.5 V), VSS = 0 V
Limits
Parameter
Symbol
Conditions
Unit
min
typ
max
RST Pin
D1
Effective pulse width
twRST
Fig. 4
1
mc
* The above pin may not be reset if the pulse width is shorter than the effective pulse width.
(mc: Machine cycle)
P31/IRQ/ACZ (When this pin is used as ACZ pin)
D2
Rise time
trs
30
Fig. 5
D3
Fall time
ms
tfs
30
0.8VDD
twRST
0.1VDD
Fig. 4 RST Input Pulse Width
(Input)
trs
tfs
VDD
VSL
VSH
VSL
VSS
(Output)
Fig. 5 AC Zero Voltage Detection Circuit Operating Diagram
- 90 -
E. On-chip EPROM Programming Electrical Characteristics
DC Characteristics
(VDD = 6 V±0.25 V, VPP = 12.5 V±0.3 V, Ta = 25 °C±5 °C)
Limits
Parameter
Symbol
Conditions
Unit
min
typ
max
Supply Current
E1
Supply current 1
IDD
30
E2
Supply current 2
IPP
15
mA
Input Pins
E3
A0 to A15, CE, OE (With 12.5-V voltage not applied to the pins)
Input voltage high
level
VIH
E4
Input voltage low
level
VIL
E5
Input leakage
current
I/O Pins
E6
VDD = 6.0 V
2.40
VDD
V
IL
VDD = 6.0 V
VSS
VIN = 0 V to VDD
0.45
±1
mA
D0 to D7
Output voltage high
level
VOH
VDD = 5.0 V
IOH = -500 mA
4.50
VDD
V
E7
Output voltage low
level
VOL
VDD = 5.0 V
IOL = 3.5 mA
VSS
0.50
E8
Input voltage high
level
VIH
VDD = 6.0 V
2.40
VDD
E9
Input voltage low
level
VIL
E10
Input leakage
current
V
IL
VDD = 6.0 V
VIN = 0 V to VDD
VSS
0.45
±1
ì1A
1. Apply the VPP power supply at 12.5 V after the VDD power supply is fixed at 6.0 V.
Turn off the VPP power supply before turning off the VDD power supply.
2. Make sure that the VPP voltage does not exceed 13.5 V including overshooting.
3. Do not dismount or mount the device with 12.5 V applied to the VPP pin, otherwise
the reliability of the device may be adversely affected.
4. Do not change the VPP voltage from 12.5 V to the VIL voltage or vice versa while the
CE pin is at VIL voltage.
- 91 -
AC Characteristics
(VDD = 6V±0.25 V, VPP = 12.5 V±0.3 V, Ta = 25 °C±5 °C)
Limits
Parameter
Symbol
Conditions
Unit
min
typ
max
E11
Address setup time
tAS
2
ms
E12
OE/VPP setup time
tOES
2
ms
E13
Data setup time
tDS
2
ms
E14
Address hold time
tAH
0
ms
E15
Data hold time
tDH
2
ms
E16
VDD setup time
tVCS
2
ms
E17
V PP setup time
tVPS
2
ms
E18
Program pulse width
tPW
0.95
E19
Additional program pulse
width
tOPW
2.85
E20
CE setup time
tCES
2
E21
OE/VPP output delay time
tOE
0
Program
1.0
ms
78.75
ms
ms
150
Verify
tAS
tAH
VIH
Address
VIL
tDS
tDH
tOE
tCES
VIH/VOH
Data
1.05
Data fixed
Valid data output
VIL/VOL
tVCS
6.0 V
VDD
5.0 V
tVPS
tOES
12.5 V
OE/VPP
VIL
VIH
CE
VIL
tPW
Fig. 11.8.1 I/O Timing during Programming
- 92 -
ms
Start
Address = Start address
VDD = 6.0V, OE/VPP =12.5 V
X=0
1-ms write pulse applied
X = X+1
YES
X = 25
NO
NG
1-word verify
1-word verify
NG
OK
Address = address+1
OK
Error
3X-ms added
Final address
VDD = 5.0V, OE/VPP = 0.0V
NG
All words readout
OK
Write completed
Fig. 11.8.2 Program flow chart
- 93 -
Error
MN150222/P0222
LSI User's Manual
December, 2000 3rd Edition
Issued by Matsushita Electric Industrial Co.,Ltd.
Matsushita Electronics Corporation
 Matsushita Electric Industrial Co., Ltd.
 Matsushita Electronics Corporation
Semiconductor Company, Matsushita Electronics Corporation
Nagaokakyo, Kyoto, 617-8520 Japan
Tel: (075) 951-8151
http://www.mec.panasonic.co.jp
SALES OFFICES
■ U.S.A. SALES OFFICE
■ HONG KONG SALES OFFICE
Panasonic Industrial Company
[PIC]
● New Jersey Office:
2 Panasonic Way, Secaucus, New Jersey 07094
Tel: 201-392-6173
Fax: 201-392-4652
● Milpitas Office:
1600 McCandless Drive, Milpitas, California 95035
Tel: 408-945-5630
Fax: 408-946-9063
● Chicago Office:
1707 N. Randall Road, Elgin, Illinois 60123-7847
Tel: 847-468-5829
Fax: 847-468-5725
● Atlanta Office:
1225 Northbrook Parkway, Suite 1-151,
Suwanee, Georgia 30174
Tel: 770-338-6940
Fax: 770-338-6849
● San Diego Office:
9444 Balboa Avenue, Suite 185
San Diego, California 92123
Tel: 619-503-2940
Fax: 619-715-5545
■ CANADA SALES OFFICE
Panasonic Canada Inc.
