WGM110 Wi-Fi

®

Module Data Sheet

The Wizard Gecko WGM110 is an all-inclusive Wi-Fi

®

Module targeted for applications where good RF performance, low-power consumption, and easy application development, together with fast time to market, are key requirements. WGM110 has excellent

RF performance and can provide long range with robust wireless connectivity.

The WGM110 Module integrates all of the necessary elements required for an IoT Wi-Fi application, including an 802.11b/g/n radio, integrated antenna, certifications, a microcontroller, Wi-Fi and IP stacks, an HTTP server, and multiple protocols, such as TCP and UDP. WGM110 can act as a Wi-Fi client or be used as a Wi-Fi access point, making the provisioning of the device as easy as surfing on the web. WGM110 can host

BGScript end user applications, which means applications can be designed without relying on an external microcontroller. Alternatively, the Wi-Fi Module can run in Network

Co-Processor (NCP) mode, leaving the complexity of TCP/IP networking to the Module so that the customer’s own host controller can be fully dedicated to processing the customer application tasks. The WGM110 Module also has highly flexible hardware interfaces which allows connection to different peripherals and sensors.

In addition to the Wi-Fi Module itself, Silicon Labs offers support to guide and help developers in using WGM110 to build IoT applications, enabling a quick time to market.

KEY POINTS

• 802.11b/g/n compliant

• TX power: +16 dBm

• RX sensitivity: -98 dBm

• Range: 450 m

• CPU core: 32-bit ARM ®

Cortex-M3

• Flash memory: 1 MB

• RAM: 128 kB

• Modular certification (pending)

• FCC

• IC

• Japan

• Korea

• CE compliant (pending)

• Can host applications

• Small size: 21.0 x 14.4 x 2.0 mm

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Module Data Sheet

Key Features

1. Key Features

The key features of the WGM110 Module are listed below.

Radio Features

• Integrated antenna

• TX Power: +16 dBm

• RX Sensitivity: -98 dBm

• Range: 450 m

Wi-Fi Features

• 802.11: b/g/n

• Bit rate: 72.2 Mbps

• 802.11 Security: WPA2/WPA Personal, WPA2/WPA Enterprise and WEP

• STA (Station Mode)

• SoftAP (Soft Access Point Mode): up to 5 clients

• WPS: 1.0 (push-button)

Hardware Interfaces

• Host interface: UART/SPI/USB

• Peripheral interfaces

• 2 x USART (UART/SPI)

• 1 x USB (2.0 Full speed)

• 2 x I2C peripheral interfaces

• Up to 32 x GPIO with interrupts

• 8-channel 12-bit ADC

• 2 x TIMER (3 PWM's each)

• Real-time counter

Electrical Characteristics

• Supply voltage: 2.7 V to 4.8 V for the radio block

• Supply voltage: 1.98 V to 3.8 V for the processor block

IP Stack

• IP version: IPv4

• TCP: client/server

• UDP: client/server

• TCP sockets: 20+

• DHCP: client/server

• ARP

• DNS: client/server

• mDNS

• DNS-SD

• HTTP: server

• TLS/SSL: client

Power consumption

• 261 mA TX current at +16 dBM

• 81 mA RX current

• 2.2 mA associated idle consumption

• 22 μA deep sleep current

Environmental specifications

• Temperature range: -40°C to +85°C

Modular certification (pending)

• FCC

• IC

• Japan

• South-Korea

Software APIs

• BGAPI ™

serial protocol API over UART/SPI/USB for modem usage

• BGLIB ™

host API which implements BGAPI serial protocol

• BGScript ™

scripting language for standalone usage

CE Compliant (pending)

Dimensions

• W x L x H: 21.0 mm x 14.4 mm x 2.0 mm

Software Development Tools

• Free SDK

MCU Features

• ARM ®

Cortex-M3

• 48 MHz

• 128 kB RAM

• 1 MB Flash

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Module Data Sheet

Pinout

2. Pinout

This section describes the pinout of the WGM110 Module.

Pads on the middle of the Module are intended for ground connections and for RF test and production programming, while pads on the

Module edges consist of general purpose input/output, power supply voltage input, ground, and reset signal connections.

Figure 2.1. WGM110 Pinout (Top View)

2.1 Power, Ground and Reset Pads

The table below lists the power, ground, and reset pads of the WGM110 Module.

Table 2.1. WGM110 Power, Ground, and Reset Pads

Pad number Function Description

38, 51 VDDCPU Processor core and peripheral interface power supply.

39

1, 16, 25, 40,

42, 44, 46,

48

VDDPA RF power amplifier and Wi-Fi core power supply

GND Ground.

All ground pads are connected together internally.

Connect ground pads directly to a solid ground plane with maximum number of vias in close proximity to pads especially at the antenna end.

These ground pads also act as thermal paths which should be used to conduct heat from the module to the

PCB.

24

37

VBUS

Do not use thermal reliefs on ground pads.

USB VBUS detect input is used to detect the presence of an external USB port bus voltage.

When USB is not used connect VBUS to VDDCPU.

RESET Reset signal input. To reset the Module pull this line low.

The reset signals resets both the MCU and the Wi-Fi radio.

Connected to an internal pull-up, can be left floating if not needed.

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Pinout

2.2 Peripherals and GPIOs

The WGM110 has 32 GPIO pads which can be configured to various peripheral functions, like UART, I2C, USB, etc., or alternatively they can be used as general purpose I/O pads.

These peripheral functions can be typically configured to multiple pad locations on the devices. Available peripherals, locations, and

I/Os are described in the following sub-sections.

2.2.1 Peripheral and GPIO pads

The table below maps out all supported peripheral functions and the GPIOs (pads) they can be routed to.

Table 2.2. Available Peripheral Functions and GPIO Pad Mapping

PERIPHERAL AND GPIO PAD MAPPING

Port Name PA PB PC

Port Pin #

Pad #

Pad #

SDA

I2C1

SCL

SDA

DEBUG

SWCLK

SWDIO

I2C0

SCL

USART0

UART SPI

CTS CLK

RTS CS

RX MISO

TX MOSI

USART1

UART SPI

CTS CLK

RTS CS

RX MISO

TX MOSI

TIMER0

CC0

CC1

CC2

•

•

•

•

•

•

•

•

•

•

•

•

•

PD

•

•

•

•

•

•

•

•

•

•

•

PE

•

•

•

•

•

•

• •

•

•

PF

•

•

•

•

•

•

•

•

•

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Module Data Sheet

Pinout

PERIPHERAL AND GPIO PAD MAPPING

Port Name PA PB PC

Port Pin #

Pad #

Pad #

CH2

CH3

CH4

CH5

CH6

CH7

USB

DM

DP

TIMER1

CCO

CC1

CC2

ADC

CH0

CH1

•

•

•

•

•

PD

•

•

•

•

•

•

•

•

•

•

PE

•

•

•

PF

•

•

2.2.2 Peripheral Locations

Many of the peripheral functions can be configured into multiple locations on the GPIO pads. This allows a more flexible configuration of the Wi-Fi Modules GPIOs.

