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XMC4000/XMC1000
32-bit Microcontroller Series for Industrial Applications
XMC Digital Power Explorer Power Board
User Manual
UG_201511_PL30_001
Board User Manual
Scope and purpose
This document describes the features and hardware details of XMC Digital Power Explorer, designed to provide an evaluation platform for digital control applications with Infineon XMC ARM
®
Cortex
™ microcontrollers. This board is part of Infineon’s Digital Power Control Application Kit.
Applicable Products
XMC4200 Microcontroller
XMC1300 Microcontroller
XMC Digital Power Explorer Kit
DAVE™
References (optional, may be shifted to Appendix)
Infineon: DAVE™, http://www.infineon.com/DAVE
Infineon: XMC Family, http://www.infineon.com/XMC
XMC Digital Power Explorer, http://www.infineon.com/xmc_dp_exp
Example codes for this board, www.infineon.com/DAVE
Customer Documentation 1 V1.0, 2015-10
XMC Digital Power Explorer Power Board User Manual
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Table of Contents
Table of Contents
Board User Manual 2 V1.0, 2015-10
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XMC Digital Power Explorer Power Board User Manual
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Overview
1 Overview
The XMC Digital Power Explorer is an evaluation board with the goal to help engineers in the learning and testing of digital power control applications. The board features a synchronous buck converter that can be controlled digitally with XMC microcontrollers. Synchronous buck converter is one of the most well known power topologies and many of the concepts of it can be ported to other power stages, what makes the synchronous buck converter a great platform for leaning and experimenting.
Different control cards can be plugged in to allow the user to select between different price/performance combinations available in XMC family of microcontrollers.
Both voltage control and peak current control with slope compensation can be implemented in this board.
This board includes loads on board for easy test of step response. Frequency behaviour can be analyized with the help of a network analyser. XMC Digital Power Explorer is ready for signal injection from network analyser equipment to study the frequency response of the buck stage.
This board is built with best in class Infineon Technologies components and with the collaboration of
Biricha Digital and Würth Elektronik .
1.1 Key features
The XMC Digital Power Explorer power board is equipped with the following features:
Synchronous buck converter capable of: o
Synchronous and non-synchronous buck converter modes o
Voltage and peak current control methods o
2 channel bucks with 1 XMC. Connecting a second XMC Digital Power Explorer in master-
slave configuration (see section 2.3)
o
3 on board loads for testing step response with option to connect external loads –i.e. electronic loads- for further advanced testing. o
Bode diagram measurement ready - requires network analyzer o
Dual channel serial communication including PMBus™ (I2C)communication
Control card connector for plugging in: o
Infineon XMC4200 Digital Power Control Card with XMC4200 (ARM ®
Microcontroller, 256 kByte on-chip Flash, LQFP64
Cortex
™
-M4F-based) o
Infineon XMC1300 Digital Power Control Card with XMC1300 (ARM
®
Cortex
™
-M0-based)
Microcontroller, up to 200 kByte on-chip Flash, TSSOP38
Single package high side and low side MOSFET
Plenty of test points for learning all details of the buck converter
General purpose switch for user interaction or control
1.2 Block diagram
the power supply domains please refer to chapter 0.
The buck converter board is comprised of the following building blocks:
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XMC Digital Power Explorer Power Board User Manual
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Overview
1 XMC Digital Power Control Card Connector compatible with XMC4200 and XMC1300 control cards. XMC
Digital Power Explorer includes 2 PCB openings to the sides of the control card connector. This hinders wrong connection of the control card.
Power adapter input jack to plug in 12 V DC adapter. Includes switch to interrupt the supply
PMBus
TM
and UART communication options. Pull up resistors included on board for I2C communication support. Pulls up are supplied from XMC Digital Control Card Connector side
3 switchable loads (45%, 45%, 10%). Each is signalized with an LEDLED ON means load is active.
Voltage measurements - ADC: Vout, Vin through resistive voltage dividers
Current measurements - Comparators: inductor current through current transformer. Options for blanking (CCU) and slope compensation by HW components using provided jumper (SV5). For more
details on current sensing consult section 2.5.