[PCI]
5700 Ambler Drive Mississauga, Ontario, L4W 2T3
Tel: 905-624-5010
Fax: 905-624-9880
■ GERMANY SALES OFFICE
Panasonic Industrial Europe G.m.b.H.
● Munich Office:
Hans-Pinsel-Strasse 2 85540 Haar
Tel: 89-46159-156
Fax: 89-46159-195
[PIEG]
Panasonic Industrial Europe Ltd.
[PIEL]
● Electric component Group:
Willoughby Road, Bracknell, Berkshire RG12 8FP
Tel: 1344-85-3773
Fax: 1344-85-3853
■ FRANCE SALES OFFICE
[PIEG]
[PSSA]
■ MALAYSIA SALES OFFICE
Panasonic Industrial Company (Malaysia) Sdn. Bhd.
● Head Office:
[PICM]
Tingkat 16B Menara PKNS PJ No.17,Jalan Yong
Shook Lin 46050 Petaling Jaya Selangor Darul Ehsan
Malaysia
Tel: 03-7516606
Fax: 03-7516666
● Penang Office:
Suite 20-17,MWE PLAZA No.8,Lebuh Farquhar,10200
Penang Malaysia
Tel: 04-2625550
Fax: 04-2619989
● Johore Sales Office:
39-01 Jaran Sri Perkasa 2/1,Taman Tampoi
Utama,Tampoi 81200 Johor Bahru,Johor Malaysia
Tel: 07-241-3822
Fax: 07-241-3996
Panasonic SH Industrial Sales (Shenzhen)
Co., Ltd.
[PSI(SZ)]
7A-107, International Business & Exhibition Centre,
Futian Free Trade Zone, Shenzhen 518048
Tel: 755-359-8500
Fax: 755-359-8516
Panasonic Industrial (Shanghai) Co., Ltd.
[PICS]
1F, Block A, Development Mansion, 51 Ri Jing Street,
Wai Gao Qiao Free Trade Zone, Shanghai 200137
Tel: 21-5866-6114
Fax: 21-5866-8000
Panasonic Industrial (Thailand) Ltd.
[PICT]
252/133 Muang Thai-Phatra Complex Building,31st
Fl.Rachadaphisek Rd.,Huaykwang,Bangkok 10320
Tel: 02-6933407
Fax: 02-6933423
[PIEG]
■ TAIWAN SALES OFFICE
Panasonic Industrial Sales Taiwan Co.,Ltd.
[PIST]
● Head Office:
6th Floor, Tai Ping & First Building No.550. Sec.4,
Chung Hsiao E. Rd. Taipei 10516
Tel: 2-2757-1900
Fax: 2-2757-1906
● Kaohsiung Office:
6th Floor, Hsien 1st Road Kaohsiung
Tel: 7-223-5815
Fax: 7-224-8362
 Matsushita Electronics Corporation 2000
Panasonic Semiconductor of South Asia
300 Beach Road # 16-01
The Concourse Singapore 199555
Tel: 390-3688
Fax: 390-3689
■ THAILAND SALES OFFICE
■ ITALY SALES OFFICE
Panasonic Industrial Europe G.m.b.H.
● Milano Office:
Via Lucini N19, 20125 Milano
Tel: 2678-8266
Fax: 2668-8207
■ SINGAPORE SALES OFFICE
■ CHINA SALES OFFICE
■ U.K. SALES OFFICE
Panasonic Industrial Europe G.m.b.H.
● Paris Office:
270, Avenue de President Wilson
93218 La Plaine Saint-Denis Cedex
Tel: 14946-4413
Fax: 14946-0007
Panasonic Shun Hing Industrial Sales (Hong Kong)
Co., Ltd.
[PSI(HK)]
11/F, Great Eagle Centre, 23 Harbour Road,
Wanchai, Hong Kong.
Tel: 2529-7322
Fax: 2865-3697
■ KOREA SALES OFFICE
Panasonic Industrial Korea Co., Ltd.
[PIKL]
Hanil Group Bldg.11th Fl.,191 Hangangro 2ga,
Youngsans-ku,Seoul 140-702,Korea
Tel: 82-2-795-9600
Fax: 82-2-795-1542
■ PHILIPPINES SALES OFFICE
National Panasonic Sales Philippines
[NPP]
102 Laguna Boulevard Laguna Technopark Sta.
Rosa. Laguna 4026 Philippines
Tel: 02-520-3150
Fax: 02-843-2778
080600
Printed in JAPAN
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement