data sheet - MEN Mikro Elektronik GmbH
Embedded Solutions
for Transportation and Industrial Markets
www.men.de/products/02F022P.html
F22P – 3U CompactPCI® PlusIO Intel® Core™
i7 CPU Board
n Intel® Core™ i7, 3rd generation
n Quad-core 64-bit processor
n For CompactPCI® 2.0 systems or CompactPCI®
PlusIO 2.30 hybrid systems (2.0 and CPCI-S.0)
n Up to 16 GB DDR3 DRAM soldered, ECC
n microSD™ card and mSATA slots
n Front I/O: VGA, 2 Gbit Ethernet, 2 USB
n Rear I/O: 4 PCIe®, 4 USB, 4 SATA, 1 Gbit
Ethernet
n Other I/O (onboard, side card): SATA, SDVO,
HDMI/Display Port, HD audio, USB, UART etc.
n 2.3 to 3.3 GHz Turbo Boost, Hyper-Threading,
Active Management Technology
n Open CL 1.1 support
The F22P versatile 4HP/3U single-board computer is a
continuation of MEN's proven range of Intel® CPU
boards. It is equipped with the high-performance third
generation Intel® Core™ i7 processor running at up to
3.3 GHz maximum turbo frequency and offering the
latest quad core processor architecture from Intel® with
full 64-bit support. The CPU card delivers an excellent
graphics performance and is designed especially for
embedded systems which require high computing
performance with low power consumption.
The F22P offers a 32-bit/33-MHz CompactPCI® bus
interface and can also be used without a bus system. 4
USB 2.0 ports, 4 PCI Express® x1 links, 2 SATA 3 Gb/s
and 2 SATA 6 Gb/s interfaces as well as one Gigabit
Ethernet are led to the J2 rear I/O connector which is
compatible with the PICMG 2.30 CompactPCI® PlusIO
specification.
The F22P is equipped with a state-of-the-art fast DDR3
DRAM which is soldered to the F22P to guarantee
optimum shock and vibration resistance. An mSATA
disk and a microSD™ card device which are connected
via a USB interface and a SATA channel offer nearly
unlimited space for user applications.
The standard I/O available at the front panel of F22P
includes graphics on a VGA connector, two PCIe®driven Gigabit Ethernet as well as two USB 2.0 ports.
F22P Data Sheet / 2014-02-28
The F22P can be extended by different side cards. Additional functions
include a digital video interface for flat panel connection via DVI
(multimedia), a variety of different UARTs or another four USBs, SATA for
hard disk connection and HD audio.
Thermal supervision of the processor and a watchdog for the operating
system complete the functionality of the F22P. A TPM (Trusted Platform
Module) chip is also assembled.
The F22P operates in Windows® and Linux environments as well as
under real-time operating systems that support Intel®'s multi-core
architecture. The InsydeH2O™ EFI BIOS was specially designed for
embedded system applications.
Equipped with Intel® components exclusively from the Intel® Embedded
Line, the F22P has a guaranteed minimum standard availability of 7
years.
The F22P is suited for a wide range of industrial applications, e.g. for
monitoring, vision and control systems as well as test and measurement.
Main target markets comprise industrial automation, multimedia, traffic
and transportation, aerospace, shipbuilding, medical engineering and
robotics.
The F22P comes with a tailored passive heat sink within 4 HP height.
The robust design of the F22P makes the board especially suited for use
in rugged environments with regard to shock and vibration according
to applicable DIN, EN or IEC industry standards. The F22P is also ready
for coating so that it can be used in humid and dusty environments.