2PWM complementary signals – CCUx - to high and low side switches
Master-Slave connectors for controlling a second XMC Digital Power Explorer with a single XMC Digital
Power Control Card
XMC Digital Power Explorer V1
VIn = VDD
Power on switch (SW4)
12V input jack
Slope comp. circuit for
XMC1300
Jumper
SV5
Current signal
Vin Vout
Load Banks
PWM_TOP
PWM_BO T
C
Loa d switches
(SW1-2-3)
From master board
Slave in connector
0
To slave board
Master out connector
CMP0
Current signal
Blan kin g o ptio n for X MC130 0
2x PWM
PWM7 TOP
PWM1 BOT
2x ADC
ADC0 Vout
ADC1 Vin
Data/clk
Communication connector
(PMBus
TM
and
UART)
3.3 V
COMP CCU CCU8 ADC USIC
XMC Digital Power Control Card Connector
BlockDiagram_Buck.emf
Figure 1
Block Diagram of XMC Digital Power Explorer
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XMC Digital Power Explorer Power Board User Manual
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Hardware Description
2 Hardware Description
The following sections give a detailed description of the hardware and how it can be used.
Load banks
Buck converter circuit
Power ON LED and Vin test point
Power ON
Switch (SW4)
Test point for triggering step response measurements
Load ON LEDs
Load bank switches
SW1, 2, 3
Input voltage jack
Vout filtered test point
Vout alternative connector
PMBus connector
General Purpose
Switch (SW5)
Figure 2
Daisy change connectors for second power explorer (master slave)
PWM test points
Injection points for network analyzer
ADC Vout input test point
XMC Digital Power Explorer hardware description
XMC dig. pow. control card connector
Slope compensation circuit jumper
Test points GPO2,
GPO1 and Current signal
Board_Interfaces_Buck.emf
2.1 Buck converter circuit description
schematic view of the buck converter stage is shown in Figure 3. The target output voltage is 3.3V.
Nevertheless, as a buck converter, any voltages from 0V to Vin are theoretically possible depending on the driving of the MOSFETs –duty cycle.
The inductor value ensures continuous conduction mode (CCM) of the buck converter as far as any of SW3 or
SW2 load switches are in the “ON” position. In other words, DCM operation occurs only when SW1 load switch is activated assuming 200 kHz switching frequency.
Note: Depending on the buck converter configuration, for example target output voltage or load connected, the board might become hot. Read carefully the disclaimer.
Table 1 Synchronous buck converter specification
Specification
Input voltage
Output voltage
Maximum output current
Name
Vin
Vout
Iout max
On board load values -
Value
12V DC
3.3V DC (depending on SW)
2 A
3.9
Ω (SW3, SW2)45% load
22
Ω (SW1) 10% load
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Hardware Description
Specification Name Value
Main inductor
Output capacitor
L1
C0 || C1
Gate driver high and low side U2
Dual MOSFET (high and low side)
Q1
22uH
200uF || 200uF 400uF
IRS2011SPBF (International Rectifier)
BSC0924NDI (Infineon Technologies)
Buck_converter_circuit.emf
Figure 3
Synchronous buck converter circuit
Power_connector_Vin.emf
Figure 4
Synchronous buck converter power connector an Vin detail
Gate driver IC integrates the high side and low side gate driver and requires external bootstrap capacitor and diode.
The MOSFET selection is a dual MOSFET in PG-TISON-8 (SuperSO8) package from OPTIMOS
TM
Infineon´s
PWM frequencies. However, example codes are typically set up for PWM frequencies between 100 kHz and
300 kHz.
Table 2 Dual MOSFET - BSC0924NDI -figure of merits
Specification
Drain to source max voltage
Name
V
DS
Value Q1 (high side) Value Q2 (low side)
30V 30V
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Hardware Description
Specification Name Value Q1 (high side) Value Q2 (low side)
Resistance drain to source at V
GS
= 10V
R
DS(on), max
5m
Ω
3.7m
Ω
Resistance drain to source at V
GS
= 4.5V
R
DS(on), max
7m
Ω
5.2m
Ω
Max drain current I
D
40A 40A
The voltage sensing in both input voltage and output voltage, is done with a resistor ladder (voltage divider).
On the current side, a current transformer is utilized and provides information during the on time of the
necessary for configuring the SW controlling the power stage.
More detailed information on current sensing can be found in section 2.5.
