XMC Digital Power Explorer User Manual

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XMC Digital Power Explorer User Manual | Manualzz

XMC4000/XMC1000

32-bit Microcontroller Series for Industrial Applications

XMC Digital Power Explorer Power Board

User Manual

UG_201511_PL30_001

Board User Manual

Scope and purpose

This document describes the features and hardware details of XMC Digital Power Explorer, designed to provide an evaluation platform for digital control applications with Infineon XMC ARM

®

Cortex

™ microcontrollers. This board is part of Infineon’s Digital Power Control Application Kit.

Applicable Products

XMC4200 Microcontroller

XMC1300 Microcontroller

XMC Digital Power Explorer Kit

DAVE™

References (optional, may be shifted to Appendix)

Infineon: DAVE™, http://www.infineon.com/DAVE

Infineon: XMC Family, http://www.infineon.com/XMC

XMC Digital Power Explorer, http://www.infineon.com/xmc_dp_exp

Example codes for this board, www.infineon.com/DAVE

Customer Documentation 1 V1.0, 2015-10

XMC Digital Power Explorer Power Board User Manual

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Table of Contents

Table of Contents

1

1.1

1.2

3

3.1

3.2

3.3

2

2.1

2.2

2.3

2.4

2.4.1

2.5

2.5.1

2.6

2.7

4

Overview.................................................................................................................... 3

Key features ......................................................................................................................................... 3

Block diagram...................................................................................................................................... 3

Hardware Description.................................................................................................. 5

Buck converter circuit description ..................................................................................................... 5

Board power supply ............................................................................................................................ 7

Master and slave configuration .......................................................................................................... 8

PMBus

TM

and UART Interface .............................................................................................................. 9

Test points ..................................................................................................................................... 9

Current signal conditioning .............................................................................................................. 10

Jumper SV5 usage for slope compensation ............................................................................... 11

Connection to network analyzer ...................................................................................................... 12

XMC Digital Power Control Card Connector ..................................................................................... 13

Production Data ........................................................................................................ 15

Schematics ........................................................................................................................................ 15

Component Placement ..................................................................................................................... 16

Bill Material (BOM) ............................................................................................................................. 17

Revision History ........................................................................................................ 20

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Overview

1 Overview

The XMC Digital Power Explorer is an evaluation board with the goal to help engineers in the learning and testing of digital power control applications. The board features a synchronous buck converter that can be controlled digitally with XMC microcontrollers. Synchronous buck converter is one of the most well known power topologies and many of the concepts of it can be ported to other power stages, what makes the synchronous buck converter a great platform for leaning and experimenting.

Different control cards can be plugged in to allow the user to select between different price/performance combinations available in XMC family of microcontrollers.

Both voltage control and peak current control with slope compensation can be implemented in this board.

This board includes loads on board for easy test of step response. Frequency behaviour can be analyized with the help of a network analyser. XMC Digital Power Explorer is ready for signal injection from network analyser equipment to study the frequency response of the buck stage.

This board is built with best in class Infineon Technologies components and with the collaboration of

Biricha Digital and Würth Elektronik .

1.1 Key features

The XMC Digital Power Explorer power board is equipped with the following features:

Synchronous buck converter capable of: o

Synchronous and non-synchronous buck converter modes o

Voltage and peak current control methods o

2 channel bucks with 1 XMC. Connecting a second XMC Digital Power Explorer in master-

slave configuration (see section 2.3)

o

3 on board loads for testing step response with option to connect external loads –i.e. electronic loads- for further advanced testing. o

Bode diagram measurement ready - requires network analyzer o

Dual channel serial communication including PMBus™ (I2C)communication

Control card connector for plugging in: o

Infineon XMC4200 Digital Power Control Card with XMC4200 (ARM ®

Microcontroller, 256 kByte on-chip Flash, LQFP64

Cortex

-M4F-based) o

Infineon XMC1300 Digital Power Control Card with XMC1300 (ARM

®

Cortex

-M0-based)

Microcontroller, up to 200 kByte on-chip Flash, TSSOP38

Single package high side and low side MOSFET

Plenty of test points for learning all details of the buck converter

General purpose switch for user interaction or control

1.2 Block diagram

Figure 1 shows the functional block diagram of the XMC Digital Power Explorer. For more information about

the power supply domains please refer to chapter 0.