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Diagram
ECC DDR3
SDRAM
Intel® Core™ i7
3rd Generation
PCIe x1
ECC DDR3
SDRAM
USB 2.0
microSD B
mSATA
USB 2.0
Side
Card
SATA (3Gb)
SATA
HD Audio
B
HDMI
VGA
F
HDMI/SDVO
USB 2.0
F
PCIe x1
USB 2.0
F
PCIe/PCI bridge PCI
B
J1
cPCI
R
F
Gb Ethernet
F
Gb Ethernet
PCIe x1
PCIe x1
Instead of one rear interface
QM77
Platform
Controller Hub
PCIe x1
PCIe x1
Gb Ethernet
Instead of one front interface
USB 2.0
SATA (3 Gb)
F Front connector
Gb Ethernet
J2
Rear
I/O
SATA (6 Gb)
R Rear I/O connector
B Onboard connector
Options
F22P Data Sheet / 2014-02-28
PCIe x1
SGPIO
R
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Technical Data
CPU
n
n
Memory
n
n
n
n
Mass Storage
n
n
n
Graphics
n
n
n
I/O
n
n
n
Front Connections (Standard)
n
n
n
Rear I/O (PICMG 2.30)
n
n
n
n
n
F22P Data Sheet / 2014-02-28
Intel® Core™ i7-3615QE
o 2.3 GHz processor core frequency
o 3.3 GHz maximum turbo frequency
o 1066 MHz system bus frequency
Chipset
o QM77 Platform Controller Hub (PCH)
Up to 6 MB last level cache integrated in i7
Up to 16 GB SDRAM system memory
o Soldered
o DDR3 with ECC support
o 1066/1333/1600 MHz memory bus frequency
64 Mbits boot Flash
Serial EEPROM 2kbits for factory settings
microSD™ card interface
o Connected via one USB port
mSATA disk slot
o Connected via one SATA channel
Serial ATA (SATA)
o Four channels via rear I/O, one channel via side-card connector, one channel for mSATA disk
o 4 SATA 3 Gbit/s interfaces, 2 SATA 6 Gbit/s interfaces (rear I/O)
o RAID level 0/1/5/10 support
Integrated in QM77 chipset
o 650 MHz graphics base frequency
o 1.2 GHz graphics maximum dynamic frequency
VGA connector at front panel
Two digital display interface ports available via side-card connector
®
o DisplayPort , HDMI and SDVO (SDVO only on one interface)
o One additional DVI connector at front panel optional via side card
o Simultaneous connection of two monitors
USB
o Two USB 2.0 ports via Series A connectors at front panel
o Four USB 2.0 ports via side-card connector
o Four USB 2.0 ports via rear I/O
o One USB for connection of microSD™
o EHCI implementation
o Data rates up to 480 Mbit/s
Ethernet
o Two 10/100/1000Base-T Ethernet channels at the front
o RJ45 connectors at front panel
®
o Ethernet controllers are connected by two x1 PCIe links
o Onboard LEDs to signal activity status and connection speed
o One 10/100/1000Base-T Ethernet channel via rear I/O
®
o Ethernet controller is connected by one x1 PCIe link
High Definition (HD) audio
o Accessible via side-card connector
VGA
Two USB 2.0 (Series A)
Two Ethernet (RJ45)
Four SATA
Four USB
One Gigabit Ethernet (second rear interface instead of one front interface as an assembly option)
Four PCI Express® x1 links
Compatible with PICMG 2.30 CompactPCI® PlusIO
o 1PCI33/4PCIE5/2SATA3/2SATA6/4USB2/1(2)ETH1G
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Technical Data
Miscellaneous
n
n
n
n
n
n
PCI Express®
n
n
n
CompactPCI® Bus
n
n
n
n
n
Busless Operation
n
n
Electrical Specifications
Mechanical Specifications
Three x1 links to connect local 1000Base-T Ethernet controllers
o Data rate 250 MB/s in each direction (2.5 Gbit/s per lane)
Four x1 links via rear I/O
o Data rate up to 500 MB/s in each direction (5 Gbit/s per lane)
Three x1 links for extension through side-card connector
o Data rate up to 500 MB/s in each direction (5 Gbit/s per lane)
Connection via PCI Express® link from processor using PCI-Express-to-PCI-Bridge
Compliance with CompactPCI® Core Specification PICMG 2.0 R3.0
System slot
32-bit/33-MHz CompactPCI® bus
V(I/O): +3.3V (+5V tolerant)
Board can be supplied with +5V only, all other voltages are generated on the board
Backplane connectors used only for power supply
n
Supply voltage/power consumption (board versions with i7-2715QE processor)
o +5V (-3%/+5%), 9.6 A typ., 14.4 A max.