Table 3
Gain
Vout gain
Analog sensing gains
Value
0,78466
Vin gain 0,20930
Current sensing gain 0.96 V/A
Formula
(R91) / (R91+(R97+R98))
R96/(R96+R95)
1:125 (transformer ratio)
R44=120ohm
2.2 Board power supply
The XMC Digital Power Explorer board is designed to be powered from a 12 V DC power supply supplying a
The LED will be “ON” when the corresponding power rail is powered.
The 12 V from VDD power rail are supplied to the XMC Digital Power Control Card. The control card internally converts that into 3.3 V to supply the MCU and other components in the control card. At the same time, the control card provides 3.3 V to XMC Digital Power Explorer board to supply the communication pin header
(PMBus
TM
connector).
Additionally, the buck converter is designed to provide 3.3 V up to 2A to the Vout connector when the buck converter is running correctly.
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Hardware Description
XMC Digital Power Explorer V1
Power on switch (SW4)
VDD = 12V
12V input jack
Vout = 3.3V
Vout connector
VCC_I2C = 3.3V
PMBus connector
VDD
VDD3.3
XMC Dig. P. Control Card Connector
Figure 5
Block Diagram of Power Supply Concept
Power_Block_Buck.emf
2.3 Master and slave configuration
XMC Digital Power Explorer can be chained to a second XMC Digital Power Explorer board to complete a master slave connection that can be controlled with a single XMC control card. To do that, connect
“MASTER_OUT” signals from the board where the XMC control card is plugged, into the “SLVE_IN” connector
of the slave board. This is shown in Figure 6.
BUCK0 BUCK1
Slave in connector
Controls master buck BUCK0
Master out connector
Controls slave buck BUCK1 cable
Slave in connector
Master out connector
XMC Control Card
XMC Control Card xx
Not used
Signals in connectors/cable
PWM_TOP
PWM_BOT
Vin
Vout
Current Signal
PWM_Blanking
BlockDiagram_Buck_Master_slave.emf
Figure 6
Diagram for a master slave connection. Control 2 Buck converters with a single XMC
In a master-slave configuration, both bucks can be controlled in voltage mode, peak current mode or a mixture of both. This is dependent only in the SW configuration of XMC in the control card side.
If communication is required –i.e. PMBus TM - the connector in the master board must be used for that purpose, as there are no signals transferred from the slave board to the master for communication and the salved communication connector is not powered on.
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Hardware Description
2.4 PMBus
TM
and UART Interface
XMC Digital Power Explorer includes a connector for communicating the buck converter with an external
7 . There are 2 communication options:
PMBus
TM through I2C interface. Pull up resistors are provided on board (R109, R105)
General purpose serial communication. In case of I2C is required, it is possible to mount resistors R103 and R104 to provide the pull up functionality. Those resistors are not populated in the PCB (DNP)
Comm_connector.emf
Figure 7
Communication connector schematic detail - (DNP = not populated component)
The communication can be used to send commands to XMC Digital Power Explorer. For example it is possible to modify the Vout target value, or to read the status of the converter.
2.4.1 Test points
help the user to inspect different points of interest and learn how the buck converter behaves in detail.
Table 4 Test points description
Test point name Test point number
PWM_TOP
PWM_BOT
INJ1/INJ2
GND
VIN
VOUT
VOUT_FILT
VOUT (ADC)
Description
TP1
TP2
TP7/TP6
High side MOSFET PWM signal
Low side MOSFET PWM signal
Injection points for network analyzers
TP3,TP10, TP15, TP16
TP18, TP23, TP24,
TP25
TP9
TP19
8 GND test points for oscilloscope probe grounding
Input voltage
TP5
TP8
Output voltage
Output voltage after additional filtering
Vout signal delivered to XMC
ADC
Type of test point
Orange
Orange
Orange
Black/SMD
Not mounted SMD
Not mounted SMD
SMD
SMD
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Hardware Description
Test point name Test point number Description Type of test point
SW1-SW3
Switching node
TP20, TP21, TP22
TP17
Used for triggering oscilloscope while testing step response of buck
SMD
Node between both MOSFETs and buck inductor
Not mounted SMD
(positioned next to
Q1)
GPO1, GPO2 TP13, TP14
General purpose test points connected to general purpose pins of XMC for signalization
(i.e. CPU load)
SMD
CUR TP12
Current signal out of current transformer (only during ON time) delivered to XMC comparator input
SMD
Additionally to test points, XMC Digital Power Explorer power board includes a general purpose switch –SW5
specific action, for example, change the control scheme.