The buck converter board is comprised of the following building blocks:

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Overview

1 XMC Digital Power Control Card Connector compatible with XMC4200 and XMC1300 control cards. XMC

Digital Power Explorer includes 2 PCB openings to the sides of the control card connector. This hinders wrong connection of the control card.

Power adapter input jack to plug in 12 V DC adapter. Includes switch to interrupt the supply

PMBus

TM

and UART communication options. Pull up resistors included on board for I2C communication support. Pulls up are supplied from XMC Digital Control Card Connector side

3 switchable loads (45%, 45%, 10%). Each is signalized with an LEDLED ON means load is active.

Voltage measurements - ADC: Vout, Vin through resistive voltage dividers

Current measurements - Comparators: inductor current through current transformer. Options for blanking (CCU) and slope compensation by HW components using provided jumper (SV5). For more

details on current sensing consult section 2.5.

2PWM complementary signals – CCUx - to high and low side switches

Master-Slave connectors for controlling a second XMC Digital Power Explorer with a single XMC Digital

Power Control Card

XMC Digital Power Explorer V1

VIn = VDD

Power on switch (SW4)

12V input jack

Slope comp. circuit for

XMC1300

Jumper

SV5

Current signal

Vin Vout

Load Banks

PWM_TOP

PWM_BO T

C

Loa d switches

(SW1-2-3)

From master board

Slave in connector

0

To slave board

Master out connector

CMP0

Current signal

Blan kin g o ptio n for X MC130 0

2x PWM

PWM7 TOP

PWM1 BOT

2x ADC

ADC0 Vout

ADC1 Vin

Data/clk

Communication connector

(PMBus

TM

and

UART)

3.3 V

COMP CCU CCU8 ADC USIC

XMC Digital Power Control Card Connector

BlockDiagram_Buck.emf

Figure 1

Block Diagram of XMC Digital Power Explorer

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Hardware Description

2 Hardware Description

The following sections give a detailed description of the hardware and how it can be used.

Load banks

Buck converter circuit

Power ON LED and Vin test point

Power ON

Switch (SW4)

Test point for triggering step response measurements

Load ON LEDs

Load bank switches

SW1, 2, 3

Input voltage jack

Vout filtered test point

Vout alternative connector

PMBus connector

General Purpose

Switch (SW5)

Figure 2

Daisy change connectors for second power explorer (master slave)

PWM test points

Injection points for network analyzer

ADC Vout input test point

XMC Digital Power Explorer hardware description

XMC dig. pow. control card connector

Slope compensation circuit jumper

Test points GPO2,

GPO1 and Current signal

Board_Interfaces_Buck.emf

2.1 Buck converter circuit description

XMC Digital Power Explorer buck converter is targeted for low voltage. Specification is shown in Table 1. The

schematic view of the buck converter stage is shown in Figure 3. The target output voltage is 3.3V.

Nevertheless, as a buck converter, any voltages from 0V to Vin are theoretically possible depending on the driving of the MOSFETs –duty cycle.

The inductor value ensures continuous conduction mode (CCM) of the buck converter as far as any of SW3 or

SW2 load switches are in the “ON” position. In other words, DCM operation occurs only when SW1 load switch is activated assuming 200 kHz switching frequency.

Note: Depending on the buck converter configuration, for example target output voltage or load connected, the board might become hot. Read carefully the disclaimer.

Table 1 Synchronous buck converter specification

Specification

Input voltage

Output voltage

Maximum output current

Name

Vin

Vout

Iout max

On board load values -

Value

12V DC

3.3V DC (depending on SW)

2 A

3.9

Ω (SW3, SW2)45% load

22

Ω (SW1) 10% load

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Hardware Description

Specification Name Value

Main inductor

Output capacitor

L1

C0 || C1

Gate driver high and low side U2

Dual MOSFET (high and low side)

Q1

22uH

200uF || 200uF  400uF

IRS2011SPBF (International Rectifier)

BSC0924NDI (Infineon Technologies)

Buck_converter_circuit.emf

Figure 3

Synchronous buck converter circuit

Power_connector_Vin.emf

Figure 4

Synchronous buck converter power connector an Vin detail

Gate driver IC integrates the high side and low side gate driver and requires external bootstrap capacitor and diode.

