UM10875 - NXP Semiconductors

UM10875 - NXP Semiconductors
UM10875
SSL5255DB1290 120 V 10 W non-isolated buck-boost LED
driver
Rev. 1 — 4 September 2015
User manual
Document information
Info
Content
Keywords
SSL5255DB1290, SSL5255TE, dimmable, buck-boost, non-isolated, LED
driver
Abstract
This user manual describes the performance, technical data, and the
connection of the SSL5255DB1290 demo board. The demo board uses a
non-isolated buck-boost topology. The SSL5255DB1290 demo board has
a form factor that is compatible with the base of an A19 LED lamp used in
Solid-State Lighting (SSL) TRIAC dimmable applications.
UM10875
NXP Semiconductors
SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
Revision history
Rev
Date
Description
v.1
20150904
first issue
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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User manual
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SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
1. Introduction
WARNING
Lethal voltage and fire ignition hazard
The non-insulated high voltages that are present when operating this product, constitute a
risk of electric shock, personal injury, death and/or ignition of fire.
This product is intended for evaluation purposes only. It shall be operated in a designated test
area by personnel qualified according to local requirements and labor laws to work with
non-insulated mains voltages and high-voltage circuits. This product shall never be operated
unattended.
This user manual describes the operation of the SSL5255DB1290 120 V 10 W dimmable
LED driver featuring the SSL5255TE. The SSL5255DB1290 demo board has an A19 LED
lamp compatible form factor. The buck-boost converter topology provides a simple and
efficient solution for mains dimmable LED lighting applications.
Figure 2 shows the dimensions of the SSL5255DB1290 demo board. The board size and
the components used ensure that the board fits in an A19 lamp base.
Figure 3 shows the assembled top view and bottom view of the SSL5255DB1290 demo
board.
1.1 Features
•
•
•
•
•
•
•
•
•
UM10875
User manual
Compact design and low component count
Excellent dimmer compatibility
Excellent line and load regulation
Power Factor > 0.9
THD < 20 %
Form factor A19 compatible
Open/short LED string protections
Meets conducted EMI EN55015
Meets 2.5 kV ring wave line surge
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SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
2. Safety warning
The demo board input is connected to the 120 V mains supply. Avoid touching the board
while it is connected to the mains voltage and when it is in operation. An isolated housing
is obligatory when used in uncontrolled, non-laboratory environments. Galvanic isolation
from the mains phase using a fixed or variable transformer is always recommended.
Figure 1 shows the symbols on how to recognize these devices.
019aab174
019aab173
a. Isolated
Fig 1.
UM10875
User manual
b. Not isolated
Isolation symbols
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SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
3. Specifications
Table 1 lists the specification of the SSL5255DB1290 demo board.
Table 1.
SSL5255DB1290 specifications
Symbol
Parameter
Value
Vmains
AC mains supply voltage
108 V (AC) to 132 V (AC)
Po
output power
9W
VLED
output voltage
30 V to 76 V; nominal VLED = 72 V
ILED
output current
125 mA
ILED/Vmains
line regulation
0.1 %
ILED/VLED
load regulation
0.1 %

efficiency
89.4 %; at 120 V (AC)/60 Hz
PF
power factor
0.97; at 120 V (AC)/60 Hz
THD
total harmonic distortion
15 %; at 120 V (AC)/60 Hz
Toper
operating temperature
40 C to +105 C
-
board dimensions
22.5 mm  49 mm
-
conducted ElectroMagnetic
Interference (EMI)
EN55015
Figure 2 shows the dimensions of the demo board.
Fig 2.
UM10875
User manual
SSL5255DB1290 demo board dimensions
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SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
4. Board photographs
a. Top view
b. Bottom view
Fig 3.
UM10875
User manual
SSL5255DB1290 demo board photographs
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SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
5. Board connections
The SSL5255DB1290 demo board is optimized for a 120 V (AC)/60 Hz mains supply. It is
designed to work with multiple LEDs or an LED module.
Remark: The maximum rated voltage of the board is 132 V (AC).
J1 and J2 are the connections for the mains voltage. J3 (LED+) and J4 (LED-) are the
connections for the LED load. Figure 4 shows the connections. Under the expected
conditions, the output current is 125 mA when using an LED string with forward
voltage (Vf) from 30 V to 76 V. The current can be adjusted using resistors R5 and R6.
Fig 4.
UM10875
User manual
SSL5255DB1290 board connections
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SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
6. Functional description
6.1 Input filtering
Capacitor C2 and inductor L2 filter the switching current from the buck converter to the
line. Capacitor C2 also provides a low impedance path for the switching current. To keep
the power factor > 0.9, the value must to be low.
Varistor MOV1 across the AC line provides protection against transient surge voltages.
6.2 Setting the output current
The LED output current is the primary parameter to set in an LED driver. It is regulated
and sensed using Rsense resistors R5 and R6.
The output current can be calculated with Equation 1:
V intregd  AV ISNS
I LED = --------------------------------------R sense
(1)
Where:
• Vintregd(AV)ISNS = 0.155 V
V I  max ISNS
Remark: VI(max)ISNS determines the maximum peak current. I peak  max  = --------------------------- .