o +3.3V (-3%/+5%), 1.8 A (3 Gb Ethernet), 1.4 A (2 Gb Ethernet), 1 A (1 Gb Ethernet)
o +12V (-10%/+10%), approx. 10 mA
o If the board is supplied with 5V only (typically without a bus connection), the 3.3V are generated on
the board and fed to the backplane (3A max.) No external 3.3 V voltage may be applied in that case!
n
Dimensions: conforming to CompactPCI® specification for 3U boards
Front panel: 4HP with ejector
Weight: 204 g (w/o heat sink)
n
n
Environmental Specifications
Board controller
Real-time clock, buffered by a GoldCap or alternatively a battery (5 years life cycle)
Watchdog timer
Temperature measurement
One user LED
Reset button
n
Temperature range (operation):
o Depends on system configuration (CPU, hard disk, heat sink...)
o Maximum: +85°C
o Minimum: -40°C (all processors)
o Conditions: airflow 1.5m/s, typical power dissipation: 12 W (board versions with i7-2715QE processor)
with Windows® XP operating system and 1 Gb Ethernet connection
Temperature range (storage): -40..+85°C
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300m to + 2,000m
Shock: 50 m/s², 30 ms
Vibration (Function): 1 m/s², 5 Hz - 150 Hz
Vibration (Lifetime): 7.9 m/s², 5 Hz - 150 Hz
Conformal coating on request
MTBF
n
549 414 h @ 40°C according to IEC/TR 62380 (RDF2000)
Safety
n
PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMC
n
Tested according to EN 55022 (radio disturbance), IEC 61000-4-3 (electromagnetic field immunity), IEC
61000-4-4 (burst) and IEC 61000-4-6 (conducted disturbances)
BIOS
n
InsydeH2O™ UEFI Framework
n
n
n
n
n
n
n
n
F22P Data Sheet / 2014-02-28
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Embedded Solutions
for Transportation and Industrial Markets
www.men.de/products/02F022P.html
Technical Data
Intel® Active Management
Technology
n
n
n
n
Software Support
n
n
n
n
n
n
n
F22P Data Sheet / 2014-02-28
Manageability Engine in Chipset
Network Filters in Chipset
Dedicated Flash Storage Area
Out of Band (OOB) Access
o Power off Access
o Independent of OS status
o Power status control
o Keyboard-Video-Mouse (KVM) Viewer (VNC-compatible)
o IDE-Redirect
o Serial-over-LAN
Note that 64-bit hardware technology can be used in an optimal way with 64-bit operating system
support
Windows®
Linux
VxWorks® (on request)
QNX® (on request)
Intel® Virtualization Technology, allows a platform to run multiple operating systems and applications in
independent partitions; one computer system can function as multiple "virtual" systems
For more information on supported operating system versions and drivers see Downloads.
Page 5
Embedded Solutions
for Transportation and Industrial Markets
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Configuration & Options
Standard Configurations
Article No.