The MOSFET selection is a dual MOSFET in PG-TISON-8 (SuperSO8) package from OPTIMOS

TM

Infineon´s

family. Main figure of merits are shown in Table 2. The board is prepared as well to be operated at different

PWM frequencies. However, example codes are typically set up for PWM frequencies between 100 kHz and

300 kHz.

Table 2 Dual MOSFET - BSC0924NDI -figure of merits

Specification

Drain to source max voltage

Name

V

DS

Value Q1 (high side) Value Q2 (low side)

30V 30V

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Hardware Description

Specification Name Value Q1 (high side) Value Q2 (low side)

Resistance drain to source at V

GS

= 10V

R

DS(on), max

5m

3.7m

Resistance drain to source at V

GS

= 4.5V

R

DS(on), max

7m

5.2m

Max drain current I

D

40A 40A

The voltage sensing in both input voltage and output voltage, is done with a resistor ladder (voltage divider).

On the current side, a current transformer is utilized and provides information during the on time of the

buck converter for peak current control mode. Sensing gains are summarized in Table 3. Those values are

necessary for configuring the SW controlling the power stage.

More detailed information on current sensing can be found in section 2.5.

Table 3

Gain

Vout gain

Analog sensing gains

Value

0,78466

Vin gain 0,20930

Current sensing gain 0.96 V/A

Formula

(R91) / (R91+(R97+R98))

R96/(R96+R95)

1:125 (transformer ratio)

R44=120ohm

2.2 Board power supply

The XMC Digital Power Explorer board is designed to be powered from a 12 V DC power supply supplying a

current of 2A. The input jack is shown in Figure 2. Sw4 switch enables the supply of the board after plugging the power adapter. To indicate the status, one indicating LED –LED4- is provided on board (see Figure 2).

The LED will be “ON” when the corresponding power rail is powered.

The 12 V from VDD power rail are supplied to the XMC Digital Power Control Card. The control card internally converts that into 3.3 V to supply the MCU and other components in the control card. At the same time, the control card provides 3.3 V to XMC Digital Power Explorer board to supply the communication pin header

(PMBus

TM

connector).

Additionally, the buck converter is designed to provide 3.3 V up to 2A to the Vout connector when the buck converter is running correctly.

Figure 5 shows details of the power supply concept of the control card. More detailed circuitry can be found

in the section 3.1.

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Hardware Description

XMC Digital Power Explorer V1

Power on switch (SW4)

VDD = 12V

12V input jack

Vout = 3.3V

Vout connector

VCC_I2C = 3.3V

PMBus connector

VDD

VDD3.3

XMC Dig. P. Control Card Connector

Figure 5

Block Diagram of Power Supply Concept

Power_Block_Buck.emf

2.3 Master and slave configuration

XMC Digital Power Explorer can be chained to a second XMC Digital Power Explorer board to complete a master slave connection that can be controlled with a single XMC control card. To do that, connect

“MASTER_OUT” signals from the board where the XMC control card is plugged, into the “SLVE_IN” connector

of the slave board. This is shown in Figure 6.

BUCK0 BUCK1

Slave in connector

Controls master buck BUCK0

Master out connector

Controls slave buck BUCK1 cable

Slave in connector

Master out connector

XMC Control Card

XMC Control Card xx

Not used

Signals in connectors/cable

 PWM_TOP

 PWM_BOT

 Vin

 Vout

 Current Signal

 PWM_Blanking

BlockDiagram_Buck_Master_slave.emf

Figure 6

Diagram for a master slave connection. Control 2 Buck converters with a single XMC

In a master-slave configuration, both bucks can be controlled in voltage mode, peak current mode or a mixture of both. This is dependent only in the SW configuration of XMC in the control card side.