The following table shows the available locations and the corresponding GPIO pads.

Note: Peripheral function signals must always be grouped to a single location, combining signals from several locations to form a peripheral function is not allowed.

The configuration of the peripheral locations is defined in the hardware configuration file. See UG161: WGM110 Wi-Fi

®

Module Config-

uration User's Guide for more details.

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Module Data Sheet

Pinout

Table 2.3. GPIO Peripheral Locations

Peripheral

USART0

USART1

I2C0

I2C1

USB

TIMER0

SPI

UART

SPI

UART

RTS

SCL

SDA

SCL

SDA

DM

DP

CC0

CC1

CC2

CC0

CC1

CC2

SWCLK

SWDIO

CS

TX

RX

CTS

RTS

Signal name

MOSI

MISO

CLK

MOSI

MISO

CLK

CS

TX

RX

CTS

LOC 0

PE10

PE11

PE12

PE13

PE10

PE11

PE12

PE13

PC0

PC1

PC0

PC1

PF10

PF11

LOC 1

PD0

PD1

PD2

PD3

PD0

PD1

PD2

PD3

PD7

PD6

PB12

PB11

PA2

PE10

PE11

PE12

PF0

PF1

LOC 2

PC9

PD7

PD6

PF0

PF1

PD7

PD6

PF0

PF1

PE1

PE0

LOC 3

PE13

PE12

PC15

PC14

PE13

PE12

PC15

PC14

PD1

PD2

PD3

TIMER1

DEBUG

PA2

PC13

PC14

PC15

PF0

PF1

PF0

PF1

Note: The following notes apply to UART Locations:

• 1: USART0 as UART: LOC 5 can be used as an UART without handshake.

• 2: USART1 as UART: LOC 0 can be used as an UART without handshake.

PB11

PF0

PF1

LOC 4

PC1

PC0

PC0

PC1

PD6

PD7

PC13

LOC 5

PC0

PC1

PC0

PC1

PF1

PF0

PF0

PF1

PF2

LOC 6 NOTE

PE13

PE12

1

1

2

2

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Module Data Sheet

Pinout

2.2.3 GPIO Port Pins

The table below lists available Ports and corresponding Port pins in the WGM110 Module and the pads they can be routed to.

Table 2.4. Available GPIO Ports and Pins and Related Pads on the WGM110 Module

Pin → 15

Port ↓

Port A

14 13

Port B

Port C PC15 PC14 PC13

12 11

PB12 PB11

10

Port D

Port E PE15 PE14 PE13 PE12 PE11 PE10

Port F PF11 PF10

9

PC9

8 7 6

PA6

5 4 3 2

PA2

1 0

PC1 PC0

PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0

PE2 PE1 PE0

PF2 PF1 PF0

2.2.4 GPIO Input and Output Modes

The GPIO pins on the WGM110 Module can be configured as inputs (options are normal input with pull-up or pull-down or with pull-up with filter or pull-down with filter), outputs (maximum output current 6 mA) or disabled (tristate). The default state of the GPIO pins after reset is "disabled".

For more information on how to configure the GPIO pins and modes, see WGM110 API Reference Manual.

2.2.5 Interrupt Pins

All GPIO pins may be used as interrupts. WGM110 supports up to 14 asynchronous external pin interrupts with the following limitations:

• All pins with the same number are grouped together and multiplexed to trigger one interrupt.

• Pin 0 from any port cannot be used as an interrupt, because it is reserved for the Module’s internal operation.

Example:

• If PB11 is used as an interrupt pin, then the use of Pin 11 of any other available port as an interrupt is not allowed (PE11 and PF11 cannot be used as an interrupt).

2.3 Debug and RF Test Pads

The table below indicates the pads available for debug and RF test connections.

Table 2.5. Debug and RF Test Pads

Debug and RF Test pads

Port Name

Pad #

Pad #

Pad Name

DEBUG

SWCLK

41

SPIMISO

SWDIO

RF TEST

SPIMISO

SPIMOSI

•

43

SPICLK

RFPORT

45

SPIMOSI

•

47

SPICS

34

50

PF0

•

PF

35

52

PF1

•

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Debug and RF Test pads

Port Name

Pad #

Pad #

41

Pad Name

SPICLK

SPICS

SPIMISO

43

RFPORT

45

SPICLK

•

SPIMOSI

47

SPICS

•

WGM110 Wi-Fi

®

Module Data Sheet

Pinout

34

50

PF0

PF

35

52

PF1

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WGM110 Wi-Fi

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Module Data Sheet

Interfaces

3. Interfaces

This section describes the features and functionalities of the available host, peripheral, debug, and RF test interfaces.

3.1 Host Interfaces

One of the three available host interfaces can be used to connect an external host, typically an MCU, to the WGM110 Wi-Fi Module and use it as a Wi-Fi modem.

3.1.1 UART

UART is one of the available host interfaces on the WGM110 Module, and it is also the default host interface for the WGM110 Modules delivered from the factory.

The table below shows the features of the UART host interface:

Table 3.1. UART Host Interface Features and Default Values

Parameter

UART baud rate

Flow control

Data bits

Parity

Stop bits

Supported USARTs

Location

Host protocol

Features / Supported ranges

9600 bps - 6 Mbps

RTS/CTS

8 or 9 none, odd, even

1 or 2

USART0 or USART1

USART0

• LOC 0

• LOC 3

USART1

• LOC 1

• LOC 2

BGAPI serial protocol

Default value

115200 Kbps

Enabled

8

None

1

-

USART 0

LOC 0

BGAPI serial protocol

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Interfaces

Figure 3.1. Recommended Schematics: Connecting WGM110 with an External Host Using the UART Interface (USART0 Loc 0)

Note: In the figure above the UART interface is wired using USART0 Location 0 pins.