2.5 Current signal conditioning
between Vdd and the buck converter high side transistor. The current transformer has a turn ratio of 1:125.
The secondary winding signal is half wave rectified –D2- and divided with a 120Ω resistor-R44. This results in a 120/125 gain which means that 1A in the buck converter translate into 0.96V in the MCU pin. Before the signal is delivered to the MCU, an RC filter (R93 and C6) is constructed to reduce high frequency spikes. The -
3dB frequency of this filter is slightly above 10MHz. As a consequence, only the current during the PWM ON time is reflected in the signal BUCK0_ISENSE. When Q1 transistor is in OFF state, the inductor current cannot be sensed in T1
Figure 8
Current sensing circuit
The current signal is then transferred to the XMC control card connector with the name BUCK0_ISENSE. This can be connected to a comparator to detect the peak current of the buck converter. The current signal can as well be suppressed with the help of signal BUCK0_PWM_BLANKING. This signal must be connected to a
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Hardware Description
XMC port pin. port pin in XMC configured as open drain. A resistor is in series to this signal to limit the current t flowing into
During the active time of that port pin, the current signal will be forced to GND and therefore not detected in the comparator. This is an implementation of the blanking time that can avoid early switching of the comparator. However this is not always necessary as in most cases RC filter (R93-C6) effect is enough.
2.5.1 Jumper SV5 usage for slope compensation
XMC Digital Power Explorer includes a jumper to select between 2 different ways of generating slope
compensation as shown in Figure 9:
XMC4000 position: in this case, GND is connected to pin 1 of the current transformer. This will permit
XMC4200 (for example) to implement internally slope compensation. This is done by using Comparator and Slope Generation peripheral (CSG) in XMC4200 microcontroller. This module includes a Comparator and a DAC with automatic slope generation. Therefore there is no need to implement slope compensation in buck converter hardware.
XMC1000 position: in this position, the generated voltage ramp on C7 connects to pin 1 of the current transformer. This will add that ramp voltage to the current signal with the effect that a slope is added.
The slope increases while BUCK_PWM_TOP is active and decreases the rest of the time. This is useful for devices like XMC1300 where the comparators do not have an automatic slope generation that can be supplied to the comparator integrated in it.
Slope_comp_SV5_jumper.emf
Slope compensation to be done by microcontroller
Slope compensation selection jumper (SV5)
Slope compensation (Vramp added) is done in HW
Figure 9
build an automatic slope generation. In the blue position-XMC4000-, the microcontroller must take care of the slope compensation, if necessary. This is labeled as XMC4000 because XMC4000 family includes the
HRPWM module with its CSG – comparator and slope generation- submodule. This peripheral includes a
DAC capable of automatically generate the necessary ramp to compensate the peak current signal
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Hardware Description
Current with added slope
Current without added slope
Vramp
Figure 10
Slope_comp_sch_options.emf
Slope compensation option schematic detail. Depending on the jumper position, a ramp will be added or not to the current signal
2.6 Connection to network analyzer
Typically, during the design of power supplies, a verification step is to analyze the frequency response of the system. In this way, it is possible to measure gain margin and phase margin and design for a robust control loop.
A network analyzer is responsible to inject a variable frequency signal into a small shunt in the circuit. At the same time, the network analyzer can measure transfer function for each given frequency of the input. In that way it is able to plot the bode diagram of that power supply.
XMC Digital Power Explorer is prepared to be used with network analyzer and includes test points (INJ1/2) as well as a shunt resistor –R97- with a resistance value of 24Ω to help measuring the bode diagram of the power stage.
black signal represents the injected voltage with variable frequency, whereas the yellow and purple lines represent the measurement paths for the analyzers to capture the amplitude of the transfer function.
Injection resistor
R97 = 24ohms
+
Output
ch2
Input ch1
Network analyzer
Netw_analyzer_connection.emf
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Figure 11
Network analyzer connection diagram
2.7 XMC Digital Power Control Card Connector
The XMC Digital Power Explorer includes a control card connector compatible with XMC4200 Digital Power
Control Card and with XMC1300 Digital Power Control Card. This connector provides to and receives from the control card, relevant signals for the control, supply or communication of the buck converter. The signals available in the connector are:
2 pairs of complementary PWM signals: buck0 (master) and buck1 (slave).