If communication is required –i.e. PMBus TM - the connector in the master board must be used for that purpose, as there are no signals transferred from the slave board to the master for communication and the salved communication connector is not powered on.

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Hardware Description

2.4 PMBus

TM

and UART Interface

XMC Digital Power Explorer includes a connector for communicating the buck converter with an external

interface. The connector is supplied with 3.3V from the XMC control card connector as can be seen in Figure

7 . There are 2 communication options:

PMBus

TM through I2C interface. Pull up resistors are provided on board (R109, R105)

General purpose serial communication. In case of I2C is required, it is possible to mount resistors R103 and R104 to provide the pull up functionality. Those resistors are not populated in the PCB (DNP)

Comm_connector.emf

Figure 7

Communication connector schematic detail - (DNP = not populated component)

The communication can be used to send commands to XMC Digital Power Explorer. For example it is possible to modify the Vout target value, or to read the status of the converter.

2.4.1 Test points

Within XMC Digital Power Explorer card there are a total of 22 test points that are listed in Table 4. This will

help the user to inspect different points of interest and learn how the buck converter behaves in detail.

Table 4 Test points description

Test point name Test point number

PWM_TOP

PWM_BOT

INJ1/INJ2

GND

VIN

VOUT

VOUT_FILT

VOUT (ADC)

Description

TP1

TP2

TP7/TP6

High side MOSFET PWM signal

Low side MOSFET PWM signal

Injection points for network analyzers

TP3,TP10, TP15, TP16

TP18, TP23, TP24,

TP25

TP9

TP19

8 GND test points for oscilloscope probe grounding

Input voltage

TP5

TP8

Output voltage

Output voltage after additional filtering

Vout signal delivered to XMC

ADC

Type of test point

Orange

Orange

Orange

Black/SMD

Not mounted SMD

Not mounted SMD

SMD

SMD

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Hardware Description

Test point name Test point number Description Type of test point

SW1-SW3

Switching node

TP20, TP21, TP22

TP17

Used for triggering oscilloscope while testing step response of buck

SMD

Node between both MOSFETs and buck inductor

Not mounted SMD

(positioned next to

Q1)

GPO1, GPO2 TP13, TP14

General purpose test points connected to general purpose pins of XMC for signalization

(i.e. CPU load)

SMD

CUR TP12

Current signal out of current transformer (only during ON time) delivered to XMC comparator input

SMD

Additionally to test points, XMC Digital Power Explorer power board includes a general purpose switch –SW5

connected to GP3 in connector (see Figure 2). This can be used by the user to signalize XMC, when to apply a

specific action, for example, change the control scheme.

2.5 Current signal conditioning

The current of the buck converter is measured with a current transformer –T1- as shown in Figure 8 , located

between Vdd and the buck converter high side transistor. The current transformer has a turn ratio of 1:125.

The secondary winding signal is half wave rectified –D2- and divided with a 120Ω resistor-R44. This results in a 120/125 gain which means that 1A in the buck converter translate into 0.96V in the MCU pin. Before the signal is delivered to the MCU, an RC filter (R93 and C6) is constructed to reduce high frequency spikes. The -

3dB frequency of this filter is slightly above 10MHz. As a consequence, only the current during the PWM ON time is reflected in the signal BUCK0_ISENSE. When Q1 transistor is in OFF state, the inductor current cannot be sensed in T1

Figure 8

Current sensing circuit

The current signal is then transferred to the XMC control card connector with the name BUCK0_ISENSE. This can be connected to a comparator to detect the peak current of the buck converter. The current signal can as well be suppressed with the help of signal BUCK0_PWM_BLANKING. This signal must be connected to a

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Hardware Description

XMC port pin. port pin in XMC configured as open drain. A resistor is in series to this signal to limit the current t flowing into

During the active time of that port pin, the current signal will be forced to GND and therefore not detected in the comparator. This is an implementation of the blanking time that can avoid early switching of the comparator. However this is not always necessary as in most cases RC filter (R93-C6) effect is enough.

