BOOSTXL-IOBKOUT GPIO Breakout BoosterPack

BOOSTXL-IOBKOUT GPIO Breakout BoosterPack

GPIO Breakout BoosterPack

User's Guide

Literature Number: SPMU364

January 2014

Contents

1

2

3

C

D

A

B

Board Overview

1.1

1.2

1.3

Specifications

..................................................................................................................

4

Kit Contents

Features

..................................................................................................................

5

......................................................................................................................

5

................................................................................................................

5

Hardware Description

2.1

..........................................................................................................

6

BoosterPack XL Connector

................................................................................................

7

2.2

2.3

2.4

2.5

2.6

2.7

Tiva™ C Series LaunchPad Compatibility

Standard BoosterPack Pinout Compatibility

...............................................................................

7

.............................................................................

8

EK-TM4C123GXL LaunchPad Shared Signals

Screw Terminals and Header Positions

.........................................................................

9

................................................................................

10

Analog Signals

ESD Protection

.............................................................................................................

11

............................................................................................................

11

Software

3.1

...........................................................................................................................

12

Dual HID Gamepad Demo Application

.................................................................................

12

Bill of Materials

Board Drawing

.................................................................................................................

14

..................................................................................................................

15

References

.......................................................................................................................

16

Schematics

.......................................................................................................................

17

2

Contents

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List of Figures

1-1.

BOOSTXL-IOBKOUT BoosterPack

.......................................................................................

4

2-1.

BOOSTXL-IOBKOUT BoosterPack Block Diagram

....................................................................

6

2-2.

Screw Terminal, Headers, and User Switch Arrangements

.........................................................

10

3-1.

Gamepad Axis Mapping

..................................................................................................

13

B-1.

Board Drawing

.............................................................................................................

15

List of Tables

1-1.

Specifications

................................................................................................................

5

2-1.

BoosterPack XL Interface Connections

..................................................................................

7

2-2.

Tiva Port and Pin Mapping

................................................................................................

7

2-3.

Standard BoosterPack Pinout Compatibility

.............................................................................

8

2-4.

Shared Tiva LaunchPad Signals

..........................................................................................

9

3-1.

BoosterPack and Gamepad Pin Mapping

..............................................................................

12

A-1.

Bill of Materials

............................................................................................................

14

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List of Figures

3

Chapter 1

SPMU364 – January 2014

Board Overview

The GPIO Breakout BoosterPack (BOOSTXL-IOBKOUT) is a low-cost IO breakout board for Tiva™ C

Series LaunchPad BoosterPack XL pinout. Every available signal is connected to a 0.1” header position in addition to the majority being connected to 3.5 mm screw terminals for easy access when prototyping.

Figure 1-1

shows the BOOSTXL-IOBKOUT.

Figure 1-1. BOOSTXL-IOBKOUT BoosterPack

Tiva is a trademark of Texas Instruments.

4

Board Overview

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1.1

Kit Contents

The BOOSTXL-IOBKOUT comes with the following:

• GPIO Breakout BoosterPack

1.2

Features

The BOOSTXL-IOBKOUT BoosterPack includes the following features:

• 3.5 mm screw terminal for all unused I/O

– 8 analog

– 22 digital

– 2 3.3-V terminals

– 4 ground terminals

• Analog channels equipped with unity-gain amplifiers

• ESD protection on every I/O signal and power rail

• 3-position user DIP switch

• Plated through-holes on a 0.1" grid for each I/O signal

• Six 0.125"-diameter mounting holes

• Dual HID gamepad demo

1.3

Specifications

Table 1-1

shows the specifications for the BOOSTXL-IOBKOUT BoosterPack.

Table 1-1. Specifications

Parameter

Board supply voltage

Value

3.3V (via LaunchPad headers)

Analog input voltage range

Digital input maximum voltage

0V to +3.3V

LaunchPad dependent

(absolute maximum +5.0V)

Digital input minimum voltage 0V

Dimensions

RoHS status

3.0" x 4.0" x 0.5" (without LaunchPad)

Compliant

Kit Contents

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Board Overview

5

Chapter 2

SPMU364 – January 2014

Hardware Description

The BOOSTXL-IOBKOUT BoosterPack provides many useful features that aid in prototyping a variety of projects with Tiva™ C Series LaunchPads (see

Figure 2-1 ). This chapter describes the BOOSTXL-

IOBKOUT hardware features.