Note: If handshaking is required, then connect external host CTS to PE13 and external host RTS to PE12.

Note: A programming connector, as shown in the schematics, must be available in the design to enable WGM110 firmware update.

3.1.2 SPI

SPI is one of the available host interfaces on the WGM110 Module. SPI must be always enabled and configured by the user, because it is not enabled or configured as default.

The table below shows the features of the SPI host interface:

Table 3.2. SPI Host Interface Features

Parameter

SPI mode

Bit rates

Bit order

Clock polarity and phase

Supported USARTs

Supported locations

Host protocol

Features (value ranges)

SPI slave

9600 bps - 6 Mbps

MSB first

Configurable

USART0 and USART1

All locations

BGAPI serial protocol

The following figure shows the recommended schematics for connecting WGM110 with an external host over SPI. In addition to the selected USART/SPI port signals, one additional GPIO pin must be dedicated to be used as a notify signal to inform the SPI Master that data from module is available.

Note: The SPI host interface can only be used as a SPI Slave.

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Module Data Sheet

Interfaces

Figure 3.2. Connecting WGM110 with an External Host Using the SPI Interface

Note: In the figure above, the SPI interface is wired using USART0 Location 0 pins.

Note: Pin PB12 is configured as an output and used to notify the external host (SPI Master) that the WGM110 Module has data to send to the host.

3.1.3 USB

USB is one of the available host interfaces on the WGM110 Module. USB must be always enabled and configured by the user, because it is not enabled or configured as default.

The table below shows the features of the USB host interface:

Parameter

USB mode

USB version

USB device class

Host protocol

Table 3.3. USB Host Interface Features

Compatibility

USB device

2.0 Full speed

CDC/ACM (COM port)

BGAPI serial protocol

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Interfaces

The next figure shows the recommended schematics for connecting WGM110 Module with an external host over USB.

Figure 3.3. Connecting the WGM110 Module with an External Host using the USB Interface

Note: When using the USB interface, the VBUS signal should be connected to the USB host's VBUS line.

Note: If the VBUS line is not available on the host, the module's VBUS signal should be connected to the VDDCPU.

Note: If the USB is not used at all, the VBUS signal should be connected to the VDDCPU.

3.2 Peripheral Interfaces and Functions

There are several different types of peripheral interface connections available on the WGM110 Module. External sensors and peripheral chips can be connected using the USART (UART/SPI) and I2C interfaces. In addition to the above mentionedconnections, WGM110 includes two timers for PWM applications, an 8-channel 12-bit ADC converter and a real time counter.

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Interfaces

3.2.1 USART (UART/SPI)

The Universal Synchronous/Asynchronous Receiver/Transmitter (USART) provides a flexible serial I/O interface. It supports full duplex asynchronous UART communication in SPI mode up to 6 Mbps.

Software emulated RTS/CTS handshaking is supported. For this reason there may be up to two extra data bytes transmited by the

Module after the host's RTS has been pulled high.

Figure 3.4. USART

3.2.2 I2C

The I2C peripheral provides an interface between the WGM110 Module and a serial I2C bus. It is capable of acting as a I2C Master.

Standard-mode is supported, allowing transmission rates up to 100 Kbps.

Figure 3.5. WGM110 Acting as an I2C Master with Several I2C Slaves Connected to the Module

3.2.3 Timer / PWM

Timer peripherals count events and can be used to generate PWM outputs. The core of each timer is a 16-bit counter. There are two timers, each with three separate outputs configurable for PWM applications.

3.2.4 Analog to Digital Converter (ADC)

The ADC inside the WGM110 Module is based on Successive Approximation Register (SAR) architecture and has a resolution of up to

12 bits (1 MSPS). The ADC includes user selectable integrated voltage references but also allows the use of an external reference.

There are 8 fixed GPIO pins configurable for single-ended ADC inputs.

3.3 Firmware Update and RF Test Interfaces

Firmware updates can be done over the ARM Serial Wire Debug (SWD) interface, which is the recommended firmware update interface for development and production programming.

It is also possible to update the firmware using the Device Firmware Update (DFU) protocol by using an interface configured as the host interface (UART, SPI or USB).

3.3.1 ARM Serial Wire Debug (SWD)

The WGM110 Module contains a 2-wire ARM SWD interface for programming and debugging. It is recommended that the pads of this interface are exposed in the application design to allow firmware updates and debugging.

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Interfaces

3.3.2 Device Firmware Upgrade (DFU)

The firmware can be updated over the configured host interface (UART, SPI, or USB) using the Device Firmware Upgrade (DFU) protocol. This method is intended to be used for field updates of the firmware, for example, when updating the WGM110 Module firmware from a connected host using the BGAPI serial protocol.

Note: You cannot update the bootloader using the DFU protocol. Bootloader update must be done using the SWD Debug interface.

Note: In case the DFU recovery mode is not useable for any reason, the SWD bus is always available at boot when the RESET pin of the WGM110 Module is being pulled down.

3.3.3 RF Test Interface

There are dedicated pads on the WGM110 Module that are used to enable the Wi-Fi radio test modes. These test modes would typically be used if RF measurements relating to CE or any other certification requirements are needed. More specifically, RF Test pads are used to enable the TX and RX test modes of the WGM110 Module.

3.3.4 Reference Schematic for SWD Debug and RF Test Interfaces

The schematic below shows the necessary connections needed for using the SWD and RF test interfaces.

Figure 3.6. SWD Debug and RF Test Interface Connections

3.4 Real Time Counter (RTC)

The Real Time Counter is a 24-bit counter providing timekeeping functions for the WGM110 Module.

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Module Data Sheet

Module Software

4. Module Software

This section gives a short overview of the software provided with the WGM110 Module and describes the basic methods of using the

Module. The figure below shows the block diagram of the software provided with the WGM110 Module and how it relates to the software on the external host.