2.5.1 Jumper SV5 usage for slope compensation

XMC Digital Power Explorer includes a jumper to select between 2 different ways of generating slope

compensation as shown in Figure 9:

XMC4000 position: in this case, GND is connected to pin 1 of the current transformer. This will permit

XMC4200 (for example) to implement internally slope compensation. This is done by using Comparator and Slope Generation peripheral (CSG) in XMC4200 microcontroller. This module includes a Comparator and a DAC with automatic slope generation. Therefore there is no need to implement slope compensation in buck converter hardware.

XMC1000 position: in this position, the generated voltage ramp on C7 connects to pin 1 of the current transformer. This will add that ramp voltage to the current signal with the effect that a slope is added.

The slope increases while BUCK_PWM_TOP is active and decreases the rest of the time. This is useful for devices like XMC1300 where the comparators do not have an automatic slope generation that can be supplied to the comparator integrated in it.

Slope_comp_SV5_jumper.emf

Slope compensation to be done by microcontroller

Slope compensation selection jumper (SV5)

Slope compensation (Vramp added) is done in HW

Figure 9

Figure 9 depicts a detail schematic view of the 2 different jumper positions and how the signals are routed to

build an automatic slope generation. In the blue position-XMC4000-, the microcontroller must take care of the slope compensation, if necessary. This is labeled as XMC4000 because XMC4000 family includes the

HRPWM module with its CSG – comparator and slope generation- submodule. This peripheral includes a

DAC capable of automatically generate the necessary ramp to compensate the peak current signal

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Hardware Description

Current with added slope

Current without added slope

Vramp

Figure 10

Slope_comp_sch_options.emf

Slope compensation option schematic detail. Depending on the jumper position, a ramp will be added or not to the current signal

2.6 Connection to network analyzer

Typically, during the design of power supplies, a verification step is to analyze the frequency response of the system. In this way, it is possible to measure gain margin and phase margin and design for a robust control loop.

A network analyzer is responsible to inject a variable frequency signal into a small shunt in the circuit. At the same time, the network analyzer can measure transfer function for each given frequency of the input. In that way it is able to plot the bode diagram of that power supply.

XMC Digital Power Explorer is prepared to be used with network analyzer and includes test points (INJ1/2) as well as a shunt resistor –R97- with a resistance value of 24Ω to help measuring the bode diagram of the power stage.

Figure 11 shows how to set up the connection of XMC Digital Power Explorer to a network analyzer. Red and

black signal represents the injected voltage with variable frequency, whereas the yellow and purple lines represent the measurement paths for the analyzers to capture the amplitude of the transfer function.

Injection resistor

R97 = 24ohms

+

Output

ch2

Input ch1

Network analyzer

Netw_analyzer_connection.emf

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Hardware Description

Figure 11

Network analyzer connection diagram

2.7 XMC Digital Power Control Card Connector

The XMC Digital Power Explorer includes a control card connector compatible with XMC4200 Digital Power

Control Card and with XMC1300 Digital Power Control Card. This connector provides to and receives from the control card, relevant signals for the control, supply or communication of the buck converter. The signals available in the connector are:

2 pairs of complementary PWM signals: buck0 (master) and buck1 (slave).

4 ADC analog inputs: Vout and Vin for both buck0 and buck1.

2 comparator inputs: peak current detection for both buck0 and buck1.

2 serial channels

4 general purpose pins

Sch_control_card_connector.emf

Figure 12

Control card power connector schematic

Attention:

The power board connector is also providing the power supply for the power GND supply domain. Hence it may carry hazardous voltages.

The pin out of the connector is described in detail in Table 5.