Tiva

TM

C Series

LaunchPad

4

LaunchPad XL Connectors

4

Op-Amp

Unity Gain

11

Op-Amp

Unity Gain

11

3

I2C

UART

ESD

Protection

DIP Switch

Breakout BoosterPack

SPI

Figure 2-1. BOOSTXL-IOBKOUT BoosterPack Block Diagram

6

Hardware Description

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BoosterPack XL Connector

2.1

BoosterPack XL Connector

The BoosterPack XL connector attaches the BoosterPack to the Tiva™ C Series LaunchPad.

Table 2-1

describes how the BoosterPack XL connector maps to the broken-out signals on the BOOSTXL-

IOBKOUT.

Pin

J1.1

J1.2

J1.3

J1.4

J1.5

J1.6

J1.7

J1.8

J1.9

J1.10

Function

+3.3V

BR

A8

A9

A4

BZ

A5

B8

A10

A11

Table 2-1. BoosterPack XL Interface Connections

Pin

J3.1

J3.2

J3.3

J3.4

J3.5

J3.6

J3.7

J3.8

J3.9

J3.10

Function

+VBUS

GND

BY

BX

AR

AZ

AY

AX

A3

S1

Pin

J4.1

J4.2

J4.3

J4.4

J4.5

J4.6

J4.7

J4.8

J4.9

J4.10

Function

S2

S3

A6

B2

B3

B4

B5

B6

B7

A1

Pin

J2.1

J2.2

J2.3

J2.4

J2.5

J2.6

J2.7

J2.8

J2.9

J2.10

Function

GND

A7

A2

B1

NC

NC

NC

B9

B10

B11

2.2

Tiva™ C Series LaunchPad Compatibility

Every available pin on the Tiva™ C Series LaunchPad is brought out to screw terminals or header positions. In the majority of cases, the pins are brought out to both.

Table 2-2

describes the Tiva C Series ports and pins that map to the signals on the BOOSTXL-IOBKOUT. Analog signals and the suggested locations for I2C, SSI, and UART are also labeled.

Table 2-2. Tiva Port and Pin Mapping

(1)

A-Side Signals

A1

A2

A3

A4

A5

A6

A7

A8

A9

AR

AX

AY

AZ

A10

A11

Port/Function

PF4

PE0

PE3

PE4

PB4

PB3

PB2

PB0/U1RX

PB1/U1TX

PD2/AIN5

PE2/AIN1

PE1/AIN2

PD3/AIN4

PA6/I2C1SCL

PA7/I2C1SDA

B-Side Signals Port/Functions

B1 PF0

B2

B3

PC4

PC5

B4

B5

B6

B7

B8

B9

BR

BX

BY

BZ

B10

B11

PC6

PC7

PD6

PD7

PA5/SSI0TX

(1)

PA4/SSI0RX

(1)

PB5/AIN11

PD1/AIN6

PD0/AIN7

PE5/AIN8

PA3/SSI0FSS1

(1)

PA2/SSI0CLK

(1)

User Switches

S1

S2

S3

Port/Functions

PF1

PF2

PF3

SSI signals in these positions do not match the standard BoosterPack pinout for SSI. Please see

Section 2.3

, Standard

BoosterPack Pinout Compatibility

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Hardware Description

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Standard BoosterPack Pinout Compatibility

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2.3

Standard BoosterPack Pinout Compatibility

The Breakout BoosterPack has the ability to be connected to other LaunchPads that follow the standard

LaunchPad pinout. Please refer to

Table 2-3

and the BOOSTXLK-IOBKOUT Schematic (

Appendix D

) when considering using a non-Tiva™ C Series LaunchPad.