CPU Type
Clock
Cores/Threads
System RAM
mSATA/microSD
Operating
Temperature
02F022P00
Celeron 1047UE
1.4 GHz
2/2
2 GB
None
-40..+85°C
02F022P01
Core i7-3615QE
2.3 GHz
4/8
4 GB
None
0..+45°C
Options
CPU
n
n
n
n
n
n
n
n
n
n
Memory
n
n
n
Intel® Core™ i7-3615QE
o Quad Core, 2.3 GHz, 6 MB Cache, 45 W
Intel® Core™ i7-3612QE
o Quad Core, 2.1 GHz, 6 MB Cache, 35 W
Intel® Core™ i7-3555LE
o Dual Core, 2.5 GHz, 4 MB Cache, 25 W
Intel® Core™ i7-3517UE,
o Dual Core, 1.7 GHz, 4 MB Cache, 17 W
Intel® Core™ i5-3610ME
o Dual Core, 2.7 GHz, 3 MB Cache, 35 W
Intel® Core™ i3-3120ME
o Dual Core, 2.4 GHz, 3 MB Cache, 35 W
Intel® Core™ i3-3217UE
o Dual Core, 1.6 GHz, 3 MB Cache, 17 W
Intel® Celeron® 1020E
o Dual Core, 2.2 GHz, 2 MB Cache, 35 W
Intel® Celeron® 1047UE
o Dual Core, 1.4 GHz, 2 MB Cache, 17 W
Intel® Celeron® 927UE (without PCI Express® on side card)
o Single Core, 1.5 GHz, 1 MB Cache, 17 W
System RAM
o Up to 16 GB
microSD™ card
o 0 MB up to maximum available
mSATA disk
o 0 MB up to maximum available
Graphics
n
One DVI-D connector at front via side card
o Simultaneous connection of two monitors
I/O
n
Ethernet
o 9-pin D-Sub connector with one or two 10/100Base-T ports instead of two RJ45 connectors
o Second Ethernet at rear I/O connector J2 instead of one interface at the front
Rear I/O
®
o VGA on CompactPCI J2 connector as an assembly option for the conduction-cooled board version
®
o VBATT on CompactPCI J1 connector as an assembly option for the conduction-cooled board version
n
Mechanical
n
Side card can be added at left or right side of CPU
Operating Temperature
n
n
Depends on system configuration (CPU, hard disk, heat sink...)
Maximum: +85°C
Minimum: -40°C (all processors)
Cooling Concept
n
Also available with conduction cooling in MEN CCA frame
Software Support
n
VxWorks® (on request)
QNX® (on request)
n
n
Please note that some of these options may only be available for large volumes. Please ask our sales staff for more information.
F22P Data Sheet / 2014-02-28
Page 6
Embedded Solutions
for Transportation and Industrial Markets
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Ordering Information
Standard F22P Models
Related Hardware
02F022P00
F22P, 3U CompactPCI® (PICMG 2.0) and CompactPCI® PlusIO (PICMG 2.30) SBC, Intel®
Celeron1047UE 1.4 GHz, 2 GB DDR3 DRAM with ECC, -40..+85°C screened
02F022P01
F22P, 3U CompactPCI® (PICMG 2.0) and CompactPCI® PlusIO (PICMG 2.30) SBC, Intel®
Core™ i7-3615QE, 2.3 GHz, 4 GB DDR3 DRAM with ECC, 0..+45°C
02F600-00
2 COM extensions and SATA hard disk slot, for F14 and compatible SBCs, -40..+85°C
screened
02F601-00
1 DVI-D and 1 audio at front, SATA hard disk slot, for F14 and compatible SBCs, 4HP,
0..+60°C
02F603-00
3U CompactPCI® side card with 2 USB and 1 COM extension, SATA hard disk and
CompactFlash® slot, for F14 and compatible SBCs, mounted to the right of the SBC,
0..+60°C
02F604-00
3U CompactPCI® side card with 1 IEEE 1394 FireWire, 1 DVI, 1 HD audio and 1 COM
extension, SATA hard disk slot, for F14 and compatible SBCs, mounted to the right of the
SBC, 0..+60°C
02F606-00
2 Gigabit Ethernet on Lemo railway compliant connectors, 1 COM extension (SA-Adapter
not included), SATA hard disk slot, for F14 and compatible SBCs, conformally
coated, -40...+85°C screened
02F608-00
4 SATA and 2 COM ports, additional SATA hard disk slot on-board, for F14 and
compatible SBCs, mounted to the right of the SBC, 0..+60°C