4 ADC analog inputs: Vout and Vin for both buck0 and buck1.
2 comparator inputs: peak current detection for both buck0 and buck1.
2 serial channels
4 general purpose pins
Sch_control_card_connector.emf
Figure 12
Control card power connector schematic
Attention:
The power board connector is also providing the power supply for the power GND supply domain. Hence it may carry hazardous voltages.
The pin out of the connector is described in detail in Table 5.
Table 5 Power board connector pin out
Pin number Signal Name
1 SGND
2 VDD
3
4
5
UART_TXD
PMBUS_CLK
UART_RXD
Control card port Note
- Digital GND
VDD
USIC2/GP5
12V supply to the control card
Can be used as serial port or user port pin
USIC0
USIC3/GP4
PMBus clock signal (I2C)
Can be used as serial port or user port
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30
36
37
38
39
40
31
32
33
34
35
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
XMC Digital Power Explorer Power Board User Manual
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Hardware Description
Pin number Signal Name Control card port Note
PMBUS_DATA
VDD3.3
GP0
BUCK1_ISENSE
SGND
SGND
BUCK0_ISENSE
-
SGND
SGND
GP1
USIC1
VDD3.3
GP0
CMP1IN
GND
GND
CMP0IN
CMP2IN
GND
GND
GP1
BUCK1_PWM_BLANKING PWM4
-
BUCK0_PWM_BLANKING PWM5
BUCK0_PWM0_BOT
BUCK1_PWM0_BOT
BUCK1_PWM0_TOP
BUCK0_PWM0_TOP
-
SGND
GP2
BUCK1_VIN
SGND
SGND
PWM0
PWM1
PWM6
PWM2
PWM7
PWM3
GND
GP2
ADC4OUT
GND
GND pin
PMBus data signal (I2C)
3.3 V output to power board
User port pin
Current signal from slave buck
Current signal of master buck
User port pin
Leading edge blanking option for slave buck
Leading edge blanking option for master buck
Low side PWM (master buck)
Low side PWM (slave buck)
High side PWM (slave buck)
High side PWM (master buck)
User port pin
Slave buck input voltage value
BUCK0_VOUT
BUCK1_VOUT
SGND
SGND
BUCK0_VIN
-
SGND
-
-
GP3
-
ADC0OUT
ADC5OUT
GND
GND
ADC1OUT
ADC6OUT
GND
ADC7OUT
ADC2OUT
GP3
ADC3OUT
Master buck output voltage value
Slave buck output voltage value
Master buck input voltage value
User port pin
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Production Data
3 Production Data
3.1 Schematics
This chapter contains the schematics of XMC Digital Power Explorer
The board has been designed with Design Spark (RS Online). The full PCB design data of this board can also be downloaded from www.infineon.com/xmc-dev .
Figure 13
Schematic of XMC Digital Power Explorer
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Lay_XMC_EXP.emf
Figure 14
Layout top view of XMC Digital Power Explorer
3.2 Component Placement
Explorer
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Component_placement.emf
Figure 15
Layout top level view of XMC Digital Power Explorer
3.3 Bill Material (BOM)
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Gate driver
IRS2011SPBF
High side and low side
MOSFETs
BSC0924NDI
Current transformer
LED
Electrolitic and ceramic capacitors
Power adapter jack
LEDs
Connector
2.54 mm pin headers
General purpose button
Board feet
Infineon Component
Würth Elektronik
Component
SMT Box 2.54 mm pin header
Inductors
2mm 40 positions female connector
Board_Components_Buck.emf
Figure 16
Components from Infineon and Würth Elektronik
Table 6 Bill of Material List
No. Device / Description
1
2
3
4
5
6
SW_SPDT_TH_2A
Test Pin SM
BAS16W
BAT54-05W
BAS30
BSC0924NDI
7
8
IRS2011SPBF
TP_THT_Orange
9 TP_THT_Black
10 C-2.2uF-1206-50V
11 SMD Resistor 22R 1210
12 SMD Resistor 3R9 1210
13 SMD Resistor 33R 0603
14 SMD Resistor 2K 0603
15 SMD Resistor 0R 0603