Pin

J1.1

J1.2

J1.3

J1.4

J1.5

J1.6

J1.7

J1.8

J1.9

J1.10

Table 2-3. Standard BoosterPack Pinout Compatibility

Breakout Use

+3.3V

BR-ANALOG

A8-RX

A9-TX

A4

BZ-ANALOG

A5

B8-MOSI

A10-SCL

A11-SDA

Standard

+3.3V

Analog In

UART-RX

UART-TX

GPIO

Analog In

SPI-CLK

GPIO

I2C-SCL

I2C-SDA

Pin

J2.1

J2.2

J2.3

J2.4

J2.5

J2.6

J2.7

J2.8

J2.9

J2.10

Breakout Use

GND

A7

A2

B1

NC

NC

NC

B9-MISO

B10-CS

B11-SCLK

Standard

GND

GPIO

GPIO

GPIO

Reset

SPI-MOSI

SPI-MISO

GPIO

SPI-CS

GPIO

Pin

J3.1

J3.2

J3.3

J3.4

J3.5

J3.6

J3.7

J3.8

J3.9

J3.10

Breakout Use

+VBUS

GND

BY-ANALOG

BX-ANALOG

AR-ANALOG

AZ-ANALOG

AY-ANALOG

AX-ANALOG

A3

S1

Standard

+VBUS

GND

Analog In

Analog In

Analog In

Analog In

Analog In

Analog In

Reserved

Reserved

Pin

J4.1

J4.2

J4.3

J4.4

J4.5

J4.6

J4.7

J4.8

J4.9

J4.10

Breakout Use

S2

S3

A6

B2

B3

B4

B5

B6

B7

A1

Standard

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

Because the BOOSTXL-IOBKOUT is almost entirely a pin-for-pin breakout, the differences between the standard BoosterPack pinout and the Breakout signals are mostly labeling. However, each analog input is connected through a unity-gain amplifier and not directly to the terminals (please see

Section 2.6

, Analog

Signals). Always refer to the BoosterPack Schematic ( Appendix D

) when connecting hardware.

8

Hardware Description

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EK-TM4C123GXL LaunchPad Shared Signals

2.4

EK-TM4C123GXL LaunchPad Shared Signals

The BOOSTXL-IOBKOUT breaks out every available signal on the Tiva™ C Series TM4C123G

LaunchPad. Therefore, some of these signals are shared with on-board features of the LaunchPad.

Table 2-4

describes which signals are shared with features on the LaunchPad.

Pin

J2.4

J2.5

J2.6

J2.7

J3.3

J3.4

J3.10

J4.1

J4.2

J4.10

Table 2-4. Shared Tiva LaunchPad Signals

Port/Function

PF0

Reset

PB7

PB6

PD0/AIN7

PD1/AIN6

PF1

PF2

PF3

PF4

LaunchPad Feature

User Switch 2

Reset

Tied to J3.4 (PD1)

Tied to J3.3 (PD0)

Tied to J2.7 (PB6)

Tied to J2.6 (PB7)

LED Red

LED Blue

LED Green

User Switch 1

BoosterPack Function

B1

NC

NC

NC

BY

BX

S1

S2

S3

A1

Please see the BoosterPack Schematic ( Appendix D

) and the EK-TM3C123GXL User’s Guide ( SPMU296 ) for more information.

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Screw Terminals and Header Positions

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2.5

Screw Terminals and Header Positions

The available LaunchPad signals are brought out to three main sections on the GPIO Breakout

BoosterPack: A-Side, B-Side, and User Switches.

A-Side and B-Side signals are all broken out to 3.5 mm-screw terminals with +3.3 V and Ground terminals interspersed throughout. The three remaining signals are brought out to the User Switches in a 3-switch

DIP switch.

Figure 2-2

shows the screw terminal and switch arrangement.

Figure 2-2. Screw Terminal, Headers, and User Switch Arrangements

Additionally, every signal is brought out to a 0.1” header position. These can be populated by standard

0.1” breakaway pin headers. All A-Side and B-Side header positions have +3.3V and Ground headers directly adjacent in a Signal-Power-Ground arrangement as shown in

Figure 2-2

. This arrangement is the same as a standard servo-style connection used in many hobbyist applications.

10

Hardware Description

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Analog Signals

2.6

Analog Signals

Each of the eight analog inputs is first passed through a Texas Instruments TLV2374 Rail-to-Rail

Operational Amplifier (op amp). The op amps are connected as unity-gain amplifiers in order to provide a low-impedance source to the LaunchPad MCU’s Analog to Digital Converter (ADC).

The TLV2374 is a Rail-to-Rail Input/Output Op Amp. Therefore, the signal applied to the terminals (op amp input) can be any level from 0 V to +3.3 V, while the input to the ADC (op amp output) can also swing from 0 V to +3.3 V.

Please see the BoosterPack Schematic ( Appendix D

) for more information.

2.7

ESD Protection

All breakout signals and power rails on the GPIO Breakout BoosterPack are also protected from

Electrostatic Discharge (ESD).