Figure 4.1. WGM110 Software Allows Both BGScript™ Based or Host MCU Based Control of the Module

The WGM110 Module includes full Wi-Fi and IP stacks, an HTTP server, and multiple protocols, such as TCP and UDP. Key security features include WPA2/WPA Personal and Enterprise support and TLS/SSL for end-to-end encryption. The WGM110 SDK contains all necessary tools for developing and deploying IoT applications for the WGM110 Module

The Wi-Fi Module has been designed to allow flexibility in selecting the most suitable design architecture. There are three main architectural options for using the WGM110 Module:

• Network Co-Processor (NCP) mode, in which the Module is connected to an external host MCU via the BGLIB API

• Stand-alone mode, in which the module is used to run BGScript applications

• Mixed mode, in which is a combination of the two above listed modes

Network Co-Processor (NCP) mode

The NCP mode is the choice to use when there is a need to implement a more complicated IoT application and the resources of an external MCU are needed. In the NCP mode, the external host MCU is connected to the Module using one of the three available host interfaces (UART, SPI, or USB). The WGM110 Module provides a high-level BGAPI to manage Wi-Fi as well as data connections. Silicon Labs provides a thin API layer (BGLib) written in ANSI C for the host, which can take care of creating and parsing the messages sent over the host interface. For evaluation purposes, GUI tools are also provided as part of the SDK.

Data between the WGM110 Module and the external host MCU can be routed either through the BGAPI or via another physical interface. For example, a serial-to-TCP/IP solution, if one UART interface is used for sending and receiving BGAPI commands; the second

UART can be bound with a TCP/IP socket. Data written to the second UART will be seamlessly passed to the TCP/IP socket.

Stand-alone mode

The stand-alone mode is especially suitable for more lightweight IoT applications, and there is no need for hosting an external MCU controller. This will naturally result in HW BOM cost savings. The WGM110 Module is natively running and controlled by a BGScript application.

Mixed mode

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Module Software

The WGM110 Module can also be used in a mixed mode, where both the NCP and Stand-alone approaches are used in parallel. In this case the BGScript application on the module can be run completely independent from any MCU action. Normally the approach is to automate certain processes in BGScript (e.g. Wi-Fi network scanning and connection) to relieve the host from doing these.

Note: To learn more about the WGM110 Module software, the SDK and the APIs in general please read the QSG122: WGM110 Wi-Fi

®

Module Software Quick-Start Guide.

Note: For a complete reference of the API, please read WGM110 API Reference Manual.

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Module Data Sheet

Hardware Design Guidelines

5. Hardware Design Guidelines

WGM110 is an easy-to use Module with regard to hardware application design, but certain guidelines must be followed to guarantee optimal performance. These guidelines are listed in the next sub-sections.

5.1 Power Supply Requirements

WGM110 Module consists of two separate internal blocks, the microcontroller and the Wi-Fi radio block. Individual power supplies are needed for both the MCU and the Wi-Fi radio blocks.

The WGM110 Module is designed to operate with a 3.3 V nominal input voltage supplied to the two supply inputs as follows:

• The VDDCPU powers the MCU and can be fed with a voltage between 2.0 V and 3.8 V.

• The VDDPA pad can be supplied with a voltage between 2.7 V and 4.8 V and supplies the RF power amplifier and the internal switch-mode converter powering the Wi-Fi digital core.

In lithium battery powered applications, VDDPA can be connected directly to the battery, while a regulator is needed to supply the

VDDCPU with a lower voltage, as needed by the design. Care should be taken that the supply source is capable of supplying enough current for the heavy load peaks of the power amplifier.

External high frequency bypass capacitors are not needed because the module contains the required supply filter capacitors. However, care should be taken to prevent strong switching noise from being superimposed on the supply lines. Such noise can be generated, for example, by on-board charge pump converters used in RS232 level shifters. Note that there is a total of about 20 µF of low ESR ceramic capacitors on the VDDPA line and approximately 2 µF on the VDDCPU line inside the module. When using external regulators to generate regulated supplies for the module, the stability of the regulator with the low ESR provided by these capacitors should be checked. Many low-drop linear regulators and some switched mode regulators are not stable when using ceramic output capacitors.

The datasheet of the regulator typically lists recommendations concerning suitable capacitors, including data on ESR range and/or stability curves. A regulator with a statement “stable with ceramic capacitors” is recommended.

5.2 PCB Design Guidelines

For optimal performance of the WGM110 Module, please follow these guidelines:

• Place the Module at the edge of the PCB, as shown in the figure below.

• Do not place any metal (traces, components, battery, etc.) within the clearance area of the antenna (shown in the figure below as a white rectangle between the pad rows).

• Connect all ground pads directly to a solid ground plane.

• Place the ground vias as close to the ground pads as possible.

• Do not place plastic or any other dielectric material in touch with the antenna.

Figure 5.1. Recommended Layout for WGM110 Module

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The layouts shown in the figure below will result in severely degraded RF-performance.

WGM110 Wi-Fi

®

Module Data Sheet

Hardware Design Guidelines

Figure 5.2. Non-optimal PCB Layouts for WGM110 Module

The impact of the size of the ground plane on the achievable range of the maximum range available for the WGM110 Module is shown below. As can be seen from the image, the curve indicates that the maximum range is achieved with approximately 15 - 20 mm ground plane on both sides of the Module, as indicated in the model images below the curve image. Narrower ground planes can be used but will result in compromised RF performance.

Figure 5.3. Guideline For the Achievable Range vs. Ground Plane Width

5.3 Antenna Design Guidelines

This section contains information regarding the optimal functioning of the antenna.

5.3.1 Effect of Plastic and Metal Materials

Do not place plastic or any other dielectric material in touch with the antenna.

Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes.

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Module Data Sheet

Hardware Design Guidelines

5.3.2 Locating the Module Close to Human Body

When using the Module in an application where the radio is located close to human body, the human RF exposure must be evaluated.

FCC, IC, and CE all have different standards for evaluating the RF exposure and, because of this, each standard will require a different minimum separation distance between the Module and human body. Certification of WGM110 allows the following minimum separation distances without any actions required from the end product manufacturer:

• FCC: 21 mm

• IC: 25 mm

• CE: The RF exposure must be evaluated using the end product

For FCC and IC, using the Module in end products where the separation distance is smaller than those listed above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a Class 2 Permissive Change or Change of ID to be applied to the existing FCC/IC certificates of the Module.

For CE certification, RF exposure must be evaluated using the end product in all cases.

Note: Placing the Module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus reducing range.

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Module Data Sheet

Electrical Characteristics

6. Electrical Characteristics

This section contains tables with electrical characteristics of WGM110 Module.

6.1 Absolute Maximum Ratings

The values indicated in the table below define the absolute maximum ratings for WGM110 Module.