For more information on the interoperability of the side cards with the respective CPU boards please see the
extension card compatibility matrix (PDF)
Memory
Systems & Card Cages
08CT12-00
CompactPCI® PlusIO rear transition module 3U/80mm, 2 Ethernet, 4 USB, 4 SATA, 4
PCIe® x1, -40°C..+85°C qualified
0751-0046
MicroSD card, 2 GB, -40..+85°C
0751-0051
SSD mSATA, 8 GB, -40..+85°C
0751-0052
MicroSD card, 4 GB, -40..+85°C
0701-0046
CompactPCI® 19" 4U/24HP desktop system for 3U cards, 3-slot 3U CompactPCI®
backplane, system slot right, 1U fan tray with 1 fan, 8 HP space for 1 pluggable PSU
0701-0056
CompactPCI® 19" 4U/84HP rack-mount enclosure for 3U cards (vertical), 4+4-slot 3U
CompactPCI® / CompactPCI® Serial hybrid backplane, prepared for rear I/O, 250W
power supply wide range 90..264VAC on rear, 1U fan tray with 2 fans included, 0..+60°C
MEN delivers turn-key systems completely installed (hardware, operating system, accessories), wired and
tested. Different rack sizes, power supplies and backplanes on request.
For details please contact your local sales representative.
Miscellaneous Accessories
0713-0003
Software: Linux
This product is designed to work under Linux. See below for all available separate software packages.
13MD05-90
F22P Data Sheet / 2014-02-28
CompactPCI® 3U 1-slot backplane for stand-alone operation of F14, F15, F17, F18, F19P,
F21P, F22P, F23P: 32-bit/33-MHz with rear I/O, 3.3V supply, ATX-power, power, JTAG,
IPMB and utility connection, 6x screw connection M3
MDIS5 System (and Device Driver) Package (MEN) for Linux. This software package
includes most standard device drivers available from MEN.
Page 7
Embedded Solutions
for Transportation and Industrial Markets
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Ordering Information
Software: Windows®
Software: Firmware/BIOS
This product is designed to work under Windows®. See below for all available separate software packages.
10Y000-78
Windows® Embedded Standard 7 BSP for F19P, F21P, F22P, F23P, G20, G22, CB70C,
CB70, XM2, MM2, BC50M, BC50I, BL50W, BL50S, BC70M, BL70S, BL70W, BL70E, DC2,
DC13, F205, F206, F210, F215, F216, G215, P506, P507 and P511
13F021P77
Windows® Installset (MEN) for F21P and F22P
(Includes all free drivers developed by MEN for the supported hardware.)
13T003-70
Windows® chipset driver (Intel®) for F14, F15, F17, F18, F18E, F19P, F21P, F22P, G20,
G22, XM2, CB70C, D9, D6, D7, D601, A19 and A20
13T005-70
Windows® USB2UART driver (FTDI) for F14, F15, F17, F18, F19P, F21P, F22P, F23P, D9,
A19, A20, XM2 and XM50 / XM51 / F50P / F50C hosts
13T006-70
Windows® HD Audio driver (Realtek) for F14, F15, F17, F18, F19P, F21P, F22P, F23P, D9
and A19
13T010-70
Windows® 32-bit network driver (Intel®) for XM1, XM1L, XM2, MM2, CB70C, F11S, F18,
F18E, F19P, F21P, F22P, G20, G22, GM1, GM2, GM3, G211, G211F, SC24, BC50I,
BC50M, BL50W, BL50S, BL70W and BL70S
13T020-70
Windows® 64-bit network driver (Intel®) for F18, F18E, F19P, F21P, F22P, G20, G22, GM1,
GM2, GM3, G211, G211F, XM2, CB70C, SC24, BC50I, BC50M, BL50W, BL50S, BL70W
and BL70S
13T029-70
Windows® Intel® Management Engine Driver (Intel®) for G22, F22P and CB70C
13T034-70
Windows® 7/8 32-bit graphics driver (Intel®) for F22P, G22, CB70C, SC25, BL70W and
BL70S
13T035-70
Windows® 7/8 64-bit graphics driver (Intel®) for F22P, G22, CB70C, SC25, BL70W and
BL70S
This product includes a specially adapted BIOS.