GPIO signals are protected by a 33-

Ω series resistor and an NXP PESD5V0L2UU Unidirectional ESD

Protection Diode, while the analog signals and power rails are protected by the diodes only. The

PESD5V0L2UU diodes offer up to 30 kV of ESD protection with a reverse standoff voltage of +5.0 V and a breakdown voltage typically at +6.2 V.

Please see the BoosterPack Schematic ( Appendix D

) and the PESD5V0L2UU datasheet for more information.

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11

Chapter 3

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Software

The GPIO Breakout BoosterPack makes it easy to connect custom circuits to any Tiva™ C Series

LaunchPad for many different applications. One possible application is a custom USB HID Gamepad.

3.1

Dual HID Gamepad Demo Application

The GPIO Breakout BoosterPack software development package includes a demo application that enumerates the Tiva C Series LaunchPad as a set of two USB HID gamepads.

Table 3-1

outlines the pin mapping between the BoosterPack and the HID gamepad data structure.

A10

A11

BX

BY

BZ

A5

A6

A7

A8

A9

BoosterPack

AX

AY

AZ

AR

A1

A2

A3

A4

BR

B1

B2

B3

B4

B5

B6

B7

Table 3-1. BoosterPack and Gamepad Pin Mapping

Tiva Pin

PE2/AIN1

PE1/AIN2

PD3/AIN4

PD2/AIN5

PF4

PE0

PE3

PE4

PB4

PB3

PB2

PB0

PB1

PA6

PA7

PD1/AIN6

PD0/AIN7

PE5/AIN8

PB5/AIN11

PF0

PC4

PC5

PC6

PC7

PD6

PD7

Gamepad A

X-Axis

Y-Axis

Z-Axis

X-Rotation

Button 1

Button 2

Button 3

Button 4

Button 5

Button 6

Button 7

Button 8

Button 9

Button 10

Button 11

Gamepad B

X-Axis

Y-Axis

Z-Axis

X-Rotation

Button 1

Button 2

Button 3

Button 4

Button 5

Button 6

Button 7

12

Software

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Dual HID Gamepad Demo Application

Table 3-1. BoosterPack and Gamepad Pin Mapping (continued)

Gamepad A BoosterPack

B8

B9

B10

B11

S1

S2

S3

Tiva Pin

PA5

PA4

PA3

PA2

PF1

PF2

PF3

Button 14

Button 15

Button 16

Gamepad B

Button 8

Button 9

Button 10

Button 11

The analog 0V – 3.3V input range is mapped to the gamepad axes as an integer scale from +511 to -512.

Figure 3-1

shows the axis mapping.

3.3 V

-512

3.3 V

-512

X Axis

1.5 V

0

0.0 V

511

3.3 V

-512

Z Axis

1.5 V

0

X Rotation

0.0 V

511

0.0 V

511

Figure 3-1. Gamepad Axis Mapping

Digital inputs are active low with internal pull-ups enabled. Simply ground the digital inputs to register a button as “pressed.”

Please see the EK-TM4C123GXL-BOOSTXL-IOBKOUT Firmware Development Package User’s Guide in the TivaWare for C Series software package.