16 SMD Resistor 10R 0603
17 SMD Resistor 100R 1206
18 SMD Resistor 0R15 1206
19 SMD Resistor 3K3 0603
Board User Manual
Quantity Position
1
4
1
1
2
16
98
4
2
1
4
6
1
1
9
1
1
1
1
SW1, SW2, SW3, SW4
TP5, TP8, TP12, TP13, TP14, TP16, TP20, TP21, TP22
D2
D3
D4
Q1
U2
TP1, TP2, TP6, TP7
TP3, TP10, TP18, TP23,TP24, TP25
C4
R1-R8, R144-R150, R85
R9-R40, R45-R84, R113-R123, R125, R128-R131, R134-R143
R100-R102, R106
R105, R109
R112
R124, R88, R89, R92
R126
R127
R132, R99
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20 SMD Resistor 5R1 0603
21 SMD Resistor 330R 1210
22 SMD Resistor 2K2 0603
23 SMD Resistor 120R 0603
24 SMD Resistor 10K 0603
25 SMD Resistor 15K 0805
26 SMD Resistor 1K8 0603
27 SMD Resistor 1K5 0603
28 SMD Resistor 5K1 0603
29 SMD Resistor 6K8 0603
30 SMD Resistor 24R 0603
31 SMD Resistor 470R 0603
32 C-WE-220uF-SMD-25V
33 C-WE-100nF-0603-50V
34 C-WE-2.2nF-0603-50V
35 C-WE-680pF-0603-16V
36 C-WE-100nF-1206-50V
37 C-WE-100nF-0805-50V
38 C-WE-10pF-0603-50V
39 C-WE-330pF-0805-50V
40 C-WE-22uF-SMD-35V
41 C-WE-22uF-1206-10V
42 WA-SNTI 6mm Spacer
43 WR-PHD 40 way Header
44
WR-DC DC Power Jack
5.5/2.5
1
45
WR-BHD 8 way SMT Box
Header
2
46 WR-PHD 10 way Header THT 1
47
WR-TBL 2 Way Terminal
Block
1
48 WE-PD 22 µH 5.3A Inductor 1
49
50
51
WE-LHMI 0.47 µH 11.5A
SMD
LED-WE-RED-1206
WR-PHD 4 way Header
1
4
1
52 WS-SHT SPDT Switch THT 1
53 WE-CST 1:125 Current Sense 1
1
4
1
2
1
1
1
2
4
1
1
2
1
1
1
1
2
1
2
1
1
1
3
1
R133
R151
R41, R42, R43
R44
R86, R87
R90
R91, R96
R93
R94
R95
R97
R98
C0, C1
C11, C14, C17, C18
C12
C13
C15, C16
C2, C5
C6
C7
C8
C9
H1-H4
J1
J2
J3, J4
J5
J6
L1
L3
LED1-LED4
SV5
SW5
T1
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Revision History
4 Revision History
Current Version is V1.0, 2015-10
Page or Reference Description of change
V1.0, 2015-10
Public version
Board User Manual 20 V1.0, 2015-10
Customer Documentation
Trademarks of Infineon Technologies AG
µHVIC™, µIPM™, µPFC™, AU-ConvertIR™, AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolDP™, CoolGaN™, COOLiR™, CoolMOS™, CoolSET™, CoolSiC™,
DAVE™, DI-POL™, DirectFET™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™,
GaNpowIR™, HEXFET™, HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™,
OPTIGA™, OptiMOS™, ORIGA™, PowIRaudio™, PowIRStage™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, SmartLEWIS™, SOLID
FLASH™, SPOC™, StrongIRFET™, SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™
Trademarks updated November 2015
Other Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
www.infineon.com
Edition 2015-10
Published by
Infineon Technologies AG
81726 München, Germany
© 2015 Infineon Technologies AG.
All Rights Reserved.
Do you have a question about this document?
Email: [email protected]
Document reference
UG_201511_PL30_001
IMPORTANT NOTICE
The information given in this document shall in no event be regarded as a guarantee of conditions characteristics or
(“Beschaffenheitsgarantie”) .
With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon
Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party.
In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications.
The data contained in this document is exclusively intended for technically trained staff.
It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the
For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office
(
www.infineon.com
).
WARNINGS
Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon
Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.
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