R sense
6.3 Output OverVoltage Protection (OVP)
Output OVP is implemented by measuring the voltage at the DEMOVP pin during the
secondary stroke.
The DEMOVP pin senses the output voltage through the resistive divider (resistors R7
and R8) connected between the LEDP node and the DEMOVP pin. When it reaches
V(th)ovp in open-load condition, OVP is triggered and IC restarts after the voltage on the
VCC pin has been discharged internally.
The OVP level can be calculated with Equation 2:
R7
V ovp = V th  ovp    1 + -------

R8
(2)
To prevent false OVP detection, an internal counter ensures that the OVP level, which
triggers OVP, is reached in 3 continuous cycles. To dissipate the energy from those 3
cycles during every restart, an output resistor (R9) is required.
6.4 Thermal foldback
A thermal foldback function is also integrated in the IC. It is triggered at 135 C. See the
SSL5255TE data sheet (Ref. 1) for more information.
The footprint for an optional thermal foldback circuit is available on the SSL5255DB1290
demo board.
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User manual
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SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
To pull down DIM pin level to lower output current under unexpected high-temperature
conditions, an NTC resistor can be used. Figure 5 shows a design example in which the
output current starts folding back at an ambient temperature of 100 C. When the ambient
temperature reaches 120 C, the output current drops 20 %.
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Fig 5.
UM10875
User manual
Optional thermal foldback
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NXP Semiconductors
SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
7. Performance
The performance was measured using an LED load with a 72 V forward at a 125 mA LED
output current. Figure 6 to Figure 11 show the performance data.
7.1 Efficiency
DDD
Ș
Fig 6.
9PDLQV9
Efficiency as a function of AC mains input voltage
7.2 Power Factor
DDD
3)
Fig 7.
UM10875
User manual
9PDLQV9
Power factor as a function of AC mains input voltage
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SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
7.3 Line regulation
DDD
,/('
P$
Fig 8.
9PDLQV9
Output current as a function of AC mains input voltage
7.4 Load regulation
DDD
,/('
P$
Fig 9.
UM10875
User manual
9/('9
Output current as a function of output voltage at nominal mains
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SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
7.5 Total Harmonic Distortion (THD)
DDD
7+'
9PDLQV9
Fig 10. THD as a function of AC mains voltage
7.6 ElectroMagnetic Interference (EMI)
The Electro Magnetic Interference (EMI) was measured according to the EN55015
standard. The board meets the requirements. Figure 11 shows the measurement results.
Fig 11. Conducted EMI performance
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SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
8. Protections
The IC incorporates the following protections:
•
•
•
•
•
•
UnderVoltage Lockout (UVLO)
Cycle-by-cycle OverCurrent Protection (OCP)
Internal OverTemperature Protection (OTP)
Cycle-by-cycle maximum on-time protection
Output OverVoltage Protection (OVP)
Output Short Protection (OSP)
For more detailed information about the IC protections, see the SSL5255TE data sheet
(Ref. 1).
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NXP Semiconductors
UM10875
User manual
9. Schematic
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Fig 12. SSL5255DB1290 minimum component count schematic diagram
UM10875
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-
DDD
SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
Rev. 1 — 4 September 2015
All information provided in this document is subject to legal disclaimers.
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UM10875
NXP Semiconductors
SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
10. Bill Of Materials (BOM)
Table 2.
SSL5255DB1290 demo board full BOM
Reference
Description and values
Part number
Manufacturer
BD1
bridge rectifier; 600 V; 0.8 A
B6S-G
Comchip Tech
C1
capacitor; 0.27 F; 250 V
ECQ-E2274KF
Panasonic
C2
capacitor; 0.1 F; 250 V
ECQ-E2104KF
Panasonic
C3
capacitor; 0.22 F; 35 V; X7R; 0603
GMK212B7224KGHT
Taiyo Yuden
C4
capacitor; 1 F; 10 V; X7R; 0603
CL10B105KP8NNNC
Samsung
C5
capacitor; 180 nF; 16 V; X7R; 0603
GRM188R71C184KA01D
Murata
C6
capacitor; electrolytic; 100 F; 80 V
UPJ1K101MHD6TO
Nichicon
C7
capacitor; 39 pF; 500 V; NP0; 0805
C0805C390JCGACTU
KEMET
D1
diode; fast; 400 V; 1 A
ES1G
Fairchild
F1
fuse; 1 A
AF2-1.00V125TM
AEM
L1
inductor; 1.2 mH; EE13
750315453r02
Würth Elektronik
L2
inductor; 8.2 mH
RL5480HC-3-8200
Renco
R2
resistor; 1.5 M; 1 %; 1206
ERJ-8ENF1504V
Panasonic
R3
resistor; 34.8 k; 1 %; 0603
RC1608F3482CS
Samsung
R4
resistor; 4.02 M, 1 %; 0603
RC1608F4024CS
Samsung
R5; R6
resistor; 2.49 ; 1 %; 1206
CRCW12062R49FKEA
Vishay
R7
resistor; 191 k; 1 %; 1206
ERJ-8ENF1913V
Panasonic
R8
resistor; 4.42 k; 1 %; 0603
ERJ-3EKF4421V
Panasonic
R9
resistor; 300 k; 1 %; 1206
ERJ-6GEYJ304V
Panasonic
R10-1;
R10-2;
R10-3;
R10-4
resistor; 357 ; 1 %; 1206
ERJ-8ENF3570V
Panasonic
MOV1
varistor
MOV-07D201K
Bourns
U1
IC; SSL5255TE; HSO8
SSL5255TE
NXP Semiconductors
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SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
11. Board layout
Figure 13 shows the top view and bottom view of the SSL5255DB1290 demo board
layout.