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Software

13

3

4

5

6

Item

1

2

7

8

9

10

Appendix A

SPMU364 – January 2014

Bill of Materials

Table A-1. Bill of Materials

Ref Qty

C1, C2, C3, C4, C5, C6, C7, 8

C8

D1, D2, D3, D4, D5, D6, D7, 19

D8, D9, D10, D11, D12, D13,

D14, D15, D16, D17, D18,

D19

J1, J4 2

Description

Capacitor, 0.1uF 50V, 10%

0603 X7R

Mfg

Murata

Dual TVS Diode, 5V Standoff, NXP

5.8V Breakdown

J5, J7 2

J6, J8 2

R1, R2, R3, R4, R5, R6, R7, 25

R8, R9, R10, R11, R12, R13,

R14, R15, R16, R17, R18,

R19, R20, R24, R25, R26,

R27, R28

R21, R22, R23 3

S1

U1, U2

PCB

1

2

1

Header, 2x10, 0.100, T-Hole, FCI

Vertical Unshrouded, 0.230

Mate, gold

Connector, 3.5mm Terminal

Block, 3.5mm, 12 Pos

On Shore

Technology

Connector, 3.5mm Terminal

Block, 3.5mm, 6 Pos

On Shore

Technology

Resistor, 33 Ohm, 1/10W, 5%, Panasonic

SMD, Thick

67997-220HLF

ED555/12DS

ED555/6DS

ERJ-3GEYJ330V

Resistor, 10K Ohm 1/10W 5%

0603 SMD

DIP Switch, SMT, 3-Pos,

SPST

Panasonic

CTS

Op Amp, 3 MHz, Quad, RailTexas to-Rail, 14TSSOP Instruments

PCB, BP-BREAKOUT, Rev

3.0, 2-layer

Part Number

GRM188R71H104KA93D

PESD5V0L2UU

ERJ-3GEYJ103V

219-3MST

TLV2374IPWR

14

Bill of Materials

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Appendix B

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Board Drawing

Figure B-1. Board Drawing

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Board Drawing

15

Appendix C

SPMU364 – January 2014

References

In addition to this document, the following references are available for download at www.ti.com

:

• EK-LM4F120XL User’s Guide (literature number SPMU289 )

• EK-TM4C123GXL User’s Guide (literature number SPMU296 )

• BoosterPack Standard http://processors.wiki.ti.com/index.php/BYOB

• PESD5V0L2UU Datasheet http://www.nxp.com/documents/data_sheet/PESD5V0L2UU_PESD6V0L2UU.pdf

• TivaWare for C Series http://www.ti.com/tool/sw-tm4c

16

References

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Appendix D

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Schematics

This section contains the complete schematics for the Tiva C Series GPIO Breakout Booster Pack.