Table 5 Power board connector pin out

Pin number Signal Name

1 SGND

2 VDD

3

4

5

UART_TXD

PMBUS_CLK

UART_RXD

Control card port Note

- Digital GND

VDD

USIC2/GP5

12V supply to the control card

Can be used as serial port or user port pin

USIC0

USIC3/GP4

PMBus clock signal (I2C)

Can be used as serial port or user port

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30

36

37

38

39

40

31

32

33

34

35

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

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Hardware Description

Pin number Signal Name Control card port Note

PMBUS_DATA

VDD3.3

GP0

BUCK1_ISENSE

SGND

SGND

BUCK0_ISENSE

-

SGND

SGND

GP1

USIC1

VDD3.3

GP0

CMP1IN

GND

GND

CMP0IN

CMP2IN

GND

GND

GP1

BUCK1_PWM_BLANKING PWM4

-

BUCK0_PWM_BLANKING PWM5

BUCK0_PWM0_BOT

BUCK1_PWM0_BOT

BUCK1_PWM0_TOP

BUCK0_PWM0_TOP

-

SGND

GP2

BUCK1_VIN

SGND

SGND

PWM0

PWM1

PWM6

PWM2

PWM7

PWM3

GND

GP2

ADC4OUT

GND

GND pin

PMBus data signal (I2C)

3.3 V output to power board

User port pin

Current signal from slave buck

Current signal of master buck

User port pin

Leading edge blanking option for slave buck

Leading edge blanking option for master buck

Low side PWM (master buck)

Low side PWM (slave buck)

High side PWM (slave buck)

High side PWM (master buck)

User port pin

Slave buck input voltage value

BUCK0_VOUT

BUCK1_VOUT

SGND

SGND

BUCK0_VIN

-

SGND

-

-

GP3

-

ADC0OUT

ADC5OUT

GND

GND

ADC1OUT

ADC6OUT

GND

ADC7OUT

ADC2OUT

GP3

ADC3OUT

Master buck output voltage value

Slave buck output voltage value

Master buck input voltage value

User port pin

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Production Data

3 Production Data

3.1 Schematics

This chapter contains the schematics of XMC Digital Power Explorer

The board has been designed with Design Spark (RS Online). The full PCB design data of this board can also be downloaded from www.infineon.com/xmc-dev .

Figure 13

Schematic of XMC Digital Power Explorer

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Lay_XMC_EXP.emf

Figure 14

Layout top view of XMC Digital Power Explorer

3.2 Component Placement

In Figure 15 the placement of components is shown in a layout view of the top layer of XMC Digital Power

Explorer

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Component_placement.emf

Figure 15

Layout top level view of XMC Digital Power Explorer

3.3 Bill Material (BOM)

This board has been done in collaboration with Würth Elektronik. In Figure 16, the different components from Infineon and Würth Elektronik are highlighted. In Table 6 a complete bill of material is given.