Table 6.1. Absolute Maximum Ratings

Rating

Storage Temperature

VDDPA

VDDCPU

GPIO Terminal Voltages

Min

-40

0

0

-0.3

Max

85

6

3.8

VDDCPU + 0.3

Unit

°C

V

V

V

6.2 Recommended Operating Conditions

The values indicated in the table below define the recommended operating value ranges for WGM110 Module.

Table 6.2. Recommended Operating Conditions

Rating

Operating Temperature Range

(including internal heating)

VDDPA

VDDCPU

Min

-40

2.7

1.98

Max

85

4.8

3.8

6.3 Input/Output Terminal Characteristics

The values indicated in the table below define the input and output terminal characteristics for WGM110 Module.

Table 6.3. Digital Input/Output Terminal Electrical Characteristics

Digital terminals

Input voltage levels

VIL input logic level low

1.7 V ≤ VDD ≤ 3.6 V

VIH input logic level high

1.7 V ≤ VDD ≤ 3.6 V

Output voltage levels

VOL output logic level low, Vdd = 3.3 V, Iol = 20 mA, strongest drive

VOH output logic level high Vdd = 3.3 V, Ioh =

-20 mA, strongest drive

Internal pull-up resistor

Internal pull-down resistor

Min

-

0.7 VDD

-

0.8 × VDD

-

-

Typ

-

-

-

-

40

40

Max

0.3VDD

-

0.2 × VDD

-

-

-

Unit

°C

V

V

Unit

V

V

V

V kohm kohm

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Module Data Sheet

Electrical Characteristics

Digital terminals

Pulse width of pulses to be removed by the glitch suppression filter when enabled

Min

10

Typ Max

50

6.4 Power-on Reset

The values indicated in the table below define the power-on reset signal characteristics for WGM110 Module.

Table 6.4. Power-on Reset Characteristics

Unit

ns

Power-on Reset

Power-on reset threshold

(rising edge)

Min

-

Typ

-

6.5 Analog Digital Converter (ADC)

The values indicated in the table below define the ADC characteristics for WGM110 Module.

Table 6.5. ADC Characteristics

Max

1.96

Unit

V

Power-on Reset

Input impedance

Input voltage range (single ended)

Common mode input range

Range of external reference voltage

Resolution

ADC clock frequency

Acquisition time (programmable)

Conversion time (6-bit)

Conversion time (8-bit)

Conversion time (12-bit)

Offset error (singleended)

Integral non-linearity

Min

1

0

0

1.25

-

-

1

7

11

13

-

-

Typ

-

-

-

-

-

-

-

-

-

-

0.3

±1.2

Max

-

Vref

VDDCPU

VDDCPU

12

13

256

-

-

-

-

±3

Unit

Mohm

V

V

V bits

MHz

ADC CLK cycles

ADC CLK cycles

ADC CLK cycles

ADC CLK cycles mV

LSB

6.6 Power Consumption

The values indicated in the table below define the power consumption characteristics and the typical power consumption in practical use cases respectively for WGM110 Module.

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Module Data Sheet

Electrical Characteristics

Wi-Fi Chipset State

Continuous transmit

Continuous transmit

Continuous receive

Powered off

Powered off

Powered off

CPU EM mode

EM0

EM0

EM0

EM0

EM1

EM2

Sleep, unassociated

Associated, idle

Associated, idle

EM2

EM2

EM2

Table 6.6. Typical Power Consumption for Different Operating Modes

Current

261

242

81

24

15.7

22

120

2.2

1.1

Unit

mA mA mA mA mA

μA

μA mA mA

Description

+16 dBm, 1 Mbps

+15 dBm, 54 Mbps

1 Mbps or 54 Mbps

CPU executing program

CPU in idle state

Module deepest power down state

CPU and Wi-Fi chipset in sleep state

DTIM=1, 100 ms beacon period

DTIM=3, 100 ms beacon period

802.11 Standard

b g / n

-

-

-

-

-

-

-

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802.11b

-

-

-

1 Mbps

2 Mbps

5.5 Mbps

-

11 Mbps

WGM110 Wi-Fi

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Module Data Sheet

RF Characteristics

7. RF Characteristics

This section contains tables with RF characteristics of the WGM110 Module.

7.1 Supported Frequencies

Supported frequencies for WGM110 Module are listed in the table below.

Table 7.1. Supported Frequencies

Parameter

Frequency

Channels CLIENT MODE

Channels AP MODE

Min

2412

1

1

Max

2472

13

11

Unit

MHz

-

-

Note: WGM110 detects the regulatory domain according to 802.11d and adjusts the number of approved channels accordingly.

7.2 Typical Receiver Sensitivity

Typical receiver sensitivity values for the WGM110 Module at different throughput values are listed in the table below.

Table 7.2. Typical Receiver Sensitivity

Typ

-98 dBm

-96 dBm

-95 dBm

-90 dBm

-

-

-

-

802.11g

6 Mbps

9 Mbps

12 Mbps

18 Mbps

24 Mbps

36 Mbps

48 Mbps

54 Mbps

Typ

-93 dBm

-92 dBm

-90 dBm

-87 dBm

-85 dBm

-81 dBm

-76 dBm

-74 dBm

802.11n Short

GI

6.5 Mbps

13 Mbps

19.5 Mbps

26 Mbps

39 Mbps

52 Mbps

58.5 Mbps

65 Mbps

Typ

-92 dBm

-88 dBm

-86 dBm

-83 dBm

-79 dBm

-75 dBm

-72 dBm

-69 dBm

802.11n Long

GI

7.2 Mbps

14.4 Mbps

21.7 Mbps

28.9 Mbps

43.3 Mbps

57.8 Mbps

65 Mbps

72.2 Mbps

Typ

-93 dBm

-91 dBm

-88 dBm

-85 dBm

-81 dBm

-76 dBm

-73 dBm

-70 dBm

7.3 Transmitter Power at Maximum Setting

Transmitter output power values at maximum setting for WGM110 Module are listed in the table below.

Table 7.3. Transmitter Output Power at Maximum Setting

Modulation type

802.11b

802.11g

802.11n

Typ

+16

+15

+15

7.4 Antenna Characteristics

This sub-section contains information describing the characteristics of the chip antenna on WGM110 Module.

Unit

dBm dBm dBm

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7.4.1 Typical Antenna Performance

Typical antenna performance values for WGM110 Module are listed in the following table.