14F022P00
Software: Miscellaneous
System BIOS for F22P
Intel® software development products such as analyzers, compilers, threading tools etc. can be downloaded
under www.intel.com/cd/software/products/asmo-na/eng/index.htm. IA-32 Intel® Architecture Software
Developer's Manuals are available under www.intel.com/products/processor/manuals/index.htm.
For operating systems not mentioned here contact MEN sales.
Documentation
Compare Chart 3U CompactPCI® Serial CPU and I/O cards » Download
Compare Chart 3U CompactPCI® / PlusIO CPU cards » Download
Compare Chart 3U CompactPCI® / PlusIO peripheral cards » Download
Compare Chart 3U CompactPCI® / PlusIO extension cards » Download
For more information on the interoperability of the side cards with the respective CPU boards please see the
extension card compatibility matrix (PDF)
F22P Data Sheet / 2014-02-28
20F022P00
F22P User Manual
20F022PER
F22P Errata
21APPN014
Application Note: Switching on the AMT function
21APPN015
Application Note: Using Real-Time Operating Systems on MEN CPUs with InsydeH2O™
UEFI BIOS
21APPN016
Application Note: Accessing SMBus under Linux Kernel 3.2 on MEN Intel® Boards
Page 8
Embedded Solutions
for Transportation and Industrial Markets
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Contact Information
Germany
France
USA
MEN Mikro Elektronik GmbH
Neuwieder Straße 3-7
90411 Nuremberg
Phone +49-911-99 33 5-0
Fax +49-911-99 33 5-901
MEN Mikro Elektronik SAS
18, rue René Cassin
ZA de la Châtelaine
74240 Gaillard
Phone +33 (0) 450-955-312
Fax +33 (0) 450-955-211
MEN Micro Inc.
860 Penllyn Blue Bell Pike
Blue Bell, PA 19422
Phone (215) 542-9575
Fax (215) 542-9577
[email protected]
www.men.de
[email protected]
www.men-france.fr
[email protected]
www.menmicro.com
The date of issue stated in this data sheet refers to the Technical Data only. Changes in ordering information given herein do not affect the date of issue. All brand or product names are
trademarks or registered trademarks of their respective holders.
MEN is not responsible for the results of any actions taken on the basis of information in the publication, nor for any error in or omission from the publication.
MEN expressly disclaims all and any liability and responsibility to any person, whether a reader of the publication or not, in respect of anything, and of the consequences of anything,
done or omitted to be done by any such person in reliance, whether wholly or partially, on the whole or any part of the contents of the publication.
The correct function of MEN products in mission-critical and life-critical applications is limited to the environmental specification given for each product in the technical user manual.The
correct function of MEN products under extended environmental conditions is limited to the individual requirement specification and subsequent validation documents for each product
for the applicable use case and has to be agreed upon in writing by MEN and the customer.Should the customer purchase or use MEN products for any unintended or unauthorized
application, the customer shall indemnify and hold MEN and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses,
and reasonable attorney fees arising out of, directly or indirectly, any claim or personal injury or death associated with such unintended or unauthorized use, even if such claim alleges
that MEN was negligent regarding the design or manufacture of the part.
In no case is MEN liable for the correct function of the technical installation where MEN products are a part of.
Copyright © 2015 MEN Mikro Elektronik GmbH. All rights reserved.
F22P Data Sheet / 2014-02-28
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