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Schematics

17

GPIO

J6

3

4

5

6

1

2

+3.3V

AX

AY

AZ

AR

1

2

3

D2

1

2

3

D1

U1-E

TLV2374IPW

4

VCC

GND

11

+3.3V

C1

0.1uF

C2

0.1uF

+3.3V

4

VCC

11

GND

U2-E

TLV2374IPW

U1-B

6

-

5

+

7

TLV2374IPW

PE2/AIN1 PD1/AIN6

7

TLV2374IPW

U2-B

-

6

5

+

U1-A

2

-

3

+

1

TLV2374IPW

PE1/AIN2 PD0/AIN7

1

TLV2374IPW

U2-A

-

2

+

3

U1-C

9

-

10

+

8

TLV2374IPW

PD3/AIN4 PE5/AIN8

8

TLV2374IPW

U2-C

-

9

10

+

U1-D

13

-

12

+

14

TLV2374IPW

PD2/AIN5 PB5/AIN11

14

TLV2374IPW

U2-D

-

13

+

12

1

2

3

D9

1

2

3

D8

+3.3V

BX

BY

BZ

BR

6

5

4

3

2

1

J8

J1

3

4

5

1

2

6

7

8

9

10

CON_110_100

BOOSTERPACK HEADERS

Nets labels are for TM4C123GXL LaunchPad

GPIO

+3.3V

PB5/AIN11

PB0/U1RX

PB1/U1TX

PE4

PE5/AIN8

PB4

PA5/SSI0TX

PA6/I2C1SCL

PA7/I2C1SDA

PB2

PE0

PF0

PA4/SSI0RX

PA3/SSI0FSS

PA2/SSI0CLK

J2

8

9

10

3

4

5

1

2

6

7

CON_110_100

+VBUS

J5

6

7

8

9

10

11

12

1

2

3

4

5

A1

A2

A3

A4

A5

A6

A7

A8

A9

A10

A11

+3.3V

1

2

3

D17

+3.3V

1

2

3

D7

1

2

3

D6

1

2

3

D5

1

2

3

D4

1

2

3

D3

R1

R2

R3

R4

R5

R28

R6

R7

R8

R9

R10

33

33

33

33

33

33

33

33

33

33

33

PF4

PE0

PE3

PE4

PB4

PB3

PB2

PB0/U1RX

PB1/U1TX

PA6/I2C1SCL

PA7/I2C1SDA

PF0

PC4

PC5

PC6

PC7

PD6

PD7

PA5/SSI0TX

PA4/SSI0RX

PA3/SSI0FSS

PA2/SSI0CLK

R11

R12

R13

R14

R15

R27

R16

R17

R18

R19

R20

33

33

33

33

33

33

33

33

33

33

33

1

2

3

D14

1

2

3

D13

1

2

3

D12

1

2

3

D11

1

2

3

D10

1

+3.3V

2

3

D18

B1

B7

B8

B9

B10

B11

B2

B3

B4

B5

B6

12

11

10

9

8

7

6

5

4

3

2

1

J7

+3.3V

+3.3V

+3.3V

C3

0.1uF

C4

0.1uF

C5

0.1uF

PF1

PF2

R24

R25

PF3

R21

10k

R22

10k

R23

10k

R26

S1-A

+3.3V

+3.3V

33

S1-B

33

S1-C

33

+3.3V

SW_1A_DIP6_SMT

1

2

3

D16

1

2

3

D15

+3.3V

+3.3V

+3.3V

C6

0.1uF

C7

0.1uF

C8

0.1uF

J3

6

7

8

9

10

1

2

3

4

5

CON_110_100

+3.3V

+VBUS

1

2

3

D19

PD0/AIN7

PD1/AIN6

PD2/AIN5

PD3/AIN4

PE1/AIN2

PE2/AIN1

PE3

PF1

PF2

PF3

PB3

PC4

PC5

PC6

PC7

PD6

PD7

PF4

DESIGNER

DAY

REVISION

3.0

DATE

12/3/2013

PROJECT

GPIO Breakout Booster Pack

DESCRIPTION

I/O breakout for Tiva C Series LaunchPads

J4

9

10

6

7

8

1

2

3

4

5

CON_110_100

TEXAS INSTRUMENTS

TIVA C SERIES MICROCONTROLLERS

108 WILD BASIN ROAD, SUITE 350

AUSTIN TX, 78746 www.ti.com/tiva

FILENAME

BreakoutBP.sch

PART NO.

BP-BREAKOUT-3.0

SHEET

1 OF 1

EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS

Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods.

Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO

BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF

MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH

ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL

DAMAGES.

Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or contact TI.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein.

REGULATORY COMPLIANCE INFORMATION

As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal

Communications Commission (FCC) and Industry Canada (IC) rules.

For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,

DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.

General Statement for EVMs including a radio

User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization.

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant

Caution

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

FCC Interference Statement for Class A EVM devices

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.

These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.

FCC Interference Statement for Class B EVM devices

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.

These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

For EVMs annotated as IC – INDUSTRY CANADA Compliant

This Class A or B digital apparatus complies with Canadian ICES-003.

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

Concerning EVMs including radio transmitters

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Concerning EVMs including detachable antennas

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.

This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.

Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement.

Concernant les EVMs avec appareils radio

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente

(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.

Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

SPACER

SPACER

SPACER

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SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan

If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:

1.

Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and

Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of

Japan,

2.

Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product, or

3.

Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.

Texas Instruments Japan Limited

(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan

http://www.tij.co.jp

【無線電波を送信する製品の開発キットをお使いになる際の注意事項】

本開発キットは技術基準適合証明を受けておりません。

本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。

1.

電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。

2.

実験局の免許を取得後ご使用いただく。

3.

技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

   上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。

日本テキサス・インスツルメンツ株式会社

東京都新宿区西新宿6丁目24番1号

西新宿三井ビル http://www.tij.co.jp

EVALUATION BOARD/KIT/MODULE (EVM)

WARNINGS, RESTRICTIONS AND DISCLAIMERS

For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end product.

Your Sole Responsibility and Risk. You acknowledge, represent and agree that:

1.

You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug

Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.

2.

You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard.

3.

Since the EVM is not a completed product, it may not meet all applicable regulatory and safety compliance standards (such as UL,

CSA, VDE, CE, RoHS and WEEE) which may normally be associated with similar items. You assume full responsibility to determine and/or assure compliance with any such standards and related certifications as may be applicable. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to perform as described or expected.

4.

You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.

Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the

EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs.

Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.

Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate

Assurance and Indemnity Agreement.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2014, Texas Instruments Incorporated

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.

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Products Applications

Audio

Amplifiers

Data Converters

DLP® Products

DSP

Clocks and Timers

Interface

Logic

Power Mgmt

Microcontrollers

RFID

OMAP Applications Processors

Wireless Connectivity www.ti.com/audio amplifier.ti.com

dataconverter.ti.com

www.dlp.com

dsp.ti.com

www.ti.com/clocks interface.ti.com

logic.ti.com

power.ti.com

microcontroller.ti.com

www.ti-rfid.com

www.ti.com/omap

Automotive and Transportation www.ti.com/automotive

Communications and Telecom www.ti.com/communications

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

Medical

Security www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security

Space, Avionics and Defense www.ti.com/space-avionics-defense

Video and Imaging

TI E2E Community

www.ti.com/wirelessconnectivity www.ti.com/video e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2014, Texas Instruments Incorporated

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