Parameter

Antenna efficiency

Antenna peak gain

Table 7.4. Typical Antenna Performance for WGM110 Module

Typical value

- 2 ... -6

+1 ... -2

WGM110 Wi-Fi

®

Module Data Sheet

RF Characteristics

Unit

dB dBi

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Module Data Sheet

RF Characteristics

7.4.2 Typical Radiation Pattern Plot of WGM110

Typical 3D radiation pattern plot for the Wizard Gecko WGM110 Module is shown in the figure below. Application layout and mechanics in close proximity to the antenna have an effect on the antenna radiation pattern, antenna efficiency, and peak gain. Optimal PCB size with regard to the effect on the antenna performance is indicated in

Figure 5.3 Guideline For the Achievable Range vs. Ground Plane

Width on page 17 . Typically peak gain is achieved in the direction pointing away from the largest ground plane.

Figure 7.1. Typical 3D Radiation Pattern for WGM110 Module

Figure 7.2. Corresponding WGM110 Module position

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Module Data Sheet

Physical Dimensions and PCB Land Pattern

8. Physical Dimensions and PCB Land Pattern

This section contains dimensional drawings of the WGM110 Module and the recommended PCB land pattern dimensions.

8.1 Module Top View Dimensions

Figure 8.1. Top View Dimensions for WGM110 Module

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8.2 Module Side View Dimensions

WGM110 Wi-Fi

®

Module Data Sheet

Physical Dimensions and PCB Land Pattern

Figure 8.2. Side View Dimensions for WGM110 Module - Side and Antenna End Views

8.3 Recommended PCB Land Pattern

Figure 8.3. Recommended PCB Land Pattern for WGM110 Module

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WGM110 Wi-Fi

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Module Data Sheet

Soldering Recommendations

9. Soldering Recommendations

This section describes the soldering recommendations regarding WGM110 Module.

WGM110 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations.

• Use the following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus, the following recommendations should be taken as a starting point guide.

• Refer to technical documentations of particular solder paste for profile configurations.

• Avoid using more than one flow.

• Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150 μm stencil thickness is recommended.

• Aperture size of the stencil should be 1:1 with the pad size.

• A low residue, “no clean” solder paste should be used due to low mounted height of the component.

• If the vias used on the application board have a diameter larger than 0.3 mm, it is recommended to mask them at the module side to prevent solder wicking through the via holes. Solders have a tendency to fill holes and leave voids in the thermal pad solder junction, as well as form solder balls on the other side of the application board which can in some cases be problematic.

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WGM110 Wi-Fi

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Module Data Sheet

Tape and Reel Packaging

10. Tape and Reel Packaging

This section contains information regarding the tape and reel packaging for the Wizard Gecko WGM110 Wi-Fi Module including shipment packaging information.

10.1 Tape Material and Dimensions

• Tape material: Polystyrene (PS)

• Tape length/reel: 53.4 m

• Tape surface resistivity: 10 4

... 10

9

Ω/sq.

• Curvature of the tape / 100 mm of tape: Complies with EIA-481 standard

• Maximum radius of unmarked round corners: 0.2 mm

• Cumulative tolerance of any 10 consecutive sprocket holes: ± 0.2 mm

• Cover tape peel strength: The peeling force required to tear the cover tape from the carrier tape will fall within tthe range of 0.1

Newton to 1.3 Newton (10 to 130 grams) at peeling speed to 300 mm per minute. This complies with the EIA standard.

• Cover tape adhesion method: pressure sensitive

Figure 10.1. Tape Dimensions - Top View

Figure 10.2. Dimensions of the Module Slot on Tape

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WGM110 Wi-Fi

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Module Data Sheet

Tape and Reel Packaging

10.2 Reel Material and Dimensions

• Reel material: Polystyrene (PS)

• Reel diameter: 13 inches (330 mm)

• Number of modules per reel: 500 pcs

• Environmental standard of reel materials: Delta Management Standard for Environnment related substances

• Disk deformation, folding whitening and mold imperfections: Not allowed

• Disk set: consists of two 13 inch (330 mm) rotary round disks and one central axis (100 mm)

• Antistatic treatment: Required

• Surface resistivity: 10 8

- 10

11

Ω/cm

2

Symbol

W0

W1

Figure 10.3. Reel Dimensions - Side View

Dimensions [mm]

45.0 ± 0.5

50.0 ± 1.0

Figure 10.4. Central Axis Dimensions

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WGM110 Wi-Fi

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Module Data Sheet

Tape and Reel Packaging

10.3 Module Orientation in Tape

Figure 10.5. Module Orientation in Tape

10.4 Moisture Sensitivity Level

WGM110 Module reels are delivered in packing which conforms to MSL3 (Moisture Sensitivity Level 3) requirements.

10.5 Tape and Reel Box Dimensions

Symbol

W

2

W

3

W

4

Figure 10.6. Tape and Reel Box Dimensions

Dimensions [mm]

368

338

72

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WGM110 Wi-Fi

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Module Data Sheet

Certifications

11. Certifications

Note:

The certifications for the WGM110 Wi-Fi Module are pending.

11.1 CE

The WGM110 Module is in conformity with the essential requirements and other relevant requirements of the R&TTE Directive (1999/5/

EC). This device is compliant with the following standards:

• Safety: EN 60950

• EMC: EN 301 489

• Spectrum: EN 300 328

A formal DoC is available from

www.silabs.com

.

11.2 FCC

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and

2. This device must accept any interference received, including interference that may cause undesirable operation.

Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.

FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmittermeets both portable and mobile limits as demonstrated in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. As long as the condition above is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

OEM Responsibilities to comply with FCC Regulations

The WGM110 Module has been certified for integration into products only by OEM integrators under the following condition:

• The antenna(s) must be installed such that a minimum separation distance of 21 mm is maintained between the radiator (antenna) and all persons at all times.

• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures.

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Module Data Sheet

Certifications

As long as the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

Note: In the event that this condition cannot be met (for certain configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling

The WGM110 Module is labeled with its own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

"Contains Transmitter Module FCC ID: QOQ-WGM110"

or

"Contains FCC ID: QOQ-WGM110"

The OEM integrator must not provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product.

To comply with FCC RF radiation exposure limits for general population, the antenna(s) used for this transmitter must be installed such that a minimum separation distance of 21 mm is maintained between the radiator (antenna) and all persons at all times and must not be co-located or operating in conjunction with any other antenna or transmitter.

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Module Data Sheet

Certifications

11.3 IC

IC (English)

This radio transmitter has been approved by Industry Canada to operate with the embedded chip antenna. Other antenna types are strictly prohibited for use with this device.