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Production Data

Gate driver

IRS2011SPBF

High side and low side

MOSFETs

BSC0924NDI

Current transformer

LED

Electrolitic and ceramic capacitors

Power adapter jack

LEDs

Connector

2.54 mm pin headers

General purpose button

Board feet

Infineon Component

Würth Elektronik

Component

SMT Box 2.54 mm pin header

Inductors

2mm 40 positions female connector

Board_Components_Buck.emf

Figure 16

Components from Infineon and Würth Elektronik

Table 6 Bill of Material List

No. Device / Description

1

2

3

4

5

6

SW_SPDT_TH_2A

Test Pin SM

BAS16W

BAT54-05W

BAS30

BSC0924NDI

7

8

IRS2011SPBF

TP_THT_Orange

9 TP_THT_Black

10 C-2.2uF-1206-50V

11 SMD Resistor 22R 1210

12 SMD Resistor 3R9 1210

13 SMD Resistor 33R 0603

14 SMD Resistor 2K 0603

15 SMD Resistor 0R 0603

16 SMD Resistor 10R 0603

17 SMD Resistor 100R 1206

18 SMD Resistor 0R15 1206

19 SMD Resistor 3K3 0603

Board User Manual

Quantity Position

1

4

1

1

2

16

98

4

2

1

4

6

1

1

9

1

1

1

1

SW1, SW2, SW3, SW4

TP5, TP8, TP12, TP13, TP14, TP16, TP20, TP21, TP22

D2

D3

D4

Q1

U2

TP1, TP2, TP6, TP7

TP3, TP10, TP18, TP23,TP24, TP25

C4

R1-R8, R144-R150, R85

R9-R40, R45-R84, R113-R123, R125, R128-R131, R134-R143

R100-R102, R106

R105, R109

R112

R124, R88, R89, R92

R126

R127

R132, R99

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20 SMD Resistor 5R1 0603

21 SMD Resistor 330R 1210

22 SMD Resistor 2K2 0603

23 SMD Resistor 120R 0603

24 SMD Resistor 10K 0603

25 SMD Resistor 15K 0805

26 SMD Resistor 1K8 0603

27 SMD Resistor 1K5 0603

28 SMD Resistor 5K1 0603

29 SMD Resistor 6K8 0603

30 SMD Resistor 24R 0603

31 SMD Resistor 470R 0603

32 C-WE-220uF-SMD-25V

33 C-WE-100nF-0603-50V

34 C-WE-2.2nF-0603-50V

35 C-WE-680pF-0603-16V

36 C-WE-100nF-1206-50V

37 C-WE-100nF-0805-50V

38 C-WE-10pF-0603-50V

39 C-WE-330pF-0805-50V

40 C-WE-22uF-SMD-35V

41 C-WE-22uF-1206-10V

42 WA-SNTI 6mm Spacer

43 WR-PHD 40 way Header

44

WR-DC DC Power Jack

5.5/2.5

1

45

WR-BHD 8 way SMT Box

Header

2

46 WR-PHD 10 way Header THT 1

47

WR-TBL 2 Way Terminal

Block

1

48 WE-PD 22 µH 5.3A Inductor 1

49

50

51

WE-LHMI 0.47 µH 11.5A

SMD

LED-WE-RED-1206

WR-PHD 4 way Header

1

4

1

52 WS-SHT SPDT Switch THT 1

53 WE-CST 1:125 Current Sense 1

1

4

1

2

1

1

1

2

4

1

1

2

1

1

1

1

2

1

2

1

1

1

3

1

R133

R151

R41, R42, R43

R44

R86, R87

R90

R91, R96

R93

R94

R95

R97

R98

C0, C1

C11, C14, C17, C18

C12

C13

C15, C16

C2, C5

C6

C7

C8

C9

H1-H4

J1

J2

J3, J4

J5

J6

L1

L3

LED1-LED4

SV5

SW5

T1

Board User Manual 19 V1.0, 2015-10

Customer Documentation

XMC Digital Power Explorer Power Board User Manual

UG_201511_PL30_001

Revision History

4 Revision History

Current Version is V1.0, 2015-10

Page or Reference Description of change

V1.0, 2015-10

Public version

Board User Manual 20 V1.0, 2015-10

Customer Documentation

Trademarks of Infineon Technologies AG

µHVIC™, µIPM™, µPFC™, AU-ConvertIR™, AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolDP™, CoolGaN™, COOLiR™, CoolMOS™, CoolSET™, CoolSiC™,

DAVE™, DI-POL™, DirectFET™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™,

GaNpowIR™, HEXFET™, HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™,

OPTIGA™, OptiMOS™, ORIGA™, PowIRaudio™, PowIRStage™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, SmartLEWIS™, SOLID

FLASH™, SPOC™, StrongIRFET™, SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™

Trademarks updated November 2015

Other Trademarks

All referenced product or service names and trademarks are the property of their respective owners.

www.infineon.com

Edition 2015-10

Published by

Infineon Technologies AG

81726 München, Germany

© 2015 Infineon Technologies AG.

All Rights Reserved.

Do you have a question about this document?

Email: [email protected]

Document reference

UG_201511_PL30_001

IMPORTANT NOTICE

The information given in this document shall in no event be regarded as a guarantee of conditions characteristics or

(“Beschaffenheitsgarantie”) .

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon

Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party.

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications.

The data contained in this document is exclusively intended for technically trained staff.

It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office

(

www.infineon.com

).

WARNINGS

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon

Technologies office.

Except as otherwise explicitly approved by Infineon

Technologies in a written document signed by authorized representatives of Infineon Technologies,

Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.

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