a. Top view
b. Bottom view
Fig 13. SSL5255DB1290 demo board layout
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SSL5255DB1290 120 V 10 W non-isolated buck-boost LED driver
12. Inductor specification
SDUWPXVWLQVHUWIXOO\WRVXUIDFH$
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PD[
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IRUUHIHUHQFHRQO\
ORWFRGHDQGGDWHFRGH
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SFSDWWHUQFRPSRQHQWVLGH
DDD
Dimensions in mm.
Fig 14. Inductor layout and dimensions
Table 3.
Inductor specifications
Parameter
Value
Test conditions
1.55 ; ±10 %
at 20 C
Electrical specifications
DC resistance; 1 to 10
inductance; 1 to 10
1.20 mH; ±10 %
10 kHz; 100 mV; Ls
saturation current; 1 to 10
850 mA
20 % roll-off from initial
dielectric; 1-core
500 V (DC); 1 m
625 V (DC); 1 s
40 C to +125 C
including temperature rise
General specification
operating temperature range
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13. Abbreviations
Table 4.
Abbreviations
Acronym
Description
EMI
ElectroMagnetic Interference
LED
Light-Emitting Diode
MELF
Metal Electrode Leadless Face
MOSFET
Metal-Oxide-Semiconductor Field-Effect Transistor
OCP
OverCurrent Protection
OSP
Output Short Protection
OTP
OverTemperature Protection
OVP
OverVoltage Protection
PF
Power Factor
SMD
Surface-Mounted Devices
SSL
Solid-State Lighting
THD
Total Harmonic Distortion
UVLO
UnderVoltage LockOut
14. References
UM10875
User manual
[1]
SSL5255TE data sheet — Mains dimmable buck-boost LED driver IC
5 Ohm/450 V; 2015 NXP Semiconductors
[2]
AN11702 application note — SSL525X buck-boost controller;
2015 NXP Semiconductors
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15. Legal information
15.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
15.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express, implied
or statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of this
product remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
to customer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business, business
interruption, loss of use, loss of data or information, and the like) arising out
the use of or inability to use the product, whether or not based on tort
(including negligence), strict liability, breach of contract, breach of warranty or
any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by customer
for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
law, even if any remedy fails of its essential purpose.
Safety of high-voltage evaluation products — The non-insulated high
voltages that are present when operating this product, constitute a risk of
electric shock, personal injury, death and/or ignition of fire. This product is
intended for evaluation purposes only. It shall be operated in a designated
test area by personnel that is qualified according to local requirements and
labor laws to work with non-insulated mains voltages and high-voltage
circuits.
The product does not comply with IEC 60950 based national or regional
safety standards. NXP Semiconductors does not accept any liability for
damages incurred due to inappropriate use of this product or related to
non-insulated high voltages. Any use of this product is at customer’s own risk
and liability. The customer shall fully indemnify and hold harmless NXP
Semiconductors from any liability, damages and claims resulting from the use
of the product.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP Semiconductors N.V.
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16. Contents
1
1.1
2
3
4
5
6
6.1
6.2
6.3
6.4
7
7.1
7.2
7.3
7.4
7.5
7.6
8
9
10
11
12
13
14
15
15.1
15.2
15.3
16
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Safety warning . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Board photographs . . . . . . . . . . . . . . . . . . . . . . 6
Board connections . . . . . . . . . . . . . . . . . . . . . . 7
Functional description . . . . . . . . . . . . . . . . . . . 8
Input filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Setting the output current . . . . . . . . . . . . . . . . . 8
Output OverVoltage Protection (OVP) . . . . . . . 8
Thermal foldback . . . . . . . . . . . . . . . . . . . . . . . 8
Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Power Factor . . . . . . . . . . . . . . . . . . . . . . . . . 10
Line regulation . . . . . . . . . . . . . . . . . . . . . . . . 11
Load regulation . . . . . . . . . . . . . . . . . . . . . . . . 11
Total Harmonic Distortion (THD). . . . . . . . . . . 12
ElectroMagnetic Interference (EMI) . . . . . . . . 12
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Bill Of Materials (BOM) . . . . . . . . . . . . . . . . . . 15
Board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Inductor specification . . . . . . . . . . . . . . . . . . . 17
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 4 September 2015
Document identifier: UM10875
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