This device complies with Industry Canada’s license-exempt RSS standards. Operation is subject to the following two conditions:

1. This device may not cause interference; and

2. This device must accept any interference, including interference that may cause undesired operation of the device.

RF Exposure Statement

Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. WGM110 meets the given requirements when the minimum separation distance to human body 25 mm. RF exposure or SAR evaluation is not required when the separation distance is 25 mm or more. If the separation distance is less than 25 mm the OEM integrator is responsible for evaluating the SAR.

OEM Responsibilities to comply with IC Regulations

The WGM110 Module has been certified for integration into products only by OEM integrators under the following conditions:

• The antenna(s) must be installed such that a minimum separation distance of 25 mm is maintained between the radiator (antenna) and all persons at all times.

• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.

As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

Note: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the IC authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate IC authorization.

End Product Labeling

The WGM110 Module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

"Contains Transmitter Module IC: 5123A-WGM110"

or

"Contains IC: 5123A-WGM110"

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product.

IC (Francais)

Cet émetteur radio (IC : 5123A-WGM110) a reçu l'approbation d'Industrie Canada pour une exploitation avec l'antenne puce incorporée. Il est strictement interdit d'utiliser d'autres types d'antenne avec cet appareil.

Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes:

1. L’appareil ne doit pas produire de brouillage;

2. L’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.

Déclaration relative à l'exposition aux radiofréquences (RF)

Les limites applicables à l’exemption de l’évaluation courante du DAS sont énoncées dans le CNR 102, 5e édition. L'appareil WGM110 répond aux exigences données quand la distance de séparation minimum par rapport au corps humain est inférieure ou égale à 25 mm. L'évaluation de l'exposition aux RF ou du DAS n'est pas requise quand la distance de séparation est de 25 mm ou plus. Si la distance de séparation est inférieure à 25 mm, il incombe à l'intégrateur FEO d'évaluer le DAS.

Responsabilités du FEO ayant trait à la conformité avec les règlements IC

Le Module WGM110 a été certifié pour une intégration dans des produits uniquement par les intégrateurs FEO dans les conditions suivantes:

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Module Data Sheet

Certifications

• La ou les antennes doivent être installées de telle façon qu'une distance de séparation minimum de 25 mm soit maintenue entre le radiateur (antenne) et toute personne à tout moment.

• Le module émetteur ne doit pas être installé au même endroit ou fonctionner conjointement avec toute autre antenne ou émetteur.

Dès lors que les deux conditions ci-dessus sont respectées, d'autres tests de l'émetteur ne sont pas obligatoires. Cependant, il incombe toujours à l'intégrateur FEO de tester la conformité de son produit final vis-à-vis de toute exigence supplémentaire avec ce module installé (par exemple, émissions de dispositifs numériques, exigences relatives aux matériels périphériques PC, etc).

Note: S'il s'avère que ces conditions ne peuvent être respectées (pour certaines configurations ou la colocation avec un autre émetteur), alors l'autorisation IC n'est plus considérée comme valide et l'identifiant IC ne peut plus être employé sur le produit final. Dans ces circonstances, l'intégrateur FEO aura la responsabilité de réévaluer le produit final (y compris l'émetteur) et d'obtenir une autorisation IC distincte.

Étiquetage du produit final

L'étiquette du Module WGM110 porte son propre identifiant IC. Si l'identifiant IC n'est pas visible quand le module est installé à l'intérieur d'un autre appareil, l'extérieur de l'appareil dans lequel le module est installé doit aussi porter une étiquette faisant référence au module qu'il contient. Dans ce cas, une étiquette comportant les informations suivantes doit être collée sur une partie visible du produit final.

"Contient le module émetteur IC: 5123A-WGM110"

or

"Contient IC : 5123A-WGM110"

L'intégrateur FEO doit être conscient de ne pas fournir d'informations à l'utilisateur final permettant d'installer ou de retirer ce module

RF ou de changer les paramètres liés aux RF dans le mode d'emploi du produit final.

11.4 MIC Japan

The certification of WGM110 Module in Japan is pending.

Certification number: TBD.

Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host equipment can place the certification mark and certification number (the same marking/number as depicted on the label of the radio module) on the outside of the host equipment. The certification mark and certification number must be placed close to the text in the

Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan.

Figure 11.1. Text to be Placed on the Housing of the End-user Device

Translation of the text in the figure above:

“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.”

11.5 KC South-Korea

The certification of WGM110 Module in South-Korea is pending.

Certification number: TBD.

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WGM110 Wi-Fi

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Module Data Sheet

Ordering Information

12. Ordering Information

This section contains cut reel (100 pcs) and full reel (500 pcs) ordering information for WGM110 Module.

WGM110A1MV1 (orderable part number) is the product code for pre-production version (non-certified) of the module. This product code is updated to production version (V2) when the official CE and FCC certifications logos are marked into Module’s metallic RF shield. The production version code, including the certification markings, is: WGM110A1MV2 and WGM110A1MV2R. The only difference of these modules are the certification markings on the shield.

Note: The only visual difference between pre-production and production Module versions will be the certification codes printed on the

RF shield.

Silicon Labs reserves the right to deliver WGM110A1MV2 or WGM110A1MV2R (production version) for customers ordering

WGM110A1MV1 (pre-production version).

Table 12.1. WGM110 Ordering Information

Part Number

WGM110A1MV1

WGM110A1MV2

WGM110A1MV2R

SLWSTK6120A

Description

WGM110 Wi-Fi Module with internal chip antenna

Cut reel

WGM110 Wi-Fi Module with internal chip antenna

Cut reel

WGM110 Wi-Fi Module with internal chip antenna

Full reel

Wi-Fi Module Wireless Starter

Kit

Features

Packaging: 100 pcs cut reel

Status: Pre-production samples

Packaging: 100 pcs cut reel

Status: Production version

Packaging: 500 pcs tape and reel

Status: Production version

WGM110 Wi-Fi Module Radio Board

WSTK Main Board

Expansion Board (buttons, leds, accelerometer, joystick)

Accessories

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Module Data Sheet

Support

13. Support

This section lists the available support provided by Silicon Labs for the WGM110 Module.

13.1 Device Support

Silicon Labs provides support material to help test, evaluate, and program the WGM110 Module. The following sub-section describes the Wireless Starter Kit WSTK6120A in more detail.

13.1.1 Wireless Starter Kit WSTK6120A

Silicon Labs Wireless Starter Kit WSTK6120A provides a platform which enables easy testing and programming of the WGM110 Module. The kit includes the WSTK Mainboard, the BRD4320A Radio Board with the WGM110 Module installed on it and an Add-On Board

BRD8006A, an external battery holder for 2x AA batteries, and USB cables.

The WGM110 Module on the Radio Board has firmware which includes a demo software. The WSTK kit provides the easiest and most recommendable way of getting started on application development using the WGM110 Module.

13.2 Documentation Support

Silicon Labs offers a set of documents which provide further information required for developing applications bases on the WGM110

Module. These documents are available from the Silicon Labs web site at http://www.silabs.com

and include the following:

• UG172: Wizard Gecko Wi-Fi

®

Module Wireless Starter Kit SLWSTK6120A User's Guide

• Wizard Gecko WGM110 Wi-Fi

®

Module Radio Board BRD4320A Reference Manual

• QSG119: Wizard Gecko WSTK Quick-Start Guide

• AN967: Wizard Gecko WSTK Demo Walkthrough

• UG160: Wizard Gecko BGTool

™

User's Guide

• UG170: Wizard Gecko BGScript

™

User's Guide

• UG161: WGM110 Wi-Fi

®

Module Configuration User's Guide

• QSG122: WGM110 Wi-Fi

®

Module Software Quick-Start Guide

• WGM110 API Reference Manual

13.3 Knowledge Base

Silicon Labs provides an online knowledge base on its web site offering an efficient way of exchanging user experience and enabling the presentation of both questions and solutions to all registered users.

The link to the knowledge base is www.silabs.com/support/knowledgebase

13.4 Technical Support

If you need further assistance and can not find the answer from the Silicon Labs' Knowledgebase you can contact Silicon Labs Technical Support through a web page.

Technical Support web link: www.silabs.com/support/

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14. Revision History

14.1 Revision 1.0

Feb. 22, 2016

Initial release.

WGM110 Wi-Fi

®

Module Data Sheet

Revision History

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Table of Contents

1. Key Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2. Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2.1 Power, Ground and Reset Pads . . . . . . . . . . . . . . . . . . . . . . . . 2

2.2 Peripherals and GPIOs . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2.2.1 Peripheral and GPIO pads . . . . . . . . . . . . . . . . . . . . . . . . . 3

2.2.2 Peripheral Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.2.3 GPIO Port Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.2.4 GPIO Input and Output Modes . . . . . . . . . . . . . . . . . . . . . . . 6

2.2.5 Interrupt Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.3 Debug and RF Test Pads . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3. Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1 Host Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1.1 UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1.2 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1.3 USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3.2 Peripheral Interfaces and Functions . . . . . . . . . . . . . . . . . . . . . .11

3.2.1 USART (UART/SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . .12

3.2.2 I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

3.2.3 Timer / PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

3.2.4 Analog to Digital Converter (ADC) . . . . . . . . . . . . . . . . . . . . . .12

3.3 Firmware Update and RF Test Interfaces. . . . . . . . . . . . . . . . . . . . .12

3.3.1 ARM Serial Wire Debug (SWD) . . . . . . . . . . . . . . . . . . . . . . .12

3.3.2 Device Firmware Upgrade (DFU) . . . . . . . . . . . . . . . . . . . . . . .13

3.3.3 RF Test Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

3.3.4 Reference Schematic for SWD Debug and RF Test Interfaces . . . . . . . . . . . . .13

3.4 Real Time Counter (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . .13

4. Module Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

14

5. Hardware Design Guidelines . . . . . . . . . . . . . . . . . . . . . . . .

16

5.1 Power Supply Requirements . . . . . . . . . . . . . . . . . . . . . . . . .16

5.2 PCB Design Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . .16

5.3 Antenna Design Guidelines . . . . . . . . . . . . . . . . . . . . . . . . .17

5.3.1 Effect of Plastic and Metal Materials . . . . . . . . . . . . . . . . . . . . . .17

5.3.2 Locating the Module Close to Human Body . . . . . . . . . . . . . . . . . . .18

6. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .

19

6.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . .19

6.2 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . .19

6.3 Input/Output Terminal Characteristics . . . . . . . . . . . . . . . . . . . . . .19

6.4 Power-on Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

6.5 Analog Digital Converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . .20

6.6 Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Table of Contents

38

7. RF Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .

22

7.1 Supported Frequencies. . . . . . . . . . . . . . . . . . . . . . . . . . .22

7.2 Typical Receiver Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . .22

7.3 Transmitter Power at Maximum Setting . . . . . . . . . . . . . . . . . . . . .22

7.4 Antenna Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .22

7.4.1 Typical Antenna Performance . . . . . . . . . . . . . . . . . . . . . . . .23

7.4.2 Typical Radiation Pattern Plot of WGM110 . . . . . . . . . . . . . . . . . . .24

8. Physical Dimensions and PCB Land Pattern

. . . . . . . . . . . . . . . . . .

25

8.1 Module Top View Dimensions . . . . . . . . . . . . . . . . . . . . . . . .25

8.2 Module Side View Dimensions . . . . . . . . . . . . . . . . . . . . . . . .26

8.3 Recommended PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . .26

9. Soldering Recommendations . . . . . . . . . . . . . . . . . . . . . . . .

27

10. Tape and Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . .

28

10.1 Tape Material and Dimensions . . . . . . . . . . . . . . . . . . . . . . . .28

10.2 Reel Material and Dimensions . . . . . . . . . . . . . . . . . . . . . . . .29

10.3 Module Orientation in Tape . . . . . . . . . . . . . . . . . . . . . . . . .30

10.4 Moisture Sensitivity Level . . . . . . . . . . . . . . . . . . . . . . . . .30

10.5 Tape and Reel Box Dimensions . . . . . . . . . . . . . . . . . . . . . . .30

11. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

31

11.1 CE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

11.2 FCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

11.3 IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

11.4 MIC Japan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

11.5 KC South-Korea. . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

12. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . .

35

13. Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

36

13.1 Device Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

13.1.1 Wireless Starter Kit WSTK6120A . . . . . . . . . . . . . . . . . . . . . .36

13.2 Documentation Support . . . . . . . . . . . . . . . . . . . . . . . . . .36

13.3 Knowledge Base . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

13.4 Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

14. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

37

14.1 Revision 1.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Table of Contents

39

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Disclaimer

Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and

"Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories products are not designed or authorized for military applications. Silicon Laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.

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